Wafer level MEMS scanning mirror testing device

Abstract

This application discloses a wafer-level MEMS scanning mirror testing device, comprising: a testing stage for placing a scanning mirror to be tested; a probe card assembly connected to a signal output device and electrically connected to the scanning mirror to be tested; a first clamping assembly adjustablely disposed on the testing stage for clamping and fixing a light source assembly, the light source assembly being used to emit a light beam to the scanning mirror to be tested; a second clamping assembly adjustablely disposed on the testing stage for clamping and fixing the probe card assembly; and a third clamping assembly adjustablely disposed on the testing stage for clamping and fixing a two-dimensional PSD, the two-dimensional PSD being used to acquire the light beam scanning trajectory formed by the scanning mirror to be tested. Therefore, the electrical signal can be transmitted to the scanning mirror under test through the probe card component to drive the scanning mirror under test. This can meet the testing requirements of bare dies of individual MEMS scanning mirrors that are not packaged after wafer dicing, and can also meet the testing requirements of MEMS scanning mirrors in the whole wafer. This makes the wafer-level MEMS scanning mirror testing device have good versatility, high testing accuracy and the ability to realize automated testing, which helps to improve testing efficiency and reduce testing costs.

Description

Technical Field

[0001] This application relates to the field of micro-motor systems technology, and in particular to a wafer-level MEMS scanning mirror testing device. Background Technology

[0002] Currently, testing MEMS scanning mirrors requires bonding them to a PCB (Printed Circuit Board) and driving the mirror to deflect by applying voltage to the PCB. Since the testing process must be performed after the MEMS scanning mirror is packaged, the packaging requirements are high, thus increasing the complexity of both packaging and testing.

[0003] In related technologies, the testing platform cannot meet the testing requirements of MEMS scanning mirrors and has at least the following drawbacks: low measurement accuracy, unsuitable for mass testing on production lines, slow measurement speed, low testing efficiency, and impact on production efficiency. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, one objective of this application is to provide a wafer-level MEMS scanning mirror testing device, which can be used for precise testing of MEMS scanning mirrors and helps to improve the testing efficiency and accuracy of MEMS scanning mirror testing.

[0005] A wafer-level MEMS scanning mirror testing device according to an embodiment of this application includes: a testing stage for placing a scanning mirror to be tested; a probe card assembly connected to a signal output device and electrically connected to the scanning mirror to be tested; a first clamping assembly adjustablely disposed on the testing stage for clamping and fixing a light source assembly, wherein the light source assembly emits a light beam toward the scanning mirror to be tested; a second clamping assembly adjustablely disposed on the testing stage for clamping and fixing the probe card assembly; and a third clamping assembly adjustablely disposed on the testing stage for clamping and fixing a two-dimensional PSD, wherein the two-dimensional PSD is used to acquire the light beam scanning trajectory formed by the scanning mirror to be tested.

[0006] According to the wafer-level MEMS scanning mirror testing device of the present application embodiment, during the testing of MEMS scanning mirrors, the probe card assembly is connected and cooperated with the scanning mirror under test to realize voltage drive at the scanning mirror under test, which can improve the versatility of the wafer-level MEMS scanning mirror testing device. The probe card assembly with a corresponding pin row structure can be set on the second clamping assembly according to the scanning mirror under test, so as to meet the testing requirements of bare dies of a single MEMS scanning mirror that has not been packaged after wafer dicing, and also meet the testing requirements of MEMS scanning mirrors in the whole wafer.

[0007] According to some embodiments of this application, the testing station includes: a seat body, a tray assembly provided in the middle region of the seat body, and the tray assembly for accommodating the scanning mirror to be tested; a first mounting seat and a second mounting seat, the first mounting seat and the second mounting seat being respectively disposed on both sides of the tray assembly in a first direction, the first mounting seat being used to mount the first clamping assembly, and the second mounting seat being used to mount the second clamping assembly.

[0008] According to some embodiments of this application, the position of the first clamping component relative to the first mounting base is adjustable in the first direction, the second direction, and the third upward position; the second clamping component is adjustable in the first direction, the second direction, and the third upward position relative to the second mounting base; the third clamping component is adjustable in the first direction, the second direction, and the third upward position relative to the second mounting base; wherein the first direction, the second direction, and the third direction are mutually perpendicular.

[0009] According to some embodiments of this application, the second clamping assembly further includes: a main body portion, which is connected and cooperates with the second mounting base; and a clamping portion, which is used to clamp and cooperate with the probe card assembly and is rotatably mounted on the main body portion about a first axis, wherein the first axis is arranged parallel to the second direction.

