Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a shell and a touchpad. The shell comprises an accommodating cavity. The touch panel is assembled in the containing cavity and comprises a cover plate, a main substrate, a circuit board, a force sensing module and a force feedback module, and the cover plate covers the top of the main substrate and is located at an opening of the containing cavity; the circuit board is connected to the bottom of the main substrate; the force sensing module is formed on at least one of the main substrate and the circuit board; the force feedback module is connected to the bottom of the main substrate; when the cover plate is touched, after the force sensing module deforms, the force feedback module makes corresponding vibration feedback. The thickness of the electronic equipment can be reduced, the electronic equipment is light and thin, and the feedback precision of the touch panel is improved on the basis of thickness reduction.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the rapid development of the electronic device industry, large-scale touchpads and pressure recognition feedback are key development trends. Accurate pressure recognition provides users with a better touchpad clicking experience. Achieving both feedback accuracy and thinness in touchpads is a pressing issue. Summary of the Invention

[0003] The present application provides an improved electronic device.

[0004] The present application provides an electronic device, including:

[0005] a housing, comprising a receiving cavity; and

[0006] The touch panel is assembled in the receiving cavity and includes a cover plate, a main substrate, a circuit board, a force sensing module and a force feedback module. The cover plate is arranged on the top of the main substrate and is located at the opening of the receiving cavity; the circuit board is connected to the bottom of the main substrate; the force sensing module is formed on at least one of the main substrate and the circuit board; the force feedback module is connected to the bottom of the main substrate; when the cover plate is touched, the force sensing module is deformed, and the force feedback module provides corresponding vibration feedback.

[0007] Preferably, the main substrate includes a tin-doped indium oxide film; the circuit board is connected to the bottom of the tin-doped indium oxide film, and the force sensing module is connected to a side of the circuit board facing away from the main substrate.

[0008] Preferably, the circuit board includes at least one circuit main body and a circuit connection part connected to the at least one circuit main body, the at least one circuit main body is connected to the bottom of the tin-doped indium oxide film, the circuit connection part is connected to one side of the circuit main body and extends outside the receiving cavity, and the force sensing module is connected to the side of the circuit main body facing away from the main substrate.

[0009] Preferably, the number of the force sensing modules is set to be multiple, and the multiple force sensing modules are symmetrically distributed in the circuit main body.

[0010] Preferably, there is a distance between the force sensing module and the bottom wall of the receiving cavity.

[0011] Preferably, there is a distance between the force feedback module and the bottom wall of the receiving cavity.

[0012] Preferably, the circuit body is bonded to the lower surface of the main substrate by elastic adhesive.

[0013] Preferably, the touch panel also includes at least one auxiliary substrate, which is assembled below the main substrate and has a gap with the main substrate; the force sensing module is connected to the side of the auxiliary substrate facing the main substrate, and is electrically connected to the main substrate through conductive glue, and the circuit board is connected to the main substrate.

[0014] Preferably, the bottom of the auxiliary substrate is supported on the bottom wall of the receiving cavity by elastic glue, so that there is a distance between the auxiliary substrate and the bottom wall of the receiving cavity.

[0015] Preferably, the number of the force sensing modules is set to be multiple, and the multiple force sensing modules are symmetrically distributed on a side of the auxiliary substrate facing the main substrate.

[0016] Preferably, the auxiliary substrate is further provided with a plurality of conductive pads, and the circuit board is electrically connected to the main substrate via the plurality of conductive pads.

[0017] Preferably, the plurality of conductive pads are distributed around the force sensing module.

[0018] Preferably, the plurality of conductive pads form at least one conductive loop, and the at least one conductive loop is electrically connected to the force sensing module.

[0019] Preferably, the main substrate includes at least four copper layers, an isolation layer provided between two adjacent copper layers, and solder resist layers provided on the top and bottom of the two copper layers.

[0020] Preferably, touch control circuits are provided in two of the at least four copper layers, a ground wire shielding layer is provided in one of the copper layers, and a pressure sensing circuit is provided in another copper layer.

[0021] Preferably, the force feedback module is arranged at the bottom of the solder resist layer.

[0022] Preferably, the isolation layer includes at least one of a polyimide layer and an epoxy resin layer.

[0023] Preferably, the force sensing module includes a plurality of piezoresistors.

[0024] Preferably, the touch panel further includes at least one conductive spring, which is electrically connected to the main substrate via conductive adhesive, and a distance is provided between the conductive spring and the main substrate to form a first sensing capacitor, the first sensing capacitor including a first electrode and a second electrode arranged opposite to each other, the main substrate serving as the first electrode, and the conductive spring serving as the second electrode; wherein the gap between the first electrode and the second electrode is in a range of 0.1 mm to 0.3 mm.

[0025] Preferably, the main substrate includes at least four copper layers, an isolation layer arranged between two adjacent copper layers, and a solder resist layer arranged on the top and bottom of the two copper layers; two of the at least four copper layers are provided with touch circuits, one of the copper layers is provided with a ground shielding layer, and the other copper layer is provided with a pressure sensing circuit.

[0026] Preferably, the copper layer located at the bottom of the main substrate includes an electrode main body and an electrode connecting part that are isolated from each other, the electrode main body and the conductive spring are arranged correspondingly and there is a distance between the two to form the first induction capacitor; a part of the electrode connecting part is electrically connected to the conductive spring through a conductive glue, and the bottom of the other part of the electrode connecting part is provided with the solder resist layer.

[0027] Preferably, the bottom of the conductive spring is supported on the bottom wall of the receiving cavity by elastic glue, so that there is a distance between the conductive spring and the bottom wall of the receiving cavity.

[0028] Preferably, the conductive spring comprises a spring body and spring pads provided on both sides of the spring body, the circuit board is connected to the spring pads, and is electrically connected to the electrode connecting portion via a conductive adhesive.

[0029] Preferably, the number of the conductive springs is multiple, and the multiple conductive springs are symmetrically distributed on the bottom of the main substrate.

[0030] Preferably, the copper layer located at the bottom of the main substrate includes at least one groove, and the electrode main body and the electrode connecting part are isolated by the groove.

