Chip packaging structure, camera module and preparation method

Abstract

The invention relates to the field of chip packaging, and provides a chip packaging structure, a camera module and a preparation method. The chip packaging structure comprises a substrate, a chip and a heat dissipation conduit assembly. The heat dissipation guide pipe assembly comprises a heat dissipation guide pipe, the chip near end of the heat dissipation guide pipe is aligned with a preset hot spot area of the chip for thermal coupling, and the chip far end is used for leading out heat of the chip. According to the invention, direct thermal coupling is established between the predetermined hot spot area on the back surface of the chip and the near-chip end of the heat dissipation conduit, and the heat is exported by using the heat dissipation conduit, so that a low-thermal-resistance and high-efficiency heat exporting special channel starting from a core heat source of the chip can be constructed; compared with a mode that heat needs to be slowly conducted through a whole chip body or a packaging material in traditional packaging, the heat dissipation efficiency of the chip is remarkably improved, particularly, the temperature peak value of a specific hot spot area when the chip works can be effectively restrained, and the performance and the working stability of the chip are improved.

Description

Technical Field

[0001] The present application relates to the field of chip packaging, and in particular to a chip packaging structure, a camera module, and a preparation method thereof. Background Art

[0002] With the continuous development of electronic devices, chip packaging technology has become a critical link in ensuring the stable operation of high-performance chips. In particular, high-power chips are increasingly used in modern electronic devices, and their heat dissipation directly affects the overall performance and reliability of the device. Well-designed chip packaging heat dissipation design not only effectively reduces chip operating temperatures but also significantly improves system efficiency and lifespan, thereby meeting consumer demand for high performance and high reliability.

[0003] To address chip heat generation, the industry generally employs a variety of heat dissipation methods. For example, internal heat sinks are added to expand the heat dissipation area, heat is removed by air convection, or heat is conducted to the device casing. Other methods include optimizing the thermal conductivity of packaging materials and employing complex airflow cooling systems. While these methods alleviate chip heat dissipation issues to a certain extent, they often require complex structural designs or rely on additional power sources, increasing system complexity and cost.

[0004] However, these conventional methods still have significant limitations when dealing with high-heat chips that consume over 1.5W of power. Due to the limited efficiency of traditional cooling methods, hot spots can easily form on the chip, impacting device performance (such as increased image noise) and long-term reliability. Especially for high-power chips that require precise control of hot spots, these technologies struggle to provide an efficient and reliable cooling solution. Summary of the Invention

[0005] In order to effectively suppress hot spots of high-power chips and improve the uniformity of chip heat dissipation, the present application provides a chip packaging structure, a camera module and a preparation method.

[0006] On the one hand, a chip packaging structure is provided, which adopts the following technical solution: A chip packaging structure, comprising: substrate; a chip located on the substrate, the chip having a first surface and a second surface opposite to the first surface; The heat dissipation pipe assembly includes a heat dissipation pipe having a near-chip end and a far-chip end. The near-chip end is thermally coupled to a predetermined hot spot area on the second surface of the chip, and the far-chip end is used to conduct heat from the chip.

[0007] By adopting the above technical solution, by establishing direct thermal coupling between the predetermined hotspot area on the back of the chip and the near-chip end of the heat dissipation pipe, and using the heat dissipation pipe to conduct heat away, a low-thermal-resistance, high-efficiency dedicated heat dissipation channel can be constructed starting from the core heat source (hotspot) of the chip. Compared with the traditional packaging method in which heat needs to be slowly conducted through the entire chip body or packaging material, this significantly improves the chip's heat dissipation efficiency. In particular, it can effectively suppress the temperature peak in specific hotspot areas when the chip is working, thereby improving chip performance and operating stability.

[0008] Optionally, a heat-conducting interface portion is provided between the chip-proximal end of the heat dissipation pipe and the second surface of the chip.

[0009] The above technical solution, by providing a thermally conductive interface between the end of the heat dissipation pipe near the chip and the second surface of the chip (hotspot area), can effectively fill the tiny gap between the two caused by microscopic surface unevenness, reducing the contact thermal resistance, further improving the heat transfer efficiency from the chip hotspot area to the heat dissipation pipe, and ensuring that heat can enter the heat dissipation pipe more smoothly.

[0010] Optionally, the material of the heat-conducting interface portion includes one of thermal grease, metal solder, and phase change material.

