Light-emitting display device

Abstract

The present disclosure relates to a light emitting display device. A light emitting display device according to the present disclosure includes: a display panel including a plurality of pixels arranged in a matrix; a cover plate covering the display panel; slits provided on the cover plate between pixels adjacent in the first direction; and a light absorbing material filled in the slit.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of Korean Patent Application No. 10 - 2023 - 0188062, filed on December 21, 2023, which is hereby incorporated by reference in its entirety as if fully set forth herein. Technical field

[0003] The present disclosure relates to a light - emitting display device with improved color purity. Background art

[0004] Recently, head - mounted displays (HMDs) including organic light - emitting diode displays have been developed. An HMD is a wearable monitoring device worn in the form of glasses or a helmet for virtual reality (VR) or augmented reality (AR), and thus it focuses on a distance close to the user's eyes. Such a head - mounted display may be equipped with a small organic light - emitting diode display having high - resolution characteristics.

[0005] In particular, in an ultra - high - density resolution display device with a pixel density of 4K PPI (pixels per inch) or higher, since the size of pixels may become smaller, color mixing may occur between two adjacent pixels, resulting in deterioration of image quality. To improve these problems, a method of increasing brightness may be considered, but this method has a problem of increasing power consumption. Therefore, structural improvements may be required to provide an image quality with brighter brightness and clearer color purity at the same power consumption. Summary of the invention

[0006] To solve the above problems, an object of the present disclosure is to provide a top - emission type light - emitting display device or a top - emission type transparent light - emitting display device that has high brightness compared to power consumption and whose color purity is enhanced or improved.

[0007] One or more exemplary embodiments of the present disclosure may provide a top - emission type light - emitting display device or a top - emission type transparent light - emitting display device that improves color purity by preventing color mixing between very densely arranged pixels in an ultra - high - resolution structure and achieves low - power operation due to high brightness at the same power consumption.

[0008] To achieve the above - mentioned object of the present disclosure, a light - emitting display device according to the present disclosure includes: a display panel including a plurality of pixels arranged in a matrix; a cover plate covering the display panel; slits formed on the cover plate between pixels adjacent in a first direction among the plurality of pixels; and a light - absorbing material filled in the slits.

[0009] In an example, the slits have a depth equal to or less than the thickness of the cover plate.

[0010] In the example, the depth of the slit is 80% to 100% of the thickness of the cover plate.

[0011] In the example, the slit includes: a first side surface extending from the upper surface of the cover plate to a first end that is recessed by a predetermined depth along the depth direction; a second side surface separated from the first side surface by a predetermined width, extending from the upper surface of the cover plate to a second end, and facing the first side surface, the second end being recessed by a predetermined depth along the depth direction; a bottom surface extending from the first end to the second end; and a top surface facing the bottom surface and disposed on the upper surface of the cover plate.

[0012] In the example, the first side surface and the second side surface are parallel to each other as vertical surfaces.

[0013] In the example, either one of the first side surface and the second side surface is an inclined plane, and the other is a vertical plane.

[0014] In the example, the first side surface and the second side surface are inclined planes.

[0015] In the example, the size of the top surface is different from the size of the bottom surface.

[0016] In the example, the display panel includes: an anode electrode disposed on each pixel; a bank covering the periphery of the anode electrode; an emission layer disposed on the anode electrode; and a cathode electrode disposed on the emission layer. The slit has a width corresponding to that of the bank.

[0017] In the example, the slit has a width 5% to 10% wider than that of the bank. The bank overlaps with the middle portion of the slit.

[0018] In the example, the display panel includes: a substrate; a driving element layer disposed on the substrate; a light-emitting element layer disposed on the driving element layer; a packaging layer disposed on the light-emitting element layer; and a color filter layer disposed on the packaging layer. The cover plate is attached to the color filter layer with a transparent optical adhesive.

[0019] In the example, the color filter layer includes a first color filter, a second color filter, and a third color filter corresponding to each pixel. The slit is disposed between the first color filter and the second color filter, between the second color filter and the third color filter, and between the third color filter and the first color filter.

[0020] In the example, the light absorption material has a refractive index smaller than that of the cover plate.

[0021] In the example, the cover plate includes a transparent material with a refractive index of 1.5 to 1.9. The light absorption material includes a black resin material with a refractive index of 1.2 to 1.4.

[0022] In the example, the display panel includes: a display area that provides video images; and a non-display area that surrounds the display area. The cover plate has an area larger than the display area and is disposed on the display area. The slit is disposed on the cover plate within the display area.

[0023] The light-emitting display device according to the present disclosure may include a black matrix that separates boundaries between pixels on a cover glass substrate (or cover glass) attached to the top of a display panel equipped with color filters. Accordingly, color purity of each pixel may be improved by preventing light from mixing at boundaries between two adjacent pixels.

[0024] The light-emitting display device according to the present disclosure may provide brighter luminance under the same power consumption by: the color filters provided in each pixel may have an area corresponding to a maximum size of a light-emitting area of each pixel. In addition, voids or gaps may be formed between pixels on the cover glass substrate placed on the color filters, and the voids may be filled with a black resin material to provide a black matrix, thereby preventing color mixing at boundaries between pixels. Accordingly, the light-emitting display device according to the present disclosure may provide high luminance and improved color purity at low power consumption, thereby providing excellent image quality in low-power operation.

[0025] In addition to the effects of the present disclosure mentioned above, other features and advantages of the present disclosure are described below, or other features and advantages of the present disclosure may be clearly understood by those skilled in the art based on such description and explanation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings included to provide a further understanding of the present disclosure and incorporated in and constituting a part of this application illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings:

[0027] Figure 1 is a plan view schematically showing a structure of a light-emitting display device according to an embodiment of the present disclosure.

[0028] Figure 2 is a circuit diagram showing a structure of one pixel provided in a light-emitting display device according to an embodiment of the present disclosure.

[0029] Figure 3 is an enlarged plan view showing structures of three pixels sequentially provided in a light-emitting display device according to an embodiment of the present disclosure.

[0030] Figure 4 is along Figure 3A cross-sectional view taken along line I-I’ in the [device name] for showing the structure of one pixel in a light-emitting display device according to an embodiment of the present disclosure.

[0031] Figure 5 A plan view showing the structures of three pixels arranged in sequence in a light-emitting display device according to a first embodiment of the present disclosure.

[0032] Figure 6 Is along Figure 5 An enlarged cross-sectional view taken along line II-II’ for showing the structures of three pixels arranged in sequence in a light-emitting display device according to a first embodiment of the present disclosure.

[0033] Figure 7 Is along Figure 5 An enlarged cross-sectional view taken along line II-II’ for showing the structures of three pixels arranged in sequence in a light-emitting display device according to a second embodiment of the present disclosure.

[0034] Figure 8 Is along Figure 5 An enlarged cross-sectional view taken along line II-II’ for showing the structures of three pixels arranged in sequence in a light-emitting display device according to a third embodiment of the present disclosure. Detailed Embodiments

[0035] The advantages and features of the present disclosure and methods for realizing them will be clarified by the embodiments described below with reference to the accompanying drawings. However, the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Instead, these example embodiments are provided so that the present disclosure may be sufficiently thorough and complete to enable those skilled in the art to fully understand the scope of the present disclosure. In addition, the scope of protection of the present disclosure is defined by the claims and their equivalents.

