Display device

Abstract

The invention relates to a display device. The display device includes a first substrate, a transistor, a light emitting diode, an encapsulation layer, a color mixing prevention layer, a partition wall, a first color conversion layer, a second color conversion layer, and a transmission layer. The transistor is disposed on a surface of the first substrate. The light emitting diode is electrically connected to the transistor. The encapsulation layer is disposed on the light emitting diode. The color mixing prevention layer is disposed on the encapsulation layer. The partition wall is disposed on the color mixing prevention layer and includes a first opening, a second opening, and a third opening. The first color conversion layer is disposed in the first aperture. A second color conversion layer is disposed in the second aperture. The transmissive layer is disposed in the third opening. The color mixing prevention layer includes one or more dichroic dyes and / or pigments.

Description

Technical Field

[0001] The present disclosure generally relates to display devices. Background Art

[0002] In a conventional light-emitting element, holes supplied from an anode and electrons supplied from a cathode may recombine in a light-emitting layer provided between the anode and the cathode to form excitons. When the excitons are stabilized, the excitons emit light.

[0003] Light-emitting diodes have various advantages such as a relatively wide viewing angle, a relatively fast response speed, a relatively thin thickness, and a relatively low power consumption. For this reason, light-emitting diodes are widely used in various electrical devices and electronic devices (such as, TVs, monitors, mobile phones, etc.) (or used in combination with various electrical devices and electronic devices (such as, TVs, monitors, mobile phones, etc.)).

[0004] Display devices including a color conversion layer have been proposed to implement a relatively efficient display device. The color conversion layer of the display device can convert incident light into light of different colors.

[0005] The background art provided herein is for the purpose of generally presenting the background of the present disclosure. The work of the currently named inventors (to the extent described in this background art section), and aspects that may not otherwise constitute prior art at the time of filing, are neither expressly nor implicitly regarded as prior art against the present disclosure. Summary of the Invention

[0006] Some aspects can provide an improved color gamut in a display device (such as, a high-resolution display device).

[0007] Additional aspects will be set forth in the detailed description below, and some will be apparent from the present disclosure, or may be learned by practice of the disclosed embodiments and / or the claimed subject matter.

[0008] According to some embodiments, a display device includes a first substrate, a transistor, a light-emitting diode, a encapsulation layer, a color mixing prevention layer, a partition wall, a first color conversion layer, a second color conversion layer, and a transmissive layer. The transistor is disposed on a surface of the first substrate. The light-emitting element is electrically connected to the transistor. The encapsulation layer is disposed on the light-emitting diode. The color mixing prevention layer is disposed on the encapsulation layer. The partition wall is disposed on the color mixing prevention layer and includes a first opening, a second opening, and a third opening. The first color conversion layer is disposed in the first opening. The second color conversion layer is disposed in the second opening. The transmissive layer is disposed in the third opening. The color mixing prevention layer includes one or more dichroic dyes and / or pigments.

[0009] In some embodiments, one or more dichroic dyes may have a long axis along which light is transmitted and a short axis along which light is absorbed. The long axis may extend in a first direction perpendicular to the surface.

[0010] In some embodiments, the short axis may extend in a second direction perpendicular to the first direction.

[0011] In some embodiments, one or more dichroic dyes may include at least one of a red dichroic dye, a green dichroic dye, and a blue dichroic dye.

[0012] In some embodiments, the color mixing prevention layer may be configured to absorb light having an oblique incident angle with respect to the color mixing prevention layer.

[0013] In some embodiments, the partition wall, the first color conversion layer, the second color conversion layer, and the transmissive layer may each have a first surface facing the first substrate. The respective first surfaces of the partition wall, the first color conversion layer, the second color conversion layer, and the transmissive layer may directly contact the color mixing prevention layer.

[0014] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may overlap each of the first opening, the second opening, and the third opening, and may not overlap at least a portion of the partition wall.

[0015] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may overlap at least one of the first color conversion layer, the second color conversion layer, and the transmissive layer.

[0016] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may be spaced apart from at least one of the first color conversion layer, the second color conversion layer, and the transmissive layer.

[0017] According to some embodiments, a display device includes a first substrate, a transistor, a light-emitting diode, a encapsulation layer, a color mixing prevention layer, a second substrate, a partition wall, a first color conversion layer, a second color conversion layer, and a transmissive layer. The transistor is disposed on a surface of the first substrate. The light-emitting diode is electrically connected to the transistor. The encapsulation layer is disposed on the light-emitting diode. The color mixing prevention layer is disposed on the encapsulation layer. The second substrate overlaps the first substrate in a direction perpendicular to the surface. The partition wall is disposed on the second substrate and includes a first opening, a second opening, and a third opening. The first color conversion layer is disposed in the first opening. The second color conversion layer is disposed in the second opening. The transmissive layer is disposed in the third opening. The color mixing prevention layer includes one or more dichroic dyes and / or pigments.

[0018] In some embodiments, the display device may further include a filling layer disposed between the partition wall and the encapsulation layer in a direction perpendicular to the surface.

[0019] In some embodiments, in a direction perpendicular to the surface, a color mixing prevention layer may be provided between the filling layer and the encapsulation layer.

[0020] In some embodiments, in a direction perpendicular to the surface, the color mixing prevention layer may overlap the entire surface.

[0021] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may overlap each of the first color conversion layer, the second color conversion layer, and the transmissive layer, respectively.

[0022] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may not overlap at least a part of the partition wall.

[0023] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may overlap at least one of the first color conversion layer, the second color conversion layer, and the transmissive layer.

[0024] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may not overlap at least one of the first color conversion layer, the second color conversion layer, and the transmissive layer.

[0025] In some embodiments, in a direction perpendicular to the surface, the color mixing prevention layer may be provided between the filling layer and the partition wall.

[0026] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may overlap each of the first opening, the second opening, and the third opening, respectively. In this view, the color mixing prevention layer may be spaced apart from at least a part of the surface of the partition wall.

[0027] In some embodiments, in a view in a direction perpendicular to the surface, the color mixing prevention layer may not overlap at least one of the first color conversion layer, the second color conversion layer, and the transmissive layer.

[0028] According to various embodiments, color mixing in a display device (e.g., a high-resolution display device) may be prevented (or at least slowed down), and color reproducibility may be improved by improving color purity.

[0029] The foregoing general description and the following detailed description are illustrative and explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In the figures of the accompanying drawings, various embodiments disclosed herein are illustrated by way of example and not by way of limitation, where like reference numerals and / or symbols refer to like elements.

[0031] Figure 1 Schematic exploded perspective view of a display device according to an embodiment.

[0032] Figure 2 Schematic cross-sectional view of a display panel according to an embodiment.

[0033] Figure 3 Schematic plan view of a part of a pixel of a display panel according to an embodiment.

[0034] Figure 4 Schematic cross-sectional view of a display panel according to an embodiment.

[0035] Figure 5 According to an embodiment Figure 4 Enlarged schematic cross-sectional view of a partial area of the display panel depicted in

[0036] Figure 6 Schematic diagram of the arrangement of a dichroic dye according to an embodiment.

[0037] Figure 7 Graph showing the transmittance of a color mixing prevention layer containing a dichroic dye according to an embodiment as a function of wavelength.

[0038] Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 Cross-sectional views of display panels according to various embodiments. Detailed Description

[0039] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations. The terms "embodiment" and "implementation" are used interchangeably to describe one or more non-limiting examples of systems, devices, methods, etc. described herein. However, it will be apparent that the various embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Further, the various embodiments may be different, but not necessarily exclusive. For example, without departing from the teachings of the present disclosure, the specific shape, configuration, and characteristics of one embodiment may be used or implemented in another embodiment.

[0040] Unless otherwise indicated, the illustrated embodiments should be understood as providing exemplary features that detail some variations of the embodiments. Thus, unless otherwise indicated, various illustrated features, components, modules, layers, films, regions, aspects, structures, etc. (hereinafter individually or collectively referred to as "elements" or "plural elements") may be combined, separated, interchanged, and / or rearranged in other ways without departing from the teachings of the present disclosure.

[0041] The use of cross-hatching and / or shading is generally provided in the accompanying drawings to clarify the boundaries between adjacent elements. For this reason, unless indicated, the presence or absence of cross-hatching or shading is not intended to convey or indicate any preference or requirement for a particular material, material property, dimension, scale, commonality between the illustrated elements, and / or any other characteristic, attribute, property, etc. of the elements. Further, in the accompanying drawings, for clarity and / or descriptive purposes, the sizes and relative sizes of elements may be enlarged. For this reason, the sizes and relative sizes of the individual elements need not be limited to the sizes and relative sizes shown in the drawings. When the embodiments can be implemented differently, the specific process order may be different from the described order. For example, two consecutively described processes may be carried out substantially simultaneously or in an order opposite to the described order. Also, the same reference numerals and / or reference characters denote the same elements.

