Optical transceiving device, optical communication equipment and system

Abstract

The invention discloses an optical module and an optical communication device and system, and belongs to the technical field of optical communication. The optical module comprises an optical interface, a transceiver module and a transmission module. The transceiver module comprises at least two transmitters used for transmitting optical signals with different wavelengths and at least two receivers used for receiving the optical signals with different wavelengths, the transmitter with the highest transmission rate in the at least two transmitters is the first transmitter, and the receiver with the highest transmission rate in the at least two receivers is the first receiver; the transmission module is used for transmitting the optical signals received by the optical interface to the at least two receivers and transmitting the optical signals transmitted by the at least two transmitters to the optical interface; wherein the first transmitter and the first receiver are located on a first side of the transmission module, the optical interface is located on a second side of the transmission module, and the first side and the second side are two opposite sides of the transmission module. The optical module is beneficial to meeting the signal quality requirement during high-speed transmission.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical transceiver, optical communication equipment and system. Background Art

[0002] A passive optical network (PON) is a point-to-multipoint, single-fiber, bidirectional optical access network. A PON system typically includes an optical line terminal (OLT), an optical distribution network (ODN), and multiple optical network units (ONUs). The OLT is connected to multiple ONUs via the ODN. With the development of optical communication technology, at least two types of ONUs will coexist in a PON system over a certain period of time. Different types of ONUs support different wavelengths and transmission rates. Therefore, the optical communication device in the OLT needs to be able to simultaneously support the wavelengths and transmission rates supported by all ONUs.

[0003] In related art, an OLT consists of a single board and at least one optical module connected to the board. The optical module includes an optical interface, a transceiver module, and a transmission module. The transceiver module includes multiple transmitters and multiple receivers. The transmission module is used to transmit optical signals from the multiple transmitters to the optical interface and transmit optical signals from the optical interface to the multiple receivers. Multiple transmitters or multiple receivers are concentrated on one side of the transmission module to separate the transmission and reception of optical signals near the optical interface.

[0004] For example, a transmission module has a first side and a second side that are opposite to each other, with multiple transmitters arranged on the first side, an optical interface arranged on the second side, and multiple receivers arranged between the first and second sides. However, this arrangement of receivers and transmitters is difficult to meet the signal quality requirements for high-speed transmission. Summary of the Invention

[0005] The present application provides an optical transceiver, optical communication equipment, and system. The optical transceiver meets the signal quality requirements during high-speed transmission by optimizing the positions of the transmitter and the receiver.

[0006] In a first aspect, the present application provides an optical transceiver device, which includes an optical interface, a transceiver module, and a transmission module. The transceiver module includes at least two transmitters and at least two receivers, the at least two transmitters being used to transmit optical signals of different wavelengths, and the at least two receivers being used to receive optical signals of different wavelengths. The transmission module is used to transmit the optical signals received by the optical interface to the at least two receivers, and to transmit the optical signals sent by the at least two transmitters to the optical interface. The first transmitter of the at least two transmitters and the first receiver of the at least two receivers are located on the first side of the transmission module, the first transmitter is the transmitter with the highest transmission rate among the at least two transmitters, and the first receiver is the receiver with the highest reception rate among the at least two receivers. The optical interface is located on the second side of the transmission module, and the first side and the second side are opposite sides of the transmission module.

[0007] In the present application, the end of the optical transceiver device opposite to the optical interface is used to connect to the circuit board plugged into the single board. Therefore, the first transmitter with the highest sending rate and the first receiver with the highest receiving rate are placed on the side of the transmission module opposite to the optical interface, which facilitates the connection of the first transmitter and the first receiver to the gold fingers on the circuit board, and is beneficial to reducing the crosstalk and transmission loss of the signals corresponding to the first transmitter and the first receiver, improving signal stability, and meeting the signal quality requirements during high-speed transmission.

[0008] Optionally, the transmission module further includes a third side and a fourth side, the third side and the fourth side being opposite sides of the transmission module and located between the first side and the second side. The other transmitters of the at least two transmitters, excluding the first transmitter, are located on the third side and / or the fourth side; and the other receivers of the at least two receivers, excluding the first receiver, are located on the third side and / or the fourth side.

[0009] Since the space on the first side of the transmission module in the optical transceiver device is usually limited, other transmitters and other receivers can be arranged at positions other than the first side and the second side, ie, around the transmission module.

[0010] In one possible implementation, the transceiver module includes three transmitters and three receivers. In this case, the at least two transmitters further include a second transmitter and a third transmitter, the transmission rate of the first transmitter is greater than the transmission rate of the second transmitter, and the transmission rate of the second transmitter is greater than the transmission rate of the third transmitter. The at least two receivers further include a second receiver and a third receiver, the reception rate of the first receiver is greater than the reception rate of the second receiver, and the reception rate of the second receiver is greater than the reception rate of the third receiver.

[0011] Optionally, the transmission rate of the first transmitter and the reception rate of the first receiver are specified by the 50G PON protocol, the transmission rate of the second transmitter and the reception rate of the second receiver are specified by the 10G PON protocol, and the transmission rate of the third transmitter and the reception rate of the third receiver are specified by the GPON protocol. With the development of optical communication systems, ONUs supporting the 50G PON protocol, the 10G PON protocol, and the GPON protocol will coexist in the system for a long time. Therefore, the optical transceiver needs to be compatible with these three types of ONUs.

[0012] In another possible implementation, the transceiver module includes two transmitters and two receivers. In this case, the at least two transmitters also include a second transmitter, and the transmission rate of the first transmitter is greater than the transmission rate of the second transmitter. The at least two receivers also include a second receiver, and the reception rate of the first receiver is greater than the reception rate of the second receiver.

[0013] Optionally, the transmission rate of the first transmitter and the reception rate of the first receiver are specified by the 50G PON protocol, and the transmission rate of the second transmitter and the reception rate of the second receiver are specified by the 10G PON protocol. With the development of optical communication systems, ONUs supporting the GPON protocol will be preferentially decommissioned. After the ONUs supporting the GPON protocol are decommissioned, ONUs supporting the 50G PON protocol and ONUs supporting the 10G PON protocol will coexist. In this case, the optical transceiver only needs to be compatible with these two types of ONUs.

[0014] Optionally, the optical transceiver device further includes a printed circuit board (PCB), the PCB including a first conductive contact array, and each transmitter and each receiver is electrically connected to the first conductive contact array. The distance between the first transmitter and the first conductive contact array is smaller than the distance between any other transmitter and the first conductive contact array, and the distance between the first receiver and the first conductive contact array is smaller than the distance between any other receiver and the first conductive contact array; further, the distance between the first transmitter and the first conductive contact array is smaller than the distance between any receiver other than the first receiver and the first conductive contact array, and the distance between the first receiver and the first conductive contact array is smaller than the distance between any transmitter other than the first transmitter and the first conductive contact array.

[0015] Since the first transmitter and the first receiver are arranged on opposite sides of the optical interface, the distance to the first conductive contact array is short, which facilitates direct connection of the first transmitter and the first receiver to the first conductive contact array.

[0016] The PCB also includes a second conductive contact array, located at opposite ends of the PCB along with the first conductive contact array. The second conductive contact array is configured to be plugged into a connector slot on the PCB. This conductive contact array plugged into a connector slot is referred to as a gold finger array.

[0017] Exemplarily, the first transmitter and the first receiver are directly electrically connected to the first conductive contact array, for example, by wire bonding, eutectic soldering, or conductive adhesive, and transmitters other than the first transmitter and receivers other than the first receiver are electrically connected to the first conductive contact array via the adapter structure. Optionally, the adapter structure includes a flexible circuit board or conductive wires.

[0018] Because the first transmitter and first receiver are directly electrically connected to the first conductive contact array on the PCB via bonding wires, crosstalk and transmission loss of the electrical signals corresponding to the first transmitter and first receiver are minimized. Furthermore, the transmission rate of the first transmitter and the reception rate of the first receiver are relatively high. The higher the rate, the smaller the loss margin, i.e., the higher the signal quality requirements. Therefore, this connection method is conducive to meeting the quality requirements of the optical signals corresponding to the wavelengths of the first transmitter and first receiver.

[0019] In one possible embodiment, the transmission module includes an optical waveguide chip, a first transmission unit, and a second transmission unit, wherein at least portions of the first transmission unit and the second transmission unit are integrated into the optical waveguide chip. The first transmission unit is configured to transmit optical signals from the optical interface to the at least two receivers according to wavelength. The second transmission unit is configured to transmit optical signals from the at least two transmitters to the first transmission unit, and the first transmission unit is further configured to transmit optical signals from the second transmission unit to the optical interface.

[0020] By arranging the optical waveguide chip in the transmission module and integrating at least part of the first transmission unit and the second transmission unit in the optical waveguide chip, the size of the optical transceiver device can be reduced.

[0021] In another possible implementation, the transmission module does not include an optical waveguide chip, and both the first transmission unit and the second transmission unit are implemented using a spatial optical mirror system or other optical devices. The transmission module using this structure is technologically mature and easy to implement.

[0022] When the transceiver module includes three transmitters, the second transmission unit includes two combiners: a first combiner and a second combiner. The first combiner and the second combiner are integrated into the optical waveguide chip. The first combiner has a first end, a second end, and a third end. The first and second ends of the first combiner are respectively configured to receive an optical signal transmitted by one of the three transmitters. The first combiner is configured to output the optical signal received by the first end of the first combiner and the optical signal received by the second end of the first combiner from the third end of the first combiner. The second combiner has a first end, a second end, and a third end. The first end of the second combiner is configured to receive an optical signal transmitted by another of the three transmitters. The second end of the second combiner is connected to the third end of the first combiner. The second combiner is configured to output the optical signal received by the first end of the second combiner and the optical signal received by the second end of the second combiner from the third end of the second combiner. In this way, the optical signals transmitted by the three transmitters are combined into one downlink optical signal via the two combiners, and the downlink optical signal is transmitted through the first transmission unit and the optical interface.

[0023] Optionally, the first end of the second combiner is configured to receive the optical signal transmitted by the first transmitter. In this manner, the optical signal transmitted by the first transmitter only needs to pass through the second combiner to reach the first transmission unit. The optical signal transmitted by the first transmitter passes through fewer optical components, which further reduces transmission loss and improves signal quality of high-rate signals.

[0024] When the number of transmitters in the transceiver module is three, the number of receivers in the transceiver module is also three. In this case, the first transmission unit can adopt any one of the following three structures.

[0025] The first structure:

[0026] A portion of the first transmission unit is integrated in the optical waveguide chip, and the other portion is located outside the optical waveguide chip.

[0027] The first transmission unit includes a transceiver splitter subunit and a wave combiner / demultiplexer subunit. A portion of the transceiver splitter subunit and the wave combiner / demultiplexer subunit are integrated into the optical waveguide chip, while another portion of the transceiver splitter subunit and the wave combiner / demultiplexer subunit are located outside the optical waveguide chip. The transceiver splitter subunit is used to transmit the optical signal from the optical interface to the wave combiner / demultiplexer subunit, and the wave combiner / demultiplexer subunit is used to transmit the received optical signal to the three receivers according to the wavelength. The transceiver splitter subunit is also used to transmit the optical signal from the second transmission unit to the optical interface.

[0028] In this first structure, the wavelength-splitting subunit includes two wavelength-splitting films and three optical transmission channels. The two wavelength-splitting films are attached to the sidewalls of the optical waveguide chip, while the three optical transmission channels are located within the optical waveguide chip. In other words, the wavelength-splitting films are located outside the optical waveguide chip, while the three optical transmission channels are integrated within the chip. Here, the optical transmission channels are optical waveguides.

[0029] The two wavelength division membranes include a first wavelength division membrane and a second wavelength division membrane, and the three optical transmission channels include a first optical transmission channel, a second optical transmission channel, and a third optical transmission channel. The first optical transmission channel is used to transmit the optical signal output by the transceiver separation subunit to the first wavelength division membrane. The optical signal output by the transceiver separation subunit includes a first sub-optical signal, a second sub-optical signal, and a third sub-optical signal. The wavelengths of the first sub-optical signal, the second sub-optical signal, and the third sub-optical signal are respectively the same as the receiving wavelengths of the three receivers. The first wavelength division membrane is used to separate the first sub-optical signal from the optical signal output by the transceiver separation subunit, and output the other sub-optical signals (i.e., the second sub-optical signal and the third sub-optical signal) of the optical signal output by the transceiver separation subunit except the first sub-optical signal to the second optical transmission channel. The second optical transmission channel is used to transmit the other sub-optical signals output by the first wavelength division membrane to the second wavelength division membrane. The second wavelength division membrane is used to separate the second sub-optical signal from the other sub-optical signals and transmit the third sub-optical signal to the third optical transmission channel. The third optical transmission channel is used to output the third sub-optical signal.

[0030] Optionally, in the wavelength division multiplexing / demultiplexing subunit, the wavelength division multiplexing (WDM) film can be formed directly on the sidewall of the optical waveguide chip, or attached to the sidewall of the optical waveguide chip by bonding or other means. Because the optical signal output by the transceiver / demultiplexer subunit is routed to each WDM film via an optical transmission channel, it can be incident on each WDM film at a relatively small angle of incidence. The smaller the angle of incidence, the thinner the WDM film. Therefore, the stress and mounting issues caused by thick WDM films can be mitigated or avoided.

[0031] Optionally, the wavelength of the first optical sub-signal is the same as the receiving wavelength of the first receiver. In this way, the first optical sub-signal passes through fewer optical components before being received by the first receiver, which is beneficial to reducing transmission loss of the first optical sub-signal and improving signal quality.

[0032] In the first structure, the transmitting and receiving separation subunit can adopt any one of structures A to C.

[0033] In Structure A, the optical waveguide chip has a receiving slot, and the transceiver separation subunit is located in the receiving slot. Optionally, in Structure A, the transceiver separation subunit includes a thin film filter. In Structure A, placing the transceiver separation subunit in the receiving slot increases the integration of the optical component and simplifies the assembly process. Here, the optical component includes the aforementioned optical interface and transmission module.

[0034] In structure B, the transceiver separation subunit is located on one side of the optical waveguide chip. Optionally, in structure B, the transceiver separation subunit includes a thin film filter, a transmission collimator, and a reception collimator. The reception collimator is located between the thin film filter and the wave combiner / splitter subunit, and the transmission collimator is located between the thin film filter and the second transmission unit. In structure B, the transceiver separation subunit is arranged on one side of the optical waveguide chip, eliminating the need to provide a receiving groove in the transceiver separation subunit. This can simplify the production process of the optical waveguide chip and help improve the yield of the optical waveguide chip.

[0035] Structure C, the transceiver separation subunit is integrated in the optical waveguide chip. Optionally, in Structure C, the transceiver separation subunit includes a mode converter and a coupler. The first end of the mode converter is used to receive the optical signal from the optical interface, the second end of the mode converter is connected to the input end of the coupler, the first output end of the coupler is connected to the output end of the second transmission unit, and the second output end of the coupler is connected to the input end of the combining and decomposing subunit. In Structure C, the transceiver separation subunit is directly manufactured in the optical waveguide chip, the integration of the optical component is higher, the volume of the optical component can be further reduced, and the assembly process of the optical component can be simplified.

