LED luminescent glass curtain wall

Abstract

The invention relates to an LED luminescent glass curtain wall, which comprises a front transparent plate, a back transparent plate and LED lamp beads, a printed circuit layer is arranged on the front transparent plate, and the front transparent plate and the back transparent plate form an installation space for accommodating the LED lamp beads; the LED lamp bead comprises a base and a light-emitting wafer, the light-emitting wafer is installed on the base, a chip installation face is formed on the base, a pin is led out from the chip installation face, and the pin is attached to the top of the base after being bent. Pins of the LED lamp beads are electrically connected with the printed circuit layer, and the LED lamp beads are installed on the front transparent plate through the base. The pins of the LED lamp beads are bent and then attached to the top of the base, so that the power input and signal connection position of the LED lamp beads is located at the top of the base, and therefore when the LED lamp beads are installed on the LED light-emitting glass curtain wall, the LED lamp beads can be tightly attached to the front transparent plate of the LED light-emitting glass curtain wall, and the LED light-emitting glass curtain wall is prevented from being damaged. Light rays emitted by the LED lamp beads can be more effectively transmitted out from the front transparent plate.

Description

Technical Field

[0001] The present invention belongs to the technical field of lamp beads, and particularly relates to an LED light-emitting glass curtain wall. Background Art

[0002] Transparent LED displays have gradually been widely used in the market and various product forms have emerged. For example, an LED light-emitting glass curtain wall is formed by arranging LED lights between two spaced transparent glasses, and different lighting patterns are presented by the emission of the LED lights.

[0003] Among them, the LED lights play an important role in the LED light-emitting glass curtain wall, which determines the overall presentation effect of the LED light-emitting glass curtain wall.

[0004] Currently, the most commonly used LED lamp beads mainly include a base and a light-emitting wafer mounted on the base, with several pins led out above; its driving requires an external driving chip or driving circuit to drive the light-emitting wafers in each LED lamp bead to be lit according to the setting. After technical improvement, a structure with a driving chip built into the LED lamp bead appears; this structure can simplify the circuit connection and has the advantage of improving the circuit design efficiency. This kind of LED lamp bead with a driving chip is often used in LED strip lighting and LED displays, and the relatively common package sizes are 5050 (outer dimension is 5mm x 5mm), 2727 (outer dimension is 2.7mm x 2.7mm), etc.

[0005] Such as Figure 1 and Figure 2 shown, it introduces an LED lamp bead with a TOP-type package structure, which includes a base 1 in the form of an insulating base, and several pins 11 extend from the bottom of the base 1; a cup-shaped space is formed on the upper part of the base 1, and a chip mounting surface 10 is formed on it. A driving chip 2 and three light-emitting wafers 3 are mounted on the chip mounting surface 10, and the light emitted by the light-emitting wafers 3 can be emitted from the top of the cup-shaped base 2.

[0006] However, when the applicant uses the LED lamp beads with this kind of structure to make an LED light-emitting glass curtain wall, it is found that as Figure 3Regarding the problems shown, the LED light-emitting glass curtain wall includes a front glass 1' and a rear glass 2'. The front glass 1' and the rear glass 2' are arranged at intervals, and the LED lamp beads are arranged between the front glass 1' and the rear glass 2'. The light 3' emitted by the LED lamp beads is transmitted through the front glass. Since the pins 11 of the existing LED lamp beads are arranged at the bottom of the base 1, its structure determines that it can only be installed on the rear glass 2' of the LED light-emitting glass curtain wall so that the light can be transmitted through the front glass 1'. When making an LED light-emitting glass curtain wall using LED lamp beads with this structure, since there is a space between the LED lamp beads and the front glass, part of the light will be reflected back by the front glass, resulting in a poor overall effect of the light pattern transmitted through the front glass. Summary of the Invention

[0007] The technical problem to be solved by the present invention is: to provide an LED light-emitting glass curtain wall for the problem that the unreasonable design of the existing LED lamp beads causes a poor lighting effect presented by the LED light-emitting glass curtain wall.

[0008] To solve the above technical problem, an embodiment of the present invention provides an LED light-emitting glass curtain wall, which includes a front transparent plate, a rear transparent plate, and LED lamp beads. A printed circuit layer is arranged on the front transparent plate, and an installation space for accommodating the LED lamp beads is formed between the front transparent plate and the rear transparent plate; The LED lamp bead includes a base and a light-emitting wafer. The light-emitting wafer is installed on the base. A chip installation surface is formed on the base, and pins are led out from the chip installation surface, and the pins are attached to the top of the base after being bent; The pins of the LED lamp bead are electrically connected to the printed circuit layer, and the LED lamp bead is installed on the front transparent plate through the base.

[0009] Optionally, the pins of the LED lamp bead are led out from the chip installation surface and bent upward along the side wall of the base to form a bent section, and the end of the bent section is bent along the top wall of the base to form a connection section for electrically connecting to the printed circuit layer.

[0010] Optionally, a groove is provided on the base, and the bent section and the connection section are embedded in the groove; the upper surface of the connection section is higher than the top surface of the base.

[0011] Optionally, the LED lamp bead further includes a driving chip, and the driving chip is installed on the base; the chip installation surface includes an isolation channel and electrode pads and signal pads isolated from each other through the isolation channel; The electrode pads include a cathode pad and an anode pad; the signal pads include a signal input pad and a signal output pad; the signal pads and the electrode pads are electrically connected to the driving chip.

