Display device and method for manufacturing the same

Abstract

A display apparatus and a method for manufacturing the same are provided. The display device includes: a second substrate including a soft material; a light emitting element over the second substrate; and a first substrate under the second substrate, including a hard material, and further including a second sub-substrate on one side of a bending region in which the second substrate is bent, and a first sub-substrate on the other side of the bending region, under the light emitting element, and a first substrate having a length of about 50 to about 200 times the length of the second sub-substrate, and the first substrate including a first surface opposite the first surface, a second surface opposite the first surface, a first side surface between the first surface and the second surface and adjacent the curved region, and a first sloped surface between the first surface and the second surface, the first inclined surface is between the first surface and the first side surface.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0003309, filed with the Korean Intellectual Property Office on January 9, 2024, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background art

[0004] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. The display device may be a flat panel display such as a liquid crystal display, a field emission display, or a light - emitting display panel.

[0005] The display device includes a display area for displaying an image and a non - display area (e.g., in a plan view) located around (e.g., surrounding) the display area. Recently, in order to increase the sense of immersion in the display area and enhance the aesthetic appearance of the display device, the width of the non - display area has been gradually reduced.

[0006] Meanwhile, in the process of manufacturing a display device, the display device may be formed by cutting a mother substrate including a plurality of display units along a plurality of cutting lines formed on the mother substrate. Summary of the invention

[0007] Aspects of the present disclosure provide a display device having a reduced or minimized dead space and a method of manufacturing the display device.

[0008] However, aspects of the present disclosure are not limited to those set forth herein. The above and other aspects of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the following detailed description of the present disclosure.

[0009] According to an aspect of the present disclosure, there is provided a display device including: a second substrate including a soft material; a light - emitting element above the second substrate; and a first substrate below the second substrate, including a hard material and including a second sub - substrate and a first sub - substrate, wherein the second sub - substrate is on one side of a bending region where the second substrate is bent, and the first sub - substrate is on the other side of the bending region, below the light - emitting element, having a length that is about 50 times to about 200 times the length of the second sub - substrate, and the first substrate includes a first surface, a second surface, a first side surface, and a first inclined surface, wherein the second surface is opposite to the first surface, the first side surface is between the first surface and the second surface and adjacent to the bending region, and the first inclined surface is between the first surface and the first side surface.

[0010] The length of the second sub-substrate can be from about 2 mm to about 4 mm.

[0011] The length of the first sub-substrate can be from about 200 mm to about 400 mm.

[0012] The first substrate can define an opening between the first sub-substrate and the second sub-substrate, wherein the length of the upper side of the opening is less than the length of the lower side of the opening.

[0013] The length of the second sub-substrate can be about 1 to about 4 times the length of the upper side of the opening.

[0014] The length of the upper side of the opening can be from about 1.2 mm to about 1.8 mm.

[0015] The length of the second sub-substrate can be about 1 to about 2.5 times the length of the lower side of the opening.

[0016] The length of the lower side of the opening can be from about 1.6 mm to about 2.0 mm.

[0017] The angle between the first side surface and the second surface can be less than about 60 degrees.

[0018] The angle formed by the first inclined surface and the first surface can be less than about 15 degrees.

[0019] The length of the first inclined surface in the extending direction parallel to the first substrate can be about 120 μm or less.

[0020] The first substrate can further include: a second side surface, between the first surface and the second surface and adjacent to the edge of the first substrate; and a second inclined surface, between the second side surface and the second surface.

[0021] The angle formed by the second inclined surface and the second surface can be different from the supplementary angle of the angle formed by the first side surface and the second surface.

[0022] The first substrate can include glass, wherein the second substrate includes a polymer resin.

[0023] According to an aspect of the present disclosure, there is provided a method for manufacturing a display device, the method including: forming a first mother substrate, a second mother substrate above the first surface of the first mother substrate, and a display unit on the second mother substrate; removing a portion of the first mother substrate in a bending region by spraying an etchant onto a second surface of the first mother substrate opposite to the first surface; irradiating a laser along the edge of the display unit on the second surface; forming a first substrate by spraying an etchant on the second surface without a mask and by cutting the first mother substrate; and forming a second substrate by patterning the second mother substrate along the edge of the display unit after forming the first substrate.

[0024] The first substrate may include: a third surface; a fourth surface opposite to the third surface; a first side surface between the third surface and the fourth surface and adjacent to the bending region; and a first inclined surface between the third surface and the first side surface and adjacent to the bending region.

[0025] The first substrate may further include: a second side surface between the third surface and the fourth surface and adjacent to the edge of the display unit; and a second inclined surface between the second side surface and the fourth surface and adjacent to the edge of the display unit, wherein the supplementary angle of the angle formed by the first side surface and the fourth surface is different from the angle formed by the second inclined surface and the fourth surface.

[0026] Forming the first substrate may include forming a dummy portion under the second mother substrate, and the dummy portion forms the remaining portion between the display units of the first mother substrate.

[0027] Forming the second substrate may include removing the second mother substrate above the dummy portion by patterning the second mother substrate.

[0028] The method may further include attaching a circuit board and an adsorption pad to each of the display units, and bending the second substrate, wherein the adsorption pad is attached to the circuit board.

[0029] A display device and a method for manufacturing the display device according to one or more embodiments of the present disclosure may reduce or minimize dead space.

[0030] However, the aspects of the embodiments are not limited to one aspect set forth herein. By referring to the claims, the above and other aspects of the embodiments will become more apparent to those of ordinary skill in the art to which the embodiments pertain. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other aspects of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, wherein:

[0032] Figure 1 is a perspective view showing a display device according to one or more embodiments;

[0033] Figure 2 is a plan view showing a display panel and a driving IC according to one or more embodiments;

[0034] Figure 3 is a perspective view showing a display device according to another embodiment;

[0035] Figure 4 is a cross-sectional view showing an example of a display area of a display panel according to one or more embodiments;

[0036] Figure 5 is a cross-sectional view taken along the Figure 1 line X1-X1';

[0037] Figure 6 is a cross-sectional view showing the Figure 5 display device bent according to one or more embodiments;

[0038] Figure 7 is a flowchart showing a method for manufacturing a display device according to one or more embodiments;

[0039] Figure 8 is a perspective view showing the Figure 7 operation S100;

[0040] Figure 9 is a cross-sectional view taken along the Figure 8 line X2-X2';

[0041] Figure 10 is a perspective view showing the Figure 7 operation S200;

[0042] Figures 11 to 14 is a cross-sectional view taken along the Figure 10 line X3-X3';

[0043] Figure 15 is a perspective view showing the Figure 7 operation S300;

[0044] Figure 16 is a cross-sectional view taken along the Figure 15 line X4-X4';

[0045] Figure 17 is a perspective view showing the Figure 7 operation S400;

[0046] Figure 18 is a cross-sectional view taken along the Figure 17 line X5-X5';

[0047] Figure 19 and Figure 20 is a cross-sectional view taken along the Figure 17 line X6-X6';

[0048] Figure 21 is a perspective view showing the Figure 7 operation S500;

[0049] Figure 22 is a cross-sectional view taken along the Figure 21 line X7-X7';

[0050] Figure 23and Figure 24 is a perspective view showing Figure 7 operation S600; and

[0051] Figure 25 is a cross-sectional view taken along line X8-X8' of Figure 24 . DETAILED DESCRIPTION

[0052] Aspects of some embodiments of the present disclosure and methods of implementing them can be more readily understood by reference to the detailed description of the embodiments and the drawings. The described embodiments are provided as examples so that the present disclosure will be thorough and complete and will fully convey the aspects of the present disclosure to those skilled in the art. Accordingly, processes, elements, and techniques that are redundant, not relevant to the description of the embodiments, or unnecessary for those of ordinary skill in the art to fully understand the aspects of the present disclosure may be omitted. Unless otherwise indicated, throughout the drawings and the written description, the same reference numerals, characters, or combinations thereof represent the same elements, and thus, their repeated description may be omitted.