[0036] The shapes, sizes, ratios, angles, numbers, etc. shown in the drawings for describing various example embodiments of the present disclosure are given only by way of example. Therefore, the present disclosure is not limited to the details shown.

[0037] For ease of description, the sizes including the dimensions and thicknesses of each component shown in the figures are shown, and the present disclosure is not limited to the dimensions and thicknesses of the components shown. However, it should be noted that the relative sizes including the relative dimensions, positions, and thicknesses of the components shown in the various figures submitted with this application are part of the present disclosure.

[0038] Unless otherwise specified, like reference numerals refer to like elements throughout the specification. In the following description, detailed descriptions of such known functions or configurations may be omitted where they may unnecessarily obscure the gist of the present disclosure.

[0039] Now, reference will be made in detail to exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts. In the specification, it should be noted that like reference numerals that have been used to denote like elements in other drawings are used for elements whenever possible. In the following description, detailed descriptions of functions and configurations known to those skilled in the art that are not relevant to the basic configuration of the present disclosure will be omitted. The terms described in the specification should be understood as follows.

[0040] In this specification, when using terms such as "comprising", "having", "including", etc., one or more other elements may be added unless a term such as "only" is used. Unless the context clearly indicates otherwise, an element described in the singular form is intended to include a plurality of elements, and vice versa.

[0041] When interpreting an element, even in the case where no explicit description of an error or tolerance range is provided, the element is interpreted as including such an error or tolerance range.

[0042] In the description of the positional relationships in various embodiments of the present disclosure, for example, when using terms such as "on", "above", "under", "over", "below", "beside", "near", etc. to describe the positional relationship between two parts, unless a more restrictive term such as "immediately", "directly", or "proximately" is used, one or more other parts may be located between the two parts. For example, in the case where an element or layer is disposed "on" another element or layer, a third layer or a third element may be interposed therebetween. Further, if a first element is described as being positioned "on" a second element, this does not necessarily mean that the first element is positioned above the second element in the drawing. The upper and lower parts of the object of interest may change depending on the orientation of the object. Thus, in the case where a first element is described as being positioned "on" a second element, the first element may be positioned "below" or "above" the second element in the drawing or in the actual configuration depending on the orientation of the object.

[0043] In the description of the temporal relationships, when a temporal order is described, for example, as "after", "subsequent", "next", or "before", discontinuous cases may be included unless a more restrictive term such as "just", "immediately", or "directly" is used.

[0044] It should be understood that although terms such as "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms because they are not used to define a specific order. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0045] When describing various elements of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish one element from another, rather than to define a specific nature, order, sequence, or number of the elements. When an element is described as "linked to", "coupled to", or "connected to" another element, unless otherwise specified, the element may be directly or indirectly connected to the other element. It is to be understood that one or more additional elements may be "interposed" between two elements described as being "linked", "connected", or "coupled" to each other.

[0046] It should be understood that the term "at least one" should be understood to include any and all combinations of one or more of the associated listed items. For example, the meaning of "at least one of the first element, the second element, and the third element" encompasses the combination of all three listed elements, the combination of any two of the three elements, and each individual element - the first element, the second element, and the third element.

[0047] As can be fully understood by those skilled in the art, the features of various embodiments of the present disclosure may be partially or fully coupled or combined with each other, and may operate with each other and be technically driven in various ways. The embodiments of the present disclosure may be executed independently of each other, or may be executed together in a mutually dependent relationship.

[0048] Hereinafter, examples of a display device according to the present disclosure will be described in detail with reference to the accompanying drawings. Where possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts.

[0049] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. Since, for ease of description, the scale of each of the elements shown in the drawings may be different from the actual scale, the present disclosure is not limited to the scale shown in the drawings.

[0050] Figure 1 is a plan view schematically showing the structure of a light-emitting display device according to an embodiment of the present disclosure. In Figure 1 it, the X-axis refers to the direction parallel to the scanning line, the Y-axis refers to the direction of the data line, and the Z-axis refers to the height direction of the display device.

[0051] Referring toFigure 1 An electroluminescent display includes a substrate 110, a cover glass CG, a gate (or scan) driver 200, a pad portion 300, a source driver IC (integrated circuit) 410, a flexible circuit film 430, a circuit board 450, and a timing controller 500.

[0052] The substrate 110 may include an electrically insulating material or a flexible material. The substrate 110 may be made of glass, metal, or plastic, but is not limited thereto. When the light-emitting display device is a flexible display, the substrate 110 may be made of a flexible material such as plastic. For example, the substrate 110 may include a transparent polyimide material.

[0053] The substrate 110 may include a display area AA and a non-display area NDA. The display area AA, which is an area for representing image information or video images, may be defined as most of the middle area of the substrate 110, but is not limited thereto. In the display area AA, a plurality of pixels P are arranged in a matrix. In addition, a plurality of scan lines (or gate lines) and a plurality of data lines may be arranged to cross each other. Each of the pixels P may be provided at the intersection of a scan line extending in the row direction to the X-axis and a data line extending in the row direction to the Y-axis.

[0054] Here, the pixel P may represent any one of red, green, and blue, or any one of red, green, blue, and white. Red pixels, green pixels, and blue pixels may be aggregated, or red pixels, green pixels, blue pixels, and white pixels may be aggregated to form a unit pixel. For example, each of the pixels representing each color may be referred to as a "sub-pixel", and it may be interpreted that these "sub-pixels" form a "pixel". As another example, it may be interpreted that the pixels representing each color are referred to as "pixels P", and three or four of these "pixels P" are aggregated to form a "unit pixel". Hereinafter, the latter case will be described.

[0055] The non-display area NDA, which is an area that does not represent video images, may be defined in the peripheral area of the substrate 110 surrounding all or some of the display area AA. In the non-display area NDA, the gate driver 200 and the pad portion 300 may be formed or provided.

[0056] The gate driver 200 may supply a scan (or gate) signal to the scan line SL in accordance with a gate control signal received from the timing controller 500 through the pad portion 300. The gate driver 200 may be formed as a GIP (gate driver in panel) type at a non-display area NDA on either outer side of the display area DA on the substrate 110. The GIP type means that the gate driver 200 is directly formed on the substrate 110. For example, the gate driver 200 may be configured with shift registers. In the GIP type, transistors of the shift registers for the gate driver 200 are directly formed on the upper surface of the substrate 110.

[0057] The pad portion 300 may be disposed in the non-display area NDA at one side edge of the display area AA of the substrate 110. The pad portion 300 may include data pads connected to each of the data lines DL, drive current pads connected to drive current lines, high potential pads receiving a high potential voltage, and low potential pads receiving a low potential voltage.

[0058] The source driver IC 410 may receive digital video data and a source control signal from the timing controller 500. The source driver IC 410 may convert the digital video data into an analog data voltage in accordance with the source control signal, and then supply it to the data lines. When the source driver IC 410 is manufactured as a chip type, it may be mounted on the flexible circuit film 430 as a COF (chip on film) or COP (chip on plastic) type.

