System on chip

Abstract

According to the system on chip based on the printed board and the processing technology thereof, the waveguide and horn antenna structure is designed based on the printed board, integrated design with other planar circuits is facilitated, and the system integration degree is improved; the on-chip system with the transceiving function based on the rectangular waveguide and the horn antenna has the advantages of being low in cost, excellent in performance, high in integration level and the like.

Description

[0001] This application is a divisional application with application number 202310096830.8, application date 2023.01.17, and invention name “A rectangular waveguide, horn antenna and on-chip system”. Technical Field

[0002] The present invention relates to the technical field of millimeter wave wireless communication, and in particular to a system on chip. Background Art

[0003] At millimeter wave frequencies, compared to microstrip transmission lines, rectangular waveguides are widely used in communication, radar, remote sensing, electronic countermeasures, and measurement systems due to their advantages such as lower transmission loss, higher power capacity, and no radiation loss. Similarly, compared to microstrip antennas, rectangular waveguide-fed horn antennas have wider operating bandwidth, higher radiation efficiency, and a smoother directional pattern, which are beneficial for improving the performance of wireless communication systems. For example, the use of rectangular waveguide-fed horn antennas in satellite communications can improve communication quality, and the use of rectangular waveguide-fed horn antennas in radar systems can improve resolution and detection distance.

[0004] For millimeter wave frequencies, due to their short operating wavelengths, traditional metal rectangular waveguide transmission lines and metal horn antennas require very strict processing accuracy control during processing and manufacturing, and often require mold opening, which will directly lead to increased production costs.

[0005] In addition, metal-made waveguide circuits and horn antennas usually require some switching structures to be integrated with other planar circuits in the form of printed circuit boards, which not only introduces additional losses, but is also not conducive to the miniaturization of the system and cannot meet the needs of increasingly miniaturized wireless communication terminals. Summary of the invention

[0006] The object of the present invention is to provide a system on chip that realizes an integrated system on chip with transceiver functions and a compact structure and low loss.

[0007] In order to solve the above-mentioned invention object, the present invention provides a system on chip, including: a radio frequency front-end module, a digital processing module and a power integrated circuit module;

[0008] The radio frequency front-end module comprises: at least one horn antenna unit, a waveguide transition structure, a radio frequency integrated circuit package chip and a lumped parameter element, wherein the package output of the radio frequency integrated circuit package chip is in the form of a waveguide output;

[0009] The digital processing module includes: a digital processing integrated circuit and a digital interface integrated circuit;

[0010] The digital processing integrated circuit is connected to the radio frequency integrated circuit packaging chip;

[0011] The power integrated circuit module is used to supply power to and perform voltage conversion on the radio frequency front-end module and the digital processing module.

[0012] Optionally, it further includes an external clock module for generating a clock signal to provide a reference source for the system.

[0013] Optionally, the waveguide transition structure includes: a rectangular waveguide for vertical transmission and a rectangular waveguide for horizontal transmission;

[0014] One end of the rectangular waveguide for vertical transmission is connected to the waveguide output port of the radio frequency integrated circuit packaging chip, and the other end is connected to one end of the rectangular waveguide for horizontal transmission. The other end of the rectangular waveguide for horizontal transmission is connected to the feeding end of the horn antenna unit.

[0015] Optionally, the radio frequency integrated circuit packaging chip, the lumped parameter element, the digital processing integrated circuit, the digital interface integrated circuit, the power integrated circuit module, and the external clock module are distributed on the upper surface of the sixth printed circuit board;

[0016] The rectangular waveguide for horizontal transmission is formed on the seventh printed circuit board, and the horn antenna unit is formed on the eighth printed circuit board;

[0017] The seventh printed circuit board is below the sixth printed circuit board, and the eighth printed circuit board is below the seventh printed circuit board.

[0018] Optionally, the horn antenna unit includes one or a combination of rectangular waveguides with different cross-sectional dimensions. The rectangular waveguide includes a printed circuit board with metal layers on its upper and lower surfaces.

