A camera module

Abstract

The present application discloses a camera module, comprising: a photosensitive chip; a lens assembly movably retained in the photosensitive path of the photosensitive chip; and a drive assembly adapted to drive the lens assembly to displace relative to the photosensitive chip; the drive assembly comprising an electrical drive portion, a magnetic coupling portion, and a first molded portion, the first molded portion integrally combining the electrical drive portion and the magnetic yoke in the magnetic coupling portion; wherein the electrical drive portion comprises a circuit board, a first coil, and a conductive carrier, the conductive carrier being used to electrically connect the circuit board and the first coil, the photosensitive chip being conductively connected to the circuit board, the magnetic yoke being disposed on the upper surface of the circuit board, and at least a portion of the lower surface of the first coil being in contact with the upper surface of the magnetic yoke. The present application aims to reduce the overall thickness of the camera module and improve its integration.

Description

Technical Field

[0001] The present application relates to the technical field of camera modules, and in particular to a camera module. Background Art

[0002] With the widespread application of camera modules in various electronic devices, the demand for their miniaturization is becoming increasingly significant. In mobile devices, in particular, camera module size has a significant impact on the overall design and user experience. The camera module's shoulder height—the vertical distance from the mounting substrate (such as a PCB) to the highest point of the module (such as the motor protective cover)—is a key factor influencing device thickness and design.

[0003] In traditional camera module designs, the motor and module structures are typically designed and installed separately. For example, the motor base and the camera module base are two separate components. The motor base primarily supports the motor and its associated functional components, such as the motor circuit board and movable frame; the camera module base, on the other hand, primarily supports components such as the motor or lens and attaches an infrared filter (IR filter). In many cases, space must also be reserved for other components such as resistors and capacitors. This design approach requires consideration of structural strength, minimum moldable thickness, and flatness for both the motor base and the camera module base, increasing the overall height of the module. This, to a certain extent, limits the application of camera modules in ultra-thin devices.

[0004] As electronic devices move toward lower profiles and ultra-thin designs, the various sub-components within camera modules, such as electromagnetic coils, guide rods, ball bearings, and springs, face increasingly stringent design requirements. These sub-components must optimize their structure and layout while ensuring functionality, to meet the dual demands of miniaturization and high performance. Summary of the Invention

[0005] One purpose of this application is to reduce the shoulder height of the camera module and improve the integration of the camera module.

[0006] To achieve the above objectives, the technical solution adopted in this application is: a camera module, comprising:

[0007] Photosensitive chip;

[0008] a lens assembly, movably held on the light-sensing path of the light-sensing chip; and

[0009] A driving assembly is suitable for driving the lens assembly to move relative to the photosensitive chip; the driving assembly includes an electrical driving part, a magnetic coupling part and a first molded part, the first molded part integrally combines the electrical driving part and the magnetic yoke in the magnetic coupling part; wherein, the electrical driving part includes a circuit board, a first coil and a conductive carrier, the conductive carrier is used to electrically connect the circuit board and the first coil, the photosensitive chip is conductively connected to the circuit board, the magnetic yoke is arranged on the upper surface of the circuit board, and at least part of the lower surface of the first coil is in contact with the upper surface of the magnetic yoke.

[0010] Preferably, the magnetic coupling portion further comprises a first magnet disposed above the first molding portion, and at least a portion of the first coil is exposed on an upper surface of the first molding portion and is opposite to the first magnet.

[0011] As a preference, projections of the conductive carrier and the magnetic yoke along the optical axis do not overlap.

[0012] Preferably, the conductive carrier includes a flexible circuit board, the flexible circuit board and the yoke are in the same plane, and the flexible circuit board is arranged on the peripheral side of the yoke; or, the first coil, the flexible circuit board and the yoke are arranged in sequence from top to bottom, and the flexible circuit board has a hole area, and the hole area is opposite to the yoke.

[0013] Preferably, the circuit board has a light-through hole opposite to the photosensitive chip, and the photosensitive chip is arranged on the lower surface of the circuit board. The driving component also includes a second molding part, which covers at least a portion of the lower surface of the circuit board, and the bottom surface of the photosensitive chip is not lower than the bottom surface of the second molding part.

[0014] As a preference, the lower surface of the circuit board is electrically connected to electronic components, and the electronic components are molded in the second molding part.

[0015] Preferably, the first molding part and the second molding part are integrally cast, or the first molding part and the second molding part are separately cast.

[0016] Preferably, the driving assembly further comprises a first carrier for carrying the lens assembly, a ball support structure being provided between the first carrier and the circuit board, the ball support structure comprising at least three pairs of relatively arranged upper ball support grooves, lower ball support grooves and balls located between each pair of the upper ball support grooves and the lower ball support grooves; wherein the upper ball support grooves are provided at the bottom of the first carrier, the lower ball support grooves are provided on the upper surface of the circuit board or are integrally formed in the first molding portion, and a first magnet opposite to the first coil is also provided at the bottom of the first carrier.