[0036] Optionally, based on the first structure, the first transmission unit further includes a direction adjustment subunit, configured to transmit the optical signal from the wavelength combining / decombining subunit to at least some of the at least two receivers other than the first receiver. The direction adjustment subunit allows for flexible arrangement of the positions of the receivers relative to the transmission module as needed.

[0037] The second structure:

[0038] The first transmission unit is integrated into the optical waveguide chip and includes three transmission subunits sequentially located on an optical path between the optical interface and the second transmission unit. Each transmission subunit includes a mode converter and a coupler. The three transmission subunits are a first transmission subunit, a second transmission subunit, and a third transmission subunit.

[0039] The input end of the coupler of the first transmission subunit is used to receive an uplink optical signal from the optical interface. The uplink optical signal includes a first sub-optical signal, a second sub-optical signal, and a third sub-optical signal, and the wavelengths of the first sub-optical signal, the second sub-optical signal, and the third sub-optical signal are respectively the same as the receiving wavelengths of the three receivers. The first output end of the coupler of the first transmission subunit is connected to the first end of the mode converter of the first transmission subunit, and the coupler of the first transmission subunit is used to output the first sub-optical signal to one of the three receivers through the second output end of the coupler of the first transmission subunit.

[0040] The input end of the coupler of the second transmission subunit is connected to the second end of the mode converter of the first transmission subunit, the first output end of the coupler of the second transmission subunit is connected to the first end of the mode converter of the second transmission subunit, and the coupler of the second transmission subunit is used to output the second sub-optical signal to another receiver among the three receivers through the second output end of the coupler of the second transmission subunit.

[0041] The input end of the coupler of the third transmission subunit is connected to the second end of the mode converter of the second transmission subunit, the first output end of the coupler of the third transmission subunit is connected to the second transmission unit, and the coupler of the third transmission subunit is used to output the third sub-optical signal to another receiver among the three receivers through the second output end of the coupler of the third transmission subunit.

[0042] When the transceiver module includes two transmitters, the second transmission unit includes a first combiner, which is integrated into the optical waveguide chip. The first combiner has a first end, a second end, and a third end. The first end and the second end of the first combiner are respectively used to receive the optical signals transmitted by the two transmitters. The first combiner is used to output the optical signal received by the first end of the first combiner and the optical signal received by the second end of the first combiner from the third end of the first combiner. In this way, the optical signals transmitted by the two transmitters are combined into one channel through a single combiner to generate a downlink optical signal, which is then transmitted through the first transmission unit and the optical interface.

[0043] When the transceiver module includes two transmitters, the number of receivers in the transceiver module is also two. In this case, the first transmission unit is integrated into the optical waveguide chip and includes two transmission subunits located sequentially on the optical path between the optical interface and the second transmission unit. Each of the two transmission subunits includes a mode converter and a coupler. The two transmission subunits are the first transmission subunit and the second transmission subunit.

[0044] The input end of the coupler of the first transmission subunit is used to receive an uplink optical signal from the optical interface, where the uplink optical signal includes a first sub-optical signal and a second sub-optical signal. The first output end of the coupler of the first transmission subunit is connected to the first end of the mode converter of the first transmission subunit, and the coupler of the first transmission subunit is used to output the first sub-optical signal to one of the two receivers via the second output end of the coupler of the first transmission subunit.

[0045] The input end of the coupler of the second transmission subunit is connected to the second end of the mode converter of the first transmission subunit, the first output end of the coupler of the second transmission subunit is connected to the first end of the mode converter of the second transmission subunit, and the coupler of the second transmission subunit is used to output the second sub-optical signal to the other of the two receivers through the second output end of the coupler of the second transmission subunit.

[0046] Optionally, the mode converter is a Bragg reflection grating, etc., and the coupler is a tapered coupling waveguide or a directional coupler, etc.

[0047] The third structure:

[0048] The first transmission unit is located outside the optical waveguide chip and includes: a splitter group and a reflector group. The splitter group is used to separate the optical signals from the optical interface according to the wavelengths corresponding to the at least two receivers, and the reflector group is used to transmit the optical signals separated by the splitter group to the receivers corresponding to the respective wavelengths. The splitter group is also used to combine the optical signals from the at least two transmitters and transmit the combined optical signals to the optical interface.

[0049] When the first transmission unit of the optical component adopts the third structure, the structural changes compared to the existing optical components are relatively small, which is conducive to the rapid implementation of the product.

[0050] In one possible implementation, the optical waveguide chip is a whole chip, so that the optical waveguide chip can be taped out in one go, with good stability and simple assembly.

[0051] In another possible implementation, the optical waveguide chip includes a first sub-chip and a second sub-chip constructed from different material platforms. The second transmission unit is integrated into the first sub-chip. A portion of the first transmission unit is integrated into the second sub-chip, while the remaining portion is located outside the optical waveguide chip. Alternatively, the first transmission unit is integrated into the second sub-chip. This allows for flexible selection of appropriate material platforms to fabricate the optical waveguide chip, leveraging the strengths of different material platforms to accomplish complex functions that would be impossible with a single platform.

[0052] Optionally, the first sub-chip adopts a silicon photonics platform, and the second sub-chip adopts a PLC platform. The processing technology of the silicon photonics platform is mature, and is particularly suitable for optical devices with small manufacturing process tolerances, such as the aforementioned directional coupler. In addition, the waveguide length used to transmit the downlink optical signal in the first sub-chip is relatively short, that is, the transmission distance of the downlink optical signal in the first optical chip is relatively short, and the shorter the transmission distance, the smaller the transmission loss, so the problem of higher waveguide transmission loss of the silicon photonics platform compared to other material platforms can be avoided. The second sub-chip adopts the PLC platform, and the transmission loss of the PLC platform is extremely low, which is conducive to reducing the transmission loss of the uplink optical signal. In addition, the optical transmission channel set in the second sub-chip mainly plays a routing role, and there are no other complex optical devices, which can effectively avoid the problem of large processing errors caused by the immature PLC processing technology.

[0053] Optical signal coupling is required between the first sub-chip and the second sub-chip. There are two coupling methods:

[0054] Mode 1: The first sub-chip and the second sub-chip are spaced apart from each other, and the first sub-chip and the second sub-chip are coupled by spatial optical alignment technology;

[0055] In a second embodiment, the first sub-chip is connected to the surface of the second sub-chip, and the first sub-chip and the second sub-chip are coupled by using an evanescent wave coupling technology.

[0056] In the second aspect, the present application provides an optical transceiver device, which includes an optical interface, a transceiver module and a transmission module; the transceiver module includes at least two transmitters and at least two receivers, the at least two transmitters are used to send optical signals of different wavelengths, and the at least two receivers are used to receive optical signals of different wavelengths; the transmission module includes an optical waveguide chip, a first transmission unit and a second transmission unit; the first transmission unit is used to transmit the optical signal from the optical interface to the at least two receivers according to the wavelength; the second transmission unit is used to transmit the optical signal from the at least two transmitters to the first transmission unit, and the first transmission unit is also used to transmit the optical signal from the second transmission unit to the optical interface, and the second transmission unit is integrated in the optical waveguide chip.

[0057] By integrating the second transmission unit into the optical waveguide chip, the size and cost of the optical transceiver can be reduced. Furthermore, the optical transceiver has a large margin for loss of downlink optical signals. Therefore, the transmission loss caused by integrating the second transmission unit into the optical waveguide chip has a minimal impact on signal quality.

[0058] The structures of the various modules (including the transceiver module and the transmission module, etc.) of the optical transceiver device provided in the second aspect refer to the optical transceiver device provided in the first aspect, and are not described in detail here.

[0059] In a third aspect, the present application provides an optical transceiver device, which is an optical module. The optical transceiver device includes: an optical interface, a transceiver module, a transmission module, and a PCB. The transceiver module includes at least two transmitters and at least two receivers, the at least two transmitters being used to transmit optical signals of different wavelengths, and the at least two receivers being used to receive optical signals of different wavelengths. The transmission module is located between the optical interface and the transceiver module and is used to transmit optical signals received by the optical interface to the at least two receivers, and to transmit optical signals sent by the at least two transmitters to the optical interface. The printed circuit board includes a first conductive contact array, the at least two transmitters and the at least two receivers are electrically connected to the first conductive contact array, the distance between a first transmitter of the at least two transmitters and the first conductive contact array is less than the distance between any other transmitters and the first conductive contact array, and the distance between a first receiver of the at least two receivers and the first conductive contact array is less than the distance between any other receivers and the first conductive contact array. The first transmitter has the highest transmission rate among the at least two transmitters, and the first receiver has the highest reception rate among the at least two receivers.

[0060] By setting the distance between the first transmitter with the highest sending rate and the first receiver with the highest receiving rate and the first conductive contact array to be smaller, so that the first transmitter and the first receiver can be directly connected to the first conductive contact array, additional switching structures (such as flexible circuit boards, etc.) can be eliminated, thereby reducing the crosstalk and transmission loss of high-speed signals, improving signal stability, and meeting the quality requirements of high-speed signals.

[0061] Optionally, the distance between the first transmitter and the first conductive contact array is smaller than the distance between any receiver other than the first receiver and the first conductive contact array, and the distance between the first receiver and the first conductive contact array is smaller than the distance between any transmitter other than the first transmitter and the first conductive contact array.

[0062] The PCB also includes a second conductive contact array, located at opposite ends of the PCB along with the first conductive contact array. The second conductive contact array is configured to be plugged into a connector slot on the PCB. This conductive contact array plugged into a connector slot is referred to as a gold finger array.

[0063] The structures of the various modules (including transceiver modules and transmission modules, etc.) of the optical transceiver device provided in the third aspect, as well as the connection methods of the various transmitters and receivers with the PCB, can be referred to the optical transceiver device provided in the first aspect above, and will not be described in detail here.

[0064] In a fourth aspect, the present application provides an optical communication device, which may be an OLT. The optical communication device includes a single board and at least one optical module connected to the single board. Each optical module includes any of the aforementioned optical transceiver devices.

[0065] In a fifth aspect, the present application provides an optical communication system, which includes an OLT, an ODN, and multiple ONUs, wherein the multiple ONUs are connected to the OLT via the ODN. The OLT is the optical communication device provided in the fourth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 This is a structural diagram of an optical transceiver provided in an embodiment of the present application;

[0067] Figure 2 is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0068] Figure 3 yes Figure 2 The working principle diagram of the optical transceiver in FIG.

[0069] Figure 4 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0070] Figure 5 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0071] Figure 6 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0072] Figure 7 yes Figure 6 A schematic structural diagram of the waveguide coupling portion between the first sub-chip and the second sub-chip;

[0073] Figure 8 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0074] Figure 9This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0075] Figure 10 yes Figure 9 Schematic diagram of the enlarged structure of the middle coupler;

[0076] Figure 11 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0077] Figure 12 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0078] Figure 13 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0079] Figure 14 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0080] Figure 15 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0081] Figure 16 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0082] Figure 17 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0083] Figure 18 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0084] Figure 19 This is a structural diagram of another optical transceiver provided in an embodiment of the present application;

[0085] Figure 20 It is a structural diagram of an optical communication system provided in an embodiment of the present application.

[0086] Reference numerals

[0087] 110, 210 optical interfaces;

[0088] f, optical fiber; a, first side; b, second side; c, third side; d, fourth side;

[0089] 120, 220, transceiver module; 121, transmitter; 122, receiver;

[0090] 211, first transmitter; 212, second transmitter; 213, third transmitter;

[0091] 221, first receiver; 222, second receiver; 223, third receiver;

[0092] 130, 230, transmission module;

[0093] 231, first transmission unit; 232, second transmission unit; 233, 533 optical waveguide chip;

[0094] 231a, 731a, 831a, transmit and receive splitter subunit; 231b, combiner / demultiplexer subunit;

[0095] 2311, thin film filter;

[0096] 2312a, first optical transmission channel; 2312b, second optical transmission channel; 2312c, third optical transmission channel;

[0097] 2313, wavelength separation film; 2313a, first wavelength separation film; 2313b, second wavelength separation film;

[0098] 2321, first combiner; 2322, second combiner; 2323, SSC;

[0099] 2331, receiving tank;

[0100] 240, substrate; 241, pin;

[0101] 430, 530, transmission module;

[0102] 4311, reflector; 4312, reflecting prism; 4313, direction adjustment channel;

[0103] 533, 633, optical waveguide chips;

[0104] 533a, 633a, first sub-chip; 533b, 633b, second sub-chip;

[0105] 5311, 5312, reflector;

[0106] 6331a, first waveguide; 6331b, second waveguide;

[0107] 6332b, glass substrate; 6333a, silicon dioxide cladding;

[0108] 7311, thin film filter, 7312, transmitting collimator; 7313, receiving collimator;

[0109] 8311, mode converter; 8312, coupler;

[0110] 8312a, first waveguide; 8312b, second waveguide;

[0111] 1031, first transmission unit; 1031a, first transmission subunit; 1031b, second transmission subunit; 1031c, third transmission subunit;

[0112] 10311, coupler; 10312, mode converter;

[0113] 1131, 1231, first transmission unit;

[0114] 1131a, first filter; 1131b, second filter; 1131c, third filter;

[0115] 1132a, first reflector group; 1132b, second reflector group; 1132c, third reflector group; 1132d, fourth reflector group;

[0116] 1133, 1233, optical waveguide chips;

[0117] 1331, first transmission unit;

[0118] 13311, first glass block;

[0119] 13312a, first filter; 13312a, second filter; 13312c, second filter; 13312d, fourth filter.

[0120] 16321, second glass block;

[0121] 16322a, first filter; 16322a, second filter; 16322c, third filter;

[0122] 191. Optical transceiver assembly; 192. PCB; 192a. First conductive contact array; 193. Transfer structure; 194. Wire bonding. DETAILED DESCRIPTION

[0123] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0124] Embodiments of the present application provide an optical transceiver, optical communication equipment, and system. The optical transceiver optimizes the positional distribution of transmitters and receivers to meet transmission signal quality requirements for each transmitter and receiver. In the embodiments of the present application, the optical transceiver is an optical transceiver assembly, or an optical module comprising an optical transceiver assembly and a circuit board.

[0125] Figure 1 This is a schematic diagram of the structure of an optical transceiver provided in an embodiment of the present application. Figure 1As shown, the optical transceiver device includes: an optical interface 110, a transceiver module 120, and a transmission module 130. The transceiver module 120 includes at least two transmitters 121 and at least two receivers 122. The at least two transmitters 121 are used to transmit optical signals of different wavelengths, and the at least two receivers 122 are used to receive optical signals of different wavelengths. The transmission module 130 is located between the optical interface 110 and the transceiver module 120 and is used to transmit optical signals received by the optical interface 110 to the at least two receivers 122, and to transmit optical signals sent by the at least two transmitters 121 to the optical interface 110.

