Display device
By providing the first conductive layer and the second conductive layer in the bending area of the display panel, and protruding toward the bending area at one end of the member on the panel, the dead zone and static current inlet of the bending area are solved, and the display effect and reliability of the display device are improved.
Patent Information
- Application Number
- CN202411964243.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-19
- Filing Date
- 2024-12-30
- Publication Date
- 2025-07-22
AI Technical Summary
The existing display devices have problems of dead zones and static current in the bending zone, which affects the display effect and reliability.
A display panel structure is designed in which a first conductive layer and a second conductive layer are provided in the bending region, and one end of the member on the panel protrudes towards the bending region, reducing or minimizing dead zones, and connecting the two conductive layers through an insulating layer and a contact hole to reduce static current inlet.
The dead zone is minimized in the bending zone and the static current inlet are reduced, and the display effect and reliability of the display device are improved.
Smart Images

Figure CN120356399A_ABST
Abstract
Description
[0001] Cross - reference to related applications
[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2024 - 0008587, filed with the Korean Intellectual Property Office on January 19, 2024, the entire disclosure of which is incorporated herein by reference. Technical field
[0003] Aspects of embodiments of the present disclosure relate to a display device. Background art
[0004] With the progress of the information age, the demand for display devices for displaying images has increased in various forms. The display device may be a liquid crystal display device, a field emission display device, or a light - emitting display device. The light - emitting display device may include an organic light - emitting display device including an organic light - emitting diode element as a light - emitting element, or an inorganic light - emitting display device including an inorganic light - emitting diode element as a light - emitting element.
[0005] The display device includes a display area for displaying an image and an outer periphery of the display area, for example, a non - display area provided to surround the display area (e.g., around the outer periphery of the display area). The width of the non - display area may gradually decrease to increase the immersion of the display area and the aesthetic sense of the display device.
[0006] In order to increase the portability of the display device and at the same time provide a wider display screen, bendable display devices in which the display area can be bent or foldable display devices in which the display area can be folded have been developed.
[0007] The above information disclosed in this background art section is for enhancing the understanding of the background of the present disclosure. Therefore, it may include information that does not constitute the prior art. Summary of the invention
[0008] One or more embodiments of the present disclosure may relate to a display device having a reduced or minimized dead zone.
[0009] One or more embodiments of the present disclosure may relate to a display device that minimizes or reduces the inflow of static electricity from the outside.
[0010] However, the aspects and features of the present disclosure are not limited to those above, and those skilled in the art will clearly understand the above and other aspects and features through the following description of some embodiments of the present disclosure.
[0011] According to one or more embodiments of the present disclosure, a display device includes: a display panel including a display area and a bending area on one side of the display area; and an on-panel member on the display panel. The display panel further includes: a substrate; a first conductive layer on the substrate in the bending area; and a second conductive layer on the first conductive layer on one side of the bending area. One end of the on-panel member facing the bending area protrudes toward the bending area more than one end of the second conductive layer facing the bending area.
[0012] In one embodiment, the upper surface of the display panel may be an exposed surface in the bending area.
[0013] In one embodiment, the display panel may not include a bending passivation layer on the upper surface of the display panel in the bending area.
[0014] In one embodiment, the distance by which one end of the on-panel member protrudes toward the bending area from one end of the second conductive layer may be 10 μm or more.
[0015] In one embodiment, the display panel may further include a light-emitting element layer on the substrate; the first conductive layer may be on one surface of the light-emitting element layer; and the second conductive layer may be on the other surface of the light-emitting element layer.
[0016] In one embodiment, the display panel may further include: an insulating layer between the first conductive layer and the second conductive layer; and a contact hole passing through the insulating layer and connecting the first conductive layer and the second conductive layer.
[0017] In one embodiment, the on-panel member may include any one of a protection member, an optical member, and an adhesive member.
[0018] In one embodiment, the on-panel member may further include an adhesive layer.
[0019] In one embodiment, the on-panel member may cover the display area and the bending area, and the adhesive force of the adhesive layer of the on-panel member at the portion covering the bending area may be less than the adhesive force of the adhesive layer of the on-panel member at the portion covering the display area.
[0020] In one embodiment, the display device may further include a touch driver located at one end of the display panel. The display panel may further include a first line on the second conductive layer and a second line on the first conductive layer. The first line and the second line may be electrically connected to the touch driver.
[0021] In one embodiment, one end of the on-panel member may protrude toward the bending area more than one end of the first line.
[0022] In one embodiment, the distance by which one end of the on-panel member protrudes toward the bending area from one end of the first line may be 10 μm or more.
[0023] In one embodiment, the display panel may further include a touch electrode on the second conductive layer; and the touch electrode may be electrically connected to the touch driver through a first line and a second line.
[0024] In one embodiment, the first line may be connected to the touch electrode; the second line may be connected to the touch driver; and the first line and the second line may be connected to each other through a contact hole penetrating the insulating layer between the first conductive layer and the second conductive layer.
[0025] In one embodiment, the display device may further include a display driver located at one end of the display panel. The display panel may further include a third line on the first conductive layer; and the third line may be electrically connected to the display driver.
[0026] In one embodiment, the display panel may further include: an upper insulating film on the third line; and a protection pattern covering the upper insulating film on the second conductive layer.
[0027] In one embodiment, one end of the on-panel member may protrude toward the bending region more than one end of the protection pattern.
[0028] In one embodiment, the distance by which one end of the on-panel member protrudes from one end of the protection pattern toward the bending region may be 10 μm or greater.
[0029] In one embodiment, the display panel may further include a light-emitting element and a data line configured to provide a data voltage to the light-emitting element; and the third line may be connected to the data line.
[0030] In one embodiment, the display panel may further include: a folding region overlapping the display region; and a first non-folding region and a second non-folding region located on opposite sides of the folding region, respectively.
[0031] In one embodiment, the maximum dynamic shock cancellation angle of the display panel in the bending region may be 3° or greater.
[0032] According to one or more embodiments of the present disclosure, a display device includes: a display panel including: a first portion including light-emitting elements; a second portion that is bent and is on one side of the first portion; and a third portion on one side of the second portion; a panel upper member on the first portion; and a display driver and a touch driver on the third portion. An upper surface of the second portion is an exposed surface, and the display panel further includes: a substrate; a first line on a first conductive layer located on the substrate and connected to the display driver; and a second line on a second conductive layer located on the first conductive layer and connected to the touch driver. The second line includes a first sub-line on the second conductive layer and a second sub-line on the first conductive layer. The first line and the second sub-line are located in the second portion, and the first sub-line is located in the first portion or the third portion. An end of the panel upper member facing the second portion protrudes toward the second portion more than an end of the first sub-line facing the second portion.
[0033] In one embodiment, a distance by which an end of the panel upper member protrudes toward the second portion from an end of the first sub-line may be 10 μm or more.
[0034] In one embodiment, the display panel may further include: an upper insulating film on the first line; and a protection pattern covering the upper insulating film on the second conductive layer.
[0035] In one embodiment, an end of the panel upper member may protrude toward the second portion more than an end of the protection pattern.
[0036] In one embodiment, a distance by which an end of the panel upper member protrudes toward the second portion from an end of the protection pattern may be 10 μm or more.
[0037] In one embodiment, the panel upper member may cover the first portion to the third portion.
[0038] In one embodiment, the display device may further include a cover tape covering the display driver, and an end of the cover tape may protrude toward the second portion more than an end of the first sub-line.
[0039] In one embodiment, the cover tape may cover the first portion to the third portion.
[0040] According to some embodiments of the present disclosure, a display device having a minimized or reduced dead zone may be provided.
[0041] According to some embodiments of the present disclosure, a display device capable of minimizing or reducing static current inflow may be provided.
[0042] However, the present disclosure is not limited to the above aspects and features, and additional aspects and features will be partly stated in the following detailed description with reference to the accompanying drawings, and partly will be apparent therefrom, or may be learned by practicing one or more of the presented embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] The above and other aspects and features of the present disclosure will be more clearly understood from the following detailed description of exemplary, non-limiting embodiments with reference to the accompanying drawings, in which:
[0044] Figure 1 is a plan view illustrating a display device according to an embodiment;
[0045] Figure 2 is for illustrating Figure 1 a schematic cross-sectional view of the display device taken along line X1-X1';
[0046] Figure 3 is for illustrating Figure 2 a cross-sectional view of the display device in a bent state;
[0047] Figure 4 is a plan view illustrating lines and pads of a display device according to an embodiment;
[0048] Figure 5 is for illustrating Figure 1 a schematic cross-sectional view of the display device taken along line X2-X2';
[0049] Figure 6A is a cross-sectional view illustrating a display panel according to an embodiment;
[0050] Figure 6B is a cross-sectional view illustrating a display panel according to another embodiment;
[0051] Figure 7 is for illustrating Figure 4 an enlarged plan view of region A;
[0052] Figure 8 is for illustrating Figure 7 a cross-sectional view of the display panel taken along line X3-X3';
[0053] Figure 9 is for illustrating Figure 7 a cross-sectional view of the display panel taken along line X4-X4';
[0054] Figure 10 is a cross-sectional view illustrating a display device according to an embodiment;
[0055] Figure 11 is a schematic cross-sectional view illustrating a dynamic impact test of a display device according to an embodiment;
[0056] Figure 12 is a cross-sectional view illustrating a display device according to a comparative example;
[0057] Figure 13A cross-sectional view illustrating a display device according to an embodiment;
[0058] Figure 14 A cross-sectional view illustrating a display device according to another embodiment; and
[0059] Figure 15 A cross-sectional view illustrating a display device according to another embodiment. Specific embodiments
[0060] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings, in which like reference numerals refer to like elements throughout. However, the present disclosure may be embodied in various different forms and should not be construed as limited to the embodiments illustrated herein. On the contrary, these embodiments are provided by way of example so that the present disclosure will be thorough and complete and will fully convey the aspects and features of the present disclosure to those skilled in the art. Accordingly, processes, elements, and techniques that are not necessary for those of ordinary skill in the art to fully understand the aspects and features of the present disclosure may not be described. Unless otherwise stated, in the entire accompanying drawings and the written description, like reference numerals represent like elements and thus their redundant description may not be repeated.
[0061] When a particular embodiment can be implemented differently, the specific process order may be different from the described order. For example, two consecutively described processes may be performed simultaneously or substantially simultaneously, or may be performed in an order opposite to the described order.
[0062] Furthermore, as will be understood by those of ordinary skill in the art, in view of the entirety of the present disclosure, each suitable feature of the various embodiments of the present disclosure may be partially or wholly combined or combined with each other, and may be interlocked and operated in various suitable ways, and each embodiment may be implemented independently of each other or combined with each other in any suitable manner, unless otherwise stated or implied.
