Display device and method of manufacturing same

Abstract

The present application relates to a display device and a method of manufacturing the same, the display device including a first substrate and a second substrate over the first substrate, the first substrate including: a base layer; a pixel defining layer over the base layer and defining a first opening and a second opening; a first light emitting layer; a first electrode in the first opening and including an organic light emitting material; and a second light emitting layer in the second opening and including first quantum dots, the second substrate including: a base substrate; a barrier wall under the base substrate and defining a first barrier wall opening overlapping the first opening and a second barrier wall opening overlapping the second opening; a first functional layer in the first barrier wall opening and including a polymer-based material; a moisture absorbing layer in the first barrier wall opening for absorbing moisture emanating from the polymer-based material; and a second functional layer in the second barrier wall opening and including a polymer-based material.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0005290, filed with the Korean Intellectual Property Office on January 12, 2024, the entire disclosure of which is incorporated herein by reference. Technical field

[0003] The present disclosure relates to a display device including quantum dots and a method of manufacturing the display device. Background art

[0004] Various display devices are being developed for application to multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game devices. The display device employs a so - called self - emissive display element that emits light by using a light - emitting material containing an organic compound to display an image.

[0005] In addition, light - emitting elements using quantum dots as their light - emitting materials are being developed to improve the color reproducibility of display devices. Summary of the invention

[0006] The present disclosure provides a display device including quantum dots and an organic light - emitting material as its light - emitting materials and having improved luminous efficiency and lifespan.

[0007] The present disclosure provides a method of manufacturing a display device.

[0008] Embodiments of the present disclosure provide a display device including a first substrate and a second substrate above the first substrate. The first substrate includes: a base layer; a pixel - defining layer above the base layer and defining a first opening and a second opening; a first light - emitting layer; in the first opening and including an organic light - emitting material; and a second light - emitting layer in the second opening and including first quantum dots. The second substrate includes: a base substrate; a barrier rib below the base substrate and defining a first barrier - rib opening overlapping the first opening and a second barrier - rib opening overlapping the second opening; a first functional layer in the first barrier - rib opening and including a polymer - based material; a moisture - absorbing layer in the first barrier - rib opening for absorbing moisture emitted from the polymer - based material; and a second functional layer in the second barrier - rib opening and including a polymer - based material.

[0009] The polymer - based material of the first functional layer may include methacrylic acid, polyacrylic acid, or citric acid.

[0010] The moisture - absorbing layer may be above the first functional layer and may be in direct contact with the first functional layer.

[0011] The first functional layer may have a thickness smaller than that of the second functional layer.

[0012] The sum of the thickness of the first functional layer and the thickness of the moisture absorption layer may be substantially equal to the thickness of the second functional layer.

[0013] The upper surface of the moisture absorption layer may contact the lower surface of the base substrate.

[0014] The moisture absorption layer may include a first moisture absorption layer and a second moisture absorption layer below the first moisture absorption layer, and the first functional layer is between the first moisture absorption layer and the second moisture absorption layer.

[0015] The lower surface of the first moisture absorption layer may directly contact the upper surface of the first functional layer, wherein the upper surface of the second moisture absorption layer directly contacts the lower surface of the first functional layer.

[0016] The first functional layer may be above the moisture absorption layer and may directly contact the moisture absorption layer.

[0017] The distance from the lower surface of the first functional layer to the upper surface of the first light-emitting layer may be greater than the distance from the lower surface of the second functional layer to the upper surface of the second light-emitting layer, wherein when observed in the direction from the first light-emitting layer to the first functional layer, the first functional layer is blocked by the moisture absorption layer.

[0018] The display device may further include a sealing member along the edges of the first substrate and the second substrate and defining an internal space together with the first substrate and the second substrate.

[0019] The base substrate may include a glass material, wherein the first functional layer, the moisture absorption layer, and the base substrate have light-transmitting properties.

[0020] The pixel defining layer may define a third opening, wherein the first substrate further includes a third light-emitting layer including second quantum dots in the third opening, wherein the barrier rib defines a third barrier rib opening overlapping with the third opening, and wherein the second substrate further includes a third functional layer including a polymer-based material in the third barrier rib opening.

[0021] The organic light-emitting material may emit blue light, wherein the first quantum dots emit green light, and wherein the second quantum dots emit red light.

[0022] Embodiments of the present disclosure provide a method of manufacturing a display device, the method comprising: forming a second substrate by providing a base substrate, forming a partition wall on the base substrate, etching the partition wall to form a first partition wall opening, a second partition wall opening, and a third partition wall opening, and forming a moisture absorption layer including a moisture absorption material in the first partition wall opening; forming a functional layer including a polymer-based material in the first partition wall opening, the second partition wall opening, and the third partition wall opening; forming a first substrate; and coupling the first substrate and the second substrate.

[0023] Forming the moisture absorption layer may include: providing the moisture absorption material in a liquid form to the first partition wall opening; and curing the moisture absorption material by irradiating ultraviolet light.

[0024] Forming the moisture absorption layer may include: providing the moisture absorption material in a liquid form to the first partition wall opening; forming a first moisture absorption layer by irradiating ultraviolet light; providing the moisture absorption material in a liquid form on the first moisture absorption layer; and forming a second moisture absorption layer by irradiating ultraviolet light.

[0025] Forming the functional layer may be performed between forming the first moisture absorption layer and forming the second moisture absorption layer.

[0026] Forming the functional layer may be performed by an inkjet process or a photoresist process.

[0027] The first substrate may include a base layer, a pixel defining layer above the base layer and defining a first opening, a second opening, and a third opening, a first light emitting layer in the first opening and including an organic light emitting material, a second light emitting layer in the second opening and including a first quantum dot, and a third light emitting layer in the third opening and including a second quantum dot, wherein coupling the first substrate and the second substrate includes aligning the first opening, the second opening, and the third opening to overlap with the first partition wall opening, the second partition wall opening, and the third partition wall opening, respectively.

[0028] According to the above, the efficiency and lifespan of the light emitting layer of the display device are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] When considered in conjunction with the drawings, the above and other aspects of the present disclosure will become readily apparent by reference to the following detailed description, in which:

[0030] Figure 1 is a perspective view of a display device according to one or more embodiments of the present disclosure;

[0031] Figure 2 is a cross-sectional view of a display device according to one or more embodiments of the present disclosure;

[0032] Figure 3A cross-sectional view of a light-emitting element included in a display device according to one or more embodiments of the present disclosure;

[0033] Figure 4 A cross-sectional view of quantum dots included in a display device according to one or more embodiments of the present disclosure;

[0034] Figure 5 is along Figure 1 A cross-sectional view of the display device taken along line I-I';

[0035] Figure 6 is along Figure 1 A cross-sectional view of the display device taken along line I-I';

[0036] Figure 7 is along Figure 1 A cross-sectional view of the display device taken along line I-I';

[0037] Figures 8A to 8H A cross-sectional view showing a method of manufacturing a display device according to one or more embodiments of the present disclosure;

[0038] Figure 9A and Figure 9B A cross-sectional view showing a method of manufacturing a display device according to one or more embodiments of the present disclosure; and

[0039] Figures 10A to 10C A cross-sectional view showing a method of manufacturing a display device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] Aspects of some embodiments of the present disclosure and methods of implementing them can be more easily understood by referring to the detailed description of the embodiments and the drawings. The described embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the aspects of the present disclosure to those skilled in the art. Accordingly, processes, elements, and techniques that are redundant, not relevant to the description of the embodiments, or unnecessary for those skilled in the art to fully understand the aspects of the present disclosure may be omitted. Unless otherwise noted, like reference numerals, characters, or combinations thereof represent like elements throughout the drawings and the written description, and thus, their repeated description may be omitted.

[0041] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as limited to the embodiments shown herein. The use of "can", "may", or "may not" in describing the embodiments corresponds to one or more embodiments of the present disclosure.

[0042] In view of the entirety of the present disclosure, those of ordinary skill in the art will understand that the present disclosure encompasses all modifications, equivalents, and substitutions within the spirit and scope of the present disclosure. Each of the features of the embodiments of the present disclosure can be combined partially or wholly with each other, and various interlocks and operations are technically possible, and each embodiment can be implemented independently of each other or can be implemented in association with each other, unless otherwise stated or implied.

[0043] In the drawings, for clarity and / or descriptive purposes, the relative dimensions of elements, layers, and regions may be exaggerated. Additionally, the use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, dimension, ratio, commonality between the elements shown, and / or any other characteristic, attribute, property, etc. of the elements.

[0044] Various embodiments are described herein with reference to cross-sectional views that are schematic illustrations of embodiments and / or intermediate structures. Accordingly, variations in the shape of the illustrations due to, for example, manufacturing techniques and / or tolerances should be expected. Additionally, the specific structural or functional descriptions disclosed herein are merely illustrative for the purpose of describing embodiments in accordance with the concepts of the present disclosure. Thus, the embodiments disclosed herein should not be construed as limited to the shapes of the elements, layers, or regions shown, but should include deviations in shape caused by, for example, manufacturing.