[0010] According to some embodiments of this application, the mounting surface height of the first mounting base is not lower than that of the tray assembly; and / or, the mounting surface height of the second mounting base is not lower than that of the tray assembly.

[0011] According to some embodiments of this application, the tray assembly includes: an adjustment seat, the adjustment seat being adjustablely disposed on the seat body; and a tray, the tray being disposed on the adjustment seat and moving synchronously with the adjustment seat relative to the seat body, the tray forming an upwardly open receiving space, and the scanning mirror to be detected being disposed within the receiving space.

[0012] According to some embodiments of this application, the probe card assembly includes: a probe card body, which is used for electrical connection with the scanning mirror to be tested and for clamping and engaging with the second clamping assembly; and an electrical connector, which is connected to the probe card body and is used for electrical connection with the signal output device.

[0013] According to some embodiments of this application, the signal output device includes: a signal source, which is connected and cooperates with the electrical connector and is used to transmit an electrical signal to one side of the electrical connector; and a signal amplifier, which is connected to the signal source and is used to adjust the voltage signal output to the side of the scanning mirror to be tested.

[0014] According to some embodiments of this application, a microscope is also included, which is disposed above the detection stage and used to observe the scanning mirror to be detected.

[0015] According to some embodiments of this application, the wafer-level MEMS scanning mirror testing device further includes: an image acquisition unit disposed on the microscope and used to acquire image information at the scanning mirror to be tested; and an image display unit disposed on the testing stage and electrically connected to the image acquisition unit, used to display images.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of a wafer-level MEMS scanning mirror testing device according to an embodiment of this application;

[0019] Figure 2 This is a front view of a wafer-level MEMS scanning mirror testing apparatus according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the structure of the first clamping assembly according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the structure of the second clamping assembly according to an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of the third clamping assembly according to an embodiment of this application;

[0023] Figure 6 This is a schematic diagram illustrating the cooperation between the second clamping component and the probe card component according to an embodiment of this application;

[0024] Figure 7 This is a test flowchart of a wafer-level MEMS scanning mirror test apparatus according to an embodiment of this application.

[0025] Figure label:

[0026] Wafer-level MEMS scanning mirror testing device 100;

[0027] Testing table 1; main body 11; first mounting base 12; second mounting base 13;

[0028] Probe card assembly 2; Probe card body 21; Electrical connector 22;

[0029] First clamping assembly 31; second clamping assembly 32; main body 321; clamping part 322; third clamping assembly 33;

[0030] Two-dimensional PSD4; light source assembly 5; tray assembly 6; adjustment seat 61; tray 62; microscope 71; image display unit 72. Detailed Implementation

[0031] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0032] The following is for reference. Figures 1-7 This application describes a wafer-level MEMS (Micro-Electro-Mechanical System) scanning mirror testing apparatus according to an embodiment of the present application. The wafer-level MEMS scanning mirror testing apparatus is used to test MEMS scanning mirrors.

[0033] Currently, testing MEMS scanning mirrors requires bonding them to a PCB (Printed Circuit Board) and driving the mirror to deflect by applying voltage to the PCB. The testing process must be performed after the MEMS scanning mirror is packaged, resulting in high packaging requirements and increasing the complexity of both packaging and testing. Furthermore, existing testing platforms cannot meet the testing needs of MEMS scanning mirrors and suffer from at least the following drawbacks: low measurement accuracy, unsuitability for mass production testing, slow measurement speed, and low testing efficiency, impacting production efficiency.

[0034] According to an embodiment of this application, a wafer-level MEMS scanning mirror testing device 100 includes a testing stage 1, a probe card assembly 2, a first clamping assembly 31, a second clamping assembly 32, and a third clamping assembly 33, for testing a MEMS scanning mirror, wherein the MEMS scanning mirror is the "scanning mirror to be tested" in this application.

[0035] The testing station 1 is used to place the scanning mirror to be tested, providing space for its arrangement, thereby enabling testing of the MEMS scanning mirror at a specific workstation. Simultaneously, the testing station 1 is constructed as a mounting carrier for the first clamping assembly 31, the second clamping assembly 32, and the third clamping assembly 33, constraining them within a certain range.

[0036] Specifically, the first clamping component 31 is adjustablely positioned on the detection stage 1 and is used to clamp and fix the light source component 5. The light source component 5 is used to emit a light beam towards the side of the scanning mirror to be tested, so that the light can be directed onto the surface of the scanning mirror to be tested (i.e., the MEMS scanning mirror). The second clamping component 32 is adjustablely positioned on the detection stage 1 and is used to clamp and fix the probe card component 2, so as to adjust the probe card component 2 to a position suitable for matching the scanning mirror to be tested, thereby facilitating the electrical connection between the probe card component 2 and the scanning mirror to be tested. The third clamping component 33 is adjustablely positioned on the detection stage 1 and is used to clamp and fix the two-dimensional PSD4 (PositionSensitiveDetector). The two-dimensional PSD4 is used to acquire the light beam scanning trajectory formed by the scanning mirror to be tested.

