Packaging device for integrated circuit

Abstract

The invention discloses a packaging device for an integrated circuit, and relates to the technical field of packaging devices for integrated circuits, the packaging device for the integrated circuit comprises a box body and a sealing cover, a locking device is fixed on the outer wall of the box body, the locking device comprises a limiting plate, a plug pin and a hinge plate, the limiting plate is fixedly connected to the outer wall of the box body, and the plug pin is fixedly connected to the hinge plate. The plug pin penetrates through the limiting plate, the hinge plate is hinged to the bottom face of the sealing cover, and a clamping device for automatically clamping and limiting the integrated circuit is arranged on the inner wall of the box body. According to the packaging device for the integrated circuit, when the integrated circuit is packaged, only the integrated circuit needs to be placed in the box body and covered with the sealing cover, the sealing cover can push a first sliding plate to slide downwards, and a first hinge rod is driven to push a second sliding plate to slide towards the center of the box body; and a first spring is matched to push a first clamping plate to push the integrated circuit to the dead center of the box body and clamp the integrated circuit, so that a worker can conveniently position the integrated circuit.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging devices, and in particular to an integrated circuit packaging device. Background Art

[0002] Integrated circuits are the core of modern electronic devices. With the rapid development of electronic technology, the integration of integrated circuits is getting higher and higher, and the functions are becoming more and more powerful. The requirements for their packaging are also constantly increasing. Packaging can not only provide physical protection for integrated circuit chips to protect them from external environment such as moisture, dust, mechanical shock, etc., but also realize the electrical connection between the chip and the external circuit, ensuring the stable transmission of signals, which plays a key role in the performance, reliability and service life of integrated circuits.

[0003] The patent announcement number is CN211700239U, which is a packaging device for integrated circuits. It includes an outer shell, a heat dissipation base, an upper cover, fastening bolts, a handle, a heat sink, a heat dissipation port, a clamping device and a fixing device. In the above application, a clamping device is arranged on the inner side of the outer shell, and by rotating the knob, the first bevel gear drives the second bevel gear to rotate, and the second bevel gear drives the screw to rotate, so that the screw drives the first screw sleeve and the second screw sleeve to rotate, so that the left clamping plate and the right clamping plate move toward the middle, and then the integrated circuit is fixed. At the same time, a fixing device is arranged in the middle of the bottom end of the upper cover. After the upper cover is covered, the spring is forced to drive the clip to assist in fixing the upper end of the integrated circuit, and the clamping device is used to achieve a double fixing effect, so that the integrated circuit is more firmly fixed in the packaging device to prevent damage caused by shaking.

[0004] However, the above-mentioned equipment needs to manually adjust the clamping device to clamp the integrated circuit. Most integrated circuits are relatively thin circuit boards, and the materials they are made of are brittle and easy to break. Manual adjustment can only be judged by visual conditions, which is not only inconvenient for staff to operate, but also easy to cause the integrated circuit to be clamped and folded after adjustment, or there is a gap that is not completely clamped. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a packaging device for an integrated circuit, which solves the problems raised in the above background technology.

[0006] To achieve the above object, the present invention is realized by the following technical solutions: A packaging device for integrated circuits, comprising a box body and a sealing cover. A locking device is fixed on the outer wall of the box body. The locking device includes a limiting plate, a bolt and a hinged plate. The limiting plate is fixedly connected to the outer wall of the box body. The bolt passes through the limiting plate and is slidably connected at the passing-through position. The hinged plate is hinged to the bottom surface of the sealing cover. A clamping device for automatically clamping and limiting the integrated circuit is arranged on the inner wall of the box body. An adsorption device for making the placement of the integrated circuit more stable is arranged on the bottom surface of the inner wall of the box body. A sealing device for further sealing the device is arranged on the side wall of the box body;

[0007] Among them, the clamping device includes a first sliding plate, a first hinged rod, a second sliding plate, a first spring, a first clamping plate, a second hinged rod, a pressing rod, a second clamping plate, a second spring and a third spring. The first sliding plate is slidably connected to the left and right sides of the inner wall of the box body. Fixed plates are fixed on the left and right sides of the inner wall of the box body. The first hinged rod is hinged to the side wall of the first sliding plate. When the first sliding plate slides, it drives the first hinged rod to move.

