Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel, the display panel comprises a display area and a test area located on at least one side of the display area, and the display panel further comprises a substrate, an isolation structure, a light emitting layer, a first packaging layer and an insulating layer. The isolation structure is arranged on the substrate and forms a plurality of isolation openings in a surrounding mode so that the light-emitting layer can be separated to form light-emitting units which are disconnected with one another. The first packaging layer comprises a packaging part, the packaging part comprises a first packaging part and a second packaging part, and the second packaging part is located on the side, away from the substrate, of the isolation structure. And a second gap is arranged between the adjacent packaging parts. The insulating layer fills the second gap in the test area. And the thickness of the insulating layer is greater than or equal to that of the first gap, so that the insulating layer fully shields the first gap in the second gap, the problem that water and oxygen in the test area are easy to enter the first gap to damage the packaging of the first packaging layer, and consequently the edge of the packaging part is tilted is solved, and the use performance of the OLED display panel is improved.

Description

Technical Field

[0001] The present application relates to the display field, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising a display panel including a display area and a test area located at least on one side of the display area, the display panel further comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer including a light-emitting unit located at the isolation opening; a first encapsulation layer including encapsulation parts that are independent of each other and located on the side of the light-emitting unit away from the substrate, the encapsulation parts including a first encapsulation part and a second encapsulation part that are connected to each other, the first encapsulation part is located at the isolation opening, the second encapsulation part is located on the side of the isolation structure away from the substrate, a first gap exists between the second encapsulation part and the isolation structure, and a second gap is formed by spacing adjacent encapsulation parts; an insulating layer, at least a portion of the insulating layer fills the second gap located in the test area, and the thickness of the insulating layer is greater than or equal to the dimension of the first gap along the thickness direction of the display panel.

[0006] According to an implementation of the first aspect of the present application, at least a portion of the insulating layer is located at a side of the first packaging portion facing away from the substrate in the test area.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion has a side wall facing the second gap, and the insulating layer covers at least a portion of the side wall.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the insulating layer includes an insulating portion located in the test area and filling the second gap, the insulating portion is staggered with the first gap, or at least a portion of the insulating portion is located in the first gap.

[0009] According to any of the foregoing embodiments of the first aspect of the present application, the insulating portion located in the test area is in contact with the isolation structure.

[0010] According to any of the foregoing embodiments of the first aspect of the present application, the insulating portion covers at least a part of the surface of the isolation structure facing away from the substrate.

[0011] According to any of the foregoing embodiments of the first aspect of the present application, the positive projection of the second gap on the substrate is located within the positive projection of the isolation structure on the substrate.

[0012] According to any of the foregoing embodiments of the first aspect of the present application, the size of the first gap in the thickness direction of the display panel is greater than or equal to 400 nm; and / or, the thickness of the insulating layer is greater than or equal to 500 nm.

[0013] According to any of the foregoing embodiments of the first aspect of the present application, the display panel further includes: a touch control layer located on the side of the insulating layer facing away from the substrate, the touch control layer includes touch control electrodes located in the display area, and the touch control electrodes are self-capacitive touch control electrodes.

[0014] According to any of the foregoing embodiments of the first aspect of the present application, the insulating layer includes a first insulating layer and a second insulating layer that are stacked and located in both the display area and the test area at the same time, the second insulating layer is located between the first insulating layer and the touch control layer, and the first insulating layer and the second insulating layer located in the test area fill the second gap and are stacked to form an insulating portion.

[0015] According to any of the foregoing embodiments of the first aspect of the present application, the material of the insulating layer includes an inorganic material.

[0016] According to any of the foregoing embodiments of the first aspect of the present application, the inorganic material includes at least one of silicon nitride or silicon oxide.

[0017] According to any of the foregoing embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0018] According to any of the foregoing embodiments of the first aspect of the present application, the display panel further includes: a second encapsulation layer located in the display area and on the side of the first encapsulation layer facing away from the substrate, the second encapsulation layer fills the second gap in the display area; a third encapsulation layer, at least a part of the third encapsulation layer is located in the display area and on the side of the second encapsulation layer facing away from the substrate.

[0019] According to any of the foregoing embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an organic material.

[0020] According to any of the foregoing embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0021] According to any of the foregoing embodiments of the first aspect of the present application, the third encapsulation layer is disposed on the same layer as the insulating layer.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the third packaging layer extends to the test area, and the third packaging layer located in the test area is reused as an insulating layer.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a first electrode layer located between the light-emitting layer and the first encapsulation layer, the first electrode layer including a first electrode located in the isolation opening, and the first electrode is electrically connected to the isolation structure.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of each light-emitting unit on the substrate is located within the orthographic projection of each first electrode on the substrate.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit and the isolation structure are spaced apart.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the substrate includes an array circuit, which is located in the display area and is used to control the light-emitting units located in the display area to emit light.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first conductive layer and a second layer, the second layer is located on a side of the first conductive layer away from the substrate, and the first electrode is electrically connected to the first conductive layer.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a conductive material or an insulating material.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a metal material, and the first conductive layer and the second layer are made of different materials.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on the side of the first conductive layer facing the substrate, and the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0032] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes:

[0033] The pixel definition layer is located on the substrate. The pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion. The pixel opening is connected to the isolation opening.

[0034] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second electrode, and the second electrode is exposed by the pixel opening.

