Micro-display module, manufacturing method thereof and display device

Abstract

The invention discloses a micro-display module, a manufacturing method thereof and a display device, and relates to the technical field of micro-display, the micro-display module comprises a light-emitting plate, a driving backboard, a circuit control board and a vertical conductive structure; the driving back plate is arranged on one side of the light-emitting plate and electrically connected with the light-emitting plate, and a first through hole with the two sides penetrating through is formed in the surface of the driving back plate; the circuit control board is arranged on the side, away from the light-emitting board, of the driving backboard. The vertical conductive structure is embedded in the first through hole, at least one end of the vertical conductive structure partially protrudes out of the edge of the first through hole, and the vertical conductive structure is electrically connected with the driving backboard; the driving backboard is electrically connected with the light-emitting board and the circuit control board through the vertical conductive structure. According to the micro display module provided by the invention, the vertical conductive structure is integrated in the driving backboard, so that the occupied space is small, the problem that the size of the existing micro display module is large is solved, and the design requirement of miniaturization is met.

Description

Technical Field

[0001] The present invention relates to the field of micro-display technology, and in particular to a micro-display module and a manufacturing method thereof, and a display device. Background Art

[0002] The micro display module includes Micro LED, a driving backplane and a circuit control board. Due to the advantages of high resolution, high brightness and low power consumption, the micro display module is widely used in near-eye display devices such as AR / VR. The driving backplane in the micro display module is integrated with a driving control circuit, which is used to realize the driving control of the Micro LED display panel. Therefore, when packaging the micro display module, the driving backplane needs to be electrically connected to the Micro LED and the circuit control board.

[0003] In the prior art, pads are usually set on the driving backplane and the circuit control board respectively, and the driving backplane and the circuit control board are electrically connected by gold wire binding. Since the gold wire connection structure occupies a large space inside the module, the micro display module is large in size, which is not conducive to achieving miniaturization design requirements. Summary of the invention

[0004] The main purpose of the present invention is to provide a micro display module and a manufacturing method thereof, and a display device, in order to solve the problem that the existing micro display module is large in size.

[0005] To achieve the above object, the present invention provides a micro display module, which includes: Light-emitting panels; A driving backplane, which is disposed on one side of the light-emitting board and is electrically connected to the light-emitting board, and a first through hole penetrating on both sides is opened on the surface of the driving backplane; A circuit control board, the circuit control board is arranged on a side of the driving backplane away from the light-emitting board; and A vertical conductive structure, wherein the vertical conductive structure is embedded in the first through hole, and at least one end of the vertical conductive structure protrudes from an edge of the first through hole, and the vertical conductive structure is electrically connected to the driving backplane; The driving backplane is electrically connected to the light-emitting panel and the circuit control panel respectively through the vertical conductive structure.

[0006] In one embodiment of the present invention, the vertical conductive structure includes a first conductive portion and a second conductive portion connected to each other; The first conductive part is arranged in the first through hole, and one end of the second conductive part away from the first conductive part protrudes from the edge of the first through hole toward the circuit control board and is electrically connected to the circuit control board. The cross-sectional dimension of the second conductive part is larger than the cross-sectional dimension of the first conductive part.

[0007] In an embodiment of the present invention, a projection of the first conductive portion toward the surface of the driving backplane is located within a projection area of the second conductive portion toward the surface of the driving backplane.

[0008] In one embodiment of the present invention, the vertical conductive structure also includes a third conductive part, which is located on the side of the first conductive part away from the second conductive part and is electrically connected to the first conductive part. An end of the third conductive part away from the first conductive part protrudes from the first through hole toward the edge of the light-emitting board and is electrically connected to the light-emitting board.

[0009] In an embodiment of the present invention, a projection of the first conductive portion on the surface of the driving backplane is located within a projection area of the third conductive portion toward the surface of the driving backplane.

[0010] In one embodiment of the present invention, the first through hole penetrates the driving back plate in a direction perpendicular to the surface of the driving back plate; Or, the first through hole includes a first through groove, a second through groove and a third through groove which are connected in sequence, the first through groove and the third through groove are respectively located on two side surfaces of the driving back plate parallel to the light-emitting board, the second through groove is located on the end surface of the driving back plate perpendicular to the light-emitting board, and the vertical conductive structure is adapted to the first through hole.

[0011] In one embodiment of the present invention, the micro display module further comprises a functional chip and a substrate, the functional chip and the substrate are both arranged between the driving backplane and the circuit control board, and the vertical conductive structure is provided with at least two; The substrate is provided with a mounting groove, the functional chip is installed in the mounting groove and is electrically connected to the substrate, the surface of the substrate is provided with a second through hole with two sides passing through, at least one vertical conductive structure is provided in the first through hole, and one vertical conductive structure is provided in the second through hole, and the substrate is electrically connected to the driving backplane and the circuit control board respectively through the vertical conductive structures.

[0012] In one embodiment of the present invention, the two surfaces of the substrate facing the driving backplane and the circuit control board are respectively provided with a first wire layer and a second wire layer; The first conductive line layer is electrically connected to the vertical conductive structure in the first through hole, the vertical conductive structure in the second through hole, and the functional chip respectively; The second conductive line layer is electrically connected to the vertical conductive structure in the second through hole and the circuit control board respectively.

[0013] In one embodiment of the present invention, the micro display module further comprises a functional chip and a substrate, and the vertical conductive structure is provided in plurality; Both the functional chip and the substrate are disposed between the driving backplane and the circuit control board. The functional chip is disposed on one side of the substrate facing the driving backplane. A second through hole penetrating both sides is formed on the surface of the substrate, and a third through hole penetrating both sides is formed on the surface of the functional chip. At least one vertical conductive structure is disposed in the first through hole, one vertical conductive structure is disposed in the second through hole, and one vertical conductive structure is disposed in the third through hole; The functional chip and the driving backplane are electrically connected through the vertical conductive structure. The functional chip and the substrate are electrically connected through the vertical conductive structure. The substrate is electrically connected to the circuit control board through the vertical conductive structure.

[0014] In an embodiment of the present invention, a third wire layer is disposed on one side of the substrate facing the functional chip. The vertical conductive structure of the functional chip is electrically connected to the substrate through the third wire layer.

[0015] The present invention also provides a method for manufacturing a microdisplay module. The manufacturing method includes: Forming a first deposition groove on one side surface of the driving backplane; Depositing a metal material in the first deposition groove to form a first conductive portion; Forming a second deposition groove on the other side surface of the driving backplane, and the first conductive portion is exposed in the second deposition groove; Depositing a metal material in the second deposition groove to form a second conductive portion partially protruding from the other side surface of the driving backplane; Encapsulating the circuit control board on one side of the driving backplane and electrically connecting it to the second conductive portion.

[0016] In an embodiment of the present invention, after the step of depositing a metal material in the first deposition groove to form a first conductive portion and before the step of forming a second deposition groove on the other side surface of the driving backplane, the method further includes: Encapsulating the light-emitting panel on one side of the driving backplane and electrically connecting it to the first conductive portion.

