Display device, display substrate and manufacturing method thereof

Abstract

The invention discloses a display device, a display substrate and a manufacturing method of the display substrate. The display substrate comprises a plurality of connecting lines, an organic insulating layer and an inorganic insulating layer. And the connecting wires are metal wires. The organic insulating layer is arranged among the plurality of connecting lines. The inorganic insulating layer is arranged between the organic insulating layer and the connecting line. The inorganic insulating layer at least isolates part of the organic insulating layer and the connecting line. According to the invention, the inorganic insulating layer is arranged and at least isolates part of the organic insulating layer from the connecting line, so that the corrosion of the organic insulating layer to the connecting line due to water absorption is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and in particular, to a display device, a display substrate, and a manufacturing method thereof. Background Art

[0002] With the iteration of display product forms from straight - panel → foldable → rollable - slidable, higher requirements are put forward for the bend - resistance performance of display products. Therefore, more and more organic layers are applied to display products to improve their bend - resistance performance.

[0003] However, organic layers are extremely prone to water absorption and severely corrode metal traces (especially after power - on), easily forming metal residues in areas where metal traces are dense, causing short - circuits between traces and thus resulting in the failure of the functions of display products. Summary of the Invention

[0004] The purpose of this application is to provide a display device, a display substrate, and a manufacturing method thereof that can effectively prevent metal traces from being corroded.

[0005] This application discloses a display substrate, which includes:

[0006] Multiple connection lines, and the connection lines are metal traces;

[0007] An organic insulating layer, which is disposed between multiple connection lines;

[0008] An inorganic insulating layer, which is disposed between the organic insulating layer and the connection lines, and the inorganic insulating layer isolates at least part of the organic insulating layer from the connection lines.

[0009] In an optional embodiment, the display substrate further includes:

[0010] A base layer, including a first surface;

[0011] A first metal layer, which is disposed on one side of the base layer having the first surface, and part of the connection lines are disposed on the first metal layer;

[0012] The organic insulating layer includes a first organic insulating layer, which is disposed on the side of the first metal layer away from the base layer and between the connection lines located on the first metal layer;

[0013] The inorganic insulating layer isolates the connection lines from the first organic insulating layer in a first direction; the first direction is a direction parallel to the first surface.

[0014] In an optional embodiment, the inorganic insulating layer also isolates the connection lines from the first organic insulating layer in a second direction; the second direction is a direction perpendicular to the first surface.

[0015] In an alternative embodiment, the display substrate further comprises:

[0016] A second metal layer disposed on a side of the first organic insulating layer away from the first metal layer, and a part of the connection lines are disposed on the second metal layer;

[0017] The organic insulating layer further comprises a second organic insulating layer, which is disposed on a side of the second metal layer away from the first organic insulating layer and between the connection lines located on the second metal layer;

[0018] The inorganic insulating layer insulates the connection lines from the second organic insulating layer in a first direction.

[0019] In an alternative embodiment, the inorganic insulating layer further insulates the connection lines from the second organic insulating layer in a second direction; the second direction is a direction perpendicular to the first surface.

[0020] In an alternative embodiment, the display substrate further comprises a base layer, a first metal layer and a second metal layer; the organic insulating layer comprises a first organic insulating layer and a second organic insulating layer;

[0021] The first metal layer is disposed on one side of the base layer, and a part of the connection lines are disposed on the first metal layer;

[0022] The first organic insulating layer is disposed on a side of the first metal layer away from the base layer and between the connection lines located on the first metal layer;

[0023] The second metal layer is disposed on a side of the first organic insulating layer away from the first metal layer, and a part of the connection lines are disposed on the second metal layer;

[0024] The second organic insulating layer is disposed on a side of the second metal layer away from the first organic insulating layer and between the connection lines located on the second metal layer;

[0025] The inorganic insulating layer insulates the connection lines located on the second metal layer from the second organic insulating layer in the first direction and / or the second direction.

[0026] In an alternative embodiment, the connection lines comprise a first titanium metal layer, a second titanium metal layer and an aluminum metal layer located between the first titanium metal layer and the second titanium metal layer; the inorganic insulating layer at least insulates the organic insulating layer from the aluminum metal layer.

