Display mother board, display panel, preparation method of display panel and display device

Abstract

The invention discloses a display mother board, a display panel, a preparation method of the display panel and a display device. The display mother board comprises a substrate, multiple metal layers located on one side of the substrate and insulating layers located between every two adjacent metal layers. The insulating layer comprises at least one inorganic insulating layer; the display mother board further comprises at least one display panel setting area and a cutting area surrounding the display panel setting area. The display panel setting area comprises a display area and a non-display area surrounding the display area; the non-display area comprises a packaging area and a non-packaging area surrounding the packaging area; the packaging area comprises a plurality of packaging corner areas and a plurality of packaging straight line areas, and the packaging corner areas are located between every two adjacent packaging straight line areas; the first metal layer comprises a first metal structure located in the packaging area; the display mother board further comprises at least one opening. The opening comprises a first opening at least located in the packaging corner region; the opening penetrates through the inorganic insulating layer, and the first metal structure and the first opening are overlapped in the thickness direction of the display mother board.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and in particular, to a display mother board, a display panel, a preparation method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are widely used in various fields due to their advantages such as being thin and light, having high brightness, low power consumption, fast response, high clarity, and high luminous efficiency. However, although OLED display panels have many above-mentioned advantages, in the cutting process, the cutting stress at the edge may cause cracks in the film layers in the display panel, which may further cause some circuits in the display panel to be disconnected, affecting normal display, and reducing the service life of components composed of multiple film layers. Summary of the Invention

[0003] The present invention provides a display mother board, a display panel, a preparation method thereof, and a display device, which can reduce the risk of cracks generated inside the display panel and improve the preparation yield and display effect of the display panel.

[0004] In a first aspect, the present invention provides a display mother board, including: a substrate, a multi-layer metal layer located on one side of the substrate, and an insulating layer located between adjacent two of the metal layers; the insulating layer includes at least one inorganic insulating layer;

[0005] The display mother board further includes at least one display panel setting area and a cutting area surrounding the display panel setting area; the display panel setting area includes a display area and a non-display area surrounding the display area; the non-display area includes a packaging area and a non-packaging area surrounding the packaging area; the packaging area includes a plurality of packaging corner areas and a plurality of packaging straight areas, and the packaging corner areas are located between adjacent two of the packaging straight areas;

[0006] The metal layer closest to the substrate side in the metal layers is the first metal layer; the first metal layer includes a first metal structure located in the packaging area;

[0007] The display mother board further includes at least one opening; the opening includes at least a first opening located in the packaging corner area; the opening penetrates the inorganic insulating layer, and in the thickness direction of the display mother board, the first metal structure overlaps with the first opening.

[0008] In a second aspect, the present invention provides a display panel, including: a display area and a non-display area surrounding the display area;

[0009] The non-display area includes a packaging area and a non-packaging area surrounding the packaging area; the packaging area includes a plurality of packaging corner areas and a plurality of packaging straight areas, and the packaging corner areas are located between two adjacent packaging straight areas;

[0010] The display panel further includes a substrate, a multi-layer metal layer on one side of the substrate, and an insulating layer between two adjacent metal layers; the insulating layer includes at least one inorganic insulating layer; the metal layer closest to the substrate is the first metal layer; the first metal layer includes a first metal structure located in the packaging area;

[0011] The display panel further includes at least one opening; the opening includes a first opening at least located in the packaging corner area; the opening penetrates the inorganic insulating layer, and in the thickness direction of the display panel, the first metal structure overlaps with the first opening.

[0012] In a third aspect, the present invention provides a method for manufacturing a display panel, including:

[0013] Providing a display mother board; the display mother board is the display mother board described in the first aspect;

[0014] Cutting the display mother board along the cutting area to obtain the display panel.

[0015] In a fourth aspect, the present invention provides a display device including the display panel described in the second aspect.

[0016] The technical solution provided by the present invention, by setting a first opening at least in the packaging corner area of the display mother board, and the first opening penetrates the inorganic insulating layer, so that when cutting the cutting area of the display mother board located in the non-packaging area away from the packaging corner area, the stress generated causes cracks to appear in the inorganic insulating layer in the non-display area, and when the cracks extend from the non-display area to the display area in the inorganic insulating layer, the first opening in the packaging corner area can block the transmission of the cracks to the display area, so as to eliminate the risk of cracks transmitting to the display area through the inorganic insulating layer, improve the preparation yield and display effect of the display area. In addition, in the thickness direction of the display mother board, the first opening is set to overlap with the first metal structure to prevent excessive etching of the inorganic insulating layer when forming the first opening, resulting in partial etching of the substrate, that is, the first metal structure can avoid excessive etching of the inorganic insulating layer, ensure the supportability and protection reliability of the substrate, is conducive to improving the production yield of the display panel, and avoiding introducing water oxygen, etc. in the substrate into the packaging area or the display area, resulting in packaging failure, and improving the preparation yield of the display mother board. Description of the Drawings

[0017] Figure 1 A schematic structural diagram of a display mother board provided for the related art;

[0018] Figure 2 Schematic top view structure diagram of the first display motherboard provided by an embodiment of the present invention;

[0019] Figure 3 It is Figure 2 Schematic cross-sectional structure diagram along the A-A' section in

[0020] Figure 4 Schematic top view structure diagram of the second display motherboard provided by an embodiment of the present invention;

[0021] Figure 5 Schematic top view structure diagram of the third display motherboard provided by an embodiment of the present invention;

[0022] Figure 6 Schematic top view structure diagram of the fourth display motherboard provided by an embodiment of the present invention;

[0023] Figure 7 It is Figure 6 Schematic cross-sectional structure diagram along the A1-A1' section in

[0024] Figure 8 Schematic top view structure diagram of the fifth display motherboard provided by an embodiment of the present invention;

[0025] Figure 9 Schematic top view structure diagram of the sixth display motherboard provided by an embodiment of the present invention;

[0026] Figure 10 It is Figure 9 Schematic cross-sectional structure diagram along the A2-A2' section in

[0027] Figure 11 Schematic top view structure diagram of the seventh display motherboard provided by an embodiment of the present invention;

[0028] Figure 12 It is Figure 11 Schematic cross-sectional structure diagram along the A3-A3' section in

[0029] Figure 13 Schematic top view structure diagram of the eighth display motherboard provided by an embodiment of the present invention;

[0030] Figure 14 It is Figure 13 Schematic cross-sectional structure diagram along the A4-A4' section in

[0031] Figure 15 Schematic top view structure diagram of the ninth display motherboard provided by an embodiment of the present invention;

[0032] Figure 16 It is Figure 15Schematic cross-sectional structure diagram along the A5-A5' section;

[0033] Figure 17 Schematic top view structure diagram of the tenth display mother board provided by the embodiment of the present invention;

[0034] Figure 18 is Figure 17 Schematic cross-sectional structure diagram along the A6-A6' section;

[0035] Figure 19 Schematic top view structure diagram of the eleventh display mother board provided by the embodiment of the present invention;

[0036] Figure 20 is Figure 19 Schematic cross-sectional structure diagram along the A7-A7' section;

[0037] Figure 21 Schematic top view structure diagram of a display panel provided by the embodiment of the present invention;

[0038] Figure 22 is Figure 21 Schematic cross-sectional structure diagram along the B-B' section;

[0039] Figure 23 Flow chart of a method for manufacturing a display panel provided by the embodiment of the present invention;

[0040] Figure 24 Schematic structural diagram of the process for manufacturing a display panel provided by the embodiment of the present invention;

[0041] Figure 25 Flow chart of a method for manufacturing a display mother board provided by the embodiment of the present invention;

[0042] Figure 26 Schematic structural diagram of the process for manufacturing a display mother board provided by the embodiment of the present invention;

[0043] Figure 27 Schematic structural diagram of a display device provided by the embodiment of the present invention. Detailed implementation manners

[0044] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all the structures.