[0017] In an embodiment of the present invention, after the step of forming a first deposition groove on one side surface of the driving backplane and before the step of depositing a metal material in the first deposition groove to form a first conductive portion, the method further includes: Depositing an insulating material in the first deposition groove to form a first insulating layer; Depositing a metal material on the surface of the first insulating layer to form a first conductive portion.

[0018] In one embodiment of the present invention, after the step of opening a second deposition groove on the other side of the driving back plate, before the step of depositing a metal material in the second deposition groove to form a second conductive portion partially protruding from the other side of the driving back plate, the step further includes: Depositing an insulating material in the second deposition tank to form a second insulating layer; The second insulating layer covering the surface of the first conductive portion is etched and removed.

[0019] In one embodiment of the present invention, the step of depositing a metal material in the second deposition tank to form a second conductive portion partially protruding from the other side surface of the driving back plate includes: Depositing metal material in the second deposition tank and on the other side of the driving back plate to form a conductive layer; The conductive layer located at the outer periphery of the second deposition groove is etched and removed to form the second conductive portion partially protruding from the second deposition groove.

[0020] The present invention further provides a display device, comprising any one of the micro display modules described above.

[0021] The present invention proposes a micro display module, which includes a light-emitting panel, a driving backplane, a circuit control board and a vertical conductive structure, wherein the driving backplane is arranged on one side of the light-emitting panel, and the circuit control board is arranged on the side of the driving backplane away from the light-emitting panel. A first through hole is provided on the surface of the driving backplane, and the vertical conductive structure is arranged in the first through hole and partially protrudes from the outside of the first through hole. For example, one end of the vertical conductive structure can protrude from the surface of the driving backplane, or both ends can protrude from the surface of the driving backplane. The vertical conductive structure is electrically connected to the metal routing inside the driving backplane, and at the same time, the two ends of the vertical conductive structure are electrically connected to the light-emitting panel and the circuit control board respectively, so as to achieve the purpose of electrical connection between the driving backplane and the light-emitting panel and the circuit control board. Since the driving backplane and the circuit control board of the micro display module of the present application do not need to be electrically connected by gold wire binding, the space of the micro display module occupied by the gold wire connection structure is reduced. At the same time, the space occupied by the vertical conductive structure itself is small, and it is arranged inside the driving backplane, and only partially protrudes from the surface of the driving backplane, so the problem of large volume of the existing micro display module is solved, and the design requirements of miniaturization are met. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1 Schematic structural diagram of an embodiment of the microdisplay module provided by the present invention; Figure 2 Schematic structural diagram of another embodiment of the microdisplay module provided by the present invention; Figure 3 For Figure 2 Exploded view of the microdisplay module; Figure 4 Schematic structural diagram of another embodiment of the microdisplay module provided by the present invention; Figure 5 For Figure 4 Exploded view of the microdisplay module; Figure 6 Schematic structural diagram of the manufacturing process of the first conductive part on the surface of the driving backplane; Figure 7 Schematic structural diagram of the manufacturing process of the second conductive part on the surface of the driving backplane; Figure 8 Schematic structural diagram of another embodiment of forming a vertical conductive structure on the driving backplane; Figure 9 Schematic structural diagram of another embodiment of forming a vertical conductive structure on the driving backplane; Figure 10 Schematic structural diagram of yet another embodiment of forming a vertical conductive structure on the driving backplane; Figure 11 Flowchart of the steps of the manufacturing method of the microdisplay module proposed by the present invention; Figure 12 For Figure 11 Flowchart after the step of depositing a metal material in the first deposition tank to form the first conductive part and before the step of opening a second deposition tank on the other side of the driving backplane in Figure 13 For Figure 11 Flowchart after the step of opening a first deposition tank on one side of the driving backplane and before the step of depositing a metal material in the first deposition tank to form the first conductive part; Figure 14 For Figure 11 Flowchart after the step of opening a second deposition tank on the other side of the driving backplane and before the step of depositing a metal material in the second deposition tank to form the second conductive part; Figure 15 For Figure 11 The flowchart in the step of depositing a metal material in the second deposition tank to form a second conductive part partially protruding from the other side of the driving backplane.

[0024] Explanation of the reference numerals in the drawings: 10. Driving backplane; 11. First deposition tank; 12. First insulating layer; 13. Second deposition tank; 14. Second insulating layer; 20. Light-emitting panel; 30. Circuit control board; 31. Pad; 40. Vertical conductive structure; 41. First conductive part; 42. Second conductive part; 43. Third conductive part; 44. Conductive block; 45. Insulating dielectric layer; 50. Substrate; 60. Functional chip; 70. Heat sink; 81. First wire layer; 82. Second wire layer; 83. Third wire layer; 90. Encapsulation layer.

[0025] The realization of the object of the present invention, functional features and advantages will be further described in conjunction with the embodiments and with reference to the drawings. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0027] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions such as "first" and "second" in the embodiments of the present invention, the descriptions of "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution that satisfies both A and B at the same time. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] The invention provides a micro display module.

[0030] Combination Figure 1 As shown, in one embodiment of the present invention, the micro display module includes a light-emitting panel 20, a driving backplane 10, a circuit control board 30 and a vertical conductive structure 40; the driving backplane 10 is arranged on one side of the light-emitting panel 20 and is electrically connected to the light-emitting panel 20, and a first through hole is opened on the surface of the driving backplane 10 and penetrates on both sides; the circuit control board 30 is arranged on the side of the driving backplane 10 away from the light-emitting panel 20; the vertical conductive structure 40 is embedded in the first through hole, and at least one end portion protrudes from the edge of the first through hole, and the vertical conductive structure 40 is electrically connected to the driving backplane 10; the driving backplane 10 is electrically connected to the light-emitting panel 20 and the circuit control board 30 respectively through the vertical conductive structure 40.

[0031] In this embodiment, the light-emitting panel 20 can be a display panel such as Micro LED, OLED, etc., and a control unit is provided inside the driving backplane 10, and the control unit can drive LED pixels to realize display control of the display panel. The circuit control board 30 can be a flexible circuit board, one end of which is connected to the driving backplane 10, and the other end is provided with a connector for connecting to a power supply.

[0032] The first through hole penetrates the driving back plate 10 along the thickness direction of the driving back plate 10. The first through hole can be a cylindrical shape, a rectangular shape, or other shapes with a constant inner diameter; it can also be a structure with a T-shaped, L-shaped, or Z-shaped cross section. It can be understood that the vertical conductive structure 40 is embedded in the first through hole, and the shape of the vertical conductive structure 40 is adapted to the shape of the first through hole, that is, the shape of the vertical conductive structure 40 can also be the shape of the above-mentioned first through hole. The vertical conductive structure 40 can be a metal conductive structure such as copper and tungsten, and is formed in the first through hole through deposition, electroplating, and other processes. The vertical conductive structure 40 is electrically connected to the metal wiring layer or electronic components inside the driving back plate 10. The two ends of the vertical conductive structure 40 are electrically connected to the pads 31 on the surface of the light-emitting panel 20 and the circuit control board 30, respectively, to achieve electrical connection between the driving back plate 10 and the light-emitting panel 20 and the flexible circuit board. Specifically, the vertical conductive structure 40 can be electrically connected to the light-emitting board 20 and the circuit control board 30 by anisotropic conductive film (ACF) bonding connection or metal bump bonding connection.