[0053] The described embodiments may have various modifications and may be implemented in different forms and should not be construed as limited to the embodiments shown herein. The use of "can", "may", or "may not" in the description of the embodiments corresponds to one or more embodiments of the present disclosure.

[0054] Those of ordinary skill in the art, considering the present disclosure as a whole, should understand that unless otherwise indicated or implied, the present disclosure covers all modifications, equivalents, and alternatives within the spirit and scope of the present disclosure. Each of the features of the embodiments of the present disclosure can be combined partially or wholly with each other, and various interlocks and operations are possible technically, and each embodiment can be implemented independently of each other or can be implemented in association with each other.

[0055] In the drawings, for clarity and / or description purposes, the relative dimensions of elements, layers, and / or regions may be exaggerated. Additionally, the use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Accordingly, unless specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, dimension, ratio, commonality between the elements shown, and / or any other characteristic, attribute, property, etc. of the elements.

[0056] In this document, various embodiments are described with reference to cross-sectional views that are schematic illustrations of embodiments and / or intermediate structures. Accordingly, variations in the shapes of the figures due to, for example, manufacturing techniques and / or tolerances are to be expected. In addition, the specific structural or functional descriptions disclosed herein are merely exemplary for the purpose of describing embodiments in accordance with the concepts of the present disclosure. Thus, the embodiments disclosed herein should not be construed as limited to the shapes of the elements, layers, or regions shown, but should include deviations in shape, for example, resulting from manufacturing.

[0057] For example, an implantation region shown as rectangular will typically have rounded or curved features at its edges and / or a gradient in the implantation concentration, rather than a binary change from the implantation region to the non-implantation region. Similarly, an implanted buried region may result in some implantation in the region between the buried region and the surface through which the implantation occurs.

[0058] For ease of description, spatially relative terms such as "below", "beneath", "under", "lower side", "underneath", "above", "on", "upper side", etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. It will be understood that, in addition to the orientation depicted in the figures, the spatially relative terms are intended to encompass different orientations of the device in use or in operation. For example, if the device in the figures is turned over, an element described as "below", "beneath", or "underneath" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "underneath" can encompass both an upper and a lower orientation. The device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly. Similarly, when a first portion is described as being disposed "on" a second portion, this means that the first portion is disposed at the upper or lower side of the second portion based on the direction of gravity, and is not limited to its upper side.

[0059] In addition, the phrase "in a plan view" means when viewing the object portion from above, and the phrase "in a schematic cross-sectional view" means when viewing a schematic cross-section taken by vertically cutting the object portion from the side. The term "overlap" or "overlapping" means that a first object can be above or below a second object, or on one side of the second object, and vice versa. Additionally, the term "overlap" can include stacking, facing or being faced, extending over, covering or partially covering, or any other suitable term as would be appreciated and understood by one of ordinary skill in the art. The expression "not overlapping" can include meanings such as "spaced apart from...", "separated from...", "offset from...", and any other suitable equivalents as would be appreciated and understood by one of ordinary skill in the art. The terms "face" and "facing" can mean that a first object can be directly or indirectly opposite a second object. In a case where a third object is between the first object and the second object, the first object and the second object can be understood to be indirectly opposite each other, but still face each other.

[0060] It will be understood that when an element, layer, region, or component is referred to as being "formed on", "on", "connected to", or "(operatively or communicatively) coupled to" another element, layer, region, or component, it can be directly formed on, directly on, directly connected to, or directly coupled to the other element, layer, region, or component, or indirectly formed on, indirectly on, indirectly connected to, or indirectly coupled to the other element, layer, region, or component, such that there can be one or more intervening elements, layers, regions, or components. Additionally, this can collectively mean direct coupling or coupled connection or indirect coupling or indirect connection, as well as integral coupling or integral connection or non-integral coupling or non-integral connection. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, it can be directly electrically connected or directly electrically coupled to the other layer, region, or component, or there can be one or more intervening layers, regions, or components. The one or more intermediate components can include switches, resistors, capacitors, etc. When describing an embodiment, unless explicitly described as a direct connection, the expression of connection indicates an electrical connection, and "direct connection / direct coupling" or "directly on" means that one component is directly connected or directly coupled to another component or directly on another component without an intermediate component.

[0061] In addition, in this specification, when a part of a layer, film, region, plate, etc. is formed on another part, the forming direction is not limited to the upward direction, but includes forming the part on the side surface or in the downward direction. Conversely, when a part of a layer, film, region, plate, etc. is formed "under" another part, this includes not only the case where the part is "directly under" the other part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components, such as "between", "directly between", or "adjacent to" and "directly adjacent to", can be similarly interpreted. It will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intermediate elements or layers.

[0062] For the purposes of this disclosure, when an expression such as "at least one of", "any one of", or "one or more of" is located after a list of elements, it modifies the entire list of elements and not the individual elements in the list. For example, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, any combination of two or more of X, Y, and Z (such as, for example, XYZ, XY, YZ, and XZ), and / or any variation thereof. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or", and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, when expressions such as "at least one of", "a plurality of", "one of", and other prepositional phrases are located before / after a list of elements, they modify the entire list of elements and not the individual elements in the list. Unless otherwise indicated, when reciting "C to D", this means C or more and D or less.

[0063] It will be understood that although the terms “first,” “second,” “third,” etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms do not correspond to a particular order, position, or preference, and are only used to distinguish one element, member, component, region, area, layer, section, or part from another element, member, component, region, area, layer, section, or part. Thus, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer, or first section described below may be referred to as a second element, second component, second region, second layer, or second section. The description of an element as a “first” element may not require or imply the existence of a second element or other elements. The terms “first,” “second,” etc. may also be used herein to distinguish different categories or sets of elements. For the sake of brevity, the terms “first,” “second,” etc. may respectively represent “first category (or first set),” “second category (or second set),” etc.

[0064] In an example, the X-axis, Y-axis, and / or Z-axis are not limited to the three axes of a rectangular coordinate system and may be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. This also applies to the first direction, second direction, and / or third direction.

[0065] The terms used herein are for the purpose of describing embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms “a” and “an” are intended to also include the plural forms, and the plural forms are also intended to include the singular forms, unless the context clearly indicates otherwise. It will also be understood that the terms “comprises,” “comprising,” “have,” “having,” “includes,” and / or “including,” when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0066] When one or more embodiments can be implemented differently, a particular process order may be performed differently from the order described. For example, two consecutively described processes may be performed substantially simultaneously, or in an order opposite to the described order.

[0067] As used herein, the terms "substantially," "about," "approximate," and like terms are used as terms of approximation and not of degree, and are intended to account for inherent deviations in measured or calculated values recognized by one of ordinary skill in the art. For example, "substantially" may include a range of + / - 5% of the corresponding value. Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), as used herein, "about" or "approximate" includes the recited value and means within an acceptable deviation of the particular value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within + / - 30%, + / - 20%, + / - 10%, + / - 5% of the recited value. Additionally, when describing embodiments of the present disclosure, the use of "may" means "one or more embodiments of the present disclosure."

[0068] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0069] Figure 1 is a perspective view showing a display device according to one or more embodiments. Figure 2 is a plan view showing a display panel and a driving IC according to one or more embodiments.