[0042] When an element (e.g., a layer) is referred to as being “on” another element (e.g., a layer), “above” another element (e.g., a layer), “connected to another element (e.g., a layer) (or connected with another element (e.g., a layer))” or “coupled to another element (e.g., a layer) (or coupled with another element (e.g., a layer))”, it can be directly on the other element (e.g., a layer), directly above the other element (e.g., a layer), directly connected to the other element (e.g., a layer) (or directly connected with the other element (e.g., a layer)) or directly coupled to the other element (e.g., a layer) (or directly coupled with the other element (e.g., a layer)), or there can be at least one intervening element (e.g., a layer). However, when an element (e.g., a layer) is referred to as being “directly on” another element (e.g., a layer), “directly above” another element (e.g., a layer), “directly connected to another element (e.g., a layer) (or directly connected with another element (e.g., a layer))” or “directly coupled to another element (e.g., a layer) (or directly coupled with another element (e.g., a layer))”, there is no intervening element (e.g., a layer). If other terms and / or phrases are used herein to describe the relationship between elements, the other terms and / or phrases should be interpreted in a similar manner, such as “between” and “directly between”, “adjacent” and “directly adjacent”, “on” and “directly on”, “contact” and “direct contact”, “touch” and “direct touch”, etc. Further, the term “connected” can refer to a physical connection, an electrical connection, and / or a fluid connection. For this purpose, for the purposes of the present disclosure, similar to how the phrase “electrically connected” is used to describe components that are connected to form an electrical connection, the phrase “fluidly connected” can be used to refer to vessels, air cavities, holes, openings, etc. that are directly connected to each other or connected to each other through one or more intervening components or vessels to form a fluid connection.

[0043] For the purposes of the present disclosure, the first axis extending along the first direction DR1, the second axis extending along the second direction DR2, and the third axis extending along the third direction DR3 are not limited to the three axes of a rectangular coordinate system (e.g., the x-axis, y-axis, and z-axis of a Cartesian coordinate system), and can be interpreted in a broader sense. For example, the first axis, the second axis, and the third axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. Further, if used herein, the phrases “at least one of X, Y,..., and Z” and “at least one selected from the group consisting of X, Y,..., and Z” can be interpreted as only X, only Y,..., only Z, or any combination of two or more of X, Y,..., and Z, such as, for example, XYZ, XYY, YZ, and ZZ. And, if used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0044] Although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element. For this purpose, the use of such identifiers (e.g., "first element") should not be construed as implicitly or inherently implying the existence of another example (e.g., "second element").

[0045] Spatial relative terms, such as "beneath", "below", "under", "lower", "above", "upper", "over", "higher", and "side" (e.g., as in "sidewall"), etc., may be used herein for descriptive purposes and thus describe the spatial relationship of one element to at least one other element as illustrated in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are also intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as "beneath" or "below" another element or feature will then be oriented "above" or "over" the other element or feature. Thus, the term "beneath" can encompass both an above and a below orientation. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and accordingly, the spatial relative descriptors used herein are to be interpreted accordingly.

[0046] The terms used herein are for the purpose of describing some embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms as well. It should be understood that if used herein, phrases such as "for each of one or more <items>" and / or "each of one or more <items>" etc. include both a single-item group and a multi-item group, i.e., the meaning of using the phrase "for each of" is that in a programming language, it is used to refer to each item in a group of any items being referred to. For example, if the group of items being referred to is a single item, "each" will only refer to that single item (although the dictionary definition of "each" often defines the term to mean "each of two or more things"), and will not imply that there must be at least two such items. Similarly, in the terms "set" or "subset" and in the "set" or "subset" itself, it should not be considered that they must encompass multiple items, and it should be understood that a set or subset can encompass only one member or multiple members (unless the context indicates otherwise).

[0047] As used in this specification, the terms "comprises," "comprising," "include," "including," "has," "have," and / or "having" indicate the presence of the stated feature, integer, step, operation, element, component, and / or group thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms "substantially," "about," "approximately," and other similar terms are used as terms of approximation and not as terms of degree, and as such, are used to account for the inherent deviations in measured, calculated, and / or provided values that would be recognized by a person of ordinary skill in the art. Accordingly, if used herein and unless otherwise indicated, the term "substantially" may mean within ±5% of the reference value. For example, substantially vertical may mean within ±5% of parallel. Also, if the term "between" is used herein in connection with a range of values, it should be understood to include the starting and ending values of the range unless otherwise indicated. For example, between 1 and 5 should be understood to include the numbers 1, 2, 3, 4, and 5, and not just the numbers 2, 3, and 4.

[0048] Various embodiments are described herein with reference to sectional views, isometric views, perspective views, orthographic views, and / or exploded views that schematically depict ideal embodiments and / or intermediate structures. As such, changes in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments disclosed herein should not be construed as limited to the shapes of the particular regions illustrated, but rather include deviations in shapes caused by, for example, manufacturing. For this purpose, the regions illustrated in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, are not intended to be limiting.

[0049] As is conventional in the art, some embodiments may be described and illustrated in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will recognize that these blocks, units, and / or modules are physically implemented by electronic circuits (or optical circuits) formed using semiconductor-based manufacturing techniques or other manufacturing techniques, such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connections, etc. In the case where the blocks, units, and / or modules are implemented by a microprocessor or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module may be implemented by dedicated hardware or as a combination of dedicated hardware performing some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) performing other functions. And, without departing from the scope of the present disclosure, each block, unit, and / or module of some embodiments may be physically separated into two or more interacting and discrete blocks, units, and / or modules. Further, without departing from the scope of the present disclosure, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms, such as those defined in a commonly used dictionary, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0051] Hereinafter, various embodiments will be described with reference to the accompanying drawings.

[0052] Figure 1 It is a schematic exploded perspective view of a display device according to an embodiment.

[0053] Reference Figure 1 , a display device 1000 according to an embodiment may include a display panel DP and a housing HM.

[0054] A side surface (or a side surface through which an image can be displayed) of the display panel DP on which an image can be displayed may be parallel (or substantially parallel) to a side surface (or a hypothetical plane) defined by a first direction DR1 and a second direction DR2.

[0055] A third direction DR3 may indicate a normal direction of the side surface on which an image can be displayed. For example, the third direction DR3 may be a thickness direction of the display panel DP.

[0056] The front surface (or the upper surface) and the back surface (or the lower surface) of each component may be separated by a third direction DR3 (or spaced apart from each other in the third direction DR3).

[0057] However, the directions indicated by the first to third directions DR1, DR2, and DR3 are relative concepts and can be converted into other directions (or represented by other directions).

[0058] The display panel DP may be a flat rigid display panel, but the implementation is not limited to such a display panel. For example, the display panel DP may be a flexible display panel, a hybrid display panel including at least one flat rigid part and at least one flexible part, and / or any other suitable display panel.

[0059] The display panel DP may be an organic light-emitting display panel (or include an organic light-emitting display panel).

[0060] However, the type of the display panel DP is not limited to this example. For example, the display panel DP may be any suitable type of display panel.

[0061] For example, the display panel DP may be a liquid crystal display panel, an electrophoretic display panel, an electro-wetting display panel, etc.

[0062] In some implementations, the display panel DP may be a micro light-emitting diode (LED) display panel, a quantum dot LED display panel, or a quantum dot organic light-emitting diode (OLED) display panel, etc.

[0063] A micro LED display panel generally includes light-emitting diodes having dimensions in the range of about 10 micrometers to about 100 micrometers for forming each pixel.

[0064] These micro light-emitting diode display panels have at least the following advantages: they use inorganic materials, can omit the backlight, have a relatively fast response speed, can achieve a relatively high brightness with relatively low power, and do not break when they are bent or otherwise curved.

[0065] A quantum dot light-emitting diode display panel is usually made by attaching a film containing quantum dots or formed with a material containing quantum dots.

[0066] Quantum dots are self-luminous particles made of inorganic materials (such as indium, cadmium, etc.) and having a diameter of several nanometers or less.

[0067] By controlling the particle size of the quantum dots, light of a desired color can be emitted (or displayed).

[0068] A quantum dot organic light emitting diode display panel is generally fabricated as follows: A blue organic light emitting diode is used as a light source, and a film containing, for example, red quantum dots and green quantum dots is attached to the blue organic light emitting diode (the blue organic light emitting diode is associated with red pixels and green pixels correspondingly), or a material containing, for example, red quantum dots and green quantum dots is deposited in corresponding regions of at least one layer that overlaps the blue organic light emitting diode (the blue organic light emitting diode is associated with red pixels and green pixels correspondingly) in, for example, a third direction DR3. Thus, pixels configured to display different colors (e.g., red, green, and blue) can be realized.