[0033] Furthermore, part of the vertical conductive structure 40 protrudes outside the first through-hole, that is, protrudes from the surface of the driving backplane 10. For example, the vertical conductive structure 40 can protrude from the surface of the driving backplane 10 facing the circuit control board 30, or can protrude from the surface of the driving backplane 10 facing the light-emitting board 20. Alternatively, both ends of the vertical conductive structure 40 protrude from both side surfaces of the driving backplane 10. This design of protruding from the surface of the driving backplane 10 enables the driving backplane 10 to be directly bonded to the pads 31 on the surface of the light-emitting board 20 and / or the circuit control board 30 by ultrasonic or thermocompression bonding without setting conductive solder (solder balls, gold balls, conductive adhesives), thus reducing the packaging process and packaging consumables of the microdisplay module. At the same time, the vertical conductive structure 40 protruding from the surface of the driving backplane 10 also improves the reliability and process feasibility of the bonding connection between the driving backplane 10 and the light-emitting board 20 and / or the circuit control board 30, facilitating bonding and packaging.

[0034] In addition, since the microdisplay module has a display area and a non-display area, the vertical conductive structure 40 on the driving backplane 10 is correspondingly arranged at the position of the non-display area to avoid affecting the aperture ratio of the display panel. To improve the heat dissipation efficiency of the microdisplay module, a heat dissipation plate 70 can also be provided. The driving backplane 10 is arranged on the heat dissipation plate 70 and encapsulated by heat-conducting materials such as heat-conducting silver paste, heat-conducting silicone grease, and heat-conducting silica gel. The heat dissipation plate 70 can be arranged at one end of the circuit control board 30. The end face of the heat dissipation plate 70 is in contact with or spaced from the end face of the circuit control board 30. Alternatively, a groove can be opened at one end of the heat dissipation plate 70, and one end of the circuit control board 30 is arranged in the groove, so that the heat dissipation plate 70 plays a role in heat dissipation and support for the circuit control board 30. A packaging layer 90 is also provided on the side of the light-emitting board 20 facing away from the driving backplane 10, which can be glass, optical glue, or an inorganic thin film prepared by atomic layer deposition (ALD) (such as transparent inorganic oxide materials such as SiO2, Al2O3, and Si3N4).

[0035] Since there is no need to electrically connect the driving backplane 10 and the circuit control board 30 of the microdisplay module of the present application by using a gold wire bonding method, the space of the microdisplay module occupied by the gold wire connection structure is reduced. At the same time, the space occupied by the vertical conductive structure 40 itself is small, and the vertical conductive structure 40 is arranged inside the driving backplane 10, only partially protruding from the surface of the driving backplane 10. Therefore, the problem of the large volume of the existing microdisplay module is solved, meeting the design requirements of miniaturization. At the same time, the circuit transmission path is shortened, the signal transmission speed is increased, and the power consumption is reduced.

[0036] In addition, the gold wire bonding connection structure not only causes the lateral dimension of the microdisplay module to increase, but also requires the use of a glue material to protect the gold wire. The height of the glue material is greater than the height of the gold wire, resulting in an uneven upper surface of the microdisplay module. An additional base needs to be assembled before the subsequent lens can be assembled, leading to an increase in the height of the overall optical engine system in the vertical direction. Therefore, the improvement solution of this application can also improve the surface flatness of the microdisplay module, reduce the composition cost and volume of the display device.

[0037] Combined with Figures 1 to 5 and Figure 7 As shown, in an embodiment of the present invention, the vertical conductive structure 40 includes a first conductive portion 41 and a second conductive portion 42 connected to each other; The first conductive portion 41 is disposed in the first through hole. One end of the second conductive portion 42 facing away from the first conductive portion 41 protrudes from the edge of the first through hole toward the circuit control board 30 and is electrically connected to the circuit control board 30. The cross-sectional dimension of the second conductive portion 42 is larger than the cross-sectional dimension of the first conductive portion 41.

[0038] In this embodiment, the pad accuracy on the surface of the light-emitting board 20 is higher than the pad 31 accuracy on the surface of the circuit control board 30. At the same time, in order to ensure that the display panel has a smaller non-display area, the pad size on the surface of the light-emitting board 20 is relatively small. The packaging accuracy requirement between the light-emitting board 20 and the driving backplane 10 is higher than the packaging accuracy between the driving backplane 10 and the circuit control board 30. Therefore, the cross-sectional dimension of the second conductive portion 42 is set to be larger than the cross-sectional dimension of the first conductive portion 41. The first conductive portion 41 has a smaller size and is adapted to the pad of the light-emitting board 20 to prevent the first conductive portion 41 from short-circuiting with other pads or components on the light-emitting board 20; the second conductive portion 42 has a larger size and is adapted to the pad 31 of the circuit control board 30 to increase the contact area between the second conductive portion 42 and the pad 31 of the circuit control board 30, thereby improving the packaging reliability and processing convenience. Of course, the shape of the first through hole is adapted to the vertical conductive structure 40 and also includes two sub-through holes with different cross-sectional dimensions.

[0039] In addition, in this embodiment, the second conductive portion 42 is electrically connected to the circuit control board 30. The second conductive portion 42 protruding from the surface of the driving backplane 10 can improve the convenience and reliability during the bonding connection; the first conductive portion 41 is electrically connected to the light-emitting board 20 to prevent the protruding first conductive portion 41 from affecting the flatness of the light-emitting board 20, thereby ensuring the display effect of the microdisplay module.

[0040] Combined with Figures 1 to 5 and Figure 7As shown, in an embodiment of the present invention, the projection of the first conductive part 41 on the surface of the driving backplane 10 is located within the projection area of the second conductive part 42 on the surface of the driving backplane 10, so that the first conductive part 41 and the second conductive part 42 have a relatively large contact area, thereby improving the connection reliability between the first conductive part 41 and the second conductive part 42 and reducing the occurrence of problems such as wire breakage and open circuit.

[0041] In other embodiments, the projection of the first conductive part 41 on the surface of the driving backplane 10 may also partially overlap with the projection of the second conductive part 42 on the surface of the driving backplane 10.