[0070] Reference Figure 1 and Figure 2 According to one or more embodiments, the display device 10 is a device that displays moving images or still images, and can be used as a display screen for each of various products such as a television, a laptop computer, a monitor, a billboard, and an Internet of Things (IoT) device, and portable electronic devices such as a mobile phone, a smartphone, a tablet personal computer (PC), a smartwatch, a watch phone, a mobile communication terminal, an electronic notepad, an e-book, a portable multimedia player (PMP), a navigation device, and an ultra-mobile PC (UMPC).

[0071] The display device 10 according to one or more embodiments may be a light-emitting display device, such as an organic light-emitting display device using organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro light-emitting display device or a nano light-emitting display device using micro light-emitting diodes (LEDs) or nano light-emitting diodes (LEDs). Hereinafter, the display device 10 is mainly described as an organic light-emitting display device, but the present disclosure is not limited thereto.

[0072] The display device 10 according to one or more embodiments may include a display panel 100, a driving integrated circuit (IC) 200, and a circuit board 300.

[0073] The display panel 100 may be formed in a rectangular plane having a long side in a first direction (X-axis direction) and a short side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The corners where the long side in the first direction (X-axis direction) and the short side in the second direction (Y-axis direction) meet may be formed at right angles or may be rounded to have a certain curvature. The planar shape of the display panel 100 is not limited to a quadrilateral shape and may be formed in other polygonal shapes, circular shapes, or elliptical shapes.

[0074] In the illustrated drawings, the first direction (X-axis direction) and the second direction (Y-axis direction) are each a horizontal direction and intersect each other. For example, the first direction (X-axis direction) and the second direction (Y-axis direction) may be orthogonal to each other. In addition, a third direction (Z-axis direction) may be a vertical direction intersecting the first direction (X-axis direction) and the second direction (Y-axis direction) (e.g., orthogonal to the first direction (X-axis direction) and the second direction (Y-axis direction)). In this specification, the direction indicated by an arrow in the first to third directions (X-axis direction, Y-axis direction, and Z-axis direction) may be referred to as one side, and the opposite direction of this direction may be referred to as the other side.

[0075] The display panel 100 may be flat, but is not limited thereto. For example, the display panel 100 may include curved surface portions formed at its left and right distal ends and having a constant curvature or a varying curvature. In addition, the display panel 100 may be flexibly bent, curved, folded, or curled.

[0076] The display panel 100 may include a main area MA, a curved area BA, and a pad area PDA. The main area MA may include a display area DA for displaying an image and a non-display area NDA located around the display area DA.

[0077] The display area DA may occupy most of the area of the display panel 100. The display area DA may generally be located at the center of the display panel 100. Pixels each including a plurality of light-emitting areas for displaying an image may be located in the display area DA.

[0078] The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may be an area outside the display area DA. The non-display area NDA may be positioned (e.g., in a plan view) to surround the display area DA. The non-display area NDA may be an edge area of the display panel 100.

[0079] The bending area BA may be located between the display area DA and the pad area PDA in the second direction (Y-axis direction). The bending area BA may extend in the first direction (X-axis direction). The bending area BA refers to an area that bends downward toward the display panel 100. When the bending area BA bends downward toward the display panel 100, a plurality of driving ICs 200 and the circuit board 300 may be located at the lower part of the display panel 100.

[0080] The pad area PDA may be a lower edge area of the display panel 100. The pad area PDA may be an area where display pads DP connected to the circuit board 300, a first driving pad, and a second driving pad connected to the driving IC 200 are located.

[0081] The display pads DP may be located in the pad area PDA to be connected to the circuit board 300. The display pads DP may be located on the edge on one side of the display panel 100. For example, the display pads DP may be located on the edge on the lower side of the display panel 100.

[0082] The driving integrated circuit (IC) 200 may generate a data voltage, a power voltage, a scan timing signal, etc. The driving IC 200 may output a data voltage, a power voltage, a scan timing signal, etc.

[0083] The driving IC 200 may be located in the pad area PDA. The driving IC 200 may be located between the display pads DP and the display area DA in the non-display area NDA. Each of the driving ICs 200 may be attached to the non-display area NDA of the display panel 100 using a chip on glass (COG) method. Optionally, the driving IC 200 may be attached to the circuit board 300 using a chip on plastic (COP) method.

[0084] The circuit board 300 may be located on the display pad DP at the edge on one side of the display panel 100. The circuit board 300 may be attached to the display pad DP using a conductive bonding member such as an anisotropic conductive film and an anisotropic conductive adhesive. Accordingly, the circuit board 300 may be electrically connected to the signal lines of the display panel 100. The circuit board 300 may be a flexible film such as a flexible printed circuit board or a chip on film.

[0085] Figure 3 is a perspective view showing a display device according to one or more other embodiments.

[0086] Reference Figure 3 , the shape of the display panel 100 may be different from the shape of the display panel 100 in one or more embodiments described such as Figure 1 .

[0087] For example, in the display panel 100, the length of the main area MA in the first direction (X-axis direction) may be longer than the lengths of the bending area BA and the pad area PDA in the first direction (X-axis direction). The bending area BA and the pad area PDA may have a shape protruding from a part of one side of the main area MA. As an example, the display panel 100 may include an L-shaped cut shape in which the widths of the bending area BA and the pad area PDA are narrower than the width of the main area MA.

[0088] Thus, the shape of the display panel 100 is not limited to Figures 1 to 3 the shape shown in, and various shapes may be applied according to the type of the display device 10.

[0089] In some embodiments, the display device 10 may further include a connection film 250. The connection film 250 may be a flexible film.

[0090] One end of the connection film 250 may be connected to Figure 2 the display pad DP of (see Figure 2 ). The other end of the connection film 250 may be connected to the circuit board 300. The driving IC 200 may be located on the connection film 250. The driving IC 200 may be mounted by a chip on film (COF) method. The circuit board 300 may be attached to the connection film 250.

[0091] In this way, in the pad area PDA, the driving IC 200 and the circuit board 300 may be mounted on the display panel 100 in various ways.

[0092] Figure 4 is a cross-sectional view showing an example of a display area of a display panel according to one or more embodiments.

[0093] Reference Figure 4, the display device 10 may further include a display panel 100, a polarizing film PF, and a cover window CW.

[0094] The display panel 100 may be an organic light-emitting display panel including light-emitting elements LEL, and the light-emitting elements LEL include an organic light-emitting layer 172. However, the display panel 100 is not limited thereto, and may also be a light-emitting display panel such as a quantum dot light-emitting display panel including a quantum dot light-emitting layer, an inorganic light-emitting display panel including an inorganic semiconductor, and a micro-light-emitting display panel or a nano-light-emitting display panel using micro light-emitting diodes (LEDs) or nano light-emitting diodes (LEDs). Hereinafter, for ease of description, the case where the display panel 100 is an organic light-emitting display panel will be described as an example.

[0095] The display panel 100 may include a substrate SUB, a display layer DISL, a packaging layer ENC, and a sensor electrode layer SENL.

[0096] The substrate SUB may include a first substrate SUB1 having a hard material and a second substrate SUB2 made of a polymer resin having a soft material.

[0097] The first substrate SUB1 may have a hard material. For example, the first substrate SUB1 may be made of glass. The first substrate SUB1 may be made of ultra-thin glass (UTG) having a thickness of about 500 μm or less.

[0098] The second substrate SUB2 may have a soft material. The second substrate SUB2 may be made of a polymer resin having a thickness less than that of the first substrate SUB1. For example, the second substrate SUB2 may have a thickness of about 20 μm or less. The second substrate SUB2 may be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. The second substrate SUB2 may be referred to as a plastic substrate because it is made of a polymer resin. In some embodiments, the second substrate SUB2 may have a multilayer structure.