[0045] Figure 1 Schematic structural diagram of a display mother board provided by the related art, as Figure 1As shown in the figure, the display motherboard 1 includes at least one display panel setting area 11 and a cutting area 12 surrounding the display panel setting area 11; the display panel setting area 11 includes a display area 13 and a non-display area 14 surrounding the display area 13; the non-display area 14 includes a packaging area 15 and a non-packaging area 16 surrounding the packaging area 15; the packaging area 15 includes a plurality of packaging corner areas 151 and a plurality of packaging straight areas 152, and the packaging corner areas 151 are located between two adjacent packaging straight areas 152. The cutting area 12 includes a cutting straight area 122 and a cutting corner area 121, the cutting corner area 121 is located on the side of the non-packaging area 16 away from the packaging corner area 151, and the cutting straight area 122 is located on the side of the non-packaging area 16 away from the packaging straight area 152.

[0046] The cutting stress is inversely proportional to the radius of curvature, that is, the smaller the radius of curvature, the greater the stress generated during cutting. Therefore, during the process of cutting the display motherboard 1 along the cutting area 12 to obtain the display panel located in the display panel setting 11, since the radius of curvature of the cutting straight area 122 approaches infinity and the radius of curvature of the cutting corner area 121 is smaller, when the cutting tool moves and cuts along the cutting corner area 121, a large cutting stress will be generated in the cutting corner area 121, resulting in horizontal cracks and vertical cracks in the non-display area 14 adjacent to the cutting corner area 121. The vertical cracks will be transmitted in the direction perpendicular to the plane where the display motherboard 1 is located, thereby driving the peeling of the packaging layer from the metal layer, resulting in the failure of the packaging of the metal layer, affecting the signal transmission performance of the metal layer, and further affecting the yield and display effect of the display panel; in the direction from the non-display area 14 to the display area 13, the horizontal cracks in the non-display area 14 will extend along the inorganic film layer in the display motherboard 1 to the display area 13, causing cracks in the film layer of the display area 13, and further resulting in the disconnection of the circuits or damage to the components in the display area 13, affecting the display effect and service life of the display panel in the display panel setting area 11.

[0047] To solve the above problems, an embodiment of the present invention provides a display mother board, which includes: a substrate, a multi-layer metal layer located on one side of the substrate, and an insulating layer located between adjacent two metal layers; the insulating layer includes at least one inorganic insulating layer; the display mother board further includes at least one display panel setting area and a cutting area surrounding the display panel setting area; the display panel setting area includes a display area and a non-display area surrounding the display area; the non-display area includes a packaging area and a non-packaging area surrounding the packaging area; the packaging area includes a plurality of packaging corner areas and a plurality of packaging straight areas, and the packaging corner areas are located between two adjacent packaging straight areas; the metal layer closest to the substrate side is the first metal layer; the first metal layer includes a first metal structure located in the packaging area; the display mother board further includes at least one opening; the opening includes a first opening at least located in the packaging corner area; the opening penetrates the inorganic insulating layer, and in the thickness direction of the display mother board, the first metal structure overlaps with the first opening.

[0048] By adopting the above technical solution, at least by providing the first opening in the packaging corner area of the display mother board, and the first opening penetrates the inorganic insulating layer, when cutting the cutting area of the display mother board located in the non-packaging area away from the packaging corner area, the stress generated can cause cracks in the inorganic insulating layer located in the non-display area, and when the cracks extend from the non-display area to the display area in the inorganic insulating layer, the first opening located in the packaging corner area can block the transmission of the cracks to the display area, so as to reduce the risk of the cracks transmitting to the display area through the inorganic insulating layer, and improve the preparation yield and display effect of the display area. In addition, in the thickness direction of the display mother board, the first opening is arranged to overlap with the first metal structure, preventing excessive etching of the inorganic insulating layer when forming the first opening, which may cause partial etching of the substrate, that is, the first metal structure can avoid excessive etching of the inorganic insulating layer, ensure the supportability and protection reliability of the substrate, is beneficial to improving the production yield of the display panel, and avoiding introducing water oxygen, etc. in the substrate into the packaging area or the display area, resulting in packaging failure, and improving the preparation yield of the display mother board.

[0049] The above is the core idea of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention.

[0050] Figure 2 It is a top view structural schematic diagram of the first display mother board provided by the embodiment of the present invention. Figure 3 is Figure 2 a cross-sectional structural schematic diagram of the A-A' section in Figure 2 and Figure 3, the display motherboard 1 includes a substrate board 10, a multi-layer metal layer M on one side of the substrate board 10, and an insulating layer I between adjacent two metal layers M; the insulating layer I includes at least one inorganic insulating layer I0. The display motherboard 1 further includes at least one display panel setting area 11 and a cutting area 12 surrounding the display panel setting area 11; the display panel setting area 11 includes a display area 13 and a non-display area 14 surrounding the display area 13; the non-display area 14 includes a packaging area 15 and a non-packaging area 16 surrounding the packaging area 15; the packaging area 15 includes a plurality of packaging corner areas 151 and a plurality of packaging straight areas 152, and the packaging corner areas 151 are located between two adjacent packaging straight areas 152. The metal layer M closest to the substrate board 10 in the metal layer M is the first metal layer M1; the first metal layer M1 includes a first metal structure M10 located in the packaging area 15; the display motherboard 1 further includes at least one opening 20; the opening 20 includes at least a first opening 21 located in the packaging corner area 151; the opening 20 penetrates through the inorganic insulating layer I0, and in the thickness direction Z of the display motherboard 1, the first metal structure M10 overlaps with the first opening 21.

[0051] Among them, the display panel setting area 11 is used to set the display panel, and the number of display panel setting areas 11 in the display motherboard 1 can be set according to actual needs. Exemplarily, taking the display motherboard 1 including 4 display panel setting areas 11 as an example, the number of display panel setting areas 11 in the display motherboard 1 can also be other values, which are not specifically limited here. The cutting area 12 is used to limit the shape of the display panel in the display panel setting area 11, and after the display motherboard 1 is prepared, the display motherboard 1 can be cut along the cutting area 12 to obtain the display panel located in the display panel setting area 11. The display area 13 is the effective area for image display in the display panel after the display panel is formed, and the non-display area 14 is the area in the display panel where no picture is displayed. The non-display area 14 usually sets driving circuits, signal lines, support structures, etc. for driving the display area 13 to display. The packaging area 15 is an area for setting the packaging structure, and this packaging structure can protect the devices, signal lines, etc. in the display area 13 and the non-display area 14 to prevent external moisture, impurities, etc. from entering and affecting the normal display of the display panel. The inorganic insulating layer I0 in the non-packaging area 16 can play a supporting role to prevent the edge of the display panel from warping or curling.

