Display panel, manufacturing method and display device

Abstract

The invention provides a display panel, a manufacturing method and a display device, and relates to the technical field of display. The display panel comprises a display substrate which is provided with a display area, a binding area and a bending area; the orthographic projection of the driving chip on the display substrate is located in the binding area; the supporting layer is located on the side away from the light emitting face of the display substrate; the bonding layer is located on the side, away from the display substrate, of the supporting layer and comprises a first bonding substrate and a first adhesive layer; after the bending area is bent, the binding area is located on the side away from the light emitting face of the display substrate, and the orthographic projection of the first bonding substrate at least covers the orthographic projection of the driving chip. In the embodiment of the invention, after the bending area of the display substrate is bent, the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area, so that a relatively large elastic modulus is provided through the first bonding substrate, and the impact resistance of the area where the driving chip is located is further improved; the structural strength of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Currently, folding mobile phones are being gradually accepted by people, which benefits from a display area that can be freely expanded. Whether it is for daily office communication or the experience of new technologies, people are very fond of them. As is well known, although the application scenarios of folding mobile phones have been broadened, due to their foldable characteristics, an inevitable problem has arisen: after a protective layer stacked by one or more relatively soft materials replaces the glass cover plate of a traditional straight mobile phone, the structural strength of the mobile phone has significantly decreased, thereby shortening the service life of the mobile phone.

[0003] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0004] An object of the present disclosure is to provide a display panel, a manufacturing method thereof, and a display device, which can improve the impact resistance of the display panel and extend the service life.

[0005] According to one aspect of the present disclosure, a display panel is provided, including:

[0006] A display substrate having a display area and a non-display area located outside the display area, the non-display area including a bonding area and a bending area, and the bending area connecting the display area and the bonding area;

[0007] A driving chip, the orthographic projection of which on the display substrate is located in the bonding area;

[0008] A support layer located on one side of the light-emitting surface facing away from the display substrate, and the orthographic projection of which on the display substrate at least coincides with the display area;

[0009] An adhesive layer located on the side of the support layer facing away from the display substrate, and including a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate, and the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa;

[0010] After the bending area is bent, the bonding area is located on the side of the light-emitting surface facing away from the display substrate, and the driving chip is located on the side of the bonding area facing away from the display area. The two first adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate, and the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

[0011] For the display panel according to any one of the present disclosures, the adhesive layer further includes a second adhesive substrate, and second adhesive layers located on two surfaces of the second adhesive substrate;

[0012] The thickness of the second adhesive substrate is less than that of the first adhesive substrate, and the second adhesive substrate is located on a side of the first adhesive substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate.

[0013] For the display panel according to any one of the present disclosures, there is no overlapping area between the first adhesive substrate and the second adhesive substrate in the rotation axis direction of the bending area.

[0014] For the display panel according to any one of the present disclosures, the second adhesive substrate has a U-shaped structure with an opening facing away from the bending area, and the first adhesive substrate is located in the U-shaped groove surrounded by the second adhesive substrate.

[0015] For the display panel according to any one of the present disclosures, the second adhesive substrate has an annular structure, and at least a part of the first adhesive substrate is located in the area surrounded by the second adhesive substrate.

[0016] For the display panel according to any one of the present disclosures, the width of the second adhesive substrate on a side of the first adhesive substrate close to the bending area is greater than or equal to 2 mm and less than or equal to 5 mm.

[0017] For the display panel according to any one of the present disclosures, the dimension of the second adhesive substrate on a side of the first adhesive substrate in the rotation axis direction of the bending area is greater than or equal to 6 mm and less than or equal to 12 mm.

[0018] For the display panel according to any one of the present disclosures, the adhesive layer further includes a second adhesive layer. The second adhesive layer is located on a side of the first adhesive substrate close to the bending area. After the bending area is bent, the second adhesive layer is respectively bonded to the support layer and the bonding area of the display substrate.

[0019] For the display panel according to any one of the present disclosures, the adhesive layer is an integrated whole layer structure.

[0020] For the display panel according to any one of the present disclosures, the first adhesive substrate has a thickened area and a thinned area;

[0021] After the bending area is bent, the orthographic projection of the thickened area in the display area at least covers the orthographic projection of the driving chip in the display area, and the thinned area is located on a side of the thickened area close to the bending area.

[0022] For the display panel according to any one of the present disclosures, there is no overlapping region between the thinning region and the thickening region in the rotation axis direction of the bending region.

[0023] For the display panel according to any one of the present disclosures, the thinning region has a U-shaped structure with an opening facing away from the bending region, and at least a part of the thickening region is located in the U-shaped groove surrounded by the thinning region.

[0024] For the display panel according to any one of the present disclosures, the thinning region has an annular structure, and the thickening region is located in the region surrounded by the thinning region.

[0025] For the display panel according to any one of the present disclosures, the thickness of the first bonding substrate in the thickening region is greater than or equal to 0.08 mm.

[0026] For the display panel according to any one of the present disclosures, the thickness of the first bonding substrate in the thinning region is less than or equal to 0.06 mm.

[0027] For the display panel according to any one of the present disclosures, the edge of the first bonding substrate extends out of the first adhesive layer.

[0028] For the display panel according to any one of the present disclosures, the extending dimension of the edge of the first bonding substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

[0029] For the display panel according to any one of the present disclosures, the edge of the first bonding substrate is aligned with the edge of the first adhesive layer.

[0030] For the display panel according to any one of the present disclosures, the edge of the first bonding substrate has a burr bent to one side, and the burr faces the support layer.

[0031] For the display panel according to any one of the present disclosures, the first bonding substrate is a metal substrate or a fiber substrate.

[0032] For the display panel according to any one of the present disclosures, one of the two first adhesive layers close to the support layer is a conductive adhesive layer, and the one far from the support layer is a non-conductive adhesive layer.

[0033] For the display panel according to any one of the present disclosures, the first bonding substrate is a non-conductive structure, and the adhesive layer further includes a conductive layer located on the side of the first bonding substrate close to the support layer.

[0034] For the display panel according to any one of the present disclosures, the thickness of the conductive layer is greater than or equal to 5 μm and less than or equal to 10 μm.

[0035] For the display panel according to any one of the present disclosures, the support layer includes a bend-resistant layer and a support substrate;

[0036] The bend-resistant layer is located between the display substrate and the support substrate, and both surfaces of the bend-resistant layer have third adhesive layers, and the two third adhesive layers are respectively bonded to the display area of the display substrate and the support substrate.

[0037] For the display panel according to any one of the present disclosures, the display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

[0038] According to one aspect of the present disclosure, a method for manufacturing a display panel is provided, the method including:

[0039] Providing a display substrate, the display panel having a display area and a non-display area located outside the display area, the non-display area including a bonding area and a bending area, the bending area connecting the display area and the bonding area;

[0040] Bonding a driving chip on one side close to the light-emitting surface of the display substrate, a positive projection of the driving chip on the display substrate being located in the bonding area;

[0041] Providing a support layer on one side facing away from the light-emitting surface of the display substrate, a positive projection of the support layer on the display substrate at least coinciding with the display area;

[0042] Providing an adhesive layer, the adhesive layer including a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate, an elastic modulus of the first adhesive substrate being greater than or equal to 10 11 Pa;

[0043] Providing the adhesive layer on one side of the support layer facing away from the display substrate, and bending the bending area of the display substrate so that the bonding area is located on one side away from the light-emitting surface of the display substrate, and the driving chip is located on one side of the bonding area facing away from the display area, and simultaneously bonding the two first adhesive layers on the surface of the first adhesive substrate to the support layer and the bonding area of the display substrate respectively, a positive projection of the first adhesive substrate in the display area at least covering a positive projection of the driving chip in the display area.

