A camera module

Abstract

The application discloses a camera module, comprising: an optical lens; a photosensitive assembly comprising a photosensitive chip and a circuit board, the photosensitive chip being arranged on and electrically connected to the circuit board; a base fixed above the circuit board; an adhesive arranged between the circuit board and the base; a focusing driving assembly and an anti-shake driving assembly, the focusing driving assembly being configured to drive the optical lens to move in a direction parallel to an optical axis, the anti-shake driving assembly driving the optical lens to move in a direction perpendicular to the optical axis; one end of a focusing substrate being fixed and electrically connected to the focusing driving assembly, the other end of the focusing substrate being fixed to the base on a first side and welded to the circuit board; one end of an anti-shake substrate being fixed and electrically connected to the anti-shake driving assembly, the other end of the anti-shake substrate being fixed to the base on a second side and welded to the circuit board, so that the base and the circuit board are subjected to symmetrical tension on the first side and the second side respectively. The camera module provided by the application has good stability and reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of camera modules, and in particular to a camera module. BACKGROUND

[0002] At present, in the market, consumers have increasingly high and diversified requirements for the functions of camera modules configured in mobile electronic devices (for example, smart phones). For example, in order to realize common optical focusing and optical anti-shake functions, a motor that can drive the movement of an optical lens is usually arranged in the camera module, so that the optical performance is adjusted by driving the movement of the optical lens by the motor.

[0003] The line conduction of the motor not only affects the transmission of signals and the performance of the motor, but also affects the reliability and stability of the camera module. Therefore, it is urgent to optimize the line conduction structure of the motor to develop a camera module with better stability and reliability. SUMMARY

[0004] One purpose of the present application is to provide a camera module that is beneficial to improving the reliability and use stability of the camera module and reducing the risk of cracking of the adhesive.

[0005] Another purpose of the present application is to provide a camera module that is beneficial to improving the focusing speed and focusing accuracy of the camera module and further enhancing the imaging quality.

[0006] To achieve the above purposes, the technical solution adopted by the present application is as follows: a camera module, comprising: an optical lens defining an optical axis; a photosensitive assembly comprising a photosensitive chip and a circuit board, the photosensitive chip being arranged on and electrically connected to the circuit board, the photosensitive chip being located on the optical path of the optical lens; a base, the circuit board being fixed below the base; an adhesive being arranged between the circuit board and the base; a focusing drive assembly and an anti-shake drive assembly, the focusing drive assembly being configured to drive the optical lens to move in a direction parallel to the optical axis, the anti-shake drive assembly being configured to drive the optical lens to move in a direction perpendicular to the optical axis; a focusing substrate and an anti-shake substrate, one end of the focusing substrate being fixed and electrically connected to the focusing drive assembly, the other end of the focusing substrate being fixed to the base on a first side and welded to the circuit board; one end of the anti-shake substrate being fixed and electrically connected to the anti-shake drive assembly, the other end of the anti-shake substrate being fixed to the base on a second side and welded to the circuit board, so that the base and the circuit board are subjected to symmetrical tension on the first side and the second side respectively; the camera module comprising a first side, a second side, a third side and a fourth side located on the circumferential side, the first side and the second side being opposite sides.

[0007] In some embodiments, the focusing substrate includes a second focusing through-connection fixed to the base and soldered to the circuit board, the anti-shake substrate includes a third anti-shake through-connection fixed to the base and soldered to the circuit board, the plane where the second focusing through-connection is located is parallel to the plane where the third anti-shake through-connection is located, and both are parallel to the direction of the optical axis; wherein the width of the second focusing through-connection along the direction perpendicular to the optical axis is less than the width of the third anti-shake through-connection along the direction perpendicular to the optical axis.

[0008] In some embodiments, the anti-shake substrate further includes a first anti-shake through-connection and a second anti-shake through-connection electrically connected to the anti-shake driving assembly, and an anti-shake bending part connected to the first anti-shake through-connection or the second anti-shake through-connection at one end and connected to the third anti-shake through-connection at the other end, the plane where the first anti-shake through-connection and the second anti-shake through-connection are located is perpendicular to the plane where the third anti-shake through-connection is located; wherein the width of the anti-shake bending part along the direction perpendicular to the optical axis is h1, the width of the third anti-shake through-connection along the direction perpendicular to the optical axis is h2, and h1 < h2.

[0009] In some embodiments, the third anti-shake through-connection has an anti-shake through-connection pad, the second focusing through-connection has a focusing through-connection pad, the plane where the anti-shake through-connection pad is located is parallel to the plane where the focusing through-connection pad is located; the top surface of the circuit board has a first pad group located at the first side and a second pad group located at the second side, the plane where the anti-shake through-connection pad and the focusing through-connection pad are located is perpendicular to the plane where the first pad group and the second pad group are located; wherein the number of the anti-shake through-connection pad, the focusing through-connection pad, the first pad group and the second pad group is the same.

[0010] In some embodiments, the base includes a first base side wall located at the first side and a second base side wall located at the second side, the first base side wall has a first groove recessed towards the optical axis, the second base side wall has a second groove recessed towards the optical axis, the circuit board closes the opening of the bottom of the first groove and the second groove; the focusing through-connection pad and the first pad group are exposed to the first groove, the anti-shake through-connection pad and the second pad group are exposed to the second groove, and solder is arranged in the first groove and the second groove to fix and electrically connect the focusing through-connection pad and the first pad group, and to fix and electrically connect the anti-shake through-connection pad and the second pad group.

[0011] In some embodiments, the circuit board includes a circuit board body, a connecting band, and a connector, the connecting band connecting the connector and the circuit board body, the connecting band and the connector being located at the third side; the first pad group and the second pad group are arranged on the circuit board body, the first pad group, the second pad group, and the connecting band and the connector being located at different sides of the circuit board body, respectively.

[0012] In some embodiments, the camera module includes an anti-shake module, the anti-shake module including an anti-shake carrier, the anti-shake driving assembly, and the anti-shake substrate, the focusing substrate being parallel to the optical axis, the focusing substrate including a first focusing through portion at one end, a second focusing through portion at the other end, and a focusing extension portion between the first focusing through portion and the second focusing through portion; wherein the first focusing through portion and the second focusing through portion are located at different sides of the circumferential side, respectively, the first focusing through portion being fixed to the anti-shake carrier, the second focusing through portion being fixed to the base and extending towards the circuit board to be fixed and electrically connected to the circuit board, the focusing extension portion being located outside the anti-shake carrier and having a gap with the anti-shake carrier, the focusing extension portion being bent at least twice outside the anti-shake carrier.

[0013] In some embodiments, the anti-shake substrate includes a first anti-shake through portion, a second anti-shake through portion, and a third anti-shake through portion, wherein the first anti-shake through portion and the second anti-shake through portion are fixed to the base at different sides of the circumferential side, the first anti-shake through portion and the second anti-shake through portion being connected to each other, the third anti-shake through portion extending from the first anti-shake through portion or the second anti-shake through portion towards the circuit board, being fixed and electrically connected to the circuit board; wherein the third anti-shake through portion and the first focusing through portion are located at adjacent sides of the circumferential side, and the third anti-shake through portion and the second focusing through portion are located at opposite sides of the circumferential side.