[0063] In the drawings, for clarity, the relative dimensions, thicknesses, and proportions of elements, layers, and regions may be enlarged and / or simplified. For ease of explanation, spatial relative terms, such as "beneath", "below", "under", "lower", "above", and "upper", etc., may be used herein to describe the relationship of one element or feature to another element or feature illustrated in the figures. It will be understood that, in addition to the orientation depicted in the figures, spatial relative terms are intended to encompass different orientations of the device during use or operation. For example, if the device in the figures is flipped, an element described as "beneath" or "below" or "lower" than other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "lower" may encompass both the above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.
[0064] In the figures, the x-direction, y-direction, and z-direction are not limited to the directions corresponding to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the x-direction, y-direction, and z-direction can be perpendicular or substantially perpendicular to each other, or can represent different directions that are not perpendicular to each other.
[0065] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, the first element, component, region, layer, or section described below may be referred to as the second element, component, region, layer, or section without departing from the spirit and scope of the present disclosure.
[0066] It will be understood that when an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or there can be one or more intervening elements or layers. Similarly, when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, it can be directly electrically connected to the other layer, region, or element, and / or can be indirectly electrically connected with one or more intervening layers, regions, or elements therebetween. Additionally, it will also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intervening elements or layers.
[0067] The terms used in this document are for the purpose of describing particular embodiments and are not intended to limit the disclosure. As used herein, the singular forms "a / an" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that when the terms "comprises / comprising / includes / including" and "has / have / having" are used in this specification, they specify the presence of the recited features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" means A, B, or A and B. Expressions such as "at least one of..." modify the entire list of elements when preceding / following the list of elements, rather than individual elements in the list. For example, the expressions "at least one of a, b, and c" and "at least one selected from the group consisting of a, b, and c" indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, c, or variations thereof.
[0068] As used herein, the terms "substantially", "about", and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent variations in measured or calculated values that would be recognized by a person of ordinary skill in the art. Further, when describing embodiments of the disclosure, the use of "may" refers to "one or more embodiments of the disclosure". As used herein, the terms "use / using" and "used" may be considered synonymous with the terms "utilize / utilizing" and "utilized", respectively.
[0069] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
[0070] Figure 1 For example, a plan view of a display device according to an embodiment is shown. Figure 2 For example, along Figure 1 A schematic cross-sectional view of the display device taken along line X1-X1' is shown. Figure 3 For example, Figure 2 A cross-sectional view of the display device in a bent state is shown.
[0071] Reference Figures 1 to 3 As shown in Figures 1 to 3 , the display device 1 can display a screen and / or an image through the display area DA. The display device 1 can include various suitable devices including the display area DA. For example, the display device 1 can include a smart phone, a cellular phone, a tablet personal computer, a personal digital assistant (PDA), a portable multimedia player (PMP), a television, a game console, a wristwatch-type electronic device, a head-mounted display, a monitor of a personal computer, a laptop computer, a vehicle navigator, a vehicle dashboard, a digital camera, a portable video camera, an external billboard, an electronic display panel, various suitable medical devices, various suitable inspection devices, various suitable household appliances including the display area DA such as a refrigerator and a washing machine, and / or devices for the Internet of Things (IoT), etc. Some examples of the foldable display device to be described in more detail below can include a foldable smart phone, a tablet personal computer, or a laptop computer, but the present disclosure is not limited thereto.
[0072] On a plane (e.g., in a plan view), the display device 1 can be formed in a rectangular or substantially rectangular shape. On a plane (e.g., in a plan view), the display device 1 can have a rectangular shape with vertical corners (e.g., right-angled corners), or a rectangular shape with rounded corners. Hereinafter, for the convenience of illustration, the display device 1 can be described in more detail as having a planar shape including a rectangular shape with rounded corners, but the present disclosure is not limited thereto.
[0073] The display device 1 can include four sides and four edges. The number of sides and edges of the display device 1 is not limited thereto. The display device 1 can include a long side and a short side.
[0074] The short side of the display device 1 can extend along one direction, and the long side of the display device 1 can extend along another direction intersecting with the one direction. For example, the short side of the display device 1 can extend along the first direction DR1, and the long side of the display device 1 can extend along the second direction DR2.
[0075] In the drawings, the first direction DR1 and the second direction DR2 are horizontal directions intersecting with each other. For example, the first direction DR1 and the second direction DR2 can be orthogonal to each other. Moreover, the third direction DR3 intersects with the first direction DR1 and the second direction DR2, and can be, for example, a vertical direction or a thickness direction orthogonal thereto. Hereinafter, with respect to the drawings, each of the directions indicated by the arrows in the first to third directions DR1, DR2, and DR3 can be referred to as one side, and the corresponding opposite direction can be referred to as the other side. However, the directions shown in the drawings refer to relative directions, and the present disclosure is not limited to the specific directions shown in the drawings.
[0076] The display device 1 may include a display panel 10 for displaying an image, an upper stacked structure 20, a lower stacked structure 30, and an external device attached to the display panel 10. The external device may include a driving chip IC, a printed circuit film FPCB, and a touch driving chip TIC. For example, the touch driving chip TIC may be a touch driver.
[0077] The display panel 10 is a panel for displaying a screen and / or an image, and some examples thereof may include a light-receiving display panel, such as a liquid crystal display panel and an electrophoretic display panel, and a self-luminous display panel, such as an organic light-emitting display panel, an inorganic light-emitting display panel, a quantum dot light-emitting display panel, a micro LED display panel, a nano LED display panel, a plasma display panel, a field emission display panel, and a cathode ray display panel.
[0078] Hereinafter, an organic light-emitting display panel will be described as a representative example of the display panel 10, and the organic light-emitting display panel applied to the embodiments will be simply abbreviated as the display panel 10 unless a special difference is described. However, the present disclosure is not limited to the organic light-emitting display panel, and other display panels 10 listed above or known to those of ordinary skill in the art may be applied.
[0079] The display panel 10 may include one surface (e.g., the upper surface) and another surface (e.g., the lower surface). Based on the display device 1, the direction from the other surface of the display panel 10 toward one surface may be the display direction, while the direction from one surface of the display panel 10 toward the other surface may be the non-display direction, but the present disclosure is not limited thereto. Both the direction from the other surface of the display panel 10 toward one surface and the direction from one surface of the display panel 10 toward the other surface may be the display direction.
[0080] In some embodiments, the display device 1 may be a foldable device. As used herein, a foldable device is a device that can be folded, and includes not only a folding device but also a device that can have two states, a folded state and an unfolded state. Hereinafter, the folded state may be referred to as the first operation state, and the unfolded state may be referred to as the second operation state.
[0081] The display panel 10 may include a folding area FA (e.g., a folding axis) and non-folding areas NFA1, NFA2. The display panel 10 may be folded based on the folding area FA (e.g., the folding axis) and change from the second operation state to the first operation state.
[0082] The folding area FA may have a linear shape extending along a first direction DR1 on a plane (e.g., in a plan view). Although the case where the folding area FA extends parallel to the short side of the display device 1 is illustrated in the drawings, the present disclosure is not limited thereto. The folding area FA may be parallel or substantially parallel to the long side, or may be inclined with respect to the short side and the long side. The folding area FA may overlap with the display area DA.
[0083] The first non-folding area NFA1 and the second non-folding area NFA2 may be areas that are not folded. The first non-folding area NFA1 may be located on one side of the folding area FA in a second direction DR2, and the second non-folding area NFA2 may be located on the other side of the folding area FA in the second direction DR2.
[0084] The display panel 10 may include a display area DA for displaying pictures or images and a non-display area NDA that does not display pictures or images depending on whether an image is displayed.
[0085] The display area DA may include a plurality of pixels. The pixels may be basic units for displaying a screen. The pixels may include red pixels, green pixels, and blue pixels, but the present disclosure is not limited thereto. The pixels may further include white pixels. The plurality of pixels may be alternately arranged on a plane (e.g., in a plan view). For example, the pixels may be arranged in a matrix form or in an array, but the present disclosure is not limited thereto.
[0086] The non-display area NDA may be provided near the display area DA (e.g., adjacent to the display area DA). The non-display area NDA may surround the display area DA (e.g., around its outer periphery). In one embodiment, the display area DA may be formed in a rectangular shape, and the non-display area NDA may be provided near the four sides of the display area DA (e.g., adjacent to the four sides of the display area DA).
[0087] The rectangular shape of the display area DA may include, for example, a short side extending in a first direction DR1 and a long side extending in a second direction DR2. The non-display area NDA may be provided near the short side and the long side of the display area DA (e.g., adjacent to the short side and the long side of the display area DA). A black matrix may be provided in the non-display area NDA of the display panel 10 to prevent or substantially prevent light leakage from adjacent pixels.
[0088] The display area DA of the display panel 10 can be set to cover both the first non-foldable area NFA1 and the second non-foldable area NFA2. In addition, the display area DA can also be located in the foldable area FA corresponding to the boundary between the first non-foldable area NFA1 and the second non-foldable area NFA2. In other words, the display area DA of the display device 1 can be continuously set regardless of the boundaries of the non-foldable areas NFA1, NFA2, the foldable area FA, etc., but the present disclosure is not limited thereto. For example, in some embodiments, the display area DA can be set in the first non-foldable area NFA1, but not in the second non-foldable area NFA2. In other embodiments, the display area DA can be set in the first non-foldable area NFA1 and the second non-foldable area NFA2, but the display area DA may not be set in the foldable area FA either.
[0089] The non-display area NDA can also be located in the first non-foldable area NFA1, the second non-foldable area NFA2, and the foldable area FA.
[0090] In some embodiments, in the first operating state, the display device 1 can be folded in an inward folding manner, where one surface of the display panel 10 is folded such that the folded surfaces face each other. In the first operating state, one surface of the first non-foldable area NFA1 of the display panel 10 can be folded to face one surface of the second non-foldable area NFA2.
[0091] In another embodiment, in the first operating state, the display device 1 can be folded in an outward folding manner, where the other surface of the display panel 10 is folded such that the folded surfaces face each other. In the first operating state, the other surface of the first non-foldable area NFA1 of the display panel 10 can be folded to face the other surface of the second non-foldable area NFA2.
[0092] The display device 1 can be folded in one of the inward folding manner and the outward folding manner (e.g., only one of the two), or can be folded in both the inward folding manner and the outward folding manner. In the case of performing both inward folding and outward folding, the inward folding and the outward folding can be performed based on the same foldable area FA, or the display device 1 can include multiple foldable areas FA, where different types of folding, such as a folding line for only inward folding and a folding line for only outward folding, can be performed.
[0093] The non-display area NDA adjacent to the other short side of the display area DA in the second direction DR2 can further include a protrusion protruding toward the other side in the second direction DR2. The width of the protrusion in the first direction DR1 can be smaller than the width of the non-display area NDA in the first direction DR1, and the non-display area NDA is located on one side of the protrusion in the second direction DR2. The width of the protrusion in the first direction DR1 can gradually decrease toward the other side in the second direction DR2, but the present disclosure is not limited thereto.
[0094] The protrusion may include a bending region BA. The bending region BA may have a line shape extending in a first direction DR1. The display panel 10 may be bent in a thickness direction (e.g., a third direction DR3) in the bending region BA of the non-display area NDA. When the display panel 10 is bent based on the bending region BA, the other surfaces of the display panel 10 may face each other.