[0059] The flexible circuit film 430 may include a plurality of first connection lines connecting the pad portion 300 to the source driver IC 410 and a plurality of second connection lines connecting the pad portion 300 to the circuit board 450. The flexible circuit film 430 may be attached to the pad portion 300 using an anisotropic conductive film such that the pad portion 300 may be connected to the first connection lines of the flexible circuit film 430.

[0060] The circuit board 450 may be attached to the flexible circuit film 430. The circuit board 450 may include a plurality of circuits implemented as driving chips. For example, the circuit board 450 may be a printed circuit board or a flexible printed circuit board.

[0061] The timing controller 500 may receive digital video data and a timing signal from an external system board through a cable of the circuit board 450. The timing controller 500 may generate a gate control signal for controlling the operation timing of the gate driver 200 and a source control signal for controlling the source driver IC 410 based on the timing signal. The timing controller 500 may supply the gate control signal to the gate driver 200 and supply the source control signal to the source driver IC 410. According to the product type, the timing controller 500 may be integrated with the source driver IC 410 into one driving chip and may be mounted on the substrate 110 to be connected to the pad unit 300.

[0062] The cover glass CG may be disposed on the substrate 110. The cover glass CG may have a size slightly larger than the display area AA and may be combined with the substrate 110 to completely cover the display area AA. When the gate driver 200 is directly formed on the substrate 110 using the GIP method, the cover glass CG may be arranged to also cover the gate driver 200. Since the pad portion 300 is the portion to which the flexible circuit film 430 is attached, the cover glass CG may not cover the pad portion 300.

[0063] A plurality of slits SLT may be provided on the top surface of the cover glass CG. Each of the slits SLT may be provided between two adjacent columns of pixels P. That is, each slit SLT may be respectively provided on the left and right sides of the pixel P. The slit SLT may be a groove formed in the cover glass CG and may have a thin groove shape recessed into the cover glass CG by a certain thickness or a through-rod shape that removes the entire thickness of the cover glass CG. Since the slit SLT may be formed only in the display area of the cover glass CG, the cover glass CG may not be separated by the slit SLT. In addition, a black resin material may be filled inside the slit SLT. For ease of description, the sizes and thicknesses of each component shown in the figure are shown, and the present disclosure is not limited to the sizes and thicknesses of the components shown, but it should be noted that the relative sizes, positions, and thicknesses of the components shown in various figures submitted with this application are part of the present disclosure. The detailed structure of the slit may be described below.

[0064] Hereinafter, reference will be made to Figures 2 to 4 to illustrate the detailed structure of the light-emitting display device according to an embodiment of the present disclosure. Figure 2 is a circuit diagram showing the structure of one pixel provided in the light-emitting display device according to an embodiment of the present disclosure. Figure 3 is an enlarged plan view showing the structures of three pixels sequentially provided in the light-emitting display device according to an embodiment of the present disclosure.

[0065] First, refer to Figures 2 to 3, each pixel P of the light-emitting display according to the present disclosure may be defined by a scan line SL, a data line DL, and a driving current line VDD. Each pixel P of the light-emitting display may include a switching thin-film transistor ST, a driving thin-film transistor DT, an organic light-emitting diode OLE, and a storage capacitor (or capacitor) Cst. The driving current line VDD may be supplied with a high-level voltage for driving the organic light-emitting diode OLE.

[0066] The switching thin-film transistor ST and the driving thin-film transistor DT may be formed on a substrate 110. For example, the switching thin-film transistor ST may be configured to be connected to the scan line SL and the data line DL. The switching thin-film transistor ST may include a gate electrode SG, a semiconductor layer SA, a source electrode SS, and a drain electrode SD. The gate electrode SG of the switching thin-film transistor ST may be a part of the scan line SL. The semiconductor layer SA may be disposed to cross the gate electrode SG. A portion where the semiconductor layer SA overlaps with the gate electrode SG may be defined as a channel region. The source electrode SS may branch from or be connected to the data line DL, and the drain electrode SD may be connected to the driving thin-film transistor DT. The source electrode SS may be on a side of the semiconductor layer SA away from the channel region, and the drain electrode SD may be on the other side of the semiconductor layer SA. By supplying a data signal to the driving thin-film transistor DT, the switching thin-film transistor ST may serve to select the pixel P to be driven.

[0067] The driving thin-film transistor DT may serve to drive the organic light-emitting diode OLE of the selected pixel P through the switching thin-film transistor ST. The driving thin-film transistor DT may include a gate electrode DG, a semiconductor layer DA, a source electrode DS, and a drain electrode DD. The gate electrode DG of the driving thin-film transistor DT may be connected to the drain electrode SD of the switching thin-film transistor ST. For example, the gate electrode DG of the driving thin-film transistor DT may extend from the drain electrode SD of the switching thin-film transistor ST. In the driving thin-film transistor DT, the drain electrode DD may branch from or be connected to the driving current line VDD. In addition, the source electrode DS may be connected to an anode electrode (or pixel electrode) ANO of the organic light-emitting diode (or light-emitting element) OLE. The semiconductor layer DA may be disposed to straddle the gate electrode DG. In the semiconductor layer DA, a portion overlapping with the gate electrode DG may be defined as a channel region. The source electrode DS may be connected to a side of the semiconductor layer DA surrounding the channel region, and the drain electrode DD is connected to the other side of the semiconductor layer DA. The storage capacitor (or capacitor) Cst may be disposed between the gate electrode DG of the driving thin-film transistor DT and the anode electrode ANO of the organic light-emitting diode OLE.

[0068] The light-emitting diode OLE can generate light according to the current controlled by the driving thin-film transistor DT. The driving thin-film transistor DT can control the amount of current flowing from the driving current line VDD to the light-emitting diode OLE based on the voltage difference between the gate electrode DG and the source electrode DS.

[0069] The light-emitting diode OLE can include an anode electrode ANO, an emission layer, and a cathode electrode. The light-emitting diode OLE can emit light according to the current controlled by the driving thin-film transistor DT. In other words, the light-emitting diode OLE can provide an image by emitting light according to the current controlled by the driving thin-film transistor DT. The anode electrode ANO of the light-emitting diode OLE can be connected to the source electrode DS of the driving thin-film transistor DT. The cathode electrode (or common electrode) can be the low-power line VSS to which a low-potential voltage is supplied. Therefore, the light-emitting diode OLE can be driven by the current flowing from the driving current line VDD to the low-power line VSS controlled by the driving thin-film transistor DT.

[0070] A plurality of pixels P can be arranged on the substrate 110. For example, the red pixel RP, the green pixel GP, and the blue pixel BP can be sequentially arranged and set along the horizontal direction. The combination of the red pixel RP, the green pixel GP, and the blue pixel BP can constitute one pixel. In another case, the red pixel, the green pixel, the white pixel, and the blue pixel can be sequentially arranged along the horizontal direction. The red pixel, the green pixel, the white pixel, and the blue pixel can form a unit pixel. Figure 3 It shows that three pixels P including the red pixel RP, the green pixel GP, and the blue pixel BP are sequentially arranged along the horizontal direction.