[0014] In some embodiments, the focusing extension further comprises a first bending portion, a first extension portion, a second bending portion, a second extension portion, and a third bending portion, the first bending portion integrally connecting the first focusing conducting portion and the first extension portion, the second bending portion integrally connecting the first extension portion and the second extension portion, and the third bending portion integrally connecting the second extension portion and the second focusing conducting portion, such that the first focusing conducting portion and the second focusing conducting portion are disposed on the first side and the fourth side of the anti-shake carrier, and the first extension portion and the second extension portion are disposed on the second side and the third side of the anti-shake carrier, wherein the first side and the second side are oppositely disposed along a second direction or a third direction, the third side and the fourth side are oppositely disposed along the third direction or the second direction, and a first direction is parallel to an optical axis, and the second direction and the third direction are orthogonal to the first direction.

[0015] In some embodiments, the camera module further comprises a focusing module, the focusing module comprising the focusing driving assembly, the focusing substrate, and a focusing carrier, the focusing driving assembly comprising a focusing driving magnet and a focusing driving coil oppositely disposed along a direction perpendicular to the first direction, the focusing driving magnet being disposed on one side of the focusing carrier, and the focusing driving coil being disposed on one side of the anti-shake carrier, wherein the focusing driving coil is disposed between the focusing driving magnet and the first focusing conducting portion along the second direction; the anti-shake driving assembly comprising at least one anti-shake driving magnet and at least one anti-shake driving coil oppositely disposed along the first direction, the anti-shake driving magnet and the focusing driving coil being disposed on different sides of the anti-shake carrier, and the anti-shake driving coil being disposed on the base, the anti-shake substrate electrically conducting the circuit board to drive the anti-shake carrier to move along the second direction and / or the third direction.

[0016] In some embodiments, the focusing substrate further comprises a reinforcing member, at least a portion of the reinforcing member being attached to an outer periphery of a bending portion of the focusing extension, and another portion of the reinforcing member extending along the second direction and / or the third direction, such that the reinforcing member is attached to a connection between the bending portion of the focusing extension and the extension portion of the focusing extension; the focusing substrate being provided with conductive lines, the number of the conductive lines being not greater than 4, wherein a width of the reinforcing member along the first direction is not greater than a width of the bending portion of the focusing extension along the first direction.

[0017] In some embodiments, a projection of the focusing substrate along the first direction and a projection of the anti-shake substrate along the first direction do not overlap on the first side and the fourth side; and the projection of the focusing substrate along the first direction and the projection of the anti-shake substrate along the first direction overlap on the second side and the third side.

[0018] In some embodiments, the base comprises a base body and a base protrusion extending from one side of the base body to the direction of the second focusing through part, the base protrusion supports the second focusing through part in the first direction, the base body is further provided with a body top surface, a body bottom surface and a body side surface, the body top surface supports the anti-shake carrier, the second focusing through part and the third anti-shake through part are arranged on opposite sides of the body side surface, and the body bottom surface is bonded to the circuit board by an adhesive.

[0019] In some embodiments, the focusing module further comprises a focusing support part, the anti-shake carrier comprises a main body, and a first cross beam, a second cross beam, a third cross beam and a fourth cross beam arranged in sequence in the circumferential direction, wherein the first cross beam and the third cross beam are arranged opposite to each other in the second direction, and the second cross beam and the fourth cross beam are arranged opposite to each other in the third direction, wherein the focusing base plate is annularly mounted on the outer circumferential side of the main body, and the focusing drive coil is mounted on the first cross beam; the anti-shake drive magnet is mounted on the second cross beam and / or the third cross beam to drive the anti-shake carrier to move in the second direction and / or the third direction; the main body is provided with a first support groove located on both sides of the first cross beam, the first support groove is adapted to the installation of the focusing support part; and the focusing carrier comprises a mounting cavity, a first side wall, a second side wall, a third side wall and a fourth side wall arranged in sequence in the circumferential direction, wherein the first side wall and the third side wall are arranged opposite to each other in the second direction, and the second side wall and the fourth side wall are arranged opposite to each other in the third direction, and the focusing drive magnet is arranged on the first side wall, so that the focusing drive magnet, the focusing drive coil and the first focusing through part are sequentially arranged on the first side of the focusing carrier in the second direction.

[0020] In some embodiments, the base is further provided with a glue storage groove arranged opposite to the base and the bonding position of the focusing base plate and the anti-shake base plate in the second direction, for accommodating glue.

[0021] Compared with the prior art, the application has the following beneficial effects:

[0022] (1) The anti-shake circuit board arranged on the opposite side and the focusing circuit board bent at least three times make the two through pads connected on the opposite sides of the base, which is beneficial to balance the tension generated by welding, reduce the risk of cracking of the adhesive, further enhance the use stability and reliability of the camera module, and prolong the service life.

[0023] (2) The application has the advantages that the focusing module is arranged on the inner side of the anti-shake module, which can reduce the weight of the focusing module and the driving weight, further reduce the energy consumption of the driving, increase the focusing and zooming speed, and thus increase the use performance, imaging quality and market competitiveness. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 The drawings are sectional views of some exemplary camera modules in the application.

[0025] Figure 2 The drawings are exploded views of some exemplary camera modules in the application.

[0026] Figure 3 The drawings are perspective views of some exemplary camera modules in the application.

[0027] Figure 4 The drawings are exploded views of some exemplary camera modules in the application.

[0028] Figure 5 The drawings are perspective views of some focusing substrates in the application.

[0029] Figure 6 The drawings are exploded views of some exemplary camera modules in the application.

[0030] Figure 7 The drawings are exploded views of some exemplary camera modules in the application.

[0031] Figure 8 The drawings are perspective views of some exemplary camera modules in the application.

[0032] Figure 9 The drawings are enlarged views of part A in the application. Figure 8

[0033] Figure 10 The drawings are exploded views of some exemplary camera modules in the application.

[0034] Figure 11 The drawings are side views of some anti-shake substrates in the application.

[0035] ​In the figure: 101, first side; 102, second side; 103, third side; 104, fourth side; 10, housing; 20, base; 21, base body; 211, body top surface; 212, body bottom surface; 213, body side surface; 2131, first base side wall; 2132, second base side wall; 2133, first groove; 2134, second groove; 22, base protrusion; 30, optical lens; 40, focusing module; 41, focusing carrier; 411, first side wall; 4111, magnet mounting portion; 4112, guide groove; 412, second side wall; 413, third side wall; 414, fourth side wall; 415, mounting cavity; 42, focusing drive assembly; 421, focusing drive magnet; 422, focusing drive coil; 43, focusing substrate; 430, conductive circuit; 431, first focusing through portion; 432, focusing extension portion; 4321, first bending portion; 4322, first extension portion; 4323, second bending portion; 4324, second extension portion; 4325, third bending portion; 433, second focusing through portion; 434, focusing through land; 435, reinforcing member; 44, focusing support portion; 441, support guide rod; 45, focusing position sensing element; 50, anti-shake module; 51, anti-shake carrier; 511, body; 512, first cross beam; 513, second cross beam; 514, third cross beam; 515, fourth cross beam; 52, anti-shake drive assembly; 521, anti-shake drive magnet; 522, anti-shake drive coil; 53, anti-shake substrate; 531, first anti-shake through portion; 532, second anti-shake through portion; 533, connecting portion; 534, anti-shake bending portion; 535, third anti-shake through portion; 5351, anti-shake through land; 54, anti-shake support portion; 541, support ball; 55, anti-shake position sensing element; 60, light sensing assembly; 61, light sensing chip; 62, circuit board; 620, circuit board body; 621, first through portion; 6211, first land set; 622, second through portion; 6221, second land set; 623, connecting band; 624, connector; 63, light filtering element; 64, light filtering element support; 70, adhesive. DETAILED DESCRIPTION

[0036] Hereinafter, the present application will be further described with specific embodiments, it should be noted that the following described embodiments or technical features can be combined to form new embodiments without conflict.