[0027] In an alternative embodiment, the width of the connection line in the first direction is greater than or equal to 2 microns and less than or equal to 6 microns; the sum of the width of the connection line and the width of the inorganic insulating layer in the first direction is greater than or equal to 3 microns and less than or equal to 7 microns.

[0028] In an alternative embodiment, the thickness of the connection line in the second direction is greater than or equal to 0.25 microns and less than or equal to 0.4 microns; the sum of the thickness of the connection line and the thickness of the inorganic insulating layer in the second direction is greater than or equal to 0.5 microns and less than or equal to 0.8 microns.

[0029] In an alternative embodiment, the connection line is a touch electrode trace; the display substrate further includes a touch area and a border area disposed on at least one side of the touch area, and the touch area includes a plurality of touch electrodes.

[0030] The border area includes:

[0031] A plurality of the touch electrode traces, and the plurality of touch electrode traces are connected to the plurality of touch electrodes.

[0032] In an alternative embodiment, the border area further includes a touch chip, and the touch electrode trace is connected to the touch chip; at the connection between the touch electrode trace and the touch chip, the side of the inorganic insulating layer close to the base layer extends away from the touch electrode trace.

[0033] The present application also discloses a manufacturing method of a display substrate, which includes:

[0034] Providing a base layer;

[0035] Depositing a first metal layer on one side of the base layer;

[0036] Etching the first metal layer to form a plurality of connection lines;

[0037] Depositing an inorganic insulating layer on the side of the first metal layer away from the base layer;

[0038] Etching the inorganic insulating layer to remove the part of the inorganic insulating layer that has no contact with the connection line;

[0039] Depositing an organic insulating layer on the side of the inorganic insulating layer away from the base layer.

[0040] The present application also discloses a display device, and the display device includes the above-mentioned display substrate.

[0041] Compared with the related art, by providing an inorganic insulating layer, the inorganic insulating layer isolates at least part of the organic insulating layer from the connection line, effectively reducing the corrosion of the connection line caused by water absorption of the organic insulating layer.

[0042] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with this specification, and are used together with the specification to explain the principles of this specification.

[0044] Figure 1 Schematic diagram of the film layer structure of the display substrate of the present application in an embodiment.

[0045] Figure 2 Schematic diagram of the film layer structure of the display substrate of the present application in an embodiment.

[0046] Figure 3 Schematic diagram of the film layer structure of the display substrate of the present application in an embodiment.

[0047] Figure 4 In an embodiment Figure 1 Schematic diagram of a partial film layer structure of the display substrate therein.

[0048] Figure 5 Schematic diagram of the planar structure of the display substrate of the present application in an embodiment.

[0049] Figure 6 Schematic diagram of the manufacturing process of the display substrate of the present application in an embodiment.

[0050] Figure 7 Schematic diagram of the manufacturing process of the display substrate of the present application in an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0051] Herein, the technical solutions in the embodiments (or "embodiment modes") of the present application will be clearly and completely described in conjunction with the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements.

[0052] If there are terms related to directional indications or positional relationships in the embodiments of the present application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, lateral, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), then such terms are only used to explain the relative positional relationships and movement conditions between components in a specific posture (as shown in the drawings); if this specific posture changes, then the directional indication or positional relationship also changes accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present application are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance.

[0053] Such asFigure 1 As shown in the figure, the present application provides a display substrate, which includes a plurality of connection lines 200, an organic insulating layer, and an inorganic insulating layer. Among them, the plurality of connection lines 200 are all metal traces.

[0054] The organic insulating layer is disposed between the plurality of connection lines 200. The inorganic insulating layer is disposed between the organic insulating layer and the connection lines 200, and the inorganic insulating layer isolates at least a part of the organic insulating layer from the connection lines 200.

[0055] By providing the inorganic insulating layer, the inorganic insulating layer isolates at least a part of the organic insulating layer from the connection lines, effectively reducing the corrosion of the connection lines caused by water absorption of the organic insulating layer.

[0056] The following will detail each embodiment of the present application that conforms to the above creative concept.

[0057] As Figure 1 shown, in an optional embodiment, the display substrate of the present application includes a base layer 10, a first metal layer 20, an organic insulating layer, and an inorganic insulating layer.

