Circuit board assembly, camera module and electronic equipment

Abstract

The invention provides a circuit board assembly, a camera module and electronic equipment, and the circuit board assembly comprises a substrate and a chip suite. The substrate is provided with a plurality of through holes; the chip suite comprises a photosensitive chip, a support, an optical filter and a plurality of conductive wires, the photosensitive chip and the optical filter are both connected with the support, the photosensitive chip is arranged at an interval relative to the optical filter, a photosensitive part of the photosensitive chip faces the optical filter to receive light penetrating through the optical filter, the photosensitive chip, the support and the optical filter define a sealing cavity, and the conductive wires are arranged in the sealing cavity. The first end of each conductive wire is fixedly and electrically connected with the photosensitive chip, and the second end of each conductive wire is inserted into the corresponding through hole and electrically connected with the substrate.

Description

Technical Field

[0001] The present application relates to the technical field of photosensitive chip assembly, and in particular to a circuit board assembly, a camera module and an electronic device. Background Art

[0002] The camera module includes a circuit board assembly, which consists of a substrate and a chip assembly. The chip assembly's photosensitive chip is soldered to pads on the substrate's surface via conductive wires (e.g., gold bonding wires). Because the conductive wires are obscured by the chip assembly's bracket, visual inspection of the connection quality after the chip assembly is soldered to the substrate is difficult, if not impossible. Summary of the Invention

[0003] The embodiments of the present application provide a circuit board assembly, a camera module, and an electronic device to solve the problem of how to improve the convenience of detecting the connection quality between the conductive wire and the substrate.

[0004] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application provides a circuit board assembly.

[0005] The circuit board assembly provided in the embodiment of the present application includes: a substrate and a chip kit; the substrate is provided with multiple through holes; the chip kit includes a photosensitive chip, a bracket, a filter and multiple conductive wires, the photosensitive chip and the filter are both connected to the bracket, the photosensitive chip is spaced relative to the filter, the photosensitive part of the photosensitive chip faces the filter to receive light passing through the filter, the photosensitive chip, the bracket and the filter form a sealed cavity, the first end of each conductive wire is fixedly connected and electrically connected to the photosensitive chip, and the second end of each conductive wire is inserted into the corresponding through hole and electrically connected to the substrate.

[0006] In some embodiments, the substrate is provided with a circuit layer, the hole wall of the through hole is provided with a conductive layer electrically connected to the circuit layer, and the second end of the conductive wire is electrically connected to the conductive layer.

[0007] In some embodiments, a conductive material in a solidified state is provided between the second end of the conductive filament and the conductive layer.

[0008] In some embodiments, the second end of the conductive filament is at least partially exposed to the outer surface of the substrate on a side facing away from the photosensitive chip.

[0009] In some embodiments, the second end of the conductive wire is parallel to the thickness direction of the photosensitive chip, and the chip assembly is stacked on the substrate along the thickness direction of the photosensitive chip.

[0010] In some embodiments, a groove is provided at a position opposite to the photosensitive chip of the substrate, and the groove wall and the photosensitive chip form a first accommodating cavity; the circuit board assembly also includes a first electronic component, which is located in the first accommodating cavity, and the first electronic component is fixedly connected and electrically connected to the substrate.

[0011] In some embodiments, the bracket includes a first annular portion, a connecting portion, and a second annular portion that are connected to each other; the second annular portion is arranged outside the first annular portion, and the end of the first annular portion facing away from the substrate and the end of the second annular portion facing away from the substrate are respectively connected to the connecting portion; the end of the first annular portion facing away from the connecting portion is connected to the photosensitive chip, and the second annular portion is also arranged outside the photosensitive chip, and the end of the second annular portion facing away from the connecting portion is connected to the substrate.

[0012] In some embodiments, the side wall of the first annular portion facing the second annular portion, the side wall of the connecting portion facing the substrate, the side wall of the second annular portion facing the first annular portion, the photosensitive chip and the substrate form a second accommodating cavity; the circuit board assembly also includes a second electronic component, the second electronic component is located in the second accommodating cavity, and the second electronic component is fixedly connected and electrically connected to the substrate.

[0013] In a second aspect, an embodiment of the present application provides a camera module.

[0014] The camera module provided in the embodiment of the present application includes: a lens and any one of the circuit board assemblies provided in the embodiment of the present application, wherein the lens is opposite to the side of the filter facing away from the photosensitive chip.

