Organic light emitting display device

Abstract

An organic light emitting display device presented herein includes: a substrate; a plurality of light emitting diodes on the substrate; the packaging layer covers the plurality of light emitting diodes; a gas barrier layer on the encapsulation layer, the gas barrier layer having a curing rate of 90% or more; and a polarizer on the gas barrier layer, the bottom surface of the polarizer being in direct contact with the gas barrier layer. The organic light emitting display device is characterized by suppressing deterioration and discoloration of the polarizer by blocking exhaust gas generated from the organic material.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2023 - 0187548, filed on December 20, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to an organic light - emitting display device, and more particularly, to an organic light - emitting display device that suppresses deterioration of a polarizer in a high - temperature / high - humidity environment. Background Art

[0004] Display devices can be used in various types of equipment, such as TVs, monitors, tablet computers, navigators, game consoles, and mobile phones. As such display devices, various types of display devices, such as liquid - crystal display (LCD) devices or organic light - emitting display (OLED) devices, have been used.

[0005] Among various display devices, an organic light - emitting display device does not require a separate light source. Therefore, an organic light - emitting display device can be made light and thin and has processing advantages, and has low power consumption according to low - voltage driving. In addition, an organic light - emitting display device includes self - emitting elements and includes layers formed of organic thin films, so that it is more flexible and elastic than other display devices and can be designed in various shapes.

[0006] Generally, in order to suppress deterioration of visibility and contrast caused by light incident from the outside into a display device, a polarizer is provided on a display panel in an organic light - emitting display device. Summary of the Invention

[0007] Generally, a polarizer of an organic light - emitting display device includes a polarizing film formed of polyvinyl alcohol (PVA) treated with iodine. In a high - temperature / high - humidity environment, exhaust gases such as acids are generated from an organic material layer provided below the polarizer and penetrate into the polarizer. This acid component generates hydrogen ions, and the hydrogen ions react with the polyvinyl alcohol of the polarizing film. The polyvinyl alcohol is deteriorated by hydrogen ions into polyene containing multiple double bonds. As described above, as the number of double bonds increases, the absorption wavelength of the polarizer moves from the UV wavelength band to the visible - light wavelength band, which results in a decrease in transmittance. In addition, when polyene is generated, there is a problem of a reddish phenomenon in which the polarizer changes color to red.

[0008] Specifically, when glass is used as a cover member, heat transfer is easy and moisture discharge is difficult, which further accelerates the formation of polyene from acidic polyvinyl alcohol.

[0009] Therefore, a technique has been proposed to inhibit deterioration into polyene by adding a crosslinking agent to polyvinyl alcohol to increase the degree of crosslinking. In this case, although the redness phenomenon caused by outgassing is improved, there are problems that the effect is not significant and an after image is generated during the non-driven state.

[0010] Therefore, the object to be achieved by the present disclosure is to inhibit deterioration and discoloration of a polarizer by blocking outgassing generated from an organic material.

[0011] The object of the present disclosure is not limited to the above object, and those skilled in the art can clearly understand other objects not mentioned above according to the following description.

[0012] According to one or more embodiments of the present disclosure, an organic light-emitting display device includes: a substrate; a plurality of light-emitting diodes on the substrate; a packaging layer covering the plurality of light-emitting diodes; a gas barrier layer on the packaging layer, the gas barrier layer having a curing rate of 90% or higher; and a polarizer on the gas barrier layer, a bottom surface of the polarizer being in direct contact with the gas barrier layer.

[0013] Other details of the embodiments of the present disclosure are included in the detailed description and the drawings.

[0014] According to one or more embodiments of the present disclosure, an organic light-emitting display device includes a gas barrier layer that blocks outgassing generated from an organic material in a high-temperature / high-humidity environment. Therefore, deterioration of the polymer of the polarizer into polyene due to outgassing can be inhibited, and redness phenomenon and transmittance deterioration of the polarizer can be inhibited.

[0015] The effects according to the embodiments of the present disclosure are not limited to the above-exemplified contents, and various other effects are included in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other embodiments, features, and other advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, wherein:

[0017] Figure 1 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0018] Figure 2 is a cross-sectional view of a polarizer according to an embodiment of the present disclosure;

[0019] Figure 3 is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0020] Figure 4It is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure;

[0021] Figure 5 It is a graph showing the degree of appearance of red emission phenomenon based on temperature of samples according to comparative examples, reference examples, and Example 1, according to one or more embodiments of the present disclosure. Detailed Description

[0022] By referring to the embodiments described in detail below in conjunction with the attached Figure 1 The advantages and features of the present disclosure and the methods for achieving these advantages and features will be clear. However, the present disclosure is not limited to the embodiments disclosed herein, but will be implemented in various forms. The embodiments are provided only as examples so that those skilled in the art can fully understand the content disclosed by the present disclosure and the scope of the present disclosure.

[0023] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing the embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the disclosure, the same reference numerals generally denote the same elements. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising", "having", and "including" used herein generally intend to allow the addition of other components, unless these terms are used together with the term "only". Any reference to the singular may include the plural unless otherwise explicitly stated.

[0024] Even if not explicitly stated, components are interpreted to include the ordinary error range.

[0025] When describing the positional relationship between two parts using terms such as "on", "above", "below", and "adjacent to", one or more parts may be located between the two parts, unless these terms are used together with the terms "immediately" or "directly".

[0026] When an element or layer is disposed "on" another element or layer, another layer or another element may be directly inserted on or between the other element.

[0027] Although terms such as "first" and "second" are used when describing various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of the present disclosure, the first component mentioned below may be the second component.

[0028] Throughout the disclosure, the same reference numerals generally denote the same elements.

[0029] For ease of description, the dimensions and thicknesses of each component shown in the drawings are illustrated, and the present disclosure is not limited to the dimensions and thicknesses of the components shown.

[0030] The features of the embodiments of the present disclosure can be partially or wholly combined or combined with each other and can be interconnected and operated in various technical ways, and these embodiments can be executed independently or in association with each other.

[0031] Hereinafter, a display device according to an embodiment of the present disclosure will be described in detail with reference to the drawings.

[0032] Figure 1 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Figure 2 is a cross-sectional view of a polarizer according to an embodiment of the present disclosure.

[0033] The display device 100 according to the present disclosure includes a substrate 110, thin film transistors 120, a passivation layer 131, a lower planarization layer 132, light emitting diodes 140, a packaging layer 150, touch electrodes 161, a gas barrier layer 170, a polarizer 180, and a cover member 190.

