Pipeline crack damage monitoring method

Through piezoelectric ceramic sensors, electric impedance data is collected and combined with multi-parameter analysis, the real-time and accuracy of pipeline crack damage monitoring in the existing technology is solved, real-time monitoring and long-term evaluation of pipeline status are realized, and pipeline safety is ensured.

CN120294071APending Publication Date: 2025-07-11JIANGXI PROVINCIAL GENERAL INST OF INSPECTION TESTING & CERTIFICATION SPECIAL EQUIP INSPECTION & TESTING RES INST
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Patent Information

Application Number
CN202510299480.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2025-07-11

AI Technical Summary

Technical Problem

The existing pipeline crack damage monitoring methods cannot achieve real-time monitoring, and the single measurement error is large and the efficiency is low, so it is impossible to detect potential pipeline damage in time.

Method used

The piezoelectric ceramic sensor is used to collect the electrical impedance mode value and phase data of the pipeline under multiple selected frequency bands. By calculating the electrical impedance mode value offset, mean square deviation and phase offset, the crack damage degree is determined, and real-time monitoring and long-term evaluation are achieved in combination with multi-parameter analysis.

Benefits of technology

Real-time monitoring of pipeline cracks is realized, the accuracy and reliability of detection is improved, potential problems can be discovered in a timely manner, and the safe operation of the pipeline is ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a pipeline crack damage monitoring method. The method comprises the following steps: S1, collecting real-time electrical impedance module value data and electrical impedance phase data of a pipeline; s2, collecting initial electrical impedance module value data and electrical impedance phase data; s3, calculating to obtain an electrical impedance module value offset and an electrical impedance module value mean square error; calculating to obtain an electrical impedance phase offset and an electrical impedance phase mean square error; s4, the crack damage degree is judged according to the electrical impedance module value offset, the electrical impedance module value mean square deviation, the electrical impedance phase offset and the electrical impedance phase mean square deviation. The method has the beneficial effects that the electric impedance data of the pipeline are collected and analyzed in real time, crack damage is found in time, safe operation of the pipeline is ensured, long-term monitoring of the state of the pipeline can be achieved through continuous data collection and analysis, potential problems are found in time, monitoring is conducted under multiple frequency bands, and the safety of the pipeline is guaranteed. The detection accuracy and reliability can be improved.
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Description

Technical Field

[0001] The present invention belongs to the technical field of pipeline monitoring, and in particular relates to a method for monitoring pipeline crack damage. Background Art

[0002] Pressure pipelines are the main means of transporting important resources such as petroleum, natural gas, refined oil, city gas, and water. The safe operation of pressure pipelines is directly related to the safety of people's lives and property. Once accidents such as leakage or explosion occur, it will not only cause huge economic losses and waste of social resources, but also pose a serious threat to the lives and safety of the people.

[0003] Current methods for monitoring pipeline crack damage, such as ultrasonic testing, radiographic testing, magnetic particle testing, penetrant testing, and eddy current testing, have the following problems: First, regular measurements are required, and it is impossible to monitor the degree of pipeline damage in real time. The detection process of conventional non-destructive testing technologies requires a lot of manual operations, such as the placement, adjustment, and data recording of equipment, and the efficiency is relatively low; Second, the error of a single measurement is relatively large. Summary of the Invention

[0004] In view of this, the present invention aims to propose a method for monitoring pipeline crack damage in order to solve at least one of the above partial technical problems.

[0005] To achieve the above object, the technical solution of the present invention is realized as follows:

[0006] The first aspect of the present invention provides a method for monitoring pipeline crack damage, including the following steps:

[0007] S1. Collect the real-time impedance modulus data and impedance phase data of the pipeline through a piezoelectric ceramic sensor at multiple selected monitoring frequency bands;

[0008] S2. Collect the initial impedance modulus data and impedance phase data of the pipeline in the crack-free state through a piezoelectric ceramic sensor;

[0009] S3. Calculate the impedance modulus offset and impedance modulus mean square deviation according to the real-time impedance modulus data and the initial impedance modulus data;

[0010] Calculate the impedance phase offset and impedance phase mean square deviation according to the real-time impedance phase data and the initial impedance phase data;

[0011] S4. Determine the crack damage degree according to the impedance modulus offset, impedance modulus mean square deviation, impedance phase offset, and impedance phase mean square deviation.