[0012] Optionally, a plurality of pins are provided on the driving chip, and the pins on the driving chip are electrically connected to the chip mounting surface and the light-emitting wafer by direct soldering or by bonding wires; The pins include signal pins, electrode pins, and color control pins; the signal pins include signal input pins and signal output pins; The pins of the LED lamp beads include electrode pins and signal pins; the electrode pins are electrically connected to the electrode pads, and the signal pins are electrically connected to the signal pads; The signal pins on the driving chip are electrically connected to the signal pads on the base; the electrode pins on the driving chip are electrically connected to the electrode pads on the base; The light-emitting wafer includes a first electrode and a second electrode; the first electrode is used to be electrically connected to the color control pin on the driving chip; the second electrode is used to be electrically connected to a certain electrode pin on the driving chip or a certain electrode pad on the base.

[0013] Optionally, the light-emitting wafer includes a first light-emitting wafer, a second light-emitting wafer, and a third light-emitting wafer; The first light-emitting wafer is a blue light-emitting wafer, the second light-emitting wafer is a red light-emitting wafer, and the third light-emitting wafer is a green light-emitting wafer; The signal input pad and the cathode pad are arranged on one side of the anode pad, and the signal output pad is arranged on the other side of the anode pad; The driving chip, the first light-emitting wafer, and the second light-emitting wafer are mounted above the anode pad; the third light-emitting wafer is mounted on the signal input pad.

[0014] Optionally, the front transparent plate includes a first transparent layer, a metal sheet is embedded in the first transparent layer, and a printed circuit layer is arranged on the first transparent layer; the printed circuit layer includes a lamp bead power supply pad, a lamp bead signal pad, and a lamp bead welding area for arranging LED lamp beads in an array, wherein the lamp bead power supply pad is used to be connected to an external power supply, and the lamp bead signal pad is used to be connected to an external signal input source; Each lamp bead welding area is provided with a pin pad corresponding to the pins of the LED lamp bead, and the pin pad includes a signal pin pad and an electrode pin pad; the electrode pins of the LED lamp bead are electrically connected to the electrode pin pads on the lamp bead welding area, and the signal pins of the LED lamp bead are electrically connected to the signal pin pads on the lamp bead welding area; A signal line for signal transmission is provided between the lamp bead signal pad and the signal pin pad in the lamp bead welding area, and between the signal pin pads of each lamp bead welding area, so that the control signals for controlling the lighting and extinguishing of each LED lamp bead can be sequentially transmitted through each LED lamp bead; The metal sheet embedded in the first transparent layer electrically connects the electrode pin pads of the same polarity and the lamp bead power pads on the lamp bead welding area.

[0015] Optionally, the front transparent plate further includes a second transparent layer, and the first transparent layer is disposed on the lower side of the second transparent layer.

[0016] Optionally, the printed circuit layer is provided with N rows * M columns of lamp bead welding areas; M lamp bead signal pads are arranged on the printed circuit layer; the M lamp bead signal pads are sequentially connected in series with the signal pin pads in the N lamp bead welding areas in the same column through signal lines.

[0017] Optionally, M pairs of lamp bead power pads are arranged on the printed circuit layer, and each pair of lamp bead power pads includes a first lamp bead power pad and a second lamp bead power pad with opposite polarities; The electrode pin pad includes a first electrode pin pad and a second electrode pin pad, and a first extension portion is led out from the first electrode pin pad; a second extension portion is led out from the second electrode pin pad; The first extension portion of the first electrode pin pad on the N lamp bead welding areas in the same column is electrically connected to the first lamp bead power pad of the same polarity through a first metal sheet embedded in the first transparent layer; the second extension portion of the second electrode pin pad on the lamp bead welding in the same column is electrically connected to the second lamp bead power pad of the same polarity through a second metal sheet embedded in the first transparent layer.

[0018] Compared with the prior art, an LED light-emitting glass curtain wall provided by an embodiment of the present invention forms a chip mounting surface on the base, and pins are led out from the chip mounting surface. After being bent, the pins are attached to the top of the base, so that the power input and signal connection positions of the LED lamp beads are at the top of the base. Thus, when the LED lamp beads are installed on the LED light-emitting glass curtain wall, they can be closely attached to the front transparent plate of the LED light-emitting glass curtain wall, and the light emitted by the LED lamp beads can be more effectively transmitted through the front transparent plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a cross-sectional view of an LED lamp bead provided in the prior art; Figure 2 is a structural schematic diagram of an LED lamp bead provided in the prior art; Figure 3It is a schematic structural diagram of an LED light-emitting glass curtain wall made of existing LED lamp beads; Figure 4 It is a schematic structural diagram of an LED lamp bead provided by an embodiment of the present invention; Figure 5 It is a cross-sectional view of an LED lamp bead provided by an embodiment of the present invention; Figure 6 It is a top view of the base of an LED lamp bead provided by an embodiment of the present invention; Figure 7 It is a top view of a driving chip provided by an embodiment of the present invention; Figure 8 It is a top view of an LED lamp bead provided by an embodiment of the present invention; Figure 9 It is a schematic structural diagram of an LED light-emitting glass curtain wall made of the LED lamp beads provided by the present invention; Figure 10 It is a partial cross-sectional view when the LED lamp beads provided by the present invention are installed on the front transparent plate; Figure 11 It is a partial cross-sectional view after the LED lamp beads provided by the present invention are installed on the front transparent plate and sealed with glue; Figure 12 It is a top view schematic diagram of embedding metal sheets and printing printed circuit layers on the front transparent plate provided by the present invention; Figure 13 It is Figure 12 The enlarged schematic diagram at A in

