Display module and display device

Abstract

The invention discloses a display module and a display device. The display module comprises a substrate; the metal composite layer is arranged on one side of the substrate and comprises a plurality of metal layers which are arranged at intervals in the first direction; the plurality of sub-pixels are arranged on one side, far away from the substrate, of the metal composite layer; the pixel definition layer is arranged on one side, far away from the substrate, of the metal composite layer; the isolation structure is at least partially arranged on the side, away from the substrate, of the pixel definition layer and located between every two adjacent sub-pixels; the display module is provided with a fingerprint area, and one side, deviating from the pixel definition layer, of the substrate is provided with an optical sensor corresponding to the fingerprint area; in the fingerprint area, the isolation structure is provided with a first opening, the first opening penetrates through the isolation structure in the first direction, any metal layer of the metal composite layer is provided with a second opening, and the second opening corresponds to the first opening. Through the arrangement, the problems that the screen body light transmittance of the display module is insufficient and fingerprint identification is difficult in the prior art are solved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] In the OLED (Organic Light-Emitting Diode) industry, for thinner and lighter displays, the proportion of products with flexible packaging is increasing. At present, the TFE (Thin Film Encapsulation) flexible packaging route using the FMM (Fine Metal Mask) process has matured. However, for higher PPI (Pixels Per Inch) and performance, the industry is currently developing a FMM-free OLED process route.

[0003] However, in related technologies, when the under-screen optical fingerprint recognition technology is applied to a FMM-free OLED display module, there are problems such as insufficient light transmittance of the screen body and difficulty for the light reflected by the fingerprint to reach the optical sensor under the screen, thus affecting the fingerprint recognition effect. Summary of the Invention

[0004] The present application mainly provides a display module and a display device to solve the problems in related technologies that when a FMM-free OLED display module performs under-screen optical fingerprint recognition, there are insufficient light transmittance of the screen body, difficulty for light to reach the optical sensor, and difficult fingerprint recognition.

[0005] To solve the above technical problems, a technical solution adopted by the present application is: providing a display module, including:

[0006] A substrate;

[0007] A metal composite layer disposed on one side of the substrate; along a first direction, the metal composite layer includes a plurality of spaced-apart metal layers;

[0008] A plurality of sub-pixels disposed on the side of the metal composite layer away from the substrate; each sub-pixel includes an anode, a light-emitting layer, and a cathode stacked in sequence;

[0009] A pixel definition layer disposed on the side of the metal composite layer away from the substrate, defining the positions of the plurality of sub-pixels;

[0010] An isolation structure disposed at least partially on the side of the pixel definition layer away from the substrate and located between two adjacent sub-pixels;

[0011] Wherein, the display module has a fingerprint area, and an optical sensor is disposed on the side of the substrate facing away from the pixel definition layer corresponding to the fingerprint area;

[0012] In the fingerprint area, the isolation structure is provided with a first opening, and the first opening penetrates through the isolation structure along a first direction; any one of the metal layers of the metal composite layer is provided with a second opening, and the second opening is arranged corresponding to the first opening.

[0013] In some embodiments, the aperture of the first opening is larger than the aperture of the second opening.

[0014] In some embodiments, the pixel defining layer is a light-transmitting layer, and the isolation structure is disposed on a side of the pixel defining layer away from the substrate; the isolation structure includes a main structure and a top structure, and the top structure is disposed on a surface of the main structure away from the substrate and covers the main structure; the first opening sequentially penetrates through the top structure and the main structure, and along one end of the first opening close to the substrate towards the end away from the substrate, the size of the first opening gradually increases;

[0015] And / or, from a side of the metal composite layer close to the substrate towards the side away from the substrate, the metal composite layer at least includes a first metal layer and a thin film transistor layer which are arranged at intervals, the first metal layer is an opaque metal layer, and the second opening is disposed in the first metal layer.

[0016] In some embodiments, in the fingerprint area, the orthographic projections of the remaining metal layers without the second opening on the substrate are all arranged at intervals from the orthographic projection of the second opening on the substrate and the orthographic projection of the first opening on the substrate;

[0017] In the fingerprint area, at other positions except the first opening and the second opening, the light rays along the first direction from the fingerprint area to the optical sensor are blocked by the anode and the remaining metal layers without the second opening.

[0018] In some embodiments, the aperture of the first opening is 2 μm - 10 μm;

[0019] And / or, in the first direction, the distance between the first opening and the second opening is 3 μm - 12 μm;

[0020] And / or, both the first opening and the second opening are circular holes, the first opening and the second opening are coaxially arranged, and the connection line between the centers of the first opening and the second opening is the axis; the side walls of the first opening and the side walls of the second opening are both inclined to the first direction; the connection line between the side walls of the first opening and the side walls of the second opening passing through the axis is the first connection line, and the included angle between the first connection line and the first direction is 5° - 25°.

[0021] In some embodiments, the display module further includes a packaging layer and a color filter layer disposed on a side of the packaging layer away from the substrate;

[0022] The color filter layer includes a plurality of color resistors disposed at intervals and corresponding to the sub-pixels, and a black matrix disposed between two adjacent color resistors;

[0023] The pixel defining layer is a black light-blocking layer. In the fingerprint area, the pixel defining layer is provided with a third opening corresponding to the first opening.

[0024] In some embodiments, the isolation structure is disposed on a side of the pixel defining layer away from the substrate, and the aperture of the third opening is smaller than the aperture of the first opening.

