Display mother board, detection method thereof and display panel

Abstract

The invention provides a display mother board and a detection method thereof, and a display panel, and relates to the technical field of display, the display mother board comprises a color film substrate and an array substrate; the array substrate comprises a panel area opposite to the color film substrate and a test wiring area located on one side of the panel area. The panel area comprises a mother board conductive part and a plurality of display panel units, and the test wiring area comprises a first test pad and a plurality of unit test pads in one-to-one correspondence with the display panel units; the mother board conductive piece is electrically connected with the first test pad; a display panel unit conductive part is arranged around the edge of each display panel unit, the display panel unit conductive parts are electrically connected with the common electrode layer of the color film substrate and the common electrode layer of the array substrate respectively, and the display panel unit conductive parts are further electrically connected with the unit test pads corresponding to the display panel units. According to the technical scheme provided by the invention, the detection difficulty of the conductivity of each display panel unit in the display mother board can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display mother board, a detection method thereof, and a display panel. Background Art

[0002] In the manufacturing process of a liquid crystal display panel, a display mother board may include a plurality of display panel units. Each display panel unit can form a liquid crystal display panel after the mother board cutting process. In each display panel unit, liquid crystal is filled between the upper alignment film of the color filter substrate and the lower alignment film of the array substrate, and the upper common electrode layer of the color filter substrate is electrically connected to the lower common electrode layer of the array substrate through a gold ball.

[0003] The main component of the alignment film is polyimide (PI). PI is an insulating material formed by a polymer. If the alignment film expands to the position where the gold ball contacts the upper / lower common electrode layer before curing, the conductivity of the gold ball will decrease. Therefore, in order to prevent defective liquid crystal display panels with poor conductivity from flowing into subsequent production processes or the market, it is necessary to detect the conduction effect of the display panel units.

[0004] However, in each display mother board, the upper common electrode layer of the color filter substrate is formed as a whole surface, and the traces in the lower common electrode layer of the array substrate are connected together. Therefore, it is relatively difficult to detect the conductivity of a single display panel unit. Summary of the Invention

[0005] In view of this, the present application provides a display mother board, a detection method thereof, and a display panel, which are used to reduce the difficulty of detecting the conductivity of each display panel unit in the display mother board.

[0006] To achieve the above object, in a first aspect, an embodiment of the present application provides a display mother board, which includes: a color filter substrate and an array substrate;

[0007] The array substrate includes: a panel area opposite to the color filter substrate, and a test trace area located on one side of the panel area;

[0008] The panel area includes a mother board conductive member and a plurality of display panel units. The test trace area includes a first test pad and a plurality of unit test pads corresponding to the plurality of display panel units one by one; the mother board conductive member is electrically connected to the first test pad;

[0009] Each display panel unit is surrounded by a display panel unit conductive member. The display panel unit conductive members are respectively electrically connected to the common electrode layer of the color filter substrate and the common electrode layer of the array substrate, and the display panel unit conductive members are also electrically connected to the unit test pads corresponding to the display panel units.

[0010] In a possible implementation manner of the first aspect, a second test pad, a control signal pad, a control signal line, and a plurality of switching tubes are further arranged in the test trace area;

[0011] The first end of each switching tube is electrically connected to the second test pad, the second end of each switching tube is electrically connected to the corresponding unit test pad, and the control end of each switching tube is electrically connected to the control signal pad through the control signal line. The control signal pad is used to transmit a on-off control signal for controlling the on-off of each switching tube through the control signal line.

[0012] By setting the control signal pad to control the on-off of each switching tube, when each switching tube is turned on, the detection device can transmit a lighting test signal to the display panel unit through the second test pad and each switching tube, so as to facilitate the lighting test; when each switching tube is turned off, each display panel unit can be made independent, and the detection device can detect the impedance between any two of the first test pad and the unit test pads, and match according to the impedance and the threshold range to determine whether the conductivity between the two test pads is normal, thereby improving the practicability and applicability of the display mother board.

[0013] In a possible implementation manner of the first aspect, there are two second test pads, and the two second test pads are respectively arranged on opposite sides of the test trace area.

[0014] Through the above implementation manner, when performing the lighting test, the second test pads on both sides can input the same signal at the same time, reducing the delay generated during the signal transmission process, so that the intensity of the lighting signals received by each display panel unit is basically the same.

[0015] In a possible implementation manner of the first aspect, there are two mother board conductive members and two first test pads. The two mother board conductive members and the two first test pads are connected in one-to-one correspondence, and the two mother board conductive members are respectively arranged in the blank areas on opposite sides of the panel area.

[0016] Through the above implementation manner, when the conductivity of one of the mother board conductive members is poor, the other mother board conductive member can still be used for detection, thereby improving the reliability of the display mother board. The mother board conductive members are arranged in the blank areas of the panel area, which can not affect the area of the display panel unit and can also avoid damaging the display panel unit when cutting the display mother board.

[0017] In a second aspect, an embodiment of the present application provides a method for detecting a display mother board, which is applied to the display mother board as described in the first aspect or any item of the first aspect. The method includes:

[0018] When the detection signal output terminal of the detection device is connected to the first target test pad in the display motherboard and the detection signal receiving terminal of the detection device is connected to the second target test pad in the display motherboard, obtain the first detection result output by the detection device; wherein, the first target test pad and the second target test pad are any two test pads among the first test pads and the unit test pads in the display motherboard, and the first detection result is used to indicate the resistance value or voltage between the first target test pad and the second target test pad.

[0019] When the detection result of the detection device exceeds the target threshold range, determine that the first target test pad and the second target test pad are not conducting.

[0020] In a possible implementation manner of the second aspect, two of the first test pads are provided.