[0037] In the description of the present application, it should be noted that for the orientation words, such as the terms "center", "transverse", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and cannot be understood as limiting the specific protection scope of the present application.

[0038] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and do not necessarily have to describe a specific order or chronological order.

[0039] The terms "include" and "have" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to only those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0040] As shown in Figures 1-11 An embodiment of the present application provides a camera module, comprising: an optical lens 30, a photosensitive assembly 60, a base 20, an adhesive 70, a focusing driving assembly 42, an anti-shake driving assembly 52, a focusing substrate 43 and an anti-shake substrate 53. The optical lens 30 defines an optical axis. The photosensitive assembly 60 comprises a photosensitive chip 61 and a circuit board 62, the photosensitive chip 61 is arranged on and electrically connected to the circuit board 62, and the photosensitive chip 61 is located on an optical path of the optical lens 30 and used for receiving a light signal. The base 20 is arranged above the circuit board 62, and the adhesive 70 is arranged between the circuit board 62 and the base 20 and used for fixing the base 20 and the circuit board 62. The focusing driving assembly 42 is configured to drive the optical lens 30 to move along a direction parallel to the optical axis, so that light converges on the photosensitive chip 61 to realize imaging. One end of the focusing substrate 43 is fixed and electrically connected to the focusing driving assembly 42, and the other end of the focusing substrate 43 is fixed and welded to the circuit board 62 on a first side 101 and the base 20, so as to receive a current signal and realize fast and accurate focusing or zooming operation.

[0041] The anti-shake driving assembly 52 is configured to drive the anti-shake module 50 and move the focusing module 40 along a direction perpendicular to the optical axis, thereby reducing the risk of reducing the imaging quality caused by the camera module shaking; one end of the anti-shake substrate 53 is fixed and electrically connected to the anti-shake driving assembly 52, and the other end of the anti-shake substrate 53 is fixed and welded to the circuit board 62 at the second side 102 opposite to the first side 101 and the base 20, so that the base 20 and the circuit board 62 are subjected to symmetrical tension at the first side 101 and the second side 102, respectively, on the one hand, and the anti-shake driving assembly 52 can transmit instruction signals, so that the anti-shake module 50 is driven in a short time, further enhancing the image anti-shake function.

[0042] It can be understood that the camera module includes an incident light side, an outgoing light side, and a peripheral side, which includes a first side 101, a second side 102, a third side 103, and a fourth side 104, wherein the first side 101 and the second side 102 are opposite sides in the peripheral side. Since the welding position will generate tension due to the solidification shrinkage of the solder, at this time, if the welding position of the focusing substrate 43 and the circuit board 62 and the welding position of the anti-shake substrate 53 and the circuit board 62 are located on two adjacent sides, for example, the first side 101 and the third side 103, the tension generated by the solidification shrinkage of the solder will be concentrated on the adjacent sides of the base 20 and the circuit board 62 or the connecting area between the adjacent sides, thereby causing the risk of uneven stress in the horizontal direction of the base 20 and the circuit board 62, at this time, in the two sides without welding, for example, the second side 102 and the fourth side 104, the circuit board 62 and the base 20 are easy to separate from the adhesive 70, thereby causing the phenomenon of peeling or cracking. It is worth mentioning that in the present application, since the focusing substrate 43 is fixed to the circuit board 62 at the first side 101, and the anti-shake substrate 53 is fixed to the circuit board 62 at the second side 102, which means that the welding position of the focusing substrate 43 and the circuit board 62, and the welding position of the anti-shake substrate 53 and the circuit board 62 are located on opposite sides in the circuit board 62, respectively, which is beneficial to balance the stress generated when the focusing substrate 43, the anti-shake substrate 53, and the circuit board 62 are welded and the tension generated by the solidification shrinkage of the solder, that is, the tension on the opposite sides of the circuit board 62 and the base 20 is symmetrical, thereby reducing the risk of cracking of the adhesive 70, further enhancing the stability and reliability of the camera module, and prolonging the service life. In other words, the structure that the welding position of the anti-shake substrate 53 and the circuit board 62 is located on opposite sides in the circuit board 62 can significantly improve the reliability and stability of the camera module while maintaining the integrity of the electrical connection.

[0043] It is worth mentioning that, as Figures 1-3As shown, the camera module includes a focus module 40 and an anti-shake module 50. The focus module 40 includes a focus drive assembly 42, a focus substrate 43 and a focus carrier 41. The anti-shake module 50 includes an anti-shake drive assembly 52, an anti-shake substrate 53 and an anti-shake carrier 51. In this application, part of the focus module 40 is arranged inside the anti-shake module 50 to reduce the length of the camera module in the first direction, thereby reducing the occupied volume of the camera module, which is conducive to expanding its application scenarios in miniaturized and high-performance electronic devices. At the same time, the focus module 40 arranged inside only needs to drive the optical lens 30 when performing the focusing step, which is conducive to reducing the weight of the focus module 40 and the weight required to be driven, reducing the drive assembly, further reducing the energy consumption of the drive, and increasing the speed of focusing and zooming, thereby increasing the performance, image quality and market competitiveness of capturing dynamic scenes. Furthermore, since the weight required to drive the focus module 40 is relatively small, the optical lens 30 can perform a larger focus movement stroke, thereby increasing the movement stroke of the optical lens 30. On the other hand, due to the reduced weight required for the drive, the focus module 40 can precisely control the drive travel of the optical lens 30, which helps improve the focusing accuracy of the focus module 40 and thus enhance the image quality. Furthermore, since the anti-shake module 50 is located outside the focus module 40, the design of the anti-shake module 50 can be more flexible. Moreover, the anti-shake travel is smaller than the focus travel, making it easier for the anti-shake module 50 to control the movement of the optical lens 30. This helps improve the accuracy of the anti-shake module 50 and reduce over-compensation or under-compensation. On this basis, as users' requirements for shooting quality continue to increase, the requirements for the optical performance of electronic products are also gradually increasing. Therefore, a variable aperture is commonly used in camera modules to improve the user's shooting experience in different lighting conditions. In this application, the focus module 40 is located inside the anti-shake module 50. The focus module 40 can support the relatively heavy variable aperture, achieving the requirements of fast and accurate optical zoom and / or optical focus, thereby enhancing market competitiveness.

[0044] Among them, such as Figure 2 As shown, the optical lens 30 defines an optical axis, which is perpendicular to the second direction and the third direction. The first direction is parallel to the optical axis. Specifically, the first direction is defined as the height direction of the camera module arranged along the Z axis, the second direction is defined as the length direction of the camera module arranged along the X axis, and the third direction is defined as the width direction of the camera module arranged along the Y axis. It is understood that the setting of the coordinate system can be flexibly set according to actual needs and is not limited here.

