Electronic device including display

Abstract

An electronic device according to an embodiment of the present disclosure may include: a housing; a waterproof member disposed on one surface of the housing along a periphery of the housing and including a waterproof material; a window cover disposed to face one surface of the housing; a display disposed between the window cover and the housing and including a bent portion at one end of the electronic device; and a molded portion extending along a periphery of the window cover and the display and disposed on one surface of the waterproof member, in which at least a portion of the molded portion may be disposed in one direction toward an outside of the electronic device with respect to a bent portion of the display and in another direction opposite to the one direction.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a display. Background Art

[0002] An electronic device may include a housing and a display module disposed to cover one surface of the housing. The display module may include a bent portion located at a lower end of the electronic device.

[0003] A waterproof tape may be disposed between the housing of the electronic device and the display module. The waterproof tape may be disposed to extend along the periphery of the electronic device. The waterproof tapes disposed on one side and the other side of the electronic device and the waterproof tape located at the lower end of the electronic device may be connected to each other through a cured-in-place gasket (CIPG). Summary of the Invention

[0004] Technical Problem

[0005] Since the bent portion of the display module is formed in a structure vulnerable to external impacts, a separate structure is required to reinforce the bent portion.

[0006] When a cured-in-place gasket (CIPG) is applied in an electronic device to connect the respective waterproof tapes to each other, it may be difficult to repair the display module. For example, when the display module is separated from the electronic device for repair and then reset, a process of resetting the CIPG to the electronic device should be performed, which may consume additional repair time and cost.

[0007] Solution to Problem

[0008] According to an embodiment of the present disclosure, an electronic device may include: a housing; a waterproof member including a waterproof material disposed on one surface of the housing along the periphery of the housing; a window cover disposed to face the one surface of the housing; a display disposed between the window cover and the housing and including a bent portion located at one end of the electronic device; and a molding portion extending along the periphery of the window cover and the display and disposed on one surface of the waterproof member,

[0009] In an embodiment, at least a portion of the molding portion may be disposed in one direction facing the outside of the electronic device and in another direction, the another direction being opposite to the one direction based on the bent portion of the display.

[0010] According to an embodiment of the present disclosure, an electronic device may include: a housing; a waterproof member including a waterproof material disposed on one surface of the housing along the periphery of the housing; a window cover disposed to face the one surface of the housing; a display disposed between the window cover and the housing and including a curved portion at one end of the electronic device; and a molding portion extending from the one end of the electronic device along the curved portion of the display and disposed on one surface of the waterproof member.

[0011] In an embodiment, the molding portion may include an inclined region that extends from one end and the other end of the molding portion toward one surface of the display in a direction inclined based on one surface of the molding portion, and at least a portion of the molding portion may be disposed in one direction toward the outside of the electronic device and in another direction opposite to the one direction based on the curved portion of the display.

[0012] In an embodiment, the molding portion may include an inclined region that extends from one end and the other end of the molding portion toward one surface of the display in a direction inclined based on one surface of the molding portion, and at least a portion of the molding portion may be disposed in one direction toward the outside of the electronic device and in another direction opposite to the one direction based on the curved portion of the display.

[0013] According to an embodiment of the present disclosure, an electronic device may include: a housing; a fastening member connected to at least a portion of the housing and detachably attaching the electronic device to a portion of a user's body; a window cover disposed to face one surface of the housing; a display disposed between the window cover and the housing and including a curved portion at one end of the electronic device; a molding portion extending along the peripheries of the window cover and the display; and a waterproof member including a waterproof material disposed between the molding portion and the housing.

[0014] Advantages of the Invention

[0015] The electronic device including a display according to an embodiment of the present disclosure may enhance the rigidity of the curved portion by disposing a molding portion around the curved portion of the display module.

[0016] The electronic device including a display according to an embodiment of the present disclosure may save costs consumed in CIPG manufacturing and setting, and may improve the convenience of repairing the display module.

[0017] The electronic device including a display according to an embodiment of the present disclosure may reduce a black matrix (BM) region where no image is displayed on the display because the electronic device is formed with a structure in which the curved portion at the lower end is removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a block diagram of an electronic device in a network environment according to an embodiment.

[0019] Figure 2a and Figure 2b is a perspective view showing an electronic device according to an embodiment of the present disclosure.

[0020] Figure 3 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0021] Figure 4a and Figure 4b is a view showing an electronic device according to an embodiment of the present disclosure.

[0022] Figure 5a 、 Figure 5b 、 Figure 5c and Figure 5d is a view showing a molding part according to an embodiment of the present disclosure.

[0023] Figure 6 is a view showing a bent part of a display according to an embodiment of the present disclosure.

[0024] Figure 7a and Figure 7b is a perspective view showing an electronic device according to an embodiment of the present disclosure.

[0025] Figure 8 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0026] Figure 9 is a view showing a window cover and a display of an electronic device according to an embodiment of the present disclosure.

[0027] Figure 10 is a view showing a bent part of a display according to an embodiment of the present disclosure.

[0028] Figure 11a and Figure 11b is a view showing a molding part and a display on which the molding part is disposed according to an embodiment of the present disclosure.

[0029] Figure 12 is a view showing a bent part of a display, a molding part, and a waterproof member according to an embodiment of the present disclosure. Detailed Description

[0030] Figure 1 is a block diagram showing an electronic device 101 in a network environment 100 according to various embodiments. Refer to Figure 1, the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection end 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection end 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single integrated component (e.g., the display module 160).

[0031] The processor 120 may run software (e.g., the program 140) to control at least one other component (e.g., a hardware component or a software component) connected to the processor 120 of the electronic device 101, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the result data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or may be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0032] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control, together with the main processor 121, at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., the server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to the hardware structure.

[0033] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0034] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0035] The input module 150 may receive commands or data to be used by other components of the electronic device 101 (e.g., the processor 120) from the outside of the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0036] The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record. The receiver may be used for receiving an incoming call. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0037] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., to a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the intensity of a force caused by the touch.

[0038] The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain a sound via the input module 150, or output a sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) directly (e.g., wiredly) or wirelessly connected to the electronic device 101.

[0039] The sensor module 176 may detect an operating state of the electronic device 101 (e.g., power or temperature) or an environmental state outside the electronic device 101 (e.g., a state of a user), and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface 177 may support one or more specific protocols used to directly (e.g., wiredly) or wirelessly connect the electronic device 101 to an external electronic device (e.g., electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0041] The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that can be recognized by a user via his sense of touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] The camera module 180 may capture a still image or a moving image. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0044] The power management module 188 may manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0045] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell.

[0046] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with an external electronic device via a first network 198 (e.g., a short-range communication network, such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or these various types of communication modules may be implemented as multiple separate components (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196.

[0047] The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies (e.g., New Radio (NR) access technologies). The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transfer rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for achieving eMBB (e.g., 20 Gbps or greater), a loss coverage for achieving mMTC (e.g., 164 dB or less), or a U-plane latency for achieving URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less).

[0048] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on the substrate. According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Subsequently, a signal or power may be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, additional components (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as part of the antenna module 197.

[0049] According to various embodiments, the antenna module 197 may form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the plurality of antennas are disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high-frequency band.

[0050] At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., a bus, a general-purpose input / output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0051] According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101 or a device of a different type from the electronic device 101. According to an embodiment, all or some of the operations running on the electronic device 101 may be run on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 is to automatically execute a function or service or is to execute a function or service in response to a request from a user or another device, the electronic device 101 may request one or more of the external electronic devices to execute at least part of the function or service instead of running the function or service, or in addition to running the function or service, the electronic device 101 may also request one or more of the external electronic devices to execute at least part of the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute additional functions or additional services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least part of a reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0052] Figure 2a A perspective view showing the front surface of an electronic device 200 according to an embodiment is shown, Figure 2b showing Figure 2a a perspective view of the rear surface of the electronic device 200 shown.