[0045] For example, an implantation region shown as rectangular will typically have rounded or curved features at its edges and / or a gradient of implantation concentration, rather than a binary change from the implantation region to the non-implantation region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation occurs.

[0046] For ease of explanation, spatial relative terms such as "below", "beneath", "under", "lower side", "underneath", "above", "on", "upper side", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to another element or feature. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, the element described as "below", "beneath" or "underneath" another element or feature will then be oriented "above" the other element or feature. Thus, the exemplary terms "below" and "beneath" can encompass both an upper and a lower orientation. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein should be interpreted accordingly. Similarly, when a first part is described as being disposed "on" a second part, this means that the first part is disposed at the upper side or the lower side of the second part, and is not limited to the upper side based on the direction of gravity.

[0047] In addition, the phrase "in a plan view" means when the object part is viewed from above, and the phrase "in a schematic cross-sectional view" means when a schematic cross-sectional view obtained by vertically cutting the object part is viewed from the side. The term "overlap" or "overlapped" means that the first object can be above or below, or on one side of, the second object, and vice versa. Additionally, the term "overlap" may include stacking, facing or facing, extending over, covering or partially covering, or any other suitable term as would be appreciated and understood by those of ordinary skill in the art. The expression "not overlap" may include meanings such as "spaced apart from", "separated from", "offset from", and any other suitable equivalents as would be appreciated and understood by those of ordinary skill in the art. The terms "face" and "facing" may mean that the first object can be directly or indirectly opposite the second object. In the case where a third object is between the first object and the second object, the first object and the second object may be understood to be indirectly opposite each other, but still face each other.

[0048] It will be understood that when an element, layer, region or component is referred to as being "formed on", "on", "connected to" or "(operatively or communicatively) coupled to" another element, layer, region or component, it can be directly formed on, directly on, directly connected to or directly coupled to the other element, layer, region or component, or can be indirectly formed on, indirectly on, indirectly connected to or indirectly coupled to the other element, layer, region or component, such that one or more intervening elements, layers, regions or components can exist. Further, this can collectively mean direct or indirect coupling or connection and integral or non-integral coupling or connection. For example, when a layer, region or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region or component, it can be directly electrically connected or directly electrically coupled to the other layer, region and / or component, or one or more intervening layers, regions or components can exist. One or more intervening components can include switches, resistors, capacitors, etc. When describing an embodiment, unless explicitly described as a direct connection, the expression of connection indicates an electrical connection, and "direct connection / direct coupling" or "directly on" means that one component is directly connected or directly coupled to another component or directly on another component without an intermediate component.

[0049] Further, in the present specification, when a part of a layer, film, region, plate, etc. is formed on another part, the forming direction is not limited to the upward direction, but includes forming the part on a side surface or in a downward direction. Conversely, when a part of a layer, film, region, plate, etc. is formed "under" another part, this includes not only the case where the part is "directly under" the other part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components such as "between", "directly between" or "adjacent to" and "directly adjacent to" can be similarly interpreted. It will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers can also exist.

[0050] For the purposes of this disclosure, when expressions such as "at least one of," "any one of," or "one or more of" are placed after a list of elements, they modify the entire list of elements and not individual elements within the list. For example, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted to mean only X, only Y, only Z, any combination of two or more of X, Y, and Z (such as, for example, XYZ, XY, YZ, and XZ), or any variation thereof. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or," and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, when expressions such as "at least one of," "a plurality of," "one of," and other prepositional phrases are placed before / after a list of elements, they modify the entire list of elements and not individual elements within the list.

[0051] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms do not correspond to a particular order, position, or preference, and are only used to distinguish one element, member, component, region, zone, layer, section, or part from another element, member, component, region, zone, layer, section, or part. Thus, without departing from the spirit and scope of this disclosure, the first element, first component, first region, first layer, or first section described below may be referred to as a second element, second component, second region, second layer, or second section. Describing an element as a "first" element does not require or imply the existence of a second element or other elements. The terms "first," "second," etc. may also be used herein to distinguish between different categories or groups of elements. For the sake of brevity, the terms "first," "second," etc. may represent "first category (or first group)," "second category (or second group)," etc., respectively.

[0052] In an example, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. This also applies to the first direction, second direction, and / or third direction.

[0053] The terms used herein are for the purpose of describing embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are intended to include the plural forms as well, and the plural forms are also intended to include the singular form, unless the context clearly indicates otherwise. It will also be understood that when used in this specification, the terms "comprises," "comprising," "has," "having," "includes," and "including" specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0054] When one or more embodiments can be implemented differently, a specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously, or in an order opposite to the described order.

[0055] As used herein, the terms "substantially," "about," "approximate," and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art. For example, "substantially" can include a range of + / - 5% of the corresponding value. Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximate" as used herein includes the stated value and means within an acceptable deviation of the particular value determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within + / - 30%, + / - 20%, + / - 10%, + / - 5% of the stated value. In addition, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure."

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the relevant art and / or the context of this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0057] Figure 1 is a perspective view of a display device DD according to one or more embodiments of the present disclosure, and Figure 2 is a cross-sectional view of a display device DD according to one or more embodiments of the present disclosure.

[0058] Figure 1The first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 are shown in the accompanying drawings, and the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be related to each other and may be changed to other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be respectively referred to as the first direction, the second direction, and the third direction, and may be given the same reference numerals as those of the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 in the accompanying drawings. In the present disclosure, the first direction axis DR1 may be substantially perpendicular to the second direction axis DR2, and the third direction axis DR3 may be a normal direction with respect to the plane defined by the first direction axis DR1 and the second direction axis DR2. In the present disclosure, the term "plane" refers to the plane defined by the first direction axis DR1 and the second direction axis DR2, and the term "section" refers to a plane that is substantially perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2 and is substantially parallel to the third direction axis DR3. The thickness direction of the display device DD may indicate a direction that is substantially parallel to the third direction DR3, that is, a normal direction with respect to the plane defined by the first direction DR1 and the second direction DR2.

[0059] The display device DD may be activated in response to an electrical signal. The display device DD may be applied to large electronic products such as televisions, monitors, outdoor billboards, etc. In addition, the display device DD may be applied to medium and small electronic products such as personal computers, notebook computers, personal digital assistants, car navigation units, game units, smart phones, tablet computers, cameras, etc. However, these are merely examples, and the display device DD may be applied to other electronic devices as long as they do not deviate from the concept of the present disclosure.

[0060] The display device DD may display an image through the display surface DD-IS. The display device DD may include a light-emitting region PXA and a non-light-emitting region NPXA. The display surface DD-IS may be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The display surface DD-IS may include a display region DA and a non-display region NDA. The light-emitting region PXA may be defined in the display region DA. The light-emitting region PXA may be referred to as a pixel region.

[0061] The light-emitting region PXA may be arranged in a stripe pattern in the display device DD. Refer to Figure 1 , the light-emitting region PXA may be arranged on the first direction axis DR1 and the second direction axis DR2. However, the present disclosure should not be limited to this or be restricted thereby, and the light-emitting region PXA may be arranged in a pentile arrangement or arranged in a diamond (Diamond ) arrangement ( and Diamond are registered trademarks of Samsung Display Co., Ltd. of Korea).

[0062] In Figure 1 , the light-emitting region PXA is shown to have a similar size, but this is merely an example. According to one or more embodiments, the light-emitting region PXA may have different sizes according to the wavelength of the light emitted therefrom.

[0063] The non-display region NDA may be defined along the edge of the display surface DD-IS. The non-display region NDA may surround the display region DA. However, the present disclosure should not be limited to this or thereby restricted, the non-display region NDA may be omitted, or the non-display region NDA may be located only at one side of the display region DA.

[0064] Figure 1 A display device DD including a flat display surface DD-IS is shown, but it should not be limited to this or thereby restricted. The display device DD may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display regions facing different directions from each other.

[0065] In the present disclosure, the upper surface (or front surface) and the lower surface (or rear surface) of each component of the display device DD may be defined with respect to the third direction DR3. More specifically, between two surfaces of a component facing each other with respect to the third direction DR3, the surface relatively closer to the display surface DD-IS may be defined as the front surface (or upper surface), and the other surface relatively farther from the display surface DD-IS may be defined as the rear surface (or lower surface). In addition, in the following description, the upper part (or upper side) and the lower part (or lower side) may be defined with respect to the third direction DR3, the upper part (or upper side) may refer to the part (or side) in the direction approaching the display surface DD-IS, and the lower part (or lower side) may refer to the part (or side) in the direction away from the display surface DD-IS.

[0066] In the present disclosure, when an element is referred to as being "directly located / formed" on another element, there is no intervening element therebetween. For example, the term "directly located / formed" may mean that two elements are in contact with each other.

[0067] Reference Figure 2 , the display device DD may include a first substrate DP, a second substrate PP located on the first substrate DP, and a sealing member SL located between the first substrate DP and the second substrate PP (as used herein, "located on..." may mean "above").