[0015] In a third aspect, an embodiment of the present application provides an electronic device.

[0016] The electronic device provided in the embodiment of the present application includes: a frame and any one of the camera modules provided in the embodiment of the present application, and the camera module is connected to the frame.

[0017] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In an embodiment of the present application, the photosensitive chip can be electrically connected to the substrate via the conductive wires by inserting the second ends of the conductive wires that are fixedly and electrically connected to the photosensitive chip into corresponding through-holes on the substrate. In this way, the connection between the second ends of the conductive wires and the portion of the through-holes on the substrate can be observed by direct visual inspection or visual inspection using a microscope to determine whether the second ends of the conductive wires are reliably connected to the substrate. Compared to detection methods such as X-ray detection in related technologies, visual inspection has the advantages of being easy to implement and having lower detection costs.

[0018] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 A schematic diagram of a circuit board assembly provided in an embodiment of the present application; Figure 2 for Figure 1 A partial enlarged schematic diagram of area A of the circuit board assembly shown in FIG; Figure 3 for Figure 1 Schematic diagram of the substrate, flexible circuit board and electrical connector of the circuit board assembly shown in FIG; Figure 4 A schematic diagram of a chip kit provided in an embodiment of the present application; Figure 5 A schematic diagram of another circuit board assembly provided in an embodiment of the present application; Figure 6 A schematic diagram of another circuit board assembly provided in an embodiment of the present application; Figure 7 for Figure 6 Schematic diagram of the substrate, flexible circuit board and electrical connector of the circuit board assembly shown in FIG; Figure 8 A top view of a substrate provided in an embodiment of the present application; Figure 9 A top view of another substrate provided in an embodiment of the present application; Figure 10 A schematic diagram of a camera module provided in an embodiment of the present application.

[0021] Description of reference numerals: 1-Circuit board assembly; 10-substrate; 11-through hole; 12-circuit layer; 13-conductive layer; 14-groove; 20 - chip kit; 21 - photosensitive chip; 211 - photosensitive portion; 22 - bracket; 221 - first annular portion; 222 - connecting portion; 223 - second annular portion; 23 - filter; 24 - conductive wire; 241 - first end; 242 - second end; 25 - sealed cavity; 30- conductive material; 41-first accommodating chamber; 42-second accommodating chamber; 51-first electronic component; 52-second electronic component; 60-electrical connector; 70-flexible circuit board; 2- Lens. DETAILED DESCRIPTION

[0022] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0024] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0025] Furthermore, it is required that the application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0026] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0027] The present application embodiment provides a circuit board assembly. Figures 1 to 7 The circuit board assembly 1 provided in the embodiment of the present application includes: a substrate 10 and a chip assembly 20. For example, the substrate 10 is a rigid circuit board. Alternatively, the substrate 10 is a combination of a flexible circuit board and a reinforcement sheet. The substrate 10 is provided with a plurality of through holes 11.

[0028] The chip assembly 20 includes a photosensitive chip 21, a bracket 22, a filter 23, and a plurality of conductive filaments 24. For example, the photosensitive chip 21 can be a charge coupled device (CCD) photosensitive chip, or a complementary metal-oxide semiconductor (CMOS) photosensitive chip. The filter 23 can be an infrared (IR) filter. Of course, other types of filters can also be provided based on actual needs, and are not listed here. The conductive filaments 24 can be conductive metal filaments. For example, the conductive filaments 24 are bonding wires.

[0029] The photosensitive chip 21 and the filter 23 are both connected to the bracket 22. The photosensitive chip 21 is spaced apart from the filter 23, and the photosensitive portion 211 of the photosensitive chip 21 faces the filter 23 to receive light passing through the filter 23. Furthermore, the photosensitive chip 21, the bracket 22, and the filter 23 form a sealed cavity 25. In this way, the photosensitive portion 211 of the photosensitive chip 21 can be oriented toward the sealed cavity 25, thereby utilizing the sealed cavity to seal and protect the photosensitive portion 211 of the photosensitive chip 21, thereby preventing the photosensitive chip 21 from being damaged due to impurities adhering to the photosensitive portion 211 during transportation of the chip kit 20 or during assembly of the chip kit 20 on the substrate 10.

[0030] Furthermore, in the embodiment of the present application, the first end 241 of each conductive thread 24 is fixedly connected and electrically connected to the photosensitive chip 21. The second end 242 of each conductive thread 24 is inserted into the corresponding through hole 11 and electrically connected to the substrate 10.