[0095] The external device may be attached to the other side of the bending region BA of the protrusion in a second direction DR2. The attachment position of the driving chip IC may be located between the attachment position of the printed circuit film FPCB and the bending region BA. In the second operating state, the driving chip IC may be located between the printed circuit film FPCB and the display area DA, or between the printed circuit film FPCB and the bending region BA.
[0096] The driving chip IC may include a driving integrated circuit to control the application of a data voltage and / or a scan signal to each corresponding pixel. A plurality of driving pads may be provided at the attachment position of the driving chip IC in the non-display area NDA, and the driving chip IC may be attached to the plurality of driving pads. For example, the driving chip IC may be a display driver.
[0097] The printed circuit film FPCB may supply a data voltage signal, a data voltage application control signal, and / or a scan signal application control signal to the driving chip IC. Additionally, the printed circuit film FPCB may supply a high voltage potential signal and a low voltage potential signal to each pixel.
[0098] The printed circuit film FPCB may include a connector CN located at the other end in the second direction DR2. The connector CN may be connected to the main circuit board.
[0099] A cover tape C-IC may be provided on the display panel 10, the driving chip IC, and the printed circuit film FPCB. The cover tape C-IC may completely cover the driving chip IC, but the present disclosure is not limited thereto. The cover tape C-IC may cover at least a part of the printed circuit film FPCB.
[0100] The cover tape C-IC may dissipate (e.g., radiate) the heat generated by the driving chip IC and the printed circuit film FPCB to the outside. The cover tape C-IC may be a thermally conductive adhesive tape including (e.g., containing) a heat dissipation material or a phase change material (PCM). For example, the cover tape C-IC may include a heat dissipation layer and an adhesive layer.
[0101] The cover tape C-IC may prevent or substantially prevent the driving chip IC and the printed circuit film FPCB from being damaged by external forces. The cover tape C-IC may prevent or substantially prevent static electricity from being generated from the driving chip IC and the printed circuit film FPCB. For example, the cover tape C-IC may include a polyamide film and / or a PET film, etc.
[0102] The touch driving chip TIC can be encapsulated on the flexible printed circuit film FPCB. The touch driving chip TIC can be connected to the touch sensing unit (e.g., touch sensing layer or touch sensing panel) of the display panel 10. The touch driving chip TIC can supply touch driving signals to a plurality of touch electrodes TEL (e.g., see Figure 4 ) of the touch sensing unit, and can sense the change amount of the capacitance between the plurality of touch electrodes TEL. For example, the touch driving signal can be a pulse signal having an appropriate frequency (e.g., a predetermined frequency). The touch driving chip TIC can determine whether an input is provided, and can calculate the input coordinates based on the change amount of the capacitance between the plurality of touch electrodes TEL. The touch driving chip TIC can be formed of an integrated circuit.
[0103] As Figure 2 shown, the upper stacked structure 20 can be disposed on one surface of the display panel 10, and the lower stacked structure 30 can be disposed on the other surface of the display panel 10. The upper stacked structure 20 and the lower stacked structure 30 can overlap other portions of the display panel 10 except for the protrusion in the third direction DR3.
[0104] In Figure 1 , the planar sizes of the upper stacked structure 20 and the lower stacked structure 30 are illustrated as being larger than the planar size of other portions of the display panel 10 except for the protrusion, but the present disclosure is not limited thereto. Each of the planar sizes of the upper stacked structure 20 and the lower stacked structure 30 can be the same as or substantially the same as the planar size of the display panel 10, or can be smaller than the planar size of the display panel 10.
[0105] As Figure 2 shown, the upper stacked structure 20 and the lower stacked structure 30 can be disposed at the display area DA and the non-display area NDA of the display panel 10 (e.g., in, on, or throughout the display area DA and the non-display area NDA of the display panel 10). The upper stacked structure 20 and the lower stacked structure 30 can be disposed at the folding area FA and the non-folding areas NFA1, NFA2 (e.g., in, on, or throughout the folding area FA and the non-folding areas NFA1, NFA2).
[0106] As Figure 3 shown, when the display device 1 is bent based on the bending area BA, the other surfaces of the display panel 10 can be bent to face each other. The driving chip IC, the flexible printed circuit film FPCB, and the cover tape C-IC can be disposed to overlap the lower stacked structure 30 in the thickness direction. For example, the driving chip IC, the flexible printed circuit film FPCB, and the cover tape C-IC can be disposed on the lower portion (e.g., lower surface or rear surface) of the lower stacked structure 30.
[0107] Figure 4 is a plan view of the lines and pads of a display device according to an embodiment.
[0108] Reference Figure 4 , the display area DA may be located at the center of the display panel 10. A plurality of pixels PX, a plurality of gate lines GL, a plurality of data lines DL, a plurality of power lines VL, and a plurality of touch electrodes TEL may be provided in the display area DA. Each of the plurality of pixels PX may be defined as a minimum unit for emitting light.
[0109] The plurality of gate lines GL may supply gate signals received from the gate driver GIC to the plurality of pixels PX. The plurality of gate lines GL may extend in a first direction DR1 and may be spaced apart from each other in a second direction DR2 that intersects the first direction DR1.
[0110] The plurality of data lines DL may supply data voltages received from the driving chip IC to the plurality of pixels PX. The plurality of data lines DL may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1.
[0111] The plurality of power lines VL may supply power voltages received from the driving chip IC to the plurality of pixels PX. In this case, the power voltage may be at least one of a driving voltage, an initialization voltage, a reference voltage, and a low potential voltage. The plurality of power lines VL may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1.
[0112] The plurality of touch electrodes TEL may form mutual capacitance to sense the touch of an object or a person. The plurality of touch electrodes TEL may include a plurality of driving electrodes and a plurality of sensing electrodes. For example, the driving electrode may be defined as a first sensing electrode, and the sensing electrode may be defined as a second sensing electrode. As another example, the driving electrode may be defined as a second sensing electrode, and the sensing electrode may be defined as a first sensing electrode.
[0113] The non-display area NDA may surround the display area DA (e.g., around its outer periphery). The gate driver GIC, the fan-out line FOL, and the gate control line GCL may be provided in the non-display area NDA. The gate driver GIC may generate a plurality of gate signals based on a gate control signal and may supply the plurality of gate signals to the plurality of gate lines GL in an appropriate order (e.g., a predetermined order) in sequence.
[0114] The fan-out line FOL may extend from the pad area PA and the touch pad areas TPA1, TPA2 to the display area DA. The fan-out line FOL may include a first fan-out line FOL1 and a second fan-out line FOL2.
[0115] The first fan-out line FOL1 can extend from the pad area PA via the driving chip IC to the display area DA. The first fan-out line FOL1 can supply the data voltage received from the driving chip IC to multiple data lines DL. The second fan-out line FOL2 can extend from the touch pad areas TPA1 and TPA2 to the display area DA. The second fan-out line FOL2 can supply the touch driving signal provided by the touch driving chip TIC to the touch electrodes TEL.
[0116] The gate control line GCL can extend from the driving chip IC to the gate driver GIC. The gate control line GCL can supply the gate control signal received from the driving chip IC to the gate driver GIC.
[0117] The protrusion of the non-display area NDA can include the driving chip IC, the pad area PA, and the touch pad areas TPA1 and TPA2.
[0118] The driving chip IC can output signals and voltages for driving the display panel 10 to the first fan-out line FOL1. The driving chip IC can supply the data voltage to the data lines DL through the first fan-out line FOL1. The data voltage can be supplied to multiple pixels PX and can control the brightness of the multiple pixels PX. The driving chip IC can supply the gate control signal to the gate driver GIC through the gate control line GCL.
[0119] The pad area PA and the touch pad areas TPA1 and TPA2 can be provided at the edge of the protrusion of the non-display area NDA. For example, the pad area PA and the touch pad areas TPA1 and TPA2 can be provided adjacent to the other end of the protrusion of the non-display area NDA in the second direction DR2. The pad area PA and the touch pad areas TPA1 and TPA2 can be electrically connected to the printed circuit film FPCB through a bonding member.
[0120] The pad area PA can include multiple display pad portions DP. The multiple display pad portions DP can be connected to the graphics system through the printed circuit film FPCB. The multiple display pad portions DP can be connected to the printed circuit film FPCB to receive digital video data from the graphics system and can supply the digital video data to the driving chip IC.
[0121] The touch pad areas TPA1 and TPA2 can include a first touch pad area TPA1 and a second touch pad area TPA2. The first touch pad area TPA1 can include multiple first touch pads TP1, and the second touch pad area TPA2 can include multiple second touch pads TP2.
[0122] The multiple first touch pads TP1 and the multiple second touch pads TP2 can be connected to the touch driving chip TIC through the printed circuit film FPCB. The multiple first touch pads TP1 and the multiple second touch pads TP2 can be connected to the printed circuit film FPCB to receive the touch driving signal from the touch driving chip TIC.
[0123] A plurality of first touch pads TP1 and a plurality of second touch pads TP2 can provide the touch driving signals provided from the touch driving chip TIC to the touch electrodes TEL through the second fan-out line FOL2. The plurality of first touch pads TP1 and the plurality of second touch pads TP2 can provide the touch sensing signals sensed from the touch electrodes TEL to the touch driving chip TIC through the second fan-out line FOL2.
[0124] Figure 5 For example, along Figure 1 a schematic cross-sectional view of the display device taken along the line X2-X2'.
[0125] Reference Figure 5 and Figure 2 and Figure 3 , the display device 1 may include a display panel 10, an upper stacked structure 20, and a lower stacked structure 30. The upper stacked structure 20 may include an on-panel member 21, a window member 22, and an upper protection member 23. The lower stacked structure 30 may include a first panel support film 31, a second panel support film 32, a lower functional member 33, and a cover spacer 34.
[0126] The display panel 10 may include a first portion 11 and a second portion 12. The first portion 11 may be disposed between the upper stacked structure 20 and the lower stacked structure 30. The second portion 12 may be disposed below the lower stacked structure 30.
[0127] The second portion 12 may be a portion where the display panel 10 is bent, and then as Figure 3 shown in is located below (e.g., beneath) the lower stacked structure 30. In Figure 5 , the first portion 11 and the second portion 12 are shown as separate elements from each other, but as Figure 3 shown in, the first portion 11 and the second portion 12 may be elements connected as one body.
[0128] The on-panel member 21 may be disposed on the entire surface of the display panel 10. For example, the on-panel member 21 may be disposed on the first portion 11 of the display panel 10.
[0129] In one embodiment, the on-panel member 21 may be a protection member. The on-panel member 21 may perform a shock mitigation function for protecting the display panel 10 from external shocks. The on-panel member 21 may include a suitable material having high flexibility and high rigidity. For example, the on-panel member 21 may include a flexible plastic material such as polyimide (PI) and / or polyethylene terephthalate (PET).
