A flexible transport system for superconducting quantum computing

Abstract

The application discloses a kind of flexible transmission systems for superconducting quantum computing, belong to flexible transmission technical field, including normal temperature installation tray, the sealing cavity that can be expanded in Z axis direction is installed on the normal temperature installation tray, multiple-channel airtight connector module is installed on the sealing cavity, the actual installation number of multiple-channel airtight connector module is adjustable in the range of 1-20 and above;The application, by the design of multi-channel radio frequency soft and hard combination board or flexible circuit board, the FPC internal circuit can work stably at high frequency up to 10GHz at each temperature of normal temperature-low temperature, and has excellent performance such as low insertion loss, return loss, by the first section flexible transmission circuit board Rigid-Flex PCB / FPC adjustment installation height and bending degree, compensate path length difference, ensure that each road signal transmission length is consistent, in turn ensure the consistency of each channel transmission loss, provide stable and reliable signal transmission foundation for superconducting quantum computer.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of flexible transmission, and particularly relates to a flexible transmission system for superconducting quantum computing. BACKGROUND

[0002] As an important technical route of quantum computing, superconducting quantum computing has developed rapidly in recent years and has made significant breakthroughs in many fields. It is currently the closest technology to realizing the superiority of quantum and building a commercial quantum computer. With the increasing demand for quantum computing performance, increasing the number of bits and improving the fidelity of superconducting quantum computers has become a key task.

[0003] However, the existing superconducting quantum computers have serious defects in signal transmission. Traditional schemes usually use coaxial cables or superconducting wires for transmission, which occupies a large amount of space load and thermal load. In the development process of multi-bit superconducting quantum computers, the space and thermal load problem has become a great obstacle. A large amount of space is occupied by transmission lines, limiting the integration of more bits in a limited volume; at the same time, excessive thermal load will affect the performance of superconducting chips, reduce the fidelity of bits, and seriously restrict the further development of multi-bit superconducting quantum computers, making it difficult to meet the growing demand for quantum computing.

[0004] In order to avoid the above technical problems, it is necessary to provide a flexible transmission system for superconducting quantum computing to overcome the defects in the prior art. SUMMARY

[0005] The purpose of the present application is to provide a flexible transmission system for superconducting quantum computing to solve the problems raised in the background art.

[0006] To achieve the above purpose, the present application provides the following technical scheme: a flexible transmission system for superconducting quantum computing, comprising a normal temperature mounting disc, a sealed cavity capable of expanding in the Z-axis direction is mounted on the normal temperature mounting disc, a multi-channel airtight connector module is mounted on the sealed cavity, the actual installation number of the multi-channel airtight connector module is adjustable in the range of 1-20 and above, an airtight cover plate forming a complete vacuum seal is connected with the sealed cavity, and the airtight cover plate and the multi-channel airtight connector module are integrally detachable structures.

[0007] A first section of flexible transmission line board Rigid-Flex PCB / FPC is installed by a mounting clamp, the first section of flexible transmission line board Rigid-Flex PCB / FPC compensates for the path length difference caused by the installation of the airtight cover plate by adjusting the installation height and the inner and outer bending degree, so that the transmission lengths of each signal remain consistent.

[0008] As a preferred embodiment, the multi-channel airtight connector module is connected to the integrated panel or directly connected to the control box through the adapter joint and its tail coaxial line.

[0009] As a preferred embodiment, the inter-board connection adapter is further included, and the upper and lower flexible lines are connected through the inter-board connection adapter. The flexible board close to the inter-board connection adapter section is welded with a radio frequency patch attenuator, and the outer shielding cover is close to the radio frequency patch attenuator.

[0010] As a preferred embodiment, at the 10mK disk, the flexible line is fixed and conducts heat through the way of being tightly clamped by two heat sinks; at the MC disk, the high-density coaxial bandpass attenuator group is additionally installed along the X-axis direction and the Z-axis direction.

[0011] As a preferred embodiment, the Rigid-Flex PCB / FPC is manufactured by using the general flexible circuit board printing and pressing process. The Rigid-Flex PCB is composed of multi-layer / single-layer FPC and multi-layer / single-layer hard board PCB. The RF signal is mainly transmitted through the FPC internal circuit structure. The common transmission structure of the FPC internal circuit is a strip line, and microstrip, coplanar waveguide, rectangular waveguide, and rectangular coaxial structure transmission can also be used. The core material of the FPC is a high-frequency flexible board material.

