Standing wave heat dissipation device and system

Abstract

The invention relates to the technical field of heat dissipation, in particular to a standing wave heat dissipation device and system, and the device comprises an active film and a passive film which are oppositely arranged. A standing wave cavity is arranged between the active film and the passive film. The cavity wall of the standing wave cavity is provided with an air flow hole channel. The active film and the passive film can vibrate in opposite directions at the same frequency, form standing waves in the standing wave cavity, continuously extrude gas in the cavity and present a surge state, so that the air in the standing wave cavity is continuously compressed and extruded from inside to outside to form an inside-outside pressure difference, and the gas in the standing wave cavity is repeatedly extruded to pass through the gas flow hole channel; and the air flow is jetted to the outside of the standing wave cavity at a high speed in a surge state to form a continuous constant high-speed air flow. When the standing wave heat dissipation device provided by the invention is used for heat dissipation, the active film and the passive film are subjected to reverse same-frequency vibration to form standing wave extrusion airflow, and compared with single vibration film vibration extrusion airflow, the airflow is faster, the efficiency is higher, and the heat dissipation effect is better.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation, and particularly to a standing wave heat dissipation device and system. Background Art

[0002] With the rapid development of artificial intelligence (AI) technology, electronic devices are increasingly tending to be miniaturized and ultrathin, but the heat density of their core chips continues to rise, resulting in increasingly prominent heat dissipation problems. Achieving efficient heat dissipation in a narrow device space has become a key technical problem to ensure the stable operation of the device and improve the overall performance of the machine. Currently, the existing micro fans on the market generally have the following technical defects: Size and thickness issues: The thickness of existing micro fans usually exceeds 2.5 mm, making it difficult to meet the stringent requirements of ultrathin devices (such as AI glasses, wearable devices, etc.) with a thickness less than 1 mm; Low air flow efficiency: Due to the short flow path, the air flow is prone to short-circuit phenomena, resulting in insufficient air volume (about 0.5 CFM) and significantly reduced heat dissipation performance; Poor energy consumption and energy efficiency ratio: High power consumption (>1 W) and low energy efficiency ratio, making it difficult to meet the requirements of low-power civilian devices. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the existing air flow micro fans, such as large size, low air flow efficiency, poor energy consumption and energy efficiency ratio, etc., and provide a standing wave heat dissipation device and system.

[0004] In a first aspect, the present invention provides a standing wave heat dissipation device, including: an active membrane and a passive membrane arranged oppositely. A standing wave cavity is provided between the active membrane and the passive membrane. Air flow channels are provided on the cavity wall of the standing wave cavity. The active membrane and the passive membrane can vibrate in opposite directions with the same frequency and form a standing wave in the standing wave cavity.

[0005] According to a preferred embodiment, the active membrane can drive the passive membrane to vibrate. When the active membrane and the passive membrane vibrate in opposite directions with the same frequency, the gas in the standing wave cavity is repeatedly squeezed through the air flow channels and sprayed out of the standing wave cavity in a surging state.

[0006] According to a preferred embodiment, it further includes: a vibration source. The vibration source is arranged on the side of the active membrane away from the standing wave cavity.

[0007] According to a preferred embodiment, the vibration source is attached to the active membrane. The vibration source is arranged at the center of the active membrane. The vibration frequency of the vibration source is greater than 25 KHz. The vibration source includes a piezoelectric ceramic and auxiliary electrodes. The auxiliary electrodes are laid on both side surfaces of the piezoelectric ceramic.

[0008] According to a preferred embodiment, a frequency modulation plate is further included. The frequency modulation plate is used to adjust the vibration frequency of the active membrane. The frequency modulation plate is arranged on the side of the active membrane close to the vibration source. The frequency modulation plate surrounds the vibration source and is connected to the active membrane layer.

[0009] According to a preferred embodiment, the standing wave cavity includes a compression frame. The active membrane and the passive membrane are arranged on both sides of the compression frame. A groove is arranged on the side of the compression frame close to the passive membrane. The active membrane includes: an active membrane frame body and an active membrane layer. The active membrane frame body is arranged along the edge of the active membrane layer. The passive membrane includes: a passive membrane frame body and a passive membrane layer. The passive membrane frame body is arranged along the edge of the passive membrane layer. The two side edges of the compression frame are respectively connected to the active membrane frame body and the passive membrane frame body, so that a first compression cavity is formed between the compression frame and the active membrane layer, and a second compression cavity is formed between the compression frame and the passive membrane layer. A channel is configured on the compression frame, and the channel conducts the first compression cavity and the second compression cavity to form the standing wave cavity.

[0010] According to a preferred embodiment, the air flow channel includes a plurality of air outlet holes arranged on the passive membrane layer. The plurality of air outlet holes are arranged on the surface of the passive membrane layer at intervals.

[0011] According to a preferred embodiment, the air flow channel includes a notch arranged between the active membrane and the passive membrane layer.