[0008] According to the above technical solution, the end of the first hinged rod away from the first sliding plate is hinged to the side wall of the second sliding plate. When the first hinged rod moves, it rotates at the same time. When the first hinged rod rotates, it drives the second sliding plate to slide. The second sliding plate is slidably connected to the bottom surface of the inner wall of the box body. The first spring is fixedly connected to the side of the second sliding plate away from the first hinged rod. When the second sliding plate slides, it drives the first spring to move. The first clamping plate is fixedly connected to the end of the first spring away from the second sliding plate. When the first spring moves, it drives the first clamping plate to slide.

[0009] According to the above technical solution, the second hinged rod is hinged to the side of the first clamping plate away from the first spring. When the first clamping plate slides, it drives the second hinged rod to move. The ends of the second hinged rods away from the first clamping plate are hinged to each other. When the second hinged rod moves, it rotates at the same time. The pressing rod passes through the hinge point where the second hinged rods are hinged to each other and is rotatably connected at the passing-through position. When the second hinged rod rotates, it pushes the pressing rod to slide. The pressing rod is slidably connected to the front and back sides of the inner wall of the box body.

[0010] According to the above technical solution, the second clamping plate is slidably connected to the bottom surface of the inner wall of the box body. A bevel block is fixed to the back surface of the second clamping plate. When the pressing rod slides, it pushes the bevel block to slide. The bevel block drives the second clamping plate to slide. The second spring is fixedly connected to the back surface of the second clamping plate. The end of the second spring away from the second clamping plate is fixedly connected to the inner wall of the box body. A third spring is fixed to the bottom surface of the first sliding plate. The end of the third spring away from the first sliding plate is fixedly connected to the upper surface of the fixed plate.

[0011] According to the above technical solution, the adsorption device includes a pressing block, a pressing plate, an air extraction rod, a suction cup, a top rod, a push plate and a fourth spring. The pressing block is fixedly connected to the bottom surface of the second clamping plate. When the second clamping plate slides, it drives the pressing block to slide. The pressing block penetrates the bottom surface of the box body, and the penetration part is slidably connected.

[0012] According to the above technical solution, the pressing plate is slidably connected to the inner wall of the box body. The pressing block slides to push the pressing plate to slide. The air extraction rod is fixedly connected to the upper surface of the pressing plate. The air extraction rod penetrates the bottom surface of the box body, and the penetration part is slidably connected. The sliding of the pressing plate drives the air extraction rod to slide. The suction cup is fixedly connected to the bottom surface of the inner wall of the box body.

[0013] According to the above technical solution, the top rod is fixedly connected to the upper surface of the pressing plate. The sliding of the pressing plate drives the top rod to slide. The push plate is fixedly connected to the upper end of the top rod. The sliding of the top rod drives the push plate to move. The upper end of the fourth spring is fixedly connected to the bottom surface of the pressing plate, and the lower end of the fourth spring is fixedly connected to the inner wall of the box body.

[0014] According to the above technical solution, the sealing device includes a connecting rod, a piston plate, an air storage cavity, a pipeline and an airbag. The connecting rod is fixedly connected to the side wall of the first sliding plate. The sliding of the first sliding plate drives the connecting rod to move. The piston plate is fixedly connected to the bottom end of the connecting rod. The movement of the connecting rod drives the piston plate to slide. The air storage cavity is fixedly connected to the bottom surface of the inner wall of the box body.

[0015] According to the above technical solution, the connecting rod penetrates the upper surface of the air storage cavity, and the penetration part is slidably connected. The side wall of the piston plate fits with the inner wall of the air storage cavity. The sliding of the piston plate pushes the gas out of the air storage cavity. One end of the side wall of the air storage cavity is communicated with one end of the pipeline, and the end of the pipeline far away from the air storage cavity is communicated with the airbag. The airbag is fixedly connected to the interlayer of the inner wall of the box body.