[0099] The display layer DISL may include a thin-film transistor layer TFTL (e.g., a circuit layer) including a plurality of thin-film transistors and a light-emitting element layer EML including a plurality of light-emitting elements.

[0100] The thin-film transistor layer TFTL (e.g., a circuit layer) may include a first buffer film BF1, a thin-film transistor TFT, a gate insulating film 130, a first interlayer insulating film 141, a capacitor Cst, a second interlayer insulating film 142, a first data metal layer, a first organic film 160, a second data metal layer, and a second organic film 180.

[0101] The first buffer film BF1 may be located on the substrate SUB. The first buffer film BF1 may be formed of an inorganic material such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer. Optionally, the first buffer film BF1 may be formed as a multilayer film of multiple layers in which a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked.

[0102] The active layer of the thin film transistor TFT including the channel region TCH, the source region TS, and the drain region TD may be located on the first buffer film BF1. The active layer may be formed of polysilicon, single crystal silicon, low temperature polysilicon, amorphous silicon, or an oxide semiconductor. When the active layer includes a polysilicon or an oxide semiconductor material, the source region TS and the drain region TD in the active layer may be conductive regions doped with ions or impurities and having conductivity.

[0103] The gate insulating film 130 may be located on the active layer of the thin film transistor TFT. The gate insulating film 130 may be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0104] The first gate metal layer including the gate electrode TG of the thin film transistor TFT, the first capacitor electrode CAE1 of the capacitor Cst, and the scan line may be located on the gate insulating film 130. The gate electrode TG of the thin film transistor TFT may overlap with the channel region TCH in the third direction (Z-axis direction). The first gate metal layer may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0105] The first interlayer insulating film 141 may be located on the first gate metal layer. The first interlayer insulating film 141 may be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film 141 may include multiple inorganic films.

[0106] The second gate metal layer including the second capacitor electrode CAE2 of the capacitor Cst may be located on the first interlayer insulating film 141. The second capacitor electrode CAE2 may overlap with the first capacitor electrode CAE1 in the third direction (Z-axis direction). Thus, the capacitor Cst may be formed of the first capacitor electrode CAE1, the second capacitor electrode CAE2, and an inorganic insulating dielectric film located therebetween and serving as a dielectric film. The second gate metal layer may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0107] The second interlayer insulating film 142 may be located on the second gate metal layer. The second interlayer insulating film 142 may be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film 142 may include a plurality of inorganic films.

[0108] The first data metal layer including the first connection electrode CE1 and the data line may be located on the second interlayer insulating film 142. The first connection electrode CE1 may be connected to the drain region TD through a first contact hole CT1 passing through the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first data metal layer may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0109] The first organic film 160 for planarizing the step caused by the thin film transistor TFT may be located on the first connection electrode CE1. The first organic film 160 may be formed of an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0110] The second data metal layer including the second connection electrode CE2 may be located on the first organic film 160. The second data metal layer may be connected to the first connection electrode CE1 through a second contact hole CT2 passing through the first organic film 160. The second data metal layer may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0111] The second organic film 180 may be located on the second connection electrode CE2. The second organic film 180 may be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0112] In one or more embodiments, the second data metal layer including the second connection electrode CE2 and the second organic film 180 may be omitted.

[0113] The light-emitting element layer EML is located on the thin film transistor layer TFTL. The light-emitting element layer EML may include a light-emitting element LEL and a pixel defining film 190.

[0114] Each of the light-emitting elements LEL may include a pixel electrode 171, a light-emitting layer 172, and a common electrode 173. Each of the light-emitting regions EA represents a region in which the pixel electrode 171, the light-emitting layer 172, and the common electrode 173 are sequentially stacked. Holes from the pixel electrode 171 and electrons from the common electrode 173 recombine with each other in the light-emitting layer 172 to emit light. In this case, the pixel electrode 171 may be an anode electrode, and the common electrode 173 may be a cathode electrode.

[0115] The pixel electrode layer including the pixel electrode 171 may be formed on the second organic film 180. The pixel electrode 171 may be connected to the second connection electrode CE2 through a third contact hole CT3 passing through the second organic film 180. The pixel electrode layer may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0116] In a top-emission structure in which light is emitted from the light-emitting layer 172 in the direction of the common electrode 173, the pixel electrode 171 may be formed of a single layer made of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or formed as a stacked structure of titanium and aluminum (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO) to increase reflectivity. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0117] The pixel defining film 190 is used to define the light-emitting region EA of the pixel. To this end, the pixel defining film 190 may be formed on the second organic film 180 to expose a partial region of the pixel electrode 171. The pixel defining film 190 may cover the edge of the pixel electrode 171. The pixel defining film 190 may be located in the third contact hole CT3. In other words, the third contact hole CT3 may be filled with the pixel defining film 190. The pixel defining film 190 may be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0118] The spacer 191 may be located on the pixel defining film 190. The spacer 191 may be used to support a mask during the process of manufacturing the light-emitting layer 172. The spacer 191 may be formed as an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0119] The light-emitting layer 172 is formed on the pixel electrode 171. The light-emitting layer 172 may include an organic material to emit light of a color (e.g., a predetermined color). For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a host and a dopant. The organic material layer may include a material that emits light (e.g., predetermined light) and may be formed of a phosphorescent material or a fluorescent material.

[0120] The common electrode 173 is formed on the light-emitting layer 172. The common electrode 173 may be formed to cover the light-emitting layer 172. The common electrode 173 may be a common layer commonly formed in the light-emitting area EA. A capping layer may be formed on the common electrode 173.

[0121] In a top-emission structure, the common electrode 173 may be formed of a transparent conductive material (TCO) such as ITO or IZO capable of transmitting light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode 173 is formed of a semi-transmissive conductive material, the light-emitting efficiency may be improved through a microcavity.

[0122] The encapsulation layer ENC may be located on the light-emitting element layer EML. The encapsulation layer ENC may include one or more inorganic films TFE1 and TFE3 to reduce or prevent oxygen or moisture from permeating into the light-emitting element layer EML. In addition, the encapsulation layer ENC may include at least one organic film TFE2 to protect the light-emitting element layer EML from foreign substances such as dust. For example, the encapsulation layer ENC may include a first encapsulation inorganic film TFE1, an encapsulation organic film TFE2, and a second encapsulation inorganic film TFE3.

[0123] The first encapsulation inorganic film TFE1 may be located on the common electrode 173, the encapsulation organic film TFE2 may be located on the first encapsulation inorganic film TFE1, and the second encapsulation inorganic film TFE3 may be located on the encapsulation organic film TFE2. The first encapsulation inorganic film TFE1 and the second encapsulation inorganic film TFE3 may be formed as a multilayer film in which one or more inorganic films among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The encapsulation organic film TFE2 may be an organic film made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0124] The sensor electrode layer SENL may be located on the encapsulation layer ENC. The sensor electrode layer SENL may include a second buffer film BF2, a first connection portion BE1, a first sensor insulating film TINS1, sensor electrodes TE and RE, and a second sensor insulating film TINS2.

[0125] The second buffer film BF2 may be located on the encapsulation layer ENC. The second buffer film BF2 may include at least one inorganic film. For example, the second buffer film BF2 may be formed as multiple films in which one or more inorganic films among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The second buffer film BF2 may be omitted.