[0020] The reference signs in the specification are as follows: 1’, front glass; 2’, back glass; 3’, light; 100, LED lamp bead; 200, mounting frame; 1, base; 2, driving chip; 3, light-emitting wafer; 10, chip mounting surface; 11, pin; 115, bending section; 116, connecting section; 21, signal input pin; 22, red pin; 23, negative pin; 24, positive pin; 25, blue pin; 26, signal output pin; 27, green pin; 31, first light-emitting wafer; 32, second light-emitting wafer; 33, third light-emitting wafer; 311, first electrode; 312, second electrode; 101, signal input pad; 102, anode pad; 103, signal output pad; 104, cathode pad; 105, isolation channel; 111, signal input pin; 112, negative pin; 113, signal output pin; 114, positive pin; 4. Metal sheet; 4a. First metal sheet; 4b. Second metal sheet; 5. Sealing glue layer; 6. Printed circuit layer; 61. Lamp bead soldering area; 62. Lamp bead power pad; 63. Lamp bead signal pad; 64. Signal line; 61a. First electrode pin pad; 61b. Second electrode pin pad; 61c. First signal input pin pad; 61d. First signal output pin pad; 611. Extension part; 611a. First extension part; 611b. Second extension part; 62a. First lamp bead power pad; 62b. Second lamp bead power pad; 64a. First printed line; 64b. Second printed line; 7. Front transparent plate; 71. Second transparent layer; 72. First transparent layer; 8. Back transparent plate; 9. Sealing filler. Detailed implementation manners

[0021] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] As Figure 4-5 shown, the LED lamp bead provided by the embodiment of the present invention includes a base 1, a driving chip 2 and a light-emitting wafer 3. The driving chip 2 and the light-emitting wafer 3 are installed on the base 1. A chip mounting surface 10 is formed on the base 1, and pins 11 are led out from the chip mounting surface 10. The pins 11 are bent and attached to the top of the base 1.

[0023] Compared with the prior art, the LED lamp bead provided by the embodiment of the present invention has a more reasonable design. By forming a chip mounting surface 10 on the base 1 and leading out pins 11 from the chip mounting surface 10, and the pins 11 are bent and attached to the top of the base 1, the power input and signal connection positions of the LED lamp bead are on the top of the base 1. Thus, when the LED lamp bead is installed on the LED light-emitting glass curtain wall, it can be closely attached to the front transparent plate 7 of the LED light-emitting glass curtain wall, and the light 3' emitted by the LED lamp bead can be more effectively transmitted through the front transparent plate 7.

[0024] In one embodiment, as Figure 8 shown, the light-emitting wafer 3 includes a first light-emitting wafer 31, a second light-emitting wafer 32 and a third light-emitting wafer 33.

[0025] The first light-emitting wafer 31 is a blue light-emitting wafer, the second light-emitting wafer 32 is a red light-emitting wafer, and the third light-emitting wafer 33 is a green light-emitting wafer; Its base 1 is as shown in Figure 5 and Figure 6 shown. A chip mounting surface 10 is formed on the base 1, and leads 11 are led out from the chip mounting surface 10. In the LED lamp bead of the TOP type structure in this example, the so-called TOP type structure refers to a structure that uses a PLCC (Chinese full name: Plastic Leaded Chip Carrier; English full name: Plastic Leaded Chip Carrier) plastic bracket as the base 1. The leads 11 of the PLCC plastic bracket packaging structure are bent inward at the top. Generally, it includes processes such as metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, and five-sided three-dimensional inkjet. Its core is to form the chip mounting surface 10 on the surface of the plastic bracket through a metal strip; and leads 11 extend from the chip mounting surface 10, as shown in Figure 5 shown. The leads 11 are led out from the chip mounting surface 10 and bent upward along the side wall of the base 1 to form a bent section 115, and the end of the bent section 115 is bent along the top wall of the base 1 to form a connection section 116 for external electrical connection. By bending the leads 11 and attaching them to the top of the base 1, the power input and signal connection positions of the LED lamp bead are at the top of the base 1. Thus, when the LED lamp bead is installed on the LED light-emitting glass curtain wall, it can be closely attached to the front transparent plate 7 of the LED light-emitting glass curtain wall (as shown in Figure 9 shown), and the light 3' emitted by the LED lamp bead can be more effectively transmitted through the front transparent plate 7.

[0026] Preferably, the base 1 is a cup-shaped base, and the light 3' emitted by the light-emitting wafer 3 can be emitted from the top of the cup-shaped base. This structure can enable the LED lamp bead to emit light better.

[0027] Preferably, a groove is provided on the base 1, and the bent section 115 and the connection section 116 are embedded in the groove to better fix the leads 11, making the LED lamp bead more stable and reliable when connected to the outside.

[0028] Preferably, the upper surface of the connection section 116 is higher than the top surface of the base 1 to facilitate external electrical connection (in this example, it is convenient to be electrically connected to the printed circuit layer on the LED light-emitting glass curtain wall), making the electrical connection more reliable.

