Display panel, manufacturing method and display device

Abstract

The embodiment of the invention provides a display panel, a manufacturing method and a display device. The display panel comprises a blind hole area. The first display panel further comprises a first flexible substrate and a first insulating layer. The first flexible substrate comprises a first surface, the first surface is the surface of the backlight side of the display panel, and the first flexible substrate comprises a first through hole. The first insulating layer is in contact with the first flexible substrate and is located on the side, facing the light emitting face of the display panel, of the first flexible substrate, and the first insulating layer is located outside the first through hole. According to the display panel provided by the embodiment of the invention, the light transmittance in the blind hole area can be improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a manufacturing method and a display device. Background Art

[0002] In order to improve the performance of the camera module, the position where the display panel and the camera module are relative needs to be hollowed out to improve the light transmittance of the camera module. In the process implementation, a laser is used to hollow out the display panel to form a through hole. However, the waterproof layer is damaged during the process of laser etching the through hole, making the display panel vulnerable to water vapor intrusion. In order to avoid water vapor intrusion, the water vapor passage is blocked by setting an isolation column in the related technology. However, it is shown in practice that although the isolation column has a certain blocking effect on the water vapor passage, there is still a risk of water vapor intrusion. Therefore, the blind hole screen came into being. The blind hole screen does not have a through-hole laser etching boundary, and the thin film package of the display panel has not been cut open and is a whole surface, so there is no need to set an isolation column for water vapor blocking, which fundamentally solves the problem of reliability risk of water vapor blocking caused by the existence of the isolation group.

[0003] However, the light transmittance of the blind hole display panel in the prior art is relatively low, which has a negative impact on the working performance of the camera module. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel, a manufacturing method and a display device to improve the problem of low light transmittance of the blind hole display panel, thereby improving the working performance of the camera module.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including a blind hole area. The first display panel also includes: a first flexible substrate and a first insulating layer. The first flexible substrate includes a first surface, the first surface is a surface of the backlight side of the display panel, and the first flexible substrate includes a first through hole. The first insulating layer contacts the first flexible substrate and is located on a side of the first flexible substrate facing the light-emitting surface of the display panel, and the first insulating layer is located outside the first through hole.

[0006] In a possible implementation of the first aspect, the display panel further includes: a second flexible substrate and a second insulating layer. The second flexible substrate is located on a side of the first insulating layer facing away from the first flexible substrate, the second flexible substrate includes a second through hole, and along the stacking direction of the first flexible substrate and the first insulating layer, the first through hole and the second through hole at least partially overlap. The second insulating layer contacts the second flexible substrate and is located on a side of the second flexible substrate facing away from the first flexible substrate. The second insulating layer includes a first portion, and the first portion of the second insulating layer is located in the second through hole.

[0007] In a possible implementation of the first aspect, the second through-hole includes a first port and a second port. The first port of the second through-hole is located at one end of the second through-hole facing the first flexible substrate, and the second port of the second through-hole is located at one end of the second through-hole facing away from the first flexible substrate. The area of the first port of the second through-hole is smaller than the area of the second port of the second through-hole.

[0008] In a possible implementation of the first aspect, the display panel further includes: a second flexible substrate and a second insulating layer. The second flexible substrate is located on a side of the first insulating layer facing away from the first flexible substrate. The second flexible substrate includes a second through-hole, and the second through-hole communicates with the first through-hole. The second insulating layer is in contact with the second flexible substrate, is located on a side of the second flexible substrate facing away from the first flexible substrate, and the second insulating layer is outside the second through-hole.

[0009] In a possible implementation of the first aspect, in the stacking direction of the first flexible substrate and the first insulating layer, the maximum height of the second flexible substrate is less than or equal to 8um.

[0010] In a possible implementation of the first aspect, the first through-hole includes a first port and a second port. The first port of the first through-hole is located at one end of the first through-hole facing away from the first insulating layer, and the second port of the first through-hole is located at one end of the first through-hole facing the first insulating layer. The area of the first port is larger than the area of the second port. In a possible implementation of the first aspect, the display panel further includes a first electrode layer. The first electrode layer includes a third through-hole and a first portion. The first portion of the first electrode layer is in contact with the third through-hole. In the stacking direction of the first flexible substrate and the first insulating layer, the first portion of the first electrode layer does not overlap with the target port, and the target port is the port with the smallest area among the first port of the first through-hole, the second port of the first through-hole, the first port of the second through-hole, and the second port of the second through-hole.

[0011] In a possible implementation of the first aspect, the target port is the second port of the first through-hole.

[0012] In a possible implementation of the first aspect, the display panel further includes: a first electrode layer and a first metal layer. The first electrode layer includes a third through hole and a first portion, and the first portion of the first electrode layer contacts the third through hole. Along the stacking direction of the first flexible substrate and the first insulating layer, the first portion of the first electrode layer overlaps with the target port, and the target port is the port with the smallest area among the first port of the first through hole, the second port of the first through hole, the first port of the second through hole, and the second port of the second through hole. The first metal layer is located on a side of the second insulating layer away from the second flexible layer, and the first metal layer includes a first metal portion, and the first metal portion is located in the second through hole. Along the stacking direction of the first flexible substrate and the first insulating layer, the first metal portion overlaps with the first portion of the first insulating layer, and the first metal portion does not overlap with the third through hole.