[0042] Combined with Figure 8 As shown, in an embodiment of the present invention, the vertical conductive structure 40 further includes a third conductive part 43. The third conductive part 43 is located on the side of the first conductive part 41 away from the second conductive part 42 and is electrically connected to the first conductive part 41. One end of the third conductive part 43 away from the first conductive part 41 protrudes from the edge of the first through hole toward the light-emitting panel 20 and is electrically connected to the light-emitting panel 20.

[0043] In this embodiment, by providing the third conductive part 43 and electrically connecting the third conductive part 43 to the pad of the light-emitting panel 20, the shape and size of the third conductive part 43 can be designed according to the pad of the light-emitting panel 20, thereby improving the convenience of the bonding connection between the driving backplane 10 and the light-emitting panel 20. In addition, due to the provision of the third conductive part 43, the first conductive part 41 then plays the role of electrically connecting the second conductive part 42 and the third conductive part 43, and the shape and size of the first conductive part 41 have higher flexibility. For example, the cross-sectional dimension of the first conductive part 41 can be designed to be smaller, and the thickness of the first conductive part 41 can be designed to be greater than the thickness of the first conductive part 41 and the second conductive part 42, so as to shorten the deposition or coating forming time of the vertical conductive structure 40.

[0044] It can be understood that the protrusion of the third conductive part 43 from the surface of the driving backplane 10 can also improve the bonding connection reliability between the driving backplane 10 and the light-emitting panel 20. Considering the flatness of the light-emitting panel 20, the height of the third conductive part 43 protruding from the driving backplane 10 can be designed to be less than the height of the second conductive part 42 protruding from the driving backplane 10. Of course, in other embodiments, the third conductive part 43 can also be provided flush with the surface of the driving backplane 10.

[0045] Combined with Figure 8As shown, in an embodiment of the present invention, the projection of the first conductive portion 41 on the surface of the driving backplane 10 is located within the projection area of the third conductive portion 43 facing the surface of the driving backplane 10, so that the first conductive portion 41 and the third conductive portion 43 have a relatively large contact area, thereby improving the connection reliability between the first conductive portion 41 and the third conductive portion 43 and reducing the occurrence of problems such as wire breakage and open circuit.

[0046] In addition, in order to improve the forming efficiency of the vertical conductive structure 40, the first conductive portion 41 can be set to have a cross-sectional dimension smaller than that of the third conductive portion 43. The relatively small cross-sectional dimension of the first conductive portion 41 can shorten the deposition time of the vertical conductive structure 40, and at the same time, the third conductive portion 43 has a sufficient contact area with the pad of the light-emitting panel 20, thereby improving the reliability of the bonding connection.

[0047] Combined with Figure 9 As shown, in an embodiment of the present invention, the vertical conductive structure 40 includes a first conductive portion 41 and a second conductive portion 42 that are vertically connected. The light-emitting panel 20 is located in the driving pixel circuit area of the driving backplane 10, and the vertical conductive structure 40 is located in the non-display area. The light-emitting panel 20 is bonded and electrically connected to the pad on the surface of the driving backplane 10 through the bonding pad at the bottom. A plurality of wiring layers are provided inside the driving backplane 10, and the driving circuit and each internal functional module are connected through the wiring layers and led out through the pads on the surface of the driving backplane 10. Therefore, the light-emitting panel 20 can be electrically connected to the wires inside the driving backplane 10 through bonding, and then sequentially connected to the first conductive portion 41, the second conductive portion 42, and the circuit control board 30 through the wires to achieve the purpose of vertical interconnection of the micro-display module.

[0048] Furthermore, in this embodiment, the light-emitting panel 20 can be formed by cutting an epitaxial wafer into a plurality of light-emitting panel 20 chips, and finally the light-emitting panel 20 chips are bonded and connected to the driving backplane 10. Since the light-emitting panel 20 is processed separately, light-emitting panel 20 chips with good performance can be selected and bonded to the wafer of the driving backplane 10, avoiding the bonding of the defective light-emitting panel area during the bonding of wafers to the driving backplane 10 and wasting the driving backplane. At the same time, the size of the cut light-emitting panel 20 matches the pixel driving circuit area of the driving backplane, avoiding the waste of more light-emitting panels, thereby saving consumables and production costs.

[0049] Combined with Figure 1 and Figure 10 As shown, in an embodiment of the present invention, the first through hole penetrates the driving backplane 10 in a direction perpendicular to the surface of the driving backplane 10; Alternatively, the first through hole includes a first through groove, a second through groove, and a third through groove that are sequentially connected. The first through groove and the third through groove are respectively located on two side surfaces of the driving backplane 10 parallel to the light emitting panel 20, and the second through groove is located on an end surface of the driving backplane 10 perpendicular to the light emitting panel 20. The vertical conductive structure 40 is adapted to the first through hole.

[0050] In this embodiment, the first through hole penetrates the driving backplane 10 in a direction perpendicular to the surface of the driving backplane 10. This design method can improve the convenience of opening the first through hole, and at the same time improve the convenience of forming the vertical conductive structure 40 during coating and deposition in the first through hole. The circuit path of the vertical conductive structure 40 is shorter, which can reduce signal transmission loss and power consumption.

[0051] In another embodiment, as Figure 10 shown, the first through hole is designed to include a first through groove, a second through groove, and a third through groove. The three enclose to form a 'C'-shaped first through hole, and the first through hole is located at the outer edge of the driving backplane 10. Correspondingly, the vertical conductive structure 40 is also designed to be 'C'-shaped, where the first conductive portion 41 is located in the second through groove, and the second conductive portion 42 and the third conductive portion 43 are respectively located in the first through groove and the third through groove. This structural design enables the first through hole to avoid internal components or traces of the driving backplane 10, preventing the first through hole from damaging the lines of the driving backplane 10.

[0052] Of course, the above two embodiments are only two feasible design solutions provided based on the inventive concept of the present application. The positions and shapes of the first through hole and the vertical conductive structure are not limited to the above two.

[0053] Combined with Figure 2 and Figure 3 shown, in an embodiment of the present invention, the microdisplay module further includes a functional chip 60 and a substrate 50. The functional chip 60 and the substrate 50 are both disposed between the driving backplane 10 and the circuit control board 30, and at least two vertical conductive structures 40 are provided; The substrate 50 is provided with a mounting groove, the functional chip 60 is mounted in the mounting groove and electrically connected to the substrate 50. The surface of the substrate 50 is provided with a second through hole that penetrates both sides. At least one vertical conductive structure 40 is disposed in the first through hole, and one vertical conductive structure 40 is disposed in the second through hole. The substrate 50 is electrically connected to the driving backplane 10 and the circuit control board 30 through the vertical conductive structure 40 respectively.

[0054] The functional chip 60 can be a storage chip, a flash memory chip, a data chip, etc. Such chips have a certain volume. Usually, the functional chip 60 is arranged on the circuit control board 30 and electrically connected to the driving backplane 10 through the circuit control board 30 to realize functions such as data storage and data processing. In this embodiment, the functional chip 60 is arranged between the driving backplane 10 and the circuit control board 30, thereby reducing the structural volume occupied by the circuit control board 30. At the same time, the functional chip 60 is integrated on one side of the driving backplane 10, shortening the circuit transmission path, increasing the signal transmission speed, reducing power consumption, and improving the integration degree of the microdisplay module.