[0025] In some embodiments, the isolation structure includes a main structure and a top structure. The top structure is disposed on a surface of the main structure away from the substrate and covers the main structure; the aperture of the third opening is larger than the width of the main structure, and one end of the main structure close to the substrate is disposed in the third opening and is spaced from the side wall of the third opening; the top structure is located on a side of the pixel defining layer away from the substrate.

[0026] In some embodiments, the isolation structure includes a main structure and a top structure. The top structure is disposed on a surface of the main structure away from the substrate and covers the main structure; the aperture of the third opening is larger than the aperture of the first opening and smaller than the width of the main structure;

[0027] A part of the main structure is disposed on a side of the pixel defining layer away from the substrate, and another part is disposed in the third opening.

[0028] In some embodiments, in the first direction, the distance between the third opening and the second opening is 3 μm - 12 μm; and / or,

[0029] An inorganic insulating layer is disposed on a surface of the pixel defining layer away from the substrate, and the inorganic insulating layer covers the side wall and the bottom wall of the third opening; the isolation structure is disposed on a surface of the inorganic insulating layer away from the substrate; and / or,

[0030] In the fingerprint area, the black matrix is provided with a fourth opening corresponding to the first opening, and the aperture of the fourth opening is larger than the aperture of the first opening.

[0031] To solve the above technical problems, another technical solution adopted by this application is: to provide a display device including any one of the above-mentioned display modules.

[0032] The beneficial effects of this application are as follows: Different from the prior art, this application discloses a display module and a display device. The display module includes: a substrate, a metal composite layer, a plurality of sub-pixels, a pixel definition layer, and an isolation structure; the metal composite layer is disposed on one side of the substrate, and along the first direction, the metal composite layer includes a plurality of spaced-apart metal layers; the plurality of sub-pixels are disposed on the side of the metal composite layer away from the substrate, and each sub-pixel includes an anode, a light-emitting layer, and a cathode stacked in sequence; the pixel definition layer is disposed on the side of the metal composite layer away from the substrate to define the positions of the plurality of sub-pixels; the isolation structure is at least partially disposed on the side of the pixel definition layer away from the substrate and is located between two adjacent sub-pixels; wherein, the display module has a fingerprint area, and an optical sensor is disposed on the side of the substrate facing away from the pixel definition layer corresponding to the fingerprint area; in the fingerprint area, the isolation structure is provided with a first opening, the first opening penetrates the isolation structure along the first direction, and any metal layer of the metal composite layer is provided with a second opening, and the second opening corresponds to the first opening. By providing the first opening in the isolation structure in the fingerprint area, providing the second opening in any metal layer of the metal composite layer, and making the first opening correspond to the second opening, the light reflected by the fingerprint can enter the optical sensor through the first opening and the second opening, avoiding the problem that the light-transmitting area in the metal composite layer exposed by the anode of the sub-pixel is blocked due to the light-impermeability of the isolation structure, ensuring the transmittance of the isolation structure and the metal composite layer to the light reflected by the fingerprint, and solving the problems of insufficient light transmittance of the screen body, difficulty for light to reach the optical sensor, and difficulty in fingerprint recognition in the related art when performing under-screen optical fingerprint recognition on a non-FMM OLED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0034] Figure 1 is a top view structural schematic diagram of a display module provided by an embodiment of the present application;

[0035] Figure 2 is Figure 1 a cross-sectional schematic diagram of the first embodiment of the display module provided;

[0036] Figure 3 is Figure 2 a cross-sectional schematic diagram of a metal composite layer, a pixel definition layer, and an isolation structure of a display module provided;

[0037] Figure 4 is Figure 2 A schematic top view of the isolation structure of the provided display module and sub-pixels;

[0038] Figure 5 is Figure 4 A schematic cross-sectional view of an embodiment of the first opening and the second opening of the provided display module;

[0039] Figure 6 is Figure 1 A schematic cross-sectional view of a second embodiment of the provided display module;

[0040] Figure 7 is Figure 6 A schematic cross-sectional view of an embodiment of the pixel definition layer and the isolation structure of the provided display module;

[0041] Figure 8 is Figure 6 A schematic cross-sectional view of another embodiment of the pixel definition layer and the isolation structure of the provided display module;

[0042] Figure 9 is Figure 6 A schematic cross-sectional view of yet another embodiment of the pixel definition layer and the isolation structure of the provided display module;

[0043] Figure 10 It is a schematic structural diagram of a display device provided by another embodiment of the present application.

[0044] Reference numerals:

[0045] 200, display device; 100, display module; Z, fingerprint area; 1, substrate; 2, metal composite layer; 21, second opening; 22, first metal layer; 23, thin film transistor layer; 24, second metal layer; 25, organic layer; 26, third metal layer; 27, inorganic layer; 3, sub-pixel; 31, anode; 32, light-emitting layer; 321, first sub-pixel; 322, second sub-pixel; 323, third sub-pixel; 33, cathode; 4, pixel definition layer; 41, third opening; 5, isolation structure; 51, main body structure; 52, top structure; 53, first opening; 6, etching protection layer; 7, encapsulation layer; 71, organic encapsulation layer; 72, inorganic encapsulation layer; 8, polarizing layer; 9, color filter layer; 91, color resist; 911, first color resist; 912, second color resist; 913, third color resist; 92, black matrix; 93, fourth opening; 10, cover plate; 11, optical sensor; 12, inorganic insulating layer; L, first connection line. Detailed embodiments