[0012] Further, the selected monitoring frequency bands in S1 include 60 - 68 kHz, 70 - 78 kHz, 80 - 88 kHz, 104 - 112 kHz, 112 - 120 kHz, 120 - 128 kHz, 130 - 138 kHz, and 140 - 148 kHz.

[0013] Further, S4 includes the following steps:

[0014] S41. Calculate the average value of the impedance modulus offset by the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset by the impedance phases of multiple selected monitoring frequency bands;

[0015] When the average value of the impedance modulus offset is less than 80 Hz, calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively;

[0016] When the average value of the impedance modulus offset is greater than or equal to 80 Hz, enter step S43;

[0017] S42. Calculate the average value of the two crack damage degrees obtained in S41 as the final crack damage degree;

[0018] S43. When the average value of the impedance modulus mean square is greater than or equal to 80 Hz, calculate the average value of the impedance modulus mean square by the impedance modulus mean squares of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase by the impedance phase mean squares of multiple selected monitoring frequency bands;

[0019] Calculate the crack damage degree through the average value of the impedance modulus mean square and the average value of the impedance phase mean square respectively;

[0020] S44. Calculate the average value of the two crack damage degrees obtained in S43 as the final crack damage degree.

[0021] Further, S4 includes the following steps:

[0022] S41. Calculate the average value of the impedance modulus offset by the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset by the impedance phases of multiple selected monitoring frequency bands;

[0023] Calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively, and calculate the average value as the first crack damage degree;

[0024] S42. When the average value of the impedance modulus mean square is greater than or equal to 80 Hz, calculate the average value of the impedance modulus mean square by the impedance modulus mean squares of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase by the impedance phase mean squares of multiple selected monitoring frequency bands;

[0025] Calculate the crack damage degree respectively through the average value of the mean square deviation of the impedance modulus and the average value of the mean square deviation of the impedance phase, and calculate the average value as the second crack damage degree;

[0026] S43. When the average value of the impedance modulus offset is less than 80 Hz, the sum of the first crack damage degree multiplied by the first coefficient and the second crack damage degree multiplied by the second coefficient is used as the final crack damage degree;

[0027] When the average value of the mean square deviation of the impedance modulus is greater than or equal to 80 Hz, the sum of the first crack damage degree multiplied by the second coefficient and the second crack damage degree multiplied by the first coefficient is used as the final crack damage degree;

[0028] The first coefficient is greater than the second coefficient.

[0029] Further, the first coefficient is 0.8 and the second coefficient is 0.2.

[0030] Further, the method for calculating the crack damage degree in step S4 is as follows:

[0031] Measure the impedance modulus offset, impedance phase offset, mean square deviation of impedance modulus, and mean square deviation of impedance phase under different damage degrees, and construct a monotonic function for predicting the damage degree;

[0032] Substitute the measured average value into the monotonic function for predicting the damage degree to calculate the crack damage degree.

[0033] Further, the diameter of the piezoelectric ceramic sensor is 5 mm - 25 mm, and the thickness of the piezoelectric ceramic sensor is 1 mm - 3 mm.

[0034] The second aspect of the present invention provides an electronic device, including a processor and a memory communicatively connected to the processor and used for storing instructions executable by the processor, and the processor is used to execute the method described in the first aspect above.

[0035] The third aspect of the present invention provides a server, including at least one processor and a memory communicatively connected to the processor, where the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor to enable the at least one processor to execute the method described in the first aspect.

[0036] The fourth aspect of the present invention provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the method described in the first aspect is implemented.

[0037] Compared with the prior art, the pipeline crack damage monitoring method described in the present invention has the following

[0038] Beneficial effects:

[0039] (1) For a pipeline crack damage monitoring method described in the present invention, by collecting and analyzing the electrical impedance data of the pipeline in real time, crack damage can be detected in a timely manner to ensure the safe operation of the pipeline. Through continuous data collection and analysis, long-term monitoring of the pipeline state can be achieved, and potential problems can be detected in a timely manner. By monitoring in multiple frequency bands, the accuracy and reliability of detection can be improved.

