Display device and method of manufacturing same

By using spacers and auxiliary electrodes in organic light emitting display equipment, the mask layer collapse problem is solved, manufacturing reliability and equipment performance are improved, process flow is simplified, and gas permeability risks are reduced.

CN120344097APending Publication Date: 2025-07-18SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202510498431.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2018-10-16
Filing Date
2019-10-10
Publication Date
2025-07-18

AI Technical Summary

Technical Problem

In the process of manufacturing high-resolution organic light-emitting display equipment, the collapse of the mask layer makes it difficult to remove the peeling layer and the mask layer, affecting the manufacturing reliability.

Method used

By providing spacers and auxiliary electrodes on the substrate to prevent or protect the release layer and mask layer from collapse, spacers are used to support the mask layer to facilitate removal of the release layer and mask layer, and spacers of organic materials and auxiliary electrodes of low resistance metals are used.

Benefits of technology

It improves the reliability of the manufacturing process, ensures the stability of the mask layer, simplifies the process flow, reduces the risk of gas penetration into the organic light emitting layer, and improves the overall performance of the display equipment.

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Abstract

A display apparatus and a method of manufacturing the same are provided. The display device includes a substrate, a pixel defining layer, a spacer, an auxiliary electrode, and an organic light emitting diode. The substrate includes a light emitting region and a non-light emitting region adjacent to the light emitting region. The pixel defining layer is disposed on the non-emission area of the substrate. The spacer is disposed on the pixel defining layer. The auxiliary electrode is disposed on the spacer. The organic light emitting diode is disposed on the substrate, and at least a portion of the organic light emitting diode is disposed in the light emitting region. The organic light emitting diode includes a pixel electrode, an intermediate layer disposed on the pixel electrode and including an organic light emitting layer, and a counter electrode disposed on the intermediate layer and electrically connected to the auxiliary electrode.
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Description

[0001] This application is a divisional application of the invention patent application "Display device and method for manufacturing the same" with the application date of October 10, 2019 and the application number of 201910956259.6. Technical Field

[0002] The present disclosure relates to a display device and a method for manufacturing the same, and more particularly, to a display device having improved reliability and a method for manufacturing the same. Background Art

[0003] Organic light-emitting display devices (among display devices) have attracted attention as next-generation display devices due to their wide viewing angles, excellent contrast ratios, and / or fast response speeds.

[0004] Generally, an organic light-emitting display device may include thin-film transistors formed on a substrate and organic light-emitting elements, and the organic light-emitting elements may emit light by themselves to operate the organic light-emitting display device (e.g., emit light by themselves during the operation of the organic light-emitting display device). The organic light-emitting elements may include pixel electrodes, counter electrodes facing the pixel electrodes, and light-emitting layers disposed between the pixel electrodes and the counter electrodes. The organic light-emitting display device may be used as a display unit for small-sized products (such as portable phones) and may also be used as a display unit for large-sized products (such as televisions).

[0005] In an organic light-emitting display device that displays full colors, different pixels may emit light of different colors, and deposition masks may be used to form the light-emitting layers of each pixel and the counter electrodes commonly provided among a plurality of pixels. As the resolution of the organic light-emitting display device increases, the width of the opening slits of the masks used in the deposition process decreases (e.g., gradually decreases), and it is desired to reduce the dispersion of the width of the opening slits. In addition, in order to manufacture a high-resolution organic light-emitting display device, it is desired to reduce or eliminate the shadow effect. Therefore, a method of performing a deposition process in a state where the mask is in close contact with the substrate may be used. Summary of the Invention

[0006] Aspects according to embodiments of the present disclosure relate to a method for manufacturing a display device that can easily remove a peeling layer and a mask layer by preventing or protecting the peeling layer and the mask layer from being affected by collapse during a manufacturing process, and a display device having improved reliability.

[0007] In an embodiment of the present disclosure, a display device may include a substrate, a pixel defining layer, spacers, auxiliary electrodes, and organic light-emitting diodes.

[0008] The substrate may include a light-emitting region and a non-light-emitting region adjacent to the light-emitting region.

[0009] The pixel defining layer may be located on the non-light emitting region of the substrate.

[0010] The spacer may be located on the pixel defining layer.

[0011] The auxiliary electrode may be located on the spacer.

[0012] The organic light emitting diode may be located on the substrate and have at least a part located in the light emitting region.

[0013] The organic light emitting diode may include: a pixel electrode; an intermediate layer located on the pixel electrode and including an organic light emitting layer; and a counter electrode located on the intermediate layer and electrically connected to the auxiliary electrode.

[0014] In an embodiment, the intermediate layer and / or the counter electrode may be stacked with the spacer.

[0015] In an embodiment, the auxiliary electrode and the pixel defining layer may seal the spacer.

[0016] In an embodiment, the spacer may include an organic material.

[0017] In an embodiment, the pixel defining layer and the spacer may be made of different materials.

[0018] In an embodiment, the pixel defining layer and the spacer may form a single integral body.

[0019] In an embodiment, the auxiliary electrode may be in contact with the top surface of the spacer.

[0020] In an embodiment, the spacers may be provided in plurality, the spacers may be adjacent to the light emitting region, and each spacer may have an island shape.

[0021] In an embodiment, when observed in a plan view, the light emitting region may have a polygonal shape, and each spacer may be adjacent to a corner of the light emitting region.

[0022] In an embodiment, the shortest distance between adjacent spacers may be in the range from 10 μm to 25 μm.

