Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device, and the display panel comprises a first substrate which comprises at least one first hole and comprises a first surface and a second surface which are opposite to each other; the first metal layer comprises a plurality of first binding terminals; the first buffer layer is positioned on one side, far away from the first substrate, of the first metal layer and comprises a plurality of first through holes corresponding to the plurality of first binding terminals; the second substrate is positioned on one side, far away from the first substrate, of the first buffer layer and comprises a plurality of second through holes corresponding to the plurality of first binding terminals; the second metal layer is located on the side, away from the first substrate, of the second substrate and comprises a plurality of signal wires; wherein the first hole exposes the corresponding first binding terminal on the second surface, the second surface is a flat surface at the edge of the first hole, and the signal wire is connected with the corresponding first binding terminal through the corresponding first through hole and the second through hole. The manufacturing yield can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of display technologies, organic light-emitting diode (OLED) display devices have been widely used in multiple fields such as flat panel displays, flexible displays, in-vehicle displays, and solid-state lighting due to advantages such as a wide color gamut, high contrast ratio, energy conservation, and foldability.

[0003] However, with the development of display technologies, how to improve the manufacturing yield when achieving an extremely narrow bezel or borderless design of a display panel is an urgent problem to be solved. Summary of the Invention

[0004] Based on this, it is necessary to provide a display panel, a manufacturing method thereof, and a display device, aiming to solve the problem of how to improve the manufacturing yield when achieving an extremely narrow bezel or borderless design of a display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including:

[0006] A first substrate, including at least one first opening, the first substrate including a first surface and a second surface disposed opposite to each other;

[0007] A first metal layer, located on a side of the first surface away from the second surface, the first metal layer including a plurality of first bonding terminals;

[0008] A first buffer layer, located on a side of the first metal layer away from the first substrate, the first buffer layer including a plurality of first through holes corresponding to the plurality of first bonding terminals;

[0009] A second substrate, located on a side of the first buffer layer away from the first substrate, the second substrate including a plurality of second through holes corresponding to the plurality of first bonding terminals, the second through holes and the corresponding first through holes at least partially overlapping in a thickness direction of the first substrate;

[0010] A second metal layer, located on a side of the second substrate away from the first substrate, the second metal layer including a plurality of signal traces;

[0011] Wherein, the first opening exposes the corresponding first bonding terminal on the second surface, and the second surface is a flat surface at an edge of the first opening, and the signal trace is connected to the corresponding first bonding terminal through the corresponding first through hole and the second through hole.

[0012] In a second aspect, based on the same inventive concept, the present application further provides a method for manufacturing a display panel, including:

[0013] Providing a carrier substrate;

[0014] Forming a sacrificial portion of a first substrate on the surface of the carrier substrate;

[0015] Forming a first portion of the first substrate on the surface of the carrier substrate, the sacrificial portion and the first portion being in the same plane parallel to the surface of the carrier substrate, a first surface of the first substrate facing away from the carrier substrate, and a second surface of the first substrate facing the carrier substrate;

[0016] Forming a first metal layer on a side of the first surface away from the second surface, the first metal layer including a plurality of first bonding terminals;

[0017] Forming a first buffer layer on a side of the first metal layer away from the first substrate, the first buffer layer including a plurality of first through holes corresponding to the plurality of first bonding terminals;

[0018] Forming a second substrate on a side of the first buffer layer away from the first substrate, the second substrate including a plurality of second through holes corresponding to the plurality of first bonding terminals, and the second through holes at least partially overlapping the corresponding first through holes in the thickness direction of the first substrate;

[0019] Forming a second metal layer on a side of the second substrate away from the first substrate, the second metal layer including a plurality of signal traces, and the signal traces connecting the corresponding first bonding terminals through the corresponding first through holes and the second through holes;

[0020] Peeling the first substrate from the carrier substrate;

[0021] Removing the sacrificial portion, so as to form at least one first opening on the first substrate, the first opening exposing the corresponding first bonding terminal on the second surface, and the second surface being a flat surface at the edge of the first opening.

[0022] In a third aspect, based on the same inventive concept, an embodiment of the present application further provides a display device, where the display device includes any one of the display panels provided in the first aspect, or the display device includes a display panel manufactured by the method for manufacturing any one of the display panels provided in the second aspect.

[0023] In the embodiment of the present application, the first substrate includes at least one first opening. The first substrate includes a first surface and a second surface disposed opposite to each other. The first metal layer is located on the side of the first surface away from the second surface. The first metal layer includes a plurality of first bonding terminals. The first opening exposes the corresponding first bonding terminals on the second surface, and the second surface is a flat surface at the edge of the first opening. The signal trace is connected to the corresponding first bonding terminal through the corresponding first through hole and second through hole. In a first aspect, in the present application, through a step-by-step manufacturing process, a sacrificial portion of the first substrate and a first portion surrounding the sacrificial portion are formed step by step. The materials of the sacrificial portion and the first portion are different. In subsequent manufacturing processes, compared with the related art, the sacrificial portion can be removed by an etching method, or the sacrificial portion can be removed by means of heating, light irradiation, or other lower temperatures, so as to form a first opening at the position of the sacrificial portion, and to make the second surface a flat surface at the edge of the first opening (eliminating the crater-shaped surface). In a second aspect, in the subsequent binding process of the circuit board, the edge of the first opening with a flat surface will not touch the circuit board, avoiding poor binding and improving the manufacturing yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 FIG. 9 is a schematic cross-sectional structure diagram of a narrow border design of a display panel in the related art provided by an embodiment of the present application.