[0069] However, it is contemplated that, according to some embodiments, the display panel DP can be one of various other display panels.

[0070] As Figure 1 shown, the display panel DP includes a display area DA in which an image can be displayed and a non-display area PA adjacent to the display area DA.

[0071] The non-display area PA can be an area where no image is displayed.

[0072] For example, the display area DA can have a square shape, and the non-display area PA can have a shape surrounding the display area DA.

[0073] However, the respective shapes and arrangements of the display area DA and the non-display area PA can be designed relatively, and are not limited to these examples.

[0074] The housing HM can provide a predetermined internal space (or cavity).

[0075] The display panel DP can be at least partially mounted inside the housing HM.

[0076] In addition to the display panel DP, various electronic components (such as a power supply, a storage device, an audio input / output module, etc.) can also be at least partially mounted (or supported) inside the housing HM.

[0077] Hereinafter, the display area of the display panel according to an embodiment will be described with reference to Figure 2 .

[0078] Figure 2 is a schematic cross-sectional view of a display panel according to an embodiment.

[0079] Referring to Figure 2 , a plurality of pixels (e.g., a first pixel PA1, a second pixel PA2, and a third pixel PA3) can be provided on the substrate SUB in, for example, a third direction DR3 with reference to Figure 1On the area overlapping with the described display area DA. For ease of description, the pixels may be individually referred to as the first pixel PA1, the second pixel PA2, and the third pixel PA3, or collectively as pixels PA1, PA2, and PA3.

[0080] Each of the pixels PA1, PA2, and PA3 may include one or more (e.g., multiple) transistors and at least one light-emitting diode connected to at least one of the one or more transistors.

[0081] The shapes and arrangements of the pixels PA1, PA2, and PA3 can be modified in various ways.

[0082] The encapsulation layer ENC may be disposed on the pixels PA1, PA2, and PA3.

[0083] The encapsulation layer ENC can protect the display area DA from external air, moisture, debris, etc.

[0084] In, for example, the third direction DR3, the encapsulation layer ENC may overlap with the entire surface of the display area DA, and the encapsulation layer ENC may be partially disposed on the non-display area PA (or partially disposed in the non-display area PA).

[0085] The first color conversion section CC1, the second color conversion section CC2, and the transmissive section CC3 may be disposed on the encapsulation layer ENC.

[0086] In, for example, the third direction DR3, the first color conversion section CC1 may overlap with the first pixel PA1; in, for example, the third direction DR3, the second color conversion section CC2 may overlap with the second pixel PA2; and in, for example, the third direction DR3, the transmissive section CC3 may overlap with the third pixel PA3.

[0087] The light emitted from the first pixel PA1 may pass through the first color conversion section CC1 to provide red light LR.

[0088] The light emitted from the second pixel PA2 may pass through the second color conversion section CC2 to provide green light LG.

[0089] The light emitted from the third pixel PA3 may pass through the transmissive section CC3 to provide blue light LB.

[0090] Below, reference will be made to Figures 3 to 7 The display panel according to an embodiment will be described in more detail.

[0091] Figure 3 It is a schematic plan view of a part of a pixel of a display panel according to an embodiment. Figure 4 It is a schematic cross-sectional view of a display panel according to an embodiment. Figure 5 For an embodiment Figure 4An enlarged schematic cross-sectional view of a portion of the display panel depicted in FIG. Figure 6 is a schematic diagram of the arrangement of the dichroic dye according to the embodiment.

[0092] Figure 7 Graph showing wavelength-dependent transmittance of a color mixture prevention layer containing a dichroic dye according to an embodiment.

[0093] First, refer to Figure 3 , according to the reference of the embodiment Figure 1 The depicted display area DA includes a red light emitting area RLA, a green light emitting area GLA, and a blue light emitting area BLA.

[0094] The non-luminescent area NLA may be disposed between the red, green, and blue light-emitting areas RLA, GLA, and BLA. For example, the non-luminescent area NLA may be disposed outside the red, green, and blue light-emitting areas RLA, GLA, and BLA, and may at least partially surround the red, green, and blue light-emitting areas RLA, GLA, and BLA.

[0095] Each light emitting region may correspond to a pixel.

[0096] For example, the blue light emitting area BLA, the red light emitting area RLA, and the green light emitting area GLA may correspond to a blue pixel, a red pixel, and a green pixel, respectively.

[0097] Although the red light-emitting area RLA, the green light-emitting area GLA, and the blue light-emitting area BLA are shown as each having a rectangular shape, embodiments are not limited to rectangular shapes. For example, the shapes of the red light-emitting area RLA, the green light-emitting area GLA, and / or the blue light-emitting area BLA can be modified in various ways. For example, at least one of the red light-emitting area RLA, the green light-emitting area GLA, and the blue light-emitting area BLA can have a circular shape, an oval shape, an elliptical shape, a triangular shape, a pentagonal shape, etc., or can have a free-form shape. Furthermore, the arrangement of the red light-emitting area RLA, the green light-emitting area GLA, and the blue light-emitting area BLA can be modified in various ways.

[0098] Below, we will refer to Figure 4 An example cross-sectional structure of the display panel DP is described.

[0099] The display part DC according to the embodiment may include a first substrate SUB1.

[0100] The first substrate SUB1 may include a flexible material (e.g., plastic), which, contrary to a conventional rigid substrate, can be inherently bent, folded, rolled up, twisted, and / or otherwise curved. In some embodiments, the first substrate SUB1 may include at least one flexible region and at least one rigid region. In an embodiment, the first substrate SUB1 may be a rigid substrate.

[0101] The buffer layer BF may be disposed on the first substrate SUB1.

[0102] Depending on the embodiment, the buffer layer BF may be omitted.

[0103] The buffer layer BF may include, for example, silicon nitride (SiN x ), silicon dioxide (SiO2), silicon oxynitride, etc.

[0104] The buffer layer BF may be disposed between the first substrate SUB1 and the semiconductor layer ACT, and may improve the characteristics of the polysilicon by blocking impurities from the first substrate SUB1 during the crystallization process of forming polysilicon, and by planarizing the first substrate SUB1 (or increasing the flatness of the first substrate SUB1). It should also be noted that the buffer layer BF may relieve the stress applied to the semiconductor layer ACT formed on the buffer layer BF.

[0105] The semiconductor layer ACT may be disposed on the buffer layer BF.

[0106] The semiconductor layer ACT may be made of polysilicon, an oxide semiconductor, or any other suitable semiconductor material.

[0107] The semiconductor layer ACT may include a channel region C, a source region S, and a drain region D.

[0108] The source region S and the drain region D may be respectively disposed on opposite sides (e.g., opposite lateral sides) of the channel region C.

[0109] The channel region C may be an intrinsic semiconductor without doped impurities, and both the source region S and the drain region D may be non-intrinsic semiconductors (or impurity semiconductors) doped with conductive impurities.

[0110] The semiconductor layer ACT may be made of an oxide semiconductor. In this case, a separate protective layer (not shown) may be added to protect the oxide semiconductor material that may be vulnerable to the external environment (e.g., a relatively high-temperature environment).

[0111] The gate insulating layer GI may be disposed on the semiconductor layer ACT.

[0112] The gate insulating layer GI may be formed to contain silicon nitride (SiN x)、A single layer or multiple layers of at least one of silicon dioxide (SiO2) and silicon oxynitride, but the embodiments are not limited to these materials.

[0113] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may include at least one of copper (Cu), copper alloy, aluminum (Al), aluminum alloy, molybdenum (Mo), and molybdenum alloy, but the embodiments are not limited to these materials. In some embodiments, the gate electrode GE may have a multilayer structure in which at least two metal layers are stacked on top of each other in, for example, the third direction DR3.

[0114] The interlayer insulating layer IL1 may be disposed on both the gate electrode GE and the gate insulating layer GI.

[0115] The interlayer insulating layer IL1 may include at least one of silicon nitride (SiN x ), silicon dioxide (SiO2), and silicon oxynitride, but the embodiments are not limited to these materials.

[0116] Openings exposing the source region S and the drain region D may be provided (or formed) in the interlayer insulating layer IL1.

[0117] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer IL1.

[0118] The source electrode SE and the drain electrode DE may be connected to the source region S and the drain region D of the semiconductor layer ACT, respectively, through the openings formed in the interlayer insulating layer IL1.

[0119] The protective layer IL2 may be disposed on each of the interlayer insulating layer IL1, the source electrode SE, and the drain electrode DE.

[0120] The protective layer IL2 may at least partially cover and planarize the underlying structure (e.g., the interlayer insulating layer IL1, the source electrode SE, and the drain electrode DE). Increasing the flatness of the underlying structure may enable the first electrode E1 to be formed on the protective layer IL2 without (or substantially without) any steps.