[0019] Optionally, a through groove is opened on the printed circuit board. The four walls of the through groove are plated with metal layers, and the through groove is filled with air.

[0020] Optionally, the printed circuit board of the rectangular waveguide includes upper, middle, and lower layers. The lower surface of the upper layer printed circuit board is covered with a metal layer. The through groove is opened on the middle layer printed circuit board, and the two side walls of the through groove parallel to the electromagnetic wave propagation direction are plated with the metal layer. The upper surface of the lower layer printed circuit board is covered with the metal layer;

[0021] A plurality of through holes are provided around the through groove;

[0022] The through groove is provided with a corner, and the corner includes an oblique angle or a plurality of stepped right angles.

[0023] Optionally, the cross-sectional dimensions of the multiple combined rectangular waveguides gradually decrease from the horn radiation port direction to the feed port; the multiple combined rectangular waveguides are oppositely arranged and penetrate through to form a stepped metal cavity; a metal layer is deposited on the lower surface area of the rectangular waveguide with a small cross-sectional dimension located within the through slot of the rectangular waveguide with a large cross-sectional dimension.

[0024] Optionally, a plurality of through holes are provided around the stepped metal cavity, the inner walls of the through holes are plated with a metal layer, and the interior is filled with resin.

[0025] Optionally, metal layers are covered on the outer four walls of the horn antenna unit.

[0026] Compared with the prior art, the on-chip system with transceiver functions provided by the present invention based on rectangular waveguides and horn antennas has the advantages of low cost, excellent performance, high integration, etc. Description of the Drawings

[0027] Figure 1 is a schematic diagram of the rectangular waveguide structure for horizontal direction transmission in Embodiment 1 of the present invention;

[0028] Figure 2 is Figure 1 the cross-sectional view along the A-A direction in

[0029] Figure 3 is a schematic diagram of the rectangular waveguide structure for multi-degree-of-freedom transmission in the horizontal direction in Embodiment 1 of the present invention;

[0030] Figure 4 is Figure 3 a schematic diagram of the rectangular waveguide structure with the topmost printed circuit board removed;

[0031] Figure 5 is a schematic diagram of the rectangular waveguide structure for vertical direction transmission in Embodiment 1 of the present invention;

[0032] Figure 6 is a comparison diagram of the simulation results of the rectangular waveguide of the present invention and the traditional metal rectangular waveguide in Embodiment 1 of the present invention;

[0033] Figure 7 is a schematic diagram of the horn antenna structure based on a printed circuit board in Embodiment 2 of the present invention;

[0034] Figure 8 is Figure 7 the cross-sectional view along the B-B direction in

[0035] Figure 9 is a bottom view of the horn antenna based on a printed circuit board in Embodiment 2 of the present invention;

[0036] Figure 10 is the return loss of the horn antenna based on a printed circuit board in Embodiment 2 of the present invention;

[0037] Figure 11 It is the radiation pattern of the horn antenna based on the printed circuit board in the second embodiment of the present invention;

[0038] Figure 12 It is the gain comparison diagram between the horn antenna based on the printed circuit board and the metal horn antenna in the second embodiment of the present invention;

[0039] Figure 13 It is the block diagram of the system-on-chip in the third embodiment of the present invention;

[0040] Figure 14 It is the schematic diagram of the structure of the system-on-chip in the third embodiment of the present invention;

[0041] Figure 15 It is the schematic diagram of the interconnection structure between an output port of the packaged chip and the horn antenna unit in the third embodiment of the present invention. Detailed implementation manners

[0042] The present invention will be described in more detail below with reference to the schematic diagrams, in which the preferred embodiments of the present invention are shown. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description should be understood as a broad guidance for those skilled in the art and not as a limitation on the present invention.