[0071] A plurality of slits SLT can be formed between the pixels P in a one-to-one correspondence. The slits SLT can be formed on the upper surface of the cover glass CG. The slits SLT can have a line segment shape extending from the top to the bottom of the display area AA except for the non-display area NDA. That is, the slits SLT can be provided between two adjacent pixels P along the horizontal direction (or the first direction). The slits SLT can not be provided between two adjacent pixels P along the vertical direction (or the second direction). In another example, the slits SLT can be provided between two adjacent pixels P along the vertical direction (or the first direction), and the slits SLT can not be placed between two adjacent pixels P along the horizontal direction (or the second direction). When the slits SLT can be placed along both the horizontal direction (or the first direction) and the vertical direction (or the second direction), the cover glass CG may be damaged or cut off. Therefore, the slits SLT can be formed only along one selected direction.

[0072] Referring to Figure 4 , the cross-sectional structure of the light-emitting display device according to an embodiment of the present disclosure will be described. Figure 4 is alongFigure 3 A cross-sectional view taken along the cutting line I-I' in Figure 3 shows the structure of one pixel in a light-emitting display device according to an embodiment of the present disclosure. The light-emitting display device may include a substrate 110, a driving element layer 220, a light-emitting element layer 330, a packaging layer 440, a color filter layer CF, and a cover glass CG. The driving element layer 220 may include a plurality of thin layers formed on the substrate 110. The driving element layer 220 may include a switching thin-film transistor ST and a driving thin-film transistor DT.

[0073] A data line DL, a driving current line VDD, and a light-shielding layer LS may be formed on the substrate 110. The light-shielding layer LS may be provided in an island shape, spaced apart from the data line DL and the driving current line VDD by a predetermined distance and overlapping with the semiconductor layers SA and DA. In some cases, the light-shielding layer LS may be omitted.

[0074] A buffer layer BUF is deposited on the entire surface of the substrate 110 to cover the driving current line VDD, the data line DL, and the light-shielding layer LS. The semiconductor layer SA of the switching thin-film transistor ST and the semiconductor layer DA of the driving thin-film transistor DT are formed on the buffer layer BUF. The switching thin-film transistor ST and the driving thin-film transistor DT are formed on the buffer layer BUF. Preferably, the channel regions in the semiconductor layers SA and DA overlap with the light-shielding layer LS.

[0075] A gate insulating layer GI is deposited on the substrate 110 to cover the semiconductor layers SA and DA. A gate electrode SG overlapping with the semiconductor layer SA of the switching thin-film transistor ST and a gate electrode DG overlapping with the semiconductor layer DA of the driving thin-film transistor DT are formed on the gate insulating layer GI. In addition, on both sides of the gate electrode SG of the switching thin-film transistor ST, a source electrode SS that contacts one side of the semiconductor layer SA while being separated from the gate electrode SG and a drain electrode SD that contacts the other side of the semiconductor layer SA are formed. Further, on both sides of the gate electrode DG of the driving thin-film transistor DT, a source electrode DS that contacts one side of the semiconductor layer DA while being separated from the gate electrode DG and a drain electrode DD that contacts the other side of the semiconductor layer DA are formed.

[0076] The gate electrodes SG and DG and the source-drain electrodes SS-SD and DS-DD are formed on the same layer but are spatially and electrically separated from each other. The source electrode SS of the switching thin-film transistor ST may be connected to the data line DL via a contact hole penetrating the gate insulating layer GI. In addition, the drain electrode DD of the driving thin-film transistor DT may be connected to the driving current line VDD via another contact hole penetrating the gate insulating layer.

[0077] A passivation layer PAS is deposited on the substrate 110 to cover the thin-film transistors ST and DT. The passivation layer PAS may be made of an inorganic material such as silicon oxide or silicon nitride.

[0078] The light-emitting element layer 330 is formed on the driving element layer 220. The light-emitting element layer 330 may include a planarization layer PL and an organic light-emitting diode OLE. The planarization layer PL may be a layer for planarizing the uneven surface of the substrate 110 on which the thin-film transistors ST and DT are formed. In order to equalize or compensate for the height difference caused by the uneven surface conditions, the planarization layer PL may be formed of an organic material. A pixel contact hole PH may be formed at the passivation layer PAS and the planarization layer PL to expose a part of the source electrode DS of the driving thin-film transistor DT.

[0079] The anode electrode (or pixel electrode) ANO may be formed on the top surface of the planarization layer PL. The anode electrode ANO may be connected to the source electrode DS of the driving thin-film transistor DT via the pixel contact hole PH. Depending on the emission type of the organic light-emitting diode OLE, the anode electrode ANO may have different structures and constituent elements. For example, in the case of the bottom emission type in which light is provided in the direction along the substrate 110, the substrate 110 may be formed of a transparent conductive material. For another example, in the case of the top emission type in which light is provided in the upward direction facing the substrate 110, the substrate 110 may be formed of a metal material having excellent light reflectivity. In addition to this, for the case of the top emission type in which light is emitted in the upward direction opposite to the substrate 110, a reflective layer formed of a metal material having excellent light reflectivity may also be included below or above the transparent layer formed of a transparent conductive material. In the present disclosure, the case where the anode electrode ANO may be formed of a reflective metal will be described.

[0080] The bank BA is formed on the top surface of the substrate 110 having the anode electrode ANO. The bank BA is preferably an insulating layer made of an inorganic material or an organic material. Hereinafter, the case made of an inorganic material will be described. The bank BA covers the peripheral region of the anode electrode ANO and exposes most of the intermediate region. The intermediate region exposed from the bank BA is defined as the emission region EA, and the region covered by the bank BA is defined as the non-emission region NEA.

[0081] The emission layer EL is provided on the anode electrode ANO and the bank BA. The emission layer EL may be deposited over the entire display area AA of the substrate 110 to cover the anode electrode ANO and the bank BA. For example, the emission layer EL may include at least two emission parts for generating white light. Specifically, the emission layer EL may include a first emission part and a second emission part stacked vertically to generate white light by mixing the first light from the first emission part and the second light from the second emission part.

[0082] For another example, the emission layer EL may include any one of a blue emission part, a green emission part, and a red emission part to generate light corresponding to the color set in each pixel. In addition, the organic light-emitting diode OLE may include a functional layer for improving the luminous efficiency and / or lifespan of the emission layer EL.

[0083] The cathode electrode (or common electrode) CAT is deposited on the entire surface of the substrate 110 on which the emission layer is formed. The cathode electrode CAT is deposited so that its surface contacts the emission layer EL. The cathode electrode CAT is formed over the entire substrate 110 to commonly connect to the emission layer EL deposited in all pixels. In the case of a top emission type, the cathode electrode CAT may include a transparent conductive material. For example, the cathode electrode CAT may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the cathode electrode CAT may include a thin metal such as aluminum (Al), magnesium (Mg), calcium (Ca), silver (Ag), or an alloy or combination thereof (e.g., aluminum magnesium alloy (AlMg)). By forming the cathode electrode CAT to have a thin thickness in the range of to , it can be formed to have light-transmitting characteristics. For the case of a bottom emission type, the cathode electrode CAT may be made of a metal material with a thickness of or greater having excellent light reflectivity. The metal material having excellent light reflectivity may include any one of aluminum (Al), magnesium (Mg), calcium (Ca), silver (Ag), or an alloy or combination thereof (e.g., aluminum magnesium alloy (AlMg)).