[0045] In some embodiments, as Figure 4 、 5As shown, the width direction of the focusing substrate 43 is parallel to the first direction, the thickness direction of the focusing substrate 43 is parallel to the second direction, or the third direction, the length of the focusing substrate 43 is the length of the focusing substrate 43 extending around the side of the camera module, and the width of the focusing substrate 43 is greater than the thickness, so as to arrange a sufficient number of conductive lines on the focusing substrate 43. The focusing substrate 43 includes a first focusing conductive part 431 at one end, a second focusing conductive part 433 at the other end, and a focusing extension part 432 between the first focusing conductive part 431 and the second focusing conductive part 433, and the planes where the first focusing conductive part 431, the second focusing conductive part 433, and the focusing extension part 432 are located are all parallel to the first direction; wherein the first focusing conductive part 431 and the second focusing conductive part 433 are respectively located on different sides of the side, the first focusing conductive part 431 is connected to the focusing driving assembly 42, the second focusing conductive part 433 is connected to the base 20 and extends towards the circuit board 62, so that the second focusing conductive part 433 is fixed and electrically connected to the circuit board 62, and the focusing extension part 432 is arranged with a gap on the outer periphery of the anti-shake bearing member 51, and the focusing extension part 432 is bent at least twice on the outer periphery of the anti-shake bearing member 51.

[0046] It can be understood that, since the focusing driving assembly 42 is arranged inside the anti-shake driving assembly 52 in the present application, the focusing substrate 43 arranged on the outer periphery of the anti-shake module 50 needs to be connected to the circuit board 62 and the focusing driving assembly 42 at the same time, and the first focusing conductive part 431 and the second focusing conductive part 433 need to be respectively located on different sides of the side, at the same time, the driving signal of the focusing module 40 needs to be conducted to the outside, so the focusing substrate 43 needs to be bent at least twice, which not only helps to reduce the generated counterforce, but also can optimize the arrangement of the internal components of the camera module and enhance flexibility. Further, since the focusing substrate 43 and the anti-shake substrate 53 are arranged respectively in the present application, i.e., the focusing substrate 43 and the anti-shake substrate 53 are of a split structure, wherein the focusing substrate 43 is electrically connected to the focusing driving assembly 42 and the circuit board 62, and the anti-shake substrate 53 is electrically connected to the anti-shake driving assembly 52 and the circuit board 62, compared with the technical solution of arranging only a single integrated substrate to be electrically connected to the focusing driving assembly 42, the anti-shake driving assembly 52, and the circuit board 62 at the same time, the number of lines for conducting electricity which must be arranged in the split focusing substrate 43 and the anti-shake substrate 53 can be reduced, which helps to reduce the width of the substrate, which makes the counterforce generated when the substrate is driven in the anti-shake step and the focusing step reduced, further reduces the risk of deformation, vibration, or stress concentration of the substrate, and improves the imaging accuracy and reliability of the camera module.

[0047] It is worth mentioning that, since the first side 101, the third side 103, the second side 102 and the fourth side 104 are connected in sequence in the clockwise direction in the camera module, when the focusing substrate 43 is bent twice in the plane where the second direction and the third direction are located, the first focusing through part 431 and the second focusing through part 433 are respectively arranged on the second side 102 and the first side 101, or the third side 103 and the fourth side 104, or the first side 101 and the second side 102, or the fourth side 104 and the third side 103, at this time, the third anti-shake through part 535 of the anti-shake substrate 53 is arranged on the second side 102, or the third side 103, or the first side 101, or the fourth side 104, so that the third anti-shake through part 535 and the second focusing through part 433 are arranged on opposite sides. When the number of bending of the focusing substrate 43 is less than twice, since the focusing substrate 43 is arranged outside the anti-shake bearing 51, the driving of the anti-shake bearing 51 in the second direction and / or the third direction will drive the focusing substrate 43 to move, which is easy to cause deformation, thereby generating an action force overcoming deformation, i.e. a counter force, in the focusing substrate 43. In other words, the action of the counter force will affect the driving effect of the anti-shake driving assembly 52, so it is necessary to reduce the counter force.

[0048] When the focusing substrate 43 is bent three times in the plane where the second direction and the third direction are located, the first focusing through part 431 and the second focusing through part 433 are respectively arranged adjacent to the fourth side 104 and the first side 101, or the second side 102 and the fourth side 104, or the third side 103 and the second side 102, or the first side 101 and the third side 103, at this time, the third anti-shake through part 535 of the anti-shake substrate 53 is arranged on the second side 102, or the third side 103, or the first side 101, or the fourth side 104, so that the third anti-shake through part 535 and the second focusing through part 433 are arranged on opposite sides. It can be understood that, when the number of bending of the focusing substrate 43 increases, the length of the focusing substrate 43 increases, which is beneficial to reduce the counter force generated by the focusing substrate 43.

[0049] In some embodiments, the projection of the focusing substrate 43 along the first direction and the projection of the anti-shake substrate 53 along the first direction do not overlap on the first side 101 and the fourth side 104; the projection of the focusing substrate 43 along the first direction and the projection of the anti-shake substrate 53 along the first direction overlap on the second side 102 and the third side 103. That is, by adjusting the number of bending and the bending direction of the focusing substrate 43, the arrangement of the focusing substrate 43 and the anti-shake substrate 53 inside the camera module can be adjusted, the structure of the focusing substrate 43 and the anti-shake substrate 53 inside the camera module can be simplified, and the space utilization of the camera module can be improved.

[0050] In some embodiments, with reference to Figure 4 and Figure 5It can be seen that the anti-shake module 50 includes an anti-shake carrier 51, the focusing extension 432 further includes a first bending portion 4321, a first extension portion 4322, a second bending portion 4323, a second extension portion 4324, and a third bending portion 4325, the first bending portion 4321 integrally connects the first focusing through portion 431 and the first extension portion 4322, the second bending portion 4323 integrally connects the first extension portion 4322 and the second extension portion 4324, and the third bending portion 4325 integrally connects the second extension portion 4324 and the second focusing through portion 433, so that the first focusing through portion 431 and the second focusing through portion 433 are arranged on the first side 101 and the fourth side 104 of the anti-shake carrier 51, and the first extension portion 4322 and the second extension portion 4324 are arranged on the second side 102 and the third side 103 of the anti-shake carrier 51, wherein the first side 101 and the second side 102 are oppositely arranged along the second direction or the third direction, and the third side 103 and the fourth side 104 are oppositely arranged along the third direction or the second direction.

[0051] By arranging the bent focusing substrate 43 outside the anti-shake carrier 51, the anti-shake carrier 51 can reduce the counteracting force generated by the focusing substrate 43 while electrically connecting the focusing driving assembly 42 and the circuit board 62, thereby further enhancing the stability of the camera module.

[0052] In some embodiments, as shown in Figure 6 The anti-shake substrate 53 includes a first anti-shake through portion 531, a second anti-shake through portion 532, and a third anti-shake through portion 535, wherein the first anti-shake through portion 531 and the second anti-shake through portion 532 are fixed on different sides of the base 20 in the circumferential side, the planes on which the first anti-shake through portion 531 and the second anti-shake through portion 532 are arranged are perpendicular to the first direction, and the plane on which the third anti-shake through portion 535 is arranged is parallel to the first direction. The first anti-shake through portion 531 and the second anti-shake through portion 532 are connected to each other, and the third anti-shake through portion 535 extends from the first anti-shake through portion 531 or the second anti-shake through portion 532 towards the circuit board 62 to be fixed and electrically connected to the circuit board 62; wherein the third anti-shake through portion 535 and the first focusing through portion 431 are located on adjacent sides of the circumferential side, and the third anti-shake through portion 535 and the second focusing through portion 433 are located on opposite sides of the circumferential side. By arranging the third anti-shake through portion 535 on the opposite side of the first focusing through portion 431, the connection position between the anti-shake substrate 53 and the circuit board 62 is arranged on the opposite side of the connection position between the focusing substrate 43 and the circuit board 62, that is, the plane on which the second focusing through portion 433 is arranged is parallel to the plane on which the third anti-shake through portion 535 is arranged, and both are parallel to the first direction, which is beneficial to balance the tension generated during welding, reduce the unilateral stress phenomenon in the camera module, and enhance the reliability and use performance of the camera module.