[0031] In this way, in the embodiment of the present application, the second end 242 of each conductive filament 24 fixedly and electrically connected to the photosensitive chip 21 can be inserted into the corresponding through-hole 11 on the substrate 10, so that the photosensitive chip 21 is electrically connected to the substrate 10 via the conductive filament 24. In this way, the connection between the second end 242 of the conductive filament 24 and the portion of the through-hole 11 of the substrate 10 can be observed by direct visual inspection or visual inspection with a microscope, thereby determining whether the second end 242 of the conductive filament 24 is reliably connected to the substrate 10. Compared with detection methods such as X-ray detection in related technologies, visual inspection has the advantages of being easy to implement and having lower detection costs.

[0032] It should be noted that, in order to prevent foreign matter from adhering to the photosensitive portion 211 of the photosensitive chip 21 during the process of connecting the photosensitive chip 21 to the substrate 10, the photosensitive chip 21, the bracket 22, and the filter 23 need to be arranged to form a sealed cavity 25 before the photosensitive chip 21 is connected to the substrate 10, so that the photosensitive portion 211 of the photosensitive chip 21 is located within the sealed cavity 25. In other words, before the photosensitive chip 21 is connected to the substrate 10, the photosensitive chip 21, the bracket 22, and the filter 23 form a whole, constituting the chip kit 20, to prevent contamination of the photosensitive portion 211 of the photosensitive chip 21 during transportation or assembly of the photosensitive chip 21.

[0033] If the solution in the related art is used, the conductive wire is directly soldered to the surface of the substrate during the assembly of the chip assembly and the substrate, causing the conductive wire to be obscured by the bracket and the substrate. Therefore, the chip assembly and substrate assembled using the solution in the related art can only be inspected using penetrating inspection methods such as X-ray inspection to detect the welding quality of the conductive wire to the substrate. Because X-ray inspection is more expensive than conventional inspection methods such as visual inspection, it can be seen that the solution in the related art has the problem of high cost for inspecting the connection quality of the chip assembly and the substrate.

[0034] The solution provided in the embodiment of the present application can be used to inspect the area where the through hole 11 of the substrate 10 is located by direct visual inspection or visual inspection using a microscope to determine whether the second end 242 of the conductive filament 24 is reliably connected to the substrate 10. Therefore, compared with the solutions in the related art, this solution has the advantages of being easy to implement and having low inspection costs.

[0035] For example, if the second end 242 of the conductive filament 24 is soldered to the through-hole 11 region of the substrate 10, the quality of the solder joint can be observed to determine whether the second end 242 of the conductive filament 24 is reliably connected to the substrate 10. For example, if the second end 242 of the conductive filament 24 is connected to the through-hole 11 region of the substrate 10 via conductive adhesive, the reliably connected second end 242 of the conductive filament 24 to the substrate 10 can be determined by observing whether the conductive adhesive fully fills the through-hole. Because the through-hole 11 on the substrate 10 penetrates the substrate 10, the problem of obstruction of the detection area is avoided, thereby improving the convenience of detecting the connection quality of the conductive filament 24 and the substrate 10.

[0036] refer to Figure 1 and Figure 2In some embodiments, the substrate 10 is provided with a circuit layer 12, the hole wall of the through hole 11 is provided with a conductive layer 13 electrically connected to the circuit layer 12, and the second end 242 of the conductive filament 24 is electrically connected to the conductive layer 13. In this way, the photosensitive chip 21 can be electrically connected to the substrate 10 via the conductive filament 24 by electrically connecting the second end 242 of the conductive filament 24 to the conductive layer 13, and the conductive layer 13 to the circuit layer 12 of the substrate 10.

[0037] refer to Figure 1 and Figure 2 In some embodiments, a conductive material 30 in a solidified state is provided between the second end 242 of the conductive wire 24 and the conductive layer 13. For example, the conductive material 30 can be conductive glue or solder paste.

[0038] For example, during the assembly of the circuit board assembly 1, a fluid conductive material 30 may be first filled into each through hole 11 of the substrate 10. The chip assembly 20 and the substrate 10 may then be docked together so that the second ends 242 of the conductive filaments 24 connected to the photosensitive chips 21 are inserted into the through holes 11 in a one-to-one correspondence. Furthermore, after the conductive material 30 solidifies, it reliably connects the second ends 242 of the conductive filaments 24 to the conductive layer 13.

