An optical module

Abstract

The present invention provides an optical module, which relates to the field of optical communication technology. The optical module includes a radio frequency board and a control board; the radio frequency board includes a first control signal interface, a first radio frequency interface, a digital processing module and a first control module; the control board includes a second control signal interface, a second radio frequency interface, an electro-optical conversion module and a second control module; the first radio frequency interface and the second radio frequency interface, the first control signal interface and the second control signal interface are all detachably connected; the digital processing module converts the mainboard digital signal into a radio frequency signal and sends it to the electro-optical conversion module, and the electro-optical conversion module converts it into an optical signal; the first control module converts the working condition signal of the digital processing module into a first working condition signal in a preset format and sends it to the mainboard interface; the second control module converts the working condition signal of the electro-optical conversion module into a second working condition signal in a preset format and sends it to the mainboard interface. The present invention improves the flexibility of the optical module and its adaptability to different types of chips.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] As core components of next-generation high-speed optical communications, optical modules play a key role in the iterative upgrades of global digital infrastructure. Their application scenarios primarily encompass hyperscale data center interconnection, 5G mobile fronthaul networks, optical interconnection for intelligent computing centers, integrated air-space-ground networks, and deterministic networks for the Industrial Internet. As optical module speeds continue to increase, the required capacity has gradually transitioned from the early 100G to 800G and the next-generation 1.6T.

[0003] Conventional optical module designs typically utilize a traditional integrated solution, primarily utilizing a single high-density interconnect (HDI) RF board to carry all optical module functions. This design integrates the optical module's signal processing, transmission, reception, and management functions onto a single HDI RF board.

[0004] However, traditional integrated solutions have significant technical drawbacks. Because all functions are integrated into a single HDI RF board, the need to support different chip types, such as different digital signal processing chips or electro-optical conversion chips, requires the entire HDI RF board to be redesigned. This results in long design cycles and fails to meet the requirements for rapid verification. Furthermore, multiple design teams are required to verify different solutions simultaneously, significantly increasing labor costs and limiting the optical module's ability to adapt to rapid iteration and diverse demands. Summary of the Invention

[0005] The present invention provides an optical module to improve the flexibility of the optical module and its adaptability to different types of chips, thereby shortening the design period of the optical module.

[0006] A first aspect of the present invention provides an optical module, the optical module comprising: a radio frequency board and a control board that are independent of each other;

[0007] The radio frequency board includes a first control signal interface, a first radio frequency interface, a mainboard interface, a digital processing module, and a first control module; the control board includes a second control signal interface, a second radio frequency interface, an electro-optical conversion module, and a second control module; the first radio frequency interface and the second radio frequency interface are detachably connected; the first control signal interface and the second control signal interface are detachably connected; the mainboard interface is used to connect to an external mainboard;

[0008] The digital processing module is used to convert the mainboard digital signal received by the mainboard interface into a radio frequency signal, and send it to the electro-optical conversion module through the first radio frequency interface and the second radio frequency interface in sequence;

[0009] The electro-optical conversion module is used to convert the radio frequency signal into an optical signal;

[0010] The first control module is used to obtain the working condition signal of the digital processing module, convert the working condition signal of the digital processing module into a first working condition signal in a preset format, and then send it to the mainboard interface;

[0011] The second control module is used to obtain the operating condition signal of the electro-optical conversion module, and convert the operating condition signal of the electro-optical conversion module into a second operating condition signal in the preset format, and then send it to the mainboard interface through the second control signal interface, the first control signal interface and the first control module in sequence.

[0012] Optionally, the first control module is further configured to receive a digital processing control signal through the mainboard interface, convert the digital processing control signal into a first control signal adapted for the digital processing module, and then send the first control signal to the digital processing module to control the working state of the digital processing module;

[0013] The first control module is further configured to receive an electro-optical conversion control signal through the mainboard interface, and sequentially send the signal to the second control module through the first control signal interface and the second control signal interface;

[0014] The second control module is further configured to convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module and then send the second control signal to the electro-optical conversion module to control the working state of the electro-optical conversion module.

[0015] Optionally, the control board further includes at least one photoelectric conversion module;

[0016] The photoelectric conversion module is used to convert the optical signal received by the control board into a radio frequency signal, and send it to the digital processing module through the second radio frequency interface and the first radio frequency interface in sequence;

[0017] The digital processing module is further configured to convert the radio frequency signal received by the first radio frequency interface into a digital signal, and output the digital signal through the mainboard interface.

[0018] Optionally, the second radio frequency interface includes a first sub-radio frequency interface and at least one second sub-radio frequency interface;

[0019] The first sub-RF interface is integrated into the electro-optical conversion module;

[0020] The second sub-RF interface is provided in a one-to-one correspondence with the photoelectric conversion module, and the second sub-RF interface is integrated into the photoelectric conversion module.

[0021] Optionally, the control board further includes an optical fiber interface; the optical fiber interface is used to transmit or receive optical signals;

[0022] The optical fiber interface is arranged on one side edge of the control board.

[0023] Optionally, the electro-optical conversion module and each of the photoelectric conversion modules are located on a side of the second control module close to the radio frequency board.

[0024] Optionally, the first radio frequency interface includes a third sub-radio frequency interface and at least one fourth sub-radio frequency interface;

[0025] The third sub-RF interface is correspondingly connected to the first sub-RF interface;

[0026] The fourth sub-RF interface and the second sub-RF interface are connected in a one-to-one correspondence.

[0027] Optionally, the mainboard interface and the first radio frequency interface are located on opposite sides of the digital processing module.

[0028] Optionally, the electro-optical conversion module includes a laser and a silicon optical modulator;

[0029] The control signal output end of the silicon optical modulator is connected to the control signal input end of the laser; and the input end of the silicon optical modulator is connected to the second radio frequency interface.