[0034] The substrate 110 supports the respective elements constituting the display device 100. The substrate 110 may be formed of an insulating material. For example, the substrate 110 may be formed of a glass substrate or may be formed of a polymer material. For example, the polymer may be selected from polyethylene terephthalate or polyimide, but is not limited thereto. The substrate 110 may be configured as a single-layer or multi-layer structure.

[0035] The substrate 110 includes regions defined as an effective region and a non-effective region. The effective region is a region for displaying an image. In the effective region, a plurality of sub-pixels for displaying an image and a driving circuit for driving the plurality of sub-pixels may be provided. Each of the plurality of sub-pixels is a separate unit that emits light, and a light emitting diode 140 may be provided in each of the plurality of sub-pixels. In Figure 1 and Figure 2 for ease of description, only one sub-pixel is shown, but is not limited thereto.

[0036] Each of the plurality of sub-pixels may be selected from a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel, but is not limited thereto. The driving circuit may include various transistors, storage capacitors, and wirings for driving the plurality of sub-pixels. For example, the driving circuit may be constituted by various components such as driving transistors, switching transistors, sensing transistors, storage capacitors, gate lines, and data lines, but is not limited thereto.

[0037] The non-effective area is an area that is set to surround the effective area and does not actually display an image. In the non-effective area, various wirings and driving ICs for driving the sub-pixels provided in the effective area are provided. For example, in the non-effective area, various driving integrated circuits (ICs) such as a gate driver IC and a data driver IC can be provided, but are not limited thereto.

[0038] The buffer layer 111 can be provided on the substrate 110. The buffer layer 111 protects the thin film transistor 120 and the light emitting diode 140 from moisture, external air, and foreign matter penetrating from the outside. In addition, the buffer layer 111 can suppress changes in the characteristics of the thin film transistor caused by hydrogen or foreign matter diffused into the substrate 110 during the formation process of the thin film transistor. The buffer layer 111 can be formed of an inorganic insulating material. For example, the buffer layer 111 can be formed of a material selected from a silicon oxide film, a silicon nitride film, or a silicon oxynitride film, but is not limited thereto. The buffer layer 111 can be formed as a single layer or a multilayer structure. For example, the buffer layer 111 can be formed of a multilayer structure in which a silicon oxide film and a silicon nitride film are laminated, but is not limited thereto.

[0039] The thin film transistor 120 is provided on the buffer layer 111. The thin film transistor 120 includes an active layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124.

[0040] The active layer 121 is provided on the buffer layer 111. The active layer 121 can be formed of an oxide semiconductor material or polysilicon. When the active layer 121 is formed of an oxide semiconductor material, a masking pattern can be further formed under the active layer 121. The masking pattern suppresses damage to the active layer 121 formed of the oxide semiconductor due to ultraviolet rays. When the active layer 121 is formed of polysilicon, impurities can be doped on both edges of the active layer 121.

[0041] The gate insulating film GI formed of an insulating material is provided on the active layer 121. The gate insulating film GI can be formed of a material selected from a silicon oxide film, a silicon nitride film, and a silicon oxynitride film, but is not limited thereto. Although it is shown in Figure 1 that the gate insulating film GI is provided only in the area overlapping with the gate electrode 122, it is not limited thereto. The gate insulating film GI can be formed on the entire surface of the substrate 110.

[0042] The gate electrode 122 formed of a conductive material such as metal can be provided on the gate insulating film GI. The gate electrode 122 is provided to overlap with the channel region of the active layer 121. For example, the gate electrode 122 can be composed of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0043] Above the gate electrode 122, an interlayer insulating film ILD formed of an insulating material is substantially formed on the entire surface of the substrate 110. For example, the interlayer insulating film ILD may be formed of an inorganic insulating material such as a silicon oxide film, a silicon nitride film, and a silicon oxynitride film; or an organic insulating material such as optical acrylic or benzocyclobutene, but is not limited thereto.

[0044] The interlayer insulating film ILD has contact holes exposing the top surfaces of both sides of the active layer 121. When the gate insulating film GI is substantially formed on the entire surface of the substrate 110, contact holes may also be formed in the gate insulating film GI. A source electrode 123 and a drain electrode 124 formed of a conductive material such as a metal are formed above the interlayer insulating film ILD. For example, the source electrode 123 and the drain electrode 124 may be made of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto. The source electrode 123 and the drain electrode 124 are arranged to be connected to both sides of the active layer 121 through the contact holes of the interlayer insulating film ILD.

[0045] In Figure 1 only one thin film transistor 120 is shown, but is not limited thereto, and switching thin film transistors, storage capacitors, etc. may also be provided.

[0046] A passivation layer 131 is provided on the thin film transistor 120 to protect the thin film transistor. For example, the passivation layer 131 can suppress the deterioration of the thin film transistor 120 due to external moisture or oxygen. For example, the passivation layer 131 may be formed of an inorganic insulating material such as a silicon oxide film or a silicon nitride film, but is not limited thereto.

[0047] A lower planarization layer 132 is provided on the passivation layer 131. The lower planarization layer 132 can flatten the top surface of the thin film transistor 120 and protect the thin film transistor 120 from external impacts. For example, the lower planarization layer 132 may be formed of an organic insulating material such as polyimide or optical acrylic, but is not limited thereto.

[0048] The passivation layer 131 and the lower planarization layer 132 may include contact holes for electrically connecting the source electrode 123 or the drain electrode 124 to the anode 141.

[0049] A light emitting diode 140 is provided on the lower planarization layer 132. The light emitting diode 140 includes an anode 141, an organic emission layer 142, and a cathode 143.

[0050] The anode 141 is provided on the lower planarization layer 132. The anode 141 is electrically connected to the drain electrode 124 of the thin film transistor 120 through the contact holes of the passivation layer 131 and the lower planarization layer 132. However, it is not limited thereto, and the anode 141 may be electrically connected to the source electrode 123 of the thin film transistor 120.

[0051] The anode 141 may be formed of a conductive material having a high work function to supply holes to the organic emission layer 142. For example, the anode 141 may include a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto. The anode 141 may be formed as a single-layer or multi-layer structure. When the light-emitting diode 140 is implemented as a top-emission type, the anode 141 may include a reflective layer that reflects the light emitted from the organic emission layer 142 toward the cathode 143. The reflective layer may include a material having excellent reflectivity, such as aluminum (Al) or silver (Ag), but is not limited thereto. For example, the anode 141 may be formed of a three-layer structure in which indium tin oxide (ITO), silver (Ag), and indium tin oxide (ITO) are laminated, but is not limited thereto.