[0040] (2) For a pipeline crack damage monitoring method described in the present invention, by collecting the electrical impedance modulus and phase data, rich information can be obtained, which helps to comprehensively evaluate the damage degree of the pipeline. By combining multi-parameters such as the electrical impedance modulus offset and mean square deviation for comprehensive analysis, the severity of crack damage can be judged more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The drawings forming a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0042] Figure 1 It is a schematic flow chart of the method described in the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0043] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0045] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0046] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0047] Embodiment 1:

[0048] A method for monitoring pipeline crack damage includes the following steps:

[0049] S1. Collect the real-time impedance modulus data and impedance phase data of the pipeline through a piezoelectric ceramic sensor at multiple selected monitoring frequency bands;

[0050] S2. Collect the initial impedance modulus data and impedance phase data of the pipeline in the crack-free state through a piezoelectric ceramic sensor;

[0051] S3. Calculate the impedance modulus offset and the mean square deviation of the impedance modulus based on the real-time impedance modulus data and the initial impedance modulus data;

[0052] Calculate the impedance phase offset and the mean square deviation of the impedance phase based on the real-time impedance phase data and the initial impedance phase data;

[0053] S4. Determine the crack damage degree based on the impedance modulus offset, the mean square deviation of the impedance modulus, the impedance phase offset, and the mean square deviation of the impedance phase.

[0054] The selected monitoring frequency bands in S1 include 60 - 68 kHz, 70 - 78 kHz, 80 - 88 kHz, 104 - 112 kHz, 112 - 120 kHz, 120 - 128 kHz, 130 - 138 kHz, and 140 - 148 kHz.

[0055] In some embodiments, S4 includes the following steps:

[0056] S41. Calculate the average value of the impedance modulus offset through the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset through the impedance phases of multiple selected monitoring frequency bands;

[0057] When the average value of the impedance modulus offset is less than 80 Hz, calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively;

[0058] When the average value of the impedance modulus offset is greater than or equal to 80 Hz, step S43 is entered;

[0059] S42. Calculate the average value of the two crack damage degrees obtained through S41 as the final crack damage degree;

[0060] S43. When the average value of the impedance modulus mean square deviation is greater than or equal to 80 Hz, calculate the average value of the impedance modulus mean square deviation through the impedance modulus mean square deviations of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase through the impedance phase mean square deviations of multiple selected monitoring frequency bands;

[0061] Calculate the crack damage degree through the average value of the impedance modulus mean square deviation and the average value of the impedance phase mean square deviation respectively;

[0062] S44. Calculate the average value of the two crack damage degrees obtained through S43 as the final crack damage degree.

[0063] In some other embodiments, S4 includes the following steps:

[0064] S41. Calculate the average value of the impedance modulus offset through the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset through the impedance phases of multiple selected monitoring frequency bands;

[0065] Calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively, and calculate the average value as the first crack damage degree;

[0066] S42. When the average value of the impedance modulus mean square deviation is greater than or equal to 80 Hz, calculate the average value of the impedance modulus mean square deviation through the impedance modulus mean square deviations of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase through the impedance phase mean square deviations of multiple selected monitoring frequency bands;

[0067] Calculate the crack damage degree through the average value of the impedance modulus mean square deviation and the average value of the impedance phase mean square deviation respectively, and calculate the average value as the second crack damage degree;

[0068] S43. When the average value of the impedance modulus offset is less than 80 Hz, the sum of the first crack damage degree multiplied by the first coefficient and the second crack damage degree multiplied by the second coefficient is used as the final crack damage degree;

[0069] When the average value of the impedance modulus mean square deviation is greater than or equal to 80 Hz, the sum of the first crack damage degree multiplied by the second coefficient and the second crack damage degree multiplied by the first coefficient is used as the final crack damage degree;

[0070] The first coefficient is greater than the second coefficient.

[0071] The first coefficient is 0.8 and the second coefficient is 0.2.

[0072] The method for calculating the crack damage degree in step S4 is as follows:

[0073] Measure the offset of the impedance modulus value, the offset of the impedance phase, the mean square deviation of the impedance modulus value, and the mean square deviation of the impedance phase under different damage degrees, and construct a monotonic function for predicting the damage degree;

[0074] Substitute the measured average value into the monotonic function for predicting the damage degree to calculate the crack damage degree.

[0075] The diameter of the piezoelectric ceramic sensor is 5 mm - 25 mm, and the thickness of the piezoelectric ceramic sensor is 1 mm - 3 mm.