[0126] The transmitter 121 with the highest transmission rate among the at least two transmitters 121 is a first transmitter, and the receiver 122 with the highest reception rate among the at least two receivers 122 is a first receiver. The first transmitter and the first receiver are located on a first side a of the transmission module 130, and the optical interface 110 is located on a second side b of the transmission module 130. The first side a and the second side b are opposite sides of the transmission module 130. That is, the first transmitter and the first receiver are located on opposite sides of the optical interface 110.

[0127] Optical interface 110 is used to connect to an optical fiber, enabling bidirectional transmission of optical signals. Bidirectional transmission here refers to both the transmit and receive directions of the optical transceiver. The transmit direction is also referred to as the downlink, and the optical signal in the transmit direction is referred to as a downlink optical signal; the receive direction is also referred to as the uplink, and the optical signal in the receive direction is referred to as an uplink optical signal. The end of the optical transceiver opposite optical interface 110 is used to electrically connect to a circuit board plugged into the board.

[0128] With the development of optical communication technology, the signal transmission rate has gradually increased. The manufacturing technology of transmitters and receivers corresponding to high transmission rates is relatively immature and requires a long time to stabilize. In this case, the link loss margin corresponding to the high transmission rate is small, and the requirements for signal transmission loss are more stringent. Therefore, it is necessary to give priority to reducing the signal transmission loss of high transmission rates to meet the signal quality requirements of the optical communication system. In an embodiment of the present application, by placing the first transmitter with the highest transmission rate and the first receiver with the highest receiving rate on the side of the transmission module opposite to the optical interface, it is convenient to connect the first transmitter and the first receiver to the gold fingers on the circuit board, which is beneficial to reduce the crosstalk and transmission loss of the signals corresponding to the first transmitter and the first receiver, and improve the signal stability, so that the signal quality requirements of the optical communication system can be met.

[0129] In the embodiments of the present application, the transmitter's transmission rate is related to its transmission wavelength, and the corresponding relationship between the transmission rate and the transmission wavelength is defined in the relevant protocols. For example, for the GPON protocol, the transmitter's transmission rate is 2.5 Gb / s and the transmission wavelength is 1480 nm-1500 nm; for the 10G PON protocol, the transmitter's transmission rate is 10 Gb / s and the transmission wavelength is 1575 nm-1580 nm; and for the 50G PON protocol, the transmitter's transmission rate is 50 Gb / s and the transmission wavelength is 1340 nm-1344 nm. The receiver's receiving rate is related to its receiving wavelength, and the corresponding relationship between the receiving rate and the receiving wavelength is defined in the relevant protocols. For example, for the GPON protocol, the receiver's receiving rate is 1.25Gb / s and the receiving wavelength is 1290nm-1330nm; for the 10G PON protocol, the receiver's receiving rate is 2.5Gb / s or 10Gb / s and the receiving wavelength is 1260nm-1280nm; for the 50G PON protocol, the receiver's receiving rate is 12.5Gb / s, 25Gb / s or 10Gb / s and the receiving wavelength is 1284nm-1288nm.

[0130] Optionally, Figure 1 In the embodiment, the at least two transmitters 121, excluding the first transmitter, are located on the third side c of the transmission module 130, and the at least two receivers 122, excluding the first receiver, are located on the fourth side d of the transmission module 130. The third side c and the fourth side d of the transmission module 130 are opposite sides of the transmission module 130 and are both located between the first side a and the second side b. Typically, space on the first side a is limited, so all transmitters 121, excluding the first transmitter, and all receivers 122, excluding the first receiver, can be placed at locations other than the first side a and the second side b.

[0131] In the embodiment of the present application, the other transmitters are located on the side of the third side c and the fourth side d close to the first transmitter, and the other receivers are located on the side of the third side c and the fourth side d close to the first receiver, which is conducive to simplifying the structure of the transmission module. Figure 1 In the embodiment, the first transmitter is located on the first side a close to the third side c, so the other transmitters can be arranged on the third side c; Figure 1 In the embodiment, the first receiver is located on the first side a near the fourth side d, so the other receivers can be arranged on the fourth side d. In other embodiments, the positions of the first transmitter and the first receiver can be interchanged, and the sides of the other transmitters and other receivers can be correspondingly swapped.

[0132] It should be noted that the positions of other transmitters and other receivers relative to the transmission module 130 can be adjusted according to actual needs. For example, if there is sufficient space on the first side a, all or part of the transmitters 121 other than the first transmitter can be located on the first side a, while the other receivers 122 other than the first receiver are not located on the first side a (i.e., located on the third side c and / or the fourth side d); or, all or part of the receivers 122 other than the first receiver can be located on the first side a, while the other transmitters 121 other than the first transmitter are not located on the first side a (i.e., located on the third side c and / or the fourth side d); or, at least part of the other transmitters 121 other than the first transmitter and at least part of the other receivers 122 other than the first receiver are located on the first side a.

[0133] The optical interface and transmission module in the embodiments of the present application may be collectively referred to as an optical component. Since the optical component includes a receiver and a transmitter that support multiple generations of PON protocols, it is also called a second-generation integrated optical component or a third-generation integrated optical component.

[0134] In an embodiment of the present application, the transmitter includes a laser diode (LD), the type of which can be selected based on the corresponding transmission wavelength of the transmitter. The receiver includes a detector, such as a photodiode (PD), which is used to convert the received optical signal into an electrical signal. The receiver may also include an amplifier device, such as a trans-impedance amplifier (TIA), for amplifying the electrical signal.

[0135] The following example illustrates an optical transceiver device with a transmission module comprising three transmitters and three receivers. The three transmitters are a first transmitter, a second transmitter, and a third transmitter, and the three receivers are a first receiver, a second receiver, and a third receiver. The first transmitter is used to transmit optical signals at a wavelength corresponding to the 50G PON protocol, and the first receiver is used to receive optical signals at a wavelength corresponding to the 50G PON protocol. The second transmitter is used to transmit optical signals at a wavelength corresponding to the 10G PON protocol, and the second receiver is used to receive optical signals at a wavelength corresponding to the 10G PON protocol. The third transmitter is used to transmit optical signals at a wavelength corresponding to the GPON protocol, and the third receiver is used to receive optical signals at a wavelength corresponding to the GPON protocol.

[0136] According to the provisions of the 50G PON protocol, the 10G PON protocol and the GPON protocol, the transmission rate of the first transmitter is greater than the transmission rate of the second transmitter, and the transmission rate of the second transmitter is greater than the transmission rate of the third transmitter; the at least two receivers also include a second receiver and a third receiver, the receiving rate of the first receiver is greater than the receiving rate of the second receiver, and the receiving rate of the second receiver is greater than the receiving rate of the third receiver.

[0137] Figure 2 This is a schematic diagram of the structure of an optical transceiver provided in an embodiment of the present application. Figure 2 As shown, the optical transceiver device includes an optical interface 210, a transceiver module 220, and a transmission module 230. The optical interface 210 is configured to connect to an optical fiber f. The transceiver module 220 includes a first transmitter 211, a second transmitter 212, and a third transmitter 213, as well as a first receiver 221, a second receiver 222, and a third receiver 223. The first transmitter 211 and the first receiver 221 are located on a first side a of the transmission module 230, and the optical interface 210 is located on a second side b of the transmission module 230. The first side a and the second side b are opposite sides of the transmission module 230. The transmission module 230 is located between the optical interface 210 and the transceiver module 220 and is configured to transmit optical signals received by the optical interface 210 to the first receiver 221, the second receiver 222, and the third receiver 223, and to transmit optical signals transmitted by the first transmitter 211, the second transmitter 212, and the third transmitter 213 to the optical interface 210.

[0138] In an embodiment of the present application, at a certain moment, the optical signal received by the optical interface 210 may include one or more wavelengths, and the transmission module 230 will transmit the optical signal to the corresponding receiver according to the wavelength. For example, the optical signal received by the optical interface 210 includes optical signals of a first receiving wavelength, a second receiving wavelength, and a third receiving wavelength, where the first receiving wavelength is between 1284nm and 1288nm, the second receiving wavelength is between 1260nm and 1280nm, and the third receiving wavelength is between 1290nm and 1330nm; the transmission module 230 will transmit the optical signal of the first receiving wavelength to the first receiver 221, the optical signal of the second receiving wavelength to the second receiver 222, and the optical signal of the third receiving wavelength to the third receiver 223. For another example, the optical signal received by the optical interface 210 may only include the optical signal of the first receiving wavelength, in which case the transmission module 230 will transmit the optical signal of the first receiving wavelength to the first receiver 221; or, the optical signal received by the optical interface 210 may only include the optical signal of the third receiving wavelength, in which case the transmission module 230 will transmit the optical signal of the third receiving wavelength to the third receiver 223.

[0139] The transmission module 230 further includes a third side c and a fourth side d, which are opposite sides of the transmission module 230 and are located between the first side a and the second side b. The second transmitter 212 and the third transmitter 213 are located on the third side c, and the second receiver 222 and the third receiver 223 are located on the fourth side d.

[0140] Alternatively, in other embodiments, the second transmitter 212 and the third transmitter 213 are located at the fourth side d of the transmission module 230 , and the second receiver 222 and the third receiver 223 are located at the third side c of the transmission module 230 .

[0141] Optionally, the second transmitter 212 and the third transmitter 213 are located close to the first transmitter 211 , and the second receiver 222 and the third receiver 223 are located close to the first receiver 221 , which helps to simplify the structure of the transmission module 30 .

[0142] like Figure 2 As shown, the optical transceiver device also includes a substrate 240 and a plurality of pins 241. The substrate 240 is used to support the aforementioned transceiver module 220 and transmission module 230. The plurality of pins 241 are connected to the substrate 240. Each receiver is connected to one or more pins 241, and each transmitter is connected to one or more pins 241. The pins 241 and the connected transmitter or receiver are located on the same side of the transmission module 230. For example, the pins connecting the first transmitter 211 and the first receiver 221 are both located on the first side a of the transmission module 230, and the pins connecting the second transmitter 212 and the third transmitter 213 are both located on the third side c of the transmission module 230. The plurality of pins 241 are used to electrically connect the transceiver module 220 to the circuit board.

[0143] Optionally, the optical transceiver device further includes a housing in which the substrate 240, the transceiver module 220 and the transmission module 230 are all encapsulated. The optical interface is fixedly connected to the housing, and the pins 241 extend out of the housing to connect to other structures.

[0144] Optionally, the transmission module 230 includes an optical waveguide chip 233, a first transmission unit 231, and a second transmission unit 232. At least portions of the first transmission unit 231 and the second transmission unit 232 are integrated into the optical waveguide chip 233. The first transmission unit 231 is configured to transmit optical signals from the optical interface 210 to respective receivers according to wavelength. The second transmission unit 232 is configured to transmit optical signals from respective transmitters to the first transmission unit 231. The first transmission unit 231 is further configured to transmit optical signals from the second transmission unit 232 to the optical interface 210.

[0145] Integrating at least part of the first transmission unit 231 and the second transmission unit 232 into the optical waveguide chip 233 is beneficial to reducing the volume of the optical component, making the volume of the optical component compatible with the size of other structures (such as the housing), and helping to reduce the cost of the optical transceiver.

[0146] Optionally, the second transmission unit 232 includes a first combiner 2321 and a second combiner 2322, which are integrated into the optical waveguide chip 233. The first combiner 2321 has a first end, a second end, and a third end. The first end and the second end of the first combiner 2321 are respectively configured to receive an optical signal transmitted by a transmitter. The first combiner 2321 is configured to output the optical signal received by the first end of the first combiner 2321 and the optical signal received by the second end of the first combiner 2321 from the third end of the first combiner 2321.

[0147] The second combiner 2322 has a first end, a second end and a third end. The first end of the second combiner 2322 is used to receive an optical signal transmitted by another transmitter. The second end of the second combiner 2322 is connected to the third end of the first combiner 2321. The second combiner 2322 is used to output the optical signal received by the first end of the second combiner 2322 and the optical signal received by the second end of the second combiner 2322 from the third end of the second combiner 2322, thereby combining the optical signals transmitted by the first transmitter 211, the second transmitter 212 and the third transmitter 213 into one path and outputting them to the first transmission unit 231, and then outputting them from the optical interface 210 via the first transmission unit 231.

[0148] For example, Figure 2 In the example, the first end of the first combiner 2321 is used to receive the optical signal transmitted by the second transmitter 212, the second end of the first combiner 2321 is used to receive the optical signal transmitted by the third transmitter 213, and the first end of the second combiner 2322 is used to receive the optical signal transmitted by the first transmitter 211. In this way, the optical signal transmitted by the first transmitter 211 only needs to pass through the second combiner 2322 to reach the first transmission unit 231. Compared with optical signals transmitted by other transmitters, the optical signal transmitted by the first transmitter 211 passes through fewer optical devices. Therefore, for the optical signal transmitted by the first transmitter 321, the connection loss caused by optical devices is minimized, which helps further reduce the transmission loss of high-speed signals and improve the signal quality of high-speed signals.

[0149] exist Figure 2In the illustrated embodiment, the first combiner 2321 and the second combiner 2322 are both directional couplers (DC). Each directional coupler has an input end, a coupling end, and an output end. The input end of the directional coupler is the first end of the combiner, the coupling end of the directional coupler is the second end of the combiner, and the output end of the directional coupler is the third end of the combiner.

[0150] The DC transmission spectrum is a sine-cosine type, which closely matches the distance between the downstream wavelengths of GPON, 10G PON, and 50G PON. Furthermore, the loss margin in downstream transmission is large, and the loss introduced by combining optical components integrated into the optical waveguide chip is within the acceptable range of the system. Furthermore, this approach helps reduce the size of the transmission module, and thus the size of the optical transceiver, thus avoiding the problem of the optical transceiver being too large to fit into a cabinet.

[0151] In other embodiments, the first combiner 2321 and the second combiner 2322 may also be implemented as a multimode interference (MMI) coupler, a Mach Zehnder interferometer (MZI), or an arrayed waveguide grating (AWG).

[0152] In the embodiment of the present application, the output end of each transmitter is spatially aligned with one end of the corresponding waveguide in the optical waveguide chip 233 to achieve optical signal transmission. Optionally, when using spatial alignment to transmit optical signals, a coupling lens may be provided between the output end of the transmitter and one end of the corresponding waveguide in the optical waveguide chip 233 to improve the coupling efficiency of the optical signal.

[0153] Optionally, to reduce end-face coupling loss, the second transmission unit 232 further includes three spot-size converters (SSCs) 2323. The three SSCs 2323 are located between the three transmitters and the optical waveguide chip 233, respectively, and are configured to convert the mode field diameter of the optical signal emitted by the corresponding transmitter to match the diameter of the optical waveguide in the optical waveguide chip 233. Typically, the mode field diameter of the optical signal emitted by the transmitter is large, while the diameter of the optical waveguide in the optical waveguide chip 233 is small. Therefore, the larger diameter end of the SSC 2323 faces the transmitter, and the smaller diameter end of the SSC 2323 faces one end of the waveguide in the optical waveguide chip 233.