[0130] In another embodiment, the on-panel member 21 may be an optical member. The on-panel member 21 may perform an anti-reflection function. The on-panel member 21 may reduce the reflectance of external light incident from the upper side of the window member 22. In one embodiment, the on-panel member 21 may include a phase retarder, a polarizer, and a destructive interference structure. For example, the phase retarder and the polarizer may be of a film type or a liquid crystal coating type. The destructive interference structure may include a first reflective layer and a second reflective layer, which are disposed at different layers (e.g., middle or upper) from each other. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may undergo destructive interference, thereby reducing the reflectance of external light.
[0131] When the on-panel member 21 performs a shock mitigation function or an anti-reflection function, the on-panel member 21 may further include an adhesive layer below (e.g., beneath) the functional layer for performing the shock mitigation function or the anti-reflection function. The adhesive layer may include a transparent adhesive such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), and / or an optically clear resin (OCR). The on-panel member 21 may be transported and processed by integrally combining the functional layer and the adhesive layer with each other.
[0132] In another embodiment, the on-panel member 21 may be an adhesive member. The on-panel member 21 may perform an adhesive function. The on-panel member 21 may connect (e.g., couple or attach) the window member 22 to the display panel 10. For example, the on-panel member 21 may include an adhesive layer (e.g., only the adhesive layer) for performing the adhesive function and may not include a functional layer for performing the shock mitigation function or the anti-reflection function. In this case, the on-panel member 21 may be formed of a transparent adhesive such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), and / or an optically clear resin (OCR).
[0133] The window member 22 may be attached to the entire or substantially the entire surface of the on-panel member 21. The window member 22 may include a transparent material such as, for example, glass or plastic (e.g., may be made of). For example, the window member 22 may include (e.g., may be) an ultra-thin glass (UTG) or a transparent polyimide film having a thickness of 0.1 mm or less.
[0134] The upper protection member 23 may be disposed on the entire or substantially the entire surface of the window member 22. The upper protection member 23 may perform at least one of the functions of shock absorption, scratch resistance, fingerprint resistance, anti-glare, and anti-scattering of the window member 22. The upper protection member 23 may include a suitable material having high elasticity and scratch resistance. For example, the upper protection member 23 may be a polymer film or a strengthened glass film.
[0135] The first panel support film 31 may be disposed on the rear surface of the first portion 11 of the display panel 10. The first panel support film 31 may be used to support the first portion 11 of the display panel 10 and protect the rear surface of the first portion 11 of the display panel 10. The first panel support film 31 may include (e.g., may be) plastic, such as polyethylene terephthalate (PET) or polyimide.
[0136] The second panel support film 32 may be disposed on the rear surface of the second portion 12 of the display panel 10 (e.g., before the display panel 10 is bent). For example, the second panel support film 32 may be disposed on the rear surface of the second portion 12 and then may be bent as shown in Figure 3 such that the second portion 12 and the second panel support film 32 are provided on the rear surface of the lower functional member 33. The second panel support film 32 may support the second portion 12 of the display panel 10 and may be used to protect the rear surface of the second portion 12 of the display panel 10. The second panel support film 32 may include (e.g., may be) plastic, such as polyethylene terephthalate (PET) or polyimide.
[0137] The lower functional member 33 may be disposed on the rear surface of the first panel support film 31. The lower functional member 33 may include at least one of a support layer for increasing the rigidity of the display panel 10, a light shielding layer for absorbing light incident from the outside, a buffer layer for absorbing impacts from the outside, and a heat dissipation layer for effectively dissipating the heat of the display panel 10.
[0138] The support layer may support the display panel 10. The support layer may be a rigid member whose shape or volume is not easily changed by external pressure. In one embodiment, the support layer may include (e.g., may be) a polymer including carbon fiber or glass fiber. When the lower functional member 33 includes a digital converter, the support layer may be formed of a polymer including carbon fiber or glass fiber to pass through the magnetic field or electromagnetic signal of the digital converter.
[0139] In another embodiment, the support layer may be a metal plate. For example, the support layer may be a metal plate including a metal or metal alloy (e.g., made of a metal or metal alloy). The support layer may include copper (Cu), aluminum (Al), stainless steel (SUS), and / or a suitable alloy thereof, but the present disclosure is not limited thereto.
[0140] The light shielding layer may shield the transmission of light to prevent or substantially prevent the components disposed therebelow from being visually recognized on the display panel 10. The light shielding layer may include a light absorbing material, such as a black pigment or a black dye.
[0141] The buffer layer can absorb external impacts to prevent or substantially prevent the display panel 10 from being damaged. The buffer layer can be formed of a single layer or multiple layers. For example, the buffer layer can include a polymer resin such as polyurethane, polycarbonate, polypropylene, and / or polyethylene (e.g., can be formed of it), or can include a suitable material with elasticity such as rubber, urethane-based material, or a sponge formed by foaming an acrylic material.
[0142] The heat dissipation layer can include a first heat dissipation layer and a second heat dissipation layer. The first heat dissipation layer includes (e.g., contains) graphite or carbon nanotubes, and the second heat dissipation layer includes a metal thin film such as copper, nickel, ferrite, and / or silver (e.g., formed of it), which can shield electromagnetic waves and can have excellent thermal conductivity.
[0143] When the display panel 10 is bent, the cover spacer 34 can uniformly or substantially uniformly maintain the distance between the lower functional member 33 and the second portion 12 of the display panel 10 in the third direction DR3. The cover spacer 34 can control the bending degree (e.g., curve or curvature) of the display panel 10. The cover spacer 34 can support the second portion 12 of the display panel 10. The cover spacer 34 can include an organic insulating material, but the present disclosure is not limited thereto.
[0144] Figure 6A To illustrate a cross-sectional view of a display panel according to an embodiment. Figure 6B To illustrate a cross-sectional view of a display panel according to another embodiment.
[0145] Reference Figure 6A and Figure 6B As shown in and, the display panel 10 can include a substrate SUB, a display layer DU, and a touch sensing layer TSU. The display layer DU can include a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL.
[0146] The substrate SUB can be a base substrate or a base member. The substrate SUB can be a flexible substrate capable of withstanding bending, folding, and / or curling, etc. For example, the substrate SUB can include a polymer resin such as polyimide (PI), but the present disclosure is not limited thereto. As another example, the substrate SUB can include a glass material or a metal material.
[0147] The thin film transistor layer TFTL can include a first buffer layer BF1, a lower metal layer BML, a second buffer layer BF2, a thin film transistor TFT, a gate insulating layer GI, a first interlayer insulating layer ILD1, a capacitor electrode CPE, a second interlayer insulating layer ILD2, a first connection electrode CNE1, a first passivation layer PAS1, a second connection electrode CNE2, and a second passivation layer PAS2.
[0148] The thin film transistor layer TFTL may include a first conductive layer CTL1, an active layer ACTL, a second conductive layer CTL2, a third conductive layer CTL3, a fourth conductive layer CTL4, and a fifth conductive layer CTL5.
[0149] As used herein, a conductive layer is a layer having conductivity by including a conductive material, and layers formed of conductive layers with the same name may be formed by the same process and / or may include the same materials as each other. In one embodiment, the insulating layer or passivation layer directly on the upper and lower portions of the same conductive layer may be the same as each other. However, when the insulating layer or passivation layer directly on the upper and lower portions of the same conductive layer is omitted in certain regions, they may not be the same as each other.
[0150] A first buffer layer BF1 may be disposed on the substrate SUB. The first buffer layer BF1 may include an inorganic layer capable of preventing or substantially preventing the penetration of air and / or moisture. For example, the first buffer layer BF1 may include a plurality of inorganic layers stacked alternately.
[0151] The first conductive layer CTL1 may be disposed on the first buffer layer BF1. The first conductive layer CTL1 may include a lower metal layer BML. The lower metal layer BML may include a suitable material for shielding light, thereby preventing or substantially preventing light from entering the semiconductor region ACT. For example, the lower metal layer BML may be formed of a single layer or multiple layers, which may include any one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and suitable alloys thereof (e.g., may be made of them). In some embodiments, the lower metal layer BML may be omitted as needed or desired.
[0152] A second buffer layer BF2 may be disposed on the first conductive layer CTL1. The second buffer layer BF2 may cover the first buffer layer BF1 and the lower metal layer BML. The second buffer layer BF2 may include an inorganic layer capable of preventing or substantially preventing the penetration of air and / or moisture. For example, the second buffer layer BF2 may include a plurality of inorganic layers stacked alternately.
[0153] A thin film transistor TFT may be disposed on the second buffer layer BF2. The thin film transistor TFT may constitute the pixel circuit of a corresponding one of a plurality of pixels. In other words, the pixel circuit of each corresponding pixel may include at least one thin film transistor TFT. For example, the thin film transistor TFT may be a driving transistor or a switching transistor of the pixel circuit. The thin film transistor TFT may include a semiconductor region ACT, a source electrode SE, a drain electrode DE, and a gate electrode GE. However, connection electrodes (e.g., a first connection electrode CNE1 and a second connection electrode CNE2), which will be described in more detail below, may also be regarded as elements included in the thin film transistor TFT.
[0154] The active layer ACTL can be disposed on the second buffer layer BF2. The active layer ACTL can include a semiconductor region ACT, a drain electrode DE, and a source electrode SE.
[0155] The semiconductor region ACT can overlap with the lower metal layer BML and the gate electrode GE in the thickness direction. The semiconductor region ACT can be insulated from the gate electrode GE by the gate insulating layer GI. The material of the semiconductor region ACT can conduct electricity in a part of the semiconductor region ACT to form the source electrode SE and the drain electrode DE.
[0156] The gate insulating layer GI can be disposed on the active layer ACTL. The gate insulating layer GI can cover the semiconductor region ACT and the second buffer layer BF2. The gate insulating layer GI can insulate the semiconductor region ACT from the gate electrode GE. The gate insulating layer GI can include a contact hole through which the first connection electrode CNE1 passes (e.g., penetrates).
[0157] The second conductive layer CTL2 can be disposed on the gate insulating layer GI. The second conductive layer CTL2 can include the gate electrode GE. The gate electrode GE can overlap with the semiconductor region ACT, and the gate insulating layer GI is interposed therebetween.
[0158] The first interlayer insulating layer ILD1 can be disposed on the second conductive layer CTL2. The first interlayer insulating layer ILD1 can cover the gate electrode GE and the gate insulating layer GI. The first interlayer insulating layer ILD1 can include a contact hole through which the first connection electrode CNE1 passes (e.g., penetrates). The contact hole of the first interlayer insulating layer ILD1 can be connected to the contact hole of the gate insulating layer GI and the contact hole of the second interlayer insulating layer ILD2.
[0159] The third conductive layer CTL3 can be disposed on the first interlayer insulating layer ILD1. The third conductive layer CTL3 can include a capacitor electrode CPE. The capacitor electrode CPE can overlap with the gate electrode GE in the thickness direction. The capacitor electrode CPE and the gate electrode GE can form a capacitance.