[0046] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0047] The terms "first", "second", and "third" in the embodiments of the present application are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0048] Referring to

[0049] Referring to Figures 1 to 9 , Figure 1 is a top view structural schematic diagram of a display module provided by an embodiment of the present application, Figure 2 is Figure 1 a cross-sectional schematic diagram of a first implementation manner of the display module provided by Figure 3 is Figure 2 a cross-sectional schematic diagram of a metal composite layer, a pixel definition layer, and an isolation structure of a display module provided by Figure 4 is Figure 2 a top view structural schematic diagram of an isolation structure and sub-pixels of a display module provided by Figure 5 is Figure 4 a cross-sectional schematic diagram of a first opening and a second opening of a display module provided by Figure 6 is Figure 1 a cross-sectional schematic diagram of a second implementation manner of the display module provided by Figure 7 is Figure 6Schematic cross-sectional view of an embodiment of the pixel definition layer and isolation structure of the provided display module Figure 8 is Figure 6 Schematic cross-sectional view of another embodiment of the pixel definition layer and isolation structure of the provided display module Figure 9 is Figure 6 Schematic cross-sectional view of yet another embodiment of the pixel definition layer and isolation structure of the provided display module

[0050] Referring to Figures 1 to 9 , an embodiment of the present application provides a display module 100, which includes a substrate 1, a metal composite layer 2, a plurality of sub-pixels 3, a pixel definition layer 4, and an isolation structure 5. The metal composite layer 2 is disposed on one side of the substrate 1. Along a first direction, the metal composite layer 2 includes a plurality of spaced-apart metal layers, wherein the first direction is the thickness direction of the display module 100, that is, the direction perpendicular to the display module 100. The plurality of sub-pixels 3 are disposed on the side of the metal composite layer 2 away from the substrate 1. Each sub-pixel 3 includes an anode 31, a light-emitting layer 32, and a cathode 33 that are sequentially stacked. The pixel definition layer 4 is disposed on the side of the metal composite layer 2 away from the substrate 1. The pixel definition layer 4 defines the positions of the plurality of sub-pixels 3. The isolation structure 5 is at least partially disposed on the side of the pixel definition layer 4 away from the substrate 1 and is located between two adjacent sub-pixels 3. The display module 100 has a fingerprint area Z. An optical sensor 11 is disposed on the side of the substrate 1 facing away from the metal composite layer 2 corresponding to the fingerprint area Z. In the fingerprint area Z, the isolation structure 5 is provided with a first opening 53. The first opening 53 penetrates the isolation structure 5 along the first direction. Any metal layer of the metal composite layer 2 is provided with a second opening 21, and the second opening 21 is disposed corresponding to the first opening 53.

[0051] It can be understood that by providing the first opening 53 in the isolation structure 5 in the fingerprint area Z, providing the second opening 21 in any metal layer of the metal composite layer 2, and disposing the first opening 53 corresponding to the second opening 21, using the principle of pinhole imaging, the light reflected by the fingerprint can enter the optical sensor 11 through the first opening 53 and the second opening 21, avoiding the problem that the isolation structure 5 blocks the light-transmitting area in the metal composite layer 2 exposed by the anode 31 of the sub-pixel 3 due to non-light-transmitting, ensuring the light transmittance of the isolation structure 5 and the metal composite layer 2 for the light reflected by the fingerprint, and solving the problems of insufficient light transmittance of the screen body, difficulty for light to reach the optical sensor 11, and difficult fingerprint recognition in the related art when the non-FMM OLED display module 100 performs under-screen optical fingerprint recognition. Specifically, in some embodiments, such as Figure 2As shown in the figure, the display module 100 further includes a packaging layer 7 and a cover plate 10. The packaging layer 7 is disposed on the side of the isolation structure 5 away from the substrate 1, and covers the sub-pixels 3, the pixel definition layer 4, and the isolation structure 5 to package and protect the display module 100. In some embodiments, the packaging layer 7 includes an organic packaging layer 71 and an inorganic packaging layer 72. Specifically, the organic packaging layer 71 is made of an organic material, and the surface of the organic packaging layer 71 away from the substrate 1 is flat; the inorganic packaging layer 72 is an inorganic insulating material, and the inorganic packaging layer 72 covers the side of the organic packaging layer 71 away from the substrate 1, and the surface of the inorganic packaging layer 72 away from the substrate 1 is flat. The cover plate 10 is disposed on the side of the inorganic packaging layer 72 away from the substrate 1. Specifically, the cover plate 10 has light transmissivity, and the fingerprint area Z is located on the cover plate 10.

[0052] In some embodiments, the display module 100 may further include an etching protection layer 6. The etching protection layer 6 is disposed on the side of the isolation structure 5 away from the substrate 1 and is located on the side of the packaging layer 7 close to the substrate 1, that is, the etching protection layer 6 is located between the isolation structure 5 and the packaging layer 7. The material of the etching protection layer 6 is an inorganic insulating material. Specifically, it may be a silicon nitride-based inorganic material. The etching protection layer 6 entirely covers the cathodes 33 of the plurality of sub-pixels 3 and the side surfaces of the isolation structure 5, that is, the etching protection layer 6 wraps all the structures located between its bottom and the metal composite layer 2 to protect the sub-pixels 3.