[0044] For the method according to any one of the present disclosures, a manufacturing method of the adhesive layer includes:

[0045] Providing a substrate substrate and performing etching to obtain the first adhesive substrate;

[0046] Providing an adhesive base material and performing die-cutting to obtain the first adhesive layers, a size of the first adhesive layers being smaller than a size of the first adhesive substrate;

[0047] On both side surfaces of the first adhesive substrate, the first adhesive layer is adhered through a transfer process, and the edge of the first adhesive substrate extends beyond the first adhesive layer.

[0048] According to any one of the methods of the present disclosure, the method for manufacturing the adhesive layer includes:

[0049] Provide a base substrate and an adhesive base material;

[0050] Adhere the adhesive base material to both side surfaces of the base substrate;

[0051] Simultaneously cut the adhesive base material and the base substrate by means of laser cutting or stamping cutting to obtain an adhesive layer including the first adhesive substrate and the first adhesive layer, and the edge of the first adhesive substrate is aligned with the edge of the first adhesive layer.

[0052] According to one aspect of the present disclosure, a display device is provided, including the display panel described in the above aspect.

[0053] The embodiments of the present disclosure at least include the following technical effects:

[0054] In the embodiments of the present disclosure, after the two first adhesive layers of the adhesive layer respectively adhere to the binding areas of the support layer and the display substrate, the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driving chip in the display area, so as to provide a relatively large elastic modulus in the area where the driving chip is located through the first adhesive substrate, thereby improving the impact resistance of the display panel in the area where the driving chip is located, so as to extend the service life of the display panel on the basis of improving the structural strength of the display panel.

[0055] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0057] Figure 1 It is a schematic cross-sectional structure diagram of a display panel before bending provided by the embodiments of the present disclosure.

[0058] Figure 2 It is a schematic cross-sectional structure diagram of a display panel after bending provided by the embodiments of the present disclosure.

[0059] Figure 3 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0060] Figure 4 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0061] Figure 5 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0062] Figure 6 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0063] Figure 7 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0064] Figure 8 A schematic top view structure diagram of a first bonding substrate provided by the embodiment of the present disclosure.

[0065] Figure 9 Another schematic top view structure diagram of a first bonding substrate provided by the embodiment of the present disclosure.

[0066] Figure 10 Another schematic top view structure diagram of a first bonding substrate provided by the embodiment of the present disclosure.

[0067] Figure 11 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0068] Figure 12 Another schematic cross-sectional structure diagram of the display panel after bending provided by the embodiment of the present disclosure.

[0069] Figure 13 A schematic top view structure diagram of a first bonding substrate and a second bonding substrate provided by the embodiment of the present disclosure.

[0070] Figure 14 Another schematic top view structure diagram of a first bonding substrate and a second bonding substrate provided by the embodiment of the present disclosure.

[0071] Figure 15 Another schematic top view structure diagram of a first bonding substrate and a second bonding substrate provided by the embodiment of the present disclosure.

[0072] Figure 16 A schematic flow chart of a manufacturing method of a display panel provided by the embodiment of the present disclosure.

[0073] Reference numerals:

[0074] 100. Display panel;

[0075] AA. Display area; BB. Non-display area; B1. Bonding area; B2. Bending area;

[0076] 10. Display substrate; 20. Driving chip; 30. Support layer; 40. Adhesive layer; 50. Metal tape; 60. Cover protective layer; 70. Flexible circuit;

[0077] 11. Display module; 12. Back film protective layer;

[0078] 121. First back film layer; 122. Second back film layer;

[0079] 21. First rubber strip; 22. Second rubber strip;

[0080] 31. Support substrate; 32. Bend-resistant layer; 33. Third adhesive layer;

[0081] 41. First bonding substrate; 42. First adhesive layer; 43. Second bonding substrate; 44. Second adhesive layer; 45. Conductive layer;

[0082] 411. Thickened area; 412. Thinned area; 413. Burr;

[0083] 421. First sub-adhesive layer; 422. Second sub-adhesive layer; 423. Conductive adhesive layer; 424. Non-conductive adhesive layer;

[0084] 61. Thin glass substrate; 62. Hardened protective layer; 63. High-temperature resistant protective layer; 64. Fourth adhesive layer. Detailed implementation manners

[0085] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0086] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the directions in the examples described in the drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component described as "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0087] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0088] Figure 1 FIG. illustrates a schematic structural diagram of an unbent display panel 100 provided by an embodiment of the present disclosure. Figure 2 FIG. illustrates a schematic structural diagram of a bent display panel 100 provided by an embodiment of the present disclosure. Figure 3 FIG. illustrates another schematic structural diagram of a bent display panel 100 provided by an embodiment of the present disclosure. As Figure 1 , Figure 2 or Figure 3 shown, the display panel 100 includes: a display substrate 10, a driving chip 20, a support layer 30, and an adhesive layer 40.

[0089] As Figure 1 shown, the display substrate 10 has a display area AA and a non-display area BB located outside the display area AA. The non-display area BB includes a bonding area B1 and a bending area B2. The bending area B2 connects the display area AA and the bonding area B1; the driving chip 20 is located on one side close to the light-emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 is located in the bonding area B1; the support layer 30 is located on the side facing away from the light-emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 at least coincides with the display area AA; the adhesive layer 40 is located on the side of the support layer 30 facing away from the display substrate 10.

[0090] As Figure 2 or Figure 3As shown, after the bending area B2 of the display substrate 10 is bent, the bonding area B1 is located on the side away from the light-emitting surface of the display substrate 10, and the driving chip 20 is located on the side of the bonding area B1 away from the display area AA. At this time, the adhesive layer 40 can be bonded to the support layer 30 and the bonding area B1 of the display substrate 10 respectively.

[0091] Among them, the bending area B2 can be bent toward the side away from the light-emitting surface of the display substrate 10. After the bending area B2 of the display substrate 10 is bent, the bonding area B1 is located on the side away from the light-emitting surface of the display substrate 10. Therefore, when the bending area B2 of the display substrate 10 is not bent, the driving chip 20 can be observed on the side of the light-emitting surface of the display substrate 10; when the bending area B2 of the display substrate 10 is bent, the driving chip 20 can be observed on the side away from the light-emitting surface of the display substrate 10.

[0092] Among them, the bonding area B1 of the display substrate 10 is used to fix the driving chip 20. The driving chip 20 can include driving elements for driving the display area AA to display images, such as data driving circuits, etc. The driving chip 20 can be fixed by bonding. Optionally, as Figure 2 or Figure 3 shown, one side of the driving chip 20 close to the bending area B2 of the display substrate 10 is fixedly connected to the bonding area B1 through the first adhesive strip 21, and the side of the driving chip 20 away from the bending area B2 of the display substrate 10 is fixedly connected to the bonding area B1 through the second adhesive strip 22. In this way, the driving chip 20 is wrapped and fixed through the first adhesive strip 21 and the second adhesive strip 22 on both sides of the driving chip 20, improving the stability of the fixation of the driving chip 20 and reducing the situation where the driving chip 20 is damaged when an external force acts on the area where the driving chip 20 is located on the display substrate 10.

[0093] In addition, the bonding area B1 of the display substrate 10 is also used to bond the flexible circuit 70 to load corresponding signals on various signal lines of the driving chip 20 through the flexible circuit 70. After the flexible circuit 70 is bonded to the bonding area B1 of the display substrate 10, as Figure 2 or Figure 3 shown, for the second adhesive strip 22 on the side of the driving chip 20 away from the bending area B2, it can be reused as the adhesive between the flexible circuit 70 and the bonding area B1 of the display substrate 10 to improve the stability of the bonding of the flexible circuit 70 on the display substrate 10.

[0094] In some embodiments, the display area AA includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area. In this way, through the setting of the folding area, the overall folding of the display panel 100 can be realized, and then the free expansion of the image display area on the display panel 100 can be realized to improve user stickiness.

[0095] Due to the provision of the folding area in the display area AA, in order to facilitate the foldability of the display panel 100 , each film layer structure included in the display panel 100 has a bendable property at least in the folding area.