[0121] The protective layer IL2 may be made of an organic material (such as at least one of polyacrylate resin and polyimide resin) and / or a laminated film (or multilayer film) of an organic material and an inorganic material.

[0122] The first electrode E1 may be disposed on the protective layer IL2.

[0123] The first electrode E1 may be electrically connected to the drain electrode DE through an opening in the protective layer IL2.

[0124] A driving transistor including, for example, the gate electrode GE, the semiconductor layer ACT, the source electrode SE, and the drain electrode DE may be connected to the first electrode E1 to supply a driving current to the light-emitting diode ED.

[0125] In addition to Figure 4 the driving transistor shown in, the display device 1000 according to some embodiments may further include a switching transistor (not shown) connected to a data line and configured to transmit a data voltage in response to receiving a scan signal, and a switching transistor (not shown) connected to the driving transistor and driven in response to the scan signal. The display device 1000 may further include a compensation transistor (not shown) configured to compensate the threshold voltage of a transistor (such as, the driving transistor).

[0126] The pixel defining layer PDL may be located on the protective layer IL2 and the first electrode E1. The pixel defining layer PDL may have a pixel opening that overlaps with the first electrode E1 in, for example, the third direction DR3 and defines a light emitting region (for example, at least partially bounds the light emitting region).

[0127] The pixel defining layer PDL may contain an organic material (such as, at least one of polyacrylate resin and polyimide resin) and / or a silica-based inorganic material.

[0128] The pixel opening may have a planar shape that is substantially similar to the shape of the first electrode E1 in a view in the third direction DR3. In some implementations, in a plan view (for example, in a view in the third direction DR3), the pixel opening may have a rhombus shape or an octagon shape similar to a rhombus shape, but the shape of the pixel opening is not limited to these examples. For example, in a view in, for example, the third direction DR3, the pixel opening may have any shape (such as, a square shape or other polygonal shape), or may have a circular shape, an oval shape, an elliptical shape, or a free form shape.

[0129] The light emitting layer EML may be disposed on the first electrode E1 and overlap with the pixel opening in, for example, the third direction DR3.

[0130] The light emitting layer EML may be made of a relatively low molecular weight organic material and / or a relatively high molecular weight organic material (such as, PEDOT (poly(3,4-ethylenedioxythiophene))).

[0131] A hole injection layer (“HIL”), a hole transport layer (“HTL”), an electron transport layer (“ETL”), and / or an electron injection layer (“EIL”) may be arranged above and / or below the light emitting layer EML. In some embodiments, the light emitting layer EML may be a multi-layer structure containing two or more layers.

[0132] The light emitting layer EML may be at least partially (for example, mostly) disposed in the pixel opening and may be disposed on the side surface (for example, the lateral side) of the pixel defining layer PDL.

[0133] Although the light-emitting layer EML is depicted as overlapping with the entire surface (or substantially the entire surface) of the first substrate SUB1, the embodiments are not limited to this example. For example, in some embodiments, the light-emitting layer EML may be provided only in the pixel apertures of the pixel defining layer PDL.

[0134] The second electrode E2 may be provided on the light-emitting layer EML.

[0135] The second electrode E2 may be provided across multiple pixels (and thus, overlap with multiple pixels in, for example, the third direction DR3), and may receive a common voltage through a common voltage emitter (not shown) in the non-display area PA.

[0136] The first electrode E1, the light-emitting layer EML, and the second electrode E2 may form a light-emitting diode ED.

[0137] The first electrode E1 may be an anode, which may be a hole injection electrode, and the second electrode E2 may be a cathode, which may be an electron injection electrode.

[0138] However, the embodiments are not limited to this example. For example, depending on the driving method of the display device 1000, the first electrode E1 may be a cathode and the second electrode E2 may be an anode.

[0139] Holes and electrons may be injected into the light-emitting layer EML from the first electrode E1 and the second electrode E2, respectively, and light emission may occur when an exciton (which is formed by the recombination of the injected holes and electrons) falls back from an excited state to a ground state.

[0140] The light-emitting diode ED according to an embodiment may include a plurality of light-emitting units (or structures). Each light-emitting unit may include a light-emitting layer EML. For example, the light-emitting diode ED according to an embodiment may include a plurality of light-emitting layers EML. The light-emitting diode ED may be a series-structured light-emitting diode, for example, a structure in which a plurality of light-emitting diodes are stacked on top of each other in, for example, the third direction DR3.

[0141] The plurality of light-emitting layers EML may emit light of the same color as each other or different colors. As an example, the light-emitting diode ED may emit light that is a mixed light of green light and blue light. In some implementations, the light-emitting diode ED may emit blue light.

[0142] The encapsulation layer ENC may be located on the second electrode E2. The encapsulation layer ENC may seal the display portion DC by covering not only the top surface of the display portion DC but also the side surfaces of the display portion DC including the light-emitting diode ED. Since the light-emitting diode ED may be relatively vulnerable to, for example, the penetration of moisture and oxygen (or sensitive to the penetration of, for example, moisture and oxygen), the encapsulation layer ENC may seal the display portion DC and block the inflow of external moisture and oxygen into, for example, the light-emitting diode ED.

[0143] The encapsulation layer ENC may include multiple layers, and among the multiple layers, the encapsulation layer ENC may be formed as a composite layer including both an inorganic layer and an organic layer. In some embodiments, the encapsulation layer ENC may be formed as a three-layer including a first inorganic layer EIL1, an organic layer EOL, and a second inorganic layer EIL2 formed in sequence, but the embodiments are not limited to this exemplary structure.

[0144] The color conversion part CC may be disposed on the encapsulation layer ENC.

[0145] The color conversion part CC may include a color mixing prevention layer DDL disposed on the encapsulation layer ENC. The color mixing prevention layer DDL may overlap with the entire surface (or substantially the entire surface) of the first substrate SUB1 in, for example, a third direction DR3. The color mixing prevention layer DDL according to an embodiment may include one or more (e.g., multiple) dichroic dyes and / or pigments. At least one dichroic dye according to an embodiment may be an anisotropic absorptive material.

[0146] The dichroic dye may have a long axis with a relatively high light transmittance and a short axis with a relatively low light transmittance. Due to this, the long axis of the dichroic dye may be a light transmission axis, and the short axis of the dichroic dye may be a light absorption axis. In some embodiments, one or more dichroic dyes included in the color mixing prevention layer DDL may be negative dichroic dyes. The long axes of one or more dichroic dyes included in the color mixing prevention layer DDL may be parallel to (or substantially parallel to) the thickness direction of the first substrate SUB1. For example, the long axes may be parallel to (or substantially parallel to) the third direction DR3. Along the thickness direction of the color mixing prevention layer DDL (e.g., the third direction DR3), the light transmittance may be relatively high, and along the direction parallel to (or substantially parallel to) the plane direction of the color mixing prevention layer DDL (e.g., the direction perpendicular to the thickness direction, such as the first direction DR1, the second direction DR2, etc.), the light absorbance may be relatively high.

[0147] The color mixing prevention layer DDL according to an embodiment may include at least one of a red dichroic dye, a green dichroic dye, and a blue dichroic dye. The red dichroic dye may transmit red light propagating along the thickness direction of the first substrate SUB1 and absorb red light propagating along a direction inclined with respect to the thickness direction of the first substrate SUB1 (or a lateral direction). The green dichroic dye may transmit green light propagating along the thickness direction of the first substrate SUB1 and absorb green light propagating along a direction inclined with respect to the thickness direction of the first substrate SUB1 (or a lateral direction). The blue dichroic dye may transmit blue light propagating along the thickness direction of the first substrate SUB1 and absorb blue light propagating along a direction inclined with respect to the thickness direction of the first substrate SUB1 (or a lateral direction).

[0148] The type of dichroic dye included in the color mixing prevention layer DDL may vary depending on the light emitted from the light emitting diode ED. When the light emitted from the light emitting diode ED is blue light, the color mixing prevention layer DDL may include a blue dichroic dye. When the light emitted from the light emitting diode ED is a mixed light of green light and blue light, the color mixing prevention layer DDL may include a green dichroic dye and a blue dichroic dye. When the light emitted from the light emitting diode ED is a mixed light of red light, green light and blue light, the color mixing prevention layer DDL may include a red dichroic dye, a green dichroic dye and a blue dichroic dye.

[0149] The partition wall BK may be provided on the color mixing prevention layer DDL.

[0150] The partition wall BK may include first apertures OP1, second apertures OP2 and third apertures OP3 that respectively overlap corresponding pixel apertures in, for example, a third direction DR3.

[0151] The sizes of the first apertures OP1, second apertures OP2 and third apertures OP3 may be different or the same. In some embodiments, the sizes of at least two of the first apertures OP1, second apertures OP2 and third apertures OP3 may be the same.