[0030] Optionally, the RF board further includes a first power supply interface and a first power conversion module; the control board further includes a second power supply interface and a second power conversion module; the first power supply interface and the second power supply interface are detachably connected; the mainboard interface is connected to the first power supply interface through the first power conversion module;

[0031] The first power conversion module is used to convert the power supply signal into the power supply voltage required by the digital processing module and then provide it to the digital processing module, and send the power supply signal to the first power supply interface;

[0032] The second power conversion module is used to receive the power supply signal through the first power supply interface and the second power supply interface in sequence, and convert the power supply signal into the power supply voltage required by the electro-optical conversion module and then provide it to the electro-optical conversion module.

[0033] The technical solution of the present invention is to set a mutually independent radio frequency board and control board in the optical module, set a first control signal interface and a first radio frequency interface in the radio frequency board, set a second control signal interface and a second radio frequency interface in the control board, and the first radio frequency interface and the second radio frequency interface are detachably connected, and the first control signal interface and the second control signal interface are detachably connected, so that the radio frequency board can be connected to control boards of different optical designs, and the control board can be connected to different types of radio frequency boards, so that the optical module can meet the needs of different application scenarios, thereby improving the flexibility of the optical module. And by setting a mainboard interface, a digital processing module and a first control module in the radio frequency board, and setting an electro-optical conversion module and a second control module in the control board, so that the radio frequency board can receive the mainboard digital signal transmitted by the external mainboard through the mainboard interface, the digital processing module can convert the mainboard digital signal received by the mainboard interface into a radio frequency signal, and can send the modulated radio frequency signal to the electro-optical conversion module, and at the same time, the electro-optical conversion module can convert the radio frequency signal into an optical signal, so that the optical module can achieve long-distance, low-loss data transmission suitable for optical communication networks. In addition, the working condition signal of the digital processing module is converted into a first working condition signal in a preset format by the first control module and then sent to the mainboard interface. The working condition signal of the electro-optical conversion module is converted into a second working condition signal in a preset format by the second control module and then sent to the mainboard interface. The first working condition signal and the second working condition signal in the preset format match the interface format of the mainboard interface, ensuring that the external mainboard can monitor the working conditions of the digital processing modules and the electro-optical conversion modules with different interface formats in real time, thereby ensuring that the optical module can adapt to the digital processing modules and the electro-optical conversion modules with different interface formats, improving the compatibility and flexibility of the optical module, and significantly shortening the design and verification cycle, reducing the design and manufacturing costs and labor costs of the optical module.

[0034] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 This is a schematic structural diagram of an optical module provided by an embodiment of the present invention;

[0037] Figure 2is a schematic structural diagram of another optical module provided by an embodiment of the present invention;

[0038] Figure 3 It is a structural diagram of another optical module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0040] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] Figure 1 Schematic diagram of the structure of an optical module provided by an embodiment of the present invention. Figure 1As shown, the optical module includes a mutually independent radio frequency board 1 and a control board 2; the radio frequency board 1 includes a first control signal interface 11, a first radio frequency interface 12, a main board interface 13, a digital processing module 14 and a first control module 15; the control board 2 includes a second control signal interface 21, a second radio frequency interface 22, an electro-optical conversion module 23 and a second control module 24; the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected; the first control signal interface 11 and the second control signal interface 21 are detachably connected; the main board interface 13 is used to connect to an external main board; the digital processing module 14 is used to convert the main board digital signal received by the main board interface 13 into a radio frequency signal, and according to The first signal is sent to the electro-optical conversion module 23 through the first RF interface 12 and the second RF interface 22; the electro-optical conversion module 23 is used to convert the RF signal into an optical signal; the first control module 15 is used to obtain the working condition signal of the digital processing module 14, and convert the working condition signal of the digital processing module 14 into a first working condition signal of a preset format and then send it to the mainboard interface 13; the second control module 24 is used to obtain the working condition signal of the electro-optical conversion module 23, and convert the working condition signal of the electro-optical conversion module 23 into a second working condition signal of a preset format and then send it to the mainboard interface 13 through the second control signal interface 21, the first control signal interface 11 and the first control module 15 in sequence.

[0042] Among them, the RF board 1 can be specifically understood as a module in the optical module for processing high-speed electrical signals and generating RF signals, and the control board 2 can be specifically understood as a module in the optical module for converting RF signals and generating optical signals. The RF board 1 includes a first control signal interface 11 and a first RF interface 12, and the control board 2 includes a second control signal interface 21 and a second RF interface 22. The first RF interface 12 and the second RF interface 22 can be understood as standardized signal transmission interfaces to achieve efficient transmission of the RF signal generated by the RF board 1 to the control board 2. Exemplarily, the first RF interface 12 and the second RF interface 22 can achieve signal transmission through multiple differential pairs. The differential pair can be composed of a pair of positive and negative signal lines, which can effectively reduce electromagnetic interference and crosstalk during the transmission of the RF signal and ensure the integrity of the RF signal. The first control signal interface 11 and the second control signal interface 21 can be understood as a communication channel between the RF board 1 and the control board 2 for transmitting low-speed control signals, so that the RF board 1 and the control board 2 can realize the interaction of working condition information of the digital processing module 14 and the electro-optical conversion module 23 through the first control signal interface 11 and the second control signal interface 21.

[0043] It can also be understood that the first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the RF board 1 can be connected to the control board 2 with different optical designs. At the same time, the control board 2 can be connected to different types of RF boards 1, so that the optical module can meet the needs of different application scenarios, thereby improving the flexibility of the optical module. Exemplarily, the signals between the first RF interface 12 and the second RF interface 22, and the signals between the first control signal interface 11 and the second control signal interface 21 can be physically interconnected by wire bonding, that is, the pads on the RF board 1 and the control board 2 can be directly connected by fine metal wires to form an electrical path between the first RF interface 12 and the second RF interface 22, and an electrical path between the first control signal interface 11 and the second control signal interface 21. Compared with traditional physical connectors, the wire bonding method has higher flexibility. Wire bonding can directly connect the pads of the RF board 1 and the control board 2, thereby optimizing the transmission path of the RF signal and the operating condition signal, and reducing the loss and delay of the RF signal and the operating condition signal. In addition, the wire bonding method does not require additional physical connector components, which reduces manufacturing costs, while reducing the risk of poor contact of the physical connector and improving the reliability of RF signal and working condition signal transmission.