[0053] Figure 2a and Figure 2b The electronic device 200 in Figure 1 may be at least partially similar to

[0054] Referring to Figure 2a andFigure 2b , the electronic device 200 may include a housing 210, which includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and side surfaces 210C surrounding the space between the first surface 210A and the second surface 210B. The housing 210 may refer to a structure forming a part of the first surface 210A, the second surface 210B, and the side surfaces 210C. The first surface 210A may be formed by a front plate 202 that is at least partially substantially transparent (e.g., a glass plate or a polymer plate coated with various coatings). The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surfaces 210C may be formed by a side frame structure (or "side member") 218 that is combined with the front plate 202 and the rear plate 211 and includes metal and / or polymer. The rear plate 211 and the side frame structure 218 may be integrally formed and may include the same material (e.g., a metal material such as aluminum).

[0055] The front plate 202 may include two first regions 210D, which are respectively disposed at its long sides and bend from the first surface 210A toward the rear plate 211 and extend seamlessly. Similarly, the rear plate 211 may include two second regions 210E, which are respectively disposed at its long sides and bend from the second surface 210B toward the front plate 202 and extend seamlessly. The front plate 202 (or the rear plate 211) may include only one of the first regions 210D (or the second regions 210E). The first region 210D or the second region 210E may be partially omitted. When viewed from the side of the electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side that does not include the first region 210D or the second region 210E, and may have a second thickness less than the first thickness on the other side that includes the first region 210D or the second region 210E.

[0056] The electronic device 200 may include at least one of a display 201, an input device 203, sound output devices 207 and 214, sensor modules 204 and 219, camera modules 205, 212 and 213, a key input device 217, an indicator (not shown), and a connector 208. The electronic device 200 may omit at least one of the above components (e.g., the key input device 217 or the indicator), or may further include other components.

[0057] For example, the display 201 may be exposed through most of the front plate 202. At least a portion of the display 201 may be exposed through the front plate 202 that forms a first region 210D of the first surface 210A and the side surface 210C. The display 201 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digital converter for detecting a stylus. At least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in the first region 210D and / or the second region 210E.

[0058] The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones arranged to detect the direction of sound. According to an embodiment, the sound output devices 207 and 214 may include speakers. The speakers may include a receiver 214 for communication and an external speaker 207. In some embodiments, the microphone, the speaker, and the connector 208 may be disposed in a space arranged in the electronic device 200 and may be exposed to the external environment through at least one hole formed in the housing 210. In some embodiments, the holes formed in the housing 210 are generally for the microphone and the speaker. In some embodiments, the sound output devices 207 and 214 may include speakers (e.g., piezoelectric speakers) that operate without using the holes formed in the housing 210.

[0059] The sensor modules 204 and 219 may generate electrical signals or data corresponding to an internal operation state or external environmental conditions of the electronic device 200. The sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210. A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display 201 in the first surface 210A. The electronic device 200 may further include at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The camera modules 205, 212, and 213 may include a first camera device 205 disposed on the first surface 210A of the electronic device 200 and a second camera device 212 and / or a flash 213 disposed on the second surface 210B. The camera module 205 or the camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 200.

[0061] The key input device 217 may be disposed on the side surface 210C of the housing 210. The electronic device 200 may not include some or all of the above key input devices 217, and the key input devices 217 not included may be implemented in other forms (such as soft keys on the display 201). The key input device 217 may be implemented using a pressure sensor included in the display 201.

[0062] The indicator may be disposed on the first surface 210A of the housing 210. For example, the indicator may provide status information of the electronic device 200 in an optical form. The indicator may provide a light source related to the operation of the camera module 205. The indicator may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp.

[0063] The connector hole 208 may include: a first connector hole 208 adapted for a connector (e.g., a USB connector) for sending power and / or data to an external electronic device and receiving power and / or data from the external electronic device; and / or a second connector hole adapted for a connector (e.g., a headphone jack) for sending an audio signal to an external electronic device and receiving an audio signal from the external electronic device.

[0064] Some of the sensor modules 205 in the camera modules 205 and 212, some of the sensor modules 204 in the sensor modules 204 and 219, or the indicator may be arranged to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of the electronic device 200 so as to be in contact with the external environment through an opening (which penetrates through the front plate 202) of the display 201. According to an embodiment, the area of the display 201 corresponding to some of the camera modules 205 is part of the area for displaying content and may be formed as a light-transmissive area having a specified light transmittance. For example, the light-transmissive area may be formed to have a light transmittance in the range of about 5% to about 20%. The light-transmissive area may include an area overlapping with the effective area (e.g., the field of view (FOV)) of the camera module 205, and light that is imaged by the image sensor and used to generate an image passes through this effective area. For example, the light-transmissive area of the display 201 may include an area where the pixel density and / or the wiring density is lower than the pixel density and / or the wiring density of the surrounding environment. For example, the light-transmissive area may replace the opening. The camera module 205 may include, for example, an under-display camera (UDC). In another embodiment, some of the sensor modules 204 may be arranged to perform their functions in the internal space of the electronic device without being visibly exposed through the front plate 202. For example, in this case, the area of the display 201 facing the sensor module may not require a perforated opening.

[0065] Figure 3 A exploded perspective view of an electronic device according to an embodiment of the present disclosure is shown.

[0066] Figure 3 The electronic device 300 in may be at least partially similar to Figure 1 the electronic device 101 in and Figure 2a the electronic device 200 in, or may further include other embodiments.

[0067] Referring to Figure 3 , the electronic device 300 (e.g., Figure 1 the electronic device 101 in) may include a side member 310 (e.g., Figure 2a the side frame structure 218 in), a support member 311 (e.g., a bracket or a support structure), a front cover 320 (e.g., Figure 2a the front plate 202 in), a display 330 (e.g., Figure 2aa display 201), at least one substrate 341 and 342 (e.g., a printed circuit board (PCB) or a flexible printed circuit board (FPCB)), a battery 350, at least one additional support 361 and 362 (e.g., a rear case), an antenna 370, and a rear cover 380 (e.g., a rear plate 211). The electronic device 300 may omit at least one of the above components (e.g., the support member 311 or at least one additional support 361 and 362), or may further include additional components. Some components of the electronic device 300 may be the same as or similar to the components of the Figure 1 electronic device 100 shown or Figure 2a the components of the electronic device 200, and thus the description thereof is omitted below.

[0068] According to various embodiments, the side member 310 may include a first surface 3101 pointing in a first direction (e.g., the z-axis direction), a second surface 3102 pointing in a direction opposite to the first surface 3101, and a side surface 3103 surrounding the space between the first surface 3101 and the second surface 3102. According to an embodiment, at least a part of the side surface 3103 may form an appearance of the electronic device. According to an embodiment, the support member 311 may be provided to extend from the side member 310 into the internal space of the electronic device 300. In an embodiment, the support member 311 may be separately provided from the side member 310. According to an embodiment, the side member 310 and / or the support member 311 may be formed of, for example, a metal material and / or a non-metallic element (e.g., a polymer). According to an embodiment, the support member 311 may be provided to support at least a part of the display 330 through the first surface 3101 and support at least a part of at least one substrate 341 and 342 and / or the battery 350 through the second surface 3102. According to an embodiment, at least one of the substrates 341 and 342 may include a first substrate 341 (e.g., a main substrate) disposed on one side based on the battery 350 and a second substrate 342 (e.g., a sub-substrate) disposed on the other side in the internal space of the electronic device. According to an embodiment, the first substrate 341 and / or the second substrate 342 may include a processor, a memory, and / or an interface. According to an embodiment, the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the memory may include, for example, a volatile memory or a non-volatile memory. According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device to each other, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an embodiment, the battery 350 is a device for supplying power to at least one component element, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery 350 may be disposed on, for example, a plane substantially the same as that of at least one of the substrates 341 and 342. According to an embodiment, the battery 350 may be disposed in a manner built in the electronic device 300. In an embodiment, the battery 350 may be detachably disposed from the electronic device 300.