[0084] The encapsulation layer 440 is stacked on the light-emitting element 220. The encapsulation layer 440 may have a single-layer structure made of an inorganic material, or a multi-layer structure in which several inorganic layers are sequentially stacked. As another example, the encapsulation layer 440 may have a structure in which an inorganic layer, an organic layer, and an inorganic layer are continuously stacked. Here, for ease of description, the encapsulation layer 440 made of a single inorganic layer will be described.

[0085] The color filter layer 550 is stacked on the encapsulation layer 440. In the color filter layer 550, a plurality of color filters CF may be arranged in a matrix corresponding to the arrangement of the pixels P. The color filter CF may be arranged to have a structure in which one of a red color filter, a green color filter, and a blue color filter is assigned to each pixel P. As another example, the color filter CF may be arranged to have a structure in which one of a red color filter, a white color filter, a green color filter, and a blue color filter is assigned to each pixel P. Hereinafter, for ease of description, the case where the color filter CF includes a red color filter R, a green color filter G, and a blue color filter B representing the three primary colors of light will be described.

[0086] The cover glass CG can be disposed on the color filter layer 550. The cover glass CG can be surface-attached to the color filter layer 550 by means of an optical adhesive layer OCA therebetween. The cover glass CG can be formed of a transparent material having a refractive index of 1.5 or higher. For example, the cover glass CG can be made of transparent glass or transparent plastic.

[0087] In an ultra-high resolution light-emitting display device with 4K PPI or higher, particularly in the case of a personal immersive display having a diagonal length of 5 inches or less and an ultra-high resolution, due to limitations in the manufacturing process, it may be very difficult to form a black matrix to prevent color mixing between two adjacent color filters. Therefore, in order to prevent color mixing between adjacent pixels, the thickness of the encapsulation layer 440 can be formed to be very thin, and then the color filter can be formed on the encapsulation layer 440. By making the distance between the emission layer EL and the color filter layer 660 as close as possible, even without a black matrix, color mixing at the pixel boundary can be minimized. However, in order to ensure that the encapsulation layer 440 protects the underlying components, there may be limitations to reducing the thickness of the encapsulation layer 440. Therefore, there are limitations to minimizing color mixing at the pixel boundary.

[0088] To overcome these limitations, in the cover glass CG of the light-emitting display device according to the present disclosure, a slit SLT can be formed in the corresponding area between two adjacent color filters. The slit SLT can be a groove shape formed by etching the cover glass CG, which has a certain width W on the surface of the cover glass CG and a depth Ts smaller than the thickness Tg of the cover glass CG. Since the slit SLT is used to prevent the light emitted from the emission layer EL from transmitting to adjacent pixels, it may be desirable to have a width corresponding to the size of the bank BA.

[0089] The cover glass CG can be the outermost placed component in the light-emitting display device according to the present disclosure. Therefore, the cover glass CG can be in contact with air. Therefore, the inside of the slit SLT can be filled with air (or in some cases, air can be present inside the slit SLT). That is, the side surface of the slit SLT can become the vertical interface where the cover glass CG meets the air. Therefore, due to the difference in refractive index between the cover glass CG and the air, most of the light emitted from the emission layer EL and guided to the slit SLT can be reflected on the vertical plane of the slit SLT. In the absence of the slit SLT, the light passing through the red color filter R can travel from the cover glass CG to the upper region of the blue color filter B or the upper region of the green color filter G, resulting in color mixing. In Figure 4 In the shown light-emitting display device according to the present disclosure, due to the slit SLT, most of the light passing through the red color filter R can be transmitted and / or reflected to the upper part of the red color filter R on the cover glass CG. Therefore, color mixing can be prevented, and color reproducibility or color purity can be improved.

[0090] The light-emitting display device according to the present disclosure may have a feature that slits are arranged on a cover glass in a structure that makes it difficult to form a black matrix between color filters. Therefore, this structure can prevent problems of color purity degradation caused by diffused reflected light due to the banks BA or pixel defining layers formed at the boundaries of the color filters, and problems of color reproducibility degradation caused by color mixing between adjacent pixels, thereby providing excellent image quality.

[0091] Hereinafter, a light-emitting display device having a cover plate CG on which various-shaped slits SLT are formed will be described using various embodiments of the present disclosure.

[0092] <First Exemplary Aspect>

[0093] Referring to Figure 5 and Figure 6 , a first exemplary aspect of the present disclosure will be described. Figure 5 is a plan view showing the structure of three pixels sequentially arranged in a light-emitting display device according to a first embodiment of the present disclosure. Figure 6 is an enlarged cross-sectional view taken along line II-II’ of Figure 5 for showing the structure of three pixels sequentially arranged in a light-emitting display device according to a first embodiment of the present disclosure. The description of the structure from the substrate 110 to the color filter 550 may be omitted or simply described because their cross-sectional structures are the same as those previously described using Figure 4 . Regarding the reference numerals shown in the drawings even without description, reference may also be made to the description in Figure 4 .

[0094] The light-emitting display device according to the first exemplary aspect of the present disclosure may include a display panel DP and a cover plate CG covering the display panel DP. The display panel DP may include a substrate 110, a driving element layer 220, a light-emitting element layer 330, a packaging layer 440, and a color filter layer 550. The driving element layer 220 may include a data line DL, a scan line SL, a driving current line VDD, a switching thin-film transistor ST, and a driving thin-film transistor DT. The light-emitting element layer 330 may include an anode electrode ANO, an emission layer EL, and a cathode electrode CAT. The anode electrode ANO of the light-emitting element layer 330 may be connected to the driving thin-film transistor DT formed in the driving element layer 220. The packaging layer 440 made of a single-layer inorganic layer may be deposited on the light-emitting element layer 330. The color filter layer 550 may be provided on the packaging layer 440.

[0095] The color filter layer 550 may include a red color filter R, a green color filter G, and a blue color filter B that are sequentially arranged, and one of the red color filter R, the green color filter G, and the blue color filter B is assigned to each pixel. In the case of a light-emitting display device (e.g., a personal immersive display device) having an ultra-high resolution of 4K PPI or higher and a diagonal length of 5 inches or less, it may be very difficult to provide a black matrix between the color filters. Therefore, the red color filter R, the green color filter G, and the blue color filter B may be arranged continuously while being in direct contact with each other.

[0096] The cover glass CG may be provided on the color filter layer 550. The cover glass CG may be attached to the color filter layer 660 on the surface using an optical adhesive layer OCA therebetween. The cover glass CG may be made of a transparent material having a refractive index of 1.5 or greater.

[0097] When the black matrix is not provided, color mixing between pixels may be minimized by thinning the thickness of the encapsulation layer 440. However, in order to ensure the function of the encapsulation layer 440, a certain thickness should be maintained, and thus there are limitations in reducing color mixing. As another problem, due to the light emitted from the emission layer EL, light emission may occur in the bank BA provided between two adjacent pixels P. The light emitted from the bank BA may cause deterioration of the color purity of the light emitted in the normal pixel region.

