Display substrate and display device

Abstract

The invention discloses a display substrate and a display device. The display substrate comprises a display area and a frame area arranged around the display area. The frame area comprises a virtual pixel area and an isolation area which are sequentially arranged in the direction away from the display area, the virtual pixel area comprises a packaging structure layer arranged on the substrate, the packaging structure layer at least comprises an organic packaging layer, an isolation groove is formed in the virtual pixel area, and the organic packaging layer is arranged in the isolation groove. The isolation groove is formed in the side, close to the substrate, of the organic packaging layer, a filling layer is arranged in the isolation groove, and the orthographic projection of the organic packaging layer on the substrate is at least partially overlapped with the orthographic projection of the filling layer on the substrate; and the leveling uniformity of the organic packaging layer is improved.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of display technology, and more particularly to a display substrate and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diodes (QLED) are active light-emitting display devices, which have the advantages of self-luminescence, wide viewing angle, high contrast ratio, low power consumption, extremely high response speed, thin and light, bendable, and low cost. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED or QLED as light-emitting devices and controlled by thin film transistors (TFT) have become the mainstream products in the current display field. Summary of the Invention

[0003] Embodiments of the present application provide a display substrate and a display device, which improve the uniformity of the leveling of the organic encapsulation layer.

[0004] Embodiments of the present application provide a display substrate, including: a display area and a border area disposed around the display area; the border area includes a virtual pixel area and an isolation area sequentially arranged along a direction away from the display area, the virtual pixel area includes an encapsulation structure layer disposed on a substrate, the encapsulation structure layer at least includes an organic encapsulation layer, an isolation groove is disposed in the virtual pixel area, the isolation groove is disposed on a side of the organic encapsulation layer close to the substrate, a filling layer is disposed in the isolation groove, and at least a part of a positive projection of the organic encapsulation layer on the substrate overlaps with a positive projection of the filling layer on the substrate.

[0005] In an exemplary embodiment, the virtual pixel area further includes a dielectric structure layer, the dielectric structure layer is disposed between the encapsulation structure layer and the substrate, the isolation area includes a first isolation wall disposed on the substrate, the first isolation wall is configured to block the flow of the organic encapsulation layer, and an isolation groove is formed between a side surface of the dielectric structure layer away from the display area and the first isolation wall; a side surface of the filling layer close to the display area is connected to a side surface of the dielectric structure layer away from the display area, and a side surface of the filling layer away from the display area is connected to the first isolation wall.

[0006] In an exemplary embodiment, a surface of the filling layer away from the substrate is substantially flush with a surface of the dielectric structure layer away from the substrate.

[0007] In an exemplary embodiment, a signal trace is disposed on a side of the isolation groove close to the substrate, and at least a part of a positive projection of the filling layer on the substrate overlaps with a positive projection of the signal trace on the substrate.

[0008] In an exemplary embodiment, the virtual pixel region further includes a raised structure, at least a part of which is disposed between a surface of the filling layer away from the substrate and the organic encapsulation layer, and the raised structure is configured to impede or accelerate the flow of the organic encapsulation layer.

[0009] In an exemplary embodiment, the raised structure includes a plurality of flow-blocking columns arranged at intervals, and the plurality of flow-blocking columns are configured to impede the flow of the organic encapsulation layer.

[0010] In an exemplary embodiment, the raised structure includes at least one flow-blocking wall, and the at least one flow-blocking wall extends along an outer contour of the display area, and the at least one flow-blocking wall is configured to impede the flow of the organic encapsulation layer.

[0011] In an exemplary embodiment, the at least one flow-blocking wall includes a plurality of flow-blocking main parts and flow-blocking connection parts connecting adjacent flow-blocking main parts, the shape of the flow-blocking main part is arc-shaped, and the shape of the flow-blocking connection part is columnar.

[0012] In an exemplary embodiment, the raised structure includes a plurality of flow-guiding walls, the plurality of flow-guiding walls extend along a direction away from the display area, and a flow-guiding groove extending along a direction away from the display area is disposed between adjacent flow-guiding walls, and the flow-guiding groove is configured to accelerate the flow of the organic encapsulation layer material along a direction away from the display area.

[0013] In an exemplary embodiment, a ratio of a total volume of the raised structure to a total volume of the organic encapsulation layer in the virtual pixel region is greater than or equal to 1 / 10 and less than or equal to 1 / 5.

[0014] In an exemplary embodiment, a height of the raised structure is greater than or equal to 0.5 micrometers and less than or equal to 1 micrometer.