[0016] The present invention provides a packaging device for integrated circuits. It has the following beneficial effects:

[0017] (1). The present invention is provided with a clamping device. When packaging an integrated circuit, only need to place the integrated circuit in the box body and cover the sealing cover. The sealing cover can push the first sliding plate to slide downward, drive the first hinge rod to push the second sliding plate to slide towards the center of the box body, and cooperate with the first spring to push the first clamping plate to push the integrated circuit to the exact center of the box body and clamp it, which is convenient for the staff to position the integrated circuit; while the first clamping plate clamps the integrated circuit, it drives the second hinge rod to rotate, drives the extrusion rod to slide downward, and pushes the second clamping plate to slide towards the center of the box body, further limiting the integrated circuit from the front and back sides, avoiding the integrated circuit sliding inside the box body and hitting the inner wall of the box body and causing damage when moving after the packaging is completed.

[0018] (2) The present invention is provided with an adsorption device. When packaging an integrated circuit, as the second clamping plates approach each other, while clamping the integrated circuit, it drives the extrusion block to slide towards the center of the box body, pushing the extrusion plate to slide downward. When the extrusion plate slides downward, it drives the ejector rod to slide downward, and cooperates with the push plate to horizontally place the integrated circuit above the suction cup, preventing the integrated circuit from skewing during clamping, ensuring there is a gap between the suction cup and the integrated circuit, and making it impossible to further fix the integrated circuit subsequently. At the same time, when opening the device to take out the integrated circuit, it automatically ejects the integrated circuit, making it more convenient for the staff to take. During packaging, the extrusion plate drives the air extraction rod to slide downward, extracting the air between the suction cup and the integrated circuit, reducing the air density and increasing the pressure between the integrated circuit and the suction cup, further fixing the integrated circuit inside the box body, preventing it from moving up and down due to jolts during movement and being damaged by impacts inside the box body.

[0019] (3) The present invention is provided with a sealing device. During packaging, the first sliding plate drives the connecting rod to move downward, pushing the piston plate to slide downward, pushing the gas inside the gas storage cavity into the airbag through the pipeline. The airbag expands, blocking the gap between the sealing cover and the box body, making the device have better sealing performance during packaging and improving the packaging effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic sectional view of the present invention;

[0022] Figure 3 is a schematic full-sectional view of the present invention;

[0023] Figure 4 is the present invention Figure 3 schematic diagram of the partial enlarged structure of area A of the present invention;

[0024] Figure 5 is a schematic diagram of the internal structure of the present invention;

[0025] Figure 6 is a schematic semi-sectional view of the box body of the present invention;

[0026] Figure 7 is a schematic diagram of the adsorption device structure of the present invention.

[0027] In the figure: 1. Box body; 2. Sealing cover; 3. Locking device; 4. Clamping device; 41. First sliding plate; 42. First hinge rod; 43. Second sliding plate; 44. First spring; 45. First clamping plate; 46. Second hinge rod; 47. Extrusion rod; 48. Second clamping plate; 49. Second spring; 410. Third spring; 5. Adsorption device; 51. Extrusion block; 52. Extrusion plate; 53. Air extraction rod; 54. Suction cup; 55. Thrust rod; 56. Push plate; 57. Fourth spring; 6. Sealing device; 61. Connecting rod; 62. Piston plate; 63. Air storage cavity; 64. Pipeline; 65. Air bag. Detailed implementation manner

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Please refer to Figures 1 - 7 One embodiment of the present invention is: A packaging device for integrated circuits, including a box body 1 and a sealing cover 2. A locking device 3 is fixed on the outer wall of the box body 1. The locking device 3 includes a limiting plate, a bolt and a hinge plate. The limiting plate is fixedly connected to the outer wall of the box body 1. The bolt penetrates through the limiting plate, and the penetration part is slidably connected. The hinge plate is hinged to the bottom surface of the sealing cover 2. A clamping device 4 for automatically clamping and limiting the integrated circuit is arranged on the inner wall of the box body 1.