[0037] Understandably, the 2D PSD4 is an optical sensor that can be used to detect moving light spots and can use the bipolar voltage signal output by the current to reflect the position of the light spot's centroid.

[0038] The scanning mirror under test can reflect light so that the light can be directed perpendicularly onto the two-dimensional PSD4 surface, thereby achieving precise alignment of the optical path, which helps to improve testing accuracy, and can detect changes in the optical path through the two-dimensional PSD4.

[0039] Furthermore, the probe card assembly 2 can be connected to the signal output device, and the probe card assembly 2 is electrically connected to the scanning mirror under test. The signal output device can output an electrical signal to the side of the scanning mirror under test through the probe card assembly 2 to drive the scanning mirror under test, thereby driving the mirror surface of the MEMS scanning mirror to deflect, and can reflect the input light of the light source assembly 5 at a continuously changing deflection angle.

[0040] In this application, the first clamping component 31 clamps and fixes the light source component 5, thereby adjusting the position of the light source component 5 relative to the detection stage 1 by adjusting the first clamping component 31, so as to place the incident light mask of the light source component 5 at the scanning mirror to be tested; the second clamping component 32 clamps and fixes the probe card component 2, and adjusting the second clamping component 32 can adjust the arrangement position of the probe card component 2, so as to connect and cooperate with the scanning mirror to be tested, so that the probe component can be aligned with the electrode point on the MEMS scanning mirror; the third clamping component clamps and fixes the two-dimensional PSD4, so as to record the beam scanning trajectory of the MEMS scanning mirror during the test by the two-dimensional PSD4, so as to obtain the index of the MEMS scanning mirror by subsequent data processing and calculation based on the host computer, and realize the accurate testing of the MEMS scanning mirror.

[0041] It is understood that when a MEMS scanning mirror is tested using the wafer-level MEMS scanning mirror testing device 100 of this application embodiment, the position of the device (such as: light source component 5, probe card component 2, two-dimensional PSD4, etc.) relative to the testing stage 1 can be adjusted by the first clamping component 31, the second clamping component 32 and the third clamping component 33, so as to test the MEMS scanning mirror within the testing range formed by the testing stage 1. This helps to achieve accurate measurement of the MEMS scanning mirror and can meet the testing requirements of the bare die of the MEMS scanning mirror and the MEMS scanning mirror in the whole wafer.

[0042] The probe card assembly 2 can be clamped and fixed by the second clamping assembly 32, and the second clamping assembly 32 can also be used to adjust the position of the probe card assembly 2 relative to the detection stage 1. This allows the probe card assembly 2 to be better adjusted to match the scanning mirror under test, which helps to achieve accurate measurement of the MEMS scanning mirror. At the same time, the probe card assembly 2 can also be adaptively adjusted according to changes in the scanning mirror under test, so that the probe card assembly 2 can match the scanning mirror under test.

[0043] It should be noted that when testing MEMS scanning mirrors with different structures, the probe card assembly 2 clamped in the second clamping assembly 32 can be replaced to form a probe card assembly 2 with a corresponding probe arrangement that matches the MEMS scanning mirror. This allows voltage to be applied to one side of the MEMS scanning mirror through the probe card assembly 2 during testing, enabling wafer-level testing of the MEMS scanning mirror. Specifically, when the voltage output by the signal output device changes, the MEMS scanning mirror can be driven, thereby causing the mirror surface of the MEMS scanning mirror to deflect, resulting in a continuously varying deflection angle of the incident light from the light source assembly 5.

[0044] Meanwhile, the wafer-level MEMS scanning mirror testing device 100 in this application can calculate the specifications of the MEMS scanning mirror (such as resonant frequency and scanning angle) by cooperating with a host computer using data acquired from a two-dimensional PSD4, enabling automated testing after coordination with the host computer. Therefore, compared with existing testing equipment, the wafer-level MEMS scanning mirror testing device 100 in this application has advantages such as high measurement accuracy, suitability for mass production line testing, fast measurement speed, and high testing efficiency.

[0045] In some embodiments of this application, the light source component 5 is configured as a laser, which can emit laser light to meet the light incident requirements of the MEMS scanning mirror.

