BDU copper bar packaging structure and packaging method thereof

Abstract

The invention discloses a BDU copper bar packaging structure and a packaging method thereof.The packaging structure comprises a second terminal, a third terminal, a common terminal, a first terminal, a first thermistor, a second thermistor, an inner plastic-coated body, an outer plastic-coated body and a copper bar, and the middle of the second terminal, the middle of the third terminal and the middle of the common terminal are all located in the inner plastic-coated body; the copper bar, the inner plastic-coated body, the first thermistor and the second thermistor are all located in the outer plastic-coated body. According to the DU copper bar packaging structure, the precision of temperature monitoring is greatly improved, the outer packaging body provides a first layer of protection for internal elements, and the sealant protects the thermistor, so that the thermistor is prevented from being interfered by external environmental factors, dust, water vapor and the like can be effectively prevented from entering the interior, and the service life of the thermistor is prolonged. And the possibility of faults such as corrosion, short circuit and the like of internal elements caused by damp and dust accumulation is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of BDU copper bar packaging, and particularly relates to a BDU copper bar packaging structure and its packaging method. Background Art

[0002] As a device for disconnecting and connecting high-voltage electricity of a power battery of a new energy vehicle, BDU (Battery Disconnect Unit) plays a crucial role in the safety of the battery pack.

[0003] Many problems have emerged in the actual application of traditional copper bar packaging structures. On the one hand, the design for temperature monitoring and control is not perfect enough. During the operation of electrical equipment, current passing through the copper bar will generate heat. If the temperature change cannot be monitored in a timely and accurate manner, it may cause overheating and damage of electrical components, thereby affecting the normal operation of the equipment and even triggering safety accidents. Existing packaging structures often cannot efficiently integrate thermistors, or the installation positions and connection methods of thermistors are unreasonable, greatly reducing the accuracy and timeliness of temperature monitoring.

[0004] On the other hand, the insulation performance and protection effect need to be improved. Good insulation is required at the electrical connection parts to prevent electric leakage. However, common copper bar packaging structures have defects in the insulation isolation design, and electrical interference is likely to occur between different terminals due to insufficient insulation, reducing the stability of the system. At the same time, in the face of complex usage environments, such as harsh conditions like humidity and dustiness, traditional packaging structures are difficult to provide sufficient protection, easily leading to faults such as corrosion and short circuit of internal components, and shortening the service life of the equipment. Summary of the Invention

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a BDU copper bar packaging structure, including a No. 2 terminal, a No. 3 terminal, a common terminal, a No. 1 terminal, a No. 1 thermistor, a No. 2 thermistor, an inner plastic body, an outer plastic body, and a copper bar. The middle parts of the No. 2 terminal, the No. 3 terminal, and the common terminal are all located inside the inner plastic body. The tail end of the No. 2 terminal is connected to one electrode of the No. 1 thermistor, and the other electrode of the No. 1 thermistor is connected to the tail end of the common terminal. The tail end of the No. 3 terminal is connected to one electrode of the No. 2 thermistor, and the other electrode of the No. 2 thermistor is connected to the tail end of the common terminal. The number of No. 1 terminals is two, and the tail ends of the two No. 1 terminals are respectively connected to the copper bar. The copper bar, the inner plastic body, the No. 1 thermistor, and the No. 2 thermistor are all located inside the outer plastic body. The head ends of the No. 2 terminal, the No. 3 terminal, the common terminal, the No. 1 terminal, and both sides of the copper bar are located outside the outer plastic body.

[0006] Preferably, as the above technical solution, a central groove communicating with the inside of the outer plastic body is provided in the middle of the outer plastic body. The No. 1 thermistor and the No. 2 thermistor are both located in the central groove, and the central groove is filled with sealant.

[0007] Preferably, as the above technical solution, insulating isolation blocks are respectively provided between the tail ends of the No. 2 terminal and the common terminal, and between the tail ends of the No. 3 terminal and the common terminal. The insulating isolation blocks are integrally formed with the inner plastic body and are located in the central groove.

[0008] Preferably, as the above technical solution, the central groove is formed by sequentially connecting multiple glue grooves. The area of the glue grooves gradually becomes smaller. A table surface is formed between adjacent two layers of glue grooves. A plurality of circular reinforcement grooves and a plurality of strip-shaped reinforcement grooves are provided on the table surface. Inner reinforcement grooves are provided on the inner walls of some of the glue grooves.

[0009] Preferably, as the above technical solution, the head ends of the No. 2 terminal, the No. 3 terminal, the common terminal, and the No. 1 terminal are located in the same plane.

[0010] A packaging method for a BDU copper busbar packaging structure includes the following steps:

[0011] Step 1, injection molding the No. 2 terminal, the No. 3 terminal, the common terminal and the inner plastic body;

[0012] Step 2, welding the No. 1 thermistor to the tail ends of the No. 2 terminal and the common terminal, welding the No. 2 thermistor to the tail ends of the No. 3 terminal and the common terminal, and welding the No. 1 terminal to the copper busbar;

[0013] Step 3, injection molding the inner plastic body, the copper busbar and the outer plastic body;

[0014] Step 4, pouring sealant into the central groove and curing;

[0015] Step 5, detecting, and finally obtaining the BDU copper busbar packaging structure.