[0017] Preferably, at least three opening areas are provided on the first molding part, and the opening areas are provided at the corners of the first molding part, or in the middle of any side, and each of the opening areas forms a lower ball support groove.

[0018] As a preference, the distance between the first coil and the first magnet is ≤0.2 mm.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] (1) The camera module of the present application further optimizes the internal space layout, reduces space waste, and can effectively reduce the shoulder height of the camera module.

[0021] (2) The camera module of the present application can provide a flatter bottom mounting platform, reducing shaking or offset caused by uneven surface, thereby improving the overall assembly accuracy and stability of the camera module.

[0022] (3) The camera module of the present application can prevent the components from shifting due to external forces during use through the molding process, thereby protecting the components from damage.

[0023] (4) Compared with the traditional split assembly, the camera module of the present application has higher impact resistance and vibration resistance and can better adapt to complex working environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a three-dimensional schematic diagram of a camera module in one embodiment of the present application.

[0025] Figure 2 This is an exploded diagram of a camera module in one embodiment of the present application.

[0026] Figure 3 Schematic cross-section of a camera module in one embodiment of the present application.

[0027] Figure 4 This is a cross-sectional schematic diagram of a camera module in another embodiment of the present application.

[0028] Figure 5 Schematic diagram of the conductive support member of the camera module in one embodiment of the present application.

[0029] Figure 6 This is a schematic top view of the first molding portion of the camera module in one embodiment of the present application.

[0030] Figure 7 This is a schematic top view of the first molding portion of the camera module in another embodiment of the present application.

[0031] Figure 8 Schematic diagram of the internal structure of the camera module in one embodiment of the present application.

[0032] Figure 9 Schematic diagram of the gap between the first magnet and the first coil of the camera module in one embodiment of the present application.

[0033] Figure 10 This is a schematic diagram of the circuit board structure of the camera module in one embodiment of the present application.

[0034] Figure 11 This is a schematic diagram of the position of the photosensitive chip of the camera module in one embodiment of the present application.

[0035] Figure 12 This is a schematic diagram of the opening area of ​​the first molding part of the camera module in one embodiment of the present application.

[0036] Figure 13 This is a schematic diagram of the first carrier structure of the camera module in one embodiment of the present application.

[0037] Figure 14 Schematic cross-sectional view of the ball support structure of the camera module in one embodiment of the present application.

[0038] Figure 15 This is a cross-sectional schematic diagram of the ball support structure of the camera module in another embodiment of the present application.

[0039] Figure 16 This is a cross-sectional schematic diagram of the ball support structure of the camera module in another embodiment of the present application.

[0040] Figure 17 Schematic diagram of the combined structure of the first carrier and the second carrier of the camera module in one embodiment of the present application.

[0041] Figure 18 Schematic diagram of the internal structure of the second driving component of the camera module in one embodiment of the present application.

[0042] Figure 19 Schematic diagram of the conductive insert structure of the camera module in one embodiment of the present application.

[0043] Figure 20Schematic diagram of the position of the conductive insert of the camera module in one embodiment of the present application.

[0044] In the figure: 1. Housing; 2. Lens assembly;

[0045] 3. Drive components;

[0046] 31. Electrical drive unit; 311. Circuit board; 3111. Light hole; 312. First coil; 313. Conductive carrier; 32. Magnetic coupling unit; 321. Magnetic yoke; 322. First magnet;

[0047] 301, first molding part; 3011, opening area;

[0048] 302, second molding part;

[0049] 33. Conductive insert; 331. First contact portion; 332. Second contact portion;

[0050] 34. Motor base;

[0051] 35. Conductive support member; 351. First support portion; 352. Second support portion; 353. Conductive portion;

[0052] 36. Ball support structure; 361. Upper ball support groove; 362. Ball; 363. Lower ball support groove;

[0053] 37. First drive assembly;

[0054] 38. Second drive assembly; 381. Second magnet; 382. Second coil;

[0055] 39. Carrier; 391. First carrier; 3911. Guide member; 3912. First reinforcement member; 3913. Second reinforcement member; 392. Second carrier;

[0056] 4. Infrared filter;

[0057] 5. Photosensitive chip;

[0058] 6. Substrate. DETAILED DESCRIPTION

[0059] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0060] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, indicating the orientation and position relationship are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of this application.

[0061] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0062] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0063] In the drawings of this application, the X, Y, and Z axes are the coordinate axes of the spatial rectangular coordinate system, and the X, Y, and Z axes correspond to the length, width, and height directions of the camera module, respectively. Among them, the optical axis direction of the camera module is the optical axis direction of the lens assembly 2, which is parallel to the Z axis.

[0064] like Figure 1-3 As shown, according to one embodiment of the present application, the camera module includes a photosensitive chip 5, a lens assembly 2 that is movably held in the light sensing path of the photosensitive chip 5, and a driving assembly 3 suitable for driving the lens assembly 2 to move relative to the photosensitive chip 5. The lens assembly 2 is used to converge light, and the light converged by the lens assembly 2 is suitable for being incident on the photosensitive chip 5 to form an image.