[0046] Combination Figure 1 and Figure 2 As shown, in some embodiments of this application, the testing station 1 includes: a seat body 11, a first mounting base 12 and a second mounting base 13. The middle area of ​​the seat body 11 is provided with a tray assembly 6, and the tray assembly 6 is used to accommodate the scanning mirror to be tested, so as to provide accommodating space for the scanning mirror to be tested through the tray assembly 6, which facilitates the constraint and adjustment of the arrangement position of the MEMS scanning mirror during the testing process.

[0047] Reference Figure 2 As shown, the first mounting base 12 and the second mounting base 13 are respectively disposed on both sides of the tray assembly 6 in the first direction, thereby facilitating the arrangement of the devices during the test and preventing interference between the devices.

[0048] Specifically, the first mounting base 12 is used to mount the first clamping assembly 31, and the second mounting base 13 is used to mount the second clamping assembly 32. The first clamping assembly 31 clamps the light source assembly 5, allowing the light source assembly 5 to emit a light beam from the first side of the tray assembly 6 in the first direction toward the scanning mirror under test. The second clamping assembly 32 clamps the probe card assembly 2, allowing the probe card assembly 2 to extend from the second side of the tray assembly 6 in the first direction toward the scanning mirror under test, and aligning the probe card assembly 2 with the scanning mirror under test. This effectively prevents interference between the probe card assembly 2 and the light beam from the light source assembly 5, ensuring the effective beam direction of the MEMS scanning mirror. The third clamping assembly 33 clamps the two-dimensional PSD4, which is suitable for placement on the path after the light beam is reflected by the MEMS. Extending the two-dimensional PSD4 from the second side of the first direction toward the scanning mirror under test avoids interference between the two-dimensional PSD4 and the optical path, and facilitates precise alignment of the two-dimensional PSD4 with the optical path. Therefore, the detector card assembly and the two-dimensional PSD4 can be arranged in an area suitable for avoiding the incident light emitted by the light source assembly 5, which helps to reduce the position adjustment time required for the clamping assembly during the test and helps to improve test efficiency while ensuring test accuracy.

[0049] Reference Figure 1 As shown, in the second mounting base 13, the second clamping assembly 32 and the third clamping assembly 33 are arranged at intervals along the second direction, thereby preventing interference between the second clamping assembly 32 and the third clamping assembly 33. The second clamping assembly 32 is arranged corresponding to the first clamping assembly 31 in the first direction to facilitate the alignment of the light source assembly 5 with the two-dimensional PSD4.

[0050] Combination Figure 1 and Figure 2 As shown, in some embodiments of this application, the position of the first clamping component 31 relative to the first mounting base 12 is adjustable in the first direction, the second direction, and the third direction upward; the position of the second clamping component 32 relative to the second mounting base 13 is adjustable in the first direction, the second direction, and the third direction upward; and the position of the third clamping component 33 relative to the second mounting base 13 is adjustable in the first direction, the second direction, and the third direction upward.

[0051] This allows each clamping component (i.e., the first clamping component 31, the second clamping component 32, and the third clamping component 33 mentioned above) to be adjusted in three directions (i.e., the first direction, the second direction, and the third direction) relative to the detection stage 1. The position adjustment is flexible and can better match the devices. For example, the probe card component 2 can be aligned with the scanning mirror under test to ensure the reliability of the electrical connection between the probe card component 2 and the scanning mirror under test; the light source component 5 can be aligned with the scanning mirror under test to ensure the incident effect of the light beam on the side of the scanning mirror under test; and the two-dimensional PSD4 can be aligned with the scanning mirror under test to ensure the effect of the two-dimensional PSD4 in recording the scanning trajectory of the light beam.

[0052] It should be noted that in the field of clamp position adjustment technology, the position adjustment method of the clamp relative to the base (such as the base body 11 in the embodiment of this application) is well known to those skilled in the art, and no specific limitation is made here on the specific structure and installation method of the clamping component in this application.

[0053] The first direction, the second direction, and the third direction are set perpendicular to each other, which makes the position adjustment of the clamping component relative to the detection stage 1 flexible, so as to ensure the adjustment range of the position of the clamping component relative to the detection stage 1, thereby facilitating the adjustment of the position of the device fixed on the clamping component.

[0054] like Figure 4 As shown, in some embodiments of this application, the second clamping assembly 32 further includes a main body portion 321 and a clamping portion 322.

[0055] The main body 321 is connected and cooperates with the second mounting base 13, and the clamping part 322 is used to clamp and cooperate with the probe card assembly 2 to clamp and fix the probe card assembly 2. The clamping part 322 is rotatably mounted on the main body 321 around the first axis, and the first axis is arranged parallel to the second direction.