[0023] In an embodiment, the display device may further include an insulating protection layer covering the top surface of the counter electrode and exposing a part of the auxiliary electrode.

[0024] In an embodiment of the present disclosure, a display device may include a substrate, a pixel defining layer, a spacer, an auxiliary electrode, a pixel electrode, an intermediate layer, and a counter electrode.

[0025] The substrate may include a light emitting region and a non-light emitting region adjacent to the light emitting region.

[0026] The pixel defining layer may be located on the non-light emitting region of the substrate.

[0027] The spacer may be located on the pixel defining layer.

[0028] The auxiliary electrode may be located on the spacer.

[0029] The pixel electrode may be located on the substrate and have at least a part located in the light-emitting region.

[0030] The intermediate layer may be located on the pixel electrode and have at least a part that overlaps with the spacer. The intermediate layer includes an organic light-emitting layer.

[0031] The counter electrode may be located on the intermediate layer, may be in contact with the auxiliary electrode, and have at least a part that overlaps with the spacer.

[0032] In an embodiment, the auxiliary electrode and the pixel defining layer may seal the spacer.

[0033] In an embodiment of the present disclosure, a method of manufacturing a display device may include: forming a first pixel electrode for emitting first-color light, a second pixel electrode for emitting second-color light, and a third pixel electrode for emitting third-color light on a substrate; forming a pixel defining layer that exposes a part of the first pixel electrode, a part of the second pixel electrode, and a part of the third pixel electrode; forming a first spacer on the pixel defining layer adjacent to the first pixel electrode; forming an auxiliary electrode covering the first spacer; forming a first peeling layer and a first mask layer on the pixel defining layer, the first peeling layer exposing the part of the first pixel electrode, and the first mask layer having a first mask opening that exposes the part of the first pixel electrode; forming a first intermediate layer on the first pixel electrode through the first mask opening; forming a first counter electrode on the first intermediate layer through the first mask opening; and removing the first peeling layer and the first mask layer.

[0034] In an embodiment, the method may further include: after the step of forming the first counter electrode, forming a first insulating protection layer covering the first counter electrode through the first mask opening.

[0035] In an embodiment, the first spacers may be provided in a plurality, and each first spacer may have an island shape.

[0036] In an embodiment, the step of forming the first peeling layer and the first mask layer may include: forming a first polymer layer on the pixel defining layer on which the auxiliary electrode is formed; forming a first photoresist layer on the first polymer layer; exposing and developing the first photoresist layer to form the first mask layer; and etching the first polymer layer using the first mask layer as an etching mask to form the first peeling layer.

[0037] In an embodiment, the first release layer may have an undercut shape that is recessed laterally from an inner surface of the first mask layer, the inner side defining a first mask opening.

[0038] In an embodiment, when observed in a plan view, the first mask layer may be superposed with the first spacer.

[0039] In an embodiment, the first release layer may expose at least a portion of the first spacer.

[0040] In an embodiment, the first spacer may include an organic material.

[0041] In an embodiment, the first pair of electrodes may be in contact with the auxiliary electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The drawings are included to provide a further understanding of the subject matter of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, are used to explain the principles of the present disclosure. In the drawings:

[0043] Figure 1 is a plan view schematically showing a display device according to an embodiment of the present disclosure;

[0044] Figure 2 is an equivalent circuit diagram of a pixel of a display device according to an embodiment of the inventive concept;

[0045] Figure 3 is Figure 1 an enlarged plan view of region AA of

[0046] Figure 4 is a cross-sectional view taken along line I-I' of Figure 3 ;

[0047] Figures 5A to 5H is a cross-sectional view showing a method of manufacturing a display device according to an embodiment of the present disclosure; and

[0048] Figure 6 is a cross-sectional view taken along line I-I' of Figure 3 to show a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] The subject matter of the present disclosure will now be described more fully hereinafter with reference to the drawings in which various embodiments are shown. However, the subject matter of the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Like reference numerals always denote like elements.

[0050] It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present. In contrast, the term “directly” indicates that no intervening element is present. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms “a,” “an,” and “the” as well as “at least one” are intended to include the plural forms. “Or” means “and / or.” It will also be understood that when the terms “comprises,” “comprising,” and / or their variants are used in this specification, they specify the presence of the stated features, regions, wholes, steps, operations, elements, components, and / or groups, but do not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or their groups. When a phrase such as “at least one of...” follows a list of elements, it modifies the entire list of elements and not individual elements in the list.

[0051] For ease of description, spatial relative terms such as “under,” “below,” “lower,” “above,” “upper,” etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as illustrated in the figures. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as “under” or “below” another element or feature will then be oriented “above” the other element or feature. Thus, the exemplary term “under” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein are to be interpreted accordingly.

[0052] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another. Thus, a first element, component, region, layer, or portion discussed below could be termed a second element, component, region, layer, or portion without departing from the teachings herein.

[0053] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary illustrations. In the drawings, the thickness of layers and regions is exaggerated for clarity. Accordingly, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but will include shape deviations resulting from, for example, manufacturing. For example, an etched region shown as rectangular will typically have rounded or curved features. Thus, the regions shown in the figures are schematic in nature, and their shapes are not intended to depict the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0054] Figure 1 is a plan view schematically showing a display device according to an embodiment of the present disclosure.

[0055] As Figure 1 shown, the display device 1000 may include a display area DA capable of displaying an image and a peripheral area PA outside the display area DA. Figure 1 It can be understood as a view of the substrate 100 of the display device 1000. For example, it can be understood that the substrate 100 includes the display area DA and the peripheral area PA.