[0016] The beneficial effects of the present invention are as follows: the DU copper busbar packaging structure of the present invention can accurately and timely sense the temperature changes of the copper busbar during operation. This efficient integration and reasonable layout greatly improve the accuracy of temperature monitoring. The design of the insulating isolation block provides a reliable insulation barrier between different terminals, effectively reduces the electrical interference caused by insufficient insulation, enhances the stability of the system, ensures that each electrical connection part can work independently and stably, and avoids the impact of problems such as signal crosstalk on equipment performance. The outer plastic body tightly wraps the copper busbar, the inner plastic body, thermistor No. 1 and thermistor No. 2, providing the first layer of protection for internal components. The central groove connected to the interior is set in the middle of the outer plastic body, and thermistor No. 1 and thermistor No. 2 are both located therein and filled with sealant, which not only further enhances the protection of the thermistor from interference from external environmental factors, but also effectively prevents dust, water vapor, etc. from entering the interior, reducing the possibility of corrosion, short circuit and other failures of internal components due to moisture and dust accumulation. At the same time, the setting of multi-layer glue grooves and circular reinforcement grooves on the table top, strip reinforcement grooves and internal reinforcement grooves on the inner wall of the glue groove greatly enhances the overall strength and sealing of the outer plastic body, so that the packaging structure can still provide reliable protection for internal electrical components when facing harsh environments such as humidity and dust, significantly extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the connection structure of terminal No. 2, terminal No. 3, common terminal, thermistor No. 1, and thermistor No. 2;

[0018] Figure 2 It is a schematic diagram of the structure of the inner plastic body;

[0019] Figure 3 This is a schematic diagram of the connection structure between terminal No. 1 and the copper busbar;

[0020] Figure 4 It is a schematic diagram of the structure of the outer plastic body;

[0021] Figure 5 It is a structural schematic diagram of the BDU copper busbar packaging structure of the present invention;

[0022] Figure 6 It is a schematic diagram of the packaging process of the BDU copper busbar packaging structure of the present invention. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] As Figures 1-5 shown, the BDU copper busbar packaging structure includes a No. 2 terminal 1, a No. 3 terminal 2, a common terminal 3, a No. 1 terminal 4, a No. 1 thermistor 5, a No. 2 thermistor 6, an inner plastic body 7, an outer plastic body 8, and a copper busbar 9. The middle parts of the No. 2 terminal 1, the No. 3 terminal 2, and the common terminal 3 are all located inside the inner plastic body 7. The tail end of the No. 2 terminal 1 is connected to one electrode of the No. 1 thermistor 5, and the other electrode of the No. 1 thermistor 5 is connected to the tail end of the common terminal 3. The tail end of the No. 3 terminal 2 is connected to one electrode of the No. 2 thermistor 6, and the other electrode of the No. 2 thermistor 6 is connected to the tail end of the common terminal 3. The number of the No. 1 terminals 4 is two, and the tail ends of the two No. 1 terminals 4 are respectively connected to the copper busbar 9. The copper busbar 9, the inner plastic body 7, the No. 1 thermistor 5, and the No. 2 thermistor 6 are all located inside the outer plastic body 8. The head ends of the No. 2 terminal 1, the No. 3 terminal 2, the common terminal 3, the No. 1 terminal 4, and both sides of the copper busbar 9 are located outside the outer plastic body 8.

[0027] Furthermore, a central groove 10 communicating with the inside of the outer plastic body 8 is provided in the middle of the outer plastic body 8. The No. 1 thermistor 5 and the No. 2 thermistor 6 are both located in the central groove 10, and the central groove 10 is filled with a sealing glue 11. The sealing glue 11 completely wraps the No. 1 thermistor 5 and the No. 2 thermistor 6, achieving a sealing effect on the No. 1 thermistor 5 and the No. 2 thermistor 6 and reducing the influence of the external environment on the No. 1 thermistor 5 and the No. 2 thermistor 6.

[0028] Further, insulating isolation blocks 12 are respectively provided between the tail ends of the No. 2 terminal 1 and the common terminal 3 and between the tail ends of the No. 3 terminal 2 and the common terminal 3. The insulating isolation blocks 12 are integrally formed with the inner plastic body 7 and are located in the central groove 10. The insulating isolation blocks 12 improve the insulation performance between the two poles of the thermistor, and at the same time, in cooperation with the sealant, can increase the structural strength between the inner plastic body 7 and the outer plastic body 8.

[0029] Further, the central groove 10 is formed by sequentially connecting multiple glue grooves 13. The area of the glue grooves 13 gradually becomes smaller. A table surface 14 is formed between adjacent two layers of glue grooves 13. A plurality of circular reinforcing grooves 15 and a plurality of strip-shaped reinforcing grooves 16 are provided on the table surface 14. Inner reinforcing grooves 17 are provided on the inner walls of some of the glue grooves 13. In this embodiment, two layers of glue grooves 13 are preferably used. The design of the multiple glue grooves 13 can form the table surface 14. In cooperation with the circular reinforcing grooves 15, strip-shaped reinforcing grooves 16 and inner reinforcing grooves 17, the contact area between the sealant and other components of the encapsulation mechanism is increased, and the bonding strength with other components is improved from different angular directions, improving the sealing effect of the sealant.