[0056] It is understood that the clamping part 322 is used to clamp and fix the probe card assembly 2. By rotating and adjusting the clamping part 322 relative to the main body part 321, the deflection angle of the probe card assembly 2 relative to the scanning mirror to be tested can be adjusted so as to adjust the probe card assembly 2 to a position suitable for matching the scanning mirror to be tested, thereby ensuring the reliability of the connection between the probe card assembly 2 and the scanning mirror to be tested.

[0057] Further integration Figure 1 As shown, the main body 321 of the second clamping assembly 32 is located in the front region of the tray assembly 6 in the second direction, so that the clamping part 322 can extend from front to back in the second direction to the upper region of the scanning mirror to be tested. By driving the clamping part 322 to rotate relative to the main body 321 around the second axis, the probe card assembly 2 can be swung, thereby facilitating the adjustment of the probe card to an angle position that matches the scanning mirror to be tested.

[0058] It should be noted that the clamping part 322 is mounted on the main body 321, and the position of the main body 321 relative to the second mounting base 13 is adjustable. That is, by adjusting the main body 321, the clamping part 322 can be moved synchronously relative to the second mounting base 13, so as to realize the position adjustment of the clamping part 322 in three directions (i.e. the first direction, the second direction and the third direction mentioned above). This allows the probe card assembly 2 to have multiple position adjustment methods, thereby enabling more precise matching between the probe card assembly 2 and the scanning mirror under test, which helps to improve the testing accuracy of the scanning mirror under test.

[0059] like Figure 2 As shown, in some embodiments of this application, the mounting surface of the first mounting base 12 is not lower than the height of the tray assembly 6, so as to arrange the first clamping assembly 31 in the upper area of ​​the tray assembly 6, so that the light source assembly 5 can emit light from the open area above to the tray assembly 6 where the scanning mirror to be tested is arranged.

[0060] like Figure 2 As shown, in some embodiments of this application, the mounting surface of the second mounting base 13 is not lower than that of the tray assembly 6, so as to arrange the second clamping assembly 32 and the third clamping assembly 33 in the upper region of the tray assembly 6, so that the probe card assembly 2 can be adjusted from the upper region of the tray assembly 6 to a position matching the scanning mirror to be tested, and the two-dimensional PSD4 is arranged in the upper region of the tray assembly 6 at a position suitable for receiving the reflected beam of the scanning mirror to be tested.

[0061] like Figure 2 As shown, in some embodiments of this application, the tray assembly 6 includes an adjustment seat 61 and a tray 62. The adjustment seat 61 is positionably disposed on the seat body 11, and the tray 62 is disposed on the adjustment seat 61. The tray 62 can move synchronously with the adjustment seat 61 relative to the seat body 11 to achieve position adjustment of the tray 62. At the same time, the tray 62 forms an upwardly open receiving space, in which the scanning mirror to be inspected can be arranged.

[0062] It is understood that the tray 62 serves as a container for the scanning mirror under test. The scanning mirror can be placed in the tray 62 for testing. The tray 62 is installed and cooperates with the adjustment seat 61. The adjustment seat 61 can drive the tray 62 to move synchronously relative to the seat body 11, thereby adjusting the position of the tray 62. Thus, the testing position of the scanning mirror under test in the wafer-level MEMS scanning mirror testing device 100 can be set, so as to adjust the scanning mirror under test to a suitable area for matching with the light source assembly 5 and the probe card assembly 2.

[0063] It should be noted that during the testing process, the scanning mirror to be tested needs to be placed in the tray 62 to provide accommodating space for the scanning mirror. The scanning mirror to be tested can be constructed as a bare die of a single MEMS scanning mirror after wafer dicing and without packaging, or it can be constructed as a MEMS scanning mirror within an entire wafer. In other words, the dimensions of the scanning mirrors to be tested can vary considerably. By adjusting the position of the tray 62 relative to the main body 11 using the adjusting seat 61, the testing area of ​​the scanning mirror can be adjusted to a suitable range for matching with the probe card assembly 2. This allows for further adjustment of the position of the probe card assembly 2 to ensure that it can be matched with the scanning mirror to be tested.

[0064] Furthermore, the adjustment seat 61 can be adjusted relative to the seat body 11 along the first direction, the second direction, and the third direction, so that the tray 62 can be adjusted in multiple directions by the adjustment seat 61, so as to adjust the scanning mirror to be tested to a suitable area for matching with the probe card assembly 2.

[0065] like Figure 6As shown, in some embodiments of this application, the probe card assembly 2 includes a probe card body 21 and an electrical connector 22. The probe card body 21 is used for electrical connection with the scanning mirror to be tested, and the probe card body 21 is used for clamping and cooperating with the second clamping assembly 32 to clamp and fix the probe card body 21, and the second clamping assembly 32 drives the probe card body 21 to achieve position adjustment. The electrical connector 22 is connected to the probe card body 21 and is used for electrical connection with a signal output device to transmit electrical signals to the probe card body 21.