[0068] The first substrate DP may be a display panel that generally generates an image. The first substrate DP of the display device DD may be a light-emitting display panel. The first substrate DP may include an inorganic light-emitting element containing an inorganic light-emitting material such as a quantum dot and an organic light-emitting element containing an organic light-emitting material.

[0069] The first substrate DP may include a base layer BS, a circuit element layer DP-CL located on the base layer BS, and a display element layer DP-OL located on the circuit element layer DP-CL. The display element layer DP-OL may include a light-emitting element ED (refer to Figure 3 ), and the components of the light-emitting element ED will be described later with reference to Figure 3 .

[0070] The second substrate PP may be located above the first substrate DP. The second substrate PP may cover the first substrate DP to reduce or prevent foreign substances, moisture, or oxygen from entering the first substrate DP. The second substrate PP may include an optically transparent portion. Thus, the light emitted from the first substrate DP can be perceived by a user viewing the upper surface of the second substrate PP after passing through the second substrate PP.

[0071] The second substrate PP may include a base substrate BL and an auxiliary layer FL located on the lower portion of the base substrate BL. The base substrate BL may provide a base surface on which the auxiliary layer FL is positioned. The auxiliary layer FL may provide functional materials to increase the lifespan of the display element layer DP-OL.

[0072] The sealing member SL may be located between the first substrate DP and the second substrate PP. The sealing member SL may be positioned along the edges of each of the first substrate DP and the second substrate PP, and may define an internal space SP together with the first substrate DP and the second substrate PP. The internal space SP may be filled with nitrogen (N2) gas.

[0073] A part of the material released from the second substrate PP may reach the first substrate DP through the internal space SP. As an example, the moisture emitted from the polymer-based materials included in the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 (refer to Figure 5 ) may enter the first substrate DP in the form of a gas or a liquid through the internal space SP. The moisture may react with the light-emitting element ED of the display element layer DP-OL (refer to Figure 3 ), and may affect the lifespan of the light-emitting element ED. This will be described in detail with reference to Figure 3 and Figure 5 .

[0074] Figure 3 is a cross-sectional view of the light-emitting element ED included in the display device DD according to one or more embodiments of the present disclosure.

[0075] The light-emitting device ED may include a first electrode AE, a hole transport region HTR, a light-emitting layer EML, an electron transport region ETR, and a second electrode CE. The light-emitting device ED may further include a capping layer CPL located on the second electrode CE (refer to Figure 5 ).

[0076] The first electrode AE may have conductivity. The first electrode AE may be an anode or a cathode. In addition, the first electrode AE may be a pixel electrode, but the present disclosure should not be limited to this or restricted thereby.

[0077] The first electrode AE may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. The first electrode AE may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a combination of compounds of two or more metal materials selected from the above materials, a combination of mixtures of two or more materials selected from the above materials, or oxides of the above metal materials.

[0078] When the first electrode AE is a transmissive electrode, the first electrode AE may include a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.). When the first electrode AE is a semi-transmissive electrode or a reflective electrode, the first electrode AE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a stacked structure of LiF and Ca), LiF / Al (a stacked structure of LiF and Al), Mo, Ti, W, their compounds, or their mixtures (e.g., a mixture of Ag and Mg). According to one or more embodiments, the first electrode AE may have a multilayer structure including a reflective layer or a semi-transmissive layer formed of the above materials and a transparent conductive layer formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). As an example, the first electrode AE may have a three-layer structure of ITO / Ag / ITO, but the present disclosure should not be limited to this or restricted thereby. As an example, the first electrode AE may include the above metal materials, a combination of two or more metal materials selected from the above metal materials, or oxides of the above metal materials. The first electrode AE may have a thickness of about to about . As an example, the thickness of the first electrode AE may be in the range of about to about .

[0079] The second electrode CE may be located on the first electrode AE. The second electrode CE may be a cathode or an anode. As an example, when the first electrode AE is an anode, the second electrode CE may be a cathode, and when the first electrode AE is a cathode, the second electrode CE may be an anode. The second electrode CE may be a common electrode. However, the present disclosure should not be limited to this or be restricted thereby.

[0080] The second electrode CE may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a combination of compounds of two or more metal materials selected from the above materials, a combination of mixtures of two or more materials selected from the above materials, or oxides of the above metal materials.

[0081] The second electrode CE may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. In the case where the second electrode CE is a transmissive electrode, the second electrode CE may include a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.).

[0082] In the case where the second electrode CE is a semi-transmissive electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, their compounds, or their mixtures (e.g., AgMg, AgYb, or MgYb). The second electrode CE may have a multilayer structure including a reflective layer or a semi-transmissive layer formed of the above materials and a transparent conductive layer formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). As an example, each of the lower electrodes may have a three-layer structure of ITO / Ag / ITO. As an example, the second electrode CE may include the above metal materials, a combination of two or more metal materials selected from the above metal materials, or oxides of the above metal materials.

[0083] In one or more embodiments, the second electrode CE may be connected to an auxiliary electrode. When the second electrode CE is connected to the auxiliary electrode, the resistance of the second electrode CE can be reduced.

[0084] The electron transport region ETR may be located between the light-emitting layer EML and the second electrode CE.

[0085] The electron transport region ETR may have a single-layer structure of a single material, a single-layer structure of multiple different materials, or a multi-layer structure including multiple layers of materials different from each other. As an example, the electron transport region ETR may have a single-layer structure of an electron injection layer EIL or an electron transport layer ETL, or may have a single-layer structure of an electron injection material and an electron transport material. The electron transport region ETR may have a thickness of about 20 nm to about 150 nm.

[0086] The electron transport region ETR may further include zinc oxide. The type of zinc oxide should not be particularly limited, and for example, the electron transport region ETR may include ZnO, ZnMgO, or a combination thereof, and may include zinc oxide ZnO doped with Li instead of zinc oxide ZnO doped with Mg, however, the present disclosure should not be limited thereto or thereby. As an example, the electron injection layer EIL may include zinc oxide, or two or more of the layers included in the electron transport region ETR may include zinc oxide.

[0087] When the electron transport region ETR includes zinc oxide, defects may occur where oxygen vacancies appear on the surface of the zinc oxide. When trap states occur through the defects, charges may be trapped and quenched, and thus, the luminous efficiency and lifespan of the device may be reduced. However, since the light-emitting element ED according to the present disclosure includes a functional layer FS containing a polymer-based material (refer to Figure 5 ), oxygen vacancies can be reduced or prevented. This will be described in detail later with reference to Figure 5 Detailed description.

[0088] The hole transport region HTR may be located between the first electrode AE and the light-emitting layer EML.

[0089] The hole transport region HTR may have a single-layer structure of a single material, a single-layer structure of multiple different materials, or a multi-layer structure including multiple layers of materials different from each other. In one or more embodiments, the hole transport region HTR may have a single-layer structure of multiple different materials, or may have a structure of a hole injection layer HIL / hole transport layer HTL or a hole injection layer HIL / hole transport layer HTL / hole buffer layer stacked in sequence from the first electrode AE. However, the present disclosure should not be limited thereto or thereby.

[0090] In each of the light-emitting elements ED, the hole transport region HTR, the light-emitting layer EML, and the electron transport region ETR may be located in the openings OH1, OH2, and OH3 of the pixel defining layer PDL (refer to Figure 5 ), (refer to Figure 5) and can be separated from the hole transport region HTR, the light emitting layer EML, and the electron transport region ETR of the adjacent light emitting region PXA. That is, the hole transport region HTR, the light emitting layer EML, and the electron transport region ETR can be located in each of the openings OH1, OH2, and OH3.

[0091] According to the display device DD, the hole transport region HTR, the light emitting layer EML, and the electron transport region ETR of each light emitting element ED can be formed by an inkjet printing method, but the present disclosure should not be limited to this or restricted thereby. The hole transport region HTR, the light emitting layer EML, and the electron transport region ETR can be formed by methods other than the inkjet printing method. Further, according to one or more embodiments, at least a part of the hole transport region HTR or at least a part of the electron transport region ETR can extend to the upper part of the pixel defining layer PDL and can be located on the upper part of the pixel defining layer PDL, or can be connected to a part of the hole transport region HTR located at an adjacent light emitting element ED or connected to a part of the electron transport region ETR located at an adjacent light emitting element ED.

[0092] According to the display device DD, the second electrode CE and the capping layer CPL (refer to Figure 5 ) can be commonly disposed on each of the first light emitting element ED-B, the second light emitting element ED-G, and the third light emitting element ED-R (refer to Figure 5 ), but the present disclosure should not be limited to this or restricted thereby. According to one or more embodiments, at least one of the second electrode CE and the capping layer CPL can be disposed to be separated from each other in the adjacent light emitting regions PXA-B, PXA-G, PXA-R (refer to Figure 5 ).