[0052] The bank BNK is disposed on the lower planarization layer 132 and the anode 141. The bank BNK is disposed on the lower planarization layer 132 to expose at least a part of the anode 141. That is, the bank BNK may be disposed on the lower planarization layer 132 to cover the edge of the anode 141. The bank BNK is an insulating layer disposed between a plurality of sub-pixels to divide the plurality of sub-pixels. The bank BNK may be formed of an organic insulating material. For example, the bank BNK may be formed of polyimide, acrylic acid, or benzocyclobutene (BCB) resin, but is not limited thereto.

[0053] The organic emission layer 142 is disposed on the anode 141. The organic emission layer 142 may be an organic layer that emits light having a specific color. The organic emission layer 142 may be patterned corresponding to each of the plurality of sub-pixels. However, the present disclosure is not limited thereto. As another example, the organic emission layer 142 may be formed as a single layer continuous over the entire effective area.

[0054] As needed, the organic emission layer 142 may also selectively include various layers such as a hole transport layer, a hole injection layer, a hole blocking layer, an electron injection layer, an electron blocking layer, or an electron transport layer.

[0055] The cathode 143 is disposed on the organic emission layer 142. The cathode 143 may be formed as a single layer continuous over the entire effective area. That is, the cathode 143 may be a common layer formed in the plurality of sub-pixels together. The cathode 143 supplies electrons to the organic emission layer 142, and thus the cathode may be formed of a conductive material having a low work function. For example, the cathode 143 may be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal such as magnesium (Mg) or silver (Ag), or an alloy including a metal, and may also include a metal doping layer, but is not limited thereto.

[0056] A capping layer may be further provided on the cathode 143. The capping layer suppresses the deterioration of the cathode 143. In addition, the capping layer reduces the loss of light that is emitted from the organic emission layer 142 and repeatedly reflected between the anode 141 and the cathode 143, thereby improving the light emission efficiency and reducing the power consumption.

[0057] The encapsulation layer 150 is provided on the light-emitting diode 140. The encapsulation layer 150 may be provided on the active area and the non-active area. The encapsulation layer 150 makes the top surface of the light-emitting diode 140 flat. In addition, the encapsulation layer 150 protects the light-emitting diode 140 from moisture or foreign substances that penetrate from the outside of the display device 100. In addition, the encapsulation layer 150 may protect the light-emitting diode 140 from external impacts. For example, the encapsulation layer 150 may have a three-layer structure including a first inorganic encapsulation layer 151, an organic encapsulation layer 152, and a second inorganic encapsulation layer 153, but is not limited thereto. The first inorganic encapsulation layer 151 is provided on the cathode 143, the organic encapsulation layer 152 is provided on the first inorganic encapsulation layer 151, and the second inorganic encapsulation layer 153 is provided on the organic encapsulation layer 152.

[0058] The first inorganic encapsulation layer 151 is provided on the cathode 143 to suppress the penetration of moisture or oxygen and to suppress the oxidation of the cathode 143. For example, the first inorganic encapsulation layer 151 may be formed of an inorganic insulating material such as a silicon nitride film, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film, but is not limited thereto.

[0059] The organic encapsulation layer 152 is provided on the first inorganic encapsulation layer 151 to flatten the surface. The organic encapsulation layer 152 is formed to be thicker than the first inorganic encapsulation layer 151. Therefore, the organic encapsulation layer 152 may be a foreign substance covering layer that covers foreign substances generated during the process. For example, the organic encapsulation layer 152 may be formed of an organic insulating material such as silicon oxycarbide, an acrylic resin, or an epoxy resin, but is not limited thereto.

[0060] The second inorganic encapsulation layer 153 is provided on the organic encapsulation layer 152 to suppress the penetration of moisture or oxygen. The second inorganic encapsulation layer 153 suppresses the penetration of moisture or oxygen from the outside into the light-emitting diode 140. For example, the second inorganic encapsulation layer 153 may be formed of an inorganic insulating material such as a silicon nitride film, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film, but is not limited thereto.

[0061] Touch sensor units 161, 162 are provided on the encapsulation layer 150 to provide a touch sensing function. The touch sensor units 161, 162 are configured to include a plurality of touch electrodes 161 and an upper planarization layer 162. The plurality of touch electrodes 161 are electrodes that sense touch inputs. Although not shown in Figure 1As shown, a plurality of touch electrodes 161 are composed of sensing electrodes and driving electrodes, and detect touch coordinates by sensing capacitance changes between the sensing electrodes and the driving electrodes. The plurality of touch electrodes 161 may be overlapped with the bank BNK as a non-emitting area and disposed on the encapsulation layer 150.

[0062] The touch sensor units 161 and 162 may be directly disposed on the encapsulation layer 150 without a separate bonding member, but are not limited thereto. The touch sensor units 161 and 162 may be bonded to the encapsulation layer 150 through a bonding member as needed.

[0063] The upper planarization layer 162 covers steps caused by the plurality of touch electrodes 161 to make the top surface flat. In addition, the upper planarization layer 162 protects the touch electrodes 161 from external impacts. For example, the upper planarization layer 162 may be formed of a transparent resin such as acrylic resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, cycloolefin-based resin, fluorine-based resin, optical acrylic, benzocyclobutene, and polyamide, but is not limited thereto.

[0064] The gas barrier layer 170 is disposed on the touch sensor units 161 and 162. The gas barrier layer 170 blocks exhaust gas generated from a layer formed of an organic material disposed below the gas barrier layer 170. For example, components such as photoinitiators or additives in the upper planarization layer 162, the organic encapsulation layer 152, etc., formed of an organic material, volatilize or decompose, thereby generating exhaust gas. When such exhaust gas penetrates into the polarizer 180 located above, the film constituting the polarizer 180 deteriorates, resulting in discoloration such as redness and deterioration of transmittance.

[0065] The gas barrier layer 170 is located between the touch sensor units 161 and 162 and the polarizer 180, and is disposed in direct contact with the bottom surface of the polarizer 180. Therefore, the gas barrier layer 170 blocks exhaust gas generated when an organic material layer such as the upper planarization layer 162 or the organic encapsulation layer 152 volatilizes or decomposes under high temperature / high humidity conditions.