[0015] An embodiment of the present application further provides a display device, including the foregoing display substrate.

[0016] The display substrate according to the embodiment of the present disclosure fills the isolation groove through the filling layer, avoids filling the isolation groove by the organic encapsulation layer material during the leveling process, reduces the loss of the organic encapsulation layer material during the leveling process, effectively reduces the debugging difficulty of the leveling of the organic encapsulation layer material in the border area, and ensures the uniformity of the leveling of the organic encapsulation layer material in the border area.

[0017] In the embodiments of the present disclosure, the display substrate fills the isolation grooves through a filling layer, reducing the step difference formed by the isolation grooves, thereby reducing the step difference formed by the subsequent organic encapsulation layer above the isolation grooves, ensuring the encapsulation effect of the organic encapsulation layer, avoiding short circuits of the signal traces located below the isolation grooves, so that the signal traces do not need to avoid the isolation grooves, which is beneficial to the design of the narrow border of the display substrate.

[0018] In the embodiments of the present disclosure, the display substrate fills the isolation grooves through a filling layer, reducing the step difference formed by the isolation grooves, thereby reducing the step difference formed by the encapsulation structure layer at the isolation grooves, ensuring the flatness of the color filter structure layer on the encapsulation structure layer, and improving the uniformity of edge emission of the display substrate.

[0019] In the embodiments of the present disclosure, the display substrate obstructs the flow of the organic encapsulation layer through a flow-blocking column, avoiding the overflow of the organic encapsulation layer.

[0020] In the embodiments of the present disclosure, the display substrate obstructs the flow of the organic encapsulation layer through a flow-blocking wall, avoiding the overflow of the organic encapsulation layer.

[0021] In the embodiments of the present disclosure, the display substrate accelerates the flow of the organic encapsulation layer material from the display area towards the isolation area through a drainage groove.

[0022] Other features and advantages of the present application will be described in the subsequent description, and some will become obvious from the description, or be understood by implementing the present application. Other advantages of the present application can be achieved and obtained through the solutions described in the description and the drawings. Description of the Drawings

[0023] The drawings are used to provide an understanding of the technical solutions of the present application, and constitute a part of the description, and are used together with the embodiments of the present application to explain the technical solutions of the present application, and do not constitute a limitation to the technical solutions of the present application.

[0024] Figure 1 It is a schematic cross-sectional structure diagram of a related display substrate;

[0025] Figure 2 It is a schematic plan structure diagram of a display substrate provided by an embodiment of the present disclosure;

[0026] Figure 3 It is a schematic cross-sectional structure diagram of a display substrate provided by an embodiment of the present disclosure;

[0027] Figure 4 It is a simulation schematic diagram of a display substrate provided by an embodiment of the present disclosure;

[0028] Figure 5 It is a schematic cross-sectional structure diagram of another display substrate provided by an embodiment of the present disclosure;

[0029] Figure 6Another schematic plan view of the convex structure of the display substrate provided by the embodiments of the present disclosure;

[0030] Figure 7 Another schematic plan view of the convex structure of the display substrate provided by the embodiments of the present disclosure;

[0031] Figure 8 Another schematic plan view of the convex structure of the display substrate provided by the embodiments of the present disclosure. Detailed implementation manners

[0032] This application describes multiple embodiments, but the description is exemplary rather than restrictive, and it is obvious to those of ordinary skill in the art that there can be more embodiments and implementation solutions within the scope covered by the embodiments described in this application. Although many possible feature combinations are shown in the drawings and discussed in the detailed implementation manners, many other combination ways of the disclosed features are also possible. Unless specifically restricted, any feature or element of any embodiment can be combined with any other feature or element in any other embodiment, or can replace any other feature or element in any other embodiment.

[0033] This application includes and contemplates combinations with features and elements known to those of ordinary skill in the art. The embodiments, features, and elements already disclosed in this application can also be combined with any conventional features or elements to form a unique inventive solution. Any feature or element of any embodiment can also be combined with features or elements from other inventive solutions to form another unique inventive solution. Therefore, it should be understood that any feature shown and / or discussed in this application can be implemented alone or in any appropriate combination. Therefore, except for the limitations made according to the appended claims and their equivalent replacements, the embodiments are not subject to other limitations. In addition, various modifications and changes can be made within the scope of the protection of the appended claims.

[0034] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not depend on the specific order of the steps described herein, the method or process should not be limited to the specific order of the steps described. As will be understood by those of ordinary skill in the art, other step orders are also possible. Therefore, the specific order of the steps set forth in the specification should not be construed as a limitation on the claims. In addition, the claims directed to the method and / or process should not be limited to performing their steps in the order written, and those skilled in the art can easily understand that these orders can be changed and still remain within the spirit and scope of the embodiments of this application.

