Modularized high-temperature superconducting current lead device

Abstract

The invention relates to the technical field of current leads, in particular to a modular high-temperature superconducting current lead device which comprises a lead mechanism and end connectors arranged at the two ends of the lead mechanism, the lead mechanism comprises a protective layer and a middle cooling mounting assembly, and the middle cooling mounting assembly comprises a center supporting frame with a hollow channel in the middle. A plurality of high-temperature superconducting current lead units are inserted into the circumferential side of the central supporting frame, and an auxiliary cooling unit is arranged between every two adjacent high-temperature superconducting current lead units. According to the modularized high-temperature superconducting current lead device, cooperative work of the main cooling channel and the auxiliary cooling channel is achieved, the heat dissipation performance is improved, the problem of local overheating is solved, assembling is achieved in a plug-in mode, installation is convenient and fast, the protective layer is composed of the supporting drainage layer and the insulating layer which are sequentially arranged from inside to outside, the mechanical strength is enhanced, and the service life is prolonged. And the heat dissipation performance is improved, and the quench recovery time is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of current leads, and in particular to a modular high-temperature superconducting current lead device. Background Art

[0002] Conventional superconducting devices often use metals such as copper or aluminum alloys for current leads. Their single structure, which spans from room temperature to cryogenic temperatures, results in significant heat loads. On the one hand, the high thermal conductivity of metals (e.g., copper, approximately 400 W / m·K) causes conductive heat leakage; on the other hand, Joule heating generated by lead resistance further exacerbates heat losses in cryogenic systems. Research has shown that heat leakage from these leads accounts for over 70% of the total system heat load, significantly increasing cooling energy consumption and hindering the long-term operation of superconducting equipment.

[0003] To reduce heat leakage, high-temperature superconducting current leads have emerged. Their room-temperature sections utilize metal materials to ensure a low-resistance connection, while the low-temperature sections utilize superconducting tape (such as YBCO). Superconducting materials exhibit zero resistance at low temperatures, enabling efficient power transmission. The cooling system is a critical component of the entire high-temperature superconducting current lead structure, typically using liquid nitrogen or other cooling media to maintain the superconducting current lead below its critical temperature, ensuring its superconducting properties. For example, patent publication CN102243907B discloses an improved high-temperature superconducting binary current lead that cools the central channel with nitrogen. However, this approach suffers from poor heat dissipation and fails to address localized overheating, resulting in unsafe and reliable operation of the lead. Summary of the Invention

[0004] The purpose of the present invention is to provide a modular high-temperature superconducting current lead device to solve the above technical problems.

[0005] To achieve the above-mentioned objectives, the present invention provides a modular high-temperature superconducting current lead device, comprising a lead mechanism and end connectors arranged at both ends of the lead mechanism, the lead mechanism comprising a protective layer and a central cooling installation assembly, the central cooling installation assembly comprising a central support frame with a hollow channel in the middle, the hollow channel being used for injecting coolant, a plurality of high-temperature superconducting current lead units being plugged into the circumferential side of the central support frame, and auxiliary cooling units being arranged between adjacent high-temperature superconducting current lead units.

[0006] Preferably, the central support frame is made of stainless steel and has a plurality of first T-shaped slots on its circumferential side.

[0007] Preferably, the high-temperature superconducting current lead unit includes a superconducting support frame, at least two superconducting tapes are arranged in the superconducting support frame, a first mounting plate is provided at the bottom of the superconducting support frame, the cross-section of the first mounting plate is T-shaped and is arranged in the first T-shaped slot and fixed by screws, and second mounting plates are provided on both sides of the superconducting support frame, and the cross-section of the second mounting plate is T-shaped.

[0008] Preferably, a temperature measuring channel is provided on the top of the superconducting support frame, and a temperature measuring optical fiber is provided in the temperature measuring channel. The temperature measuring optical fiber extends in the same direction as the superconducting tape, and the temperature measuring optical fiber is used to detect the temperature of the superconducting tape in the corresponding superconducting support frame.