[0053] By using the structure of the inorganic etching protection layer 6, the organic packaging layer 71 plus the inorganic packaging layer 72 to package the display module 100, it combines the advantages of good water and oxygen barrier properties of inorganic packaging materials and good film-forming properties of organic packaging materials, can isolate the external environment, so as to avoid the contamination and corrosion of the display module 100 by substances such as impurities, oxygen, and moisture in the air, and avoid problems such as being damaged under external force, improve the packaging reliability, and is beneficial to extending the device life and improving the device stability.

[0054] In some embodiments, the metal composite layer 2 may be the driving circuit layer of the display module 100, and the second opening 21 may be disposed in any metal layer of the driving circuit layer; alternatively, the metal composite layer 2 may also include the driving circuit layer and other metal layers at the same time, and the second opening 21 may be disposed in any other metal layer except the driving circuit layer. That is, any metal layer in the driving circuit layer of the display module 100 can be directly used to form the second opening 21, or other metal layers independent of the driving circuit layer can be provided to form the second opening 21, which can be designed according to specific needs, and the present application does not limit this. It can be understood that directly disposing the second opening 21 in any metal layer of the driving circuit layer of the display module 100 is beneficial to reducing the thickness of the metal composite layer 2 of the display module 100, thereby reducing the thickness of the display module 100 to meet more usage requirements, and is also beneficial to cost savings; at the same time, providing other metal layers independent of the driving circuit layer to form the second opening 21 can avoid affecting the normal distribution of the metal traces in the driving circuit layer and avoid affecting the performance of the driving circuit layer.

[0055] Referring to Figures 2 to 5 , in the first embodiment, the pixel definition layer 4 is a light-transmitting layer, and the isolation structure 5 is entirely located on the side of the pixel definition layer 4 away from the substrate 1. The light-emitting layer 32 of the sub-pixel 3 is an organic light-emitting layer made of an organic light-emitting material, and the light generated by the organic light-emitting layer of the sub-pixel 3 can irradiate the fingerprint area Z. The sub-pixel 3 may include a first sub-pixel 321, a second sub-pixel 322, and a third sub-pixel 323. The colors of the organic light-emitting layers of the first sub-pixel 321, the second sub-pixel 322, and the third sub-pixel 323 may be different. For example, the colors of the organic light-emitting layers of the first sub-pixel 321, the second sub-pixel 322, and the third sub-pixel 323 may be red, green, and blue respectively to generate light of different colors. In the fingerprint area Z, after the light is reflected by the fingerprint, it sequentially passes through the cover plate 10, the encapsulation layer 7, then passes through the first opening 53 of the isolation structure 5, the pixel definition layer 4, and passes through the second opening 21 of the metal composite layer 2 and the substrate 1, and then is transmitted to the optical sensor 11 located at the bottom of the substrate 1 to achieve the fingerprint recognition function.

[0056] Specifically, in some embodiments, the aperture of the first opening 53 is larger than that of the second opening 21. By making a large hole in the isolation structure 5 and a small hole in the metal layer of the metal composite layer 2, a structure with nested large and small holes is formed. It can be understood that the first opening 53 is disposed within the isolation structure 5, and the second opening 21 is disposed within any metal layer of the metal composite layer 2. In the first direction, the first opening 53 is located at the top of the second opening 21, and the first opening 53 is closer to the fingerprint area Z on the side of the cover plate 10. The light reflected by the fingerprint first reaches the first opening 53 and then reaches the position of the second opening 21. By setting the aperture of the first opening 53 to be larger than that of the second opening 21, it can be ensured that the light reflected by the fingerprint can smoothly and sufficiently pass through the first opening 53 and be transmitted to the second opening 21, ensuring the transmittance of the light reflected by the fingerprint, and thus ensuring the fingerprint recognition effect. At the same time, it can also prevent the size of the second opening 21 from being larger than that of the first opening 53, which would overly occupy the space in the metal composite layer 2 and have an adverse impact on the metal traces of the drive circuit layer in the metal composite layer 2, avoiding the problem of affecting the performance of the drive circuit layer in the metal composite layer 2.

[0057] In some embodiments, the aperture of the first opening 53 is 2μm - 10μm. For example, the aperture of the first opening 53 can be any value such as 2μm, 3.8μm, 4.2μm, 6μm, 7.4μm, 8μm, 9μm, 9.5μm, 10μm, etc., and the aperture of the second opening 21 is smaller than that of the first opening 53. It can be understood that setting the aperture of the first opening 53 within the above range can prevent the problem that the light reflected by the fingerprint cannot sufficiently pass through the first opening 53 of the isolation structure 5 and reach the second opening 21 and be transmitted to the optical sensor 11, resulting in insufficient transmittance of the light reflected by the fingerprint in the isolation structure 5 and the metal composite layer 2. It can also prevent the problem that the aperture of the first opening 53 is too large, which affects the structural strength and stability of the isolation structure 5, thereby affecting the evaporation of the sub-pixels 3 and the performance of the display module 100. It can also prevent waste of the distribution space of the metal traces in the metal composite layer 2. The above settings can ensure that there is enough light reflected by the fingerprint passing through the first opening 53, ensuring the transmittance of the light reflected by the fingerprint, and also ensuring that the display module 100 has stable and excellent performance.