[0035] According to another embodiment of the first aspect of the present application, there is provided a display panel, comprising a display area and a test area located at least on one side of the display area, the display panel further comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit located at the isolation opening; a first encapsulation layer comprising encapsulation portions that are independent of each other and located on the side of the light-emitting unit away from the substrate, the encapsulation portions comprising a first encapsulation portion and a second encapsulation portion that are connected to each other, the first encapsulation portion being located at the isolation opening, the second encapsulation portion being located on the side of the isolation structure away from the substrate, a first gap being present between the second encapsulation portion and the isolation structure, and a second gap being formed by spacing adjacent encapsulation portions; a second encapsulation layer being located in the display area and on the side of the first encapsulation layer away from the substrate; a third encapsulation layer, at least a portion of the third encapsulation layer being located on the side of the second encapsulation layer away from the substrate, the third encapsulation layer filling the second gap located in the test area, and a thickness of the third encapsulation layer being greater than or equal to a dimension of the first gap along a thickness direction of the display panel.

[0036] According to any of the aforementioned implementations of the first aspect of the present application, the third packaging layer located in the test area is in contact with the isolation structure.

[0037] An embodiment of a second aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0038] An embodiment of a third aspect of the present application provides a method for preparing a display panel, wherein the display panel includes a display area and a test area located on at least one side of the display area, and the preparation method further includes:

[0039] An isolation structure is prepared on the substrate, wherein the isolation structure encloses an isolation opening;

[0040] A light-emitting layer is prepared on a substrate, wherein the light-emitting layer includes light-emitting units located in the isolation openings;

[0041] A first encapsulation layer is prepared on the substrate, the first encapsulation layer includes encapsulation parts that are independent of each other and located on the side of the light-emitting unit away from the substrate, the encapsulation parts include a first encapsulation part and a second encapsulation part that are connected to each other, the first encapsulation part is located at the isolation opening, the second encapsulation part is located on the side of the isolation structure away from the substrate, a first gap exists between the second encapsulation part and the isolation structure, and adjacent encapsulation parts are spaced to form a second gap;

[0042] An insulating layer is prepared on the side of the first encapsulation layer away from the substrate, at least part of the insulating layer fills the second gap in the test area, and the thickness of the insulating layer is greater than or equal to the dimension of the first gap along the thickness direction of the display panel.

[0043] According to the display panel of the embodiment of the present application, the display panel includes a display area and a test area located at least on one side of the display area, and the display panel also includes a substrate, an isolation structure, a light-emitting layer, a first encapsulation layer and an insulating layer. The isolation structure is arranged on the substrate and encloses a plurality of isolation openings to separate the light-emitting layer to form mutually disconnected light-emitting units, thereby reducing the crosstalk of carriers in the light-emitting layer, improving the display effect of the display panel, and the light-emitting unit does not need to use a precision mask plate, which can reduce the development and use of the precision mask plate and reduce the preparation cost. The first encapsulation layer includes an encapsulation part, and the encapsulation part includes a first encapsulation part and a second encapsulation part. The first encapsulation part is located in the isolation opening to encapsulate the light-emitting unit, and the second encapsulation part is located on the side of the isolation structure away from the substrate to encapsulate the isolation structure. A second gap is provided between adjacent encapsulation parts. The second gap is used to etch the redundant light-emitting unit located on the side of the isolation structure away from the substrate, thereby forming a first gap between the second encapsulation part and the isolation structure. At least part of the insulating layer fills the second gap located in the test area to achieve the encapsulation of the second gap by the insulating layer, and reduce the invasion of water and oxygen into the isolation structure. And the thickness of the insulating layer is greater than or equal to the first gap, so that the insulating layer can fully shield the first gap in the second gap, thereby improving the problem that water and oxygen in the test area can easily enter the first gap to destroy the encapsulation of the first encapsulation layer, thereby causing the edge of the encapsulation part to warp, thereby improving the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0045] Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application;

[0046] Figure 2 is a partial cross-sectional view of a display panel test area provided in an embodiment of the present application;

[0047] Figure 3 is a partial top view of a display panel test area provided in an embodiment of the present application;

[0048] Figure 4 is a partial cross-sectional view of a display panel test area in another embodiment;

[0049] Figure 5 is a partial cross-sectional view of a display panel test area in another embodiment;

[0050] Figure 6 is a partial cross-sectional view of a display panel test area in yet another embodiment;

[0051] Figure 7 It is a partial cross-sectional view of the display area of a display panel provided by an embodiment of the present application;

[0052] Figure 8 It is a partial cross-sectional view of the display area of the display panel in another embodiment;

[0053] Figure 9 It is a partial cross-sectional view of the test area of a display panel provided by an embodiment of the present application;

[0054] Figure 10 It is a partial cross-sectional view of the display area of the display panel in yet another embodiment;

[0055] Figure 11 It is a partial cross-sectional view of the test area of the display panel in still another embodiment;

[0056] Figure 12 It is a partial cross-sectional view of the display area of the display panel in still another embodiment;

[0057] Figure 13 It is a partial cross-sectional view of the test area of the display panel in yet another embodiment;

[0058] Figure 14 It is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present application.