[0012] According to a preferred embodiment, the air flow channel includes a plurality of air outlet holes; the setting positions of the air outlet holes include: the surface of the passive membrane layer and / or between the active membrane and the passive membrane layer.

[0013] According to a preferred embodiment, at least two vibration damping pads are connected to the side of the active membrane away from the compression frame, and the vibration damping pads are connected to the installation surface. The vibration damping pads arranged on the active membrane are centrosymmetric about the center of the vibration source.

[0014] According to a preferred embodiment, a housing is further included. The housing is arranged as a box-shaped structure with an open top and a hollow interior. The active membrane is connected to the inner bottom surface of the housing through a vibration damping pad, the passive membrane is located at the top of the housing, and the vibration source is located inside the housing.

[0015] According to a preferred embodiment, when the air flow channel is arranged between the active membrane and the passive membrane layer, an air outlet is arranged on the side wall of the housing, and the air outlet is coaxial with the air flow channel.

[0016] According to a preferred embodiment, the grooves provided on the side of the compression frame close to the passive membrane include: a first groove and a second groove surrounding the first groove. Among them, the first groove is provided in the middle of the compression frame. A first protrusion is provided on the side of the passive membrane layer close to the compression frame, and the first protrusion is adapted to the first groove.

[0017] According to a preferred embodiment, several of the channels are distributed in the grooves provided on the side of the compression frame close to the passive membrane.

[0018] According to a preferred embodiment, the standing wave cavity is integrally formed.

[0019] According to a preferred embodiment, the standing wave cavity includes a compression frame. The active membrane, the compression frame, and the passive membrane are integrally formed.

[0020] On the other hand, the present invention also provides a standing wave heat dissipation system. The standing wave heat dissipation system includes the standing wave heat dissipation device provided by the present invention and a control unit, and the control unit is used to adjust the vibration frequencies of the active membrane and the passive membrane in the standing wave heat dissipation device.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] The standing wave heat dissipation device and system provided by the present invention generate a mechanical vibration standing wave in the standing wave cavity, continuously squeeze the gas in the cavity, presenting a surge state, so that the air in the standing wave cavity is continuously compressed and squeezed from the inside to the outside, forming an inside-outside pressure difference and jetting out of the standing wave cavity at a high speed, forming a continuous and constant high-speed air flow. When using the standing wave heat dissipation device and system provided by the present invention for heat dissipation, the active membrane drives the passive membrane to vibrate, the active membrane and the passive membrane have the same vibration frequency and opposite directions, a standing wave is formed in the standing wave cavity, so that the gas in the standing wave cavity is repeatedly squeezed through the air flow channels and jetted out of the standing wave cavity in a surge state. The active membrane and the passive membrane vibrate at the same frequency to form a standing wave to squeeze the air flow, which is more efficient than a single vibrating membrane vibrating to squeeze the air flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is an exploded structural schematic diagram of a standing wave heat dissipation device according to a preferred embodiment of the present invention;

[0024] Figure 2 is a structural schematic diagram of the active membrane of a standing wave heat dissipation device according to a preferred embodiment of the present invention;

[0025] Figure 3 is a structural schematic diagram of the compression frame of a standing wave heat dissipation device with surface air outlet according to a preferred embodiment of the present invention;

[0026] Figure 4 Schematic diagram of the passive film of the surface air outlet standing wave heat dissipation device according to a preferred embodiment of the present invention;

[0027] Figure 5 Schematic diagram of the passive film of the side air outlet standing wave heat dissipation device according to a preferred embodiment of the present invention;

[0028] Figure 6 Schematic diagram of a standing wave heat dissipation system according to a preferred embodiment of the present invention.

[0029] Markings in the figure:

[0030] Active film 110, active film frame 111, active film layer 112, compression frame 120, first groove 121, second groove 122, channel 123, passive film 130, passive film frame 131, passive film layer 132, air outlet hole 133, notch 134, first protrusion 135, vibration source 200, piezoelectric ceramic 210, auxiliary electrode 220, housing 300, damping pad 400, frequency modulation board 500, control unit 600. Specific embodiments

[0031] The present invention will be further described in detail below with reference to specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments. Any technology implemented based on the content of the present invention belongs to the scope of the present invention.

[0032] In the description of the specific embodiments of the present invention, unless otherwise specified, the terms of orientation or positional relationship such as "upper", "lower", "left", "right", "center", "inner", "outer", etc. are all expressions based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the invention product / device / device is commonly used. These terms of orientation or positional relationship are only for the convenience of describing the present invention solution or simplifying the description in the specific embodiments, so as to facilitate technicians to quickly understand the solution, rather than indicating or implying that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, it should not be construed as a limitation to the present invention.