[0053] In some embodiments, as shown in Figures 5-6As shown, the third anti-shake conducting part 535 has an anti-shake conducting pad 5351, and the second focusing conducting part 433 has a focusing conducting pad 434. The plane on which the anti-shake conducting pad 5351 is located is parallel to the plane on which the focusing conducting pad 434 is located. The top surface of the circuit board 62 has a first pad group 6211 located on the first side 101 and a second pad group 6221 located on the second side 102. The planes on which the anti-shake conducting pad 5351 and the focusing conducting pad 434 are located are perpendicular to the planes on which the first pad group 6211 and the second pad group 6221 are located. The number of the anti-shake conducting pad 5351, the focusing conducting pad 434, the first pad group 6211, and the second pad group 6221 is the same. It can be understood that the anti-shake substrate 53, the focusing substrate 43, and the circuit board 62 are welded together through the welding process to form a connection path of the pads perpendicular to each other, which is conducive to increasing the connection stability of the internal components of the camera module and providing sufficient space for the filler to avoid the risk of virtual welding or short circuit and enhance the use stability and performance of the camera module. However, when the welding position between the third anti-shake conducting part 535 and the circuit board 62 is located on the same side or adjacent side of the welding position between the second focusing conducting part 433 and the circuit board 62, the greater tension generated by welding on one side will further increase the risk of cracking of the adhesive 70 inside the camera module, thereby reducing the reliability of the camera module.

[0054] Therefore, the welding position between the third anti-shake conducting part 535 and the circuit board 62 is located on the opposite side of the welding position between the second focusing conducting part 433 and the circuit board 62, which balances and symmetrizes the tension generated by the solidification and shrinkage of the filler while reducing the risk of unilateral stress of the camera module. Especially when the module undergoes reliability tests such as temperature cycling, dropping, or mechanical impact, the risk of cracking of the circuit board 62, the base 20, and the adhesive 70 is further reduced, and the cracking phenomenon of the glue between each driving component and the photosensitive component 60 can also be reduced.

[0055] In some embodiments, as shown in FIG. 1A, Figure 6 As shown in FIG. 1A, Figure 11 As shown, the anti-shake substrate 53 further includes a connecting part 533 and an anti-shake bending part 534. The connecting part 533 integrally connects the first anti-shake conducting part 531 and the second anti-shake conducting part 532. The anti-shake bending part 534 extends from the outer side of the second anti-shake conducting part 532 along the first direction to integrally connect the second anti-shake conducting part 532 and the third anti-shake conducting part 535. The width of the anti-shake bending part 534 along the second direction is h1, and the width of the third anti-shake conducting part 535 along the second direction is h2, where h1 < 2h2 / 3 and h2 > h1. In other words, the anti-shake bending part 534 can enhance the use stability of the connection between each part of the anti-shake substrate 53 and also help to reduce the counteracting force generated in the anti-shake substrate 53.

[0056] It can be understood that, since the first anti-shake conducting part 531 and the second anti-shake conducting part 532 are arranged on the top surface of the base 20, the third anti-shake conducting part 535 needs to be arranged on the side surface of the base 20 and fixed with the glue on the side surface of the base 20, so the third anti-shake conducting part 535 needs to be bent downward along the first direction from the plane where the first anti-shake conducting part 531 and the second anti-shake conducting part 532 are located, but the bending part, that is, the anti-shake bending part 534, has a large rebound force, which is easy to cause the third anti-shake conducting part 535 to separate from the base 20, thereby affecting the subsequent welding of the third anti-shake conducting part 535 and the circuit board 62.

[0057] It is worth mentioning that, in order to reduce the rebound force of the anti-shake bending part 534, the length h1 of the anti-shake bending part 534 along the second direction can be reduced. On the other hand, in order to ensure that the third anti-shake conducting part 535 and the base 20 have sufficient bonding area for fixation, and that the third anti-shake conducting part 535 and the circuit board 62 have sufficient welding area, the length h2 of the third anti-shake conducting part 535 along the second direction can be increased. Further, since h2 is greater than h1 in the present application, reducing the width of the anti-shake bending part 534 along the second direction is beneficial to reducing the rebound force generated by the anti-shake bending part 534, but the value of h1 cannot be too small to meet the width requirement of the conductive circuit 430 in the anti-shake substrate 53. In other words, by reducing the width of the anti-shake bending part 534 along the second direction, the stiffness coefficient of the anti-shake bending part 534 is smaller, and thus the rebound force is reduced. On the one hand, by increasing the length of the third anti-shake conducting part 535 along the second direction, a larger bonding area can be provided for the bonding of the anti-shake substrate 53, further improving the bonding stability and use performance, thereby avoiding the phenomenon of glue separation between the third anti-shake conducting part 535 and the base 20. On the other hand, it can avoid affecting the welding between the third anti-shake conducting part 535 and the circuit board 62, thereby improving the convenience of subsequent welding processing, and further improving the use reliability and stability of the camera module.

[0058] In some embodiments, the base 20 further comprises a glue storage groove arranged opposite to the bonding position of the focus substrate 43 and the anti-shake substrate 53 along the second direction, for accommodating glue, further increasing the bonding area, and improving the use stability and reliability of the camera module.

[0059] In some embodiments, the second focusing conducting part 433 has a width along a direction perpendicular to the optical axis smaller than a width of the third anti-shake conducting part 535 along a direction perpendicular to the optical axis. It can be understood that, since the second focusing conducting part 433 extends along the first direction towards the base 20, the second focusing conducting part 433 only needs to satisfy the area for fixing with the base 20 and the area for welding with the circuit board 62 along the width perpendicular to the optical axis. As mentioned above, the third anti-shake conducting part 535 needs to be bent downward along the first direction from the plane where the first anti-shake conducting part 531 and the second anti-shake conducting part 532 are located, and the width of the bent anti-shake bending part 534 along the direction perpendicular to the optical axis needs to be small to reduce the rebound force, so the width of the third anti-shake conducting part 535 along the direction perpendicular to the optical axis needs to be increased to ensure that the third anti-shake conducting part 535 has sufficient bonding area with the base 20 and sufficient welding area with the circuit board 62, so as to improve the reliability and stability of the camera module. That is, by making the width of the second focusing conducting part 433 along the direction perpendicular to the optical axis smaller than the width of the third anti-shake conducting part 535 along the direction perpendicular to the optical axis, not only can the second focusing conducting part 433 and the third anti-shake conducting part 535 have sufficient connection strength with the base 20 and the circuit board 62, but also the rebound force of the bent anti-shake substrate 53 can be reduced.