[0096] In some embodiments, Figure 1 As shown, the display substrate 10 includes a display module 11 and a back film protection layer 12, the display module 11 has a display area AA and a non-display area BB located outside the display area AA, the non-display area BB includes a binding area B1, and a bending area B2 located between the display area AA and the binding area B1; the back film protection layer 12 is located on the side away from the light emitting surface of the display module 11, and includes a first back film layer 121 and a second back film layer 122, the orthographic projection of the first back film layer 121 on the display module 11 at least overlaps with the display area AA, and the orthographic projection of the second back film layer 122 on the display module 11 at least overlaps with the binding area B1.

[0097] Among them, Figure 1 As shown, before bending in the bending area B2, the driver chip 20 is located on the side close to the light emitting surface of the display module 11, and its orthographic projection on the display module 11 is located in the binding area B1, so that the driver chip 20 is connected to the wiring and flexible circuit 70 of the display module 11 at the binding area B1 at the same time.

[0098] In some embodiments, the support layer 30 includes a support substrate 31 , the orthographic projection of the support substrate 31 on the display substrate 10 at least overlaps with the display area AA, and one side of the support substrate 31 is fixedly connected to the display area AA of the display substrate 10 .

[0099] In this way, the supporting performance of the display substrate 10 is improved by the supporting substrate 31 , thereby improving the structural strength of the display panel 100 and extending the service life of the display panel 100 .

[0100] The support layer 30 has a large elastic modulus to ensure its own structural strength, thereby ensuring the structural strength of the display panel 100. For example, the support layer 30 may include a metal material (such as stainless steel) with a large elastic modulus, or may include a carbon fiber material, a glass fiber material, etc. with a large elastic modulus.

[0101] In other embodiments, Figure 2 or Figure 3 As shown, the supporting layer 30 includes a bending-resistant layer 32 and a supporting substrate 31. The bending-resistant layer 32 is located between the display substrate 10 and the supporting substrate 31, and both surfaces of the bending-resistant layer 32 have a third adhesive layer 33. The two third adhesive layers 33 are respectively bonded to the display area AA of the display substrate 10 and the supporting substrate 31.

[0102] In this way, the bending resistance performance of the display substrate 10 is improved by the bending-resistant layer 32, and the supporting performance for the display substrate 10 is improved by the supporting substrate 31, thereby better improving the structural strength of the display panel 100 and extending the service life of the display panel 100.

[0103] Among them, the bending-resistant layer 32 can be a polyimide film or a mixed film of perfluoroethylene propylene and polyimide, as long as it can ensure that the bending-resistant layer 32 has a certain bending resistance performance. The embodiments of the present disclosure do not limit this. For the supporting substrate 31, reference can be made to the above embodiments.

[0104] In some embodiments, such as Figure 2 or Figure 3 as shown, the display panel 100 further includes a metal tape 50 (such as a copper foil tape, etc.), and the metal tape 50 is located between the support layer 30 and the adhesive layer 40.

[0105] In this way, through the setting of the metal tape 50, the bonding strength between the adhesive layer 40 and the support layer 30 can be improved, avoiding the situation of peeling between the support layer 30 and the adhesive layer 40. At the same time, the structural strength of the display panel 100 is improved, and the grounding of the metal tape 50 can also be achieved. At this time, some ground signal lines in the display panel 100 can be directly electrically connected to the metal tape 50, thereby reducing the wiring difficulty of the ground signal lines.

[0106] In some embodiments, such as Figure 2 or Figure 3 as shown, the display panel 100 further includes a cover protective layer 60, and the cover protective layer 60 is located on one side close to the light-emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 at least covers the display area AA of the display substrate 10.

[0107] Among them, the cover protective layer 60 has a light-transmitting property to ensure the normal display of the image on the display panel 100. In this way, through the setting of the cover protective layer 60, while not affecting the normal display of the display panel 100, the protection of the display substrate 10 is realized, that is, the impact resistance performance of the display panel 100 is improved, avoiding the damage of the display substrate 10 caused by foreign objects directly hitting the display substrate 10, thereby facilitating the extension of the service life of the display panel 100.

[0108] Optionally, such as Figure 2 or Figure 3 as shown, the cover protective layer 60 includes a thin glass substrate 61 and a hardened protective layer 62 located on the side of the thin glass substrate 61 away from the display substrate 10, and the hardened protective layer 62 and the thin glass substrate 61 can be bonded by a transparent adhesive.

[0109] Among them, the transparent adhesive can be an optical adhesive, a pressure-sensitive adhesive, etc., as long as it has a certain adhesive force and its light transmittance is ensured. The hardened protective layer 62 can be a hardened plastic film or a hardened high-temperature resistant polyester film, as long as it can ensure a certain hardness to have characteristics such as high light transmittance, wear resistance, and scratch resistance. The embodiments of the present disclosure do not limit this. For the case where the hardened protective layer 62 is a hardened high-temperature resistant polyester film, not only the impact resistance of the display substrate 10 is ensured, but also the high-temperature resistance of the display substrate 10 can be ensured, thereby further improving the service life of the display panel 100.

[0110] Further, as Figure 2 or Figure 3 shown, the cover protective layer 60 further includes a high-temperature resistant protective layer 63. The high-temperature resistant protective layer 63 is located between the thin glass substrate 61 and the display substrate 10. Both surfaces of the high-temperature resistant protective layer 63 have a fourth adhesive layer 64, and the two fourth adhesive layers 64 are respectively bonded to the display area AA of the thin glass substrate 61 and the display substrate 10.

[0111] In this way, through the setting of the high-temperature resistant protective layer 63, the high-temperature resistance of the display substrate 10 can be effectively ensured, thereby further improving the service life of the display panel 100. The high-temperature resistant protective layer 63 can be a high-temperature polyester film, etc.

[0112] In the embodiments of the present disclosure, the adhesive layer 40 can be bonded only to the bonding area B1 after being bent in the bending area B2, or as Figure 2 or Figure 3 shown, after the bending area B2 is bent, the adhesive layer 40 extends out of the edge of the bonding area B1, so as to be bonded to the edge of the bonding area B1 and the bending area B2 at the same time.

[0113] As Figure 2 or Figure 3 shown, the adhesive layer 40 includes a first adhesive substrate 41 and first adhesive layers 42 located on two surfaces of the first adhesive substrate 41. The elastic modulus of the first adhesive substrate 41 is greater than or equal to 10 11 Pa.

[0114] After the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the support layer 30 and the bonding area B1 of the display substrate 10, and the orthographic projection of the first adhesive substrate 41 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA.

[0115] Thus, after the two first adhesive layers 42 of the adhesive layer 40 bond the support layer 30 and the bonding area B1 of the display substrate 10 respectively, the orthographic projection of the first bonded substrate 41 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA, so as to provide a relatively large elastic modulus in the area where the driving chip 20 is located through the first bonded substrate 41, thereby improving the impact resistance of the display panel 100 in the area where the driving chip 20 is located, and on the basis of improving the structural strength of the display panel 100, extending the service life of the display panel 100.

[0116] Among them, for the elastic modulus of the first bonded substrate 41, by way of example, it can be 1.0×10 11 Pa, 1.2×10 11 Pa, 1.5×10 11 Pa, 1.8×10 11 Pa, 2.0×10 11 Pa, 2.2×10 11 Pa, 2.5×10 11 Pa, etc. The first adhesive layer 42 can be transferred onto the surface of the first bonded substrate 41 (such as a stainless steel substrate) through a transfer process, or can be formed on the surface of the first bonded substrate 41 (such as a carbon fiber composite substrate) by a coating method, which can be specifically determined according to the specific material of the first bonded substrate 41.

[0117] It should be noted that in combination with the above-mentioned situation where the display panel 100 further includes a metal tape 50, at this time, as Figure 2 or Figure 3 shown, after the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the metal tape 50 and the bonding area B1 of the display substrate 10.