[0033] In addition, when terms such as "horizontal", "vertical", "hanging", "parallel" appear, it does not mean that the corresponding device / component / element is required to be absolutely horizontal or vertical or hanging or parallel, but it can be slightly inclined or deviated. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure must be completely horizontal, but it can be slightly inclined. Or, it can be simply understood that the corresponding device / component / element is arranged in directions such as "horizontal", "vertical", "hanging", "parallel", etc., and can have an error / deviation of ±10% relative to the corresponding direction setting, more preferably an error / deviation within ±8%, more preferably an error / deviation within ±6%, more preferably an error / deviation within ±5%, more preferably an error / deviation within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the solution of the present invention.

[0034] In addition, when expressions such as "first", "second", "third", etc. appear in the terms, they are only used to distinguish the description of the same or similar components, and should not be understood as emphasizing or implying the relative importance of specific components.

[0035] In addition, in the description of the embodiments of the present invention, "several", "multiple", "a number of" represent at least 2. It can be any case of 2, 3, 4, 5, 6, 7, 8, 9, etc., and even can be a case of more than 9.

[0036] In addition, in the description of the technical solution of the present invention, unless otherwise clearly specified / defined / restricted, where terms such as "set", "installed", "connected", "connected", "provided with", "laid", "arranged" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection, and can be connection means commonly used in the art such as welding, riveting, bolting, threaded connection, etc. Such a connection can be a mechanical connection, an electrical connection or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components.

[0037] Embodiment 1

[0038] This embodiment provides a standing wave heat dissipation device. The heat dissipation device includes: an active film 110 and a passive film 130.

[0039] See Figure 1 , preferably, the active film 110 and the passive film 130 are arranged opposite to each other.

[0040] Preferably, a standing wave cavity is provided between the active film 110 and the passive film 130. Air flow channels are provided on the cavity wall of the standing wave cavity. The active film 110 and the passive film 130 can vibrate in opposite directions at the same frequency and form a standing wave in the standing wave cavity.

[0041] The standing-wave heat dissipation device provided in this embodiment generates a mechanical vibration standing wave in the standing-wave cavity, continuously compresses the gas in the cavity, presents a surge state, causes the air in the standing-wave cavity to be continuously compressed and extruded from the inside to the outside, forms an internal and external pressure difference, and jets out of the standing-wave cavity at a high speed, forming a continuous and constant high-speed air flow.

[0042] Embodiment 2

[0043] This embodiment is a further improvement of Embodiment 1, and the repeated content will not be elaborated.

[0044] The active membrane 110 can drive the passive membrane 130 to vibrate. When the active membrane 110 and the passive membrane 130 vibrate in opposite directions with the same frequency, the gas in the standing-wave cavity is repeatedly compressed and passes through the air flow channels, and jets out of the standing-wave cavity in a surge state.

[0045] See Figure 1 , preferably, the standing-wave heat dissipation device further includes: a vibration source 200. Preferably, the vibration source 200 is arranged on the side of the active membrane 110 away from the standing-wave cavity. The vibration source 200 is attached to the active membrane 110. The vibration source 200 is arranged at the center of the active membrane 110.

[0046] When using the standing-wave heat dissipation device provided in this embodiment for heat dissipation, the vibration source 200 drives the active membrane 110 to vibrate, the active membrane 110 drives the passive membrane 130 to vibrate, the active membrane 110 and the passive membrane 130 vibrate with the same frequency and opposite directions, forming a standing wave in the standing-wave cavity, causing the gas in the standing-wave cavity to be repeatedly compressed and pass through the air flow channels, and jets out of the standing-wave cavity in a surge state. The reverse and same-frequency vibration of the active membrane 110 and the passive membrane 130 to form a standing wave to squeeze the air flow has higher efficiency compared with the vibration of a single vibration membrane to squeeze the air flow; and in this embodiment, only by driving the vibration source 200 can the active membrane 110 and the passive membrane 130 vibrate in opposite directions with the same frequency to form a standing wave, improving the energy efficiency ratio of the heat dissipation device.

[0047] Preferably, both the active membrane 110 and the passive membrane 130 are made of metal or alloy vibration membranes.

[0048] See Figure 1 , preferably, the standing-wave cavity includes a compression frame 120. The active membrane 110 and the passive membrane 130 are arranged on both sides of the compression frame 120.

[0049] See Figure 2 , preferably, the active membrane 110 includes: an active membrane frame body 111 and an active membrane layer 112. The active membrane frame body 111 is arranged along the edge of the active membrane layer 112. The active membrane frame body 111 and the active membrane layer 112 are connected by welding, bonding and other methods. The compression frame 120 is connected to the active membrane frame body 111, so that the cavity between the compression frame 120 and the active membrane layer 112 forms a first compression cavity.

[0050] See Figure 3 , preferably, a groove and a channel 123 are provided on one side of the compression frame 120 close to the passive membrane 130.

