Manual tester suitable for full-automatic double-socket test chip

Abstract

The invention discloses a full-automatic double-socket chip testing hand tester which comprises an upper socket and a lower socket, the upper socket is movably connected with the lower socket through a rotating shaft, and the upper socket comprises an upper socket shell and an upper testing assembly arranged on the inner side of the upper socket shell. The lower socket comprises a lower socket shell and a lower test assembly arranged on the inner side of the lower socket shell, the upper test assembly comprises a first guide frame, a test needle, a test needle baffle and a first circuit board, and the lower test assembly comprises a second circuit board, a second guide frame, a metal block and a sealing ring. The first circuit board and the second circuit board can be subjected to chip test conduction at the same time, the test efficiency is improved, frequent movement of the chip is avoided, the chip can be effectively prevented from being damaged, the Handler is easy and convenient to install, the test performance is more stable, the test service life is prolonged, the test speed is increased, safety is high, and the application range is wide.

Description

Technical Field

[0001] The present invention relates to the technical field of hand testers, and in particular to a hand tester suitable for a fully automated dual-socket test chip. Background Art

[0002] Currently, due to the small size of the chip under test, for cost considerations during testing, expensive equipment is usually not used for testing. The commonly adopted method by relevant technical departments is as follows: Manually place the chip on a conductive metal carrier, and then manually test the chip under different temperatures, voltages, and currents by testing multiple groups of different types of sockets. However, such a detection method requires connecting various conduction lines, with cumbersome operations. It not only has low detection efficiency but also easily causes the position of the chip to shift. In the lightest case, it leads to unstable test parameters of the chip, and in the worst case, it causes damage to the chip during the testing process. Therefore, there is an urgent need to develop a hand tester suitable for a fully automated dual-socket test chip to solve the above technical problems.

[0003] In view of this, the present invention is specifically proposed. Summary of the Invention

[0004] The object of the present invention is to provide a hand tester suitable for a fully automated dual-socket test chip. By setting upper and lower two sockets, chip test conduction can be simultaneously performed on the first circuit board and the second circuit board, which not only improves the test efficiency but also avoids frequent movement of the chip. It can not only effectively prevent damage to the chip but also be easily installed with a Handler, making the test performance more stable, the test life increased, the test speed accelerated, with high safety, wide application range, applicable to the testing of different model chips, having broad application prospects, and being conducive to popularization and application.

[0005] To achieve the above object, a manual tester for a dual-socket test chip suitable for full automation provided by the present invention includes an upper socket and a lower socket. The upper socket is movably connected to the lower socket through a rotating shaft. The upper socket includes an upper socket housing and an upper test component disposed inside the upper socket housing. A first ejector pin is provided at the top of the upper socket housing. The lower socket includes a lower socket housing and a lower test component disposed inside the lower socket housing. A handle is movably connected to the front side of the lower socket housing. A second ejector pin is provided on the handle. A groove for fitting with the handle is provided on the upper socket housing. When the air cylinder abuts against the second ejector pin on the handle, the handle disengages from the groove on the upper socket housing, and the upper socket rotates around the rotating shaft to open the manual tester. The upper test component includes a first guide frame, test pins, a test pin baffle, and a first circuit board. The first guide frame and the test pin baffle are mounted on the first circuit board. Test pins are provided in the test area of the test pin baffle. By the air cylinder abutting against the first ejector pin, the upper socket makes a closing movement around the rotating shaft towards the lower socket. The lower test component includes a second circuit board, a second guide frame, a metal block, and a sealing ring. The second guide frame and the metal block are mounted on the second circuit board. The sealing ring is adhesively bonded inside the second guide frame in an embedded manner. The metal block is provided inside the sealing ring. During testing, the chip to be tested is placed on the metal block of the lower socket, and vacuum is pumped through the small holes at the bottom of the lower socket to suck and fix the chip for positioning. At this time, the upper surface of the chip to be tested contacts the test pins of the upper socket, and the vacuum suction at the bottom of the socket stops and is changed to blow out high-pressure air to prevent damage to the chip or equipment caused by high-voltage arcing during testing. The lower surface of the chip to be tested contacts the metal block of the lower socket, and both the upper and lower sides of the chip under test are electrically connected for testing.

[0006] Preferably, the handle is connected to the lower socket housing through a positioning pin two and a second spring.

[0007] Preferably, side clips are movably connected to both sides of the lower socket housing. The side clips can make opening and closing movements on both sides of the lower socket housing. The side clips are movably connected to the side clip mounting grooves on both sides of the lower socket housing through a positioning pin one and a first spring.