[0118] In some embodiments, the first bonded substrate 41 can be a metal substrate (such as a stainless steel substrate, etc.) or a fiber substrate (such as a carbon fiber composite substrate, a glass fiber composite substrate, an aramid fiber composite substrate, etc.). Of course, the first bonded substrate 41 can also be a substrate of other materials, as long as it has a relatively high elastic modulus to improve the impact resistance of the display panel 100 in the area where the driving chip 20 is located, and the embodiments of the present disclosure do not limit this.

[0119] By way of example, when the first bonded substrate 41 is a stainless steel substrate, the elastic modulus of the first bonded substrate 41 is 1.94×10 11 Pa; when the first bonded substrate 41 is a glass fiber composite board, the elastic modulus of the first bonded substrate 41 is 1.2×10 11 Pa; when the first bonded substrate 41 is a carbon fiber composite board, the elastic modulus of the first bonded substrate 41 is 2.3×10 11 Pa.

[0120] In some embodiments, both of the two first adhesive layers 42 on the surface of the first bonding substrate 41 are non-conductive adhesive layers, that is, insulating adhesive layers, so as to ensure the insulation performance between the bonding region B1 and the display region AA, and further avoid the influence of the bonding region B1 on the image display of the display region AA.

[0121] In some other embodiments, as Figure 3 shown, one of the two first adhesive layers 42 on the surface of the first bonding substrate 41 that is closer to the support layer 30 is a conductive adhesive layer 423, and the one that is farther from the support layer 30 is a non-conductive adhesive layer (i.e., insulating adhesive layer) 424. In this way, the unilateral impedance data of the display panel 100 can be directly measured through the adhesive layer 40, that is, the impedance data between the bonding region B1 and the support layer 30 after the display panel 100 is bent, so as to verify the unilateral impedance requirement of the display panel 100.

[0122] Of course, for the first adhesive layers 42 on the two surfaces of the first bonding substrate 41, it is also possible that one of the two first adhesive layers 42 that is closer to the support layer 30 is a non-conductive adhesive layer 424, and the one that is farther from the support layer 30 is a conductive adhesive layer 423, as long as the measurement of the unilateral impedance data of the display panel 100 can be achieved. The embodiments of the present disclosure do not limit this.

[0123] Combined with the above, the first bonding substrate 41 can be a metal substrate or a fiber substrate. That is to say, the first bonding substrate 41 can be a conductive structure or a non-conductive structure. When the first bonding substrate 41 is a conductive structure, the first bonding substrate 41 has certain conductive performance, so as to be able to normally test the unilateral impedance data of the display panel 100. When the first bonding substrate 41 is a non-conductive structure, in order to facilitate the test of the unilateral impedance data of the display panel 100, it can be as Figure 4 shown, the adhesive layer 40 further includes a conductive layer 45 located on the side of the first bonding substrate 41 closer to the support layer 30. In this way, through the setting of the conductive layer 45, the local conductive performance of the first bonding substrate 41 can be ensured, so as to ensure the test of the unilateral impedance data of the display panel 100.

[0124] Among them, the conductive layer 45 can be an electroplated metal layer, such as an electroplated nickel layer, etc. The conductive layer 45 can cover the entire unilateral surface of the first bonding substrate 41, or can cover the unilateral partial surface of the first bonding substrate 41, as long as it can ensure that the first bonding substrate 41 realizes local conduction under the setting of the conductive layer 45.

[0125] Preferably, the edge of the conductive layer 45 can be aligned with the edge of the first adhesive layer 42. In this way, the flatness of the first adhesive layer 42 can be ensured, thereby ensuring the bonding area between the first adhesive layer 42 and the support layer 30, and at the same time ensuring the local conductivity of the first bonded substrate 41.

[0126] Among them, the thickness of the conductive layer 45 is greater than or equal to 5 μm and less than or equal to 10 μm, so as to avoid the weak conductivity of the first bonded substrate 41 when the thickness of the conductive layer 45 is relatively thin, and to avoid the excessive thickness of the conductive layer 45 affecting the thickness of the first adhesive layer 42, thereby affecting the bonding effect between the bonding layer 40 and the support layer 30. Exemplarily, the thickness of the conductive layer 45 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc.

[0127] In some embodiments, for the first bonded substrate 41 and the first adhesive layer 42 included in the bonding layer 40, in combination with the situation where the first adhesive layer 42 is transferred to the surface of the first bonded substrate 41 as described above, it can be the first method: first cut the sizes of the first bonded substrate 41 and the first adhesive layer 42, and then transfer the first adhesive layer 42 to the surface of the first bonded substrate 41; it can also be the second method: first cut the size of the first bonded substrate 41, then transfer the first adhesive layer 42 to the surface of the first bonded substrate 41, and finally cut the size of the first adhesive layer 42; it can also be the third method: first transfer the first adhesive layer 42 to the surface of the first bonded substrate 41, and then cut the sizes of the first bonded substrate 41 and the first adhesive layer 42.

[0128] When manufacturing the bonding layer 40 according to the first method described above, optionally, the etching process can be used to ensure the outer shape size of the first bonded substrate 41, and at the same time the die-cutting process can be used to ensure the outer shape size of the first adhesive layer 42; and then as Figure 2 shown, the edge of the first bonded substrate 41 extends beyond the first adhesive layer 42. That is, the size of the first adhesive layer 42 is smaller than that of the first bonded substrate 41 to ensure the feasibility of transferring the first adhesive layer 42 to the surface of the first bonded substrate 41, and to avoid the edge of the first adhesive layer 42 extending beyond the first bonded substrate 41 due to process errors during transfer.

[0129] Among them, the size by which the edge of the first bonded substrate 41 extends beyond the first adhesive layer 42 is greater than or equal to 0.1 mm, so as to ensure the yield of transferring the first adhesive layer 42 to the surface of the first bonded substrate 41. Exemplarily, the size by which the edge of the first bonded substrate 41 extends beyond the first adhesive layer 42 is 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. Preferably, the size by which the edge of the first bonded substrate 41 extends beyond the first adhesive layer 42 is 0.15 mm.

[0130] Of course, the dimension that the edge of the first bonding substrate 41 extends beyond the first adhesive layer 42 may also be slightly less than 0.1 mm, as long as the yield rate of transferring the first adhesive layer 42 to the surface of the first bonding substrate 41 can be ensured.

[0131] Furthermore, the dimension that the edge of the first bonding substrate 41 extends beyond the first adhesive layer 42 is less than or equal to 0.2 mm. In this way, the dimension of the first adhesive layer 42 can be increased, thereby ensuring the bonding strength between the bonding layer 40 and the bonding area B1 of the support layer 30 and the display substrate 10.

[0132] Of course, the dimension that the edge of the first bonding substrate 41 extends beyond the first adhesive layer 42 may also be slightly greater than 0.2 mm, as long as the bonding stability between the bonding layer 40 and the bonding area B1 of the support layer 30 and the display substrate 10 can be ensured.

[0133] When manufacturing the bonding layer 40 according to the second or third method described above, since the last step includes cutting the first adhesive layer 42, it can be ensured that the edge of the first bonding substrate 41 is flush with the edge of the first adhesive layer 42 as shown in Figure 5 or Figure 6 . In this way, a larger dimension of the first adhesive layer 42 can be ensured to increase the bonding area of the bonding area B1 of the support layer 30 and the display substrate 10, thereby ensuring the bonding stability between the bonding layer 40 and the bonding area B1 of the support layer 30 and the display substrate 10.

[0134] Optionally, when manufacturing the bonding layer 40 according to the second method described above, the outer shape dimension of the first bonding substrate 41 can be ensured by an etching process, and the outer shape dimension of the first adhesive layer 42 can be ensured by a laser cutting process. Optionally, when manufacturing the bonding layer 40 according to the third method described above, the outer shape dimensions of both the first bonding substrate 41 and the first adhesive layer 42 can be ensured by a stamping process.