[0093] The description of the light emitting element ED can be applied to the first light emitting element ED-B, the second light emitting element ED-G, and the third light emitting element ED-R (refer to Figure 5 ). In the display device DD, at least one of the first light emitting element ED-B, the second light emitting element ED-G, and the third light emitting element ED-R can be an inorganic light emitting element in which the light emitting layer includes an inorganic light emitting substance, and the others of the first light emitting element ED-B, the second light emitting element ED-G, and the third light emitting element ED-R can be organic light emitting elements in which the light emitting layer includes an organic light emitting substance. As an example, in the display device DD shown in Figure 5 , the first light emitting element ED-B can be an organic light emitting element, and the second light emitting element ED-G and the third light emitting element ED-R can be inorganic light emitting elements.

[0094] The light emitting element ED can further include a capping layer CPL located on the second electrode CE (refer to Figure 5)。The capping layer CPL can have a single-layer or multi-layer structure. The capping layer CPL can be an organic layer or an inorganic layer.

[0095] Figure 4 is a cross-sectional view of quantum dots QD included in a display device according to one or more embodiments of the present disclosure.

[0096] Reference Figure 4 , the quantum dots QD can include a core CR and at least one shell SH surrounding the core CR.

[0097] The quantum dots QD can include II-VI group compounds, III-V group compounds, III-VI group compounds, I-III-VI group compounds, IV-VI group compounds, group IV elements, group IV compounds, or any combination thereof.

[0098] The II-VI group compounds can be selected from binary compounds, ternary compounds, or quaternary compounds. The binary compounds are selected from the group consisting of CdSe, CdTe, CdS, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and mixtures thereof. The ternary compounds are selected from the group consisting of CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and mixtures thereof. The quaternary compounds are selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and mixtures thereof.

[0099] The III-VI group compounds can include binary compounds such as In2S3, In2Se3, etc., ternary compounds such as InGaS3, InGaSe3, etc., or any combination thereof.

[0100] The I-III-VI group compounds can be selected from ternary compounds or quaternary compounds. The ternary compounds are selected from the group consisting of AgInS, AgInS2, CuInS, CuInS2, AgGaS2, CuGaS2, CuGaO2, AgGaO2, AgAlO2, and mixtures thereof. The quaternary compounds are selected from the group consisting of AgInGaS2 and CuInGaS2.

[0101] The III-V compounds can be selected from binary compounds, ternary compounds, and quaternary compounds. The binary compounds are selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof. The ternary compounds are selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InAlP, InNP, InNAs, InNSb, InPAs, InPSb, GaAlNP, and mixtures thereof. The quaternary compounds are selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and mixtures thereof. The III-V compounds may further include group II metals. For example, InZnP can be selected as the III-II-V compound.

[0102] The IV-VI compounds can be selected from binary compounds, ternary compounds, and quaternary compounds. The binary compounds are selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe, and mixtures thereof. The ternary compounds are selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof. The quaternary compounds are selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof. The group IV elements can be selected from the group consisting of Si, Ge, and mixtures thereof. The group IV compounds can be binary compounds selected from the group consisting of SiC, SiGe, and mixtures thereof.

[0103] In this case, the binary, ternary, or quaternary compounds can be present in the particles at a uniform concentration, or can be present in the same particle after being divided into multiple parts with different concentrations.

[0104] The interface between the core CR and the shell SH can have a concentration gradient in which the concentration of the elements present in the shell SH decreases as the distance from the center decreases.

[0105] The quantum dot QD may have a core-shell structure, which includes a core CR containing the above-mentioned nanocrystals and a shell SH surrounding the core CR. The shell SH of the quantum dot QD can be used as a protective layer to reduce or prevent chemical modification of the core CR and maintain semiconductor properties, and / or can be used as a charge layer to endow the quantum dot QD with electrophoretic properties. The shell SH may have a single-layer or multi-layer structure. The shell SH of the quantum dot QD may include metal oxides, non-metal oxides, semiconductor compounds, or a combination thereof as examples.

[0106] The metal oxide or non-metal oxide may include binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, and NiO, or ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, and CoMn2O4, but they should not be limited to or restricted by this.

[0107] In addition, the semiconductor compound may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, but they should not be limited to or restricted by this.

[0108] The quantum dot QD may have a full width at half maximum (FWHM) of the light emission wavelength spectrum of about 45 nm or less, about 40 nm or less, or about 30 nm or less. The color purity and color reproducibility can be improved within this range. In addition, since the light emitted by the quantum dot QD can be emitted in all directions, the optical viewing angle can be improved.

[0109] In addition, the quantum dot QD may have a shape commonly used in the art, but should not be particularly limited. More specifically, spherical, pyramidal, multi-armed, or cubic nanoparticles, nanotubes, nanowires, nanofibers, nanosheets, etc. can be applied to the quantum dot QD.

[0110] Quantum dots QD can control the color of the emitted light according to their particle sizes, and thus, quantum dots QD can have various emission colors such as blue, red, and green. As the size of quantum dots QD decreases, quantum dots QD can emit light in a shorter wavelength region. As an example, among quantum dots QD having the same core CR, the particle size of quantum dots QD emitting green light can be smaller than that of quantum dots QD emitting red light. In addition, among quantum dots QD having the same core CR, the particle size of quantum dots QD emitting blue light can be smaller than that of quantum dots QD emitting green light, but the present disclosure should not be limited to this or restricted thereby. According to one or more embodiments, even among quantum dots QD having the same core CR, the particle size of the quantum dots can be adjusted according to the material of the shell SH and according to the thickness of the shell SH.

[0111] Meanwhile, when quantum dots QD have various emission colors such as blue, red, and green, the cores CR of quantum dots QD having different emission colors can include different materials from each other.

[0112] Quantum dots QD can also include ligands LG placed outside the shell SH of quantum dots QD. Ligands LG can be placed on the surface of the shell SH of quantum dots QD. Ligands LG can increase the dispersibility of quantum dots QD, but this is merely an example. According to one or more embodiments, quantum dots QD can have a structure in which ligands LG are not placed on the surface of quantum dots QD.

[0113] Figure 5 is a cross-sectional view of a display device DD taken along the line I-I'. Figure 1

[0114] Referring to Figure 5 , the display device DD can include a first substrate DP, a second substrate PP located above the first substrate DP, and an internal space SP between the first substrate DP and the second substrate PP.

[0115] The first substrate DP can include a base layer BS, a circuit element layer DP-CL located on the base layer BS, and a display element layer DP-OL located on the circuit element layer DP-CL.

[0116] The base layer BS can provide a base surface on which other components are positioned. The base layer BS can be a glass substrate, a metal substrate, or a plastic substrate, but it should not be limited to this or restricted thereby. According to one or more embodiments, the base layer BS can include an inorganic layer, an organic layer, or a composite material layer.

[0117] The circuit element layer DP-CL can be located on the base layer BS. In one or more embodiments, the circuit element layer DP-CL can include an insulating layer and transistors. The insulating layer can have a stacked structure. Each of the transistors can include a control electrode, an input electrode, and an output electrode. As an example, the circuit element layer DP-CL can include switching transistors and driving transistors to drive the light-emitting elements ED-B, ED-G, and ED-R of the display element layer DP-OL.

[0118] The display element layer DP-OL can be located on the circuit element layer DP-CL. The display element layer DP-OL can include a first light-emitting element ED-B, a second light-emitting element ED-G, a third light-emitting element ED-R, and a pixel defining layer PDL.

[0119] Each of the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R can include a first electrode AE, a hole transport region HTR, light-emitting layers EL-B, EL-G, and EL-R, an electron transport region ETR, and a second electrode CE.

[0120] The first electrode AE can be located on the circuit element layer DP-CL. The first electrode AE can be exposed through the openings OH1, OH2, and OH3 of the pixel defining layer PDL.

[0121] The pixel defining layer PDL can be located on the circuit element layer DP-CL and can cover a part of the first electrode AE. The pixel defining layer PDL can be formed of a polymer resin. As an example, the pixel defining layer PDL can include a polyacrylate-based resin or a polyimide-based resin. In addition, in addition to the polymer resin, the pixel defining layer PDL can also include an inorganic material. At the same time, the pixel defining layer PDL can include a light absorption material, or can include a black pigment or dye. When forming the pixel defining layer PDL, carbon black can be used as the black pigment or dye, but the present disclosure should not be limited.

[0122] The first opening OH1, the second opening OH2, and the third opening OH3 can be defined by the pixel defining layer PDL. The first opening OH1, the second opening OH2, and the third opening OH3 can penetrate the pixel defining layer PDL in the direction from the upper surface to the lower surface of the pixel defining layer PDL. At least a part of the first electrode AE can be exposed through the first opening OH1, the second opening OH2, and the third opening OH3.

[0123] The second electrode CE can be located on the first electrode AE. When the first electrode AE is an anode, the second electrode CE can be a cathode, and when the first electrode AE is a cathode, the second electrode CE can be an anode.