[0051] See Figure 4 and Figure 5 , preferably, the passive membrane 130 includes: a passive membrane frame body 131 and a passive membrane layer 132. The passive membrane frame body 131 is arranged along the edge of the passive membrane layer 132. The passive membrane frame body 131 and the passive membrane layer 132 are connected by welding, bonding and other means. The compression frame 120 is connected to the passive membrane frame body 131, so that a cavity between the compression frame 120 and the passive membrane layer 132 forms a second compression cavity.

[0052] Preferably, the channel 123 configured on the compression frame 120 conducts the first compression cavity and the second compression cavity to form a standing wave cavity. Preferably, the compression frame 120 is connected to the active membrane frame body 111 and the passive membrane frame body 131 by welding, bonding and other means respectively, so that the active membrane 110, the passive membrane 130 and the compression frame 120 jointly form a standing wave cavity.

[0053] Preferably, the active membrane 110 is connected to one side of the compression frame 120 away from the passive membrane 130 by welding, bonding and other means, so that the compression frame 120 vibrates synchronously with the active membrane 110. Preferably, the active membrane 110, the passive membrane 130 and the compression frame 120 are arranged in parallel and coaxially aligned, and the shapes of the active membrane 110, the passive membrane 130 and the compression frame 120 are adapted to each other. Preferably, the active membrane 110, the passive membrane 130 and the compression frame 120 are all arranged in a rectangle. Preferably, the active membrane 110 and the passive membrane 130 are both vibration membranes made of metal or alloy materials. Preferably, the compression frame 120 is made of elastic metal or alloy.

[0054] See Figure 3 , preferably, the groove provided on one side of the compression frame 120 close to the passive membrane 130 includes: a first groove 121 and a second groove 122 surrounding the first groove 121. Among them, the first groove 121 is arranged in the middle of the compression frame 120.

[0055] See Figure 4 and Figure 5 , preferably, a first protrusion 135 is provided on one side of the passive membrane layer 132 close to the compression frame 120. The first protrusion 135 is adapted to the first groove 121. Preferably, after the passive membrane 130 is connected to the compression frame 120, the first protrusion 135 can enter the first groove 121, and there is a gap between the first protrusion 135 and the first groove 121.

[0056] Preferably, a plurality of channels 123 are distributed in the groove provided on one side of the compression frame 120 close to the passive membrane 130.

[0057] Preferably, the channel 123 is opened in the second groove 122 of the first groove 121. Preferably, a plurality of channels 123 are arranged in the second groove 122 of the first groove 121 at intervals.

[0058] Preferably, the first groove 121, the second groove 122 and the first protrusion 135 can be set as circular, triangular, rectangular, polygonal or other irregular shapes. Preferably, the channel 123 can be set as circular, triangular, rectangular, polygonal or other irregular shapes, and the channel 123 penetrates the compression frame 120. Preferably, the first protrusion 135 and the second groove 122 are set as rectangles.

[0059] Preferably, through the settings of the first protrusion 135 and the second groove 122, a reduced-scale standing wave cavity is added between the passive membrane 130 and the compression frame 120, which improves the volume of the standing wave cavity in the whole standing wave cavity and the compression ratio in the standing wave cavity. Driven by the mechanical vibration standing wave in the standing wave cavity, a surge air flow is formed in which the back wave squeezes the front wave. The air flow in the standing wave cavity is continuously squeezed from the inside to the outside through the air flow channel, generating a high-speed air flow that is continuously ejected outward.

[0060] Preferably, after the active membrane 110, the passive membrane 130 and the compression frame 120 are connected, the channel 123 is conducted.

[0061] Preferably, this embodiment can adjust the volume of the standing wave cavity by adjusting the number, area, depth of the grooves in the compression frame 120, the number, area of the channels 123, etc., so as to adjust the compression ratio in the standing wave cavity.

[0062] Preferably, the standing wave cavity is integrally formed.

[0063] Preferably, the active membrane 110, the compression frame 120 and the passive membrane 130 are integrally formed. A first compression cavity is formed between the compression frame 120 and the active membrane layer 112, and a second compression cavity is formed between the compression frame 120 and the passive membrane layer 132. The compression frame 120 is provided with a channel 123, and the channel 123 conducts the first compression cavity and the second compression cavity to form a standing wave cavity.

[0064] Preferably, the active membrane 110, the compression frame 120 and the passive membrane 130 can be integrally formed into a compression box through laser engraving technology, etching technology, etc. The standing wave cavity is located inside the compression box.

[0065] Preferably, the vibration frequency of the vibration source 200 is greater than 25KHz. The vibration source 200 includes a piezoelectric ceramic 210 and an auxiliary electrode 220. The auxiliary electrode 220 is laid on both side surfaces of the piezoelectric ceramic 210.

[0066] See Figure 1, preferably, the vibration source 200 includes a piezoelectric ceramic 210 and auxiliary electrodes 220. The auxiliary electrodes 220 are disposed on both side surfaces of the piezoelectric ceramic 210. The piezoelectric ceramic 210 can be set to a circular, triangular, rectangular, polygonal or other irregular shape. The auxiliary electrodes 220 are provided on both side surfaces of the piezoelectric ceramic 210. Preferably, the shape of the auxiliary electrodes 220 matches that of the piezoelectric ceramic 210.