[0029] In an embodiment, as shown in Figure 6As shown, the chip mounting surface 10 includes isolation channels 105 and pads isolated from each other by the isolation channels 105; pins 11 are led out from the pads; in this example, the pads are actually metal sheets of the same material as the pins. The metal sheets are stamped and the vacant places are filled with injection molding to form the isolation channels 105. The isolation channels 105 are actually insulating plastic materials that separate the pins and at the same time play the role of fixing the base. Specifically, the pads include electrode pads and signal pads; the electrode pads include a cathode pad 104 and an anode pad 102; the signal pads include a signal input pad 101 and a signal output pad 103; the pins 11 include electrode pins and signal pins. The electrode pins are electrically connected to the electrode pads, and the signal pins are electrically connected to the signal pads; among them, the electrode pins include a positive electrode pin 114 and a negative electrode pin 112; the signal pins include a signal input pin 111 and a signal output pin 113; the positive electrode pin 114 is led out from the cathode pad 104; the negative electrode pin 112 is led out from the anode pad 102. The signal input pin 111 is led out from the signal input pad 101, and the signal output pin 113 is led out from the signal output pad 103. The isolation channels 105 separate the above-mentioned cathode pad 104, anode pad 102, signal input pad 101 and signal output pad 103. There is only one interval between two adjacent pads, and this design greatly reduces the complexity of the design of the base 1. The overall external dimensions of the base 1 can be made smaller and more compact.

[0030] The driving chip 2 is as Figure 7As shown, the driving chip 2 is well-known to the public. Generally, a driving circuit is integrated inside the driving chip 2, and a passivation layer is provided on the driving chip 2. The passivation layer is a surface insulating layer formed during the manufacturing of the driving chip 2. A number of pins (or terminals) are provided on the driving chip 2, and the pins on the driving chip 2 are electrically connected to the chip mounting surface 10 and the light-emitting wafers 3 by direct soldering or by bonding wires. The pins (English name: PAD) are generally provided on the passivation layer, and the pins are terminals inside the chip. The pins include signal pins, electrode pins, and color control pins; among them, the signal pins are used to input control signals. Preferably, they are generally also used to transmit control signals to the lower-level LED lamp beads. Therefore, the signal pins generally include a signal input pin 21 and a signal output pin 26; the number of the signal input pin 21 and the signal output pin 26 can vary according to the actual application scenario. For example, in some scenarios, there may be only one signal input pin 21, and in some scenarios, 2 signal input pins 21 are required; the electrode pins are used to connect to the electrode pins on the base 1 to provide power for the driving chip 2; in this example, the electrode pins include a positive electrode pin 24 and a negative electrode pin 23, and for the convenience of connection, the number of the electrode pins can be multiple and are arranged at different positions to facilitate electrical connection to the light-emitting wafers 3 or the pins 11 on the base 1. At the same time, the color control pins provided on the driving chip 2 are used to connect to one of the electrodes on the light-emitting wafer 3, such as named the first electrode 311 (cathode or anode), and the other electrode of the light-emitting wafer 3, such as named the second electrode 312 (this electrode is a common anode or common cathode) is connected to one of the pins 11 on the base 1 (the polarity of this pin 11 is the same as the polarity of the second electrode 312) or to a certain electrode pin on the driving chip 2 (the polarity of this electrode pin is the same as the polarity of the second electrode 312). After the driving chip 2 inputs a control signal through the signal input pin 21, the internal driving circuit processes it and outputs a current value or controls the current ratio to each light-emitting wafer 3. The internal driving circuit adjusts the output current of each control pin, so as to keep the light-emitting intensity of each light-emitting wafer 3 within the corresponding preset range.

[0031] In this example, as Figure 7 and Figure 8As shown, the color control pins include a red pin 22, a blue pin 25, and a green pin 27. The first light-emitting chip 31 is a blue light-emitting chip, the second light-emitting chip 32 is a red light-emitting chip, and the third light-emitting chip 33 is a green light-emitting chip. Among them, the red pin 22 is electrically connected to the first electrode 311 of the red light-emitting chip; the green pin 27 is electrically connected to the first electrode 311 of the green light-emitting chip; the blue pin 25 is electrically connected to the first electrode 311 of the blue light-emitting chip; the second electrodes 312 of the red light-emitting chip, the green light-emitting chip, and the red light-emitting chip are all connected to the same electrode pad on the base 1, so that the red light-emitting chip, the green light-emitting chip, and the red light-emitting chip form a common cathode or common anode circuit structure.

[0032] The signal pad and the electrode pad are electrically connected to the driving chip 2. Specifically, the signal pins on the driving chip 2 are electrically connected to the signal pads on the base 1; the electrode pins on the driving chip 2 are electrically connected to the electrode pads on the base 1; More specifically, the positive pin 24 on the driving chip 2 is electrically connected to the cathode pad 104 on the base 1, and the negative pin 23 is electrically connected to the anode pad 102 on the base 1.

[0033] Among them, the electrical connection between the driving chip 2, the light-emitting chip 3, and the chip mounting surface 10 on the base 1 can be a direct welding electrical connection or a bonding connection through a bonding wire.

[0034] Of course, the LED lamp bead is also encapsulated with a transparent adhesive layer, which is well known to the public. For example, epoxy resin and silicone are used as the transparent glue for encapsulation. Details are not described herein.

[0035] In an embodiment, as Figure 6 and Figure 8 shown, the signal input pad 101 and the cathode pad 104 are arranged on one side of the anode pad 102, and the signal output pad 103 is arranged on the other side of the anode pad 102; The driving chip 2, the first light-emitting chip 31 (blue light-emitting chip), and the second light-emitting chip 32 (red light-emitting chip) are mounted on the upper part of the anode pad 102; the third light-emitting chip 33 (green light-emitting chip) is mounted on the signal input pad 101. This makes the structure more compact.

[0036] Among them, the first light-emitting chip 31 uses a blue light-emitting chip. Since both electrodes of the blue light-emitting chip are arranged on the upper surface of the blue light-emitting chip, it is electrically connected to the corresponding blue pin 25 and the anode pad 102 on the driving chip 2 by means of bonding wires. Among them, the first electrode 311 of the first light-emitting chip 31 is bound and connected to the blue pin 25 by a bonding wire, and the second electrode 312 is bound and connected to the anode pad 102 by a bonding wire.