[0124] The first light-emitting layer EL-B, the second light-emitting layer EL-G, and the third light-emitting layer EL-R may be respectively located in the first opening OH1, the second opening OH2, and the third opening OH3. Each of the first light-emitting layer EL-B, the second light-emitting layer EL-G, and the third light-emitting layer EL-R may be located between the first electrode AE and the second electrode CE.

[0125] The first light-emitting layer EL-B may include an organic light-emitting material, and each of the second light-emitting layer EL-G and the third light-emitting layer EL-R may include quantum dots as an inorganic light-emitting material. As an example, the first light-emitting layer EL-B may include a blue organic light-emitting material that emits blue light, the second light-emitting layer EL-G may include a first quantum dot QD-G that emits green light, and the third light-emitting layer EL-R may include a second quantum dot QD-R that emits red light.

[0126] The organic light-emitting material included in the first light-emitting layer EL-B may include a host material and a dopant material. The organic light-emitting material of the first light-emitting layer EL-B may include a blue light-emitting dopant. When the first light-emitting layer EL-B includes a blue organic light-emitting material having excellent lifetime characteristics compared to blue quantum dots, the first light-emitting layer EL-B may have excellent luminous efficiency and lifetime characteristics. However, when moisture enters the first light-emitting layer EL-B, the lifetime of the first light-emitting layer EL-B including the organic light-emitting material may be reduced.

[0127] The first quantum dot QD-G included in the second light-emitting layer EL-G may be a green light-emitting quantum dot. The second quantum dot QD-R included in the third light-emitting layer EL-R may be a red light-emitting quantum dot. Reference Figure 4 The description of the quantum dot QD may be applied to each of the first quantum dot QD-G and the second quantum dot QD-R, and thus, the details thereof will not be repeated.

[0128] The hole transport region HTR may be located between the first electrode AE and the light-emitting layers EL-B, EL-R, and EL-G, and the electron transport region ETR may be located between the second electrode CE and the light-emitting layers EL-B, EL-R, and EL-G. Reference Figure 3 The description of the hole transport region HTR and the electron transport region ETR may be applied to the hole transport region HTR and the electron transport region ETR, and thus, the details thereof will not be repeated.

[0129] The hole transport regions HTR, light-emitting layers EL-B, EL-R, or EL-G, and electron transport regions ETR of the first light-emitting element ED-B, second light-emitting element ED-G, and third light-emitting element ED-R may be respectively located in each of the openings OH1, OH2, and OH3, and may be separated from the hole transport regions HTR, light-emitting layers EL-B, EL-R, or EL-G, and electron transport regions ETR of the adjacent light-emitting region PXA. That is, the hole transport regions HTR, light-emitting layers EL-B, EL-R, and EL-G, and electron transport regions ETR may be located in the openings OH1, OH2, and OH3 after patterning.

[0130] The hole transport regions HTR, light-emitting layers EL-B, EL-R, and EL-G, and electron transport regions ETR may be formed by an inkjet printing method, but the present disclosure should not be limited to or restricted by this. According to one or more embodiments, the hole transport regions HTR, light-emitting layers EL-B, EL-R, and EL-G, and electron transport regions ETR may be formed by a method other than the inkjet printing method. In one or more embodiments, at least a part of the hole transport region HTR or a part of the electron transport region ETR may extend to an upper portion of the pixel defining layer PDL located at the adjacent light-emitting element ED, a part of the hole transport region HTR, and / or a part of the electron transport region ETR, and may be located on an upper portion of the pixel defining layer PDL located at the adjacent light-emitting element ED, a part of the hole transport region HTR, and / or a part of the electron transport region ETR.

[0131] The display area DA may include a first light-emitting region PXA-B, a second light-emitting region PXA-G, a third light-emitting region PXA-R, and a non-light-emitting region NPXA. Refer to Figure 1 The description of the light-emitting region PXA may be applied to the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R, and thus, the details thereof will not be repeated.

[0132] The first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R may be respectively defined as regions where the first electrode AE is exposed through the first opening OH1, the second opening OH2, and the third opening OH3. That is, the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R may be distinguished from each other by the pixel defining layer PDL. The first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R may be regions from which light generated by the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R is emitted, respectively. When observed in a plane, the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R may be spaced apart from each other.

[0133] According to the colors of the light emitted from the light-emitting elements ED-B, ED-G, and ED-R, the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R can be distinguished from each other. In the display device DD according to the present disclosure, the first light-emitting region PXA-B may be a blue light-emitting region, the second light-emitting region PXA-G may be a green light-emitting region, and the third light-emitting region PXA-R may be a red light-emitting region.

[0134] According to the colors of the light emitted from the light-emitting layers EL-B, EL-G, and EL-R of the light-emitting elements ED-B, ED-G, and ED-R, the light-emitting regions PXA-B, PXA-G, and PXA-R may have different sizes. As an example, in the display device DD, the first light-emitting region PXA-B corresponding to the first light-emitting element ED-B for emitting blue light may have the largest size, and the second light-emitting region PXA-G corresponding to the second light-emitting element ED-G for emitting green light may have the smallest size, but the present disclosure should not be limited to this or restricted thereby. According to one or more embodiments, the light-emitting regions PXA-B, PXA-G, and PXA-R may have a size ratio different from the size ratio of the light-emitting regions PXA-B, PXA-G, and PXA-R shown in Figure 5 the size ratio of the light-emitting regions PXA-B, PXA-G, and PXA-R shown in

[0135] The non-light-emitting region NPXA may be defined as the region in the display region DA (refer to Figure 1 ) other than the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R. The non-light-emitting region NPXA may be defined between the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R adjacent to each other, and may correspond to the pixel defining layer PDL. The non-light-emitting region NPXA may define the boundaries between the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R. The non-light-emitting region NPXA may surround the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R.

[0136] The second substrate PP may include a base substrate BL and an auxiliary layer FL located on the lower portion of the base substrate BL.

[0137] The base substrate BL can provide a base surface on which the auxiliary layer FL is positioned. The base substrate BL can have a light-transmissive property. Thus, the light emitted from the first substrate DP can be observed by the user after passing through the second substrate PP. As an example, the base substrate BL can be an optically transparent glass substrate, but the present disclosure should not be limited to this or restricted thereby. According to one or more embodiments, the base substrate BL can be a plastic substrate, a metal substrate, or a composite material substrate.

[0138] The auxiliary layer FL can be located on the lower portion of the base substrate BL. The auxiliary layer FL can include a barrier wall BK, a functional layer FS, and a moisture absorption layer DH.

[0139] The barrier wall BK can include a polymer resin and a liquid-repellent additive. The barrier wall BK can include a light-absorbing material or a pigment or dye. As an example, the barrier wall BK can include a black pigment or a black dye to achieve a black barrier wall. The barrier wall BK can include carbon black, but the present disclosure should not be limited thereto.

[0140] The first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3 can be defined by the barrier wall BK to penetrate the barrier wall BK along a direction from the upper surface of the barrier wall BK toward the lower surface. The first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3 can respectively overlap with the first opening OH1, the second opening OH2, and the third opening OH3. Thus, the first light-emitting region PXA-B, the second light-emitting region PXA-G, and the third light-emitting region PXA-R can respectively overlap with the first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3.

[0141] The functional layer FS can include a first functional layer FS1, a second functional layer FS2, and a third functional layer FS3. The first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 can be respectively located in the first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3.

[0142] The moisture absorption layer DH can be located in the first barrier wall opening BH1. The moisture absorption layer DH can contact the functional layer FS. The moisture absorption layer DH can absorb the moisture discharged from the polymer-based material of the functional layer FS.

[0143] The sum of the thickness TH1 of the first functional layer FS1 and the thickness RH of the moisture absorption layer DH can be the same as each of the thickness TH2 of the second functional layer FS2 and the thickness TH3 of the third functional layer FS3. Thus, the thickness TH1 of the first functional layer FS1 can be less than the thickness TH2 of the second functional layer, but the present disclosure should not be limited to this or restricted thereby.

[0144] The first distance DS1 from the upper surface of the first light-emitting layer EL-B included in the first light-emitting element ED-B to the lower surface of the first functional layer FS1 may be substantially the same as the second distance DS2 from the upper surface of the second light-emitting layer EL-G included in the second light-emitting element ED-G to the lower surface of the second functional layer FS2. However, the present disclosure should not be limited to this or be restricted thereby, and the first distance DS1 may be different from the second distance DS2.

[0145] The first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may include a polymer-based material. For example, the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may include an acid polymer-based material. As an example, the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may include methacrylic acid, polyacrylic acid, or citric acid.

[0146] The polymer-based materials included in the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may emit moisture when exposed to ultraviolet light or when affected by thermal conditions. The emitted moisture may reach the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R after passing through the internal space SP.

[0147] Each of the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may be closest to one of the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R that overlaps therewith, and the moisture released from each of the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 may have a "main effect" on the one of the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R that is closest thereto. In the following description, the expression that the moisture emitted from a specific functional layer has a "main effect" on a light-emitting element means that the moisture emitted from the specific functional layer reaches the one of the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R the most.