[0069] The antenna 370 may be disposed between the rear cover 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device or wirelessly transmit and receive power required for charging. The antenna structure may be formed by a part of the side member 310 and / or the support member 311 or a combination thereof. In some embodiments, the electronic device 300 may further include a digital converter for detecting an external electronic pen.

[0070] Figure 4a and Figure 4b is a view showing an electronic device 400 according to an embodiment of the present disclosure.

[0071] Figure 4a is a view showing a housing 410 of an electronic device 400 according to an embodiment of the present disclosure. Figure 4b is a view showing a window cover 430 and a display 440 of an electronic device 400 according to an embodiment of the present disclosure.

[0072] Figure 4a and Figure 4b The electronic device 400 may refer to, for example, the electronic device 101 in reference Figure 1 or may include at least a part of the electronic device 101 Figure 1 in.

[0073] Figure 4a and Figure 4b The electronic device 400 may refer to, for example, the electronic device 300 or Figure 3 in reference to FIG. 2 or the electronic device 300 or 400 Figure 3 or may include at least a part of the electronic device 300 or 400 in FIG. 2 or

[0074] When describing the electronic device 400 according to an embodiment of the present disclosure, the width direction of the electronic device 400 may refer to, for example, the x-axis direction, and the length direction of the electronic device 400 may refer to, for example, the y-axis direction.

[0075] Reference Figure 4a and Figure 4b According to an embodiment of the present disclosure, the electronic device 400 may include a housing 410, a waterproof member 420, a window cover 430, a display 440, and / or a molding part 450.

[0076] In an embodiment, the housing 410 may form the appearance of the electronic device 400. The housing 410 may provide a space in which electronic components of the electronic device 400 are disposed.

[0077] In an embodiment, the housing 410 may extend in the width direction (e.g., the x-axis direction) and the length direction (e.g., the y-axis direction) of the electronic device 400.

[0078] In an embodiment, the waterproof member 420 may be disposed on one surface of the housing 410. The waterproof member 420 may be disposed to extend from the one surface of the housing 410 along the perimeter of the housing 410.

[0079] In an embodiment, the waterproof member 420 may be a waterproof tape containing a waterproof material. The waterproof member 420 may be used to prevent and / or reduce external water from flowing into the electronic device 400.

[0080] In an embodiment, on Figure 4a the one surface of the housing 410 as shown, Figure 4b the window cover 430 and the display 440 as shown may be disposed. The window cover 430 and the display 440 may be disposed to cover the one surface of the housing 410.

[0081] In an embodiment, the window cover 430 may refer to, for example, Figure 3 the front cover 320, or may include Figure 3 at least a part of the front cover 320.

[0082] In an embodiment, the window cover 430 may include a transparent material such that the display 440 may be exposed to the outside. For example, the window cover 430 may include transparent glass or plastic.

[0083] In an embodiment, the display 440 may refer to, for example, Figure 3 the display 330, or may include Figure 3 at least a part of the display 330.

[0084] In an embodiment, the circuit board 460 may be disposed on one surface of the display 440. The circuit board 460 may include at least one processor (e.g., Figure 1 the processor 120). The circuit board 460 may control the driving of the display 440 through the processor. The circuit board 460 may be electrically connected to the driving circuit 480 (refer to Figure 6 ).

[0085] In an embodiment, the circuit cover member 470 may be disposed in one direction (e.g., the negative y-axis direction) of the circuit board 460. The circuit cover member 470 may be a tape disposed to cover one surface of the driving circuit 480 (refer to Figure 6 ).

[0086] In an embodiment, the molding part 450 may be disposed on one surface of the window cover 430 and the display 440. The molding part 450 may extend along the perimeter of the display 440 and the window cover 430 on one surface of the window cover 430 and the display 440.

[0087] In an embodiment, at least a portion of the molding part 450 may be disposed on the outer perimeter of the circuit board 460. For example, referring to Figure 4b , a portion of the molding part 450 may be spaced apart from the circuit board 460 on one side (e.g., based on the negative x-axis direction of the circuit board 460) and the other side of the circuit board 460.

[0088] At least a portion of the molding part 450 according to an embodiment may be disposed at a position overlapping with the position where the bending part 441 of the display 440 is disposed (refer to Figure 6 ).

[0089] In an embodiment, the width of the molding part 450 may be formed differently depending on the position where the molding part 450 extends. For example, referring to Figure 4b , in the molding part 450 extending in the length direction (e.g., y-axis direction) of the electronic device 400, a region where the molding part 450 extends together with the interposed circuit board 460 may be formed with a width narrower than that of other regions.

[0090] In an embodiment, when the window cover 430 and the display 440 are disposed on one surface of the housing 410, the waterproof member 420 and the molding part 450 may be disposed in contact with each other. For example, the waterproof member 420 may be disposed on one surface of the molding part 450 (e.g., based on the molding part 450, the surface opposite to the surface where the display 440 is located). The waterproof member 420 and the molding part 450 being disposed in contact with each other can prevent and / or block external water from flowing into the electronic device 400.

[0091] In an embodiment, the waterproof member 420 and the molding part 450 may extend to form a closed loop. For example, the waterproof member 420 and the molding part 450 may form a closed loop without a cutout part by extending in the width direction (e.g., x-axis direction) and the length direction (e.g., y-axis direction) of the electronic device 400.

[0092] In an embodiment, the molding part 450 may be used to reduce the gap between the internal structures of the electronic device 400. For example, in the display 440, there may be a gap between a portion where the circuit board 460 and the circuit cover member 470 are disposed and a portion where the circuit board 460 and the circuit cover member 470 are not disposed, and the molding part 450 may extend to reduce the gap between these portions.

[0093] In an embodiment, the waterproof member 420 may be disposed on the molded portion 450, and may easily and completely seal the electronic device 400. For example, it may be difficult for the waterproof member 420 to completely seal the electronic device 400 due to gaps between internal structures of the electronic device 400. Since the molded portion 450 is used to reduce the gaps between internal structures of the electronic device 400, when the waterproof member 420 is disposed on the molded portion 450, the electronic device 400 may be easily and completely sealed.

[0094] Since the electronic device 400 according to the embodiment of the present disclosure does not include a cured in place gasket (CIPG) for connecting between the waterproof members 420, but the waterproof function of the electronic device 400 is realized by setting the waterproof member 420 on the molding part 450, the cost consumed in the manufacture and setting of the CIPG can be saved. In addition, since the electronic device 400 according to the embodiment has a structure that does not include the CIPG, the separation and maintenance of the window cover 430 and the display 440 will be easy.

[0095] Since the electronic device 400 according to an embodiment of the present disclosure does not include a joint portion that may be located at a lower end portion of the electronic device 400 (eg, a distal end based on the negative y-axis direction of the electronic device 400 ), a black matrix (BM) area on the display 440 where no picture is displayed may be reduced.

[0096] Figure 5a , Figure 5b , Figure 5c and Figure 5d is a view showing a molding part 550 according to an embodiment of the present disclosure.

[0097] Figure 5a is a view illustrating a molding part 550 provided at one end of an electronic device 400 according to an embodiment of the present disclosure. Figure 5b It is shown Figure 5a An enlarged view of the molded portion 550 is shown in area A. Figure 5c is a perspective view illustrating an inclined region 551 of a molding part 550 according to an embodiment. Figure 5d is a perspective view showing an inclined region 551 of a molding part 550 according to an embodiment viewed in another direction.

[0098] In the embodiments, reference Figure 5a , the molded portion 550 may not be provided to extend along the entire circumference of the electronic device 400, but may be provided only at one end of the electronic device 400. For example, the molded portion 550 may be provided only at a distal end of the electronic device 400 located in the negative y-axis direction.

[0099] The molding part 550 according to the embodiment may be disposed at the bent part 441 (refer toFigure 6 ) at a position where the positions overlap.

[0100] The molding part 550 according to the embodiment may extend in the width direction (e.g., the x-axis direction) of the electronic device 400.