[0058] Specifically, in some embodiments, the isolation structure 5 includes a main structure 51 and a top structure 52. The top structure 52 is disposed on the surface of the main structure 51 away from the substrate 1 and covers the main structure 51. In other embodiments, the isolation structure 5 may also only include the main structure 51 and not include the top structure 52, and the cross-sectional shape of the main structure 51 can be directly set as an inverted trapezoid.

[0059] See Figures 2 to 5, in some embodiments, the isolation structure 5 includes a main structure 51 and a top structure 52. Along the first direction, the first opening 53 sequentially penetrates through the top structure 52 and the main structure 51 of the isolation structure 5, and the size of the first opening 53 gradually increases from the end close to the substrate 1 to the end far from the substrate 1 along the first opening 53. In a specific embodiment, as Figure 5 shown, the cross-sectional shape of the main structure 51 is generally trapezoidal, the top structure 52 protrudes from the side surface of the main structure 51, and the width of the top structure 52 is greater than the width of the main structure 51 to shield the main structure 51, facilitating the evaporation of the sub-pixels 3 by using the isolation structure 5, so as to eliminate the fine metal mask and save costs. The first opening 53 only sequentially penetrates through the top structure 52 and the main structure 51 of the isolation structure 5 and does not extend into the pixel definition layer 4. That is, the pixel definition layer 4 itself has light transmittance and no opening is provided inside. In a specific embodiment, both the first opening 53 and the second opening 21 can be set as circular holes. In other embodiments, the first opening 53 and the second opening 21 can also be set as holes of other shapes. For example, the cross-sectional shapes of the first opening 53 and the second opening 21 can be any shape such as rectangular, oval, hexagonal, etc., which can be designed according to needs.

[0060] It can be understood that the size of the first opening 53 gradually increases from the end close to the substrate 1 to the end far from the substrate 1 along the first opening 53. That is, the size of the first opening 53 at the end far from the substrate 1 is larger than the size at the end close to the substrate 1, which can not only ensure that the light emitted by the sub-pixel 3 irradiates on the fingerprint and is smoothly reflected by the fingerprint and enters and passes through the first opening 53 from the end far from the substrate 1 of the first opening 53, but also makes the side wall of the first opening 53 inclined to the first direction, ensuring that both the top structure 52 and the main structure 51 of the isolation structure 5 are effectively and evenly penetrated by the first opening 53. Since the size of the first opening 53 is small, the above setting can avoid the situation that the size of the first opening 53 corresponding to the top structure 52 part is smaller than the size of the first opening 53 corresponding to the main structure 51 part, and the size of the first opening 53 corresponding to the top structure 52 part changes suddenly, resulting in the top structure 52 protruding from the main structure 51 at the position corresponding to the first opening 53, and then causing problems such as bulging or etching residue at the position of the first opening 53 when depositing film layers such as the encapsulation layer 7, affecting the normal transmission path of the light reflected by the fingerprint in the first opening 53. The above setting effectively ensures that the optical path of the light reflected by the fingerprint is not affected, ensures that there is no abnormal light-transmitting structure in the light-transmitting channel, ensures the accuracy of the light collection of the optical sensor 11, is beneficial to improving the fingerprint recognition effect, and improves the performance of the display module 100.

[0061] In some embodiments, the relative size of the first opening 53 and the second opening 21 can be adjusted and limited by the angle between the sidewall of the first opening 53 and the sidewall of the second opening 21. Refer to Figure 5 , in one embodiment, both the first opening 53 and the second opening 21 are circular holes, the first opening 53 and the second opening 21 are coaxially arranged, the line connecting the centers of the first opening 53 and the second opening 21 is the axis, the sidewalls of the first opening 53 and the second opening 21 are both inclined to the first direction, and the line connecting the sidewalls of the first opening 53 and the second opening 21 passing through the axis is the first connecting line L. The angle between the first connecting line L and the first direction is 5° - 25°. By setting the angle between the first connecting line L and the first direction to 5° - 25°, it can be ensured that the light reflected by the fingerprint can pass through the first opening 53 and the second opening 21 more smoothly and sufficiently, improving the transmittance of the light reflected by the fingerprint and enhancing the fingerprint recognition effect.

[0062] Refer to Figure 3 , in some embodiments, from the side of the metal composite layer 2 close to the substrate 1 to the side away from the substrate 1, the metal composite layer 2 at least includes a first metal layer 22 and a thin film transistor layer 23 (TFT) arranged at intervals. As Figure 3 shown, in a specific embodiment, from the side of the metal composite layer 2 close to the substrate 1 to the side away from the substrate 1, the metal composite layer 2 successively includes a first metal layer 22, a thin film transistor layer 23, a second metal layer 24, an organic layer 25, a third metal layer 26, and an inorganic layer 27. Both the organic layer 25 and the inorganic layer 27 are planarization layers, and the anode 31 of the sub-pixel 3 is arranged on the side of the inorganic layer 27 away from the substrate 1. Among them, the thin film transistor layer 23 includes a gate metal layer (not shown in the figure) and a source-drain metal layer (not shown in the figure) arranged at intervals, and the above-mentioned multiple metal layers are arranged at intervals.

[0063] The second opening 21 can be arranged in any one of the metal layers on the side of the organic layer 25 close to the substrate 1. For example, the second opening 21 can be arranged in the first metal layer 22, or can be arranged in the gate metal layer or the source-drain metal layer of the thin film transistor layer 23, or can also be arranged in the second metal layer 24. It can be understood that arranging the second opening 21 in any one of the metal layers on the side of the organic layer 25 close to the substrate 1 can ensure that there is a sufficient distance between the second opening 21 and the first opening 53 in the first direction, thereby ensuring that the light reflected by the fingerprint can be effectively transmitted between the first opening 53 and the second opening 21, and avoiding the distance between the second opening 21 and the first opening 53 in the first direction being too short and affecting the transmission of the light reflected by the fingerprint to the optical sensor 11.