[0135] When cutting the first bonding substrate 41 and the first adhesive layer 42 by a stamping process, as shown in Figure 6 , a burr 413 that bends to one side will be formed at the edge of the first bonding substrate 41, that is, the edge of the first bonding substrate 41 has a burr 413 that bends to one side. At this time, the burr 413 at the edge of the first bonding substrate 41 can be set to face the support layer 30. In this way, when the bonding layer 40 is only bonded to the bonding area B1, the burr 413 on the first bonding substrate 41 can be prevented from abutting against the bonding area B1 of the display substrate 10, thereby avoiding the situation of damage to the bonding area B1 of the display substrate 10. As shown in Figure 6As shown, when the edge of the adhesive layer 40 extends into the bending area B2, that is, when the adhesive layer 40 is adhered to the edges of both the bonding area B1 and the bending part B2 simultaneously, it is possible to avoid the burr 413 on the first adhesive substrate 41 from coming into contact with the bending area B2 of the display substrate 10, thereby avoiding damage to the bending area B2 of the display substrate 10.

[0136] In the embodiments of the present disclosure, for the adhesive layer 40 included in the display panel 100, it can be an integrated whole-layer structure or a split structure arranged along the direction away from the bending area B2 in combination with the position of the driving chip 20. Next, the integrated structure and the split structure will be explained respectively.

[0137] For the case where the adhesive layer 40 is set as an integrated whole-layer structure:

[0138] In some embodiments, the thickness of the entire area on the first adhesive substrate 41 is consistent. This can simplify the processing technology of the first adhesive substrate 41, thereby improving the assembly efficiency of the display panel 100.

[0139] In some other embodiments, as Figure 7 shown, the first adhesive substrate 41 has a thickened area 411 and a thinned area 412. After the bending area B2 is bent, the orthographic projection of the thickened area 411 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA, and the thinned area 412 is located on the side of the thickened area 411 close to the bending area B2.

[0140] In this way, through the setting of the thinned area 412 on the first adhesive substrate 41, the thickness of the first adhesive layer 42 in the thinned area 412 can be increased, thereby increasing the bonding strength between the adhesive layer 40 and the bonding area B1 of the display substrate 10 and the support layer 30 at the position close to the bending area B2. Furthermore, the fixing strength of the display area AA and the bonding area B1 of the display substrate 10 can be improved, ensuring the bending effect of the bending area B2 of the display substrate 10, and reducing the situation where the support layer 30 and the bonding area B1 are partially detached from the adhesive layer 40 due to the radial tension borne by the bending area B2 and the influence of high-temperature and high-humidity environments. Therefore, the service life of the display panel 100 is extended.

[0141] Among them, the thickened area 411 and the thinned area 412 of the first bonding substrate 41 can be obtained through an etching process, and the transition between the thickened area 411 and the thinned area 412 can be a stepped transition or a sloped transition. For the case of a sloped transition, it can be achieved through an inclined plane or an inclined arc surface. The embodiments of the present disclosure do not limit this. For the case where the thickened area 411 and the thinned area 412 of the first bonding substrate 41 are in a stepped transition, for the first adhesive layer 42 on the surface of the first bonding substrate 41, the outer dimensions of the first sub-adhesive layer 421 located in the thickened area 411 and the outer dimensions of the second sub-adhesive layer 422 located in the thinned area 412 can be obtained through a die-cutting process, and then the first sub-adhesive layer 421 and the second sub-adhesive layer 422 are respectively transferred to the thickened area 411 and the thinned area 412 of the first bonding substrate 41.

[0142] Among them, as Figure 7 shown, the first adhesive layer 42 includes a first sub-adhesive layer 421 located in the thickened area 411 of the first bonding substrate 41 and a second sub-adhesive layer 422 located in the thinned area 412 of the first bonding substrate 41; the edge of the thickened area 411 of the first bonding substrate 41 extends beyond the edge of the first sub-adhesive layer 421, and the edge of the first bonding substrate 41 in the thinned area 412 extends beyond the edge of the second sub-adhesive layer 422 to ensure the transfer yield when the first sub-adhesive layer 421 is transferred to the thickened area 411 of the first bonding substrate 41 and the second sub-adhesive layer 422 is transferred to the thinned area 412 of the first bonding substrate 41.

[0143] It should be noted that the dimension by which the edge of the thickened area 411 of the first bonding substrate 41 extends beyond the edge of the first sub-adhesive layer 421 and the dimension by which the edge of the thinned area 412 of the first bonding substrate 41 extends beyond the edge of the second sub-adhesive layer 422 can refer to the dimension by which the edge of the first bonding substrate 41 extends beyond the edge of the first adhesive layer 42 described in the above embodiments, and the embodiments of the present disclosure will not elaborate on this. By way of example, both the dimension by which the edge of the thickened area 411 of the first bonding substrate 41 extends beyond the edge of the first sub-adhesive layer 421 and the dimension by which the edge of the thinned area 412 of the first bonding substrate 41 extends beyond the edge of the second sub-adhesive layer 422 are 0.15 millimeters.

[0144] Optionally, the thickness of the first bonding substrate 41 in the thickened area 411 is greater than or equal to 0.08 mm. In this way, by defining the minimum thickness of the first bonding substrate 41 in the thickened area 411, the support strength of the thickened area 411 for the area where the driving chip 20 is located is ensured, effectively ensuring the impact resistance of the display panel 100 in the area where the driving chip 20 is located and reducing the possibility of damage to the driving chip 20. For example, the thickness of the first bonding substrate 41 in the thickened area 411 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0145] Furthermore, it can be set that the thickness of the first bonding substrate 41 in the thickened area 411 is less than or equal to 0.12 mm. In this way, by defining the maximum thickness of the first bonding substrate 41 in the thickened area 411, the situation where the first sub-bonding agent layer 421 on the surface of the thickened area 411 is too thin is avoided, thereby ensuring the bonding stability of the first sub-bonding agent layer 421 to the bonding area B1 of the support layer 30 and the display substrate 10.

[0146] It should be noted that the specific thickness of the first bonding substrate 41 in the thickened area 411 can also be set with reference to the distance between the support layer 30 and the bonding area B1 after the display substrate 10 is bent, so as to ensure that the thickened area 411 of the first bonding substrate 41 has sufficient support strength for the area where the driving chip 20 is located, and the two first sub-bonding agent layers 421 of the thickened area 411 have sufficient bonding strength with the support layer 30 and the bonding area B1 respectively. In this case, the thickness of the first bonding substrate 41 in the thickened area 411 can be set slightly less than 0.08 mm or slightly greater than 0.12 mm. For example, the thickness of the first bonding substrate 41 in the thickened area 411 is 0.07 mm, 0.13 mm, etc.

[0147] Optionally, the thickness of the first bonding substrate 41 in the thinned area 412 is less than or equal to 0.06 mm. In this way, by defining the maximum thickness of the first bonding substrate 41 in the thinned area 412, the minimum thickness of the second sub-bonding agent layer 422 on the surface of the thinned area 412 is ensured, thereby ensuring the bonding stability of the second sub-bonding agent layer 422 to the position of the support layer 30 near the bending area B2 of the display substrate 10 and the position of the bonding area B1 of the display substrate 10 near the bending area B2, and thus ensuring the stability of the arc formed after the bending area B2 of the display substrate 10 is bent. For example, the thickness of the first bonding substrate 41 in the thinned area 412 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0148] It should be noted that the specific thickness of the first bonding substrate 41 in the thinning area 412 can also be set with reference to the distance between the support layer 30 and the bonding area B1 after the display substrate 10 is bent, so as to ensure that the two second sub-bonding layers 422 of the first bonding substrate 41 in the thinning area 412 have sufficient bonding strength with the support layer 30 and the bonding area B1 respectively, and the thickness of the first bonding substrate 41 in the thinning area 412 is set to be slightly greater than 0.06 mm. For example, the thickness of the first bonding substrate 41 after thinning is 0.07 mm.