[0065] Furthermore, the first driving component 37 includes an electrical driving part 31 and a magnetic coupling part 32. When the electrical driving part 31 is energized, it can generate a magnetic field that interacts with the magnetic coupling part 32. At least a portion of the magnetic coupling part 32 is suitable for being driven by magnetic force, thereby driving the lens assembly 2 to move.

[0066] Specifically, the electrical driving unit 31 includes a circuit board 311 , a first coil 312 and a conductive carrier 313 for electrically connecting the circuit board 311 and the first coil 312 , wherein the circuit board 311 is conductively connected to the photosensitive chip 5 .

[0067] The magnetic coupling unit 32 includes a first magnet 322 and a yoke 321. The first magnet 322 is positioned opposite the first coil 312. When the first coil 312 is energized to generate a magnetic field, it drives the first magnet 322 to move. The first magnet 322 is positioned within the lens assembly 2. Therefore, when the first magnet 322 moves relative to the first coil 312, it drives the lens assembly 2 relative to the first coil 312. The yoke 321 is used to enhance the intensity and directionality of the magnetic field generated by the first coil 312, making the magnetic field more concentrated and uniform. The first magnet 322 and yoke 321 are positioned above and below the first coil 312, respectively. Specifically, the yoke 321 is positioned below the first coil 312. The yoke 321 enhances the magnetic field strength and stabilizes its distribution. Furthermore, it raises the height of the first coil 312 to prevent an excessive distance between the first coil 312 and the first magnet 322, which could affect the driving effect.

[0068] In some preferred embodiments, the yoke 321 is provided on the upper surface of the circuit board 311, and at least part of the lower surface of the first coil 312 contacts the upper surface of the yoke 321. Since the yoke 321 has a relatively high flatness, the first coil 312 is provided on the upper surface of the yoke 321, and the flatness of the yoke 321 can be utilized to ensure the flatness of the first coil 312.

[0069] In some embodiments, the driving assembly 3 includes a first carrier 391 for carrying the lens assembly 2 and a first driving assembly 37 for driving the first carrier 391, wherein the first driving assembly 37 includes the above-mentioned first magnet 322 and the first coil 312, the first coil 312 is arranged on the circuit board 311, and the first magnet 322 and the first coil 312 are arranged on the first carrier 391 opposite to each other. When the first coil 312 is energized, it interacts with the first magnet 322 to form an electromagnetic force to drive the first carrier 391 and the lens assembly 2 to move relative to the circuit board 311 and the photosensitive chip 5.

[0070] In one possible implementation, the conductive carrier 313 is used to conductively connect the first coil 312 to the circuit board 311. The conductive carrier 313 can be arranged between the first coil 312 and the magnetic yoke 321, or can be arranged on the peripheral side of the magnetic yoke 321 to reduce the thickness, or can be arranged on the peripheral side of the first coil 312. It is worth mentioning that when the projections of the conductive carrier 313 and the magnetic yoke 321 along the Z axis overlap, the current on the conductive carrier 313 may affect the effect of the magnetic yoke 321 on the magnetic field. Therefore, in some preferred embodiments, the projections of the conductive carrier 313 and the magnetic yoke 321 along the Z axis (or optical axis) do not overlap. For example, in Figure 4In the illustrated embodiment, the conductive carrier 313 and the magnetic yoke 321 are disposed below the first coil 312. The conductive carrier 313 and the magnetic yoke 321 are in the same plane, and the conductive carrier 313 is disposed around the yoke 321, so that the magnetic yoke 321 is not interfered with by the low magnetic permeability of the conductive carrier 313. It will be understood that the magnetic yoke 321 is typically made of a material with high magnetic permeability, such as iron. When the first coil 312 is energized, a magnetic field is generated. The magnetic yoke 321 can effectively guide and concentrate this magnetic field, distributing it along a predetermined path, reducing magnetic field dispersion and energy loss, and enhancing the intensity of the magnetic field in a specific area. Specifically, the magnetic yoke 321 can more efficiently guide the magnetic field to the key areas that interact with the first magnet 322, improving the efficiency and precision of the electromagnetic drive system and ensuring that the generated electromagnetic force can accurately act on the target component, such as the lens assembly 2, to achieve fast and accurate focusing or optical image stabilization operations. Therefore, the projections of the conductive carrier 313 and the magnetic yoke 321 along the optical axis do not overlap, which can effectively prevent the magnetic field generated by the current flowing through the conductive carrier 313 from being superimposed on or offset by the magnetic field around the magnetic yoke 321 and the first coil 312, thereby preventing the distribution of the driving magnetic field originally formed by the first coil 312 and the magnetic yoke 321 from being disturbed.