[0035] Through the research of the inventors of the present application, it is found that OLED devices usually adopt a thin-film encapsulation process, and there is an organic encapsulation layer (Organic Film) in the thin-film encapsulation layer (TFE). Its main function is to coat the light-emitting device, playing the role of extending the water and oxygen erosion path and adjusting the film stress. The preparation process of the organic encapsulation layer is as follows: through inkjet printing (InkjetPrint) technology, the ink is printed on the front-end glass and leveled naturally; subsequently, the ink is cured by ultraviolet rays of a UV curing device (UV CureEquipment) to form an organic encapsulation layer. In the preparation process of the organic encapsulation layer, the leveling of the ink is a key factor of the process. The leveling effect of the ink is related to the morphology of the film layer below. For example, the density of the support pillars (PS), the shape of the pixel definition layer (PDL), the aperture ratio of the pixel definition layer (PDL), etc.

[0036] Figure 1 It is a schematic cross-sectional structure diagram of a related display substrate. Among them, Figure 1 It schematically shows the structure of the display substrate before forming the thin-film encapsulation layer. As Figure 1 shown, the related display substrate includes a display area 100' and a border area arranged around the display area 100'. The border area includes a virtual pixel area 210' and an isolation area 220' arranged in sequence along the direction away from the display area 100'. The virtual pixel area 210' includes a dielectric structure layer 20' arranged on the substrate. The isolation area 220' includes a first isolation wall 401' and a second isolation wall 402' arranged in sequence along the direction away from the display area 100'. An isolation groove 11' is formed between the side surface of the dielectric structure layer 20' on the side away from the display area 100' and the first isolation wall 401'. During the leveling process of the organic encapsulation layer material, a part of the organic encapsulation layer material will fill into the isolation groove 11', resulting in the loss of a part of the extra volume of the organic encapsulation layer material during the leveling process, and the leveling area of the organic encapsulation layer material cannot be accurately controlled. Moreover, the isolation groove 11' will form a climbing distance, resulting in poor filling ability of the organic encapsulation layer material at the isolation groove 11', large step difference of the organic encapsulation layer, and inability to effectively protect the signal traces located below the organic encapsulation layer, which is likely to cause the problem of signal trace short circuit. For this reason, the related display substrate needs to avoid the area where the isolation groove 11' is located for the leveling path of the organic encapsulation layer material, which is not conducive to the narrow border design.

[0037] In addition, for a COE (Color on Encapsulation) display substrate, due to the large step difference of the organic encapsulation layer, the thickness of the color film structure layer located above the organic encapsulation layer is uneven, resulting in poor edge emission uniformity of the display substrate.

[0038] An embodiment of the present disclosure provides a display substrate, comprising: a display area and a border area disposed around the display area; the border area includes a dummy pixel area and an isolation area sequentially disposed in a direction away from the display area, the dummy pixel area includes a packaging structure layer disposed on a substrate, the packaging structure layer at least includes an organic packaging layer, an isolation groove is disposed in the dummy pixel area, the isolation groove is disposed on a side of the organic packaging layer close to the substrate, a filling layer is disposed in the isolation groove, and at least a part of a positive projection of the organic packaging layer on the substrate overlaps with a positive projection of the filling layer on the substrate.

[0039] Figure 2 It is a schematic plan view of a display substrate provided by an embodiment of the present disclosure. As Figure 2 shown, on a plane parallel to the display substrate, the display substrate in the embodiment of the present disclosure includes a display area 100 and a border area 200 disposed around the display area 100. The shape of the display area 100 may be rectangular or rounded rectangular, and the display area 100 includes a plurality of sub-pixels forming a pixel array, and the plurality of sub-pixels are configured to display a dynamic picture or a still image. The shape of the border area 200 may be rectangular ring-shaped or rounded rectangular ring-shaped, and the border area 200 includes a dummy pixel area (Dummy Pixel) and an isolation area sequentially disposed in a direction away from the display area 100. The dummy pixel area includes a packaging structure layer, and the packaging structure layer at least includes an organic packaging layer. The isolation area includes a first isolation wall and a second isolation wall spaced apart in a direction away from the display area 100. The first isolation wall is configured to block the flow of the organic packaging layer material and prevent the organic packaging layer material from overflowing.