[0149] For the case where the first bonding substrate 41 has a thickening area 411 and a thinning area 412, the distribution of the thickening area 411 and the thinning area 412 on the first bonding substrate 41 can be specifically determined with reference to the size and shape of the bonding area B1 of the display substrate 10.

[0150] Optionally, as Figure 8 shown, there is no overlapping area between the thinning area 412 and the thickening area 411 in the direction of the rotation axis O of the bending area B2. For example, when the bonding area B1 of the display substrate 10 is large and the outer contour is a square structure, the first bonding substrate 41 can be set as a square structure, and a part of the first bonding substrate 41 close to the bending area B2 is set as the thinning area 412, and a part away from the bending area B2 is set as the thickening area 411.

[0151] Optionally, as Figure 9 shown, the thinning area 412 has a U-shaped structure with an opening facing away from the bending area B2, and at least part of the thickening area 411 is located in the U-shaped groove surrounded by the thinning area 412. For example, when the bonding area B1 of the display substrate 10 is small and the outer contour is a special-shaped structure, the first bonding substrate 41 can be set as a square structure, and a part of the first bonding substrate 41 close to the bending area B2 and the parts on both sides in the axial direction of the bending area B2 are set as the U-shaped thinning area 412, and the remaining part is set as the thickening area 411 located in the U-shaped groove of the thinning area 412.

[0152] Optionally, as Figure 10 shown, the thinning area 412 has an annular structure, and the thickening area 411 is located in the area surrounded by the thinning area 412. For example, when the bonding area B1 of the display substrate 10 is large and the outer contour has no specific structure limitation, the first bonding substrate 41 can be set as a square structure, and the outer ring part of the first bonding substrate 41 is set as the annular thinning area 412, and the part in the area surrounded by the thinning area 412 is set as the thickening area 411.

[0153] It should be noted that for the above three implementation manners, such as Figure 8 、 Figure 9 or Figure 10As shown, the width L1 of the thinning area 412 on the side of the first bonding substrate 41 close to the bending area B2 is greater than or equal to 2 mm and less than or equal to 5 mm. Exemplarily, the width L1 of the thinning area 412 on the side of the first bonding substrate 41 close to the bending area B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the thickening area 411 of the first bonding substrate 41 provides better support for the area where the driving chip 20 is located, the stability of the bonding between the second sub-bonding agent layer 422 on the surface of the thinning area 412 of the first bonding substrate 41 and the support layer 30 and the bonding area B1 can be ensured, thereby ensuring the stability of the arc formed after bending the bending area B2 of the display substrate 10.

[0154] It should be noted that for the latter two implementation manners above, as Figure 9 or Figure 10 shown, the dimension L2 of the thinning area 412 on the side of the first bonding substrate 41 in the direction of the rotation axis O of the bending area B2 is greater than or equal to 6 mm and less than or equal to 12 mm. Exemplarily, the dimension L2 of the thinning area 412 on the side of the first bonding substrate 41 in the direction of the rotation axis O of the bending area B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. In this way, the distribution range of the thinning area 412 on the first bonding substrate 41 can be further increased, and then the bonding area of the second sub-bonding agent layer 422 can be increased, so as to ensure that the thickening area 411 of the first bonding substrate 41 provides better support for the area where the driving chip 20 is located, while ensuring the stability of the bonding between the second sub-bonding agent layer 422 on the surface of the thinning area 412 of the first bonding substrate 41 and the support layer 30 and the bonding area B1, thereby ensuring the stability of the arc formed after bending the bending area B2 of the display substrate 10.

[0155] For the case where the bonding layer 40 is set as a split structure:

[0156] In some implementation manners, as Figure 11 shown, the bonding layer 40 further includes a second bonding agent layer 44. The second bonding agent layer 44 is located on the side of the first bonding substrate 41 close to the bending area B2. After the bending area B2 is bent, the second bonding agent layer is bonded to the support layer 30 and the bonding area B1 of the display substrate 10 respectively. In this way, for the position of the support layer 30 close to the bending area B2 and the position in the bonding area B1 of the display substrate 10 close to the bending area B2, they are directly bonded through the integral second bonding agent layer 44, thereby effectively ensuring the bonding stability, reducing the situation that the support layer 30 and the bonding area B1 are partially peeled off from the bonding layer 40 due to the radial tension borne by the bending area B2 and the influence of the high-temperature and high-humidity environment, and further extending the service life of the display panel 100.

[0157] In other implementation manners, as Figure 3 , Figure 4 or Figure 12As shown, the adhesive layer 40 further includes a second adhesive substrate 43 and second adhesive layers 44 located on two surfaces of the second adhesive substrate 43; the thickness of the second adhesive substrate 43 is less than that of the first adhesive substrate 41, and the second adhesive substrate 43 is located on the side of the first adhesive substrate 41 close to the bending area B2. After the bending area B2 is bent, the two second adhesive layers are respectively adhered to the support layer 30 and the bonding area B1 of the display substrate 10.

[0158] In this way, it can be ensured that the thickness of the second adhesive layer 44 is greater than that of the first adhesive layer 42, so as to further ensure the bonding stability of the position of the support layer 30 close to the bending area B2 and the position of the bonding area B1 of the display substrate 10 close to the bending area B2 with the adhesive layer 40, thereby ensuring the bending effect of the bending area B2 of the display substrate 10, reducing the situation that the support layer 30 and the bonding area B1 are partially detached from the adhesive layer 40 due to the influence of radial tension and high-temperature and high-humidity environment in the bending area B2, and further extending the service life of the display panel 100.

[0159] Wherein, the first adhesive substrate 41 and the second adhesive substrate 43 are arranged at intervals, and the distance between the first adhesive substrate 41 and the second adhesive substrate 43 is greater than or equal to 0.2 mm to avoid interference between the first adhesive substrate 41 and the second adhesive substrate 43. Exemplarily, the distance between the first adhesive substrate 41 and the second adhesive substrate 43 is 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm. Of course, the distance between the first adhesive substrate 41 and the second adhesive substrate 43 can also be slightly less than 0.2 mm, such as 0.18 mm, as long as interference between the first adhesive substrate 41 and the second adhesive substrate 43 can be avoided.

[0160] Wherein, the second adhesive layer 44 can be formed on the surface of the second adhesive substrate 43 by coating to improve the fastening of the second adhesive layer 44 to the second adhesive substrate 43. Since the second adhesive layer 44 is formed on the surface of the second adhesive substrate 43 by coating, as Figure 12 shown, the edges of the second adhesive substrate 43 and the second adhesive layer 44 can be made flush to ensure that the second adhesive layer 44 has a larger bonding area. The second adhesive substrate 43 can be made of a material with a relatively small elastic modulus, such as a high-temperature-resistant polyester film, etc.

[0161] Optionally, the thickness of the first adhesive substrate 41 is greater than or equal to 0.08 mm. In this way, by defining the minimum thickness of the first adhesive substrate 41, the support strength of the area where the driving chip 20 is located is ensured, effectively guaranteeing the impact resistance of the display panel 100 in the area where the driving chip 20 is located and reducing the possibility of damage to the driving chip 20. For example, the thickness of the first adhesive substrate 41 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0162] Furthermore, the thickness of the first adhesive substrate 41 can be set to be less than or equal to 0.12 mm. In this way, by defining the maximum thickness of the first adhesive substrate 41, the situation where the first adhesive layer 42 on the first adhesive substrate 41 is too thin is avoided, thereby ensuring the bonding stability of the first adhesive layer 42 to the bonding area B1 of the support layer 30 and the display substrate 10.