[0071] In a specific embodiment, Figure 4 As shown, the yoke 321 is disposed on the upper surface of the circuit board 311, the first coil 312 is disposed on the upper surface of the yoke 321, and the conductive carrier 313 is disposed on the circumference of the yoke 321. One end of the conductive carrier 313 is conductively connected to the first coil 312, and the other end is conductively connected to the circuit board 311. In this embodiment, the first coil 312, the yoke 321, and the conductive carrier 313 are integrated into the upper surface of the circuit board 311, and the overall height of the drive assembly 3 can be further reduced. For example, the conductive carrier 313 is provided with a through-hole area. The shape of the hole area is adapted to the yoke 321, and the area of ​​the hole area is slightly larger than the yoke 321. The yoke 321 is disposed in the hole area.

[0072] In other embodiments, the magnetic yoke 321, the conductive carrier 313 and the first coil 312 are arranged in sequence from bottom to top, the first coil 312 is arranged above the conductive carrier 313 and electrically connected to the first coil 312, the conductive carrier 313 is arranged above the magnetic yoke 321, and the conductive carrier 313 has a penetrating hole area, and the magnetic yoke 321 is placed below the hole area. The hole area makes it possible for there to be no obstruction of the conductive carrier 313 above the magnetic yoke 321, thereby ensuring that the magnetic circuit between the magnetic yoke 321 and the first magnet 322 is unobstructed, which can reduce magnetic resistance, improve the efficiency of the magnetic circuit, and thereby enhance the effect of electromagnetic drive.

[0073] Furthermore, the drive assembly 3 includes a first molded portion 301, which integrally combines the electrical drive portion 31 and the yoke 321 of the magnetic coupling portion 32. In other words, the first molded portion 301 integrally combines the circuit board 311, the first coil 312, the conductive carrier 313, and the yoke 321. The use of the first molded portion 301 to integrally combine the circuit board 311, the first coil 312, the conductive carrier 313, and the yoke 321 effectively improves the product's integration and facilitates providing a flatter mounting platform for the lens assembly 2.

[0074] Using the first molded portion 301 to encapsulate the first coil 312, the magnetic yoke 321, and the conductive carrier 313 further reduces the overall shoulder height of the camera module. Because the circuit board 311 typically contains numerous circuit components that occupy height space, using a traditional lens mount (i.e., the lens mount is positioned on the circuit board 311, the lens assembly is positioned on the lens mount, and the magnetic coil structure is positioned between the lens assembly and the lens mount) would increase the thickness or height of the camera module, resulting in a higher shoulder height. However, the present application eliminates the lens holder and directly arranges the first coil 312, the magnetic yoke 321 and the conductive carrier 313 on the circuit board 311, and forms a first molded part 301 on the circuit board 311. The first molded part 301 can protect the circuit board 311, the first coil 312, the magnetic yoke 321 and the conductive carrier 313. At the same time, thanks to the advantages of the molding process, the upper surface height of the first molded part 301 can be made not to exceed the upper surface height of the first coil 312. Therefore, the first molded part 301 basically does not introduce additional height space, thereby reducing the shoulder height of the camera module.

[0075] In some embodiments, the conductive carrier 313 includes a flexible circuit board, which can be bent, folded, and formed according to the complex structure of the camera module to adapt to different space limitations.

[0076] In some embodiments, as Figure 5As shown, the conductive carrier 313 includes a flexible circuit board and a conductive support member 35. The first molded portion 301 may also be integrally integrated with the conductive support member 35. The conductive support member 35 includes a first support portion 351, a second support portion 352, and a conductive portion 353. The first support portion 351 is used to support the magnetic yoke 321. Because the first coil 312 is disposed above the magnetic yoke 321, the first coil 312 and the first magnet 322 are opposite each other and the distance between them should not be too far. This ensures that sufficient electromagnetic force can be generated between the first coil 312 and the first magnet 322 to drive the lens assembly 2 to achieve anti-shake. Therefore, the conductive support member 35 helps to raise the height of the magnetic yoke 321, further raising the height of the first coil 312 above the magnetic yoke 321 to ensure that the distance between the first coil 312 and the first magnet 322 is not too large. The second support portion 352 is used to support the flexible circuit board and conduct electrical signals between the flexible circuit board and the circuit board 311. The conductive portion 353 is used to electrically connect the flexible circuit board and the circuit board 311 , so that the first coil 312 electrically connected to the conductive carrier 313 can generate electromagnetic force after being energized to drive the lens assembly 2 to move.

[0077] In other embodiments, the conductive carrier 313 includes a wire, meaning that the first coil 312 is electrically connected to the circuit board 311 via a wire. This wire is encapsulated within the first molded portion 301, which protects the wire and prevents breakage. In this implementation, the first coil 312 can be directly connected to the circuit board 311 via a wire, eliminating the need for a flexible printed circuit board (FPC) corresponding to the first coil 312, further reducing the camera module's shoulder height and saving costs.