[0021] Before obtaining the first detection result output by the detection device when the detection signal output terminal of the detection device is connected to the first target test pad in the display motherboard and the detection signal receiving terminal of the detection device is connected to the second target test pad in the display motherboard, the method further includes:

[0022] When the two first test pads are respectively connected to the detection signal output terminal and the detection signal receiving terminal of the detection device in a one-to-one correspondence, obtain the second detection result output by the detection device.

[0023] If the second detection result is within the target threshold range, determine that the conduction between the two first test pads is normal.

[0024] If the second detection result is not within the target threshold range, determine that the two first test pads are not conducting.

[0025] In a possible implementation manner of the second aspect, if the two first test pads are not conducting, the method further includes:

[0026] Obtain a plurality of third detection results output by the detection device, and the plurality of third detection results include: the detection results obtained when the detection signal output terminal of the detection device is connected to any one of the first test pads and the detection signal receiving terminal of the detection device is successively connected to the unit test pads in the display motherboard.

[0027] If there is a detection result within the target threshold range, determine that the first test pad connected to the detection signal output terminal and the unit test pad connected to the detection signal receiving terminal of the detection device are conducting normally.

[0028] In a possible implementation of the second aspect, after determining that the conduction between the two first test pads is normal, connect the detection signal output terminal and the detection signal receiving terminal of the detection device to any two unit test pads respectively, and obtain a fourth detection result output by the detection device;

[0029] When the fourth detection result is within the target threshold range, determine that the conduction between the two unit test pads is normal.

[0030] In a possible implementation of the second aspect, before connecting the detection device to the first target test pad and the second target test pad respectively, the method further includes:

[0031] Control each switching transistor in the display mother board to be turned off through the control signal pad.

[0032] In a third aspect, an embodiment of the present application provides a display panel, which is cut from the display mother board described in the first aspect or any one of the first aspects above.

[0033] The display mother board provided by the embodiment of the present application includes a color filter substrate and an array substrate; the array substrate includes: a panel area opposite to the color filter substrate, and a test trace area located on one side of the panel area; the panel area includes a mother board conductive member and a plurality of display panel units, and the test trace area includes a first test pad and a plurality of unit test pads corresponding to the display panel units one by one; the mother board conductive member is electrically connected to the first test pad; a display panel unit conductive member is disposed around the edge of each display panel unit, and the display panel unit conductive members are respectively electrically connected to the common electrode layer of the color filter substrate and the common electrode layer of the array substrate, and the display panel unit conductive member is also electrically connected to the unit test pad corresponding to the display panel unit. Through the above implementation, the impedance (or called resistance value) between any two test pads in the first test pad and the unit test pad can be detected, and whether the two test pads are normally conducted can be determined according to the matching result between the detected resistance value and the target threshold range, thereby reducing the detection difficulty of the conduction of each display panel unit in the display mother board.

[0034] It can be understood that the beneficial effects of the above second aspect and third aspect can be referred to the relevant descriptions in the first aspect above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a top view schematic diagram of the display mother board provided by the embodiment of the present application;

[0036] Figure 2 is a structural schematic diagram of the display mother board provided by the embodiment of the present application;

[0037] Figure 3The cross-sectional view of the display panel unit provided by the embodiment of the present application along the line A-A';

[0038] Figure 4 The structural schematic diagram of the motherboard conductive part and the motherboard conductive part fixing part provided by the embodiment of the present application:

[0039] Figure 5 The flow schematic diagram of the display motherboard detection method provided by the embodiment of the present application;

[0040] Figure 6 The schematic diagram for detecting the conductivity between the first test pad and the display panel unit provided by the embodiment of the present application;

[0041] Figure 7 The schematic diagram for detecting the conductivity between two display panel units provided by the embodiment of the present application;

[0042] Figure 8 The schematic diagram for detecting the conductivity of the display panel unit when the first test pad is conducting normally provided by the embodiment of the present application;

[0043] Figure 9 The detection schematic diagram when the first test pad is not conducting provided by the embodiment of the present application.

[0044] Explanation of reference numerals:

[0045] PA - Panel area; TA - Test trace area; Array - Array substrate; CF - Color filter substrate; LC - Liquid crystal layer; SC - Control signal pad;

[0046] 10 - Display motherboard; 100 - Display panel unit; 100a - Display panel unit; 100b - Display panel unit; 100y - Display panel unit;

[0047] 1001 - First substrate; 1002 - First common electrode layer; 1003 - First alignment film; 1004 - Second substrate; 1005 - Second common electrode layer; 1006 - Second alignment film; 1007 - Display panel unit conductive part; 1008 - Frame adhesive; 1009 - First test pad; 1010 - Unit test pad; 1011 - First test line; 1012 - Second test pad; 1013 - Switching tube; 1014 - Short connection wire; 1015 - Second test line; 1016 - Control signal line;

[0048] 110 - Motherboard conductive part; 120 - Motherboard conductive part fixing part;

[0049] 20 - Detection device. Detailed implementation manners

[0050] The terms used in the implementation part of the embodiments of this application are only for explaining the specific embodiments of this application, rather than aiming to limit this application. These several specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0051] Figure 1 This is a top view schematic diagram of a display mother board provided for an embodiment of this application. As Figure 1 shown, the display mother board 10 can be composed of multiple display panel units 100, and each display panel unit 100 can become a display panel after the mother board cutting process.

[0052] The display mother board 10 can include a colour filter (CF) substrate and an array substrate, and the common electrode layers of the colour filter substrate and the array substrate are conductively connected through a conductive member. The common electrode layers on the CF side and the array side are usually made of indium tin oxide (ITO) to improve the light transmittance.

[0053] The alignment film is usually coated with polyimide film. Compared with the alignment film made of photosensitive resin, it has a lower preparation cost and thus has been widely used. When preparing the alignment film, since the PI solution is in a liquid state during coating and has fluidity, under the action of the liquid surface tension, there will be a situation where the PI solution spreads outside to the ITO under the conductive member, resulting in the conductive member being unable to pierce the alignment film on the CF side and contact the ITO on the array side. Moreover, the PI film is an insulating film formed by a polymer, which makes the common electrode signal on the array side unable to be conducted to the CF side through the conductive member, thus resulting in abnormal conduction and a situation of screen flickering, and further causing a series of functional problems.

