Display panel and display device

Abstract

The invention belongs to the technical field of display, and discloses a display panel and a display device.The display panel comprises a display area and at least one hole opening area located in the display area, the hole opening area comprises a function hole, and a partition area is arranged between the display area and the function hole; at least one isolation column surrounding the functional hole is arranged in the partition area; the isolation column comprises an insulating layer arranged on a substrate and a covering layer arranged on the side, away from the insulating layer, of the substrate, and the covering layer is provided with a protruding part relative to the side wall of the insulating layer along at least one side, perpendicular to the stacking direction of the insulating layer and the covering layer, of the covering layer. And the protruding part and the side wall of the insulating layer form a partition groove. According to the display panel, water and oxygen can be prevented from immersing into the display panel from the functional holes, packaging effectiveness is guaranteed, damage to the isolation columns in the anode etching process can be avoided, and the dark spot problem is avoided.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is regarded as the next-generation display device because of its advantages such as self-luminescence, high efficiency, bright colors, thin and light weight, power saving, and rollability, and has attracted more and more attention in recent years.

[0003] Generally, various sensor components such as cameras and fingerprint sensors need to be placed on the front of a display device integrated with an OLED display panel. To avoid affecting the screen-to-body ratio of the display device, functional holes can be provided in the display area of the OLED display panel, and various sensor components such as cameras and fingerprint sensors can be arranged in the functional holes. Since the side walls of the functional holes expose the organic light-emitting layer and the cathode, etc., water and oxygen in the atmosphere will penetrate into the display panel along the organic light-emitting layer, causing the organic light-emitting layer to fail, resulting in poor display and reducing the packaging effectiveness of the display panel. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a display panel and a display device.

[0005] In a first aspect, a display panel is provided. The display panel includes a display area and at least one opening area located in the display area. The opening area includes a functional hole, and a partition area is provided between the display area and the functional hole. At least one isolation column surrounding the functional hole is provided in the partition area. The isolation column includes an insulating layer provided on a substrate and a covering layer provided on a side of the substrate away from the insulating layer. At least one side of the covering layer in a direction perpendicular to the lamination direction of the insulating layer and the covering layer has a protrusion relative to the side wall of the insulating layer, and the protrusion and the side wall of the insulating layer form a partition groove.

[0006] In addition, the display panel of the present invention may further have the following additional technical features: In some embodiments, the covering layer includes a main body portion. The main body portion is provided on a side of the insulating layer away from the substrate. One side of the main body portion has the protrusion relative to the side wall of the insulating layer, and a first extension portion is provided on the other side of the main body portion. The first extension portion covers the side wall of the insulating layer on a side away from the protrusion.

[0007] In some embodiments, the orthographic projection of the main body portion on the substrate at least covers the orthographic projection of the insulating layer on the substrate.

[0008] In some embodiments, a second extension portion is further provided at one end of the first extension portion away from the main body portion, and the second extension portion extends away from the insulating layer along a direction perpendicular to the stacking direction of the insulating layer and the covering layer.

[0009] In some embodiments, the main body portion, the first extension portion, and the second extension portion are integrally formed.

[0010] In some embodiments, the covering layer is an insulating covering layer.

[0011] In some embodiments, there are a plurality of isolation columns, and the plurality of isolation columns include a first type of sub-isolation column and a second type of sub-isolation column. The first type of sub-isolation column has the partition grooves on both the side away from the functional hole and the side close to the functional hole. The second type of sub-isolation column has the partition groove and the first extension portion on both sides along the direction perpendicular to the stacking direction of the insulating layer and the covering layer respectively; the second type of sub-isolation column is arranged closer to the display area than the first type of sub-isolation column.

[0012] In some embodiments, the display panel further includes an interlayer dielectric layer provided on the substrate. A first passivation layer is provided on the side of the interlayer dielectric layer away from the substrate. A planarization layer is provided on the side of the first passivation layer away from the interlayer dielectric layer. The planarization layer is located in the display area and is provided on the same layer as the insulating layer; A second passivation layer is provided on the side of the planarization layer away from the first passivation layer. The second passivation layer is located in the display area and is provided on the same layer as the covering layer.

[0013] In some embodiments, a first electrode thin film is provided on the side of the second passivation layer away from the planarization layer. The first electrode thin film is located in the display area and the partition area. The first electrode thin film located in the partition area is removed by an etching process in patterning, and the first electrode thin film located in the display area is patterned to form a first electrode.

[0014] In some embodiments, a pixel definition layer is provided on the side of the second passivation layer away from the planarization layer. The pixel definition layer is provided with a plurality of opening areas, and at least a part of the first electrode is provided in the opening areas; An organic light-emitting layer is provided on the side of the first electrode away from the second passivation layer. The organic light-emitting layer covers the pixel definition layer and the first electrode, and the organic light-emitting layer extends towards the partition area to the side wall of the isolation column and forms an organic light-emitting block on the side of the isolation column away from the substrate.