[0026] Figure 2 FIG. 13 is a schematic cross-sectional structure diagram of a first display panel provided by an embodiment of the present application.

[0027] Figure 3 FIG. 17 is a schematic cross-sectional structure diagram of a second display panel provided by an embodiment of the present application.

[0028] Figure 4 FIG. 21 is a schematic flow chart of the manufacturing method of a display panel provided by an embodiment of the present application.

[0029] Figure 5 FIG. 25 is a schematic diagram of a first intermediate process of the manufacturing method of a display panel provided by an embodiment of the present application.

[0030] Figure 6 FIG. 29 is a schematic diagram of a second intermediate process of the manufacturing method of a display panel provided by an embodiment of the present application.

[0031] Figure 7 Schematic diagram of the third intermediate process of a manufacturing method of a display panel provided by an embodiment of the present application.

[0032] Figure 8 Schematic diagram of the fourth intermediate process of a manufacturing method of a display panel provided by an embodiment of the present application.

[0033] Figure 9 Schematic diagram of the fifth intermediate process of a manufacturing method of a display panel provided by an embodiment of the present application.

[0034] Figure 10 Schematic diagram of a display device provided by an embodiment of the present application.

[0035] Reference numerals: display device 200; display panel 100; first substrate 11; first planar layer 12; first metal layer 13; first buffer layer 14; second substrate 15; first insulating layer 16; second insulating layer 17; second metal layer 18; second planar layer 19; third insulating layer 21; first surface 11a; second surface 11b; first bonding terminal 131; first opening 111; first through hole 141; second through hole 151; signal trace 181; second opening 121; first virtual coil X1; first thickness d1; second thickness d2; first angle α1; circuit board 30; circuit board body 31; second bonding terminal 32; first adhesive 41; conductive connection portion 42; second adhesive 43; ink layer 44; sacrificial portion 101; first portion 102; first width L1; second width L2; carrier plate 10. Detailed embodiments

[0036] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0038] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there can also be intermediate elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more intermediate elements. It can also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can also be one or more intermediate elements.

[0039] In the case of using "comprising", "having", and "including" as described herein, unless explicit limiting terms are used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be understood as having a quantity of one.

[0040] It should be understood that although terms such as "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, the first element can be referred to as the second element, and similarly, the second element can be referred to as the first element.

[0041] It should also be understood that when interpreting an element, although not explicitly described, the element is interpreted as including an error range, and this error range should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "about", "approximate", or "substantially" can mean within one or more standard deviations, which is not limited herein.

[0042] In addition, in the specification, the phrase "schematic diagram of planar distribution" refers to the drawing when observing the target part from above, and the phrase "schematic cross-sectional diagram" refers to the drawing when observing the cross-section intercepted by vertically cutting the target part from the side.

[0043] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are only drawn by way of example in the drawings and are not necessarily drawn to the true scale.

[0044] Without departing from the spirit or scope of the present application, various modifications and variations can be made in the present application, which are obvious to those skilled in the art. Thus, the present application is intended to cover modifications and variations of the present application that fall within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in the embodiments of the present application can be combined with each other without conflict.

[0045] As described in the background art section, with the development of display technology, how to improve the manufacturing yield when achieving an extremely narrow bezel or borderless design of the display panel is an urgent problem to be solved. Please refer toFigure 1 , Figure 1 This is a schematic cross-sectional structure diagram of a narrow border design of a display panel in the related art provided by an embodiment of the present application. Figure 1 It is shown that the display panel includes a first substrate 11 and a first bonding terminal 131 on one side of the first surface 11a of the first substrate 11. The first substrate 11 includes a first opening 111. The circuit board 30 is located on the side of the second surface 11b away from the first surface 11a. The circuit board 30 includes a plurality of second bonding terminals 32. The second bonding terminals 32 are electrically connected to the corresponding first bonding terminals 131 through the first opening 111. In the related art, the first opening 111 needs to be formed by laser grooving after forming the integral first substrate 11. The laser grooving method is likely to cause damage to the first substrate 11 and is likely to form Figure 1 the uneven surface (crater-shaped surface) at the position of the first virtual coil X1 in. In the subsequent bonding process of the circuit board 30, the uneven surface (crater-shaped surface) is likely to touch the circuit board 30, resulting in poor bonding and reducing the manufacturing yield of the display panel.

[0046] Based on the above technical problems, the inventors have found through research that the first substrate includes at least one first opening. The first substrate includes a first surface and a second surface arranged opposite to each other. The first metal layer is located on the side of the first surface away from the second surface. The first metal layer includes a plurality of first bonding terminals. The first opening exposes the corresponding first bonding terminals on the second surface, and the second surface is a flat surface at the edge of the first opening. The signal trace is connected to the corresponding first bonding terminal through the corresponding first through hole and second through hole. In a first aspect, the present application forms the sacrificial part of the first substrate and the first part surrounding the sacrificial part through a step-by-step manufacturing process. The materials of the sacrificial part and the first part are different. In the subsequent manufacturing process, compared with the related art, the sacrificial part can be removed by an etching method or by a lower temperature method such as heating and light irradiation, so as to form a first opening at the position of the sacrificial part and make the second surface a flat surface at the edge of the first opening (eliminating the crater-shaped surface). In a second aspect, in the subsequent bonding process of the circuit board, the edge of the first opening with a flat surface will not touch the circuit board, avoiding poor bonding and improving the manufacturing yield of the display panel.