[0037] The second light-emitting chip 32 is a red light-emitting chip. Since the two electrodes of the red light-emitting chip are respectively arranged on its upper and lower surfaces, the second electrode of the red light-emitting chip is directly welded to the anode pad 102 by silver paste, and the first electrode 311 is connected to the red pin 22 of the driving chip 2 by a bonding wire.

[0038] The third light-emitting chip 33 is a green light-emitting chip. Since the two electrodes of the green light-emitting chip are arranged on one of its surfaces, after the green light-emitting chip is bonded to the signal input pad 101 by means of adhesion, it needs to be connected to the green pin 27 and the anode pad 102 on the driving chip 2 by bonding wires respectively. Specifically, the first electrode 311 of the third light-emitting chip 33 is bound and connected to the green pin 27 on the driving chip 2 by a bonding wire, and the second electrode 312 is bound and connected to the anode pad 102 on the base 1 by a bonding wire. Among them, the bonding wires usually include gold wires, copper wires, palladium-coated copper wires, and alloy wires, etc.

[0039] Preferably, in order to further reduce the size of the LED lamp bead, the blue light-emitting chip can be placed above the driving chip 2 because the volume of blue light is the smallest under the condition of white balance ratio, and it is most suitable to install the blue light-emitting chip on the driving chip 2, which will occupy a smaller area of the driving chip 2, and the size of the driving chip 2 can be made smaller. And because the current of the blue light-emitting chip is the smallest, the heat generated when placed on the driving chip 2 is the smallest. The red light-emitting chip and the green light-emitting chip have large currents and large heat generation, and placing them on the base is more conducive to heat conduction and heat dissipation.

[0040] The specific structures of the front transparent plate 7 of the LED light-emitting glass curtain wall for installing the LED lamp beads of the present invention and the printed circuit layer 6 thereon will be specifically described below: Among them, the LED light-emitting glass curtain wall includes a front transparent plate 7, a back transparent plate 8, and the LED lamp beads 100 of the present invention; a printed circuit layer 6 is arranged on the front transparent plate 7; an installation space for accommodating the LED lamp beads is formed between the front transparent plate 7 and the back transparent plate 8; the pins 11 of the LED lamp beads are electrically connected to the printed circuit layer 6 and the base 1 is installed on the front transparent plate 7; the light-emitting surface of the LED lamp beads faces the front transparent plate 7. The LED lamp beads of the present invention can be installed in a more suitable position on the LED light-emitting glass curtain wall, so that a better lighting effect can be presented on the front transparent plate 7 of the LED light-emitting glass curtain wall. A chip installation surface 10 is formed on the base 1, and pins 11 are led out from the chip installation surface 10. The pins 11 are bent and pasted on the top of the base 1, so that the positions of power input and signal connection of the LED lamp beads 100 are on the top of the base 1. Therefore, when the LED lamp beads 100 are installed on the LED light-emitting glass curtain wall, they can be closely attached to the front transparent plate 7 of the LED light-emitting glass curtain wall, so that the light emitted by the LED lamp beads 100 can be more effectively transmitted through the front transparent plate 7. Among them, the front transparent plate 7 can be made of glass, and copper is directly plated on the glass to form the printed circuit layer 6, that is, copper is plated on the glass through UV curing technology, so as to form the printed circuit layer 6 on the glass.

[0041] Preferably, as Figure 10-12 shown, the front transparent plate 7 includes a first transparent layer 72; A metal sheet 4 is embedded in the first transparent layer 72; the printed circuit layer 6 is arranged on the first transparent layer 72; the printed circuit layer 6 includes a lamp bead power supply pad 62, a lamp bead signal pad 63, and a lamp bead soldering area 61 for installing the LED lamp beads 100 arranged in an array; A pin soldering pad corresponding to the pin 11 of the LED lamp bead 100 is provided on each lamp bead soldering area 61; the pin soldering pad includes a signal pin soldering pad and an electrode pin soldering pad; the electrode pin of the LED lamp bead 100 is electrically connected to the electrode pin soldering pad on the lamp bead soldering area 61, and the signal pin of the LED lamp bead 100 is electrically connected to the signal pin soldering pad on the lamp bead soldering area 61.

[0042] A signal line 64 for signal transmission is provided between the lamp bead signal pad 63 and the signal pin pads in the lamp bead soldering area 61, and between the signal pin pads of each lamp bead soldering area 61, so that the control signals for controlling the lighting and extinguishing of each LED lamp bead 100 can be sequentially transmitted through each LED lamp bead 100. Specifically, for example, a signal line 64 for signal transmission is provided between the lamp bead signal pad 63 and the signal pin pads in the lamp bead soldering area 61, and between the signal pin pads of adjacent lamp bead soldering areas 61 in the same row or the same column. However, it is not limited that the adjacent LED lamp beads 100 must be connected through the signal line 64. For example, the LED lamp bead 100 at the end of the same column can be connected to the LED lamp bead at the head of its adjacent column through the signal line 64, etc., which are all possible.

[0043] The metal sheet 4 embedded in the first transparent layer 72 electrically connects the electrode pin pads of the same polarity on the lamp bead soldering area 61 and the lamp bead power supply pad 62.

[0044] As a preferred method, this example preferably includes a second transparent layer 71, and the first transparent layer 72 is arranged on the lower side of the second transparent layer 71.