[0012] As a preferred embodiment, the high-frequency flexible board material includes MPI and LCP. The copper layer of the FPC is selected from one of pure copper, constantan, nickel copper, manganese copper, and aluminum foil. PP is a bonding layer used for bonding.

[0013] As a preferred embodiment, the hard board PCB is used for reinforcement, impedance compensation, and heat conduction. The hard board PCB can be replaced by a metal block. The metal block can increase the external heat conduction performance of the FPC. The hard board PCB or the metal block is provided with a window or a slot, which cooperates with the FPC to realize local RF impedance compensation. The local RF impedance compensation includes a circuit pad via, a via hole, a solder pad, and a soldering part.

[0014] The circuit pad via corresponds to a specific circuit connection position, the via hole is used for interlayer electrical connection, and the solder pad and the soldering part are actual soldering operation areas.

[0015] As a preferred embodiment, in the sealed environment formed by the sealed cavity, the airtight cover plate and the multi-channel airtight connector module, the first section of the flexible transmission line board Rigid-Flex PCB / FPC is installed and the height and the bending degree inside and outside are adjusted by the mounting clamp, the single-board channel number is maximized by densely arranging the radio frequency lines under the condition of ensuring the isolation degree of adjacent radio frequency channels, the Z-axis direction step offset is realized at the connection position of each board in the dilution refrigerator, and the load utilization rate is maximized in the three-dimensional space.

[0016] As a preferred embodiment, the transmission assembly further includes mounting components for fixing / shielding / heat sinking and radio frequency elements for realizing other radio frequency signal functions in addition to the Rigid-Flex PCB / FPC, and on the basis that the first section of the flexible transmission line board Rigid-Flex PCB / FPC adjusts the height and the bending degree by the mounting clamp to compensate for the path length difference, the radio frequency elements cooperate with the Rigid-Flex PCB / FPC to realize the signal transmission function;

[0017] The radio frequency signal functions include attenuation, filtering, heat conduction, amplification, combining, mixing, one-way transmission and isolation; based on the Rigid-Flex PCB / FPC transmission structure, the arrangement combination and application of related elements on the flexible transmission structure in the field of quantum computing are protected;

[0018] The arrangement combination and application include direct welding and indirect interconnection, for example, welding a radio frequency patch attenuator on the flexible board close to the inter-board interconnection adapter section belongs to direct welding, and the multi-channel airtight connector module is connected to the integrated panel or the measurement and control box through the adapter joint and the coaxial line at the tail thereof, which belongs to indirect interconnection.

[0019] The application discloses a use method of a flexible transmission system for superconducting quantum computing.

[0020] S1, install the sealed cavity on the normal-temperature mounting disc, install the multi-channel airtight connector module according to the requirement, and form a vacuum seal through the airtight cover plate;

[0021] S2, install the first section of the flexible transmission line board Rigid-Flex PCB / FPC, and adjust the height and the bending degree thereof by the mounting clamp;

[0022] S3, connect the upper and lower sections of the flexible line through the inter-board interconnection adapter, and install the radio frequency patch attenuator and the outer shielding cover;

[0023] S4, fix the flexible line by using two side heat sinks at the 10mK disc, and install the high-density coaxial bandpass attenuator group at the MC disc.

[0024] S5, through the adapter joint of the multi-channel airtight connector module and the coaxial line connection integrated panel or control box, signal transmission is realized.

[0025] Compared with the prior art, the present application has the following advantages:

[0026] The present application, by designing a multi-channel radio frequency soft and hard combination board or a flexible circuit board, the FPC internal circuit can work stably at a high frequency of up to 10GHz at normal temperature-low temperature, and has excellent performance such as low insertion loss and return loss, through the first flexible transmission line board Rigid-Flex PCB / FPC to adjust the installation height and bending degree, compensate the path length difference, ensure the consistency of the signal transmission length, and further ensure the consistency of the transmission loss of each channel, and provide a stable and reliable signal transmission basis for the superconducting quantum computer.

[0027] The present application, based on Rigid-Flex PCB / FPC, can complete a series of complex functions such as signal transmission, attenuation, heat sink at low temperature, filtering, signal merging and the like in the process of signal transmission from room temperature to the superconducting chip inside the quantum computer, for example, the flexible board welding radio frequency patch attenuator near the inter-board interconnection adapter section effectively reduces the thermal load on the next temperature disc; the outer shielding cover conducts the heat energy conducted by the upper temperature disc in the line to the shielding cover, and transmits it to the temperature disc in the present layer through the mounting clamp for absorption, and realizes good heat management.