[0008] Preferably, a reset block for correcting the orientation of the manual tester is provided at the top of the upper socket housing.

[0009] Preferably, the test pin baffle is composed of an upper test pin baffle and a lower test pin baffle. During testing, the test area of the test pin baffle contacts the chip to be tested on the metal block, and the same type of test pins are used for testing.

[0010] Preferably, a hinge block is fixedly connected to the rear end of the lower socket housing. A shaft hole matching the rotating shaft is provided on the hinge block. Both ends of the rotating shaft are fixedly connected inside the shaft hole. A spring groove is provided on the hinge block for controlling the opening and closing between the upper socket and the lower socket.

[0011] Preferably, a bearing is provided inside the upper socket housing. The rotating shaft is in close fit and movably connected with the bearing, so that the upper socket can rotate around the rotating shaft.

[0012] Preferably, a limit point is provided outside the hinge block. After the hinge block, the rotating shaft and the upper socket housing are fitted, the rotating shaft is in close fit with the bearing and reaches the limit point of the hinge block when the upper socket is fully opened, so that the upper socket abuts against the hinge block and stops at the abutting surface position.

[0013] Preferably, both the first circuit board and the second circuit board are ceramic circuit boards with copper injection inside.

[0014] Preferably, the overall socket can be replaced according to the model of the chip to be tested.

[0015] The manual tester for a dual-socket test chip applicable to full automation provided by the present invention has the following beneficial effects.

[0016] 1. By providing two sockets, namely an upper socket and a lower socket, the present invention can simultaneously test the conduction of the first circuit board and the second circuit board. Two test results can be obtained with one action, which not only improves the test efficiency, but also avoids frequent movement of the chip and prevents the chip from being damaged. Through the cooperative connection among the guide frame, the sealing ring and the metal block, the conduction and detection speed of the dual-socket circuit board of the chip to be tested can be improved.

[0017] 2. Through the first guide frame and the second guide frame, the present invention realizes the precise positioning and sealed testing of the chip to be tested. By pushing the first ejector pin and the second ejector pin with the air cylinder, the repeated opening and closing of the manual tester is realized, thereby improving the product safety.

[0018] 3. By injecting copper into the ceramic substrates of the first circuit board and the second circuit board, the present invention not only realizes the conduction of each layer in contact, but also can perform the stacking of different-shaped height differences, improves the heat dissipation problem of the original circuit board and the single problem of only planar design, and can better cooperate with chips to be tested with different thicknesses in terms of compatibility. Description of the Drawings

[0019] Figure 1 It is a three-dimensional view when the manual tester for a dual-socket test chip applicable to full automation provided by the present invention is opened; Figure 2 It is a side view when the manual tester for a dual-socket test chip applicable to full automation provided by the present invention is opened; Figure 3 It is a three-dimensional view when the manual tester for a dual-socket test chip applicable to full automation provided by the present invention is testing; Figure 4Top view during the manual testing of a manual tester for a dual-socket test chip applicable to full automation provided by the present invention; Figure 5 Side view during the manual testing of a manual tester for a dual-socket test chip applicable to full automation provided by the present invention; Figure 6 Exploded side view during the manual testing of a manual tester for a dual-socket test chip applicable to full automation provided by the present invention; Figure 7 Stereoscopic exploded view during the manual testing of a manual tester for a dual-socket test chip applicable to full automation provided by the present invention.

[0020] In the figure: 1. Upper socket 2. Upper socket housing 3. Reset block 4. First ejector pin 5. Groove 6. Spring groove 7. Upper test pin baffle 8. Lower test pin baffle 9. Sealing ring 10. First guiding frame 11. Metal block 12. First circuit board 13. Hinge block 14. Bearing 15. Rotating shaft 16. Lower socket 17. Lower socket housing 18. Second circuit board 19. Handle 20. Second ejector pin 21. Side clamp 22. First positioning pin 23. Second positioning pin 24. First spring 25. Second spring 26. Second guiding frame 27. Test pin. Detailed implementation manners

[0021] The following further describes the present invention in conjunction with specific embodiments and the accompanying drawings to facilitate understanding of the content of the present invention.