[0015] In some embodiments, a second electrode is disposed on a side of the organic light-emitting layer away from the first electrode. The second electrode is located in the display area and extends toward the partition area to the sidewall of the isolation pillar, and an electrode block is formed on a side of the organic light-emitting block away from the isolation pillar.

[0016] In a second aspect, a display device is provided, and the display device includes the display panel according to any embodiment of the present application.

[0017] The display panel and the display device provided by the present disclosure utilize the isolation pillars formed by the insulating layer and the covering layer, which can block water and oxygen from entering the display panel through the functional holes, ensuring the effectiveness of the encapsulation; and can avoid damage to the isolation pillars during the anodic etching process, avoiding GDS problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0019] Figure 1 It is a schematic structural diagram of the display panel provided by the present application; Figure 2 It is the first structural diagram of the existing isolation pillar; Figure 3 It is the second structural diagram of the existing isolation pillar; Figure 4 For Figure 3 The physical diagram of the isolation pillar in Figure 5 It is a schematic cross-sectional view of the display panel provided by the present application; Figure 6 It is a layout diagram of the isolation pillars provided by the present application; Figure 7 It is a structural diagram of the isolation pillars provided by the present application; Figure 8 It is a structural diagram of the display device provided by the embodiment of the present application.

[0020] In the above figures: 10 display panel; 101 display area; 102 opening area; 1021 functional hole; 1022 partition area; 11 Substrate; 12 Buffer layer; 13 Active layer; 14 Gate insulating layer; 15 Gate; 16 Interlayer dielectric layer; 17 Source electrode; 18 Drain electrode; 19 First passivation layer; 20 Planarization layer; 21 Second passivation layer; 22 First electrode; 23 Pixel definition layer; 24 Organic light-emitting layer; 241 Organic light-emitting block; 25 Second electrode; 251 Electrode block; 26 First encapsulation layer; 27 Second encapsulation layer; 28 Third encapsulation layer; 30 Isolation pillar; 31 Insulating layer; 32 Cover layer; 320 Main body portion; 321 First extension portion; 322 Second extension portion; 33 Partition groove; 301 First metal layer; 302 Second metal layer; 303 Third metal layer; 100 Display device. Detailed implementation manners

[0021] Hereinafter, the technical solutions in some embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0022] Unless otherwise required by the context, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example", or "some examples", etc. are intended to indicate that the specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the described specific features, structures, materials, or characteristics can be included in any one or more embodiments or examples in any suitable manner.

[0023] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more.

[0024] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0025] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0026] It should be understood that when a layer or element is referred to as being on another layer or substrate, it may be directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate.

[0027] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions is exaggerated for clarity. Thus, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include shape deviations caused by, for example, manufacturing.

[0028] Generally, various sensor components such as cameras and fingerprint sensors need to be placed on the front side of the display device 100 integrated with the OLED display panel 10. In order not to affect the screen-to-body ratio of the display device 100, function holes 1021 can be provided in the display area 101 of the OLED display panel 10, and various sensor components such as cameras and fingerprint sensors can be disposed in the function holes 1021. Since the sidewalls of the function holes 1021 expose the organic light-emitting layer 24 and the cathode, etc., water and oxygen in the atmosphere will penetrate into the display panel 10 along the organic light-emitting layer 24, causing the organic light-emitting layer 24 to fail, resulting in poor display and reducing the encapsulation effectiveness of the display panel 10.

[0029] Currently, metal isolation posts 30 are provided between the function holes 1021 and the display area 101 to isolate the erosion of water and oxygen on the OLED light-emitting devices, as Figure 2As shown, the metal isolation pillar 30 generally adopts an I-shaped structure formed by a first metal layer 301, a second metal layer 302, and a third metal layer 303. Among them, the thicknesses of the first metal layer 301 and the third metal layer 303 are 500 Å, and the thickness of the second metal layer 302 is 6000 Å; the first metal layer 301 and the third metal layer 303 are formed of titanium (Ti), and the second metal layer 302 is formed of aluminum (Al); or as Figure 3 and Figure 4 shown, a metal isolation pillar with a double I-shaped structure is adopted. Since the side wall of the second metal layer 302 of the metal isolation pillar 30 is exposed, in the exposed area of the side wall of the second metal layer 302, the anode of the OLED will directly contact the side wall of the second metal layer 302 of the metal isolation pillar 30 during the etching process of forming the anode, and the Ag + precipitated during the anode etching will react with the Al on the side wall of the second metal layer 302, resulting in Al damage of the metal isolation pillar 30, and causing a problem of dark spots (GDS, Grow dark spot) in the display panel 10. Among them, GDS refers to the failure of the OLED display package, resulting in the oxidation and light emission failure of the organic light-emitting device, forming a non-light-emitting black spot.