[0154] Optionally, the SSC 2323 may be an optical fiber taper, the small end of the optical fiber taper is connected to or spatially aligned with the optical waveguide chip 233 , and the large end of the optical fiber taper is connected to the transmitter.

[0155] In other embodiments, the SSC 2323 is integrated into the optical waveguide chip 233. In this case, the SSC 2323 can be a tapered waveguide, with the small end of the tapered waveguide connected to the optical waveguide in the optical waveguide chip 233 and the large end of the tapered waveguide facing the output end of the corresponding transmitter; or, the SSC 2323 includes a tapered waveguide and a grating array, with the small end of the tapered waveguide connected to the optical waveguide in the optical waveguide chip 233, the large end of the tapered waveguide facing one end of the grating array, and the other end of the grating array facing the output end of the corresponding transmitter. The embodiments of the present application do not limit the type of SSC.

[0156] In this embodiment of the present application, the number of combiners included in the second transmission unit 232 is determined by the number of transmitters included in the transceiver module 220. The number of combiners included in the second transmission unit 232 is one less than the number of transmitters included in the transceiver module 220. When the number of transmitters included in the transceiver module 220 is greater than one and i is greater than one and less than the number of transmitters included in the transceiver module, the first end of the i-th combiner is used to receive an optical signal transmitted by one transmitter, and the second end of the i-th combiner is connected to the third end of the i-1-th combiner. When i is equal to 1, the first end and the second end of the first combiner are respectively used to receive an optical signal transmitted by one transmitter. When i is equal to the number of transmitters included in the transceiver module, the third end of the i-th combiner is used to output the optical signal to the first transmission unit 31.

[0157] For example, in Figure 2 In the illustrated embodiment, the transceiver module 220 includes three transmitters. Therefore, the second transmission unit 232 includes two combiners: a first combiner 2321 and a second combiner 2322 .

[0158] Optionally, the first transmission unit 231 includes a transceiver splitter subunit 231a and a wavelength combiner / demultiplexer subunit 231b. Portions of the transceiver splitter subunit 231a and the wavelength combiner / demultiplexer subunit 231b are integrated into the optical waveguide chip 233. That is, a portion of the first transmission unit 231 is integrated into the optical waveguide chip 233, while the remaining portion is located outside the optical waveguide chip 233. The transceiver splitter subunit 231a is configured to transmit optical signals from the optical interface 210 to the wavelength combiner / demultiplexer subunit 231b. The wavelength combiner / demultiplexer subunit 231b is configured to transmit the optical signals from the transceiver splitter subunit 231a to various receivers according to their wavelengths. The transceiver splitter subunit 231a is also configured to transmit optical signals from the second transmission unit 232 to the optical interface 210.

[0159] When the transceiver module 220 includes three receivers, the wavelength-division multiplexing / demultiplexing subunit 231b includes two wavelength-division multiplexing films 2313 and three optical transmission channels 2312. The two wavelength-division multiplexing films 2313 are attached to the sidewalls of the optical waveguide chip 233, and the three optical transmission channels 2312 are located within the optical waveguide chip 233. In other words, each optical transmission channel 2312 is a waveguide within the optical waveguide chip 233. Here, the wavelength-division multiplexing films 2313 are thin-film filters.

[0160] The two wavelength separation films 2313 are respectively a first wavelength separation film 2313a and a second wavelength separation film 2313b, and the three optical transmission channels 2312 are respectively a first optical transmission channel 2312a, a second optical transmission channel 2312b and a third optical transmission channel 2312c.

[0161] The first optical transmission channel 2312a is located between the transceiver splitter subunit 231a and the first wavelength division membrane 2313a. The first optical transmission channel 2312a is used to transmit the optical signal output by the transceiver splitter subunit 231a to the first wavelength division membrane 2313a. The optical signal output by the transceiver splitter subunit 231a (i.e., the uplink optical signal) includes a first sub-optical signal, a second sub-optical signal, and a third sub-optical signal. The wavelengths of the first sub-optical signal, the second sub-optical signal, and the third sub-optical signal are the same as the receiving wavelengths of the three receivers.

[0162] The first wavelength-dividing film 2313a is used to separate the first sub-optical signal from the optical signal output by the transceiver separation sub-unit 231a, so as to output the first sub-optical signal to a corresponding receiver (i.e., a receiver having a receiving wavelength identical to that of the first sub-optical signal). The first wavelength-dividing film 2313a is also used to output the other sub-optical signals (i.e., the second sub-optical signal and the third sub-optical signal) in the optical signal output by the transceiver separation sub-unit 231a, except for the first sub-optical signal, to the second optical transmission channel 2312b. Exemplarily, the first wavelength-dividing film 2313a transmits the first sub-optical signal in the optical signal output by the transceiver separation sub-unit 231a to the corresponding receiver, and reflects the second sub-optical signal and the third sub-optical signal to the second optical transmission channel 2312b.

[0163] The second optical transmission channel 2312b is located between the first wavelength separation film 2313a and the second wavelength separation film 2313b. The second optical transmission channel 2312b is used to transmit other optical signals from the first wavelength separation film 2313a to the second wavelength separation film 2313b.

[0164] The second wavelength-splitting film 2313b is used to separate the second sub-optical signal from the other received optical signals and transmit the second sub-optical signal to a corresponding receiver (i.e., a receiver that receives the same wavelength as the second sub-optical signal). The second wavelength-splitting film 2313b is also used to transmit the third sub-optical signal from the other received optical signals to the third optical transmission channel 2312c. Exemplarily, the second wavelength-splitting film 2313b transmits the second sub-optical signal to the corresponding receiver and reflects the third sub-optical signal to the third optical transmission channel 2312c.

[0165] The third optical transmission channel 2312c is used to transmit the third optical sub-signal to a corresponding receiver (ie, a receiver having a receiving wavelength that is the same as the wavelength of the third optical sub-signal).

[0166] Exemplarily, the wavelength separation film 2313 includes a multilayer dielectric film, which may include alternating high refractive index layers and low refractive index layers. By coordinating the thickness and refractive index of the high refractive index layer and the low refractive index layer, it is possible to transmit light of a part of the wavelength and reflect light of another part of the wavelength, thereby achieving separation of the optical signal.

[0167] Since the wavelength distance of the upstream optical signals supported by the GPON protocol, 10G PON protocol and 50G PON protocol is relatively small, it is necessary to separate the wavelengths more accurately. Therefore, it is necessary to ensure that the incident angle is a set angle (for example, 13.5°) to ensure that the optical signal of the required wavelength can be filtered out with low loss. The larger the incident angle, the thicker the wavelength division membrane will be. The thicker wavelength division membrane will have problems with high stress and mounting. In this embodiment, by attaching the wavelength division membrane to the side wall of the optical waveguide chip and using the optical transmission channel (i.e., waveguide) in the optical waveguide chip as a route, a precise incident angle can be obtained. Therefore, the incident angle of the wavelength division membrane can be reduced, thereby reducing the thickness of the wavelength division membrane, thereby alleviating or even avoiding the stress and mounting problems caused by the thick wavelength division membrane. In addition, the wavelength division sub-unit 31b is also integrated in the optical waveguide chip 233, which is conducive to reducing the product size and improving consistency.

[0168] For example, the incident angle of the optical signal output from the optical transmission channel on the wavelength division film can be less than 8°. Thus, compared with the wavelength division film with an incident angle of 13.5°, the thickness of the wavelength division film can be reduced by more than 20%.

[0169] In some examples, the wavelength separation film 2313 is deposited on the sidewalls of the optical waveguide chip 233. The deposition method can be physical vapor deposition (PVD) or chemical vapor deposition (CVD), etc., which is not limited in this application. In other examples, the wavelength separation film 2313 is bonded to the sidewalls of the optical waveguide chip 233.

[0170] exist Figure 2 In the embodiment, the first wavelength-dividing film 2313a transmits the first optical sub-signal to the first receiver 221. The wavelength of the first optical sub-signal is the same as the reception wavelength of the first receiver 221. The second wavelength-dividing film 2313b transmits the second optical sub-signal to the second receiver 222. The wavelength of the second optical sub-signal is the same as the reception wavelength of the second receiver 222. The output end of the third optical transmission channel 2312c outputs the third optical sub-signal to the third receiver 223. The wavelength of the third optical sub-signal is the same as the reception wavelength of the third receiver 223.

[0171] The optical signal received by the first receiver 221 only passes through the first wavelength division membrane 2313a in the propagation path from the transceiver separation sub-unit 231a to the first receiver 221, and passes through the least optical devices compared with the optical signals received by other receivers. Therefore, for the optical signal received by the first receiver 221, the connection loss caused by the optical devices is minimized, which is conducive to further reducing the transmission loss of high-speed signals and improving the signal quality of high-speed signals.

[0172] Exemplarily, the optical waveguide chip has a rectangular structure. In order to match the positions of each receiver, the first wavelength separation film 2313a and the second wavelength separation film 2313b are located on two adjacent side walls of the optical waveguide chip, and the output end of the third optical transmission channel 2313c is located on the side wall where the second wavelength separation film 2313b is located.

[0173] The optical waveguide chip 233 has a receiving groove 2331, and the transceiver separation subunit 231a is located in the receiving groove 2331. Optionally, the transceiver separation subunit 231a includes a thin film filter 2311. The light splitting surface of the thin film filter 2311 forms an angle of 45 degrees with the optical axis of the optical interface 210.

[0174] Exemplarily, the transceiver separation sub-unit further includes an input channel, a first output channel, and a second output channel. The input channel, the first output channel, and the second output channel are all integrated into the optical waveguide chip 233. One end of the input channel is coupled to the optical interface 210 (e.g., spatially aligned), and the other end of the input channel is used to transmit the uplink optical signal received by the optical interface 210 to the thin film filter 2311. One end of the first output channel is connected to the second side of the thin film filter 2311, and the other end of the first output channel is connected to the second transmission unit 232, and is used to transmit the downlink optical signal output by the second transmission unit 232 to the thin film filter 2311. The thin film filter 2311 is used to transmit the downlink optical signal, allowing the downlink optical signal to be output through the input channel and the optical interface. One end of the second output channel is connected to the first side of the thin film filter 2311, and the other end of the second output channel is connected to the first optical transmission channel 2312a in the multiplexing / demultiplexing sub-unit 231b. The thin film filter 2311 is used to reflect the uplink optical signal received by the optical interface 210 and reflect the uplink optical signal to the second output channel. The second output channel is used to output the uplink optical signal to the multiplexing / demultiplexing sub-unit 231 b.

[0175] In some examples, the thin film filter 2311 can be a filter, which can include a transparent substrate and a spectroscopic layer located on the surface of the transparent substrate; or, the filter can include a multilayer dielectric film, which can include alternating high refractive index layers and low refractive index layers.

[0176] The embodiments of the present application do not impose any restrictions on the materials of the optical splitting layer and the dielectric film, as long as they can reflect optical signals within a first wavelength range and transmit optical signals within a second wavelength range. The first wavelength range includes the transmission wavelength of each transmitter, and the second wavelength range includes the receiving wavelength of each receiver; alternatively, the first wavelength range includes the receiving wavelength of each receiver, and the second wavelength range includes the transmission wavelength of each transmitter.

[0177] Figure 2 In the embodiment, the optical waveguide chip 233 is an integral structure and can adopt a silicon photonic platform, a PLC platform, a III-V (e.g., InP-based) platform, or a silicon nitride platform. Among them, the silicon photonic platform has a mature process and a high refractive index contrast, which is conducive to the realization of a small-sized chip. The PLC platform has a low processing cost and lower loss than the silicon photonic platform, and is polarization-insensitive, making it particularly suitable for uplink optical signals with non-fixed polarization directions. In the embodiment of the present application, the PLC platform mainly refers to a glass-based platform.

[0178] Taking the optical waveguide chip 233 using the silicon photonic platform as an example, the first directional coupler and the second directional coupler are arranged in the propagation direction (eg Figure 2 The length of the left and right direction is about 1.2 mm, and the length of the left and right direction is about 1.2 mm. Figure 2The width in the vertical direction) is less than 30μm; the distance between each output / input port of the optical waveguide chip 233 is also required to be 1-2mm to ensure subsequent coupling with the laser or detector. For example, the distance between the output port of the optical waveguide chip 233 that is spatially aligned with the second transmitter 212 and the output port of the optical waveguide chip 233 that is spatially aligned with the third transmitter 213 is 1-2mm. The size of the optical waveguide chip 233 using the silicon photonic platform is approximately 5mm×3mm. After being assembled with devices such as transmitters and receivers, the overall size is also very small. Compared with the use of a coaxial space optical mirror system to implement a transmission module (with a size of about 20mm), Figure 2 The product size of the optical transceiver shown is significantly reduced.

[0179] Figure 3 yes Figure 2 Schematic diagram of the working principle of the optical transceiver. Figure 3 As shown, the uplink optical signal received by optical interface 210 from optical fiber f passes through transceiver / splitter subunit 231a and then reaches combiner / demultiplexer subunit 231b. Combiner / demultiplexer subunit 231b transmits the uplink optical signal to each receiver according to wavelength. Each receiver performs optical-to-electrical conversion on the received optical signal and then transmits it through the connected electrical interface. Each transmitter receives the electrical signal sent by the connected electrical interface and transmits an optical signal to second transmission unit 232 based on the electrical signal. Second transmission unit 232 combines the optical signals received from each transmitter to obtain a downlink optical signal. The downlink optical signal is transmitted to transceiver / splitter subunit 231a, and then emitted from transceiver / splitter subunit 231a to optical interface 210 and transmitted through optical fiber f connected to optical interface 210.

[0180] The electrical interface connecting the first transmitter and the first receiver is the first transceiver interface. The electrical interface connecting the second transmitter and the second receiver is the second transceiver interface. The electrical interface connecting the third transmitter and the third receiver is the third transceiver interface. Each transceiver interface includes one or more of the aforementioned pins 241.

[0181] Figure 4 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 2 The difference between the optical transceiver shown in the figure is that the positions of the second receiver and the third receiver are different and the structure of the first transmission unit is different. Figure 4 As shown, the second receiver 222, the second transmitter 212 and the third transmitter 213 are all located on the third side c of the transmission module 430, and the third receiver 223 is located on the fourth side d of the transmission module 430. The third receiver 223 and the second receiver 222 are located on a side of the optical waveguide chip 433 close to the optical interface 410.

[0182] In order to match the positions of the third receiver 223 and the second receiver 222, the first transmission unit 431, in addition to the aforementioned transceiver separation sub-unit 231a and the multiplexer / demultiplexer sub-unit 231b, also includes a direction adjustment sub-unit, which is used to transmit the optical signal from the multiplexer / demultiplexer sub-unit 231b to the second receiver 222 and the third receiver 223.