[0067] The piezoelectric ceramic 210 is a high-frequency ultrasonic piezoelectric ceramic with excellent performance, having high mechanical and electrical properties. The piezoelectric constant d33 > 750 pC / N, the Curie temperature point is greater than 260 °C, the frequency is greater than 400 kHz, the elastic modulus is greater than 0.43, the dielectric constant εT33 / ε0 = 3500, the elastic compliance coefficient S11 > 18×10-12 m2 / N, the Curie temperature > 320 °C, and the Poisson's ratio σ > 0.35. It can be suitable for working in a high-temperature environment of 100 °C for a long time, and has a wide working temperature range.

[0068] The piezoelectric ceramic 210 is bonded to the active membrane 110 through a differential pressure and step curing process, so that the force directions of the piezoelectric ceramic sheet and the metal active membrane are constantly consistent during operation, ensuring the standing wave after the mechanical vibration waves of the piezoelectric ceramic sheet and the passive membrane 130 are superimposed, increasing and stabilizing the mechanical vibration amplitude; ensuring that the standing wave heat dissipation device can work for a long time, stably and with high performance.

[0069] Preferably, the auxiliary electrodes 220 are disposed on the electrode layers on both sides of the piezoelectric ceramic 210, avoiding the stress concentration at the bonding part caused by directly bonding the piezoelectric ceramic 210 with a large difference in thermal expansion coefficient to the active membrane 110. The auxiliary electrodes 220 not only strengthen the electrical conductivity but also avoid problems such as ceramic sheet fragmentation and bonding layer peeling caused by excessive stress concentration between the inner electrode of the piezoelectric ceramic 210, the piezoelectric ceramic sheet and the metal membrane during the operation of the heat dissipation device, resulting in the failure of the heat dissipation device.

[0070] Preferably, the use of the auxiliary electrodes 220 can block the pores of the piezoelectric ceramic 210. In the traditional method of setting electrodes by brushing silver paste on the surface of the piezoelectric ceramic 210, silver ion migration occurs on the pores of the piezoelectric ceramic 210 during power-on, forming a primary battery, corroding the piezoelectric ceramic 210, affecting the life of the piezoelectric ceramic 210, and causing the piezoelectric ceramic 210 to fragment. The use of the auxiliary electrodes 220 can avoid the above problems.

[0071] Setting the auxiliary electrodes 220 on the electrode layers on both sides of the piezoelectric ceramic 210 can ensure that the bonding layer between the piezoelectric ceramic 210 and the active membrane 110 does not peel off, crack or have pores. The bonding layer is uniform and firm, and the piezoelectric ceramic 210 does not fragment, enabling the active membrane 110 to work stably for a long time under high-frequency vibration. At the same time, it can also ensure that the heat dissipation device can work for a long time, achieving a noise reduction effect at an ultrasonic frequency above 25 kHz.

[0072] See Figure 1 , preferably, a frequency modulation plate 500 is provided on the side of the active membrane 110 close to the vibration source 200. The frequency modulation plate 500 is used to adjust the vibration frequency of the active membrane 110. The frequency modulation plate 500 is arranged on the side of the active membrane 110 close to the vibration source 200. The frequency modulation plate 500 surrounds the vibration source 200 and is connected to the active membrane 110. Preferably, the frequency modulation plate 500 is arranged as a frame. In order to ensure the maximum air outlet of the heat dissipation device, mainly to ensure the maximum vibration amplitude of the active membrane 110 and the passive membrane 120, that is, to find the resonance points of the two vibration membranes. Since the structural forms and vibration-related physical characteristics (such as mass, stiffness, and damping) of the active membrane 110 and the passive membrane 120 are fixed, it is not convenient to adjust the frequency. In this embodiment, by introducing the frequency modulation plate 500 and through the method of structural superposition, the natural frequencies of the active membrane 110 and the passive membrane 120 are changed to achieve the purpose of frequency adjustment. By finely adjusting the frequency modulation plate 500, such as changing the structural shape of the frequency modulation plate 500, or changing the structural stiffness of the frequency modulation plate 500, or changing the structural damping of the frequency modulation plate 500, the vibration frequency of the entire heat dissipation device is adjusted, so that the heat dissipation device, at a constant low excitation (drive power supply) frequency externally, ensures consistency with the frequency transmitted by the drive power supply, achieves a resonance effect, the vibration amplitudes of the active membrane 110 and the passive membrane 120 are the largest, and the heat dissipation device is always in the best state.

[0073] Preferably, by means of the frequency modulation plate 500, the vibration frequencies of the active membrane 110 and the passive membrane 120 are adjusted, and the consistency of the vibration frequencies of the heat dissipation devices in mass production can be ensured.