[0044] Specifically, the RF board 1 includes a motherboard interface 13, a digital processing module 14, and a first control module 15. The RF board 1 is connected to an external motherboard via the motherboard interface 13 so that the RF board 1 can receive motherboard digital signals transmitted by the external motherboard via the motherboard interface 13. For example, the external motherboard can be a switch or server in a data center for transmitting high-speed digital signals. The digital processing module 14 can be a digital signal processing chip. The first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected so that the optical module can support digital signal processing chips with different interface formats to process the motherboard digital signals. The digital processing module 14 is used to convert the motherboard digital signal received by the motherboard interface 13 into a radio frequency signal. Exemplarily, the digital processing module 14 can modulate the motherboard digital signal to modulate the non-return-to-zero (NRZ) signal transmitted by the motherboard into a four-level pulse amplitude modulation (PAM4) signal, thereby generating a radio frequency signal suitable for high-speed transmission. The digital processing module 14 can output the modulated radio frequency signal through a differential pair and send it to the electro-optical conversion module 23 through the first radio frequency interface 12 and the second radio frequency interface 22 in sequence, so as to enable the electro-optical conversion module 23 to convert the electrical signal into an optical signal.

[0045] The control board 2 includes an electro-optical conversion module 23 and a second control module 24. Optionally, the electro-optical conversion module 23 may include a laser and a silicon optical modulator. The first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the optical module can support lasers and silicon optical modulators with different interface formats to process the RF signals received by the second RF interface 22. The electro-optical conversion module 23 is used to convert the RF signals received by the second RF interface 22 into optical signals. Specifically, the control signal output end of the silicon optical modulator is connected to the control signal input end of the laser, and the input end of the silicon optical modulator is connected to the second RF interface so that the laser can generate a continuous optical carrier as a carrier for RF signal data transmission. The silicon optical modulator is based on silicon photonics technology and is used to modulate the RF signal received by the second RF interface onto the optical carrier generated by the laser to generate an optical signal carrying the data information of the RF signal. For example, the silicon optical modulator can employ a Mach-Zehnder Modulator (MZM) structure, which modulates the optical carrier's light intensity by changing the phase difference of the optical carrier through RF signal drive, thereby generating an optical signal that carries the data information of the RF signal. Silicon optical modulators are based on silicon photonics technology and are compatible with complementary metal-oxide-semiconductor (CMOS) processes. They offer low manufacturing costs and are suitable for mass production, reducing the design and manufacturing costs of optical modules. Furthermore, the electro-optical conversion module 23 can output the optical signal to an external network, enabling the optical module to achieve long-distance, low-loss data transmission suitable for optical communication networks.

[0046] In addition, the first control module 15 is used to obtain the operating condition signal of the digital processing module 14, and convert the operating condition signal of the digital processing module 14 into a first operating condition signal in a preset format and then send it to the mainboard interface 13, so that the first control module 15 can adjust the operating condition signal of the digital processing module 14 with different interface formats, so that the operating condition signal of the digital processing module 14 with different interface formats can be sent to the mainboard interface 13 in a unified interface format. The first operating condition signal in the preset format matches the interface format of the mainboard interface 13, ensuring that the external mainboard can monitor the operating conditions of the digital processing modules 14 with different interface formats in real time. Exemplarily, the operating conditions of the digital processing module 14 may include the power supply voltage, operating current, chip temperature and bit error rate of the digital signal processing chip. The second control module 24 is configured to obtain an operating condition signal from the electro-optical conversion module 23, convert the operating condition signal from the electro-optical conversion module 23 into a second operating condition signal in a preset format, and then transmit the signal to the mainboard interface 13 sequentially through the second control signal interface 21, the first control signal interface 11, and the first control module 15. This allows the second control module 24 to adjust the operating condition signals of the electro-optical conversion module 23 with different interface formats so that the operating condition signals of the electro-optical conversion module 23 with different interface formats can be transmitted to the mainboard interface 13 in a unified interface format. The second operating condition signal in the preset format matches the interface format of the mainboard interface 13, ensuring that the external mainboard can monitor the operating conditions of the electro-optical conversion modules 23 with different interface formats in real time. For example, the operating conditions of the electro-optical conversion module 23 may include the bias current of the laser, the driving voltage of the silicon optical modulator, and the temperature of the silicon optical modulator. This ensures that the optical module can adapt to digital processing modules 14 with different interface formats and electro-optical conversion modules 23 with different interface formats, thereby improving the compatibility and flexibility of the optical module. The first control module 15 and the second control module 24 may include a microcontroller chip. The specific model of the microcontroller chip may be selected according to actual application requirements, and the present invention does not impose any specific limitation on this.

[0047] Specifically, the first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the RF board 1 can be connected to the control board 2 with different optical designs, and the control board 2 can be connected to different types of RF boards 1. The digital signal processing chips in different types of RF boards 1 have differences in the output format of the working condition signals. The first control module 15 can convert the working condition signals of different types of digital signal processing chips into a first working condition signal of a preset format through the internal signal routing function, and send it to the mainboard interface 13. For example, the operating condition signal of digital signal processing chip A is output in a 16-bit format via register address 0x01, while the operating condition signal of digital signal processing chip B may be output in an 8-bit format via register address 0x02. The first control module 15 normalizes these operating condition signals of different output formats through programmable logic, such as a field programmable gate array (FPGA) or an application-specific integrated circuit (ASIC), to unify them into a first operating condition signal of a preset format, such as a first operating condition signal output in a 16-bit format via register address 0x10, and sends the first operating condition signal to the mainboard interface 13. At the same time, the lasers and silicon optical modulators in the control boards 2 with different optical designs have different output formats of their operating condition signals. The second control module 24 can, through its internal signal routing function, convert the operating condition signals of the lasers and silicon optical modulators with different optical designs into a second operating condition signal of a preset format and send it to the mainboard interface 13. For example, the operating condition signal of silicon photomodulator A is output in a 10-bit format through register address 0x03, while the operating condition signal of silicon photomodulator B may be output in a 12-bit format through 0x04. The second control module 24 can normalize these operating condition signals of different output formats through programmable logic and unify them into a second operating condition signal of a preset format, such as a second operating condition signal output in a 16-bit format at register address 0x10, and send the second operating condition signal to the mainboard interface 13 through the second control signal interface 21, the first control signal interface 11 and the first control module 15 in sequence.