[0059] Explanation of reference numerals:

[0060] 10, display panel;

[0061] 100, substrate; 110, array circuit;

[0062] 200, isolation structure; 210, first conductive layer; 220, second layer; 230, third layer; 240, isolation opening;

[0063] 300, light-emitting layer; 310, light-emitting unit;

[0064] 400, first encapsulation layer; 410, encapsulation part; 411, first encapsulation part; 412, second encapsulation part; 413, side wall; 420, second gap; 430, first gap; 440, second encapsulation layer; 450, third encapsulation layer;

[0065] 500, insulating layer; 501, first insulating layer; 502, second insulating layer; 510, insulating part;

[0066] 600, touch layer; 610, touch electrode;

[0067] 700, first electrode layer; 710, first electrode;

[0068] 800, Pixel Definition Layer; 810, Pixel Limiting Portion; 820, Pixel Opening; 830, Second Electrode;

[0069] AA, Display Area; TEG, Test Area. Detailed Embodiment

[0070] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions, and advantages of the present application more clear, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0071] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0072] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "above" or "over" another layer or another region, it may mean directly above the other layer or another region, or there may be other layers or regions between it and the other layer or another region. And if the component is flipped, this layer or this region will be "below" or "beneath" the other layer or another region.

[0073] Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. The following will describe the embodiments of the display panel, the display device, and the method for manufacturing a display panel with reference to the accompanying drawings.

[0074] Embodiments of the present application provide a display panel, which may be an Organic Light Emitting Diode (OLED) display panel.

[0075] Please refer to Figures 1 to 4, Figure 1 is a schematic top view of a display panel provided in an embodiment of the present application; Figure 2 is a partial cross-sectional view of a display panel test area provided in an embodiment of the present application;

[0076] Figure 3 is a partial top view of a display panel provided in an embodiment of the present application; Figure 4 FIG. 4 is a partial cross-sectional view of a display panel test area in another embodiment.

[0077] like Figures 1 to 4 As shown, the first aspect of the present application provides a display panel 10, the display panel 10 includes a display area AA and a test area TEG located at least on one side of the display area AA, the display panel 10 also includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first packaging layer 400 and an insulating layer 500; the isolation structure 200 is located on one side of the substrate 100, and is also located in the display area AA and the test area TEG, the isolation structure 200 encloses an isolation opening 240; the light-emitting layer 300 is located on one side of the substrate 100, and is also located in the display area AA and the test area TEG, the light-emitting layer 300 includes a light-emitting unit 310 located in the isolation opening 240; the first packaging layer 400 is also located The display area AA and the test area TEG include a packaging part 410 located on the side of the light-emitting unit 310 away from the substrate 100, the packaging part 410 includes a first packaging part 411 and a second packaging part 412 connected to each other, the first packaging part 411 is located at the isolation opening 240, the second packaging part 412 is located on the side of the isolation structure 200 away from the substrate 100, a first gap 430 exists between the second packaging part 412 and the isolation structure 200, and adjacent packaging parts 410 are spaced to form a second gap 420; at least a portion of the insulating layer 500 fills the second gap 420 located in the test area TEG, and the thickness of the insulating layer 500 is greater than or equal to the dimension of the first gap 430 along the thickness direction of the display panel 10.

[0078] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area AA and a test area TEG located at at least one side of the display area AA, and the display panel 10 also includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first encapsulation layer 400 and an insulating layer 500. The isolation structure 200 is disposed on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and the light-emitting unit 310 does not need to use a precision mask plate to prepare the light-emitting unit 310, which can reduce the development and use of the precision mask plate and reduce the preparation cost. The first encapsulation layer 400 includes an encapsulation portion 410, and the encapsulation portion 410 includes a first encapsulation portion 411 and a second encapsulation portion 412. The first encapsulation portion 411 is located in the isolation opening 240 to encapsulate the light-emitting unit 310, and the second encapsulation portion 412 is located on the side of the isolation structure 200 away from the substrate 100 to encapsulate the isolation structure 200. A second gap 420 is provided between adjacent encapsulation portions 410. The second gap 420 is used to etch the redundant light-emitting unit 310 located on the side of the isolation structure 200 away from the substrate 100, thereby forming a first gap 430 between the second encapsulation portion 412 and the isolation structure 200. At least part of the insulating layer 500 fills the second gap 420 located in the test area TEG, so as to realize the encapsulation of the second gap 420 by the insulating layer 500 and reduce the invasion of water and oxygen into the isolation structure 200. The thickness of the insulating layer 500 is greater than or equal to the first gap 430, so that the insulating layer 500 can fully shield the first gap 430 in the second gap 420, thereby improving the problem that water and oxygen in the TEG in the test area can easily enter the first gap 430 to destroy the encapsulation of the first encapsulation layer 400, thereby causing the edge of the encapsulation part 410 to warp, thereby improving the performance of the OLED display panel 10.

[0079] See also Figure 4 , Figure 4 FIG. 5 is a partial cross-sectional view of a display panel test area in another embodiment. The insulating layer 500 includes an insulating portion 510 located in the test area TEG and filling the second gap 420. The insulating layer 500 may be formed in the test area TEG as follows: Figure 4 As shown, only the second gap 420 is filled, so that the insulating layer 500 can fully shield the first gap 430 in the second gap 420 , and improve the water and oxygen in the test area TEG to easily enter the first gap 430 to destroy the package of the first package layer 400 .

[0080] Optionally, the insulating portion 510 is disposed offset from the first gap 430. In these alternative embodiments, the insulating portion 510 is located within the second gap 420 and is disposed offset from the first gap 430, such that the insulating portion 510 can seal the first gap 430, making it difficult for water and oxygen in subsequent processes to enter the first gap 430 to damage the encapsulation of the first encapsulation layer 400, and reducing the possibility of edge warping of the encapsulation portion 410.

[0081] Please refer to Figure 5 , Figure 5 which is a partial cross-sectional view of the display panel test area in yet another embodiment.