[0064] In some embodiments, in the first direction, the distance between the first opening 53 and the second opening 21 is 3 μm - 12 μm. For example, the distance between the first opening 53 and the second opening 21 can be any value such as 3 μm, 4 μm, 6 μm, 8 μm, 11 μm, 12 μm, etc. It can be understood that by setting the vertical distance between the first opening 53 and the second opening 21 within the above range, it can ensure that in the first direction, there is sufficient distance between the first opening 53 and the second opening 21 to ensure the transmission effect of the light reflected by the fingerprint between the first opening 53 and the second opening 21, and ensure that the light reflected by the fingerprint has sufficient transmittance in the isolation structure 5 and the metal composite layer 2, thereby facilitating the improvement of the fingerprint recognition effect of the optical sensor 11.

[0065] Specifically, the first metal layer 22 is an opaque metal layer. For example, the first metal layer 22 can be made of metals such as molybdenum, titanium, aluminum, etc. The first metal layer 22 is located on the side of the thin film transistor layer 23 close to the substrate 1, and the first metal layer 22 is the metal layer at the bottom layer (closest to the substrate 1) in the metal composite layer 2. In a specific embodiment, the second opening 21 is provided in the first metal layer 22. It can be understood that by providing the second opening 21 in the metal layer at the bottom layer of the metal composite layer 2, it can make the vertical distance between the first opening 53 and the second opening 21 the largest in the first direction, ensure that the light reflected by the fingerprint can be transmitted more effectively between the first opening 53 and the second opening 21, ensure that the light reflected by the fingerprint has sufficient transmittance, and thus ensure the light transmission effect.

[0066] See Figure 5 , in some embodiments, in the fingerprint area Z, the orthographic projections of the remaining metal layers without the second opening 21 on the substrate 1 are all spaced from the orthographic projection of the second opening 21 on the substrate 1 and the orthographic projection of the first opening 53 on the substrate 1. That is, the remaining metal layers in the metal composite layer 2 without the second opening 21 avoid the light transmission path between the first opening 53 and the second opening 21, preventing the remaining metal layers from blocking the light transmitted from the first opening 53 to the second opening 21 and affecting the light transmittance, and ensuring that the light can pass through the first opening 53 and the second opening 21 smoothly.

[0067] In the fingerprint area Z, at positions other than the first opening 53 and the second opening 21, the light transmitted from the fingerprint area Z to the optical sensor 11 along the first direction is blocked by the anode 31 and the remaining metal layers where the second opening 21 is not provided. That is, the remaining metal layers in the metal composite layer 2 are all non-transparent metal layers. In the fingerprint area Z, the light reflected by the fingerprint in the direction perpendicular to the display module 100 can only be transmitted to the optical sensor 11 from the position between the first opening 53 and the second opening 21. The light at other positions is blocked by the anode 31 of the sub-pixel 3 and the remaining metal layers, avoiding problems such as light leakage and formation of slit interference, which may cause interference with the recognition feedback result of the optical sensor 11. The above settings are beneficial to improving the accuracy and reliability of fingerprint recognition.

[0068] See Figure 2 , in the first embodiment, the display module 100 further includes a polarizing layer 8 (POL). The polarizing layer 8 is disposed on the side of the encapsulation layer 7 away from the substrate 1. Specifically, the polarizing layer 8 is located between the cover plate 10 and the encapsulation layer 7 to control the direction and intensity of light, reduce the reflection and glare on the screen surface, optimize the image quality and visual experience, and enhance the contrast of the image.

[0069] See Figures 6 to 9 , in the second embodiment, the display module 100 further includes a color filter layer 9. The color filter layer 9 is disposed on the side of the encapsulation layer 7 away from the substrate 1. Specifically, the color filter layer 9 includes a plurality of color resistors 91 arranged at intervals and a black matrix 92 disposed between two adjacent color resistors 91. The color resistors 91 are arranged corresponding to the positions of the sub-pixels 3, and the black matrix 92 isolates two adjacent color resistors 91. Specifically, the color resistors 91 may include a first color resistor 911, a second color resistor 912, and a third color resistor 913. The first color resistor 911, the second color resistor 912, and the third color resistor 913 have different colors and can be respectively arranged in red, green, and blue corresponding to the colors of the first sub-pixel 321, the second sub-pixel 322, and the third sub-pixel 323.

[0070] Different from the first embodiment of the display module 100, in this embodiment, the display module 100 does not include the polarizing layer 8, and the color filter layer 9 is used to replace the polarizing layer 8, and the pixel defining layer 4 is a black light-blocking layer. After the light reflected by the fingerprint passes through the first opening 53 of the isolation structure 5, it cannot directly pass through the pixel defining layer 4. Therefore, in the fingerprint area Z, the pixel defining layer 4 is provided with a third opening 41 corresponding to the first opening 53, so that the light can smoothly pass through the first opening 53 and the pixel defining layer 4 and reach the optical sensor 11.