[0058] The base layer 10 can be made of an organic material, which can be materials such as PI (Polyimide), PC (Polycarbonate), or photocurable flexible resin. The base layer 10 includes a first surface, and the first metal layer 20 is disposed on the side of the base layer 10 having the first surface. Please refer to Figure 4 , Figure 4 which is a schematic diagram of the hierarchical structure of the first metal layer 20 and the first inorganic insulating layer 21 in an embodiment. The first metal layer 20 can include a first titanium metal layer 22, an aluminum metal layer 23, and a second titanium metal layer 24 from the direction close to the base layer 10 to the direction away from the base layer 10. Among them, the thickness of the aluminum metal layer 23 is greater than the thicknesses of the first titanium metal layer 22 and the second titanium metal layer 24. In other optional embodiments, the first titanium metal layer 22 and the second titanium metal layer 24 can be selectively replaced with a nickel metal layer, etc., and the aluminum metal layer can be selectively replaced with a gold metal layer, a silver metal layer, or a copper metal layer, etc. Part of the connection lines 200 are disposed on the first metal layer 20, and the connection lines 200 have the same structure as the first metal layer 20. In this embodiment, the connection lines 200 including the first titanium metal layer 22, the second titanium metal layer 24, and the aluminum metal layer 23 located between the first titanium metal layer 22 and the second titanium metal layer 24 are taken as an example for illustration.

[0059] In this embodiment, the organic insulating layer can be made of materials such as PI, PC, or photocurable flexible resin. The material of the organic insulating layer can be the same as that of the base layer 10 or different from that of the base layer 10. The organic insulating layer includes a first organic insulating layer 30. The first organic insulating layer 30 is disposed on the side of the first metal layer 20 away from the base layer 10, and the first organic insulating layer 30 is also disposed between the connection lines 200 located on the first metal layer 20. That is, the first organic insulating layer 30 insulates a plurality of connection lines 200 in the first direction F1 and covers the side of the connection lines 200 away from the base layer 10. The first direction F1 is parallel to the first surface of the base layer 10.

[0060] In this embodiment, the material of the inorganic insulating layer can be silicon nitride, silicon oxide, silicon oxynitride, etc. The inorganic insulating layer includes a first inorganic insulating layer 21. The first inorganic insulating layer 21 insulates the aluminum metal layer 23 and the first organic insulating layer 30 in the first direction F1. That is, the first inorganic insulating layer 21 covers the side portions of the connection lines 200 to isolate the aluminum exposed areas on the side portions of the connection lines 200 from the first organic insulating layer 30. In this way, the first organic insulating layer 30 cannot corrode the aluminum exposed areas on the side portions of the connection lines 200 due to water absorption.

[0061] Optionally, the first inorganic insulating layer 21 can also insulate the connection lines 200 and the first organic insulating layer 30 in the first direction F1. That is, the first inorganic insulating layer 21 covers the side portions of the connection lines 200 to isolate the aluminum exposed areas and titanium exposed areas on the side portions of the connection lines 200 from the first organic insulating layer 30. At this time, the width of the connection lines 200 in the first direction F1 is greater than or equal to 2 microns and less than or equal to 6 microns, and can be, for example, 2, 2.5, 3, 4, or 5 microns, etc. The sum of the width of the connection lines 200 and the first inorganic insulating layer 21 in the first direction F1 is greater than or equal to 3 microns and less than or equal to 7 microns, and can be, for example, 3, 3.5, 4, 5, 6.5 microns, etc.

[0062] Optionally, the first inorganic insulating layer 21 also insulates the connection lines 200 and the first organic insulating layer 30 in the second direction F2 at the same time. The second direction F2 is perpendicular to the first surface of the base layer 10. That is, the first inorganic insulating layer 21 covers the top of the connection lines 200 to isolate the titanium exposed areas on the top of the connection lines 200 from the first organic insulating layer 30. In this way, the first organic insulating layer 30 cannot corrode the titanium exposed areas on the top of the connection lines 200 due to water absorption. At this time, the thickness of the connection lines 200 in the second direction F2 is greater than or equal to 0.25 microns and less than or equal to 0.4 microns, and can be, for example, 0.25, 0.28, 0.3, 0.36, or 0.39 microns, etc. The sum of the thickness of the connection lines 200 and the first inorganic insulating layer 21 in the second direction F2 is greater than or equal to 0.5 microns and less than or equal to 0.8 microns, and can be, for example, 0.5, 0.55, 0.67, 0.77, or 0.79 microns, etc.