[0056] Pixels configured to emit different colors of light may be provided in the display area DA. In this regard, Figure 1 shows a first pixel PX1, a second pixel PX2, and a third pixel PX3 configured to emit red light, green light, and blue light, respectively. In Figure 1 the first to third pixels PX1, PX2, and PX3 are arranged in a Pentile form. However, embodiments of the present disclosure are not limited thereto. In certain embodiments, the arrangement of the pixels may be variously modified and appropriately modified. In some embodiments of the present disclosure, the first to third pixels PX1, PX2, and PX3 may display images of different colors.

[0057] The peripheral area PA may correspond to a non-display area, and drivers for supplying electrical signals and power to the pixels and power voltage supply lines may be provided in the peripheral area PA. In addition, the peripheral area PA may include a pad area, and the pad area includes pads electrically connected to an electronic device and / or a printed circuit board.

[0058] In the present embodiment, when viewed in a plan view, the display device 1000 has a rectangular shape. The extending direction of the long side of the display device 1000 is defined as the first direction DR1, and the extending direction of the short side of the display device 1000 is defined as the second direction DR2 (e.g., perpendicular to the first direction DR1). The thickness direction of the display device 1000 is defined as the third direction DR3 (e.g., perpendicular to the first direction DR1 and the second direction DR2).

[0059] Figure 2 is an equivalent circuit diagram of a pixel of a display device according to an embodiment of the present disclosure.

[0060] Referring to Figure 2 , the pixel may include a pixel circuit PC and a display element connected to the pixel circuit PC. In Figure 2 , an organic light-emitting diode OLED is shown as the display element. The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst.

[0061] The second thin-film transistor T2 may be a switching thin-film transistor and may be connected to a scan line SL and a data line DL. The second thin-film transistor T2 may transfer a data voltage input from the data line DL to the first thin-film transistor T1 in response to a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the second thin-film transistor T2 and a driving voltage line PL, and may store a voltage corresponding to the difference between the voltage transferred from the second thin-film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0062] The first thin-film transistor T1 may be a driving thin-film transistor and may be connected to the driving voltage line PL and the storage capacitor Cst. The first thin-film transistor T1 may control a driving current flowing from the driving voltage line PL to the organic light-emitting diode OLED (e.g., the pixel electrode of the organic light-emitting diode OLED) in response to the value of the voltage stored in the storage capacitor Cst. The organic light-emitting diode OLED may emit light having a set or predetermined luminance determined by the driving current. A second power supply voltage ELVSS may be supplied to the counter electrode (e.g., the cathode) of the organic light-emitting diode OLED.

[0063] In Figure 2 , the pixel circuit PC includes two thin-film transistors and one storage capacitor. However, embodiments of the present disclosure are not limited thereto. In some embodiments, the number of thin-film transistors and the number of storage capacitors may be differently and appropriately changed according to the design of the pixel circuit PC.

[0064] Figure 3 is Figure 1 an enlarged plan view of the region AA of Figure 4is a cross-sectional view taken along line I-I' of Figure 3 The cross-sectional view is taken along line I-I' of Figure 3 .

[0065] Referring to Figure 3 , a light-emitting region and a non-light-emitting region NPXA can be defined in the display region DA. The light-emitting region can be a region where an image is displayed among the first pixel PX1 to the third pixel PX3. The light-emitting region can be defined to correspond to portions of the pixel electrodes 211, 212, and 213 that are exposed by the openings OP11, OP21, and OP31 of the pixel defining layer 120 (to be described in more detail later).

[0066] The region where an image is displayed in the first pixel PX1 can be defined as a first light-emitting region PXA1, the region where an image is displayed in the second pixel PX2 can be defined as a second light-emitting region PXA2, and the region where an image is displayed in the third pixel PX3 can be defined as a third light-emitting region PXA3.

[0067] The non-light-emitting region NPXA can be a region where light emitted from the organic light-emitting diodes OLED1 to OLED3 is blocked. The non-light-emitting region NPXA can be defined (e.g., formed) between the light-emitting regions PXA1, PXA2, and PXA3. The non-light-emitting region NPXA can be a single region. That is, the non-light-emitting region NPXA can form a single continuous region around or surrounding each light-emitting region.

[0068] Referring to Figure 4 , a first pixel circuit to a third pixel circuit PC1, PC2, and PC3 for driving the first pixel to the third pixel PX1, PX2, and PX3, respectively, can be provided on the substrate 100. In one embodiment, a buffer layer can be provided between the substrate 100 and the pixel circuits PC1, PC2, and PC3. The first pixel circuit to the third pixel circuit PC1, PC2, and PC3 can include thin-film transistors and storage capacitors described with reference to Figure 2 .

[0069] The substrate 100 can include a polymer resin such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), and / or cellulose acetate propionate (CAP).

[0070] A first insulating layer 110 can be provided on the first pixel circuit to the third pixel circuit PC1, PC2, and PC3. The first insulating layer 110 can cover the pixel circuits PC1, PC2, and PC3 and can be a planarizing insulating layer to provide a flat surface. The first insulating layer 110 can include an organic insulating material such as polyimide.

[0071] Components constituting the first pixel circuit PC1 to the third pixel circuit PC3 (e.g., the semiconductor layer, gate electrode, source electrode, drain electrode of a thin film transistor, and electrode plates of a storage capacitor) may be formed between the substrate 100 and the first insulating layer 110. In addition, inorganic insulating layers and / or organic insulating layers provided between the semiconductor layer and the gate electrode, between the gate electrode and the source electrode or drain electrode, and between the electrode plates of the storage capacitor may also be formed between the substrate 100 and the first insulating layer 110.