[0066] Furthermore, the electrical connector 22 can be configured as a probe card connection cable to realize the electrical connection between the signal output device and the probe card body 21 through the probe card connection cable. The connection method is simple and easy to operate.

[0067] The probe card body 21 is used to make contact with the electrode points of the MEMS scanning mirror, and the electrical signal can be transmitted from the signal output device to the probe card body 21 through the electrical connector 22, so that the electrical signal can be further transmitted to the MEMS scanning mirror through the probe card body 21 to realize beam scanning.

[0068] Therefore, the electrical signal can be transmitted to the scanning mirror under test through the probe card component 2, and the bare die of the MEMS scanning mirror can be tested, improving the versatility of the wafer-level MEMS scanning mirror test device 100. The probe card body 21 with corresponding pin arrangement can be set according to the arrangement of electrode points on the MEMS scanning mirror to meet the testing needs of various types of MEMS scanning mirrors.

[0069] In a further embodiment of this application, the signal output device includes a signal source and a signal amplifier.

[0070] The signal source is connected to the electrical connector 22, and the signal source is used to transmit an electrical signal to one side of the electrical connector 22. The signal amplifier is connected to the signal source, and the signal amplifier is used to adjust the voltage signal output to the side of the scanning mirror to be tested.

[0071] Specifically, the signal source can be constructed as a function signal generator, and the signal amplifier can be constructed as a high-voltage amplifier, so that the signal source and the signal amplifier work together to output multiple electrical signals, thereby applying multiple voltages to one side of the MEMS scanning mirror, thereby driving the MEMS scanning mirror to deflect.

[0072] It is understood that the signal output device in the embodiments of this application can change the amplification factor of the voltage amplifier to make the output voltage the driving voltage of the scanning mirror under test (i.e., MEMS scanning mirror), thereby realizing the driving of the scanning mirror under test under the driving voltage.

[0073] It should be noted that the specific testing steps and calculation methods for MEMS scanning mirrors based on two-dimensional PSD4 are well known to those skilled in the art, and are not specifically limited here. This application only needs to be able to achieve data acquisition during the testing process based on two-dimensional PSD4.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments of this application, the wafer-level MEMS scanning mirror testing device 100 further includes a microscope 71. The microscope 71 is disposed in the area above the testing stage 1, and the microscope 71 can be used to observe one side of the scanning mirror to be tested, so that the tester can observe the MEMS scanning mirror from top to bottom through the microscope 71, so that the tester can grasp the status of the MEMS scanning mirror (e.g., deflection) in a timely manner.

[0075] like Figure 1 and Figure 2 As shown, in some embodiments of this application, the wafer-level MEMS scanning mirror testing device 100 further includes an image acquisition unit (not shown) and an image display unit 72. The image acquisition unit is disposed on the microscope 71 and is used to acquire image information at the scanning mirror to be tested. The image display unit 72 is disposed on the testing stage 1 and is electrically connected to the image acquisition unit so as to display the image through the image display unit 72, so that the tester can intuitively observe the state of one side of the scanning mirror to be tested through the image display unit 72.

[0076] The image acquisition unit can be configured as a camera to realize the image acquisition function of the image acquisition unit, and the image display unit 72 can be configured as a display screen to realize the image display function of the image display unit 72.

[0077] Reference Figures 1-7 The testing process of the wafer-level MEMS scanning mirror testing apparatus 100 according to an embodiment of this application is described as follows:

[0078] The wafer-level MEMS scanning mirror testing device 100 can be connected to external devices such as a host computer.

[0079] First, the position of the tray assembly 6 can be adjusted by adjusting the adjusting seat 61 to drive the tray 62 to move, and the tray assembly 6 can carry the scanning mirror to be tested so as to arrange the scanning mirror to be tested in a suitable testing area.

[0080] Next, the devices are clamped onto the corresponding clamping components, and the positions of the clamping components (i.e., the first clamping component 31, the second clamping component 32 and the third clamping component 33) are further adjusted to arrange the devices in a position suitable for cooperating with the scanning mirror to be tested. At this time, the probe card body 21 can be aligned with the electrode point of the scanning mirror to be tested.

[0081] Furthermore, an electrical signal is output to the probe card assembly 2 via the signal output device. The electrical signal can be transmitted to the MEMS scanning mirror via the probe card assembly 2 to apply a driving signal to the MEMS scanning mirror, thereby causing the MEMS scanning mirror to deflect.