[0078] In some other embodiments, the conductive carrier 313 includes a conductive metal sheet, that is, the first coil 312 is electrically connected to the circuit board 311 via the conductive metal sheet. The upper surface of the conductive metal sheet and the upper surface of the yoke 321 are located on the same horizontal plane, at least a portion of the lower surface of the first coil 312 contacts the upper surface of the yoke 321, and another portion of the lower surface of the first coil 312 contacts the upper surface of the conductive metal sheet. In this way, the flatness of the yoke 321 and the conductive metal sheet can be utilized to ensure the flatness of the first coil 312. Optionally, the conductive metal sheet can be an L-shaped conductive metal sheet or a Z-shaped conductive metal sheet.

[0079] In some embodiments, as Figure 6 As shown, the first coil 312 integrally combined with the first molded part 301 can be completely encapsulated in the first molded part 301, that is, the first coil 312 is not exposed, and the first coil 312 can be completely isolated from the external environment to prevent the coil from being corroded by dust, moisture, chemicals, etc.

[0080] In other embodiments, Figure 7As shown, the first molded part 301 covers at least a portion of the upper surface of the circuit board 311, and the first magnet 322 is arranged above the first molded part 301. At least a portion of the first coil 312 is exposed on the upper surface of the first molded part 301 and is opposite to the first magnet 322, ensuring the magnetic field alignment accuracy between the first coil 312 and the first magnet 322, making the interaction of the magnetic fields more efficient and stable. At the same time, the first coil 312 is exposed on the upper surface of the first molded part 301, which is conducive to reducing the distance between the first coil 312 and the first magnet 322, thereby enhancing the electromagnetic induction effect, making the camera module respond faster and more accurately during focusing and optical image stabilization, thereby improving the overall performance of the camera module.

[0081] In one embodiment, Figure 8 As shown, the drive assembly 3 also includes a carrier 39, which comprises a first carrier 391 and a second carrier 392. The first carrier 391 is an OIS (Optical Image Stabilization) carrier, and the second carrier 392 is an AF (Auto Focus) carrier. The lens assembly 2 is mounted on the second carrier 392, which is movably mounted to the first carrier 391 along the optical axis. Movement of the second carrier 392 relative to the first carrier 391 adjusts the vertical distance of the lens assembly 2 relative to the photosensitive chip 5, thereby achieving focus adjustment. Those skilled in the art will appreciate that a motor composed of coils and magnets can be positioned between the first and second carriers 391, 392, to drive the second carrier 392. The first carrier 391 is held above the circuit board 311 by a ball bearing support structure 36, allowing it to move perpendicular to the optical axis to adjust the horizontal position of the lens assembly 2 relative to the photosensitive chip 5, thereby achieving an anti-shake function. It is worth mentioning that the first magnet 322 is disposed on the first carrier 391 , that is, the first driving component 37 is used to drive the first carrier 391 to move.

[0082] In some embodiments, as Figure 9 As shown, the distance between the first coil 312 and the first magnet 322 is L, where L is ≤ 0.2 mm. It should be understood that if the distance between the first coil 312 and the first magnet 322 is too close, the driving point of the lens assembly 2 will be too low, resulting in unbalanced force and unstable movement of the lens assembly 2. Therefore, the distance between the first coil 312 and the first magnet 322, which are partially exposed on the surface of the first molding part 301, does not exceed 0.2 mm. This can achieve a lower shoulder height of the camera module while maintaining a balanced force on the lens assembly 2.

[0083] Furthermore, if Figure 10As shown, the circuit board 311 has a light hole 3111 opposite to the photosensitive chip 5. The size of the light hole 3111 corresponds to the photosensitive chip 5 to ensure that light can be focused on the photosensitive chip 5. Figure 11 As shown, the photosensitive chip 5 is arranged on the lower surface of the circuit board 311, so that the lower surface of the circuit board 311 can be fully utilized, so that there is enough space on the upper surface of the circuit board 311 to place components such as the yoke 321 and the first coil 312. It should be understood that compared with the traditional camera module, the photosensitive chip 5 of the present application is located below the circuit board 311, which can sink the photosensitive chip 5 and raise the position of the circuit board 311. It can lower the shoulder height of the camera module along the Z-axis direction while ensuring that there is a suitable distance between the photosensitive chip 5 and the lens assembly 2. This not only avoids the problem of light not being able to converge accurately due to improper spacing between the photosensitive chip 5 and the lens assembly 2, resulting in blurring, out-of-focus, etc. It can also prevent the photosensitive chip 5 and the lens assembly 2 from colliding or rubbing against each other due to direct contact or too close spacing when subjected to vibration or impact.

[0084] Furthermore, the driving component 3 of the camera module of the present application further includes a second molding portion 302, such as Figure 11 As shown, the second molding part 302 covers at least a portion of the lower surface of the circuit board 311, thereby preventing the circuit board 311 and the electronic components mounted thereon from being damaged by external physical impact, collision or friction, thereby improving the durability of the camera module.

[0085] Furthermore, if Figure 11 As shown, the bottom surface of the photosensitive chip 5 is not lower than the bottom surface of the second molding part 302. The second molding part 302 provides sufficient physical protection for the photosensitive chip 5 to prevent the photosensitive chip 5 from being directly exposed to the outside and its lower surface from being scratched or damaged by the outside, so as to ensure the optical performance of the photosensitive chip 5 and extend the service life of the photosensitive chip 5.