[0031] Preferably, the main substrate includes at least five copper layers, an isolation layer arranged between two adjacent copper layers, a solder resist layer arranged on the top and bottom of the two copper layers, and an isolation layer arranged between the two copper layers located at the bottom of the main substrate; two of the at least five copper layers are provided with touch circuits, one of the copper layers is provided with a ground shielding layer, and the other copper layer is provided with a pressure sensing circuit; the two copper layers located at the bottom of the main substrate are separated by the isolation layer and have a gap to form a second sensing capacitor, the second sensing capacitor includes a third electrode and a fourth electrode arranged opposite to each other, and the two copper layers located at the bottom of the main substrate serve as the third electrode and the fourth electrode respectively; wherein the gap between the third electrode and the fourth electrode ranges from 0.1mm to 0.3mm.

[0032] Preferably, the isolation layer includes a plurality of support portions distributed along rows and / or columns.

[0033] Preferably, the plurality of support portions are arranged at equal or unequal intervals.

[0034] Preferably, the multiple support parts have the same height.

[0035] Preferably, the widths of two adjacent support portions are the same or different.

[0036] Preferably, the isolation layer comprises a flexible isolation layer.

[0037] Preferably, the main substrate further includes a supporting layer, which is provided at the bottom of the solder resist layer and abuts against the bottom wall of the receiving cavity.

[0038] Preferably, a receiving hole is provided on the bottom wall of the shell, and the force feedback module is provided at the bottom of the main substrate and is partially located in the receiving hole.

[0039] Preferably, the support layer comprises a flexible support layer.

[0040] Preferably, the cover plate and the top wall of the shell are an integral structure.

[0041] Preferably, the force feedback module includes a vibration motor.

[0042] Preferably, the circuit board includes a flexible circuit board.

[0043] Preferably, a through hole is provided on the bottom wall of the shell, and an end of the circuit board not connected to the main substrate extends to the outside of the shell through the through hole.

[0044] Preferably, the electronic device includes a laptop computer, which also includes a keyboard assembly and a display assembly assembled in the shell, the keyboard assembly is connected to the display assembly, and includes a keyboard area and a touch area, the touch area is located on one side of the keyboard area, and the display assembly is located on a side of the keyboard area away from the touch area; the touchpad is arranged in the touch area, and the receiving cavity is arranged in the touch area.

[0045] The electronic device provided in the embodiment of the present application is provided with a housing and a touchpad. The housing is provided with a receiving cavity, the touchpad is assembled in the receiving cavity, and is provided with a cover plate, a main substrate, a circuit board, a force sensing module, and a force feedback module. The cover plate is provided on top of the main substrate and located at the opening of the receiving cavity. The circuit board is connected to the bottom of the main substrate. The force sensing module is formed on at least one of the main substrate and the circuit board, and the force feedback module is connected to the bottom of the main substrate. When the cover plate is touched, the force sensing module deforms, and the force feedback module provides corresponding vibration feedback. Such a configuration can reduce the thickness of the electronic device, achieve lightweight and thin electronic devices, and improve the feedback accuracy of the touchpad on the basis of thinning the thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0047] Figure 1 Shown is a structural schematic diagram of an embodiment of an electronic device of the present application.

[0048] Figure 2 Shown Figure 1 The cross-sectional view of the touch panel of the electronic device taken along line AA is a schematic diagram of an embodiment.

[0049] Figure 3 Shown Figure 2 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0050] Figure 4 Shown Figure 2 A circuit diagram of a touch panel of an electronic device is shown.

[0051] Figure 5 Shown Figure 1 The cross-sectional view of the touch panel of the electronic device taken along line AA is a schematic diagram of another embodiment.

[0052] Figure 6 Shown Figure 5 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0053] Figure 7 Shown Figure 5 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0054] Figure 8 Shown Figure 5 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0055] Figure 9 Shown Figure 1 A schematic cross-sectional view of line AA of a touch panel of an electronic device according to another embodiment is shown.

[0056] Figure 10 Shown Figure 9 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0057] Figure 11 Shown Figure 9 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0058] Figure 12 Shown Figure 9 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0059] Figure 13 Shown Figure 9 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0060] Figure 14 Shown Figure 9 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0061] Figure 15 Shown Figure 9 A circuit diagram of a touch panel of an electronic device is shown.

[0062] Figure 16 Shown Figure 1 The cross-sectional diagram of another embodiment of the touch panel of the electronic device taken along line AA is shown.

[0063] Figure 17 Shown Figure 16 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0064] Figure 18 Shown Figure 16 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0065] Figure 19 Shown Figure 16 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0066] Figure 20 Shown Figure 16 A schematic diagram of the partial structure of a touch panel of an electronic device is shown.

[0067] Figure 21 Shown Figure 16 A schematic diagram of the partial structure of a touch panel of an electronic device is shown. DETAILED DESCRIPTION

[0068] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0069] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. Unless otherwise defined, technical or scientific terms used in this application should have the ordinary meaning understood by a person of ordinary skill in the art to which this application belongs. The terms "first," "second," and similar words used in this specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish different components. Similarly, the terms "a" or "an" and similar words do not denote a limitation of quantity, but rather indicate the presence of at least one. The terms "plurality" or "several" mean at least two. Unless otherwise indicated, the terms "front," "rear," "lower," and / or "upper" and similar words are for convenience only and are not intended to limit to a single position or spatial orientation. The terms "include" or "comprising" and similar words mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. The terms "connected" or "connected" and similar words are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.

[0070] As used in this specification and the appended claims, the singular forms "a," "an," "said," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0071] The present application provides an electronic device comprising a housing and a touchpad. The housing includes a receiving cavity. The touchpad is assembled in the receiving cavity and comprises a cover plate, a main substrate, a circuit board, a force sensing module, and a force feedback module. The cover plate is disposed on top of the main substrate and located at the opening of the receiving cavity; the circuit board is connected to the bottom of the main substrate; the force sensing module is formed on at least one of the main substrate and the circuit board; and the force feedback module is connected to the bottom of the main substrate. When the cover plate is touched, the force sensing module deforms, and the force feedback module provides corresponding vibration feedback.