[0076] In different monitoring frequency bands, the impedance modulus value and phase will have peaks and valleys at specific frequency points. Compared with the impedance modulus value and phase when there is no crack originally, when crack damage occurs in the monitored pipeline, the frequencies corresponding to the peaks and valleys in the impedance modulus value and phase curves shift towards the low-frequency direction. When the crack length gradually increases, the amount of frequency shift gradually increases. In order to quantitatively characterize the occurrence and expansion process of cracks, this study uses two indexes, namely the frequency shift amount △f and the root mean square deviation RMSD, as the damage evaluation indexes. In order to simplify the amount of data for analysis, only the impedance modulus value is selected as the object for quantitative analysis. For the frequency shift amount △f, among a series of monitoring frequency bands of each piezoelectric sensor, select the peak with a higher peak amplitude and more obvious characteristics as the object for investigation. For the root mean square deviation RMSD. The calculation formula of RMSD is as follows:

[0077]

[0078] In the formula, x i and y i are the impedance data corresponding to the pipeline in the original crack-free state and the real-time state respectively in the same monitoring frequency band.

[0079] As the crack length increases, the frequency offset △f shows a continuously increasing trend. For characteristic peaks such as 120.43 kHz and 135.77 kHz, when the crack size is large enough, obvious distortion appears in the impedance spectrum of PZT, and the previous series of characteristic peaks are no longer suitable for comparison as the same group. The relationship between the calculated RMSD value and the crack length is obtained. As the crack length increases, the RMSD values in different monitoring frequency bands generally show a continuously increasing trend, and only a few data points deviate from the above rule. Except for these individual data points, the RMSD values in other monitoring frequency bands are in good agreement with the increase in crack length, and the consistent increase characteristics in the 80 - 88 kHz and 140 - 148 kHz frequency bands are the best. The RMSD value in the high - frequency band is larger and has higher sensitivity to the growth of crack damage. When the monitoring frequency band increases to 80 - 88 kHz, the RMSD value begins to have high monitoring sensitivity to the growth of cracks.

[0080] Whether using the frequency offset △f or the root - mean - square deviation RMSD value as the damage identification index, the piezoresistive impedance technique has very high recognition for an initial 1 - mm crack. When the monitored pipeline is in a healthy state, that is, without crack damage, ideally, the values of the frequency offset △f and the root - mean - square deviation RMSD should both be 0.

[0081] The predicted damage degree by △f is more accurate when △f is below 80 Hz, and RMSD is more accurate when △f is above 80 Hz. Selecting the corresponding calculation method through the value of the impedance modulus △f can improve the accuracy of calculating the damage degree.

[0082] Beneficial effects:

[0083] By collecting and analyzing the impedance data of the pipeline in real - time, crack damage can be detected in a timely manner to ensure the safe operation of the pipeline. Through continuous data collection and analysis, long - term monitoring of the pipeline state can be achieved, and potential problems can be discovered in a timely manner. By monitoring in multiple frequency bands, the accuracy and reliability of detection can be improved.

[0084] By collecting impedance modulus and phase data, rich information can be obtained, which helps to comprehensively evaluate the damage degree of the pipeline. Combining multi - parameters such as impedance modulus offset and root - mean - square deviation for comprehensive analysis can more accurately judge the severity of crack damage.

[0085] Embodiment 2:

[0086] An electronic device includes a processor and a memory communicatively connected to the processor and used to store executable instructions of the processor. The processor is used to execute the method described in Embodiment 1 above.

[0087] Embodiment 3:

[0088] A server includes at least one processor and a memory communicatively connected to the processor. The memory stores instructions executable by the at least one processor. The instructions are executed by the processor to cause the at least one processor to execute the method described in Embodiment 1.

[0089] Embodiment 4:

[0090] A computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the method described in Embodiment 1 is implemented.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. And these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the present embodiments, and they should all be covered by the scope of the claims and the description of the present invention.

[0092] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for monitoring pipeline crack damage, characterized in that, It includes the following steps: S1. Collect the real-time impedance modulus data and impedance phase data of the pipeline through a piezoelectric ceramic sensor at multiple selected monitoring frequency bands; S2. Collect the initial impedance modulus data and impedance phase data of the pipeline in a crack-free state through a piezoelectric ceramic sensor; S3. Calculate the impedance modulus offset and the mean square deviation of the impedance modulus based on the real-time impedance modulus data and the initial impedance modulus data; Calculate the impedance phase offset and the mean square deviation of the impedance phase based on the real-time impedance phase data and the initial impedance phase data; S4. Determine the crack damage degree based on the impedance modulus offset, the mean square deviation of the impedance modulus, the impedance phase offset, and the mean square deviation of the impedance phase.