[0043] In the following paragraphs, the present invention will be described more specifically by way of example with reference to the accompanying drawings. The advantages and features of the present invention will be clearer according to the following description and the claims. It should be noted that the drawings are all in very simplified forms and use non-precise scales, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0044] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. can be based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0045] A regular metallic rectangular waveguide refers to a straight hollow metallic tube with a rectangular cross-section. Its cross-sectional shape and dimensions, the structural material of the tube wall (usually metals such as copper and aluminum, and sometimes gold or silver is plated on its wall), and the medium filling situation inside the tube (usually air medium) do not change along its tube axis direction. It completely confines the guided electromagnetic wave within the metallic tube and propagates along its axial direction. Since it has only one conductor and cannot propagate TEM guided waves, the propagation modes can be divided into two major categories: transverse electric (TE) guided waves and transverse magnetic (TM) guided waves, and there are infinitely many modes. Each guided mode has a corresponding cut-off wavelength λc (or cut-off frequency fc). Only when the condition λc > λ (λ is the operating wavelength) or fc < f (f is the operating frequency) is satisfied can it be transmitted.

[0046] In actual use, a rectangular waveguide almost always operates in the dominant mode TE10 mode (the guided mode with the longest cut-off wavelength λc or the lowest cut-off frequency fc). Considering conditions such as suppressing higher-order modes, having low transmission loss, and large power capacity, the cross-sectional dimensions of a rectangular waveguide are generally selected as the wide side a = 0.7λ and the narrow side b = (0.4 - 0.5)a. After the waveguide dimensions are determined, its operating frequency range can be determined. To ensure low loss and no higher-order modes, its operating frequency range is taken as 1.25 - 1.9 times the cut-off frequency of the dominant mode.

[0047] The loss of a rectangular waveguide mainly consists of the loss of the uniformly filled medium in the waveguide and the conductor loss. Therefore, using air medium filling and a metallic rectangular waveguide with excellent conductive characteristics has very low transmission loss.

[0048] When an electromagnetic wave signal is transmitted in the waveguide, induced current will be generated on the inner wall surface of the metallic waveguide, which is called wall current. At millimeter-wave frequencies, the skin effect will cause this wall current to flow concentrated on a very thin inner wall surface of the waveguide. For example, for a copper waveguide with an operating frequency of 80 GHz, its skin depth (the depth at which the current propagates from the conductor surface to the conductor interior) is about 0.24 μm. When the conductor thickness is greater than its skin depth at the operating frequency, it can be considered that it can effectively transmit the electromagnetic wave signal.

[0049] At millimeter-wave frequencies (30 - 300 GHz, with wavelengths of 1 - 10 mm), the operating wavelength of a rectangular waveguide is short and its cross-sectional dimensions are small. It is possible to use conventional printed circuit boards (PCBs) and their processing technologies to realize the functions of a metallic rectangular waveguide, which is more conducive to the integrated design and integration with radio frequency and millimeter-wave chips.

[0050] Embodiment 1

[0051] In the implementation of the present invention, a rectangular waveguide is provided, including a printed circuit board. A through groove is opened on the printed circuit board. Metal layers are plated on the four walls of the through groove. The through groove is filled with air, and a plurality of through holes 123 are provided around the through groove.

[0052] Please refer to Figure 1-2 , the rectangular waveguide 111 for horizontal transmission based on the printed circuit board and its processing technology includes three layers of printed circuit boards. The top layer is the first printed circuit board 11, and the lower surface of the first printed circuit board 11 is covered with the metal layer, that is, the copper-clad layer 12.

[0053] The middle layer is the second printed circuit board 21. A through groove 122 is formed on the second printed circuit board. The size of the through groove can be adjusted according to the size of other components to be docked. Metal layers 22 are plated on two side walls of the through groove 122 parallel to the electromagnetic wave propagation direction.

[0054] The bottom layer is the third printed circuit board 31, and the upper surface of the third printed circuit board 31 is covered with the metal layer, that is, the copper-clad layer 32.

[0055] Among them, the copper-clad layer 12 on the lower surface of the first printed circuit board, the through groove 122 and the metal layers 22 on its two side walls, and the copper-clad layer 32 on the upper surface of the third printed circuit board together constitute an air-filled rectangular waveguide cavity 124, realizing low-loss transmission of electromagnetic wave signals in the horizontal direction.