[0055] The substrate 50 functions to fixedly support the functional chip 60 and is electrically connected to the functional chip 60. The size of the installation groove formed on the surface of the substrate 50 is adapted to the functional chip 60. It can be understood that when there are multiple functional chips 60, the substrate 50 is correspondingly provided with multiple installation grooves, and each functional chip 60 is installed in an installation groove. Solder pads can be arranged on the substrate 50, and the functional chip 60 is directly electrically connected to the solder pads of the substrate 50. Alternatively, a wire layer can be arranged on the surface of the substrate 50, and the functional chip 60 is electrically connected to the substrate 50 through the wire layer.

[0056] A second through hole is formed on the surface of the substrate 50, and the vertical conductive structure 40 is arranged in the second through hole. The specific structures of the second through hole and the vertical conductive structure 40 can refer to the above description of the first through hole and the vertical conductive structure 40, and will not be further elaborated here. The vertical conductive structure 40 arranged in the first through hole can be vertically corresponding to the vertical conductive structure 40 arranged in the second through hole, so that the second conductive part 42 in the first through hole is directly bonded and connected to the second conductive part 42 in the second through hole to realize the electrical connection between the driving backplane 10 and the functional chip 60. Of course, the vertical conductive structure 40 arranged in the first through hole can also be arranged in a dislocation manner with the vertical conductive structure 40 arranged in the second through hole, and a wire layer is arranged between the substrate 50 and the driving backplane 10, and the vertical conductive structure 40 in the first through hole and the vertical conductive structure 40 in the second through hole are electrically connected through the wire layer.

[0057] Two, three, etc. second channels can also be formed on the surface of the substrate 50, and a vertical conductive structure 40 is arranged in each second channel. The number of the second channels and the vertical conductive structure 40 can be set according to the number of the functional chips 60 and the electrical connection lines. For example Figure 2 As shown, there are three functional chips 60 and installation grooves, and two second channels are formed and are respectively located between two adjacent installation grooves.

[0058] Combined Figure 2 and Figure 3As shown, in an embodiment of the present invention, a first wire layer 81 and a second wire layer 82 are respectively provided on two surfaces of the substrate 50 facing the driving backplane 10 and the circuit control board 30; The first wire layer 81 is electrically connected to the vertical conductive structure 40 in the first through hole, the vertical conductive structure 40 in the second through hole, and the functional chip 60 respectively; The second wire layer 82 is electrically connected to the vertical conductive structure 40 in the second through hole and the circuit control board 30 respectively.

[0059] In this embodiment, the first wire layer 81 and the second wire layer 82 can be made of materials such as copper and gold, and are formed by processes such as deposition, electroplating, and etching to achieve electrical connection in the horizontal direction. It can be understood that, as Figure 3 shown, the first wire layer 81 is formed on one side of the driving backplane 10 facing the substrate 50. At this time, the electrical connection between the first wire layer 81 and the second conductive part 42 can be realized through the electroplating process. Therefore, the second conductive part 42 can be set to be flush with the surface of the driving backplane 10 or slightly protrude from the surface of the driving backplane 10.

[0060] In order to realize the electrical connection between the first wire layer 81 and the functional chip 60 and the vertical conductive structure 40 in the second through hole, a conductive block 44 is formed by electroplating deposition on the surface of the functional chip 60. The conductive block 44 protrudes from the surface of the functional chip 60 and is flush with the second conductive part 42 of the vertical conductive structure 40 in the second through hole. At the same time, a plurality of conductive blocks 44 protruding from the surface of the first wire layer 81 are provided on the side of the first wire layer 81 facing the substrate 50. And the plurality of conductive blocks 44 on the surface of the first wire layer 81 respectively correspond to the conductive blocks 44 on the surface of the functional chip 60 and the second conductive part 42 in the second through hole, and are bonded to realize the electrical connection between the functional chip 60, the vertical conductive structure 40 in the second through hole and the first wire layer 81.

[0061] The setting of the conductive block 44 improves the reliability and convenience of the bonding connection between the functional chip 60 and the second wire layer 82, and between the vertical conductive structure 40 in the second through hole and the second wire layer 82. When packaging the driving backplane 10 and the substrate 50 installed with the functional chip 60, there is no need to set conductive solder on the surfaces of the driving backplane 10, the functional chip 60, and the substrate 50, which reduces the packaging process and packaging consumables, avoids the process errors caused by the offset of the solder joint position and the solder volume error when applying the conductive solder, and improves the overall packaging accuracy and packaging reliability.

[0062] In this embodiment, by providing a first wire layer 81 and a second wire layer 82, the electrical connection in the horizontal direction of the driving backplane 10, the functional chip 60, and the substrate 50 can be realized, which can improve the convenience of the layout of structures such as the first through-hole, the second through-hole, and each vertical conductive structure 40, as well as the convenience of the electrical connection between the driving backplane 10 and the functional chip 60 and the substrate 50.

[0063] Combined Figure 4 with Figure 5 As shown, in an embodiment of the present invention, the microdisplay module further includes a functional chip 60 and a substrate 50, and a plurality of vertical conductive structures 40 are provided; Both the functional chip 60 and the substrate 50 are disposed between the driving backplane 10 and the circuit control board 30. The functional chip 60 is disposed on the side of the substrate 50 facing the driving backplane 10. The surface of the substrate 50 is provided with a second through-hole penetrating both sides, and the surface of the functional chip 60 is provided with a third through-hole penetrating both sides. At least one vertical conductive structure 40 is disposed in the first through-hole, one vertical conductive structure 40 is disposed in the second through-hole, and one vertical conductive structure 40 is disposed in the third through-hole; The functional chip 60 and the driving backplane 10 are electrically connected through the vertical conductive structure 40, the functional chip 60 and the substrate 50 are electrically connected through the vertical conductive structure 40, and the substrate 50 is electrically connected to the circuit control board 30 through the vertical conductive structure 40.

[0064] In this embodiment, the functional chip 60 is mounted on the surface of the substrate 50 and integrated between the driving backplane 10 and the circuit control board 30, and then the driving backplane 10 and the substrate 50 are electrically connected through the vertical conductive structure 40 in the third through-hole, which can also achieve the purpose of improving the module integration degree.

[0065] It can be understood that the third through-hole and the vertical conductive structure 40 disposed in the third through-hole can refer to the above relevant descriptions about the first through-hole, the second through-hole, and the vertical conductive structures 40 disposed in the first through-hole and the second through-hole, and will not be further elaborated here. Since the functional chip 60 is clamped between the driving backplane 10 and the substrate 50, the vertical conductive structure 40 disposed in the third through-hole includes a first conductive portion 41, a second conductive portion 42, and a third conductive portion 43. The second conductive portion 42 and the third conductive portion 43 respectively protrude from the surface of the driving backplane 10 and are respectively bonded to the vertical conductive structure in the second through-hole 40 and the vertical conductive structure 40 in the first through-hole, thereby realizing the electrical connection of the driving backplane 10, the functional chip 60, the substrate 50, and the circuit control board 30.