[0040] Figure 3 It is a schematic cross-sectional view of a display substrate provided by an embodiment of the present disclosure. Among them, Figure 3 It may be Figure 2 a cross-sectional view in the A-A' direction in Figure 3As shown, in a plane perpendicular to the display substrate, the isolation region 220 includes a first isolation wall 401 and a second isolation wall 402 disposed on the base 101, and the first isolation wall 401 and the second isolation wall 402 are spaced apart along a direction away from the display region 100. The virtual pixel region 210 includes a dielectric structure layer 20 disposed on the base 101 and an encapsulation structure layer disposed on a side of the dielectric structure layer 20 away from the base. An isolation groove 11 is provided in the virtual pixel region 210. The isolation groove 11 is disposed on a side of the encapsulation structure layer close to the base, and is located between a side of the dielectric structure layer 20 away from the display region 100 and the first isolation wall 401 of the isolation region 220. The isolation groove 11 is configured to isolate water and oxygen. A filling layer 121 is provided in the isolation groove 11, and the filling layer 121 is configured to fill the isolation groove 11 to reduce the step difference of the isolation groove 11. The encapsulation structure layer at least includes an organic encapsulation layer 303, and at least a part of a positive projection of the organic encapsulation layer 303 on the base overlaps with a positive projection of the filling layer 121 on the base.

[0041] In the embodiment of the present disclosure, the display substrate fills the isolation groove 11 with the filling layer 121, avoids the organic encapsulation layer 303 material from filling the isolation groove 11 during the leveling process, reduces the loss of the organic encapsulation layer 303 material during the leveling process, effectively reduces the debugging difficulty of the organic encapsulation layer 303 material leveling in the border region, and ensures the uniformity of the organic encapsulation layer 303 material leveling in the border region.

[0042] In an exemplary embodiment, both the first isolation wall 401 and the second isolation wall 402 may include a first pattern layer, a second pattern layer, and a third pattern layer that are sequentially stacked along a direction away from the base. The first pattern layer may be disposed on the same layer as the third organic dielectric layer in the display region 100, and use the same material and be prepared by the same manufacturing process; the second pattern layer may be disposed on the same layer as the pixel definition layer in the display region 100, and use the same material and be prepared by the same manufacturing process; the third pattern layer may be disposed on the same layer as the spacer layer in the display region 100, and use the same material and be prepared by the same manufacturing process, thereby simplifying the process and reducing the production cost.

[0043] In an exemplary embodiment, the dielectric structure layer 20 may be a multi-layer stack structure. For example, the dielectric structure layer 20 may include a first organic dielectric layer 201, a second organic dielectric layer 202, and a third organic dielectric layer 203 that are sequentially stacked along a direction away from the substrate 101. An edge of the first organic dielectric layer 201 on a side away from the display area 100 extends a part compared to an edge of the second organic dielectric layer 202 on a side away from the display area 100, and an edge of the second organic dielectric layer 202 on a side away from the display area 100 extends a part compared to an edge of the third organic dielectric layer 203 on a side away from the display area 100, so that a side surface of the dielectric structure layer 20 on a side away from the display area 100 is in a stepped shape including three steps.

[0044] In an exemplary embodiment, the first organic dielectric layer 201 of the dielectric structure layer 20 may be provided on the same layer as the first organic dielectric layer of the display area 100, and made of the same material, and prepared by the same manufacturing process; the second organic dielectric layer 202 of the dielectric structure layer 20 may be provided on the same layer as the second organic dielectric layer of the display area 100, and made of the same material, and prepared by the same manufacturing process; the third organic dielectric layer 203 of the dielectric structure layer 20 may be provided on the same layer as the third organic dielectric layer of the display area 100, and made of the same material, and prepared by the same manufacturing process, thereby simplifying the process and reducing the production cost.

[0045] In an exemplary embodiment, a side wall of the isolation groove 11 on a side close to the display area 100 includes a side surface of the dielectric structure layer 20 on a side away from the display area 100, and a side wall of the isolation groove 11 on a side away from the display area 100 includes a side wall of the first isolation wall 401 on a side close to the display area 100.

[0046] In an exemplary embodiment, the filling layer 121 is disposed in the isolation groove 11. A side of the filling layer 121 close to the display area 100 is connected to a side surface of the dielectric structure layer 20 on a side away from the display area 100, and a side of the filling layer 121 away from the display area 100 is connected to a side wall of the first isolation wall 401. A surface of the filling layer 121 on a side away from the substrate is substantially flush with a surface of the dielectric structure layer 20 on a side away from the substrate, and the surface of the filling layer 121 on a side away from the substrate is connected to the surface of the dielectric structure layer 20 on a side away from the substrate to form a flat surface.