[0056] This rectangular waveguide is completely composed of printed circuit boards (Printed Circuit Boards, PCB), so it can be manufactured by the processing technology of printed circuit boards. There are also various manufacturing methods: the upper, middle, and lower printed circuit boards can be processed separately, and then Figure 1 the through holes 123 in are used for pin positioning, and the three printed circuit boards are welded; in other examples, the upper, middle, and lower printed circuit boards can be processed separately, and then Figure 1 the through holes 123 in are used for pin positioning and screw fastening; the upper and middle or middle and lower two printed circuit boards can also be integrally processed by the laminate process, and then welded or screw-fastened to another printed circuit board through Figure 1 the through holes 123 in.

[0057] Please refer to Figure 3 and Figure 4 As shown, this embodiment also provides another rectangular waveguide 112 based on the printed circuit board and its processing technology, which includes three layers of printed circuit boards. Its composition form is similar to that of the rectangular waveguide 111, and will not be elaborated here.

[0058] Specifically, the through groove 122 is provided with a corner, and the waveguide cavity 124 of the rectangular waveguide 112 is bent in the horizontal plane. Therefore, the rectangular waveguide 112 can be transmitted in different directions in the horizontal plane.

[0059] Such as Figure 4As shown in the figure, in order to enable the rectangular waveguide 112 to have good transmission characteristics (low reflection coefficient), chamfering 125 is performed on the corners of the through slot 122 on the second printed circuit board 21 to offset the electromagnetic wave reflection caused by the sudden change in the structure at the corners. The chamfering form can be an oblique angle or a right angle with multiple stepped shapes, and no specific limitation is imposed here.

[0060] Please refer to Figure 5 , this embodiment also provides a rectangular waveguide 113 for vertical direction transmission based on a printed circuit board and its processing technology, including a layer of printed circuit board 01.

[0061] Specifically, a through slot 102 is opened on the printed circuit board 01, and metal layers 02 are plated on the side walls of the through slot 102. The through slot 102 and the metal layers 02 on its side walls form a rectangular waveguide cavity 104 filled with air, realizing low-loss transmission of electromagnetic wave signals in the vertical direction.

[0062] Through holes 103 are opened on the printed circuit board 01, which can be used for pin alignment or screw fastening when integrated with other planar circuits. Metal copper layers 03 are also covered on the upper and lower surfaces of the printed circuit board 01, which are used as the ground layer, shielding layer of other planar circuits or for welding and assembling with the surfaces of other planar circuits.

[0063] Please refer to Figure 6 , Figure 6 As a comparison diagram of the simulation results of the rectangular waveguide 111 for horizontal direction transmission based on a printed circuit board and its processing technology and a traditional metal rectangular waveguide, it can be obtained that within the working frequency band, the return loss of the two waveguides is less than -40 dB, and the transmission coefficient is basically equal to 0 dB, indicating that the rectangular waveguide based on a printed circuit board has excellent electromagnetic wave transmission characteristics comparable to those of a traditional metal rectangular waveguide.

[0064] In summary, the rectangular waveguide structure in the embodiments of the present invention is simple in formation, convenient to process, and can also be well guaranteed in terms of processing efficiency and processing accuracy; the entire waveguide structure is designed based on a printed circuit board, which is conducive to integrated design with other planar circuits and improves the system integration degree.

[0065] Embodiment 2

[0066] The horn antenna in this embodiment can be regarded as a combination of rectangular waveguides with different cross-sectional sizes. Therefore, it can also be realized by using a printed circuit board.

[0067] The embodiments of the present invention provide a waveguide-fed horn antenna based on a printed circuit board and its processing technology, which uses the rectangular waveguide described in Embodiment 1. Specifically, it includes one or a combination of multiple rectangular waveguides with different cross-sectional sizes. The multiple combined rectangular waveguides gradually decrease in cross-sectional size from the horn radiation port direction to the feed port. The horn antenna is fabricated based on a multi-layer board processing technology, and metal layers are covered on the upper and lower surfaces of the printed circuit board.

