Sewing machine plate punching depth detection method and system based on image processing

Abstract

The embodiment of the invention relates to the technical field of sewing machine plate processing, and particularly discloses a sewing machine plate punching depth detection method and system based on image processing. According to the embodiment of the invention, the punching detection path is planned; the current punching position is determined, punching detection shooting is carried out, a detection shooting image is obtained, and the detection shooting image is processed; identifying the enhanced detection image, and calculating the current punching depth; according to the current punching parameters and the current punching depth, punching machining adjustment control is conducted; and carrying out processing visual display on the current punching depth. According to the method, through dynamic path decision of bionic stress release, plate mechanical characteristics and a biological optimization mechanism are deeply coupled, a high-stress area is actively recognized in the machining process, holes are preferentially formed, accumulative deformation and microcracks of a thin-wall part are inhibited from the source, and breakthrough improvement of structural integrity and assembly precision of the sewing machine plate is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of sewing machine plate processing, and in particular relates to a method and system for detecting the punching depth of a sewing machine plate based on image processing. Background Art

[0002] Sewing machine plate processing is the process of processing metal (such as cast iron, aluminum alloy, steel plate, etc.) or non-metallic materials (such as engineering plastics) into parts (i.e. sewing machine plates) that meet the structural design and functional requirements of sewing machines through a series of machining, forming and surface treatment processes.

[0003] Sewing machine plate punching is one of the most common sewing machine plate processing technologies.

[0004] In the existing technology, the punching process of the sewing machine plate is usually carried out directly according to the pre-set processing depth parameters, and there is a lack of dynamic detection and adjustment mechanism of the actual processing status. In actual production scenarios, the sewing machine plate may be deformed or placed unevenly, resulting in errors in the actual punching depth, affecting the processing quality of the sewing machine plate. Summary of the Invention

[0005] The purpose of the embodiments of the present invention is to provide a method and system for detecting the punching depth of a sewing machine plate based on image processing, aiming to solve the problems raised in the background technology.

[0006] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions: A method for detecting the punching depth of a sewing machine plate based on image processing, the method comprising the following steps: Receive punching processing requirements of sewing machine plates, plan multiple punching processing positions, match corresponding punching processing parameters, and plan punching detection paths; According to the punching detection path, determine the current punching position, perform punching detection shooting, obtain the detection shooting image, and process the detection shooting image to generate an enhanced detection image; According to the current drilling position, matching the current drilling parameters, identifying the enhanced detection image, determining the drill bit depth on the board, and calculating the current drilling depth; Performing drilling process adjustment control according to the current drilling parameters and the current drilling depth; A three-dimensional model of a sewing machine plate is obtained, and based on the three-dimensional model of the plate, a processing visualization display of the current punching depth is performed.

[0007] A sewing machine plate punching depth detection system based on image processing, the system includes a detection path planning unit, a detection shooting processing unit, a punching depth calculation unit, a processing adjustment control unit and a processing visualization display unit, wherein: The detection path planning unit is used to receive the punching processing requirements of the sewing machine plate, plan multiple punching processing positions, match the corresponding punching processing parameters, and plan the punching detection path; a detection and shooting processing unit, configured to determine the current punching position according to the punching detection path, perform punching detection shooting, obtain a detection shooting image, and process the detection shooting image to generate an enhanced detection image; a drilling depth calculation unit, configured to match current drilling parameters according to the current drilling position, identify the enhanced detection image, determine the drill depth on the board, and calculate the current drilling depth; A processing adjustment control unit, configured to perform adjustment control of the drilling process according to the current drilling parameters and the current drilling depth; The processing visualization display unit is used to obtain a three-dimensional model of the plate of the sewing machine plate, and based on the three-dimensional model of the plate, perform processing visualization display on the current punching depth.

[0008] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention deeply couples the mechanical properties of the plate with the biological optimization mechanism through dynamic path decision-making of bionic stress release. During the processing, it actively identifies high-stress areas and prioritizes opening holes, thereby fundamentally suppressing the cumulative deformation and microcracks of thin-walled parts, achieving a breakthrough improvement in the structural integrity and assembly accuracy of sewing machine plates.