[0126] The first connection part BE1 may be located on the second buffer film BF2. The first connection part BE1 may be formed as a single layer made of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may be formed as a stacked structure of titanium and aluminum (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0127] The first sensor insulating film TINS1 may be located on the first connection part BE1. The first sensor insulating film TINS1 may be formed as an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0128] The sensor electrodes, i.e., the driving electrode TE and the sensing electrode RE, may be located on the first sensor insulating film TNIS1. In addition, dummy patterns may be located on the first sensor insulating film TNIS1. The driving electrode TE, the sensing electrode RE, and the dummy patterns do not overlap with the light-emitting region EA. The driving electrode TE, the sensing electrode RE, and the dummy patterns may be formed as a single layer made of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may be formed as a stacked structure of titanium and aluminum (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0129] The second sensor insulating film TINS2 may be located on the driving electrode TE, the sensing electrode RE, and the dummy patterns. The second sensor insulating film TINS2 may include at least one of an inorganic film and an organic film. The inorganic film may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic film may be made of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0130] The polarizing film PF may be located on the sensor electrode layer SENL. The polarizing film PF may be located on the display panel 100 to reduce reflection of external light. The polarizing film PF may include a first base member, a linear polarizer, a phase retardation film (such as a quarter-wavelength (λ / 4) plate), and a second base member. The first base member, the phase retardation film, the linear polarizer, and the second base member of the polarizing film PF may be sequentially stacked on the display panel 100.

[0131] The cover window CW may be located on the polarizing film PF. The cover window CW may be attached to the polarizing film PF through a transparent adhesive member such as an optically clear adhesive (OCA) film.

[0132] Figure 5 is a cross-sectional view taken along Figure 1 the line X1-X1'. Figure 6 is a cross-sectional view showing Figure 5 the state in which the display device according to one or more embodiments is bent.

[0133] Referring to Figure 5 and Figure 6 , in addition to the display panel 100, the polarizing film PF, the cover window CW, the driving IC 200, and the circuit board 300, the display device 10 may further include a protective film PRTL and a panel lower cover PB. The display panel 100 may include a substrate SUB, a display layer DISL, a packaging layer ENC, and a sensor electrode layer SENL.

[0134] Since the display layer DISL, the packaging layer ENC, the sensor electrode layer SENL, the polarizing film PF, and the cover window CW have been described above, their descriptions will be omitted.

[0135] The substrate SUB may include a first substrate SUB1 having a hard material and a second substrate SUB2 made of a polymer resin having a soft material. The first substrate SUB1 may not be located in the bending region BA. For example, the first substrate SUB1 may include or define an opening BOP that exposes the second substrate SUB2. That is, since the first substrate SUB1 made of a hard material is not located in the bending region BA, the display device 10 can be easily bent as Figure 6 shown.

[0136] The protective film PRTL may be located on the thin film transistor layer TFTL in the bending region BA. The protective film PRTL may be a layer that protects the thin film transistor layer TFTL exposed to the outside in the bending region BA. The protective film PRTL may be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0137] The panel lower cover PB can be located on the second surface of the first substrate SUB1 of the display panel 100. The second surface of the first substrate SUB1 can be the surface opposite to the first surface. For example, the panel lower cover PB can be located on the lower surface BS of the first substrate SUB1. The panel lower cover PB can be attached to the second surface of the first substrate SUB1 of the display panel 100 through an adhesive member. The adhesive member can be a pressure-sensitive adhesive (PSA).

[0138] The panel lower cover PB can include at least one of a light-blocking member for absorbing light incident from the outside, a buffer member for absorbing impact from the outside, and a heat-dissipating member for effectively discharging the heat of the display panel 100.

[0139] As Figure 6 shown, the driving IC 200 and the circuit board 300 can be bent toward the lower part of the display panel 100. The pad area PDA to which the driving IC 200 and the circuit board 300 of the display panel 100 are attached can be attached to the lower surface of the panel lower cover PB using the adhesive member 310.

[0140] The adhesive member 310 can be a pressure-sensitive adhesive. In the state where the display device 10 is bent, the adhesive member 310 can be positioned between the first substrate SUB1 located in the main area MA and the first substrate SUB1 located in the pad area PDA. The adhesive member 310 can be located below the panel lower cover PB.

[0141] In the display device 10, the first substrate SUB1 can include an upper surface US, a lower surface BS, a first side surface SS1, a first inclined surface IP1_1, a second side surface SS2, and a second inclined surface IP1_2.

[0142] The upper surface US of the first substrate SUB1 can be the surface on one side in the third direction (Z-axis direction), and the lower surface BS of the first substrate SUB1 can be the surface on the side opposite to this side in the third direction (Z-axis direction).

[0143] The first side surface SS1 can be positioned at the edge BEG of the bending area BA. The edge BEG of the bending area BA can refer to the edge formed by etching the first substrate SUB1 in the bending area BA.

[0144] The first side surface SS1 can be positioned between the upper surface US and the lower surface BS. The first side surface SS1 can be positioned at the edge BEG of the bending area BA. The first side surface SS1 can be an inclined surface.

[0145] For example, as Figure 5As shown, a first angle θ1, which is an acute angle formed between the lower surface BS and the first side surface SS1 of the first substrate SUB1, can be less than about 60 degrees. In one or more embodiments, the first angle θ1 can be about 45 degrees to 50 degrees.

[0146] The inclined surface of the first side surface SS1 can be formed when the protective film is attached, and a portion of the first substrate SUB1 in the bending region BA can be etched during the process of manufacturing the display device 10. For example, by attaching the protective film to the remaining region of the first substrate SUB1 except for the bending region BA, only the first substrate SUB1 positioned in the bending region BA can be etched first. The first substrate SUB1 positioned in the bending region BA can be formed into an inclined surface due to the isotropic property of wet etching. After the first substrate SUB1 positioned in the bending region BA is etched to a certain thickness, the entire first substrate SUB1 can be etched by removing the protective film. In this way, the thickness of the first substrate SUB1 can be reduced, and at the same time, an opening BOP exposing the second substrate SUB2 can be formed in the bending region BA.

[0147] Therefore, the first substrate SUB1 can include a first sub - substrate SSUB1 positioned on one side of the opening BOP and a second sub - substrate SSUB2 positioned on the other side of the opening BOP.

[0148] The first inclined surface IP1_1 can be positioned between the upper surface US and the first side surface SS1. The first inclined surface IP1_1 can be an undercut formed between the first substrate SUB1 and the second substrate SUB2. When during the process of manufacturing the display device 10, the first inclined surface IP1_1 can be formed due to the over - etching of the etchant that has penetrated into the interface between the first substrate SUB1 and the second substrate SUB2 when etching the first substrate SUB1.

[0149] In some embodiments, as Figure 5 shown, the length L_IP1_1 of the first inclined surface IP1_1 in the second direction (Y - axis direction) can be about 120 μm or less. The length L_IP1_1 of the first inclined surface IP1_1 in the second direction (Y - axis direction) can refer to the distance in the second direction (Y - axis direction) from the end P2 at the edge BEG of the bending region BA of the first substrate SUB1 to the boundary P1 where the first inclined surface IP1_1 of the first substrate SUB1 meets the upper surface US. In one or more embodiments, a second angle θ2, which is an acute angle formed between the first inclined surface IP1_1 and the upper surface US of the first substrate SUB1, can be less than about 15 degrees.

[0150] The second side surface SS2 can be positioned at the edge EG of the display panel 100. The edge EG of the display panel 100 can refer to the edge formed by etching the first substrate SUB1 along the periphery of the display unit DPC (see Figure 8 ), which will be described later.

[0151] The second side surface SS2 can be positioned between the upper surface US and the lower surface BS. The second side surface SS2 can be positioned at the edge EG of the display panel 100. The second side surface SS2 can be a substantially vertical surface, but is not limited thereto.