[0082] As Figure 5 shown, optionally, at least a portion of the insulating portion 510 also extends into the first gap 430, that is, the insulating portion 510 is located in the second gap 420 and the first gap 430, further blocking water and oxygen from entering the first gap 430 and reducing the possibility of edge warping of the encapsulation portion 410. As Figure 2 and Figure 4 shown, in some alternative embodiments, the second encapsulation portion 412 has a sidewall 413 facing the second gap 420, and the insulating layer 500 also covers at least a portion of the sidewall 413 in the test area TEG.

[0083] In these alternative embodiments, the insulating layer 500 covers the sidewall 413 to block water and oxygen from entering the first gap 430 through the sidewall 413, and the insulating portion 510 is disposed to cover the sidewall 413, such that the water and oxygen path is between the insulating portion 510 and the sidewall 413, increasing the water and oxygen intrusion path and making it difficult for water and oxygen to enter the first gap 430.

[0084] Optionally, at least a portion of the insulating layer 500 also extends to the side of the first encapsulation portion 411 facing away from the substrate 100 in the test area TEG.

[0085] As Figure 2 shown, optionally, the insulating portion 510 located in the test area TEG contacts the isolation structure 200, so that the insulating portion 510 can fill the second gap 420, further improving the sealing effect of the insulating portion 510 on the first gap 430.

[0087] Please refer to Figure 6 , Figure 6 which is a partial cross-sectional view of the display panel test area in yet another embodiment.

[0088] As Figure 6 shown, optionally, the insulating portion 510 covers at least a portion of the surface of the isolation structure 200 facing away from the substrate 100, such that the insulating portion 510 encapsulates the isolation structure 200, making it difficult for water and oxygen to invade the isolation structure 200 and improving the service life and reliability of the isolation structure 200.

[0089] Optionally, the orthographic projection of the second gap 420 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100 , and the redundant light-emitting material and electrode material in the first gap 430 can be etched through the second gap 420 .

[0090] In some optional embodiments, a dimension of the first gap 430 in the thickness direction of the display panel 10 is greater than or equal to 400 nm; and / or a thickness of the insulating layer 500 is greater than or equal to 500 nm.

[0091] In these optional embodiments, since the dimension of the first gap 430 in the thickness direction of the display panel 10 is greater than or equal to 400 nm, in order to make the thickness of the insulating layer 500 greater than or equal to the dimension of the first gap 430 along the thickness direction of the display panel 10, the thickness of the insulating layer 500 is set to be greater than or equal to 500 nm, so that the insulating layer 500 can fully block the first gap 430 in the second gap 420, thereby improving the problem of water and oxygen in the TEG in the test area easily entering the first gap 430 to destroy the encapsulation of the first encapsulation layer 400, thereby causing the edge of the encapsulation part 410 to warp.

[0092] See also Figure 7 , Figure 7 It is a partial cross-sectional view of a display area of ​​a display panel provided in an embodiment of the present application.

[0093] like Figure 7 As shown, in some optional embodiments, the display panel 10 further includes a touch layer 600 located on a side of the insulating layer 500 facing away from the substrate 100 , and the touch layer 600 includes a touch electrode 610 located in the display area AA.

[0094] In these optional embodiments, the touch layer 600 is located on the side of the insulating layer 500 facing away from the substrate 100, that is, the insulating layer 500 is reused as the insulating layer 500 of the touch layer 600. When the touch electrode 610 of the touch layer 600 is a self-capacitive touch electrode, in the preparation process of the touch electrode 610, the insulating layer 500 can be made thicker, so that the thickness of the insulating layer 500 can be greater than or equal to the size of the first gap 430 along the thickness direction of the display panel 10.

[0095] See also Figure 8 and Figure 9 , Figure 8 is a partial cross-sectional view of a display area of ​​a display panel in another embodiment, Figure 9 It is a partial cross-sectional view of a display panel test area provided in an embodiment of the present application.

[0096] like Figure 8 and Figure 9As shown, in some alternative embodiments, the insulating layer 500 includes a first insulating layer 501 and a second insulating layer 502 that are stacked and located in both the display area AA and the test area TEG simultaneously. The second insulating layer 502 is located between the first insulating layer 501 and the touch layer 600. The first insulating layer 501 and the second insulating layer 502 in the test area TEG fill the second gap 420 and are stacked to form an insulating portion 510.

[0097] In these alternative embodiments, the insulating layer 500 is divided into two layers, namely the first insulating layer 501 and the second insulating layer 502. To obtain a thicker insulating layer 500, the two layers are separately prepared, which can reduce the manufacturing difficulty of the insulating layer 500.

[0098] Optionally, the material of the insulating layer 500 includes an inorganic material. The inorganic material has high density, making it difficult for water and oxygen to enter the first gap 430 through the insulating layer 500.

[0099] Optionally, the inorganic material includes at least one of silicon nitride or silicon oxide.

[0100] In some alternative embodiments, the material of the first encapsulation layer 400 includes an inorganic material.

[0101] In these alternative embodiments, the first encapsulation layer 400 includes an inorganic material. The inorganic material has good density and good barrier properties against water vapor and oxygen. And when both the first encapsulation layer 400 and the insulating portion 510 are inorganic materials, the contact between the first encapsulation layer 400 and the insulating layer 500 is more dense, further blocking water and oxygen from entering the first gap 430.

[0102] As Figure 7 and Figure 8 shown, in some alternative embodiments, the display panel 10 further includes a second encapsulation layer 440 and a third encapsulation layer 450. The second encapsulation layer 440 is located in the display area AA and on the side of the first encapsulation layer 400 away from the substrate 100. The second encapsulation layer 440 fills the second gap 420 in the display area AA; at least a part of the third encapsulation layer 450 is located in the display area AA and on the side of the second encapsulation layer 440 away from the substrate 100.