[0072] The electronic device provided in the embodiment of the present application is provided with a housing and a touchpad. The housing is provided with a receiving cavity, the touchpad is assembled in the receiving cavity, and is provided with a cover plate, a main substrate, a circuit board, a force sensing module, and a force feedback module. The cover plate is provided on top of the main substrate and located at the opening of the receiving cavity. The circuit board is connected to the bottom of the main substrate. The force sensing module is formed on at least one of the main substrate and the circuit board, and the force feedback module is connected to the bottom of the main substrate. When the cover plate is touched, the force sensing module deforms, and the force feedback module provides corresponding vibration feedback. Such a configuration can reduce the thickness of the electronic device, achieve lightweight and thin electronic devices, and improve the feedback accuracy of the touchpad on the basis of thinning the thickness.

[0073] The electronic device of the present application is described in detail below with reference to the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can be combined with each other.

[0074] Figure 1 FIG. 1 is a schematic structural diagram of an embodiment of an electronic device 100 of the present application. Figure 2 Shown Figure 1 The diagram is a cross-sectional view of an embodiment of the touch panel 20 of the electronic device 100 taken along line AA. Figure 3 Shown Figure 2 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 4 Shown Figure 2 The circuit diagram of the touch panel 20 of the electronic device 100 is shown in FIG. Figures 1 to 4As shown, the electronic device 100 may be a laptop computer. The electronic device 100 includes a housing 10 and a touchpad 20. The housing 10 is used to assemble the touchpad 20. The laptop computer also includes a keyboard assembly 106 and a display assembly 107 assembled in the housing 10. The keyboard assembly 106 is connected to the display assembly 107 and includes a keyboard area 101 and a touch area 102. The touch area 102 is located on one side of the keyboard area 101. The display assembly 107 is located on a side of the keyboard area away from the touch area 102. The touchpad 20 is provided in the touch area 102. The housing 10 includes a receiving cavity 103. The receiving cavity 103 is provided in the touch area 102. The touchpad 20 is assembled in the receiving cavity 103. The receiving cavity 103 extends in the horizontal and vertical directions and utilizes the space in the horizontal and vertical directions to accommodate the touchpad 20. The touchpad 20 includes a cover 201, a main substrate 202, a circuit board 203, a force sensing module 204, and a force feedback module 205. The cover 201 is positioned on top of the main substrate 202 and located at the opening of the receiving cavity 103. In this embodiment, the cover 201 is flush with the top surface of the housing 10. The main substrate 202 houses a portion of the touch control circuitry. The circuit board 203 is connected to the bottom of the main substrate 202. The circuit board 203 comprises a flexible circuit board 203. The circuit board 203 includes a ground shielding layer and pressure sensing circuitry. The force sensing module 204 is formed on at least one of the main substrate 202 and the circuit board 203. In some embodiments, the force sensing module 204 is assembled to the main substrate 202. In other embodiments, the force sensing module 204 is assembled to the circuit board 203. In still other embodiments, the force sensing module 204 is formed on both the main substrate 202 and the circuit board 203. This is not limited in this application. The force feedback module 205 is connected to the bottom of the main substrate 202. In this embodiment, the force feedback module 205 includes a vibration motor. When the cover 201 is touched, the force sensing module 204 deforms, and the force feedback module 205 provides corresponding vibration feedback. When a finger touches or presses the touch area 102, the touch circuit provided in the main substrate 202 can recognize the finger's capacitance signal to identify the finger's movement. When the finger presses the touch area 102 with force, the cover 201 of the touchpad 20 will deform, causing the main substrate 202, the force sensing module 204, and the force feedback module 205 to deform, thereby realizing pressure recognition. At the same time, the force feedback module 205 will also provide corresponding vibration feedback based on the deformation amount. Compared with related technologies, the support structure can be eliminated, the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner and lighter. On the basis of the thinner thickness, the feedback accuracy of the touchpad 20 can also be improved.

[0075] exist Figure 2In the embodiment shown, the cover plate 201 is an integral structure with the top wall of the housing 10. The housing 10 and the cover plate 201 can be provided as a whole, which can reduce the gap between the touchpad 20 and the housing 10, prevent friction between the touchpad 20 and the housing 10 when pressed, and thus improve the appearance of the exquisite. Figure 2 In the embodiment shown, there is a distance between the force sensing module 204 and the bottom wall of the receiving cavity 103. Providing a gap between the force sensing module 204 and the bottom wall of the receiving cavity 103 can ensure that the force sensing module 204 has space for deformation, thereby avoiding affecting the touch function. Figure 2 In the embodiment shown, there is a distance between the force feedback module 205 and the bottom wall of the receiving chamber 103. Providing a gap between the force feedback module 205 and the bottom wall of the receiving chamber 103 ensures that the force feedback module 205 has room to vibrate, thereby preventing the feedback function from being affected.

[0076] exist Figures 2 to 3 In the illustrated embodiment, the main substrate 202 includes a tin-doped indium oxide film 206. The tin-doped indium oxide film 206 can be a flexible ITO film, which can be an N-type oxide semiconductor - indium tin oxide. The ITO film is an indium tin oxide semiconductor transparent conductive film. The circuit board 203 is connected to the bottom of the tin-doped indium oxide film 206, and the force sensing module 204 is connected to the side of the circuit board 203 facing away from the main substrate 202. By configuring the main substrate 202 as the tin-doped indium oxide film 206 and providing a touch circuit within the tin-doped indium oxide film 206, when a finger presses the touch area 102, the touch circuit provided within the tin-doped indium oxide film 206 can recognize the finger's capacitance signal to identify the finger's movement, with sensitive recognition performance and high touch feedback accuracy.