[0060] In some embodiments, as shown in Figure 7 and Figure 10 The circuit board 62 includes a circuit board body 620, a connecting strip 623 and a connector 624. The connecting strip 623 and the connector 624 are located on the third side 103 of the circuit board 62 and integrally connect the circuit board body 620 and the connector 624 along the second direction. The circuit board body 620 is provided with a first conducting part 621 on the first side 101, and the first conducting part 621 is fixed and conducted with the focusing conducting pad 434 through welding, so that the focusing substrate 43 is electrically connected to the circuit board 62. The circuit board body 620 is provided with a second conducting part 622 on the second side 102, and the second conducting part 622 is fixed and conducted with the anti-shake conducting pad 5351 through welding, so that the anti-shake substrate 53 is electrically connected to the circuit board 62. It can be understood that, since the connecting strip 623, the connector 624, the first pad group 6211 and the second pad group 6221 are respectively connected to different sides of the circuit board body 620, it is beneficial to optimize the wiring inside the camera module, reduce the intersection and interference in the signal transmission path, and further improve the overall signal transmission quality of the camera module. On the other hand, it is also possible to optimize the structural arrangement inside the camera module to avoid the phenomenon of space conflict between the connecting strip 623, the anti-shake module 50 and the focusing module 40, further improve the overall layout in the camera module, and improve the portability and use performance of the camera module.

[0061] In some embodiments, with reference toFigure 6 It can be known that the focusing module 40 comprises the focusing carrier 41, the focusing driving assembly 42 comprises the focusing driving magnet 421 and the focusing driving coil 422 which are oppositely arranged along the second direction, the focusing driving magnet 421 is arranged at one side of the focusing carrier 41, and the focusing driving coil 422 is arranged at one side of the anti-vibration carrier 51, wherein the focusing driving coil 422 is arranged between the focusing driving magnet 421 and the first focusing conduction part 431 along the second direction; the anti-vibration driving assembly 52 comprises at least one anti-vibration driving magnet 521 and at least one anti-vibration driving coil 522 which are oppositely arranged along the first direction, the anti-vibration driving magnet 521 and the focusing driving coil 422 are arranged at different sides of the anti-vibration carrier 51, the anti-vibration driving coil 522 is arranged at the base 20, and the anti-vibration substrate 53 is electrically connected to the circuit board 62, so as to drive the anti-vibration carrier 51 to move along the second direction and / or the third direction. By arranging the focusing driving assembly 42 and the anti-vibration driving assembly 52, the focusing carrier 41 and the anti-vibration carrier 51 can be driven respectively, which is beneficial to further reduce the driving weight and energy consumption during focusing driving, so as to realize fast focusing and / or fast zooming. Moreover, such fast response is very important for capturing dynamic scenes, which can ensure that the image remains clear during zooming.

[0062] In some embodiments, as shown in Figure 4 The focusing module 40 further comprises the focusing support part 44, which is arranged at the fourth side 104 of the focusing carrier 41 and is arranged at the corner of the focusing carrier 41 along the third direction, so as to support the focusing carrier 41 inside the anti-vibration carrier 51, which is beneficial to improve the mounting stability of the components inside the camera module.

[0063] In some embodiments, the focusing support part 44 is a support guide rod 441, which is used to support the focusing carrier 41 inside the anti-vibration carrier 51, and the focusing carrier 41 comprises guide grooves 4112 arranged at both sides of the first side wall 411, which are used to accommodate the support guide rod 441, so as to provide stable support force in the first direction.

[0064] In some embodiments, the focusing module 40 further comprises the focusing position sensing element 45, which is used to detect the real-time position of the optical lens 30 during focusing, so as to enhance the imaging quality of the camera module.

[0065] In some embodiments, referring to Figures 3-6It can be known that the anti-shake carrier 51 comprises a main body 511, and a first cross beam 512, a second cross beam 513, a third cross beam 514 and a fourth cross beam 515 arranged in sequence along the circumferential direction, wherein the first cross beam 512 and the third cross beam 514 are oppositely arranged along the second direction, and the second cross beam 513 and the fourth cross beam 515 are oppositely arranged along the third direction, wherein the focusing substrate 43 is mounted on the outer circumferential side of the main body 511, and the focusing driving coil 422 is mounted on the first cross beam 512; the anti-shake driving magnet 521 is mounted on the second cross beam 513 and / or the third cross beam 514 to drive the anti-shake carrier 51 to move along the second direction and / or the third direction; the main body 511 is provided with a first support groove, and the first support groove is located on both sides of the first cross beam 512 and is adapted to the installation of the focusing support part 44; and the focusing carrier 41 comprises a mounting cavity 415, a first side wall 411, a second side wall 412, a third side wall 413 and a fourth side wall 414 arranged in sequence along the circumferential direction, wherein the first side wall 411 and the third side wall 413 are oppositely arranged along the second direction, and the second side wall 412 and the fourth side wall 414 are oppositely arranged along the third direction, and the focusing driving magnet 421 is arranged on the magnet mounting part 4111 recessed on the first side wall 411, so that the focusing driving magnet 421, the focusing driving coil 422 and the first focusing through part 431 are arranged in sequence along the second direction on the first side 101 of the focusing carrier 41. By arranging the focusing driving assembly 42 and the anti-shake driving assembly 52 under each cross beam or on the side surface of the anti-shake carrier 51, the occupied space of the internal components of the camera module can be reduced, and the compactness of the structure can be increased.

[0066] In some embodiments, as shown in Figure 5 The bending angle at the bending part in the focusing substrate 43 is 90°±5°, which is beneficial to reduce the degree of protrusion at the bending part, reduce the risk of contact interference with the camera module shell 10, improve the bending strength, facilitate the control of the bending angle, and further enhance the imaging quality and use performance of the camera module.

[0067] In some embodiments, as shown in Figure 5The dashed line part shown in the figure is provided with a conductive circuit 430 in the focusing substrate 43, and the number of the conductive circuit 430 is not more than 4, specifically, the number of the conductive circuit 430 is 1, or 2, or 3, or 4. It is worth mentioning that since the focusing substrate 43 and the anti-shake substrate 53 are separately arranged in the present application, the number of the conductive circuit 430 arranged in the single focusing substrate 43 can be reduced to further reduce the width of the bending part, so as to reduce the repulsive force generated in the focusing substrate 43 and improve the driving performance of the camera module. On the other hand, when the number of the conductive circuit 430 is not symmetrical with the number of the pads, it will increase the risk of causing interlayer crosstalk, signal delay difference and welding misplacement. Therefore, by reducing the number of the conductive circuit 430, the number of the anti-shake through pad 5351 and the focusing through pad 434 can be reduced, so as to improve the overall signal integrity and assembly yield of the circuit board 62, simplify the wiring design of the conductive circuit 430, further reduce the occupied space of the camera module, and reduce the production cost.

[0068] In some embodiments, the focusing substrate 43 further comprises a reinforcing member 435, at least a part of the reinforcing member 435 is attached to the outer side of the bending part of the focusing extension 432, and another part of the reinforcing member 435 extends along the second direction and / or the third direction, so that the reinforcing member 435 is attached to the connection between the bending part of the focusing extension 432 and the straight part of the focusing extension 432. It can be understood that by arranging the reinforcing member 435 on the outer periphery of the bending part, the mechanical strength of the focusing substrate 43 at the bending part is increased, the bending angle is controlled, and the risk of damage and fracture is reduced. The reinforcing member 435 can be a metal sheet to further increase the bending strength.

[0069] In some embodiments, the width of the reinforcing member 435 along the first direction is not more than the width of the bending part of the focusing extension 432 along the first direction, and the width of the extension and the bending part along the first direction is not less than 0.8 mm and not more than 1 mm. It is worth mentioning that since the conductive circuit 430 in the focusing substrate 43 needs to be grounded, the width should not be too small to maintain good signal transmission quality and enhance the use performance of the camera module.