[0048] The operating condition signals are converted by the first control module 15 and the second control module 24, without adjusting the soldering method between the RF board 1 and the control board 2; this can be achieved simply through software configuration or hardware routing of the first control module 15 and the second control module 24. By converting the operating condition signals of the digital processing module 14 and the electro-optical conversion module 23 with different interface formats through the first control module 15 and the second control module 24, the optical module can flexibly adapt to various types of digital signal processing chips, as well as lasers and silicon optical modulators with different optical designs. This improves the flexibility of the optical module and its compatibility with different chip types, allowing the optical module to meet the diverse needs of different application scenarios. In the traditional integrated RF board design, if the type of digital signal processing chip or the optical design of the laser and silicon optical modulator is changed, the entire RF board 1 or control board 2 needs to be redesigned, and the design cycle is usually 4-6 months. However, through the adjustment function of the first control module 15 and the second control module 24, there is no need to redesign the RF board 1 and the control board 2 or adjust the welding method. Different types of digital signal processing chips and lasers and silicon optical modulators with different optical designs can be adapted only through the software configuration or hardware routing of the first control module 15 and the second control module 24, which significantly shortens the design and verification cycle, thereby reducing the design and manufacturing costs and labor costs of the optical module.

[0049] It's also understandable that in traditional integrated RF board designs, RF board 1 must meet high-speed design requirements, such as strict impedance control, high-order high-density interconnect (HDI) or modified semi-additive process (mSAP), and may even involve bare chip design, placing high demands on the board and printed circuit board manufacturing processes. Control board 2, on the other hand, only needs to support low-speed signal control, placing more stringent requirements on the board and printed circuit board manufacturing processes. By modularizing the RF board 1 and control board 2 in the optical module, RF board 1 can adopt high-order printed circuit board manufacturing processes, allowing RF board 1 to focus on high-speed signal processing while control board 2 only needs to use standard printed circuit board manufacturing processes to support low-speed signal control. This reduces the optical module's demand for demanding printed circuit board design, reduces the manufacturing difficulty and cost of the optical module, and improves the module's flexibility and maintainability.

[0050] In this embodiment, a mutually independent radio frequency board and control board are provided in the optical module, and a first control signal interface and a first radio frequency interface are provided in the radio frequency board, and a second control signal interface and a second radio frequency interface are provided in the control board, and the first radio frequency interface and the second radio frequency interface are detachably connected, and the first control signal interface and the second control signal interface are detachably connected, so that the radio frequency board can be connected to control boards of different optical designs, and the control board can be connected to different types of radio frequency boards, so that the optical module can meet the needs of different application scenarios, thereby improving the flexibility of the optical module. In addition, a mainboard interface, a digital processing module and a first control module are provided in the radio frequency board, and an electro-optical conversion module and a second control module are provided in the control board, so that the radio frequency board can receive a mainboard digital signal transmitted from an external mainboard through the mainboard interface, the digital processing module can convert the mainboard digital signal received by the mainboard interface into a radio frequency signal, and can send the modulated radio frequency signal to the electro-optical conversion module, and at the same time, the electro-optical conversion module can convert the radio frequency signal into an optical signal, so that the optical module can achieve long-distance, low-loss data transmission suitable for optical communication networks. In addition, the working condition signal of the digital processing module is converted into a first working condition signal in a preset format by the first control module and then sent to the mainboard interface. The working condition signal of the electro-optical conversion module is converted into a second working condition signal in a preset format by the second control module and then sent to the mainboard interface. The first working condition signal and the second working condition signal in the preset format match the interface format of the mainboard interface, ensuring that the external mainboard can monitor the working conditions of the digital processing modules and the electro-optical conversion modules with different interface formats in real time, thereby ensuring that the optical module can adapt to the digital processing modules and the electro-optical conversion modules with different interface formats, improving the compatibility and flexibility of the optical module, and significantly shortening the design and verification cycle, reducing the design and manufacturing costs and labor costs of the optical module.

[0051] Optionally, the first control module 15 is also used to receive a digital processing control signal through the mainboard interface 13, and convert the digital processing control signal into a first control signal adapted to the digital processing module 14 and then send it to the digital processing module 14 to control the working state of the digital processing module 14; the first control module 15 is also used to receive an electro-optical conversion control signal through the mainboard interface 13, and send it to the second control module 24 through the first control signal interface 11 and the second control signal interface 21 in sequence; the second control module 24 is also used to convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module 23 and then send it to the electro-optical conversion module 23 to control the working state of the electro-optical conversion module 23.

[0052] Specifically, after the external mainboard receives the first operating condition signal from the digital processing module 14 through the mainboard interface 13, it can generate a digital processing control signal based on the first operating condition signal, and can output the digital processing control signal to the first control module 15 through the mainboard interface 13, so that the first control module 15 can receive the digital processing control signal through the mainboard interface 13, convert the digital processing control signal into a first control signal adapted for the digital processing module 14, and then send it to the digital processing module 14 to control the operating state of the digital processing module 14. For example, if the external mainboard determines that the temperature of the digital signal processing chip is too high based on the first operating condition signal, the external mainboard can generate a digital processing control signal to control the first control module 15 to reduce the operating frequency of the digital signal processing chip or increase the supply voltage of the digital signal processing chip to reduce the power consumption and temperature of the digital signal processing chip.

[0053] In addition, the first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the control board 2 can be connected to different types of RF boards 1. The digital signal processing chips in different types of RF boards 1 have different input interfaces for control signals. The first control module 15 can convert the digital processing control signal into a first control signal that is adapted to the digital signal processing chip through an internal signal routing function, and send it to the digital signal processing chip. For example, the format of the digital processing control signal is register address 0x30 and output in 16-bit format, while the input interface of the control signal of digital signal processing chip A may be register address 0x05 and input in 10-bit format, and the input interface of the control signal of digital signal processing chip B may be register address 0x06 and input in 12-bit format. The first control module 15 converts the digital processing control signal into a first control signal that is adapted to different digital signal processing chips through programmable logic, and sends it to the corresponding digital signal processing chip.