[0163] It should be noted that the specific thickness of the first adhesive substrate 41 can also be set with reference to the distance between the support layer 30 and the bonding area B1 after the display substrate 10 is bent. To ensure that the first adhesive substrate 41 has sufficient support strength for the area where the driving chip 20 is located, and that the two first adhesive layers 42 respectively have sufficient bonding strength with the support layer 30 and the bonding area B1, the thickness of the first adhesive substrate 41 can be set to be slightly less than 0.08 mm, or slightly greater than 0.12 mm. For example, the thickness of the first adhesive substrate 41 is 0.07 mm, 0.13 mm, etc.

[0164] Optionally, the thickness of the second adhesive substrate 43 is less than or equal to 0.06 mm. In this way, by defining the maximum thickness of the second adhesive substrate 43, the minimum thickness of the second adhesive layer 44 on the second adhesive substrate 43 is ensured, thereby ensuring the bonding stability of the second adhesive layer 44 to the position of the support layer 30 near the bending area B2 of the display substrate 10 and the position of the bonding area B1 of the display substrate 10 near the bending area B2, and thus ensuring the stability of the arc formed after the bending area B2 of the display substrate 10 is bent. For example, the thickness of the second adhesive substrate 43 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0165] It should be noted that the specific thickness of the second adhesive substrate 43 can also be set with reference to the distance between the support layer 30 and the bonding area B1 after the display substrate 10 is bent. To ensure that the two second adhesive layers 44 on the surface of the second adhesive substrate 43 respectively have sufficient bonding strength with the support layer 30 and the bonding area B1, the thickness of the second adhesive substrate 43 can be set to be slightly greater than 0.06 mm. For example, the thickness of the second adhesive substrate 43 is 0.07 mm.

[0166] For the case where the adhesive layer 40 includes a first adhesive substrate 41 and a second adhesive substrate 43, the distribution of the first adhesive substrate 41 and the second adhesive substrate 43 can be determined specifically with reference to the size and shape of the bonding area B1 of the display substrate 10.

[0167] Optionally, as Figure 13 shown, there is no overlapping area between the first adhesive substrate 41 and the second adhesive substrate 43 in the direction of the rotation axis O of the bending area B2. Exemplarily, when the bonding area B1 of the display substrate 10 is relatively large and the outer contour is a square structure, the first adhesive substrate 41 and the second adhesive substrate 43 can both be set as square structures, and the second adhesive substrate 43 is located on the side close to the bending area B2, and the first adhesive substrate 41 is located on the side far from the bending area B2.

[0168] Optionally, as Figure 14 shown, the second adhesive substrate 43 has a U-shaped structure with an opening facing away from the bending area B2, and the first adhesive substrate 41 is located in the U-shaped groove surrounded by the second adhesive substrate 43. Exemplarily, when the bonding area B1 of the display substrate 10 is relatively small and the outer contour is an irregular structure, the second adhesive substrate 43 can be set as a U-shaped structure, and the opening of the second adhesive substrate 43 faces away from the bending area B2, and the first adhesive substrate 41 is set as a square structure and is located in the U-shaped groove of the second adhesive substrate 43.

[0169] Optionally, as Figure 15 shown, the second adhesive substrate 43 has an annular structure, and at least part of the first adhesive substrate 41 is located in the area surrounded by the second adhesive substrate 43. Exemplarily, when the bonding area B1 of the display substrate 10 is relatively large and the outer contour is not limited to a specific structure, the second adhesive substrate 43 can be set as an annular structure, the first adhesive substrate 41 is a square structure, and is located in the area surrounded by the second adhesive substrate 43.

[0170] It should be noted that for the above three embodiments, as Figure 13 , Figure 14 or Figure 15 shown, the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 close to the bending area B2 is greater than or equal to 2 mm and less than or equal to 5 mm. Exemplarily, the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 close to the bending area B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the first adhesive substrate 41 provides better support for the area where the driving chip 20 is located, it can ensure the stability of the bonding of the second adhesive layer 44 on the surface of the second adhesive substrate 43 to the support layer 30 and the bonding area B1, thereby ensuring the stability of the arc formed after the bending area B2 of the display substrate 10 is bent.

[0171] It should be noted that for the latter two embodiments, as Figure 14 or Figure 15As shown, the dimension L4 of the second bonding substrate 43 on the side of the first bonding substrate 41 in the direction of the rotation axis O of the bending region B2 is greater than or equal to 6 mm and less than or equal to 12 mm. By way of example, the dimension L4 of the second bonding substrate 43 on the side of the first bonding substrate 41 in the direction of the rotation axis O of the bending region B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. In this way, the distribution range of the second bonding substrate 43 can be further increased, and then the bonding area of the second adhesive layer 44 can be increased, so as to ensure that the first bonding substrate 41 forms better support for the region where the driving chip 20 is located, while ensuring the bonding stability of the second adhesive layer 44 on the surface of the second bonding substrate 43 to the support layer 30 and the bonding region B1, thereby ensuring the bending stability of the bending region B2 of the display substrate 10 into an arc.

[0172] The embodiment of the present disclosure also provides a manufacturing method of a display panel, which is used to manufacture the display panel described in the above embodiment. As Figure 16 shown, the method includes the following steps: S110 to S150.

[0173] Step S110: Provide a display substrate. The display panel has a display area and a non-display area located outside the display area. The non-display area includes a bonding region and a bending region, and the bending region connects the display area and the bonding region.

[0174] Step S120: Bond a driving chip on one side close to the light-emitting surface of the display substrate. The orthographic projection of the driving chip on the display substrate is located in the bonding region.

[0175] Step S130: Provide a support layer on the side facing away from the light-emitting surface of the display substrate. The orthographic projection of the support layer on the display substrate at least coincides with the display area.

[0176] Step S140: Provide an adhesive layer, which includes a first bonding substrate and first adhesive layers on two surfaces of the first bonding substrate. The elastic modulus of the first bonding substrate is greater than or equal to 10 11 Pa.

[0177] Step S150: Provide an adhesive layer on the side of the support layer facing away from the display substrate, and bend the bending region of the display substrate so that the bonding region is located on the side away from the light-emitting surface of the display substrate, and the driving chip is located on the side of the bonding region away from the display area. At the same time, bond the two first adhesive layers on the surface of the first bonding substrate to the support layer and the bonding region of the display substrate respectively. The orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

[0178] In the embodiments of the present disclosure, for the display panel manufactured through the above steps S110 to S150, it can be ensured that the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area, so as to provide a relatively large elastic modulus in the area where the driving chip is located through the first bonding substrate, thereby improving the impact resistance of the display panel in the area where the driving chip is located, and on the basis of improving the structural strength of the display panel, extending the service life of the display panel.

[0179] In the above step S110, the manufacturing method of the display substrate can refer to the related art, as long as it is ensured that the display substrate has a display area and a non-display area, the display area has pixels for displaying images, and the non-display area has a bonding area and a bending area. Further, it can also be as described in the above embodiments, where the display area has a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

[0180] In the above step S120, the driving chip may include driving elements for driving the display area to display images, such as data driving circuits, etc. The driving chip can be fixed through the adhesive on both sides to improve the stability of the driving chip fixation and reduce the situation of damage to the driving chip when an external force acts on the area where the driving chip is located on the display substrate.

[0181] In the above step S130, the specific structure of the support layer can refer to that described in the above embodiments, and the embodiments of the present disclosure will not elaborate on this. For the manufacturing process of the support layer on the light-emitting surface side away from the display substrate, it can refer to the related art.

[0182] In the above step S140, the manufacturing method of the bonding layer can refer to that described in the above embodiments, and step S140 can be formed before any one of steps S110, S120, and S130.

[0183] Optionally, the manufacturing method of the bonding layer includes: providing a substrate substrate and performing etching to obtain a first bonding substrate; providing an adhesive substrate and performing die-cutting to obtain a first adhesive layer, and the size of the first adhesive layer is smaller than that of the first bonding substrate; bonding the first adhesive layer on both side surfaces of the first bonding substrate through a transfer process, and the edge of the first bonding substrate extends out of the first adhesive layer.