[0066] Further, when multiple functional chips 60 are provided, one vertical conductive structure 40 can be provided on each functional chip 60, or two or more vertical conductive structures 40 can be provided. Correspondingly, the driving backplane 10 is also provided with multiple vertical conductive structures 40. When multiple vertical conductive structures 40 are provided in the horizontal direction, an insulating dielectric layer 45 can be provided outside the through hole and between two adjacent vertical conductive structures 40. The material of the insulating dielectric layer 45 can be oxides (such as SiO2) and organic materials (such as PI glue), etc., to isolate the two vertical conductive structures 40. For example Figure 4 and Figure 5 As shown, insulating dielectric layers 45 are provided on the surface of the driving backplane 10 facing the functional chip 60, the surface of the functional chip 60 facing the driving backplane 10, and the surface of the functional chip 60 facing the substrate 50, and the bonded vertical conductive structures 40 are isolated, so as to achieve the effects of insulation and anti-static breakdown.

[0067] Combined with Figure 4 and Figure 5 As shown, in an embodiment of the present invention, a third wire layer 83 is provided on one side of the substrate 50 facing the functional chip 60, and the vertical conductive structure 40 of the functional chip 60 is electrically connected to the substrate 50 through the third wire layer 83.

[0068] In this embodiment, since the substrate 50 functions to carry and electrically connect the functional chip 60 to the circuit control board 30, a third wire layer 83 is provided on one side of the substrate 50 facing the functional chip 60, and the third wire layer 83 electrically connects the vertical conductive structures 40 provided on the functional chip 60. At this time, as Figure 5 shown, only one second through hole needs to be opened on the surface of the substrate 50, and the vertical conductive structure 40 is provided, and at the same time, both ends of the vertical conductive structure 40 are electrically connected to the third wire layer 83 and the pad 31 on the surface of the circuit control board 30 respectively, so as to realize the electrical connection between the functional chip 60 and the circuit control board 30. Therefore, the processing procedure of the substrate 50 is simplified.

[0069] Of course, in other embodiments, a third wire layer 83 can also be provided on one side of the substrate 50 facing the circuit control board 30, and is electrically connected to the vertical conductive structure 40 in the second through hole and the circuit control board 30 through the third wire layer 83.

[0070] It can be understood that by providing the vertical conductive structure 40 and the wire layer at different devices and different positions of the device, electrical interconnection in the vertical and horizontal directions is realized, the structural volume of the microdisplay module is reduced, the integration degree of the microdisplay module is improved, and it is convenient to be applied to miniaturized products, such as AR and VR devices, which can improve the user experience.

[0071] The present invention also provides a method for manufacturing a microdisplay module. For the specific structure and beneficial effects of the microdisplay module, please refer to the above embodiments, which will not be elaborated here one by one.

[0072] Combined with Figure 6 、 Figure 7 and Figure 11 As shown, in an embodiment of the present invention, the manufacturing method includes: S100: Open a first deposition groove 11 on one side surface of the driving backplane 10; S200: Deposit a metal material in the first deposition groove 11 to form a first conductive portion 41; S300: Open a second deposition groove 13 on the other side surface of the driving backplane 10, and the first conductive portion 41 is exposed in the second deposition groove 13; S400: Deposit a metal material in the second deposition groove 13 to form a second conductive portion 42 that partially protrudes from the other side surface of the driving backplane 10; S500: Package the circuit control board 30 on one side of the driving backplane 10 and electrically connect it to the second conductive portion 42.

[0073] In this embodiment, the first deposition groove 11 is etched in the driving backplane 10 through processes such as photolithography and etching, and then the first deposition groove 11 is filled with a metal material through processes such as electroplating and sputtering. At this time, the outer side of the first deposition groove 11, that is, the surface of the driving backplane 10, is also electroplated with a metal material. The metal material on the surface of the driving backplane 10 is removed by chemical mechanical polishing (CMP), and the first conductive portion 41 is formed in the first deposition groove 11. Further, before depositing the metal material, an insulating material is first deposited in the first deposition groove 11 to form an insulating layer, and then the metal material is deposited on the surface of the insulating layer to form the first conductive portion 41, thereby improving the insulation performance between the first conductive portion 41 and the driving backplane 10.

[0074] Flip the driving backplane 10, and on the other side of the driving backplane 10, open a second deposition groove 13 through processes such as photolithography and etching. The width of the second deposition groove 13 can be greater than, less than, or equal to the width of the first deposition groove 11. Then, fill the second deposition groove 13 with a metal material through processes such as electroplating and sputtering. At this time, the outer side of the second deposition groove 13, that is, the surface of the driving backplane 10, is also electroplated with a metal material. Remove the metal material outside the periphery of the second deposition groove 13 through a mask etching process, and form a second conductive portion 42 protruding from the surface of the driving backplane 10 within the second deposition groove 13. The materials of the second conductive portion 42 and the first conductive portion 41 can be the same metal material to improve the bonding strength between the first conductive portion 41 and the second conductive portion 42. Further, before depositing the metal material to form the second conductive portion 42, first deposit an insulating material in the second deposition groove 13 to form an insulating layer, and then deposit a metal material on the surface of the insulating layer to form the second conductive portion 42, thereby improving the insulation performance between the second conductive portion 42 and the driving backplane 10.

[0075] Through the above manufacturing method, a vertical conductive structure 40 including a first conductive portion 41 and a second conductive portion 42 is formed. Since the first conductive portion 41 and the second conductive portion 42 are formed by electroplating and sputtering processes, compared with the existing methods of bonding and adhering conductive materials, the first conductive portion 41 and the second conductive portion 42 in the vertical conductive structure 40 formed in this application have a higher bonding force, reducing the risk of open circuit. In addition, a part of the second conductive portion 42 is disposed within the first through hole, and the first through hole plays a role of laterally limiting and fixing the second conductive portion 42, improving the stability when the second conductive portion 42 is bonded and electrically connected to the circuit control board 30. At the same time, protruding the second conductive portion 42 from the surface of the driving backplane 10 can facilitate the bonding connection with the pad 31 of the circuit control board 30, eliminating the need to use conductive solder to electrically connect the two, reducing the packaging process and packaging consumables.

[0076] In addition, before opening the second deposition groove 13 on the other side surface of the driving backplane 10, the driving backplane 10 can be thinned to expose the first conductive portion 41 on the other side surface of the driving backplane 10 through processes such as mechanical cutting, CMP, wet etching, and dry etching, and then the second deposition groove 13 is fabricated. This step of thinning the driving backplane 10 can increase the heat dissipation efficiency of the microdisplay module in the direction perpendicular to the driving backplane 10 and reduce the packaging size at the same time.