[0160] The second interlayer insulating layer ILD2 can be disposed on the third conductive layer CTL3. The second interlayer insulating layer ILD2 can cover the capacitor electrode CPE and the first interlayer insulating layer ILD1. The second interlayer insulating layer ILD2 can include a contact hole through which the first connection electrode CNE1 passes (e.g., penetrates). The contact hole of the second interlayer insulating layer ILD2 can be connected to the contact hole of the first interlayer insulating layer ILD1 and the contact hole of the gate insulating layer GI.
[0161] The fourth conductive layer CTL4 may be disposed on the second interlayer insulating layer ILD2. The fourth conductive layer CTL4 may include a first connection electrode CNE1. The first connection electrode CNE1 may electrically connect the source electrode SE or the drain electrode DE of the thin film transistor TFT to the second connection electrode CNE2. The first connection electrode CNE1 may be inserted into contact holes formed in the second interlayer insulating layer ILD2, the first interlayer insulating layer ILD1, and the gate insulating layer GI to contact the source electrode SE or the drain electrode DE of the thin film transistor TFT. In some embodiments, the first connection electrode CNE1 may also be regarded as an element included in the thin film transistor TFT. In one embodiment, the first connection electrode CNE1 may perform the same or substantially the same function as the source electrode SE or the drain electrode DE of the thin film transistor TFT.
[0162] The first passivation layer PAS1 may be disposed on the fourth conductive layer CTL4. The first passivation layer PAS1 may cover the first connection electrode CNE1 and the second interlayer insulating layer ILD2. The first passivation layer PAS1 may protect the thin film transistor TFT. The first passivation layer PAS1 may include contact holes through which the second connection electrode CNE2 passes (e.g., penetrates).
[0163] The fifth conductive layer CTL5 may be disposed on the first passivation layer PAS1. The fifth conductive layer CTL5 may include a second connection electrode CNE2. The second connection electrode CNE2 may electrically connect the first connection electrode CNE1 to a corresponding one of the pixel electrodes AE1, AE2, and AE3 of the light emitting elements ED1, ED2, and ED3. The second connection electrode CNE2 may be inserted into contact holes formed in the first passivation layer PAS1 to contact the first connection electrode CNE1. In some embodiments, the second connection electrode CNE2 may also be regarded as an element included in the thin film transistor TFT. In one embodiment, the second connection electrode CNE2 may perform the same or substantially the same function as the source electrode SE or the drain electrode DE of the thin film transistor TFT.
[0164] The second passivation layer PAS2 may be disposed on the fifth conductive layer CTL5. The second passivation layer PAS2 may cover the second connection electrode CNE2 and the first passivation layer PAS1. The second passivation layer PAS2 may include contact holes through which the pixel electrodes AE1, AE2, and AE3 of the light emitting elements ED1, ED2, and ED3 pass (e.g., penetrate).
[0165] The light emitting element layer EML may be disposed on the thin film transistor layer TFTL. The light emitting element layer EML may include light emitting elements ED1, ED2, and ED3 and a bank layer BKL. The light emitting elements ED1, ED2, and ED3 may include pixel electrodes AE1, AE2, and AE3, light emitting layers EL1, EL2, and EL3, and common electrodes CE1, CE2, and CE3.
[0166] The pixel electrodes AE1, AE2, and AE3 may be disposed on the second passivation layer PAS2. Each of the pixel electrodes AE1, AE2, and AE3 may be disposed to overlap with any one of the openings OP of the bank layer BKL. The pixel electrodes AE1, AE2, and AE3 may be electrically connected to the source electrode SE or the drain electrode DE of the thin film transistor TFT through the first connection electrode CNE1 and the second connection electrode CNE2.
[0167] In one embodiment, the pixel electrodes AE1, AE2, and AE3 may include a first pixel electrode AEl, a second pixel electrode AE2, and a third pixel electrode AE3 provided for each pixel PX. The first pixel electrode AE1, the second pixel electrode AE2, and the third pixel electrode AE3 may be disposed to be spaced apart from each other on the second passivation layer PAS2. In some embodiments, the pixel electrodes AE1, AE2, and AE3 may respectively constitute light emitting elements ED1, ED2, and ED3 that emit light of different colors from each other.
[0168] The light emitting layers EL1, EL2, and EL3 may be disposed on the pixel electrodes AE1, AE2, and AE3.
[0169] In one embodiment, the light emitting layers EL1, EL2, and EL3 may be organic light emitting layers including (e.g., made of) an organic material. In the light emitting layers EL1, EL2, and EL3, when the corresponding thin film transistor TFT applies a voltage (e.g., a predetermined voltage) to the pixel electrodes AE1, AE2, and AE3 of the light emitting elements ED1, ED2, and ED3, and the common electrodes CE1, CE2, and CE3 of the light emitting elements ED1, ED2, and ED3 receive a common voltage or a cathode voltage, holes and electrons may move to the light emitting layers EL1, EL2, and EL3 through a hole transport layer and an electron transport layer, respectively, and may be combined with each other in the light emitting layers EL1, EL2, and EL3 to emit light.
[0170] In another embodiment, the light emitting elements ED1, ED2, and ED3 may include quantum dot light emitting diodes including a quantum dot light emitting layer, inorganic light emitting diodes including an inorganic semiconductor, or micro light emitting diodes.
[0171] The light emitting layers EL1, EL2, and EL3 may include a first light emitting layer EL1, a second light emitting layer EL2, and a third light emitting layer EL3. The first light emitting layer EL1 may be disposed on the first pixel electrode AE1, the second light emitting layer EL2 may be disposed on the second pixel electrode AE2, and the third light emitting layer EL3 may be disposed on the third pixel electrode AE3. The first to third light emitting layers EL1, EL2, and EL3 may be the light emitting layers of the first to third light emitting elements ED1, ED2, and ED3, respectively.
[0172] In some embodiments, the first light-emitting layer EL1 may emit red light of a first color, the second light-emitting layer EL2 may emit green light of a second color, and the third light-emitting layer EL3 may emit blue light of a third color, but the present disclosure is not limited thereto.
[0173] Common electrodes CE1, CE2, and CE3 may be disposed on the light-emitting layers EL1, EL2, and EL3. The common electrodes CE1, CE2, and CE3 may include a transparent conductive material such that light generated from the light-emitting layers EL1, EL2, and EL3 may be transmitted therethrough. The common electrodes CE1, CE2, and CE3 may receive a common voltage or a low-potential voltage. When the pixel electrodes AE1, AE2, and AE3 receive voltages corresponding to data voltages and the common electrodes CE1, CE2, and CE3 receive a low-potential voltage, a potential difference is formed between the pixel electrodes AE1, AE2, and AE3 and the common electrodes CE1, CE2, and CE3 such that the light-emitting layers EL1, EL2, and EL3 may emit light.
[0174] The common electrodes CE1, CE2, and CE3 may include a first common electrode CE1, a second common electrode CE2, and a third common electrode CE3. The first common electrode CE1 may be disposed on the first light-emitting layer EL1, the second common electrode CE2 may be disposed on the second light-emitting layer EL2, and the third common electrode CE3 may be disposed on the third light-emitting layer EL3. However, as shown in the figure, the common electrodes CE1, CE2, and CE3 may overlap multiple pixels PX as an integrated electrode and may be disposed on the entire or substantially the entire surface of the display layer DU along the side and upper surfaces of the bank layer BKL and the upper surfaces of the light-emitting layers EL1, EL2, and EL3.
[0175] The bank layer BKL may be disposed on the thin-film transistor layer TFTL or the substrate SUB. The bank layer BKL may include an opening OP provided for each corresponding pixel PX. The opening OP of the bank layer BKL may separate the light-emitting regions of the light-emitting elements ED1, ED2, and ED3. For example, the light-emitting elements ED1, ED2, and ED3 may respectively overlap the opening OP of the bank layer BKL.
[0176] In some embodiments, the opening OP of the bank layer BKL may overlap the pixel electrodes AE1, AE2, and AE3 and may expose portions of the pixel electrodes AE1, AE2, and AE3 therebelow. For example, the bank layer BKL may cover portions of the pixel electrodes AE1, AE2, and AE3 on both ends (e.g., opposite ends) of the pixel electrodes AE1, AE2, and AE3 and may expose the remaining portions of the pixel electrodes AE1, AE2, and AE3 through the opening OP.
[0177] In some embodiments, the light-emitting layers EL1, EL2, and EL3 of the light-emitting elements ED1, ED2, and ED3 may be disposed in the openings OP of the bank layer BKL, but the present disclosure is not limited thereto. The light-emitting layers EL1, EL2, and EL3 may be conformally disposed on the side and upper surfaces of the bank layer BKL.
[0178] In some embodiments, the common electrodes CE1, CE2, and CE3 may be conformally disposed on the side and upper surfaces of the bank layer BKL, but the present disclosure is not limited thereto. The common electrodes CE1, CE2, and CE3 may be disposed in the openings OP of the bank layer BKL.
[0179] The thin-film encapsulation layer TFEL may be disposed on the plurality of light-emitting elements ED1, ED2, and ED3 and the bank layer BKL, and may cover the plurality of light-emitting elements ED1, ED2, and ED3 and the bank layer BKL. The thin-film encapsulation layer TFEL may include at least one inorganic layer to prevent or substantially prevent the penetration of oxygen and / or moisture into the light-emitting element layer EML. The thin-film encapsulation layer TFEL may include at least one organic layer to protect the light-emitting element layer EML from particles such as dust.
[0180] The thin-film encapsulation layer TFEL may include a first encapsulation layer TFE1, a second encapsulation layer TFE2, and a third encapsulation layer TFE3 stacked in sequence. The first encapsulation layer TFE1 and the third encapsulation layer TFE3 may be inorganic encapsulation layers, and the second encapsulation layer TFE2 disposed therebetween may be an organic encapsulation layer.
[0181] Each of the first encapsulation layer TFE1 and the third encapsulation layer TFE3 may include at least one inorganic insulating material. The inorganic insulating material may include alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride.
[0182] The second encapsulation layer TFE2 may include a polymer material. The polymer material may include acrylic resin, epoxy resin, polyimide, and / or polyethylene, etc. For example, the second encapsulation layer TFE2 may include acrylic resin, such as polymethyl methacrylate and / or polyacrylic acid, etc. The second encapsulation layer TFE2 may be formed by curing a monomer or coating a polymer.
[0183] In one embodiment, the first encapsulation layer TFE1 may be disposed on the common electrodes CE1, CE2, and CE3. The first encapsulation layer TFE1 may be conformally disposed along the shape of the common electrodes CE1, CE2, and CE3. The second encapsulation layer TFE2 may be disposed on the first encapsulation layer TFE1. The second encapsulation layer TFE2 may be used to planarize or substantially planarize the step difference of the underlying layer. The third encapsulation layer TFE3 may be disposed on the second encapsulation layer TFE2.
[0184] The touch sensing layer TSU may be disposed on the thin film encapsulation layer TFEL. The touch sensing layer TSU may include a first touch insulation layer SIL1, a second touch insulation layer SIL2, a touch electrode TEL, and an outer coating OC. The touch sensing layer TSU may include a sixth conductive layer CTL6.