[0047] The above is the core idea of the present application. Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

[0048] Please refer to Figures 2 to 9 . Figure 2The first cross-sectional structure diagram of a display panel provided by an embodiment of the present application. Figure 3 The second cross-sectional structure diagram of a display panel provided by an embodiment of the present application. Figure 2 Schematically shows the cross-sectional structure of the display panel before binding to the circuit board. Figure 3 Schematically shows the cross-sectional structure of the display panel after binding to the circuit board.

[0049] Figure 4 The schematic flow chart of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 5 The first intermediate process diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 6 The second intermediate process diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 7 The third intermediate process diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 8 The fourth intermediate process diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 9 The fifth intermediate process diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0050] The present application provides a display panel 100, which includes a first substrate 11, a first metal layer 13, a first buffer layer 14, and a second substrate 15. The first substrate 11 includes at least one first opening 111, and the first substrate 11 includes a first surface 11a and a second surface 11b that face away from each other; the first metal layer 13 is located on the side of the first surface 11a away from the second surface 11b, and the first metal layer 13 includes a plurality of first binding terminals 131; the first buffer layer 14 is located on the side of the first metal layer 13 away from the first substrate 11, and the first buffer layer 14 includes a plurality of first through holes 141 corresponding to the plurality of first binding terminals 131; the second substrate 15 is located on the side of the first buffer layer 14 away from the first substrate 11, and the second substrate 15 includes a plurality of second through holes 151 corresponding to the plurality of first binding terminals 131, and the second through holes 151 at least partially overlap with the corresponding first through holes 141 in the thickness direction of the first substrate 11; the second metal layer 18 is located on the side of the second substrate 15 away from the first substrate 11, and the second metal layer 18 includes a plurality of signal traces 181; wherein, the first opening 111 exposes the corresponding first binding terminal 131 on the second surface 11b, and the second surface 11b is a flat surface at the edge of the first opening 111, and the signal trace 181 is connected to the corresponding first binding terminal 131 through the corresponding first through hole 141 and second through hole 151.

[0051] Exemplarily, such as Figure 2 and Figure 3As shown, the material of the first substrate 11 may include polyimide (abbreviated as PI), and the material of the second substrate 15 may include polyimide (abbreviated as PI). The materials of the first substrate 11 and the second substrate 15 may be the same or different, which is not limited herein.

[0052] Exemplarily, compare Figure 2 or Figure 3 with that in the subsequent manufacturing method Figure 6 , Figure 2 or Figure 3 in which the first part 102 of the first substrate 11 is illustrated.

[0053] Exemplarily, the first buffer layer 14 has a strong ability to block and isolate water vapor and oxygen. The material of the first buffer layer 14 includes, but is not limited to, silicon oxide, silicon nitride, and silicon oxynitride. The first buffer layer 14 is an insulating material.

[0054] Exemplarily, the second through hole 151 and the corresponding first through hole 141 overlap at least partially in the thickness direction of the first substrate 11, that is, the orthographic projection of the second through hole 151 on the plane where the first substrate 11 is located overlaps at least partially with the orthographic projection of the first through hole 141 on the plane where the first substrate 11 is located, so that the second through hole 151 exposes the corresponding first bonding terminal 131 on the side of the second substrate 15 away from the first substrate 11, facilitating the signal trace 181 to connect to the corresponding first bonding terminal 131 through the corresponding first through hole 141 and the second through hole 151.

[0055] Exemplarily, the display panel 100 may include signal lines such as multiple data signal lines and clock signal lines for driving the gate driving circuit. The second metal layer 18 is located on the side of the second substrate 15 away from the first substrate 11. The second metal layer 18 includes multiple signal traces 181, and the multiple signal traces 181 may include, but are not limited to, multiple data signal lines and / or clock signal lines.

[0056] Exemplarily, the first substrate 11 includes at least one first opening 111, and the first opening 111 exposes the corresponding first bonding terminal 131 on the second surface 11b, facilitating the circuit board 30 to be bonded and electrically connected to the first bonding terminal 131 on one side of the second surface 11b.

[0057] Exemplarily, compared with Figure 1 the related art in Figure 2 and Figure 3 in the embodiments, the second surface 11b is a flat surface at the edge of the first opening 111, eliminating the unevenness of the second surface 11b at the edge of the first opening 111 caused by the laser grooving process (eliminating the crater-shaped surface).