[0086] In some embodiments, the lower surface of the circuit board 311 is electrically connected to several electronic components, such as capacitors and resistors. These electronic components are molded within the second molded portion 302, thereby improving the utilization of the internal space of the second molded portion 302 and ensuring that all components can be arranged within the limited area of ​​the circuit board 311. This achieves a more compact layout of the camera module, helps further reduce the size of the camera module, and meets the miniaturization requirements of modern electronic devices.

[0087] In some embodiments, the first molded part 301 and the second molded part 302 are integrally cast, or the first molded part 301 and the second molded part 302 are separately cast. Compared with the traditional camera module, the first molded part 301 and the second molded part 302 of the present application that are integrally cast do not have the welding points between the motor base and the camera module in the split design. The seamless connection method can ensure that when used for a long time or subjected to external force, the joints between the molded parts will not crack or deform, thereby extending the service life of the camera module. The first molded part 301 and the second molded part 302 that are separately cast can optimize the shape, size and material properties of each molded part according to different functional requirements or application scenarios. For example, the first molded part 301 can be made of high-strength material to provide better support, while the second molded part 302 can be made of lighter or easier to process materials to meet specific performance requirements.

[0088] Furthermore, a ball support structure 36 is arranged between the first carrier 391 and the circuit board 311. The ball support structure 36 includes several pairs of relatively arranged upper ball support grooves 361 and lower ball support grooves 363. At least one ball 362 is arranged between each pair of upper ball support grooves 361 and lower ball support grooves 363. The upper ball support grooves 361 are located at the bottom of the first carrier 391, and the lower ball support grooves 363 are located on the upper surface of the circuit board 311 or are integrally formed in the first molding part 301.

[0089] In some embodiments, the first molded portion 301 is provided with at least three openings 3011, located at corners of the first molded portion 301 or in the middle of any side. Each opening 3011 forms a lower ball support groove 363, each adapted to accommodate a ball 362. It will be appreciated that the three openings 3011 are not aligned, forming a stable triangular support plane. Therefore, the distances between the three vertices of the ball 362 accommodated in the opening 3011 form a stable triangular support plane, evenly distributing stress and thus ensuring greater stability during high-precision operations such as camera module stabilization and focusing.

[0090] like Figure 12-14As shown, the first molded portion 301 is provided with an opening area 3011 at each of its three corners. The ball support structure 36 includes three pairs of opposing upper ball support grooves 361 and lower ball support grooves 363, and balls 362 positioned between each pair of upper and lower ball support grooves 361 and 363. The upper ball support grooves 361 are positioned at the bottom of the first carrier 391, while the lower ball support grooves 363 are positioned within the opening area 3011 of the first molded portion 301. Balls 362 are positioned within the lower ball support grooves 363, with the top portions of the balls 362 protruding from the upper ball support grooves 361 at the bottom of the first carrier 391 to flexibly support the first carrier 391. It should be understood that because the integrally formed lower ball support grooves 363 are formed simultaneously with the first molded portion 301, their position and angle precision are higher, ensuring smoother movement of the balls 362 within the support grooves and reducing friction and wear caused by assembly errors.

[0091] In some embodiments, as Figure 15 As shown, lower ball support groove 363 is located on the upper surface of circuit board 311. Lower ball support groove 363 is disposed on the side of first molded portion 301, wherein the lower surface of lower ball support groove 363 is approximately on the same horizontal plane as the lower surface of first molded portion 301. This improves the overall stability of ball support structure 36 and prevents uneven force on lower ball support groove 363 due to height differences. Separating first molded portion 301 from lower ball support groove 363 allows for different sizes of lower ball support groove 363 to accommodate balls 362 of different specifications. Lower ball support groove 363 can be constructed solely of a material with improved rigidity and flatness, allowing balls 362 to slide more smoothly.

[0092] In some embodiments, as Figure 16 As shown, the camera module also includes a motor base 34 disposed on the first molded portion 301 or circuit board 311. The motor base 34 includes at least three protrusions extending toward the bottom of the first carrier 391. The first molded portion 301 forms a clearance area at a position corresponding to each protrusion, so that the bottom surface of the protrusion faces the upper surface of the circuit board 311, and the top surface of the protrusion faces the bottom surface of the first carrier 391. The top surface of the protrusion forms a lower ball support groove 363. The motor base 34, which is used solely for mounting the ball 362, can be made of a material with greater rigidity and flatness, which not only provides a more stable support force for the ball support structure 36, but also improves its ability to withstand external pressure or impact.

[0093] In some embodiments, the photosensitive chip 5 is electrically connected to the lower surface of the circuit board 311 through welding pins or metal wires. The welding pins or metal wires can enhance the stability of the photosensitive chip 5 in the camera module, making it tightly combined with the circuit board 311, reducing the risk of loosening or displacement of the photosensitive chip 5 due to external forces such as vibration and collision, and improving the reliability and durability of the camera module.