[0052] The substrate 10 may include a flexible substrate or a rigid substrate; the flexible substrate may include flexible organic film layers such as polyimide (PI) film, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, and ultra-thin glass film, so that the substrate 10 has special properties such as bendability and curliness. The rigid substrate may include a hard inorganic material layer such as glass, so that the substrate 10 has sufficient support ability. The material of the metal layer M includes copper or aluminum, etc., and the material of the insulating layer I includes silicon nitride or aluminum oxide, etc. The number of metal layers M and insulating layers I provided can be set according to actual needs, and no specific limitation is made here. This embodiment only takes the display mother board 1 including three metal layers M and three insulating layers I as an example for illustration.

[0053] It can be understood that the cutting area 12 may include a cutting straight area 122 and a cutting corner area 121. The cutting corner area 121 is located on the side of the non-encapsulation area 16 facing away from the encapsulation corner area 151, and the cutting straight area 122 is located on the side of the non-encapsulation area 16 facing away from the encapsulation straight area 152. The cutting stress is inversely proportional to the radius of curvature, that is, the smaller the radius of curvature, the greater the stress generated during cutting. Therefore, during the process of cutting the display mother board 1 along the cutting area 12 to obtain the display panel located in the display panel setting 11, since the radius of curvature of the cutting straight area 122 approaches infinity, while the radius of curvature of the cutting corner area 121 is smaller, when the cutting tool moves and cuts along the cutting corner area 121, a large cutting stress will be generated in the cutting corner area 121, resulting in cracks in the non-display area 14 adjacent to the cutting corner area 121. The cracks will extend from the non-display area 14 in the display mother board 1 to the display area 13, causing cracks in the film layer of the display area 13. In addition, compared with the metal layer M or the organic insulating layer, the inorganic insulating layer I0 has a relatively large elastic modulus. When an external force acts on the inorganic insulating layer I0, the metal layer M, and the organic insulating layer, the inorganic insulating layer I0 with a high elastic modulus bears most of the stress. As a result, cracks are mainly generated in the inorganic insulating layer I0 and are transmitted along the inorganic insulating layer I0 to the display area 13, causing cracks in the film layer of the display area 13, and further resulting in disconnection of the circuit or damage to components in the display area 13, affecting the display effect and service life of the display panel in the display panel setting area 11.

[0054] The technical solution of the present invention is to set at least one opening 20 penetrating through the inorganic insulating layer I0 in the display mother board 1, and the opening 20 includes at least a first opening 21 located in the encapsulation corner area 151, so as to cut the cutting area 12. Then, cracks generated in the non-display area 14 of the first opening 21 facing away from the display area 13. When the cracks propagate from the non-display area 14 to the display area 13 in the inorganic insulating layer I0, the propagation path is disconnected at the first opening 21, thereby preventing the cracks from continuing to propagate to the display area 13, reducing the risk of cracks in the display area 13, ensuring the stability of the circuits or devices in the display area 13, and thus improving the production yield and display effect of the display panel.

[0055] In addition, in the thickness direction Z of the display mother board 1, the first metal structure M10 overlaps with the first opening 21, so that the first metal structure M10 in the encapsulation corner area 151 can cover the substrate 10. When using processes such as etching to remove the inorganic insulating layer to form the first opening 21, if the inorganic insulating layer is over-etched, the etching will stop when reaching the first metal structure M10 due to the existence of the first metal structure M10, preventing the inorganic insulating layer I0 from being over-etched when forming the first opening, and resulting in partial etching of the substrate 10. That is, the first metal structure M10 can avoid over-etching of the inorganic insulating layer I0, ensure the supportability and protection reliability of the substrate 10, which is beneficial to improving the production yield of the display panel. In addition, it can avoid introducing water, oxygen, etc. in the substrate 10 into the encapsulation area 15 or the display area 13, resulting in encapsulation failure, and improving the production yield of the display mother board 1.

[0056] The technical solution of the present invention is to set at least a first opening in the encapsulation corner area of the display mother board. The first opening penetrates through the inorganic insulating layer, so that the stress generated when cutting the cutting area of the display mother board located in the non-encapsulation area away from the encapsulation corner area causes cracks in the inorganic insulating layer located in the non-display area. When the cracks extend from the non-display area to the display area in the inorganic insulating layer, the first opening located in the encapsulation corner area can block the propagation of the cracks to the display area, so as to reduce the risk of cracks propagating to the display area through the inorganic insulating layer, and improve the production yield and display effect of the display area. In addition, in the thickness direction of the display mother board, the first opening is set to overlap with the first metal structure, preventing the inorganic insulating layer from being over-etched when forming the first opening, resulting in partial etching of the substrate, that is, the first metal structure can avoid over-etching of the inorganic insulating layer, ensure the supportability and protection reliability of the substrate, which is beneficial to improving the production yield of the display panel, and avoid introducing water, oxygen, etc. in the substrate into the encapsulation area or the display area, resulting in encapsulation failure, and improving the production yield of the display mother board.

[0057] It can be understood that Figure 1Only the display motherboard structure with the opening 20 located in the encapsulation corner area 151 is shown herein. On this basis, the opening 20 can also be located in the encapsulation straight area 152. In an alternative embodiment, Figure 4 is a top view structural schematic diagram of the second display motherboard provided by an embodiment of the present invention. As Figure 4 shown, the opening 20 further includes a second opening 22 located in at least a part of the encapsulation straight area 152.

[0058] Specifically, when cutting the cutting straight area 122, certain cutting stress will also be generated. The lateral stress generated by cutting will be transmitted to the encapsulation straight area 152. When the cutting stress increases to a certain degree, cracks will be generated in the encapsulation straight area 152. At this time, by setting the second opening 22 in the encapsulation straight area 152 to block the cracks from spreading along the encapsulation straight area 152 to the display area 13, the risk of cracks in the display area 13 is reduced, and the production yield and display effect of the display area 13 are improved.

[0059] Optionally, Figure 5 is a top view structural schematic diagram of the third display motherboard provided by an embodiment of the present invention. As Figure 5 shown, the multiple encapsulation straight areas 152 include a first encapsulation straight area 1521 located on one side of the display area 13; a plurality of first bonding pads 17 are provided in the first encapsulation straight area 1521; the second opening 22 is not provided in the first encapsulation straight area 1521.

[0060] Among them, the display area 13 includes a plurality of signal lines, and the signal lines include data lines or scan lines, etc. The first bonding pads 17 can not only be electrically connected to the signal lines in the display area 13, but also be electrically connected to the signal lines in the non-display area 14. After the driving chip is electrically connected to the first bonding pads 17 through the signal lines in the non-display area 14 in the subsequent process, the driving signals provided by the driving chip can be transmitted to the signal lines in the display area 13 through the first bonding pads 17 to ensure the normal picture display of the display area 13.