[0070] In some embodiments, as shown in FIG. 6, the focusing substrate 43 further comprises a focusing extension 432, the focusing extension 432 is arranged on the focusing substrate 43, and the focusing extension 432 comprises a straight part and a bending part, the bending part is arranged on the straight part, and the bending part is arranged to be perpendicular to the straight part. Figure 6 、 Figure 8 and Figure 9It can be known that the base 20 comprises a base body 21 and a base protrusion 22, the base protrusion 22 extends from one side of the base body 21 to the light entry side, the second focusing through hole 433 is fixed to the base protrusion 22, the base body 21 is further provided with a body top surface 211, a body bottom surface 212 and a body side surface 213, the body top surface 211 supports the anti-shake carrier 51, the second focusing through hole 433 and the third anti-shake through hole 535 are arranged on opposite sides of the body side surface 213, and the body bottom surface 212 is bonded to the circuit board 62 through the adhesive 70. By arranging the base protrusion 22, the contact area of the second focusing through hole 433 and the base 20 is increased, a stable supporting force is provided for the connection between the second focusing through hole 433 and the circuit board 62, and the precision during welding is further increased.

[0071] In some embodiments, the base 20 comprises a first base side wall 2131 located at the first side 101 and a second base side wall 2132 located at the second side 102, the first base side wall 2131 has a first groove 2133 recessed towards the optical axis, the second base side wall 2132 has a second groove 2134 recessed towards the optical axis, and the circuit board 62 closes the openings at the bottoms of the first groove 2133 and the second groove 2134; the focusing through hole pad 434 and the first pad group 6211 are exposed to the first groove 2133, the anti-shake through hole pad 5351 and the second pad group 6221 are exposed to the second groove 2134, solder is arranged in the first groove 2133 and the second groove 2134 to fix and electrically connect the focusing through hole pad 434 and the first pad group 6211, and the first pad group 6211 is arranged in the first groove 2133, and the anti-shake through hole pad 5351 and the second pad group 6221 are fixed and electrically connected, and the second pad group 6221 is arranged in the second groove 2134; the adhesive 70 is arranged between the top surface of the circuit board 62 and the bottom surface of the base 20, solder is arranged in the first groove 2133 to weld the first pad group 6211 and the focusing through hole pad 434 in conduction, and solder is arranged in the second groove 2134 to weld the second pad group 6221 and the anti-shake through hole pad 5351 in conduction. By arranging the first groove 2133 and the second groove 2134 in the base 20, the focusing through hole pad 434 and the anti-shake through hole pad 5351 are avoided, and the solder arranged in the grooves is used for the welding step.

[0072] In some embodiments, as Figure 6As shown, the anti-shake module 50 further comprises anti-shake support portions 54, which are located at at least three corners of the anti-shake module 50 and are spaced between the top surface 211 of the main body and the bottom surface of the anti-shake carrier 51, so as to movably support the anti-shake module 50 above the base 20, further enhancing the anti-shake performance, use reliability and use accuracy of the camera module. In at least one embodiment, the anti-shake support portions 54 are located at the corners formed by the first side 101 and the third side 103 of the anti-shake module 50, the corners formed by the second side 102 and the third side 103, and the corners formed by the second side 102 and the fourth side 104.

[0073] In some embodiments, the main body 511 portion in the anti-shake carrier 51 is provided with a support groove on the side close to the base 20 for accommodating the anti-shake support portions 54, wherein the anti-shake support portions 54 are support ball 541 structures. It can be understood that, due to the small friction of the support ball 541 structure, less energy is consumed when driving the anti-shake carrier 51, thereby reducing the power consumption of the entire camera module and prolonging the use time.

[0074] In some embodiments, the anti-shake module 50 further comprises an anti-shake position sensing element 55 for detecting the position offset of the optical lens 30 caused by device vibration and the like, enhancing the imaging quality of the camera module.

[0075] In some embodiments, as shown, Figure 1 The camera module further comprises a filter element 63, a filter element support 64 and electronic elements, the filter element support 64 is arranged on the circuit board 62 to support the filter element 63, so that the filter element 63 is arranged opposite to the photosensitive chip 61 along the first direction; the electronic elements are electrically connected to the chip circuit board 62. It is worth mentioning that, by supporting the filter element 63 through the filter element support 64, displacement or shaking phenomenon can be avoided during use, which is conducive to maintaining the stability of the optical path, further enhancing the imaging quality and use performance of the camera module.

[0076] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: An optical lens defines an optical axis; A photosensitive component, comprising a photosensitive chip and a circuit board, wherein the photosensitive chip is arranged and electrically connected to the circuit board, and the photosensitive chip is located on the optical path of the optical lens; A base, the circuit board is fixed below the base; An anti-shake bearing component is provided above the base; An adhesive is provided between the circuit board and the base; a focus drive assembly and an anti-shake drive assembly, wherein the focus drive assembly is configured to drive the optical lens to move in a direction parallel to the optical axis, and the anti-shake drive assembly is configured to drive the optical lens to move in a direction perpendicular to the optical axis; a focus substrate and an anti-shake substrate, wherein the focus substrate is annularly mounted on the outer periphery of the anti-shake carrier with a gap therebetween, the focus substrate being bent at least twice on the outer periphery of the anti-shake carrier, one end of the focus substrate being fixed to and electrically connected to the focus drive assembly, and the other end of the focus substrate being fixed to the base on a first side and welded to the circuit board; One end of the anti-shake substrate is fixed and electrically connected to the anti-shake driving assembly, and the other end of the anti-shake substrate is fixed to the base on the second side and welded to the circuit board, so that the base and the circuit board are subjected to symmetrical pulling forces on the first side and the second side respectively; the camera module includes a first side, a second side, a third side and a fourth side located on the peripheral side, and the first side and the second side are opposite sides; the focus substrate includes a second focus conductive part fixed to the base and welded to the circuit board, the anti-shake substrate includes a third anti-shake conductive part fixed to the base and welded to the circuit board, the first side, the second side, the third side and the fourth side are located on the peripheral side, and the first side and the second side are located on the opposite sides; the focus substrate includes a second focus conductive part fixed to the base and welded to the circuit board, and the anti-shake substrate includes a third anti-shake conductive part fixed to the base and welded to the circuit board. The plane where the second focusing conductive portion is located is parallel to the plane where the third anti-shake conductive portion is located, and both are parallel to the direction of the optical axis; wherein the width of the second focusing conductive portion in the direction perpendicular to the optical axis is smaller than the width of the third anti-shake conductive portion in the direction perpendicular to the optical axis; the anti-shake substrate further includes a first anti-shake conductive portion and a second anti-shake conductive portion electrically connected to the anti-shake driving component, and the third anti-shake conductive portion is bent downward along the optical axis from the plane where the first anti-shake conductive portion and the second anti-shake conductive portion are located, and the plane where the first anti-shake conductive portion and the second anti-shake conductive portion are located is perpendicular to the plane where the third anti-shake conductive portion is located.

2. The camera module according to claim 1, wherein: The anti-shake substrate also includes an anti-shake bent portion, one end of which is connected to the first anti-shake conductive portion or the second anti-shake conductive portion, and the other end is connected to the third anti-shake conductive portion; wherein the width of the anti-shake bent portion along the direction perpendicular to the optical axis is h1, the width of the third anti-shake conductive portion along the direction perpendicular to the optical axis is h2, and h1<h2.