[0009] Preferably, the auxiliary cooling unit includes a cooling support frame, with second T-shaped slots on both sides of the cooling support frame, the second mounting plug plate is arranged in the second T-shaped slots, and an auxiliary cooling channel is arranged in the middle of the cooling support frame, and the auxiliary cooling channel is used to inject coolant.

[0010] Preferably, the terminal connector includes a first copper terminal and a second copper terminal, and the first copper terminal and the second copper terminal are respectively arranged at two ends of the lead mechanism.

[0011] Preferably, the protective layer includes a supporting and draining layer and an insulating layer which are sequentially arranged from the inside to the outside. The supporting and draining layer is made of copper, and the insulating layer is made of polyimide.

[0012] Therefore, the present invention adopts the above modular high-temperature superconducting current lead device, which has the following beneficial effects:

[0013] (1) The central channel is used as the main cooling channel. Liquid nitrogen or other coolants are injected into the central channel 1 to directly cool the core area, quickly reducing the overall temperature of the conductor and maintaining the stability of the superconducting state. Auxiliary cooling units are set between adjacent high-temperature superconducting current lead units. Several auxiliary cooling units are distributed circumferentially. Liquid nitrogen flows through the auxiliary cooling units to evenly absorb local heat, eliminating the temperature gradient problem caused by traditional single-channel cooling and solving the problem of local overheating. The main and auxiliary dual cooling channels work together, and the liquid nitrogen flow field covers the entire surface of the superconducting unit. The heat dissipation efficiency is improved by 30%-50% compared with the traditional single-channel design. The local temperature difference is controlled within 1K to avoid the formation of hot spots.

[0014] (2) The superconducting support frame and the cooling support frame adopt modular plug-in, forming a flexible and expandable axial splicing structure, which is convenient and quick to install. The time required to replace a single superconducting unit is reduced by 70%, which is particularly suitable for scenarios with limited space or frequent maintenance.

[0015] (3) The protective layer adopts a support and drainage layer and an insulating layer arranged in sequence from the inside to the outside, which not only enhances the mechanical strength but also improves the heat dissipation performance. The high thermal conductivity of the support and drainage layer further enhances the heat dissipation. The temperature rise rate of the sheath is reduced by 40% during the timeout, which creates a critical time window for emergency repairs and achieves electromagnetic shielding and environmental corrosion protection at the same time.

[0016] (4) A temperature measurement channel is set on the top of the superconducting support frame, and distributed optical fiber temperature measurement technology is used to collect real-time surface temperature data of the superconducting tape and accurately locate local overheating areas. When a temperature anomaly is detected (such as temperature rise caused by quench), the support drainage layer acts as a current bypass to quickly divert high current and reduce thermal damage to the superconducting tape. The temperature rise of the superconducting tape after quench can be limited to below 5K. At the same time, the auxiliary cooling channel accelerates heat dissipation and shortens the quench recovery time. The recovery time is shortened to minutes. The auxiliary cooling channel continues to provide cooling after quench, suppressing thermal runaway and reducing the risk of microcracks in the tape caused by thermal stress.

[0017] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of a modular high-temperature superconducting current lead device of the present invention;

[0019] Figure 2 This is a schematic structural diagram of the lead mechanism of the present invention;

[0020] Figure 3 This is a schematic diagram of the central support frame structure of the present invention;

[0021] Figure 4 Schematic diagram of the cooling support structure of the present invention

[0022] Reference numerals

[0023] 1. Lead mechanism; 11. Central support frame; 111. Hollow channel; 112. First T-shaped slot; 12. Superconducting support frame; 121. Superconducting tape; 122. First mounting plug-in plate; 123. Second mounting plug-in plate; 124. Temperature measurement channel; 13. Cooling support frame; 131. Second T-shaped slot; 132. Auxiliary cooling channel; 14. Support and drainage layer; 15. Insulation layer; 2. End connector; 21. First end copper terminal; 22. Second end copper terminal. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the inventive product is usually placed when in use. These are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention. In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the internal parts of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0026] like Figure 1-2 As shown, a modular high-temperature superconducting current lead device includes a lead mechanism 1 and end connectors 2 arranged at both ends of the lead mechanism 1, the end connector 2 includes a first end copper terminal 21 and a second end copper terminal 22, and the first end copper terminal 21 and the second end copper terminal 22 are respectively arranged at both ends of the lead mechanism 1.