[0054] At the same time, after the external mainboard receives the second operating condition signal of the electro-optical conversion module 23 through the mainboard interface 13, it can generate an electro-optical conversion control signal according to the second operating condition signal, and can output the electro-optical conversion control signal to the first control module 15 through the mainboard interface 13, so that the first control module 15 can send the electro-optical conversion control signal to the second control module 24 through the first control signal interface 11 and the second control signal interface 21 in sequence, so that the second control module 24 can convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module 23 and then send it to the electro-optical conversion module 23, thereby controlling the working state of the electro-optical conversion module 23. For example, if the external mainboard determines based on the second operating condition signal that the bias current of the laser is too low, resulting in insufficient optical power, the external mainboard can generate an electro-optical conversion control signal to control the second control module 24 to increase the bias current of the laser; if the external mainboard determines based on the second operating condition signal that the driving voltage of the silicon optical modulator does not match, for example, at this time the driving voltage of the silicon optical modulator is 2V, and the target value of the driving voltage of the silicon optical modulator is 1.5V, the external mainboard can generate an electro-optical conversion control signal to control the second control module 24 to adjust the driving voltage of the silicon optical modulator to 1.5V.

[0055] In addition, the first RF interface 12 and the second RF interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the RF board 1 can be connected to control boards 2 of different optical designs. The lasers and silicon optical modulators in the control boards 2 of different optical designs have different input interfaces for control signals. The second control module 24 can convert the electro-optical conversion control signal into a second control signal adapted for the laser and silicon optical modulator through an internal signal routing function, and send the second control signal to the laser and silicon optical modulator. For example, the format of the electro-optical conversion control signal is register address 0x30 output in a 16-bit format, while the input interface of the control signal of silicon optical modulator A may be register address 0x05 input in a 10-bit format, and the input interface of the control signal of silicon optical modulator B may be register address 0x06 input in a 12-bit format. The second control module 24 converts the electro-optical conversion control signal into a second control signal adapted for different lasers and silicon optical modulators through programmable logic, and sends the second control signal to the corresponding laser and silicon optical modulator.

[0056] The digital processing control signal and the electro-optical conversion control signal are converted respectively by the first control module 15 and the second control module 24, so that the optical module can flexibly adapt to a variety of digital signal processing chips of different types and lasers and silicon optical modulators with different optical designs, thereby improving the flexibility of the optical module and its compatibility with different types of chips, enabling the optical module to meet the diverse needs of different application scenarios, and significantly shortening the design and verification cycle, thereby reducing the design and manufacturing costs and labor costs of the optical module.

[0057] Optionally, the control signals transmitted by the first control signal interface 11 and the second control signal interface 21 include I2C signals and GPIO signals. The I2C signal is used to transmit status data and control instructions. For example, the second control module 24 transmits the voltage value of the electro-optical conversion module 23 to the first control module 15 via the I2C signal, so that the first control module 15 can send the voltage value of the electro-optical conversion module 23 to the mainboard interface 13, thereby enabling real-time monitoring of the working status of the electro-optical conversion module 23. The GPIO signal is used to transmit a switching signal or an interrupt signal. For example, when the external mainboard determines that the working state of the electro-optical conversion module 23 is abnormal based on the second working condition signal, for example, when the temperature of the silicon optical modulator is too high, the second control module 24 can send a fault alarm signal of the electro-optical conversion module 23 to the first control module 15 through the GPIO signal. The first control module 15 can send the fault alarm signal to the mainboard interface 13, so that the external mainboard can generate an electro-optical conversion control instruction based on the fault alarm signal, so as to stop the electro-optical conversion module 23 from working by controlling the second control module 24, so as to avoid further deterioration of the fault of the electro-optical conversion module 23, and at the same time remind the operator to promptly discover the abnormal working condition in the optical module and perform maintenance in time, thereby improving the maintenance efficiency and service life of the optical module.

[0058] By setting the RF board 1 to include a first control signal interface 11 and the control board 2 to include a second control signal interface 21, the optical module can monitor the working status of the digital processing module 14 and the electro-optical conversion module 23 in real time through the first control module 15 and the second control module 24, and can dynamically adjust the working parameters of the digital processing module 14 and the electro-optical conversion module 23 through the external mainboard, so that the optical module can promptly discover and solve potential problems in the RF board 1 and the control board 2, thereby optimizing the performance of the optical module and improving the reliability and stability of the optical module.

[0059] Optional, Figure 2 FIG. 1 is a schematic diagram of the structure of another optical module provided by an embodiment of the present invention. Figure 2 As shown, the control board 2 also includes at least one photoelectric conversion module 25; the photoelectric conversion module 25 is used to convert the optical signal received by the control board 2 into a radio frequency signal, and send it to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12 in sequence; the digital processing module 14 is also used to convert the radio frequency signal received by the first radio frequency interface 12 into a digital signal, and output the digital signal through the main board interface.

[0060] The photoelectric conversion module 25 can be specifically understood as a functional component in the control board 2 for converting an optical signal into a radio frequency signal. Specifically, the photoelectric conversion module 25 can convert the optical signal received by the control board 2 into a radio frequency signal, and can send the converted radio frequency signal to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12 in sequence, so that the digital processing module 14 can further process the radio frequency signal. Exemplarily, the photoelectric conversion module 25 may include a photodetector and a transimpedance amplifier (TIA). The photodetector may be a photodiode. When the optical signal received by the control board 2 is irradiated on the photosensitive area of ​​the photodiode, the photodiode can convert the intensity change of the optical signal into a photocurrent, that is, an electrical signal. However, the photocurrent is usually very weak. Therefore, the photodiode can also input the photocurrent into the transimpedance amplifier. The transimpedance amplifier can convert the weak photocurrent into a voltage signal and amplify it to generate a radio frequency signal suitable for sending to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12 in sequence. By setting up the photoelectric conversion module 25 including a photodetector and a transimpedance amplifier, the optical module can efficiently realize the conversion from optical signals to electrical signals, so that the optical module has bidirectional communication capabilities. The conversion function of the photoelectric conversion module 25 from optical signals to electrical signals and the conversion function of the electro-optical conversion module 23 from electrical signals to optical signals complement each other, so that the optical module can meet the bidirectional communication requirements of the data center or 5G mobile fronthaul network.