[0148] Due to the moisture reaching the second light-emitting element ED-G and the third light-emitting element ED-R, oxygen vacancies may be blocked on the surface of zinc oxide in the electron transport region ETR included in each of the second light-emitting element ED-G and the third light-emitting element ED-R. Therefore, a forward aging phenomenon with a reduced trap density may occur in the second light-emitting element ED-G and in the third light-emitting element ED-R, and the efficiency, material stability, and lifetime of the second light-emitting element ED-G including the first quantum dot QD-G and the third light-emitting element ED-R including the second quantum dot QD-R may be improved.

[0149] Since the first light-emitting element ED-B includes an organic light-emitting material, the lifespan of the first light-emitting element ED-B may be reduced due to moisture entering the first light-emitting element ED-B.

[0150] However, the display device DD according to the present disclosure includes a moisture absorption layer DH in the opening BH1 of the first partition wall, and thus, the reduction in the lifespan of the first light-emitting element ED-B can be improved.

[0151] The moisture absorption layer DH may include a moisture absorption material. The moisture absorption material may include a getter that absorbs and removes moisture in the form of a gas or a liquid. The moisture absorption material may be a known material that absorbs and removes moisture and should not be particularly limited as long as the moisture absorption material absorbs and removes moisture.

[0152] Since the moisture absorption layer DH is in contact with the first functional layer FS1, compared with the case where the moisture absorption layer DH is separated from the first functional layer FS1, the moisture emitted from the polymer-based material included in the first functional layer FS1 can be removed more effectively. That is, the moisture that has a "major impact" on the first light-emitting element ED-B and is emitted from the first functional layer FS1 can be removed, and the reduction in the lifespan of the first light-emitting element ED-B can be reduced.

[0153] The moisture absorption layer DH may have a light-transmitting property. Since the first functional layer FS1 and the base substrate BL also have a light-transmitting property, the light emitted from the first light-emitting element ED-B, the second light-emitting element ED-G, and the third light-emitting element ED-R can be observed by the user after passing through the first functional layer FS1, the moisture absorption layer DH, and the base substrate BL of the second substrate PP.

[0154] In the display device DD according to the present embodiment, the lifespans of the second light-emitting element ED-G and the third light-emitting element ED-R including quantum dots QD-G and QD-R, respectively, can be improved by the second functional layer FS2 and the third functional layer FS3. In addition, the reduction in the lifespan of the first light-emitting element ED-B including the organic light-emitting material OR-B can be reduced or prevented by the moisture absorption layer DH.

[0155] In addition, a separate process of excluding only the first functional layer FS1 from the first partition wall opening BH1 that overlaps the first light-emitting element ED-B among the first partition wall opening BH1, the second partition wall opening BH2, and the third partition wall opening BH3 defined by the partition wall BK can be omitted. Therefore, the manufacturing process of the display device DD can be simplified, and the manufacturing cost of the display device DD can be reduced.

[0156] Figure 6 is a cross-sectional view of the display device DD-1 taken along the line I-I'. Figure 1 of the display device DD-1.

[0157] Reference Figure 6 As shown in Figure 6 , the display device DD-1 may include a first substrate DP, a second substrate PP-1 located on the first substrate DP, and an internal space SP located between the first substrate DP and the second substrate PP-1. In Figure 6 the same / similar reference numerals denote Figure 5 the same / similar elements in

[0158] and thus, the repeated detailed description of the same / similar reference numerals will be omitted.

[0159] The first substrate DP may include a base layer BS, a circuit element layer DP-CL located on the base layer BS, and a display element layer DP-OL located on the circuit element layer DP-CL.

[0160] The second substrate PP-1 may include a base substrate BL and an auxiliary layer FL-1 located on the lower portion of the base substrate BL.

[0161] The auxiliary layer FL-1 may be located on the lower portion of the base substrate BL. The auxiliary layer FL-1 may include a partition wall BK, a functional layer FS-1, and a moisture absorption layer DH-1.

[0162] The thickness TH1-1 of the first functional layer FS1-1 may be substantially the same as each of the sum of the thicknesses RHa1 and RHa2 of the moisture absorption layer DH-1 and the thicknesses TH2 of the second functional layer FS2 and TH3 of the third functional layer FS3. Accordingly, the thickness TH1-1 of the first functional layer FS1-1 may be less than the thickness TH2 of the second functional layer FS2.

[0163] In addition, the first functional layer FS1-1 may have a volume smaller than that of the second functional layer FS2. Accordingly, the amount of moisture emitted from the first functional layer FS1-1 may be less than the amount of moisture emitted from the second functional layer FS2.

[0164] A first distance DS1-1 from the lower surface of the first functional layer FS1-1 to the upper surface of the first light-emitting layer EL-B may be greater than a second distance DS2 from the lower surface of the second functional layer FS2 to the upper surface of the second light-emitting layer EL-G. Accordingly, the rate at which moisture emitted from the first functional layer FS1-1 reaches the first light-emitting element ED-B may be less than the rate at which moisture emitted from the second functional layer FS2 reaches the second light-emitting element ED-G.

[0165] Since the display device DD-1 includes the moisture absorption layer DH-1 located in the opening BH1 of the first partition wall, the lifespan of the first light-emitting element ED-B can be not significantly reduced.

[0166] The moisture absorption layer DH-1 may include a first moisture absorption layer D1 and a second moisture absorption layer D2 located under the first moisture absorption layer D1. The lower surface of the first moisture absorption layer D1 may directly contact the upper surface of the first functional layer FS1-1 to form a first contact surface CS1. The upper surface of the second moisture absorption layer D2 may directly contact the lower surface of the first functional layer FS1-1 to form a second contact surface CS2. That is, a plurality of contact surfaces CS1 and CS2 may be formed between the first functional layer FS1-1 and the moisture absorption layer DH-1.

[0167] When a plurality of contact surfaces CS1 and CS2 are formed, the contact area between the moisture absorption layer DH-1 and the first functional layer FS1-1 can be larger than the contact area when a single contact surface CS (refer to Figure 5 ) is formed. Therefore, the moisture absorption layer DH-1 can effectively remove the moisture emitted from the polymer-based material of the first functional layer FS1-1.

[0168] The second moisture absorption layer D2 may be spaced apart from the first moisture absorption layer D1, and the first functional layer FS1-1 is interposed therebetween.

[0169] The first functional layer FS1-1 and the first light-emitting layer EL-B may be spaced apart from each other, and the second moisture absorption layer D2 is interposed therebetween. That is, when observed in the direction from the first functional layer FS1-1 to the first light-emitting layer EL-B, the first light-emitting layer EL-B may be blocked by the second moisture absorption layer D2. Therefore, the path through which the moisture emitted from the first functional layer FS1-1 reaches the first light-emitting layer EL-B can be blocked by the second moisture absorption layer D2. Therefore, the moisture absorption layer DH-1 can effectively reduce or prevent the moisture emitted from the polymer-based material of the first functional layer FS1-1 from reaching the first light-emitting element ED-B.

[0170] Figure 7 is a cross-sectional view of the display device DD-2 taken along the line I-I' of Figure 1 .

[0171] Refer to Figure 7 , the display device DD-2 may include a first substrate DP, a second substrate PP-2 located on the first substrate DP, and an internal space SP located between the first substrate DP and the second substrate PP-2. In Figure 7 , the same / similar reference numerals represent Figure 5 and Figure 6identical / similar elements in [the figures], and thus, repeated detailed descriptions of identical / similar reference numerals will be omitted.

[0172] The first substrate DP may include a base layer BS, a circuit element layer DP-CL located on the base layer BS, and a display element layer DP-OL located on the circuit element layer DP-CL.

[0173] The second substrate PP-2 may include a base substrate BL and an auxiliary layer FL-2 located on the lower portion of the base substrate BL.

[0174] The auxiliary layer FL-2 may be located on the lower portion of the base substrate BL. The auxiliary layer FL-2 may include a partition wall BK, a functional layer FS-2, and a moisture absorption layer DH-2.

[0175] The functional layer FS-2 may include a first functional layer FS1-2, a second functional layer FS2, and a third functional layer FS3. The first functional layer FS1-2, the second functional layer FS2, and the third functional layer FS3 may be respectively located in a first partition wall opening BH1, a second partition wall opening BH2, and a third partition wall opening BH3.

[0176] The sum of the thickness TH1-2 of the first functional layer FS1-2 and the thickness RH-2 of the moisture absorption layer DH-2 may be substantially the same as each of the thickness TH2 of the second functional layer FS2 and the thickness TH3 of the third functional layer FS3. The thickness TH1-2 of the first functional layer FS1-2 may be less than the thickness TH2 of the second functional layer FS2, but the present disclosure should not be limited to this or restricted thereby.

[0177] In addition, the first functional layer FS1-2 may have a volume smaller than that of the second functional layer FS2. Therefore, the amount of moisture emitted from the first functional layer FS1-2 may be less than the amount of moisture emitted from the second functional layer FS2.