[0103] In these alternative embodiments, the display panel 10 adopts a three - layer encapsulation, which has good encapsulation performance and reduces the possibility of water and oxygen intrusion. And since the second encapsulation layer 440 and the third encapsulation layer 450 are located in the display area AA and there is no second encapsulation layer 440 and third encapsulation layer 450 in the test area TEG, the first encapsulation layer 400 and the insulating layer 500 can be in direct contact in the test area TEG to achieve the encapsulation of the second gap 420 by the insulating layer 500.

[0104] Optionally, the material of the second encapsulation layer 440 includes an organic material.

[0105] Optionally, the material of the third encapsulation layer 450 includes an inorganic material. The first encapsulation layer 400, the second encapsulation layer 440, and the third encapsulation layer 450 are respectively encapsulated with an inorganic material, an organic material, and an inorganic material to form a TFE (Thin Film Encapsulation) thin film encapsulation structure, further improving the encapsulation performance.

[0106] Please refer to Figure 10 and Figure 11 , Figure 10 which is a partial cross-sectional view of the display area of the display panel in another embodiment; Figure 11 which is a partial cross-sectional view of the test area of the display panel in yet another embodiment;.

[0107] As Figure 10 and Figure 11 shown, optionally, the third encapsulation layer 450 is provided on the same layer as the insulating layer 500, that is, the third encapsulation layer 450 is reused as the insulating layer 500. The third encapsulation layer 450 is located between the second encapsulation layer 440 and the touch layer 600 in the display area AA. The third encapsulation layer is located on the side of the first encapsulation layer 400 facing away from the substrate 100 and fills the second gap 420 in the test area TEG. Since the third encapsulation layer 450 has a relatively large thickness, the third encapsulation layer 450 can fill the second gap 420, so that the insulating layer 500 can fully block the first gap 410 in the second gap 420, improving the problem that water and oxygen in the test area TEG easily enter the first gap 430 to damage the encapsulation of the first encapsulation layer 400, thereby causing the edge of the encapsulation portion 410 to warp, and enhancing the service performance of the OLED display panel 10.

[0108] Please continue to refer to Figure 10 and Figure 11 , optionally, the third encapsulation layer 450 extends to the test area TEG, and the third encapsulation layer 450 located in the test area TEG is reused as the insulating layer 500. Since the third encapsulation layer 450 has a relatively large thickness, the third encapsulation layer 450 can fill the second gap 420, so that the insulating layer 500 can fully block the first gap 410 in the second gap 420, improving the problem that water and oxygen in the test area TEG easily enter the first gap 430 to damage the encapsulation of the first encapsulation layer 400, thereby causing the edge of the encapsulation portion 410 to warp, and enhancing the service performance of the OLED display panel 10.

[0109] Please continue to refer to Figure 10 and Figure 11, in some alternative embodiments, the display panel 10 further includes a first electrode layer 700. The first electrode layer 700 is located between the light-emitting layer 300 and the first encapsulation layer 400. The first electrode layer 700 includes a first electrode 710 located in the isolation opening 240, and the first electrode 710 is electrically connected to the isolation structure 200.

[0110] In these alternative embodiments, the isolation structure 200 partitions the first electrode layer 700 to form spaced-apart first electrodes 710. The spaced-apart first electrodes 710 are electrically connected through the isolation structure 200 to form a whole-surface electrode, ensuring the normal light emission of the light-emitting unit 310.

[0111] In some alternative embodiments, the orthographic projection of each light-emitting unit 310 on the substrate 100 is located within the orthographic projection of each first electrode 710 on the substrate 100.

[0112] In these alternative embodiments, the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 710 on the substrate 100, that is, the first electrode 710 is disposed to cover the light-emitting unit 310 to serve as the electrode of the light-emitting unit 310, ensuring the normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0113] Optionally, the light-emitting unit 310 and the isolation structure 200 are spaced apart, and the light-emitting layer 300 and the isolation structure 200 are spaced apart, that is, the light-emitting units 310 are spaced apart from each other, reducing the crosstalk of carriers between the light-emitting units 310 and improving the color bleeding problem of the light-emitting unit 310.

[0114] Please refer to Figure 12 , Figure 12 is a partial cross-sectional view of the display area of the display panel in yet another embodiment.

[0115] As Figure 12 shown, optionally, the substrate 100 includes an array circuit 110. The array circuit 110 is located in the display area AA and is used to control the light emission of the light-emitting units 310 located in the display area AA.

[0116] Optionally, the array circuit 110 may also be located in the test area TEG. In this application, the description is made with the array circuit 110 disposed in the display area AA.

[0117] In some alternative embodiments, the isolation structure 200 includes a first conductive layer 210 and a second layer 220. The second layer 220 is located on the side of the first conductive layer 210 facing away from the substrate 100. The first electrode 710 is electrically connected to the first conductive layer 210, and the orthographic projection of the first conductive layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100.

[0118] In these alternative embodiments, the first conductive layer 210 and the second layer 220 are arranged to form an isolation structure 200. The orthographic projection of the first conductive layer 210 close to the substrate 100 on the substrate 100 is within the orthographic projection of the second layer 220 on the substrate 100. The area of the second layer 220 is larger than that of the first conductive layer 210. The second layer 220 covers the surface of the first conductive layer 210 close to the second layer 220. At this time, the first conductive layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, a large drop occurs at the edge of the isolation structure 200, and the first conductive layer 210 is concave relative to the second layer 220. It is difficult for the light-emitting layer 300 to connect at the edge of the isolation structure 200, resulting in breakage. The light-emitting layer 300 breaks to form mutually disconnected light-emitting units 310.