[0009] 2. The present invention adopts a multi-source anti-interference depth calculation model, creatively integrating optical compensation of drill bit posture, hole mouth state restoration and dynamic calibration of tool wear, completely overcoming the measurement failure problem of traditional image methods in industrial scenarios such as inclined drilling and burr occlusion, and achieving a qualitative leap in hole depth accuracy under all working conditions.

[0010] 3. Based on a cross-module data collaboration engine, the present invention breaks through the data barriers of three-dimensional design models, real-time processing records and historical process knowledge, forming a "detection-decision-optimization" closed-loop self-learning mechanism, which significantly improves the system's adaptability to material fluctuations and tool aging. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention.

[0012] Figure 1 A flow chart of a method provided by an embodiment of the present invention is shown.

[0013] Figure 2 The application architecture diagram of the system provided by the embodiment of the present invention is shown.

[0014] Figure 3 The structure block diagram of the detection path planning unit in the system provided by the embodiment of the present invention is shown.

[0015] Figure 4 The figure shows a structural block diagram of a detection and shooting processing unit in a system provided by an embodiment of the present invention.

[0016] Figure 5 The figure shows a structural block diagram of a perforation depth calculation unit in a system provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] It is understandable that in the prior art, the punching process of the sewing machine plate is usually carried out directly according to the pre-set processing depth parameters, and there is a lack of dynamic detection and adjustment mechanism for the actual processing status. In actual production scenarios, the sewing machine plate may be deformed or placed unevenly, resulting in errors in the actual punching depth, affecting the processing quality of the sewing machine plate.

[0019] To solve the above problems, an embodiment of the present invention receives the punching processing requirements of a sewing machine plate, plans multiple punching processing positions, matches corresponding punching processing parameters, and plans a punching detection path; determines the current punching position according to the punching detection path, performs punching detection shooting, obtains the detection shooting image, and processes the detection shooting image to generate an enhanced detection image; matches the current punching parameters according to the current punching position, identifies the enhanced detection image, determines the drill bit depth on the plate, and calculates the current punching depth; performs punching processing adjustment control based on the current punching parameters and the current punching depth; obtains a three-dimensional model of the sewing machine plate, and based on the three-dimensional model, performs processing and visualization of the current punching depth. The system can determine the current punching position according to the punching detection path, perform punching detection shooting, processing and identification, determine the drill bit depth on the plate, calculate the current punching depth, and then perform punching processing adjustment control according to the current punching depth and perform visualization. It can dynamically detect and adjust the actual processing status, effectively avoid errors in the actual punching depth, and improve the processing quality of the sewing machine plate.

[0020] Figure 1 A flow chart of a method provided by an embodiment of the present invention is shown.

[0021] Specifically, the method for detecting the punching depth of a sewing machine plate based on image processing comprises the following steps: Step S101: receiving the punching processing requirements of the sewing machine plate, planning multiple punching processing positions, matching corresponding punching processing parameters, and planning a punching detection path.

[0022] In an embodiment of the present invention, the punching processing requirements of the sewing machine plate are received from the staff, the punching processing requirements are identified, a plurality of punching processing positions are planned on the sewing machine plate, and processing parameter data are extracted from the punching processing requirements. Then, the punching processing parameters corresponding to the plurality of punching processing positions are matched from the processing parameter data. Then, according to the plurality of punching processing positions and the plurality of punching processing parameters, the movement planning of the punching detection is performed to generate a punching detection path.

[0023] Among them, in the preferred embodiment provided by the present invention, the receiving of the punching processing requirements of the sewing machine plate, planning multiple punching processing positions, matching corresponding punching processing parameters, and planning the punching detection path specifically include the following steps: Step S1011, receiving a punching processing requirement of a sewing machine plate; Step S1012, identifying the punching processing requirements and planning multiple punching processing positions; Step S1013, extracting processing parameter data from the punching processing requirements; Step S1014, matching the punching processing parameters corresponding to the plurality of punching processing positions from the processing parameter data; Step S1015 , planning a punching detection path according to the multiple punching processing positions and the multiple punching processing parameters.