[0045] The form of the metal sheet 4 is not particularly limited. For example, the cross-section of the metal sheet 4 includes a circle, a semi-circle, a triangle, an ellipse, a quadrilateral or other regular or irregular polygons. By this method, the width and height of the metal sheet 4 can be effectively adjusted to make the width relatively small and the height increased. On the one hand, it can ensure its power supply requirements, and at the same time, it will not affect the overall transparency effect of the front transparent plate 7. In this example, the cross-section of the metal sheet 4 is a quadrilateral, wherein the width of the metal sheet 4 is 0.1 - 1 mm, and the height is 1 - 3 mm. Within this size range, the power supply requirements of the entire column of LED lamp beads 100 can be more ideally met, and its conductivity is many times stronger than that of other transparent conductive materials. At the same time, the blockage of the line of sight is relatively small, and a very high transparency can be ensured. For example, specifically, in this example, the width of the metal sheet 4 is 0.3 mm, the height is 2 mm, and its cross-sectional area is 0.6 mm2, which is equivalent to a copper wire with a diameter of 1.6 mm and has a strong conductivity. Regarding the metal sheet 4, its material, etc. are not limited, as long as its conductivity meets the requirements. Usually, a metal with a high conductivity is preferably used. In this example, a copper sheet is preferably used.

[0046] In this example, taking Figure 10 the perspective as a reference, the lower end surface of the metal sheet 4 is in the same plane as the lower plane of the first transparent layer 72, or the lower end surface of the metal sheet 4 is slightly higher than this lower plane. Of course, it is preferred that the lower end surface of the metal sheet 4 is parallel to the lower plane of the first transparent layer 72. Because it is better to implement in terms of technology and it is easy to achieve its consistency and stability.

[0047] By using the method of power supply with the metal sheet 4 provided in this example, the size of the LED lamp beads 100 can be further reduced, and the gap between the LED lamp beads 100 can be decreased. For example, the length of the LED lamp beads is 1 - 5 mm, and the width is 1 - 5 mm. The gap between the LED lamp beads 100 is 3 - 10 mm. The gap mentioned here refers to the distance between the centers of adjacent LED lamp beads 100. For example, in this example, the gap between the LED lamp beads 100 can be 5 mm.

[0048] The second transparent layer 71 can be made of various rigid or flexible materials known to the public. For example, the second transparent layer 71 can be a glass substrate, a PET (English name: Polyethylene terephthalate, Chinese name: Polyethylene terephthalate) substrate, a transparent PI (English name: polyimide, Chinese name: polyimide) film, etc.

[0049] The first transparent layer 72 is usually a transparent layer obtained by casting and hardening a transparent material. The metal sheet 4 is added during the casting process, and the arrangement of the metal sheet 4 is carried out according to requirements, so that the subsequent formed printed circuit layer 6 is electrically connected to it. The transparent material can be, for example, epoxy resin, PET (English name: Polyethyleneterephthalate, Chinese name: Polyethylene terephthalate), acrylic (Chinese full name: polymethyl methacrylate; English full name: Polymeric Methyl Methacrylate; abbreviation: PMMA), silicone, etc.

[0050] As Figure 12 and Figure 13 shown, the lamp bead power supply pad 62 mentioned in this example is used to connect to the external DC power supply, and the DC power supply is connected to each LED lamp bead 100 through the lamp bead power supply pad 62 by the metal sheet 4 mentioned in this application; it includes a first lamp bead power supply pad 62a and a second lamp bead power supply pad 62b with opposite polarities; for example, in this example, the first lamp bead power supply pad 62a is the positive electrode pad; the second lamp bead power supply pad 62b is the negative electrode pad.

[0051] The LED signal pad 63 is used to connect to an external signal input source, which is usually connected to the control chip of the previous stage; the number of the LED signal pads 63 is not specifically limited. For example, there is only one LED signal pad 63, and a control signal is input through one LED signal pad 63, and then the control signal is sequentially transmitted to each series-connected LED lamp bead 100 through the signal line 64. Of course, it can also be set according to the number of I / O ports on the control chip. For example, it is allowed that the LED lamp beads 100 in the same row or the same column use the same LED signal pad 63, or the LED lamp beads 100 in multiple rows or multiple columns use the same LED signal pad 63.

[0052] Regarding the signal line 64 defined here, it can be a printed signal line printed on the first transparent layer 72. The printed signal line can be an ITO (Chinese full name: indium tin oxide; English full name: Indium Tin Oxides) line, a silver paste line, a copper clad wire, etc. In this example, it is a grid-shaped copper clad wire printed on the first transparent layer 72. Or it can be a fly wire network formed by using a metal wire to machine-wire point-to-point. Similarly, the pads and the epitaxial part 611 on the printed circuit layer 6 can also be made by using a transparent conductive material for printed circuit manufacturing, such as a metal grid, ITO, nano silver, etc.

[0053] As Figure 11 shown, after the LED lamp beads 100 are soldered to the corresponding lamp bead soldering areas 61 on the printed circuit layer 6 through surface mount technology, a sealing glue layer 5 will be integrally encapsulated on its surface. Further, according to needs, a back transparent plate 8 can also be provided on the sealing glue layer 5. And wire harnesses are led out from the lamp bead power pad 62 and the LED signal pad 63, and sealed and encapsulated at the edge between the back transparent plate 8 and the front transparent plate 7 to achieve a waterproof effect. For example, as Figure 9 shown, a sealing filler 9 can be provided at the edge between the back transparent plate 8 and the front transparent plate 7. Preferably, after filling the sealing filler 9, a mounting frame 200 is provided at the edge of the LED light-emitting glass curtain wall to further strengthen the connection between the back transparent plate 8 and the front transparent plate 7.