[0061] Specifically, since a plurality of first bonding pads 17 are provided in the first encapsulation straight area 1521, signal lines such as fan-out lines and power buses will be provided around the first bonding pads 17, and each signal line can be distributed in different metal layers M. If the second opening 22 is provided in the first encapsulation straight area 1521, the inorganic insulating layer I0 between adjacent two metal layers M will be removed, causing the signal lines located in different metal layers M to be short-circuited, resulting in incorrect signal transmission. The signal lines in the display area 13 receive incorrect driving signals, affecting the display reliability of the display area 13. Therefore, the second opening 22 is only provided in the encapsulation straight area 152 except the first encapsulation straight area 1521 to ensure the accuracy and reliability of the driving signals provided by the first encapsulation straight area 1521 to the display area 13 and improve the display effect of the display area 13.

[0062] Optionally, continue to refer to Figure 4 and Figure 5 , the first opening 21 and the second opening 22 are connected to form an annular or semi-annular opening that at least partially surrounds the display area 13.

[0063] Specifically, the first opening 21 and the second opening 22 are connected such that the number of inorganic insulating layers I0 passing through the first opening 21 and the second opening 22 is the same as that of the film layers. After the first opening 21 and the second opening 22 are connected, they are an integrated structure. When forming the first opening 21 and the second opening 22, the same process can be used to prepare the first opening 21 and the second opening 22 simultaneously, improving the preparation efficiency. The first opening 21 and the second opening 22 are connected to form an annular or semi-annular opening that partially surrounds the display area 13, so that the first opening 21 and the second opening 22 can block some or all of the cracks around the encapsulation area 15, disconnect the transmission path of the cracks to the display area 13, and thus reduce the risk of cracks generated in the display area 13 and ensure the display effect of the display area 13.

[0064] Refer to Figure 5 , when multiple first bonding pads 17 are provided in the first encapsulation straight area 1521, in order to avoid short circuits of signal lines in different metal layers in the first encapsulation straight area 1521 after the second opening 22 is provided in the first encapsulation straight area 1521, which may lead to problems such as signal transmission errors to the display area 13, the second opening 22 is not provided in the first encapsulation straight area 1521. At this time, the connected first opening 21 and second opening 22 form a semi-annular opening surrounding the display area 13, so as to ensure the accuracy and reliability of the driving signal provided by the first encapsulation straight area 1521 to the display area 13 on the basis that cracks can be blocked from being transmitted to the display area 13 in the encapsulation area 15 except for the first encapsulation straight area 1521, and improve the display effect of the display area 13.

[0065] Optionally, Figure 6 This is a top view structural schematic diagram of the fourth display mother board provided by an embodiment of the present invention. Figure 7 is Figure 6 the cross-sectional structural schematic diagram along the A1-A1' section in Figure 6 and Figure 7 , the opening 20 includes a plurality of first sub-openings 201 arranged along the first direction (X1, X2, X3 or X4), and any two first sub-openings 201 are not connected to each other; the first direction (X1, X2, X3 or X4) is parallel to the direction from the display area 13 to the non-display area 14.

[0066] Specifically, a plurality of first sub-openings 201 arranged along the first direction (X1, X2, X3 or X4) may be provided only within the encapsulation corner region 151, so that when a crack generated during cutting in the inorganic insulating layer I0 in the non-encapsulation region 16 of the encapsulation corner region 151 facing away from the display region 13 is transmitted to the encapsulation corner region 151, the transmission path can be cut off by the first sub-opening 201 close to the encapsulation region 16, and when a crack appears in the inorganic insulating layer I0 between two first sub-openings 201, the transmission path of the crack will be disconnected at the first sub-opening 201 close to the display region 13, thereby preventing the crack from further transmitting to the display region 13, further reducing the risk of crack transmission to the display region 13, and improving the production yield and display effect of the display region 13.

[0067] It should be noted that Figure 6 when it is shown in that the opening only includes the first opening located in the encapsulation corner region, a plurality of first sub-openings 201 are provided within the encapsulation corner region 151. In other alternative embodiments, such as Figure 8 as shown, when the opening further includes a second opening located in at least a part of the encapsulation straight region, the second opening may also include a plurality of first sub-openings 201 arranged along the first direction (X5, X6 or X7), further reducing the risk of crack transmission from the partial encapsulation straight region 152 to the display region 13, and improving the production yield and display effect of the display panel.

[0068] It can be understood that Figure 6 and Figure 8 only show that the display mother board 1 includes two first sub-openings 201 arranged along the first direction (X1, X2, X3, X4, X5, X6 or X7). In other alternative embodiments, the number of first sub-openings 201 arranged along the first direction (X1, X2, X3, X4, X5, X6 or X7) may also be three or more, which can be set according to actual needs and will not be specifically limited herein.

[0069] Optionally, Figure 9 FIG. 19 is a top view structural schematic diagram of a sixth display mother board provided by an embodiment of the present invention, Figure 10 and Figure 9 FIG. 20 is a cross-sectional structural schematic diagram of the cross-section along A2-A2' in FIG. 19. Referring to Figure 9 and Figure 10 , the non-encapsulation region 16 includes at least a third opening 23 penetrating through each inorganic insulating layer I0.

[0070] Specifically, on the basis of providing the opening 20 in the encapsulation area 15, at least a third opening 23 penetrating through each inorganic insulating layer I0 can be provided in the non-encapsulation area 16, so that during the process of cracks generated in the non-encapsulation area 16 propagating towards the encapsulation area 15 or the display area 13, the crack transmission path is disconnected at the third opening 23, further reducing the risk of cracks in the non-encapsulation area 16 propagating towards the display area 13, improving the crack resistance of the display area 13, as well as the film layer adhesion degree of the display area 13, and thus improving the display effect of the display panel.

[0071] Optionally, Figure 11 is a top view structural schematic diagram of the seventh display mother board provided by an embodiment of the present invention. As Figure 11 shown, the non-encapsulation area 16 includes a first non-encapsulation area 161 on one side of the display area 13; at least one second bonding pad 18 is provided in the first non-encapsulation area 161; the third opening 23 is not provided in the first non-encapsulation area 161.

[0072] Among them, the display area 13 includes a plurality of signal lines. The signal lines include data lines or scan lines, etc. The second bonding pad 18 can not only be electrically connected to the signal lines in the display area 13, but also be electrically connected to the signal lines in the non-display area 14. After the driving chip is electrically connected to the second bonding pad 18 through the signal lines in the non-display area 14 in the subsequent process, the driving signal provided by the driving chip can be transmitted to the signal lines in the display area 13 through the second bonding pad 18, ensuring the normal picture display of the display area 13.

[0073] Specifically, since a plurality of second bonding pads 18 are provided in the first non-encapsulation area 161, signal lines such as fan-out lines or power lines will be provided around the second bonding pad 18. Each signal line can be distributed in different metal layers M. If a second opening 22 is provided in the first non-encapsulation area 161, the inorganic insulating layer I0 between adjacent two metal layers M will be removed, causing the signal lines located in different metal layers M to be short-circuited, resulting in incorrect signal transmission, and the signal lines in the display area 13 receiving incorrect driving signals, affecting the display reliability of the display area 13. Therefore, the second opening 22 is only provided in the encapsulation straight area 152 except the first non-encapsulation area 161 to ensure the accuracy and reliability of the driving signal provided by the first non-encapsulation area 161 to the display area 13 and improve the display effect of the display area 13.

[0074] Optionally, Figure 12 is a cross-sectional structural schematic diagram along the A3-A3' section in Figure 11 . Referring to Figure 11 and Figure 12 , the display mother board 1 further includes a first insulating layer I01 between the first metal layer M1 and the substrate 10; the material of the first insulating layer I01 is an inorganic material; the third opening 23 also penetrates through the first insulating layer I01.