[0152] The first color conversion layer CCL1 may be provided in the first aperture OP1. The first color conversion layer CCL1 may convert the supplied light (or incident light) into red light. The first color conversion layer CCL1 may include first quantum dots QD1 and a scatterer SC.

[0153] The second color conversion layer CCL2 may be provided in the second aperture OP2. The second color conversion layer CCL2 may convert the supplied light into green light. The second color conversion layer CCL2 may include second quantum dots QD2 and a scatterer SC.

[0154] The transmissive layer TL may be provided in the third aperture OP3. The transmissive layer TL may be provided in a part of the display device 1000 corresponding to the blue light emitting region BLA. For example, the transmissive layer TL may be provided in a space separated by the partition wall BK that overlaps the blue light emitting region BLA in, for example, a third direction DR3.

[0155] The transmissive layer TL may transmit the light emitted from the light emitting diode ED. The transmissive layer TL may include a scatterer SC. The scatterer SC may be at least one selected from the group consisting of: SiO2, BaSO4, Al2O3, ZnO, ZrO2 and TiO2.

[0156] Reference Figure 5, the display device 1000 according to an embodiment may include a first light-emitting diode ED1 overlapping with a first color conversion layer CCL1 in, for example, a third direction DR3, and a second light-emitting diode ED2 overlapping with a second color conversion layer CCL2 in, for example, the third direction DR3.

[0157] When light is emitted from the second light-emitting diode ED2, the light may be emitted in various directions. The light L1 emitted toward the side (for example, the light L1 that is generally emitted toward the first color conversion layer CCL1 and / or the transmissive layer TL) (i.e., the side light) may pass through the encapsulation layer ENC and enter the color mixing prevention layer DDL. As used herein, the phrase "side light" may refer to "off-axis light" that is incident on the color mixing prevention layer DDL at an oblique angle rather than a perpendicular angle (or a substantially perpendicular angle). In some embodiments, the "side light" may be regarded as "off-axis light" related to the orientation of the long axis of one or more dichroic dyes DD in the color mixing prevention layer DDL (see, Figure 6 ). Therefore, the phrases "side light" and "off-axis light" may be used interchangeably. As Figure 6 shown, the light incident on the color mixing prevention layer DDL (or incident to the color mixing prevention layer DDL) may be incident in a direction inclined with respect to the long axis of the dichroic dye DD.

[0158] Refer to Figure 7 , the front transmittance of the color mixing prevention layer DDL is relatively high in the entire wavelength band (or substantially the entire wavelength band) (such as, Figure 7 the wavelength band depicted in). However, the side transmittance of the color mixing prevention layer DDL may have a significantly low value (or a range of low values) within a certain wavelength range. For example, depending on the lateral direction (or the inclination direction) of the light L1, the light L1 may be absorbed and not incident on the first color conversion layer CCL1. Accordingly, unnecessary (or undesired) light conversion due to off-axis light can be prevented (or at least slowed down), and color reproducibility can be improved.

[0159] In the case where the color mixing prevention layer DDL is omitted, the light emitted from the second light-emitting diode ED2 toward the first color conversion layer CCL1 may be incident on the first color conversion layer CCL1. The light incident on the first color conversion layer CCL1 may be converted into, for example, red light by the first quantum dot QD1, and may leave the first color conversion layer CCL1. Because of this, the light may propagate from an undesired region (and / or propagate in an undesired direction), and there is a possibility of color mixing, which may reduce the display quality of the display device that does not include the color mixing prevention layer DDL. However, according to various embodiments, the color mixing prevention layer DDL can be used to prevent (or at least slow down) undesired light propagation and color mixing, which can improve the display quality of the related display device 1000.

[0160] Quantum dots including a first quantum dot QD1 and a second quantum dot QD2 will be described in more detail below.

[0161] In the present specification, a quantum dot (hereinafter, also referred to as a "semiconductor nanocrystal") includes at least one of a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element or compound, a Group I-III-VI compound, and a Group II-III compound, and in some embodiments, may additionally (or optionally) include at least one of a Group II-III-VI compound and a Group I-II-IV-VI compound. However, the embodiments are not limited to these examples.

[0162] The Group II-VI compound may be at least one selected from the group consisting of: binary compounds (such as, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and / or any mixture of two or more binary compounds); ternary compounds (such as, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and / or any mixture of two or more ternary compounds); and quaternary compounds (such as, HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, and / or any mixture of two or more quaternary compounds). However, the embodiments are not limited to these examples.

[0163] The Group II-VI compound may further include a Group III metal. However, the embodiments are not limited to these examples.

[0164] The Group III-V compound can be at least one selected from the group consisting of: binary compounds (such as, GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and / or any mixture of two or more binary compounds); ternary compounds (such as, GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, InPSb and / or any mixture of two or more ternary compounds); and quaternary compounds (such as, GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and / or any mixture of two or more quaternary compounds). However, the embodiments are not limited to these examples.

[0165] The Group III-V compound may further include a Group II metal (e.g., InZnP). However, the embodiments are not limited to these examples.

[0166] The Group IV-VI compound can include at least one selected from the group consisting of: binary compounds (such as, SnS, SnSe, SnTe, PbS, PbSe, PbTe and / or any mixture of two or more binary compounds); ternary compounds (such as, SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and / or any mixture of two or more ternary compounds); and quaternary compounds (such as, SnPbSSe, SnPbSeTe, SnPbSTe and / or any mixture of two or more quaternary compounds). However, the embodiments are not limited to these examples.

[0167] The Group IV element or compound can be at least one selected from the group consisting of: single-element materials (such as, Si, Ge and / or any mixture thereof) and binary compounds (such as, SiC, SiGe and / or any mixture thereof). However, the embodiments are not limited to these examples.

[0168] Examples of the Group I-III-VI compound include, but are not limited to, at least one of CuInSe2, CuInS2, CuInGaSe, and CuInGaS.

[0169] Examples of the Group I-II-IV-VI compounds include, but are not limited to, at least one of CuZnSnSe and CuZnSnS.

[0170] The Group II-III-VI compounds may include at least one of ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe, and HgAlTe. In some embodiments, the Group II-III-VI compounds may be at least one selected from the group consisting of HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, and MgInSe. However, the embodiments are not limited to these examples.

[0171] In an embodiment, the quantum dots may not include cadmium.

[0172] The quantum dots may include semiconductor nanocrystals based on Group III-V compounds, which Group III-V compounds include, for example, indium and phosphorus.

[0173] The Group III-V compounds may further include zinc.

[0174] The quantum dots may include semiconductor nanocrystals based on Group II-VI compounds, which semiconductor nanocrystals based on Group II-VI compounds include, for example, chalcogens (e.g., sulfur, selenium, tellurium, and / or any combination thereof) and zinc.

[0175] In the quantum dots, the binary compounds, ternary compounds, and / or quaternary compounds mentioned above may be present in the quantum dots at a uniform concentration, or may be partially partitioned into a concentration distribution of different states and present in the quantum dots.

[0176] In some embodiments, one quantum dot may have a core-shell structure surrounding at least one other quantum dot.

[0177] The interface between the core and the shell may have a concentration gradient in which the concentration of the elements present in the shell decreases towards the center of the core.

[0178] In some embodiments, the quantum dots may have a core-shell structure including a core containing at least one of the above semiconductor nanocrystals and a shell surrounding the core.

[0179] The shell of the quantum dots may be used as a protective layer for maintaining semiconductor properties by preventing (or at least slowing down) chemical denaturation of the core and / or as a charging layer for imparting electrophoretic properties to the quantum dots.

[0180] The shell can be a single-layer structure or a multi-layer structure.

[0181] Examples of the shell of the quantum dots include at least one of metal oxides, non-metal oxides, and semiconductor compounds.

[0182] For example, the metal oxide or non-metal oxide can be a binary compound (such as, SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, MgAl2O4, CoFe2O4, NiFe2O4, CoMn2O4, etc.), but the embodiments are not limited to these examples.

[0183] The semiconductor compound can include, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., however, the embodiments are not limited to these examples.

[0184] In some embodiments, the semiconductor nanocrystal can have a structure including a single semiconductor nanocrystal core and a multi-layer shell surrounding the single semiconductor nanocrystal core.

[0185] In an embodiment, the multi-layer shell can have two or more layers (such as, 2 layers, 3 layers, 4 layers, 5 layers or more layers).

[0186] Two adjacent layers of the multi-layer shell can have a single composition (or share the same composition) or different compositions.

[0187] In the multi-layer shell, each layer can have a composition that changes along the radius of the quantum dot (or the layer of the quantum dot).

[0188] The quantum dot can have a full width at half maximum ("FWHM") of the emission wavelength spectrum of about 45 nm or less (such as, about 40 nm or less or about 30 nm or less), and within this range, color purity and / or color reproducibility can be improved.