[0054] Among them, the sealing glue layer 5 can be obtained by pouring and hardening a certain transparent material. For example, it can be made of epoxy resin, transparent silica gel or other transparent materials. The back transparent plate 8 is generally made of a glass cover plate or a transparent component made of a replaceable printed plastic material. Covering the sealing glue layer 5 on the first transparent layer 72 and then covering the back transparent plate 8 can ensure good airtightness and is not easy to let water vapor invade and cause the LED lamp beads 100 to fail.

[0055] Next, the connection method between the metal sheet 4 and the printed circuit line will be further explained in combination with specific preferred embodiments.

[0056] As shown in Figure 12 and Figure 13 shown, there are N rows * M columns of lamp bead soldering pads 61 provided on the printed circuit layer 6; There are M lamp bead signal pads 63 arranged on the printed circuit layer 6; the M lamp bead signal pads 63 are sequentially connected in series through signal lines 64 between the signal pin pads in the N lamp bead soldering pads 61 in the same column as them. The signal pin pads on each lamp bead soldering pad 61 at least include a first signal input pin pad 61c and a first signal output pin pad 61d. Specifically, the M lamp bead signal pads 63 are sequentially connected in series through signal lines 64 between the first signal input pin pads 61c and the first signal output pin pads 61d in the N lamp bead soldering pads 61 in the same column as them.

[0057] As an example, assume N = 5; M = 5; in this example, 5 * 5 lamp bead soldering pads 61 are printed on the first transparent layer 72. To enable those skilled in the art to understand the inventive concept of the present invention, the columns formed by the lamp bead soldering pads 61 in the same row are called soldering rows; the columns formed by the lamp bead soldering pads 61 in the same column are called soldering columns.

[0058] In this example, there are 5 lamp bead signal pads 63 arranged on the printed circuit layer 6; the 5 lamp bead signal pads 63 are sequentially connected in series through signal lines 64 between the signal pin pads in the 5 lamp bead soldering pads 61 in the same column as them; specifically, a first signal input pin pad 61c and a first signal output pin pad 61d are provided in the lamp bead soldering pad 61; for the series connection, the lamp bead signal pad 63 in the corresponding column is connected to the first signal input pin pad 61c in the first lamp bead soldering pad 61 in this column through a signal line 64 (in this example, this signal line 64 is called the first printed line 64a); then the first signal output pin pad 61d in the first lamp bead soldering pad 61 is connected to the first signal input pin pad 61c in the second lamp bead soldering pad 61 in the same column through a signal line 64 (the signal line 64 in the adjacent lamp bead soldering pad 61 in this example is called the second printed line 64b), and the 3rd, 4th, and 5th lamp bead soldering pads 61 are connected in series in this way. Of course, the series connection method is not necessarily limited to the same row or the same column. The signal lines 64 in this example are all in a grid form, which can further increase the transparency of the LED light-emitting glass curtain wall. Among them, the first signal input pin pad 61c is electrically connected to the signal input pin 111 of the LED lamp bead, and the first signal output pin pad 61d is electrically connected to the signal output pin 113 of the LED lamp bead.

[0059] In one embodiment, there are M pairs of lamp bead power pads 62 arranged on the printed circuit layer 6, and each pair of the lamp bead power pads 62 includes a first lamp bead power pad 62a and a second lamp bead power pad 62b with opposite polarities; In this example, as Figure 12 and Figure 13 shown, 5 pairs of LED power pads 62 are arranged on the printed circuit layer 6; each pair of the LED power pads 62 includes a first LED power pad 62a and a second LED power pad 62b with opposite polarities; As Figure 13 shown, the electrode pin pads in each LED soldering area 61 include a first electrode pin pad 61a and a second electrode pin pad 61b; a first extension 611a extends from the first electrode pin pad 61a; a second extension 611b extends from the second electrode pin pad 61b; the first extensions 611a of the first electrode pin pads 61a on N LED soldering areas 61 in the same column are electrically connected to the first LED power pads 62a with the same polarity through a first metal sheet 4a embedded in the first transparent layer 72; the second extensions 611b of the second electrode pin pads 61b on the LED soldering areas 61 in the same column are electrically connected to the second LED power pads 62b with the same polarity through a second metal sheet 4b embedded in the first transparent layer 72.

[0060] In this example, the first extensions 611a of the first electrode pin pads 61a on 5 LED soldering areas 61 in the same column are welded and electrically connected to the first LED power pads 62a with the same polarity through a first metal sheet 4a; the second extensions 611b of the second electrode pin pads 61b on the LED soldering areas 61 in the same column are welded and electrically connected to the second LED power pads 62b with the same polarity through a second metal sheet 4b. Among them, the first electrode pin pad 61a and the second electrode pin pad 61b are used to be electrically connected to the electrode pins of the LED lamp beads, so as to provide power for the LED lamp beads, and the polarities of the first electrode pin pad 61a and the second electrode pin pad 61b correspond to the polarities of the electrode pins of the LED lamp beads.

[0061] After the LED lamp beads 100 are installed on the printed circuit layer 6, they are electrically connected to the extensions 611 extending from the electrode pin pads on the LED soldering areas 61 through the metal sheets 4 and the LED power pads 62, and the current is electrically connected from the electrode pins of the LED lamp beads 100 through the electrode pin pads to form a power supply loop. At the same time, the control signals flowing in from the LED signal pads 63 flow through each series-connected LED lamp bead 100 in turn, are received by the previous LED lamp bead 100 and transmitted to the next LED lamp bead 100. To realize the on / off and color change control of the light-emitting wafers 3 on each LED lamp bead 100.