[0028] The present application, by building a flexible transmission system, successfully solves the problems of space and heat load in the superconducting quantum computer, the sealed cavity can be expanded in the Z-axis direction, the number of multi-channel airtight connector modules can be flexibly adjusted, and the space layout can be optimized according to actual needs, at the same time, various structures and components in the system work cooperatively, effectively reducing the heat load and improving the bit number of the superconducting quantum computer in the same volume, which provides the possibility for large-scale quantum computing.

[0029] The present application uses ordinary flexible circuit board printing and pressing process to manufacture Rigid-Flex PCB / FPC, which has lower cost and higher efficiency compared with vapor deposition and electromagnetic sputtering schemes, and the detachable structure of the airtight cover plate and the multi-channel airtight connector module facilitates the installation and fixation of the back flexible transmission circuit board; the reasonable design and layout of the components in the system reduce the assembly difficulty and improve the stability of the whole system, which is conducive to large-scale production and application.

[0030] The application guarantees the maximum number of single-board channel through the dense arrangement of RF lines under the condition of ensuring the isolation of adjacent RF channels, realizes the maximization of load utilization in three-dimensional space by the stepwise dislocation of Z-axis direction of each board connection part in the dilution refrigerator, greatly improves the number of transmission line boards that can be installed in a single window due to the far smaller thickness size of FPC than the slot size, and fully utilizes the limited space resources. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the flexible transmission system of the application.

[0032] Figure 2 It is a schematic diagram of the local enlargement of the inter-board interconnection adapter and the structure near it.

[0033] Figure 3 It is a schematic diagram of the multi-layer structure of FPC (flexible circuit board).

[0034] Figure 4 It is a comparative schematic diagram of the connection structure of FPC and PCB (hard board).

[0035] In the figure: 101, sealed cavity; 102, gas-tight cover plate; 103, adapter joint and tail coaxial line thereof; 104, multi-channel gas-tight connector module; 105, integrated panel; 106, first section of flexible transmission line board Rigid-Flex PCB / FPC; 107, inter-board interconnection adapter; 108, RF patch attenuator; 109, outer shielding cover; 110, mounting clamp; 111, two-side heat sink; 301, high-frequency flexible plate material; 302, windowing or slotting; 303, line pad via hole; 304, via hole; 305, solder pad and soldering part. DETAILED DESCRIPTION

[0036] The application will be further described below in combination with examples.

[0037] The following examples are used to illustrate the application, but cannot be used to limit the protection scope of the application. The conditions in the examples can be further adjusted according to specific conditions, and simple improvements of the method of the application under the concept of the application all belong to the protection scope of the application.

[0038] Please refer to Figures 1-4The application provides a flexible transmission system for superconducting quantum computing, comprising a normal-temperature mounting disc, a sealed cavity 101 capable of expanding in the Z-axis direction is mounted on the normal-temperature mounting disc, a multi-channel airtight connector module 104 is mounted on the sealed cavity 101, the actual mounting number of the multi-channel airtight connector module 104 can be adjusted in the range of 1-20 and above, an airtight cover plate 102 is connected with the sealed cavity 101 to form a complete vacuum seal, and the airtight cover plate 102 and the multi-channel airtight connector module 104 are integrally detachable structures.

[0039] A first section of flexible transmission line board Rigid-Flex PCB / FPC 106 is mounted through a mounting clamp 110, the first section of flexible transmission line board Rigid-Flex PCB / FPC 106 compensates for the path length difference caused by the installation of the airtight cover plate 102 by adjusting the mounting height and the inner and outer bending degree, so that the signal transmission lengths of all paths remain consistent.

[0040] As shown in Figure 1 , the multi-channel airtight connector module 104 is connected to the integrated panel 105 or directly connected to the measurement and control case through an adapter and its tail coaxial line 103.

[0041] As shown in Figure 2 , it also includes an inter-board interconnection adapter 107, the upper and lower sections of flexible lines are connected through the inter-board interconnection adapter 107, a radio frequency patch attenuator 108 is welded on the flexible board near the inter-board interconnection adapter 107, and an outer shielding cover 109 is tightly attached to the radio frequency patch attenuator 108.