[0030] Among them, the clamping device 4 includes a first sliding plate 41, a first hinge rod 42, a second sliding plate 43, a first spring 44, a first clamping plate 45, a second hinge rod 46, a pressing rod 47, a second clamping plate 48, a second spring 49 and a third spring 410. The first sliding plate 41 is slidably connected to the left and right sides of the inner wall of the box body 1. When closing the sealing cover 2, the sealing cover 2 will push the first sliding plate 41 to slide downward. Fixed plates are provided on the left and right sides of the inner wall of the box body 1. The first hinge rod 42 is hinged to the side wall of the first sliding plate 41. The end of the first hinge rod 42 away from the first sliding plate 41 is hinged to the side wall of the second sliding plate 43. When the first sliding plate 41 slides downward, it drives the first hinge rod 42 to slide downward. Since the height of the hinge point between the first hinge rod 42 and the second sliding plate 43 remains unchanged, when the first sliding plate 41 drives the first hinge rod 42 to move downward, the first hinge rod 42 also rotates around the hinge point between the first hinge rod 42 and the second sliding plate 43. The second sliding plate 43 is slidably connected to the bottom surface of the inner wall of the box body 1. The first hinge rod 42 rotates to push the second sliding plate 43 to slide towards the center of the box body 1. The first spring 44 is fixedly connected to the side of the second sliding plate 43 away from the first hinge rod 42. When the second sliding plate 43 slides, it drives the first spring 44 to move. The first clamping plate 45 is fixedly connected to the end of the first spring 44 away from the second sliding plate 43. The first spring 44 adapts to the size of the integrated circuit, preventing the first clamping plate 45 from applying excessive force when clamping the integrated circuit and damaging the integrated circuit. The first spring 44 pushes the first clamping plate 45 to slide towards the center. The first clamping plates 45 on both sides slide towards the center to clamp the integrated circuit placed in the box body 1 and at the same time position the integrated circuit, pushing the integrated circuit to the exact center of the box body 1, facilitating further fixation in the subsequent process. The second hinge rod 46 is hinged to the side of the first clamping plate 45 away from the first spring 44. The ends of the second hinge rod 46 away from the first clamping plate 45 are hinged to each other. When the two first clamping plates 45 approach each other, they drive the second hinge rod 46 to move. Since the distance between the two first clamping plates 45 becomes smaller, but the length of the second hinge rod 46 remains unchanged, when the two first clamping plates 45 drive the second hinge rod 46 to approach each other, they also rotate. The rotation of the second hinge rod 46 causes the hinge point where they are hinged to move downward. The pressing rod 47 passes through the hinge point where the second hinge rod 46 is hinged, and the passing point is rotatably connected. The pressing rod 47 is slidably connected to the front and rear sides of the inner wall of the box body 1. When the hinge point where the second hinge rod 46 is hinged moves downward, it pushes the pressing rod 47 to slide downward along the inner wall of the box body 1. The second clamping plate 48 is slidably connected to the bottom surface of the inner wall of the box body 1. A bevel block is fixed to the back of the second clamping plate 48. When the pressing rod 47 slides downward, it pushes the bevel block on the back of the second clamping plate 48 to slide. When the bevel block slides, the second clamping plate 48 also slides towards the exact center of the box body 1 to clamp and position the integrated circuit from the front and rear, preventing the integrated circuit from sliding and colliding inside the box body 1 and being damaged when moving after the encapsulation is completed.The second spring 49 is fixedly connected to the back surface of the second clamping plate 48. One end of the second spring 49 away from the second clamping plate 48 is fixedly connected to the inner wall of the box body 1. When the second clamping plate 48 slides towards the center, the second spring 49 is stretched. When the clamping device 4 is released, the second clamping plate 48 slides in the direction away from the center of the box body 1 under the restoring elastic force of the second spring 49 to release the integrated circuit. A third spring 410 is fixed to the bottom surface of the first sliding plate 41. One end of the third spring 410 away from the first sliding plate 41 is fixedly connected to the upper surface of the fixed plate. When the sealing cover 2 is opened, the third spring 410 pushes the first sliding plate 41 upward to release the clamping device 4. When packaging the integrated circuit, the clamping device 4 only needs to place the integrated circuit in the box body 1, cover the sealing cover 2, and the sealing cover 2 can push the first sliding plate 41 to slide downward, driving the first hinge rod 42 to push the second sliding plate 43 to slide towards the center of the box body 1, and cooperating with the first spring 44 to push the first clamping plate 45 to push the integrated circuit to the exact center of the box body 1 and clamp it, which is convenient for subsequent further fixation; while the first clamping plate 45 clamps the integrated circuit, it drives the second hinge rod 46 to rotate, driving the pressing rod 47 to slide downward, pushing the second clamping plate 48 to slide towards the center of the box body 1, further limiting the integrated circuit from the front and back sides, avoiding the integrated circuit sliding inside the box body 1 and hitting the inner wall of the box body 1 and causing damage when moving after the packaging is completed.,