[0054] In order to determine whether there is an unconnected problem in the display panel before the back-end process (including partial sticking and bonding), it is necessary to perform electrical detection on the display panel unit in the front-end. The electrical detection can include voltage drop detection, resistance detection, etc. For the convenience of description, the following will take resistance detection as an example for explanation. By measuring the resistance value between the common electrode layer on the CF side and the common electrode layer on the array side of the display panel unit 100, when the conduction is poor, the order of magnitude of the resistance value is usually in megohms, so that it can be determined whether the display panel unit can directly proceed to the next process according to the resistance value.

[0055] On the CF side, the ITO is coated over the entire surface. That is, in the display mother board composed of multiple display panel units 100, the common electrode layer on the CF side is continuous across the whole board, while the common electrode layer on the Array side is formed by connecting all the common electrode lines together. This makes it very difficult to measure the conduction relationship of a single display panel unit 100 in the display mother board. Even if it is detected that there is a conduction defect in the display panel units 100 of the display mother board, it is impossible to determine the corresponding display panel unit 100. Only all the display panel units 100 in the display mother board can be judged as having conduction defects. This not only causes a decrease in the product yield, but also consumes a large amount of manpower and material resources additionally, and reduces the detection efficiency of the detection process.

[0056] In view of this, an embodiment of the present application provides a display mother board, which may include: a color filter substrate and an array substrate. Among them, the array substrate may include: a panel area opposite to the color filter substrate, and a test trace area located on one side of the panel area. The panel area may include a mother board conductive member (or referred to as a large board conductive member) and a plurality of display panel units. The test trace area may include a first test pad and a plurality of unit test pads corresponding to the display panel units one by one. The mother board conductive member may be electrically connected to the first test pad. The edge of each display panel unit may be surrounded by a display panel unit conductive member, and the display panel unit conductive member may be electrically connected to the common electrode layer of the color filter substrate and the common electrode layer of the array substrate respectively.

[0057] Through the above implementation manner, the detection difficulty of the conductivity of each display panel unit in the display mother board can be reduced. Thus, before the bias bonding is performed, the resistance value of any display panel unit in the display mother board can be detected, avoiding the situation of wasting manpower and material resources due to the detection of conduction defects in subsequent processes, and the detection accuracy can be verified multiple times.

[0058] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0059] Figure 2 It is a schematic structural diagram of the display mother board provided by the embodiment of the present application. Figure 3 It is a cross-sectional view of the display panel unit along the line A-A' provided by the embodiment of the present application. Figure 4 It is a schematic structural diagram of the mother board conductive member and the mother board conductive member fixing part provided by the embodiment of the present application. Refer to Figures 2 to 4 , the display mother board 10 may include a panel area PA and a test trace area TA. In the panel area PA, a plurality of display panel units 100 may be included, and the number of display panel units 100 may be set according to actual needs.

[0060] Each display panel unit 100 may include a display area and a non-display area (not shown). The display area may include an array substrate Array and a color filter substrate CF disposed opposite to each other, and a liquid crystal layer LC located between the array substrate Array and the color filter substrate CF. The edge of the display panel unit 100 (i.e., the non-display area) may enclose a display panel unit conductive member 1007. The array substrate Array may include a first substrate 1001, a first common electrode layer 1002, and a first alignment film 1003 disposed in a stacked manner. The color filter substrate CF may include a second substrate 1004, a second common electrode layer 1005, and a second alignment film 1006 disposed in a stacked manner. The first common electrode layer 1002 and the second common electrode layer 1005 are connected by the display panel unit conductive member 1007. In other words, the display panel unit conductive member 1007 may transfer the voltage on the array substrate Array to the color filter substrate CF, or transfer the voltage on the color filter substrate CF to the array substrate Array to form an electric field between the first common electrode layer 1002 and the second common electrode layer 1005.

[0061] It should be noted that the first common electrode layer 1002 is part of the common electrode layer on the Array side, and the second common electrode layer 1005 is part of the common electrode layer on the CF side.

[0062] The first substrate 1001 and the second substrate 1004 may serve as carriers to facilitate the preparation of other film layers thereon. The first common electrode layer 1002 and the second common electrode layer 1005 may form an electric field under a driving signal to drive the liquid crystal molecules in the liquid crystal layer LC to deflect. The first alignment film 1003 and the second alignment film 1006 may provide an initial pretilt angle for the liquid crystal molecules to facilitate the deflection of the liquid crystal molecules. The PI liquid for preparing the first alignment film 1003 and the second alignment film 1006 has fluidity before being formed. If it covers the first common electrode layer 1002 and the second common electrode layer 1005, it will cause an abnormal electric field intensity between the first common electrode layer 1002 and the second common electrode layer 1005 of the display panel unit 100, and the liquid crystal molecules cannot deflect normally.

[0063] The panel area PA may further include a motherboard conductive member 110. The motherboard conductive member 110 may be a gold ball, a silver ball, or other conductive materials for connecting the common electrode layer on the CF side and the common electrode layer on the Array side. The materials of the display panel unit conductive member 1007 and the motherboard conductive member 110 may be the same to reduce the preparation difficulty.

[0064] The motherboard conductive member 110 can be disposed in the blank area (or referred to as the Dummy area, i.e., the area where the display panel unit 100 is not disposed). In terms of process, since the conductivity detection of each display panel unit 100 has been completed when cutting the display motherboard 10, in the embodiment of the present application, disposing the motherboard conductive member 110 in the blank area will not affect the normal cutting of the blank area, and can also avoid damaging the display panel unit 100 when cutting the display motherboard 10, thereby improving the rationality of the manufacturing process.