[0098] To solve these problems, in a first exemplary aspect of the present disclosure, the thickness of the encapsulation layer 440 may not be formed to be thin. Instead, the light-emitting display device may have a structure in which a plurality of slits SLT may be arranged at regular intervals on the cover glass CG. For example, the slits SLT may be provided in Figure 2 the display area AA therein, and may be provided one by one between the pixels P along the Y-axis. The slits SLT may have a groove shape formed by etching the cover glass CG, which has a certain width W on the surface of the cover glass CG and a depth Ts smaller than the thickness Tg of the cover glass CG. For example, the depth Ts of the slits SLT may be 80% to 95% of the thickness Tg of the cover glass CG.

[0099] The slits SLT may be provided directly above the bank BA and overlap with the bank BA. Since the slits SLT may be intended to prevent the light reflected and / or refracted by the bank BA from going out, it is desirable to have a width corresponding to the size of the bank BA. The width of the slits SLT may be equal to or slightly larger than the width of the bank BA. In addition, the bank BA may overlap with the slits SLT such that the bank BA may be completely covered by the slits SLT. By providing the slits SLT on the bank BA, the slits SLT may prevent the light emitted from the emission layer EL and scattered by the bank BA from being emitted to the outside. For example, the width W of the slits SLT may be 5% to 10% larger than the width of the bank BA.

[0100] According to the cross-sectional view, the slit SLT may include a first side surface 10, a second side surface 20, a bottom surface 30, and a top surface 40. The first side surface 10 may be a side wall extending from the upper surface of the cover plate CG to a first end 11 that is recessed by a depth Ts in a direction toward the lower surface. The second side surface 20 may be a side wall opposite to the first side surface 10 extending from the upper surface of the cover plate CG to a second end 21 that is spaced apart from the first side surface 10 by a width W and recessed by a depth Ts. The bottom surface 30 may be a surface extending from the first end 11 to the second end 21. The top surface 40 may face the bottom surface 30 and may be a surface provided on the upper surface of the cover plate CG. In a first exemplary aspect, the cross-sectional shape of the slit SLT may have a right-angled rectangular shape in which the first side surface 10 and the second side surface 20 are parallel to each other and the bottom surface 30 and the top surface 40 are parallel to each other.

[0101] In a first exemplary aspect, the interior of the slit SLT may be filled with a light-absorbing material (alternatively, in some cases, the light-absorbing material may be present inside the slit SLT). For example, the light-absorbing material may be a black resin material. Thus, the slit SLT filled with the light-absorbing material may be a black matrix BM provided between two adjacent pixels P - particularly between two adjacent color filters. The black matrix BM may include a first side surface 10, a second side surface 20, a bottom surface 30, and a top surface 40.

[0102] Since the black matrix BM is provided on the bank BA, the black matrix BM can completely block the light scattered from the bank BA. That is, it is desirable to prevent the problem of color purity degradation caused by the light scattered from the bank BA. In addition, the slit SLT filled with the light-absorbing material can block the light emitted from the emission layer EL of one pixel and entering an adjacent pixel, thereby preventing color mixing at the boundary of the pixel P.

[0103] The black resin for the light-absorbing material may have a lower refractive index than the cover plate CG. For example, when the cover plate CG is made of glass, the cover plate CG may have a refractive index of 1.5, so the light-absorbing material may be made of a black resin having a refractive index of 1.2 to 1.3. For another example, when the cover plate CG is made of a plastic material having a refractive index of 1.7 to 1.9, the black matrix BM may be made of a black resin having a refractive index of 1.2 to 1.4.

[0104] The black matrix BM can be disposed between two adjacent color filters. Accordingly, due to the difference in refractive index between the cover glass CG and the black matrix BM filling the slit SLT, the light emitted from the emission layer EL, passing through the color filter, and then reaching the slit SLT can be reflected and refracted. Among these lights, those that satisfy the total reflection condition can be reflected and returned to the pixel region from which the light was first emitted. Meanwhile, the refracted light that may not satisfy the total reflection condition can be absorbed by the black matrix BM and may not travel to adjacent pixels. Accordingly, color mixing between adjacent pixels can be almost completely prevented, and color reproducibility can be improved.

[0105] The light-emitting display device according to the first exemplary aspect may have a structure in which the black matrix BM can be further formed by filling the interior of the slit SLT with the black resin material in the case described in Figure 4 For the case of Figure 4 , since only the slit SLT exists, the light that may not be blocked by the slit SLT or may not satisfy the total reflection condition may leak, resulting in deterioration of image quality. However, in the first exemplary aspect, since the slit SLT can be filled with the black resin material, most of the light that may not be blocked by the slit SLT or may not satisfy the total reflection condition can be absorbed, thereby improving color purity and color reproducibility.

[0106] <Second Exemplary Aspect>

[0107] Hereinafter, a second exemplary aspect of the present disclosure will be described with reference to Figure 7 FIG. Figure 7 is an enlarged cross-sectional view taken along line II-II' of FIG. showing the structure of three pixels sequentially arranged in a light-emitting display device according to a second embodiment of the present disclosure. The description of the structure from the substrate 110 to the color filter 550 may be omitted or simply described because their cross-sectional structures are the same as those described previously using Figure 5 or Figure 4 or Figure 6 The description of the same. Even for the reference numerals shown in the drawings without description, reference may be made to the description in Figure 4 or Figure 6 FIG.

[0108] The light-emitting display device according to the second exemplary aspect of the present disclosure may include a display panel DP and a cover glass CG covering the display panel DP. The display panel DP may include a substrate 110, a driving element layer 220, a light-emitting element layer 330, a encapsulation layer 440, and a color filter layer 550. The driving element layer 220 may include a data line DL, a scan line SL, a driving current line VDD, a switching thin-film transistor ST, and a driving thin-film transistor DT. The light-emitting element layer 330 may include an anode electrode ANO, an emission layer EL, and a cathode electrode CAT. The anode electrode ANO of the light-emitting element layer 330 may be connected to the driving thin-film transistor DT formed in the driving element layer 220. The encapsulation layer 440 made of a single inorganic layer may be deposited on the light-emitting element layer 330. The color filter layer 550 may be disposed on the encapsulation layer 440.

[0109] The color filter layer 550 may include a red color filter R, a green color filter G, and a blue color filter B arranged in sequence, and one of the red color filter R, the green color filter G, and the blue color filter B may be assigned to each pixel. In the case of a light-emitting display device (such as a personal immersive display device) having an ultra-high resolution of 4K PPI or higher and a diagonal length of 5 inches or less, it may be very difficult to provide a black matrix between the color filters. Therefore, the red color filter R, the green color filter G, and the blue color filter B may be arranged continuously while being in direct contact with each other.

[0110] The cover glass CG may be disposed on the color filter layer 550. The cover glass CG may be attached to the color filter layer 660 on the surface using an optical adhesive layer OCA therebetween. The cover glass CG may be made of a transparent material having a refractive index of 1.5 or greater.