[0189] According to some embodiments, since the light emitted by (or through) these quantum dots can be emitted in all directions (or substantially all directions), the optical viewing angle of the display device 1000 including the quantum dots can be improved.

[0190] One or more quantum dots can have a band gap between different shell materials and core materials.

[0191] For example, the band gap of the shell material can be greater than the band gap of the core material.

[0192] In some embodiments, the bandgap of the shell material can be less than the bandgap of the core material.

[0193] The quantum dots can have multiple layers of shells.

[0194] In a multi-layer shell, the bandgap of the outer layer (e.g., the layer farther from the core of the relevant quantum dot) can be greater than the bandgap of the inner layer (e.g., the layer closer to the core of the relevant quantum dot).

[0195] In a multi-layer shell, the bandgap of the outer layer can be less than the bandgap of the inner layer.

[0196] In some embodiments, by adjusting the composition and / or size of the quantum dots, the quantum dots can be used to control the absorption wavelength and / or emission wavelength.

[0197] The maximum emission peak wavelength of the quantum dots can be in the range of, for example, wavelengths (or wavelength ranges) associated with ultraviolet radiation to wavelengths (or wavelength ranges) associated with infrared radiation or even wavelengths longer than infrared radiation. For example, the range of the maximum emission peak wavelength of the quantum dots can have a lower limit in the range of about 10 nm to about 400 nm and an upper limit in the range of about 780 nm to about 1 mm or even longer. However, the embodiments are not limited to these examples.

[0198] In some embodiments, the quantum dots can have a quantum efficiency of at least about 10% (e.g., at least about 30%, at least about 50%, at least about 60%, at least about 70%, at least about 90% or even about 100%).

[0199] In some embodiments, the quantum dots can have a relatively narrow spectrum. The quantum dots can have, for example, a full width at half maximum (FWHM) of the emission wavelength spectrum of about 50 nm or less (e.g., about 45 nm or less, about 40 nm or less, or about 30 nm or less).

[0200] The quantum dots can have a particle size in the range of about 1 nm or greater to about 100 nm or less. The particle size refers to the diameter of the particle or the diameter determined based on a two-dimensional image obtained by, for example, transmission electron microscopy analysis assuming a spherical shape.

[0201] In some embodiments, the size of the quantum dots can be in the range of about 1 nm to about 50 nm. For example, the lower limit of this range can be at least about 2 nm, at least about 3 nm, or at least about 4 nm, and the upper limit of this range can be at most about 50 nm, at most about 40 nm, at most about 30 nm, at most about 20 nm, at most about 15 nm, or at least about 10 nm. In some implementations, the size can be a few nanometers or less.

[0202] The shape of the quantum dots is not specifically limited. For example, the shape of the quantum dots may include, but is not limited to, spheres, polyhedrons (such as cubes or cuboids), cones, multi-legged bodies (e.g., bipedal bodies, tripedal bodies, quadrupedal bodies, etc.), nanotubes, nanorods, nanowires, nanosheets, or any combination of these shapes. However, the embodiments are not limited to these example shapes.

[0203] The quantum dots are commercially available or may be synthetic.

[0204] During the colloidal synthesis of the quantum dots, the particle size of the quantum dots can be relatively freely controlled, and the particle size can also be uniformly adjusted, or even made uniform (or substantially uniform).

[0205] The quantum dots may include organic ligands (e.g., organic ligands having hydrophobic and / or hydrophilic moieties).

[0206] Organic ligand residues can bind to the surface of the quantum dots.

[0207] The organic ligands may include at least one of RCOOH, RNH2, R2NH, R3N, RSH, R3PO, R3P, ROH, RCOOR, RPO(OH)2, RHPOOH, and R2POOH, where each R is independently at least one of a substituted or unsubstituted C3 to C40 alkyl (e.g., an alkyl of C5 or more and C24 or less), a substituted or unsubstituted C3 to C40 alkenyl, a substituted or unsubstituted C3 to C40 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C40 aryl, and a substituted or unsubstituted C6 to C40 aromatic hydrocarbon group (e.g., an aromatic hydrocarbon group of C6 or more and C20 or less). However, the embodiments are not limited to these examples.

[0208] Examples of the organic ligand may include thiol compounds (e.g., methanethiol, ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, octanethiol, dodecanethiol, hexadecanethiol, octadecanethiol, and benzyl thiol), amines (e.g., methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, octylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dimethylamine, diethylamine, dipropylamine, tributylamine, trioctylamine, etc.), carboxylic acid compounds (e.g., formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, octanoic acid, dodecanoic acid, hexadecanoic acid, octadecanoic acid, oleic acid, and benzoic acid), phosphine compounds (e.g., methylphosphine, ethylphosphine, propylphosphine, butylphosphine, pentylphosphine, octylphosphine, dioctylphosphine, tributylphosphine, trioctylphosphine, etc.), oxides of phosphine compounds (e.g., methylphosphine oxide, ethylphosphine oxide, propylphosphine oxide, butylphosphine oxide, pentylphosphine oxide, tributylphosphine oxide, octylphosphine oxide, dioctylphosphine oxide, trioctylphosphine oxide, diphenylphosphine oxide, triphenylphosphine oxide), C5 to C20 alkylphosphinic acids and C5 to C20 alkylphosphonic acids (e.g., hexylphosphinic acid, octylphosphinic acid, dodecylphosphinic acid, tetradecylphosphinic acid, hexadecylphosphinic acid, and octadecylphosphinic acid), or at least one of them. However, the embodiments are not limited to these examples.

[0209] The quantum dots may include a single hydrophobic organic ligand or a mixture of one or more types of hydrophobic organic ligands.

[0210] The hydrophobic organic ligand may not contain photopolymerizable residues (e.g., acrylate group, methacrylate group, etc.).

[0211] Referring again to Figure 4 , the color conversion section CC includes a second substrate SUB2 that overlaps the first substrate SUB1 in, for example, a third direction DR3.

[0212] The second substrate SUB2 may include a flexible material (e.g., plastic), which, contrary to a conventional rigid substrate, can be inherently bent, folded, rolled up, twisted, and / or otherwise curved. In some embodiments, the second substrate SUB2 may include at least one flexible region and at least one rigid region. In an embodiment, the second substrate SUB2 may be a rigid substrate.

[0213] The color conversion section CC may include a first color filter CF1, a second color filter CF2, and a third color filter CF3 disposed between the second substrate SUB2 and the display section DC.

[0214] The first color filter CF1 may overlap the transmissive layer TL in, for example, a third direction DR3.

[0215] The first color filter CF1 transmits blue light that passes through the transmissive layer TL and absorbs light of the remaining wavelengths (or other wavelengths), thereby increasing the purity of the blue light emitted to the outside of the display device 1000.

[0216] The second color filter CF2 may overlap with the first color conversion layer CCL1 in, for example, the third direction DR3.

[0217] The second color filter CF2 transmits red light that passes through the first color conversion layer CCL1 and absorbs light of the remaining wavelengths (or other wavelengths), thereby increasing the purity of the red light emitted to the outside of the display device 1000.

[0218] The third color filter CF3 may overlap with the second color conversion layer CCL2 in, for example, the third direction DR3.

[0219] The third color filter CF3 transmits green light that passes through the second color conversion layer CCL2 and absorbs light of the remaining wavelengths (or other wavelengths), thereby increasing the purity of the green light emitted to the outside of the display device 1000.

[0220] At least two of the third color filter CF3, the second color filter CF2, and the first color filter CF1 may overlap with each other in the non-light-emitting region NLA in, for example, the third direction DR3, and for this reason, they can be used as a light-blocking layer.

[0221] The non-light-emitting region NLA may overlap with both the pixel defining layer PDL of the display section DC and the partition wall BK of the color conversion section CC in, for example, the third direction DR3.

[0222] The third insulating layer IL3 may be provided between the first to third color filters CF1, CF2, and CF3 and the display section DC.

[0223] The third insulating layer IL3 may include an organic material and / or an inorganic material (such as, for example, silicon nitride (SiN x ), silicon dioxide (SiO2), silicon oxynitride, etc.).

[0224] The filling layer FL may be located between the third insulating layer IL3 and the display section DC in, for example, the third direction DR3.

[0225] The filling layer FL may bond components formed on the first substrate SUB1 and components formed on the second substrate SUB2.

[0226] The first substrate SUB1 and the second substrate SUB2 may be combined (or joined together) through the filling layer FL.

[0227] The display device 1000 according to an embodiment may include a color mixing prevention layer (e.g., color mixing prevention layer DDL) to prevent (or at least slow down) color mixing due to off-axis light emitted from, for example, the light emitting diode ED. This may improve the color gamut of the related display device 1000, and thus, provide a display device 1000 with improved display quality.