[0183] Optionally, the direction adjustment subunit may include one or more reflective devices. The type, quantity, and position of the reflective devices may be set according to actual needs. The direction adjustment subunit may be used to flexibly arrange the positions of the various receivers relative to the transmission module 430.

[0184] For example, Figure 4 As shown, the direction adjustment subunit includes a reflector 4311, a reflective prism 4312, and a direction adjustment channel 4313. The reflector 4311 is attached to the sidewall of the optical waveguide chip 433, the direction adjustment channel 4313 is integrated into the optical waveguide chip 433, and the reflective prism 4312 is located on the side of the optical waveguide chip 433 near the optical interface 410. The reflector 4311 is used to receive the optical signal output by the third optical transmission channel 2312c and reflect the optical signal output by the third optical transmission channel 2312c to the input end of the direction adjustment channel 4313. The reflective prism 4312 has two reflective surfaces: one reflective surface faces the second wavelength splitting film 2313b and is used to reflect the optical signal separated by the second wavelength splitting film 2313b to the second receiver 322; the other reflective surface faces the output end of the third optical transmission channel 2312c and is used to reflect the optical signal output from the output end of the third optical transmission channel 2312c to the third receiver 223.

[0185] In this embodiment, the second wavelength separation film 2313b and the first wavelength separation film 2313a are located on two opposite sidewalls of the optical waveguide chip 233. The reflective mirror 4311 and the first wavelength separation film 2313a are located on the same sidewall of the optical waveguide chip 233.

[0186] Exemplarily, the reflecting prism 4312 is a right-angle prism, and the two reflecting surfaces are respectively two right-angled surfaces of the right-angle prism 4312. In other embodiments, the reflecting prism 4312 can be replaced by two reflecting mirrors, which are respectively located at the two reflecting surfaces of the reflecting prism 4312.

[0187] Figure 5 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 4 The difference between the optical transceiver shown in the figure is that the positions of the second receiver and the third receiver are different and the structure of the first transmission unit is different. Figure 5As shown, the second transmitter 212 and the third transmitter 213 are both located on the third side c of the transmission module 530, and the second receiver 222 and the third receiver 223 are located on the fourth side d of the transmission module 530. Furthermore, in the direction from the first side a to the second side b, the third receiver 223 and the second receiver 222 are respectively located on either side of the optical waveguide chip 533. Specifically, the third receiver 223 is located on the side of the optical waveguide chip 533 close to the optical interface, and the second receiver 222 is located on the side of the optical waveguide chip 533 close to the first transmitter 211 and the first receiver 221.

[0188] Figure 5 In the embodiment, the direction adjustment subunit includes two reflectors 5311 and 5312. The reflector 5311 is located on the side of the optical waveguide chip 533 close to the optical interface, with its reflective surface facing the second wavelength separation film 2313b, and is used to reflect the optical signal separated by the second wavelength separation film 2313b to the third receiver 223. The other reflector 5312 is located on the side of the optical waveguide chip 533 close to the first transmitter 211 and the first receiver 221, with its reflective surface facing the output end of the third optical transmission channel 2312c, and is used to reflect the optical signal output from the output end of the third optical transmission channel 2312c to the second receiver 222.

[0189] Figure 4 In the embodiment, the optical waveguide chip 233 is an integral structure, and Figure 5 In the embodiment, the optical waveguide chip 533 includes a first sub-chip 533a and a second sub-chip 533b. The second transmission unit 32 is integrated into the first sub-chip 533a. A portion of the first transmission unit 31 is integrated into the second sub-chip 533b, and the other portion of the first transmission unit 31 is located outside the optical waveguide chip 533 (i.e., not integrated into the first sub-chip 533a or the second sub-chip 533b).

[0190] The first sub-chip 533a and the second sub-chip 533b use different material platforms. For example, the first sub-chip 533a uses a silicon photonics platform, and the second sub-chip 533b uses a PLC platform. The processing technology of the silicon photonics platform is mature and is particularly suitable for optical devices with small process tolerances, such as the aforementioned directional coupler. In addition, the length of the waveguide used to transmit the downlink optical signal in the first sub-chip 533a is shorter, that is, the transmission distance of the downlink optical signal in the first optical chip 533a is shorter, and the shorter the transmission distance, the smaller the transmission loss, so the problem of higher waveguide transmission loss of the silicon photonics platform compared to other material platforms can be avoided. The second sub-chip 533b uses a PLC platform, and the transmission loss of the PLC platform is extremely low, which can be less than 0.05dB / cm, so the transmission loss of the uplink optical signal is relatively small. In addition, the mode field diameter of the waveguide in the PLC platform is closer to that of the optical fiber, so the coupling loss with the optical fiber is lower. In addition, the waveguide (i.e., the aforementioned optical transmission channel) provided in the second sub-chip 533b mainly plays a routing role, and there are no other complex optical devices, which can effectively avoid the problem of large processing errors caused by the immature PLC processing technology.

[0191] Optionally, the first sub-chip 533a and the second sub-chip 533b are arranged side by side. An output port of the first sub-chip 533a is spatially aligned with an input port of the second sub-chip. The output port is used to output a combined signal (i.e., a downlink optical signal) of the optical signals output by each transmitter, and the input port is used to receive the combined signal so that the combined signal is transmitted to the first transmission unit 31. Exemplarily, a gap exists between an output port of the spatially aligned first sub-chip 533a and an input port of the second sub-chip to improve the coupling efficiency of light between the first sub-chip 533a and the second sub-chip 533b.

[0192] Optionally, the first sub-chip 533a and the second sub-chip 533b can be processed on the same substrate (e.g., a ceramic substrate), or can be processed into independent chips and then packaged on the same substrate. When the first sub-chip 533a and the second sub-chip 533b are processed into independent chips and then packaged together, the first sub-chip 533a and the second sub-chip 533b can be tested separately to promptly screen out defective products and improve the yield rate of the optical component.

[0193] Figure 6 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 5 The difference between the optical transceiver shown is that the positional relationship and the connection relationship between the first sub-chip and the second sub-chip are different. Figure 6In the embodiment, the optical waveguide chip 633 includes a first sub-chip 633a and a second sub-chip 633b. The first sub-chip 633a is connected to the surface of the second sub-chip 633b, and the first sub-chip 633a and the second sub-chip 633b are coupled by evanescent wave coupling technology.

[0194] Exemplarily, the first sub-chip 633a adopts a silicon photonics platform, and the second sub-chip 633b adopts a PLC platform.

[0195] Figure 7 yes Figure 6 Schematic diagram of the structure of the waveguide coupling between the first sub-chip and the second sub-chip. Figure 7 As shown, the second sub-chip 633b includes a glass substrate 6332b, a waveguide layer and a cladding (not shown in the figure), wherein the waveguide layer includes a second waveguide 6331b. The waveguide 6331b is located in the glass substrate 6332b and is formed by ion exchange or ion implantation. The first sub-chip 633a includes a silicon substrate (not shown), a silicon waveguide layer and a silicon dioxide cladding 6333a stacked in sequence, and the waveguide layer includes a first waveguide 6331a. At the waveguide coupling point between the first sub-chip 633a and the second sub-chip 633b, that is, Figure 6 At center A, the cladding of the second sub-chip 633b is removed, and the glass substrate 6332b is bonded to the silicon dioxide cladding 6333a. Because the glass substrate 6332b and the silicon dioxide cladding 6333a have similar temperature dependence, stress, and other characteristics, they can be bonded together with high performance.

[0196] The first waveguide 6331a and the second waveguide 6331b are centrally aligned in the stacking direction of the first sub-chip 633a and the second sub-chip 633b. That is, the centerline of the first waveguide 6331a and the centerline of the second waveguide 6331b are parallel to each other, and the plane where the centerline of the first waveguide 6331a and the centerline of the second waveguide 6331b lie is parallel to the stacking direction of the first sub-chip 633a and the second sub-chip 633b.

[0197] It should be noted that, in order to facilitate observation of the relative positions of the first waveguide 6331a and the second waveguide 6331b, Figure 7 The silicon substrate is omitted.

[0198] The first waveguide 6331a is a slowly tapered waveguide. This slowly tapered waveguide is the primary structure for adiabatic coupling, enabling light transfer between waveguides of different materials and sizes. By adding a certain length of slowly tapered waveguide, the propagation constants of the modes in the first and second waveguides intersect, thus achieving optical coupling between the first waveguide 6331a and the second waveguide 6331b.

[0199] Here, the slowly tapered waveguide means that the tapered change rate must be small to ensure that light transmitted therein does not leak to the outside.

[0200] Optionally, in this embodiment, the SSCs for coupling between the optical fiber and the optical waveguide chip 633, and between the space and the optical waveguide chip 633 are both designed on the PLC chip with a larger mode field diameter (i.e., the second sub-chip 633b). That is, in this embodiment, in addition to Figure 6 In addition to the A in FIG, the evanescent wave coupling technology is also used at SSC 2323 to couple the optical signal sent by the transmitter to the first sub-chip 633a. In other embodiments, it is also possible to only Figure 6 The evanescent wave coupling technology is used at A in the figure.

[0201] When the coupling length of evanescent wave coupling is sufficient, the theoretical coupling loss is close to 0. The current loss is mainly caused by process errors. With the rapid development of current heterogeneous integration processes, small-sized, extremely low-loss three-generation integrated optical components can be obtained.

[0202] It should be noted that Figure 6 The structure of the mid-direction adjustment subunit Figure 4 The structure of the direction adjustment subunit is the same as that of the direction adjustment subunit, and will not be described in detail here. Figure 6 The direction adjustment subunit in can be Figure 5 The structure of the mid-direction adjustment subunit.

[0203] exist Figures 2 to 6 In the embodiment shown, the transmitting and receiving separation sub-units are all located in the receiving grooves of the optical waveguide chip. In this way, the optical component has a high degree of integration, a small volume, and high stability.

[0204] Figure 8 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 8 The optical transceiver shown is Figure 2 The difference between the optical transceiver and the optical transceiver shown in the figure is that the structure of the transceiver separation subunit is different. Figure 8 As shown, the transceiver separation subunit 731a is located on one side of the optical waveguide chip 233. This avoids the need for slotting in the optical waveguide chip 233, thereby preventing the slotting from affecting the yield of the optical waveguide chip 233. This helps improve the yield of the optical waveguide chip 233 and simplifies the manufacturing process of the optical waveguide chip 233.

[0205] Exemplarily, the transceiver separation subunit 731a includes a thin film filter 7311, a transmitting collimator 7312, and a receiving collimator 7313. The receiving collimator 7313 is located between the thin film filter 7311 and the multiplexing / demultiplexing subunit 231b. The thin film filter 7311 is used to transmit the optical signal from the optical interface to the receiving collimator 7313. Then, after being collimated by the receiving collimator 7313, the optical signal is transmitted to the multiplexing / demultiplexing subunit 231b. The transmitting collimator 7312 is located between the thin film filter 7311 and the second transmission unit 232. It is used to collimate the combined signal (i.e., the downlink optical signal) of the optical signals emitted by each transmitter and transmit the collimated combined signal to the thin film filter 7311. The thin film filter 7311 transmits the received combined signal to the optical interface.

[0206] The structure of thin film filter can be seen in Figure 2 Detailed description of the related embodiments is omitted here.

[0207] In this embodiment, the thin film filter and the collimator are used in conjunction to realize separation and transmission of optical signals. The technology is relatively mature and easy to realize.

[0208] For example, Figure 8 In the embodiment, the optical waveguide chip 233 includes a top surface, a bottom surface, and multiple side walls. The top surface and the bottom surface are opposite to each other, and the multiple side walls are connected end to end and connected between the top surface and the bottom surface. The multiple side walls include a first side wall, a second side wall, a third side wall, a fourth side wall, a fifth side wall, and a sixth side wall connected in sequence. The first side wall and the third side wall are relatively parallel, the second side wall is perpendicularly connected between the first side wall and the third side wall, the fourth side wall and the sixth side wall are both parallel to the third side wall, and the fifth side wall is parallel to the first side wall and perpendicularly connected between the fourth side wall and the sixth side wall. The receiving collimator 7313 is opposite to the sixth side wall, and the transmitting collimator 7312 is opposite to the fifth side wall.

[0209] Figure 9 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 9 The optical transceiver shown is Figure 2 The difference between the optical transceiver and the optical transceiver shown in the figure is that the structure of the transceiver separation subunit is different. Figure 9 As shown, the transceiver separation subunit 831a is integrated into the optical waveguide chip 233. Figure 2 Compared with the method of providing a receiving groove in the optical waveguide chip 233, Figure 9 Directly integrating the transmit / receive splitter subunit 831a into the optical waveguide chip 233 can further improve the integration level. As the manufacturing process of the optical waveguide chip 233 gradually develops, the processing error is getting smaller and smaller, and even a chip structure close to spatial optical loss can be achieved.

[0210] Illustratively, the transceiver splitter subunit 831a includes a mode converter 8311 and a coupler 8312. The first end of the mode converter 8311 is used to receive an optical signal from the optical interface, the second end of the mode converter 8311 is connected to the input end of the coupler 8312, the first output end of the coupler 8312 is connected to the output end of the second transmission unit 232, and the second output end of the coupler 8312 is connected to the input end of the multiplexing / demultiplexing subunit 231b.

[0211] In GPON, 10G PON, and 50G PON protocols, the wavelength spacing between uplink and downlink optical signals is only 10nm, requiring a precise waveguide structure to achieve high-isolation splitting. Therefore, the mode converter 8311 is used to convert the uplink optical signal into a polarization state different from that of the downlink optical signal, or to a higher-order mode, thereby increasing the differentiation between the uplink and downlink optical signals and achieving high-isolation splitting.

[0212] For example, the combined signal of each transmitter, that is, the downlink optical signal, is the transverse electric wave (TE) fundamental mode. The mode converter converts the uplink optical signal into the transversal magnetic wave (TM) fundamental mode or a high-order mode to obtain the uplink optical signal after mode conversion. The coupler 8312 couples the mode-converted uplink optical signal to the combining and decombining sub-unit 231b, which does not affect the transmission of the TE fundamental mode, that is, does not affect the transmission of the downlink optical signal.

[0213] Optionally, higher-order modes include, but are not limited to, first-order TE modes or second-order TE modes. The converted mode is selected primarily based on the coupling efficiency between the TE fundamental mode and the converted mode. The mode with the highest coupling efficiency can be selected as the converted mode. Simulation results show that when the TM fundamental mode is coupled to another waveguide, the ideal coupling efficiency exceeds 99%, and the ideal loss of the TE mode in the reverse propagation direction of the original waveguide can be less than 0.05dB.

[0214] Optionally, the mode coupler 8311 is a Bragg reflection grating.

[0215] Optionally, the coupler 8312 can be a tapered coupling waveguide or a directional coupler, etc.