[0184] Optionally, the manufacturing method of the bonding layer includes: providing a substrate substrate and an adhesive substrate; bonding the adhesive substrate on both side surfaces of the substrate substrate; simultaneously cutting the adhesive substrate and the first substrate substrate through laser cutting or stamping cutting to obtain a bonding layer including the first bonding substrate and the first adhesive layer, and the edge of the first bonding substrate is aligned with the edge of the first adhesive layer.

[0185] In the above step S150, for the bent display substrate, when bonding the support layer and the bonding area of the display substrate through the bonding layer, it is only necessary to ensure that the orthographic projection of the first bonding substrate in the display area covers at least the orthographic projection of the driving chip in the display area.

[0186] It should be noted that although the steps of the manufacturing method of the display panel in the present disclosure are described in a specific order in the drawings, however, this does not require or imply that these steps must be executed in this specific order, or that all the steps shown must be executed to achieve the desired result. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc.

[0187] The embodiment of the present disclosure further provides a display device, and the display device includes the display panel described in the above embodiment. Combining with the display panel described in the above embodiment, for the display device including the display panel, the structural strength of the display device can be ensured, and at the same time, the service life of the display device can be improved.

[0188] Those skilled in the art will readily think of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and examples are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.

Claims

1. A display panel, characterized in that, Comprising: A display substrate having a display area and a non-display area located on the periphery of the display area. The non-display area includes a bonding area and a bending area, and the bending area connects the display area and the bonding area; A driving chip, the orthographic projection of which on the display substrate is located in the bonding area; A support layer located on one side of the light-emitting surface facing away from the display substrate, and the orthographic projection of which on the display substrate at least coincides with the display area; The adhesive layer is located on the side of the support layer facing away from the display substrate and includes a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate. The elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa; After the bending area is bent, the bonding area is located on the side of the light-emitting surface facing away from the display substrate, and the driving chip is located on the side of the bonding area facing away from the display area. Two first adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate, and the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

2. The display panel according to claim 1, wherein The adhesive layer further includes a second bonding substrate and second adhesive layers located on two surfaces of the second bonding substrate; The thickness of the second bonding substrate is less than that of the first bonding substrate, and the second bonding substrate is located on the side of the first bonding substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate.

3. The display panel according to claim 2, characterized in that, There is no overlapping area between the first bonding substrate and the second bonding substrate in the rotation axis direction of the bending area.

4. The display panel according to claim 2, characterized in that, The second bonding substrate has a U-shaped structure with an opening facing away from the bending area, and the first bonding substrate is located in the U-shaped groove surrounded by the second bonding substrate.

5. The display panel according to claim 2, characterized in that, The second bonding substrate has an annular structure, and at least part of the first bonding substrate is located in the area surrounded by the second bonding substrate.

6. The display panel according to any one of claims 3 to 5, characterized in that, The width of the second bonding substrate on the side of the first bonding substrate close to the bending area is greater than or equal to 2 mm and less than or equal to 5 mm.

7. The display panel according to claim 4 or 5, characterized in that, The dimension of the second bonding substrate on one side of the first bonding substrate in the rotation axis direction of the bending area is greater than or equal to 6 mm and less than or equal to 12 mm.

8. The display panel according to claim 1, wherein The adhesive layer further includes a second adhesive layer located on the side of the first bonding substrate close to the bending area. After the bending area is bent, the second adhesive layer is respectively bonded to the support layer and the bonding area of the display substrate.

9. The display panel according to claim 1, wherein, The adhesive layer is an integrated whole layer structure.

10. The display panel according to claim 9, characterized in that, The first bonding substrate has a thickened area and a thinned area; After the bending area is bent, the orthographic projection of the thickened area in the display area at least covers the orthographic projection of the driving chip in the display area, and the thinned area is located on the side of the thickened area close to the bending area.

11. The display panel according to claim 10, wherein, There is no overlapping area between the thinned area and the thickened area in the rotation axis direction of the bending area.

12. The display panel according to claim 10, characterized in that, The thinned area has a U-shaped structure with an opening facing away from the bending area, and at least part of the thickened area is located in the U-shaped groove surrounded by the thinned area.

13. The display panel according to claim 10, wherein The thinned area has an annular structure, and the thickened area is located in the area surrounded by the thinned area.

14. The display panel according to any one of claims 10-13, characterized in that The thickness of the first bonding substrate in the thickened area is greater than or equal to 0.08 mm.

15. The display panel according to any one of claims 10-13, characterized in that, The thickness of the first bonding substrate in the thinned area is less than or equal to 0.06 mm.

16. The display panel according to claim 1, wherein The edge of the first bonding substrate extends out of the first adhesive layer.

17. The display panel according to claim 16, characterized in that, The extending dimension of the edge of the first bonding substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

18. The display panel according to claim 1, characterized in that, The edge of the first bonding substrate is aligned with the edge of the first adhesive layer.

19. The display panel according to claim 18, wherein, The edge of the first bonding substrate has a burr bent to one side, and the burr faces the support layer.

20. The display panel according to claim 1, wherein The first bonding substrate is a metal substrate or a fiber substrate.

21. The display panel according to claim 1, wherein Among the two first adhesive layers, the one closer to the support layer is a conductive adhesive layer, and the one farther from the support layer is a non-conductive adhesive layer.

22. The display panel according to claim 21, wherein The first bonding substrate is a non-conductive structure, and the bonding layer further includes a conductive layer located on the side of the first bonding substrate closer to the support layer.

23. The display panel according to claim 22, wherein The thickness of the conductive layer is greater than or equal to 5 μm and less than or equal to 10 μm.

24. The display panel according to claim 1, wherein, The support layer includes a bend-resistant layer and a support substrate; The bend-resistant layer is located between the display substrate and the support substrate, and both surfaces of the bend-resistant layer have a third adhesive layer, and the two third adhesive layers are respectively bonded to the display area of the display substrate and the support substrate.

25. The display panel according to claim 1, characterized in that, The display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

26. A manufacturing method of a display panel, characterized in that, The method includes: Providing a display substrate, the display panel having a display area and a non-display area located outside the display area, the non-display area including a bonding area and a bending area, and the bending area connecting the display area and the bonding area; Bonding a driving chip on one side close to the light-emitting surface of the display substrate, and the orthographic projection of the driving chip on the display substrate is located in the bonding area; Providing a support layer on one side facing away from the light-emitting surface of the display substrate, and the orthographic projection of the support layer on the display substrate at least coincides with the display area; Provide an adhesive layer, the adhesive layer includes a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate, and the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa; Providing the bonding layer on the side of the support layer facing away from the display substrate, and bending the bending area of the display substrate so that the bonding area is located on the side facing away from the light-emitting surface of the display substrate, and the driving chip is located on the side of the bonding area facing away from the display area, and simultaneously bonding the two first adhesive layers on the surface of the first bonding substrate to the support layer and the bonding area of the display substrate respectively, and the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

27. The method according to claim 26, wherein The manufacturing method of the bonding layer includes: Providing a base substrate and performing etching to obtain the first bonding substrate; Providing an adhesive substrate and performing die-cutting to obtain the first adhesive layer, and the size of the first adhesive layer is smaller than the size of the first bonding substrate; Bonding the first adhesive layer on both side surfaces of the first bonding substrate through a transfer process, and the edge of the first bonding substrate extends out of the first adhesive layer.

28. The method according to claim 26, wherein The manufacturing method of the bonding layer includes: Providing a base substrate and an adhesive substrate; Bonding the adhesive substrate on both side surfaces of the base substrate; Cut the adhesive substrate and the substrate board simultaneously by means of laser cutting or stamping cutting to obtain an adhesive layer including the first adhesive substrate and the first adhesive layer, with the edge of the first adhesive substrate aligned with the edge of the first adhesive layer.

29. A display device, characterized in that, A display panel according to any one of claims 1-25.

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