[0101] In an embodiment, the molding part 550 may extend to cover at least a part of the circuit cover member 470. For example, referring to Figure 5a and Figure 5b , the molding part 550 may be located at the distal ends of the circuit board 460 and the circuit cover member 470 in the negative y-axis direction, and may extend to cover at least a part of the circuit board 460 and the circuit cover member 470.

[0102] Referring to Figure 5b , the molding part 550 according to the embodiment may be formed to extend in the width direction (e.g., the x-axis direction) of the electronic device 400.

[0103] In an embodiment, one end of the molding part 550 may refer to, for example, the distal end of the molding part 550 in the negative x-axis direction, and the other end of the molding part 550 may refer to, for example, the distal end of the molding part 550 in the positive x-axis direction.

[0104] In an embodiment, one end of the circuit board 460 may refer to, for example, the distal end of the circuit board 460 in the negative x-axis direction, and the other end of the circuit board 460 may refer to, for example, the distal end of the circuit board 460 in the positive x-axis direction.

[0105] The molding part 550 according to the embodiment may include an inclined area 551 and / or an extended area 552. The inclined area 551 may be an area formed at one end and the other end of the molding part 550. The extended area 552 may be an area extending between the inclined areas 551.

[0106] Referring to Figure 5b , the molding part 550 according to the embodiment may include inclined areas 551 at one end and the other end thereof. The inclined areas 551 may be arranged to cover parts of the circuit board 460 and the display 440 at one end and the other end of the molding part 550.

[0107] In an embodiment, the inclined areas 551 may be arranged at positions overlapping with the positions where one end and the other end of the circuit board 460 are formed.

[0108] In an embodiment, the inclined area 551 of the molding part 550 may be an area extending from one surface of the circuit board 460 toward one surface of the display 440.

[0109] In an embodiment, one surface of the display 440 may refer to, for example, the surface of the display 440 facing the negative z-axis direction.

[0110] Reference Figure 5c According to an embodiment, the molding part 550 may further extend in the negative z-axis direction based on one surface of the display 440. For example, the molding part 550 may extend to have a thickness in the z-axis direction based on one surface of the display 440.

[0111] According to an embodiment, since the molding part 550 extends further in the z-axis direction compared to one surface of the display 440, the extended area 552 of the molding part 550 may be disposed at a position that is further moved in the height direction (e.g., the negative z-axis direction) of the electronic device 400 compared to one surface of the display 440.

[0112] In an embodiment, the extended area 552 of the molding part 550 may be formed to extend in the width direction (e.g., the x-axis direction) of the electronic device 400 while facing the negative z-axis direction based on the molding part 550.

[0113] Reference Figure 5a and Figure 5b , the inclined area 551 of the molding part 550 may extend toward one surface of the display 440 in the inclined direction based on a plane substantially parallel to the extended area 552.

[0114] In an embodiment, the thickness of the inclined area 551 (e.g., the length of the inclined area 551 in the z-axis direction) may become thicker as it approaches the extended area 552. For example, the inclined area 551 may be formed such that the thickness of the inclined area 551 becomes smaller as the inclined area 551 moves away from the extended area 552.

[0115] In an embodiment, at least a part of the waterproof member 420 (reference Figure 4a ) may be disposed on the molding part 550. For example, at least a part of the waterproof member 420 (reference Figure 4a ) may be disposed in a form that extends along the inclined area 551 and the extended area 552 of the molding part 550.

[0116] In an embodiment, when the molding part 550 includes the inclined area 551, the waterproof member 420 (reference Figure 4a ) may extend to be in close contact with the molding part 550, and no gap space may be formed between the waterproof member 420 (reference Figure 4a ) and the display 440. For example, when the molding part 550 does not include the inclined area 551, due to the gap between one surface of the display 440 and the circuit board 460, a gap may be formed in the waterproof member 420 (reference Figure 4aA gap space is formed between the display 440. In the case where the molding part 550 includes an inclined area 551, the molding part 550 may extend along the inclined area 551 to connect to one surface of the display 440. Therefore, the waterproof member 420 (refer to Figure 4a ) may extend to be in complete close contact with the molding part 550, and no gap space may be formed between the waterproof member 420 (refer to Figure 4a ) and the display 440.

[0117] In an embodiment, Figure 4b the shown molding part 450 may include Figure 5b the shown inclined area 551. Figure 4b The area of the shown molding part 450 extending from the circuit board 460 to one surface of the display 440 may be formed in the same form as the form of Figure 5b the shown inclined area 551. For example, Figure 4b the area of the shown molding part 450 extending from the circuit board 460 to one surface of the display 440 may extend from one surface of the circuit board 460 in an inclined direction toward one surface of the display 440.

[0118] Figure 6 is a view showing a bent part 441 of the display 440 according to an embodiment of the present disclosure.

[0119] Figure 6 may be a cross-sectional view showing the window cover 430 and the display 440 along Figure 4b the shown cross-section A - A'.

[0120] When describing the display 440 according to an embodiment of the present disclosure, the length direction of the display 440 may refer to the y-axis direction, for example, and the height direction of the display 440 may refer to the z-axis direction. The length direction and height direction of the display 440 may be substantially the same as the length direction and height direction of the electronic device 400.

[0121] In an embodiment, the display 440 may be disposed on one surface of the window cover 430. For example, the display 440 may be disposed on the surface of the window cover 430 facing the negative z-axis direction.

[0122] In an embodiment, the display 440 may include multiple layers. For example, the display 440 may include an adhesive layer, a display panel, a protective layer for protecting the display panel, a barrier layer for blocking electromagnetic waves transmitted from the display panel, and / or a support layer for absorbing impacts from the outside.

[0123] In an embodiment, the display 440 may include a bent portion 441 that is at least partially bent and extends. The bent portion 441 may be located at one end of the display 440 (e.g., the distal end of the display 440 in the negative y-axis direction).

[0124] In an embodiment, the bent portion 441 may extend in the length direction of the display 440 (e.g., the y-axis direction), and then may be bent to extend in the height direction of the display 440 (e.g., the z-axis direction).

[0125] In an embodiment, the inward direction based on the bent portion 441 of the electronic device 400 may represent the direction pointing from the bent portion 441 toward the inside of the electronic device 400. For example, referring to Figure 6 , the inward direction based on the bent portion 441 of the electronic device 400 may represent the positive y-axis direction based on the bent portion 441.

[0126] In an embodiment, the outward direction based on the bent portion 441 of the electronic device 400 may represent the direction pointing from the bent portion 441 toward the outside of the electronic device 400. For example, referring to Figure 6 , the outward direction based on the bent portion 441 of the electronic device 400 may represent the negative y-axis direction based on the bent portion 441.

[0127] In an embodiment, at least a portion of the bent portion 441 may be formed convexly in the outward direction of the electronic device 400.

[0128] In an embodiment, one surface of the bent portion 441 may refer to the surface facing the outward direction (e.g., the negative y-axis direction) based on the bent portion 441 of the electronic device 400, and the other surface of the bent portion 441 may refer to the surface facing the inward direction (e.g., the positive y-axis direction) based on the bent portion 441 of the electronic device 400.

[0129] In an embodiment, the molding portion 450 may include a first molding region 450a, a second molding region 450b, and / or a third molding region 450c.

[0130] In an embodiment, at least a portion of the molding portion 450 may be disposed on one surface of the bent portion 441, and at least a portion of the molding portion 450 may be disposed on the other surface of the bent portion 441. For example, the first molding region 450a may be disposed on one surface of the bent portion 441. The second molding region 450b may be disposed on the other surface of the bent portion 441.

[0131] In an embodiment, the bending part 441 may be spaced apart from the window cover 430 in the height direction (e.g., the z-axis direction) of the electronic device 400. At least a part of the molding part 450 may be disposed in a space formed due to the interval between the bending part 441 and the window cover 430.