[0075] Among them, the inorganic materials include silicon nitride, silicon dioxide, aluminum oxide, etc., which can be set according to actual needs.

[0076] Specifically, since the metal layer M is disposed in the non-encapsulation area 16, the metal layer M serves as an antenna effect source to generate high-frequency noise, and the metal layer M located in the non-encapsulation area 16 may contact conductive adhesives (such as silver paste) in the encapsulation area 15 to form a micro-short circuit channel, resulting in a reduction in the transmission reliability of some signal lines for transmitting drive signals to the display area 13, affecting the display yield of the display panel. Therefore, the metal layer M is usually not disposed in the non-encapsulation area 16, so the third opening 23 can be provided to penetrate all the inorganic insulating layers including the first insulating layer I01, preventing the cracks generated by cutting from spreading along the first insulating layer I01 to the display area 13, further reducing the risk of cracks in the film layer, and improving the yield of the display panel 100.

[0077] Optionally, Figure 13 FIG. 10 is a top view structural schematic diagram of an eighth display mother board provided by an embodiment of the present invention. Figure 14 is Figure 13 a cross-sectional structural schematic diagram of the cross-section along A4-A4' in FIG. 10. Referring to Figure 13 and Figure 14 , the third opening 23 includes a plurality of third sub-openings 203 arranged along the second direction (Y1, Y2, Y3, Y4, Y5 or Y6), and any two third sub-openings 203 are not connected to each other; the second direction (Y1, Y2, Y3, Y4, Y5 or Y6) is parallel to the direction from the encapsulation area 15 to the non-encapsulation area 16.

[0078] Specifically, a plurality of third sub-openings 203 arranged along the second direction (Y1, Y2, Y3, Y4, Y5 or Y6) can be provided in the non-encapsulation area 16, so that when cracks generated during cutting in a part of the inorganic insulating layer I0 in the non-encapsulation area 16 close to the cutting area 12 spread towards the encapsulation area 15, the transmission path can be cut off by the third sub-opening 203 close to the cutting area 12, and when cracks appear in the inorganic insulating layer between two third sub-openings 203, the transmission path of the cracks will be disconnected at the third sub-opening 203 close to the display area 13, and thus cannot spread to the display area 13, further reducing the risk of cracks spreading to the display area 13, and improving the preparation yield and display effect of the display area 13.

[0079] It can be understood that Figure 13Only two third sub-openings 203 arranged along the second direction (Y1, Y2, Y3, Y4, Y5 or Y6) are shown in [Figure 0], and in other alternative embodiments, the number of third sub-openings 203 arranged along the second direction (Y1, Y2, Y3, Y4, Y5 or Y6) can also be three or more, which can be set according to actual needs and will not be specifically limited here.

[0080] Optionally, Figure 15 is a top view structural schematic diagram of the ninth display mother board provided by an embodiment of the present invention, Figure 16 is Figure 15 a cross-sectional structural schematic diagram of the cross-section along A5 - A5' in [Figure 5], referring to Figure 15 and Figure 16 , the display mother board 1 further includes a bending protection layer 30; the bending protection layer 30 is located on the side of each insulating layer I in the non-encapsulation area 16 away from the substrate 10, and the bending protection layer 30 fills the third opening 23.

[0081] Among them, the material of the bending protection layer 30 includes polyimide (PI) film, transparent polyurethane (TPU), etc., which can be set according to actual needs and will not be specifically limited here.

[0082] Specifically, the bending protection layer 30 has a certain elastic deformation ability. When the non-encapsulation area 16 is bent, it can reduce the bending difficulty of the non-encapsulation area 16, so that the display panel in the display panel setting area 11 can achieve the structure of a four-curved surface screen, or the display panel can be applied to a foldable display device, improving the practicability of the display panel in the display panel setting area 11.

[0083] Optionally, Figure 17 is a top view structural schematic diagram of the tenth display mother board provided by an embodiment of the present invention, Figure 18 is Figure 17 a cross-sectional structural schematic diagram of the cross-section along A6 - A6' in [Figure 6], referring to Figure 17 and Figure 18 , the display mother board 1 further includes a first protection layer 40 located on the side of the bending protection layer 30 away from the substrate 10; the first protection layer 40 includes a first protection structure 41, and the insulating layer I includes an insulating structure I11 located between the third openings 23; in the thickness direction Z of the display mother board 1, the first protection structure 41 overlaps with the insulating structure I11.

[0084] Among them, the material of the first protection layer 40 includes silicon dioxide or silicon nitride, etc., which can be set according to actual needs and will not be specifically limited here. The first protection layer 40 can be prepared on the same layer as the planarization layer in the display area 13 to reduce the preparation process of the display mother board and improve the preparation efficiency of the display mother board 1.

[0085] Specifically, when the non-bending area 16 is bent, each insulating layer I in the non-bending area 16 will be subjected to stress in the direction from the substrate 10 to the insulating layer I. By providing the first protection structure 41 covering the insulating structure I11, the bending stress on the insulating structure I11 in the non-packaging area 16 during bending can be reduced to prevent cracks and the like from occurring in the insulating structure I11. In this way, in the thickness direction Z of the display mother board 1, the first protection layer 40 is located on the side of the bending protection layer 30 away from the substrate 10, enabling the first protection layer 40 to protect each insulating layer I in the non-packaging area 16 and further reducing the risk of cracks in the insulating layer during bending.

[0086] Optionally, continuing to refer to Figure 18 , the display mother board 1 further includes a packaging layer 50; the packaging layer 50 covers the display area 13 and the packaging area 15.

[0087] Among them, the packaging layer 50 includes a multi-layer laminated packaging structure of an inorganic layer - an organic layer - an inorganic layer, or a laminated packaging structure of an inorganic layer - an inorganic layer. The film layer structure of the packaging layer 50 covering the display area 13 can be the same as or different from the film layer structure of the packaging layer 50 covering the packaging area 15, and can be set according to actual needs, and no specific limitation is made here. In an optional embodiment, the film layer structure of the packaging layer 50 covering the display area 13 includes a laminated packaging structure of an inorganic layer 51 - an organic layer 52 - an inorganic layer 53, and the packaging layer 50 covering the packaging area 15 includes a laminated packaging structure of an inorganic layer 51 - an inorganic layer 53.

[0088] Specifically, the packaging layer 50 can prevent water, mist, etc. from entering the display panel setting area 11 through the inorganic layer, and can absorb the entering impurities through the organic layer to ensure the packaging effect and extend the service life of the display panel in the display panel setting area 11. The packaging layer 50 can protect the metal layer or semiconductor layer in the packaging area 15 and the display area 13, prevent water, mist or impurities in the outside air from entering the light-emitting device or transmission line in the display panel setting area, so as to protect the transmission line and the light-emitting device and ensure the service life of the display panel.

[0089] Optionally, Figure 19 is a top view structural schematic diagram of the eleventh display mother board provided by the embodiment of the present invention, Figure 20 is Figure 19 the cross-sectional structural schematic diagram along the A7 - A7' section in Figure 19 and Figure 20 , the multi-layer metal layer M further includes a second metal layer M2 located on the side of the first metal layer M1 away from the substrate 10; the second metal layer M2 includes a first signal line; the first signal line is at least located in the packaging area 15, and the first signal line is in contact with the first metal structure M10.