[0042] As shown in Figure 1 , at the 10mK disc, the flexible line is fixed and conducts heat through the way of being tightly clamped by two heat sinks 111; at the MC disc, high-density coaxial bandpass attenuator groups are additionally installed along the X-axis direction and the Z-axis direction.

[0043] As shown in Figure 1 , the Rigid-Flex PCB / FPC is made by using ordinary flexible circuit board printing and pressing process, the Rigid-Flex PCB is composed of multi-layer / single-layer FPC and multi-layer / single-layer hard board PCB, mainly transmits radio frequency signals through the FPC internal line structure, the common transmission structure of the FPC internal line is a strip line, and microstrip, coplanar waveguide, rectangular waveguide and rectangular coaxial structure transmission can also be used, and the core material of the FPC is high-frequency flexible plate material 301.

[0044] As shown in Figure 4 , the high-frequency flexible plate material 301 includes MPI and LCP, the copper layer of the FPC is selected from one of pure copper, constantan, nickel copper, manganese copper and aluminum foil, and the PP is an adhesive layer used for adhesion.

[0045] AsFigure 4 As shown, the hard board PCB is used for reinforcement, impedance compensation and heat conduction, the hard board PCB can be replaced by a metal block, the metal block can increase the heat conduction performance of the FPC to the outside, and the hard board PCB or the metal block is provided with a window or a slot 302, which is matched with the FPC to realize local radio frequency impedance compensation, and the local radio frequency impedance compensation includes a circuit pad via hole 303, a via hole 304, a solder pad and a soldering part 305;

[0046] The circuit pad via hole 303 corresponds to a specific circuit connection position, the via hole 304 is used for interlayer electrical connection, and the solder pad and the soldering part 305 are actual soldering operation areas.

[0047] As shown in the drawings, Figure 1 As shown in the drawings, in the sealed environment composed of the sealed cavity 101, the air-tight cover plate 102 and the multi-channel air-tight connector module 104, the first section of the flexible transmission circuit board Rigid-Flex PCB / FPC 106 is installed and the height and the inner and outer bending degree are adjusted by the mounting clamp 110, the adjacent radio frequency channel isolation is ensured, the radio frequency circuit is densely arranged, the number of channels of the single board is maximized, the Z-axis direction step offset of each board connection part in the dilution refrigerator is realized, and the load utilization rate in the three-dimensional space is maximized.

[0048] As shown in the drawings, Figure 1 As shown in the drawings, in addition to the Rigid-Flex PCB / FPC, the transmission assembly also includes mounting components for fixing / shielding / heat sinking and radio frequency elements for realizing other radio frequency signal functions, on the basis that the first section of the flexible transmission circuit board Rigid-Flex PCB / FPC 106 adjusts the height and the bending degree by the mounting clamp 110 to compensate for the path length difference, these radio frequency elements cooperate with the Rigid-Flex PCB / FPC to realize the signal transmission function;

[0049] Among them, the radio frequency signal function includes attenuation, filtering, heat conduction, amplification, combining, mixing, one-way transmission, isolation; based on the Rigid-Flex PCB / FPC transmission structure, the arrangement, combination and application of related elements in the quantum computing field on the flexible transmission structure are protected;

[0050] The arrangement, combination and application include direct welding and indirect interconnection, for example, the flexible board welding radio frequency patch attenuator 108 near the interconnection adapter 107 section belongs to direct welding, and the multi-channel air-tight connector module 104 is connected with the integrated panel 105 or the measurement and control cabinet through the adapter and the coaxial line 103 at the tail thereof, which belongs to indirect interconnection.

[0051] The application discloses a use method of a flexible transmission system for superconducting quantum computing, and comprises the following steps:

[0052] S1, install the sealed cavity 101 on the normal temperature installation disc, install the multi-channel airtight connector module 104 according to requirements, and form a vacuum seal through the airtight cover plate 102;

[0053] S2, install the first section flexible transmission line board Rigid-Flex PCB / FPC 106, and adjust the height and bending degree thereof by using the installation clamp 110;

[0054] S3, connect the upper and lower sections of flexible lines through the inter-board connection adapter 107, and install the radio frequency patch attenuator 108 and the outer shielding cover 109;

[0055] S4, fix the flexible line at the 10mK disc by using the two-side heat sink 111, and install the high-density coaxial bandpass attenuator group at the MC disc;

[0056] S5, connect the integrated panel 105 or the control machine box through the adapter joint of the multi-channel airtight connector module 104 and the coaxial line 103 at the tail thereof, so as to realize signal transmission.