[0132] In an embodiment, the rigidity of the bending part 441 may be enhanced by disposing the molding part 450 on one surface and the other surface of the bending part 441 of the display 440. Since the bending part 441 includes a bent and extended shape, it may be vulnerable to external shocks when not supported by a separate structure. The molding part 450 may be disposed on one surface and the other surface of the bending part 441, and may be used to enhance the rigidity of the bending part 441 by supporting the bending part 441.

[0133] In an embodiment, the driving circuit 480 may be disposed in one direction of the display 440. For example, the driving circuit 480 may be disposed in the negative z-axis direction based on the display 440.

[0134] In an embodiment, the driving circuit 480 may be a display driving circuit (display driver integrated circuit (DDI)). The driving circuit 480 may be electrically connected to the display 440. The driving circuit 480 may be used to control a plurality of pixels included in the display 440.

[0135] In an embodiment, the circuit cover member 470 may be disposed in one direction of the driving circuit 480. For example, the circuit cover member 470 may be disposed in the negative z-axis direction based on the driving circuit 480. The circuit cover member 470 may be disposed to cover one surface of the driving circuit 480, and may be used to protect the driving circuit 480.

[0136] In an embodiment, the molding part 450 may be disposed on at least a part of the circuit cover member 470. For example, the third molding area 450c of the molding part 450 may be disposed to cover at least one of the circuit cover members 470 in the negative z-axis direction based on the circuit cover member 470.

[0137] In an embodiment, the molding part 450 may be formed by using injection molding. For example, after manufacturing the display 440, the molding part 450 may be disposed on the bending part 441 of the display by insert injection molding.

[0138] In an embodiment, Figure 6 may be a cross-sectional view showing the window cover 430 and the display 440 along Figure 5a the cross-section B-B' shown. In Figure 6 is a cross-sectional view showing the window cover 430 and the display 440 along Figure 5a the cross-section B-B' shown,Figure 6 The molded part 450 shown may refer to, for example, Figure 5a the molded part 550 shown. For example, as Figure 6 shown, Figure 5a the molded part 550 may be disposed on one surface and the other surface of the bent part 441 of the display 440, and may be configured to cover at least one of the circuit cover members 470.

[0139] Figure 7a and Figure 7b are perspective views showing an electronic device 700 according to an embodiment of the present disclosure.

[0140] Figure 7a is a perspective view showing the front of the electronic device 700 according to an embodiment. Figure 7b is a perspective view showing the back of the electronic device 700 according to an embodiment.

[0141] Referring to Figure 7a and Figure 7b , the electronic device 700 according to an embodiment may include a housing 710 and fastening members 750 and 760. The housing 710 includes a first surface (or front surface) 710A, a second surface (or back surface) 710B, and side surfaces 710C surrounding a space between the first surface 710A and the second surface 710B. The fastening members 750 and 760 are connected to at least a part of the housing 710 and are configured to detachably attach the electronic device 700 to a user body part (e.g., a wrist or an ankle).

[0142] In an embodiment (not shown), the housing may refer to a structure forming some of Figure 7a the first surface 710A, the second surface 710B, and the side surfaces 710C. According to an embodiment, at least a part of the first surface 710A may be formed of a substantially transparent front plate 701 (e.g., a glass plate or a polymer plate including various coatings). The second surface 710B may be formed of a back plate 707. The back plate 707 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surfaces 710C may be formed of a side border structure (or “side member”) 706, which is combined with the front plate 701 and the back plate 707 and includes metal and / or polymer. In a certain embodiment, the back plate 707 and the side border structure 706 may be integrally formed and may include the same material (e.g., a metal material such as aluminum).

[0143] The fastening members 750 and 760 may be formed of various materials and shapes. The assembled plurality of unit link members may be flexibly formed of fabric, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials.

[0144] According to an embodiment, the electronic device 700 may include at least one of a display 720 (refer to Figure 8 ), audio modules 705 and 708, a sensor module 711, key input devices 702, 703, 704, and a connector hole 709. In an embodiment, at least one component element of the electronic device 700 (e.g., key input devices 702, 703, and 704, connector hole 709, or sensor module 711) may be omitted, or other component elements may be additionally included.

[0145] The display 720 may be visibly exposed, for example, through most of the front plate 701. The shape of the display 720 may correspond to the shape of the front plate 701 and may be circular, oval, or polygonal. The display 720 may be provided in combination with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a fingerprint sensor.

[0146] The audio modules 705 and 708 may include a microphone hole 705 and a speaker hole 708. In the microphone hole 705, a microphone for obtaining external sounds may be provided, or in an embodiment, a plurality of microphones may be provided to sense the direction of sounds. The speaker hole 708 may be used for an external speaker and a receiver for calls. In an embodiment, the speaker hole 708 and the microphone hole 703 may be implemented as one hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker hole 708.

[0147] The sensor module 711 may generate an electrical signal or a data value corresponding to an internal operation state or an external environmental state of the electronic device 700. The sensor module 711 may include, for example, a biosensor module (e.g., an HRM sensor, a blood oxygen saturation sensor, and / or a blood glucose sensor) disposed toward a second surface 710B of the housing 710. The electronic device 700 may further include a sensor module (not shown), such as a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0148] The key input devices 702, 703, and 704 may include a roller key 702 disposed on a first surface 710A of the housing 710 and rotatable in at least one direction and / or side key buttons 703 and 704 disposed on a side surface 710C of the housing 710. The roller key 702 may have a shape corresponding to the shape of the front plate 701. In another embodiment, the electronic device 700 may not include some or all of the above key input devices 702, 703, and 704, and the unincluded key input devices 702, 703, and 704 may be implemented on the display 720 in the form of soft keys and touch keys. The connector hole 709 may accommodate a connector (e.g., a USB connector) for sending power and / or data to and receiving power and / or data from an external electronic device, or may include another connector hole (not shown) that may accommodate a connector for sending an audio signal to and receiving an audio signal from an external electronic device. The electronic device 700 may further include, for example, a connector cover (not shown) configured to cover at least a portion of the connector hole 709 and prevent foreign substances from entering the connector hole 709.

[0149] The fastening members 750 and 760 may be detachably connected to at least a partial area of the housing 710 by using locking members 751 and 761. The fastening members 750 and 760 may include one or more of a fixing member 752, a fixing member fastening hole 753, a band guiding member 754, and a band fixing ring 755.

[0150] The fixing member 752 may be configured to fix the housing 710 and the fastening members 750 and 760 to a body part of a user (e.g., a wrist or an ankle). The fixing member fastening hole 753 may fix the housing 710 and the fastening members 750 and 760 to the body part of the user corresponding to the fixing member 752. Since the band guiding member 754 is configured to limit the movement range of the fixing member 752 when the fixing member 752 is fastened to the fastening hole 753, the fastening members 750 and 760 may closely adhere to the body part of the user. In a state where the fixing member 752 and the fixing member fastening hole 753 are fastened to each other, the band fixing ring 755 may limit the movement range of the fastening members 750 and 760.

[0151] Figure 8 is an exploded perspective view showing an electronic device 800 according to an embodiment of the present disclosure.

[0152] Reference Figure 8, the electronic device 800 may include a bezel structure 810, a scroll key 820, a front plate 701, a display 720, a first antenna 850, a second antenna 855, a support member 860 (e.g., a bracket), a battery 870, a printed circuit board 880, a sealing member 890, a rear plate 707, and fastening members 895 and 897.

[0153] At least one component element of the electronic device 800 according to an embodiment may be the same as or similar to Figure 7a or Figure 7b at least one component element of the electronic device 700, and its repeated description may be omitted hereinafter.

[0154] The support member 860 may be disposed inside the electronic device 800 and may be connected to the bezel structure 810 or may be integrally formed with the bezel structure 810. The support member 860 may be formed of, for example, a metal material and / or a non-metal (e.g., polymer) material. The support member 860 may have one surface combined with the display 720 and another surface combined with the printed circuit board 880. The printed circuit board 880 may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit (GPU), a sensor processor, or a communication processor.