[0058] In an embodiment of the present application, the first substrate 11 includes at least one first opening 111. The first substrate 11 includes a first surface 11a and a second surface 11b disposed opposite to each other. The first metal layer 13 is located on a side of the first surface 11a away from the second surface 11b. The first metal layer 13 includes a plurality of first bonding terminals 131. The first opening 111 exposes the corresponding first bonding terminal 131 on the second surface 11b, and the second surface 11b is a flat surface at the edge of the first opening 111. The signal trace 181 is connected to the corresponding first bonding terminal 131 through the corresponding first through hole 141 and second through hole 151. In a first aspect, in the present application, through a step-by-step manufacturing process (please refer to the subsequent manufacturing method of the display panel), the sacrificial portion 101 of the first substrate 11 and the first portion 102 surrounding the sacrificial portion 101 are formed step by step. The materials of the sacrificial portion 101 and the first portion 102 are different. In subsequent manufacturing processes, compared with the related art, the sacrificial portion 101 can be removed by an etching method, or the sacrificial portion 101 can be removed by a lower temperature method such as heating and light irradiation, so as to form the first opening 111 at the position of the sacrificial portion, and the second surface 11b is a flat surface at the edge of the first opening 111 (eliminating the crater-shaped surface). In a second aspect, in the subsequent bonding process of the circuit board 30, the edge of the first opening 111 with a flat surface does not touch the circuit board 30, avoiding poor bonding and improving the manufacturing yield of the display panel 100.

[0059] In some embodiments, such as Figure 2 and Figure 3 shown, the display panel 100 further includes a first planarization layer 12. The first planarization layer 12 is located between the first substrate 11 and the first metal layer 13. The first planarization layer 12 includes at least one second opening 121. The second opening 121 and the corresponding first opening 111 at least partially overlap in the thickness direction of the first substrate 11; wherein, the first opening 111 and the corresponding second opening 121 expose the corresponding first bonding terminal 131 on the second surface 11b.

[0060] Exemplarily, the second opening 121 and the corresponding first opening 111 at least partially overlap in the thickness direction of the first substrate 11, that is, the orthographic projection of the second opening 121 on the plane where the first substrate 11 is located and the orthographic projection of the first opening 111 on the plane where the first substrate 11 is located at least partially overlap, so that the first opening 111 and the corresponding second opening 121 expose the corresponding first bonding terminal 131 on the second surface 11b, facilitating the circuit board 30 to be bonded and electrically connected to the first bonding terminal 131 through the corresponding second opening 121 and the corresponding first opening 111 on one side of the second surface 11b.

[0061] Exemplarily, the material of the first flat layer 12 includes an inorganic material. For example, the first flat layer 12 has a strong ability to block and isolate water vapor and oxygen. The material of the first buffer layer 14 includes, but is not limited to, silicon oxide, silicon nitride, and silicon oxynitride, and the first buffer layer 14 is an insulating material. However, in some other embodiments, the material of the first buffer layer 14 can also be an organic material.

[0062] Exemplarily, in some embodiments, the edge of the positive projection of the first bonding terminal 131 on the plane where the first substrate 11 is located is within the range of the positive projection of the first flat layer 12 on the plane where the first substrate 11 is located, that is, the edge of the first bonding terminal 131 overlaps with the first flat layer 12 in the thickness direction of the first substrate 11. The first flat layer 12 can block water vapor and oxygen from entering the side end face of the first bonding terminal 131, thereby protecting the first bonding terminal 131 and preventing the first bonding terminal 131 from being corroded. For example, the first bonding terminal 131 includes a Mo / Al / Mo (molybdenum-aluminum-molybdenum) laminate stacked in sequence in the direction away from the first substrate 11, which can prevent water vapor and oxygen from entering the aluminum metal layer through the side end face of the first bonding terminal 131.

[0063] In some embodiments, the material of the first substrate 11 includes an organic material, and the thickness of the first substrate 11 is 5 to 15 micrometers.

[0064] Exemplarily, the thickness of the first substrate 11 is 5 to 15 micrometers, that is Figure 2 the first thickness d1 is 5 to 15 micrometers, so that the first substrate 11 not only has a strong supporting effect but also can form a first opening 111 with an appropriate depth.

[0065] Exemplarily, Figure 2 the first thickness d1 is 5 to 15 micrometers, Figure 2 the first thickness d1 can be any value among 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, and 15 micrometers.

[0066] In some embodiments, the material of the first flat layer 12 is an inorganic material, and the thickness of the first flat layer 12 is 50 Å to 5000 Å.

[0067] Exemplarily, the material of the first flat layer 12 is an inorganic material, the thickness of the first flat layer 12 is 50 Å to 5000 Å, the edge of the first bonding terminal 131 overlaps with the first flat layer 12 in the thickness direction of the first substrate 11, and the first flat layer 12 can block water vapor and oxygen from entering the side end face of the first bonding terminal 131, thereby protecting the first bonding terminal 131 and preventing the first bonding terminal 131 from being corroded.

[0068] In some embodiments, the material of the second substrate 15 includes an organic material, and the thickness of the second substrate 15 is 5 to 10 micrometers.

[0069] Exemplarily, the thickness of the second substrate 15 is 5 to 10 micrometers, that is Figure 2 the second thickness d2 in is 5 to 10 micrometers, such that the second substrate 15 not only has a strong supporting effect but also can form a second through-hole 151 with a suitable depth.

[0070] Exemplarily, Figure 2 the second thickness d2 in is 5 to 10 micrometers, Figure 2 the second thickness d2 in can be any value among 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, and 10 micrometers.