[0030] To at least partially solve the above technical problems, referring to Figure 1 、 Figures 5 to 7 , in a first aspect, a display panel 10 is provided. The display panel 10 includes a display area 101 and at least one opening area 102 located in the display area 101. The opening area 102 includes a functional hole 1021. A partition area 1022 is provided between the display area 101 and the functional hole 1021, and at least one isolation pillar 30 surrounding the functional hole 1021 is provided in the partition area 1022; The isolation pillar 30 includes an insulating layer 31 provided on a substrate 11 and a covering layer 32 provided on a side of the substrate 11 away from the insulating layer 31. At least one side of the covering layer 32 in a direction perpendicular to the lamination direction of the insulating layer 31 and the covering layer 32 has a protrusion relative to the side wall of the insulating layer 31, and the protrusion and the side wall of the insulating layer 31 form a partition groove 33.

[0031] Specifically, referring to Figure 1 , the display panel 10 includes a display area 101 configured to display images. At least one opening area 102 is provided in the display area 101, a functional hole 1021 is provided in the opening area 102, the functional hole 1021 is configured to install an optical device, the shape of the functional hole 1021 can be circular, square, polygonal, elliptical, etc., and the optical device can be an optical sensor such as a camera device, a fingerprint recognition device, a 3D imaging device, etc. This application does not make any limitations here.

[0032] It can be understood that the present application places no restrictions on the position of the functional hole 1021 in the display area 101. The functional hole 1021 can be located in the upper or lower part of the display area 101, or the functional hole 1021 can also be located at the edge of the display area 101. The functional hole 1021 can be a through hole or a blind hole, etc.

[0033] Reference Figure 1 , a partition area 1022 is formed between the functional hole 1021 and the display area 101. The partition area 1022 is arranged around the functional hole 1021 and is located between the functional hole 1021 and the display area 101. At least one isolation column 30 surrounding the functional hole 1021 is arranged in the partition area 1022. The isolation column 30 is configured to block the ingress of water and oxygen in the functional hole 1021 into the display panel 10 to ensure the effectiveness of the display panel 10. Exemplarily, a plurality of multi-turn isolation columns 30 surrounding the functional hole 1021 are arranged in the partition area 1022, which can further prevent water and oxygen from entering the display panel 10.

[0034] Reference Figures 5 to 7 , the isolation column 30 includes an insulating layer 31 provided on the substrate 11. One side of the insulating layer 31 along the stacking direction perpendicular to the insulating layer 31 and the covering layer 32 has a protrusion relative to the side wall of the insulating layer 31, so that a partition groove 33 is formed between the protrusion on one side of the insulating layer 31 and the side wall of the insulating layer 31. The partition groove 33 can be arranged towards the side close to or away from the functional hole 1021; or, both sides of the insulating layer 31 along the stacking direction perpendicular to the insulating layer 31 and the covering layer 32 have protrusions relative to the side wall of the insulating layer 31, so that partition grooves 33 are formed between both sides of the insulating layer 31 and the opposite two side walls of the insulating layer 31, that is, both the side of the isolation column 30 close to and away from the functional hole 1021 have partition grooves 33, making the isolation column 30 as a whole in a T-shaped structure.

[0035] In this example, the partition groove 33 arranged on one side or both sides of the isolation column 30 close to or / and away from the functional layer can disconnect the organic light-emitting layer 24 and the cathode, etc. at the position of the isolation column 30, that is, the organic light-emitting layer 24 and the cathode are no longer a continuous film layer structure in the partition area 1022, truncating the water and oxygen transmission channel, blocking the ingress of water and oxygen, and ensuring the effectiveness and reliability of the encapsulation; and during the formation of the anode by etching, the insulating layer 31 uses a non-conductive material, so that the anode contacts the side wall of the insulating layer 31, and the silver ions (Ag + ) precipitated from the anode will not damage the side wall of the metal isolation column 30, avoiding the GDS problem.

[0036] It can be understood that the insulating layer 31 is formed of a non-conductive insulating material, which can be an organic material, an inorganic material, or a mixture of the two. Among them, the inorganic material can be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON). The organic materials include polyimide (PI), epoxy resin, polystyrene (PS), etc.

[0037] For the display panel 10 provided by the embodiment of the present application, the isolation column 30 formed by the insulating layer 31 and the covering layer 32 can block the intrusion of water and oxygen into the display panel 10 from the functional hole 1021, ensuring the effectiveness of the encapsulation; and it can avoid damage to the isolation column 30 during the anodic etching process and avoid GDS problems.

[0038] In some embodiments, referring to Figure 6 and Figure 7 , the covering layer 32 includes a main body portion 320. The main body portion 320 is disposed on a side of the insulating layer 31 away from the substrate 11. One side of the main body portion 320 has a protrusion relative to the side wall of the insulating layer 31, and a first extension portion 321 is disposed on the other side of the main body portion 320. The first extension portion 321 covers the side wall of the insulating layer 31 on a side away from the protrusion.