[0090] Among them, the signals transmitted by the first signal line include a positive power supply signal PVDD, a negative power supply signal PVEE, etc., which can be set according to actual needs and are not specifically limited here.

[0091] Specifically, by setting the second metal layer M2 where the first signal line is located to be in contact with the first metal structure M10, the first metal structure M10 becomes a part of the first signal line, so that the first signal line has a larger metal layer thickness in the encapsulation area 15, which can reduce the overall impedance of the first signal line, reduce the attenuation of the first signal during transmission in the first signal line, and improve the efficiency and accuracy of the first signal line in transmitting signals.

[0092] Based on the same inventive concept, the present invention also provides a display panel. Figure 21 It is a top view structural schematic diagram of a display panel provided by an embodiment of the present invention. Figure 22 is Figure 21 a cross-sectional structural schematic diagram along the B-B' section in Figure 21 and Figure 22 , the display panel 100 includes a display area 13 and a non-display area 14 surrounding the display area 13; the non-display area 14 includes an encapsulation area 15 and a non-encapsulation area 16 surrounding the encapsulation area 15; the encapsulation area 15 includes a plurality of encapsulation corner areas 151 and a plurality of encapsulation straight areas 152, and the encapsulation corner areas 151 are located between two adjacent encapsulation straight areas 152; the display panel 100 also includes a substrate 10, a multi-layer metal layer M on one side of the substrate 10, and an insulating layer I between adjacent two metal layers M; the insulating layer I includes at least one inorganic insulating layer I0; the metal layer M closest to the substrate 10 on one side is the first metal layer M1; the first metal layer M1 includes a first metal structure M10 located in the encapsulation area 15; the display panel 100 also includes at least one opening 20; the opening 20 includes at least a first opening 21 located in the encapsulation corner area 151; the opening 20 penetrates through the inorganic insulating layer I0, and in the thickness direction Z of the display panel 100, the first metal structure M10 overlaps with the first opening 21.

[0093] Among them, the display area 13 is the effective area in the display panel 100 where image display is realized after the display panel 100 is formed, and the non-display area 14 is the area in the display panel 100 where no picture is displayed. The non-display area 14 usually sets driving circuits, signal lines, support structures, etc. for driving the display area 13 to display. The encapsulation area 15 is an area for setting an encapsulation structure, and this encapsulation structure can protect the devices, signal lines, etc. in the display area 13 and the non-display area 14, preventing external moisture, impurities, etc. from entering and affecting the normal display of the display panel 100. The inorganic insulating layer I0 in the non-encapsulation area 16 can play a supporting role to prevent the edges of the display panel 100 from warping or curling.

[0094] The substrate 10 may include a flexible substrate or a rigid substrate; the flexible substrate may include flexible organic film layers such as polyimide (PI) film, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, and ultra-thin glass film, so that the substrate 10 has special properties such as bendability and curliness. The rigid substrate may include a hard inorganic material layer such as glass, so that the substrate 10 has sufficient supporting ability. The material of the metal layer M includes copper or aluminum, etc., and the material of the insulating layer I includes silicon nitride or aluminum oxide, etc. The number of metal layers M and insulating layers I provided can be set according to actual needs. Here, only an example is given where the display panel 100 includes three metal layers M and three insulating layers I, and it can also be other numbers, which are not specifically limited here.

[0095] It can be understood that the cutting stress is inversely proportional to the radius of curvature, that is, the smaller the radius of curvature, the greater the stress generated during cutting. Refer to Figure 2 and Figure 21 , so during the process of cutting the display mother board 1 along the cutting area 12 to obtain the display panel 100 located in the display panel setting 11, since the radius of curvature of the cutting straight area 122 approaches infinity, while the radius of curvature of the cutting corner area 121 is smaller, when the cutting tool moves and cuts along the cutting corner area 121, a large cutting stress will be generated in the cutting corner area 121, resulting in cracks in the non-display area 14 adjacent to the cutting corner area 121. The cracks will extend from the non-display area 14 in the display mother board 1 to the display area 13, causing cracks in the film layer of the display area 13. In addition, compared with the metal layer M or the organic insulating layer, the inorganic insulating layer I0 has a relatively large elastic modulus. When an external force acts on the inorganic insulating layer I0, the metal layer M, and the organic insulating layer, the inorganic insulating layer I0 with a high elastic modulus bears most of the stress. As a result, cracks are mainly generated in the inorganic insulating layer I0 and propagate along the inorganic insulating layer I0 to the display area 13, causing cracks in the film layer of the display area 13, and further resulting in disconnection of the circuits or damage to components in the display area 13, affecting the display effect and service life of the display panel 100.

[0096] The technical solution of the present invention is to set at least one opening 20 penetrating the inorganic insulating layer I0 in the display mother board 1, and the opening 20 includes at least a first opening 21 located in the encapsulation corner area 151, so as to cut the cutting area 12. Then, cracks generated in the non-display area 14 of the first opening 21 facing away from the display area 13, when the cracks propagate from the non-display area 14 to the display area 13 in the inorganic insulating layer I0, the propagation path is disconnected at the first opening 21, thereby preventing the cracks from continuing to propagate to the display area 13, reducing the risk of cracks in the display area 13, ensuring the stability of the circuits or devices in the display area 13, and thus improving the production yield and display effect of the display panel 100.

[0097] In addition, in the thickness direction Z of the display panel 100, the first metal structure M10 overlaps with the first opening 21, so that the first metal structure M10 in the encapsulation corner area 151 can cover the substrate 10. When using processes such as etching to remove the inorganic insulating layer to form the first opening 21, if the inorganic insulating layer is over-etched, the etching will stop when reaching the first metal structure M10 due to the existence of the first metal structure M10, preventing the inorganic insulating layer I0 from being over-etched when forming the first opening, and thus preventing part of the substrate 10 from being etched. That is, the first metal structure M10 can avoid over-etching of the inorganic insulating layer I0, ensuring the supportability and protection reliability of the substrate 10, which is beneficial to improving the production yield of the display panel 100. In addition, it can avoid introducing water, oxygen, etc. in the substrate 10 into the encapsulation area 15 or the display area 13, resulting in encapsulation failure, and improving the preparation yield of the display panel 100.

[0098] According to the technical solution of the present invention, by providing at least a first opening in the encapsulation corner area of the display panel, the first opening penetrates the inorganic insulating layer. During the process of cutting to form the display panel, the stress generated during cutting causes cracks to appear in the inorganic insulating layer located in the non-display area, and when the crack extends from the non-display area to the display area in the inorganic insulating layer, the first opening located in the encapsulation corner area can block the transmission of the crack to the display area, reducing the risk of the crack transmitting to the display area through the inorganic insulating layer, and improving the preparation yield and display effect of the display area. In addition, in the thickness direction of the display panel, the first opening is arranged to overlap with the first metal structure, preventing the inorganic insulating layer from being over-etched when forming the first opening, and thus preventing part of the substrate from being etched. That is, the first metal structure can avoid over-etching of the inorganic insulating layer, ensuring the supportability and protection reliability of the substrate, which is beneficial to improving the production yield of the display panel, and avoiding introducing water, oxygen, etc. in the substrate into the encapsulation area or the display area, resulting in encapsulation failure, and improving the preparation yield of the display panel.