[0071] In some embodiments, in the same direction parallel to the plane where the first substrate 11 is located, the width of the first opening 111 on the first surface 11a is smaller than the width on the second surface 11b.

[0072] Exemplarily, in the same direction parallel to the plane where the first substrate 11 is located, the width of the first opening 111 on the first surface 11a is smaller than the width on the second surface 11b, such that the width of the first opening 111 formed on the first surface 11a is smaller, the width of the first opening 111 formed on the second surface 11b is larger, and the first opening 111 forms Figure 2 and Figure 3 the trapezoidal shape shown in, so as to facilitate the electrical connection of the circuit board 30 to the first binding terminal 131 on one side of the second surface 11b.

[0073] Exemplarily, please refer to Figure 9 shown in, in the same direction parallel to the plane where the first substrate 11 is located, the width of the first opening 111 on the first surface 11a is the first width L1, the width of the first opening 111 on the second surface 11b is the second width L2, and the first width L1 is smaller than the second width L2.

[0074] In some embodiments, the included angle between the side wall of the first opening 111 and the first surface 11a of the first substrate 11 is in the range of 30 degrees to 90 degrees.

[0075] Exemplarily, as Figure 2 shown in, in combination with Figure 9 shown in the subsequent manufacturing method, the included angle between the side wall of the first opening 111 and the first surface 11a of the first substrate 11 is in the range of 30 degrees to 90 degrees, that is, the first angle α1 is in the range of 30 degrees to 90 degrees, and the first angle α1 can be any value among 30 degrees, 40 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees, and 90 degrees.

[0076] Exemplarily, asFigure 3 As shown, in the same direction parallel to the plane where the first substrate 11 is located, the width of the first opening 111 on the first surface 11a is smaller than the width on the second surface 11b, or the angle between the side wall of the first opening 111 and the first surface 11a of the first substrate 11 is in the range of 30 degrees to 90 degrees. When the circuit board 30 is bound and electrically connected to the first binding terminal 131 on one side of the second surface 11b, it can facilitate the first adhesive 41, the conductive connection part 42, and / or the second adhesive 43 to completely cover the surface of the first binding terminal 131 exposed in the first opening 111, avoiding the first binding terminal 131 from directly contacting the water vapor and oxygen in the air, and improving the reliability of the display panel.

[0077] In some embodiments, the orthographic projection of the area of the second opening 121 on the second substrate 15 is within the range of the orthographic projection of the area of the first opening 111 on the second substrate 15.

[0078] Exemplarily, the orthographic projection of the area of the second opening 121 on the second substrate 15 is within the range of the orthographic projection of the area of the first opening 111 on the second substrate 15, that is, in any cross-sectional direction, a trapezoidal first opening 111 as shown can be formed, so as to facilitate the circuit board 30 to be bound and electrically connected to the first binding terminal 131 on one side of the second surface 11b, and it can facilitate the first adhesive 41, the conductive connection part 42, and / or the second adhesive 43 to completely cover the surface of the first binding terminal 131 exposed in the first opening 111, avoiding the first binding terminal 131 from directly contacting the water vapor and oxygen in the air, and improving the reliability of the display panel. Figure 2 and Figure 3 As shown, in the same direction parallel to the plane where the first substrate 11 is located, the width of the first opening 111 on the first surface 11a is smaller than the width on the second surface 11b, or the angle between the side wall of the first opening 111 and the first surface 11a of the first substrate 11 is in the range of 30 degrees to 90 degrees. When the circuit board 30 is bound and electrically connected to the first binding terminal 131 on one side of the second surface 11b, it can facilitate the first adhesive 41, the conductive connection part 42, and / or the second adhesive 43 to completely cover the surface of the first binding terminal 131 exposed in the first opening 111, avoiding the first binding terminal 131 from directly contacting the water vapor and oxygen in the air, and improving the reliability of the display panel.

[0079] In some embodiments, the display panel 100 further includes a circuit board 30. The circuit board 30 is located on the side of the second surface 11b away from the first surface 11a. The circuit board 30 includes a plurality of second binding terminals 32, and the second binding terminals 32 are electrically connected to the corresponding first binding terminals 131.

[0080] Exemplarily, as Figure 3 shown, the circuit board 30 includes a circuit board body 31 and second binding terminals 32 located on the circuit board body 31. A first adhesive 41 is provided between the circuit board 30 and the first binding terminal 131 and / or the first flat layer 12. The first adhesive 41 can be NCF glue (non-conductive glue, Non-Conductive Film). The first adhesive 41 is used to support and carry the circuit board 30, but the material of the first adhesive 41 is not limited to NCF glue.

[0081] Exemplarily, as Figure 3As shown, the display panel 100 includes a plurality of conductive connection portions 42. The conductive connection portions 42 connect the second bonding terminals 32 to the corresponding first bonding terminals 131. The second bonding terminals 32 and the corresponding first bonding terminals 131 are bonded and electrically connected through the conductive connection portions 42. The conductive connection portions 42 can be conductive materials such as silver paste, etc., but the material of the conductive connection portions 42 is not limited to silver paste.

[0082] Exemplarily, as Figure 3 shown, the outer side of the conductive connection portion 42 is covered with a second adhesive material 43. The second adhesive material 43 is an insulating protective adhesive, which can play a role in protecting parts such as the conductive connection portion 42.