[0063] As Figure 2 and Figure 4 shown, in an alternative embodiment, the display substrate further includes a second metal layer 40, the organic insulating layer further includes a second organic insulating layer 50, and the inorganic insulating layer further includes a second inorganic insulating layer 41. Among them, the second metal layer 40 is disposed on a side of the first organic insulating layer 30 away from the first metal layer 20. The material structure of the second metal layer 40 may be the same as or different from that of the first metal layer 20. Refer Figure 4 ring to, the second metal layer 40 may also include a first titanium metal layer 22, an aluminum metal layer 23, and a second titanium metal layer 24 in a direction from near the base layer 10 to away from the base layer 10. Among them, the thickness of the aluminum metal layer 23 is greater than the thicknesses of the first titanium metal layer 22 and the second titanium metal layer 24. In other alternative embodiments, the first titanium metal layer 22 and the second titanium metal layer 24 may be selectively replaced with a nickel metal layer, etc., and the aluminum metal layer may be selectively replaced with a gold metal layer, a silver metal layer, or a copper metal layer, etc. Part of the connection line 200 is disposed on the second metal layer 40, and the connection line 200 has the same structure as the second metal layer 40. In this embodiment, the connection line 200 includes a first titanium metal layer 22, a second titanium metal layer 24, and an aluminum metal layer 23 located between the first titanium metal layer 22 and the second titanium metal layer 24 as an example for illustration.

[0064] The second organic insulating layer 50 is disposed on a side of the second metal layer 40 away from the first organic insulating layer 30, and the second organic insulating layer 50 is simultaneously disposed between the connection lines 200 located on the second metal layer 40. That is, the second organic insulating layer 50 insulates a plurality of connection lines 200 located on the second metal layer 40 in the first direction F1, and covers a side of the connection lines 200 away from the base layer 10.

[0065] In this embodiment, the second inorganic insulating layer 41 can insulate the aluminum metal layer 23 and the second organic insulating layer 50 in the first direction F1. That is, the second inorganic insulating layer 41 covers the side portions of the connection line 200 to isolate the aluminum exposed area on the side of the connection line 200 from the second organic insulating layer 50. Thus, the second organic insulating layer 50 cannot corrode the aluminum exposed area on the side of the connection line 200 due to water absorption.

[0066] Optionally, the second inorganic insulating layer 41 may insulate the connection line 200 from the second organic insulating layer 50 in the first direction F1. That is, the second inorganic insulating layer 41 covers the side portion of the connection line 200, so that the aluminum exposed area and the titanium exposed area on the side portion of the connection line 200 are isolated from the second organic insulating layer 50. At this time, the width of the connection line 200 in the first direction F1 is greater than or equal to 2 μm and less than or equal to 6 μm, for example, it may be 2, 2.5, 3, 4, or 5 μm, etc. The sum of the width of the connection line 200 and the width of the second inorganic insulating layer 41 in the first direction F1 is greater than or equal to 3 μm and less than or equal to 7 μm, for example, it may be 3, 3.5, 4, 5, 6.5 μm, etc.

[0067] Optionally, the second inorganic insulating layer 41 also insulates the connection line 200 from the second organic insulating layer 50 in the second direction F2 at the same time. That is, the second inorganic insulating layer 41 covers the top of the connection line 200, so that the titanium exposed area on the top of the connection line 200 is isolated from the second organic insulating layer 50. In this way, the second organic insulating layer 50 cannot corrode the titanium exposed area on the top of the connection line 200 due to water absorption. At this time, the thickness of the connection line 200 in the second direction F2 is greater than or equal to 0.25 μm and less than or equal to 0.4 μm, for example, it may be 0.25, 0.28, 0.3, 0.36, or 0.39 μm, etc. The sum of the thickness of the connection line 200 and the thickness of the second inorganic insulating layer 41 in the second direction F2 is greater than or equal to 0.5 μm and less than or equal to 0.8 μm, for example, it may be 0.5, 0.55, 0.67, 0.77, or 0.79 μm, etc.