[0074] Preferably, in this embodiment, by setting the positions and forms of the air flow channels, heat dissipation devices with different air outlet forms are set.

[0075] See Figure 4 , preferably, the air flow channel includes a plurality of air outlet holes 133 provided on the passive membrane layer 132. The plurality of air outlet holes 133 are arranged on the surface of the passive membrane layer 132 at intervals.

[0076] See Figure 5 , preferably, the air flow channel includes: a notch 134. Preferably, the notch 134 can be provided on the passive membrane frame 131; it can also be provided on the edge of the compression frame 120 close to the passive membrane 130; it can also be opened on the edge of the passive membrane frame 131 and the compression frame 120 at the same time. Preferably, the notch 134 is provided on the side wall of the standing wave cavity. Preferably, the notch 134 is arranged as a rectangle, and the laterally outgoing gas jets out at high speed from the notch 134 to form a tiny rectangular air curtain. The air flow channel includes the notch 134 provided between the active membrane 110 and the passive membrane layer 132.

[0077] Preferably, the air flow channel includes a plurality of air outlet holes 133; the arrangement positions of the air outlet holes 133 include: the surface of the passive membrane layer 132 and / or between the active membrane 110 and the passive membrane layer 132.

[0078] Preferably, the air flow channel includes a plurality of air outlet holes 133 provided on the passive membrane layer 132. The plurality of air outlet holes 133 are arranged on the surface of the passive membrane layer 132 at intervals; the shapes and sizes of the air outlet holes 133. Preferably, the plurality of air outlet holes 133 are arranged in a central annular pattern on the surface of the passive membrane layer 132.

[0079] The air outlet facing is a type with a plurality of air outlet holes 133, a small aperture (with diameters all below 0.5 mm), a relatively high gas flow rate greater than 1 CFM, a wind speed greater than 10 m / s, a frequency greater than 25 KHz, and good sound insulation. The gas for the air outlet facing is ejected parallel and at high speed from the plurality of air outlet holes 133.

[0080] Preferably, the air flow channel of the heat dissipation device can be set only as a notch 134, or only as air outlet holes 133, or can also include both a notch 134 and air outlet holes 133.

[0081] Preferably, the heat dissipation device has a high air outlet wind speed (> 20 m / s), a large air volume (> 3 L / min), low noise (< 26 dB), a small volume (thickness < 0.8 mm), a high protection level (IP68), ensuring long-term continuous operation (MTTF > 100000 h), and a stable output air flow.

[0082] Preferably, after the active membrane 110, the compression frame 120, the passive membrane 130, the vibration source 200, and the frequency modulation board 500 are connected, they can be installed on a specific device (such as a semiconductor chip or other devices) for heat dissipation.

[0083] Preferably, at least two vibration damping pads 400 are connected to the side of the active membrane 110 away from the compression frame 120, and are connected to the installation surface through the vibration damping pads 400. The vibration damping pads 400 provided on the active membrane 110 are centrosymmetric about the center of the vibration source 200. Preferably, the active membrane 110 is connected to the installation surface through four vibration damping pads 400, and there is a gap between the vibration source 200 and the frequency modulation board 500 and the installation surface. The vibrations of the vibration source 200 and the standing wave cavity during operation will not be transmitted to the installation surface. The vibration damping pads 400 are made of elastic materials, silicone, or rubber. The active membrane 110 is elastically connected to the installation surface through the vibration damping pads 400. When the heat dissipation device is working, the vibration damping pads 400 provide a buffering effect to prevent vibrations from being transmitted to the installation surface.

[0084] Embodiment 3

[0085] This embodiment is a further improvement of Embodiment 2, and the repeated content will not be elaborated. The heat dissipation device further includes a housing 300 for encapsulating the active membrane 110, the compression frame 120, the passive membrane 130, the vibration source 200, and the frequency modulation board 500. The housing 300 is set as a box-shaped structure with an open top and a hollow interior. The housing 300 is made of a packaging material for high-temperature resistant polymers, ceramics, and other electronic chip devices.

[0086] When the heat dissipation device is encapsulated by the housing 300, the active membrane 110 is connected to the inner bottom surface of the housing 300 through a vibration damping pad 400, the passive membrane 130 is located at the top of the housing 300, and the compression frame 120, the passive membrane 130, the vibration source 200, and the frequency modulation board 500 are located inside the housing 300.

[0087] Since the active membrane 110, the compression frame 120, the passive membrane 130, the vibration source 200, and the frequency modulation board 500 are connected as a whole when the heat dissipation device is working, mechanical vibrations will be generated. By connecting through the vibration damping pad 400 to the inner bottom surface of the housing 300, the vibration can be prevented from being transmitted to the isolation mounting surface (the inner bottom surface of the housing 300).