[0119] In some alternative embodiments, the second layer 220 includes a conductive material or an insulating material.

[0120] In these alternative embodiments, the second layer 220 includes a conductive material. For example, the second layer 220 includes a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, during the wet etching of the first conductive layer 210 using an etching solution, the second layer 220 is difficult to be etched, so that the first conductive layer 210 can be more easily recessed relative to the second layer 220.

[0121] In some alternative embodiments, the second layer 220 includes a metallic material, and the materials of the first conductive layer 210 and the second layer 220 are different.

[0122] In these alternative embodiments, when both the first conductive layer 210 and the second layer 220 are metallic materials, an etching solution can be used for wet etching the first conductive layer 210. By setting the etching solution, the etching rate of the second layer 220 can be made less than that of the first conductive layer 210. Since the etching rate of the first conductive layer 210 is large, when wet etching with the etching solution, even if the second layer 220 is etched to a certain extent, the first conductive layer 210 is etched faster, so that the first conductive layer 210 is recessed relative to the second layer 220.

[0123] Please refer to Figure 13 , Figure 13 which is a partial cross-sectional view of the test area of the display panel in yet another embodiment.

[0124] As Figure 13 shown, in some alternative embodiments, the isolation structure 200 further includes a third layer 230 on the side of the first conductive layer 210 facing the substrate 100. The orthographic projection of the first conductive layer 210 on the substrate 100 is within the orthographic projection of the third layer 230 on the substrate 100.

[0125] In these alternative embodiments, in order to obtain the first conductive layer 210 with an inward concave setting, during the etching process, the first conductive layer 210 has a faster etching rate relative to the second layer 220 and the third layer 230, thereby forming the inward concave first conductive layer 210. Since the etching rate of the first conductive layer 210 is relatively fast, more waste generated by etching is likely to enter other positions of the display panel 10, resulting in adverse effects. After the third layer 230 is provided, the first conductive layer 210 can be better attached to the third layer 230, and the generated etching waste falls on the third layer 230, facilitating cleaning.

[0126] As Figure 13 shown, in some alternative embodiments, the display panel 10 further includes a pixel definition layer 800. The pixel definition layer 800 is located on the substrate 100. The pixel definition layer 800 includes pixel defining portions 810 and a pixel defining portion 820 formed by enclosing the pixel defining portions 810. The pixel defining portion 820 communicates with the isolation opening 240.

[0127] In these alternative embodiments, the pixel defining portions 810 of the pixel definition layer 800 enclose to form the pixel defining portion 820 to set the light-emitting units 310 and realize the normal light emission of the light-emitting units 310. And the pixel defining portions 810 define the setting areas of the respective light-emitting units 310, reducing color crosstalk defects between the respective light-emitting units 310.

[0128] Optionally, the display panel 10 further includes a second electrode 830. The second electrode 830 is exposed by the pixel defining portion 820. One of the second electrode 830 and the first electrode 710 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. In the embodiments of the present application, the second electrode 830 is taken as an example to be the anode of the light-emitting unit 310, and the first electrode 710 is taken as the cathode of the light-emitting unit 310 for illustration.

[0129] Optionally, the light-emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL).

[0130] Please refer to Figure 10 and Figure 11According to another embodiment of the first aspect of the present application, a display panel 10 is provided. The display panel 10 includes a display area AA and a test area TEG located at at least one side of the display area AA. The display panel 10 also includes: a substrate 100; an isolation structure 200 located at one side of the substrate 100, the isolation structure 200 encloses and forms an isolation opening 240; a light-emitting layer 300 located at one side of the substrate 100, the light-emitting layer 300 includes a light-emitting unit 310 located at the isolation opening 240; a first encapsulation layer 400, including an encapsulation part 410 that is independent of each other and located at a side of the light-emitting unit 310 away from the substrate 100, the encapsulation part 410 includes a first encapsulation part 411 and a second encapsulation part 412 that are connected to each other, The first packaging part 411 is located at the isolation opening 240, the second packaging part 412 is located at the side of the isolation structure 200 away from the substrate 100, there is a first gap 430 between the second packaging part 412 and the isolation structure 200, and adjacent packaging parts 410 are spaced to form a second gap 420; the second packaging layer 440 is located in the display area AA and on the side of the first packaging layer 400 away from the substrate 100; at least part of the third packaging layer 450 is located at the side of the second packaging layer 440 away from the substrate 100, the third packaging layer 450 fills the second gap 420 located in the test area TEG, and the thickness of the third packaging layer 450 is greater than or equal to the dimension of the first gap along the thickness direction of the display panel 10.