[0068] As Figure 3 shown, in an optional embodiment, the display substrate further includes a base layer 10, a first metal layer 20, and a second metal layer 40; the organic insulating layer includes a first organic insulating layer 30 and a second organic insulating layer 50. Among them, the first metal layer 20 is disposed on one side of the base layer 10, and part of the connection lines 200 are disposed on the first metal layer 20. The first organic insulating layer 30 is disposed on the side of the first metal layer 20 away from the base layer 10, and between the connection lines 200 located on the first metal layer 20. The second metal layer 40 is disposed on the side of the first organic insulating layer 30 away from the first metal layer 20, and part of the connection lines 200 are disposed on the second metal layer 40. The second organic insulating layer 50 is disposed on the side of the second metal layer 40 away from the first organic insulating layer 30, and between the connection lines 200 located on the second metal layer 40. The inorganic insulating layer includes a second inorganic insulating layer 41, and the second inorganic insulating layer 41 insulates the connection lines 200 located on the second metal layer 40 from the second organic insulating layer 50 in the first direction F1 and / or the second direction F2.

[0069] As Figure 2 、 Figure 4 and Figure 5As shown, in an optional embodiment, the display substrate is a touch display substrate, the connection line 200 is a touch electrode trace, the base layer 10 is disposed on the upper side of the encapsulation layer of the light-emitting substrate in the display substrate, and the first metal layer 20 and the second metal layer 40 respectively correspond to the TMA (Touch Metal A, the first metal layer of the touch film layer) and the TMB (Touch Metal B, the second metal layer of the touch film layer) layers of the display substrate.

[0070] The display substrate further includes a touch area 1000 and a border area 2000 disposed on at least one side of the touch area 1000. The touch area 1000 is generally provided with a plurality of first touch electrodes 110 and a plurality of second touch electrodes 120. The first touch electrodes 110 generally extend along the fourth direction F4, and the plurality of first touch electrodes 110 are arranged along the third direction F3. The second touch electrodes 120 generally extend along the third direction F3, and the plurality of second touch electrodes 120 are arranged along the fourth direction F4. Among them, the third direction F3 intersects with the fourth direction F4. Specifically, the third direction F3 may be the length direction of the display panel, and the fourth direction F4 may be the width direction of the display panel. Of course, the third direction F3 may also be a direction deviated by a certain degree from the length direction of the display panel, and the fourth direction F4 may be a direction deviated by a certain degree from the width direction of the display panel. In some foldable screen display devices, the third direction F3 may also be the width direction of the display panel, and the fourth direction F4 may also be the length direction of the display panel, etc.

[0071] The first touch electrode 110 may be disposed on one of the first metal layer 20 and the second metal layer 40, and the second touch electrode 120 may also be disposed on one of the first metal layer 20 and the second metal layer 40. At the position where the first touch electrode 110 and the second touch electrode 120 intersect, the first touch electrode 110 and the second touch electrode 120 are located in different film layers to form a touch capacitance. For example, the main bodies of the first touch electrode 110 and the second touch electrode 120 may both be disposed on the second metal layer 40, and at the intersection position, the first touch electrode 110 may be wire-wound to the first metal layer 20 to form a touch capacitance.

[0072] The border area 2000 is provided with touch electrode traces and a touch chip 300. A plurality of touch electrode traces are connected to a plurality of touch electrodes 100. The plurality of touch electrode traces may include a plurality of first touch electrode traces 210 connecting the first touch electrodes 110 and the touch chip 300, and a plurality of second touch electrode traces 220 connecting the second touch electrodes 120 and the touch chip 300.

[0073] Some of the first touch electrode traces 210 are disposed on the first metal layer 20, and the other part is disposed on the second metal layer 40. The first touch electrode traces 210 disposed on the first metal layer 20 and the first touch electrode traces 210 disposed on the second metal layer 40 are at least partially overlapped in the second direction F2. Some of the second touch electrode traces 220 are disposed on the first metal layer 20, and the other part is disposed on the second metal layer 40. The second touch electrode traces 220 disposed on the first metal layer 20 and the second touch electrode traces 220 disposed on the second metal layer 40 are at least partially overlapped in the second direction F2 of the display panel.