[0071] Specifically, in some embodiments, such as Figure 7As shown, the isolation structure 5 is entirely disposed on the side of the pixel definition layer 4 away from the substrate 1, and the aperture of the third opening 41 is smaller than that of the first opening 53. That is, the aperture of the first opening 53 in the isolation structure 5 is larger than that of the third opening 41 in the pixel definition layer 4 to ensure the light transmittance and also ensure the strength of the isolation structure 5 and the normal distribution of the metal traces in the metal composite layer 2. Specifically, the first opening 53, the third opening 41, and the second opening 21 are coaxially arranged, and the positional relationship between the first opening 53 and the second opening 21 in the first embodiment of the display module 100 is applicable to the positional relationship between the third opening 41 and the first opening 53 in this embodiment. That is, in this embodiment, in the first direction, the distance between the third opening 41 and the second opening 21 is 3 μm - 12 μm to ensure that there is sufficient distance between the third opening 41 and the second opening 21 in the first direction to ensure the transmission effect of the light reflected by the fingerprint between the third opening 41 and the second opening 21, ensure that the light reflected by the fingerprint has sufficient transmittance, and thus is conducive to improving the fingerprint recognition effect of the optical sensor 11.

[0072] Furthermore, in this embodiment, since the pixel definition layer 4 is a black light-blocking layer, there is a risk of precipitation of conductive substances during the subsequent evaporation and etching processes for the black pixel definition layer 4. Therefore, an inorganic insulating layer 12 is provided on the surface of the pixel definition layer 4 away from the substrate 1, and the inorganic insulating layer 12 covers the side wall and the bottom wall of the third opening 41, and the isolation structure 5 is disposed on the surface of the inorganic insulating layer 12 away from the substrate 1 to prevent the precipitation of conductive substances during the subsequent evaporation and etching processes from affecting the normal light emission of the sub-pixel 3.

[0073] Furthermore, the black matrix 92 of the color filter layer 9 is light-blocking, and the black matrix 92 is provided with a fourth opening 93 corresponding to the first opening 53. The aperture of the fourth opening 93 is larger than that of the first opening 53 to facilitate the light reflected by the fingerprint to pass through the fourth opening 93 and be transmitted to the position of the first opening 53, ensuring that the light reflected by the fingerprint can be smoothly transmitted to the optical sensor 11. The aperture of the fourth opening 93 should not be too large, and the included angle between the first connecting line L between the side walls of the first opening 53 and the second opening 21 and the side wall of the fourth opening 93 is between -2° and 2° to ensure the light transmission effect.

[0074] See Figure 8, in some embodiments, the aperture of the third opening 41 of the pixel definition layer 4 is larger than the aperture of the first opening 53 of the isolation structure 5. Specifically, the aperture of the third opening 41 of the pixel definition layer 4 is larger than the width of the main body structure 51. One end of the main body structure 51 close to the substrate 1 is disposed within the third opening 41 and is spaced apart from the sidewall of the third opening 41, and the top structure 52 is located on the side of the pixel definition layer 4 away from the substrate 1. The inorganic insulating layer 12 covers the surface of the pixel definition layer 4 away from the substrate 1 and the sidewalls and bottom wall of the third opening 41. The main body structure 51 of the isolation structure 5 is disposed within the third opening 41. The fourth opening 93, the third opening 41, the first opening 53, and the second opening 21 are coaxially disposed. The thickness of the isolation structure 5 is greater than the thickness of the pixel definition layer 4, so as to be able to normally perform evaporation coating on the sub-pixels 3, and at the same time, the thickness of the display module 100 can also be reduced. The light reflected by the fingerprint sequentially passes through the fourth opening 93 of the black matrix 92, the first opening 53 of the isolation structure 5, and the second opening 21 in the metal composite layer 2 and enters the optical sensor 11 to realize fingerprint recognition.

[0075] See Figure 9 , in some embodiments, the aperture of the third opening 41 of the pixel definition layer 4 is larger than the aperture of the first opening 53 and smaller than the width of the main body structure 51. A part of the main body structure 51 is disposed on the side of the pixel definition layer 4 away from the substrate 1, and another part is disposed within the third opening 41. Specifically, the part of the main body structure 51 located within the third opening 41 covers the sidewall of the third opening 41. Among them, the inorganic insulating layer 12 covers the surface of the pixel definition layer 4 away from the substrate 1 and the sidewalls and bottom wall of the third opening 41. The fourth opening 93, the third opening 41, the first opening 53, and the second opening 21 are coaxially disposed. The light reflected by the fingerprint sequentially passes through the fourth opening 93 of the black matrix 92, the first opening 53 of the isolation structure 5, and the second opening 21 in the metal composite layer 2 and enters the optical sensor 11 to realize fingerprint recognition.

[0076] In the embodiments of the present application, by providing the first opening 53 in the isolation structure 5 in the fingerprint area Z, providing the second opening 21 in any metal layer of the metal composite layer 2, and disposing the first opening 53 corresponding to the second opening 21, using the principle of pinhole imaging, the light reflected by the fingerprint in the fingerprint area Z can pass through the first opening 53 and the second opening 21 and enter the optical sensor 11, avoiding the problem that the isolation structure 5 blocks the light-transmitting area in the metal composite layer 2 exposed by the anode 31 of the sub-pixel 3 due to non-light-transmitting, ensuring the transmittance of the isolation structure 5 and the metal composite layer 2 to the light reflected by the fingerprint, and solving the problems in the related art that in the under-screen optical fingerprint recognition of the non-FMM OLED display module 100, there are problems such as insufficient light transmittance of the screen body, difficulty for light to reach the optical sensor 11, and difficulty in fingerprint recognition, and improving the performance of the display module 100.