[0027] The lead-in mechanism 1 comprises a protective layer and a central cooling mounting assembly.

[0028] The protective layer comprises a support and drainage layer 14 and an insulation layer 15, arranged sequentially from the inside out. The support and drainage layer 14 is made of copper and wraps around the outside of the superconducting support frame 12 and the cooling support frame 13. It not only secures the support frame but also facilitates heat dissipation from the superconducting current leads. When the superconducting current leads quench, they can drain the current, minimizing damage to the superconducting tape 121 caused by the high current and heat after the quench. The insulation layer 15 is made of polyimide and has a thickness of 0.1-0.5mm. It maintains good operating conditions within the -269°C to 400°C range, is resistant to nearly all organic solvents and acids, and exhibits excellent wear and arc resistance. It can operate stably in both deep cryogenic environments (liquid nitrogen environments) and high temperatures (short-term exposure to 400°C), extending its service life to over 10 years.

[0029] The central cooling assembly includes a central support frame 11 with a hollow channel 111 in the middle. The hollow channel 111 is used to inject coolant, which serves as the main cooling method to reduce the temperature of the superconducting current lead conductor and ensure the safe operation of the superconducting current lead conductor. Several high-temperature superconducting current lead units are plugged into the circumferential side of the central support frame 11, such as Figure 3As shown, the central support frame 11 is made of stainless steel and has several first T-shaped slots 112 on its circumference for inserting the high-temperature superconducting current lead unit. The high-temperature superconducting current lead unit includes a superconducting support frame 12, which contains at least two superconducting tapes 121. Superconducting tapes 121 are made of YBCO tape. The high critical magnetic field characteristics of YBCO tape (>3T, 77K) make it suitable for high magnetic field scenarios (such as nuclear magnetic resonance equipment), and its current carrying capacity is twice that of traditional Bi-2223 tape. In this embodiment, superconducting tape 121 is 4mm wide and 0.2mm thick. Due to its anisotropy, high critical magnetic field, high critical current density, and excellent mechanical properties, YBCO tape can carry large currents over a wide temperature and magnetic field range. The superconducting support frame 12 is used to protect the superconducting tape 121, making it less susceptible to wear and deformation. A first mounting plate 122 is provided at the bottom of the superconducting support frame 12 . The first mounting plate 122 has a T-shaped cross section and is disposed in the first T-shaped slot 112 and fixed by screws to achieve installation of the high-temperature superconducting current lead unit.

[0030] An auxiliary cooling unit is provided between adjacent high-temperature superconducting current lead units. The auxiliary cooling unit includes a cooling support frame 13, such as Figure 4 As shown, second mounting plates 123 are provided on both sides of the superconducting support frame 12. The cross-section of the second mounting plates 123 is T-shaped. Second T-shaped slots 131 are provided on both sides of the cooling support frame 13. The second mounting plates 123 are disposed within the second T-shaped slots 131. The cooling support frame 13 and the superconducting support frame 12 are both installed by plugging. Depending on the specifications of the high-temperature superconducting current leads, the cooling support frame 13 and the superconducting support frame 12 of the corresponding specifications and shapes can be selected, making installation more flexible and convenient. The specific assembly process is as follows:

[0031] The superconducting support frame 12 is inserted into the first T-shaped slot 112 of the central support frame 11 and fixed with screws, and then the cooling support frame 13 is inserted between adjacent superconducting support frames 12. The two ends of the central support frame 11 are connected to the first end copper terminal 21 and the second end copper terminal 22 through internal threads, and then the support and drainage layer 14 and the insulation layer 15 are covered in sequence.