[0228] Hereinafter, various display panels according to some embodiments will be described with reference to Figures 8 to 15 FIGs. Figures 8 to 15 , ,

[0229] , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 are schematic cross-sectional views of display panels according to various embodiments.

[0229] Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 The description of components identical to those described above will be omitted or briefly described.

[0230] First, referring to FIG. Figure 8 , the color conversion section CC according to an embodiment may include a color mixing prevention layer DDL provided on the encapsulation layer ENC.

[0231] First, referring to Figure 8 , the color conversion section CC according to an embodiment may include a color mixing prevention layer DDL provided on the encapsulation layer ENC.

[0232] The color mixing prevention layer DDL may overlap with a part of the first substrate SUB1 in, for example, the third direction DR3.

[0233] The color mixing prevention layer DDL may overlap with openings (e.g., first to third openings OP1, OP2, and OP3) included in the partition wall BK in, for example, the third direction DR3.

[0234] The color mixing prevention layer DDL may be patterned.

[0235] The color mixing prevention layer DDL may be spaced apart from at least a part of the partition wall BK.

[0236] The color mixing prevention layer DDL may not overlap with at least a part of the partition wall BK in, for example, the third direction DR3. In some embodiments, a part of the color mixing prevention layer DDL may overlap with a corresponding part of the partition wall BK in, for example, the third direction DR3. For this reason, a part of the color mixing prevention layer DDL may be provided between the corresponding part of the partition wall BK and the encapsulation layer ENC in, for example, the third direction DR3.

[0237] The color mixing prevention layer DDL may overlap with at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, the third direction DR3.

[0238] The color mixing prevention layer DDL can prevent (or at least slow down) color mixing by absorbing off-axis light that would otherwise be incident on the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL (or incident on the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL).

[0239] Reference Figure 9 According to an embodiment, the color mixing prevention layer DDL can overlap at least a portion of the first substrate SUB1 in, for example, a third direction DR3.

[0240] The color mixing prevention layer DDL can overlap at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, a third direction DR3.

[0241] The color mixing prevention layer DDL can be spaced apart from at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL.

[0242] The color mixing prevention layer DDL can be formed only in regions where color mixing may occur.

[0243] Although Figure 9 an embodiment is depicted in which the color mixing prevention layer DDL is disposed in the blue light emitting region BLA and the red light emitting region RLA but not in the green light emitting region GLA, the embodiment is not limited to this example.

[0244] For example, in some embodiments, the color mixing prevention layer DDL can be selectively disposed in at least one of the red light emitting region RLA, the green light emitting region GLA, and the blue light emitting region BLA, and selectively not disposed in at least one of the remaining light emitting regions of the red light emitting region RLA, the green light emitting region GLA, and the blue light emitting region BLA.

[0245] Reference Figure 10 The stacked structure of the display portion DC can be similar to the stacked structure Figure 4 described.

[0246] The color conversion portion CC can include a second substrate SUB2 that can overlap the first substrate SUB1 in, for example, a third direction DR3.

[0247] The second substrate SUB2 can include a flexible material (such as, plastic), which, contrary to a conventional rigid substrate, can inherently bend, fold, roll up, twist, and / or otherwise flex. In some embodiments, the second substrate SUB2 can include at least one flexible region and at least one rigid region. In an embodiment, the second substrate SUB2 can be a rigid substrate.

[0248] The color conversion section CC includes a first color filter CF1, a second color filter CF2, and a third color filter CF3 disposed between the second substrate SUB2 and the display section DC.

[0249] At least two of the third color filter CF3, the second color filter CF2, and the first color filter CF1 may overlap each other in the non-light emitting region NLA in, for example, the third direction DR3, and thus can be used as a light blocking layer.

[0250] The non-light emitting region NLA may overlap both the pixel defining layer PDL of the display section DC and the partition wall BK of the color conversion section CC in, for example, the third direction DR3.

[0251] The third insulating layer IL3 may be disposed between the first to third color filters CF1, CF2, and CF3 and the display section DC in, for example, the third direction DR3.

[0252] The third insulating layer IL3 may include at least one of an organic material and an inorganic material (such as, silicon nitride (SiN x ), silicon dioxide (SiO2), silicon oxynitride, etc.).

[0253] The partition wall BK, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL may be located between the third insulating layer IL3 and the display section DC in, for example, the third direction DR3.

[0254] The partition wall BK may be disposed on one side (e.g., the lower side) of the third insulating layer IL3.

[0255] The partition wall BK may include a first opening OP1, a second opening OP2, and a third opening OP3 that overlap with the pixel opening in, for example, the third direction DR3.

[0256] The first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL may be disposed on one side (e.g., the lower side) of the third insulating layer IL3.

[0257] The first color conversion layer CCL1 may be disposed in the first opening OP1.

[0258] The second color conversion layer CCL2 may be disposed in the second opening OP2.

[0259] The transmissive layer TL may be disposed in the third opening OP3.

[0260] The filling layer FL may be disposed between the display section DC and each of the partition wall BK, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, the third direction DR3.

[0261] The filling layer FL can be combined to form components on the first substrate SUB1 and components on the second substrate SUB2.

[0262] The first substrate SUB1 and the second substrate SUB2 can be combined (or joined) together through the filling layer FL.

[0263] The color mixing prevention layer DDL can be disposed between the filling layer FL and the display portion DC in, for example, the third direction DR3.

[0264] The color conversion portion CC can include the color mixing prevention layer DDL disposed on the encapsulation layer ENC.

[0265] The color mixing prevention layer DDL can overlap with the entire surface (or substantially the entire surface) of the first substrate SUB1 in, for example, the third direction DR3.

[0266] The color mixing prevention layer DDL according to an embodiment can include one or more (e.g., multiple) dichroic dyes DD and / or pigments.

[0267] At least one dichroic dye DD according to an embodiment can be an anisotropic absorptive material.

[0268] The dichroic dye DD can have a long axis with a relatively high transmittance and a short axis with a relatively low transmittance.

[0269] The long axes of one or more dichroic dyes DD included in the color mixing prevention layer DDL can be parallel to (or substantially parallel to) the thickness direction of the first substrate SUB1. For example, the long axes can be parallel to (or substantially parallel to) the third direction DR3. Along the thickness direction of the color mixing prevention layer DDL (e.g., the third direction DR3), the transmittance can be relatively high, and along the direction parallel to (or substantially parallel to) the plane of the color mixing prevention layer DDL (e.g., the direction perpendicular to the thickness direction, such as the first direction DR1, the second direction DR2, etc.), the absorbance can be relatively high.

[0270] The color mixing prevention layer DDL according to an embodiment can include at least one of a red dichroic dye, a green dichroic dye, and a blue dichroic dye.

[0271] The red dichroic dye can transmit red light propagating along the thickness direction of the first substrate SUB1 and absorb red light propagating along a direction inclined with respect to the thickness direction of the first substrate SUB1.

[0272] The green dichroic dye can transmit green light propagating along the thickness direction of the first substrate SUB1 and absorb green light propagating along a direction inclined with respect to the thickness direction of the first substrate SUB1.

[0273] The blue dichroic dye transmits blue light propagating along the thickness direction of the first substrate SUB1 and absorbs blue light propagating in a direction inclined with respect to the thickness direction of the first substrate SUB1.

[0274] The type of the dichroic dye DD included in the color mixing prevention layer DDL may change depending on the light emitted from the light emitting diode ED.

[0275] When the light emitted from the light emitting diode ED is blue light, the color mixing prevention layer DDL may include a blue dichroic dye.

[0276] When the light emitted from the light emitting diode ED is a mixed light of green light and blue light, the color mixing prevention layer DDL may include a green dichroic dye and a blue dichroic dye.

[0277] When the light emitted from the light emitting diode ED is a mixed light of red light, green light and blue light, the color mixing prevention layer DDL may include a red dichroic dye, a green dichroic dye and a blue dichroic dye.

[0278] The color mixing prevention layer DDL according to an embodiment may at least partially prevent (or at least slow down) color mixing caused by light emitted from, for example, the light emitting diode ED in a direction inclined with respect to the orientation of the major axis of one or more dichroic dyes DD, thereby providing a display device 1000 having improved color reproducibility and display quality.

[0279] Reference Figure 11 , the color conversion section CC according to an embodiment may include a color mixing prevention layer DDL provided on the encapsulation layer ENC.

[0280] The color mixing prevention layer DDL may overlap with a part of the first substrate SUB1 in, for example, the third direction DR3.

[0281] The color mixing prevention layer DDL may overlap with the openings (for example, the first to third openings OP1, OP2 and OP3) included in the partition wall BK in, for example, the third direction DR3.

[0282] The color mixing prevention layer DDL may overlap with the pixel openings included in the pixel definition layer PDL in, for example, the third direction DR3.