[0072] The first organic light-emitting diode to the third organic light-emitting diodes OLED1, OLED2, and OLED3 may be provided on the first insulating layer 110. The first organic light-emitting diode to the third organic light-emitting diodes OLED1, OLED2, and OLED3 may be provided to correspond to the first light-emitting region to the third light-emitting regions PXA1, PXA2, and PXA3, respectively.

[0073] The first organic light-emitting diode to the third organic light-emitting diodes OLED1, OLED2, and OLED3 may have similar structures, and thus the first organic light-emitting diode OLED1 will be mainly described in more detail hereinafter. The description of the second organic light-emitting diode OLED2 and the third organic light-emitting diode OLED3 may be substantially the same as the description of the first organic light-emitting diode OLED1.

[0074] The first organic light-emitting diode OLED1 may include a first pixel electrode 211, a first intermediate layer 221, and a first counter electrode 231.

[0075] The first pixel electrode 211 may include a reflective layer formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), and / or a mixture thereof.

[0076] Optionally, the first pixel electrode 211 may include the reflective layer described above and a transparent conductive oxide (TCO) layer on and / or under the reflective layer. For example, the transparent conductive oxide layer may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and / or aluminum zinc oxide (AZO). In an embodiment, the first pixel electrode 211 may have a three-layer structure of ITO / Ag / ITO.

[0077] The first intermediate layer 221 may include an organic light-emitting layer, and may further include functional layers disposed on and / or under the organic light-emitting layer. The functional layers may include a hole injection layer, a hole transport layer, an electron transport layer, and / or an electron injection layer. The organic light-emitting layer may emit red, green, blue, or white light.

[0078] The first pair of electrodes 231 may be formed of a conductive material having a low work function. For example, the first pair of electrodes 231 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), and / or alloys thereof. In an embodiment, the first pair of electrodes 231 may include aluminum (Al), silver (Ag), and / or an alloy of magnesium and silver (Mg:Ag). In an embodiment, the first pair of electrodes 231 may include an alloy in which the content of silver (Ag) is greater than the content of magnesium (Mg).

[0079] The first intermediate layer 221 and the first pair of electrodes 231 may be formed by a thermal deposition method.

[0080] The first intermediate layer 221 and the first pair of electrodes 231 may be disposed in the first light-emitting region PXA1 and a portion of the non-light-emitting region NPXA adjacent to the first light-emitting region PXA1, and may not be disposed in other portions of the non-light-emitting region NPXA.

[0081] Each of the second organic light-emitting diode OLED2 and the third organic light-emitting diode OLED3 may have substantially the same structure as the first organic light-emitting diode OLED1, and thus a detailed description of its components will not be repeated.

[0082] The second organic light-emitting diode OLED2 may include a second pixel electrode 212, a second intermediate layer 222, and a second pair of electrodes 232. The third organic light-emitting diode OLED3 may include a third pixel electrode 213, a third intermediate layer 223, and a third pair of electrodes 233. In an embodiment of the present disclosure, the first to third intermediate layers 221, 222, and 223 may include organic light-emitting layers configured to emit lights of different colors from each other.

[0083] The display device 1000 may further include a pixel defining layer 120. The pixel defining layer 120 may define the non-light-emitting region NPXA.

[0084] The pixel defining layer 120 may be disposed on the first pixel electrode to the third pixel electrodes 211, 212, and 213, and may cover the ends of the first pixel electrode to the third pixel electrodes 211, 212, and 213. The first opening to the third openings OP11, OP21, and OP31 may be provided (e.g., formed) in the pixel defining layer 120. The first opening to the third openings OP11, OP21, and OP31 may expose portions of the first pixel electrode to the third pixel electrodes 211, 212, and 213, respectively. The first opening to the third openings OP11, OP21, and OP31 may correspond to the first light emitting region to the third light emitting regions PXA1, PXA2, and PXA3, respectively.

[0085] The first intermediate layer to the third intermediate layers 221, 222, and 223 may be disposed on the pixel defining layer 120.

[0086] For example, the pixel defining layer 120 may be formed of an organic insulating material such as an acrylic organic material and / or benzocyclobutene (BCB). In another embodiment, the pixel defining layer 120 may be formed of an inorganic insulating material such as silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON), and / or silicon oxycarbide (SiOC). When the pixel defining layer 120 is formed of an inorganic insulating material, the pixel defining layer 120 may block the permeation paths of oxygen and / or moisture to inhibit, protect, or prevent the organic light emitting diode from being damaged by oxygen and / or moisture.

[0087] The display device 1000 may further include an auxiliary electrode 130. The auxiliary electrode 130 may be disposed on the pixel defining layer 120. The auxiliary electrode 130 may be in direct contact with the top surface of the pixel defining layer 120.

[0088] The auxiliary electrode 130 may be disposed in the non-light emitting region NPXA. The area of the auxiliary electrode 130 may be smaller than the area of the pixel defining layer 120 in a plan view, and thus the auxiliary electrode 130 may be covered by the pixel defining layer 120 in a plan view. The auxiliary electrode 130 may be formed of a metal layer including a low-resistance metal such as molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), and / or their alloys. In addition, the auxiliary electrode 130 may further include a transparent conductive oxide layer (e.g., indium tin oxide (ITO)) disposed on and / or under the above-described metal layer.