[0013] In a possible implementation of the first aspect, the display panel further includes: a first electrode layer and a thin film encapsulation layer. The first electrode layer is located on a side of the first insulating layer away from the first flexible substrate, the first electrode layer includes a third through hole, and along the stacking direction of the first flexible substrate and the first insulating layer, the third through hole at least partially overlaps with the first through hole. The thin film encapsulation layer is located on a side of the first electrode layer away from the first flexible substrate layer, the thin film encapsulation layer includes a first portion, and the first portion of the thin film encapsulation layer is located in the third through hole.

[0014] In a possible implementation of the first aspect, the display panel further includes: a first electrode layer and a thin film encapsulation layer. The first electrode layer is located on a side of the first insulating layer away from the first flexible substrate, and the first electrode layer includes a third through hole. Along the stacking direction of the first flexible substrate and the first insulating layer, the third through hole at least partially overlaps with the first through hole. The thin film encapsulation layer is located on a side of the first electrode layer away from the first flexible substrate layer, and the thin film encapsulation layer is located outside the third through hole.

[0015] In a possible implementation of the first aspect, the display panel further includes: a thin film encapsulation layer. Along the stacking direction of the first flexible substrate and the first insulating layer, the thin film encapsulation layer covers the first flexible substrate. The thin film encapsulation layer includes a first surface, the first surface of the thin film encapsulation layer is located on a side of the thin film encapsulation layer away from the first flexible substrate, and the first surface of the thin film encapsulation layer is a whole surface structure.

[0016] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, comprising: A display panel is manufactured on a first substrate, and the display panel includes a first flexible substrate and a first insulating layer. The first flexible substrate includes a first surface, and the first surface is a surface of the backlight side of the display panel. The first insulating layer contacts the first flexible substrate, and the first insulating layer is located on a side of the first flexible substrate facing a light-emitting surface of the display panel.

[0017] The first substrate is peeled off.

[0018] Etch the target area of the first flexible substrate to form a first through hole in the target area of the first flexible substrate.

[0019] In a possible implementation of the second aspect, fabricating a display panel on a first substrate includes: Prepare a first flexible substrate on the first substrate, and form a first insulating layer on the first flexible substrate.

[0020] Form a second flexible substrate on the first insulating layer, and etch the target area of the second flexible substrate to form a second through hole in the target area of the second flexible substrate. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap.

[0021] In a possible implementation of the second aspect, fabricating a display panel on a first substrate includes: Prepare a first flexible substrate on the first substrate.

[0022] Form a first insulating layer on the first flexible substrate, and etch the target area of the first insulating layer to form a through hole in the target area of the first insulating layer. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the first insulating layer at least partially overlap.

[0023] Form a second flexible substrate on the first insulating layer. Wherein, within the target area of the first insulating layer, the first flexible substrate is in contact with the second flexible substrate.

[0024] After the step of peeling off the first substrate, it further includes: Etch the target area of the second flexible substrate to form a second through hole in the target area of the second flexible substrate. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap. The second through hole is communicated with the first through hole.

[0025] In a third aspect, an embodiment of the present application provides a display device, including the display panel provided in the first aspect.

[0026] In this embodiment, the first insulating layer is in contact with the first flexible substrate, and the first insulating layer is located outside the first through hole, which means that the first through hole does not include the first insulating layer, that is, the first through hole can be hollow, so that the area where the first through hole in the blind hole area of the display panel is not filled with any film layer material, therefore, the light transmittance of the blind hole area is increased. Description of the Drawings

[0027] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0028] Figure 1 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 2 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 3 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 4 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 5 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 6 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 7 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 8 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 9 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 10 Schematic diagram of a display panel provided by an embodiment of the present application; Figure 11 Flowchart of a method for manufacturing a display panel provided by an embodiment of the present application; Figure 12 Schematic diagram of a display device provided by an embodiment of the present application.

[0029] Label description 100, display panel; 101, blind hole area; 102, through hole; 110, first flexible substrate; 111, first through hole; 120, first insulating layer; 121, first hole; 130, second flexible substrate; 131, second through hole; 140, second insulating layer; 141, second hole; 150, array layer; 160, planarization layer; 170, first electrode layer; 171, third through hole; 180, thin film encapsulation layer; 190, first metal layer; 191, first metal part. Detailed implementation manners

[0030] To better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0031] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0032] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0033] It should be understood that the term "and / or" used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0034] In the related art, some of the film layers such as the cathode layer, the array substrate, and the flexible substrate in the blind hole display panel are not removed. The superposition of each film layer results in a low overall light transmittance of the display panel, thereby affecting the imaging ability of the imaging module.