[0077] Combined Figure 7 and Figure 12 As shown, in an embodiment of the present invention, after the step of depositing a metal material in the first deposition groove 11 to form the first conductive portion 41 and before the step of opening the second deposition groove 13 on the other side surface of the driving backplane 10, the following steps are further included: S210: Encapsulate the light-emitting panel 20 on one side of the driving backplane 10 and electrically connect it to the first conductive portion 41.

[0078] In this embodiment, since the tilt angle and offset of the light-emitting panel 20 will affect the final display effect of the display panel, the encapsulation accuracy requirements for the light-emitting panel 20 and the driving backplane 10 are relatively high. At the same time, the second conductive portion 42 protruding from the surface of the driving backplane 10 will affect the flatness of the driving backplane 10. Therefore, before fabricating the second deposition groove 13 and the second conductive portion 42, the light-emitting panel 20 is encapsulated on one side of the driving backplane 10, and the light-emitting panel 20 is electrically connected to the first conductive portion 41 to improve the display effect of the micro-display module.

[0079] Combined with Figure 6 and Figure 13 As shown, in an embodiment of the present invention, after the step of forming the first deposition groove 11 on one side surface of the driving backplane 10, before the step of depositing a metal material in the first deposition groove 11 to form the first conductive portion 41, it further includes: S110: Deposit an insulating material in the first deposition groove 11 to form the first insulating layer 12; S120: Deposit a metal material on the surface of the first insulating layer 12 to form the first conductive portion 41.

[0080] In this embodiment, the first insulating layer 12 is formed by a vapor deposition process. The material of the insulating layer can be SiO2, Al2O3, Si3N4, etc. The first insulating layer 12 plays an insulating and protective role for the first conductive portion 41, avoiding the problem of short circuit between the first conductive portion 41 and the substrate of the driving backplane 10, and improving the voltage withstand effect of the first conductive portion 41. It can be understood that when depositing the insulating material in the first deposition groove 11, an insulating layer will also be deposited on the outer surface of the driving backplane 10. Therefore, after the deposition is completed, it is also necessary to remove the insulating layer on the surface of the driving backplane 10 by etching to form the first insulating layer 12 on the inner wall surface of the first deposition groove 11.

[0081] Furthermore, a seed layer (not shown) is deposited on the surface of the first insulating layer 12, and then a metal material is deposited on the surface of the seed layer to form the first conductive portion 41. The material of the seed layer can be one or several of gold, silver, tin, copper, titanium, nickel, etc. The seed layer has a high bonding force with the first conductive portion 41, which can improve the stability of the first conductive portion 41 in the first deposition groove 11.

[0082] Combined with Figure 7 and Figure 14As shown, in an embodiment of the present invention, after the step of forming the second deposition groove 13 on the other side of the driving backplane 10, before the step of depositing a metal material in the second deposition groove 13 to form a second conductive part 42 that partially protrudes from the other side of the driving backplane 10, the following steps are further included: S310: Deposit an insulating material in the second deposition groove 13 to form a second insulating layer 14; S320: Etch and remove the second insulating layer 14 covering the surface of the first conductive part 41.

[0083] In this embodiment, the second insulating layer 14 is located between the second conductive part 42 and the substrate of the driving backplane 10, and also plays a role of insulation and protection. For specific details, reference can be made to the above description of the first insulating layer 12, and no further elaboration will be made here. Since the second conductive part 42 needs to be electrically connected to the first conductive part 41, after the insulating material is deposited in the second deposition groove 13, it is necessary to etch and remove the second insulating layer 14 covering the surface of the first conductive part 41 so that the first conductive part 41 is exposed at the bottom of the second deposition groove 13, and then the second conductive part 42 is deposited and formed. Further, a metal material is deposited on the surface of the second insulating layer 14 to form a seed layer (not shown), and then a metal material is deposited on the surface of the seed layer to form the second conductive part 42. The material of the seed layer can be one or several of gold, silver, tin, copper, titanium, nickel, etc. The seed layer has a high bonding force with the second conductive part 42, which can improve the stability of the second conductive part 42 in the second deposition groove 13.

[0084] Combined Figure 7 and Figure 15 As shown, in an embodiment of the present invention, in the step of depositing a metal material in the second deposition groove 13 to form a second conductive part 42 that partially protrudes from the other side of the driving backplane 10, the following steps are included: S410: Deposit a metal material in the second deposition groove 13 and on the other side of the driving backplane 10 to form a conductive layer; S420: Etch and remove the conductive layer located outside the second deposition groove 13 to form a second conductive part 42 that partially protrudes from the second deposition groove 13.

[0085] In this embodiment, a metal material is deposited on the other side of the deposition groove and the driving backplane 10 at the same time. After the deposition is completed, through a mask etching process, the conductive layer on the surface of the driving backplane 10 is removed, and thus the second conductive part 42 protruding from the second deposition groove 13 can be formed. In other embodiments, a mask plate can also be covered on the other side of the driving backplane 10, and then the metal material is deposited in the second deposition groove 13 to form the second conductive part 42.

[0086] In an embodiment of the present invention, after the step of fabricating the second conductive part 42 is completed, a third deposition groove is formed on the side of the driving backplane 10 away from the second conductive part 42, and at least a part of the first conductive part 41 is exposed in the third deposition groove. Then, a metal material is deposited in the third deposition groove to form a third conductive part 43 connecting the first conductive part 41.

[0087] The third conductive part 43 can be flush with the surface of the driving backplane 10 or partially protrude from the surface of the driving backplane 10. The cross-sectional size and shape of the third conductive part 43 are designed to be adapted to the pads of the light-emitting panel 20, thereby improving the process feasibility of connecting the driving backplane 10 and the light-emitting panel 20.

[0088] It can be understood that the vertical conductive structure 40 in the present application can also be disposed on the functional chip 60 and the substrate 50. Before the step of encapsulating the circuit control board 30 on one side of the driving backplane 10 and electrically connecting it to the second conductive part 42, the functional chip 60 and the substrate 50 are bonded and electrically connected through the vertical conductive structure 40, and then the functional chip 60 and the driving backplane 10 are bonded and electrically connected through the vertical conductive structure 40 to achieve the vertical interconnection of the driving backplane 10 with the driving chip and the substrate 50. Of course, it is also possible to first bond and electrically connect the functional chip 60 and the driving backplane 10 through the vertical conductive structure 40, and then bond and electrically connect the functional chip 60 and the substrate 50 through the vertical conductive structure 40. Finally, the substrate 50 and the circuit control board 30 are bonded and electrically connected. The manufacturing method of disposing the vertical conductive structure 40 on the functional chip 60 and the substrate 50 can refer to the above embodiments of disposing the vertical conductive structure 40 on the driving backplane 10, and will not be elaborated further here.