[0089] The auxiliary electrode 130 may be in contact with the first through third pairs of electrodes 231, 232, and 233 to be electrically connected to the first through third pairs of electrodes 231, 232, and 233. The first through third pairs of electrodes 231, 232, and 233 may be electrically connected to each other through the auxiliary electrode 130 and may thus receive the same voltage for driving the first through third organic light-emitting diodes OLED1, OLED2, and OLED3.

[0090] The display device 1000 may further include spacers 150. The spacers 150 may be disposed between the pixel defining layer 120 and the auxiliary electrode 130.

[0091] The spacers 150 may be disposed in the non-light emitting area NPXA. When observed in a plan view, the spacers 150 may have an island shape and may be disposed in plural around each of the first through third light emitting areas PXA1, PXA2, and PXA3. In Figure 3 this case, four spacers 150 separated from each other are disposed around each of the first through third light emitting areas PXA1, PXA2, and PXA3. However, embodiments of the present disclosure are not limited thereto. The number of spacers 150 disposed around each of the first through third light emitting areas PXA1, PXA2, and PXA3 may be set or changed differently and appropriately.

[0092] In an embodiment of the present disclosure, when observed in a plan view (e.g., in the third direction DR3), each of the first through third light emitting areas PXA1, PXA2, and PXA3 may have a polygonal shape. When observed in a plan view, the spacers 150 may be disposed adjacent to the corners of each of the first through third light emitting areas PXA1, PXA2, and PXA3.

[0093] The shortest distance DT in the plan view between adjacent spacers 150 may be in the range of 10 μm to 25 μm. In a method of manufacturing a display device (described in more detail later with reference to Figures 5C to 5E ), the spacers 150 may support a mask layer to prevent or protect the mask layer from collapsing. However, if the shortest distance between adjacent spacers 150 is greater than 25 μm, it may be difficult for the spacers 150 to support the mask layer. If the shortest distance is less than 10 μm, the etching solution may not penetrate freely between the spacers 150.

[0094] In Figure 3 this case, the spacers 150 have a circular shape in a plan view. However, embodiments of the present disclosure are not limited thereto. The shape of the spacers 150 may be modified differently and appropriately.

[0095] The spacer 150 may include an organic material.

[0096] The spacer 150 may be sealed (e.g., encapsulated or completely covered) by the auxiliary electrode 130. Thus, even if gas appears (e.g., is generated) from the organic material included in the spacer 150 during the manufacturing process, the gas does not transfer (e.g., does not penetrate) to the organic light-emitting layer included in the first to third intermediate layers 221, 222, and 223. Accordingly, the organic light-emitting layer can be protected.

[0097] The display device 1000 may further include first to third insulating protection layers 241, 242, and 243. The first to third insulating protection layers 241, 242, and 243 may be respectively disposed on the first to third pairs of electrodes 231, 232, and 233 and may respectively cover the first to third pairs of electrodes 231, 232, and 233. The first to third insulating protection layers 241, 242, and 243 may respectively encapsulate the first to third pairs of electrodes 231, 232, and 233 to prevent or protect the first to third pairs of electrodes 231, 232, and 233 from being exposed to moisture and / or air.

[0098] The first to third insulating protection layers 241, 242, and 243 may be separated from each other. Accordingly, a part of the auxiliary electrode 130 may be exposed between the first to third insulating protection layers 241, 242, and 243.

[0099] The first to third insulating protection layers 241, 242, and 243 may include an inorganic insulating material such as silicon nitride and / or silicon oxide. The first to third insulating protection layers 241, 242, and 243 may be formed by, for example, a chemical vapor deposition (CVD) method.

[0100] Ends of each of the first to third intermediate layers 221, 222, and 223, ends of each of the first to third pairs of electrodes 231, 232, and 233, and ends of each of the first to third insulating protection layers 241, 242, and 243 may be stacked with the spacer 150.

[0101] Figures 5A to 5H is a cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. Figures 5A to 5H may correspond to a cross-sectional view taken along Figure 3 line I-I'.

[0102] Figures 5A to 5HThe first light-emitting region to the third light-emitting regions PXA1, PXA2, and PXA3 and a non-light-emitting region NPXA adjacent to (e.g., surrounding) the first light-emitting region to the third light-emitting regions PXA1, PXA2, and PXA3 are shown. The first light-emitting region to the third light-emitting regions PXA1, PXA2, and PXA3 may be defined as regions for displaying images having different colors.

[0103] Referring Figure 5A , pixel circuits PC1 to PC3, a first insulating layer 110, first to third pixel electrodes 211, 212, and 213, and a pixel defining layer 120 may be formed on a substrate 100. The pixel circuits PC1 to PC3, the first insulating layer 110, the first to third pixel electrodes 211, 212, and 213, and the pixel defining layer 120 may be formed using any suitable or known method, and their detailed descriptions will not be repeated.

[0104] Thereafter, spacers 150 may be formed on the pixel defining layer 120.

[0105] An organic material may be deposited on the pixel defining layer 120, and then, a patterning process may be performed on the organic material to form the spacers 150. The spacers 150 may be stacked on the pixel defining layer 120.

[0106] The spacers 150 may be formed in an island shape around each of the first light-emitting region to the third light-emitting regions PXA1, PXA2, and PXA3.

[0107] The spacers 150 may include first to third spacers 151, 152, and 153.