[0152] The second inclined surface IP1_2 can be positioned between the lower surface BS and the second side surface SS2. The second inclined surface IP1_2 can be positioned at the edge EG of the display panel 100. In the process of manufacturing the display device 10, the second inclined surface IP1_2 can be formed due to the isotropy of the etchant during the process of spraying the etchant after laser irradiation.

[0153] In some embodiments, the third angle θ3 and the fourth angle θ4 can be obtuse angles, where the third angle θ3 is the angle formed between the second side surface SS2 and the second inclined surface IP1_2, and the fourth angle θ4 is the angle formed between the second inclined surface IP1_2 and the lower surface BS.

[0154] Since the second inclined surface IP1_2 is formed by laser irradiation and the isotropy of the etchant, while the first side surface SS1 is formed by the anisotropy generated by etching the entire area simultaneously or substantially simultaneously after partially etching the bent area BA, the third angle θ3 and the fourth angle θ4 can be different from the supplementary angle of the first angle θ1. In addition, since the first inclined surface IP1_1 is an undercut caused by the penetration of the etchant, the supplementary angle of the second angle θ2 can be different from the third angle θ3 and the fourth angle θ4.

[0155] In the display device 10, the length L_SSUB1 of the first sub-substrate SSUB1 in the second direction (Y-axis direction) can be about 50 times to about 200 times the length L_SSUB2 of the second sub-substrate SSUB2 in the second direction (Y-axis direction). For example, the length L_SSUB2 of the second sub-substrate SSUB2 in the second direction (Y-axis direction) can be about 2 mm to about 4 mm, and the length L_SSUB1 of the first sub-substrate SSUB1 in the second direction (Y-axis direction) can be about 200 mm to about 400 mm.

[0156] The length L_SSUB1 of the first sub-substrate SSUB1 in the second direction (Y-axis direction) may refer to the distance from the end of the first sub-substrate SSUB1 that is farthest from the opening BOP at one end in the second direction (Y-axis direction) to the boundary P3 where the lower surface BS and the first side surface SS1 of the first sub-substrate SSUB1 meet. The length L_SSUB2 of the second sub-substrate SSUB2 in the second direction (Y-axis direction) may refer to the distance from the end of the second sub-substrate SSUB2 that is farthest from the opening BOP at one end in the second direction (Y-axis direction) to the boundary P4 where the lower surface BS and the first side surface SS1 of the first sub-substrate SSUB1 meet.

[0157] The length L_SSUB2 of the second sub-substrate SSUB2 in the second direction (Y-axis direction) may be about 1 times to about 4 times the length L1_BOP of the upper side of the opening BOP in the second direction (Y-axis direction). For example, the length L1_BOP of the upper side of the opening BOP in the second direction (Y-axis direction) may be about 1.2 mm to about 1.8 mm.

[0158] The length L1_BOP of the upper side of the opening BOP in the second direction (Y-axis direction) may refer to the distance between the ends P2 at the edge BEG of the bending region BA of the first substrate SUB1.

[0159] The length L_SSUB2 of the second sub-substrate SSUB2 in the second direction (Y-axis direction) may be about 1 times to about 2.5 times the length L2_BOP of the lower side of the opening BOP in the second direction (Y-axis direction). For example, the length L2_BOP of the lower side of the opening BOP in the second direction (Y-axis direction) may be about 1.6 mm to about 2.0 mm.

[0160] The length L2_BOP of the lower side of the opening BOP in the second direction (Y-axis direction) may refer to the distance between the boundaries P3 and P4 where the lower surface BS and the first side surface SS1 of the first substrate SUB1 meet.

[0161] Because the display device 10 may not have the first substrate SUB1 located in the bending region BA, the magnitude of the force suitable for bending the display device 10 may be relatively small. Therefore, even if the adsorption pad PAD (see Figure 24 ) is attached to the circuit board 300 when the display device 10 is bent, damage to the display device 10 can be reduced or minimized. Therefore, the spare space where the adsorption pad PAD can be attached may not be separately located in the bending region BA and the pad region PDA. Therefore, in the method S1 for manufacturing a display device described later (see Figure 7 ), by reducing or minimizing the lengths of the bending region BA and the pad region PDA, the display unit DPC (seeFigure 8 ) and the dead space of the display device 10 can be reduced or minimized.

[0162] Hereinafter, a method for manufacturing a display device according to one or more embodiments will be described.

[0163] Figure 7 is a flowchart illustrating a method for manufacturing a display device according to one or more embodiments.

[0164] refer to Figure 7 , a method S1 for manufacturing a display device according to one or more embodiments may include: forming a second mother substrate on a first surface of a first mother substrate, and forming a display unit on the second mother substrate (operation S100); removing a portion of the first mother substrate located in the curved area by attaching a first protective film to the second surface of the first mother substrate, removing a portion of the first protective film located in the curved area, and spraying an etchant onto the second surface of the first mother substrate, and removing the remaining first protective film (operation S200); forming a plurality of laser irradiation areas positioned along an edge of the display unit by irradiating a laser onto the second surface of the first mother substrate , and attaching a second protective film to the first surface of the first mother substrate (operation S300); forming a first substrate by spraying an etchant onto the second surface of the first mother substrate without a separate mask to reduce the thickness of the first mother substrate, and simultaneously or substantially simultaneously cutting the first mother substrate along multiple laser irradiation areas (operation S400); forming a second substrate by removing the second protective film and patterning the second mother substrate (operation S500); and separating a plurality of display units, attaching a driving IC and a circuit board to each of the plurality of display units, attaching an adsorption pad to the circuit board, and bending the second substrate (operation S600).

[0165] Figure 8 It is shown Figure 7 FIG. 1 is a perspective view of operation S100 . Figure 9 It is along Figure 8 A cross-sectional view taken along line X2-X2'.

[0166] Apart from Figure 7 In addition, refer to Figure 8 and Figure 9 A second mother substrate may be formed on the first surface of the first mother substrate, and a display unit ( Figure 7 Operation S100 in FIG.

[0167] The mother substrate MSUB may include a first mother substrate MSUB1 and a second mother substrate MSUB2. The second mother substrate MSUB2 may be located on the first mother substrate MSUB1. The first mother substrate MSUB1 may have a hard material. The second mother substrate MSUB2 may have a soft material.

[0168] Each display unit DPC may include a first mother substrate MSUB1, a second mother substrate MSUB2 located on the upper surface US of the first mother substrate MSUB1, a display layer DISL located on the second mother substrate MSUB2, a packaging layer ENC located on the display layer DISL, and a sensor electrode layer SENL located on the packaging layer ENC. The display layer DISL may include a thin film transistor layer TFTL and a light emitting element layer EML.

[0169] Figure 10 is a perspective view showing Figure 7 the operation S200 of. Figures 11 to 14 is a cross-sectional view taken along Figure 10 the line X3-X3' of.

[0170] In addition to Figure 7 , also referring to Figures 10 to 14 , the first protective film may be attached to the second surface of the first mother substrate, the portion of the first protective film located in the bending region may be removed, and the etchant may be sprayed onto the second surface of the first mother substrate to remove the portion of the first mother substrate located in the bending region, and the remaining first protective film may be removed (the operation S200 in Figure 7 ).

[0171] As Figure 11 shown, the first protective film PRF1 may be attached to the rear surface of the mother substrate MSUB (for example, the lower surface BS of the first mother substrate MSUB1). The first protective film PRF1 may be an acid-resistant film. The first protective film PRF1 may reduce or prevent the etching of the first mother substrate MSUB1 in the region where the first protective film PRF1 is attached.