[0039] Specifically, the covering layer 32 includes a main body portion 320 and a first extension portion 321 that are bent and connected. Among them, the main body portion 320 covers a side of the insulating layer 31 away from the substrate 11, and one side of the main body portion 320 along a direction perpendicular to the lamination direction of the insulating layer 31 and the covering layer 32 has a protrusion relative to the first side wall of the insulating layer 31, so that the protrusion and the first side wall of the insulating layer 31 form a partition groove 33; a first extension portion 321 covering the second side wall of the insulating layer 31 is disposed on the other side of the main body portion 320. The first side wall of the insulating layer 31 is one of the side walls of the insulating layer 31 close to or away from the functional hole 1021, and the second side wall of the insulating layer 31 is the other of the side walls of the insulating layer 31 close to or away from the functional hole 1021. Exemplarily, the first side wall of the insulating layer 31 is the side wall close to the functional hole 1021, and the second side wall of the insulating layer 31 is the side wall away from the functional hole 1021; or, the first side wall of the insulating layer 31 is the side wall away from the functional hole 1021, and the second side wall of the insulating layer 31 is the side wall close to the functional hole 1021.

[0040] In this example, the first extension portion 321 covers the first side wall or the second side wall of the insulating layer 31, and the first extension portion 321 can at least cover the first side wall or the second side wall of the insulating layer 31, avoiding contact between the anode and the side wall of the insulating layer 31, and further avoiding damage to the side wall of the insulating layer 31 caused by the precipitation of Ag + during the anodic etching process, so as not to cause GDS problems.

[0041] In some embodiments, the orthographic projection of the main body portion 320 on the substrate 11 at least covers the orthographic projection of the insulating layer 31 on the substrate.

[0042] Specifically, the main body portion 320 can at least completely cover the surface of the insulating layer 31 on the side away from the substrate 11, so that the organic light-emitting layer 24 and the cathode are disconnected at the position of the isolation column 30, truncating the water and oxygen transmission channels, blocking the intrusion of water and oxygen, and ensuring the effectiveness and reliability of the encapsulation.

[0043] In some embodiments, referring to Figure 6 and Figure 7 , a second extension portion 322 is further provided at one end of the first extension portion 321 away from the main body portion 320, and the second extension portion 322 extends in a direction away from the insulating layer 31 along a direction perpendicular to the lamination direction of the insulating layer 31 and the covering layer 32.

[0044] Specifically, the second extension portion 322 is arranged parallel to the main body portion 320, and the second extension portion 322 covers the foundation. Through the cooperation of the first extension portion 321 and the second extension portion 322, the first side wall or the second side wall of the insulating layer 31 can be completely covered. Preferably, the first extension portion 321 and the second extension portion 322 are arranged on the side wall of the insulating layer 31 away from the functional hole 1021, so as to avoid the contact between the anode and the side wall of the insulating layer 31, and further avoid the damage of the silver ions precipitated by the anode etching to the isolation column 30.

[0045] In this example, the setting of the second extension portion 322 prevents the side wall of the insulating layer 31 of the isolation column 30 away from the partition groove 33 from being eroded by the etching solution, avoiding damage to the isolation column 30.

[0046] In some embodiments, referring to Figure 6 and Figure 7 , the main body portion 320, the first extension portion 321 and the second extension portion 322 are integrally formed. In this example, the covering layer 32 is formed by using the integrally formed main body portion 320, the first extension portion 321 and the second extension portion 322, which simplifies the process and improves the preparation efficiency of the display panel 10.

[0047] In some embodiments, the covering layer 32 is an insulating covering layer 32.

[0048] Specifically, the covering layer 32 is an insulating covering layer 32 formed of an insulating material. The insulating material can be an organic material, an inorganic material, or a mixture of the two. Among them, the inorganic material can be one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON). The organic materials include polyimide (PI), epoxy resin, polystyrene (PS), etc.

[0049] The insulating layer 31 is also formed of an insulating material. The insulating material of the insulating layer 31 can be the same as or different from that of the covering layer 32. The present disclosure does not make a limitation. The insulating material of the insulating layer 31 is specifically as described above, and will not be elaborated in this application.

[0050] In this example, the covering layer 32 is made of a non-conductive insulating material and covers the side wall of the insulating layer 31. The anode contacts the side wall of the covering layer 32. The silver ions precipitated by the anodic etching will not damage the side wall of the covering layer 32, avoiding damage to the isolation column 30 and further avoiding GDS problems.

[0051] In some embodiments, referring to Figure 6 , there are multiple isolation columns 30. The multiple isolation columns 30 include a first type of sub-isolation column 30 and a second type of sub-isolation column 30. Both the side of the first type of sub-isolation column 30 away from the functional hole 1021 and the side close to the functional hole 1021 have the partition grooves 33. Both sides of the second type of sub-isolation column 30 along the stacking direction perpendicular to the insulating layer 31 and the covering layer 32 respectively have the partition groove 33 and the first extension portion 321; the second type of sub-isolation column 30 is disposed closer to the display area 101 than the first type of sub-isolation column 30.