3. The camera module according to claim 2, wherein: The third anti-shake conductive portion has an anti-shake conductive pad, and the second focus conductive portion has a focus conductive pad. The plane where the anti-shake conductive pad is located is parallel to the plane where the focus conductive pad is located; the top surface of the circuit board has a first pad group located on the first side and a second pad group located on the second side, and the plane where the anti-shake conductive pad and the focus conductive pad are located is perpendicular to the plane where the first pad group and the second pad group are located; wherein the number of the anti-shake conductive pads, the focus conductive pads, the first pad group and the second pad group is the same.

4. The camera module according to claim 3, wherein: The base includes a first base sidewall located on the first side and a second base sidewall located on the second side, the first base sidewall having a first groove recessed toward the optical axis, the second base sidewall having a second groove recessed toward the optical axis, and the circuit board enclosing openings at the bottoms of the first groove and the second groove; The focus conductive pad and the first pad group are exposed in the first groove, the anti-shake conductive pad and the second pad group are exposed in the second groove, and solder is set in the first groove and the second groove to fix and electrically connect the focus conductive pad and the first pad group, and to fix and electrically connect the anti-shake conductive pad and the second pad group.

5. The camera module according to claim 3, wherein: The circuit board includes a circuit board body, a connecting strip and a connector, the connecting strip connects the connector and the circuit board body, and the connecting strip and the connector are located on the third side; the first solder pad group and the second solder pad group are arranged on the circuit board body, and the first solder pad group, the second solder pad group, the connecting strip and the connector are respectively located on different sides of the circuit board body.

6. The camera module according to claim 4, wherein: The camera module includes an anti-shake module, which includes the anti-shake carrier, the anti-shake drive assembly and the anti-shake substrate. The focus substrate is parallel to the optical axis. The focus substrate includes a first focus conductive portion located at one end, a second focus conductive portion located at the other end and a focus extension portion located between the first focus conductive portion and the second focus conductive portion; wherein, the first focus conductive portion and the second focus conductive portion are respectively located on different sides of the peripheral side, the first focus conductive portion is fixed to the anti-shake carrier, the second focus conductive portion is fixed to the base and extends toward the circuit board to be fixed and electrically connected to the circuit board, the focus extension portion is located on the periphery of the anti-shake carrier and has a gap between the anti-shake carrier, and the focus extension portion is bent at least twice on the periphery of the anti-shake carrier.

7. The camera module according to claim 6, wherein: The anti-shake substrate includes a first anti-shake conductive portion, a second anti-shake conductive portion and the third anti-shake conductive portion, wherein the first anti-shake conductive portion and the second anti-shake conductive portion are fixed to the base on different sides of the peripheral side, the first anti-shake conductive portion and the second anti-shake conductive portion are connected to each other, and the third anti-shake conductive portion extends from the first anti-shake conductive portion or the second anti-shake conductive portion toward the circuit board to be fixed and electrically connected to the circuit board; wherein the third anti-shake conductive portion and the first focus conductive portion are located on adjacent sides of the peripheral side, and the third anti-shake conductive portion and the second focus conductive portion are located on opposite sides of the peripheral side.

8. The camera module according to claim 6, wherein: The focus extension portion further includes a first bending portion, a first extension portion, a second bending portion, a second extension portion and a third bending portion, the first bending portion integrally connects the first focus conductive portion and the first extension portion, the second bending portion integrally connects the first extension portion and the second extension portion, and the third bending portion integrally connects the second extension portion and the second focus conductive portion, so that the first focus conductive portion and the second focus conductive portion are arranged on the first side and the fourth side of the anti-shake support component, the first extension portion and the second extension portion are arranged on the second side and the third side of the anti-shake support component, wherein the first side and the second side are arranged relative to each other along the second direction or the third direction, the third side and the fourth side are arranged relative to each other along the third direction or the second direction, and the first direction is parallel to the optical axis, and the second direction and the third direction are orthogonal to the first direction.

9. The camera module according to claim 6, wherein: The camera module also includes a focusing module, which includes the focusing drive assembly, the focusing substrate and the focusing carrier, the focusing drive assembly includes a focusing drive magnet and a focusing drive coil arranged relative to each other along a first direction perpendicular to the first direction, the focusing drive magnet is arranged on one side of the focusing carrier, and the focusing drive coil is arranged on one side of the anti-shake carrier, wherein the focusing drive coil is arranged between the focusing drive magnet and the first focusing conductive portion along the second direction; the anti-shake drive assembly includes at least one anti-shake drive magnet and at least one anti-shake drive coil arranged relative to each other along the first direction, the anti-shake drive magnet and the focusing drive coil are arranged on opposite sides of the anti-shake carrier, the anti-shake drive coil is arranged on the base, and the anti-shake substrate is electrically connected to the circuit board to drive the anti-shake carrier to move along the second direction and / or the third direction.

10. The camera module according to claim 6, wherein: The focusing substrate further includes a reinforcement member, at least a portion of the reinforcement member is attached to the outer periphery of the bent portion of the focusing extension portion, and another portion of the reinforcement member extends along the second direction and / or the third direction, such that the reinforcement member is attached to the connection between the bent portion of the focusing extension portion and the extending portion of the focusing extension portion; Conductive circuits are provided in the focusing substrate, and the number of the conductive circuits is no more than 4. The width of the reinforcing member along the first direction is no more than the width of the bent portion of the focusing extension portion along the first direction.

11. The camera module according to claim 1, wherein: The projection of the focusing substrate along the first direction does not overlap with the projection of the anti-shake substrate along the first direction on the first side and the fourth side; the projection of the focusing substrate along the first direction overlaps with the projection of the anti-shake substrate along the first direction on the second side and the third side.

12. The camera module according to claim 6, wherein: The base includes a base body and a base protrusion, the base protrusion extends from one side of the base body toward the second focus conductive portion, the base protrusion supports the second focus conductive portion along a first direction, the base body is further provided with a main body top surface, a main body bottom surface and a main body side surface, the main body top surface supports the anti-shake carrier, the second focus conductive portion and the third anti-shake conductive portion are arranged on opposite sides of the main body side surface, and the main body bottom surface is bonded to the circuit board by an adhesive.

13. The camera module according to claim 9, wherein: The focus module further includes a focus support portion, the anti-shake bearing component includes a main body, and a first beam, a second beam, a third beam, and a fourth beam sequentially arranged along a circumferential direction, wherein the first beam and the third beam are arranged opposite to each other along a second direction, and the second beam and the fourth beam are arranged opposite to each other along a third direction, wherein the focus substrate is annularly mounted on the outer circumference of the main body, the focus drive coil is mounted on the first beam; the anti-shake drive magnet is mounted on the second beam and / or the third beam; the main body is provided with a first support groove, the first support groove is located on both sides of the first beam, and the first support groove is adapted to the installation of the focus support portion; and The focusing carrier includes a mounting cavity, a first side wall, a second side wall, a third side wall and a fourth side wall arranged in sequence along the circumferential direction, wherein the first side wall and the third side wall are arranged opposite to each other along the second direction, and the second side wall and the fourth side wall are arranged opposite to each other along the third direction, and the focusing drive magnet is arranged on the first side wall, so that the focusing drive magnet, the focusing drive coil and the first focusing conductive part are arranged in sequence on the first side of the focusing carrier along the second direction.

14. The camera module according to claim 12, wherein: The base is further provided with a glue storage tank, which is arranged along the second direction at the joints between the base, the focusing substrate and the anti-shake substrate, and is used to accommodate glue.

Images