[0047] In an exemplary embodiment, the filling layer 121 may be a single-layer structure, the filling layer 121 may be an organic material, the filling layer 121 may be provided on the same layer as a film layer (such as a pixel definition layer or a spacer layer) in the display area 100, made of the same material, and prepared by the same manufacturing process, thereby simplifying the process and reducing the production cost.

[0048] In some embodiments, the filling layer may be a multi-film layer stacked structure. The filling layer may include a plurality of dielectric layers stacked along a direction away from the substrate. The dielectric layers may be organic materials. The dielectric layers may be provided on the same layer as the film layers (such as the pixel definition layer or the spacer layer) in the display area, made of the same material, and prepared by the same preparation process, thereby simplifying the process and reducing the production cost.

[0049] In an exemplary embodiment, the preparation process of the filling layer 121 may include: sequentially preparing a pixel driving layer, an anode, a pixel definition layer, and a spacer layer in the display area 100; subsequently, filling the isolation groove 11 with an organic material, and forming the filling layer 121 through the leveling of the organic material; subsequently, forming a light-emitting functional layer by evaporation on the anode in the display area 100 through a mask plate.

[0050] In an exemplary embodiment, a signal trace 13 is provided on a side of the isolation groove 11 close to the substrate. The isolation groove 11 may expose at least a part of the surface of the signal trace 13. The filling layer 121 is provided on a side of the signal trace 13 away from the substrate. The filling layer 121 is made of an insulating material. At least a part of the orthographic projection of the filling layer 121 on the substrate 101 overlaps with the orthographic projection of the signal trace 13 on the substrate 101. Wherein, the signal trace 13 may include a Flexible Multi-Layer On Cell (FMLOC) trace.

[0051] In the embodiment of the present disclosure, the display substrate fills the isolation groove 11 through the filling layer 121, reduces the step difference formed by the isolation groove 11, thereby reducing the step difference formed by the subsequent organic encapsulation layer 303 above the isolation groove 11, ensuring the encapsulation effect of the organic encapsulation layer 303, and avoiding short circuit of the signal trace 13 under the isolation groove 11. Thus, the signal trace 13 does not need to be arranged avoiding the isolation groove 11, which is beneficial to the narrow border design of the display substrate.

[0052] In an exemplary embodiment, the virtual pixel area 210 further includes a pixel definition layer 204. The pixel definition layer 204 is provided on a side of the dielectric structure layer 20 away from the substrate. The pixel definition layer 204 exposes at least a part of the surface of the dielectric structure layer 20. The pixel definition layer 204 in the virtual pixel area 210 may be connected to the pixel definition layer in the display area 100 as a whole, made of the same material, and prepared by the same preparation process, thereby simplifying the process and reducing the production cost.

[0053] In an exemplary embodiment, the encapsulation structure layer includes a first inorganic encapsulation layer 301, a second inorganic encapsulation layer 302 arranged in sequence along the direction away from the substrate 101, and an organic encapsulation layer 303 disposed between the first inorganic encapsulation layer 301 and the second inorganic encapsulation layer 302. The first inorganic encapsulation layer 301 and the second inorganic encapsulation layer 302 extend along the direction away from the display area 100, covering in sequence the pixel definition layer 204, the exposed surface of the dielectric structure layer 20, and the filling layer 121 in the virtual pixel area 210, extending to the isolation area 220, and covering the first isolation wall 401 and the second isolation wall 402 in the isolation area 220; the organic encapsulation layer 303 extends along the direction away from the display area 100, covering in sequence the pixel definition layer 204, the exposed surface of the dielectric structure layer 20, and the filling layer 121 in the virtual pixel area 210, extending to the first isolation wall 401 of the isolation area 220, and being blocked by the first isolation wall 401.

[0054] In an exemplary embodiment, the virtual pixel area 210 further includes a color filter structure layer. The color filter structure layer is disposed on the side of the encapsulation structure layer away from the substrate. The surface of the color filter structure layer away from the substrate is flat and has a uniform thickness.

[0055] In the embodiment of the present disclosure, the display substrate fills the isolation groove 11 through the filling layer 121, reducing the step difference formed by the isolation groove 11, thereby reducing the step difference formed by the encapsulation structure layer at the isolation groove 11, ensuring the flatness of the color filter structure layer on the encapsulation structure layer, and improving the uniformity of the edge light emission of the display substrate.