[0077] exist Figures 2 to 3 In the illustrated embodiment, the circuit board 203 includes at least one circuit body 207 and a circuit connection portion 208 connected to the at least one circuit body 207. The at least one circuit body 207 is connected to the bottom of the tin-doped indium oxide film 206. The circuit connection portion 208 is connected to one side of the circuit body 207 and extends outside the receiving cavity 103. The force sensing module 204 is connected to the side of the circuit body 207 facing away from the main substrate 202. With this arrangement, a partial ground shielding layer and a sensing circuit are provided within the circuit body 207 for connecting the tin-doped indium oxide film 206 and the force sensing module 204, which can simplify the circuit structure of the circuit board 203. Figures 2 to 3 In the embodiment shown, the circuit body 207 is bonded to the lower surface of the main substrate 202 by elastic adhesive. Connecting the circuit body 207 and the main substrate 202 by elastic adhesive can improve deformation sensitivity.

[0078] exist Figures 2 to 4In the embodiment shown, the number of force sensing modules 204 is set to be multiple, and the multiple force sensing modules 204 are symmetrically distributed on the circuit main body 207. In some embodiments, one or more circuit main bodies 207 are provided. In this embodiment, more than one circuit main body 207 is provided. The more than one circuit main body 207 is symmetrically distributed. The multiple force sensing modules 204 are symmetrically distributed in the extension direction of the circuit main body 207. The multiple force sensing modules 204 are provided and the multiple force sensing modules 204 are symmetrically arranged, thereby improving the touch sensitivity. Figures 2 to 4 In the illustrated embodiment, force sensing module 204 includes multiple piezoresistors. Each force sensing module 204 comprises four pressure-sensitive materials or piezoresistors of equal length, width, and thickness. The four piezoresistors R1, R2, R3, and R4 form a Wheatstone bridge circuit. Each force sensing module 204 includes four independent piezoresistors.

[0079] In this embodiment, the plurality of varistors are disposed on the circuit body 207 of the circuit board 203 by silk screen printing, pad printing, stencil printing, or etching. The varistors are encapsulated with protective adhesive and connected to the thin-film crystal circuitry within the circuit body 207 via silver glue or solder paste. These varistors can generate resistance changes based on deformation, and the deformation is recorded based on the resistance change. When the touchpad 20 is subjected to finger pressure, it deforms, causing the varistor to deform and change its resistance. The deformation of the force sensing module 204 is monitored based on the voltage change generated by the resistance change. For example, in actual applications, the initial values ​​of the varistor R1, R2, R3, and R4 are equal: V1 = VCC*R1 / (R1+R2) = VCC / 2. V2 = VCC*R3 / (R3+R4) = VCC / 2. After deformation, the resistance values ​​at different locations will change. For example, if the resistance of R2 and R3 increases, V1 decreases, and V2 increases. In this embodiment, the deformation is determined by the changes in V1 and V2, and the vibration motor generates corresponding vibration feedback according to the deformation, thereby achieving precise control of the touch panel 20 and improving the control accuracy of the touch panel 20.

[0080] Figure 5 Shown Figure 1 The cross-sectional view of the touch panel 20 of the electronic device 100 taken along line AA is another embodiment of the present invention. Figure 6 Shown Figure 5 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 7 Shown Figure 5 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 8 Shown Figure 5 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100. Figures 5 to 8 As shown, Figures 5 to 8The embodiment shown is Figures 1 to 4 The embodiment shown is similar, with the main difference being that the touchpad 20 also includes at least one auxiliary substrate 209, which is assembled below the main substrate 202 and spaced apart from the main substrate 202. The force sensing module 204 is connected to the side of the auxiliary substrate 209 facing the main substrate 202 and is electrically connected to the main substrate 202 via conductive adhesive 210. The circuit board 203 is also connected to the main substrate 202. In this embodiment, the auxiliary substrate 209 serves as a carrier for securing the force sensing module 204. The auxiliary substrate 209 and the force sensing module 204 mounted thereon can be considered a pressure sensing module as a whole, connected to the main substrate 202 via SMT (Surface Mount Technology) technology. When the touchpad 20 is subjected to force, the force is transmitted to the pressure sensing module, causing the position of the force sensing module 204 to deform, thereby enabling pressure detection. In this embodiment, multiple auxiliary substrates 209 are provided. The multiple auxiliary substrates 209 are arranged corresponding to the multiple force sensing modules 204. The four force sensing modules 204 of this embodiment are symmetrically distributed to ensure uniform feedback.

[0081] exist Figure 5 and Figure 6 In the embodiment shown, the bottom of the auxiliary substrate 209 is supported on the bottom wall of the receiving cavity 103 by elastic glue 211, so that there is a distance between the auxiliary substrate 209 and the bottom wall of the receiving cavity 103. This arrangement allows the auxiliary substrate 209 to be connected to the bottom wall of the receiving cavity 103 through the elastic glue 211, avoiding direct connection with the bottom wall of the receiving cavity 103, providing a buffer distance for deformation and improving touch sensitivity. Figure 5 and Figure 7 In the embodiment shown, the number of force sensing modules 204 is set to be multiple. The multiple force sensing modules 204 are symmetrically distributed on the side of the auxiliary substrate 209 facing the main substrate 202. In this embodiment, the multiple force sensing modules 204 are symmetrically distributed on the upper surface of the auxiliary substrate 209, so that the multiple force sensing modules 204 are electrically connected to the main substrate 202 through the conductive adhesive 210, so that the auxiliary substrate 209 cooperates with the main substrate 202 to realize the touch function. Figure 7 In the embodiment shown, the auxiliary substrate 209 is further provided with a plurality of conductive pads 212, and the circuit board 203 is electrically connected to the main substrate 202 via the plurality of conductive pads 212. In this embodiment, the auxiliary substrate 209 is provided with at least one force sensing module 204 and at least four conductive pads 212 used in conjunction with the at least one force sensing module 204. Figure 7 In the embodiment shown, a plurality of conductive pads 212 are distributed around the force sensing module 204. In this embodiment, at least four conductive pads 212 are distributed around at least one force sensing module 204 to facilitate electrical connection with the main substrate 202 via the conductive adhesive 210. Figure 7 In the illustrated embodiment, the plurality of conductive pads 212 form at least one conductive loop, and the at least one conductive loop is electrically connected to the force sensing module 204 . Figure 7 In the embodiment, each of the four conductive pads 212 can be defined as VCC, V1, V2, and GND, and form a pressure sensing loop. A pressure sensing module has at least one pressure sensing loop and one force sensing module 204. Figure 7 Only two pressure sensing modules are shown, namely, two pressure sensing circuits and two force sensing modules 204, which can output two sets of pressure signals, but the present invention is not limited thereto.