[0108] The first spacer 151 may be formed around the first light-emitting region PXA1, the second spacer 152 may be formed around the second light-emitting region PXA2, and the third spacer 153 may be formed around the third light-emitting region PXA3. In other words, the first spacer 151 may be formed outside a first opening OP11 (see Figure 4 ) of the pixel defining layer 120, the second spacer 152 may be formed outside a second opening OP21 (see Figure 4 ) of the pixel defining layer 120, and the third spacer 153 may be formed outside a third opening OP31 (see Figure 4 ) of the pixel defining layer 120.

[0109] The first spacer 151 may be the spacer closest to the first light-emitting region PXA1 among the first to third light-emitting regions PXA1, PXA2, and PXA3, the second spacer 152 may be the spacer closest to the second light-emitting region PXA2 among the first to third light-emitting regions PXA1, PXA2, and PXA3, and the third spacer 153 may be the spacer closest to the third light-emitting region PXA3 among the first to third light-emitting regions PXA1, PXA2, and PXA3.

[0110] Thereafter, an auxiliary electrode 130 may be formed on the pixel defining layer 120 on which the spacers 150 are formed. A conductive material may be formed on the pixel defining layer 120 and the spacers 150, and then, a patterning process may be performed on the conductive material to form the auxiliary electrode 130.

[0111] The auxiliary electrode 130 may be formed of a metal layer including a low-resistance metal such as molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), and / or an alloy thereof. In addition, the auxiliary electrode 130 may further include a transparent conductive oxide layer (e.g., indium tin oxide (ITO)) provided on and / or under the above-described metal layer.

[0112] The auxiliary electrode 130 may be stacked on the pixel defining layer 120 and the spacers 150. The auxiliary electrode 130 may cover the spacers 150 and may seal the spacers 150 together with the pixel defining layer 120.

[0113] Refer to Figure 5B , subsequently, a first polymer layer 301 may be formed on the pixel defining layer 120 on which the auxiliary electrode 130 is formed.

[0114] The first polymer layer 301 may include a polymer material. For example, the first polymer layer 301 may include a fluorine-containing polymer. For example, the first polymer layer 301 may include polytetrafluoroethylene, polytrifluorochloroethylene, polydichlorodifluoroethylene, a copolymer of trifluorochloroethylene and dichlorodifluoroethylene, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, and / or a copolymer of trifluorochloroethylene and perfluoroalkyl vinyl ether.

[0115] To form the first polymer layer 301, a polymer material may be coated on the pixel defining layer 120 on which the auxiliary electrode 130 is formed. Thereafter, by heating the polymer material, the polymer material may reflux (e.g., may be made to flow), and thus, the first polymer layer 301 having a flat top surface may be formed.

[0116] Next, a photoresist material may be coated on the first polymer layer 301 to form a first photoresist layer 311.

[0117] Reference Figure 5C Subsequently, the first photoresist layer 311 may be patterned to form the first mask layer 320. A portion of the first photoresist layer 311 located at a position corresponding to the first pixel electrode 211 may be removed through an exposure process and a development process. A first mask opening OP12 exposing the first pixel electrode 211 may be provided (e.g., formed) in the first mask layer 320.

[0118] At this time, when observed in a plan view, the first mask layer 320 may overlap with the first spacer 151.

[0119] Subsequently, the first polymer layer 301 may be etched using the first mask layer 320 as an etch mask to form the first peeling layer 310. A first peeling opening OP13 exposing the first pixel electrode 211 may be provided (e.g., formed) in the first peeling layer 310.

[0120] When the first polymer layer 301 includes a fluoropolymer, a solvent capable of etching the fluoropolymer (e.g., hydrofluoroether) may be used as an etch solution.

[0121] The first peeling layer 310 may have an undercut shape that laterally departs from the inner surface of the first mask layer 320 defining the first mask opening OP12. In other words, when observed in a plan view, the first mask layer 320 may have an area wider (e.g., larger) than the area of the first peeling layer 310 and may cover the first peeling layer 310. When observed in a plan view, the size of the first peeling opening OP13 may be larger than the size of the first mask opening OP12.

[0122] The distance W1 between the pixel defining layer 120 (e.g., the top surface of the pixel defining layer 120) and the top surface of the first peeling layer 310 may be larger than the distance W2 between the pixel defining layer 120 (e.g., the top surface of the pixel defining layer 120) and the top surface of the first spacer 151.

[0123] The first peeling layer 310 may expose at least a portion of the first spacer 151. The first peeling layer 310 may not overlap with at least a portion of the first spacer 151. The first peeling layer 310 may be separated from the first spacer 151.

[0124] Reference Figure 5D Next, a first intermediate layer 221 and a first pair of electrodes 231 may be sequentially formed on the first pixel electrode 211 through the first mask opening OP12 of the first mask layer 320. Materials for forming the first intermediate layer 221 and the first pair of electrodes 231 may be formed on the first mask layer 320 and on the first pixel electrode 211.

[0125] The first intermediate layer 221 and the first pair of electrodes 231 may be formed to overlap with the first spacer 151 and the auxiliary electrode 130. The first pair of electrodes 231 may be in contact with the auxiliary electrode 130. The first organic light-emitting diode OLED1 may be formed through the process of Figure 5D .

[0126] The structures and materials of the first intermediate layer 221 and the first pair of electrodes 231 may be the same as those described with reference to Figure 4 , and thus the detailed description thereof will not be repeated.

[0127] With reference to Figure 5E , subsequently, the first insulating protection layer 241 may be formed through the first mask opening OP12 of the first mask layer 320. A material for forming the first insulating protection layer 241 may be formed on the first pair of electrodes 231, and a material for forming the first insulating protection layer 241 may also be formed on the first mask layer 320.