[0065] The motherboard conductive member 110 can be individually disposed in a dot form at the positions where the CF-side common electrode layer and the Array-side common electrode layer need to be electrically connected. In some embodiments, a motherboard conductive member fixing portion 120 can also be disposed in the blank area, and the motherboard conductive member 110 can be doped in the motherboard conductive member fixing portion 120. On the one hand, the motherboard conductive member fixing portion 120 can fix the motherboard conductive member 110 and can support the color filter substrate CF and the array substrate Array in the blank area, maintaining the flatness and thickness of the display motherboard 10. On the other hand, the motherboard conductive member fixing portion 120 can also absorb the stress generated when cutting the display motherboard 10, reducing the deformation or rupture of the display motherboard 10 under the influence of stress and the alignment deviation of the color filter substrate CF and the array substrate Array. On the third hand, the motherboard conductive member fixing portion 120 can also play an insulating role, reducing electromagnetic interference and protecting the motherboard conductive member 110 from the influence of oxidation.

[0066] It can be understood that in the embodiment of the present application, the function of the motherboard conductive member 110 is to connect the CF-side common electrode layer and the Array-side common electrode layer. Therefore, the motherboard conductive member 110 can be locally disposed only in the panel area PA. Correspondingly, the motherboard conductive member fixing portion 120 can also be locally disposed, thereby reducing material waste and the preparation amount of the manufacturing process, optimizing the resource allocation of the manufacturing process, and facilitating the formation of a display panel after cutting the display motherboard 10. In addition, this can also facilitate the connection of the display panel unit 100 to the first test pad 1009 and reduce the wiring difficulty.

[0067] The area of the array substrate Array exceeding the panel area PA can form a test wiring area TA. In the test wiring area TA, a first test pad 1009 and a plurality of unit test pads 1010 corresponding to the display panel units 100 one by one can be disposed. The first test pad 1009 can be electrically connected to the motherboard conductive member 110 through a first test line 1011. The unit test pad 1010 can be electrically connected to the display panel unit conductive member 1007 of the corresponding display panel unit 100 through a second test line 1015, so that the detection signal can be transmitted to the display panel unit 100.

[0068] In some embodiments, in the blank area of the panel area PA, an external pin (not shown) may be further provided between the display panel unit conductive member 1007 and the unit test pad 1010 of each display panel, so as to be exposed after the mother board is cut, facilitating the detection of the display panel formed by each display panel unit 100. The preparation materials of the first test pad 1009 and the unit test pad 1010 may be the same as those of the first common electrode layer 1002, which is convenient for preparation.

[0069] Taking the display panel unit 100a as an example, the mother board conductive member 110 can be electrically connected to the corresponding unit test pad 1010 through the CF-side common electrode layer, the display panel unit conductive member 1007 of the display panel unit 100a, and the Array-side common electrode layer, so as to form a detection signal loop when detecting the resistance value between the first test pad 1009 and the unit test pad 1010, thereby determining whether the display panel unit 100a is conducting.

[0070] By arranging the first test pad 1009 and the unit test pad 1010 in the test trace area TA, it is convenient to cut the mother board of the display mother board 10 without damaging the display panel unit 100 after the conductivity detection of the display panel unit 100 is completed. In addition, this does not restrict the routing space of the common electrode layer, and the area of the prepared test pad can also be increased, so that the probe of the detection device is easier to contact the test pad, facilitating the measurement of the detection device, and thus reducing the detection difficulty. Since the probe is usually relatively sharp, compared with arranging the test pads entirely within the display panel unit 100, in the embodiment of the present application, by arranging the test pads in the test trace area TA, the number of test pads within the display panel unit 100 can be effectively reduced, facilitating the preparation of the test pads, reducing the occupied area of the test pads in the panel area PA, simplifying the routing in the panel area PA, improving the space utilization rate, and reducing the damage to the display panel unit 100 during mother board cutting and probe needle insertion, thereby improving the yield of the display panel.

[0071] The detection device can be a multimeter or an electrical detection machine tool, and the embodiment of the present application does not make any special restrictions on this. The probe of the detection device can be divided into a detection signal output end and a detection signal receiving end. For the convenience of description, they are simply referred to as the first probe and the second probe. It should be noted that the embodiment of the present application does not make any special restrictions on whether the first probe and the second probe are the detection signal output end or the detection signal receiving end. For example, when the first probe is the detection signal output end, the second probe is the detection signal receiving end. Of course, when the first probe is the detection signal receiving end, the second probe is the detection signal output end. The test pads in the embodiment of the present application can be connected to the detection signal output end of the detection device or the detection signal receiving end of the detection device, as long as a detection loop can be formed.

[0072] Taking the case where the motherboard conductive member 110 is disposed on the left side as an example, when detecting the resistance between the motherboard conductive member 110 and the y-th display panel unit 100y, the first probe can be inserted into the first test pad 1009, and the second probe can be inserted into the unit test pad 1010 corresponding to the y-th display panel unit 100y, thereby forming a detection circuit.

[0073] Considering that when the size of the display panel unit 100 is relatively large or the number of display panel units 100 is relatively large, if only one motherboard conductive member 110 and one first test pad 1009 are provided, as the distance between the motherboard conductive member 110 and the y-th display panel unit 100y at the far end increases, signal attenuation will occur during the transmission of the detection signal, resulting in a smaller intensity of the received detection signal, thereby increasing the measurement difficulty.

[0074] In an alternative implementation, with continued reference to Figure 2 , two motherboard conductive members 110 can be provided. Correspondingly, the number of first test pads 1009 can also be set to two, so that the motherboard conductive members 110 and the first test pads 1009 can be connected in a one-to-one correspondence. The two motherboard conductive members 110 can be respectively disposed on both sides of the blank area opposite to the panel area PA, which can shorten the transmission distance of the detection signal, thereby improving the detection accuracy. By providing two motherboard conductive members 110, the reliability of the display motherboard 10 can also be improved. For example, when the conductivity of one of the motherboard conductive members 110 is poor, the other motherboard conductive member 110 can still be used for detection.