[0082] exist Figure 8 In the illustrated embodiment, the main substrate 202 includes at least four copper layers 2021, an isolation layer 2022 provided between two adjacent copper layers 2021, and a solder resist layer 2023 provided on the top and bottom of the two copper layers 2021. At least four copper layers 2021 are provided with touch circuits, ground shielding layers, and pressure sensing circuits. The isolation layer 2022 provided between two adjacent copper layers 2021 plays an isolation role to prevent the two adjacent copper layers 2021 from being electrically connected. In some embodiments, the isolation layer includes at least one of a polyimide layer and an epoxy resin layer. The solder resist layer 2023 provided on the top and bottom of the two uppermost and lowermost copper layers 2021 can prevent conductive solder bridging between various electronic components provided on the copper layer 2021, thereby improving safety. In some embodiments, the force feedback module 205 is provided at the bottom of the solder resist layer 2023. The copper layer 2021 is isolated from the force feedback module 205 by the solder resist layer 2023. In Figure 8 In the illustrated embodiment, two of the at least four copper layers 2021 contain touch control circuitry, one of the copper layers 2021 contains a ground shield layer, and another copper layer 2021 contains a pressure sensing circuit. In this embodiment, the main substrate 202 utilizes a four-layer copper design, with the first and second layers providing capacitive touch control circuitry, the third layer providing a ground shield layer, and the fourth layer providing the pressure sensing circuitry. This arrangement increases the number of layers in the main substrate 202 while thinning or reducing the number of circuit boards 203, allowing the ground shield layer and pressure sensing circuitry to be integrated into the main substrate 202, thus achieving pressure sensing functionality. This simplifies the process, reduces the thickness of the module, and reduces costs.

[0083] Figure 9 Shown Figure 1 The cross-sectional view of the touch panel 20 of the electronic device 100 along line AA is another embodiment of the present invention. Figure 10 Shown Figure 9 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 11 Shown Figure 9 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 12 Shown Figure 9 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 13 Shown Figure 9 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 .

[0084] Figure 14 Shown Figure 9 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 15 Shown Figure 9 The circuit diagram of the touch panel 20 of the electronic device 100 is shown. Figures 9 to 15 As shown, the touch panel 20 also includes at least one conductive spring 213, which is electrically connected to the main substrate 202 via a conductive adhesive 210. A distance exists between the conductive spring 213 and the main substrate 202, forming a first sensing capacitor C1. The first sensing capacitor C1 includes a first electrode C11 and a second electrode C12 arranged opposite each other. The main substrate 202 serves as the first electrode C11, and the conductive spring 213 serves as the second electrode C12. The gap between the first electrode C11 and the second electrode C12 ranges from 0.1 mm to 0.3 mm. In this embodiment, the main substrate 202 and the conductive spring 213 serve as two capacitor electrodes, and a suitable gap is set between the two capacitor electrodes to form the first sensing capacitor C1. The touch cover 201 changes the gap between the two electrodes of the first sensing capacitor to change the capacitance value of the first sensing capacitor C1, thereby outputting a corresponding pressure signal. In some embodiments, the gap between the main substrate 202 and the conductive spring 213 is set to 0.1 mm, 0.2 mm, or 0.3 mm. In this embodiment, the gap between the main substrate 202 and the conductive spring 213 is set appropriately to improve feedback accuracy.

[0085] exist Figure 10 In the illustrated embodiment, the main substrate 202 includes at least four copper layers 2021, an isolation layer 2022 provided between two adjacent copper layers 2021, and a solder resist layer 2023 provided on the top and bottom of the two copper layers 2021. At least four copper layers 2021 are provided with touch circuits, ground shielding layers, and pressure sensing circuits. The isolation layer 2022 provided between two adjacent copper layers 2021 plays an isolation role to prevent the two adjacent copper layers 2021 from being electrically connected. In some embodiments, the isolation layer includes at least one of a polyimide layer and an epoxy resin layer. The solder resist layer 2023 provided on the top and bottom of the two uppermost and lowermost copper layers 2021 can prevent conductive solder bridging between various electronic components provided on the copper layer 2021, thereby improving safety. In some embodiments, the force feedback module 205 is provided at the bottom of the solder resist layer 2023. The copper layer 2021 is isolated from the force feedback module 205 by the solder resist layer 2023. In Figure 8In the illustrated embodiment, two of the at least four copper layers 2021 contain touch control circuitry, one of the copper layers 2021 contains a ground shield layer, and another copper layer 2021 contains a pressure sensing circuit. In this embodiment, the main substrate 202 utilizes a four-layer copper design, with the first and second layers providing capacitive touch control circuitry, the third layer providing a ground shield layer, and the fourth layer providing the pressure sensing circuitry. This arrangement increases the number of layers in the main substrate 202 while thinning or reducing the number of circuit boards 203, allowing the ground shield layer and pressure sensing circuitry to be integrated into the main substrate 202, thus achieving pressure sensing functionality. This simplifies the process, reduces the thickness of the module, and reduces costs.

[0086] exist Figure 10 and Figure 11 In the illustrated embodiment, the copper layer 2021 at the bottom of the main substrate 202 includes an isolated electrode body 2024 and an electrode connection portion 2025. The electrode body 2024 and the conductive spring 213 are positioned in a manner corresponding to each other, with a distance therebetween, forming a first sensing capacitor C1. A portion of the electrode connection portion 2025 is electrically connected to the conductive spring 213 via a conductive adhesive 210, while a solder resist layer 2023 is provided on the bottom of another portion of the electrode connection portion 2025. In this embodiment, the electrode body 2024 and the conductive spring 213 are positioned opposite each other, serving as the first electrode C11 of the first sensing capacitor C1, while the conductive spring 213 serves as the second electrode C12 of the first sensing capacitor C1. The copper layer at the bottom of the main substrate 202 includes at least one groove 214, separating the electrode body 2024 and the electrode connection portion 2025. This arrangement isolates the electrode body 2024 from the electrode connection portion 2025, allowing the electrode body 2024 to function as the first electrode C11 of the first sensing capacitor C1, and the conductive spring 213 to function as the second electrode C12 of the first sensing capacitor C1. The touch cover 201 changes the gap between the two electrodes of the first sensing capacitor to alter the capacitance of the first sensing capacitor, thereby outputting a corresponding pressure signal. This improves control accuracy while reducing the thickness of the module.