2. The pipeline crack damage monitoring method according to claim 1, characterized in that: The selected monitoring frequency bands in S1 include 60 - 68 kHz, 70 - 78 kHz, 80 - 88 kHz, 104 - 112 kHz, 112 - 120 kHz, 120 - 128 kHz, 130 - 138 kHz, 140 - 148 kHz.

3. A pipeline crack damage monitoring method according to claim 1, characterized in that, S4 in the above includes the following steps: S41. Calculate the average value of the impedance modulus offset through the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset through the impedance phases of multiple selected monitoring frequency bands; When the average value of the impedance modulus offset is less than 80 Hz, calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively; When the average value of the impedance modulus offset is greater than or equal to 80 Hz, go to step S43; S42. Calculate the average value of the two crack damage degrees obtained in S41 as the final crack damage degree; S43. When the average value of the mean square deviation of the impedance modulus is greater than or equal to 80 Hz, calculate the average value of the mean square deviation of the impedance modulus through the mean square deviations of the impedance modulus of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase through the mean square deviations of the impedance phase of multiple selected monitoring frequency bands; Calculate the crack damage degree through the average value of the mean square deviation of the impedance modulus and the average value of the mean square deviation of the impedance phase respectively; S44. Calculate the average value of the two crack damage degrees obtained in S43 as the final crack damage degree.

4. A method for monitoring pipeline crack damage according to claim 1, characterized in that S4 in the above includes the following steps: S41. Calculate the average value of the impedance modulus offset through the impedance modulus offsets of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase offset through the impedance phases of multiple selected monitoring frequency bands; Calculate the crack damage degree through the average value of the impedance modulus offset and the average value of the impedance phase offset respectively, and calculate the average value as the first crack damage degree; S42. When the average value of the mean square deviation of the impedance modulus is greater than or equal to 80 Hz, calculate the average value of the mean square deviation of the impedance modulus through the mean square deviations of the impedance modulus of multiple selected monitoring frequency bands, and calculate the average value of the impedance phase through the mean square deviations of the impedance phase of multiple selected monitoring frequency bands; Calculate the crack damage degree through the average value of the mean square deviation of the impedance modulus and the average value of the mean square deviation of the impedance phase respectively, and calculate the average value as the second crack damage degree; S43. When the average value of the impedance modulus offset is less than 80 Hz, the sum of the first crack damage degree multiplied by the first coefficient and the second crack damage degree multiplied by the second coefficient is used as the final crack damage degree; When the average value of the mean square deviation of the impedance modulus is greater than or equal to 80 Hz, the sum of the first crack damage degree multiplied by the second coefficient and the second crack damage degree multiplied by the first coefficient is used as the final crack damage degree; The first coefficient is greater than the second coefficient.

5. A pipeline crack damage monitoring method according to claim 4, characterized in that: The first coefficient is 0.8 and the second coefficient is 0.

2.

6. A pipeline crack damage monitoring method according to claim 3 or 4, characterized in that: The method for calculating the crack damage degree in step S4 is as follows: Measure the impedance modulus offset, impedance phase offset, impedance modulus mean square deviation, and impedance phase mean square deviation under different damage degrees, and construct a monotonic function for predicting the damage degree; Substitute the measured average value into the monotonic function for predicting the damage degree to calculate the crack damage degree.

7. A method for monitoring pipeline crack damage according to claim 1, characterized in that: The diameter of the piezoelectric ceramic sensor is 5 mm - 25 mm, and the thickness of the piezoelectric ceramic sensor is 1 mm - 3 mm.

8. An electronic device, comprising a processor and a memory communicatively connected to the processor and configured to store executable instructions of the processor, wherein: The processor is configured to execute the method according to any one of claims 1 - 7 above.

9. A server, characterized in that: Comprising at least one processor, and a memory communicatively connected to the processor, the memory storing instructions executable by the at least one processor, the instructions being executed by the processor to cause the at least one processor to execute the method according to any one of claims 1 - 7.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by the processor, the method according to any one of claims 1 - 7 is implemented.