[0022] As Figures 1-7As shown in the figures, they are respectively the perspective view and side view when the manual tester of a dual-socket test chip applicable to full automation provided by the present invention is opened, and the perspective view, top view, side view, side view exploded view and perspective exploded view during testing. The manual tester of the dual-socket test chip applicable to full automation includes an upper socket 1 and a lower socket 16. The upper socket 1 is movably connected to the lower socket 16 through a rotating shaft 15. The upper socket 1 includes an upper socket housing 2 and an upper test component arranged inside the upper socket housing 2. At the top of the upper socket housing 2, there are a reset block 3 and a first ejector pin 4 for correcting the orientation of the manual tester. The lower socket 16 includes a lower socket housing 17 and a lower test component arranged inside the lower socket housing 17. A handle 19 is movably connected to the front side of the lower socket housing 17. A second ejector pin 20 is arranged on the handle 19. There is a groove 5 on the upper socket housing 2 that fits with the handle 19. When the air cylinder abuts against the second ejector pin 20 on the handle 19, the handle 19 disengages from the groove 5 on the upper socket housing 2, and the upper socket 1 rotates around the rotating shaft 15 to open the manual tester. The upper test component includes a first guide frame 10, test pins 27, a test pin baffle and a first circuit board 12. The first guide frame 10 and the test pin baffle are installed on the first circuit board 12. Test pins 27 are arranged in the test area of the test pin baffle. By the air cylinder abutting against the first ejector pin 4, the upper socket 1 makes a closing movement around the rotating shaft 15 towards the lower socket 16. The lower test component includes a second circuit board 18, a second guide frame 26, a metal block 11 and a sealing ring 9. The second guide frame 26 and the metal block 11 are installed on the second circuit board 18. The sealing ring 9 is adhesively embedded inside the second guide frame 26. The metal block 11 is arranged inside the sealing ring 9. Preferably, the handle 19 is connected to the lower socket housing 17 through a positioning pin two 23 and a second spring 25.

[0023] On both sides of the lower socket housing 17, there are side clamps 21 movably connected. The side clamps 21 can perform opening and closing movements on both sides of the lower socket housing 17. The side clamps 21 are movably connected to the side clamp mounting grooves on both sides of the lower socket housing 17 through positioning pins 22 and first springs 24. The test probe baffle is composed of an upper test probe baffle 7 and a lower test probe baffle 8. During testing, the test area of the test probe baffle contacts the chip to be tested on the metal block 11, and the same type of test probe 27 is used for testing. At the rear end of the lower socket housing 17, there is a hinge block 13 fixedly connected. The hinge block 13 is provided with a shaft hole matching the rotating shaft 15, and both ends of the rotating shaft 15 are fixedly connected to the shaft hole. The hinge block 13 is provided with a spring groove 6 for controlling the opening and closing between the upper socket 1 and the lower socket 16. Inside the upper socket housing 2, there is a bearing 14. The rotating shaft 15 is closely fitted and movably connected with the bearing 14, so that the upper socket 1 can rotate around the rotating shaft 15. There are limit points outside the hinge block 13. After the hinge block 13, the rotating shaft 15 and the upper socket housing 2 are matched, the rotating shaft 15 is closely fitted with the bearing 14 and reaches the limit point of the hinge block 13 when the upper socket 1 is fully opened, so that the upper socket 1 abuts against the hinge block 13 and stops at the abutting surface position. Both the first circuit board 12 and the second circuit board 18 are ceramic circuit boards with copper injection inside. The overall socket can be replaced according to the model of the chip to be tested.

[0024] The working principle of the present invention is as follows: During testing, the chip to be tested is placed on the metal block 11 of the lower socket 16, and vacuum is pumped through the small holes at the bottom of the lower socket 16 to suck and fix the chip. At this time, the upper surface of the chip to be tested contacts the test probe 27 of the upper socket 1, and the bottom of the socket stops sucking vacuum and changes to blowing high-pressure air to prevent damage to the chip or equipment caused by high-voltage arcing during testing. The lower surface of the chip to be tested contacts the metal block 11 of the lower socket 16, and both the upper and lower sides of the chip under test are conducted for testing. The present invention is used in the scenario of testing chips by cylinder operation. When the hand tester is closed, the upper socket 1 and the lower socket 16 are connected and conducted for the chip. Since the circuit boards in the two sockets are different, two different sets of test data can be obtained.

[0025] The present invention can simultaneously test the conduction of the first circuit board 12 and the second circuit board 18 by providing two sockets, namely the upper socket 1 and the lower socket 16. Two test results can be obtained with one action, which not only improves the test efficiency but also avoids frequent movement of the chip and prevents the chip from being damaged. Through the cooperative connection among the guiding frame, the sealing ring 9 and the metal block 11, the conduction and detection speed of the dual-socket circuit board for the chip to be tested can be improved. The present invention realizes the precise positioning and sealed test of the chip to be tested through the first guiding frame 10 and the second guiding frame 26, and realizes the repeated switching of the hand tester by pushing the first ejector pin 4 and the second ejector pin 20 by the air cylinder, thereby improving the product safety. The present invention injects copper into the ceramic substrates of the first circuit board 12 and the second circuit board 18, which not only realizes the conduction of each layer in contact but also enables the stacking of different-shaped height differences, improves the heat dissipation problem of the original circuit board and the monotony problem of only planar design, and can better cooperate with chips of different thicknesses to be tested in terms of compatibility.