[0087] exist Figures 9 to 11 In the illustrated embodiment, the bottom of the conductive spring 213 is supported by elastic adhesive on the bottom wall of the receiving cavity 103, creating a distance between the conductive spring 213 and the bottom wall of the receiving cavity 103. This arrangement allows the conductive spring 213 to be connected to the bottom wall of the receiving cavity 103 via the elastic adhesive 211, avoiding direct contact with the bottom wall of the receiving cavity 103. This provides a buffered distance for deformation and improves touch sensitivity.

[0088] exist Figures 9 to 12In the illustrated embodiment, a plurality of conductive springs 213 are provided. The plurality of conductive springs 213 are symmetrically distributed on the bottom of the main substrate 202. In this embodiment, the plurality of conductive springs 213 are symmetrically distributed on the lower surface of the main substrate 202, opposite the electrode body 2024 of the bottommost copper layer 2021 of the main substrate 202, with appropriate gaps provided to form an inductive capacitor, utilizing the characteristics of the inductive capacitor to achieve touch control.

[0089] exist Figures 13 and 14 In the illustrated embodiment, the conductive spring 213 includes a spring body 2131 and spring pads 2132 disposed on either side of the spring body 2131. The circuit board 203 is connected to the spring pads 2132 and electrically connected to the electrode connection portion 2025 via the conductive adhesive 210. This arrangement enables soldering to the circuit board 203 by providing the spring body 2131 and two spring pads 2132, thereby achieving a stable and reliable electrical connection to the circuit board 203. In some embodiments, one or more spring pads 2132 may be provided. In this embodiment, two spring pads 2132 are provided, and the two spring pads 2132 are symmetrically arranged on either side of the spring body 2131. The conductive spring 213 can be soldered to the back of the main substrate 202 using a SMT process. The two spring pads 2132 of the conductive spring 213 are connected to the main substrate 202 using solder paste. A certain safety gap is left between the spring body 2131 of the conductive spring 213 and the electrode body 2024 of the bottom copper layer 2021 of the main substrate 202, leaving them suspended in the air to form a capacitor system. The spring body 2131 and the electrode body 2024 are spaced apart and have elastic force, allowing for elastic deformation.

[0090] Combine Figures 9 to 15 In the embodiment shown, the pressure sensing module is connected to the main substrate 202 through the SMT process, and the pressure sensing module consists of a conductive spring 213, a welding point, and a double-sided tape. When the cover 201 is subjected to force, the force is transmitted to the pressure sensing module, and the distance between the conductive spring 213 and the electrode body 2024 of the bottom copper layer 2021 of the main substrate 202 changes, resulting in a change in the capacitance value. C = εrS / 4πkd. Among them, εr is the relative dielectric constant, S is the facing area of ​​the capacitor plates, d is the distance between the capacitor plates, and k is the electrostatic force constant. When subjected to force, the only variable d changes, causing the capacitance C to change, thereby realizing pressure detection. For example, the original capacitance is Cs0. When the air gap changes, it changes to ΔCs. When the standard waveform is input to VREF, the voltage is read at ΔVSIG to calculate the value of ΔCs.

[0091]

[0092]

[0093] In the above solution, a first inductive capacitor is formed between the conductive spring 213 and the electrode body 2024 of the bottom copper layer 2021 of the main substrate 202. The change in the distance between the two electrodes of the first inductive capacitor is used to determine the change in capacitance, thereby achieving precise control.

[0094] Figure 16 Shown Figure 1 The cross-sectional view of the touch panel 20 of the electronic device 100 along line AA is another embodiment of the present invention. Figure 17 Shown Figure 16 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 18 Shown Figure 16 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 19 Shown Figure 16 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figure 20 Shown Figure 16 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 .

[0095] Figure 21 Shown Figure 16 FIG. 1 is a schematic diagram of a partial structure of the touch panel 20 of the electronic device 100 . Figures 16 to 21 In the embodiment shown, Figures 9 to 15 The embodiment shown is similar, with the main difference being that the main substrate 202 includes at least five copper layers 2021, an isolation layer 2022 disposed between two adjacent copper layers 2021, solder resist layers 2023 disposed on the top and bottom of the two copper layers 2021, and an isolation layer 2022 disposed between the two copper layers 2021 located at the bottom of the main substrate 202. Two of the at least five copper layers 2021 have touch control circuits, one has a ground shield layer, and another has a pressure sensing circuit. The at least five copper layers 2021 are provided with touch control circuits, a ground shield layer, and a pressure sensing circuit. The isolation layer 2022 disposed between two adjacent copper layers 2021 provides isolation, preventing electrical connection between the two adjacent copper layers 2021. The solder resist layers 2023 disposed on the top and bottom of the uppermost and lowermost copper layers 2021 can prevent conductive solder from bridging between various electronic components disposed on the copper layers 2021, thereby improving safety.