[0035] As Figures 1 to 3 shown, an embodiment of the present application provides a display panel 100, including a blind hole area 101. In a possible implementation, the blind hole area 101 is an area where blind holes or through holes are formed in some of the film layers of all the film layers of the display panel 100. It should be noted that the blind holes in the blind hole area 101 are for the display panel 100, rather than for a certain film layer in the display panel 100. For example, a certain film layer in the display panel 100 may have a through hole, but due to the formation of blind holes or non-opening of other film layers, at least one end of the through hole will be blocked, thereby forming a blind hole. Therefore, in the final product display panel 100, the through hole in this film layer is a blind hole in the display panel 100. Therefore, the display panel 100 provided by the embodiment of the present application is a blind hole screen, that is, a display panel 100 with blind holes.

[0036] As Figures 1 to 3As shown, in one embodiment of the present application, the display panel 100 includes a first flexible substrate 110 and a first insulating layer 120. The first flexible substrate 110 includes a first surface, which is the surface of the backlight side of the display panel 100, so the first flexible substrate 110 is the substrate located on the outermost surface of the display panel 100. For example, the light-emitting side of the display panel 100 is located on the upper side, and the backlight side is located on the lower side, then the first flexible substrate 110 is the film layer on the lower side of the display panel 100. The first flexible substrate 110 includes a first through hole 111. The first through hole 111 is located in the blind hole area 101. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first through hole 111 penetrates the first flexible substrate 110.

[0037] The first insulating layer 120 is in contact with the first flexible substrate 110 and is located on the side of the first flexible substrate 110 facing the light-emitting surface of the display panel 100, and the first insulating layer 120 is located outside the first through hole 111. The first insulating layer 120 is located on the side of the first flexible substrate 110 away from the first surface and in contact with the first flexible substrate 110. Therefore, taking the light-emitting side of the display panel 100 as an example, the backlight side is located at the upper side and the backlight side is located at the lower side, the first insulating layer 120 can be the second film layer of the display panel 100 from the bottom to the top. The first insulating layer 120 is located outside the first through hole 111, which means that the first through hole 111 is not filled by the first insulating layer 120. Therefore, the first through hole 111 is hollow, so the first through hole 111 has good light transmittance, thereby making the blind hole area 101 of the display panel 100 have good light transmittance.

[0038] like Figure 1 As shown, in a possible implementation, the first insulating layer 120 includes a first portion, and along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first portion of the first insulating layer 120 overlaps with the first through hole 111, and the first portion of the first insulating layer 120 covers the port of the first through hole 111 toward the light-emitting side of the display panel 100. For example, the first insulating layer 120 has no openings in the blind hole area 101, and neither blind holes nor through holes are opened. In this implementation, the first insulating layer 120 in the blind hole area has no openings, which can reduce the complexity of the process and help reduce costs.

[0039] In a possible implementation, the first insulating layer 120 includes a first hole 121, and the first hole 121 is located in the blind hole area 101. The first hole 121 may be Figure 2 The first hole 121 may also be a blind hole as shown. Figure 3 In this implementation, opening the first hole 121 in the blind hole area 101 is beneficial to further improve the light transmittance.

[0040] In this embodiment, the first insulating layer 120 is in contact with the first flexible substrate 110, and the first insulating layer 120 is located outside the first through hole 111, which means that the first through hole 111 does not include the first insulating layer 120, that is, the first through hole 111 can be hollow, so that the area where the first through hole 111 of the blind hole area 101 of the display panel 100 is located is not filled with any film layer material, thereby increasing the light transmittance of the blind hole area 101.

[0041] like Figure 4 As shown, in one embodiment of the present application, the display panel 100 further includes: a second flexible substrate 130 and a second insulating layer 140. The second flexible substrate 130 is located on a side of the first insulating layer 120 away from the first flexible substrate 110, and the second flexible substrate 130 includes a second through hole 131, and the second through hole 131 is located in the blind hole area 101. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the second through hole 131 penetrates the second flexible substrate 130. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first through hole 111 and the second through hole 131 at least partially overlap. The second insulating layer 140 contacts the second flexible substrate 130, and the second insulating layer 140 is located on a side of the second flexible substrate 130 away from the first flexible substrate 110. The second insulating layer 140 includes a first portion, and the first portion of the second insulating layer 140 is located in the second through hole 131.

[0042] In this embodiment, the second through hole 131 is provided on the second flexible substrate 130, which means that the second flexible substrate 130 in the area where the second through hole 131 is located is removed, thereby facilitating the improvement of light transmittance. The first part of the second insulating layer 140 is located in the second through hole 131, which is conducive to the process implementation and reduces the process cost. At the same time, the display panel 100 is provided with two flexible substrates to play a protective and risk prevention role. For example, when the first flexible substrate 110 is accidentally damaged by collision, wear and tear, etc., the second flexible substrate 130 can continue to provide protection and support for other film layers in the display panel 100 located on the light-emitting side of the second flexible substrate 130.