[0094] In some embodiments, along the optical axis, a magnetic yoke 321, a conductive carrier 313 and a first coil 312 are sequentially arranged in the first molded part 301 from bottom to top. The conductive carrier 313 may also be arranged directly above the magnetic yoke 321 without a hole area. By placing the conductive carrier 313 directly above the magnetic yoke 321, the hollow area for accommodating the magnetic yoke 321 is omitted, thereby simplifying the assembly process. However, this arrangement may cause certain interference to the distribution of the magnetic field. Therefore, in order to simplify the process while ensuring the performance of the module, a conductive carrier 313 material with low magnetic permeability can be selected, or an appropriate insulating layer can be added to further reduce the interference of the conductive carrier 313 with the magnetic field, thereby simplifying the assembly process while ensuring that the performance of the camera module is not affected.

[0095] In some embodiments, as Figure 17 As shown, along the Z-axis, the first carrier 391 and the second carrier 392 overlap in height at least partially. This partial overlap allows the carriers 39, which would otherwise need to be stacked in sequence in the height direction, to share some space, effectively utilizing the vertical space within the camera module and avoiding space waste, thereby further reducing the overall shoulder height of the camera module.

[0096] Furthermore, if Figure 18 As shown, the driving component 3 also includes a second driving component 38, which includes a second magnet 381 and a second coil 382. The second magnet 381 and the second coil 382 are relatively arranged between the second carrier 392 and the first carrier 391, so that when the second coil 382 is energized, the second coil 382 generates a magnetic field and interacts with the magnetic field generated by the second magnet 381 to generate an electromagnetic force to drive the second carrier 392 arranged above the first carrier 391 to move, thereby realizing the focusing function of the camera module.

[0097] Furthermore, if Figure 17 and Figure 18As shown, the first carrier 391 further includes a guide 3911, which is clamped between the first carrier 391 and the second carrier 392. When the camera module needs to perform operations such as optical zoom and autofocus, the guide 3911 can constrain the movement direction of the second carrier 392 to prevent the second carrier 392 from shifting or shaking during movement. It should be understood that since the second carrier 392 is primarily used to carry the lens assembly 2, the guide 3911 guides the movement of the second carrier 392 to change the position of the lens assembly 2, thereby changing the distance between the lens assembly 2 and the photosensitive chip 5, thereby achieving the camera module focusing function.

[0098] Furthermore, if Figure 18 As shown, the first carrier 391 is also provided with a first reinforcement 3912 and a second reinforcement 3913, wherein the first reinforcement 3912 covers the top of the first magnet 322, and can provide physical support for the first magnet 322 to prevent it from being displaced or deformed when subjected to external force or vibration. Furthermore, the second reinforcement 3913 is arranged between the second magnet 381 and the second carrier 392 to prevent the second magnet 381 from loosening or being damaged due to external force or vibration during use, thereby ensuring the safe operation of the camera module. In addition, this structural reinforcement can ensure that the magnet and coil maintain a stable position and shape inside the camera module, thereby ensuring the normal operation of the electromagnetic drive system.

[0099] In some embodiments, as Figure 19 and Figure 20 As shown, the driving assembly 3 further includes a conductive insert 33, which is disposed around at least three sides of the driving assembly 3. Specifically, the conductive insert 33 surrounds the first molded portion 301, the first carrier 391, and the second carrier 392. The conductive insert 33 includes a first contact portion 331 and a second contact portion 332. The first contact portion 331 is embedded in the interior of the first molded portion 301 and is electrically connected to the circuit board 311 and the first coil 312. The second contact portion 332 is embedded in the interior of the first carrier 391 and is electrically connected to the second coil 382, ​​ensuring that current and control signals can be transmitted from the circuit board 311 to the second coil 382, ​​thereby realizing the optical anti-autofocus function of the camera module.

[0100] Furthermore, the first contact portion 331 of the conductive insert 33 is provided with electrical interfaces related to the autofocus (AF) function, AFSDA, AFVDD, AFGND, and AFSCL, arranged in sequence along the X-axis. AFSDA is the I2C data line of the AF module, used to transmit control commands and status information from the focus motor (such as the voice coil motor (VCM)). AFVDD is the supply voltage of the AF motor, providing power to the VCM and its driver circuit. AFGND is the ground line of the AF module, providing a reference ground potential for AFVDD. AFSCL is the I2C clock line of the AF module, working with AFSDA to synchronize data transmission. The second contact portion 332 of the conductive insert 33 includes a positive and negative electrode interface. These interfaces provide a stable current path for the various components in the first carrier 391, forming a complete current loop and controlling the movement of the lens assembly 2, thereby achieving precise focusing of the camera module.

[0101] In some embodiments, the camera module further includes a substrate 6 , which is fixed to the lower surface of the second molding part 302 by glue to protect the photosensitive chip 5 attached to the lower surface of the circuit board 311 .