[0075] Similarly, in the case where the motherboard conductive member 110 includes two, two corresponding motherboard conductive member fixing parts 120 can also be provided. The motherboard conductive member fixing parts 120 can correspond to the motherboard conductive members 110 one by one, so that each motherboard conductive member fixing part 120 can limit the corresponding motherboard conductive member 110. For the specific effects, reference can be made to the above embodiments, and the embodiments of the present application will not be elaborated herein.

[0076] It should be noted that the motherboard conductive member 110 can be disposed at any position in the blank area according to actual needs, and the embodiments of the present application do not make special restrictions on this. The number of the motherboard conductive members 110 and the first test pads 1009 can also be set according to actual needs.

[0077] A frame adhesive 1008 can be provided around the edge of each display panel unit 100. The display panel unit conductive member 1007 of each display panel unit 100 can be disposed in the frame adhesive 1008 of the display panel unit 100 to support the thickness of the display panel, reduce the influence of electrical measurement interference and static electricity on the display panel unit conductive member 1007, and prevent the liquid crystal molecules in the liquid crystal layer LC from overflowing.

[0078] In some embodiments, a second test pad 1012 is further provided in the test trace area TA, and the second test pad 1012 is electrically connected to the unit test pads 1010 of each display panel unit 100 respectively. By performing a lighting test, it can be determined whether each display panel unit 100 can be lit. When the detection device performs a lighting test, a lighting test signal can be output to each display panel unit 100 through the second test pad 1012, and the liquid crystal molecules inside each display panel unit 100 can be deflected under the driving action of the lighting test signal, thereby emitting light.

[0079] When detecting the conductivity of the display panel unit 100, the first probe and the second probe of the detection device can be used to pierce two first test pads 1009 respectively. When the resistance value between the two first test pads 1009 is within the threshold range, it can be determined that the motherboard conductive member 110 can normally conduct the common electrode layer on the CF side and the common electrode layer on the Array side, so as to make prior preparations for the subsequent conductivity detection.

[0080] The preparation materials of the second test pad 1012, the first test pad 1009, and each unit test pad 1010 can be the same. In this way, on the one hand, the preparation difficulty can be reduced and the preparation process can be reduced. On the other hand, the influence of material differences on the resistance value can be minimized as much as possible, and the accuracy of detection can be improved.

[0081] In the ideal state of the lighting test, all display panel units 100 should be lit and have the same brightness. However, due to the differences in the conductivity of the display panel unit conductive members 1007 of each display panel unit 100 with the first common electrode layer 1002 and the second common electrode layer 1005, the brightness of some display panel units 100 is relatively low.

[0082] In order to detect whether the conductivity of the display panel unit 100 with low brightness is normal, in some embodiments, the test trace area TA may further include a control signal pad SC and a plurality of switching tubes 1013 electrically connected to the control signal pad SC, and the switching tubes 1013 may also be connected to the unit test pads 1010 in one-to-one correspondence.

[0083] Specifically, the first end of each switching tube 1013 can be electrically connected to the second test pad 1012 through a short wire 1014, the second end can be electrically connected to the corresponding unit test pad 1010 through a second test wire 1015, and the control end can be electrically connected to the control signal pad SC through a control signal line 1016. The on / off of each switching tube 1013 can be controlled by an on / off control signal output by the control signal pad SC. The number of control signal lines 1016 can be multiple, and each control signal line 1016 is respectively connected to the control end of a switching tube 1013 to control the on / off of the corresponding switching tube 1013. In some embodiments, such as Figure 2As shown, the control terminals of the respective switching transistors 1013 can also be connected to the same control signal line 1016, thereby simplifying the circuit.

[0084] The switching transistor 1013 can be an N-channel Metal-Oxide-Semiconductor (NMOS) or a P-channel Metal-Oxide-Semiconductor (PMOS). Among them, the NMOS conducts when the on-off control signal output by the control signal pad SC is a high-level signal and cuts off (or is called off) when the on-off control signal output by the control signal pad SC is a low-level signal; the PMOS cuts off when the on-off control signal output by the control signal pad SC is a low-level signal and conducts when the on-off control signal output by the control signal pad SC is a high-level signal. For the convenience of description, the following takes the switching transistor 1013 as an NMOS as an example for description.

[0085] After determining that the two motherboard conductive members 110 can conduct normally, during the lighting test, the on-off control signal that the control signal pad SC can output is the first level (such as a high level), and the respective switching transistors 1013 conduct, and the lighting test signal can pass through the connection between the second test pad 1012, the respective switching transistors 1013, the unit test pad 1010 and the display panel unit conductive member 1007 of each display panel unit 100, so as to transmit the lighting test signal to the display panel unit 100. Exemplarily, if the brightness of the a-th display panel unit 100a is low, it can be determined that the electric field generated between the first common electrode layer 1002 and the second common electrode layer 1005 is not sufficient to deflect the liquid crystal molecules to the normal angle, that is, the display panel unit conductive member 1007 may not be able to conduct the first common electrode layer 1002 and the second common electrode layer 1005 normally, and the resistance value of the a-th display panel unit 100a is relatively large.

[0086] When the on-off control signal output by the control signal pad SC is the second level (such as a low level), the respective switching transistors 1013 cut off, and the respective display panel units 100 can be independent of each other and not interfere with each other. Continuing with the example of the low brightness of the a-th display panel unit 100a, for verification, the first probe of the detection device can also be pricked on the unit test pad 1010 of the a-th display panel unit 100a, and the second probe can be pricked on the unit test pad 1010 of another display panel unit 100 with normal display brightness, or any first test pad 1009. If the resistance value exceeds the threshold range, it is determined that the a-th display panel unit 100a does have a conduction failure. Through the above embodiments, the display panel unit 100 can be verified, thereby effectively reducing the false detection rate.