[0283] The color mixing prevention layer DDL may be spaced apart from at least a part of the partition wall BK.

[0284] The color mixing prevention layer DDL may not overlap with at least a part of the partition wall BK in, for example, the third direction DR3.

[0285] The color mixing prevention layer DDL may not overlap at least a portion of the pixel definition layer PDL in, for example, a third direction DR3. In some implementations, a portion of the color mixing prevention layer DDL may overlap a corresponding portion of the pixel definition layer PDL in, for example, a third direction DR3.

[0286] The color mixing prevention layer DDL may overlap the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, a third direction DR3.

[0287] The color mixing prevention layer DDL may prevent (or at least mitigate) color mixing by absorbing off-axis light that may otherwise be incident on the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL (or incident to the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL).

[0288] The color mixing prevention layer DDL according to an embodiment may be disposed between the filling layer FL and the encapsulation layer ENC.

[0289] The color mixing prevention layer DDL may be disposed on top of the encapsulation layer ENC (e.g., directly on top of the encapsulation layer ENC) and may contact (e.g., directly contact) the filling layer FL, but the arrangement of the color mixing prevention layer DDL is not limited to this example.

[0290] A separate protective layer (not shown) may be located between the color mixing prevention layer DDL and the filling layer FL.

[0291] Reference Figure 12 , the color mixing prevention layer DDL according to an embodiment may overlap at least a portion of the first substrate SUB1 in, for example, a third direction DR3.

[0292] The color mixing prevention layer DDL may overlap at least a portion of the encapsulation layer ENC in, for example, a third direction DR3.

[0293] The color mixing prevention layer DDL may overlap at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, a third direction DR3.

[0294] The color mixing prevention layer DDL may be spaced apart from at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL.

[0295] The color mixing prevention layer DDL may be formed only in regions where color mixing may occur.

[0296] Although Figure 12Illustrates an embodiment in which the color mixing prevention layer DDL is provided in the blue light-emitting region BLA and the red light-emitting region RLA but not in the green light-emitting region GLA, but the embodiment is not limited to this example.

[0297] For example, in some embodiments, the color mixing prevention layer DDL can be selectively provided in at least one of the red light-emitting region RLA, the green light-emitting region GLA, and the blue light-emitting region BLA, and selectively not provided in at least one of the remaining light-emitting regions of the red light-emitting region RLA, the green light-emitting region GLA, and the blue light-emitting region BLA.

[0298] Reference Figure 13 , according to an embodiment, the color mixing prevention layer DDL can be provided (e.g., in the third direction DR3) between the partition wall BK and the filling layer FL, between the first color conversion layer CCL1 and the filling layer FL, between the second color conversion layer CCL2 and the filling layer FL, and between the transmissive layer TL and the filling layer FL.

[0299] In addition to the position where the color mixing prevention layer DDL is provided, the color mixing prevention layer DDL can have a structure substantially the same as that described in reference Figure 10 described.

[0300] Reference Figure 14 , according to an embodiment, the color mixing prevention layer DDL can be provided (e.g., in the third direction DR3) between the first color conversion layer CCL1 and the filling layer FL, between the second color conversion layer CCL2 and the filling layer FL, and between the transmissive layer TL and the filling layer FL.

[0301] The color mixing prevention layer DDL can be provided between adjacent partition walls BK, for example, in a view in the third direction DR3.

[0302] The color mixing prevention layer DDL can overlap with the first to third openings OP1, OP2, and OP3 included in the partition wall BK, for example, in the third direction DR3.

[0303] The color mixing prevention layer DDL can overlap with the pixel openings included in the pixel definition layer PDL, for example, in the third direction DR3.

[0304] The color mixing prevention layer DDL can be spaced apart from the partition wall BK, for example, in a view in the third direction DR3. In some embodiments, the color mixing prevention layer DDL can contact (e.g., directly contact) one or more portions of the partition wall BK.

[0305] The color mixing prevention layer DDL can overlap with the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL, for example, in the third direction DR3.

[0306] The color mixing prevention layer DDL is accessible (e.g., directly accessible) to the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL.

[0307] The color mixing prevention layer DDL can prevent (or at least slow down) color mixing by absorbing off-axis light that would otherwise be incident on the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL (or incident to the first color conversion layer CCL1, the second color conversion layer CCL2, and / or the transmissive layer TL).

[0308] Depending on the implementation, a separate protective layer (not shown) can be located between the color mixing prevention layer DDL, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL.

[0309] Reference Figure 15 , the color mixing prevention layer DDL can overlap at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL in, for example, a third direction DR3.

[0310] The color mixing prevention layer DDL can be spaced apart from at least one of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL.

[0311] The color mixing prevention layer DDL can be formed only in regions where color mixing may occur.

[0312] Although Figure 15 an implementation is depicted where the color mixing prevention layer DDL is provided in the blue light emitting region BLA and the red light emitting region RLA but not in the green light emitting region GLA, the implementation is not limited to this example.

[0313] For example, in some implementations, the color mixing prevention layer DDL can be selectively provided in at least one of the red light emitting region RLA, the green light emitting region GLA, and the blue light emitting region BLA, and selectively not provided in at least one of the remaining light emitting regions of the red light emitting region RLA, the green light emitting region GLA, and the blue light emitting region BLA.

[0314] A display device according to one or more implementations can prevent (or at least slow down) unnecessary (or undesired) light conversion due to light emitted from a light emitting diode in a lateral direction (or a sufficiently inclined direction), and thereby, provide an improved color gamut and an increased display quality.

[0315] Although some detailed descriptions have been made of the foregoing embodiments for the purpose of clear understanding, it will be obvious that certain changes and modifications can be practiced within the scope of the claims. It should be noted that there are many alternative ways to implement the processes, systems and devices of the disclosed embodiments. Accordingly, the embodiments should be regarded as illustrative rather than restrictive, and the embodiments are not limited to the details given herein.

Claims

1. A display device comprising: a first substrate; a transistor, disposed on the surface of the first substrate; a light emitting diode electrically connected to the transistor; an encapsulation layer, disposed on the light-emitting diode; a color mixing prevention layer, disposed on the encapsulation layer; a partition wall, disposed on the color mixing prevention layer, the partition wall comprising a first opening, a second opening, and a third opening; a first color conversion layer, disposed in the first opening; a second color conversion layer, disposed in the second opening; and a transmission layer, disposed in the third opening, The color mixing prevention layer comprises one or more dichroic dyes and / or pigments.

2. The display device according to claim 1, wherein: The one or more dichroic dyes have a major axis along which they transmit light and a minor axis along which they absorb light, and The major axis extends in a first direction perpendicular to the surface, The minor axis extends in a second direction perpendicular to the first direction.

3. The display device according to claim 1, wherein: The partition wall, the first color conversion layer, the second color conversion layer, and the transmission layer each have a first surface facing the first substrate, and The first surfaces of each of the partition wall, the first color conversion layer, the second color conversion layer, and the transmission layer directly contact the color mixture prevention layer.

4. The display device according to claim 1, wherein: In a view in a direction perpendicular to the surface, the color mixture prevention layer overlaps each of the first opening, the second opening, and the third opening, respectively, and does not overlap at least a portion of the partition wall.

5. The display device according to claim 1, wherein: The color mixture prevention layer overlaps at least one of the first color conversion layer, the second color conversion layer, and the transmission layer in a view in a direction perpendicular to the surface.

6. A display device comprising: a first substrate; a transistor, disposed on the surface of the first substrate; a light emitting diode electrically connected to the transistor; an encapsulation layer, disposed on the light-emitting diode; a color mixing prevention layer, disposed on the encapsulation layer; a second substrate overlapping the first substrate in a direction perpendicular to the surface; a partition wall, disposed on the second substrate, the partition wall comprising a first opening, a second opening, and a third opening; a first color conversion layer, disposed in the first opening; a second color conversion layer, disposed in the second opening; and a transmission layer, disposed in the third opening, The color mixing prevention layer comprises one or more dichroic dyes and / or pigments.

7. The display device according to claim 6, further comprising: a filling layer, provided between the isolation wall and the encapsulation layer in the direction perpendicular to the surface, In the direction perpendicular to the surface, the color mixing prevention layer is arranged between the filling layer and the encapsulation layer.

8. The display device according to claim 6, wherein: The color mixture preventing layer overlaps the entire surface in the direction perpendicular to the surface.

9. The display device according to claim 6, wherein: The color mixture prevention layer overlaps each of the first color conversion layer, the second color conversion layer, and the transmission layer, respectively, in a view in the direction perpendicular to the surface.

10. The display device according to claim 7, wherein: The color mixture prevention layer overlaps at least one of the first color conversion layer, the second color conversion layer, and the transmission layer in a view in the direction perpendicular to the surface.

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