[0032] An auxiliary cooling channel 132 is provided in the middle of the cooling support frame 13 for injecting coolant. The cross-section of the auxiliary cooling channel 132 is circular, ensuring smoother coolant flow. The auxiliary cooling channels 132 are distributed axially along the cooling support frame 13, with each auxiliary cooling channel 132 corresponding to the heat dissipation area of two adjacent high-temperature superconducting current lead units. Each auxiliary cooling channel 132 effectively absorbs heat generated by the adjacent high-temperature superconducting current lead units and achieves uniform cooling across the conductor, improving cooling and heat dissipation efficiency and serving as auxiliary cooling.

[0033] A temperature measuring channel 124 is provided at the top of the superconducting support frame 12. A temperature measuring optical fiber is provided in the temperature measuring channel 124. The temperature measuring optical fiber extends in the same direction as the superconducting tape 121. The distance between the temperature measuring channel 124 and the superconducting tape 121 is 1-3 mm. The temperature measuring optical fiber uses distributed temperature measurement technology to achieve temperature monitoring with an accuracy of ±0.1K. When temperature abnormalities occur, they can be repaired in time to avoid long-term temperature abnormalities affecting the stable operation of the conductor, thereby ensuring the safety and reliability of the conductor during operation. The temperature measuring optical fiber is used to realize the injection operation of the corresponding coolant through the control device to achieve cooling of the corresponding position. The control device is a conventional setting in this field and will not be described in detail here.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solutions of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A modular high-temperature superconducting current lead device, comprising a lead mechanism and terminal connectors disposed at both ends of the lead mechanism, characterized in that: The lead mechanism includes a protective layer and a central cooling installation assembly. The central cooling installation assembly includes a central support frame with a hollow channel in the middle. The hollow channel is used to inject coolant. Several high-temperature superconducting current lead units are inserted on the circumferential side of the central support frame, and auxiliary cooling units are arranged between adjacent high-temperature superconducting current lead units.

2. A modular high-temperature superconducting current lead device according to claim 1, characterized in that: The central support frame is made of stainless steel and has a plurality of first T-shaped slots on its circumferential side.

3. The modular high-temperature superconducting current lead device according to claim 1, characterized in that: The high-temperature superconducting current lead unit includes a superconducting support frame, in which at least two superconducting tapes are arranged, and a first mounting plate is provided at the bottom of the superconducting support frame. The cross-section of the first mounting plate is T-shaped and is arranged in the first T-shaped slot and fixed by screws. Second mounting plates are provided on both sides of the superconducting support frame, and the cross-section of the second mounting plate is T-shaped.

4. The modular high-temperature superconducting current lead device according to claim 1, characterized in that: A temperature measuring channel is provided on the top of the superconducting support frame, and a temperature measuring optical fiber is provided in the temperature measuring channel. The temperature measuring optical fiber extends in the same direction as the superconducting tape, and is used to detect the temperature of the superconducting tape in the corresponding superconducting support frame.

5. The modular high-temperature superconducting current lead device according to claim 1, characterized in that: The auxiliary cooling unit includes a cooling support frame, with second T-shaped slots on both sides of the cooling support frame, the second mounting plug-in plate is arranged in the second T-shaped slots, and an auxiliary cooling channel is arranged in the middle of the cooling support frame, the auxiliary cooling channel is used to inject coolant.

6. The modular high-temperature superconducting current lead device according to claim 1, characterized in that: The terminal connector comprises a first copper terminal and a second copper terminal, and the first copper terminal and the second copper terminal are respectively arranged at two ends of the lead mechanism.

7. The modular high-temperature superconducting current lead device according to claim 1, characterized in that: The protective layer includes a supporting and draining layer and an insulating layer which are sequentially arranged from the inside to the outside. The supporting and draining layer is made of copper, and the insulating layer is made of polyimide.

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