[0068] Please refer to Figure 7-9 the horn antenna 114 shown, which includes a combination of rectangular waveguides with two different cross-sectional sizes. In other examples, according to requirements for antenna metrics such as gain, beam width, operating bandwidth, etc., an appropriate number of rectangular waveguides with different cross-sectional sizes can be selected for combination.

[0069] The horn antenna 114 includes a fourth printed circuit board 41 and a fifth printed circuit board 51. A through slot 44 corresponding to the size of the feed rectangular waveguide is provided on the fourth printed circuit board 41, and metal layers 49 are plated on the side walls of the through slot 44; the fifth printed circuit board 51 is located below the fourth printed circuit board 41, and a rectangular through slot 46 with corresponding dimensions is provided on the fifth printed circuit board 51, and metal layers 52 are plated on the side walls of the through slot 46, and the size of the through slot 46 is larger than the size of the through slot 44 on the fourth printed circuit board 41, aiming to improve the impedance matching characteristics of the antenna input port. The size of the through slot 46 can be increased only in the wide side direction or in both the length and width directions. The through slot 46 is aligned with and penetrates the through slot 44. A metal layer 42 is plated on the lower surface area of the fourth printed circuit board 41 located within the through slot 46 of the fifth printed circuit board 51, and thus a stepped metal cavity 43 can be formed to radiate electromagnetic wave signals outward; a semi-cured sheet 40 (P sheet, Prepregs) used for processing the laminate is between the fourth printed circuit board 41 and the fifth printed circuit board 51.

[0070] As Figure 8 - Figure 9 shown, through holes 143 are provided around the stepped metal cavity 43, and metal layers 47 are plated on the side walls of the through holes 143. Metal copper 142 and 144 are plated on the upper surface of the fourth printed circuit board 41 and the lower surface of the fifth printed circuit board 51 respectively. The surface waves on the printed circuit board and the unwanted electromagnetic wave signals within the printed circuit board can be suppressed through the metal layers 47, 142, and 144. When forming an array antenna, the mutual influence between antenna elements can be suppressed, thereby improving the antenna performance; metal wrappings 141 are provided on the four outer side walls of the horn antenna 114 to further suppress unwanted electromagnetic radiation.

[0071] The through holes 143 are filled with resin 45 for plugging the holes, and then metal layers 48 are electroplated on the upper surface of the printed circuit board 41 and the lower surface of the printed circuit board 51 for leveling treatment to ensure the flatness of the surface of the horn antenna 114, which can improve the reliability when welding and assembling with other planar circuits.

[0072] Please refer to Figure 10-12 , Figure 10 which is the return loss curve of the horn antenna 114 in this example. It can be seen from the figure that within the frequency band of 70 - 90 GHz, the return loss is less than -17 dB (the electromagnetic wave reflectivity is lower than 2%), and the matching characteristics are good; Figure 11For its E-plane (the plane containing the electric field vector and the maximum radiation direction) and H-plane (the plane containing the magnetic field vector and the maximum radiation direction) patterns, it can be seen that the half-power beam widths in both planes are greater than 70°, and the symmetry is good; Figure 12 This is a comparison chart of the gain curves of the horn antenna in this embodiment and the traditional metal horn antenna. It can be seen that the gain values of the two are basically the same throughout the frequency band, and in the frequency band of 75 - 88 GHz, the gain is greater than 7.5 dB, and the fluctuation is less than 1 dB, having a stable gain characteristic.

[0073] In summary, the horn antenna provided in the embodiment of the present invention based on the printed circuit board and its processing technology has excellent characteristics of a wide operating frequency band, stable pattern, and wide coverage range, and has low processing cost, low profile, is easy to integrate with other planar circuits, and can be integrally designed.

[0074] Embodiment Three

[0075] Please refer to Figure 13 - Figure 15 , the embodiment of the present invention provides a system-on-chip (SoC) with transceiver functions based on a printed circuit board and its processing technology, including: a radio frequency front-end module, a digital processing module, and a power integrated circuit module.