[0066] For example, the gas barrier layer 170 has a high curing rate of 90% or higher. In this case, penetration of exhaust gas generated from the layer disposed below the gas barrier layer 170 into the polarizer 180 can be effectively suppressed.

[0067] The gas barrier layer 170 may include an acrylic resin. For example, the gas barrier layer 170 includes an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer. The acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer may have a higher curing rate than the acrylic resin cured without including a urethane acrylate oligomer. Therefore, the acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer has a high curing rate of 90% or higher, and thus is used as the gas barrier layer 170. For example, the cured product of the acrylate-based monomer may have a curing rate of 60%, and the cured product cured by including an acrylate-based monomer and a urethane acrylate oligomer under the same curing conditions may have a curing rate of 97% or higher.

[0068] For example, the acrylate-based monomer may be one or more selected from methyl methacrylate, hydroxyalkyl acrylate, glycidyl methacrylate, multifunctional methacrylate, cyclopropyl (meth) acrylate, and cyclohexyl (meth) acrylate, but is not limited thereto. For example, the urethane acrylate oligomer may be one or more selected from aromatic urethane acrylate, urethane methacrylate, multifunctional urethane acrylate having two or more functional groups, and multifunctional hyperbranched urethane acrylate, but is not limited thereto.

[0069] In order to form an acrylic resin with a high curing rate, during photo-curing, the exposure amount is increased or the curing process is performed two or more times to form the gas barrier layer 170. For example, a high curing rate can be achieved by curing a composition containing an acrylate-based monomer and a urethane acrylate oligomer once and then additionally performing a secondary curing. For example, the primary curing and the secondary curing can be independently performed by a method selected from a thermal curing method and a photo-curing method. For example, when a composition containing an acrylate-based monomer and a urethane acrylate oligomer is first UV-cured and then additionally thermally cured, the curing rate is increased by 5% or more compared to an example where only UV-curing is performed.

[0070] As another example, a cross-linking agent can be added to increase the curing rate. For example, the gas barrier layer 170 can include an acrylic resin cured by containing an acrylate-based monomer, a urethane acrylate oligomer, and a polyfunctional acrylate-based cross-linking agent. In this case, the acrylic resin is cross-linked by the polyfunctional acrylate-based cross-linking agent to achieve a high curing rate.

[0071] For example, the polyfunctional acrylate-based cross-linking agent can be selected from pentaerythritol triacrylate, trimethylolpropane triacrylate, etc., but is not limited thereto.

[0072] The polarizer 180 is disposed on the gas barrier layer 170. The polarizer 180 can have various combinations according to the required optical characteristics. Hereinafter, the polarizer 180 will be described in detail with reference to Figure 2 It should be noted that the polarizer 180 is not limited to Figure 2 the structure shown.

[0073] The polarizer 180 includes a first adhesive layer Adh1 at the bottom. The polarizer 180 can be adhered to the gas barrier layer 170 through the first adhesive layer Adh1. For example, the first adhesive layer Adh1 can be selected from an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure-sensitive adhesive (PSA), but is not limited thereto.

[0074] The polarizer 180 includes a polarizing film 184. The polarizing film 184 only transmits linearly polarized light in a predetermined direction. Specifically, the polarizing film 184 absorbs linearly polarized light parallel to the absorption axis and transmits linearly polarized light perpendicular to the absorption axis (i.e., parallel to the transmission axis). For example, the polarizing film 184 can be formed by stretching polyvinyl alcohol (PVA) dyed with iodine ions or dichroic dyes.

[0075] Polyvinyl alcohol can deteriorate into polyene in a high-temperature / high-humidity environment. Specifically, in a high-temperature / high-humidity environment, iodine dyed on polyvinyl alcohol acts as a catalyst to turn polyvinyl alcohol into polyene. To minimize or at least reduce this phenomenon, the polarizing film 184 may further include a crosslinking agent and a heat stabilizer that crosslink the polyvinyl alcohol.

[0076] As described above, the acidic exhaust gas generated from the organic material layer below the polarizer 180 reacts with moisture to form hydrogen ions. Polyvinyl alcohol reacts with hydrogen ions to form polyene. When polyvinyl alcohol deteriorates into polyene, discoloration such as reddening occurs, and the transmittance may deteriorate. However, in the display device 100 according to an embodiment of the present disclosure, the exhaust gas can be blocked by the gas barrier layer 170 provided below the polarizer 180. Therefore, the deterioration of polyvinyl alcohol in the polarizing film 184 into polyene can be suppressed.

[0077] A base film 183 may be provided below the polarizing film 184. The base film 183 supports the polarizing film 184. For example, the base film 183 may be formed of a material selected from acrylic resin and polyethylene terephthalate, but is not limited thereto.

[0078] A protective layer 185 that protects the polarizing film 184 from external moisture, oxygen, or foreign substances may be provided above the polarizing film 184. For example, the protective layer 185 may be formed of triacetyl cellulose, cycloolefin polymer, polycarbonate, acrylic, or polyethylene terephthalate, but is not limited thereto.

[0079] A hard coat 186 may be further provided above the protective layer 185 to protect the polarizing film 184 from external impact or scratching. For example, the hard coat 186 may be formed of a material selected from urethane resin or silicone resin, but is not limited thereto.

[0080] The polarizer 180 may further include at least one antireflection film to reduce the reflectance of external light while maintaining the high emission efficiency of the light emitted from the light-emitting diode 140. For example, the polarizer 180 may include one or more selected from a positive C-plate (+C plate) 181 and a neutral density filter 182 as the antireflection film. Although Figure 2 both the positive C-plate 181 and the neutral density filter 182 are shown, the present disclosure is not limited thereto.

[0081] The +C plate 181 is a uniaxial retardation film, which may be a film having the same refractive index in the x direction and the y direction, and the refractive index in the z direction may be greater than the refractive indices in the x direction and the y direction. By including the +C plate, not only can the reflection of external light in the forward direction be suppressed, but also the reflection of external light in the lateral direction can be suppressed.

[0082] The neutral density filter 182 constantly reduces the amount of light transmitted in the visible light wavelength band. For example, the neutral density filter 182 constantly reduces the amount of light transmitted in the wavelength range of 380 nm to 780 nm to reduce the reflectance of external light.