[0083] Exemplarily, as Figure 3 shown, on the side of the circuit board 30 away from the first substrate 11, an ink layer 44 can also be covered. The ink layer 44 plays a role in protecting the surface of the side of the circuit board 30 away from the first substrate 11.

[0084] Exemplarily, as Figure 3 shown, in some embodiments, the display panel 100 includes a first substrate 11, a first planar layer 12, a first metal layer 13, a first buffer layer 14, a second substrate 15, a first insulating layer 16, a second insulating layer 17, a second metal layer 18, a second planar layer 19, and a third insulating layer 21 that are sequentially stacked. The material of the first insulating layer 16 can include but is not limited to silicon oxide, silicon nitride. The first insulating layer 16 can play a role in blocking foreign particles on the surface of the second substrate 15. The second insulating layer 17 can be one of the film layers that form the driving circuit of the display panel, for example, a gate insulating layer or an insulating layer between different metal layers. The material of the second planar layer 19 can include organic substances. The second planar layer 19 can play a role in filling and planarizing the depressions caused by the first through hole 141 and the second through hole 151. The third insulating layer 21 can play a role in planarizing the surface of the second planar layer 19 away from the first substrate 11. The material of the third insulating layer 21 can include organic materials or inorganic materials.

[0085] Exemplarily, in some embodiments, the structure of the display panel 100 is not limited to Figure 3 shown. For example, the display panel 100 does not include any one of the first insulating layer 16, the second insulating layer 17, the second planar layer 19, and the third insulating layer 21.

[0086] It should be noted that, in some embodiments, on the side of the second surface 11b away from the first surface 11a, one first opening 111 can expose a plurality of first bonding terminals 131 at the same time. In some other embodiments, on the side of the second surface 11b away from the first surface 11a, one first opening 111 can expose one first bonding terminal 131, and the display panel 100 includes a plurality of first openings 111.

[0087] Please refer to Figures 4 to 9 , based on the same application concept, the embodiments of the present application further provide a manufacturing method of a display panel. The display panel 100 in any of the above can be manufactured by using this manufacturing method of the display panel. The manufacturing method of the display panel includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S800, step S900.

[0088] Step S100: Provide a carrier substrate.

[0089] Exemplarily, as Figure 5 shown, provide a carrier substrate 10.

[0090] Exemplarily, the carrier substrate 10 can be a glass substrate, but is not limited thereto. For example, the carrier substrate 10 can be a ceramic substrate. The carrier substrate 10 is used to carry the first substrate 11 during the manufacturing process.

[0091] Step S200: Form a sacrificial portion of the first substrate on the surface of the carrier substrate.

[0092] Exemplarily, as Figure 5 shown, form a sacrificial portion 101 of the first substrate 11 on the surface of the carrier substrate 10.

[0093] Step S300: Form a first portion of the first substrate on the surface of the carrier substrate. The sacrificial portion and the first portion are located in the same plane parallel to the surface of the carrier substrate. The surface of the first substrate facing away from the carrier substrate is the first surface, and the surface of the first substrate facing the carrier substrate is the second surface.

[0094] Exemplarily, as Figure 6 shown, form a first portion 102 of the first substrate 11 on the surface of the carrier substrate 10. The sacrificial portion 101 and the first portion 102 are located in the same plane parallel to the surface of the carrier substrate 10. The surface of the first substrate 11 facing away from the carrier substrate 10 is the first surface 11a, and the surface of the first substrate 11 facing the carrier substrate 10 is the second surface 11b.

[0095] Exemplarily, in some embodiments, step S200 is manufactured prior to step S300. In some other embodiments, step S300 is manufactured prior to step S200. When step S200 is manufactured prior to step S300, it is easy to make the width of the first opening 111 on the first surface 11a smaller than the width on the second surface 11b in the same direction parallel to the plane where the first substrate 11 is located, that is, the width of the first opening 111 formed on the first surface 11a is smaller, and the width of the first opening 111 formed on the second surface 11b is larger, which is easy to form Figure 2 and Figure 3The first opening 111 in the shape of a trapezoid as shown.

[0096] Exemplarily, the first part 102 can be disposed around the sacrificial part 101, and the sacrificial part 101 corresponds to the subsequent first opening 111.

[0097] Exemplarily, the material of the sacrificial part 101 is different from that of the first part 102. The material of the first part 102 can include polyimide, etc., and the material of the sacrificial part 101 can include at least one of materials such as photoresist material, polysilicon, silicon oxide, etc., so that the sacrificial part 101 is removed in the subsequent step S900 without affecting the first part 102, to ensure that the second surface 11b is a flat surface at the edge of the first opening 111.

[0098] Step S400, forming a first metal layer on the side of the first surface away from the second surface, and the first metal layer includes a plurality of first bonding terminals.

[0099] Exemplarily, as Figure 7 shown, a first metal layer 13 is formed on the side of the first surface 11a away from the second surface 11b, and the first metal layer 13 includes a plurality of first bonding terminals 131.

[0100] Step S500, forming a first buffer layer on the side of the first metal layer away from the first substrate, and the first buffer layer includes a plurality of first through-holes corresponding to the plurality of first bonding terminals.