[0026] Specific examples are used in this article to elaborate on the inventive concept in detail. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for those of ordinary skill in the art of this technology, any obvious modification, equivalent replacement or other improvement made without departing from the inventive concept should be included in the protection scope of the present invention.

Claims

1. A manual tester for a dual-socket test chip suitable for full automation, characterized in that, It includes an upper socket and a lower socket. The upper socket is movably connected to the lower socket through a rotating shaft. The upper socket includes an upper socket housing and an upper test component disposed inside the upper socket housing. A first ejector pin is provided at the top of the upper socket housing. The lower socket includes a lower socket housing and a lower test component disposed inside the lower socket housing. A handle is movably connected to the front side of the lower socket housing. A second ejector pin is provided on the handle. A groove for fitting the handle is provided on the upper socket housing. When the air cylinder abuts against the second ejector pin on the handle, the handle disengages from the groove on the upper socket housing, and the upper socket rotates around the rotating shaft to open the hand tester. The upper test component includes a first guide frame, test pins, a test pin baffle, and a first circuit board. The first guide frame and the test pin baffle are mounted on the first circuit board. Test pins are provided in the test area of the test pin baffle. By the air cylinder abutting against the first ejector pin, the upper socket makes a closing movement around the rotating shaft towards the lower socket. The lower test component includes a second circuit board, a second guide frame, a metal block, and a sealing ring. The second guide frame and the metal block are mounted on the second circuit board. The sealing ring is adhesively bonded in the second guide frame in an embedded manner. The metal block is provided inside the sealing ring. During testing, the chip to be tested is placed on the metal block of the lower socket, and vacuum is pumped through the small holes at the bottom of the lower socket to suck and fix the chip for positioning. At this time, the upper surface of the chip to be tested contacts the test pins of the upper socket, and the vacuum suction at the bottom of the socket stops and is changed to blow out high-pressure air to prevent damage to the chip or equipment caused by high-voltage arcing during testing. The lower surface of the chip to be tested contacts the metal block of the lower socket, and both the upper and lower sides of the chip under test are electrically connected for testing.

2. The manual tester for a dual-socket test chip applicable to full automation according to claim 1, characterized in that, The handle is connected to the lower socket housing through a positioning pin two and a second spring.

3. The manual tester for a dual-socket test chip applicable to full automation according to claim 2, wherein Side clamps are movably connected to both sides of the lower socket housing. The side clamps can make opening and closing movements on both sides of the lower socket housing. The side clamps are movably connected to the side clamp mounting grooves on both sides of the lower socket housing through a positioning pin one and a first spring.

4. The manual tester for a dual socket test chip applicable to full automation according to claim 3, wherein A reset block for correcting the orientation of the hand tester is provided at the top of the upper socket housing.

5. The manual tester for a dual-socket test chip applicable to full automation according to claim 4, characterized in that, The test pin baffle is composed of an upper test pin baffle and a lower test pin baffle. During testing, the test area of the test pin baffle contacts the chip to be tested on the metal block, and the same type of test pins are used for testing.

6. The manual tester for a dual socket test chip applicable to full automation according to claim 5, characterized in that, A hinge block is fixedly connected to the rear end of the lower socket housing. A shaft hole matching the rotating shaft is provided on the hinge block. Both ends of the rotating shaft are fixedly connected in the shaft hole. A spring groove is provided on the hinge block for controlling the opening and closing between the upper socket and the lower socket.

7. A manual tester for a dual-socket test chip applicable to full automation according to claim 6, characterized in that, A bearing is provided inside the upper socket housing. The rotating shaft is in close fit and movably connected with the bearing, enabling the upper socket to rotate around the rotating shaft.

8. A manual tester for a dual socket test chip applicable to full automation, characterized in that Limit points are provided outside the hinge block. After the hinge block, the rotating shaft and the upper socket housing are fitted, the rotating shaft is in close fit with the bearing and reaches the limit points of the hinge block when the upper socket is fully opened, causing the upper socket to abut against the hinge block and stop at the abutting surface position.

9. A manual tester for a dual-socket test chip applicable to full automation according to claim 8, characterized in that, Both the first circuit board and the second circuit board are ceramic circuit boards with copper injection inside.

10. A manual tester for a dual socket test chip applicable to full automation according to claim 9, characterized in that, The overall socket can be replaced according to the model of the chip to be tested.

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