[0061] Furthermore, the digital processing module 14 is further configured to convert the RF signal received by the first RF interface 12 into a digital signal. Specifically, the RF signal received by the first RF interface 12 may be a high-speed analog signal, such as a PAM4 signal, which includes four levels. The digital processing module 14 includes an analog-to-digital converter to sample and quantize the RF signal into a digital signal. Exemplarily, the digital processing module 14 can map the four PAM4 levels (0, 1, 2, 3) into two bits of binary data (00, 01, 10, 11), thereby generating a digital signal, such as an NRZ signal. Furthermore, the digital processing module 14 can output the converted digital signal through a motherboard interface, enabling further processing by an external motherboard, such as data decoding or forwarding. By configuring the digital processing module 14 to convert the RF signal into a digital signal, the optical module implements a complete conversion link from optical to digital signals through the optoelectronic conversion module 25 and the digital processing module 14. Combined with the electrical-to-optical conversion function of the electro-optical conversion module 23, the optical module possesses bidirectional communication capabilities, enhancing its flexibility.

[0062] It is understood that the control board 2 may include one or more photoelectric conversion modules 25. For example, see Figure 2 The control board 2 may include two optoelectronic conversion modules 25, so that the optical module can flexibly configure the number of optoelectronic conversion modules 25 according to actual needs. For example, the optical module can choose to use one optoelectronic conversion module 25 to reduce power consumption, or use two optoelectronic conversion modules 25 to increase data throughput, based on data transmission requirements. This improves the flexibility and adaptability of the optical module to meet the needs of different application scenarios. The specific number of optoelectronic conversion modules 25 can be determined according to actual needs, and the present invention does not make specific restrictions on this. Without special restrictions, the embodiments of the present invention all take the control board 2 including two optoelectronic conversion modules 25 as an example to illustrate the technical solutions of the present invention. It can also be understood that the electro-optical conversion module 23 and each optoelectronic conversion module 25 are arranged sequentially along a first direction, and the first direction is parallel to the plane where the control board 2 is located, so that the electro-optical conversion module 23 and each optoelectronic conversion module 25 are physically independent of each other, thereby reducing electromagnetic interference and signal crosstalk between the modules and improving the signal integrity and operating stability of the optical module.

[0063] Optional, continue to refer to Figure 2 The second RF interface 22 includes a first sub-RF interface 221 and at least one second sub-RF interface 222; the first sub-RF interface 221 is integrated into the electro-optical conversion module 23; the second sub-RF interface 222 is set in a one-to-one correspondence with the photoelectric conversion module 25, and the second sub-RF interface 222 is integrated into the photoelectric conversion module 25.

[0064] Specifically, the first sub-RF interface 221 is integrated into the electro-optical conversion module 23, so that the electro-optical conversion module 23 can convert the RF signal received by the first sub-RF interface 221 into an optical signal. Figure 2 The second RF interface 22 may include two second sub-RF interfaces 222, and each of the second sub-RF interfaces 222 is provided in a one-to-one correspondence with the optoelectronic conversion module 25. The second sub-RF interface 222 is integrated into the optoelectronic conversion module 25, so that the optoelectronic conversion module 25 can convert the optical signal received by the control board 2 into an RF signal and output it through the second sub-RF interface 222. By independently providing the first sub-RF interface 221 and at least one second sub-RF interface 222 in the second RF interface 22, modular transmission of RF signals in the optical module is achieved, so that RF signals can be independently transmitted and distributed, reducing the complexity of the RF signal transmission path, thereby improving the efficiency and reliability of RF signal transmission.

[0065] Optional, continue to refer to Figure 2 The control board 2 further includes an optical fiber interface 26 ; the optical fiber interface 26 is used to transmit or receive optical signals; the optical fiber interface 26 is arranged on one side edge of the control board.

[0066] Specifically, the optical fiber interface 26 can be understood as a physical interface in the control board 2 for connecting an optical fiber. The optical fiber interface 26 is used to couple the optical signal converted from the radio frequency signal by the electro-optical conversion module 23 to the optical fiber. The optical fiber can be understood as a medium for transmitting optical signals, and is used to transmit the optical signal generated by the electro-optical conversion module 23 to an external network or device to achieve external transmission of the optical signal. At the same time, the optical fiber interface 26 is also used to transmit the optical signal in the optical fiber to the optoelectronic conversion module 25, so that the optoelectronic conversion module 25 can convert the optical signal received by the optical fiber interface 26 into a radio frequency signal. In addition, the optical fiber interface 26 is provided on one side edge of the control board to optimize the input and output paths of the optical signal and avoid interference between the optical fiber interface 26 and the radio frequency signal or control signal transmission path, thereby reducing electromagnetic interference and spatial conflict between the optical signal and the electrical signal, improving the signal integrity and working stability of the optical module, and facilitating the plugging and unplugging of the optical fiber, thereby improving the ease of use of the optical module.

[0067] Optional, continue to refer to Figure 2 The electro-optical conversion module 23 and each photoelectric conversion module 25 are located on a side of the second control module 24 close to the radio frequency board 1 .

[0068] For details, please refer to Figure 2 The electro-optical conversion module 23 and the two optoelectronic conversion modules 25 are both located on the side of the second control module 24 close to the RF board 1, so that the first sub-RF interface 221 integrated in the electro-optical conversion module 23 and the second sub-RF interface 222 integrated in the optoelectronic conversion module 25 are both close to the first RF interface 12 in the RF board 1, thereby reducing the loss and delay of the RF signal during transmission and improving the efficiency of RF signal transmission. At the same time, the close distance facilitates the physical interconnection between the RF board 1 and the control board 2 through wire bonding. By shortening the wire length, the parasitic inductance and capacitance are reduced, further improving the transmission performance of the RF signal.