[0185] The first touch insulation layer SIL1 may be disposed on the thin film encapsulation layer TFEL. The first touch insulation layer SIL1 may have insulation and optical functions. The first touch insulation layer SIL1 may include at least one inorganic layer. In some embodiments, the first touch insulation layer SIL1 may be omitted as needed or desired.
[0186] The second touch insulation layer SIL2 may cover the first touch insulation layer SIL1. In some embodiments, in addition to the touch electrode TEL disposed on the second touch insulation layer SIL2, another layer of touch electrode may be further disposed on the first touch insulation layer SIL1. In this case, the second touch insulation layer SIL2 may cover the other layer of touch electrode. The second touch insulation layer SIL2 may have insulation and optical functions. For example, the second touch insulation layer SIL2 may be an inorganic layer including at least one of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer.
[0187] The sixth conductive layer CTL6 may be disposed on the second touch insulation layer SIL2. The sixth conductive layer CTL6 may include the touch electrode TEL. The touch electrode TEL may not overlap with the light emitting elements ED1, ED2, and ED3. The touch electrode TEL may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or indium tin oxide (ITO), or may be formed of a stacked structure of aluminum and titanium (e.g., Ti / Al / Ti), a stacked structure of aluminum and ITO (e.g., ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (e.g., ITO / APC / ITO).
[0188] The outer coating OC may be disposed on the second touch insulation layer SIL2 and the touch electrode TEL. The outer coating OC may planarize or substantially planarize the upper ends of the second touch insulation layer SIL2 and the touch electrode TEL. The outer coating OC may be a colorless light-transmissive layer having no color in the visible light band. For example, the outer coating OC may include a colorless light-transmissive organic material such as an acrylic resin.
[0189] In some embodiments, as Figure 6BAs shown, the display panel 10 may further include a third touch insulation layer SIL3. The third touch insulation layer SIL3 may be disposed on the touch electrode TEL. The third touch insulation layer SIL3 may be disposed between the touch electrode TEL and the outer coating OC. The third touch insulation layer SIL3 may cover the touch electrode TEL and the second touch insulation layer SIL2. The third touch insulation layer SIL3 may have insulation and optical functions. The third touch insulation layer SIL3 may be formed of at least one of the aforementioned materials of the second touch insulation layer SIL2.
[0190] Figure 7 For illustration Figure 4 of the enlarged plan view of the region A. Figure 8 For illustration along Figure 7 the line X3-X3’ of the cross-sectional view of the display panel. Figure 9 For illustration along Figure 7 the line X4-X4’ of the cross-sectional view of the display panel.
[0191] Referring to Figures 7 to 9 and Figure 4 , the fan-out line FOL may extend from the display area DA toward the bending area BA of the non-display area NDA. For example, as Figure 7 shown, the fan-out line FOL may extend in the second direction DR2. In Figure 7 , for convenience, the display area DA is omitted and only the fan-out line FOL is shown. The fan-out line FOL may also be disposed in the display area DA.
[0192] The fan-out line FOL may include a first fan-out line FOL1 and a second fan-out line FOL2. The second fan-out line FOL2 may include a first sub-fan-out line FOL2_1 and a second sub-fan-out line FOL2_2.
[0193] As described above, the first fan-out line FOL1 may supply the data voltage received from the driving chip IC to the plurality of data lines DL. The second fan-out line FOL2 may supply the touch driving signal provided by the touch driving chip TIC to the touch electrode TEL. The second fan-out line FOL2 may supply the touch sensing signal sensed from the touch electrode TEL to the touch driving chip TIC.
[0194] The first fan-out line FOL1 may be disposed at (e.g., in or on) the thin film transistor layer TFTL. For example, as Figure 9 shown, the first fan-out line FOL1 may be disposed at (e.g., in or on) the fourth conductive layer CTL4 which is the same layer as the layer of the first connection electrode CNE1, but the present disclosure is not limited thereto. The first fan-out line FOL1 may be disposed at (e.g., in or on) any one of the first to fifth conductive layers CTL1, CTL2, CTL3, CTL4, and CTL5.
[0195] The first sub-fan out line FOL2_1 can be disposed in the touch sensing layer TSU. For example, as Figure 8 shown, the first sub-fan out line FOL2_1 can be disposed in the sixth conductive layer CTL6 which is the same layer as the layer of the touch electrode TEL, but the present disclosure is not limited thereto. When a touch electrode of another layer is further disposed between the first touch insulating layer SIL1 and the second touch insulating layer SIL2, the first sub-fan out line FOL2_1 can be disposed in the same layer as the layer of the touch electrode of the other layer. The first sub-fan out line FOL2_1 can be connected to the touch electrode TEL in the display area DA.
[0196] The second sub-fan out line FOL2_2 can be disposed in the thin film transistor layer TFTL. For example, as Figure 8 and Figure 9 shown, the second sub-fan out line FOL2_2 can be disposed in the fourth conductive layer CTL4, or in other words, in the same layer as the layer of the first fan out line FOL1, but the present disclosure is not limited thereto. The second sub-fan out line FOL2_2 can be disposed at any one (e.g., in or on) of the first to fifth conductive layers CTL1, CTL2, CTL3, CTL4, and CTL5. The second sub-fan out line FOL2_2 can be connected to the touch driving chip TIC through the touch pads TP1, TP2 in the non-display area NDA (e.g., see Figure 1 ).
[0197] In the display device 1 according to the present embodiment, the first sub-fan out line FOL2_1 can be connected to the second sub-fan out line FOL2_2 through the contact hole CNT. The contact hole CNT can penetrate (e.g., can pierce through) the insulating layer or insulating film located between the first sub-fan out line FOL2_1 and the second sub-fan out line FOL2_2.
[0198] At least one of the second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, the first encapsulation layer TFE1, and the wire passivation film FPF can be disposed between the first sub-fan out line FOL2_1 and the second sub-fan out line FOL2_2. The second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, and the first encapsulation layer TFE1 can extend from the display area DA to the non-display area NDA, and can be disposed between the first sub-fan out line FOL2_1 and the second sub-fan out line FOL2_2.
[0199] The wire passivation film FPF can be disposed in the non-display area NDA. As Figure 8 and Figure 9As shown, the wire passivation film FPF may be disposed at the same layer as that of the first passivation layer PAS1 (e.g., middle or upper), but the present disclosure is not limited thereto. The wire passivation film FPF may be disposed at the same layer as that of the second passivation layer PAS2 or the dam layer BKL (e.g., middle or upper).
[0200] The wire passivation film FPF may protect the first fan-out line FOL1 and the second sub-fan-out line FOL2_2 disposed below (e.g., beneath) the wire passivation film FPF. For example, the wire passivation film FPF may prevent or substantially prevent penetration of dust or the like into the first fan-out line FOL1 and the second sub-fan-out line FOL2_2, or may prevent or substantially prevent static current from flowing thereto. The wire passivation film FPF may include an organic film.
[0201] In the display device 1 according to the present embodiment, the first sub-fan-out line FOL2_1 may be connected to the second sub-fan-out line FOL2_2 disposed at the same layer (e.g., middle or upper) as that of the first fan-out line FOL1, and thus the reliability of the display device 1 may be improved.
[0202] For example, in a region adjacent to the bending region BA, the second fan-out line FOL2 connected to the touch driving chip TIC and the first fan-out line FOL1 connected to the driving chip IC may be disposed at the same layer (e.g., middle or upper) such that the stress applied to the first fan-out line FOL1 and the second fan-out line FOL2 during bending of the display panel 10 may be maintained uniformly or substantially uniformly. Accordingly, the electrical characteristics of the first fan-out line FOL1 and the second fan-out line FOL2 may be maintained uniformly or substantially uniformly. As a result, the reliability of the display device 1 may be improved.
[0203] The display device 1 may further include a protection pattern CPT. The protection pattern CPT may extend from the display region DA toward the non-display region NDA. For example, the protection pattern CPT may extend in the second direction DR2. Although the protection pattern CPT is only shown in the non-display region NDA in the drawings, for the sake of illustration, the display region DA may be omitted in the drawings. For this reason, in some embodiments, the protection pattern CPT may also be disposed in the display region DA.
[0204] The protection pattern CPT may be disposed at the touch sensing layer TSU (e.g., middle or upper). For example, as Figure 9 shown, the protection pattern CPT may be disposed at the sixth conductive layer CTL6 at the same layer as that of the first sub-fan-out line FOL2_1 (e.g., middle or upper), but the present disclosure is not limited thereto. When a touch electrode of another layer is further disposed between the first touch insulating layer SIL1 and the second touch insulating layer SIL2, the protection pattern CPT may be disposed at the same layer as that of the touch electrode of the other layer (e.g., middle or upper).
[0205] The display device 1 according to the present embodiment includes a protection pattern CPT, thereby preventing or substantially preventing delamination of the upper insulating film provided on the first fan-out line FOL1. For example, the protection pattern CPT may cover the upper insulating film.
[0206] For example, at least one of the second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, the first encapsulation layer TFE1, and the wire passivation film FPF may be provided between the protection pattern CPT and the first fan-out line FOL1.
[0207] The protection pattern CPT may cover the second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, one end of the first encapsulation layer TFE1, and one end of the wire passivation film FPF. For example, the protection pattern CPT may cover the second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, the other end of the first encapsulation layer TFE1 in the second direction DR2, and one end of the wire passivation film FPF in the second direction DR2.
[0208] The protection pattern CPT may cover the ends of the second touch insulating layer SIL2, the first touch insulating layer SIL1, the third encapsulation layer TFE3, the first encapsulation layer TFE1, and the wire passivation film FPF, thereby preventing or substantially preventing end delamination.
[0209] In some embodiments, the total thickness of the upper layer on the sixth conductive layer CTL6 may be within about 4 μm. For example, the thicknesses TH1 and TH2 of the outer coating OC of the upper layer on the protection pattern CPT and the first sub-fan-out line FOL2_1 may be within about 4 μm.
[0210] Figure 10 FIG. is a cross-sectional view illustrating a display device according to an embodiment.
[0211] Reference Figure 10 and Figures 7 to 9 , the display panel 10 may include a first portion 11, a second portion 12, and a third portion 13.
[0212] The first portion 11 may be located on one side of the bending region BA. The second portion 12 may be located on the other side of the bending region BA. For example, the first portion 11 may be located in the display region DA and in the non-display region NDA between the bending region BA and the display region DA. The second portion 12 may be located in the non-display region NDA opposite to the display region DA, with the bending region BA therebetween. The first portion 11 and the second portion 12 may be flat or substantially flat portions, but the present disclosure is not limited thereto.
[0213] The third portion 13 may be located between the first portion 11 and the second portion 12. The third portion 13 may be located in the bending region BA.