[0096] exist Figures 16 to 21In the illustrated embodiment, two copper layers 2021 located at the bottom of the main substrate 202 are separated by an isolation layer 2022 and have a gap therebetween, forming a second sensing capacitor C2. The second sensing capacitor C2 includes a third electrode C21 and a fourth electrode C22, which are arranged opposite each other. The two copper layers 2021 located at the bottom of the main substrate 202 serve as the third electrode C21 and the fourth electrode C22, respectively. The gap between the third electrode C21 and the fourth electrode C22 ranges from 0.1 mm to 0.3 mm. The two copper layers 2021 located at the bottom of the main substrate 202 serve as two capacitor electrodes, and a suitable gap is provided between the two capacitor electrodes to form the second sensing capacitor C2. The touch cover 201 changes the gap between the two electrodes of the second sensing capacitor C2 to change the capacitance value of the second sensing capacitor C2, thereby outputting a corresponding pressure signal. In some embodiments, the gap between the two copper layers 2021 located at the bottom of the main substrate 202 is set to 0.1 mm, 0.2 mm, or 0.3 mm. In this embodiment, the gap between the two copper layers 2021 at the bottom of the main substrate 202 is set appropriately to improve the feedback accuracy. Figures 18 to 21 In the illustrated embodiment, a strip of double-sided tape is placed beneath the main substrate 202, bonding it to the entire device. When force is applied to the cover plate 201 of the touch area 102, the force is transmitted to the main substrate 202, causing the distance between the copper foils within the main substrate 202 to change, resulting in a change in capacitance, as calculated by the formula C = εrS / 4πkd, where εr is the relative dielectric constant, S is the area of ​​the capacitor plates facing each other, d is the distance between the capacitor plates, and k is the electrostatic force constant. When force is applied, the only variable, distance d, changes, causing capacitance C to change, thereby enabling pressure detection.

[0097] exist Figures 16 and 17 In the embodiment shown, the main substrate 202 further includes a support layer 2026, which is provided at the bottom of the solder resist layer 2023 and abuts against the bottom wall of the receiving cavity 103. In this arrangement, the support layer 2026 supports the solder resist layer 2023, so that a buffer gap is provided between the solder resist layer 2023 and the bottom wall of the receiving cavity 103, thereby improving feedback accuracy. Figures 16 and 17 In the embodiment shown, the support layer 2026 comprises a flexible support layer. In this configuration, the flexible support layer can act as a buffer.

[0098] exist Figures 16 and 17 In the embodiment shown, the bottom wall of the housing 10 is provided with a receiving hole 104, and the force feedback module 205 is provided at the bottom of the main substrate 202 and is partially located in the receiving hole 104. In this arrangement, the receiving hole 104 is used to accommodate the force feedback module 205, and the overall thickness of the device is reduced without affecting its use. Figures 16 and 17In the embodiment shown, the bottom wall of the housing 10 is provided with a through hole 105, and the end of the circuit board 203 not connected to the main substrate 202 extends out of the housing 10 through the through hole 105. In this arrangement, the through hole 105 is used to accommodate the circuit board 203, making the structure compact.

[0099] exist Figures 18 to 21 In the illustrated embodiment, the isolation layer 2022 includes a plurality of support portions 2027 distributed along rows and / or columns. Figure 20 In the illustrated embodiment, the isolation layer 2022 includes a plurality of support portions 2027 distributed along rows and columns. Figure 21 In the illustrated embodiment, the isolation layer 2022 includes multiple support portions 2027 distributed along columns. In other embodiments, the isolation layer 2022 includes multiple support portions 2027 distributed along rows. The multiple support portions 2027 are spaced apart. In this embodiment, the isolation layer 2022 comprises a flexible isolation layer. The support portions 2027 comprise flexible support portions. This arrangement allows the flexible isolation layer to function as a buffer. In some embodiments, the multiple support portions 2027 are spaced evenly or unevenly. In this embodiment, the multiple support portions 2027 are spaced evenly. In other embodiments, the multiple support portions 2027 are spaced unevenly. In this embodiment, the multiple support portions 2027 have the same height. This arrangement ensures that the gaps between the third electrode C21 and the fourth electrode C22 of the second sensing capacitor C2 are equal, thereby ensuring consistent feedback. In some embodiments, the widths of adjacent support portions 2027 may be the same or different. In this embodiment, the widths of adjacent support portions 2027 are the same, ensuring consistent feedback accuracy. In some other embodiments, the widths of two adjacent support portions 2027 are different, which can be set according to actual conditions and is not limited in this application. Figure 21 In the illustrated embodiment, the support portion 2027 may be a double-sided tape, and the double-sided tape is symmetrically distributed.

[0100] Combine Figures 18 to 21 As shown, the main substrate 202 adopts a five-layer copper design, the first and second layers are capacitive touch circuits, the third layer is a ground shielding layer, the fourth and fifth layers are arranged with pressure sensing circuits, a bracket grid is set between the two layers of copper, and the two layers of copper on the fourth and fifth layers between the grids form a capacitance detection module. Double-sided tape is arranged below the center of the module to ensure that the distance between the two layers of copper changes when under pressure. In order to strengthen the strength of the fifth layer of copper, the thickness can be increased or a layer of solder mask (for example, FR4 material) can be added to improve the single-layer strength and the overall reliability of the module. The whole is divided into several areas by the support part 2027 to form a capacitor system. The smaller the area, the higher the recognition accuracy. The accuracy can also be improved by reducing the area or designing different area shapes. The capacitor area can be designed to be square, rectangular, circular, etc., which is not limited in this application.

[0101] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: a housing, comprising a receiving cavity; and A touch panel assembled in the receiving cavity and comprising a cover plate, a main substrate, a circuit board, a force sensing module and a force feedback module, wherein the cover plate is arranged on top of the main substrate and is located at the opening of the receiving cavity; The circuit board is connected to the bottom of the main substrate; the force sensing module is formed on at least one of the main substrate and the circuit board; the force feedback module is connected to the bottom of the main substrate; when the cover is touched, the force sensing module is deformed, and the force feedback module provides corresponding vibration feedback.

2. The electronic device according to claim 1, wherein The main substrate includes a tin-doped indium oxide film; the circuit board is connected to the bottom of the tin-doped indium oxide film, and the force sensing module is connected to a side of the circuit board facing away from the main substrate.

3. The electronic device according to claim 2, wherein: The circuit board includes at least one circuit main body and a circuit connection part connected to the at least one circuit main body, the at least one circuit main body is connected to the bottom of the tin-doped indium oxide film, the circuit connection part is connected to one side of the circuit main body and extends outside the receiving cavity, and the force sensing module is connected to the side of the circuit main body facing away from the main substrate.