[0172] Next, as Figure 12 shown, the first protective film PRF1 located in the bending region BA may be removed. The lower surface BS of the first mother substrate MSUB1 may be exposed in the bending region BA where the first protective film PRF1 is removed.

[0173] Next, as Figure 13As shown, a portion of the first mother substrate MSUB1 located in the bending region BA can be etched by spraying the etchant ECH onto the lower surface BS of the first mother substrate MSUB1. As a result, a portion of the first mother substrate MSUB1 located in the bending region BA can be removed. The thickness Tba of the first mother substrate MSUB1 in the bending region BA can be less than the first thickness T1' of the first mother substrate MSUB1 in the remaining region other than the bending region BA.

[0174] After etching the first mother substrate MSUB1, an inclined surface can be formed in the bending region BA. Such an inclined surface can be formed isotropically by wet etching.

[0175] Next, as Figure 14 shown, the first protective film PRF1 can be removed.

[0176] Figure 15 is a perspective view showing Figure 7 the operation S300. Figure 16 is a cross-sectional view taken along the line X4-X4' of Figure 15 the same.

[0177] In addition to Figure 7 this, reference is also made to Figure 15 and Figure 16 , by irradiating a laser on the second surface of the first mother substrate, a plurality of laser irradiation regions located along the edge of the display unit can be formed, and a second protective film can be attached to the first surface of the first mother substrate (operation S300 in Figure 7 ).

[0178] According to one or more embodiments, various lasers LR can be used. For example, the laser LR according to one or more embodiments can be an infrared Bessel beam having a wavelength of about 1030 nm, but is not limited thereto.

[0179] The laser LR can be irradiated on the second surface (e.g., the lower surface BS) of the first mother substrate MSUB1. However, the present specification is not limited thereto, and the laser LR can also be irradiated on the first surface (e.g., the upper surface US) of the first mother substrate MSUB1.

[0180] The contour line can be defined as a virtual line connecting a plurality of laser irradiation regions CH. The contour line can be formed by irradiating the laser LR along the edge of a plurality of display units DPC to form a plurality of laser irradiation regions CH.

[0181] When the laser LR is irradiated on the lower surface BS of the first mother substrate MSUB1, the depth (or contour length) T_CH of each of the plurality of laser irradiation regions CH can be adjusted according to the repetition rate, processing speed, and pulse energy.

[0182] For example, the depth T_CH of each of the plurality of laser irradiation regions CH may be less than the thickness of the first mother substrate MSUB1. As an example, when the thickness of the first mother substrate MSUB1 is about 500 μm, the depth T_CH of each of the plurality of laser irradiation regions CH may be about 50 μm to about 300 μm. However, the depth T_CH of each of the plurality of laser irradiation regions CH is not limited thereto, and may also be the same as the thickness of the first mother substrate MSUB1.

[0183] In one or more embodiments, the laser LR used to form the plurality of laser irradiation regions CH may irradiate at a repetition rate of about 1 kHz to about 250 kHz, a processing speed of about 1 mm / s to about 250 mm / s, and a pulse energy of about 10 μJ to about 300 μJ, but is not limited thereto.

[0184] Next, a second protective film PRF2 may be attached to the upper surface US of the first mother substrate MSUB1, for example, attached to the plurality of display units DPC. The second protective film PRF2 may simultaneously cover all of the plurality of display units DPC. The second protective film PRF2 may cover the plurality of display units DPC and the second mother substrate MSUB2.

[0185] The second protective film PRF2 may be an acid-resistant film. The second protective film PRF2 may protect the plurality of display units DPC from the etchant ECH during the etching process of the first mother substrate MSUB1.

[0186] Figure 17 is a perspective view showing Figure 7 the operation S400. Figure 18 is a cross-sectional view taken along Figure 17 the line X5-X5' of Figure 19 and Figure 20 is a cross-sectional view taken along Figure 17 the line X6-X6' of

[0187] In addition to Figure 7 , reference is also made to Figures 17 to 20 , the thickness of the first mother substrate can be reduced by spraying an etchant on the second surface of the first mother substrate without a separate mask, and the first mother substrate is cut along the plurality of laser irradiation regions simultaneously or substantially simultaneously to form the first substrate ( Figure 7 operation S400 in

[0188] When the etchant ECH is sprayed onto the lower surface BS of the first mother substrate MSUB1, the first mother substrate MSUB1 may be reduced from the first thickness T1' to the second thickness T2'. The first thickness T1' may be about 500 μm, and the second thickness T2' may be about 200 μm, but is not limited thereto.

[0189] Since the first mother substrate MSUB1 is etched without a separate mask, the first mother substrate MSUB1 can be etched isotropically and uniformly throughout the entire area of the lower surface BS.

[0190] As Figure 19 and Figure 20 shown, each of the plurality of laser irradiation regions CH may include a physical hole formed by the laser LR and a region around the physical hole whose physical properties are changed by the laser. Optionally, each of the plurality of laser irradiation regions CH may also be a region whose physical properties are changed by the laser LR without a physical hole. As a result, the etching rate of the etchant ECH in each of the plurality of laser irradiation regions CH may be higher than the etching rate in other regions of the first mother substrate MSUB1 that are not irradiated with the laser.

[0191] When the thickness of the first mother substrate MSUB1 is reduced by the etchant ECH and the etchant ECH penetrates into the plurality of laser irradiation regions CH formed by the laser LR, due to the plurality of laser irradiation regions CH, there may be a difference in the etching rate between the region where the laser irradiation region CH is formed and the region where the laser irradiation region CH is not formed. That is, anisotropic etching can be performed on the first mother substrate MSUB1, in which the etching rate in the region where the laser irradiation region CH is formed is faster than the etching rate in the region where the laser irradiation region CH is not formed. As a result, the first substrate SUB1 formed separately from the first mother substrate MSUB1 may include a second side surface SS2 at the edge EG of the display panel 100 and a second inclined surface IP1_2 located between the second side surface SS2 and the lower surface BS.

[0192] When the etchant ECH penetrates into the plurality of laser irradiation regions CH formed by the laser LR, a cutting line CL can be formed along the plurality of laser irradiation regions CH. The first substrate SUB1 can be separated from the dummy portion DUM of the first mother substrate MSUB1 along the cutting line CL. The dummy portion DUM may be a portion of the first mother substrate MSUB1 formed by the remaining first mother substrate MSUB1.

[0193] Meanwhile, as Figure 18 shown, the first mother substrate MSUB1 can be etched in the bending region BA and adjacent regions. As Figure 14 shown, since the first mother substrate MSUB1 on which the inclined surface is formed is etched again in operation S200, the shape of the edge BEG of the bending region BA may be different from Figure 19 and Figure 20 the shape of the edge EG of the display panel 100 shown. As Figure 18As shown in [reference], at the edge BEG of the bending region BA, a first side surface SS1, a first inclined surface IP1_1 located between the first side surface SS1 and the upper surface US, and an opening BOP may be formed.

[0194] In the method S1 for manufacturing a display device, the process of etching the first mother substrate MSUB1 may be performed before the process of patterning the second mother substrate MSUB2, which will be described later.

[0195] In this case, as Figure 19 shown in [reference], by the second mother substrate MSUB2 located on the first mother substrate MSUB1 in the region between the display units DPC, the penetration of the etchant ECH from the plurality of laser irradiation regions CH into the display units DPC may be reduced or minimized. Therefore, since no additional margin is required to reduce or prevent damage to the display units DPC due to the penetration of the etchant ECH, the distance ND1 between the display units DPC may be reduced or minimized. Accordingly, the area efficiency occupied by the display units DPC relative to the size of the mother substrate MSUB may be increased.