[0089] The present invention also provides a display device, which includes a micro-display module. The specific structure of the micro-display module refers to the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments of the micro-display module, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated one by one here.

[0090] The display device can be an AR / VR device, or an electronic device such as a smart watch or a mobile phone. Since the need for miniaturization of display devices is increasing, especially for near-eye display devices such as AR / VR, the miniaturized design can improve the wearing experience of users. Therefore, in the present application, by improving the micro-display module, the volume of the micro-display module is reduced, thereby reducing the volume of the display device and improving the wearing and using experience of the display device.

[0091] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A microdisplay module, characterized in that, The micro display module comprises: Light-emitting panels; A driving backplane, which is disposed on one side of the light-emitting panel and is electrically connected to the light-emitting panel, and a first through hole is provided on a surface of the driving backplane; A circuit control board, the circuit control board is arranged on a side of the driving backplane away from the light-emitting board; and A vertical conductive structure, wherein the vertical conductive structure is embedded in the first through hole, and at least one end of the vertical conductive structure protrudes from an edge of the first through hole, and the vertical conductive structure is electrically connected to the driving backplane; The driving backplane is electrically connected to the light-emitting panel and the circuit control panel respectively through the vertical conductive structure.

2. The microdisplay module according to claim 1, characterized in that, The vertical conductive structure includes a first conductive portion and a second conductive portion connected to each other; The first conductive part is arranged in the first through hole, the end of the second conductive part away from the first conductive part protrudes from the edge of the first through hole toward the circuit control board and is electrically connected to the circuit control board, and the cross-sectional dimension of the second conductive part is larger than the cross-sectional dimension of the first conductive part.

3. The microdisplay module according to claim 2, characterized in that, The projection of the first conductive portion toward the surface of the driving backplane is located within the projection area of the second conductive portion toward the surface of the driving backplane.

4. The microdisplay module according to claim 2, wherein The vertical conductive structure also includes a third conductive part, which is located on a side of the first conductive part away from the second conductive part and is electrically connected to the first conductive part. An end of the third conductive part away from the first conductive part protrudes from the first through hole toward the edge of the light-emitting board and is electrically connected to the light-emitting board.

5. The microdisplay module according to claim 4, wherein The projection of the first conductive portion on the surface of the driving backplane is located within the projection area of the third conductive portion toward the surface of the driving backplane.

6. The microdisplay module according to any one of claims 1 to 5, characterized in that, The first through hole penetrates the driving back plate in a direction perpendicular to the surface of the driving back plate; Or, the first through hole includes a first through groove, a second through groove and a third through groove which are connected in sequence, the first through groove and the third through groove are respectively located on two side surfaces of the driving back plate parallel to the light-emitting board, the second through groove is located on the end surface of the driving back plate perpendicular to the light-emitting board, and the vertical conductive structure is adapted to the first through hole.

7. The microdisplay module according to any one of claims 1 to 5, characterized in that The micro display module further includes a functional chip and a substrate, and the vertical conductive structure is provided with at least two; The functional chip and the substrate are both arranged between the driving backplane and the circuit control board. The substrate is provided with a mounting groove, and the functional chip is installed in the mounting groove and is electrically connected to the substrate. The surface of the substrate is provided with a second through hole with two sides passing through. At least one vertical conductive structure is arranged in the first through hole, and one vertical conductive structure is arranged in the second through hole. The substrate is electrically connected to the driving backplane and the circuit control board respectively through the vertical conductive structures.

8. The microdisplay module according to claim 7, wherein, The two surfaces of the substrate facing the driving backplane and the circuit control board are respectively provided with a first wire layer and a second wire layer; The first conductive line layer is electrically connected to the vertical conductive structure in the first through hole, the vertical conductive structure in the second through hole, and the functional chip respectively; The second conductive line layer is electrically connected to the vertical conductive structure in the second through hole and the circuit control board respectively.

9. The microdisplay module according to any one of claims 1 to 5, characterized in that, The micro-display module further includes a functional chip and a substrate, and a plurality of vertical conductive structures are provided; Both the functional chip and the substrate are disposed between the driving backplane and the circuit control board. The functional chip is disposed on one side of the substrate facing the driving backplane. A second through hole penetrating both sides is formed on the surface of the substrate, and a third through hole penetrating both sides is formed on the surface of the functional chip. At least one of the vertical conductive structures is disposed in the first through hole, one of the vertical conductive structures is disposed in the second through hole, and one of the vertical conductive structures is disposed in the third through hole; The functional chip and the driving backplane are electrically connected through the vertical conductive structure, the functional chip and the substrate are electrically connected through the vertical conductive structure, and the substrate is electrically connected to the circuit control board through the vertical conductive structure.

10. The microdisplay module according to claim 9, wherein, A third conductive layer is disposed on one side of the substrate facing the functional chip, and the vertical conductive structure of the functional chip is electrically connected to the substrate through the third conductive layer.

11. A manufacturing method of a microdisplay module, characterized in that, The manufacturing method includes: Forming a first deposition groove on one side surface of the driving backplane; Depositing a metal material in the first deposition groove to form a first conductive portion; Forming a second deposition groove on the other side surface of the driving backplane, and the first conductive portion is exposed in the second deposition groove; Depositing a metal material in the second deposition groove to form a second conductive portion partially protruding from the other side surface of the driving backplane; Encapsulating the circuit control board on one side of the driving backplane and electrically connecting it to the second conductive portion.

12. The manufacturing method according to claim 11, wherein, After the step of depositing a metal material in the first deposition groove to form a first conductive portion and before the step of forming a second deposition groove on the other side surface of the driving backplane, the method further includes: Encapsulating a light-emitting panel on the other side of the driving backplane and electrically connecting it to the first conductive portion.

13. The manufacturing method according to claim 11, wherein After the step of forming a first deposition groove on one side surface of the driving backplane and before the step of depositing a metal material in the first deposition groove to form a first conductive portion, the method further includes: Depositing an insulating material in the first deposition groove to form a first insulating layer; Depositing a metal material on the surface of the first insulating layer to form a first conductive portion.

14. The manufacturing method according to claim 11, characterized in that, After the step of forming a second deposition groove on the other side surface of the driving backplane and before the step of depositing a metal material in the second deposition groove to form a second conductive portion partially protruding from the other side surface of the driving backplane, the method further includes: Depositing an insulating material in the second deposition groove to form a second insulating layer; Etching and removing the second insulating layer covering the surface of the first conductive portion.

15. The manufacturing method according to any one of claims 11 to 14, characterized in that, The step of depositing a metal material in the second deposition groove to form a second conductive portion partially protruding from the other side surface of the driving backplane includes: Depositing a metal material in the second deposition groove and on the other side surface of the driving backplane to form a conductive layer; Etching and removing the conductive layer located outside the periphery of the second deposition groove to form the second conductive portion partially protruding from the second deposition groove.

16. A display device, characterized in that, The display device includes the micro-display module according to any one of claims 1 to 10.

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