[0082] Finally, the beam scanning trajectory of the MEMS scanning mirror is recorded using a two-dimensional PSD4, and the data is sampled by an external information acquisition module (such as a data acquisition card, ADC (analog-to-digital converter)) connected to the wafer-level MEMS scanning mirror test device 100, and the data is sent to the host computer for data processing.

[0083] Therefore, based on the scanning mirror test method of 2D PSD4, it is possible to record the moving distance of the light spot after reflection by the MEMS scanning mirror, the distance between the 2D PSD4 and the MEMS scanning mirror, etc., and further calculate the indicators of the MEMS scanning mirror (such as the resonant frequency index and scanning angle index of the MEMS scanning mirror) according to the trigonometric function relationship, so as to realize the test of the MEMS scanning mirror.

[0084] It should be noted that the wafer-level MEMS scanning mirror testing device 100 of this application embodiment can realize the resonant frequency test and deflection angle test of the MEMS scanning mirror.

[0085] In the resonant frequency test, firstly, the wafer-level MEMS scanning mirror test device in this application embodiment is used to "adjust the optical path", which specifically includes the following: by adjusting the first clamping component, the second clamping component and the detection stage, the light source component 5 emits a laser to the scanning mirror to be tested, and the outgoing beam of the scanning mirror to be tested is set perpendicular to the two-dimensional PSD (e.g., the receiving surface of the two-dimensional PSD), and the distance between the scanning mirror to be tested and the two-dimensional PSD is further recorded.

[0086] Furthermore, during the testing process, it is necessary to "determine the scanning frequency", which specifically includes: determining the sweep frequency range of the two-axis drive signals of the scanning mirror under test, further determining the sweep frequency interval of the drive signals, adjusting the drive voltage, and changing the frequency of the drive signals applied to the MEMS scanning mirror (i.e., the scanning mirror under test).

[0087] After the above "determine the scanning frequency" step is completed, data processing can be performed by the host computer, specifically including: recording the two-dimensional PSD output signal, converting the two-dimensional PSD output signal into line segment length, and determining the driving frequency corresponding to the longest length.

[0088] After the above "data processing" step is completed, it is determined whether the driving frequency meets the accuracy requirements. If the driving frequency meets the accuracy requirements, it is determined as the resonant frequency of the MEMS scanning mirror, and the test is completed. If the driving frequency does not meet the accuracy requirements, the above "determine scanning frequency" step is executed again to reapply the signal to the scanning mirror under test and perform data processing again until a driving frequency that meets the accuracy requirements is obtained. In this way, the resonant frequency test of the MEMS scanning mirror is achieved.

[0089] During the deflection angle test, firstly, the initial and final values ​​of the applied voltage are set, and the voltage step interval is set. The voltage is then applied to the MEMS scanning mirror. The two-dimensional PSD output signal is recorded by the host computer and converted into distance information. At the same time, the distance between the two-dimensional PSD and the scanning mirror is recorded so that the deflection angle of the MEMS scanning mirror can be calculated by the host computer, thus realizing the deflection angle test of the MEMS scanning mirror.

[0090] In summary, the wafer-level MEMS scanning mirror testing device 100 according to the embodiments of this application has at least the following advantages compared with the prior art:

[0091] (1) During the MEMS scanning mirror test, the probe card assembly 2 is connected and cooperated with the scanning mirror under test to realize the voltage drive at the scanning mirror under test, which can improve the versatility of the wafer-level MEMS scanning mirror test device 100. The probe card assembly 2 with corresponding pin row structure can be set on the second clamping assembly 32 according to the scanning mirror under test, so as to meet the test requirements of the bare die of a single MEMS scanning mirror that has not been packaged after wafer dicing, and also meet the test requirements of the MEMS scanning mirror in the whole wafer.

[0092] (2) The devices used for testing (such as: light source assembly 5, probe card assembly 2 and two-dimensional PSD4, etc.) can be clamped and fixed by clamping components (such as: the first clamping component 31, the second clamping component 32 and the third clamping component 33 mentioned above), which facilitates the positioning of the devices, helps to improve the testing accuracy, obtain accurate data parameters, and after being combined with the host computer, can accurately measure the resonant frequency and scanning angle of the MEMS scanning mirror, and can realize automated testing, which helps to improve the testing efficiency of the MEMS scanning mirror and reduce the testing cost.

[0093] (3) The positions of the multiple clamping components and tray components 6 in the test stage 1 are adjustable and can be adjusted in multiple directions to match the devices in the wafer-level MEMS scanning mirror test device 100. Moreover, the arrangement of the devices is reasonable and can effectively avoid interference between devices.