[0052] Specifically, there are multiple isolation columns 30 located in the partition area 1022. The multiple isolation columns 30 are divided into a first type of sub-isolation column 30 and a second type of sub-isolation column 30. Both sides of the first type of sub-isolation column 30 have the partition grooves 33; one side of the second type of sub-isolation column 30 has the partition groove 33 and the other side has the first extension portion 321. The second type of sub-isolation column 30 is disposed closer to the display area 101 than the first type of sub-isolation column 30, so that most of the cathodes located in the partition area 1022 are not charged, further reducing the possibility of electrolytic reaction of water and oxygen invading into the partition area 1022, and ensuring the reliability and encapsulation effect of the display panel 10 encapsulation.

[0053] In some embodiments, the display area 101 of the display panel 10 further includes a plurality of pixel units arranged in a matrix. Each pixel unit includes any one of a red pixel unit, a green pixel unit, or a blue pixel unit. Each pixel unit includes an organic light-emitting device and a pixel driving circuit, and the pixel driving circuit can drive the corresponding organic light-emitting device to emit light.

[0054] The pixel driving circuit may include electronic components such as multiple transistors, capacitors, and driving elements of the transistors. For example, the pixel driving circuit may include three transistors and one capacitor, forming 3T1C (i.e., one driving transistor, two switching transistors, and one capacitor). It may also include more than three transistors and at least one capacitor, such as 4T1C (i.e., one driving transistor, three switching transistors, and one capacitor), 5T1C (i.e., one driving transistor, four switching transistors, and one capacitor), or 7T1C (i.e., one driving transistor, six switching transistors, and one capacitor), etc. Among them, the transistor may be a thin film transistor (Thin Film Transistor, abbreviated as TFT), a metal oxide semiconductor field effect transistor (abbreviated as MOS), or other switching devices with the same characteristics. The thin film transistor may be any one of a low temperature poly-silicon (Low Temperature Poly-silicon, LTPS) TFT, an oxide TFT (Oixde TFT), or a low temperature poly-oxide (Low Temperature Poly-Oixde, LTPO) TFT.

[0055] Exemplarily, the display panel 10 includes a pixel driving circuit disposed on the substrate 11, an organic light emitting device is disposed on a side of the pixel driving circuit away from the substrate 11, and a packaging layer is disposed on a side of the organic light emitting device away from the pixel driving circuit.

[0056] Exemplarily, referring to Figure 5 , the pixel driving circuit includes a buffer layer 12 disposed on the substrate 11, an active layer 13 is disposed on a side of the buffer layer 12 away from the substrate 11, a gate insulating layer 14 covering the active layer 13 and the buffer layer 12 is disposed on a side of the active layer 13 away from the buffer layer 12, a gate 15 is disposed on a side of the gate insulating layer 14 away from the active layer 13, an interlayer dielectric layer 16 covering the gate 15 and the gate insulating layer 14 is disposed on a side of the gate 15 away from the active layer 13, a first conductive layer is disposed on a side of the interlayer dielectric layer 16 away from the gate 15, the first conductive layer includes a source electrode 17 and a drain electrode 18, the source electrode 17 and the drain electrode 18 are electrically connected to two sides of the active layer 13 through vias penetrating the interlayer dielectric layer 16 and the gate insulating layer 14, and a first passivation layer 19 covering the source electrode 17, the drain electrode 18, and the interlayer dielectric layer 16 is disposed on a side of the first conductive layer away from the interlayer dielectric layer 16. In this example, the active layer 13, the gate 15, the source electrode 17, and the drain electrode 18 constitute the transistors of the pixel driving circuit.

[0057] In this example, the buffer layer 12, the gate insulating layer 14, and the interlayer dielectric layer 16 can be made of inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer. The first conductive layer is made of a metal material such as one or more of silver, copper, aluminum, titanium, and molybdenum, or an alloy material of the above metals, and can be a single layer or a multi-layer composite structure. The active layer 13 can be made of amorphous silicon, polycrystalline silicon, metal oxides (such as IGZO), and organic semiconductor materials, etc.

[0058] Exemplarily, referring to Figure 5 , the organic light-emitting device includes an anode, a pixel defining layer 23, an organic light-emitting layer 24, and a cathode. The encapsulation layer includes a first encapsulation layer 26, a second encapsulation layer 27, and a third encapsulation layer 28 which are stacked. Among them, the first encapsulation layer 26 and the third encapsulation layer 28 can be inorganic encapsulation layers, and the second encapsulation layer 27 is an organic encapsulation layer.