[0099] Based on the same inventive concept, the present invention also provides a method for manufacturing a display panel. This manufacturing method is applicable to manufacturing the display panel provided by the embodiments of the present invention, and this method can be implemented in the form of hardware and / or software. Figure 23 It is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present invention. Figure 24 It is a schematic structural diagram of a process for manufacturing a display panel provided by an embodiment of the present invention. Refer to Figure 23 and Figure 24 , the method for manufacturing the display panel includes:

[0100] S10. Provide a display mother board.

[0101] The display motherboard includes a base substrate, a plurality of metal layers located on one side of the base substrate, and an insulating layer located between two adjacent metal layers; the insulating layer includes at least one inorganic insulating layer. The display motherboard also includes at least one display panel setting area 11 and a cutting area 12 surrounding the display panel setting area 11; the display panel setting area 11 includes a display area 13 and a non-display area 14 surrounding the display area 13; the non-display area 14 includes a packaging area 15 and a non-packaging area 16 surrounding the packaging area 15; the packaging area 15 includes a plurality of packaging corner areas 151 and a plurality of packaging straight line areas 152, and the packaging corner area 151 is located between two adjacent packaging straight line areas 152. The metal layer closest to the base substrate in the metal layer is the first metal layer; the first metal layer includes a first metal structure located in the packaging area 15; the display motherboard 1 also includes at least one opening 20; the opening 20 includes a first opening 21 located at least in the packaging corner area 151; the opening 20 penetrates the inorganic insulating layer, and in the thickness direction of the display motherboard 1, the first metal structure overlaps with the first opening 21.

[0102] Specifically, the display motherboard 1 may be formed by: providing a substrate; preparing various metal layers and an insulating layer located between adjacent metal layers on one side of the substrate by processes such as chemical vapor deposition sputtering or evaporation, so that the insulating layer can insulate the signal lines arranged in the two adjacent metal layers, prevent the signals between the two adjacent metal layers from crosstalk, and improve the display reliability of the display panel; wherein, the metal layer closest to the substrate side among the prepared metal layers may be the first metal layer; while preparing the various metal layers and the insulating layer, after the various inorganic insulating layers located on the side of the first metal structure away from the substrate are prepared, the various inorganic insulating layers located on the side of the first metal structure away from the substrate may be removed by a hole digging process, etc., thereby forming an opening 20.

[0103] S20, cutting the display motherboard along the cutting area to obtain a display panel.

[0104] The cutting area 12 surrounds the display panel setting area 11 .

[0105] Specifically, fine cutting equipment or the like can be used to cut along the cutting area 12 around the same display panel setting area 11 to obtain the display panel 100 located in the display panel setting area 11. The specific removal method can be implemented by laser cutting or etching liquid etching. When laser cutting is used, the power of the laser is related to parameters such as the thickness of the cutting area 12, which can be set according to actual needs and is not specifically limited here. For example, refer to Figure 24, it can be cut along the cutting path q1 to obtain the display panel 100. The cutting stress is inversely proportional to the radius of curvature, that is, the smaller the radius of curvature, the greater the stress generated during cutting. Therefore, during the process of cutting the display mother board 1 along the cutting path q1 to obtain the display panel 100 located in the display panel setting 11, since the radius of curvature of the cutting straight line area 122 approaches infinity, while the radius of curvature of the cutting corner area 121 is smaller, when the cutting tool moves and cuts along the cutting corner area 121, a large cutting stress will be generated in the cutting corner area 121, resulting in cracks in the non-display area 14 adjacent to the cutting corner area 121. The path through which the cracks propagate from the non-display area 14 to the display area 13 in the inorganic insulating layer I0 will be disconnected by the first opening 21, thereby preventing the cracks from continuing to propagate to the display area 13, reducing the risk of cracks in the display area 13, ensuring the stability of the circuits or devices in the display area 13, and thus improving the production yield and display effect of the display panel.

[0106] In addition, in the thickness direction Z of the display mother board 1, the first metal structure M10 overlaps with the first opening 21, so that the first metal structure M10 in the encapsulation corner area 151 can cover the substrate 10. When using processes such as etching to remove the inorganic insulating layer to form the first opening 21, if the inorganic insulating layer is over-etched, the etching will stop when reaching the first metal structure M10 due to the existence of the first metal structure M10, preventing the inorganic insulating layer I0 from being over-etched when forming the first opening, and resulting in partial etching of the substrate 10. That is, the first metal structure M10 can prevent the inorganic insulating layer I0 from being over-etched, ensure the supportability and protection reliability of the substrate 10, which is beneficial to improving the production yield of the display panel. In addition, it can avoid introducing water, oxygen, etc. in the substrate 10 into the encapsulation area 15 or the display area 13, resulting in encapsulation failure, and improve the production yield of the display mother board 1.

[0107] The technical solution provided by the present invention, by at least setting a first opening in the encapsulation corner area of the display mother board, the first opening penetrates the inorganic insulating layer, so that when providing the display mother board and cutting the display mother board along the cutting area, when cracks appear in the inorganic insulating layer in the non-display area due to cutting stress, the first opening located in the encapsulation corner area can disconnect the propagation path of the cracks from the non-display area to the display area, so as to reduce the risk of cracks propagating to the display area through the inorganic insulating layer, and improve the production yield and display effect of the display area. In addition, in the thickness direction of the display mother board, the first opening is set to overlap with the first metal structure. When using processes such as etching to form the first opening, the first metal structure can prevent over-etching to the substrate, ensure the supportability and protection reliability of the substrate, and avoid introducing water, oxygen, etc. in the substrate into the encapsulation area or the display area, resulting in encapsulation failure, and improve the production yield of the display mother board.

[0108] In an optional embodiment, the embodiments of the present invention illustrate the case of providing a display mother board. Figure 25 It is a flowchart of a method for manufacturing a display mother board provided by an embodiment of the present invention. Figure 26 It is a schematic structural diagram of a process for manufacturing a display mother board provided by an embodiment of the present invention. Refer to Figure 25 and Figure 26 , providing the display mother board includes:

[0109] S11. Provide a substrate.

[0110] Among them, the substrate 10 may include a flexible substrate or a rigid substrate; the flexible substrate may include flexible organic film layers such as polyimide (PI) film, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, and ultra-thin glass film, so that the substrate 10 has special properties such as bendability and curliness. The rigid substrate may include a hard inorganic material layer such as glass, so that the substrate 10 has sufficient support ability.

[0111] Specifically, a raw substrate with a larger size can be provided, and then according to the set size of the display mother board, a cutting tool is used to divide the raw substrate with a larger size to obtain a plurality of substrates corresponding to the set size, so that when forming a metal layer and an insulating layer on one side of each cut substrate to form a display mother board later, there is no need to cut the raw substrate again, improving the manufacturing efficiency of the display mother board.

[0112] S12. Form a multi-layer metal layer and an insulating layer located between adjacent two metal layers on one side of the substrate.

[0113] Among them, refer to Figure 26 , the inorganic insulating layer I includes a connection via 130 located in the display area 13 and an opening 20 located at least in the encapsulation corner area; the connection via 131 and the opening 20 are formed in the same process.