[0076] The radio frequency front-end module includes: at least one horn antenna unit 633 for realizing electromagnetic wave transmission / reception, a waveguide transition structure for realizing low-loss transmission of radio frequency signals, a radio frequency integrated circuit package chip 61 for realizing radio frequency signal generation and reception, and lumped parameter elements 62 for realizing the filtering and decoupling functions of the radio frequency circuit. The package output of the radio frequency integrated circuit package chip 61 is in the form of waveguide output.

[0077] The digital processing module includes: a digital processing integrated circuit 63 for realizing signal level conversion and a digital interface integrated circuit 64 for realizing the function of an external high-speed digital signal interface.

[0078] The digital processing integrated circuit 63 is connected to the radio frequency integrated circuit package chip 61.

[0079] The power integrated circuit module 66 is used to supply power and perform voltage conversion on the radio frequency front-end module and the digital processing module.

[0080] It also includes an external clock module 65 for generating a clock signal to provide a reference source for the system.

[0081] The waveguide transition structure includes: a rectangular waveguide 611 for vertical transmission and a rectangular waveguide 622 for horizontal transmission.

[0082] As Figure 15As shown, the radio frequency integrated circuit packaging chip 61 is soldered onto the upper surface of the sixth printed circuit board 06 through a Ball Grid Array (BGA) 67. The waveguide output port of the radio frequency integrated circuit packaging chip 61 is connected to the rectangular waveguide 611 that transmits in the vertical direction. That is to say, the sixth printed circuit board 06 can not only serve as a carrier board for the packaging chip and other modules, but also as a dielectric substrate for forming the rectangular waveguide transmission line, thereby improving the system integration and simplifying the design.

[0083] Specifically, one end of the rectangular waveguide 611 that transmits in the vertical direction is connected to the waveguide output port of the radio frequency integrated circuit packaging chip 61, and the other end is connected to one end of the rectangular waveguide 622 that transmits in the horizontal direction. The other end of the rectangular waveguide 622 that transmits in the horizontal direction is connected to the feeding end of the horn antenna unit 633.

[0084] The radio frequency integrated circuit packaging chip 61, lumped parameter element 62, digital processing integrated circuit 63, digital interface integrated circuit 64, power integrated circuit module 66, and external clock module 65 are distributed on the upper surface of the sixth printed circuit board 06.

[0085] The rectangular waveguide 622 that transmits in the horizontal direction is formed on the seventh printed circuit board, and the horn antenna unit 633 is formed on the eighth printed circuit board.

[0086] The seventh printed circuit board is below the sixth printed circuit board, and the eighth printed circuit board is located below the seventh printed circuit board.

[0087] A waveguide transition structure is formed by the rectangular waveguide 611 that transmits in the vertical direction and the rectangular waveguide 622 that transmits in the horizontal direction to achieve low-loss interconnection between the packaging chip 61 and the horn antenna 633. The metallized holes 69 on the eighth printed circuit board 08 can be used to shield unwanted electromagnetic wave signals inside the printed circuit board, reducing the mutual influence between the horn antenna units 633. The through holes 68 can be used for pin positioning or screw fastening during the installation process.

[0088] Since each module in the system-on-chip provided in this embodiment is designed based on the printed circuit board, not only the excellent performance of the rectangular waveguide and horn antenna in the millimeter wave band is utilized, but also an integrated design of the entire system-on-chip based on the printed circuit board can be achieved, reducing the design complexity and difficulty, improving the system integration, facilitating the miniaturization of the device and reducing the production cost, and can be applied to fields such as automotive autonomous driving, road traffic monitoring, high-voltage line identification of helicopters, and airport foreign object detection.