[0043] like Figure 4 As shown, in a possible implementation, the second insulating layer 140 is an inorganic insulating layer, and the first portion of the second insulating layer 140 is conformally attached to the inner wall of the second through hole 131. In this implementation, along the stacking direction of the second flexible substrate 130 and the second insulating layer 140, the thickness of the first portion of the second insulating layer 140 is significantly smaller than the thickness of the second flexible substrate 130, and the light transmittance of the second insulating layer 140 is due to the second flexible substrate 130. Therefore, although the first portion of the second insulating layer 140 blocks the second through hole 131, the overall light transmittance of the blind hole area 101 of the display panel 100 is still improved.

[0044] As shown Figure 5 In a possible implementation, as shown, the display panel 100 further includes an array layer 150 and a planarization layer 160. The array layer 150 is located on a side of the second insulating layer 140 away from the second flexible substrate 130. The planarization layer 160 is located on a side of the array layer 150 away from the second flexible substrate 130. The array layer 150 includes a first portion, and the first portion of the array layer 150 conformally adheres to the inner wall of the second through hole 131. The planarization layer 160 planarizes the array layer 150. In this implementation, the second portion is filled by the array layer 150, and planarization is achieved by the planarization layer 160, that is, the second flexible substrate 130 located in the second through hole 131 is removed, thereby facilitating the improvement of the light transmittance. And the second through hole 131 is filled, blocking the intrusion of water and oxygen from the second through hole 131 into the interior of the display panel 100, thereby facilitating the protection of the electrical or optical devices inside the display panel 100 from the intrusion of external water and oxygen.

[0045] As shown Figure 4 Or Figure 5 In a possible implementation, as shown, the second through hole 131 includes a first port and a second port. The first port of the second through hole 131 is located at one end of the second through hole 131 facing the first flexible substrate 110, and the second port of the second through hole 131 is located at one end of the second through hole 131 away from the first flexible substrate 110. The area of the first port of the second through hole 131 is smaller than the area of the second port of the second through hole 131.

[0046] In this implementation, the area of the first port is smaller than the area of the second port, which means that the large opening of the second through hole 131 faces the light-emitting side, and the small opening faces the backlight side. Such an opening of the second through hole 131 facilitates the step treatment in the subsequent process and ensures the continuity of the film layer or the circuit.

[0047] As shown Figure 6 In an embodiment of the present application, as shown, the display panel 100 further includes: a second flexible substrate 130 and a second insulating layer 140. The second flexible substrate 130 is located on a side of the first insulating layer 120 away from the first flexible substrate 110. The second flexible substrate 130 includes a second through hole 131. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the second through hole 131 penetrates through the second flexible substrate 130. The second through hole 131 communicates with the first through hole 111. The second insulating layer 140 is in contact with the second flexible substrate 130, and is located on a side of the second flexible substrate 130 away from the first flexible substrate 110, and the second insulating layer 140 is located outside the second through hole 131.

[0048] In this implementation manner, the second through-hole 131 is in communication with the second through-hole 131, and the second insulating layer 140 is located outside the second through-hole 131, which means that through-holes are formed on both the first flexible substrate 110 and the second flexible substrate 130, and neither of these two through-holes is filled with other film layers. For example, both the first through-hole 111 and the second through-hole 131 are in a hollow state, thereby improving the light transmittance of the regions where the first through-hole 111 and the second through-hole 131 are located, and ultimately enhancing the light transmittance of the blind hole region 101 of the display panel 100.

[0049] In this implementation manner, the first insulating layer 120 includes a first hole 121. The first hole 121 is located in the blind hole region 101 and is a through-hole. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first hole 121 penetrates through the first insulating layer 120, and the first through-hole 111, the second through-hole 131, and the first hole 121 overlap. The first through-hole 111 and the second through-hole 131 are in communication through the first hole 121.

[0050] As Figure 6 shown, in a possible implementation manner, the second insulating layer 140 includes a first portion. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first portion of the second insulating layer 140 overlaps with the second through-hole 131, and the first portion covers the port of the second through-hole 131 facing the light-emitting side of the display panel 100. That is, the second insulating layer 140 does not have an opening (including neither a blind hole nor a through-hole) in the region where the second through-hole 131 is located. The second insulating layer 140 has a protective and supporting effect on the film layers located on its light-emitting side.

[0051] As Figure 7 or Figure 8 shown, in a possible implementation manner, the second insulating layer 140 includes a second hole 141. The second hole 141 is located in the blind hole region 101. The second hole 141 can be a blind hole as Figure 7 shown or a through-hole as Figure 8 shown. The first opening of the second hole 141 faces the first flexible substrate 110. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the second hole 141, the first through-hole 111, the second through-hole 131, and the first hole 121 overlap. The first opening of the second hole 141 is in communication with the second through-hole 131. By forming the second hole 141 in the second insulating layer 140 and making the second hole 141 in communication with the second through-hole 131, for example, both the second hole 141, the first through-hole 111, the second through-hole 131, and the first hole 121 are hollow, thereby increasing the light transmittance.