[0056] Figure 4 This is a simulation schematic diagram of a display substrate provided by an embodiment of the present disclosure. Among them, Figure 4 It schematically shows the structure of the display substrate before forming the encapsulation structure layer. As Figure 4 shown, the filling layer 121 in the virtual pixel area 210 fills the isolation groove 11, which can effectively reduce the step difference formed by the isolation groove 11, making the surface of the filling layer 121 and the surface of the dielectric structure layer 20 form a flat surface, avoiding the filling of the isolation groove 11 by the material of the organic encapsulation layer 303 during the leveling process, ensuring the uniformity of the leveling of the organic encapsulation layer 303 material in the border area, ensuring the encapsulation effect of the organic encapsulation layer 303 above the filling layer 121, and enabling the organic encapsulation layer 303 to provide a flat support surface for the subsequent formed film layer (such as the color filter structure layer).

[0057] Figure 5 This is a cross-sectional structure schematic diagram of another display substrate provided by an embodiment of the present disclosure. Among them, Figure 5 It schematically shows the structure of the display substrate before forming the encapsulation structure layer. The structure of the virtual pixel area of the display substrate in this exemplary embodiment is basically the same as that of the display substrate in the embodiment Figure 3 shown. The difference is that, as Figure 5As shown, in this exemplary embodiment, the virtual pixel region of the substrate further includes a raised structure 122, at least a part of the raised structure 122 is disposed on the side of the organic encapsulation layer 303 close to the substrate, and the raised structure 122 is configured to impede the flow of the organic encapsulation layer 303 and prevent the overflow of the organic encapsulation layer.

[0058] In an exemplary embodiment, the raised structure 122 is disposed on the surface of the dielectric structure layer 20 away from the substrate and on the surface of the filling layer 121 away from the substrate. The first inorganic encapsulation layer 301 of the encapsulation structure layer covers the raised structure 122, and at least a part of the orthographic projection of the organic encapsulation layer 303 of the encapsulation structure layer on the substrate overlaps with the orthographic projection of the raised structure 122 on the substrate.

[0059] In some embodiments, the raised structure may also be disposed on the surface of the pixel defining layer in the virtual pixel region away from the substrate, which will not be elaborated herein in the present disclosure; or, the raised structure may be only disposed on the surface of the filling layer away from the substrate; or, the raised structure may be only disposed on the surface of the dielectric structure layer away from the substrate, which will not be elaborated herein in the present disclosure.

[0060] In an exemplary embodiment, the raised structure 122 may be disposed on the same layer as the spacer layer in the display region, made of the same material, and prepared by the same manufacturing process, thereby simplifying the process and reducing the production cost. Among them, the spacer layer in the display region is disposed on the pixel defining layer and is configured to support the mask plate for evaporating the light-emitting functional layer.

[0061] In an exemplary embodiment, the ratio of the height of the raised structure 122 to the height of the spacer layer in the display region may be greater than or equal to 1 / 3 and less than or equal to 2 / 3. For example, the height of the raised structure 122 may be greater than or equal to 0.5 micrometer and less than or equal to 1 micrometer.

[0062] In an exemplary embodiment, the raised structure 122 includes a plurality of flow-blocking columns 122-1 disposed at intervals, the plurality of flow-blocking columns 122-1 may be arranged in an array, and the plurality of flow-blocking columns 122-1 are configured to impede the flow of the organic encapsulation layer 303 and prevent the overflow of the organic encapsulation layer.

[0063] In an exemplary embodiment, the shape of the flow-blocking column 122-1 may include at least one of a cylindrical shape, a frustum shape, a pyramid shape, a rectangular column shape, a pentagonal column shape, a hexagonal column shape, or other polygonal column shapes. The flow-blocking column 122-1 may be a single-layer film structure, and the flow-blocking column 122-1 may include an organic material or an inorganic material; or, the flow-blocking column 122-1 may be a multi-layer film stacked structure. For example, the flow-blocking column 122-1 may be a stacked structure of multiple inorganic layers.

[0064] Figure 6A schematic plan view of another raised structure of a display substrate provided by an embodiment of the present disclosure. Among them, Figure 6 illustrates Figure 5 a schematic plan view of the raised structure in Figure 6 As shown, the shape of the positive projection of the flow-blocking pillar 122-1 on the substrate is a rectangle. The length of the outer contour of the positive projection of the flow-blocking pillar 122-1 on the substrate in the first direction X is greater than or equal to 5 microns and less than or equal to 10 microns, and the length of the outer contour of the positive projection of the flow-blocking pillar 122-1 on the substrate in the second direction Y is greater than or equal to 5 microns and less than or equal to 10 microns. Among them, the first direction X and the second direction Y are perpendicular to each other.