[0011] The above technical solution specifies that the thermal interface part uses thermal grease, metal solder or phase change material, which have good thermal conductivity or specific thermal management functions. This ensures that the thermal interface part can reliably achieve low thermal resistance thermal connection, ensures efficient heat transfer from the chip hotspot to the heat dissipation pipe, and provides material-level protection for the overall heat dissipation performance.

[0012] Optionally, the phase change temperature point of the phase change material is set to be lower than the maximum allowable operating temperature of the chip, wherein the phase change material reduces the thermal resistance of the thermal coupling interface or absorbs latent heat when the phase change occurs, so as to enhance the heat transfer efficiency from the second surface of the chip to the heat dissipation pipe.

[0013] This technical solution utilizes a phase-change material that undergoes a phase change at a specific temperature (when the hotspot temperature rises). This prevents excessive cooling of the chip at normal operating temperatures, which could impact its performance. Furthermore, the material's state change reduces interfacial thermal resistance, improving thermal conductivity. By absorbing the latent heat of the phase change, the material buffers rapid temperature increases, effectively addressing transient high temperatures in hotspots. This enables dynamic response and intelligent control of chip hotspot temperatures, improving the thermal management and robustness of the package structure under dynamic loads or transient high-temperature shocks.

[0014] Optionally, the predetermined hot spot area is determined through thermal simulation or actual measurement.

[0015] By adopting the above technical solution, the hot spot area is accurately determined through thermal simulation or actual measurement, ensuring that the heat dissipation pipe can be accurately aligned with the actual core heating position on the chip for thermal coupling, avoiding the low efficiency or waste of resources that may be caused by blind placement or full coverage, maximizing the advantages of the heat dissipation of the heat dissipation pipe, and improving the accuracy and effectiveness of the heat dissipation solution.

[0016] Optionally, the substrate has a through hole, the position of the through hole corresponds to the position of the predetermined hot spot area, and the heat dissipation pipe passes through the through hole and is connected to the heat dissipation area.

[0017] This technical solution creates through-holes in the substrate corresponding to hotspots and connects heat pipes through these holes to the heat dissipation area. This provides a more direct, low-resistance physical path through the substrate for heat dissipation from the chip hotspots. This reduces the thermal resistance of heat diffusion in the substrate plane, improves the efficiency of vertical heat dissipation, and facilitates rapid heat transfer to the other side of the substrate or a designated heat dissipation area.

[0018] Optionally, the chip-far end of the heat dissipation pipe is connected to a heat sink.

[0019] Using the above technical solution, the far-chip end of the heat pipe is connected to the radiator, ensuring that the heat efficiently transferred by the heat pipe can be effectively received and dissipated by specialized heat dissipation components (such as heat sinks, heat spreaders, equipment housings, etc.), avoiding heat accumulation at the end of the output path, and forming a complete and efficient thermal management chain from the chip hotspot to the final heat dissipation.

[0020] Optionally, the heat sink is arranged on the back side of the substrate.

[0021] By adopting the above technical solution, the radiator is arranged on the back of the substrate, so that the heat passing through the substrate through the heat dissipation pipe can be directly transferred to the adjacent radiator, which is conducive to achieving a compact packaging structure layout and facilitating the final dissipation of heat to the external environment of the package body.

[0022] On the other hand, a camera module is provided, comprising the chip packaging structure.

[0023] By adopting the above-mentioned technical solution and applying a chip packaging structure with efficient hotspot heat dissipation capabilities to the camera module, the operating temperature of core chips such as the image sensor (CMOS) or image signal processor (ISP) can be effectively reduced, especially the hotspot temperature can be suppressed, thereby significantly reducing image thermal noise, improving image quality, ensuring the stable operation of the module under high loads such as high resolution and high frame rate, and extending its service life.

[0024] In another aspect, a method for preparing the chip packaging structure is provided, comprising: Determine a predetermined hot spot area on the second surface of the chip based on thermal simulation or actual measurement results, and set a heat dissipation pipe assembly at the predetermined hot spot area, the heat dissipation pipe assembly including a heat dissipation pipe, wherein the chip-proximal end of the heat dissipation pipe is thermally coupled to the predetermined hot spot area; Providing a substrate, wherein the substrate is provided with a through hole corresponding to the position of the predetermined hot spot area; The second surface of the chip is disposed on the substrate, wherein the heat dissipation pipe 31 passes through the through hole, and the end of the heat dissipation pipe far from the chip is connected to the heat sink.