[0155] The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 800 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0156] The battery 870 is a device for supplying power to at least one component element and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery 870 may be, for example, disposed on a plane substantially the same as the plane of the printed circuit board 880. The battery 870 may be integrally disposed inside the electronic device 800 or may be detachably disposed in the electronic device 800.

[0157] The first antenna 850 may overlap with the second antenna 855 and may be disposed between the circuit board 880 and the rear plate 707. The first antenna 850 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the first antenna 850 may perform near field communication with an external device, may wirelessly transmit and receive power required for charging, or may transmit a magnetic-based signal (including a near field communication signal or payment data). In another embodiment, the antenna structure may be formed by a portion of the bezel structure 810 and / or the support member 860, or may be formed by a combination of the bezel structure 810 and / or the support member 860. In yet another embodiment, the first antenna 850 may be disposed on the printed circuit board 880 in the form of a chip antenna.

[0158] The second antenna 855 may be disposed between the printed circuit board 880 and the rear plate 707. The second antenna 855 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the second antenna 855 may perform near field communication with an external device, may wirelessly transmit and receive power required for charging, or may transmit a magnetic-based signal (including a near field communication signal or payment data). In another embodiment, the antenna structure may be formed by a portion of the bezel structure 810 and / or the rear plate 707, or may be formed by a combination of the bezel structure 810 and / or the rear plate 707.

[0159] The sealing member 890 may be located between the bezel structure 810 and the rear plate 707. The sealing member 890 may be configured to prevent moisture and foreign substances from flowing into the space surrounded by the bezel structure 810 and the rear plate 707.

[0160] Figure 9 is a view showing a window cover 910 and a display 920 of an electronic device 900 according to an embodiment of the present disclosure.

[0161] The electronic device 900 according to an embodiment of the present disclosure may refer to, for example, Figure 7a , Figure 7b and Figure 8 the electronic devices 700 or 800 shown, or may include at least a part of the electronic devices 700 or 800. For example, the electronic device 900 may be a wearable electronic device, which may be worn on at least a part of the body of a user using the electronic device 900. For example, the electronic device 900 may be detachably attached to a part of the user's body by using fastening members 750 and 760.

[0162] In an embodiment, the electronic device 900 may include a window cover 910, a display 920, a driving circuit 930 (refer to Figure 10 ) and / or a circuit cover member 940.

[0163] The window cover 910 according to an embodiment may refer to, for example, Figure 7a the front plate 701, or may include at least a part of the front plate 701.

[0164] In an embodiment, the window cover 910 may be arranged to cover the housing 710 (refer to Figure 7a ). For example, the window cover 910 may be arranged in a direction (e.g., the positive z-axis direction) based on the housing 710 (refer to Figure 7a ), and may cover at least a part of the housing 710 (refer to Figure 7a ).

[0165] In an embodiment, at least a part of the window cover 910 may be formed to be substantially transparent. For example, at least a part of the window cover 910 may be formed to be substantially transparent so that the display 920 can be exposed to the outside.

[0166] The display 920 according to an embodiment may refer to, for example, Figure 8 the display 720, or may include at least a part of the display 720.

[0167] In an embodiment, the window cover 910 and the display 920 may be formed in corresponding shapes to each other. For example, referring to Figure 9 , when the display 920 is formed in a circular shape, the window cover 910 may be formed in a corresponding circular shape.

[0168] Although Figure 9 shows that the window cover 910 and the display 920 are formed in a circular shape, this is exemplary, and the shapes of the window cover 910 and the display 920 may not be limited thereto. For example, the window cover 910 and the display 920 may be formed in an elliptical shape or a polygonal shape.

[0169] In an embodiment, the display 920 may be exposed through at least a part of the window cover 910. The display 920 may be driven by a driving circuit 930 (refer to Figure 10 ).

[0170] In an embodiment, the circuit cover member 940 may be a member arranged to cover one surface of the driving circuit 930 (refer to Figure 10 ).

[0171] In an embodiment, the circuit cover member 940 may be arranged on one end of the window cover 910 and the display 920. For example, the circuit cover member 940 may be arranged at the distal end in the negative y-axis direction based on the window cover 910 and the display 920.

[0172] Figure 10 is a view showing a bent portion 921 of the display 920 according to an embodiment of the present disclosure.

[0173] Figure 10 It may be a cross-sectional view showing the C-C' cross-section of the window cover 910 and the display 920 along the Figure 9 shown C-C' cross-section.

[0174] When describing the display 920 according to an embodiment of the present disclosure, the length direction of the display 920 may refer to the y-axis direction, for example, and the height direction of the display 920 may refer to the z-axis direction. The length direction and the height direction of the electronic device 900 may be substantially the same as the length direction and the height direction of the display 920.

[0175] In an embodiment, the display 920 may be disposed on one surface of the window cover 910. For example, the display 920 may be disposed on the surface facing the negative z-axis direction based on the window cover 910.

[0176] In an embodiment, the display 920 may include multiple layers. For example, the display 920 may include an adhesive layer, a display panel, a protective layer for protecting the display panel, a barrier layer for blocking electromagnetic waves transmitted from the display panel, and / or a support layer for absorbing external impacts.

[0177] In an embodiment, the display 920 may include a bent portion 921 that is at least partially bent and extends. The bent portion 921 may be located at one end of the display 920 (e.g., the distal end in the negative y-axis direction of the display 920).

[0178] In an embodiment, the bent portion 921 may extend in the length direction of the display 920 (e.g., the y-axis direction), and then may be bent to extend in the height direction of the display 920 (e.g., the z-axis direction).

[0179] In an embodiment, the inward direction of the electronic device 900 based on the bent portion 921 may represent the direction pointing from the bent portion 921 toward the inside of the electronic device 900. For example, referring to Figure 10 , the inward direction of the electronic device 900 based on the bent portion 921 may represent the positive y-axis direction based on the bent portion 921.

[0180] In an embodiment, the outward direction of the electronic device 900 based on the bent portion 921 may represent the direction pointing from the bent portion 921 toward the outside of the electronic device 900. For example, referring to Figure 10 , the outward direction of the electronic device 900 based on the bent portion 921 may represent the negative y-axis direction based on the bent portion 921.

[0181] In an embodiment, at least a portion of the bent portion 921 may be convexly formed in the outward direction of the electronic device 900 (e.g., the negative y-axis direction).

[0182] In an embodiment, the bending part 921 may be disposed at an interval from the window cover 910 in the height direction (e.g., the z-axis direction) of the electronic device 900.

[0183] In an embodiment, the driving circuit 930 may be disposed in one direction of the display 920. For example, the driving circuit 930 may be disposed in the negative z-axis direction based on the display 920.

[0184] In an embodiment, the driving circuit 930 may be a display driving circuit (display driver integrated circuit (DDI)). The driving circuit 930 may be electrically connected to the display 920. The driving circuit 930 may be used to control a plurality of pixels included in the display 920.

[0185] In an embodiment, the circuit cover member 940 may be disposed in one direction of the driving circuit 930. For example, the circuit cover member 940 may be disposed in the negative z-axis direction based on the driving circuit 930. The circuit cover member 940 may be disposed to cover one surface of the driving circuit 930 and may be used to protect the driving circuit 930.

[0186] Figure 11a and Figure 11b are views showing a molding part 950 according to an embodiment of the present disclosure and the display 920 on which the molding part 950 is disposed.

[0187] Figure 11a is a view showing the molding part 950 according to an embodiment. Figure 11b is a view showing the display 920 and the window cover 910 on which the molding part 950 is disposed according to an embodiment.

[0188] Reference Figure 11a and Figure 11b , the molding part 950 according to an embodiment may be formed to extend along the peripheral shape of the window cover 910 and the display 920. For example, in the case where the window cover 910 and the display 920 include a circular shape, the molding part 950 may be formed to extend in a circular peripheral shape.