[0089] In summary, the rectangular waveguide and horn antenna provided by the present invention based on a printed circuit board and its processing technology are composed of the metal layer on the surface of the printed circuit board and its slotted side walls. Therefore, material properties such as the dielectric constant and loss tangent angle of the circuit board itself have little impact on the transmission characteristics of the formed waveguide and the radiation characteristics of the horn antenna. Thus, a variety of different low-cost single printed circuit board materials (such as epoxy resin boards, fiberglass boards, epoxy glass composite boards, or hydrocarbon ceramic composite boards) or a combination of multiple materials can be selected for processing and manufacturing to reduce the manufacturing cost. At present, the PCB processing technology is relatively mature. The rectangular waveguide and horn antenna structures in the embodiments of the present invention are simple in formation and convenient for processing, and can also be well guaranteed in terms of processing efficiency and processing accuracy. The entire waveguide and horn antenna structure is designed based on the printed circuit board, which is conducive to the integrated design with other planar circuits and improves the system integration degree. The on-chip system (System on Chip, SoC) with transceiver functions provided based on the rectangular waveguide and horn antenna has the advantages of low cost, excellent performance, and high integration degree.

[0090] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A system on a chip, characterized in that, Comprising: a radio frequency front-end module, a digital processing module, and a power integrated circuit module; The radio frequency front-end module includes: at least one horn antenna unit, a waveguide transition structure, a radio frequency integrated circuit package chip, and lumped elements, and the package output of the radio frequency integrated circuit package chip is in the form of waveguide output; The digital processing module includes: a digital processing integrated circuit and a digital interface integrated circuit; The digital processing integrated circuit is connected to the radio frequency integrated circuit package chip; The power integrated circuit module is used to supply power and perform voltage conversion for the radio frequency front-end module and the digital processing module.

2. The system on chip according to claim 1, characterized in that, It further includes an external clock module for generating a clock signal to provide a reference source for the system.

3. The system on chip according to claim 2, wherein The waveguide transition structure includes: a rectangular waveguide for vertical transmission and a rectangular waveguide for horizontal transmission; One end of the rectangular waveguide for vertical transmission is connected to the waveguide output port of the radio frequency integrated circuit package chip, and the other end is connected to one end of the rectangular waveguide for horizontal transmission, and the other end of the rectangular waveguide for horizontal transmission is connected to the feeding end of the horn antenna unit.

4. The system on chip according to claim 3, characterized in that, The radio frequency integrated circuit package chip, the lumped elements, the digital processing integrated circuit, the digital interface integrated circuit, the power integrated circuit module, and the external clock module are distributed on the upper surface of the sixth printed circuit board; The rectangular waveguide for horizontal transmission is formed on the seventh printed circuit board, and the horn antenna unit is formed on the eighth printed circuit board; The seventh printed circuit board is below the sixth printed circuit board, and the eighth printed circuit board is below the seventh printed circuit board.

5. The system on chip according to claim 1, characterized in that, The horn antenna unit includes one or more combinations of rectangular waveguides with different cross-sectional dimensions, and the rectangular waveguide includes a printed circuit board with metal layers on its upper and lower surfaces.

6. The system on chip according to claim 5, wherein A through groove is provided on the printed circuit board, and the four walls of the through groove are plated with metal layers, and the through groove is filled with air.

7. The system on chip according to claim 6, characterized in that, The printed circuit board of the rectangular waveguide includes upper, middle, and lower layers, wherein the lower surface of the upper printed circuit board is covered with a metal layer, the through groove is provided on the middle printed circuit board and the two side walls parallel to the electromagnetic wave propagation direction of the through groove are plated with the metal layer, and the upper surface of the lower printed circuit board is covered with the metal layer; A plurality of through holes are provided around the through groove; The through groove is provided with a corner, and the corner includes an oblique angle or a plurality of stepped right angles.

8. The system on chip according to claim 6, characterized in that, The rectangular waveguides in the multiple combinations gradually decrease in cross-sectional dimension from the horn radiation port direction to the feeding port; the multiple combinations of rectangular waveguides are oppositely arranged and penetrate to form a stepped metal cavity; a metal layer is plated on the lower surface area of the small cross-sectional dimension rectangular waveguide located in the through groove of the large cross-sectional dimension rectangular waveguide.

9. The system on chip according to claim 8, wherein A plurality of through holes are provided around the stepped metal cavity, the inner walls of the through holes are plated with metal layers, and the interior is filled with resin.

10. The system on chip according to claim 5, wherein Metal layers are covered on the outer four walls of the horn antenna unit.

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