[0057] The working principle and use process of the application are as follows: firstly, the installation process of the system is convenient and efficient. The sealed cavity 101 is installed on the normal temperature installation disc, 1-20 groups or more of the multi-channel airtight connector module 104 are flexibly installed according to actual requirements, and then the airtight cover plate 102 is installed to form a vacuum seal. This whole detachable structure facilitates the subsequent installation and fixation of the first section flexible transmission line board Rigid-Flex PCB / FPC 106 on the back, and reduces the assembly difficulty;

[0058] In the signal transmission link, the first section flexible transmission line board Rigid-Flex PCB / FPC 106 adjusts the installation height and the inner and outer bending degree by using the installation clamp 110, effectively compensates for the path length difference caused by the installation of the airtight cover plate 102, makes the lengths of all signal transmission paths consistent, guarantees the consistency of transmission loss of all channels, meets the strict requirements of the superconducting quantum computer on stable signal transmission, and enables the system to stably operate in different temperature environments. At the 10mK disc, the flexible line is tightly clamped and fixed by using the two-side heat sink 111 and conducts heat, reduces the radio frequency switching times, and improves the performance. At the MC disc, the high-density coaxial bandpass attenuator group is installed along the X-axis direction and the Z-axis direction, so that more flexible modules and channel numbers are adapted and supported.

[0059] In addition, the system performs well in space and thermal load management. The sealed cavity 101 can be expanded in the Z-axis direction, and the number of multi-channel airtight connector modules 104 can be adjusted. In combination with the design of Z-axis direction step misalignment at the connection position of each plate in the dilution refrigerator, the system realizes the maximum utilization of loads in three-dimensional space, greatly improves the number of superconducting quantum computer bits in the same volume, and at the same time, the radio frequency patch attenuator 108 welded on the flexible plate near the interconnection adapter 107 segment, in combination with the outer shielding cover 109, effectively reduces the thermal load on the next temperature disc, and optimizes the thermal management of the system.

[0060] Moreover, the system has powerful signal processing functions. In addition to the Rigid-Flex PCB / FPC, the mounting components for fixing / shielding / heat sinking and the radio frequency elements for realizing other radio frequency signal functions work together. On the basis of the first segment of the flexible transmission line board Rigid-Flex PCB / FPC 106, the system realizes multiple functions such as attenuation, filtering, heat conduction, amplification, combining, mixing, one-way transmission, isolation, etc., ensuring the accuracy and stability of the superconducting quantum computing chip signal transmission and control, and fully meeting the complex needs of superconducting quantum computing.

[0061] Although embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flexible transport system for superconducting quantum computing comprising a room temperature mounting disc, characterized in that: The normal temperature installation disc is provided with a sealed cavity (101) which can expand in the Z-axis direction, and the sealed cavity (101) is provided with a multi-channel airtight connector module (104); The actual installation number of the multi-channel airtight connector module (104) can be flexibly adjusted, and the airtight cavity cover plate (102) is connected with the sealed cavity (101) to form a complete vacuum seal, and the airtight cavity cover plate (102) and the multi-channel airtight connector module (104) are integrally detachable structures; A first section of flexible transmission line board Rigid-Flex PCB / FPC (106) is installed through an installation clamp (110), the first section of flexible transmission line board Rigid-Flex PCB / FPC (106) compensates for the path length difference caused by the installation of the airtight cavity cover plate (102) by adjusting the installation height and the inner and outer bending degree, so that the signal transmission lengths of each path remain consistent.

2. A flexible transport system for superconducting quantum computing according to claim 1, wherein: The multi-channel airtight connector module (104) is connected to an integrated panel (105) or directly connected to a measurement and control case through an adapter and a coaxial line (103) at the tail thereof.

3. The flexible transport system for superconducting quantum computing of claim 1, wherein: It also includes an inter-board interconnection adapter (107), and the upper and lower sections of flexible lines are connected through the inter-board interconnection adapter (107), and a radio frequency patch attenuator (108) is welded to the flexible board near the inter-board interconnection adapter (107), and an outer shielding cover (109) is tightly attached to the radio frequency patch attenuator (108).

4. The flexible transport system for superconducting quantum computing of claim 1, wherein: At the 10mK disc, the flexible line is fixed and conducts heat in a tightly clamped manner through two side heat sinks (111); at the MC disc, high-density coaxial bandpass attenuator groups are additionally installed along the X-axis direction and the Z-axis direction.