[0031] During the operation of this embodiment: Place the integrated circuit on the push plate 56, cover the sealing cover 2, make the fixing plate penetrate through the hinge plate, and then toggle the bolt so that the bolt penetrates through the fixing plate. When the sealing cover 2 is closed, push the first sliding plate 41 downward. The first sliding plate 41 slides downward along the inner wall of the box body 1. While the first sliding plate 41 slides downward, it compresses the third spring 410. When the first sliding plate 41 slides downward, it drives the first hinge rod 42 to slide downward. Since the height of the hinge point between the first hinge rod 42 and the second sliding plate 43 remains unchanged, when the first sliding plate 41 drives the first hinge rod 42 to move downward, the first hinge rod 42 also rotates around the hinge point between the first hinge rod 42 and the second sliding plate 43. The first hinge rod 42 rotates and pushes the second sliding plate 43 to slide towards the center of the box body 1. When the second sliding plate 43 slides, it drives the first spring 44 to move. The first spring 44 pushes the first clamping plate 45 to slide towards the center. The two first clamping plates 45 slide towards the center to clamp the integrated circuit placed in the box body 1. When the two first clamping plates 45 approach each other, they drive the second hinge rod 46 to move. Since the distance between the two first clamping plates 45 becomes smaller, but the length of the second hinge rod 46 remains unchanged, when the two first clamping plates 45 drive the second hinge rod 46 to approach each other, they also rotate. The rotation of the second hinge rod 46 causes the hinge point where they are hinged to move downward. When the hinge point where the second hinge rod 46 is hinged moves downward, it pushes the extrusion rod 47 to slide downward along the inner wall of the box body 1. When the extrusion rod 47 slides downward, it pushes the inclined plane block on the back of the second clamping plate 48 to slide, driving the second clamping plate 48 to also slide towards the center. When the second clamping plate 48 slides towards the center, it stretches the second spring 49 and clamps the integrated circuit from the front and back sides at the same time. When the sealing cover 2 is opened, the first sliding plate 41 slides upward under the elastic force of the third spring 410, driving the first hinge rod 42 to move upward. When the first hinge rod 42 moves upward, it pulls the second sliding plate 43 to slide away from the center of the box body 1. The second sliding plate 43 drives the first spring 44 to move. The first spring 44 drives the first clamping plate 45 to release the integrated circuit. When the first clamping plates 45 move away from each other, they drive the second hinge rod 46 to rotate. The second hinge rod 46 drives the extrusion rod 47 to slide upward. The second clamping plate 48 slides away from the center of the box body 1 under the pulling force of the second spring 49, releasing the integrated circuit.