[0083] A second adhesive layer Adh2 may be provided between the base film 183 and the neutral density filter 182. Thus, the antireflection films 181, 182 can be adhered to the base film 183 through the second adhesive layer Adh2. For example, the second adhesive layer Adh2 may be selected from an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure-sensitive adhesive (PSA), but is not limited thereto.

[0084] Optionally, the polarizer 180 may further include at least one retardation film between the antireflection films 181, 182 and the polarizing film 184 as needed. For example, the retardation film may include one or more selected from a quarter (λ / 4) wave plate (QWP) and a half (λ / 2) wave plate (HWP).

[0085] It should be noted that Figure 2 the polarizer 180 shown is shown for ease of description and is not limited thereto. As another example, the polarizer 180 may have a structure in which a first adhesive layer, a +C plate, a λ / 4 wave plate, a second adhesive layer, a polarizing film, and a base film (and / or a protective layer) are laminated in this order. The antireflection film may be optionally omitted as needed. For example, the polarizer 180 may have a structure in which a λ / 4 wave plate, a λ / 2 wave plate, a polarizing film, and a base film (and / or a protective layer) are laminated in this order.

[0086] The cover member 190 is disposed on the polarizer 180. The cover member 190 protects the display device 100 from external air and external impacts. For example, the cover member 190 may be selected from cover glass or a cover film.

[0087] Figure 3 is a cross-sectional view of a display device according to another embodiment of the present disclosure. Figure 3 The shown display device 200 includes a substrate 110, a thin film transistor 120, a passivation layer 131, a lower planarization layer 132, a light emitting diode 140, a packaging layer 150, a light shielding pattern LS, an optical gap layer PAC, a touch electrode 161, a plurality of lenses ML, a gas barrier layer 270, a polarizer 180, and a cover member 190. Except that a light shielding pattern LS, an optical gap layer PAC, and a plurality of lenses ML are further provided and the gas barrier layer 270 has a different arrangement structure, Figure 3 the shown display device 200 is Figure 1 and 2 substantially the same as the display device 100 described above. Therefore, the description of the repeated components will be omitted.

[0088] Reference Figure 3 , the display device 200 includes a light-shielding pattern LS, an optical gap layer PAC, and a plurality of lenses ML that control the light emitted from the light-emitting diodes 140 to improve the light-emission efficiency and reduce the viewing angle.

[0089] The light-shielding pattern LS is disposed on the encapsulation layer 150. The light-shielding pattern LS is disposed to contact the second inorganic encapsulation layer 153. The light-shielding pattern LS is disposed to overlap with the bank BNK corresponding to the non-emission region of the light-emitting diode 140. By doing so, the light propagated from the light-emitting diode 140 of one sub-pixel to the light-emitting diode 140 of an adjacent sub-pixel is blocked. Therefore, light is not emitted through other regions except the emission region EA of each sub-pixel, and thus the viewing angle can be reduced. As a reference, the emission region EA can be defined as the region that is not covered by the bank BNK and is exposed.

[0090] The optical gap layer PAC is disposed on the light-shielding pattern LS. The optical gap layer PAC ensures an optical gap between the light-emitting diode 140 and the lens ML to improve the forward light-emission efficiency of the light emitted from the light-emitting diode 140. In addition, the optical gap layer PAC removes the step of the light-shielding pattern LS to make the upper part of the light-shielding pattern LS flat. For example, the optical gap layer PAC can be formed of a transparent resin such as an acrylic resin, but is not limited thereto.

[0091] The touch electrode 161 is disposed on the optical gap layer PAC. The touch electrode 161 can be disposed to overlap with the light-shielding pattern LS.

[0092] Each of the plurality of lenses ML is disposed on the optical gap layer PAC. Each of the plurality of lenses ML is disposed to correspond to the emission region EA of the light-emitting diode 140 included in each of the plurality of sub-pixels. Each of the plurality of lenses ML is disposed to overlap with the emission region EA to improve the forward light-emission efficiency of the light emitted from the light-emitting diode 140. For example, the cross-section of each of the plurality of lenses ML can have a semi-circular shape, but is not limited thereto.

[0093] In Figure 1 and 2 of the display device 100, the upper planarization layer 162 is disposed to cover the touch electrode 161 and the gas barrier layer 170 is disposed on the upper planarization layer 162. In contrast, Figure 3 the display device 200 shown does not include the upper planarization layer 162, but the gas barrier layer 270 is disposed to cover the touch electrode 161 and the plurality of lenses ML.

[0094] That is to say, the gas barrier layer 270 removes the steps caused by the touch electrode 161 and the plurality of lenses ML, so that the upper part of the touch electrode 161 and the plurality of lenses ML is flat. In addition, the gas barrier layer 270 protects the components below the gas barrier layer 270 from external impacts.

[0095] The gas barrier layer 270 has a high curing rate of 90% or higher. In this case, the exhaust gas generated from the layer provided below the gas barrier layer 270 is effectively suppressed from penetrating into the polarizer 180.

[0096] The gas barrier layer 270 may include an acrylic resin. For example, the gas barrier layer 270 may include an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer. Therefore, the acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer has a high curing rate of 90% or higher, thus serving as the gas barrier layer 270.

[0097] In addition, a crosslinking agent may be added to improve the curing rate. For example, the gas barrier layer 270 may include an acrylic resin cured by including an acrylate-based monomer, a urethane acrylate oligomer, and a polyfunctional acrylate-based crosslinking agent. In this case, the acrylic resin is crosslinked by the polyfunctional acrylate-based crosslinking agent to achieve a high curing rate.

[0098] The specific characteristics of the acrylate-based monomer, the urethane acrylate oligomer, and the polyfunctional acrylate-based crosslinking agent are the same as those described above, so the repeated description will be omitted.

[0099] The plurality of lenses ML and the gas barrier layer 270 may have different refractive indices. For example, the refractive index of the gas barrier layer 270 may be lower than the refractive index of the plurality of lenses ML. Therefore, the light emitted to the outside of the display device 200 can be focused by the plurality of lenses ML.

[0100] The gas barrier layer 270 may include a fluororesin to have a refractive index lower than that of the plurality of lenses Ml. For example, the gas barrier layer 270 includes one or more resins selected from an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer; and a fluororesin. The fluororesin has a lower refractive index than the acrylic resin. Therefore, as in Figure 3 the display device 200, when the gas barrier layer 270 is provided to cover the plurality of lenses ML, the gas barrier layer 270 may include a fluororesin to focus light more effectively.