[0024] Among them, in the preferred embodiment provided by the present invention, planning the punching detection path according to multiple punching processing positions and multiple punching processing parameters specifically includes the following steps: Step S10151, calculating a detection priority coefficient of each drilling position based on the current required depth and a preset depth tolerance threshold in the plurality of drilling parameters, to obtain a priority coefficient corresponding to the drilling position; Step S10152: Based on the drill bit type and hole diameter specifications in the plurality of drilling processing parameters, the drilling processing positions having the same drill bit type and hole diameter specifications are divided into processing parameter groups; Step S10153, sorting the processing parameter groups according to the priority coefficients corresponding to the punching processing positions from high to low to obtain a sorting result; Step S10154: planning an inspection path within the processing parameter group based on the spatial proximity principle and the sorting result; Step S10155: planning the detection paths between the processing parameter groups according to the principle of minimizing the number of switching times of the processing parameter groups; Step S10156: Based on the detection paths within the planned processing parameter group and the detection paths between the planned processing parameter groups, a punching detection path is finally generated.

[0025] Furthermore, the image processing-based sewing machine plate punching depth detection method further includes the following steps: Step S102 : determining the current punching position according to the punching detection path, performing punching detection shooting, acquiring a detection shooting image, and processing the detection shooting image to generate an enhanced detection image.

[0026] In an embodiment of the present invention, during the punching process of the sewing machine plate, the current punching position is determined from a plurality of punching processing positions according to the punching detection path, and the punching detection position at this time in the punching detection path is determined. According to the current punching position and the punching detection position, the punching detection direction is determined, and then the punching detection shooting is performed according to the punching detection direction to obtain the detection shooting image. Thereafter, the detection shooting image is gray-scaled, and Gaussian filtering is used to filter the image noise, and histogram equalization is used to enhance the image contrast, thereby realizing automatic image processing of the detection shooting image and generating an enhanced detection image.

[0027] Among them, in the preferred embodiment provided by the present invention, determining the current punching position according to the punching detection path, performing punching detection shooting, obtaining the detection shooting image, and processing the detection shooting image to generate the enhanced detection image specifically includes the following steps: Step S1021, obtaining a three-dimensional model of the sewing machine plate and all currently processed hole positions; Step S1022: Consider the unprocessed hole position as a growth point, calculate the local stress value of each growth point under a preset load, take the highest stress value as the stress concentration factor, and obtain the target growth point; Step S1023: For the target hole position, the distance from the target hole position to the nearest unprocessed hole position and the distance from the target hole position to the next nearest unprocessed hole position are calculated, and the two distances are multiplied and the inverse is taken to obtain the hole group density factor of the target growth point; Step S1024, multiplying the stress concentration coefficient by the hole cluster density factor of the target growth point to generate a dynamic priority value of the target growth point; Step S1025, selecting the unprocessed hole position corresponding to the highest dynamic priority value of the target growth point as the current drilling position to obtain the prioritized processed hole position; Step S1026 , marking the prioritized machining holes at corresponding positions on the three-dimensional model to obtain an updated three-dimensional model; Step S1027, determining the current punching position according to the updated three-dimensional model; Step S1028, determining a punching detection direction for the current punching position; Step S1029: perform punch detection and capture according to the punch detection direction to obtain a detection capture image; Step S10210 , grayscale processing is performed on the detection image, and Gaussian filtering is used to filter image noise, and histogram equalization is used to enhance image contrast to generate an enhanced detection image.

[0028] Furthermore, the image processing-based sewing machine plate punching depth detection method further includes the following steps: Step S103 , matching the current drilling parameters according to the current drilling position, identifying the enhanced detection image, determining the drill depth on the board, and calculating the current drilling depth.

[0029] In an embodiment of the present invention, the current drilling parameters corresponding to the current drilling position are matched from multiple drilling processing parameters, and then the enhanced detection image is subjected to target recognition to determine the target drill bit area. Then, the target drill bit image is extracted from the enhanced detection image according to the target drill bit area, and then the size of the target drill bit image is subjected to size recognition to determine the drill bit depth on the board. The current drill bit length is determined based on the current drilling parameters, and the current drill bit length is subtracted from the drill bit depth on the board to obtain the current drilling depth.