[0102] In some embodiments, the camera module further includes a housing 1, which is adapted to be interlocked with the first molded portion 301 to form a receiving cavity with the first molded portion 301 to protect components in the lens assembly 2 and the driving assembly 3.

[0103] In some embodiments, the camera module further includes an infrared filter 4, such as Figure 3 As shown, the infrared filter 4 is glued on top of the first molding part 301, thereby effectively blocking excess infrared light to prevent overexposure of the photosensitive chip 5 by infrared light, so that the photosensitive chip 5 only receives visible light, ensuring image clarity and color accuracy.

[0104] In a specific embodiment, Figure 2 As shown, along the Z-axis direction, from bottom to top, the camera module of the present application has a substrate 6 thickness of 0.1mm, a bonding adhesive thickness between the substrate 6 and the second molded part 302 of 0.04mm, a thickness of the second molded part 302 of 0.24mm, a circuit board 311 thickness of 0.21mm, a first molded part 301 and a first coil 312 exposed on the upper surface of the first molded part 301 of 0.31mm in thickness, a safety distance height maintained between the first magnet 322 and the first coil 312 of 0.1mm, and a thickness from the first magnet 322 to the top surface of the camera module of 2.75mm. Compared to the shoulder height of 4.6mm of the traditional camera module, the shoulder height of the camera module of the embodiment of the present application is reduced by 0.85mm, and the overall shoulder height is only 3.75mm.

[0105] Compared to the prior art, the motor base and the camera module base each require a certain thickness to meet the requirements of structural strength and injection molding process, which to a certain extent limits the trend of camera modules towards miniaturization. The present application optimizes the position space of the photosensitive chip 5 and the circuit board 311 by integrating the first coil 312, the yoke 321 and the conductive carrier 313 into the first molded part 301 in an integrated manner, thereby reducing the mutual interference between components and the occupation of redundant space, and achieving a high degree of integration of various components in the internal space. The first molded part 301 of the present application can simultaneously have the dual functions of the motor base and the camera module base in the existing camera module, significantly reducing the volume and thickness of the camera module, and meeting the dual needs of electronic equipment for miniaturization and high-performance camera modules.

[0106] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: Photosensitive chip; A lens assembly is movably held on the light-sensing path of the light-sensing chip; as well as A drive assembly adapted to drive the lens assembly to displace relative to the photosensitive chip; the drive assembly comprising an electrical drive portion, a magnetic coupling portion, and a first molded portion, wherein the first molded portion integrally combines the electrical drive portion and a yoke in the magnetic coupling portion; wherein the electrical drive portion comprises a circuit board, a first coil, and a conductive carrier, the conductive carrier being configured to electrically connect the circuit board and the first coil, the photosensitive chip being conductively connected to the circuit board, the yoke being disposed on an upper surface of the circuit board, and at least a portion of a lower surface of the first coil being in contact with an upper surface of the yoke; The projections of the conductive carrier and the magnetic yoke along the optical axis do not overlap; The conductive carrier includes a flexible circuit board, which is in the same plane as the yoke and is arranged on the circumferential side of the yoke; or, the first coil, the flexible circuit board and the yoke are arranged in sequence from top to bottom, and the flexible circuit board has a hole area, which is opposite to the yoke.

2. The camera module according to claim 1, wherein: The magnetic coupling portion further includes a first magnet disposed above the first molding portion. At least a portion of the first coil is exposed on an upper surface of the first molding portion and faces the first magnet.

3. The camera module according to any one of claims 1-2, characterized in that: The circuit board has a light-through hole opposite to the photosensitive chip, and the photosensitive chip is arranged on the lower surface of the circuit board. The driving component also includes a second molding part, which covers at least a portion of the lower surface of the circuit board. The bottom surface of the photosensitive chip is not lower than the bottom surface of the second molding part.

4. The camera module according to claim 3, wherein: The lower surface of the circuit board is electrically connected to electronic components, and the electronic components are molded in the second molding part.

5. The camera module according to claim 3, wherein: The first molding part and the second molding part are integrally cast, or the first molding part and the second molding part are separately cast.

6. The camera module according to any one of claims 1-2, characterized in that: The driving assembly also includes a first carrier for carrying the lens assembly, a ball support structure is arranged between the first carrier and the circuit board, and the ball support structure includes at least three pairs of relatively arranged upper ball support grooves, lower ball support grooves and balls located between each pair of the upper ball support grooves and the lower ball support grooves; wherein, the upper ball support grooves are arranged at the bottom of the first carrier, the lower ball support grooves are arranged on the upper surface of the circuit board or are integrally formed in the first molding part, and the bottom of the first carrier is also provided with a first magnet opposite to the first coil.

7. The camera module according to claim 6, wherein: At least three opening areas are provided on the first molding part. The opening areas are provided at the corners of the first molding part, or at the middle position of any side. Each of the opening areas forms a lower ball support groove.

8. The camera module according to claim 2, wherein: The distance between the first coil and the first magnet is ≤0.2 mm.

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