[0128] The first insulating protection layer 241 may seal or encapsulate the first pair of electrodes 231. The material of the first insulating protection layer 241 may be the same as that described with reference to Figure 4 , and thus the detailed description thereof will not be repeated.

[0129] The first intermediate layer 221, the first pair of electrodes 231, and the first insulating protection layer 241 described with reference to Figure 5D and Figure 5E may be formed through a deposition process.

[0130] During the deposition process of the first intermediate layer 221, the first pair of electrodes 231, and / or the first insulating protection layer 241, the temperature rises, causing the first release layer 310 to soften and flow back (e.g., to flow), so the first release layer 310 does not firmly (e.g., does not sufficiently) support the first mask layer 320. In this case, the portion of the first mask layer 320 that does not overlap with the first release layer 310 and is adjacent to the first light-emitting region PXA1 may collapse toward the pixel defining layer 120. If the first mask layer 320 collapses, the position and shape of the first mask opening OP12 will change. In this case, it may be difficult to form a desired deposition pattern in the first light-emitting region PXA1 in subsequent processes. In addition, if the first mask layer 320 collapses, the first mask layer 320 will come into contact with at least one of the first intermediate layer 221, the first pair of electrodes 231, and the first insulating protection layer 241, so the space for the etching solution to penetrate (e.g., the space for the etching solution to penetrate may be blocked) cannot be ensured. In this case, it may be difficult to remove the first release layer 310 and the first mask layer 320 in subsequent processes.

[0131] However, in the method of manufacturing a display device according to an embodiment of the present disclosure, when the first mask layer 320 collapses during the deposition process of the first intermediate layer 221 and the first pair of electrodes 231, the first spacer 151 can support the first mask layer 320. The first spacer 151 can be adjacent to the first light-emitting region PXA1 and can have an island shape. Therefore, even if the first mask layer 320 may collapse, the first mask layer 320 can have a region that does not contact at least one selected from the first intermediate layer 221, the first pair of electrodes 231, and the first insulating protection layer 241 between the first spacers 151 (adjacent to each other), and an etching solution for removing the first stripping layer 310 (for example, the etching solution for removing the first stripping layer 310 can flow unobstructed) can be freely provided through the region. Therefore, the first stripping layer 310 and the first mask layer 320 can be easily removed.

[0132] Referring to Figure 5F , thereafter, the first stripping layer 310 and the first mask layer 320 can be removed. The first stripping layer 310 and the first mask layer 320 can be removed using an etching solution.

[0133] When the first stripping layer 310 includes a fluoropolymer, a solvent capable of etching the fluoropolymer (for example, hydrofluoroether) can be used as the etching solution.

[0134] The first organic light-emitting diode OLED1 and the first insulating protection layer 241 can be formed in the first light-emitting region PXA1 through the process of Figures 5A to 5F .

[0135] Thereafter, the process of forming the second organic light-emitting diode OLED2 and the second insulating protection layer 242 in the second light-emitting region PXA2 can be performed. The second organic light-emitting diode OLED2 and the second insulating protection layer 242 can be formed by repeatedly performing (for example, by repeating) Figures 5B to 5F the process on the second light-emitting region PXA2. The process of forming the second organic light-emitting diode OLED2 and the second insulating protection layer 242 can be substantially the same as the process of forming the first organic light-emitting diode OLED1 and the first insulating protection layer 241, and thus the detailed description thereof will not be repeated. Figure 5G is a view in which the second organic light-emitting diode OLED2 and the second insulating protection layer 242 are formed.

[0136] Thereafter, the process of forming the third organic light-emitting diode OLED3 and the third insulating protection layer 243 in the third light-emitting region PXA3 can be performed. The third organic light-emitting diode OLED3 and the third insulating protection layer 243 can be formed by repeatedly performing (for example, by repeating) Figures 5B to 5FThe process is used to form the third organic light-emitting diode OLED3 and the third insulating and protecting layer 243. The process of forming the third organic light-emitting diode OLED3 and the third insulating and protecting layer 243 can be substantially the same as the process of forming the first organic light-emitting diode OLED1 and the first insulating and protecting layer 241, and thus the detailed description thereof will not be repeated. Figure 5H is a view in which the third organic light-emitting diode OLED3 and the third insulating and protecting layer 243 are formed.

[0137] Figure 6 is along Figure 3 the line I-I' is intercepted to show a cross-sectional view of the display device according to an embodiment of the present disclosure.

[0138] Figure 6 the spacers and the pixel defining layer of the display device 1001 are different from those of the display device 1000, while the other components of the display device 1001 can be substantially the same as the corresponding components of the display device 1000. Hereinafter, with reference to Figure 4 mainly describes the spacers and the pixel defining layer of the display device 1001, and the description of the other components will not be repeated. Figure 6 The display device 1001 may include a pixel defining layer 120-1 and spacers 150-1 disposed on the pixel defining layer 120-1. The pixel defining layer 120-1 and the spacers 150-1 may constitute a single integral (whole) body.

[0139] The pixel defining layer 120-1 and the spacers 150-1 may be formed of the same material. The pixel defining layer 120-1 and the spacers 150-1 may include an organic material.

[0140] The pixel defining layer 120-1 and the spacers 150-1 may be formed by the same process using a halftone mask.