[0088] Preferably, by connecting through the vibration damping pad 400 to the mounting surface, it is avoided that the active membrane 110 directly contacts the inner bottom surface of the housing 300, which affects the free vibration of the vibration membrane, causes the mechanical vibration frequency of the heat dissipation device to decrease, affects the performance of the micro-fan, and at the same time leads to the generation of abnormal high-frequency noise. Since the heat dissipation device is often directly attached to the electronic device that needs to be cooled during operation, by connecting through the vibration damping pad 400 to the mounting surface, it can also prevent the mechanical vibration of the standing wave cavity from being transmitted to the electronic device being cooled, and at the same time play a role in vibration isolation.

[0089] Preferably, after the vibration source 200 is attached to the active membrane 110, there is a gap between the vibration source 200 and the inner bottom surface of the housing 300. Preferably, after the vibration source 200 is attached to the active membrane 110, the standing wave cavity is connected to the mounting surface (the inner bottom surface of the housing 300) through the vibration damping pad 400, and the vibrations of the vibration source 200 and the standing wave cavity during operation will not be transmitted to the inner bottom surface of the housing 300.

[0090] According to a preferred embodiment, when the air flow channel is arranged between the active membrane 110 and the passive membrane layer 132, an air outlet is provided on the side wall of the housing 300, and the air outlet is coaxial with the air flow channel. An air outlet is provided on the side wall of the housing 300, and the air outlet is coaxially aligned with the notch 134. The lateral air outlet gas jets out at a high speed from the rectangular air outlet, forming a tiny rectangular air curtain.

[0091] To meet the heat dissipation requirements of micro and miniaturized devices, the heat dissipation device has been miniaturized (3 - 10 × 3 - 10 × 0.4 - 1.0). The active membrane 110, compression frame 120, passive membrane 130, and frequency modulation board 500 are positioned by jigs and precisely multi-layer welded by laser, ensuring the product consistency of the heat dissipation device, suitable for mass production, and meeting the large-scale demand of the heat dissipation market for micro and ultra-thin electronic devices.

[0092] Preferably, the power transmission pins of the auxiliary electrode 210 pass through the housing 300 and are connected to an external drive power supply, and can be set in various forms, including surface mount type, bottom mount type, dual in-line plug type, bent pin type, etc.

[0093] Preferably, the vibration frequency in the heat dissipation device is greater than 26KHz, successfully avoiding the sound wave reception range of the human ear and other household pets and poultry. When the standing wave type solid-state piezoelectric ultrasonic micro-fan works, it operates without noise or with low noise. The heat dissipation device itself is small in size (10 × 10 × 0.5mm 3 ), especially suitable for wearable electronic devices and thin and high-noise-reduction scenarios.

[0094] Due to the relatively high standing wave resonance frequency above 26KHz, it always operates in the high-frequency ultrasonic state, with low noise (<26dB), high wind speed (>10m / s), and low power consumption (<0.3W). The standing wave type solid-state piezoelectric ultrasonic micro-fan can freely select different arrays of micro-fans according to different usage scenarios to achieve an ideal heat dissipation effect.

[0095] Example 4

[0096] This embodiment provides a standing wave heat dissipation system. Refer to Figure 6 , the heat dissipation system includes a control unit 600 and a heat dissipation device. In this embodiment, the heat dissipation device is the heat dissipation device described in Embodiment 1 and Embodiment 2.

[0097] Refer to Figure 6 , after the external power supply is connected to the control unit 600, it forms the drive power supply for the heat dissipation device, and then regulates the heat dissipation device.

[0098] The input voltage of the drive power supply is wide (DC5V~DC36V), the drive frequency range is large (10Hz~35KHz), and the temperature can be automatically compensated, ensuring that the heat dissipation device always operates in the best state. When the control unit 600 is connected to the serial port, it can monitor in real time, accurately provide the working state information of the heat dissipation device, effectively achieve real-time monitoring, and ensure the safe and efficient operation of the device that needs heat dissipation.

[0099] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A standing wave heat dissipation device, characterized in that, Comprising: An actively vibrating membrane (110) and a passively vibrating membrane (130) which are arranged opposite to each other, a standing wave cavity is arranged between the actively vibrating membrane (110) and the passively vibrating membrane (130), and air flow channels are arranged on the cavity wall of the standing wave cavity; the actively vibrating membrane (110) and the passively vibrating membrane (130) can vibrate in opposite directions with the same frequency and form a standing wave in the standing wave cavity.

2. A standing wave heat dissipation device according to claim 1, wherein the actively vibrating membrane (110) can drive the passively vibrating membrane (130) to vibrate; when the actively vibrating membrane (110) and the passively vibrating membrane (130) vibrate in opposite directions with the same frequency, the gas in the standing wave cavity is repeatedly squeezed through the air flow channels and ejected to the outside of the standing wave cavity in a surge state.

3. The standing wave heat dissipation device according to claim 2, characterized in that, Further comprising: a vibration source (200); the vibration source (200) is arranged on the side of the actively vibrating membrane (110) away from the standing wave cavity.