[0087] If the two motherboard conductive components 110 cannot conduct properly, in some embodiments, the first probe of the detection device can be first pricked onto the first test pad 1009, for example, the left first test pad 1009, and the second probe is pricked onto the unit test pad 1010 corresponding to the a-th display panel unit 100a. If the resistance value is normal, it proves that the left motherboard conductive component 110 conducts normally. If the resistance value exceeds the threshold range, at least one of the left motherboard conductive component 110 and the a-th display panel unit 100a is not conducting. The second probe can be re-pricked onto any display panel unit 100 other than the a-th display panel unit 100, for example, the b-th display panel unit 100b, so as to measure the resistance value between the left first test pad 1009 and the b-th display panel unit 100b. If the resistance value is normal, it is determined that the left first test pad 1009 and the b-th display panel unit 100b conduct normally. For verification, the resistance value between the a-th display panel unit 100a and the b-th display panel unit 100b can also be measured. When the resistance value is normal, it is determined that the left motherboard conductive component 110, the a-th display panel unit 100a, and the b-th display panel unit 100b all conduct normally, and the right motherboard conductive component 110 is not conducting.

[0088] During actual detection, the display panel unit 100 with good conduction can be used as a reference unit, which is convenient for screening the non-conducting display panel units 100.

[0089] Similarly, by respectively pricking the first probe and the second probe of the detection device onto the unit test pads 1010 corresponding to different display panel units 100, it can be determined whether the display panel units 100 conduct normally according to the resistance value.

[0090] In the embodiment of the present application, by setting the control signal pad SC and the switching tube 1013, each display panel unit 100 can be made independent. In this way, the short-circuit detection of any display panel unit 100 in the display motherboard 10 can also be performed by detecting the resistance values of each display panel unit 100, so as to accurately identify the display panel unit 100 with an internal short circuit, improving the practicality of the display motherboard detection.

[0091] It should be noted that the threshold range for judging the resistance value can be obtained according to historical experience data, or can be calculated through data such as the resistance of the prepared material and the transmission distance. The present application embodiment does not particularly limit the acquisition method of the threshold range.

[0092] In some embodiments, each display panel unit conductive member 1007 can be electrically connected to a corresponding unit test pad 1010 through a second test line 1015, and each switching transistor 1013 can be electrically connected to a second test pad 1012 through a jumper wire 1014. Both the jumper wire 1014 and the second test line 1015 can be made of a low-resistance material, so that a low-resistance path can be formed during the conduction detection to quickly neutralize or redistribute charges. First, by using a connection wire for connection, the connection difficulty can be reduced, and it is also convenient for subsequent laser cutting or edge grinding processes to cut off the connection between each display panel unit conductive member 1007 and the unit test pad 1010, and between the second end of each switching transistor 1013 and the corresponding second test pad 1012. Second, this can prevent the threshold voltage of the switching transistor 1013 from changing due to charge accumulation and improve the working reliability of the switching transistor 1013. Third, this can also reduce the impact of static electricity in the manufacturing environment on the display panel unit 100 and ensure that the display panel unit 100 can work properly.

[0093] Considering that there are multiple display panel units 100 in the display mother board 10, in some embodiments, two second test pads 1012 can be provided. The two test pads can be respectively arranged on opposite sides of the test trace area TA and connected through a jumper wire 1014. In this way, when performing a lighting test, the second test pads 1012 on both sides can input the same signal simultaneously, reducing the delay generated during signal transmission and making the intensity of the lighting signals received by each display panel unit 100 basically the same.

[0094] The display mother board provided by the embodiments of the present application may include: a color filter substrate and an array substrate. The array substrate includes: a panel area opposite to the color filter substrate, and a test trace area located on one side of the panel area. The panel area includes a mother board conductive member and multiple display panel units, and the test trace area includes a first test pad and multiple unit test pads corresponding to the display panel units one by one. The mother board conductive member is electrically connected to the first test pad. The edge of each display panel unit is surrounded by a display panel unit conductive member, and the display panel unit conductive members are respectively electrically connected to the common electrode layer of the color filter substrate and the common electrode layer of the array substrate. The display panel unit conductive members are also electrically connected to the unit test pads corresponding to the display panel units. This solution can reduce the detection difficulty of the conductivity of each display panel unit in the display mother board, so that the resistance value of any display panel unit in the display mother board can be detected before partial bonding is performed, avoiding the situation of waste of manpower and material resources due to poor conduction detected in subsequent processes, and the detection accuracy can be verified multiple times.

[0095] Based on the same inventive concept, the embodiments of the present application also provide a display mother board detection method, which can be applied to the display mother board in the above embodiments. Refer to FIGS. 2 and Figure 5, the method may include the following steps:

[0096] Step S110: When the detection signal output end of the detection device is connected to the first target test pad in the display motherboard and the detection signal receiving end of the detection device is connected to the second target test pad in the display motherboard, obtain the first detection result output by the detection device.

[0097] The detection device can be a multimeter to reduce the detection cost. In the embodiments of the present application, the first target test pad and the second target test pad can be any two test pads among the first test pad 1009 and the unit test pad 1010 in the display motherboard. The probes of the detection device can be divided into a detection signal output end (the first probe) and a detection signal receiving end (the second probe). The first probe and the second probe can form a detection loop in the display motherboard by piercing two test pads, so as to obtain the first detection result. Among them, the first detection result can indicate the voltage or resistance value between the first target test pad and the second target test pad.