[0077] Refer to Figure 10 , Figure 10 which is a schematic structural diagram of a display device provided by another embodiment of the present application.

[0078] See Figure 10 , another embodiment of the present application further provides a display device 200, which includes the display module 100 of any one of the above, improving the reliability and accuracy of fingerprint recognition of the display device 200 and enhancing the performance of the display device 200.

[0079] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A display module, characterized in that: include: substrate; A metal composite layer is disposed on one side of the substrate; along a first direction, the metal composite layer includes a plurality of metal layers disposed at intervals; A plurality of sub-pixels are arranged on a side of the metal composite layer away from the substrate; each of the sub-pixels comprises an anode, a light-emitting layer and a cathode which are stacked in sequence; A pixel definition layer, disposed on a side of the metal composite layer away from the substrate, defining positions of a plurality of sub-pixels; An isolation structure, at least partially disposed on a side of the pixel definition layer away from the substrate, and located between two adjacent sub-pixels; Wherein, the display module has a fingerprint area, and an optical sensor is arranged on a side of the substrate away from the pixel definition layer corresponding to the fingerprint area; In the fingerprint area, the isolation structure is provided with a first opening, and the first opening penetrates the isolation structure along a first direction; any metal layer of the metal composite layer is provided with a second opening, and the second opening is provided corresponding to the first opening.

2. The display module according to claim 1, characterized in that: The aperture of the first opening is larger than the aperture of the second opening.

3. The display module according to claim 2, characterized in that: The pixel definition layer is a light-transmitting layer, and the isolation structure is arranged on a side of the pixel definition layer away from the substrate; the isolation structure includes a main structure and a top structure, and the top structure is arranged on a surface of the main structure away from the substrate and shields the main structure; the first opening sequentially penetrates the top structure and the main structure, and the size of the first opening gradually increases from an end of the first opening close to the substrate to an end away from the substrate; And / or, from the side of the metal composite layer close to the substrate to the side away from the substrate, the metal composite layer at least includes a first metal layer and a thin film transistor layer arranged at intervals, the first metal layer is a non-transparent metal layer, and the second opening is arranged in the first metal layer.

4. The display module according to claim 2, characterized in that: In the fingerprint area, the orthographic projections of the remaining metal layers on the substrate that are not provided with the second openings are spaced apart from the orthographic projections of the second openings on the substrate and the orthographic projections of the first openings on the substrate; In the fingerprint area, except for the first opening and the second opening, light from the fingerprint area to the optical sensor along the first direction is blocked by the anode and the rest of the metal layer where the second opening is not provided.

5. The display module according to claim 2, characterized in that: The pore size of the first opening is 2 μm-10 μm; and / or, in the first direction, a distance between the first opening and the second opening is 3 μm-12 μm; And / or, the first opening and the second opening are both circular holes, the first opening and the second opening are coaxially arranged, and the line between the center of the first opening and the center of the second opening is the axis; the side wall of the first opening and the side wall of the second opening are both inclined to the first direction; the line between the side wall of the first opening and the side wall of the second opening passing through the axis is the first connecting line, and the angle between the first connecting line and the first direction is 5°-25°.

6. The display module according to claim 2, characterized in that: The display module further comprises an encapsulation layer and a color filter layer arranged on a side of the encapsulation layer away from the substrate; The color filter layer includes a plurality of color resists arranged at intervals and corresponding to the sub-pixels, and a black matrix arranged between two adjacent color resists; The pixel definition layer is a black opaque layer. In the fingerprint area, the pixel definition layer is provided with a third opening corresponding to the first opening.

7. The display module according to claim 6, characterized in that: The isolation structure is arranged on a side of the pixel definition layer away from the substrate, and the aperture of the third opening is smaller than the aperture of the first opening.

8. The display module according to claim 6, characterized in that: The isolation structure includes a main structure and a top structure, wherein the top structure is arranged on a surface of the main structure away from the substrate and blocks the main structure; the aperture of the third opening is larger than the width of the main structure, and one end of the main structure close to the substrate is arranged in the third opening and is spaced apart from the side wall of the third opening; the top structure is located on a side of the pixel definition layer away from the substrate.

9. The display module according to claim 6, characterized in that: The isolation structure comprises a main structure and a top structure, wherein the top structure is disposed on a surface of the main structure away from the substrate and shields the main structure; the aperture of the third opening is larger than the aperture of the first opening and smaller than the width of the main structure; A portion of the main structure is disposed on a side of the pixel definition layer away from the substrate, and another portion is disposed in the third opening.

10. The display module according to any one of claims 7 to 9, characterized in that: In the first direction, the distance between the third opening and the second opening is 3 μm-12 μm; and / or, An inorganic insulating layer is disposed on a surface of the pixel definition layer away from the substrate, and the inorganic insulating layer covers the sidewalls and bottom wall of the third opening; the isolation structure is disposed on a surface of the inorganic insulating layer away from the substrate; and / or, In the fingerprint area, the black matrix is ​​provided with a fourth opening corresponding to the first opening, and the aperture of the fourth opening is larger than the aperture of the first opening.

11. A display device, characterized in that: Comprising a display module as described in any one of claims 1-10.

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