[0216] Figure 10 yes Figure 9 Schematic diagram of the enlarged structure of the coupler in FIG. The coupler is a tapered coupled waveguide. Figure 10As shown, the tapered coupling waveguide includes a first waveguide 8312a and a second waveguide 8312b. There is a small distance between the first waveguide 8312a and the second waveguide 8312b and the extension direction is substantially the same, so that the light wave transmitted in the first waveguide 8312a can be coupled to the second waveguide 8312b. Figure 10 In part (a), the first waveguide 8312a is a tapered waveguide, and the width of the first waveguide 8312a gradually decreases from the first end to the second end of the first waveguide 8312a. The second waveguide 8312b is a tapered waveguide, and the width of the second waveguide 8312b gradually increases from the first end to the second end of the first waveguide 8312a. In the direction from the first end to the second end of the first waveguide 8312a, the distance between the first waveguide 8312a and the second waveguide 8312b remains unchanged. Figure 10 In part (b), the first waveguide is a straight waveguide, that is, the width of the first waveguide 8312a is constant in the direction from the first end to the second end of the first waveguide 8312a. Figure 10 The second waveguide 8312a is the same as the second waveguide in part (a) and is not described in detail here. For example, the first end of the first waveguide 8312a is the input end of the aforementioned coupler, the second end of the first waveguide 8312a is the first output end of the aforementioned coupler, and the second end of the second waveguide 8312b (the end closest to the second end of the second waveguide 8312a) is the second output end of the aforementioned coupler.

[0217] Figure 11 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 11 The optical transceiver shown is Figures 2 to 9 The difference between the optical transceiver devices shown is that the structure of the first transmission unit is different. Figures 2 to 9 In the first transmission unit, there are two independent sub-units: the receiving and transmitting separation sub-unit and the combining and splitting sub-unit. Figure 11 In the embodiment, the first transmission unit 1031 does not distinguish between a transceiver separation subunit and a wavelength combination / demultiplexing subunit, but rather includes three transmission subunits sequentially located between the optical interface and the second transmission unit 232. Each transmission subunit corresponds to a receiver and is configured to separate an optical signal having the same wavelength as the corresponding receiver from the optical signal received by the optical interface and transmit the optical signal to the corresponding receiver.

[0218] like Figure 11 As shown in part (a), each transmission subunit includes a coupler 10311 and a mode converter 10312. The coupler 10311 and the mode converter 10312 are both integrated into the optical waveguide chip, that is, in this embodiment, the first transmission unit 1031 is fully integrated into the optical waveguide chip 233, and the integration of the optical components is relatively high. Figure 2Compared with the embodiment shown, there is no need to perform processing such as grooving, and the production efficiency is higher.

[0219] For example, Figure 11 As shown in part (b), the three transmission subunits are a first transmission subunit 1031a, a second transmission subunit 1031b and a third transmission subunit 1031c which are arranged in sequence along the light propagation direction from the optical interface to the second transmission unit 232.

[0220] In this embodiment, the uplink optical signal received by the optical interface includes a first optical sub-signal, a second optical sub-signal, and a third optical sub-signal, each of which has the same receiving wavelength as a receiver.

[0221] The input end of the coupler 10311 of the first transmission subunit 1031a is used to receive an uplink optical signal, the first output end of the coupler 10311 of the first transmission subunit 1031a is connected to the first end of the mode converter 10312 of the first transmission subunit 1031a, and the coupler 10311 of the first transmission subunit 1031a is used to output the first sub-optical signal to one of the three receivers through the second output end of the coupler 10311 of the first transmission subunit 1031a.

[0222] The input end of the coupler 10311 of the second transmission subunit 1031b is connected to the second end of the mode converter of the first transmission subunit 1031a, and the first output end of the coupler 10311 of the second transmission subunit is connected to the first end of the mode converter of the second transmission subunit. The coupler 10311 of the second transmission subunit is used to output the second sub-optical signal to another receiver among the three receivers through the second output end of the coupler of the second transmission subunit.

[0223] The input end of the coupler of the third transmission subunit 1031b is connected to the second end of the mode converter of the second transmission subunit 1031b, the first output end of the coupler 10311 of the third transmission subunit is connected to the second transmission unit 232, and the coupler 10311 of the third transmission subunit 1031c is used to output the third sub-optical signal to another receiver among the three receivers through the second output end of the coupler 10311 of the third transmission subunit 1031c.

[0224] In this embodiment, the wavelength of the first optical sub-signal is the same as the receiving wavelength of the third receiver, the wavelength of the second optical sub-signal is the same as the receiving wavelength of the second receiver, and the wavelength of the third optical sub-signal is the same as the receiving wavelength of the first receiver. This facilitates the arrangement of the optical waveguides in the optical waveguide chip. In other embodiments, the wavelength of the first optical sub-signal can be replaced by the wavelength of the first receiver, the wavelength of the second optical sub-signal can be replaced by the wavelength of the second receiver, and the wavelength of the third optical sub-signal can be replaced by the wavelength of the third receiver.

[0225] Optionally, the mode converter 10312 is a Bragg reflection grating. The reflection wavelengths of the Bragg reflection gratings in each transmission subunit are different. The reflection wavelengths of the Bragg reflection gratings in the three transmission subunits are respectively the same as the receiving wavelengths of the three receivers.

[0226] Optionally, the coupler 10311 can be a tapered coupling waveguide or a directional coupler, etc.

[0227] Figure 12 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 12 The optical transceiver shown is Figures 2 to 9 The difference between the optical transceiver shown in FIG. 1 is that the structure of the first transmission unit 1131 is different. Figure 12 In the embodiment, the first transmission unit 1131 is located outside the optical waveguide chip 1133 and is implemented using a space optical mirror system.

[0228] Illustratively, the first transmission unit 1131 includes a splitter group and a reflector group. The splitter group is used to separate optical signals from the optical interface according to wavelengths corresponding to at least two receivers, the reflector group is used to transmit the optical signals separated by the splitter group to receivers corresponding to the respective wavelengths, and the splitter group is further used to combine optical signals from at least two transmitters and transmit the combined optical signals to the optical interface.

[0229] Figure 12 In the embodiment, the second receiver 222 , the second transmitter 212 and the third transmitter 213 are all located at the third side c of the transmission module 1130 , and the third receiver 223 is located at the fourth side d of the transmission module 1130 .

[0230] Exemplarily, the optical waveguide chip 1133 is a rectangular structure, and the output port of the optical waveguide chip 1133 is located on one side of the optical waveguide chip 1133 (i.e., the left side in the figure) in the length direction of the optical waveguide chip 1133. The first transmission unit 1131 is located on one side of the optical waveguide chip 1133 in the length direction of the optical waveguide chip 1133, and is located between the optical interface (not shown) and the optical waveguide chip 1133.

[0231] The optical splitter assembly includes a first filter 1131a, a second filter 1131b, and a third filter 1131c. The first filter 1131a, the second filter 1131b, and the third filter 1131c are arranged sequentially from the optical interface to the optical waveguide chip 1133. The reflector assembly includes a first reflector assembly 1132a, a second reflector assembly 1132b, and a third reflector assembly 1132c. The first filter 1131a is configured to separate an optical signal of a third receiving wavelength from an optical signal received by the optical interface and transmit the separated optical signal to the first reflector assembly 1132a. The first reflector assembly 1132a is configured to transmit the optical signal of the third receiving wavelength to the third receiver 223. The first filter 1131a is also configured to transmit optical signals other than the third receiving wavelength from the optical signal received by the optical interface to the second filter 1131b. The second filter 1131b is used to separate the optical signal of the second receiving wavelength from the optical signal received by the first filter 1131a and transmit the separated optical signal to the second reflector group 1132b. The second reflector group 1132b is used to transmit the optical signal of the second receiving wavelength to the second receiver 222. The second filter 1131b is also used to transmit the optical signal other than the second receiving wavelength from the optical signal received by the first filter 1131a to the third filter 1131c. The third filter 1131c is used to transmit the optical signal of the first receiving wavelength from the optical signal received by the second filter 1131b to the third reflector group 1132c. The third reflector group 1132c is used to transmit the optical signal of the first receiving wavelength to the first receiver 211.

[0232] Each of the first reflector group 1132a, the second reflector group 1132b, and the third reflector group 1132c includes one or more reflectors, and the number of reflectors in each reflector group is determined by the position of the corresponding receiver. Figure 12 As shown, the first reflector group 1132a includes one reflector, the second reflector group 1132b includes one reflector, and the third reflector group 1132c includes two reflectors.

[0233] Figure 12 The arrangement of the first transmission unit 31 is conducive to reducing the size of the optical transceiver device in the width direction of the optical waveguide chip 33, that is, reducing the width of the optical transceiver device.

[0234] It should be noted that the arrangement order of the three reflector groups can be changed as needed, and the embodiment of the present application does not limit this. For example, the second reflector group 1131b, the first reflector group 1131a, and the third reflector group 1131c can be arranged in sequence between the optical interface and the optical waveguide chip 1133.

[0235] Figure 13This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 13 The optical transceiver shown is Figure 12 The difference between the optical transceiver and the optical transceiver is that the position of the first transmission unit relative to the optical waveguide chip is different. Figure 13 As shown, the exit port of the optical waveguide chip 1233 is located on one side of the optical waveguide chip 1233 in the width direction of the optical waveguide chip 1233 (i.e., the lower side in the figure), and the first transmission unit 1231 is located on one side of the optical waveguide chip 1233 in the width direction of the optical waveguide chip 1233.

[0236] In addition to the first reflector group 1132a, the second reflector group 1132b and the third reflector group 1132c, the first transmission unit 1231 also includes a fourth reflector group 1232d, which is used to change the propagation direction of the optical signal emitted by the optical waveguide chip 1233 to be parallel to the optical axis direction of the optical interface. This is because Figure 13 In the embodiment, the optical axis direction of the optical interface is parallel to the length direction of the optical waveguide chip 1233 and perpendicular to the width direction of the optical waveguide chip 1233. In order to facilitate the output of the optical signal from the optical interface, the propagation direction of the optical signal output from the optical waveguide chip 1233 needs to be adjusted first.

[0237] Figure 13 The arrangement of the first transmission unit 31 is conducive to reducing the size of the optical transceiver device in the length direction of the optical waveguide chip 33, that is, reducing the length of the optical transceiver device.

[0238] Figure 14 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 14 The optical transceiver shown is Figure 12 The difference between the optical transceiver shown is that the structure of the first transmission unit is different. Figure 14 In the embodiment, the first transmission unit 1331 adopts a Z-block system to replace the spatial optical mirror system.

[0239] like Figure 14 As shown, the first transmission unit 1331 includes a first glass block 13311 and a first filter set. The first glass block 13311 has a first side surface and a second side surface facing each other. The first side surface faces the optical interface, and the second side surface faces the optical waveguide chip 1133. The first filter set includes a first filter 13312a, a second filter 13312b, a third filter 13312c, and a fourth filter 13312d. The third filter 13312c is located on the first side surface, and the first filter 13312a, the second filter 13312b, and the fourth filter 13312d are all located on the second side surface.

[0240] The fourth filter 13312d is used to transmit the downstream optical signal output by the optical waveguide chip 1133. After being reflected by the third filter 13312c, the second filter 13312b, and the first filter 13312a, the downstream optical signal is emitted through the optical port on the first side surface to the optical interface. Alternatively, the fourth filter 13312d can also be an antireflection film.

[0241] The uplink optical signal received by the optical interface enters the glass block 13311 through the optical port on the first side surface and then reaches the first filter 13312a. The first filter 13312a transmits the optical signal of the first receiving wavelength to the first receiver 221 and reflects the optical signal other than the first receiving wavelength to the second filter 13312b. The second filter 13312b transmits the optical signal of the second receiving wavelength for transmission to the second receiver 221 and reflects the optical signal other than the first receiving wavelength to the third filter 13312c. The third filter 13312c transmits the optical signal of the third receiving wavelength for transmission to the third receiver 223.

[0242] It should be noted that the first transmission unit further includes the aforementioned direction adjustment subunit, which is used to control the propagation direction of at least part of the optical signals of the first receiving wavelength, the second receiving wavelength and the third receiving wavelength.

[0243] For example, Figure 14 In FIG, the direction adjustment subunit includes two reflectors 4311 and 4312. The reflector 4311 is used to reflect the optical signal of the second receiving wavelength to the second receiver 222, and the reflector 4312 is used to reflect the optical signal of the third receiving wavelength to the third receiver 223.

[0244] The optical port refers to an area on the first side that is spatially aligned with the optical interface to allow an optical signal to enter the first glass block 13311 from the optical interface and / or allow an optical signal in the first glass block 13311 to exit the optical interface.

[0245] Figure 14 The arrangement of the first transmission unit 1331 is conducive to reducing the size of the optical transceiver device in the width direction of the optical waveguide chip 33, that is, reducing the width of the optical transceiver device.

[0246] Figure 15 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 15 The optical transceiver shown is Figure 14 The difference between the optical transceiver shown in FIG. 1 is that the position of the first transmission unit 1331 relative to the optical waveguide chip 1233 is different. Figure 15As shown, the exit port of the optical waveguide chip 1233 is located on one side of the optical waveguide chip 1233 (i.e., the lower side in the figure) in the width direction of the optical waveguide chip 1233, and the first transmission unit 1331 is located on one side of the optical waveguide chip 1233 in the width direction of the optical waveguide chip 1233.

[0247] Figure 15 The arrangement of the first transmission unit 1331 is conducive to reducing the size of the optical transceiver device in the length direction of the optical waveguide chip 1233, that is, reducing the length of the optical transceiver device.

[0248] exist Figures 12 to 15 In the illustrated embodiment, the first transmission unit and the optical waveguide chip are arranged side by side, or in the same plane. In other embodiments, the first transmission unit and the optical waveguide chip can be arranged in layers, for example, with the optical waveguide chip in the lower layer and the majority of the first transmission unit in the upper layer. Here, upper and lower layers refer to the thickness of the optical waveguide chip. In other words, the optical waveguide chip can be mounted on the bottom of the first transmission unit without affecting its structure. This assembly method can further reduce the size of the optical component.

[0249] exist Figures 12 to 15 In the illustrated embodiment, the working portion of the optical waveguide chip is approximately 1.5 mm long, and the waveguide bending radius is only 10 μm in a standard silicon photonics platform, allowing for free change of waveguide routing, and modification of chip size and aspect ratio to accommodate co-packaging with a space optical system.

[0250] exist Figures 12 to 16 In the illustrated embodiment, the second transmission unit is integrated into the optical waveguide chip, and the first transmission unit is located on one side of the optical waveguide chip. This structure not only reduces the size of the optical component, but also has relatively small structural changes compared to existing optical components, which is conducive to the rapid implementation of the product.

[0251] Figure 16 1 is a structural diagram of another optical transceiver provided in an embodiment of the present application. In this optical transceiver, the transmission module is composed of a space optical mirror system, which is also called a coaxial space optical system.