[0030] Further, the head ends of the No. 2 terminal 1, the No. 3 terminal 2, the common terminal 3, and the No. 1 terminal 4 are located in the same plane.

[0031] The encapsulation method of the BDU copper busbar encapsulation structure, as Figure 6 shown, includes the following steps:

[0032] Step 1: Injection mold the No. 2 terminal 1, the No. 3 terminal 2, the common terminal 3 and the inner plastic body 7.

[0033] Step 2: Weld the No. 1 thermistor 5 to the tail ends of the No. 2 terminal 1 and the common terminal 3, weld the No. 2 thermistor 6 to the tail ends of the No. 3 terminal 2 and the common terminal 3, and weld the No. 1 terminal 4 to the copper busbar 9.

[0034] Step 3: Injection mold the inner plastic body 7, the copper busbar 9 and the outer plastic body 8.

[0035] Step 4: Pour the sealant 11 into the central groove 10 and cure it.

[0036] Step 5: Conduct inspections, and finally obtain the BDU copper busbar encapsulation structure. The inspections include conventional inspections (RT inspections), insulation inspections, etc.

[0037] It is worth mentioning that the technical features such as the thermistor and the sealant involved in this invention patent application should be regarded as the prior art. For the specific structures, working principles, and possible control methods and spatial arrangement methods involved in these technical features, the conventional selections in the art can be adopted, and they should not be regarded as the invention points of this invention patent. This invention patent will not be further specifically elaborated.

[0038] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations based on the concept of the present invention without creative work. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field according to the concept of the present invention through logical analysis, reasoning or limited experiments on the basis of the prior art should fall within the protection scope determined by the claims.

Claims

1. BDU copper busbar packaging structure, characterized by: It includes terminal No. 2, terminal No. 3, a common terminal, terminal No. 1, thermistor No. 1, thermistor No. 2, an inner plastic body, an outer plastic body, and a copper busbar. The middle of terminal No. 2, the middle of terminal No. 3, and the middle of the common terminal are all located inside the inner plastic body. The tail end of terminal No. 2 is connected to an electrode of thermistor No. 1, the other electrode of thermistor No. 1 is connected to the tail end of the common terminal, the tail end of terminal No. 3 is connected to an electrode of thermistor No. 2, the other electrode of thermistor No. 2 is connected to the tail end of the common terminal. There are two terminals No. 1, and the tail ends of the two terminals No. 1 are respectively connected to the copper busbar. The copper busbar, the inner plastic body, thermistor No. 1, and thermistor No. 2 are all located inside the outer plastic body. The head end of terminal No. 2, the head end of terminal No. 3, the head end of the common terminal, the head end of terminal No. 1, and both sides of the copper busbar are all located outside the outer plastic body.

2. The BDU copper bus packaging structure according to claim 1, characterized in that: A central groove communicating with the interior of the outer plastic body is provided in the middle of the outer plastic body, and the No. 1 thermistor and the No. 2 thermistor are both located in the central groove, which is filled with sealant.

3. The BDU copper busbar packaging structure according to claim 2, characterized in that: An insulating isolation block is provided between the tail end of the No. 2 terminal and the tail end of the common terminal, and between the tail end of the No. 3 terminal and the tail end of the common terminal. The insulating isolation block is integrally formed with the inner plastic body, and the insulating isolation block is located in the central groove.

4. The BDU copper busbar packaging structure according to claim 2, characterized in that: The central groove is composed of multiple layers of glue grooves connected in sequence, the area of ​​the glue grooves gradually becomes smaller, and a table top is formed between two adjacent layers of glue grooves. A plurality of circular reinforcement grooves and a plurality of strip reinforcement grooves are arranged on the table top, and inner reinforcement grooves are arranged on the inner walls of some of the glue grooves.

5. The BDU copper busbar packaging structure according to claim 1, characterized in that: The head end of terminal No. 2, the head end of terminal No. 3, the head end of the common terminal, and the head end of terminal No. 1 are located in the same plane.

6. The packaging method of the BDU copper busbar packaging structure according to any one of claims 2 to 5, characterized in that: The following steps are included: Step 1: Injection mold the No. 2 terminal, No. 3 terminal, common terminal and inner plastic body; Step 2: Weld thermistor No. 1 to the tail end of terminal No. 2 and the tail end of the common terminal, weld thermistor No. 2 to the tail end of terminal No. 3 and the tail end of the common terminal, and weld terminal No. 1 to the copper busbar; Step 3, injection molding the inner plastic body, the copper busbar and the outer plastic body; Step 4: Pour sealant into the center groove and solidify; Step 5: Detection, and finally obtain the BDU copper busbar packaging structure.

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