[0098] In some embodiments, the switching transistor 1013 in the display motherboard can be turned on by a high level or a low level. Taking the high level turn-on as an example, when the control signal pad SC outputs a first level (such as a high level) to control each switching transistor 1013 to turn on, the second test pad 1012 can transmit a detection signal to the corresponding display panel unit 100 through the switching transistor 1013, so as to facilitate the lighting test.

[0099] Before detecting the display motherboard, the control signal pad SC can output a second level (such as a low level) to control each switching transistor to turn off, and each display panel unit can be independent of each other and not interfere with each other.

[0100] Step S120: When the first detection result of the detection device exceeds the target threshold range, determine that the first target test pad and the second target test pad are not conducting.

[0101] Taking the detection of the resistance value as an example, after the detection device obtains the first detection result, it can judge whether the resistance value is within the target threshold range. When the resistance value is within the target threshold range, it can be determined that the conduction between the first target test pad and the second target test pad is normal. Otherwise, the first target test pad and the second target test pad are not conducting. Figures 6 - 8 "OK" in it indicates that the detection result is within the target threshold range and the conduction is normal, and "NG" indicates that the detection result exceeds the target threshold range and the conduction is not normal (simply referred to as not conducting).

[0102] Refer to Figure 6, in some embodiments, the first probe can be inserted into the first test pad 1009, and the second probe can be inserted into the unit test pads 1010 one by one, so as to obtain the first detection results corresponding to each display panel unit 100 output by the detection device.

[0103] If there is a situation where the obtained first detection result is within the target threshold range, it is determined that the display panel unit 100 where the second probe is inserted is conducting normally.

[0104] If all the detection results exceed the target threshold range, it can be determined that the first test pad 1009 and / or all the display panel units 100 are not conducting. Then, the first probe can be inserted into the unit test pad 1010 corresponding to any display panel unit 100, such as 100a, and the second probe can be inserted into the unit test pad 1010 corresponding to another display panel unit 100, such as display panel unit 100b. If the first detection result is within the target threshold range, it can be determined that the first test pad 1009 is not conducting. Then, taking the display panel unit 100a as the reference panel unit, refer to Figure 7 , obtain the resistance value between the reference panel unit and other display panel units 100. If the resistance value exceeds the target threshold range, it can be determined that the corresponding display panel unit 100 is not conducting.

[0105] In some embodiments, the number of the first test pads 1009 can be two, refer to Figure 8 , the second detection result between the two first test pads 1009 output by the detection device can be obtained first. Specifically, the first probe and the second probe can be respectively inserted into the two first test pads, and the second detection result can be obtained.

[0106] If there is a second detection result within the target threshold range, it is determined that the two first test pads 1009 are conducting normally. After determining that both of the two first test pads 1009 are conducting normally, the first probe can be inserted into the first test pad 1009, and the second probe can be inserted into the unit test pad 1010 corresponding to other display panel units 100, so as to obtain the first detection result.

[0107] Exemplarily, if the first probe is inserted into the first test pad 1009 and the second probe is inserted into the unit test pad 1010 corresponding to a display panel unit 100, since it has been determined that the first test pad 1009 is conducting normally, in the case where the first detection result is not within the target threshold range, it can be determined that the display panel unit 100 where the second probe is inserted is not conducting.

[0108] If the second detection result between the two first test pads 1009 exceeds the target threshold range, at least one of the two first test pads 1009 is not conducting, refer to Figure 9 .

[0109] After that, the first probe can be connected to one of the first test pads 1009, for example, the left first test pad 1009, the second probe can be connected to the unit test pads 1010 of each display panel unit 100 in the display mother board 10, and the third detection result output by the detection device can be obtained.

[0110] If all the third detection results exceed the target threshold range, the first probe can be inserted into the right first test pad 1009, and then the second probe can be inserted into the unit test pads 1010 corresponding to each display panel unit 100 in sequence, for example, inserted into the display panel unit 100a and the display panel unit 100b in sequence, and the third detection result can be obtained. If it conforms to the first situation, that is, if there is a third detection result within the target threshold range, it can be determined that the right first test pad 1009 is conducting normally, the display panel unit 100 where the second probe is inserted is conducting normally, and the left first test pad 1009 is not conducting.

[0111] If it conforms to the second situation, that is, if there is no third detection result within the target threshold range, the first probe can be inserted into the unit test pad 1010 corresponding to a display panel unit 100, and the second probe can be inserted into the unit test pads 1010 corresponding to other display panel units 100 except the display panel unit 100 where the first probe is inserted in sequence. Figure 7 , for example, the display panel unit 100a and the display panel unit 100b. If there is a fourth detection result within the target threshold range, it can be determined that both the left first test pad 1009 and the right first test pad 1009 are not conducting. After that, the display panel unit 100 corresponding to the detection result within the target threshold range can be used as the reference panel unit, and the fourth detection result between the reference panel unit and other display panel units 100 can be obtained. If the fourth detection result exceeds the target threshold range, it can be determined that the corresponding display panel unit 100 is not conducting.

[0112] Since the display mother board detection method in this embodiment detects the display mother board in the above embodiment, that is, the display mother board detection method in this embodiment can achieve all the technical features and technical effects of the above display mother board embodiment. For details, refer to the above embodiment and will not be elaborated here.

[0113] An embodiment of the present application further provides a display panel, and the display panel can be cut from the display mother board described in any of the above embodiments.

[0114] Before the mother board cutting process, an ultraviolet (UV) curing alignment process is usually applied to the display mother board to align the liquid crystal. That is, while applying an alignment voltage to each display panel unit in the display mother board, in a UV curing manner, the liquid crystal is tilted in the expected direction, thereby having a certain pre-tilt angle, so that the liquid crystal molecules can rotate orderly according to the previous pre-tilt angle after the subsequent voltage is applied.