[0101] Exemplarily, as Figure 7 shown, a first buffer layer 14 is formed on the side of the first metal layer 13 away from the first substrate 11, and the first buffer layer 14 includes a plurality of first through-holes 141 corresponding to the plurality of first bonding terminals 131.

[0102] Step S600, forming a second substrate on the side of the first buffer layer away from the first substrate, and the second substrate includes a plurality of second through-holes corresponding to the plurality of first bonding terminals, and the second through-holes at least partially overlap with the corresponding first through-holes in the thickness direction of the first substrate.

[0103] Exemplarily, as Figure 7 shown, a second substrate 15 is formed on the side of the first buffer layer 14 away from the first substrate 11, and the second substrate 15 includes a plurality of second through-holes 151 corresponding to the plurality of first bonding terminals 131, and the second through-holes 151 at least partially overlap with the corresponding first through-holes 141 in the thickness direction of the first substrate 11.

[0104] Step S700: Form a second metal layer on the side of the second substrate away from the first substrate. The second metal layer includes a plurality of signal traces, and the signal traces are connected to the corresponding first bonding terminals through the corresponding first vias and second vias.

[0105] Exemplarily, as Figure 7 shown, a second metal layer 18 is formed on the side of the second substrate 15 away from the first substrate 11. The second metal layer 18 includes a plurality of signal traces 181, and the signal traces 181 are connected to the corresponding first bonding terminals 131 through the corresponding first vias 141 and second vias 151.

[0106] Step S800: Peel the first substrate from the carrier.

[0107] Exemplarily, as Figure 7 and Figure 8 shown, the first substrate 11 is peeled from the carrier 10.

[0108] Exemplarily, as Figure 7 and Figure 8 shown, peeling the first substrate 11 from the carrier 10 can be any peeling method in the prior art.

[0109] Step S900: Remove the sacrificial part so as to form at least one first opening on the first substrate. The first opening exposes the corresponding first bonding terminal on the second surface, and the second surface is a flat surface at the edge of the first opening.

[0110] Exemplarily, as Figure 9 shown, the sacrificial part 101 is removed so as to form at least one first opening 111 on the first substrate 11. The first opening 111 exposes the corresponding first bonding terminal 131 on the second surface 11b, and the second surface 11b is a flat surface at the edge of the first opening 111.

[0111] Exemplarily, since the materials of the sacrificial part 101 and the first part 102 are different, removing the sacrificial part 101 does not affect the first part 102. For example, the sacrificial part 101 can be removed by dry etching or wet etching methods to ensure that the second surface 11b is a flat surface at the edge of the first opening 111.

[0112] In some embodiments, the method for manufacturing a display panel further includes: forming a first planarization layer 12 on a side of the first surface 11a away from the second surface 11b, forming a first metal layer 13 on a side of the first planarization layer 12 away from the first surface 11a, the first planarization layer 12 including at least one second opening 121, and the first planarization layer 12 covering the boundary between the first portion and the sacrificial portion; wherein, after forming at least one first opening 111, the second opening 121 and the corresponding first opening 111 overlap at least partially in the thickness direction of the first substrate 11.

[0113] Exemplarily, the first planarization layer 12 has the same or similar beneficial effects as those in the above embodiments, and will not be elaborated herein.

[0114] In some embodiments, in the step of forming the first portion 102 of the first substrate 11 on the surface of the carrier substrate (step S300), in a direction perpendicular to the plane where the first substrate 11 is located, the height of the sacrificial portion 101 is greater than or equal to the height of the first portion 102.

[0115] Exemplarily, as Figure 6 shown, Figure 6 it is schematically shown that the height of the sacrificial portion 101 is equal to the height of the first portion 102.

[0116] Exemplarily, in a direction perpendicular to the plane where the first substrate 11 is located, the height of the sacrificial portion 101 being greater than or equal to the height of the first portion 102 can prevent the first substrate 11 from covering the surface of the sacrificial portion 101 away from the carrier substrate 10, and the first opening 111 can be formed better in step S900.

[0117] In some embodiments, the material of the sacrificial portion 101 includes at least one of photoresist, polysilicon, and silicon oxide. When forming the first opening 111 by etching or other methods, the structure of the first portion 102 can be not affected, such that the second surface 11b is a flat surface at the edge of the first opening 111.

[0118] In some embodiments, please refer to Figure 3 shown, the method for manufacturing a display panel further includes: providing a circuit board 30, the circuit board 30 including a plurality of second bonding terminals 32; aligning the plurality of second bonding terminals 32 of the circuit board 30 with a plurality of first bonding terminals 131, and electrically connecting the second bonding terminals 32 to the corresponding first bonding terminals 131.

[0119] Please refer to Figure 10 , Figure 10 which is a schematic diagram of a display device provided by an embodiment of the present application.

[0120] In a third aspect, based on the same application concept, the present application also provides a display device 200. The display device 200 includes the display panel 100 of any one of the above, or the display device 200 includes the display panel 100 combined with several of the above features, or the display device 200 includes the display panel manufactured by the manufacturing method of any one of the above display panels.

[0121] Exemplarily, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiments. The same parts can be understood with reference to the explanation of the display panel 100 above and will not be repeated below.