[0069] Optional, continue to refer to Figure 2 The first RF interface 12 includes a third sub-RF interface 121 and at least one fourth sub-RF interface 122; the third sub-RF interface 121 and the first sub-RF interface 221 are connected correspondingly; the fourth sub-RF interface 122 and the second sub-RF interface 222 are connected one-to-one.

[0070] Specifically, the third sub-RF interface 121 in the first RF interface 12 is connected to the first sub-RF interface 221 so that the electro-optical conversion module 23 can convert the RF signal transmitted sequentially through the third sub-RF interface 121 and the first sub-RF interface 221 into an optical signal. Figure 2The fourth sub-RF interface 122 may include two fourth sub-RF interfaces 122, and the fourth sub-RF interface 122 and the second sub-RF interface 222 are connected in a one-to-one correspondence, so that the optoelectronic conversion module 25 can convert the optical signal received by the control board 2 into a RF signal, and output it in sequence through the second sub-RF interface 222 and the fourth sub-RF interface 122. By setting the third sub-RF interface 121 and the first sub-RF interface 221 to be connected in a one-to-one correspondence, and the fourth sub-RF interface 122 and the second sub-RF interface 222 to be connected in a one-to-one correspondence, the optical module realizes the precise transmission and modular management of the RF signal, ensures the directional transmission of the RF signal between the RF board 1 and the control board 2, avoids the confusion and interference of the RF signal, improves the efficiency and reliability of the RF signal transmission, and facilitates the modular design and independent debugging of the optical module.

[0071] Optional, continue to refer to Figure 2 The mainboard interface 13 and the first RF interface 12 are located on opposite sides of the digital processing module 14 .

[0072] Specifically, the motherboard interface 13 and the first RF interface 12 are disposed on opposite sides of the digital processing module 14 to increase the physical distance between the motherboard interface 13 and the first RF interface 12. The motherboard interface 13 primarily transmits low-speed digital signals and control signals, while the first RF interface 12 primarily transmits high-speed RF signals. The signal characteristics of the two differ significantly. Therefore, increasing the physical distance between the motherboard interface 13 and the first RF interface 12 effectively isolates electromagnetic interference between the low-speed and high-speed signals, thereby preventing crosstalk between the high-speed RF signals and the low-speed digital signals, and improving the stability and reliability of signal transmission in the optical module.

[0073] Optional, Figure 3 FIG. 1 is a schematic diagram of the structure of another optical module provided by an embodiment of the present invention. Figure 3 As shown, the RF board 1 also includes a first power supply interface 16 and a first power conversion module 17; the control board 2 also includes a second power supply interface 27 and a second power conversion module 28; the first power supply interface 16 and the second power supply interface 27 are detachably connected; the mainboard interface 13 is connected to the first power supply interface 16 through the first power conversion module 17; the first power conversion module 17 is used to convert the power supply signal into the power supply voltage required by the digital processing module 14 and provide it to the digital processing module 14, and send the power supply signal to the first power supply interface 16; the second power conversion module 28 is used to receive the power supply signal through the first power supply interface 16 and the second power supply interface 27 in sequence, and convert the power supply signal into the power supply voltage required by the electro-optical conversion module 23 and provide it to the electro-optical conversion module 23.

[0074] Among them, the first power supply interface 16 and the second power supply interface 27 can be specifically understood as a physical connection channel for transmitting power signals between the RF board 1 and the control board 2, so as to provide a path for the external mainboard to supply power to the control board 2 through the RF board 1. The first power supply interface 16 and the second power supply interface 27 are detachably connected, so that the RF board 1 can be connected to the control board 2 with different optical designs. At the same time, the control board 2 can be connected to different types of RF boards 1, so that the optical module can meet the needs of different application scenarios, thereby improving the flexibility of the optical module. Exemplarily, the signal between the first power supply interface 16 and the second power supply interface 27 can be physically interconnected by wire bonding, that is, the pads on the RF board 1 and the control board 2 can be directly connected by thin metal wires to form an electrical path between the first power supply interface 16 and the second power supply interface 27, so that a DC power signal can be transmitted. Specifically, the mainboard interface 13 is connected to the first power supply interface 16 through the first power conversion module 17, so that the external mainboard can provide a power signal, such as a 3.3V voltage, to the first power conversion module 17 through the mainboard interface 13, so as to power the digital processing module 14 and the first control module 15 in the RF board 1. At the same time, the first power conversion module 17 can also send a power supply signal to the first power supply interface 16, for example, transmit a 3.3V voltage to the first power supply interface 16, so that the second power conversion module 28 can receive the power supply signal through the first power supply interface 16 and the second power supply interface 27 in sequence, so as to be able to power the electro-optical conversion module 23 and the second control module 24 in the control board 2. The RF board 1 and the control board 2 are uniformly powered by the mainboard interface 13, the first power supply interface 16 and the second power supply interface 27, which enhances the flexibility of the modular design of the optical module. There is no need to set a separate power input for the control board 2. The control board 2 can obtain the power signal from the RF board 1 only through the first power supply interface 16 and the second power supply interface 27, thereby reducing the loss of the power signal and improving the power supply efficiency.

[0075] In addition, the first power conversion module 17 and the second power conversion module 28 can be specifically understood as functional components for power conversion in the radio frequency board 1 and the control board 2, respectively. Exemplarily, the first power conversion module 17 and the second power conversion module 28 can be DC-DC power supply chips. The DC-DC power supply chip can be specifically understood as a DC-DC converter that can convert the input DC voltage into DC output voltages of different levels. Specifically, the external motherboard provides a power supply signal, such as a 3.3V DC voltage, to the first power conversion module 17 through the motherboard interface 13. The first power conversion module 17 can reduce the input 3.3V DC voltage to the voltage required by the digital processing module 14, such as 1.2V, through the switching circuit in the DC-DC power supply chip, and can provide the converted 1.2V voltage to the digital processing module 14, thereby ensuring the normal operation of the digital processing module 14. At the same time, the first power conversion module 17 can also send a power supply signal to the first power supply interface 16, so that the second power conversion module 28 can receive the power supply signal, such as 3.3V DC voltage, through the first power supply interface 16 and the second power supply interface 27 in sequence. The second power conversion module 28 can reduce the input 3.3V DC voltage to the voltage required by the electro-optical conversion module 23 through the switching circuit in the DC-DC power supply chip, such as the 1.8V voltage required by the silicon optical modulator, and can provide the converted 1.8V voltage to the silicon optical modulator. If the voltage required by the laser is 3.3V, the second power conversion module 28 can directly provide the 3.3V voltage to the laser without reducing the voltage, thereby ensuring the normal operation of the silicon optical modulator and the laser in the electro-optical conversion module 23.