[0111] Similar to the first exemplary aspect, the second exemplary aspect may have a structure in which a plurality of slits SLT may be arranged at regular intervals on the cover glass CG. The slit SLT may have a groove shape formed by etching the cover glass CG, which has a certain width W on the surface of the cover glass CG and a depth Ts smaller than the thickness Tg of the cover glass CG. For example, the depth Ts of the slit SLT may be 80% to 95% of the thickness Tg of the cover glass CG. The slit SLT may be disposed directly above the bank BA and overlap with the bank BA.

[0112] According to the cross-sectional view, the slit SLT may include a first side surface 10, a second side surface 20, a bottom surface 30, and a top surface 40. The first side surface 10 may be a side wall extending from the upper surface of the cover glass CG to the first end 11, and the first end 11 is recessed by a depth Ts in the direction toward the lower surface. The second side surface 20 may be a side wall opposite to the first side surface 10 extending from the upper surface of the cover glass CG to the second end 21, and the second end 21 is spaced apart from the first side surface 10 by a width W and recessed by a depth Ts. The bottom surface 30 may be a surface extending from the first end 11 to the second end 21. The top surface 40 may face the bottom surface 30 and may be a surface provided on the upper surface of the cover glass CG.

[0113] The inside of the slit SLT may be filled with a light-absorbing material. For example, the light-absorbing material may be a black resin material. Thus, the slit SLT filled with the light-absorbing material may be a black matrix BM provided between two adjacent pixels P - particularly between two adjacent color filters. The black matrix BM may include a first side surface 10, a second side surface 20, a bottom surface 30, and a top surface 40.

[0114] Since the black matrix BM is provided on the bank BA, the black matrix BM can completely block the light scattered from the bank BA. That is, it is desired to prevent the problem of color purity degradation caused by the light scattered from the bank BA. In addition, the slit SLT filled with the light-absorbing material can block the light emitted from the emission layer EL of one pixel and entering the adjacent pixel, thereby preventing color mixing at the boundary of the pixel P.

[0115] The structure of the light-emitting display device according to the second exemplary aspect may be almost the same as the structure of the light-emitting display device according to the first exemplary aspect. There may be a difference in the cross-sectional shape of the slit SLT. The following description may focus on the different features of the second exemplary aspect. The descriptions that are the same as those in the first exemplary aspect may be omitted or simply explained.

[0116] In the first exemplary aspect, the cross-sectional shape of the slit SLT may have a rectangular shape. Meanwhile, in the second exemplary aspect, the cross-sectional shape of the slit SLT may have a trapezoidal shape. For example, the second side surface 20 may be a vertical surface with a groove formed deeply in the direction perpendicular to the surface of the cover glass CG. The first side surface 10 may be a surface with a groove formed deeply and inclined at a predetermined angle with respect to the surface of the cover glass CG.

[0117] Specifically, the first side surface 10 of the slit SLT for the second exemplary aspect may be an inclined surface inclined at a certain angle (different from the vertical angle) with respect to the surface of the cover glass CG. On the other hand, the second side surface 20 may be a vertical plane. In Figure 7In [the device], the first side surface 10 as an inclined surface may be disposed on the left side, and the second side surface 20 as a vertical surface may be placed on the right side. However, it is not limited thereto. The first side surface 10 as an inclined surface may be disposed on the right side, and the second side surface 20 as a vertical surface may be placed on the left side. For another example, both of the first side surface 10 and the second side surface 20 may be inclined surfaces.

[0118] According to the inclination direction of the inclined surface, the top surface 40 may have an area larger or narrower than that of the bottom surface 30. When the top surface 40 has an area larger than that of the bottom surface 30, due to the shape of the slit SLT - particularly proportional to the inclination degree of the first side surface 10 as the inclined surface, the light emitted from the emission layer EL can be deflected in the direction where the inclined surface is provided (i.e., in the left direction in Figure 7 [the device]). For another example, when both the first side surface 10 and the second side surface 20 are inclined (or inclined surfaces), the light emitted from the emission layer EL can be concentrated in the central region of the pixel (when the size of the top surface 40 can be smaller than that of the bottom surface 30), or the light can be widely diffused in the edge direction (when the size of the top surface 40 can be larger than that of the bottom surface 30).

[0119] In the light-emitting display device according to the second exemplary aspect, by filling the slit SLT with a black resin material, the light that may not be blocked by the slit SLT or may not satisfy the total reflection condition can be absorbed. Therefore, the color purity and color reproduction rate can be further improved. In addition, different from the situation described in Figure 5 [the device] showing the first exemplary aspect, the different feature lies in that an inclined surface inclined in one direction is provided. By this feature, there is an effect of deflecting the direction of the light emitted from the emission layer EL in one direction. For example, by applying the light-emitting display device according to the second exemplary aspect to a personal immersive display device, there is an effect of biasing the image information provided from the pixel to be focused on the user's left eye and right eye respectively. For another example, when the second exemplary aspect is applied to a monitor installed on an automotive dashboard, the effect of providing a specific image only to a specific person can be achieved by biasing the image information toward the driver's seat or toward the passenger's seat.

[0120] <Third Embodiment>

[0121] Hereinafter, the third exemplary aspect of the present disclosure will be described with reference to Figure 8 [the drawings]. Figure 8 is along Figure 5An enlarged cross-sectional view taken along line II-II' for showing the structure of three pixels sequentially arranged in a light-emitting display device according to a third embodiment of the present disclosure. The description of the structure from the substrate 110 to the color filter 550 may be omitted or simply described because their cross-sectional structures are the same as those previously described using Figure 4 The same description as that described. Regarding the reference numerals shown in the drawings that are not described even without description, reference may be made to Figure 4 The description in

[0122] A light-emitting display device according to a first exemplary aspect of the present disclosure may include a display panel DP and a cover glass CG covering the display panel DP. The display panel DP may include a substrate 110, a driving element layer 220, a light-emitting element layer 330, a packaging layer 440, and a color filter layer 550. The driving element layer 220 may include a data line DL, a scan line SL, a driving current line VDD, a switching thin-film transistor ST, and a driving thin-film transistor DT. The light-emitting element layer 330 may include an anode electrode ANO, an emission layer EL, and a cathode electrode CAT. The anode electrode ANO of the light-emitting element layer 330 may be connected to the driving thin-film transistor DT formed in the driving element layer 220. The packaging layer 440 made of a single-layer inorganic layer may be deposited on the light-emitting element layer 330. The color filter layer 550 may be disposed on the packaging layer 440.

[0123] The color filter layer 550 may include a red color filter R, a green color filter G, and a blue color filter B arranged in sequence, and one of the red color filter R, the green color filter G, and the blue color filter B may be assigned to each pixel. In the case of a light-emitting display device having an ultra-high resolution of 4K PPI or higher and a diagonal length of 5 inches or less (for example, a personal immersive display device), it may be very difficult to provide a black matrix between the color filters. Therefore, the red color filter R, the green color filter G, and the blue color filter B may be arranged continuously while being in direct contact with each other.

[0124] The cover glass CG may be disposed on the color filter layer 550. The cover glass CG may be attached to the color filter layer 660 on the surface using an optical adhesive layer OCA therebetween. The cover glass CG may be made of a transparent material having a refractive index of 1.5 or greater.