5. The flexible transport system for superconducting quantum computing of claim 1, wherein: The Rigid-Flex PCB / FPC is made by using ordinary flexible circuit board printing and pressing process, the Rigid-Flex PCB is composed of multi-layer / single-layer FPC and multi-layer / single-layer hard board PCB, mainly transmits radio frequency signals through the FPC internal line structure, the common transmission structure of the FPC internal line is a strip line, and microstrip, coplanar waveguide, rectangular waveguide and rectangular coaxial structure transmission can also be used, and the core material of the FPC is a high-frequency flexible plate material (301).

6. A flexible transport system for superconducting quantum computing according to claim 5, wherein: The high-frequency flexible plate material (301) includes MPI and LCP, the copper layer of the FPC is selected from one of pure copper, constantan, nickel copper, manganese copper and aluminum foil, and PP is an adhesive layer for bonding.

7. The flexible transport system for superconducting quantum computing of claim 5, wherein: The hard board PCB is used for reinforcement, impedance compensation and heat conduction, the hard board PCB can be replaced by a metal pressing block, the metal pressing block can increase the external heat conduction performance of the FPC, and the hard board PCB or the metal pressing block is provided with a window or a slot (302) to cooperate with the FPC to realize local radio frequency impedance compensation, and the local radio frequency impedance compensation includes a line pad via (303), a via hole (304), a solder pad and a soldering part (305); The line pad via (303) corresponds to a specific line connection position, the via hole (304) is used for interlayer electrical connection, and the solder pad and the soldering part (305) are actual soldering operation areas.

8. The flexible transport system for superconducting quantum computing of claim 1, wherein: In a sealed environment composed of a sealed cavity (101), a gas-tight cover plate (102) and a multi-channel gas-tight connector module (104), the first section of the flexible transmission line board Rigid-Flex PCB / FPC (106) is installed and adjusted in height and bending degree by the mounting clamp (110). In the case of ensuring the isolation degree of adjacent radio frequency channels, the maximum number of single-board channels is ensured by densely arranging radio frequency lines. In the dilution refrigerator, the Z-axis direction step offset is realized at the connection position of each board to maximize the utilization rate of the load in three-dimensional space.

9. The flexible transport system for superconducting quantum computing of claim 1, wherein: In addition to the Rigid-Flex PCB / FPC, the transmission assembly also includes mounting components for fixing / shielding / heat sinking and radio frequency elements for realizing other radio frequency signal functions. On the basis of the first section of the flexible transmission line board Rigid-Flex PCB / FPC (106) adjusting the height and bending degree by the mounting clamp (110) to compensate for the difference in path length, these radio frequency elements cooperate with the Rigid-Flex PCB / FPC to realize signal transmission functions; The radio frequency signal functions include attenuation, filtering, heat conduction, amplification, combining, mixing, one-way transmission, and isolation. Based on the Rigid-Flex PCB / FPC transmission structure, the arrangement, combination and application of related elements in the field of quantum computing on flexible transmission structures are protected. The arrangement, combination and application include direct welding and indirect interconnection. The welding of the radio frequency patch attenuator (108) on the flexible board near the inter-board interconnection adapter (107) is direct welding, and the connection of the multi-channel gas-tight connector module (104) to the integrated panel (105) or the measurement and control cabinet through the adapter connector and its tail coaxial line (103) is indirect interconnection.

10. A method of use of a flexible transport system for superconducting quantum computing, characterized in that, The steps include: S1, install the sealed cavity (101) on the normal temperature mounting disc, install the multi-channel gas-tight connector module (104) according to the requirements, and form a vacuum seal through the gas-tight cover plate (102); S2, install the first section of the flexible transmission line board Rigid-Flex PCB / FPC (106) and adjust its height and bending degree by using the mounting clamp (110); S3, connect the upper and lower sections of the flexible line through the inter-board interconnection adapter (107), and install the radio frequency patch attenuator (108) and the outer shielding cover (109); S4, fix the flexible line with two side heat sinks (111) at the 10mK disc, and install a high-density coaxial bandpass attenuator group at the MC disc; S5, connect the integrated panel (105) or the measurement and control cabinet through the adapter connector and its tail coaxial line (103) of the multi-channel gas-tight connector module (104) to realize signal transmission.

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