[0059] In some embodiments, referring to Figure 5 , the display panel 10 further includes an interlayer dielectric layer 16 disposed on the substrate 11. A first passivation layer 19 is disposed on a side of the interlayer dielectric layer 16 away from the substrate 11. A planarization layer 20 is disposed on a side of the first passivation layer 19 away from the interlayer dielectric layer 16. The planarization layer 20 is located in the display area 101, and the planarization layer 20 is disposed on the same layer as the insulating layer 31; A second passivation layer 21 is disposed on a side of the planarization layer 20 away from the first passivation layer 19. The second passivation layer 21 is located in the display area 101, and the second passivation layer 21 is disposed on the same layer as the covering layer 32.

[0060] Exemplarily, a planarization layer 20 is disposed on a side of the first passivation layer 19 away from the interlayer dielectric layer 16. The planarization layer 20 is located in the display area 101, and the planarization layer 20 and the insulating layer 31 in the partition area 1022 are formed by the same patterning process, reducing costs and improving production efficiency. In this example, the planarization layer 20 and the insulating layer 31 can be formed of the same organic material such as polyimide (PI), polystyrene (PS), polycarbonate (PC), benzocyclobutene (BCB), etc.

[0061] Exemplarily, referring to Figure 5 , a second passivation layer 21 is disposed on a side of the planarization layer 20 away from the first passivation layer 19. The second passivation layer 21 is located in the display area 101, and the second passivation layer 21 and the covering layer 32 are formed by the same patterning process, reducing costs and improving production efficiency. In this example, the second passivation layer 21 and the covering layer 32 can be formed of the same organic material such as polyimide (PI), polystyrene (PS), polycarbonate (PC), benzocyclobutene (BCB), etc.

[0062] In some embodiments, a first electrode film is disposed on a side of the second passivation layer 21 away from the flat layer 20. The first electrode film is located in the display area 101 and the partition area 1022. The first electrode film located in the partition area 1022 is removed by an etching process in patterning, and the first electrode film located in the display area 101 is patterned to form a first electrode 22.

[0063] Specifically, a first electrode film is formed on a side of the second passivation layer 21 away from the flat layer 20. The first electrode film is located in the display area 101 and the partition area 1022. During the patterning and etching process of the first electrode film, it will be removed in the partition area 1022. The silver ions generated during the etching process of the first electrode film located in the partition area 1022 will not react with the insulating layer 31 and the covering layer 32 of the isolation column 30, and will not corrode the isolation column 30, avoiding the problem of poor GDS. The first electrode film located in the display area 101 is patterned to form a first electrode 22, and the first electrode 22 can be an anode.

[0064] In some embodiments, referring to Figure 5 , a pixel definition layer 23 is disposed on a side of the second passivation layer 21 away from the flat layer 20. The pixel definition layer 23 is provided with a plurality of opening areas, and at least a part of the first electrode 22 is disposed in the opening areas; An organic light-emitting layer 24 is disposed on a side of the first electrode 22 away from the second passivation layer 21. The organic light-emitting layer 24 covers the pixel definition layer 23 and the first electrode 22, and the organic light-emitting layer 24 extends toward the partition area 1022 to the side wall of the isolation column 30, and an organic light-emitting block 241 is formed on a side of the isolation column 30 away from the substrate 11.

[0065] Specifically, a pixel definition layer 23 is disposed on a side of the second passivation layer 21 away from the flat layer 20. The pixel definition layer 23 is provided with a plurality of opening areas, and at least a part of the first electrode 22 is located in the opening areas. An organic light-emitting layer 24 covering the pixel definition layer 23 and the first electrode 22 is disposed on a side of the first electrode 22 away from the second passivation layer 21. The organic light-emitting layer 24 is located in the display area 101 and extends to the side wall of the isolation column 30 in the partition area 1022 and is disconnected, and an organic light-emitting block 241 is formed on a side of the isolation column 30 away from the substrate 11.

[0066] In this example, the organic light-emitting layer 24 extends to contact the side wall of the insulating layer 31 of the isolation column 30 or the side wall of the first extension portion 321 of the covering layer 32 on a side closer to the partition area 1022. The organic light-emitting layer 24 in the partition area 1022 is isolated from the organic light-emitting block 241, truncating the water and oxygen transmission channel, blocking the intrusion of water and oxygen, and ensuring the effectiveness and reliability of the encapsulation.

[0067] In some embodiments, with reference to Figure 5 , a second electrode 25 is disposed on a side of the organic light-emitting layer 24 away from the first electrode 22. The second electrode 25 is located in the display area 101 and extends toward the partition area 1022 to the side wall of the isolation column 30, and an electrode block 251 is formed on a side of the organic light-emitting block 241 away from the isolation column 30.

[0068] Specifically, a second electrode 25 is disposed on a side of the organic light-emitting layer 24 away from the first electrode 22. The second electrode 25 may be a cathode. The cathode is located in the display area 101 and extends toward the side of the isolation column 30 and is disconnected at the side wall of the isolation column 30, and an electrode block 251 is formed on a side of the organic light-emitting block 241 away from the isolation column 30.