[0032] Please refer to Figures 1 - 7, on the basis of the above embodiments, in another embodiment of the present invention, an adsorption device 5 for making the integrated circuit more stable when placed is provided on the bottom surface of the inner wall of the box body 1. The adsorption device 5 includes a pressing block 51, a pressing plate 52, an air extraction rod 53, a suction cup 54, a top rod 55, a push plate 56 and a fourth spring 57. The pressing block 51 is fixedly connected to the bottom surface of the second clamping plate 48. When the second clamping plates 48 approach each other to clamp the integrated circuit, the pressing block 51 is driven to slide towards the center of the box body 1. The pressing block 51 penetrates the bottom surface of the box body 1, and the penetration part is slidably connected. The pressing plate 52 is slidably connected to the inner wall of the box body 1. When the pressing block 51 contacts the pressing plate 52, the pressing plate 52 is pushed to slide downward along the inclined surface of the pressing plate 52. The air extraction rod 53 is fixedly connected to the upper surface of the pressing plate 52. The air extraction rod 53 penetrates the bottom surface of the box body 1, and the penetration part is slidably connected. When the pressing plate 52 slides downward, the air extraction rod 53 is driven to slide downward. The suction cup 54 is fixedly connected to the bottom surface of the inner wall of the box body 1. When the air extraction rod 53 slides downward, the air between the integrated circuit and the suction cup 54 is extracted, so that the air density between the integrated circuit and the suction cup 54 becomes smaller and the pressure becomes larger. The top rod 55 is fixedly connected to the upper surface of the pressing plate 52. When the pressing plate 52 slides downward, the top rod 55 is driven to slide downward. The push plate 56 is fixedly connected to the upper end of the top rod 55. When the top rod 55 slides downward, the push plate 56 is driven to move downward, so that the gap between the integrated circuit and the suction cup 54 is smaller when they are in contact. The upper end of the fourth spring 57 is fixedly connected to the bottom surface of the pressing plate 52, and the lower end of the fourth spring 57 is fixedly connected to the inner wall of the box body 1. When the pressing plate 52 slides downward, the fourth spring 57 is compressed. When the adsorption device 5 packages the integrated circuit, through the mutual approach of the second clamping plates 48, while clamping the integrated circuit, the pressing block 51 is driven to slide towards the center of the box body 1, pushing the pressing plate 52 to slide downward. When the pressing plate 52 slides downward, the top rod 55 is driven to slide downward, and the push plate 56 is used to horizontally place the integrated circuit above the suction cup 54, avoiding the integrated circuit from being skewed when clamped, so that there is a gap between the suction cup 54 and the integrated circuit, and the integrated circuit cannot be further fixed subsequently. At the same time, when the device is opened to take out the integrated circuit, the integrated circuit is automatically pushed out, which is more convenient for the staff to take. When packaging, the pressing plate 52 drives the air extraction rod 53 to slide downward, extracting the air between the suction cup 54 and the integrated circuit, making the air density between the integrated circuit and the suction cup 54 smaller and the pressure larger, further fixing the integrated circuit inside the box body 1, avoiding the integrated circuit from moving up and down due to bumps during movement and being impacted inside the box body 1.