[0178] A first distance DS1-2 from the lower surface of the first functional layer FS1-2 to the upper surface of the first light-emitting layer EL-B may be greater than a second distance DS2 from the lower surface of the second functional layer FS2 to the upper surface of the second light-emitting layer EL-G. Therefore, the rate at which moisture emitted from the first functional layer FS1-2 reaches the first light-emitting element ED-B may be less than the rate at which moisture emitted from the second functional layer FS2 reaches the second light-emitting element ED-G.

[0179] Because the display device DD-2 includes the moisture absorption layer DH-2 located in the first partition wall opening BH1, the lifespan of the first light-emitting element ED-B may not be significantly reduced.

[0180] The first functional layer FS1-2 may be located on the moisture absorption layer DH-2. The first functional layer FS1-2 may be in direct contact with the moisture absorption layer DH-2. Refer to Figure 7 , the lower surface of the first functional layer FS1-2 may be in direct contact with the upper surface of the moisture absorption layer DH-2 to form a contact surface CS-2.

[0181] The first functional layer FS1-2 and the first light-emitting layer EL-B may be spaced apart from each other, and the moisture absorption layer DH-2 may be interposed therebetween. That is, when viewed in the direction from the first functional layer FS1-2 to the first light-emitting layer EL-B, the first light-emitting layer EL-B may be blocked by the moisture absorption layer DH-2. Accordingly, the path through which moisture emitted from the first functional layer FS1-2 reaches the first light-emitting layer EL-B may be blocked by the moisture absorption layer DH-2. Accordingly, the moisture absorption layer DH-2 may effectively reduce or prevent moisture emitted from the polymer-based material of the first functional layer FS1-2 from reaching the first light-emitting element ED-B.

[0182] Figures 8A to 8H is a cross-sectional view showing a method of manufacturing a display device according to one or more embodiments of the present disclosure.

[0183] The method of manufacturing a display device may include forming a first substrate and a second substrate and coupling the first substrate and the second substrate.

[0184] Forming the second substrate may include providing a base substrate, forming partition walls on the base substrate, and etching the partition walls to form first through third partition wall openings.

[0185] Forming the second substrate may include providing a base substrate, forming partition walls on the base substrate, etching the partition walls to form first through third partition wall openings, and forming a moisture absorption layer including a moisture absorption material and a functional layer including a polymer-based material.

[0186] In this case, the moisture absorption layer may be located in the first partition wall opening, and the functional layer may be located in the first through third partition wall openings.

[0187] By reference to Figures 8A to 8H The display device manufactured by the manufacturing method described may have a structure substantially the same as the structure of the display device described in reference to Figures 1 to 5 description. Accordingly, in Figures 8A to 8H , the same reference numerals denote Figures 1 to 5 the same elements in

[0188] For convenience of explanation, Figures 8A to 8Fshows a structure in which the base substrate BL is located at the bottommost position and other components included in the second substrate PP (refer to Figure 8F ) except for the base substrate BL are stacked in the third direction DR3. For ease of explanation, Figures 8A to 8E the preliminary second substrate RP of Figure 8F refers to a structure in which the second substrate PP (refer to

[0189] The formation of the second substrate PP (refer to Figure 5 ) may include disposing the base substrate BL and forming a barrier wall BK on the base substrate BL. Figure 8A shows a structure in which the barrier wall BK is located on the base substrate BL.

[0190] The barrier wall BK may include a polymer resin and a liquid-repellent additive. The barrier wall BK may include a light-absorbing material or a pigment or a dye. As an example, the barrier wall BK may include a black pigment or a black dye to achieve a black barrier wall. The barrier wall BK may include carbon black, but the present disclosure should not be limited thereto.

[0191] Refer to Figure 8B , the barrier wall BK may be etched to form a first barrier wall opening BH1, a second barrier wall opening BH2, and a third barrier wall opening BH3.

[0192] Each of the first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3 may penetrate a part of the barrier wall BK along a direction from the upper surface to the lower surface of the barrier wall BK. The first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3 may be formed by a photoresist process, but the present disclosure should not be limited thereto or restricted thereby.

[0193] For ease of explanation, Figure 8B shows a part BP of the barrier wall BK that defines the barrier wall openings BH1, BH2, and BH3. When observed in the second direction DR2, the width WD of the part BP of the barrier wall BK in the cross section may decrease as it goes from the lower surface to the upper surface of the barrier wall BK. That is, when observed in the second direction DR2, the width WD of the cross section of the part BP of the barrier wall BK may decrease upward in the third direction DR3, but this is merely an example. The shape of the barrier wall BK should not be particularly limited as long as the barrier wall openings BH1, BH2, and BH3 are defined as parts that penetrate the barrier wall BK from the upper surface to the lower surface.

[0194] Then, a moisture absorption layer DH including a moisture absorption material may be formed.

[0195] The process of forming the moisture absorption layer DH may include providing a moisture absorption material in liquid form to the first partition wall opening BH1. Figure 8C The process of dropping a moisture absorption material in liquid form onto the first partition wall opening BH1 using an inkjet printing method is shown.

[0196] A first ink IK-D including a moisture absorption material in liquid form may be provided through a first nozzle NZa of an inkjet printing device. The first nozzle NZa may be located above the first partition wall opening BH1 and may eject the first ink IK-D into the first partition wall opening BH1.

[0197] By setting the first nozzle NZa of the inkjet printing device to provide the first ink IK-D at a high resolution, the first ink IK-D may be selectively provided to the first partition wall opening BH1. However, the present disclosure should not be limited to this or thereby restricted, and a part of the first ink IK-D may be ejected into the second partition wall opening BH2 or the third partition wall opening BH3.

[0198] The process of forming the moisture absorption layer DH may include irradiating ultraviolet rays to the moisture absorption material in liquid form to cure the moisture absorption material. Figure 8D The process of irradiating ultraviolet rays UV to the moisture absorption material in liquid form to cure the moisture absorption material is shown.

[0199] An ultraviolet lamp LP may be positioned above the partition wall BK. The ultraviolet lamp LP may be spaced apart from the partition wall BK. Figure 8D A single ultraviolet lamp LP is shown as an example, but the present disclosure should not be limited to this or thereby restricted, and a plurality of ultraviolet lamps LP may be provided.

[0200] The moisture absorption material in liquid form may be cured by the ultraviolet rays UV irradiated thereto. As an example, monomers or oligomers contained in the moisture absorption material in liquid form may be polymerized into polymers by chemical polymerization.

[0201] Then, referring to Figure 8E and Figure 8F , the process of forming a functional layer FS including a polymer-based material may be performed.

[0202] Figure 8E The process of dropping a second ink IK-F in liquid form onto the first partition wall opening BH1, the second partition wall opening BH2, and the third partition wall opening BH3 using an inkjet printing method is shown as an example.

[0203] The first nozzle NZb1, the second nozzle NZb2, and the third nozzle NZb3 can respectively supply the second ink IK-F to the first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3. The second ink IK-F can include a polymer-based material.

[0204] The second ink IK-F can be ejected from the first nozzle NZb1, the second nozzle NZb2, and the third nozzle NZb3 substantially simultaneously, but the present disclosure should not be limited to this or be restricted thereby. According to one or more embodiments, at least one of the first nozzle NZb1, the second nozzle NZb2, and the third nozzle NZb3 can eject the second ink IK-F at different times.

[0205] Reference Figure 8E , the amount of the second ink IK-F ejected from the first nozzle NZb1 can be less than the amount of the second ink IK-F ejected from the second nozzle NZb2 and the third nozzle NZb3.

[0206] Figure 8F Shows a functional layer FS formed by curing the second ink IK-F provided to the first barrier wall opening BH1, the second barrier wall opening BH2, and the third barrier wall opening BH3.

[0207] For ease of explanation, the functional layer FS is classified into a first functional layer FS1 formed in the first barrier wall opening BH1, a second functional layer FS2 formed in the second barrier wall opening BH2, and a third functional layer FS3 formed in the third barrier wall opening BH3. However, the first functional layer FS1, the second functional layer FS2, and the third functional layer FS3 can be a single layer formed by a single process.

[0208] Since the amount of the second ink IK-F ejected from the first nozzle NZb1 is less than the amount of the second ink IK-F ejected from the second nozzle NZb2 and the third nozzle NZb3, the thickness TH1 of the first functional layer FS1 can be less than the thickness TH2 of the second functional layer FS2 and less than the thickness TH3 of the third functional layer FS3.

[0209] Therefore, the sum of the thickness RH of the moisture absorption layer DH and the thickness TH1 of the first functional layer FS1 can be substantially the same as the thickness TH2 of the second functional layer FS2 formed in the second barrier wall opening BH2 and the thickness TH3 of the third functional layer FS3 formed in the third barrier wall opening BH3, but the present disclosure should not be limited to this or be restricted thereby.

[0210] Figure 8E and Figure 8F Shows a process of forming the functional layer FS using an inkjet printing method as an example, but the present disclosure should not be limited to this or be restricted thereby. As an example, the formation of the functional layer FS can be performed by a photoresist process.