[0094] Meanwhile, the wafer-level MEMS scanning mirror testing device 100 of this application is integrated with the two-dimensional PSD testing platform. This not only improves the debugging accuracy of the equipment during the test preparation stage, facilitating the full correspondence between the two-dimensional PSD4 and the scanning mirror under test, thereby improving the beam scanning trajectory detection accuracy during the test, but also allows for measurement accuracy of up to 0.001° or higher through the two-dimensional PSD testing platform. Furthermore, it can measure the scanning angle, resonant frequency, and angular accuracy of the scanning mirror under test. Therefore, the wafer-level MEMS scanning mirror testing device 100 of this application can fully test and inspect the scanning mirror under test.

[0095] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0096] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0097] In the description of this application, "multiple" means two or more.

[0098] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0099] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0100] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0101] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer-level MEMS scanning mirror testing device, characterized in that, include: The testing table (1) is used to place the scanning mirror to be tested. The testing table (1) includes: a base body (11), a first mounting base (12) and a second mounting base (13). The middle area of ​​the base body (11) is provided with a tray assembly (6), and the tray assembly (6) is used to accommodate the scanning mirror to be tested. The first mounting base (12) and the second mounting base (13) are respectively provided on both sides of the tray assembly (6) in a first direction. The probe card assembly (2) can be connected to a signal output device and electrically connected to the scanning mirror to be tested; The first clamping component (31) is tunably disposed on the detection stage (1) and is used to clamp and fix the light source component (5). The light source component (5) is used to emit a light beam to the scanning mirror to be tested. The first clamping component (31) is mounted on the first mounting base (12). The second clamping assembly (32) is tunably disposed on the detection stage (1) and is used to clamp and fix the probe card assembly (2). The second clamping assembly (32) is mounted on the second mounting base (13). The second clamping assembly (32) includes a main body (321) and a clamping part (322). The main body (321) is connected and cooperates with the second mounting base (13). The clamping part (322) is used to clamp and cooperate with the probe card assembly (2) and is rotatably mounted on the main body (321) around a first axis, and the first axis is parallel to the second direction. The third clamping component (33) is tunably positioned on the detection stage (1) and is used to clamp and fix the two-dimensional PSD (4), and the two-dimensional PSD (4) is used to collect the beam scanning trajectory formed by the scanning mirror to be detected.

2. The wafer-level MEMS scanning mirror testing device according to claim 1, characterized in that, The position of the first clamping component (31) relative to the first mounting base (12) is adjustable in the first direction, the second direction, and the third upward position; The second clamping assembly (32) is adjustable relative to the second mounting base (13) in the first direction, the second direction, and the third upward position; The third clamping assembly (33) is adjustable relative to the second mounting base (13) in the first direction, the second direction, and the third upward position; The first direction, the second direction, and the third direction are arranged perpendicular to each other.

3. The wafer-level MEMS scanning mirror testing device according to claim 1, characterized in that, The height of the mounting surface of the first mounting base (12) is not lower than that of the tray assembly (6); And / or, the mounting surface height of the second mounting base (13) is not lower than that of the tray assembly (6).

4. The wafer-level MEMS scanning mirror testing device according to claim 1, characterized in that, The tray assembly (6) includes: Adjustment seat (61), the position of which is adjustablely disposed on the seat body (11); The tray (62) is located on the adjustment seat (61) and moves synchronously with the adjustment seat (61) relative to the seat body (11). The tray (62) forms an upward-open accommodating space, and the scanning mirror to be tested is located in the accommodating space.

5. The wafer-level MEMS scanning mirror testing device according to claim 1, characterized in that, The probe card assembly (2) includes: The probe card body (21) is used to electrically connect with the scanning mirror to be tested and to clamp and cooperate with the second clamping assembly (32); Electrical connector (22) is connected to the probe card body (21) and is used for electrical connection with the signal output device.

6. The wafer-level MEMS scanning mirror testing device according to claim 5, characterized in that, The signal output device includes: A signal source, which is connected and cooperates with the electrical connector (22) and is used to transmit an electrical signal to one side of the electrical connector (22); A signal amplifier, which is connected to the signal source, is used to adjust the voltage signal output to the side of the scanning mirror to be tested.

7. The wafer-level MEMS scanning mirror testing device according to claim 1, characterized in that, It also includes a microscope (71), which is located above the detection stage (1) and is used to observe one side of the scanning mirror to be tested.

8. The wafer-level MEMS scanning mirror testing device according to claim 7, characterized in that, Also includes: An image acquisition unit is provided on the microscope (71) and is used to acquire image information at the scanning mirror to be tested; An image display unit (72) is provided on the detection station (1) and is electrically connected to the image acquisition unit and is used to display images.

Images