[0062] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An LED light-emitting glass curtain wall, which comprises a front transparent plate, a back transparent plate and LED lamp beads, and is characterized in that, A printed circuit layer is arranged on the front transparent plate, and an installation space for accommodating the LED lamp beads is formed between the front transparent plate and the back transparent plate; The LED lamp bead includes a base and a light-emitting wafer. The light-emitting wafer is installed on the base. A chip installation surface is formed on the base, and leads are led out from the chip installation surface. The leads are bent and attached to the top of the base; The leads of the LED lamp bead are electrically connected to the printed circuit layer, and the LED lamp bead is installed on the front transparent plate through the base.

2. The LED light-emitting glass curtain wall according to claim 1, characterized in that, The leads of the LED lamp bead are led out from the chip installation surface and bent upward along the side wall of the base to form a bent section, and the end of the bent section is bent along the top wall of the base to form a connection section for electrically connecting to the printed circuit layer.

3. The LED light-emitting glass curtain wall according to claim 2, wherein A groove is provided on the base, and the bent section and the connection section are embedded in the groove; The upper surface of the connection section is higher than the top surface of the base.

4. The LED light-emitting glass curtain wall according to claim 1, characterized in that, The LED lamp bead further includes a driving chip, and the driving chip is installed on the base; the chip installation surface includes isolation channels and electrode pads and signal pads isolated from each other through the isolation channels; The electrode pads include a cathode pad and an anode pad; the signal pads include a signal input pad and a signal output pad; the signal pads and the electrode pads are electrically connected to the driving chip.

5. The LED light-emitting glass curtain wall according to claim 4, wherein A plurality of pins are provided on the driving chip, and the pins on the driving chip are electrically connected to the chip installation surface and the light-emitting wafer through direct soldering or bonding wires; The pins include signal pins, electrode pins, and color control pins; the signal pins include a signal input pin and a signal output pin; The leads of the LED lamp bead include electrode leads and signal leads; the electrode leads are electrically connected to the electrode pads, and the signal leads are electrically connected to the signal pads; The signal pins on the driving chip are electrically connected to the signal pads on the base; the electrode pins on the driving chip are electrically connected to the electrode pads on the base; The light-emitting wafer includes a first electrode and a second electrode; the first electrode is used to be electrically connected to the color control pin on the driving chip; the second electrode is used to be electrically connected to a certain electrode pin on the driving chip or a certain electrode pad on the base.

6. The LED light-emitting glass curtain wall according to claim 5, wherein, The light-emitting wafer includes a first light-emitting wafer, a second light-emitting wafer, and a third light-emitting wafer; The first light-emitting wafer is a blue light-emitting wafer, the second light-emitting wafer is a red light-emitting wafer, and the third light-emitting wafer is a green light-emitting wafer; The signal input pad and the cathode pad are arranged on one side of the anode pad, and the signal output pad is arranged on the other side of the anode pad; The driving chip, the first light-emitting wafer, and the second light-emitting wafer are installed above the anode pad; the third light-emitting wafer is installed on the signal input pad.

7. The LED light-emitting glass curtain wall according to claim 5, characterized in that The front transparent plate includes a first transparent layer, in which a metal sheet is embedded, and a printed circuit layer is disposed on the first transparent layer; the printed circuit layer includes a lamp bead power pad, a lamp bead signal pad, and lamp bead pads for mounting LED lamp beads arranged in an array, wherein the lamp bead power pad is used to connect to an external power supply, and the lamp bead signal pad is used to connect to an external signal input source; Each of the lamp bead pads is provided with a pin pad corresponding to the pins of the LED lamp bead, and the pin pad includes a signal pin pad and an electrode pin pad; the electrode pins of the LED lamp bead are electrically connected to the electrode pin pads on the lamp bead pads, and the signal pins of the LED lamp bead are electrically connected to the signal pin pads on the lamp bead pads; Signal lines for signal transmission are provided between the lamp bead signal pad and the signal pin pads in the lamp bead pads, and between the signal pin pads of each of the lamp bead pads, so that control signals for controlling the lighting and extinguishing of each LED lamp bead can be sequentially transmitted through each LED lamp bead; The metal sheet embedded in the first transparent layer electrically connects the electrode pin pads of the same polarity on the lamp bead pads and the lamp bead power pad.

8. The LED light-emitting glass curtain wall according to claim 7, wherein The front transparent plate further includes a second transparent layer, and the first transparent layer is disposed on the lower side of the second transparent layer.

9. The LED light-emitting glass curtain wall according to claim 7, wherein, There are N rows * M columns of lamp bead pads on the printed circuit layer; M lamp bead signal pads are arranged on the printed circuit layer; the M lamp bead signal pads are sequentially connected in series through signal lines to the signal pin pads in the N lamp bead pads in the same column.

10. The LED light-emitting glass curtain wall according to claim 9, characterized in that, M pairs of lamp bead power pads are arranged on the printed circuit layer, and each pair of lamp bead power pads includes a first lamp bead power pad and a second lamp bead power pad with opposite polarities; The electrode pin pad includes a first electrode pin pad and a second electrode pin pad, and a first extension portion is led out from the first electrode pin pad; a second extension portion is led out from the second electrode pin pad; The first extension portions of the first electrode pin pads on the N lamp bead pads in the same column are electrically connected to the first lamp bead power pads of the same polarity through a first metal sheet embedded in the first transparent layer; the second extension portions of the second electrode pin pads on the N lamp bead pads in the same column are electrically connected to the second lamp bead power pads of the same polarity through a second metal sheet embedded in the first transparent layer.

Images