[0101] For example, the gas barrier layer 270 may include a fluororesin cured by including (per)fluoro(alkyl vinyl ether) and fluorinated polyol. For example, the (per)fluoro(alkyl vinyl ether) may be selected from (per)fluoro(propyl vinyl ether) etc., but is not limited thereto. For example, the fluorinated polyol may be selected from (per)fluoropolyester polyol, (per)fluoroalkanediol etc., but is not limited thereto.

[0102] Figure 4 is a cross-sectional view of a display device according to another embodiment of the present disclosure. Refer to Figure 4 , the display device 300 includes a substrate 110, thin film transistors 320a and 320b, a passivation layer 131, a lower planarization layer 132, light emitting diodes 340a and 340b, a packaging layer 150, a light shielding pattern LS, an optical gap layer PAC, a touch electrode 161, a plurality of lenses ML1 and ML2, a gas barrier layer 270, a polarizer 180, and a cover member 190. Except for the arrangement structures of the thin film transistors 320a and 320b, the light emitting diodes 340a and 340b, and the plurality of lenses ML1 and ML2, Figure 4 the display device 300 shown is Figure 3 substantially the same as the display device 200 described above. Therefore, the description of the repeated components will be omitted.

[0103] In the display device 300, one sub-pixel includes a first light emitting diode 340a and a second light emitting diode 340b. In addition, the first light emitting diode 340a is electrically connected to the first thin film transistor 320a, and the second light emitting diode 340b is electrically connected to the second thin film transistor 320b.

[0104] First, the first thin film transistor 320a and the second thin film transistor 320b will be described in detail.

[0105] A first active layer 321a and a second active layer 321b are respectively formed on the buffer layer 111. The first active layer 321a and the second active layer 321b may be independently formed of an oxide semiconductor material or polysilicon respectively.

[0106] A first gate electrode 322a is disposed above the first active layer 321a so as to overlap with the channel region of the first active layer 321a with a gate insulating film GI therebetween. A second gate electrode 322b is disposed above the second active layer 321b so as to overlap with the channel region of the second active layer 321b with a gate insulating film GI therebetween. For example, each of the first gate electrode 322a and the second gate electrode 322b may be made of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0107] Above the first gate electrode 322a and the second gate electrode 322b, an interlayer insulating film ILD formed of an insulating material is substantially formed on the entire surface of the substrate 110. The interlayer insulating film ILD has contact holes exposing both top surfaces of each of the first active layer 321a and the second active layer 321b.

[0108] A first source electrode 323a, a first drain electrode 324a, a second source electrode 323b, and a second drain electrode 324b formed of a conductive material such as metal are disposed above the interlayer insulating film ILD. The first source electrode 323a and the first drain electrode 324a are in contact with both sides of the first active layer 321a through the contact holes of the interlayer insulating film ILD, and the second source electrode 323b and the second drain electrode 324b are in contact with both sides of the second active layer 321b through the contact holes of the interlayer insulating film ILD.

[0109] For example, each of the first source electrode 323a, the first drain electrode 324a, the second source electrode 323b, and the second drain electrode 324b may be formed of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0110] The first active layer 321a, the first gate electrode 322a, the first source electrode 323a, and the first drain electrode 324a form a first thin film transistor 320a. The second active layer 321b, the second gate electrode 322b, the second source electrode 323b, and the second drain electrode 324b form a second thin film transistor 320b.

[0111] A passivation layer 131 and a lower planarization layer 132 are sequentially laminated on the first thin film transistor 320a and the second thin film transistor 320b. The passivation layer 131 and the lower planarization layer 132 may respectively include contact holes for electrically connecting the first source electrode 323a or the first drain electrode 324a to the first anode 341a and contact holes for electrically connecting the second source electrode 323b or the second drain electrode 324b to the second anode 341b.

[0112] A first light emitting diode 340a and a second light emitting diode 340b are disposed on the lower planarization layer 132. The first light emitting diode 340a includes a first anode 341a, an organic emission layer 342, and a cathode 143, and the second light emitting diode 340b includes a second anode 341b, an organic emission layer 342, and a cathode 143.

[0113] Each of the first anode 341a and the second anode 341b is disposed on the lower planarization layer 132. The first anode 341a can be electrically connected to the first drain electrode 324a of the first thin film transistor 320a through a contact hole in the passivation layer 131 and the lower planarization layer 132. The second anode 341b can be electrically connected to the second drain electrode 324b of the second thin film transistor 320b through a contact hole in the passivation layer 131 and the lower planarization layer 132.

[0114] For example, each of the first anode 341a and the second anode 341b can be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

[0115] The bank BNK is disposed on the lower planarization layer 132, the first anode 341a, and the second anode 341b. The bank BNK is disposed on the lower planarization layer 132 so as to expose at least a part of each of the first anode 341a and the second anode 341b. That is, the bank BNK can be disposed on the lower planarization layer 132 so as to cover the edges of each of the first anode 341a and the second anode 341b. Accordingly, the bank BNK includes a first opening OP1 exposing the first anode 341a and a second opening OP2 exposing the second anode 341b. Accordingly, the bank BNK can not only separate a plurality of sub-pixels, but also separate the first light emitting diodes 340a and the second light emitting diodes 340b included in each of the plurality of sub-pixels from each other. The region corresponding to the first anode 341a exposed without being covered by the bank BNK can be defined as a first emission region EA1, and the region corresponding to the second anode 341b exposed without being covered by the bank BNK can be defined as a second emission region EA2. That is, the first emission region EA1 overlaps with the first opening OP1, and the second emission region EA2 overlaps with the second opening OP2.

[0116] The organic emission layer 342 is formed above the first anode 341a and the second anode 341b exposed through the first opening OP1 and the second opening OP2 of the bank BNK. The organic emission layer 342 above the first anode 341a and the organic emission layer 342 above the second anode 341b are connected to each other to be integrally formed. However, it is not limited thereto, and the organic emission layer 342 above the first anode 341a and the organic emission layer 342 above the second anode 341b may be separated from each other.

[0117] The cathode 143 is disposed on the organic emission layer 342. The cathode 143 can be formed as a single layer continuous over the entire effective area.

[0118] The encapsulation layer 150 is disposed on the first light-emitting diode 340a and the second light-emitting diode 340b, and the light-shielding pattern LS is disposed on the encapsulation layer 150. The light-shielding pattern LS is disposed to overlap with the bank portion BNK corresponding to the non-emission regions of the first light-emitting diode 340a and the second light-emitting diode 340b. That is, the light-shielding pattern LS has openings at positions corresponding to the first emission region EA1 and the second emission region EA2.