[0211] Then, a process of joining the first substrate DP and the second substrate PP can be performed.

[0212] The first substrate DP may include a base layer BS, a pixel defining layer PDL located on the base layer BS and provided with first to third openings OH1 to OH3 defined therethrough, a first light-emitting layer EL-B located in the first opening OH1 and including an organic light-emitting material OR-B, a second light-emitting layer EL-G located in the second opening OH2 and including first quantum dots QD-G, and a third light-emitting layer EL-R located in the third opening OH3 and including second quantum dots QD-R.

[0213] Reference Figure 8G , joining the first substrate DP and the second substrate PP may include aligning the second substrate PP and the first substrate DP to allow the first to third openings OH1 to OH3 to overlap with a first barrier rib opening BH1, a second barrier rib opening BH2, and a third barrier rib opening BH3, respectively.

[0214] The aligned second substrate PP may be moved downward to the first substrate DP. However, the present disclosure should not be limited to this or be restricted thereby, as long as the second substrate PP and the first substrate DP are close to each other. As an example, the first substrate DP may be moved upward to approach the second substrate PP.

[0215] A sealing member SL may be positioned between the first substrate DP and the second substrate PP along an edge of each of the first substrate DP and the second substrate PP (reference Figure 2 ). The sealing member SL may include an organic material to ensure viscosity to join the first substrate DP and the second substrate PP and to ensure impact resistance. In addition, the sealing member SL may include inorganic materials such as frit, an amine-based curing agent, and a photoinitiator.

[0216] Reference Figure 8H , the sealing member SL may define an internal space SP together with the first substrate DP and the second substrate PP (reference Figure 2 ). The internal space SP may be filled with nitrogen gas.

[0217] Figure 9A And Figure 9B are cross-sectional views showing a method of manufacturing a display device according to one or more embodiments of the present disclosure.

[0218] By reference Figure 9A And Figure 9B The display device manufactured by the manufacturing method described may have a structure substantially the same as that of the display device DD-1 described with reference to Figure 6 . Accordingly, in Figure 9A AndFigure 9B in which, like reference numerals denote Figure 6 the same elements of the display device DD-1 in

[0219] and, accordingly, a repeated detailed description of the same elements will be omitted. Figures 8A to 8F The preliminary second substrate RP-1 shown in Figure 9A can be obtained by performing a process the same as / similar to that of Figure 9A and Figure 9B Therefore, the following description with reference to Figures 8A to 8F will focus on the features different from those of

[0220] With reference to Figure 9A , the first ink IK-D can be ejected onto the first partition wall opening BH1 through the first nozzle NZa. That is, different from the process of forming the preliminary second substrate RP described with reference to Figures 8A to 8F , the process of ejecting the first ink IK-D onto the first partition wall opening BH1 can be performed multiple times.

[0221] In the first partition wall opening BH1, the first functional layer FS1-1 can be positioned between the first moisture absorption layer D1 and the second moisture absorption layer D2. That is, the process of forming the first functional layer FS1-1 can be performed between the process of forming the first moisture absorption layer D1 and the process of forming the second moisture absorption layer D2.

[0222] The thickness RHa1 of the first moisture absorption layer D1 and the thickness TH1-1 of the first functional layer FS1-1 included in the preliminary second substrate RP-1 shown in Figure 9A can be different from the thickness RH of the moisture absorption layer DH and the thickness TH1 of the first functional layer FS1 described with reference to Figure 8F .

[0223] With reference to Figure 9B , ultraviolet rays UV can be irradiated onto the moisture absorption material in liquid form to cure the moisture absorption material.

[0224] The ultraviolet lamp LP can be positioned above the partition wall BK. The ultraviolet lamp LP can be spaced apart from the partition wall BK. The first ink IK-D provided on the first functional layer FS1-1 can be cured by the ultraviolet rays UV and can be formed into the second moisture absorption layer D2. As an example, monomers or oligomers included in the moisture absorption material in liquid form can be polymerized into polymers by chemical polymerization.

[0225] Then, on the preliminary second substrate RP-1 shown in Figure 9B , processes the same as / similar to those described with reference to Figure 8G and Figure 8H can be performed, andFigure 6 The described display device DD-1.

[0226] Figures 10A to 10C is a cross-sectional view showing a method of manufacturing a display device according to one or more embodiments of the present disclosure.

[0227] By referring to Figures 10A to 10C The display device manufactured by the described manufacturing method may have a structure substantially the same as that of the display device DD-2 referred to in Figure 7 . Thus, in Figures 10A to 10C , the same reference numerals represent Figure 7 the same elements of the display device DD-2 in , and thus, repeated detailed descriptions of the same elements will be omitted.

[0228] It can be obtained by performing processes the same as / similar to those of Figure 8A and Figure 8B . Thus, the following description with reference to Figure 10A will focus on the features different from those of Figures 10A to 10C . Figures 8A to 8F

[0229] Referring to Figure 10A , a process of forming the functional layer FS-2 can be performed on the preliminary second substrate RP-2. That is, different from the process of forming the preliminary second substrate RP described in Figures 8A to 8H , the process of forming the functional layer FS-2 can be performed before the process of forming the moisture absorption layer DH-2.

[0230] The second ink IK-F can be ejected onto the first partition wall opening BH1 through the first nozzle NZb1. The second ink IK-F can be directly ejected onto the base substrate BL exposed through the first partition wall opening BH1.

[0231] Referring to Figure 10B , the first ink IK-D can be supplied to the first partition wall opening BH1. That is, when the second ink IK-F (refer to Figure 10A ) is cured and forms the first functional layer FS1-2, the first ink IK-D can be supplied onto the first functional layer FS1-2. The first ink IK-D can be ejected onto the first functional layer FS1-2 through the first nozzle NZa.

[0232] Referring to Figure 10C, ultraviolet rays UV can be irradiated onto the moisture-absorbing material to cure the moisture-absorbing material. The ultraviolet lamp LP can be positioned above the partition wall BK. The ultraviolet lamp LP can be spaced apart from the partition wall BK. The first ink IK-D provided on the first functional layer FS1-2 can be cured by ultraviolet rays UV and can be formed into a moisture-absorbing layer DH-2. As an example, monomers or oligomers contained in the moisture-absorbing material in liquid form can be polymerized into polymers through chemical polymerization.

[0233] Then, it can be performed on the preliminary second substrate RP-2 shown in Figure 10C the same / similar processes as those described in reference Figure 8G and Figure 8H and a display device DD-2 described in reference Figure 7 can be manufactured.

[0234] Although embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these embodiments, and those of ordinary skill in the art can make various changes and modifications within the spirit and scope of the present disclosure as claimed in the appended claims. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the present disclosure should be determined according to the appended claims and their functional equivalents that should be included therein.

Claims

1. A display device, comprising: A first substrate, comprising: A base layer; A pixel definition layer, above the base layer, and defining a first opening and a second opening; A first light-emitting layer, in the first opening, and comprising an organic light-emitting material; and A second light-emitting layer, in the second opening, and comprising a first quantum dot; and A second substrate, above the first substrate, and comprising: A base substrate; A barrier rib, below the base substrate, and defining a first barrier rib opening overlapping with the first opening and a second barrier rib opening overlapping with the second opening; A first functional layer, in the first barrier rib opening, and comprising a polymer-based material; A moisture absorption layer, in the first barrier rib opening, for absorbing moisture emitted from the polymer-based material; and A second functional layer, in the second barrier rib opening, and comprising a polymer-based material.

2. The display device according to claim 1, wherein, The polymer-based material of the first functional layer comprises methacrylic acid, polyacrylic acid or citric acid.

3. The display device according to claim 1, wherein, The moisture absorption layer is above the first functional layer and in direct contact with the first functional layer.

4. The display device according to claim 1, wherein, The first functional layer has a thickness smaller than that of the second functional layer.

5. The display device according to claim 1, wherein, The sum of the thickness of the first functional layer and the thickness of the moisture absorption layer is equal to the thickness of the second functional layer.

6. The display device according to claim 1, wherein, The upper surface of the moisture absorption layer contacts the lower surface of the base substrate.

7. The display device according to claim 1, wherein, The moisture absorption layer comprises a first moisture absorption layer and a second moisture absorption layer below the first moisture absorption layer, and the first functional layer is between the first moisture absorption layer and the second moisture absorption layer.

8. The display device according to claim 7, wherein, The lower surface of the first moisture absorption layer directly contacts the upper surface of the first functional layer, and wherein, the upper surface of the second moisture absorption layer directly contacts the lower surface of the first functional layer.

9. The display device according to claim 1, wherein, The first functional layer is above the moisture absorption layer and in direct contact with the moisture absorption layer.

10. The display device according to claim 1, wherein, The distance from the lower surface of the first functional layer to the upper surface of the first light-emitting layer is greater than the distance from the lower surface of the second functional layer to the upper surface of the second light-emitting layer, and wherein, when observed in the direction from the first light-emitting layer to the first functional layer, the first functional layer is blocked by the moisture absorption layer.

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