[0052] In a possible implementation, the maximum height of the second flexible substrate 130 is less than or equal to 8 um along the stacking direction of the first flexible substrate 110 and the first insulating layer 120. The maximum height of the second flexible substrate 130 is less than or equal to 8 um, which is conducive to reducing the overall thickness of the display panel 100 and making the display panel 100 thinner and lighter.

[0053] like Figures 1 to 8 As shown, in a possible implementation, the first through hole 111 includes a first port and a second port, the first port of the first through hole 111 is located at an end of the first through hole 111 away from the first insulating layer 120, the second port of the first through hole 111 is located at an end of the first through hole 111 facing the first insulating layer 120, and the area of ​​the first port of the first through hole 111 is greater than the area of ​​the second port of the first through hole 111.

[0054] In this implementation, the area of ​​the first port of the first through hole 111 is larger than the area of ​​the second port of the first through hole 111, which means that the large opening of the first through hole 111 faces the backlight side. This design helps reduce process difficulty and thus production costs.

[0055] like Figure 6 or Figure 7 or Figure 8 As shown, in a possible implementation, the display panel 100 further includes: a second flexible substrate 130 and a second insulating layer 140. The second flexible substrate 130 is located on a side of the first insulating layer 120 away from the first flexible substrate 110, and the second flexible substrate 130 includes a second through hole 131, and the second through hole 131 penetrates the second flexible substrate 130 along the stacking direction of the first flexible substrate 110 and the first insulating layer 120. The display panel 100 further includes a through hole 102, and the through hole 102 includes a first through hole 111 and a second through hole 131. The second through hole 131 is connected to the first through hole 111. The second insulating layer 140 contacts the second flexible substrate 130 and is located on a side of the second flexible substrate 130 away from the first flexible substrate 110, and the second insulating layer 140 is located outside the second through hole 131. The port area of ​​the through hole 102 facing the backlight side is larger than the port area facing the light emitting side. For example, as Figure 6 As shown, when the second insulating layer 140 does not open a hole in the blind hole area 101, the end of the through hole 102 facing the light-emitting side is the end of the second through hole 131 facing the light-emitting side; the end of the through hole 102 facing the backlight side is the end of the first through hole 111 facing the backlight side.

[0056] In this implementation, the through hole 102 gradually decreases from the backlight side port toward the light output side port, which can improve the light transmittance on one hand, reduce the process difficulty on the other hand, and ultimately reduce the production cost.

[0057] likeFigure 5 or Figure 6 As shown in Figure 6 , in an embodiment of the present application, the display panel 100 further includes a first electrode layer 170. The first electrode layer 170 includes a third through hole 171 and a first portion. The first portion of the first electrode layer 170 is in contact with the third through hole 171. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the third through hole 171 penetrates through the first electrode layer 170. In a possible implementation manner, the first electrode layer 170 is a cathode layer.

[0058] As Figures 1 to 4 shown in Figures 1 to 4 , in a possible implementation manner, along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first portion of the first electrode layer 170 overlaps with the target port, and the target port covers the third through hole 171. Wherein, the target port is the port with the smallest area among the first port of the first through hole 111, the second port of the first through hole 111, the first port of the second through hole 131, and the second port of the second through hole 131. In this implementation manner, the first portion of the first electrode layer 170 overlapping with the target port helps prevent over-etching during the etching of the first through hole or the through hole, thereby causing too high a light transmittance and having a negative impact on the imaging function of the imaging module.

[0059] As Figure 5 or Figure 6 shown in Figure 6 , in a possible implementation manner, along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first portion of the first electrode layer 170 does not overlap with the target port, and the target port is the port with the smallest area among the first port of the first through hole 111, the second port of the first through hole 111, the first port of the second through hole 131, and the second port of the second through hole 131.

[0060] In this embodiment, the area of the third through hole 171 is larger than the area of the target port, so as to ensure that the first through hole 111 or the through hole 102 will not be blocked by the first portion, and by providing the third through hole 171 on the first electrode layer 170, that is, removing the first electrode layer 170 in the area where the third through hole 171 is located, the light transmittance is improved.

[0061] As Figure 5 shown in Figure 5 , in a possible implementation manner, the target port is the second port of the first through hole 111. The second port of the first through hole 111 has the smallest area, which means that the first through hole 111 is not blocked by the second flexible substrate 130, thus helping to improve the light transmittance.

[0062] As Figure 9As shown, in a possible implementation, the display panel 100 further includes: a first electrode layer 170, that is, a first metal layer 190. The first electrode layer 170 includes a third through hole 171 and a first portion, and the first portion of the first electrode layer 170 is in contact with the third through hole 171. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the first portion of the first electrode layer 170 overlaps with the target port, and the target port is the port with the smallest area among the first port of the first through hole 111, the second port of the first through hole 111, the first port of the second through hole 131, and the second port of the second through hole 131. The first metal layer 190 is located on the side of the second insulating layer 140 away from the second flexible layer, and the first metal layer 190 includes a first metal portion 191, and the first metal portion 191 is located in the second through hole 131. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120 , the first metal portion 191 overlaps with a first portion of the first insulating layer 120 , and the first metal portion 191 does not overlap with the third through hole 171 .