[0065] In some embodiments, the shape of the positive projection of the flow-blocking pillar on the substrate may be at least one of a circle, an ellipse, a triangle, a rectangle, a trapezoid, and polygons such as a pentagon and a hexagon.

[0066] In an exemplary embodiment, the ratio of the total volume of the raised structure 122 to the total volume of the organic encapsulation layer 303 in the virtual pixel region 210 may be greater than or equal to 1 / 10 and less than or equal to 1 / 5. For example, taking the total volume of the organic encapsulation layer 303 in the virtual pixel region 210 as 10,000 cubic microns as an example, the total volume of the raised structure 122 in the virtual pixel region 210 is greater than or equal to 1,000 cubic microns and less than or equal to 2,000 cubic microns, the volume of the flow-blocking pillar 122-1 is greater than or equal to 50 cubic microns and less than or equal to 100 cubic microns, and the number of the flow-blocking pillars 122-1 is greater than or equal to 10 and less than or equal to 20.

[0067] The display substrate of the embodiment of the present disclosure hinders the flow of the material of the organic encapsulation layer 303 through the flow-blocking pillar 122-1, avoiding the overflow of the organic encapsulation layer 303, and is applicable to products with good leveling properties.

[0068] Figure 7 A schematic plan view of another raised structure of a display substrate provided by an embodiment of the present disclosure. The structure of the raised structure of the display substrate in this exemplary embodiment is basically the same as that of the raised structure of the display substrate in the embodiment shown in Figure 6 The difference is that, as shown in Figure 7 As shown, the raised structure 122 of the display substrate in this exemplary embodiment includes at least one flow-blocking wall 122-2. At least one flow-blocking wall 122-2 extends along the outer contour of the display area 100, and at least one flow-blocking wall 122-2 is arranged at intervals along the direction away from the display area 100. At least one flow-blocking wall 122-2 is configured to hinder the flow of the organic encapsulation layer 303 and avoid the overflow of the organic encapsulation layer.

[0069] In an exemplary embodiment, the flow-blocking wall 122-2 includes a plurality of flow-blocking main body portions 122-2-1 arranged along the outer contour direction of the display area 100 and flow-blocking connection portions 122-2-2 connecting adjacent flow-blocking main body portions. The shape of the flow-blocking main body portion 122-2-1 can be arc-shaped, and the flow-blocking main body portion 122-2-1 bends along the direction away from the display area 100. The shape of the flow-blocking connection portion 122-2-2 can be rectangular columnar, and the flow-blocking connection portions 122-2-2 are respectively connected to the ends of adjacent flow-blocking main body portions 122-2-1.

[0070] In some embodiments, the shape of the flow-blocking main body portion can also be an arc-shaped that bends along the direction close to the display area; or, the shape of the flow-blocking main body portion can also be a broken line shape that bends along the direction close to or away from the display area. The present disclosure will not elaborate herein.

[0071] In the embodiment of the present disclosure, the display substrate blocks the flow of the organic encapsulation layer 303 material through the flow-blocking wall 122-2, avoiding the overflow of the organic encapsulation layer 303, and is applicable to products with good leveling properties.

[0072] Figure 8 This is a schematic plan view of the convex structure of another display substrate provided by the embodiment of the present disclosure. The structure of the convex structure of the display substrate in this exemplary embodiment is basically the same as that of the convex structure of the display substrate in the embodiment Figure 6 shown. The difference is that, as Figure 8 shown, the convex structure 122 of the display substrate in this exemplary embodiment includes a plurality of drainage walls 122-3. The plurality of drainage walls 122-3 extend along the direction away from the display area 100, and the plurality of drainage walls 122-3 are arranged at intervals along the outer contour direction of the display area 100. A drainage groove 122-4 is provided between adjacent drainage walls 122-3. The drainage groove 122-4 extends along the direction away from the display area 100, and the drainage groove 122-4 is configured to accelerate the flow of the organic encapsulation layer 303 material from the display area 100 towards the isolation area 220.

[0073] In the embodiment of the present disclosure, the display substrate accelerates the flow of the organic encapsulation layer 303 material from the display area 100 towards the isolation area 220 through the drainage groove 122-4, and is applicable to products with poor leveling properties.