[0039] refer to Figure 1 and Figure 2 In some embodiments, the second end 242 of the conductive filament 24 is at least partially exposed to the outer surface of the substrate 10 facing away from the photosensitive chip 21. Thus, by observing whether the second end 242 of the conductive filament 24 is exposed to the outer surface of the substrate 10 facing away from the photosensitive chip 21, it can be determined whether the conductive filament 24 is accurately inserted into the through hole 11 of the substrate 10.

[0040] In other embodiments, the second end 242 of the conductive thread 24 of the newly assembled circuit board assembly 1 is at least partially exposed on the outer surface of the substrate 10 on the side facing away from the photosensitive chip 21. After passing the quality inspection, the portion where the second end 242 of the conductive thread 24 is exposed on the outer surface of the substrate 10 on the side facing away from the photosensitive chip 21 can be cut off.

[0041] refer to Figures 1 to 4 In some embodiments, the second end 242 of the conductive thread 24 is parallel to the thickness direction of the photosensitive chip 21, and the chip assembly 20 is stacked on the substrate 10 along the thickness direction of the photosensitive chip 21. In this way, the second end 242 of the conductive thread 24 can be smoothly inserted into the through hole 11 of the substrate 10.

[0042] refer to Figure 6 and Figure 7In some embodiments, a groove 14 is provided at a portion of the substrate 10 opposite the photosensitive chip 21. The groove wall of the groove 14 and the photosensitive chip 21 form a first accommodating cavity 41. The circuit board assembly 1 further includes a first electronic component 51, which is located in the first accommodating cavity 41 and is fixedly and electrically connected to the substrate 10. In this way, by arranging the first electronic component 51 below the photosensitive chip 21, the substrate 10's ability to accommodate electronic components can be improved.

[0043] The number of first electronic components 51 can be one or more. For example, the first electronic component 51 can be at least one of a capacitor, an inductor, and a resistor. For example, the distance between the bottom wall of the groove 14 and the photosensitive chip 21 is 20 microns, so the first electronic component 51 with a smaller height can be placed in the first accommodating cavity 41.

[0044] refer to Figure 4 and Figure 5 In some embodiments, the bracket 22 includes a first annular portion 221, a connecting portion 222, and a second annular portion 223 that are connected to each other. The second annular portion 223 is arranged outside the first annular portion 221, and the end of the first annular portion 221 facing away from the substrate 10 and the end of the second annular portion 223 facing away from the substrate 10 are respectively connected to the connecting portion 222. The end of the first annular portion 221 facing away from the connecting portion 222 is connected to the photosensitive chip 21, and the second annular portion 223 is also arranged outside the photosensitive chip 21, and the end of the second annular portion 223 facing away from the connecting portion 222 is connected to the substrate 10. In this way, the photosensitive chip 21 can be indirectly fixedly connected to the substrate 10 via the second annular portion 223 by fixing the second annular portion 223 to the substrate 10.

[0045] refer to Figure 4 and Figure 5 In some embodiments, the sidewall of the first annular portion 221 facing the second annular portion 223, the sidewall of the connecting portion 222 facing the substrate 10, the sidewall of the second annular portion 223 facing the first annular portion 221, the photosensitive chip 21, and the substrate 10 form a second accommodating cavity 42. The circuit board assembly 1 further includes a second electronic component 52, which is located in the second accommodating cavity 42 and is fixedly connected and electrically connected to the substrate 10.

[0046] The number of second electronic components 52 can be one or more. For example, the second electronic component 52 can be at least one of a capacitor, an inductor, and a resistor. Thus, by placing the second electronic component 52 in the second accommodating cavity 42 between the bracket 22 and the substrate 10, the compactness of the circuit board assembly 1 can be improved.

[0047] In some embodiments, the circuit board assembly 1 is provided with both a first accommodating cavity 41 and a second accommodating cavity 42 . The first accommodating cavity 41 is provided with a first electronic component 51 , and the second accommodating cavity 42 is provided with a second electronic component 52 .

[0048] In some embodiments, conductive wires 24 are provided on all four sides of the photosensitive chip 21. The substrate 10 is provided with four groups of through holes 11, and the conductive wires 24 on one side of the photosensitive chip 21 are connected to each group of through holes 11 in a one-to-one correspondence. Figure 8 , a single group of through holes 11 is distributed along a single straight line. Figure 9 The single set of through holes 11 are arranged along two straight lines with staggered spacing. In this way, the spacing between adjacent through holes 11 can be increased by staggering the through holes 11, thereby avoiding the reduction in strength of the substrate 10 caused by arranging the through holes 11 along a single straight line.