[0214] The first sub-fan out line FOL2_1 can extend from the first portion 11 in one direction. The first sub-fan out line FOL2_1 can be connected to the second sub-fan out line FOL2_2 through a contact hole CNT in a region of the first portion 11 adjacent to the third portion 13. The second sub-fan out line FOL2_2 can extend through the first portion 11 and the third portion 13 to a region of the second portion 12 adjacent to the third portion 13. The second sub-fan out line FOL2_2 can be connected to the first sub-fan out line FOL2_1 again through a contact hole CNT in a region of the second portion 12 adjacent to the third portion 13. The first sub-fan out line FOL2_1 can extend from the second portion 12 in one direction. The first sub-fan out line FOL2_1 can be on the second sub-fan out line FOL2_2 on one side of the bending area BA.
[0215] The protection pattern CPT can be disposed in a region of the first portion 11 adjacent to the third portion 13. In some embodiments, the protection pattern CPT can also be disposed in a region of the second portion 12 adjacent to the third portion 13.
[0216] In some embodiments, one end CPTa of the protection pattern CPT can be closer to the bending area BA or the third portion 13 than one end FOL2_1a of the first sub-fan out line FOL2_1. For example, one end CPTa of the protection pattern CPT can be positioned at a first distance D1 closer to the bending area BA or the third portion 13 than one end FOL2_1a of the first sub-fan out line FOL2_1. The first distance D1 can be within about 100 μm.
[0217] In the display device 1 according to the present embodiment, the upper surface 10a_BA of the third portion 13 can be an exposed surface. No layer can be provided on the upper surface 10a_BA of the third portion 13. For example, Figure 12 the bending passivation layer BPL shown in can not be provided on the upper surface 10a_BA of the third portion 13. Therefore, the dead zone of the display device 1 can be minimized or reduced. The dead zone of the display device 1 will be described in more detail with reference to Figure 12 and Figure 13 more specifically.
[0218] In the display device 1 according to the present embodiment, the panel upper member 21 can be disposed on the protection pattern CPT and the first sub-fan out line FOL2_1. The panel upper member 21 can cover the protection pattern CPT and the first sub-fan out line FOL2_1. The cover tape C-IC can be disposed on the protection pattern CPT and the first sub-fan out line FOL2_1. The cover tape C-IC can cover the protection pattern CPT and the first sub-fan out line FOL2_1.
[0219] One end 21a of the member 21 on the panel may protrude toward the bending region BA more than the outermost end of the sixth conductive layer CTL6. One end 21a of the member 21 on the panel may protrude toward the bending region BA more than one end CPTa of the protection pattern CPT and / or one end FOL2_1a of the first sub-fan-out line FOL2_1. For example, one end 21a of the member 21 on the panel may protrude by a second distance D2 to be closer to the bending region BA than one end CPTa of the protection pattern CPT or one end FOL2_1a of the first sub-fan-out line FOL2_1.
[0220] For example, as Figure 10 shown, the second distance D2 may be a horizontal distance between one end CPTa of the protection pattern CPT and one end 21a of the member 21 on the panel, for example, in the second direction DR2. As another example, when there is no protection pattern CPT, or when one end FOL2_1a of the first sub-fan-out line FOL2_1 is positioned closer to the bending region BA or the third portion 13 than one end CPTa of the protection pattern CPT, the second distance D2 may be a horizontal distance between one end FOL2_1a of the first sub-fan-out line FOL2_1 and one end 21a of the member 21 on the panel, for example, in the second direction DR2.
[0221] One end C-ICa of the cover tape C-IC may protrude toward the bending region BA more than the outermost end of the sixth conductive layer CTL6. One end C-ICa of the cover tape C-IC may protrude toward the bending region BA more than one end CPTa of the protection pattern CPT and / or one end FOL2_1a of the first sub-fan-out line FOL2_1. For example, one end C-ICa of the cover tape C-IC may protrude toward the bending region BA by a third distance D3 closer than one end CPTa of the protection pattern CPT or one end FOL2_1a of the first sub-fan-out line FOL2_1.
[0222] For example, referring to Figure 10 , when there is no protection pattern CPT or one end FOL2_1a of the first sub-fan-out line FOL2_1 is positioned closer to the bending region BA or the third portion 13 than one end CPTa of the protection pattern CPT, the third distance D3 may be a horizontal distance between one end FOL2_1a of the first sub-fan-out line FOL2_1 and one end C-ICa of the cover tape C-IC, for example, in the second direction DR2. As another example, when one end CPTa of the protection pattern CPT is positioned closer to the bending region BA or the third portion 13 than one end FOL2_1a of the first sub-fan-out line FOL2_1, the third distance D3 may be a horizontal distance between one end CPTa of the protection pattern CPT and one end C-ICa of the cover tape C-IC, for example, in the second direction DR2.
[0223] In the display device 1 according to the present embodiment, at least one of the panel upper member 21 and the cover tape C-IC may protrude more than the protection pattern CPT and the first sub-fan-out line FOL2_1 to shield static electricity (e.g., electromagnetic waves) flowing in from the outside.
[0224] For example, the total thickness of the insulating film provided on the upper portion of the second sub-fan-out line FOL2_2 provided in the third portion 13 may be greater than the total thickness of the insulating film provided on the upper portions of the protection pattern CPT and the first sub-fan-out line FOL2_1 provided in the first portion 11. Accordingly, the static electricity flowing into the second sub-fan-out line FOL2_2 may be shielded by the insulating film provided on the upper portion of the second sub-fan-out line FOL2_2 in the third portion 13. In one embodiment, when the upper surface 10a_BA of the third portion 13 is an exposed surface without a bent passivation layer BPL (e.g., see Figure 12 ), static electricity of about 12 kV or less may be shielded from the third portion 13.
[0225] Since the total thickness of the insulating film provided on the first sub-fan-out line FOL2_1 and the protection pattern CPT is relatively thin, the display device 1 according to the present embodiment may shield static electricity by allowing one end 21a of the panel upper member 21 and one end C-ICa of the cover tape C-IC to protrude more toward the bent area BA than one end CPTa of the protection pattern CPT and / or one end FOL2_1a of the first sub-fan-out line FOL2_1.
[0226] In the display device 1 according to the present embodiment, other conductive patterns that require static electricity shielding due to the thin thickness of the upper insulating film may also have the same or substantially the same structure as the above-described first sub-fan-out line FOL2_1 and protection pattern CPT. For example, one end 21a of the panel upper member 21 and one end C-ICa of the cover tape C-IC may protrude more toward the bent area BA than the conductive pattern in which the thickness of the upper insulating film is thin. In one embodiment, the upper insulating film may be an insulating film having a total thickness of about 4 μm or less (e.g., the total thickness in the case of multiple layers).
[0227] Although the cover tape C-IC and the panel upper member 21 have been described separately, they may differ from each other in that the panel upper member 21 is provided on the first portion 11 and the cover tape C-IC is provided on the second portion 12. In other words, both the cover tape C-IC and the panel upper member 21 may be provided on the same surface of the display panel 10 and may protrude more toward the bent area BA than the first sub-fan-out line FOL2_1. For example, the cover tape C-IC may be included in the panel upper member 21.
[0228] In one embodiment, the second distance D2 and the third distance D3 may be about 10 μm or greater. When the second distance D2 and the third distance D3 are 10 μm or greater, the member 21 on the panel may shield the static electricity to the same or substantially the same level as the insulating film disposed on the upper portion of the second sub-fan out line FOL2_2 in the third part 13. When the second distance D2 and the third distance D3 are 10 μm or greater, the member 21 on the panel may shield static electricity of 12 kV or less.
[0229] Figure 11 FIG. is a schematic cross-sectional view illustrating a dynamic impact test of a display device according to an embodiment.
[0230] Reference Figure 11 and Figure 10 FIG. illustrates a method of performing a dynamic impact test on the third part 13 of the display panel 10. The dynamic impact test according to an embodiment may be a Charpy impact test. For example, the dynamic impact test may be a Charpy impact test according to test standards ISO179 or ASTM D6110.
[0231] The dynamic impact test apparatus may include a jig JIG, a bar R, and a weight W.
[0232] The jig JIG may include an inclined surface such that the angle formed with the ground may be a first angle θ1. One end of the bar R is fixed to the rotation axis CL, and the other end of the bar R may perform a pendulum motion. A weight W having a suitable weight (e.g., a predetermined weight) may be disposed at the other end of the bar R.
[0233] In the dynamic impact test according to an embodiment, the length L1 of the bar R may be approximately 30 cm. The weight of the weight W may be approximately 202.4 g. The weight W may be a cylindrical weight having an approximate diameter of 10 mm.
[0234] The display device 1 may be disposed on the inclined surface such that the angle formed with the ground is the first angle θ1. According to the first angle θ1 of the inclined surface, the display device 1 may be inclined with respect to the ground.
[0235] The moving angle of the bar R may be a second angle θ2. The larger the second angle θ2 as the moving angle of the bar R, the greater the impact amount applied to the third part 13 of the display panel 10 when the weight W is placed.
[0236] In the dynamic impact test according to an embodiment, the maximum dynamic impact cancellation angle of the display device 1 in the bending area BA may be approximately 3° or greater. More specifically, the second angle θ2 may be approximately 10° or greater. The maximum dynamic impact cancellation angle may be the maximum value of the second angle θ2 that the display device 1 can withstand without being damaged.
[0237] For example, when the maximum dynamic shock cancellation angle of the display device 1 is 3°, even if the counterweight W is placed at a position where the second angle θ2 is 3° or less, the display device 1 may not be damaged. As another example, when the maximum dynamic shock cancellation angle of the display device 1 is 10°, even if the counterweight W is placed at a position where the second angle θ2 is 10° or less, the display device 1 may not be damaged.
[0238] In the display device 1 according to the present embodiment, since the maximum dynamic shock cancellation angle is 3° or greater, even if the display device 1 does not include a bend passivation layer BPL (for example, see Figure 12 ), the display device 1 may not be deformed due to bending stress.
[0239] Figure 12 FIG. is a cross-sectional view illustrating a display device according to a comparative example. Figure 13 FIG. is a cross-sectional view illustrating a display device according to an embodiment.
[0240] Referring to Figure 12 and Figure 13 and Figure 1 , the display device 1' according to the comparative example may include a bend passivation layer BPL. The bend passivation layer BPL can relieve the bending stress generated in the bending region BA. The bend passivation layer BPL may include an organic material. For example, the organic material may include a photosensitive organic material such as an acrylic material.
[0241] When the display device 1' according to the comparative example is a foldable device, the display device 1' may include an open area OPA to avoid interference between the bend passivation layer BPL and the on-panel member 21 due to a folding sliding phenomenon or a bending sliding phenomenon. The folding sliding phenomenon or the bending sliding phenomenon refers to the phenomenon in which the inner surface of the thick film protrudes more than its outer surface due to the length difference between the inner surface and the outer surface when the thick film is folded or bent.
[0242] The open area OPA refers to an area where the bend passivation layer BPL is not provided on the display panel 10. When the display device 1' is folded, the open area OPA can prevent or substantially prevent interference with the bend passivation layer BPL due to the sliding of the on-panel member 21, and when the display panel 10 is bent, it can prevent or substantially prevent interference with the on-panel member 21 due to the sliding of the bend passivation layer BPL. The display device 1' according to the comparative example has as many first dead zones DS1 as the open area OPA.