4. The electronic device according to claim 3, wherein: The number of the force sensing modules is set to be multiple, and the multiple force sensing modules are symmetrically distributed on the circuit main body; and / or There is a distance between the force sensing module and the bottom wall of the receiving cavity; and / or There is a distance between the force feedback module and the bottom wall of the receiving cavity; and / or The circuit main body is bonded to the lower surface of the main substrate by elastic adhesive.

5. The electronic device according to claim 1, wherein The touch panel also includes at least one auxiliary substrate, which is assembled below the main substrate and has a gap with the main substrate; the force sensing module is connected to the side of the auxiliary substrate facing the main substrate and is electrically connected to the main substrate through conductive glue, and the circuit board is connected to the main substrate.

6. The electronic device according to claim 5, characterized in that The bottom of the auxiliary substrate is supported on the bottom wall of the receiving cavity by elastic glue, so that there is a distance between the auxiliary substrate and the bottom wall of the receiving cavity; and / or The number of the force sensing modules is set to be multiple, and the multiple force sensing modules are symmetrically distributed on a side of the auxiliary substrate facing the main substrate.

7. The electronic device according to claim 6, wherein: The auxiliary substrate is further provided with a plurality of conductive pads, and the circuit board is electrically connected to the main substrate via the plurality of conductive pads; The plurality of conductive pads are distributed around the force sensing module; and / or The plurality of conductive pads form at least one conductive loop, and the at least one conductive loop is electrically connected to the force sensing module.

8. The electronic device according to claim 6, wherein: The main substrate comprises at least four copper layers, an isolation layer provided between two adjacent copper layers, and solder resist layers provided on the top and bottom of the two copper layers; Two of the at least four copper layers are provided with touch control circuits, one of the copper layers is provided with a ground shielding layer, and another of the copper layers is provided with a pressure sensing circuit; and / or The force feedback module is arranged at the bottom of the solder resist layer; and / or The isolation layer includes at least one of a polyimide layer and an epoxy resin layer.

9. The electronic device according to claim 1 or 5, characterized in that: The force sensing module includes a plurality of pressure-sensitive resistors.

10. The electronic device according to claim 1, wherein The touch panel further includes at least one conductive spring, which is electrically connected to the main substrate via conductive adhesive. A distance is provided between the conductive spring and the main substrate to form a first sensing capacitor. The first sensing capacitor includes a first electrode and a second electrode disposed opposite to each other, the main substrate serving as the first electrode, and the conductive spring serving as the second electrode. The gap between the first electrode and the second electrode is in a range of 0.1 mm to 0.3 mm.

11. The electronic device according to claim 10, characterized in that The main substrate includes at least four copper layers, an isolation layer provided between two adjacent copper layers, and solder resist layers provided on the top and bottom of the two copper layers; two of the at least four copper layers are provided with touch control circuits, one of the copper layers is provided with a ground shielding layer, and another copper layer is provided with a pressure sensing circuit; The copper layer located at the bottom of the main substrate includes an electrode main body and an electrode connecting portion that are isolated from each other, the electrode main body and the conductive spring are correspondingly arranged with a distance between them to form the first sensing capacitor; a portion of the electrode connecting portion is electrically connected to the conductive spring via a conductive adhesive, and the bottom of another portion of the electrode connecting portion is provided with the solder resist layer; and / or The bottom of the conductive spring is supported on the bottom wall of the receiving cavity by elastic glue, so that there is a distance between the conductive spring and the bottom wall of the receiving cavity.

12. The electronic device according to claim 11, wherein: The conductive spring comprises a spring body and spring pads provided on both sides of the spring body, the circuit board is connected to the spring pads and is electrically connected to the electrode connection portion via a conductive adhesive; and / or The number of the conductive springs is set to be multiple, and the multiple conductive springs are symmetrically distributed on the bottom of the main substrate; and / or The copper layer located at the bottom of the main substrate includes at least one groove, and the electrode main body and the electrode connecting part are isolated by the groove.

13. The electronic device according to claim 1, wherein The main substrate includes at least five copper layers, an isolation layer arranged between two adjacent copper layers, a solder resist layer arranged on the top and bottom of the two copper layers, and an isolation layer arranged between the two copper layers located at the bottom of the main substrate; two of the at least five copper layers are provided with touch circuits, one of the copper layers is provided with a ground shielding layer, and another copper layer is provided with a pressure sensing circuit; the two copper layers located at the bottom of the main substrate are separated by the isolation layer and have a gap to form a second sensing capacitor, the second sensing capacitor includes a third electrode and a fourth electrode arranged opposite to each other, and the two copper layers located at the bottom of the main substrate serve as the third electrode and the fourth electrode respectively; wherein the gap between the third electrode and the fourth electrode ranges from 0.1 mm to 0.3 mm.

14. The electronic device according to claim 13, wherein: The isolation layer includes a plurality of support portions distributed along rows and / or columns; The plurality of support portions are arranged at equal or unequal intervals; and / or The plurality of support portions have the same height; and / or The widths of two adjacent support portions are the same or different; and / or The isolation layer includes a flexible isolation layer.

15. The electronic device according to claim 13, wherein: The main substrate further includes a supporting layer, which is provided at the bottom of the solder resist layer and abuts against the bottom wall of the receiving cavity; The bottom wall of the housing is provided with a receiving hole, the force feedback module is provided at the bottom of the main substrate and is partially located in the receiving hole; and / or The support layer includes a flexible support layer.

16. The electronic device according to claim 1, 2, 5, 10 or 13, characterized in that: The cover plate and the top wall of the housing are an integral structure; and / or The force feedback module includes a vibration motor; and / or The circuit board includes a flexible circuit board; and / or A through hole is provided on the bottom wall of the shell, and an end of the circuit board not connected to the main substrate extends to the outside of the shell through the through hole.

17. The electronic device according to claim 1, wherein: The electronic device includes a laptop computer, which also includes a keyboard assembly and a display assembly assembled in the shell. The keyboard assembly is connected to the display assembly and includes a keyboard area and a touch area. The touch area is located on one side of the keyboard area, and the display assembly is located on a side of the keyboard area away from the touch area. The touchpad is arranged in the touch area, and the receiving cavity is arranged in the touch area.

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