[0049] In some embodiments, the through hole 11 can be processed on the substrate 10 by a drilling process. Alternatively, the through hole 11 can be processed on the substrate 10 by a laser processing process. Alternatively, when the main body of the substrate 10 is made of ceramic material, the through hole 11 can be processed on the substrate 10 by a stamping process. Exemplarily, the diameter of the through hole 11 is 30 microns to 50 microns. The diameter of the conductive filament 24 is 15 microns to 22 microns. Of course, in other embodiments, the diameter of the through hole 11 and the diameter of the conductive filament 24 can be other values, which are not listed here one by one.

[0050] It should be noted that in related art, the ends of the conductive filaments need to be machined into a soldering portion, which is then soldered to the pads on the substrate surface. This soldering portion takes up the surface area of ​​the substrate used for component placement. However, using the solution provided in the embodiment of the present application, the second end 242 of the conductive filament 24 is inserted into the through-hole 11. Because the diameter of the through-hole 11 is smaller than the area of ​​the soldering portion of the conductive filament in related art, this can save the surface area of ​​the substrate 10 compared to related art.

[0051] In addition, since the second end 242 of the conductive wire 24 is inserted into the through hole 11, and the second end 242 of the conductive wire 24 is fixedly connected to the conductive layer 13 of the hole wall of the through hole 11 through the conductive material 30 (for example, solder) in a solidified state, the conductive material 30 has a certain height along the thickness direction of the substrate 10, and can be more firmly connected to the conductive layer 13 of the hole wall of the through hole 11.

[0052] It should also be noted that the solution provided in the embodiment of the present application, because the second end 242 of the conductive wire 24 of the circuit board assembly 1 is inserted into the through hole 11, and the first electronic component 51 is arranged on the bottom wall of the groove 14 of the substrate 10, has the advantage of being smaller in length, width, and height compared to circuit board assemblies in related arts. This can further improve the compactness of the camera module equipped with the circuit board assembly 1.

[0053] refer to Figure 1 In some embodiments, the circuit board assembly 1 further includes an electrical connector 60. Exemplarily, the electrical connector 60 is a board-to-board (BTB) connector. The electrical connector 60 is electrically connected to the substrate 10. Exemplarily, the circuit board assembly 1 further includes a flexible circuit board 70, through which the substrate 10 is connected to the electrical connector 60.

[0054] For example, the circuit board assembly 1 is provided in a camera module, which is provided in an electronic device including a main board (or a sub-board). The circuit board assembly 1 can be electrically connected to the main board (or sub-board) via an electrical connector 60 .

[0055] In order to enable those skilled in the art to better implement the solution provided by the embodiment of the present application, a more detailed assembly method of the circuit board assembly 1 is provided below for reference.

[0056] In some embodiments, the substrate 10 may be obtained first. A first pad is provided on the bottom wall of the groove 14 of the substrate 10 , and a second pad is provided at a portion of the substrate 10 corresponding to the area between the first annular portion 221 and the second annular portion 223 .

[0057] Furthermore, the through hole 11 of the substrate 10 may be filled with solder paste, and the solder paste may be applied to the first solder pad and the second solder pad.

[0058] The first electronic component 51 may be disposed above the first pad, and the second electronic component 52 may be disposed above the second pad.

[0059] Furthermore, an adhesive may be provided on a side of the second annular portion 223 of the bracket 22 facing away from the connecting portion 222 .

[0060] Furthermore, the chip assembly 20 can be docked with the substrate 10 so that the conductive wires 24 of the chip assembly 20 are inserted into the through holes 11 in a one-to-one correspondence.

[0061] Furthermore, a reflow soldering process can be performed on the assembly of the substrate 10 and the chip assembly 20. Furthermore, after the reflow soldering process is performed on the assembly of the substrate 10 and the chip assembly 20, the adhesive on the side of the second annular portion 223 facing away from the connecting portion 222 solidifies, thereby bonding and fixing the chip assembly 20 to the substrate 10.

[0062] The embodiment of the present application provides a camera module. Figure 10 The camera module provided in the embodiments of the present application includes: a lens 2 and any one of the circuit board assemblies 1 provided in the embodiments of the present application. The lens 2 and the filter 23 are positioned opposite to each other on the side facing away from the photosensitive chip 21. In this way, light can pass through the lens 2 and the filter 23 and be emitted to the photosensitive portion 211 of the photosensitive chip 21.