[0025] The above technical solution, by first identifying the hotspot and then precisely placing the heat dissipation pipe, utilizing a substrate with through-holes and connecting the pipe to the heat sink through the through-holes, reliably manufactures a chip package structure with the heat dissipation pipe precisely aligned with the chip hotspot and an efficient external heat dissipation path (through the substrate to the heat sink). This ensures the feasibility of the chip package structure and effectively demonstrates the design's heat dissipation advantages in actual products.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. By establishing direct thermal coupling between a predetermined hotspot on the back of the chip and the near-chip end of the heat pipe, and using the heat pipe to conduct heat away, a low-resistance, high-efficiency dedicated heat dissipation channel is constructed from the chip's core heat source (hotspot). Compared to traditional packaging, where heat must be slowly conducted through the entire chip body or packaging material, this significantly improves the chip's heat dissipation efficiency. In particular, it effectively suppresses temperature peaks in specific hotspots during chip operation, improving chip performance and operational stability. 2. Phase change materials undergo phase changes at specific temperatures (when hotspot temperatures rise). This prevents overcooling of the chip at normal operating temperatures, which can affect its performance. Furthermore, the material's state change reduces interfacial thermal resistance, improves thermal conductivity, and absorbs latent heat from the phase change to buffer rapid temperature increases, effectively addressing transient high temperatures in hotspots. This enables dynamic response and intelligent control of chip hotspot temperatures, improving the thermal management and robustness of the package structure under dynamic loads or transient high-temperature shocks. 3. Placing the heat sink on the back of the substrate allows heat passing through the substrate via the heat pipe to be directly transferred to the adjacent heat sink, which is conducive to achieving a compact package structure layout and facilitating the ultimate dissipation of heat to the external environment of the package. 4. Applying chip packaging structures with efficient hotspot heat dissipation capabilities to camera modules can effectively reduce the operating temperature of core chips such as image sensors (CMOS) or image signal processors (ISPs), especially suppressing their hotspot temperatures. This significantly reduces image thermal noise, improves image quality, ensures stable operation of the module under high loads such as high resolution and high frame rate, and extends its service life. 5. By first identifying the hotspot and then precisely placing the heat dissipation pipe, utilizing a substrate with through-holes, and connecting the pipe through the through-holes to the heat sink, a chip package structure can be reliably manufactured with the heat dissipation pipe precisely aligned with the chip hotspot and an efficient external heat dissipation path (through the substrate to the heat sink). This ensures the feasibility of the chip package structure and effectively demonstrates the design's heat dissipation advantages in actual products. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a planar schematic diagram of the chip packaging structure of Example 1 of the present application; Figure 2 It is along Figure 1 Schematic diagram of the cross section along line AA; Figure 3 is a planar schematic diagram of the chip packaging structure of Example 2 of the present application; Figure 4 It is along Figure 3 Schematic diagram of the cross section along line AA; Figure 5 3 is a schematic structural diagram of a camera module according to Example 3 of the present application; Figure 6 It is a flow chart of the chip packaging structure preparation method of Example 4 of the present application.

[0028] Explanation of the reference numerals: 10, substrate; 11, through hole; 20, chip; 21, first surface; 22, second surface; 30, heat dissipation pipe assembly; 31, heat dissipation pipe; 31a, near-chip end; 31b, far-chip end; 40, thermal interface portion; 51, lens; 52, bracket; 52a, light hole; 53, filter; 54, heat sink. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1 —6 Further explain this application in detail.

[0030] Example 1 Figure 1 It is a planar schematic diagram of the chip packaging structure of Example 1 of the present application. Figure 2 It is along Figure 1 Schematic diagram of the cross section along the AA line. Figure 1 and Figure 2The embodiment of the present application discloses a chip packaging structure, including a substrate 10, a chip 20 and a heat dissipation pipe assembly 30.

[0031] The substrate 10 is provided with at least one through-hole 11 for passage of a heat dissipation pipe 31. The first surface 21 of the chip 20 is provided with an active area (not shown), and the second surface 22 of the chip 20 is disposed on the substrate 10. The heat dissipation pipe assembly 30 includes at least one heat dissipation pipe 31. The chip-proximal end 31a of the heat dissipation pipe 31 is thermally coupled to at least one predetermined hotspot area of ​​the chip 20, while the chip-distal end 31b is used to conduct heat away. The predetermined hotspot area can be determined through thermal simulation or actual measurement.