[0074] At the connection of the touch electrode trace and the touch chip 300, for example Figure 5 in area A, since both the first touch electrode trace 210 and the second touch electrode trace 220 are connected to the touch chip 300 in this area, the touch electrode trace density in this area will be relatively large. Optionally, on the side of the inorganic insulating layer close to the base layer 10 in this area, it extends away from the touch electrode trace. Specifically, as Figure 4 shown, on the side of the first inorganic insulating layer 21 and the second insulating layer 41 close to the base layer 10, they both extend away from the touch electrode trace. In this way, it can better prevent the organic insulating layer from corroding the touch electrode trace due to water absorption. Optionally, the extension length of this extended part is greater than or equal to 0.3 microns and less than or equal to 0.7 microns. For example, the extension length can be 0.3, 0.4, 0.45, 0.5 or 0.7 microns, etc.

[0075] As Figure 6 shown, the present application also discloses a manufacturing method of a display substrate, which includes:

[0076] Providing a base layer 10;

[0077] Depositing a first metal layer 20 on one side of the base layer 10;

[0078] Etching the first metal layer 20 to form a plurality of connection lines 200;

[0079] Depositing an inorganic insulating layer on the side of the first metal layer 20 away from the base layer 10. The side of the first metal layer 20 away from the base layer 10 includes the surface of the base layer 10 exposed due to etching of the first metal layer 20;

[0080] Etching the inorganic insulating layer to remove the part of the inorganic insulating layer that has no contact with the connection lines 200;

[0081] Depositing an organic insulating layer on the side of the inorganic insulating layer away from the base layer 10.

[0082] Among them, the etching of the first metal layer 20 and the inorganic insulating layer is dry etching. Chlorine can be used as the etching gas for etching the first metal layer 20. Its reaction rate is controlled by surface chemical reactions, and the lateral etching rate is approximately equal to the longitudinal etching rate. In this way, an isotropic chemical etching effect can be obtained. SF6 (sulfur hexafluoride) or CFx series (such as CF4, C2F6) can be used as the etching gas for etching the inorganic insulating layer. Taking SF6 as an example, it dissociates more F free radicals, has a faster reaction rate, and the manufacturing process is relatively clean. In this application, dry etching is performed twice. Among them, the first dry etching is used to etch the first metal layer 20. In some cases, the first metal layer 20 that needs to be removed cannot be completely removed by this etching, resulting in metal residues in multiple connection lines 200, making the display substrate prone to problems such as short circuits. The second dry etching is used to etch the inorganic insulating layer located on the upper side of the first metal layer 20. When etching the inorganic insulating layer, the remaining part of the first metal layer 20 will also be etched away. In this way, the metal residues between multiple connection lines 200 can be effectively removed, preventing problems such as short circuits in the display panel.

[0083] As Figure 7 shown, in some alternative embodiments, the inorganic insulating layer deposited on the side of the first metal layer 20 away from the base layer 10 is the first inorganic insulating layer 21. The organic insulating layer deposited on the side of the first inorganic insulating layer 21 away from the base layer 10 is the first organic insulating layer 30.

[0084] The method further includes:

[0085] Depositing a second metal layer 40 on the side of the first organic insulating layer 30 away from the base layer 10;

[0086] Etching the second metal layer 40 to form multiple connection lines 200;

[0087] Depositing a second inorganic insulating layer 41 on the side of the second metal layer 40 away from the base layer 10. The side of the second metal layer 40 away from the base layer 10 includes the surface of the first organic insulating layer 30 exposed due to etching of the second metal layer 40;

[0088] Etching the second inorganic insulating layer 41 to remove the part of the second inorganic insulating layer 41 that has no contact with the connection lines 200;

[0089] Depositing a second organic insulating layer 50 on the side of the second inorganic insulating layer 41 away from the base layer 10.

[0090] Among them, the etching of the second metal layer 40 and the second inorganic insulating layer 41 is dry etching, and the process is the same as that of the Figure 6 embodiment shown, and will not be elaborated here.

[0091] To solve the above technical problems, the present application further provides a display device, and the display device includes the above-mentioned display substrate.

[0092] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of the present application is not limited to the precise structures described in the above embodiments and shown in the drawings; all modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A display substrate, characterized in that, The display substrate includes: Multiple connection lines, and the connection lines are metal traces; An organic insulating layer, and the organic insulating layer is disposed between multiple ones of the connection lines; An inorganic insulating layer, and the inorganic insulating layer is disposed between the organic insulating layer and the connection lines, and the inorganic insulating layer at least isolates part of the organic insulating layer from the connection lines.