[0131] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area AA and a test area TEG located at at least one side of the display area AA, and the display panel 10 also includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first encapsulation layer 400, a second encapsulation layer 440 and a third encapsulation layer 450. The isolation structure 200 is disposed on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and the light-emitting unit 310 does not need to use a precision mask plate to prepare the light-emitting unit 310, which can reduce the development and use of the precision mask plate and reduce the preparation cost. The first encapsulation layer 400 includes an encapsulation portion 410, and the encapsulation portion 410 includes a first encapsulation portion 411 and a second encapsulation portion 412. The first encapsulation portion 411 is located in the isolation opening 240 to encapsulate the light-emitting unit 310, and the second encapsulation portion 412 is located on a side of the isolation structure 200 away from the substrate 100 to encapsulate the isolation structure 200. A second gap 420 is provided between adjacent encapsulation portions 410. The second gap 420 is used to etch the redundant light-emitting unit 310 located on a side of the isolation structure 200 away from the substrate 100, thereby forming a first gap 430 between the second encapsulation portion 412 and the isolation structure 200. The third encapsulation layer 450 is relatively thick and can fill the second gap 420 so that the insulating layer 500 can fully shield the first gap 410 in the second gap 420, thereby improving the water and oxygen in the test area TEG from easily entering the first gap 430 to destroy the encapsulation of the first encapsulation layer 400, thereby causing the edge of the encapsulation part 410 to warp, thereby improving the performance of the OLED display panel 10.

[0132] like Figure 11 As shown, optionally, the third encapsulation layer 450 located in the test area TEG contacts the isolation structure 200 , so that the third encapsulation layer 450 can fill the second gap 420 , further improving the sealing effect of the third encapsulation layer 450 on the first gap 430 .

[0133] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0134] The embodiment of the second aspect of the present application also provides a display device, including the display panel 10 of any of the above-mentioned first aspect embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect embodiments, which will not be repeated here.

[0135] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0136] The third aspect of the present application also provides a method for preparing a display panel 10. The display panel 10 may be the display panel 10 provided by any of the first aspect embodiments described above. The display panel 10 includes a display area AA and a test area TEG located at at least one side of the display area AA. Please refer to the method for preparing a display panel 10. Figures 1 to 13 , and see Figure 14 , Figure 14 1 is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. The preparation method comprises:

[0137] Step S01: preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening.

[0138] Step S02: preparing a light-emitting layer on a substrate, wherein the light-emitting layer includes light-emitting units located in the isolation openings.

[0139] Step S03: Prepare a first encapsulation layer on the substrate, the first encapsulation layer includes an encapsulation portion located on the side of the light-emitting unit facing away from the substrate, the encapsulation portion includes a first encapsulation portion and a second encapsulation portion connected to each other, the first encapsulation portion is located at the isolation opening, the second encapsulation portion is located on the side of the isolation structure facing away from the substrate, a first gap exists between the second encapsulation portion and the isolation structure, and adjacent encapsulation portions are spaced to form a second gap.

[0140] Step S04: preparing an insulating layer on the side of the first packaging layer away from the substrate, at least part of the insulating layer filling the second gap in the test area, and the thickness of the insulating layer is greater than or equal to the dimension of the first gap along the thickness direction of the display panel.

[0141] According to the preparation method of the third aspect of the present application, an isolation structure 200 is prepared on a substrate 100 by step S01. A light-emitting layer 300 is prepared by step S02, and the isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and preparing the light-emitting unit 310 without using a precision mask plate, which can reduce the development and use of the precision mask plate and reduce the preparation cost. A first encapsulation layer 400 is prepared by step S03, and the first encapsulation layer 400 includes an encapsulation part 410, and the encapsulation part 410 includes a first encapsulation part 411 and a second encapsulation part 412, the first encapsulation part 411 is located in the isolation opening 240 to encapsulate the light-emitting unit 310, and the second encapsulation part 412 is located on the side of the isolation structure 200 away from the substrate 100 to encapsulate the isolation structure 200. A second gap 420 is provided between adjacent packaging parts 410. The second gap 420 is used to etch the redundant light-emitting unit 310 located on the side of the isolation structure 200 away from the substrate 100, thereby forming a first gap 430 between the second packaging part 412 and the isolation structure 200. The insulating layer 500 is prepared by step S04, and the insulating layer 500 fills the second gap 420 located in the test area TEG, so as to realize the packaging of the second gap 420 by the insulating layer 500, and reduce the invasion of water and oxygen into the isolation structure 200. And the thickness of the insulating layer 500 is greater than or equal to the first gap 430, so that the insulating layer 500 fully shields the first gap 430 in the second gap 420, improves the problem that water and oxygen in the test area TEG easily enter the first gap 430 to destroy the packaging of the first packaging layer 400, thereby causing the edge of the packaging part 410 to warp.

[0142] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a test area located at at least one side of the display area, and the display panel further includes: substrate; An isolation structure, located on one side of the substrate, and the isolation structure encloses an isolation opening; A light-emitting layer, located on one side of the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; A first encapsulation layer includes encapsulation parts that are independent of each other and located at a side of the light-emitting unit away from the substrate, the encapsulation parts include a first encapsulation part and a second encapsulation part that are connected to each other, the first encapsulation part is located at the isolation opening, the second encapsulation part is located at a side of the isolation structure away from the substrate, a first gap exists between the second encapsulation part and the isolation structure, and adjacent encapsulation parts are spaced to form a second gap; An insulating layer, at least a portion of which fills the second gap located in the test area, and a thickness of the insulating layer is greater than or equal to a dimension of the first gap along a thickness direction of the display panel.

2. The display panel according to claim 1, wherein The insulating layer includes an insulating portion located in the test area and filling the second gap, the insulating portion and the first gap are staggered, or at least a portion of the insulating portion is located in the first gap; Preferably, the second packaging portion has a side wall facing the second gap, and the insulating layer covers at least a portion of the side wall; Preferably, at least a portion of the insulating layer is located in the test area on a side of the first packaging portion away from the substrate; Preferably, the insulating portion located in the test area is in contact with the isolation structure; Preferably, the insulating portion covers at least a portion of the surface of the isolation structure facing away from the substrate; Preferably, the orthographic projection of the second gap on the substrate is located within the orthographic projection of the isolation structure on the substrate.