[0125] Similar to the first exemplary aspect, the third exemplary aspect may have a structure in which a plurality of slits SLT may be arranged at regular intervals on the cover glass CG. The interior of the slit SLT may be filled with a black resin material. Thus, the slit SLT filled with a light-absorbing material may be a black matrix BM provided between two adjacent pixels P - particularly between two adjacent color filters. Since the black matrix BM is provided on the bank BA, the black matrix BM can completely block the light scattered from the bank BA. That is, it is desirable to prevent the problem of color purity degradation caused by the light scattered from the bank BA. In addition, the slit SLT filled with a light-absorbing material can block the light emitted from the emission layer EL of one pixel and entering an adjacent pixel, thereby preventing color mixing at the boundary of the pixel P.

[0126] The structure of the light-emitting display device according to the third exemplary aspect may be almost the same as the structure of the light-emitting display device according to the first exemplary aspect. There may be a difference in the cross-sectional shape of the slit SLT.

[0127] In the first exemplary aspect, the slit SLT may have a groove shape formed by etching the cover glass CG, which has a certain width W on the surface of the cover glass CG and a depth Ts smaller than the thickness Tg of the cover glass CG. Meanwhile, in the third exemplary aspect, the slit SLT may have a through-bar shape formed by etching the cover glass CG, which has a certain width W on the surface of the cover glass CG and a depth Ts equal to the thickness Tg of the cover glass CG. That is, in the third exemplary aspect, the depth Ts of the slit SLT may be 100% of the thickness Tg of the cover glass CG.

[0128] The slit SLT may be provided directly above the bank BA and overlap with the bank BA. The width of the slit SLT may be equal to or slightly larger than the width of the bank BA. The bank BA may overlap with the slit SLT such that the bank BA can be completely covered by the slit SLT. For example, the width W of the slit SLT may be 5% to 10% larger than the width of the bank BA.

[0129] According to the cross-sectional view, the slit SLT may include a first side surface 10, a second side surface 20, a bottom surface 30, and a top surface 40. In Figure 7 this case, the cross-sectional shape of the slit SLT may have the same rectangular shape as the first exemplary aspect. However, without being limited thereto, the cross-sectional shape of the slit SLT may have a trapezoidal shape as in the second exemplary aspect.

[0130] The interior of the slit SLT may be filled with a light-absorbing material. The slit SLT filled with a light-absorbing material may be a black matrix BM provided between two adjacent pixels P - particularly between two adjacent color filters. The black resin for the light-absorbing material may have a refractive index smaller than the refractive index of the cover glass CG.

[0131] In a third exemplary aspect, since the slit SLT is filled with a black resin material, color purity and color reproducibility properties can be further improved by absorbing light that may not be blocked by the slit SLT or may not satisfy the total reflection condition.

[0132] In a first exemplary aspect, a portion of the transparent cover plate CG remains at the bottom of the slit SLT filled with the black matrix BM, so that light can leak through this portion. However, in the third exemplary aspect, since the black matrix BM can have the same thickness as the cover plate CG, color mixing between adjacent pixels can be blocked more completely.

[0133] The features, structures, effects, etc. described in the above exemplary embodiments of the present disclosure are included in at least one exemplary embodiment of the present disclosure and are not necessarily limited to one exemplary embodiment. In addition, those skilled in the art guided by the present disclosure can implement the features, structures, effects, etc. illustrated in at least one exemplary embodiment in combinations or modifications relative to other exemplary embodiments. Therefore, such combinations and variations should be construed as being included within the scope of the present disclosure.

[0134] It will be apparent to those skilled in the art that various substitutions, modifications, and variations can be made within the scope of the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, the embodiments of the present disclosure are intended to cover various substitutions, modifications, and variations of the present disclosure, provided that the substitutions, modifications, and variations are within the scope of the appended claims and their equivalents. These and other changes can be made to the embodiments in accordance with the above detailed description. Generally, in the appended claims, the terms used should not be construed as limiting the claims to the specific exemplary embodiments disclosed in the specification and claims, but should be construed as including all possible embodiments and the full scope of equivalents to such claims. Therefore, the claims are not limited by the present disclosure.

Claims

1. A light-emitting display device, comprising: A display panel including a plurality of pixels arranged in a matrix; a cover plate, which covers the display panel; A slit is provided on the cover plate between pixels adjacent to each other in a first direction among the plurality of pixels; as well as A light absorbing material is filled in the slit.

2. The light-emitting display device according to claim 1, wherein: The slit has a depth equal to or less than a thickness of the cover plate.

3. The light-emitting display device according to claim 2, wherein: The depth of the slit is 80% to 100% of the thickness of the cover plate.

4. The light-emitting display device according to claim 2, wherein: The slit comprises: a first side surface extending from the upper surface of the cover plate to a first end, the first end being recessed to a predetermined depth along the depth direction; a second side surface separated from the first side surface by a predetermined width, extending from the upper surface of the cover plate to a second end, and facing the first side surface, the second end being recessed to the predetermined depth along the direction of the depth; a bottom surface extending from the first end to the second end; and A top surface faces the bottom surface and is disposed on an upper surface of the cover plate.

5. The light-emitting display device according to claim 4, wherein: The first side surface and the second side surface are parallel to each other as vertical surfaces.

6. The light-emitting display device according to claim 4, wherein: Any one of the first side surface and the second side surface is an inclined plane, and the other is a vertical plane.

7. The light-emitting display device according to claim 4, wherein: The first side surface and the second side surface are inclined planes.

8. The light-emitting display device according to claim 4, wherein: The size of the top surface is different from the size of the bottom surface.

9. The light-emitting display device according to claim 1, wherein: The display panel comprises: an anode electrode disposed on each pixel; a bank covering a periphery of the anode electrode; an emission layer disposed on the anode electrode; and a cathode electrode disposed on the emission layer, The slit has a width corresponding to the bank.

10. The light emitting display device according to claim 9, wherein: The slit has a width 5% to 10% wider than the bank, and Wherein, the bank overlaps with a middle portion of the slit.

11. The light-emitting display device according to claim 1, wherein: The display panel comprises: substrate; A driving element layer, which is arranged on the substrate; A light emitting element layer, which is disposed on the driving element layer; an encapsulation layer, which is disposed on the light-emitting element layer; and a color filter layer disposed on the encapsulation layer, Wherein, the cover plate is attached to the color filter layer using a transparent optical adhesive.

12. The light-emitting display device according to claim 11, wherein: The color filter layer includes a first color filter, a second color filter, and a third color filter corresponding to each pixel, and The slits are disposed between the first color filter and the second color filter, between the second color filter and the third color filter, and between the third color filter and the first color filter.

13. The light-emitting display device according to claim 1, wherein: The light absorbing material has a refractive index less than that of the cover plate.

14. The light emitting display device according to claim 13, wherein: The cover plate comprises a transparent material having a refractive index of 1.5 to 1.9, and Wherein, the light absorbing material comprises a black resin material having a refractive index of 1.2 to 1.

4.

15. The light emitting display device according to claim 1, wherein: The display panel comprises: a display area that provides a video image; and a non-display area surrounding the display area, The cover plate has an area larger than the display area and is disposed on the display area, and Wherein, the slit is arranged on the cover plate in the display area.

Images