[0063] In this implementation, the first metal portion 191 can protect the first portion of the first electrode layer 170 from being affected by laser ablation, thereby protecting the first portion of the first electrode layer 170 .

[0064] like Figure 9 As shown, in one embodiment of the present application, the display panel 100 further includes: a first electrode layer 170 and a thin film encapsulation layer 180. The first electrode layer 170 is located on a side of the first insulating layer 120 away from the first flexible substrate 110, and the first electrode layer 170 includes a third through hole 171. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the third through hole 171 at least partially overlaps with the first through hole 111. The thin film encapsulation layer 180 is located on a side of the first electrode layer 170 away from the first flexible substrate 110 layer, and the thin film encapsulation layer 180 includes a first portion, and the first portion of the thin film encapsulation layer 180 is located in the third through hole 171. For example, Figure 9 As shown, the first portion of the thin film encapsulation layer 180 completely fills the third through hole 171 , that is, the third through hole 171 is filled up by the first portion of the thin film encapsulation layer 180 .

[0065] In the present embodiment, the third through hole 171 is filled with the first portion of the thin film encapsulation layer 180 , thereby achieving encapsulation of the third through hole 171 , thereby reducing the probability of water and oxygen invading the interior of the display panel 100 .

[0066] like Figure 10As shown, in an embodiment of the present application, the display panel 100 further includes: a first electrode layer 170 and a thin film encapsulation layer 180. The first electrode layer 170 is located on a side of the first insulating layer 120 facing away from the first flexible substrate 110. The first electrode layer 170 includes a third through hole 171. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the third through hole 171 penetrates through the first electrode layer 170. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the third through hole 171 at least partially overlaps with the first through hole 111. The thin film encapsulation layer 180 is located on a side of the first electrode layer 170 facing away from the first flexible substrate 110 layer, and the thin film encapsulation layer 180 is located outside the third through hole 171.

[0067] In this embodiment, the thin film encapsulation layer 180 is located outside the third through hole 171 of the first electrode layer 170, which means that the third through hole 171 can be hollow. Thereby, the light transmittance of the blind hole area 101 of the display panel 100 can be improved.

[0068] As Figure 9 or Figure 10 As shown, in a possible implementation manner, the display panel 100 further includes: a thin film encapsulation layer 180. Along the stacking direction of the first flexible substrate 110 and the first insulating layer 120, the thin film encapsulation layer 180 covers the first flexible substrate 110. The thin film encapsulation layer 180 includes a first surface. The first surface of the thin film encapsulation layer 180 is located on a side of the thin film encapsulation layer 180 facing away from the first flexible substrate 110, and the first surface of the thin film encapsulation layer 180 is a whole surface structure.

[0069] In this implementation manner, the first surface of the thin film encapsulation layer 180 being a whole surface structure can ensure that the thin film encapsulation layer 180 can perform a whole surface encapsulation on the display panel 100, thereby reducing the probability of the internal electrical devices or optical devices of the display panel 100 being invaded by water and oxygen. In a possible implementation manner, the first surface of the thin film encapsulation layer 180 can be a planar structure.

[0070] In summary, for the display panel 100 provided by the embodiment of the present application, the first through hole 111 and the second through hole 131 are provided in the blind hole area 101, which means that the first flexible substrate 110 and the second flexible substrate 130 in the blind hole area 101 are removed. The removal of the first flexible substrate 110 and the second flexible substrate 130 is beneficial to reducing the light absorption rate, and thus beneficial to improving the light transmittance.

[0071] As Figure 11 As shown, the embodiment of the present application further provides a method for manufacturing a display panel, including: S100, fabricate a display panel on a first substrate. The display panel includes a first flexible substrate and a first insulating layer. The first flexible substrate includes a first surface, which is the surface on the backlight side of the display panel. The first insulating layer is in contact with the first flexible substrate and is located on the side of the first flexible substrate facing the light-emitting surface of the display panel.

[0072] In a possible implementation, the first substrate can be a support plate, such as a glass substrate. Fabricate the display panel according to the process sequence in the related art. For example, sequentially form a first flexible substrate, a first insulating layer, an array layer, a planarization layer, a first electrode layer, and a thin film encapsulation layer, etc. on the first substrate.

[0073] S200, peel off the first substrate.

[0074] In step S200, after fabricating the display panel, the first substrate needs to be peeled off from the backlight side of the display panel. Specifically, the first substrate needs to be peeled off from the first flexible substrate. In step S200, the peeling of the first substrate can be achieved according to the peeling process in the related art, which will not be elaborated here.

[0075] S300, etch a target area of the first flexible substrate to form a first through hole in the target area of the first flexible substrate.

[0076] In step S300, use laser etching to remove the first flexible substrate in the target area of the first flexible substrate to obtain a first through hole. The first through hole penetrates the first flexible substrate. The target area of the first flexible substrate is located within a preset blind hole area. In a possible implementation, the target area of the first flexible substrate coincides with the blind hole area.