[0033] A sealing device 6 for further sealing the device is provided on the side wall of the box body 1. The sealing device 6 includes a connecting rod 61, a piston plate 62, an air storage chamber 63, a pipeline 64 and an airbag 65. The connecting rod 61 is fixedly connected to the side wall of the first sliding plate 41. When the first sliding plate 41 slides downward, it drives the connecting rod 61 to move downward. The piston plate 62 is fixedly connected to the bottom end of the connecting rod 61. When the connecting rod 61 moves downward, it drives the piston plate 62 to slide downward. The air storage chamber 63 is fixedly connected to the bottom surface of the inner wall of the box body 1. The connecting rod 61 penetrates the upper surface of the air storage chamber 63, and the penetration part is slidably connected. The side wall of the piston plate 62 is in contact with the inner wall of the air storage chamber 63. When the piston plate 62 slides downward, the gas inside the air storage chamber 63 is pushed out. One end of the side wall of the air storage chamber 63 is communicated with one end of the pipeline 64, and the end of the pipeline 64 far away from the air storage chamber 63 is communicated with the airbag 65. The gas inside the air storage chamber 63 is transported to the airbag 65 through the pipeline 64, causing the airbag 65 to expand. The airbag 65 is fixedly connected to the interlayer of the inner wall of the box body 1. When the airbag 65 expands, it blocks the gap between the sealing cover 2 and the box body 1. When the sealing device 6 is sealed, the first sliding plate 41 drives the connecting rod 61 to move downward, pushing the piston plate 62 to slide downward, and pushing the gas inside the air storage chamber 63 into the airbag 65 through the pipeline 64. The airbag 65 expands and blocks the gap between the sealing cover 2 and the box body 1, making the device have better sealing performance during packaging and improving the packaging effect of the device.

[0034] During the operation of this embodiment: when the sealing cover 2 is closed, the second clamping plates 48 approach each other, driving the extrusion block 51 to slide towards the center of the box body 1. When the extrusion block 51 contacts the extrusion plate 52, it pushes the extrusion plate 52 to slide downward along the inclined surface of the extrusion plate 52. When the extrusion plate 52 slides downward, it compresses the fourth spring 57. When the extrusion plate 52 slides downward, it drives the ejector rod 55 to slide downward. When the ejector rod 55 slides downward, it drives the push plate 56 to move downward, making the gap between the integrated circuit and the suction cup 54 smaller when they are in contact. When the extrusion plate 52 slides downward, it drives the air extraction rod 53 to slide downward, extracting the air between the integrated circuit and the suction cup 54, making the air density between the integrated circuit and the suction cup 54 smaller and the pressure larger. When the sealing cover 2 is opened, the fourth spring 57 pushes the extrusion plate 52 to slide upward. The extrusion plate 52 drives the air extraction rod 53 to slide upward, restoring the air density between the integrated circuit and the suction cup 54. At the same time, the extrusion plate 52 drives the ejector rod 55 to slide upward, and the ejector rod 55 drives the push plate 56 to move upward, pushing the integrated circuit away from the suction cup 54.

[0035] When the sealing cover 2 is closed and the first sliding plate 41 slides downward, it drives the connecting rod 61 to move downward. The downward movement of the connecting rod 61 drives the piston plate 62 to slide downward, pushing out the gas inside the air storage cavity 63. The gas inside the air storage cavity 63 is transported through the pipeline 64 into the airbag 65, causing the airbag 65 to expand and block the gap between the sealing cover 2 and the box body 1. When the sealing cover 2 is opened, the first sliding plate 41 slides upward under the thrust of the third spring 410, driving the connecting rod 61 to slide upward. The connecting rod 61 drives the piston plate 62 to slide upward, sucking the gas on the inner wall of the airbag 65 back into the air storage cavity 63 through the pipeline 64 for convenient use next time.

[0036] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging device for an integrated circuit, comprising a box (1) and a sealing cover (2), characterized in that: The outer wall of the box (1) is fixed with a locking device (3), and the locking device (3) comprises a limit plate, a latch and a hinge plate, the limit plate is fixedly connected to the outer wall of the box (1), the latch passes through the limit plate and is slidably connected at the penetration point, the hinge plate is hinged to the bottom surface of the sealing cover (2), the inner wall of the box (1) is provided with a clamping device (4) for automatically clamping and limiting the integrated circuit, the bottom surface of the inner wall of the box (1) is provided with an adsorption device (5) for making the integrated circuit more stable when placed, and the side wall of the box (1) is provided with a sealing device (6) for further sealing the device; The clamping device (4) comprises a first sliding plate (41), a first hinge rod (42), a second sliding plate (43), a first spring (44), a first clamping plate (45), a second hinge rod (46), an extrusion rod (47), a second clamping plate (48), a second spring (49) and a third spring (410); the first sliding plate (41) is slidably connected to the left and right sides of the inner wall of the box body (1); fixed plates are fixed to the left and right sides of the inner wall of the box body (1); and the first hinge rod (42) is hinged to the side wall of the first sliding plate (41).