[0119] The optical gap layer PAC is disposed on the light-shielding pattern LS to flatten the upper portion of the light-shielding pattern LS. The touch electrode 161 is disposed on the optical gap layer PAC. The touch electrode 161 may be disposed to overlap with the light-shielding pattern LS.

[0120] In addition, the first lens ML1 and the second lens ML2 are disposed on the optical gap layer PAC. The first lens ML1 is disposed to overlap with the first emission region EA1, and the second lens ML2 is disposed to overlap with the second emission region EA2.

[0121] The first lens ML1 is disposed in the first emission region EA1 to refract the light from the first light-emitting diode 340a in a specific direction. The second lens ML2 is disposed in the second emission region EA2 to refract the light from the second light-emitting diode 340b in a specific direction.

[0122] The first lens ML1 and the second lens ML2 may have different shapes. For example, the first lens ML1 may be a hemispherical lens, and the second lens ML2 may be a semi-cylindrical lens. Therefore, the light emitted from the first light-emitting diode 340a is refracted by the first lens ML1 at a specific angle and emitted, and the light emitted from the second light-emitting diode 340b is refracted by the second lens ML2 at a specific angle different from that of the first lens ML1 and emitted. Due to the different shapes of the first lens ML1 and the second lens ML2, the first lens ML1 and the second lens ML2 limit the viewing angles in different directions. Therefore, the first light-emitting diode 340a and the second light-emitting diode 340b are selectively driven to achieve a wide viewing angle and a narrow viewing angle. For example, the first emission region EA1 provided with the hemispherical first lens ML1 may have a narrow viewing angle of 30 degrees or less in the up, down, left, and right directions. The second emission region EA2 provided with the semi-cylindrical second lens ML2 may have a narrow viewing angle of 30 degrees or less in the up and down directions and a wide viewing angle of 60 degrees or more in the left and right directions. Therefore, the up and down narrow field-of-view mode and the left and right narrow field-of-view mode can be achieved by driving the first light-emitting diode 340a, and the up and down narrow field-of-view mode and the left and right wide field-of-view mode can be achieved by driving the second light-emitting diode 340b.

[0123] Figure 4 The shown display device 300 does not include Figure 1Rather than the upper planarization layer 162 of the display device 100, a gas barrier layer 270 is included to cover the touch electrode 161, the first lens ML1, and the second lens ML2.

[0124] The gas barrier layer 270 may have a refractive index different from that of the first lens ML1 and the second lens ML2. For example, the refractive index of the gas barrier layer 270 may be less than the refractive index of each of the first lens ML1 and the second lens ML2.

[0125] A polarizer 180 and a cover member 190 may be sequentially laminated on the gas barrier layer 270. The gas barrier layer 270, the polarizer 180, and the cover member 190 are the same as those described above in Figures 1 to 3 and thus repeated descriptions will be omitted.

[0126] Hereinafter, the effects of the present disclosure described above will be described with reference to different embodiments. However, the following embodiments are set forth for purposes of illustration of the present disclosure, but the scope of the present disclosure is not limited thereto.

[0127] [Experimental Example 1]

[0128] A reliability test was conducted to understand the presence of the gas barrier layer and the difference in effects based on its curing rate. For this purpose, samples having the configurations listed in Table 1 were manufactured, and a reliability test was conducted at high temperature / high humidity (85 °C / 85%). During the reliability test, the samples were stored at high temperature / high humidity, the time when redness was observed was recorded, and the grade of redness was evaluated as high, medium, low, and N / A.

[0129] [Table 1]

[0130]

[0131] Referring to Table 1, according to the comparative example that does not include the gas barrier layer, it was confirmed that high-grade redness was observed after 420 hours. In the reference example in which a gas barrier layer with a curing rate of 85% was provided between the organic material layer and the polarizer, it was confirmed that the grade of redness was lower than that of the comparative example, but redness was observed after 792 hours. In Example 1 including a gas barrier layer with a curing rate of 90%, it was confirmed that no redness occurred during 1366 hours. That is, a gas barrier layer with a high curing rate of 90% or higher can inhibit the penetration of exhaust gas into the polarizer. Therefore, even if exhaust gas is generated from the organic layer under high temperature / high humidity conditions, it is possible to block the exhaust gas and inhibit the discoloration or deterioration of the polarizer.

[0132] [Experimental Example 2]

[0133] To understand the temperature-based redness levels of the samples according to the comparative example, reference example, and Example 1, the samples were stored at 85 °C, 95 °C, and 105 °C for 500 hours, respectively. After 500 hours, the redness levels of the samples were visually observed. The results are as Figure 5 shown. Figure 5 FIG. is a chart showing the degree of appearance of temperature-based redness of the samples according to the comparative example, reference example, and Example 1, respectively, according to one or more embodiments of the present disclosure. In Figure 5 this figure, level 0 indicates no redness, level 1 indicates that redness appears at a weak level, level 2 is a medium-weak level of redness, level 3 is a medium level of redness, level 4 is a medium-high level of redness, and level 5 is a high level of redness.

[0134] Referring to Figure 5 , it was confirmed that in Example 1 including a gas barrier layer with a curing rate of 90%, no redness occurred at temperature conditions of 85 °C, 95 °C, and 105 °C, respectively.

[0135] In contrast, it was confirmed that in the comparative example without a gas barrier layer, the most severe redness was visually observed. The reference example includes a gas barrier layer, but has a curing rate of 85% which is lower than that of Example 1. Therefore, it was confirmed that the level of redness is lower than that of the comparative example, but as the temperature increases to 85 °C, 95 °C, and 105 °C, the intensity of redness increases sharply.

[0136] In summary, in a high-temperature environment of 85 °C or higher, exhaust gas is generated from the organic layer, thereby turning the polyvinyl alcohol included in the polarizer into polyene, which causes redness and thus changes the color of the sample to red. Therefore, when a gas barrier layer is provided between the organic layer and the polarizer, the exhaust gas is blocked, thereby reducing redness. In addition, when a gas barrier layer with a high curing rate of 90% is provided as in Example 1, it was confirmed that the exhaust gas is blocked more effectively, thereby suppressing redness.