[0077] In this embodiment, the target area of the first flexible substrate is etched after peeling off the first substrate to remove the first flexible substrate within the target area, thereby increasing the light transmittance, and the first through hole and the film layer on the side of the first flexible substrate facing the light-emitting side form a blind hole structure, achieving the purpose of preventing water and oxygen intrusion while omitting structures such as spacer posts. Therefore, the manufacturing method of the display panel provided by the embodiments of the present application achieves the purposes of reducing the process complexity, saving production costs, and preventing water and oxygen intrusion.

[0078] In a possible implementation, fabricating the display panel on the first substrate includes: S110, prepare a first flexible substrate on the first substrate and form a first insulating layer on the first flexible substrate.

[0079] S120. Form a second flexible substrate on the first insulating layer, and etch a target area of the second flexible substrate to form a second through hole in the target area of the second flexible substrate. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap.

[0080] Wherein, the target area of the second flexible substrate is located within a preset blind hole area of the display panel. In a possible implementation, the target area of the second flexible substrate coincides with the blind hole area.

[0081] After the second flexible substrate is formed, the second flexible substrate located within the target area is etched to obtain the second through hole. Therefore, the etching of the target area of the second flexible substrate can be carried out by dry etching or wet etching. Therefore, etching immediately after the second flexible substrate is formed increases the selectivity of the etching method. At the same time, for example, using wet etching is also conducive to saving production costs and effectively preventing the occurrence of film layer collapse in the second through hole.

[0082] In a possible implementation, fabricating a display panel on the first substrate includes: S101. Prepare a first flexible substrate on the first substrate.

[0083] S102. Form a first insulating layer on the first flexible substrate, and etch a target area of the first insulating layer to form a through hole in the target area of the first insulating layer. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the first insulating layer at least partially overlap.

[0084] In step S102, the first insulating layer is etched and a through hole is formed to lay a good foundation for subsequent steps.

[0085] S103. Form a second flexible substrate on the first insulating layer. Wherein, within the target area of the first insulating layer, the first flexible substrate is in contact with the second flexible substrate.

[0086] The contact between the first flexible substrate and the second flexible substrate within the target area of the first insulating layer facilitates the formation of the second through hole and the first through hole in subsequent steps.

[0087] After the step of peeling off the first substrate, it further includes: S400. Etch the target area of the second flexible substrate to form a second through hole in the target area of the second flexible substrate, and the first through hole and the second through hole are connected. Wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap.

[0088] In a possible implementation, step S300 and step S400 can be carried out simultaneously. Since the first flexible substrate and the second flexible substrate are in contact within the target area of the first insulating layer, during etching, the first flexible substrate and the second flexible substrate within this area can be removed simultaneously using laser etching to improve the transmittance of the blind via area. The display panel obtained by the method provided in this implementation can be Figures 6 to 8 any of the display panels shown in

[0089] As Figure 12 shown, the embodiment of the present application further provides a display device 200, including the display panel 100 provided in any of the foregoing embodiments or implementations.

[0090] The display device provided by the embodiment of the present application has a good light transmittance in the blind via area and does not require a complex structure for water vapor intrusion isolation. Therefore, it has the advantages of low production cost, strong water and oxygen intrusion resistance, and high cost performance.

[0091] For the same and similar parts between the various embodiments in this specification, reference can be made to each other, and the various embodiments or implementations can be combined with each other in the absence of technical conflicts.

Claims

1. A display panel, characterized in that, Including blind hole area; A first flexible substrate, wherein the first flexible substrate comprises a first surface, the first surface is a surface of the backlight side of the display panel, and the first flexible substrate comprises a first through hole; A first insulating layer is in contact with the first flexible substrate and is located on a side of the first flexible substrate facing the light emitting surface of the display panel, and the first insulating layer is located outside the first through hole.

2. The display panel according to claim 1, wherein Also includes: A second flexible substrate is located on a side of the first insulating layer away from the first flexible substrate, the second flexible substrate comprises a second through hole, and along a stacking direction of the first flexible substrate and the first insulating layer, the first through hole and the second through hole at least partially overlap; The second insulating layer contacts the second flexible substrate and is located on a side of the second flexible substrate away from the first flexible substrate; the second insulating layer includes a first portion, and the first portion of the second insulating layer is located in the second through hole.

3. The display panel according to claim 2, wherein The second through hole includes a first port and a second port, the first port of the second through hole is located at an end of the second through hole facing the first flexible substrate, and the second port of the second through hole is located at an end of the second through hole away from the first flexible substrate; the area of ​​the first port of the second through hole is smaller than the area of ​​the second port of the second through hole.

4. The display panel according to claim 1, characterized in that, Also includes: A second flexible substrate is located on a side of the first insulating layer away from the first flexible substrate, the second flexible substrate comprises a second through hole, and the second through hole is connected to the first through hole; The second insulating layer is in contact with the second flexible substrate and is located on a side of the second flexible substrate facing away from the first flexible substrate, and the second insulating layer is located outside the second through hole.