[0030] In a preferred embodiment of the present invention, the steps of matching the current drilling parameters according to the current drilling position, identifying the enhanced detection image, determining the drill depth on the board, and calculating the current drilling depth specifically include the following steps: Step S1031, matching the current punching parameters corresponding to the current punching position from a plurality of punching processing parameters; Step S1032, performing target recognition on the enhanced detection image to extract a target drill bit image; Step S1033, performing size recognition on the target drill bit image to determine the drill bit depth on the board; Step S1034, determining the current drill length according to the current drilling parameters; Step S1035 , calculating the current drilling depth according to the current drill length and the drill depth on the board.

[0031] In a preferred embodiment of the present invention, the current drilling depth is calculated according to the current drill length and the drill depth on the board, specifically comprising the following steps: Step S10351, performing basic drilling depth calculation on the current drill length and the drill depth on the board to obtain a calculated basic drilling depth; Step S10352: performing drill bit posture analysis on the enhanced detection image, identifying the angle between the drill bit axis and the normal of a preset reference plane, and calculating a posture correction value using a preset angle-depth correction model to obtain a calculated posture correction value; Step S10353: performing orifice state analysis on the enhanced detection image to identify the degree of obstruction of the drill bit depth measurement on the plate by the orifice burr, and calculating the orifice state correction value using the angle-depth correction model to obtain the calculated orifice state correction value; Step S10354: Obtain historical drilling depth data of completed drilling positions within a preset range of the current drilling position, and calculate a spatial depth trend compensation amount using an angle-depth correction model to obtain a calculated spatial depth trend compensation amount; Step S10355: Calculating a dynamic compensation amount for drill wear using an angle-depth correction model based on the drill type and current drilling sequence in the current drilling parameters and the wear compensation coefficient of similar drills in history, thereby obtaining a calculated dynamic compensation amount for drill wear. Step S10356, comprehensively calculate the basic drilling depth, the calculated posture correction amount, the calculated hole state correction amount, the calculated spatial depth trend compensation amount and the calculated drill wear dynamic compensation amount, and use the angle-depth correction model to finally calculate the current drilling depth.

[0032] Furthermore, the image processing-based sewing machine plate punching depth detection method further includes the following steps: Step S104 , performing drilling process adjustment control according to the current drilling parameters and the current drilling depth.

[0033] In an embodiment of the present invention, the current required depth is determined based on the current drilling parameters, and by comparing the current required depth with the current drilling depth, it is determined whether the processing requirements are met. If the processing requirements are not met, the processing adjustment depth is calculated, and a processing adjustment instruction is generated based on the processing adjustment depth. Then, the drilling processing adjustment control is performed according to the processing adjustment instruction.

[0034] Among them, in the preferred embodiment provided by the present invention, the punching process adjustment control according to the current punching parameters and the current punching depth specifically includes the following steps: Step S1041, determining the current required depth according to the current drilling parameters; Step S1042, comparing the current required depth with the current drilling depth to calculate the machining adjustment depth; Step S1043, generating a machining adjustment instruction according to the machining adjustment depth; Step S1044: Perform punching adjustment control according to the processing adjustment instruction.

[0035] Furthermore, the image processing-based sewing machine plate punching depth detection method further includes the following steps: Step S105 , obtaining a three-dimensional model of the sewing machine plate, and visually displaying the current punching depth based on the three-dimensional model of the plate.

[0036] In an embodiment of the present invention, the internal processing code of the sewing machine plate is obtained, and then according to the internal processing code, the three-dimensional model of the plate of the sewing machine plate is matched from a preset model database, and the three-dimensional model of the plate is exported and processed, and according to the current punching position, the current punching depth and the current punching parameters, a punching display image is generated, and then based on the three-dimensional model of the plate, the display area of ​​the punching display image is determined, and in the display area, the punching processing of the punching display image is visualized.