[0137] Embodiments of the present disclosure can also be described as follows:

[0138] According to one aspect of the present disclosure, an organic light-emitting display device includes: a substrate; a plurality of light-emitting diodes provided on the substrate; a packaging layer provided to cover the plurality of light-emitting diodes; a gas barrier layer provided on the packaging layer; and a polarizer provided on the gas barrier layer, wherein the gas barrier layer is provided to be in direct contact with the bottom surface of the polarizer and has a curing rate of 90% or higher.

[0139] The organic light-emitting display device may further include a plurality of touch electrodes provided on the packaging layer, wherein the gas barrier layer may be provided above the plurality of touch electrodes.

[0140] The organic light emitting display device may further include a planarization layer disposed between the encapsulation layer and the gas barrier layer to cover the plurality of touch electrodes.

[0141] The gas barrier layer may include an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer.

[0142] The gas barrier layer may include an acrylic resin cured by further including a polyfunctional acrylate-based crosslinking agent.

[0143] The polarizer may include: an adhesive layer in contact with the gas barrier layer; at least one anti-reflection film disposed on the adhesive layer; a polarizing film disposed on the anti-reflection film and including polyvinyl alcohol; and a base film disposed on at least one surface of the polarizing film.

[0144] The anti-reflection film may include one or more selected from a +C plate (positive C plate) and a neutral density filter.

[0145] The polarizer may further include at least one retardation film disposed between the anti-reflection film and the polarizing film.

[0146] The retardation film may include one or more selected from a quarter (λ / 4) wave plate (QWP) and a half (λ / 2) wave plate (HWP).

[0147] The organic light emitting display device may further include a plurality of lenses disposed between the plurality of touch electrodes corresponding to the emission regions of the light emitting diodes, and the gas barrier layer may be disposed to cover the plurality of lenses and the plurality of touch electrodes.

[0148] The organic light emitting display device may further include: a light shielding pattern disposed on the encapsulation layer corresponding to the non-emission regions of the light emitting diodes; and an optical gap layer disposed on the light shielding pattern, wherein the plurality of lenses and the plurality of touch electrodes may be disposed on the optical gap layer.

[0149] The refractive index of the gas barrier layer may be lower than the refractive index of the plurality of lenses.

[0150] A plurality of sub-pixels may be defined on the substrate, each of the plurality of sub-pixels may include a first light emitting diode and a second light emitting diode disposed on the substrate, and the plurality of lenses may include a first lens corresponding to the emission region of the first light emitting diode and a second lens corresponding to the emission region of the second light emitting diode.

[0151] The first lens may be a hemispherical lens, and the second lens may be a semi-cylindrical lens.

[0152] The gas barrier layer may include one or more resins selected from the following: an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer; and a fluororesin cured by including (per)fluoro(alkyl vinyl ether) and a fluorinated polyol.

[0153] Although the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all respects and do not limit the present disclosure. The protection scope of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope thereof should be interpreted as falling within the scope of the present disclosure.

Claims

1. An organic light emitting display device, comprising: substrate; a plurality of light emitting diodes on the substrate; an encapsulation layer covering the plurality of light emitting diodes; a gas barrier layer on the encapsulation layer, the gas barrier layer having a curing rate of 90% or more; as well as A polarizer is on the gas barrier layer, a bottom surface of the polarizer is in direct contact with the gas barrier layer. 2 . The organic light emitting display device according to claim 1 , further comprising a plurality of touch electrodes on the encapsulation layer, wherein the gas barrier layer is above the plurality of touch electrodes. 3 . The organic light emitting display device according to claim 2 , further comprising a planarization layer between the encapsulation layer and the gas barrier layer, the planarization layer covering the plurality of touch electrodes. 4 . The organic light emitting display device of claim 1 , wherein the gas barrier layer comprises an acrylic resin cured by including an acrylate-based monomer and a urethane acrylate oligomer in the acrylic resin. 5 . The organic light emitting display device of claim 4 , wherein the gas barrier layer comprises an acrylic resin cured by further including a multifunctional acrylate-based cross-linking agent in the acrylic resin.

6. The organic light emitting display device according to claim 1, wherein the polarizer comprises: an adhesive layer in contact with the gas barrier layer; at least one antireflective film on the adhesive layer; a polarizing film on the at least one anti-reflective film, the polarizing film comprising polyvinyl alcohol; as well as A base film is on at least one surface of the polarizing film. 7 . The organic light emitting display device according to claim 6 , wherein the at least one anti-reflection film comprises one or more selected from the group consisting of a +C plate and a neutral density filter. 8 . The organic light emitting display device of claim 6 , wherein the polarizer further comprises at least one retardation film between the at least one anti-reflection film and the polarizing film. 9 . The organic light emitting display device according to claim 8 , wherein the at least one retardation film comprises one or more selected from the group consisting of a quarter wave plate and a half wave plate.

10. The organic light emitting display device according to claim 2, further comprising a plurality of lenses between the plurality of touch electrodes, the plurality of lenses corresponding to emission regions of the light emitting diodes among the plurality of light emitting diodes, and The gas blocking layer covers the plurality of lenses and the plurality of touch electrodes.

11. The organic light emitting display device according to claim 10, further comprising: a light shielding pattern on the encapsulation layer, the light shielding pattern corresponding to a non-emitting area of ​​the light emitting diode; and an optical gap layer on the light shielding pattern, The plurality of lenses and the plurality of touch electrodes are on the optical gap layer. 12 . The organic light emitting display device according to claim 10 , wherein a refractive index of the gas barrier layer is lower than a refractive index of the plurality of lenses.

13. An organic light-emitting display device according to claim 10, wherein there are a plurality of sub-pixels on the substrate, each of the plurality of sub-pixels includes a first light-emitting diode on the substrate and a second light-emitting diode on the substrate, and the plurality of lenses include a first lens corresponding to an emission area of ​​the first light-emitting diode and a second lens corresponding to an emission area of ​​the second light-emitting diode. 14 . The organic light emitting display device of claim 13 , wherein the first lens is a hemispherical lens, and the second lens is a semi-cylindrical lens.

15. The organic light-emitting display device according to claim 10, wherein the gas barrier layer comprises one or more resins selected from acrylic resin and fluororesin, wherein the acrylic resin is cured by including an acrylate-based monomer and a urethane acrylate oligomer in the acrylic resin, and the fluororesin is cured by including a (per)fluoro(alkyl vinyl ether) and a fluorinated polyol in the fluororesin.

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