[0069] In this example, the second electrode 25 extends toward the side closer to the partition area 1022 and contacts the side wall of the insulating layer 31 of the isolation column 30 or the side wall of the first extension portion 321 of the covering layer 32. The second electrode 25 in the partition area 1022 is isolated from the electrode block 251, truncating the water and oxygen transmission channel, blocking the intrusion of water and oxygen, and ensuring the effectiveness and reliability of the encapsulation.

[0070] The substrate 11 may be a rigid substrate or a flexible substrate. The rigid substrate may be made of glass or quartz material, and the flexible substrate may be made of materials such as polyimide (PI). The flexible substrate may be a single-layer structure, or may be a laminated structure composed of an inorganic material layer and a flexible material layer. The present application does not make a limitation herein.

[0071] An embodiment of the present application provides a method for manufacturing a display panel 10, with reference to Figure 5 , including: Forming a buffer layer 12 on the substrate 11; Forming an active layer 13 on a side of the buffer layer 12 away from the substrate 11; Forming a gate insulating layer 14 covering the buffer layer 12 and the active layer 13 on a side of the active layer 13 away from the buffer layer 12; Forming a gate 15 by a patterning process on a side of the gate insulating layer 14 away from the active layer 13; Forming an interlayer dielectric layer 16 covering the gate 15 and the gate insulating layer 14 on a side of the gate 15 away from the active layer 13; Forming a first conductive layer on a side of the interlayer dielectric layer 16 away from the gate 15. The first conductive layer includes a source electrode 17 and a drain electrode 18. The source electrode 17 and the drain electrode 18 are electrically connected to both sides of the active layer 13 through vias penetrating the interlayer dielectric layer 16 and the gate insulating layer 14; Forming a first passivation layer 19 covering the source electrode 17, the drain electrode 18, and the interlayer dielectric layer 16 on a side of the first conductive layer away from the interlayer dielectric layer 16; On the side of the first passivation layer 19 away from the interlayer dielectric layer 16, a planarization layer 20 and an insulating layer 31 are formed by the same patterning process. The planarization layer 20 is located in the display area 101, and the insulating layer 31 is located in the partition area 1022. Among them, the partition area 1022 has a plurality of insulating layers 31 arranged at intervals around the functional hole 1021; On the side of the planarization layer 20 away from the first passivation layer 19, a second passivation layer 21 and a covering layer 32 are formed by the same patterning process. The second passivation layer 21 is located in the display area 101, and the covering layer 32 is located in the partition area 1022. Among them, the partition area 1022 has a plurality of covering layers 32 arranged at intervals around the functional hole 1021, and each covering layer 32 is disposed on the side of the corresponding insulating layer 31 away from the substrate 11; A pixel definition layer 23 is formed on the side of the second passivation layer 21 away from the planarization layer 20. A plurality of opening areas are provided in the pixel definition layer 23, and a first electrode 22 is formed in the opening. The first electrode 22 is an anode; An organic light-emitting layer 24 is formed on the side of the first electrode 22 away from the second passivation layer 21. The organic light-emitting layer 24 is located in the display area 101 and extends beyond the partition area 1022 to the side wall of the isolation column 30 and is disconnected. An organic light-emitting block 241 is formed on the side of the isolation column 30 away from the substrate 11. That is, the organic light-emitting layer 24 and the organic light-emitting block 241 are formed by the same patterning process; A second electrode 25 is formed on the side of the organic light-emitting layer 24 away from the first electrode 22. The second electrode 25 is located in the display area 101 and extends toward the partition area 1022 to the side wall of the isolation column 30, and an electrode block 251 is formed on the side of the organic light-emitting block 241 away from the isolation column 30. That is, the second electrode 25 and the electrode block 251 are formed by the same patterning process. The second electrode 25 is a cathode; A first encapsulation layer 26 is formed on the side of the second electrode 25 away from the organic light-emitting layer 24, a second encapsulation layer 27 is formed on the side of the first encapsulation layer 26 away from the second electrode 25, and a third encapsulation layer 28 is formed on the side of the second encapsulation layer 27 away from the first encapsulation layer 26.

[0072] In this example, the patterning process includes conventional technical means such as coating photoresist, mask exposure, development, etching, and stripping photoresist.

[0073] In a second aspect, a display device 100 is provided. The display device 100 includes the display panel 10 described in any embodiment of the present application, or includes the display panel 10 obtained by the preparation method of the display panel 10 described in any embodiment of the present application.

[0074] The display device 100 includes the display panel 10 as described above. Of course, it may also include other components. For example, it may include a circuit for providing an electrical signal to the display panel 10 to drive the display panel 10 to emit light. This circuit may be referred to as a control circuit and may include a circuit board and / or an IC (Integrated Circuit) electrically connected to the display panel 10.