[0032] The heat dissipation conduit 31 can be a solid structure, a hollow tubular structure, or a structure containing a working medium phase change cavity. The heat dissipation conduit 31 can be made of a highly thermally conductive material such as copper, aluminum, graphite, pyrolytic graphite sheets, or diamond. For example, copper has a thermal conductivity of approximately 400 W / mK; aluminum has a thermal conductivity of approximately 237 W / mK; graphite has an in-plane thermal conductivity exceeding 1000 W / mK; pyrolytic graphite sheets offer even better thermal conductivity; and diamond offers the best thermal conductivity.

[0033] The heat pipe 31 can be designed in the form of a solid column / strip, flat ribbon, hollow tube (heat pipe), flat plate (vapor chamber), or an array of micro-heat pipes, depending on actual needs. The connection between the chip-proximal end 31a of the heat pipe 31 and the second surface 22 of the chip 20 can be achieved using a highly thermally conductive adhesive, soldering, or a press-fit thermal interface material (TIM) to achieve a low-thermal-resistance connection. For example, when using Sn-Ag-Cu low-temperature solder as the connection material, the target thermal resistance can be controlled to less than 0.1°C·cm² / W.

[0034] The chip-distal end 31b of the heat pipe 31 can extend outside the package or connect to a low-resistance heat dissipation path inside or outside the package, such as a substrate heat dissipation area, an external heat sink, or a device frame. The chip-distal end 31b of the heat pipe 31 can be treated in a variety of ways, including direct exposure, increased contact surface (e.g., fins), connection to the substrate heat dissipation area, or direct connection to an external heat sink (e.g., a mobile phone midframe).

[0035] The working principle of this embodiment is as follows: by directly or indirectly integrating at least one high-thermal-conductivity heat dissipation pipe 31 on the second surface 22 of the chip 20, heat is transferred from the second surface 22 of the chip 20 to the heat dissipation pipe 31 through a low-thermal-resistance interface. Heat is then rapidly conducted to the distal end by the heat dissipation pipe 31's inherent high thermal conductivity, bypassing high-resistance paths such as packaging materials and efficiently dissipating heat to an external cooling system. Compared to traditional packaging, this significantly improves heat dissipation efficiency, effectively suppresses hot spots, and enhances performance and reliability.

[0036] Example 2 Figure 3 It is a planar schematic diagram of the chip packaging structure of Example 2 of the present application. Figure 4 It is along Figure 3 Schematic diagram of the cross section along the AA line. Figure 3 and Figure 4 This embodiment differs from Example 1 in that a thermal interface portion 40 is provided between the chip-proximal end 31a of the heat dissipation pipe 31 and the second surface 22 of the chip 20. The material of the thermal interface portion 40 may include thermal grease, metal solder, phase change material, etc. When a phase change material is selected, the phase transition temperature is set to be lower than the maximum allowable operating temperature of the chip 20. When the phase change material undergoes a phase transition, it can reduce the thermal resistance of the thermal coupling interface or absorb latent heat, thereby enhancing the heat transfer efficiency from the second surface 22 of the chip 20 to the heat dissipation pipe 31.

[0037] Optionally, a solid-liquid phase change material is used, and its phase change temperature point is set near the upper limit of the normal operating temperature of the chip 20 but below the danger threshold, for example, 65°C-75°C. The PCM has a certain thermal conductivity in the solid state, and the thermal conductivity is significantly improved in the liquid state. Optional materials include paraffin-based, fatty acid-based, or low-melting-point alloy-based PCMs. The PCM layer can be a thin layer covering the entire contact area near the chip end 31a, or can be patterned into a ring or lattice shape, surrounding or filling the key contact interface area between the near-chip end 31a of the heat dissipation pipe 31 and the second surface 22 of the chip 20.

[0038] The power consumption and heat generation of the chip 20 (especially the processor and image sensor) are not constant but vary dynamically with the workload (such as image processing complexity, frame rate, and AI computing intensity). This can result in short periods of high peak power consumption (creating transient hotspots) and longer periods of low power consumption or standby mode. If a fixed thermal path with extremely high heat transfer efficiency is provided under all operating conditions, this extremely high heat dissipation capacity could lead to overcooling when the chip 20 is under low load and generating little heat, negatively impacting the performance of the chip 20. This structure, however, utilizes a phase transition of the PCM at the hotspot to dynamically optimize and enhance the heat transfer efficiency from that hotspot to the heat dissipation conduit 31, achieving real-time control and cooling of the hotspot of the chip 20.