2. The display substrate according to claim 1, wherein The display substrate further includes: A base layer, including a first surface; A first metal layer, disposed on one side of the base layer having the first surface, and part of the connection lines are disposed on the first metal layer; The organic insulating layer includes a first organic insulating layer, and the first organic insulating layer is disposed on a side of the first metal layer away from the base layer, and between the connection lines located on the first metal layer; The inorganic insulating layer isolates the connection lines from the first organic insulating layer in a first direction; the first direction is a direction parallel to the first surface.

3. The display substrate according to claim 2, wherein The inorganic insulating layer also isolates the connection lines from the first organic insulating layer in a second direction; the second direction is a direction perpendicular to the first surface.

4. The display substrate according to claim 2, wherein The display substrate further includes: A second metal layer, disposed on a side of the first organic insulating layer away from the first metal layer, and part of the connection lines are disposed on the second metal layer; The organic insulating layer further includes a second organic insulating layer, and the second organic insulating layer is disposed on a side of the second metal layer away from the first organic insulating layer, and between the connection lines located on the second metal layer; The inorganic insulating layer isolates the connection lines from the second organic insulating layer in the first direction.

5. The display substrate according to claim 4, wherein The inorganic insulating layer also isolates the connection lines from the second organic insulating layer in a second direction; the second direction is a direction perpendicular to the first surface.

6. The display substrate according to claim 1, wherein The display substrate further includes a base layer, a first metal layer, and a second metal layer; the organic insulating layer includes a first organic insulating layer and a second organic insulating layer; The first metal layer is disposed on one side of the base layer, and part of the connection lines are disposed on the first metal layer; The first organic insulating layer is disposed on a side of the first metal layer away from the base layer, and between the connection lines located on the first metal layer; The second metal layer is disposed on a side of the first organic insulating layer away from the first metal layer, and part of the connection lines are disposed on the second metal layer; The second organic insulating layer is disposed on a side of the second metal layer away from the first organic insulating layer, and between the connection lines located on the second metal layer; The inorganic insulating layer isolates the connection lines located on the second metal layer from the second organic insulating layer in the first direction and / or the second direction.

7. The display substrate according to claim 1, wherein The connection lines include a first titanium metal layer, a second titanium metal layer, and an aluminum metal layer located between the first titanium metal layer and the second titanium metal layer; the inorganic insulating layer at least isolates the organic insulating layer from the aluminum metal layer.

8. The display substrate according to claim 2, wherein The width of the connection line in the first direction is greater than or equal to 2 microns and less than or equal to 6 microns; the sum of the width of the connection line and the width of the inorganic insulating layer in the first direction is greater than or equal to 3 microns and less than or equal to 7 microns.

9. The display substrate according to claim 3, wherein The thickness of the connection line in the second direction is greater than or equal to 0.25 microns and less than or equal to 0.4 microns; the sum of the thickness of the connection line and the thickness of the inorganic insulating layer in the second direction is greater than or equal to 0.5 microns and less than or equal to 0.8 microns.

10. The display substrate according to any one of claims 1-5, characterized in that, The connection line is a touch electrode trace; the display substrate further includes a touch area and a border area disposed on at least one side of the touch area, and the touch area includes a plurality of touch electrodes; The border area includes: A plurality of the touch electrode traces, and the plurality of touch electrode traces are connected to the plurality of touch electrodes.

11. The display substrate according to claim 10, wherein The border area further includes a touch chip, and the touch electrode trace is connected to the touch chip; at the connection of the touch electrode trace and the touch chip, the side of the inorganic insulating layer close to the base layer extends away from the touch electrode trace.

12. A manufacturing method of a display substrate, characterized in that, Comprising: Providing a base layer; Depositing a first metal layer on one side of the base layer; Etching the first metal layer to form a plurality of connection lines; Depositing an inorganic insulating layer on the side of the first metal layer away from the base layer; Etching the inorganic insulating layer to remove the part of the inorganic insulating layer that has no contact with the connection line; Depositing an organic insulating layer on the side of the inorganic insulating layer away from the base layer.

13. A display device, characterized in that, The display device includes the display substrate according to any one of claims 1-11.

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