2. The integrated circuit packaging device according to claim 1, characterized in that: One end of the first hinge rod (42) away from the first sliding plate (41) is hinged to the side wall of the second sliding plate (43); the second sliding plate (43) is slidably connected to the bottom surface of the inner wall of the box body (1); the first spring (44) is fixedly connected to a side of the second sliding plate (43) away from the first hinge rod (42); and the first clamping plate (45) is fixedly connected to one end of the first spring (44) away from the second sliding plate (43).

3. The integrated circuit packaging device according to claim 2, characterized in that: The second hinged rod (46) is hinged on a side of the first clamping plate (45) away from the first spring (44), and one end of the second hinged rod (46) away from the first clamping plate (45) is hinged to each other. The extrusion rod (47) passes through the hinge point where the second hinged rod (46) is hinged to each other, and is rotatably connected at the penetration point. The extrusion rod (47) is slidably connected to the front and rear sides of the inner wall of the box body (1).

4. The integrated circuit packaging device according to claim 3, characterized in that: The second clamping plate (48) is slidably connected to the bottom surface of the inner wall of the box body (1), a ramp block is fixed to the back side of the second clamping plate (48), the second spring (49) is fixedly connected to the back side of the second clamping plate (48), one end of the second spring (49) away from the second clamping plate (48) is fixedly connected to the inner wall of the box body (1), and a third spring (410) is fixedly connected to the bottom surface of the first sliding plate (41), and one end of the third spring (410) away from the first sliding plate (41) is fixedly connected to the upper surface of the fixed plate.

5. The integrated circuit packaging device according to claim 1, characterized in that: The adsorption device (5) comprises an extrusion block (51), an extrusion plate (52), an air suction rod (53), a suction cup (54), a push rod (55), a push plate (56) and a fourth spring (57); the extrusion block (51) is fixedly connected to the bottom surface of the second clamping plate (48); the extrusion block (51) passes through the bottom surface of the box body (1) and is slidably connected at the penetration point.

6. The integrated circuit packaging device according to claim 5, characterized in that: The extrusion plate (52) is slidably connected to the inner wall of the box body (1), the suction rod (53) is fixedly connected to the upper surface of the extrusion plate (52), the suction rod (53) passes through the bottom surface of the box body (1) and is slidably connected at the penetration point, and the suction cup (54) is fixedly connected to the bottom surface of the inner wall of the box body (1).

7. The integrated circuit packaging device according to claim 6, characterized in that: The push rod (55) is fixedly connected to the upper surface of the extrusion plate (52), the push plate (56) is fixedly connected to the upper end of the push rod (55), the upper end of the fourth spring (57) is fixedly connected to the bottom surface of the extrusion plate (52), and the lower end of the fourth spring (57) is fixedly connected to the inner wall of the box body (1).

8. The integrated circuit packaging device according to claim 1, characterized in that: The sealing device (6) comprises a connecting rod (61), a piston plate (62), an air storage chamber (63), a pipeline (64) and an air bag (65), wherein the connecting rod (61) is fixedly connected to the side wall of the first sliding plate (41), the piston plate (62) is fixedly connected to the bottom end of the connecting rod (61), and the air storage chamber (63) is fixedly connected to the bottom surface of the inner wall of the box body (1).

9. The integrated circuit packaging device according to claim 8, characterized in that: The connecting rod (61) passes through the upper surface of the air storage chamber (63) and is slidably connected at the penetration point. The side wall of the piston plate (62) fits the inner wall of the air storage chamber (63). The side wall of the air storage chamber (63) is connected to one end of the pipe (64). The end of the pipe (64) away from the air storage chamber (63) is connected to the air bag (65). The air bag (65) is fixedly connected to the interlayer of the inner wall of the box body (1).

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