[0039] Furthermore, when the hotspot temperature rises and the PCM inside the through-hole 11 melts and expands, the PCM fills the gap between the heat dissipation conduit 31 and the inner wall of the through-hole 11, thereby enhancing the sealing of the through-hole 11 and preventing contaminants such as moisture and dust from invading the package interior or reaching the back of the chip along this path. Furthermore, the pressure generated by the expansion of the PCM acts on the inner wall of the heat dissipation conduit 31 and the through-hole 11, improving the physical contact between these interfaces and reducing contact thermal resistance.

[0040] The operating principle of this embodiment is to further optimize the heat transfer path by adding a thermal interface portion 40 between the chip-proximal end 31a of the heat dissipation pipe 31 and the second surface 22 of the chip 20. In particular, when using phase change material, the heat transfer efficiency can be dynamically adjusted based on the actual heating conditions of the chip 20, preventing overcooling of the chip 20 and affecting its performance. Compared to structures without PCM, this can more effectively ensure the operating performance of the chip 20 under dynamic loads or hot spot drift, suppress instantaneous peak temperatures, and improve overall heat dissipation performance.

[0041] When the hotspot temperature rises, the PCM inside the through-hole 11 melts and expands, filling the gap between the heat dissipation conduit 31 and the inner wall of the through-hole 11. This strengthens the seal of the through-hole 11 and prevents contaminants such as moisture and dust from entering the package or reaching the back of the chip. Furthermore, the pressure generated by the expansion of the PCM acts on the inner wall of the heat dissipation conduit 31 and the through-hole 11, improving the physical contact between these interfaces and reducing contact thermal resistance.

[0042] Example 3 Figure 5 Schematic diagram of the structure of the camera module of Example 3 of the present application. Figure 5The embodiment of the present application also discloses a camera module, including a lens 51, a bracket 52, a filter 53, a heat sink 54, and a substrate 10, a chip 20 and a heat dissipation pipe assembly 30 arranged in the chip packaging structure of Example 1 or Example 2.

[0043] The lens 51 is located on the first surface 21 of the chip 20 . The substrate 10 is fixed on the bracket 52 , and the chip 20 is disposed inside the bracket 52 .

[0044] The lens 51 is disposed on a side of the camera module near the incident direction of light and is used to reflect and refract light to form a desired image. The lens 51 typically includes at least one lens, an aperture, etc. The chip 20 may be a silicon-based chip manufactured using integrated circuit manufacturing technology, such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor).

[0045] The bracket 52 is a groove structure with one end open. The opening is connected to the substrate 10, so that the chip 20 is accommodated in the groove, thereby isolating it from the external environment and preventing other signals from interfering with the chip 20. The end of the bracket 52 facing away from the substrate 10 is connected to the lens 51 to fix the lens 51 on the light incident side of the camera module.

[0046] The bracket 52 is provided with a light hole 52a, and the filter 53 is arranged on the side of the bracket 52 facing away from the chip 20, and the filter 53 is opposite to the light hole 52a, wherein the filter 53 can select light of a required radiation band as needed, such as an infrared cut filter (IRCF), and the infrared cut filter can be a blue glass infrared cut filter or an infrared cut film directly mounted on the glass surface.

[0047] The heat sink 54 is disposed on the back side of the substrate 10 and connected to the far chip end 31 b of the heat dissipation pipe 31 to quickly dissipate the heat generated by the chip 20 .

[0048] The implementation principle of this embodiment is: applying a chip packaging structure with high-efficiency hotspot heat dissipation capability to a camera module can effectively reduce the operating temperature of the chip (20) (such as an image sensor (CMOS) or an image signal processor (ISP), etc.), especially suppressing its hotspot temperature, thereby significantly reducing image thermal noise, improving imaging quality, ensuring stable operation of the module under high loads such as high resolution and high frame rate, and extending its service life.