[0074] In an exemplary embodiment, the drainage wall 122-3 can be a laminated structure of multiple film layers. For example, the drainage wall 122-3 includes a plurality of drainage columns 122-3-1 and a drainage connection layer 122-3-2. The plurality of drainage columns 122-3-1 are arranged at intervals along the direction away from the display area. The drainage connection layer 122-3-2 is disposed on the side of the plurality of drainage columns 122-3-1 away from the substrate. The shape of the drainage connection layer 122-3-2 is a strip extending along the direction away from the display area. The drainage connection layer 122-3-2 is configured to connect adjacent drainage columns 122-3-1 together and enclose the interval between adjacent drainage columns 122-3-1, so that the drainage wall 122-3 forms a continuous film layer extending along the direction away from the display area.

[0075] In some embodiments, the drainage wall can be a single film layer structure, and the shape of the drainage wall is a strip extending along the direction away from the display area.

[0076] The present disclosure also provides a display device, which includes the aforementioned display substrate. The display device can be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any product or component with a display function. The embodiments of the present invention are not limited thereto.

[0077] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0078] In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include at least one of such features.

[0079] In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0080] In this application, unless otherwise clearly specified or limited, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0081] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first feature and the second feature are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature in terms of horizontal height. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature in terms of horizontal height.

[0082] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "examples", "specific examples" or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0083] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display substrate, characterized in that, Comprising: A display area and a border area arranged around the display area; the border area includes a virtual pixel area and an isolation area arranged in sequence along the direction away from the display area, the virtual pixel area includes an encapsulation structure layer arranged on a substrate, the encapsulation structure layer at least includes an organic encapsulation layer, an isolation groove is arranged in the virtual pixel area, the isolation groove is arranged on the side of the organic encapsulation layer close to the substrate, a filling layer is arranged in the isolation groove, and at least part of the orthographic projection of the organic encapsulation layer on the substrate overlaps with the orthographic projection of the filling layer on the substrate.

2. The display substrate according to claim 1, wherein The virtual pixel area further includes a dielectric structure layer, the dielectric structure layer is arranged between the encapsulation structure layer and the substrate, the isolation area includes a first isolation wall arranged on the substrate, the first isolation wall is configured to block the flow of the organic encapsulation layer, and an isolation groove is formed between the side surface of the dielectric structure layer away from the display area and the first isolation wall; one side of the filling layer close to the display area is connected to the side surface of the dielectric structure layer away from the display area, and one side of the filling layer away from the display area is connected to the first isolation wall.

3. The display substrate according to claim 2, wherein The surface of the filling layer away from the substrate is substantially flush with the surface of the dielectric structure layer away from the substrate.

4. The display substrate according to claim 1, wherein, A signal trace is arranged on the side of the isolation groove close to the substrate, and at least part of the orthographic projection of the filling layer on the substrate overlaps with the orthographic projection of the signal trace on the substrate.

5. The display substrate according to any one of claims 1 to 4, characterized in that The virtual pixel area further includes a convex structure, at least part of the convex structure is arranged between the surface of the filling layer away from the substrate and the organic encapsulation layer, and the convex structure is configured to impede or accelerate the flow of the organic encapsulation layer.

6. The display substrate according to claim 5, wherein, The convex structure includes a plurality of flow-blocking columns arranged at intervals, and the plurality of flow-blocking columns are configured to impede the flow of the organic encapsulation layer.

7. The display substrate according to claim 5, wherein The convex structure includes at least one flow-blocking wall, the at least one flow-blocking wall extends along the outer contour of the display area, and the at least one flow-blocking wall is configured to impede the flow of the organic encapsulation layer.

8. The display substrate according to claim 7, wherein, The at least one flow-blocking wall includes a plurality of flow-blocking main parts and flow-blocking connecting parts connecting adjacent flow-blocking main parts, the shape of the flow-blocking main part is arc-shaped, and the shape of the flow-blocking connecting part is column-shaped.

9. The display substrate according to claim 5, wherein The convex structure includes a plurality of drainage walls, the plurality of drainage walls extend along the direction away from the display area, a drainage groove extending along the direction away from the display area is arranged between adjacent drainage walls, and the drainage groove is configured to accelerate the flow of the organic encapsulation layer material along the direction away from the display area.

10. The display substrate according to claim 5, wherein The ratio of the total volume of the convex structure to the total volume of the organic encapsulation layer in the virtual pixel area is greater than or equal to 1 / 10 and less than or equal to 1 / 5.

11. The display substrate according to claim 5, wherein The height of the convex structure is greater than or equal to 0.5 micrometers and less than or equal to 1 micrometer.

12. A display device, characterized in that, Including the display substrate according to any one of claims 1 to 11.

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