[0189] Although Figure 11a shows the molding part 950 extending in a circular peripheral shape, this is exemplary, and the shape of the molding part 950 may not be limited thereto. For example, in the case where the window cover 910 and the display 920 have a rectangular shape, the molding part may be formed to extend in a rectangular peripheral shape.

[0190] Reference Figure 11b , the molding part 950 may be disposed on one surface of the window cover 910 and the display 920. For example, the molding part 950 may be disposed on one surface of the window cover 910 and the display 920 along the periphery of the window cover 910 and the display 920.

[0191] Reference Figure 11a and Figure 11b , the width of the molding part 450 can be formed differently depending on the position where the molding part 950 is set. For example, the width of the molding part 950 set on the bending part 921 (reference Figure 10 ) of the display 920 located at the distal end in the negative y-axis direction based on the display 920 can be formed to be larger than the width of the molding part 950 set in other areas.

[0192] In an embodiment, the molding part 950 can be used to reduce the step height between the internal structures of the electronic device 900. For example, the molding part 950 can extend, and the gap between the part where the circuit cover member 940 is set on the display 920 and the part where the circuit cover member 940 is not set can be reduced.

[0193] Figure 12 is a view showing the bending part 921, the molding part 950, and the waterproof member 960 of the display 920 according to an embodiment of the present disclosure.

[0194] Figure 12 is a cross-sectional view showing the bending part 921, the molding part 950, and the waterproof member 960 along the Figure 11b section D-D' shown in.

[0195] In an embodiment, one surface of the bending part 921 can refer to the surface facing the outward direction (e.g., the negative y-axis direction) of the electronic device 900 based on the bending part 921, and the other surface of the bending part 921 can refer to the surface facing the inward direction (e.g., the positive y-axis direction) of the electronic device 900 based on the bending part 921.

[0196] In an embodiment, the molding part 950 can include a first molding area 950a, a second molding area 950b, and / or a third molding area 950c.

[0197] In an embodiment, at least a part of the molding part 950 can be set on one surface of the bending part 921, and at least a part of the molding part 950 can be set on the other surface of the bending part 921. For example, the first molding area 950a can be set on one surface of the bending part 921. The second molding area 950b can be set on the other surface of the bending part 921.

[0198] In an embodiment, at least a part of the molding part 950 is set in the space formed due to the interval between the bending part 921 and the window cover 910.

[0199] In an embodiment, the molding part 950 may be disposed on at least a part of the circuit cover member 940. For example, the third molding area 950c of the molding part 950 may be disposed to cover at least a part of the circuit cover member 940 in the negative z-axis direction based on the circuit cover member 940.

[0200] In an embodiment, the molding part 950 may be formed by using an injection molding manufacturing method. For example, after manufacturing the display 920, the molding part 950 may be disposed on the bent part 921 of the display 920 by insert injection molding.

[0201] In an embodiment, by disposing the molding part 950 on one surface and the other surface of the bent part 921 of the display 920, the rigidity of the bent part 921 may be enhanced. Since the bent part 921 has a bent and extended shape, it may be vulnerable to external impact when not supported due to a separate structure. The molding part 950 may be disposed on the bent part 921 and enhance the rigidity of the bent part 921 by supporting the bent part 921.

[0202] In an embodiment, the waterproof member 960 may be disposed on the molding part 950. For example, the waterproof member 960 may be disposed in the negative z-axis direction based on the molding part 950. The waterproof member 960 may extend along the perimeter of the window cover 910 and the display 920 in the direction in which the molding part 950 extends.

[0203] In an embodiment, the waterproof member 960 may be a waterproof tape containing a waterproof material. The waterproof member 960 may be used to prevent and / or reduce external water from flowing into the electronic device 900.

[0204] In an embodiment, the waterproof member 960 may be disposed on the molding part 950, and the electronic device 900 may be easily and completely sealed. For example, due to the gaps between the internal structures of the electronic device 900, it may be difficult for the waterproof member 960 to completely seal the electronic device 900. Since the molding part 950 is used to reduce the gaps between the internal structures of the electronic device 900, the electronic device 900 may be easily and completely sealed when the waterproof member 960 is disposed on the molding part 950.

[0205] An electronic device 400 according to an embodiment of the present disclosure may include: a housing 410; a waterproof member 420 including a waterproof material disposed on one surface of the housing 410 along the perimeter of the housing 410; a window cover 430 disposed to face one surface of the housing 410; a display 440 disposed between the window cover 430 and the housing 410 and including a bent part 441 at one end of the electronic device 400; and a molding part 450 extending along the perimeter of the window cover 430 and the display 440 and disposed on one surface of the waterproof member 420.

[0206] In an embodiment, at least a part of the molding part 450 may be disposed in one direction toward the outside of the electronic device 400 and in another direction that is opposite to the one direction based on the bending part 441 of the display 440.

[0207] In an embodiment, the bending part 441 of the display 440 may extend from one end of the electronic device 400 in the length direction of the electronic device 400, may be bent to extend in the height direction of the electronic device 400, and may be formed convexly in one direction toward the outside of the electronic device 400.

[0208] In an embodiment, at least a part of the molding part 450 may be disposed on one surface of the bending part 441 that is formed convexly in the direction toward the outside of the electronic device 400 and on another surface of the bending part that is opposite to the one surface.

[0209] In an embodiment, the bending part 441 of the display 440 may be spaced apart from the window cover 430 in the height direction of the electronic device 400.

[0210] In an embodiment, the molding part 450 may be disposed in a space formed due to the spaced-apart arrangement of the bending part 441 of the display 440 and the window cover 430.

[0211] In an embodiment, the electronic device 400 may include: a driving circuit 480 configured to drive the display 440; a circuit board 460 disposed on one surface of the display 440 and electrically connected to the driving circuit 480; and a circuit cover 470 disposed to cover the driving circuit 480.

[0212] In an embodiment, a region of the molding part 450 extending from the circuit board 460 to one surface of the display 440 may extend from one surface of the circuit board 460 in an inclined direction toward the one surface of the display 440.

[0213] In an embodiment, the molding part 450 may be disposed to cover at least a part of the circuit cover 470.

[0214] In an embodiment, the molding part 450 may be disposed on the bending part 441 of the display 440 by using insert injection molding.

[0215] In an embodiment, the width of the molding part 450 may be formed differently depending on the position where the molding part 450 extends.

[0216] An electronic device 400 according to an embodiment of the present disclosure may include: a housing 410; a waterproof member 420 including a waterproof material disposed on one surface of the housing 410 along the periphery of the housing 410; a window cover 430 disposed to face one surface of the housing 410; a display 440 disposed between the window cover 430 and the housing 410 and including a bent portion 441 at one end of the electronic device 400; and a molding portion 550 extending from one end of the electronic device 400 along the bent portion 441 of the display 440 and disposed on one surface of the waterproof member 420.

[0217] In an embodiment, the molding portion 550 may include an inclined region 551 that extends in a direction inclined with respect to one surface of the molding portion 550 from one end and the other end of the molding portion 550 toward one surface of the display 440, and at least a portion of the molding portion 550 may be disposed in a direction toward the outside of the electronic device 400 and in another direction opposite to the one direction based on the bent portion 441 of the display 440.

[0218] In an embodiment, at least a portion of the molding portion 550 may be disposed on one surface of the bent portion 441 that is convexly formed in a direction toward the outside of the electronic device 400 and on another surface of the bent portion 441 opposite to the one surface.

[0219] In an embodiment, the molding portion 550 may be disposed in a space formed due to the bent portion 441 of the display 400 being spaced apart from the window cover 430.

[0220] In an embodiment, the molding portion 550 may further include an extension region 552 that is located at a position shifted in the height direction of the electronic device 400 compared to one surface of the display 440 and extends between the inclined regions 551.

[0221] In an embodiment, the inclined region 551 may be formed such that the thickness of the inclined region 551 becomes smaller as the inclined region 551 moves away from the extension region 552.