[0076] The first power conversion module 17 and the second power conversion module 28 convert the unified power supply signal provided by the external motherboard into the power supply voltage required by the digital processing module 14 and the electro-optical conversion module 23, ensuring that the digital processing module 14 and the electro-optical conversion module 23 can operate at the optimal voltage, thereby improving the operating efficiency of the optical module. The independent configuration of the first power conversion module 17 and the second power conversion module 28 enhances the flexibility of the modular design of the optical module. If the electro-optical conversion module 23 with a different optical design is replaced, only the output voltage of the second power conversion module 28 needs to be adjusted, without modifying the power supply design of the RF board 1. This improves the compatibility of the optical module with different types of chips and significantly shortens the design and verification cycle. At the same time, by configuring the first power conversion module 17 and the second power conversion module 28 as DC-DC power supply chips, the DC-DC power supply chip has high conversion efficiency, which can reduce energy loss during the voltage conversion process, thereby reducing the overall power consumption of the optical module. The small size and high integration of the DC-DC power supply chip reduce the space occupied by the power management circuit in the RF board 1 and the control board 2, thereby reducing the design and manufacturing cost of the optical module.

[0077] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present invention can be achieved. This is not limited herein.

[0078] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. An optical module, characterized in that: include: Independent RF board and control board; The radio frequency board includes a first control signal interface, a first radio frequency interface, a mainboard interface, a digital processing module, and a first control module; the control board includes a second control signal interface, a second radio frequency interface, an electro-optical conversion module, and a second control module; the first radio frequency interface and the second radio frequency interface are detachably connected; the first control signal interface and the second control signal interface are detachably connected; the mainboard interface is used to connect to an external mainboard; The digital processing module is used to convert the mainboard digital signal received by the mainboard interface into a radio frequency signal, and send it to the electro-optical conversion module through the first radio frequency interface and the second radio frequency interface in sequence; The electro-optical conversion module is used to convert the radio frequency signal into an optical signal; The first control module is used to obtain the working condition signal of the digital processing module, convert the working condition signal of the digital processing module into a first working condition signal in a preset format, and then send it to the mainboard interface; The second control module is used to obtain the operating condition signal of the electro-optical conversion module, and convert the operating condition signal of the electro-optical conversion module into a second operating condition signal in the preset format, and then send it to the mainboard interface through the second control signal interface, the first control signal interface and the first control module in sequence.

2. The optical module according to claim 1, wherein The first control module is further configured to receive a digital processing control signal through the mainboard interface, convert the digital processing control signal into a first control signal adapted to the digital processing module, and then send the first control signal to the digital processing module to control the working state of the digital processing module; The first control module is further configured to receive an electro-optical conversion control signal through the mainboard interface, and sequentially send the signal to the second control module through the first control signal interface and the second control signal interface; The second control module is further configured to convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module and then send the second control signal to the electro-optical conversion module to control the working state of the electro-optical conversion module.

3. The optical module according to claim 1, wherein: The control board also includes at least one photoelectric conversion module; The photoelectric conversion module is used to convert the optical signal received by the control board into a radio frequency signal, and send it to the digital processing module through the second radio frequency interface and the first radio frequency interface in sequence; The digital processing module is further configured to convert the radio frequency signal received by the first radio frequency interface into a digital signal, and output the digital signal through the mainboard interface.

4. The optical module according to claim 3, wherein: The second radio frequency interface includes a first sub-radio frequency interface and at least one second sub-radio frequency interface; The first sub-RF interface is integrated into the electro-optical conversion module; The second sub-RF interface is provided in a one-to-one correspondence with the photoelectric conversion module, and the second sub-RF interface is integrated into the photoelectric conversion module.

5. The optical module according to claim 4, wherein: The control board also includes an optical fiber interface; the optical fiber interface is used to transmit or receive optical signals; The optical fiber interface is arranged on one side edge of the control board.

6. The optical module according to claim 3, wherein: The electro-optical conversion module and each of the photoelectric conversion modules are located on a side of the second control module close to the radio frequency board.

7. The optical module according to claim 4, wherein: The first radio frequency interface includes a third sub-radio frequency interface and at least one fourth sub-radio frequency interface; The third sub-RF interface is correspondingly connected to the first sub-RF interface; The fourth sub-RF interface and the second sub-RF interface are connected in a one-to-one correspondence.

8. The optical module according to claim 1, wherein: The mainboard interface and the first radio frequency interface are located on opposite sides of the digital processing module.

9. The optical module according to claim 1, wherein: The electro-optical conversion module includes a laser and a silicon optical modulator; The control signal output end of the silicon optical modulator is connected to the control signal input end of the laser; and the input end of the silicon optical modulator is connected to the second radio frequency interface.

10. The optical module according to claim 1, wherein: The RF board further includes a first power supply interface and a first power conversion module; the control board further includes a second power supply interface and a second power conversion module; the first power supply interface and the second power supply interface are detachably connected; the mainboard interface is connected to the first power supply interface through the first power conversion module; The first power conversion module is used to convert the power supply signal into the power supply voltage required by the digital processing module and then provide it to the digital processing module, and send the power supply signal to the first power supply interface; The second power conversion module is used to receive the power supply signal through the first power supply interface and the second power supply interface in sequence, and convert the power supply signal into the power supply voltage required by the electro-optical conversion module and then provide it to the electro-optical conversion module.

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