[0252] like Figure 16 As shown, in Figure 12Based on this, the optical signal output port of the second transmitter 211 is spatially aligned with the third filter 1131c. The optical signal passes through the third filter 1131c, the second filter 1131b, and the first filter 1131a in sequence, and is transmitted to the fourth filter 1131d. The fourth filter 1131d is used to reflect the optical signals transmitted by the second transmitter 212 and the third transmitter 213, and to transmit the optical signal transmitted by the first transmitter 211. In this way, the optical signal transmitted by the first transmitter 211 is combined at the fourth filter 1131d with the optical signals transmitted by the second transmitter 212 and the third transmitter 213, resulting in a downlink optical signal, which is then emitted from the optical interface.

[0253] Figure 17 FIG. 1 is a structural diagram of another optical transceiver provided in an embodiment of the present application. In the optical transceiver, the transmission module is composed of a Z-block system. Figure 17 As shown, in Figure 14 Based on the optical transceiver shown in FIG. 2 , the second transmitter 212 and the third transmitter 213 are arranged on the first side a of the transmission module. The first and second combiners 2321 and 2322 in the optical waveguide chip 1233 and the second transmission unit 232 are replaced with a second glass block 16321 and a second filter set. The second glass block 16321 has a first side and a second side facing each other. The second filter set includes a first filter 16322a, a second filter 16322b, and a third filter 16322c. The first, second, and third filters 16322a, 16322b, 16322c are located on the first side of the second glass block 16321. The second side of the second glass block 16321 is a reflective surface with a light outlet.

[0254] The first filter 16322a, the second filter 16322b and the third filter 16322c are respectively used to receive the optical signals emitted by the corresponding transmitter. The received optical signals are reflected in the second glass block 16321, and are combined into one path and emitted from the light outlet on the second side to the first transmission unit.

[0255] It should be noted that Figures 4 to 17 The optical transceiver shown in the figure does not show the optical interface and substrate. For related content, please refer to Figure 2 The optical transceiver shown.

[0256] It should also be noted that the above description uses an example in which the transceiver module includes three transmitters and three receivers. In other embodiments, the transceiver module includes two transmitters and two receivers. In this case, the two transmitters are a first transmitter and a second transmitter, and the transmission rate of the first transmitter is greater than the transmission rate of the second transmitter. The two receivers are a first receiver and a second receiver, and the reception rate of the first receiver is greater than the reception rate of the second receiver.

[0257] Optionally, the transmission rate of the first transmitter and the reception rate of the first receiver are specified by the 50G PON protocol, and the transmission rate of the second transmitter and the reception rate of the second receiver are specified by the 10G PON protocol. With the development of optical communication systems, ONUs supporting the GPON protocol will be prioritized for network withdrawal. After the ONUs supporting the GPON protocol are withdrawn from the network, ONUs supporting the 50G PON protocol and ONUs supporting the 10G PON protocol will coexist. In this case, the optical transceiver only needs to be compatible with these two types of ONUs.

[0258] The following combination Figure 18 The following example illustrates the case where the transceiver module includes two transmitters and two receivers. Figure 18 As shown, the transceiver module includes a first transmitter 211, a first receiver 221, a second transmitter 212, and a second receiver 222. The first transmitter 211 and the first receiver 221 are located on a first side a of the transmission module 230, and the optical interface 210 is located on a second side b of the transmission module 230. The first side a and the second side b are opposite sides of the transmission module 230. The second transmitter 212 is located on a third side c of the transmission module 230, and the second receiver 222 is located on a fourth side d of the transmission module 230.

[0259] The transmission module 230 is located between the optical interface 210 and the transceiver module 220 and is used to transmit the optical signal received by the optical interface 210 to the first receiver 221 and the second receiver 222 , and to transmit the first transmitter 211 and the second transmitter 212 to the optical interface 210 .

[0260] The second transmission unit 232 includes only one combiner, namely a first combiner 2321. The first end and the second end of the first combiner 2321 are respectively used to receive the optical signals transmitted by the first transmitter 211 and the second transmitter 212. The first combiner 2321 is used to output the optical signal received at the first end and the optical signal received at the second end from the third end of the first combiner 2321, thereby combining the optical signals transmitted by the first transmitter 211 and the second transmitter 212 into one channel and outputting it to the first transmission unit 231. The optical signals are then output from the optical interface 210 via the first transmission unit 231.

[0261] When the transceiver module 220 includes two receivers, the wavelength-splitting subunit 231b includes a wavelength-splitting film and two optical transmission channels. The wavelength-splitting film is attached to the sidewall of the optical waveguide chip 233, and the two optical transmission channels are located in the optical waveguide chip 233. The wavelength-splitting film is the first wavelength-splitting film 2313a, and the two optical transmission channels are the first optical transmission channel 2312a and the second optical transmission channel 2312b. The first optical transmission channel 2312a is located between the transceiver-splitting subunit 231a and the first wavelength-splitting film 2313a. The first optical transmission channel 2312a is used to transmit the optical signal output by the transceiver-splitting subunit 231a to the first wavelength-splitting film 2313a. The optical signal output by the transceiver-splitting subunit 231a includes a first sub-optical signal and a second sub-optical signal. The wavelengths of the first sub-optical signal and the second sub-optical signal are the same as the receiving wavelengths of the two receivers. The first wavelength separation film 2313a is used to separate the first sub-optical signal from the optical signal output by the transceiver separation sub-unit 231a, and output the first sub-optical signal to the corresponding receiver. The first wavelength separation film 2313a is also used to output the second sub-optical signal from the optical signal output by the transceiver separation sub-unit 231a to the second optical transmission channel 2312b. The second optical transmission channel 2312b is used to transmit the second sub-optical signal to the corresponding receiver.

[0262] That is, when the transceiver module includes two transmitters and two receivers, it is only necessary to remove the aforementioned third transmitter and third receiver and the structures related to the third transmitter and third receiver in the transmission module.

[0263] In some other embodiments, the transceiver module may include four transmitters and four receivers. As optical communication systems evolve, new protocols may emerge after the 50G PON protocol. If the ONUs supporting the three protocols preceding the new protocol remain online, ONUs supporting all four protocols will coexist. Therefore, the optical transceiver must be compatible with all four types of ONUs. In this case, appropriate splitter / combiner components will need to be added to the transmission module.

[0264] For example, when the transceiver module 220 includes four transmitters, Figure 2 The second transmission unit 232 in the figure can be replaced with the following structure. The second transmission unit 232 includes three combiners: a first combiner, a second combiner, and a third combiner. The first and second ends of the first combiner are respectively used to receive an optical signal transmitted by one transmitter. The third end of the first combiner is connected to the second end of the second combiner. The first end of the second combiner is used to receive an optical signal transmitted by another transmitter. The third end of the second combiner is connected to the second end of the third combiner. The first end of the third combiner is used to receive an optical signal transmitted by the last transmitter. The third end of the third combiner is used to output the optical signal to the first transmission unit 231.

[0265] Accordingly, when the transceiver module 220 includes four receivers, Figure 2 The wavelength-combining / demultiplexing subunit 231b can be replaced with the following structure. The wavelength-combining / demultiplexing subunit 231b includes three wavelength-division coatings and four optical transmission channels. The three wavelength-division coatings are attached to the sidewalls of the optical waveguide chip 233, and the four optical transmission channels are located within the optical waveguide chip 233. The three wavelength-division coatings are the first wavelength-division coating, the second wavelength-division coating, and the third wavelength-division coating. The two optical transmission channels are the first optical transmission channel, the second optical transmission channel, the third optical transmission channel, and the fourth optical transmission channel.

[0266] The first optical transmission channel is used to transmit the optical signal output by the transceiver separation subunit 231a to the first wavelength division membrane. The optical signal output by the transceiver separation subunit 231a includes a first sub-optical signal, a second sub-optical signal, a third sub-optical signal, and a fourth sub-optical signal. The wavelengths of the first sub-optical signal, the second sub-optical signal, the third sub-optical signal, and the fourth sub-optical signal are the same as the receiving wavelengths of the four receivers.

[0267] The first wavelength separation film is used to separate the optical signal output by the transceiver separation sub-unit 231a into a first sub-optical signal, and output the first sub-optical signal to the corresponding receiver. The first wavelength separation film is also used to output the other sub-optical signals of the optical signal output by the transceiver separation sub-unit 231a, except the first sub-optical signal, to the second optical transmission channel. The second optical transmission channel is used to transmit the other received sub-optical signals to the corresponding second wavelength separation film.

[0268] The second wavelength-dividing film is configured to separate the second optical sub-signal from the other received optical sub-signals and output the second optical sub-signal to a corresponding receiver. The second wavelength-dividing film is further configured to output the other received optical sub-signals, excluding the second optical sub-signal, to a third optical transmission channel. The third optical transmission channel is configured to transmit the other received optical sub-signals to the corresponding third wavelength-dividing film.

[0269] The third wavelength division film is used to separate the third sub-optical signal from the other received sub-optical signals and output the third sub-optical signal to a corresponding receiver. The second wavelength division film is also used to output the other sub-optical signals (i.e., the fourth sub-optical signal) from the other received sub-optical signals except the third sub-optical signal to a fourth optical transmission channel. The fourth optical transmission channel is used to output the fourth sub-optical signal to a corresponding receiver.

[0270] In the embodiment of the present application, no matter how many receivers the transceiver module 220 includes, the first receiver is used to receive the optical signal separated by the wavelength division membrane closest to the transceiver separation sub-unit 231a on the optical path, so as to ensure that the number of optical devices passing through is minimized, thereby reducing the transmission loss of the high-speed signal and improving the signal quality of the high-speed signal.

[0271] For another example, when the transceiver module 220 includes four receivers, Figure 10 The first transmission unit 1031 in the embodiment can be replaced by the following structure. The first transmission unit includes four transmission subunits. The structure of each transmission subunit is the same as Figure 10 The four transmission subunits are respectively a first transmission subunit, a second transmission subunit, a third transmission subunit and a fourth transmission subunit which are sequentially arranged along the light propagation direction from the optical interface to the second transmission unit.

[0272] The input end of the coupler of the first transmission subunit is used to receive an uplink optical signal from the optical interface. The uplink optical signal includes a first sub-optical signal, a second sub-optical signal, a third sub-optical signal, and a fourth sub-optical signal. The wavelengths of the first sub-optical signal, the second sub-optical signal, the third sub-optical signal, and the fourth sub-optical signal are respectively the same as the receiving wavelengths of the four receivers. The first output end of the coupler of the first transmission subunit is connected to the first end of the mode converter of the first transmission subunit, and the coupler of the first transmission subunit is used to output the first sub-optical signal to one of the four receivers through the second output end of the coupler of the first transmission subunit.

[0273] The input end of the coupler of the second transmission subunit is connected to the second end of the mode converter of the first transmission subunit, the first output end of the coupler of the second transmission subunit is connected to the first end of the mode converter of the second transmission subunit, and the coupler of the second transmission subunit is used to output the second sub-optical signal to another receiver among the four receivers through the second output end of the coupler of the second transmission subunit.

[0274] The input end of the coupler of the third transmission subunit is connected to the second end of the mode converter of the second transmission subunit, the first output end of the coupler of the third transmission subunit is connected to the first end of the mode converter of the third transmission subunit, and the coupler of the third transmission subunit is used to output the third sub-optical signal to another receiver among the four receivers through the second output end of the coupler of the third transmission subunit.

[0275] The input end of the coupler of the fourth transmission subunit is connected to the second end of the mode converter of the third transmission subunit, the first output end of the coupler of the fourth transmission subunit is connected to the second transmission unit, and the coupler of the fourth transmission subunit is used to output the fourth sub-optical signal to the last receiver of the four receivers through the second output end of the coupler of the fourth transmission subunit.

[0276] That is, when the transceiver module 220 includes Y receivers and Y is an integer greater than 1, the first transmission unit may include Y transmission subunits located sequentially on the optical path between the optical interface and the second transmission unit, and each transmission subunit includes a mode converter and a coupler. In each transmission subunit, the first output end of the coupler is connected to the first end of the mode converter, and the second output end of the coupler is connected to a receiver, and the coupler is used to transmit the sub-optical signal corresponding to the same transmission subunit to the connected receiver. In the first transmission subunit, the input end of the coupler is used to receive the optical signal from the optical interface. In the transmission subunits other than the first transmission subunit, the input end of the coupler is connected to the second end of the mode converter in the previous transmission subunit. In the last transmission subunit, the second end of the mode converter is connected to the second transmission unit.

[0277] The embodiment of the present application further provides an optical transceiver device, which is an optical module. Figure 19 This is a structural diagram of another optical transceiver provided in an embodiment of the present application. Figure 19 As shown, the optical transceiver device includes an optical transceiver component 191, a PCB 192 and a switching structure 193. The structure of the optical transceiver component 191 can be Figures 1 to 18 The structure of the optical transceiver device shown in FIG. PCB 192 includes a first conductive contact array 192a for electrically connecting to the optical transceiver assembly and a second conductive contact array (not shown) for inserting into the connector slot. The first conductive contact array 192a and the second conductive contact array are arranged at opposite ends of the PCB 192. For example, the first conductive contact array 192a includes a plurality of conductive contacts arranged side by side, and the second conductive contact array also includes a plurality of conductive contacts arranged side by side. Since the second conductive contact array is directly inserted into the connector slot to achieve electrical connection with other devices, it can also be called a gold finger array.

[0278] The distance between the first transmitter 211 and the first conductive contact array 192a is smaller than the distance between any other transmitter except the first transmitter and the first conductive contact array 192a, and is also smaller than the distance between any other receiver except the first receiver and the first conductive contact array 192a. The distance between the first receiver 221 and the first conductive contact array 192a is smaller than the distance between any other transmitter except the first transmitter and the first conductive contact array 192a, and is also smaller than the distance between any other receiver except the first receiver and the first conductive contact array 192a.

[0279] Because the first transmitter 211 and the first receiver 221 are relatively close to the first conductive contact array 192a, they are directly electrically connected to the first conductive contact array 192a in the PCB 192, for example, via wire bonding 194. Direct electrical connection methods include, but are not limited to, wire bonding, conductive adhesive bonding, or eutectic soldering. Because the other transmitters and receivers are farther from the first conductive contact array 192a, they are electrically connected to the first conductive contact array 192a via the adapter structure 193. That is, the second transmitter 212, the third transmitter 213, the second receiver 222, and the third receiver 223 are all electrically connected to the first conductive contact array 192a via the adapter structure 193. Different transmitters are connected to different gold fingers, and different receivers are connected to different gold fingers. The same transmitter can be connected to one or more gold fingers, and the same receiver can be connected to one or more gold fingers. Optionally, the higher the signal rate corresponding to the transmitter, the more golden fingers are connected.