[0222] In an embodiment, the molding portion 550 may be disposed to cover at least a portion of the circuit cover 470.

[0223] In an embodiment, the molding portion 550 may be disposed on the bent portion 441 of the display 440 by using insert injection molding.

[0224] An electronic device 900 according to an embodiment of the present disclosure may include: a housing 710; fastening members 750 and 760 connected to at least a part of the housing 710 and detachably attaching the electronic device 900 to a part of a user's body; a window cover 910 disposed to face one surface of the housing 710; a display 920 disposed between the window cover 910 and the housing 710 and including a curved portion 921 located at one end of the electronic device 900; a molding portion 950 extending along the peripheries of the window cover 910 and the display 920; and a waterproof member 960 including a waterproof material disposed between the molding portion 950 and the housing 710.

[0225] In an embodiment, at least a part of the molding portion 950 may be disposed in one direction facing the outside of the electronic device 900 and in another direction opposite to the one direction based on the curved portion 921 of the display 920.

[0226] In an embodiment, the curved portion 921 of the display 920 may extend from one end of the electronic device 900 in the length direction of the electronic device 900, may be bent to extend in the height direction of the electronic device 900, and may be convexly formed in one direction facing the outside of the electronic device 900.

[0227] In an embodiment, at least a part of the molding portion 950 may be disposed on one surface of the curved portion 921 convexly formed in the direction facing the outside of the electronic device 900 and on another surface of the curved portion 921 opposite to the one surface.

[0228] In an embodiment, the curved portion 921 of the display 920 may be spaced apart from the window cover 910 in the height direction of the electronic device 900.

[0229] In an embodiment, the molding portion 950 may be disposed in a space formed due to the curved portion 921 of the display 920 being spaced apart from the window cover 910.

[0230] In an embodiment, the molding portion 950 may be disposed on the curved portion 921 of the display 920 by using insert injection molding.

[0231] The technical problems to be solved by the present disclosure are not limited to the above technical problems, and those skilled in the art in the field of the present disclosure will clearly understand other technical problems not mentioned.

[0232] The effects obtainable from the present disclosure are not limited to the above effects, and those skilled in the art to which the present disclosure pertains can clearly understand other effects not mentioned.

[0233] An electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the electronic devices described above.

[0234] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms, or alternative forms corresponding to the respective embodiments. For the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that a singular form of a noun corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding one of the plurality of phrases or all possible combinations. As used herein, terms such as "first" and "second" or "1st" and "2nd" may be used to simply distinguish a corresponding component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, in the case where the terms "operably" or "communicatively" are used or where the terms "operably" or "communicatively" are not used, if an element (e.g., a first element) is referred to as "coupled with", "coupled to", "connected with", or "connected to" another element (e.g., a second element), it means that the one element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0235] As used in connection with the various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware and may be used interchangeably with other terms (e.g., "logic", "logic block", "part", or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or part of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0236] The various embodiments described herein can be implemented as software (e.g., program 140) including one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and run the at least one instruction with or without using one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions can include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Herein, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being stored temporarily in the storage medium.

[0237] According to an embodiment, a method according to various embodiments of the present disclosure can be included and provided in a computer program product. The computer program product can be traded between a seller and a purchaser as a product. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or can be distributed online (e.g., downloaded or uploaded) via an application store (e.g., PlayStoreTM), or can be directly distributed (e.g., downloaded or uploaded) between two user devices (e.g., smart phones). If it is distributed online, at least part of the computer program product can be generated temporarily, or at least part of the computer program product can be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an application store's server, or a forwarding server).

[0238] According to various embodiments, each of the above components (e.g., modules or programs) can include a single entity or multiple entities, and some of the multiple entities can be separately provided in different components. According to various embodiments, one or more of the above components can be omitted, or one or more other components can be added. Optionally or additionally, multiple components (e.g., modules or programs) can be integrated into a single component. In this case, according to various embodiments, the integrated component can still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions before integration.

[0239] According to various embodiments, operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device, comprising: a housing (410); a waterproof member (420) including a waterproof material disposed on one surface of the housing along a periphery of the housing; a window cover (430) disposed to face the one surface of the housing; a display (440) disposed between the window cover and the housing and including a bent portion (441) located at one end of the electronic device; and a molding portion (450) extending along a periphery of the window cover and the display and disposed on one surface of the waterproof member, wherein at least a portion of the molding portion is disposed in one direction toward an outside of the electronic device and in another direction, the another direction being a direction opposite to the one direction based on the bent portion of the display.

2. The electronic device according to claim 1, wherein the bent portion of the display extends from one end of the electronic device in a length direction of the electronic device, is bent to extend in a height direction of the electronic device, and is convexly formed in one direction toward the outside of the electronic device; and wherein the at least a portion of the molding portion is disposed on one surface of the bent portion convexly formed in the one direction toward the outside of the electronic device and on another surface of the bent portion, the another surface being a surface opposite to the one surface.

3. The electronic device according to any one of claims 1 to 2, wherein the bent portion of the display is spaced apart from the window cover in the height direction of the electronic device; and wherein the molding portion is disposed in a space formed due to the bent portion of the display being spaced apart from the window cover.

4. The electronic device according to any one of claims 1 to 3, further comprising: a driving circuit (480) configured to drive the display; a circuit board (460) disposed on one surface of the display and electrically connected to the driving circuit; and a circuit cover (470) disposed to cover the driving circuit.

5. The electronic device according to claim 4, wherein, A region of the molding portion extending from the circuit board to the one surface of the display extends from one surface of the circuit board in an inclined direction toward the one surface of the display.

6. The electronic device according to claim 4, wherein the molding portion is disposed to cover at least a portion of the circuit cover.

7. The electronic device according to any one of claims 1 to 6, wherein, The molding portion is disposed on the bent portion of the display by using insert injection molding.

8. The electronic device according to any one of claims 1 to 7, wherein, The width of the molding portion is formed differently depending on a position where the molding portion extends.

9. An electronic device, comprising: a housing (410); a waterproof member (420) including a waterproof material disposed on one surface of the housing along a periphery of the housing; a window cover (430) disposed to face the one surface of the housing; a display (440) disposed between the window cover and the housing and including a bent portion (441) located at one end of the electronic device; and The molding part (550) extends along the bent part of the display from one end of the electronic device and is disposed on one surface of the waterproof member. The molding part includes an inclined area (551) that extends from one end and the other end of the molding part toward one surface of the display in a direction inclined based on one surface of the molding part, and at least a part of the molding part is disposed in one direction toward the outside of the electronic device and in another direction opposite to the one direction based on the bent part of the display.

10. The electronic device according to claim 9, wherein, The bent part of the display extends from one end of the electronic device in the length direction of the electronic device, is bent to extend in the height direction of the electronic device, and is convexly formed in one direction toward the outside of the electronic device. And At least a part of the molding part is disposed on one surface of the bent part that is convexly formed in one direction toward the outside of the electronic device, and on the other surface of the bent part, the other surface being a surface opposite to the one surface.

11. The electronic device according to any one of claims 9 to 10, wherein the bent part of the display is spaced apart from the window cover in the height direction of the electronic device; and The molding part is disposed in a space formed due to the bent part of the display being spaced apart from the window cover.

12. The electronic device according to any one of claims 9 to 11, wherein the molding part further includes an extension area (552) that is located at a position moved in the height direction of the electronic device compared to one surface of the display and extends between the inclined areas.

13. The electronic device according to claim 12, wherein the inclined area is formed such that the thickness of the inclined area becomes smaller as the inclined area moves away from the extension area.

14. The electronic device according to any one of claims 9 to 13, further comprising: A driving circuit (480) configured to drive the display; A circuit board (460) disposed on one surface of the display and electrically connected to the driving circuit; And A circuit cover (470) disposed to cover the driving circuit.

15. The electronic device according to claim 14, wherein, The molding part is disposed to cover at least a part of the circuit cover.

Images