[0063] An embodiment of the present application provides an electronic device. The electronic device provided by the embodiment of the present application includes: a frame and any one of the camera modules provided by the embodiment of the present application, wherein the camera module is connected to the frame. In the case where the electronic device is a mobile phone, the frame is the middle frame of the mobile phone, and the camera module is connected to the middle frame of the mobile phone. Of course, the electronic device can also be a tablet computer or smart watch, etc., which are not listed here one by one.

[0064] In addition, electronic devices also include components such as display modules, batteries, and motherboards. Since the structure of electronic devices can be referred to in related technologies, the specific structure of electronic devices will not be described in detail here.

[0065] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0066] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A substrate (10) and a chip kit (20); The substrate (10) is provided with a plurality of through holes (11); The chip kit (20) comprises a photosensitive chip (21), a bracket (22), a filter (23) and a plurality of conductive wires (24); the photosensitive chip (21) and the filter (23) are both connected to the bracket (22); the photosensitive chip (21) is spaced apart from the filter (23); a photosensitive portion (211) of the photosensitive chip (21) faces the filter (23) to receive light passing through the filter (23); and the photosensitive chip (21), the bracket (22) and the filter (23) form a sealed cavity (25); The first end (241) of each conductive wire (24) is fixedly connected and electrically connected to the photosensitive chip (21), and the second end (242) of each conductive wire (24) is inserted into the corresponding through hole (11) and electrically connected to the substrate (10).

2. The circuit board assembly according to claim 1, wherein: The substrate (10) is provided with a circuit layer (12), the hole wall of the through hole (11) is provided with a conductive layer (13) electrically connected to the circuit layer (12), and the second end (242) of the conductive wire (24) is electrically connected to the conductive layer (13).

3. The circuit board assembly according to claim 2, wherein: A conductive material (30) in a solidified state is provided between the second end (242) of the conductive wire (24) and the conductive layer (13).

4. The circuit board assembly according to claim 1, wherein: The second end (242) of the conductive wire (24) is at least partially exposed to the outer surface of the substrate (10) on a side facing away from the photosensitive chip (21).

5. The circuit board assembly according to claim 1, wherein: The second end (242) of the conductive wire (24) is parallel to the thickness direction of the photosensitive chip (21), and the chip kit (20) is stacked on the substrate (10) along the thickness direction of the photosensitive chip (21).

6. The circuit board assembly according to claim 1, wherein: A groove (14) is provided at a portion of the substrate (10) opposite to the photosensitive chip (21), and the groove wall of the groove (14) and the photosensitive chip (21) form a first accommodating cavity (41); The circuit board assembly further comprises a first electronic component (51), the first electronic component (51) being located in the first accommodating cavity (41), and the first electronic component (51) being fixedly and electrically connected to the substrate (10).

7. The circuit board assembly according to claim 1, wherein: The bracket (22) comprises a first annular portion (221), a connecting portion (222), and a second annular portion (223) connected to each other; the second annular portion (223) is arranged outside the first annular portion (221); the end of the first annular portion (221) facing away from the substrate (10) and the end of the second annular portion (223) facing away from the substrate (10) are respectively connected to the connecting portion (222); The end of the first annular portion (221) facing away from the connecting portion (222) is connected to the photosensitive chip (21), and the second annular portion (223) is also arranged outside the photosensitive chip (21), and the end of the second annular portion (223) facing away from the connecting portion (222) is connected to the substrate (10).

8. The circuit board assembly according to claim 7, wherein: The side wall of the first annular portion (221) facing the second annular portion (223), the side wall of the connecting portion (222) facing the substrate (10), the side wall of the second annular portion (223) facing the first annular portion (221), the photosensitive chip (21) and the substrate (10) form a second accommodating cavity (42); The circuit board assembly further comprises a second electronic component (52), the second electronic component (52) being located in the second accommodating cavity (42), and the second electronic component (52) being fixedly and electrically connected to the substrate (10).

9. A camera module, characterized in that: include: A lens (2) and a circuit board assembly according to any one of claims 1 to 8, wherein the lens (2) is opposite to a side of the filter (23) facing away from the photosensitive chip (21).

10. An electronic device, characterized in that: include: A frame and the camera module according to claim 9, wherein the camera module is connected to the frame.

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