[0037] In a preferred embodiment of the present invention, the current required depth is compared with the current drilling depth to calculate the processing adjustment depth, which specifically includes the following steps: Step S10421, calculating a basic depth deviation between the current required depth and the current drilling depth to obtain a calculated basic depth deviation; Step S10422: Determine and obtain a feature-error correlation model, perform feature analysis on the enhanced detection image, identify hole burr features and drill side wear features, and calculate feature compensation amounts for the hole burr features and drill side wear features using the feature-error correlation model to obtain calculated feature compensation amounts. Step S10423, obtaining the historical records of machining adjustment depths of completed holes within the preset range of the current drilling position, and calculating the spatial prediction compensation amount using the feature-error correlation model to obtain the calculated spatial prediction compensation amount; Step S10424, calculating a drill bit characteristic compensation amount using a feature-error correlation model based on the drill bit type, current speed parameter, and feed rate parameter in the current drilling parameters, combined with the drill bit type, historical speed parameter, and historical feed rate parameter in the historical drilling parameters, to obtain a calculated drill bit characteristic compensation amount; Step S10425, based on the calculated basic depth deviation, the calculated characteristic compensation amount, the calculated spatial prediction compensation amount and the calculated drill bit characteristic compensation amount, the machining adjustment depth is calculated.

[0038] Among them, in the preferred embodiment provided by the present invention, the obtaining of the three-dimensional model of the plate of the sewing machine plate and the visual display of the processing of the current punching depth based on the three-dimensional model of the plate specifically include the following steps: Step S1051, obtaining the internal processing code of the sewing machine plate; Step S1052, matching and exporting a three-dimensional model of the sewing machine plate from a preset model database according to the internal processing code; Step S1053, generating a punching display image according to the current punching position, the current punching depth, and the current punching parameters; Step S1054 : Based on the three-dimensional model of the plate, the positioning visualization of the punching process is performed on the punching display image.

[0039] Further, Figure 2 The application architecture diagram of the system provided by the embodiment of the present invention is shown.

[0040] Among them, in another preferred embodiment provided by the present invention, the sewing machine plate punching depth detection system based on image processing includes: The detection path planning unit 101 is used to receive the punching processing requirements of the sewing machine plate, plan multiple punching processing positions, match corresponding punching processing parameters, and plan a punching detection path.

[0041] In an embodiment of the present invention, the detection path planning unit 101 receives the punching processing requirements of the sewing machine plate input by the staff, then identifies the punching processing requirements, plans multiple punching processing positions on the sewing machine plate, and extracts processing parameter data from the punching processing requirements, and then matches the punching processing parameters corresponding to the multiple punching processing positions from the processing parameter data, and then performs mobile planning for punching detection based on the multiple punching processing positions and the multiple punching processing parameters to generate a punching detection path.

[0042] Specifically, Figure 3 FIG. 1 is a structural block diagram of the detection path planning unit 101 in the system provided by an embodiment of the present invention.

[0043] In a preferred embodiment of the present invention, the detection path planning unit 101 specifically includes: The demand receiving module 1011 is used to receive the punching processing demand of the sewing machine plate; A location planning module 1012 is used to identify the punching processing requirements and plan multiple punching processing locations; A parameter extraction module 1013 is used to extract processing parameter data from the punching processing requirements; A processing parameter matching module 1014 is used to match the punching processing parameters corresponding to the plurality of punching processing positions from the processing parameter data; The path planning module 1015 is used to plan a punching detection path according to a plurality of punching processing positions and a plurality of punching processing parameters.

[0044] Furthermore, the sewing machine plate punching depth detection system based on image processing further includes: The detection and shooting processing unit 102 is used to determine the current punching position according to the punching detection path, perform punching detection shooting, obtain a detection shooting image, and process the detection shooting image to generate an enhanced detection image.

[0045] In an embodiment of the present invention, during the punching process of the sewing machine plate, the detection and shooting processing unit 102 determines the current punching position from multiple punching processing positions according to the punching detection path, and determines the punching detection position at this time in the punching detection path, and determines the punching detection direction according to the current punching position and the punching detection position, and then performs punching detection shooting according to the punching detection direction to obtain a detection shooting image. Thereafter, the detection shooting image is gray-scaled, and Gaussian filtering is used to filter image noise, and histogram equalization is used to enhance image contrast, thereby realizing automatic image processing of the detection shooting image and generating an enhanced detection image.