[0075] In some embodiments, the display device 100 may be an illumination device. At this time, the display device 100 serves as a light source to achieve an illumination function. For example, the display device 100 may be a backlight module in a liquid crystal display device 100, a lamp for internal or external illumination, or various signal lights, etc.

[0076] In some other embodiments, the display device 100 may be a display substrate for implementing a display image (i.e., a picture) function. The display device 100 may include a display or a product including a display. Among them, the display may be a flat panel display (FPD), a micro display, etc. If divided according to whether the user can see the back scene of the display, the display may be a transparent display or an opaque display. If divided according to whether the display can be bent or curled, the display may be a flexible display or a common display (which may be referred to as a rigid display).

[0077] Exemplarily, products including a display may include: a computer display, a television, a billboard, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (PDA), a laptop computer, a digital camera, a portable video camera, a viewfinder, a vehicle, a large-area wall, a screen in a theater, or a stadium sign, etc.

[0078] The technical features and beneficial effects of the above display device 100 are the same as those of the display panel 10 provided in the above embodiments of the present disclosure, and will not be elaborated here.

[0079] The above description is only a preferred embodiment of the present application and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, a technical solution formed by mutually replacing the above features with (but not limited to) technical features having similar functions disclosed in the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and at least one opening area in the display area, the opening area comprises a functional hole, a partition area is arranged between the display area and the functional hole, and at least one isolation column surrounding the functional hole is arranged in the partition area; The isolation column includes an insulating layer arranged on a substrate and a covering layer arranged on a side of the substrate away from the insulating layer. The covering layer has a protrusion relative to the side wall of the insulating layer along at least one side perpendicular to the stacking direction of the insulating layer and the covering layer, and the protrusion forms a partition groove with the side wall of the insulating layer.

2. The display panel according to claim 1, characterized in that: The covering layer includes a main body portion, which is arranged on a side of the insulating layer away from the substrate, one side of the main body portion has the protrusion relative to the side wall of the insulating layer, and the other side of the main body portion is provided with a first extension portion, which covers the side wall of the insulating layer away from the protrusion.

3. The display panel according to claim 2, characterized in that: The orthographic projection of the main body on the base at least covers the orthographic projection of the insulating layer on the substrate.

4. The display panel according to claim 2, characterized in that: A second extending portion is further disposed at one end of the first extending portion away from the main body portion, and the second extending portion is extended toward a side away from the insulating layer along a direction perpendicular to the stacking direction of the insulating layer and the covering layer.

5. The display panel according to claim 4, characterized in that: The main body, the first extension portion and the second extension portion are integrally formed.

6. The display panel according to claim 1, characterized in that: The covering layer is an insulating covering layer.

7. The display panel according to claim 2, characterized in that: There are multiple isolation columns, which include first-type sub-isolation columns and second-type sub-isolation columns. The first-type sub-isolation columns have the partition groove on both the side away from the functional hole and the side close to the functional hole. The second-type sub-isolation columns have the partition groove and the first extension portion on both sides along the stacking direction perpendicular to the insulating layer and the covering layer. The second-type sub-isolation columns are arranged closer to the display area relative to the first-type sub-isolation columns.

8. The display panel according to claim 1, characterized in that: The display panel further comprises an interlayer dielectric layer disposed on the substrate, a first passivation layer is disposed on a side of the interlayer dielectric layer away from the substrate, a planarization layer is disposed on a side of the first passivation layer away from the interlayer dielectric layer, the planarization layer is located in the display area, and the planarization layer is disposed on the same layer as the insulating layer; A second passivation layer is disposed on a side of the planar layer away from the first passivation layer. The second passivation layer is located in the display area, and the second passivation layer is disposed in the same layer as the cover layer.

9. The display panel according to claim 8, characterized in that: A first electrode film is disposed on a side of the second passivation layer away from the planar layer. The first electrode film is located in the display area and the partition area. The first electrode film located in the partition area is removed by an etching process in patterning, and the first electrode film located in the display area is patterned to form a first electrode.

10. The display panel according to claim 9, characterized in that: A pixel definition layer is disposed on a side of the second passivation layer away from the planar layer, the pixel definition layer is provided with a plurality of opening areas, and the first electrode is at least partially disposed in the opening area; An organic light-emitting layer is disposed on a side of the first electrode away from the second passivation layer, the organic light-emitting layer covers the pixel definition layer and the first electrode, and the organic light-emitting layer extends toward the partition area to the side wall of the isolation column, and forms an organic light-emitting block on a side of the isolation column away from the substrate.

11. The display panel according to claim 10, characterized in that: A second electrode is disposed on a side of the organic light-emitting layer away from the first electrode. The second electrode is located in the display area and extends toward the partition area to the sidewall of the isolation column, and forms an electrode block on a side of the organic light-emitting block away from the isolation column.

12. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 11.

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