[0141] In the display device 1001 according to an embodiment of the present disclosure, the pixel defining layer 120-1 and the spacers 150-1 may be formed by the same process, and thus one patterning process may be eliminated. Therefore, according to

[0142] in the embodiment of Figure 6 the manufacturing process can be simplified. Figure 6 In the method of manufacturing a display device according to an embodiment of the present disclosure, spacers may be formed to be stacked with a mask layer to prevent or protect the peeling layer and the mask layer from collapsing. Therefore, the peeling layer and the mask layer can be easily removed in subsequent processes.

[0143]

[0144] ​In addition, the spacer may be covered by the auxiliary electrode, and thus gas transfer (e.g., permeation) caused by outgassing can be reduced or prevented from occurring into the organic light emitting diode.

[0145] As used herein, the terms "substantially", "about" and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art. Further, when describing embodiments of the present invention, the use of "may" means "one or more embodiments of the present invention". Moreover, the term "exemplary" is intended to mean an example or illustration.

[0146] Additionally, any numerical range recited herein is intended to include all sub-ranges of the same numerical precision subsumed within the recited range. For example, a range of "1.0 to 10.0" is intended to include all sub-ranges between (and including) the recited minimum value of 1.0 and the recited maximum value of 10.0, that is, all sub-ranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0 (such as, by way of example, 2.4 to 7.6). Any maximum numerical limitation recited herein is intended to include all lower numerical limitations subsumed therein, and any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein. Accordingly, the applicant reserves the right to amend this specification (including the claims) to expressly recite any sub-ranges that are subsumed herein and are expressly recited within the range.

[0147] Although the subject matter of the present disclosure has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present disclosure. Accordingly, it should be understood that the above embodiments are illustrative and not restrictive. Thus, the scope of the present disclosure will be determined by the broadest permissible interpretation of the claims and their equivalents, and should not be limited or restricted by the foregoing description.

Claims

1. A display device, the display device comprising: a substrate having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region; an organic light-emitting diode including a pixel electrode located in the light-emitting region, an intermediate layer on the pixel electrode and including a light-emitting layer, and a counter electrode on the intermediate layer; an auxiliary electrode electrically connected to the counter electrode; a first layer located between the pixel electrode and the auxiliary electrode, the first layer covering an end portion of the pixel electrode; and a second layer located between the first layer and the auxiliary electrode.

2. The display device according to claim 1, wherein, The intermediate layer and / or the counter electrode are superposed on the second layer.

3. The display device according to claim 1, wherein The first layer includes an inorganic material.

4. The display device according to claim 1, wherein, The first layer and / or the second layer includes an inorganic material.

5. The display device according to claim 1, wherein, The first layer and the second layer are made of different materials from each other.

6. The display device according to claim 1, wherein, The first layer and the second layer constitute a single integral body.

7. The display device according to claim 1, wherein, The auxiliary electrode is in contact with a top surface of the second layer.

8. The display device according to claim 1, wherein, The second layer is provided in a plurality adjacent to the light-emitting region, and wherein each of the second layers has an island shape.

9. The display device according to claim 8, wherein, When observed in a plan view, the light-emitting region has a polygonal shape, and wherein each of the second layers is adjacent to a corner of the light-emitting region.

10. The display device according to claim 8, wherein, The shortest distance between the second layers adjacent to each other is in the range of 10 μm to 25 μm.

11. A display device, the display device comprising: a substrate having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region; a pixel electrode, at least a part of the pixel electrode being located in the light-emitting region; an intermediate layer located on the pixel electrode and including a light-emitting layer; a counter electrode located on the intermediate layer; a first layer covering an end portion of the pixel electrode; a second layer located on the first layer; and an auxiliary electrode located on the second layer and in contact with the counter electrode.

12. The display device according to claim 11, wherein, The first layer includes an inorganic material.

13. A method of manufacturing a display device, the method comprising the steps of: forming a first pixel electrode for emitting first-color light, a second pixel electrode for emitting second-color light, and a third pixel electrode for emitting third-color light on a substrate; forming a first layer exposing a part of the first pixel electrode, a part of the second pixel electrode, and a part of the third pixel electrode; forming a second layer on the first layer covering an end portion of the first pixel electrode; forming an auxiliary electrode on the second layer; forming a pattern-forming auxiliary layer and a first mask layer on the second layer, wherein the pattern-forming auxiliary layer exposes the part of the first pixel electrode, and the first mask layer has a first mask opening exposing the part of the first pixel electrode; forming a first intermediate layer on the first pixel electrode through the first mask opening; forming a first counter electrode on the first intermediate layer through the first mask opening.

14. The method according to claim 13, the method further comprising: after the step of forming the first counter electrode, forming a first insulating protection layer covering the first counter electrode through the first mask opening.

15. The method according to claim 13, wherein, The second layer is provided in a plurality, and Among them, each in the second layer has an island shape.

16. The method according to claim 13, wherein, The steps of forming the pattern forming auxiliary layer and the first mask layer include: forming a first material layer on the first layer on which the auxiliary electrode is formed; forming a second material layer on the first material layer; exposing and developing the second material layer to form the first mask layer; and using the first mask layer as an etching mask to etch the first material layer to form the pattern forming auxiliary layer.

17. The method according to claim 13, wherein, The pattern forming auxiliary layer has an undercut shape that is recessed from the inner surface of the first mask layer that defines the first mask opening.

18. The method according to claim 17, wherein In a plan view, the first mask layer overlaps with the second layer.

19. The method according to claim 13, wherein, The second layer contacts the auxiliary electrode.

20. The method according to claim 13, wherein, The first pair of electrodes contacts the auxiliary electrode.