3. The display panel according to claim 1, wherein The dimension of the first gap in the thickness direction of the display panel is greater than or equal to 400 nm; And / or, the thickness of the insulating layer is greater than or equal to 500 nm.

4. The display panel according to claim 1, wherein The display panel further includes: A touch layer, located on a side of the insulating layer away from the substrate, the touch layer comprising touch electrodes located in the display area, the touch electrodes being self-capacitive touch electrodes; Preferably, the insulating layer includes a first insulating layer and a second insulating layer which are stacked and located in the display area and the test area at the same time, the second insulating layer is located between the first insulating layer and the touch layer, and the first insulating layer and the second insulating layer located in the test area fill the second gap and are stacked to form an insulating part.

5. The display panel according to claim 1, wherein The material of the insulating layer includes inorganic material; Preferably, the inorganic material includes at least one of silicon nitride or silicon oxide; Preferably, the material of the first encapsulation layer includes an inorganic material; Preferably, the display panel further includes: A second encapsulation layer is located in the display area and on a side of the first encapsulation layer away from the substrate, and the second encapsulation layer fills a second gap in the display area; a third encapsulation layer, at least a portion of which is located in the display area and on a side of the second encapsulation layer away from the substrate; Preferably, the material of the second encapsulation layer includes organic material; Preferably, the material of the third encapsulation layer includes inorganic material; Preferably, the third encapsulation layer is disposed on the same layer as the insulating layer; Preferably, the third encapsulation layer extends to the test area, and the third encapsulation layer located in the test area is reused as the insulating layer.

6. The display panel according to claim 1, characterized in that, The display panel further includes: A first electrode layer, located between the light-emitting layer and the first encapsulation layer. The first electrode layer includes a first electrode located in the isolation opening, and the first electrode is electrically connected to the isolation structure; Preferably, the orthographic projection of each light-emitting unit on the substrate is located within the orthographic projection of each first electrode on the substrate; Preferably, the light-emitting unit and the isolation structure are spaced apart; Preferably, the substrate includes an array circuit, and the array circuit is located in the display area and is used to control the light-emitting units located in the display area to emit light.

7. The display panel according to claim 6, wherein The isolation structure includes a first conductive layer and a second layer. The second layer is located on the side of the first conductive layer facing away from the substrate, and the first electrode and the first conductive layer are electrically connected; Preferably, the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the second layer on the substrate; Preferably, the second layer includes a conductive material or an insulating material; Preferably, the second layer includes a metal material, and the materials of the first conductive layer and the second layer are different; Preferably, the isolation structure further includes a third layer located on the side of the first conductive layer facing the substrate, and the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the third layer on the substrate; Preferably, the display panel further includes: A pixel definition layer, located on the substrate. The pixel definition layer includes pixel defining portions and pixel openings formed by enclosing the pixel defining portions. The pixel openings communicate with the isolation openings; Preferably, the display panel further includes a second electrode, and the second electrode is exposed through the pixel opening.

8. A display panel, characterized in that, The display panel includes a display area and a test area located on at least one side of the display area. The display panel further includes: A substrate; An isolation structure, located on one side of the substrate. The isolation structure encloses an isolation opening; A light-emitting layer, located on one side of the substrate. The light-emitting layer includes light-emitting units located in the isolation opening; A first encapsulation layer, including encapsulation portions that are independent of each other and located on the side of the light-emitting unit facing away from the substrate. The encapsulation portions include a first encapsulation portion and a second encapsulation portion that are connected to each other. The first encapsulation portion is located in the isolation opening, the second encapsulation portion is located on the side of the isolation structure facing away from the substrate, and there is a first gap between the second encapsulation portion and the isolation structure. Adjacent encapsulation portions are spaced apart to form a second gap; A second encapsulation layer, located in the display area and on the side of the first encapsulation layer facing away from the substrate; A third encapsulation layer, at least part of the third encapsulation layer is located on the side of the second encapsulation layer facing away from the substrate. The third encapsulation layer fills the second gap located in the test area, and the thickness of the third encapsulation layer is greater than or equal to the dimension of the first gap in the thickness direction of the display panel; Preferably, the third encapsulation layer located in the test area is in contact with the isolation structure.

9. A display device, characterized in that, A display panel comprising any one of claims 1 to 8.

10. A method for preparing a display panel, characterized in that, The display panel includes a display area and a test area located at at least one side of the display area, and the preparation method further includes: Preparing an isolation structure on a substrate, wherein the isolation structure encloses an isolation opening; Preparing a light-emitting layer on the substrate, wherein the light-emitting layer includes a light-emitting unit located in the isolation opening; A first encapsulation layer is prepared on the substrate, wherein the first encapsulation layer includes encapsulation parts that are independent of each other and located at a side of the light-emitting unit away from the substrate, the encapsulation parts include a first encapsulation part and a second encapsulation part that are connected to each other, the first encapsulation part is located at the isolation opening, the second encapsulation part is located at a side of the isolation structure away from the substrate, a first gap exists between the second encapsulation part and the isolation structure, and adjacent encapsulation parts are spaced to form a second gap; An insulating layer is prepared on a side of the first encapsulation layer away from the substrate, at least part of the insulating layer fills the second gap in the test area, and the thickness of the insulating layer is greater than or equal to the dimension of the first gap along the thickness direction of the display panel.

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