[0115] Considering the limited number of probes of the detection device, in some embodiments, the display mother board may further include a mother board test pad. The mother board test pad can be electrically connected to the second test pads of each display mother board. The control signal pad outputs a high level. In this way, when the alignment is performed on each display mother board in the display mother board, the detection device can transmit the alignment voltage to the display panel units in each display mother board through the mother board test pad to control the deflection of the liquid crystal molecules. Since the alignment voltages received by each display panel unit all come from the mother board test pad, this can ensure the alignment effect and avoid the problem of screen splitting caused by abnormal alignment.

[0116] Compared with the method of increasing the number of probes of the detection device to pierce the test pads in the display panel units, in the embodiments of the present application, the test pads are arranged in the test trace area TA, and the mother board test pads are arranged on the display mother board. This can reduce the contact difficulty between the probes of the detection device and the test pads, and also reduce the alignment difficulty and improve the alignment efficiency.

[0117] It should be understood that in the description of the specification and the appended claims of the present application, the terms "include", "comprise", "have" and any deformation thereof are intended to cover non-exclusive inclusion, all meaning "including but not limited to", unless otherwise specifically emphasized in other ways.

[0118] In the description of the present application, unless otherwise specified, " / " means that the objects associated before and after are in an "or" relationship. For example, A / B may represent A or B; "and / or" in the present application is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Among them, A and B may be singular or plural.

[0119] Moreover, in the description of the present application, unless otherwise specified, "a plurality of" means two or more than two. "At least one of the following" or its similar expressions refer to any combination of these items, including any combination of single items or plural items.

[0120] In addition, in the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "perpendicular", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0121] In the present application, unless otherwise clearly defined and limited, the terms "connected", "coupled", etc. shall be understood in a broad sense. For example, it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0122] In addition, in the description of the specification and claims of the present application, the terms "first", "second", etc. are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than that shown or described herein; the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0123] In the embodiments of the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or designs. Rather, the use of words such as "exemplarily" or "for example" is intended to present relevant concepts in a specific manner.

[0124] The reference to "one embodiment" or "some embodiments" etc. described in the specification of the present application means that specific features, structures or characteristics described in connection with that embodiment are included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display motherboard, characterized in that, Including: A color filter substrate and an array substrate; The array substrate includes: a panel area opposite to the color filter substrate, and a test trace area located on one side of the panel area; The panel area includes a motherboard conductive member and a plurality of display panel units, and the test trace area includes a first test pad and a plurality of unit test pads corresponding to the plurality of display panel units one by one; the motherboard conductive member is electrically connected to the first test pad; A display panel unit conductive member is disposed around the edge of each display panel unit, and the display panel unit conductive members are respectively electrically connected to the common electrode layer of the color filter substrate and the common electrode layer of the array substrate, and the display panel unit conductive member is also electrically connected to the unit test pad corresponding to the display panel unit.

2. The display mother board according to claim 1, wherein A second test pad, a control signal pad, a control signal line and a plurality of switching tubes are further disposed in the test trace area; The first end of each switching tube is electrically connected to the second test pad, the second end of each switching tube is electrically connected to the corresponding unit test pad, and the control end of each switching tube is electrically connected to the control signal pad through the control signal line. The control signal pad is used to transmit an on / off control signal for controlling the on / off of each switching tube through the control signal line.

3. The display motherboard according to claim 2, wherein There are two second test pads, and the two second test pads are respectively disposed on opposite sides of the test trace area.

4. The display motherboard according to any one of claims 1-3, characterized in that, There are two motherboard conductive members and two first test pads, and the two motherboard conductive members and the two first test pads are connected in one-to-one correspondence. The two motherboard conductive members are respectively disposed in the blank areas on opposite sides of the panel area.

5. A method for detecting a display motherboard, characterized in that, Applied to the display motherboard according to any one of claims 1-4, the method includes: When the detection signal output end of the detection device is connected to the first target test pad in the display motherboard and the detection signal receiving end of the detection device is connected to the second target test pad in the display motherboard, obtaining a first detection result output by the detection device; wherein, the first target test pad and the second target test pad are any two test pads among the first test pad and the plurality of unit test pads in the display motherboard, and the first detection result is used to indicate the resistance value or voltage between the first target test pad and the second target test pad; When the first detection result exceeds the target threshold range, it is determined that the first target test pad and the second target test pad are not conducting.

6. The method according to claim 5, wherein There are two first test pads; Before obtaining the first detection result output by the detection device when the detection signal output end of the detection device is connected to the first target test pad in the display motherboard and the detection signal receiving end of the detection device is connected to the second target test pad in the display motherboard, the method further includes: When the two first test pads are respectively connected to the detection signal output end and the detection signal receiving end of the detection device in one-to-one correspondence, obtaining a second detection result output by the detection device; If the second detection result is within the target threshold range, it is determined that the conduction between the two first test pads is normal; If the second detection result is not within the target threshold range, it is determined that there is no conduction between the two first test pads.

7. The method according to claim 6, wherein If there is no conduction between the two first test pads, the method further includes: obtaining a plurality of third detection results output by the detection device, the plurality of third detection results including: detection results obtained when the detection signal output end of the detection device is connected to any one of the first test pads, and the detection signal receiving end of the detection device is successively connected to the unit test pads in the display mother board; If there is a detection result within the target threshold range, it is determined that the first test pad connected to the detection signal output end and the unit test pad connected to the detection signal receiving end of the detection device are conducting normally.

8. The method according to claim 6, wherein Connect the detection signal output end and the detection signal receiving end of the detection device to any two unit test pads respectively, and obtain the fourth detection result of the detection device; When the fourth detection result is within the target threshold range, it is determined that the conduction between the two unit test pads is normal.

9. The method according to any one of claims 5 - 8, characterized in that, Before connecting the detection device to the first target test pad and the second target test pad respectively, the method further includes: controlling each switching tube in the display mother board to be turned off through the control signal pad.

10. A display panel, characterized in that, The display panel is cut from the display mother board according to any one of claims 1-4.

Images