[0122] Exemplarily, the display device 200 provided in the embodiments of the present application may be Figure 10 the mobile phone shown in the figure, or may be any electronic product with a display function, including but not limited to the following categories: television, laptop computer, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, in-vehicle display, industrial control equipment, medical display screen, touch interaction terminal, etc. The embodiments of the present application do not make special limitations on this.

[0123] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0124] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized in that, Comprising: A first substrate, including at least one first opening, the first substrate including a first surface and a second surface disposed opposite to each other; A first metal layer, located on a side of the first surface away from the second surface, the first metal layer including a plurality of first bonding terminals; A first buffer layer, located on a side of the first metal layer away from the first substrate, the first buffer layer including a plurality of first through holes corresponding to the plurality of first bonding terminals; A second substrate, located on a side of the first buffer layer away from the first substrate, the second substrate including a plurality of second through holes corresponding to the plurality of first bonding terminals, the second through holes at least partially overlapping with the corresponding first through holes in the thickness direction of the first substrate; A second metal layer, located on a side of the second substrate away from the first substrate, the second metal layer including a plurality of signal traces; Wherein, the first opening exposes the corresponding first bonding terminal on the second surface, and the second surface is a flat surface at the edge of the first opening, and the signal traces are connected to the corresponding first bonding terminals through the corresponding first through holes and the second through holes.

2. The display panel according to claim 1, wherein Further comprising: A first planar layer, located between the first substrate and the first metal layer, the first planar layer including at least one second opening, the second opening at least partially overlapping with the corresponding first opening in the thickness direction of the first substrate; Wherein, the first opening and the corresponding second opening expose the corresponding first bonding terminal on the second surface.

3. The display panel according to claim 2, wherein The material of the first substrate includes an organic material, and the thickness of the first substrate is 5 microns to 15 microns; and / or, The material of the first planar layer is an inorganic material, and the thickness of the first planar layer is 50 angstroms to 5000 angstroms; and / or, The material of the second substrate includes an organic material, and the thickness of the second substrate is 5 microns to 10 microns; and / or, In the same direction parallel to the plane where the first substrate is located, the width of the first opening on the first surface is smaller than the width on the second surface; and / or, The included angle between the side wall of the first opening and the first surface of the first substrate is in the range of 30 degrees to 90 degrees; and / or, The orthographic projection of the area of the second opening on the second substrate is within the range of the orthographic projection of the area of the first opening on the second substrate.

4. The display panel according to claim 1, wherein Further comprising: A circuit board, located on a side of the second surface away from the first surface, the circuit board including a plurality of second bonding terminals, the second bonding terminals being electrically connected to the corresponding first bonding terminals.

5. A manufacturing method of a display panel, characterized in that Comprising: Providing a carrier board; Forming a sacrificial portion of the first substrate on the surface of the carrier board; Forming a first portion of the first substrate on the surface of the carrier board, the sacrificial portion and the first portion being in the same plane parallel to the surface of the carrier board, the surface of the first substrate facing away from the carrier board being the first surface, and the surface of the first substrate facing the carrier board being the second surface; Forming a first metal layer on a side of the first surface away from the second surface, the first metal layer including a plurality of first bonding terminals; A first buffer layer is formed on a side of the first metal layer away from the first substrate, and the first buffer layer includes a plurality of first through holes corresponding to the plurality of first bonding terminals. A second substrate is formed on a side of the first buffer layer away from the first substrate. The second substrate includes a plurality of second through holes corresponding to the plurality of first bonding terminals, and the second through holes at least partially overlap with the corresponding first through holes in the thickness direction of the first substrate. A second metal layer is formed on a side of the second substrate away from the first substrate. The second metal layer includes a plurality of signal traces, and the signal traces are connected to the corresponding first bonding terminals through the corresponding first through holes and second through holes. The first substrate is peeled off from the carrier plate. The sacrificial portion is removed to form at least one first opening in the first substrate. The first opening exposes the corresponding first bonding terminal on the second surface, and the second surface is a flat surface at the edge of the first opening.

6. The manufacturing method of the display panel according to claim 5, characterized in that, It further includes: A first planar layer is formed on a side of the first surface away from the second surface. The first metal layer is formed on a side of the first planar layer away from the first surface. The first planar layer includes at least one second opening, and the first planar layer covers the boundary between the first portion and the sacrificial portion. Wherein, after forming at least one first opening, the second opening at least partially overlaps with the corresponding first opening in the thickness direction of the first substrate.

7. The manufacturing method of the display panel according to claim 5, wherein, In the step of forming the first portion of the first substrate on the surface of the carrier plate, in a direction perpendicular to the plane where the first substrate is located, the height of the sacrificial portion is greater than or equal to the height of the first portion.

8. The manufacturing method of the display panel according to claim 5, characterized in that The material of the sacrificial portion includes at least one of photoresist, polysilicon, and silicon oxide.

9. The manufacturing method of the display panel according to claim 5, wherein, It further includes: Providing a circuit board, the circuit board includes a plurality of second bonding terminals; Aligning the plurality of second bonding terminals of the circuit board with the plurality of first bonding terminals, and electrically connecting the second bonding terminals to the corresponding first bonding terminals.

10. A display device, characterized in that, Including the display panel according to any one of claims 1 to 4.

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