4. The standing wave heat dissipation device according to claim 3, characterized in that, The vibration source (200) is attached to the actively vibrating membrane (110); the vibration source (200) is arranged at the center of the actively vibrating membrane (110); the vibration frequency of the vibration source (200) is greater than 25 KHz; the vibration source (200) comprises a piezoelectric ceramic (210) and auxiliary electrodes (220); the auxiliary electrodes (220) are laid on both side surfaces of the piezoelectric ceramic (210).

5. The standing wave heat dissipation device according to claim 3, characterized in that, Further comprising a frequency modulation plate (500); the frequency modulation plate (500) is used for adjusting the vibration frequency of the actively vibrating membrane (110); the frequency modulation plate (500) is arranged on the side of the actively vibrating membrane (110) close to the vibration source (200); the frequency modulation plate (500) surrounds the vibration source (200) and is connected to the actively vibrating membrane layer (112).

6. The standing wave heat dissipation device according to claim 1, characterized in that The standing wave cavity comprises a compression frame (120); the actively vibrating membrane (110) and the passively vibrating membrane (130) are arranged on both sides of the compression frame (120); a groove is arranged on the side of the compression frame (120) close to the passively vibrating membrane (130); the actively vibrating membrane (110) comprises an actively vibrating membrane frame body (111) and an actively vibrating membrane layer (112); the actively vibrating membrane frame body (111) is arranged along the edge of the actively vibrating membrane layer (112); the passively vibrating membrane (130) comprises a passively vibrating membrane frame body (131) and a passively vibrating membrane layer (132); the passively vibrating membrane frame body (131) is arranged along the edge of the passively vibrating membrane layer (132); both side edges of the compression frame (120) are respectively connected to the actively vibrating membrane frame body (111) and the passively vibrating membrane frame body (131), so that a first compression cavity is formed between the compression frame (120) and the actively vibrating membrane layer (112), and a second compression cavity is formed between the compression frame (120) and the passively vibrating membrane layer (132); a channel (123) is arranged on the compression frame (120), and the channel (123) conducts the first compression cavity and the second compression cavity to form the standing wave cavity.

7. The standing wave heat dissipation device according to claim 6, wherein, The air flow channels comprise a plurality of air outlet holes (133) arranged on the passively vibrating membrane layer (132); the plurality of air outlet holes (133) are arranged on the surface of the passively vibrating membrane layer (132) at intervals.

8. The standing wave heat dissipation device according to claim 6, characterized in that, The air flow channel includes a notch (134) provided between the active membrane (110) and the passive membrane layer (132).

9. The standing wave heat dissipation device according to claim 6, characterized in that, The air flow channel includes a plurality of air outlet holes (133); the setting positions of the air outlet holes (133) include: the surface of the passive membrane layer (132) and / or between the active membrane (110) and the passive membrane layer (132).

10. The standing wave heat dissipation device according to claim 6, wherein At least two damping pads (400) are connected to the side of the active membrane (110) away from the compression frame (120), and are connected to the installation surface through the damping pads (400); The damping pads (400) provided on the active membrane (110) are centrosymmetric about the center of the vibration source (200).

11. A standing wave heat dissipation device according to claim 6, characterized in that, It further includes a housing (300); The housing (300) is arranged as a box-like structure with an open top and a hollow interior; The active membrane (110) is connected to the inner bottom surface of the housing (300) through a damping pad (400), the passive membrane (130) is located at the top of the housing (300), and the vibration source (200) is located inside the housing (300).

12. A standing wave heat dissipation device according to claim 11, wherein When the air flow channel is provided between the active membrane (110) and the passive membrane layer (132), an air outlet is provided on the side wall of the housing (300), and the air outlet is coaxial with the air flow channel.

13. The standing wave heat dissipation device according to claim 6, wherein The grooves provided on the side of the compression frame (120) close to the passive membrane (130) include: a first groove (121) and a second groove (122) surrounding the first groove (121); wherein, the first groove (121) is provided in the middle of the compression frame (120); A first protrusion (135) is provided on the side of the passive membrane layer (132) close to the compression frame (120), and the first protrusion (135) is adapted to the first groove (121).

14. A standing wave heat dissipation device according to claim 6, characterized in that, A plurality of the channels (123) are distributed in the grooves provided on the side of the compression frame (120) close to the passive membrane (130).

15. A standing wave heat dissipation device according to claim 1, characterized in that, The standing wave cavity is integrally formed.

16. The standing wave heat dissipation device according to claim 1, wherein, The standing wave cavity includes a compression frame (120); the active membrane (110), the compression frame (120) and the passive membrane (130) are integrally formed.

17. A standing wave heat dissipation system, characterized in that, It includes the standing wave heat dissipation device according to any one of claims 1 to 16 and a control unit (600), and the control unit (600) is used to adjust the vibration frequencies of the active membrane (110) and the passive membrane (130) in the standing wave heat dissipation device.

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