[0196] Figure 21 is a perspective view showing Figure 7 the operation S500 of [[reference]]. Figure 22 is a cross-sectional view taken along the line X7 - X7' of Figure 21 of [[reference]].

[0197] In addition to Figure 7 this, referring also to Figure 21 and Figure 22 , the second substrate ([operation S500 in [[reference]]]) may be formed by removing the second protective film and patterning the second mother substrate. Figure 7 of [[reference]].

[0198] After the process of etching the first mother substrate MSUB1 is completed, the second protective film PRF2 may be removed.

[0199] Next, as Figure 21 and Figure 22 shown in [reference], the second mother substrate MSUB2 may be patterned along the edge of the display units DPC. The second substrate SUB2 may be formed by patterning the second mother substrate MSUB2.

[0200] As an example, the second mother substrate MSUB2 may be patterned such that the edge of the second mother substrate MSUB2 is formed along the cutting line CL formed in the process of etching the first mother substrate MSUB1. In this case, the edge of the second substrate SUB2 may coincide with the edge of the first substrate SUB1. However, the present disclosure is not limited thereto, and as another example, the edge of the second substrate SUB2 may be positioned between the edge of the display units DPC and the edge of the first substrate SUB1.

[0201] The second substrate SUB2 can be removed from the dummy portion DUM. Each of the plurality of display units DPC can be separated from the first mother substrate MSUB1 (or the dummy portion DUM). Finally, each of the plurality of display units DPC can include a first substrate SUB1, a second substrate SUB2, a display layer DISL, a packaging layer ENC, and a sensor electrode layer SENL.

[0202] Figure 23 and Figure 24 is a perspective view showing Figure 7 the operation S600. Figure 25 is a cross-sectional view taken along the line X8-X8' of Figure 24 .

[0203] In addition to Figure 7 , referring also to Figures 23 to 25 , the operation S600 can include separating the plurality of display units, attaching a driving IC and a circuit board to each of the plurality of display units, attaching an adsorption pad to the circuit board, and bending the second substrate (operation S600 in Figure 7 ).

[0204] As shown in Figure 23 , each of the plurality of display units DPC can be separated from the first mother substrate MSUB1 (or the dummy portion DUM).

[0205] As shown in Figure 24 and Figure 25 , the driving IC 200 and the circuit board 300 can be attached to each of the plurality of display units DPC. In some embodiments, a connection film 250 can be further attached according to the installation method of the driving IC 200.

[0206] In the method S1 for manufacturing a display device, an adsorption pad PAD can be attached to the circuit board 300. When the adsorption pad PAD is attached to the second substrate SUB2, the attachment tolerance of the adsorption pad PAD can be appropriately considered. Therefore, the length ND2 of the bending region BA and the pad region PDA in the second direction (Y-axis direction) can be increased. On the other hand, according to the method S1 for manufacturing a display device, since the adsorption pad PAD is attached to the circuit board 300, a separate attachment tolerance for the adsorption pad PAD is not required, thereby reducing or minimizing the dead space of the display device 10.

[0207] By applying a force to the adsorption pad PAD in the third direction (Z-axis direction), the second substrate SUB2 can be bent along the bending region BA. Since the first substrate SUB1 made of a hard material is not located in the bending region BA, a relatively small force can be applied to the adsorption pad PAD to bend the second substrate SUB2. Therefore, damage to the bonding region of the circuit board 300 and the connection film 250 can be reduced or minimized.

[0208] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the present disclosure. Therefore, the disclosed preferred embodiments of the present disclosure are used only in a general and descriptive sense and not for the purpose of limitation.

Claims

1. A display device, comprising: A second substrate, comprising a soft material; A light-emitting element, above the second substrate; And A first substrate, below the second substrate, comprising a hard material, and comprising: A second sub-substrate, on one side of a bending region where the second substrate bends; and A first sub-substrate, on the other side of the bending region, below the light-emitting element, having a length 50 times to 200 times the length of the second sub-substrate, and The first substrate comprises: A first surface; A second surface, opposite to the first surface; A first side surface, between the first surface and the second surface, and adjacent to the bending region; and A first inclined surface, between the first surface and the first side surface.

2. The display device according to claim 1, wherein, The length of the second sub-substrate is 2 mm to 4 mm.

3. The display device according to claim 2, wherein, The length of the first sub-substrate is 200 mm to 400 mm.

4. The display device according to claim 1, wherein, The first substrate defines an opening between the first sub-substrate and the second sub-substrate, and Wherein, the length of the upper side of the opening is less than the length of the lower side of the opening.

5. The display device according to claim 4, wherein, The length of the second sub-substrate is 1 times to 4 times the length of the upper side of the opening.

6. The display device according to claim 5, wherein, The length of the upper side of the opening is 1.2 mm to 1.8 mm.

7. The display device according to claim 4, wherein, The length of the second sub-substrate is 1 times to 2.5 times the length of the lower side of the opening.

8. The display device according to claim 7, wherein, The length of the lower side of the opening is 1.6 mm to 2.0 mm.

9. The display device according to claim 1, wherein, The angle between the first side surface and the second surface is less than 60 degrees.

10. The display device according to claim 1, wherein The angle formed by the first inclined surface and the first surface is less than 15 degrees.

11. The display device according to claim 10, wherein, The length of the first inclined surface in the extending direction parallel to the first substrate is 120 μm or less.

12. The display device according to claim 10, wherein, The first substrate further comprises: A second side surface, between the first surface and the second surface, and adjacent to the edge of the first substrate; and A second inclined surface, between the second side surface and the second surface.

13. The display device according to claim 12, wherein, The angle formed by the second inclined surface and the second surface is different from the supplementary angle of the angle formed by the first side surface and the second surface.

14. The display device according to claim 1, wherein, The first substrate comprises glass, and wherein, the second substrate comprises a polymer resin.

15. A method for manufacturing a display device, the method comprising: Forming a first mother substrate, a second mother substrate above the first surface of the first mother substrate, and a display unit on the second mother substrate; Removing a part of the first mother substrate in the bending region by spraying an etchant onto the second surface of the first mother substrate opposite to the first surface; Irradiating a laser along the edge of the display unit on the second surface; Forming a first substrate by spraying an etchant onto the second surface without a mask and by cutting the first mother substrate; And After forming the first substrate, forming a second substrate by patterning the second mother substrate along the edge of the display unit.

16. The method according to claim 15, wherein, The first substrate comprises: A third surface; A fourth surface, opposite to the third surface; A first side surface, between the third surface and the fourth surface, and adjacent to the curved region; and A first inclined surface, between the third surface and the first side surface, and adjacent to the curved region.

17. The method according to claim 16, wherein, The first substrate further includes: A second side surface, between the third surface and the fourth surface, and adjacent to the edge of the display unit; and A second inclined surface, between the second side surface and the fourth surface, and adjacent to the edge of the display unit, wherein the supplementary angle of the angle formed by the first side surface and the fourth surface is different from the angle formed by the second inclined surface and the fourth surface.

18. The method according to claim 15, wherein, Forming the first substrate includes forming a dummy portion under the second mother substrate, and the dummy portion forms the remaining portion of the first mother substrate between the display units.

19. The method according to claim 18, wherein, Forming the second substrate includes removing the second mother substrate above the dummy portion by patterning the second mother substrate.

20. The method according to claim 15, further comprising attaching a circuit board and an adsorption pad to each of the display units, and bending the second substrate, Among them, wherein the adsorption pad is attached to the circuit board.

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