[0243] The display device 1' according to the comparative example may have a second dead zone DS2 overlapping with the first panel support film 31 and the second panel support film 32 to prevent or substantially prevent delamination of the bend passivation layer BPL.
[0244] The display device 1' according to the comparative example may have a third dead zone DS3 as an area for bending the display panel 10. For example, the third dead zone DS3 may correspond to the radius of curvature of the bending area BA.
[0245] The display device 1' according to the comparative example may have a fourth dead zone DS4 corresponding to the thickness of the display panel 10.
[0246] The display device 1' according to the comparative example may have a fifth dead zone DS5 corresponding to the thickness of the bending passivation layer BPL.
[0247] On the other hand, the display device 1 according to the present embodiment (for example, see Figure 13 ) may not include the bending passivation layer BPL.
[0248] Since the display device 1 according to the present embodiment does not include the bending passivation layer BPL, there may be no interference between the on-panel member 21 and the bending passivation layer BPL, and thus the display device 1 according to the present embodiment may not include the first dead zone DS1.
[0249] Since the display device 1 according to the present embodiment does not include the bending passivation layer BPL, there may be no delamination of the bending passivation layer BPL, and thus the display device 1 according to the present embodiment may not include the second dead zone DS2.
[0250] Since the display device 1 according to the present embodiment does not include the bending passivation layer BPL, there may be no thickness of the bending passivation layer BPL, and thus the display device 1 according to the present embodiment may not include the fifth dead zone DS5.
[0251] The display device 1 according to the present embodiment may not include the first dead zone DS1, the second dead zone DS2, and the fifth dead zone DS5, so that the dead zone may be minimized or reduced when compared with the comparative example.
[0252] Hereinafter, some other embodiments of the display device will be described in more detail. In the following embodiments, elements that are the same as or substantially the same as those above are denoted by the same reference numerals, and thus their redundant descriptions may not be repeated, and the differences between them may be described in more detail hereinafter.
[0253] Figure 14 FIG. is a cross-sectional view illustrating a display device according to another embodiment.
[0254] Reference Figure 14 , the display device 1_1 according to the present embodiment may be different from the display device 1 described above with reference to Figure 10 etc. in that the on-panel member 21 may cover all of the first to third portions 11, 12, and 13 of the display panel 10.
[0255] More specifically, the on-panel member 21 of the display device 1_1 according to the present embodiment can extend from the display area DA to the non-display area NDA. For example, the on-panel member 21 can be disposed on the first part 11, the third part 13, and the second part 12 of the display panel 10.
[0256] The on-panel member 21 can cover the second fan-out line FOL2 located in the first part 11 and the second fan-out line FOL2 located in the second part 12. The on-panel member 21 can cover the second fan-out line FOL2 located in the third part 13. The on-panel member 21 can shield static electricity flowing in from the outside into the second fan-out line FOL2.
[0257] One end 21a of the on-panel member 21 can be disposed on the second part 12. One end 21a of the on-panel member 21 can overlap with the cover tape C-IC in the third direction DR3. A step difference can be included in one end C-ICa of the cover tape C-IC.
[0258] The adhesion of the on-panel member 21 to the upper surface 10a_BA of the third part 13 can be less than the adhesion of the on-panel member 21 to the upper surface of the first part 11. The adhesion of the adhesive layer of the on-panel member 21 can be removed or weakened at the portion in contact with the upper surface 10a_BA of the third part 13. Therefore, delamination of the on-panel member 21 due to bending and sliding at the portion in contact with the upper surface 10a_BA of the third part 13 can be avoided.
[0259] Figure 15 FIG. is a cross-sectional view illustrating a display device according to another embodiment.
[0260] Reference Figure 15 According to the present embodiment, the display device 1_2 can be different from the display device 1 described above with reference to Figure 10 etc. in that the cover tape C-IC can cover all of the first to third parts 11, 12, and 13 of the display panel 10.
[0261] More specifically, the cover tape C-IC of the display device 1_2 according to the present embodiment can extend from the non-display area NDA including the bending area BA. For example, the cover tape C-IC can be disposed on the second part 12, the third part 13, and the first part 11 of the display panel 10.
[0262] The cover tape C-IC can cover the second fan-out line FOL2 located in the second part 12 and the second fan-out line FOL2 located in the first part 11. The cover tape C-IC can cover the second fan-out line FOL2 located in the third part 13. The cover tape C-IC can shield static electricity flowing in from the outside into the second fan-out line FOL2.
[0263] One end C-ICa of the cover tape C-IC can be provided on the first part 11. One end C-ICa of the cover tape C-IC can contact one end 21a of the member 21 on the panel.
[0264] The adhesive force of the adhesive layer of the cover tape C-IC can be removed or weakened at the portion in contact with the upper surface 10a_BA of the third part 13. Therefore, delamination of the cover tape C-IC due to bending and sliding at the portion in contact with the upper surface 10a_BA of the third part 13 can be avoided.
[0265] The foregoing is illustrative of some embodiments of the present disclosure and is not to be construed as limiting thereof. Although some embodiments have been described, those skilled in the art will readily recognize that various modifications can be made to the embodiments without departing from the spirit and scope of the present disclosure. It will be understood that the description of the features or aspects in each embodiment should generally be considered as available for other similar features or aspects in other embodiments, unless otherwise described. Thus, as will be apparent to those of ordinary skill in the art, the features, characteristics, and / or elements described in connection with a particular embodiment can be used alone or in combination with the features, characteristics, and / or elements described in connection with other embodiments, unless otherwise specifically indicated. Therefore, it should be understood that the foregoing is illustrative of various example embodiments and should not be construed as limited to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other example embodiments are intended to be included within the spirit and scope of the present disclosure as defined in the claims and their equivalents.
Claims
1. A display device, comprising: a display panel including a display area and a bending area on one side of the display area; and a panel upper member on the display panel, wherein the display panel further includes: a substrate; a first conductive layer on the substrate in the bending area; and a second conductive layer on the first conductive layer on one side of the bending area, and wherein one end of the panel upper member facing the bending area protrudes toward the bending area more than one end of the second conductive layer facing the bending area.
2. The display device according to claim 1, wherein an upper surface of the display panel is an exposed surface in the bending area.
3. The display device according to claim 2, wherein the display panel does not include a bending passivation layer on the upper surface of the display panel in the bending area.
4. The display device according to claim 1, wherein a distance by which the one end of the panel upper member protrudes toward the bending area from the one end of the second conductive layer is 10 μm or more.
5. The display device according to claim 1, wherein: the display panel further includes a light-emitting element layer on the substrate; the first conductive layer is on one surface of the light-emitting element layer; and the second conductive layer is on the other surface of the light-emitting element layer.
6. The display device according to claim 1, wherein the display panel further includes: an insulating layer between the first conductive layer and the second conductive layer; and a contact hole penetrating the insulating layer and connecting the first conductive layer and the second conductive layer.
7. The display device according to claim 1, wherein the panel upper member includes any one of a protection member, an optical member, and an adhesive member.
8. The display device according to claim 7, wherein the panel upper member further includes an adhesive layer.
9. The display device according to claim 8, wherein the panel upper member covers the display area and the bending area, and wherein an adhesive force of the adhesive layer of the panel upper member at a portion covering the bending area is less than an adhesive force of the adhesive layer of the panel upper member at a portion covering the display area.
10. The display device according to claim 1, further comprising a touch driver at one end of the display panel, wherein: the display panel further includes a first line on the second conductive layer and a second line on the first conductive layer; and the first line and the second line are electrically connected to the touch driver.
11. The display device according to claim 10, wherein the one end of the panel upper member protrudes toward the bending area more than one end of the first line.
12. The display device according to claim 11, wherein a distance by which the one end of the panel upper member protrudes toward the bending area from the one end of the first line is 10 μm or more.
13. The display device according to claim 10, wherein: the display panel further includes a touch electrode on the second conductive layer; and The touch electrode is electrically connected to the touch driver through the first line and the second line.
14. The display device according to claim 13, wherein: The first line is connected to the touch electrode; The second line is connected to the touch driver; And The first line and the second line are connected to each other through a contact hole penetrating an insulating layer between the first conductive layer and the second conductive layer.
15. The display device according to claim 1, further comprising a display driver located at one end of the display panel, wherein: The display panel further comprises a third line on the first conductive layer; and The third line is electrically connected to the display driver.
16. The display device according to claim 15, wherein the display panel further comprises: An upper insulating film on the third line; And A protection pattern on the second conductive layer covering the upper insulating film.
17. The display device according to claim 16, wherein the one end of the on-panel member protrudes toward the bending area more than one end of the protection pattern.
18. The display device according to claim 17, wherein the distance that the one end of the on-panel member protrudes from the one end of the protection pattern toward the bending area is 10 μm or more.
19. The display device according to claim 15, wherein: The display panel further comprises a light-emitting element and a data line configured to provide a data voltage to the light-emitting element; and The third line is connected to the data line.
20. The display device according to claim 1, wherein the display panel further comprises: A folding area overlapping with the display area; And A first non-folding area and a second non-folding area located on opposite sides of the folding area, respectively.
21. The display device according to claim 1, wherein the maximum dynamic shock cancellation angle of the display panel in the bending area is 3° or more.
22. A display device, comprising: A display panel, comprising: A first part including a light-emitting element; A second part on one side of the first part and bent; and A third part on one side of the second part; An on-panel member on the first part; and A display driver and a touch driver on the third part, Wherein an upper surface of the second part is an exposed surface, Wherein the display panel further comprises: A substrate; A first line on a first conductive layer located on the substrate and connected to the display driver; and A second line on a second conductive layer located on the first conductive layer and connected to the touch driver, Wherein the second line includes a first sub-line on the second conductive layer and a second sub-line on the first conductive layer, Wherein the first line and the second sub-line are located in the second part, and the first sub-line is located in the first part or the third part, and Wherein one end of the on-panel member facing the second part protrudes toward the second part more than one end of the first sub-line facing the second part.
23. The display device according to claim 22, wherein a distance by which the one end of the on-panel member protrudes from the one end of the first sub-line toward the second portion is 10 μm or more.
24. The display device according to claim 22, wherein the display panel further comprises: an upper insulating film on the first line; and a protection pattern covering the upper insulating film on the second conductive layer.
25. The display device according to claim 24, wherein the one end of the on-panel member protrudes more toward the second portion than one end of the protection pattern.
26. The display device according to claim 25, wherein a distance by which the one end of the on-panel member protrudes from the one end of the protection pattern toward the second portion is 10 μm or more.
27. The display device according to claim 22, wherein the on-panel member covers the first portion to the third portion.
28. The display device according to claim 22, further comprising a cover tape covering the display driver, wherein one end of the cover tape protrudes more toward the second portion than the one end of the first sub-line.
29. The display device according to claim 28, wherein the cover tape covers the first portion to the third portion.
Citation Information
Patent Citations
System and Method for managing fire response
KR1020240008587A