[0114] Specifically, each insulating layer can be prepared by chemical vapor deposition and other processes, each metal layer and the insulating layer between two adjacent metal layers can be prepared by chemical vapor deposition sputtering or evaporation and other processes, and the insulating layer and the metal layer can be prepared alternately so that the insulating layer is located between two adjacent metal layers to prevent the signal crosstalk between the two adjacent metal layers, thereby improving the display reliability of the display panel. The connecting vias 130 located in the display area 13 are used to connect the metal layers M of different layers to achieve signal transmission. The connecting vias 130 include a first connecting via 131 close to the side of the base substrate 10 and a second connecting via 132 away from the side of the base substrate 10. At the same time as the connecting vias 130 are formed in the same insulating layer I, the insulating layer I overlapping with the first metal structure M10 can be removed to remove each insulating layer I single layer. Alternatively, after all inorganic insulating layers on the side of the first metal structure M10 facing away from the substrate substrate are prepared, all insulating layers I overlapping with the first metal structure M10 and located on the side of the first metal structure M10 facing away from the substrate substrate 10 can be removed while preparing the second connecting via 132. The specific preparation method of the opening 20 can be selected according to actual needs, and is not specifically limited here. The opening 20 and the connecting via 130 can be formed by dry etching or wet etching.

[0115] The technical solution provided by the present invention provides a base substrate, forms multiple metal layers on one side of the base substrate, and an insulating layer located between two adjacent metal layers, and adopts the same process to prepare connecting vias and openings, without adding additional steps for preparing the openings, thereby improving the preparation efficiency of the display motherboard.

[0116] Based on the same inventive concept, an embodiment of the present invention further provides a display device, which includes a display panel provided by any embodiment of the present invention. Therefore, the display device has the technical features of the display panel provided by the embodiment of the present invention, and can achieve the beneficial effects of the display panel provided by the embodiment of the present invention. The similarities can be referred to the above description of the display panel provided by the embodiment of the present invention, and will not be repeated here.

[0117] For example, Figure 27 A schematic diagram of a display device according to an embodiment of the present invention is shown in FIG. Figure 27 As shown, the display device 200 includes the display panel 100 provided in the embodiment of the present invention. The display device 200 provided in the embodiment of the present invention can be any electronic product with a display function, including but not limited to the following categories: mobile phones, televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc., and the embodiment of the present invention does not specifically limit this.

[0118] Note that the above is only the preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, re-adjustments, combinations with each other and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it may also include more other equivalent embodiments, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display motherboard, characterized in that, Comprising: A substrate, a multi-layer metal layer on one side of the substrate, and an insulating layer between adjacent two metal layers; The insulating layer includes at least one inorganic insulating layer; The display mother board further includes at least one display panel setting area and a cutting area surrounding the display panel setting area; the display panel setting area includes a display area and a non-display area surrounding the display area; the non-display area includes a packaging area and a non-packaging area surrounding the packaging area; the packaging area includes a plurality of packaging corner areas and a plurality of packaging straight areas, and the packaging corner areas are located between adjacent two packaging straight areas; The metal layer closest to the substrate side among the metal layers is the first metal layer; the first metal layer includes a first metal structure located in the packaging area; The display mother board further includes at least one opening; the opening includes a first opening at least located in the packaging corner area; the opening penetrates the inorganic insulating layer, and in the thickness direction of the display mother board, the first metal structure overlaps with the first opening.

2. The display motherboard according to claim 1, characterized in that, The opening further includes a second opening located in at least part of the packaging straight area.

3. The display motherboard according to claim 2, wherein A plurality of the packaging straight areas include a first packaging straight area on one side of the display area; a plurality of first bonding pads are arranged in the first packaging straight area; The second opening is not arranged in the first packaging straight area.

4. The display motherboard according to claim 2, wherein The first opening and the second opening are connected to form at least part of an annular or semi-annular opening surrounding the display area.

5. The display motherboard according to claim 1, characterized in that, The opening includes a plurality of first sub-openings arranged in a first direction, and any two of the first sub-openings are not connected; the first direction is parallel to the direction from the display area to the non-display area.

6. The display motherboard according to claim 1, wherein The non-packaging area includes a third opening at least penetrating each of the inorganic insulating layers.

7. The display motherboard according to claim 6, characterized in that, The non-packaging area includes a first non-packaging area on one side of the display area; at least one second bonding pad is arranged in the first non-packaging area; The third opening is not arranged in the first non-packaging area.

8. The display motherboard according to claim 6, characterized in that, Further comprising: A first insulating layer between the first metal layer and the substrate; The material of the first insulating layer is an inorganic material; The third opening also penetrates the first insulating layer.

9. The display mother board according to claim 6, wherein, The third opening includes a plurality of third sub-openings arranged in a second direction, and any two of the third sub-openings are not connected; the second direction is parallel to the direction from the packaging area to the non-packaging area.

10. The display motherboard according to claim 6, characterized in that, Further comprising: A bending protection layer; The bending protection layer is located on the side of each insulating layer in the non-packaging area away from the substrate, and the bending protection layer fills the third opening.

11. The display mother board according to claim 10, wherein Further comprising: A first protection layer on the side of the bending protection layer away from the substrate; The first protection layer includes a first protection structure, and the insulating layer includes an insulating structure located between the third openings; in the thickness direction of the display mother board, the first protection structure overlaps with the insulating structure.

12. The display mother board according to claim 1, wherein, Further comprising: A packaging layer; The packaging layer covers the display area and the packaging area.

13. The display motherboard according to claim 1, characterized in that, The multi-layer metal layer further includes a second metal layer on the side of the first metal layer away from the substrate; The second metal layer includes a first signal line; the first signal line is at least located in the encapsulation region, and the first signal line is in contact with the first metal structure.

14. A display panel, characterized in that, Comprising: A display region and a non-display region surrounding the display region; The non-display region includes an encapsulation region and a non-encapsulation region surrounding the encapsulation region; the encapsulation region includes a plurality of encapsulation corner regions and a plurality of encapsulation straight regions, and the encapsulation corner regions are located between two adjacent encapsulation straight regions; The display panel further includes a substrate, a multi-layer metal layer on one side of the substrate, and an insulating layer between two adjacent metal layers; the insulating layer includes at least one inorganic insulating layer; the metal layer closest to the substrate side is the first metal layer; the first metal layer includes a first metal structure located in the encapsulation region. The display panel further includes at least one opening; the opening includes a first opening at least located in the encapsulation corner region; the opening penetrates the inorganic insulating layer, and in the thickness direction of the display panel, the first metal structure overlaps with the first opening.

15. A method for manufacturing a display panel, characterized in that, Comprising: Providing a display mother board; The display mother board is the display mother board according to any one of claims 1-13; Cutting the display mother board along the cutting region to obtain the display panel.

16. The method for manufacturing a display panel according to claim 15, wherein Providing a display mother board, comprising: Providing a substrate; Forming a multi-layer metal layer on one side of the substrate and an insulating layer between two adjacent metal layers; Wherein, the inorganic insulating layer includes connection vias located in the display region and openings at least located in the encapsulation corner regions; the connection vias and the openings are formed in the same process.

17. A display device, characterized in that, Comprising: The display panel according to claim 14.

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