5. The display panel according to any one of claims 2 to 4, characterized in that, Along the stacking direction of the first flexible substrate and the first insulating layer, the maximum height of the second flexible substrate is less than or equal to 8 um.

6. The display panel according to any one of claims 2 to 4, characterized in that, The first through hole includes a first port and a second port. The first port of the first through hole is located at an end of the first through hole away from the first insulating layer, and the second port of the first through hole is located at an end of the first through hole facing the first insulating layer. The area of ​​the first port of the first through hole is greater than the area of ​​the second port of the first through hole.

7. The display panel according to claim 6, wherein, It also includes a first electrode layer, the first electrode layer includes a third through hole and a first part, the first part of the first electrode layer is in contact with the third through hole; along the stacking direction of the first flexible substrate and the first insulating layer, the first part of the first electrode layer does not overlap with the target port, and the target port is the port with the smallest area among the first port of the first through hole, the second port of the first through hole, the first port of the second through hole, and the second port of the second through hole.

8. The display panel according to claim 7, wherein, The target port is a second port of the first through hole.

9. The display panel according to claim 6, wherein, Also includes: a first electrode layer, wherein the first electrode layer comprises a third through hole and a first portion, and the first portion of the first electrode layer contacts the third through hole; Along the stacking direction of the first flexible substrate and the first insulating layer, the first portion of the first electrode layer overlaps with a target port, and the target port is a port with the smallest area among the first port of the first through hole, the second port of the first through hole, the first port of the second through hole, and the second port of the second through hole; A first metal layer is located on a side of the second insulating layer away from the second flexible layer, the first metal layer includes a first metal portion, and the first metal portion is located in the second through hole; along the stacking direction of the first flexible substrate and the first insulating layer, the first metal portion overlaps with a first part of the first insulating layer, and the first metal portion does not overlap with the third through hole.

10. The display panel according to claim 1, wherein, Also includes: a first electrode layer, the first electrode layer being located on a side of the first insulating layer away from the first flexible substrate, the first electrode layer comprising a third through hole, and along a stacking direction of the first flexible substrate and the first insulating layer, the third through hole at least partially overlaps with the first through hole; The thin film encapsulation layer is located on a side of the first electrode layer away from the first flexible substrate layer. The thin film encapsulation layer includes a first portion. The first portion of the thin film encapsulation layer is located in the third through hole.

11. The display panel according to claim 1, characterized in that, Also includes: a first electrode layer, the first electrode layer being located on a side of the first insulating layer away from the first flexible substrate, the first electrode layer comprising a third through hole; along a stacking direction of the first flexible substrate and the first insulating layer, the third through hole at least partially overlaps with the first through hole; The thin film encapsulation layer is located on a side of the first electrode layer away from the first flexible substrate layer, and the thin film encapsulation layer is located outside the third through hole.

12. The display panel according to claim 1, characterized in that, Also includes: a thin film encapsulation layer, along a stacking direction of the first flexible substrate and the first insulating layer, the thin film encapsulation layer covering the first flexible substrate; The thin film encapsulation layer comprises a first surface, the first surface of the thin film encapsulation layer is located on a side of the thin film encapsulation layer away from the first flexible substrate, and the first surface of the thin film encapsulation layer is a whole surface structure.

13. A method for manufacturing a display panel, characterized in that, include: The display panel is manufactured on a first substrate, wherein the display panel includes a first flexible substrate and a first insulating layer; the first flexible substrate includes a first surface, and the first surface is a surface of the backlight side of the display panel; the first insulating layer is in contact with the first flexible substrate, and the first insulating layer is located on a side of the first flexible substrate facing a light emitting surface of the display panel; peeling off the first substrate; The target area of ​​the first flexible substrate is etched to form a first through hole in the target area of ​​the first flexible substrate.

14. The manufacturing method according to claim 13, characterized in that, The manufacturing of the display panel on the first substrate comprises: preparing the first flexible substrate on the first substrate, and forming a first insulating layer on the first flexible substrate; A second flexible substrate is formed on the first insulating layer, and a target area of the second flexible substrate is etched to form a second through hole in the target area of the second flexible substrate; wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap.

15. The manufacturing method according to claim 13, wherein The manufacturing of the display panel on the first substrate includes: Preparing the first flexible substrate on the first substrate; Forming a first insulating layer on the first flexible substrate, and etching a target area of the first insulating layer to form a through hole in the target area of the first insulating layer, wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the first insulating layer at least partially overlap; Forming a second flexible substrate on the first insulating layer; wherein, within the target area of the first insulating layer, the first flexible substrate is in contact with the second flexible substrate; After the step of peeling the first substrate, it further includes: Etching a target area of the second flexible substrate to form a second through hole in the target area of the second flexible substrate; wherein, along the stacking direction of the first flexible substrate and the first insulating layer, the target area of the first flexible substrate and the target area of the second flexible substrate at least partially overlap; the second through hole is in communication with the first through hole.

16. A display device, characterized in that, Including the display panel according to any one of claims 1-12.

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