[0049] Example 4 Figure 6 Schematic diagram of the process of preparing the chip packaging structure of Example 4 of the present application. Figure 6 The present application also discloses a method for preparing a chip packaging structure, comprising the following steps: S1. Determine a predetermined hotspot area on the second surface 22 of the chip 20 based on thermal simulation or actual measurement results, and dispose a heat dissipation pipe assembly 30 at the predetermined hotspot area. The heat dissipation pipe assembly 30 includes a heat dissipation pipe 31. The chip-proximal end 31a of the heat dissipation pipe 31 is thermally coupled to the predetermined hotspot area.

[0050] S2. Providing a substrate 10, wherein the substrate 10 is provided with a through hole 11 corresponding to the position of the predetermined hot spot area.

[0051] S3 , disposing the second surface 22 of the chip 20 on the substrate 10 , passing the heat dissipation pipe 31 through the through hole 11 , and connecting the chip-distal end 31 b of the heat dissipation pipe 31 to the heat sink 54 .

[0052] The implementation principle of this embodiment is as follows: by first determining the hotspot and then precisely positioning the heat dissipation conduit 31, utilizing the substrate 10 having the through-hole 11, and then passing the heat dissipation conduit 31 through the through-hole 11 to connect to the heat sink 54, a chip package structure can be reliably manufactured in which the heat dissipation conduit 31 is precisely aligned with the hotspot of the chip 20 and has an efficient external heat dissipation path (through the substrate 10 to connect to the heat sink 54). This ensures the feasibility of the chip package structure and effectively demonstrates the heat dissipation advantages of the design in actual products.

[0053] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A chip packaging structure, characterized in that: include: base(10); A chip (20) is located on the substrate (10), wherein the chip (20) has a first surface (21) and a second surface (22) opposite to the first surface (21); A heat dissipation pipe assembly (30) comprises a heat dissipation pipe (31), wherein the heat dissipation pipe (31) has a near-chip end (31a) and a far-chip end (31b), wherein the near-chip end (31a) is aligned with a predetermined hot spot area of ​​a second surface (22) of the chip (20) for thermal coupling, and the far-chip end (31b) is used to conduct heat away from the chip (20).

2. The chip packaging structure according to claim 1, wherein: A heat-conducting interface portion (40) is provided between the near-chip end (31a) of the heat dissipation pipe (31) and the second surface (22) of the chip (20).

3. The chip packaging structure according to claim 2, wherein: The material of the heat-conducting interface portion (40) includes one of heat-conducting silicone grease, metal solder, and phase change material.

4. The chip packaging structure according to claim 3, wherein: The phase change temperature point of the phase change material is set to be lower than the maximum allowable operating temperature of the chip (20), wherein the phase change material reduces the thermal resistance of the thermal coupling interface or absorbs latent heat when the phase change occurs, so as to enhance the heat transfer efficiency from the second surface (22) of the chip (20) to the heat dissipation pipe (31).

5. The chip packaging structure according to claim 1, wherein: The predetermined hot spot area is determined through thermal simulation or actual measurement.

6. The chip packaging structure according to claim 1, wherein: The substrate (10) has a through hole (11), the position of the through hole (11) corresponds to the position of the predetermined hot spot area, and the heat dissipation pipe (31) passes through the through hole (11) and is connected to the heat dissipation area.

7. The chip packaging structure according to claim 6, wherein: The far chip end (31b) of the heat dissipation pipe (31) is connected to the heat sink (54).

8. The chip packaging structure according to claim 7, wherein: The heat sink (54) is arranged on the back side of the substrate (10).

9. A camera module, characterized in that: The chip packaging structure comprises the chip packaging structure according to any one of claims 1-8.

10. A method for preparing a chip packaging structure according to any one of claims 1 to 8, characterized in that: include: Determining a predetermined hot spot area on the second surface (22) of the chip (20) based on thermal simulation or actual measurement results, and providing a heat dissipation pipe assembly (30) at the predetermined hot spot area, wherein the heat dissipation pipe assembly (30) includes a heat dissipation pipe (31), and a near-chip end (31a) of the heat dissipation pipe (31) is thermally coupled to the predetermined hot spot area; Providing a substrate (10), wherein a through hole (11) corresponding to the position of the predetermined hot spot area is opened on the substrate (10); The second surface (22) of the chip (20) is arranged on the substrate (10), wherein the heat dissipation pipe (31) passes through the through hole (11), and the far chip end (31b) of the heat dissipation pipe (31) is connected to the heat sink (54).

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