[0280] Because the first transmitter 211 and the first receiver 221 are directly electrically connected to the first conductive contact array 192a in the PCB 192, the transmission loss of the electrical signals corresponding to the first transmitter 211 and the first receiver 221 is relatively low. However, the transmission rate of the first transmitter 211 and the reception rate of the first receiver 221 are relatively high, resulting in a relatively small loss margin, which means that the signal quality requirements are relatively high. Therefore, this connection method is conducive to meeting the signal quality requirements corresponding to the first transmitter 211 and the first receiver 221. Here, the loss margin is smaller when the rate is higher because the production of the detector in the receiver and the laser in the transmitter corresponding to high rates is relatively immature, resulting in a more stringent link insertion loss budget.

[0281] In this embodiment, the transfer structure 193 is a flexible printed circuit (FPC). The FPC includes a first transfer gold finger, a second transfer gold finger, and a connection line connected between the first transfer gold finger and the second transfer gold finger. The second transmitter 212 is directly electrically connected to the first transfer gold finger, and the second transfer gold finger is directly electrically connected to the first conductive contact array 192a in the PCB192, thereby realizing the electrical connection between the second transmitter 212 and the PCB 192 through the FPC. The way in which the third transmitter 213, the second receiver 222, and the third receiver 223 are electrically connected to the PCB 192 through the FPC is the same as that of the second transmitter 223, and will not be repeated here. For example, Figure 19 In the embodiment, the third transmitter and the second transmitter are connected to the PCB 192 via an FPC, and the second receiver and the third receiver are connected to the PCB 192 via an FPC.

[0282] Alternatively, in other embodiments, the transfer structure is a conductive wire, etc. For example, the second transmitter 212 , the third transmitter 213 , the second receiver 222 and the third receiver 223 are respectively connected to corresponding gold fingers on the PCB 192 via a conductive wire.

[0283] The type of the transfer structure can be selected based on factors such as the relative position and distance between the transmitter and the PCB 192, and the embodiment of the present application does not limit this.

[0284] An embodiment of the present application further provides an optical communication device, comprising a single board and at least one optical transceiver connected to the single board, wherein at least one optical module comprises the aforementioned optical transceiver.

[0285] An embodiment of the present application also provides an optical communication system. Figure 20 Schematic diagram of the structure of the optical communication system provided by the embodiment of the present application. Figure 20 As shown, the optical communication system is a PON system, consisting of an optical transmission line (OLT), optical network units (ONUs), and optical network devices (ODNs). The OLT connects to multiple ONUs via the ODN. For upper-layer networks, the OLT provides uplink access to the PON network. For the ONUs, the OLT provides control, management, and ranging functions.

[0286] The multiple ONUs include ONUs that support multiple PON protocols. For example, Figure 20 In the ONU, the multiple ONUs include an ONU supporting the GPON protocol, an ONU supporting the 10G PON protocol (including XG PON and XGS PON), and an ONU supporting the 50G PON protocol.

[0287] Unless otherwise defined, the technical or scientific terms used herein shall have the usual meaning understood by persons of ordinary skill in the field to which this application belongs. The words "first", "second", "third" and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "a" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprising" mean that the elements or objects appearing before "include" or "comprising" cover the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. "A and / or B" means that there are the following three situations: the first, A; the second, B; the third, A and B.

[0288] The above is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An optical transceiver, characterized in that: The optical transceiver device includes: an optical interface, a transceiver module and a transmission module; The transceiver module includes at least two transmitters and at least two receivers, wherein the at least two transmitters are used to transmit optical signals of different wavelengths, and the at least two receivers are used to receive optical signals of different wavelengths; The transmission module is used to transmit the optical signal received by the optical interface to the at least two receivers, and transmit the optical signal sent by the at least two transmitters to the optical interface; In which, the first transmitter among the at least two transmitters and the first receiver among the at least two receivers are located on the first side of the transmission module, the first transmitter is the transmitter with the highest transmission rate among the at least two transmitters, and the first receiver is the receiver with the highest receiving rate among the at least two receivers, and the optical interface is located on the second side of the transmission module, and the first side and the second side are opposite sides of the transmission module.

2. The optical transceiver according to claim 1, wherein: The transmission module further includes a third side and a fourth side, the third side and the fourth side being opposite sides of the transmission module and located between the first side and the second side. The other transmitters of the at least two transmitters except the first transmitter are located on the third side and / or the fourth side; The other receivers of the at least two receivers except the first receiver are located on the third side and / or the fourth side.

3. The optical transceiver according to claim 1, wherein: The at least two transmitters also include a second transmitter and a third transmitter, and the at least two receivers also include a second receiver and a third receiver. The transmission rate of the first transmitter and the receiving rate of the first receiver are specified by the 50G PON protocol, the transmission rate of the second transmitter and the receiving rate of the second receiver are specified by the 10GPON protocol, and the transmission rate of the third transmitter and the receiving rate of the third receiver are specified by the GPON protocol.

4. The optical transceiver according to any one of claims 1 to 3, characterized in that: The optical transceiver device further includes a printed circuit board, the printed circuit board includes a first conductive contact array, the at least two transmitters and the at least two receivers are electrically connected to the first conductive contact array, The distance between the first transmitter and the first conductive contact array is smaller than the distance between any transmitter other than the first transmitter and the first conductive contact array; A distance between the first receiver and the first conductive contact array is smaller than a distance between any receiver other than the first receiver and the first conductive contact array.

5. The optical transceiver according to claim 4, wherein: The first transmitter is connected to the first conductive contact array through wire bonding, eutectic welding or conductive glue; the first receiver is connected to the first conductive contact array through wire bonding, eutectic welding or conductive glue.

6. The optical transceiver according to any one of claims 1 to 5, characterized in that: The transmission module includes an optical waveguide chip, a first transmission unit and a second transmission unit, wherein at least parts of the first transmission unit and the second transmission unit are integrated into the optical waveguide chip; The first transmission unit is used to transmit the optical signal from the optical interface to the at least two receivers according to the wavelength; The second transmission unit is used to transmit the optical signals from the at least two transmitters to the first transmission unit, and the first transmission unit is further used to transmit the optical signal from the second transmission unit to the optical interface.

7. The optical transceiver according to claim 6, wherein: The transceiver module includes three transmitters, the second transmission unit includes a first combiner and a second combiner, and the first combiner and the second combiner are integrated in the optical waveguide chip; The first combiner has a first end, a second end, and a third end. The first end and the second end of the first combiner are respectively used to receive an optical signal transmitted by one of the three transmitters. The first combiner is used to output the optical signal received by the first end of the first combiner and the optical signal received by the second end of the first combiner from the third end of the first combiner. The second combiner has a first end, a second end, and a third end. The first end of the second combiner is used to receive an optical signal transmitted by another transmitter among the three transmitters. The second end of the second combiner is connected to the third end of the first combiner. The second combiner is used to output the optical signal received by the first end of the second combiner and the optical signal received by the second end of the second combiner from the third end of the second combiner.

8. The optical transceiver according to claim 7, wherein: The first end of the second combiner is used to receive the optical signal transmitted by the first transmitter.

9. The optical transceiver according to claim 6, wherein: The transceiver module includes two transmitters, the second transmission unit includes a first combiner, and the first combiner is integrated in the optical waveguide chip; The first combiner has a first end, a second end, and a third end. The first end and the second end of the first combiner are respectively used to receive the optical signals transmitted by the two transmitters. The first combiner is used to output the optical signal received by the first end of the first combiner and the optical signal received by the second end of the first combiner from the third end of the first combiner.

10. The optical transceiver according to claim 7 or 8, characterized in that: The transceiver module includes three receivers, the first transmission unit includes a transceiver splitter unit and a wave combiner / demultiplexer unit, a portion of the first transmission unit is integrated into the optical waveguide chip, and another portion of the first transmission unit is outside the optical waveguide chip; The transceiver splitter subunit is used to transmit the optical signal from the optical interface to the wavelength combination / demultiplexer subunit, and the wavelength combination / demultiplexer subunit is used to transmit the received optical signal to the three receivers according to the wavelength; The transceiver separation subunit is further configured to transmit the optical signal from the second transmission unit to the optical interface.

11. The optical transceiver according to claim 10, wherein: The wave combiner / demultiplexer unit includes two wavelength division films and three optical transmission channels, wherein the two wavelength division films are attached to the side walls of the optical waveguide chip, and the three optical transmission channels are located in the optical waveguide chip; The two wavelength division films include a first wavelength division film and a second wavelength division film, and the three optical transmission channels include a first optical transmission channel, a second optical transmission channel and a third optical transmission channel. The first optical transmission channel is used to transmit the optical signal output by the transceiver separation sub-unit to the first wavelength division membrane, the optical signal output by the transceiver separation sub-unit includes a first sub-optical signal, a second sub-optical signal and a third sub-optical signal, and the wavelengths of the first sub-optical signal, the second sub-optical signal and the third sub-optical signal are respectively the same as the receiving wavelengths of the three receivers; The first wavelength division film is used to separate the first sub-optical signal from the optical signal output by the transceiver separation sub-unit, and output the other sub-optical signals except the first sub-optical signal in the optical signal output by the transceiver separation sub-unit to the second optical transmission channel; The second optical transmission channel is used to transmit the other sub-optical signals output by the first wavelength division film to the second wavelength division film; The second wavelength separation film is used to separate the second sub-optical signal from the other sub-optical signals, and transmit the third sub-optical signal to a third optical transmission channel; The third optical transmission channel is used to output the third sub-optical signal.

12. The optical transceiver according to claim 11, wherein: The wavelength of the first sub-optical signal is the same as a receiving wavelength of the first receiver.

13. The optical transceiver according to any one of claims 10 to 12, characterized in that: The optical waveguide chip has a receiving groove therein, and the transmitting and receiving separation sub-unit includes a thin film filter, and the thin film filter is located in the receiving groove.

14. The optical transceiver according to any one of claims 10 to 12, characterized in that: The transmit-receive separation subunit is located on one side of the optical waveguide chip, and the transmit-receive separation subunit includes a thin film filter, a transmit collimator and a receive collimator. The receive collimator is located between the thin film filter and the combiner / demultiplexer subunit, and the transmit collimator is located between the thin film filter and the second transmission unit.

15. The optical transceiver according to any one of claims 10 to 12, characterized in that: The transmitting and receiving separation sub-unit is integrated in the optical waveguide chip, and the transmitting and receiving separation sub-unit includes a mode converter and a coupler. The first end of the mode converter is used to receive the optical signal from the optical interface, the second end of the mode converter is connected to the input end of the coupler, the first output end of the coupler is connected to the output end of the second transmission unit, and the second output end of the coupler is connected to the input end of the multiplexing / demultiplexing sub-unit.

16. The optical transceiver according to claim 7 or 8, characterized in that: The transceiver module includes three receivers, the first transmission unit is integrated in the optical waveguide chip, the first transmission unit includes three transmission sub-units sequentially located on the optical path between the optical interface and the second transmission unit, and each of the three transmission sub-units includes a mode converter and a coupler; The three transmission subunits are respectively a first transmission subunit, a second transmission subunit, and a third transmission subunit; the input end of the coupler of the first transmission subunit is used to receive an uplink optical signal from the optical interface, the uplink optical signal includes a first sub-optical signal, a second sub-optical signal, and a third sub-optical signal; the wavelengths of the first sub-optical signal, the second sub-optical signal, and the third sub-optical signal are respectively the same as the receiving wavelengths of the three receivers; the first output end of the coupler of the first transmission subunit is connected to the first end of the mode converter of the first transmission subunit; the coupler of the first transmission subunit is used to output the first sub-optical signal to one of the three receivers through the second output end of the coupler of the first transmission subunit; an input end of the coupler of the second transmission subunit connected to the second end of the mode converter of the first transmission subunit, a first output end of the coupler of the second transmission subunit connected to the first end of the mode converter of the second transmission subunit, and the coupler of the second transmission subunit configured to output the second sub-optical signal to another receiver among the three receivers through the second output end of the coupler of the second transmission subunit; The input end of the coupler of the third transmission subunit is connected to the second end of the mode converter of the second transmission subunit, the first output end of the coupler of the third transmission subunit is connected to the second transmission unit, and the coupler of the third transmission subunit is used to output the third sub-optical signal to another receiver among the three receivers through the second output end of the coupler of the third transmission subunit.

17. The optical transceiver according to claim 9, wherein: The transceiver module includes two receivers, the first transmission unit is integrated in the optical waveguide chip, the first transmission unit includes two transmission sub-units sequentially located on the optical path between the optical interface and the second transmission unit, and each of the two transmission sub-units includes a mode converter and a coupler; The two transmission subunits are respectively a first transmission subunit and a second transmission subunit, the input end of the coupler of the first transmission subunit is used to receive an uplink optical signal from the optical interface, the uplink optical signal includes a first sub-optical signal and a second sub-optical signal, the first sub-optical signal and the second sub-optical signal are respectively the same as the receiving wavelengths of the two receivers, the first output end of the coupler of the first transmission subunit is connected to the first end of the mode converter of the first transmission subunit, and the coupler of the first transmission subunit is used to output the first sub-optical signal to one of the two receivers through the second output end of the coupler of the first transmission subunit; The input end of the coupler of the second transmission subunit is connected to the second end of the mode converter of the first transmission subunit, the first output end of the coupler of the second transmission subunit is connected to the first end of the mode converter of the second transmission subunit, and the coupler of the second transmission subunit is used to output the second sub-optical signal to the other of the two receivers through the second output end of the coupler of the second transmission subunit.

18. The optical transceiver according to any one of claims 6 to 8, characterized in that: The first transmission unit is located outside the optical waveguide chip, and the first transmission unit includes: a splitter device group and a reflector device group, the splitter device group is used to separate the optical signal from the optical interface according to the wavelengths corresponding to the at least two receivers, and the reflector device group is used to transmit the optical signal separated by the splitter device group to the receivers corresponding to the respective wavelengths. The splitter device group is also used to combine the optical signals from the at least two transmitters and transmit the combined optical signal to the optical interface.

19. The optical transceiver according to any one of claims 6 to 18, characterized in that: The optical waveguide chip includes a first sub-chip and a second sub-chip using different material platforms. The second transmission unit is integrated into the first sub-chip; A portion of the first transmission unit is integrated into the second sub-chip, and another portion of the first transmission unit is located outside the optical waveguide chip; or, the first transmission unit is integrated into the second sub-chip.

20. The optical transceiver according to claim 19, wherein: The first sub-chip and the second sub-chip are spaced apart from each other, and the first sub-chip and the second sub-chip are coupled by spatial optical alignment technology; Alternatively, the first sub-chip is connected to the surface of the second sub-chip, and the first sub-chip and the second sub-chip are coupled by an evanescent wave coupling technology.

21. An optical communication device, characterized in that: The optical communication device includes a single board and at least one optical module, wherein the at least one optical module is connected to the single board, and at least one of the at least one optical module is the optical module according to any one of claims 1 to 20.

22. An optical communication system, characterized in that: The optical communication system includes an optical line terminal OLT, an optical distribution network ODN and multiple optical network units ONU. The OLT is connected to the multiple ONUs through the ODN. The OLT is the optical communication device according to claim 21.

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