[0046] Specifically, Figure 4 FIG. 1 shows a structural block diagram of the detection and shooting processing unit 102 in the system provided by an embodiment of the present invention.

[0047] In a preferred embodiment of the present invention, the detection, shooting and processing unit 102 specifically includes: A position determination module 1021 is configured to determine a current punching position from a plurality of punching processing positions according to the punching detection path; A direction determination module 1022 is configured to determine a punch detection direction for the current punch position; The detection and shooting module 1023 is used to perform punching detection and shooting according to the punching detection direction to obtain a detection and shooting image; The image processing module 1024 is used to grayscale the detection image, filter image noise using Gaussian filtering, and enhance image contrast using histogram equalization to generate an enhanced detection image.

[0048] Furthermore, the sewing machine plate punching depth detection system based on image processing further includes: The drilling depth calculation unit 103 is used to match the current drilling parameters according to the current drilling position, identify the enhanced detection image, determine the drill depth on the board, and calculate the current drilling depth.

[0049] In an embodiment of the present invention, the drilling depth calculation unit 103 matches the current drilling parameters corresponding to the current drilling position from multiple drilling processing parameters, and then performs target recognition on the enhanced detection image to determine the target drill bit area, and then extracts the target drill bit image from the enhanced detection image according to the target drill bit area, and then performs size recognition on the target drill bit image to determine the drill bit depth on the board, and determines the current drill bit length based on the current drilling parameters, and subtracts the current drill bit length from the drill bit depth on the board to obtain the current drilling depth.

[0050] Specifically, Figure 5 FIG. 1 shows a structural block diagram of the perforation depth calculation unit 103 in the system provided by an embodiment of the present invention.

[0051] In a preferred embodiment of the present invention, the punching depth calculation unit 103 specifically includes: The current parameter matching module 1031 is used to match the current punching parameters corresponding to the current punching position from a plurality of punching processing parameters; A target recognition module 1032 is configured to perform target recognition on the enhanced detection image and extract a target drill bit image; A size recognition module 1033 is used to perform size recognition on the target drill bit image and determine the depth of the drill bit on the board; A length determination module 1034 is configured to determine a current drill length based on the current drilling parameters; The depth calculation module 1035 is used to calculate the current drilling depth according to the current drill length and the drill depth on the board.

[0052] Furthermore, the sewing machine plate punching depth detection system based on image processing further includes: The processing adjustment control unit 104 is used to perform drilling processing adjustment control according to the current drilling parameters and the current drilling depth.

[0053] In an embodiment of the present invention, the processing adjustment control unit 104 determines the current required depth based on the current punching parameters, and determines whether the processing requirements are met by comparing the current required depth with the current punching depth. If the processing requirements are not met, the processing adjustment depth is calculated, and a processing adjustment instruction is generated based on the processing adjustment depth. Then, the punching processing adjustment control is performed according to the processing adjustment instruction.

[0054] The processing visualization display unit 105 is used to obtain a three-dimensional model of the plate of the sewing machine plate, and perform processing visualization display of the current punching depth based on the three-dimensional model of the plate.

[0055] In an embodiment of the present invention, the processing visualization display unit 105 obtains the internal processing code of the sewing machine plate, and then matches the three-dimensional model of the plate of the sewing machine plate from a preset model database according to the internal processing code, and exports the three-dimensional model of the plate, and generates a punching display image according to the current punching position, the current punching depth and the current punching parameters, and then determines the display area of ​​the punching display image based on the three-dimensional model of the plate, and performs a visualization display of the punching processing on the punching display image in the display area.

[0056] It should be understood that, although the various steps in the flow chart of each embodiment of the present invention are shown in sequence according to the indication of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless otherwise specified herein, the execution of these steps is not strictly limited in order, and these steps can be performed in other orders. Moreover, at least a portion of the steps in each embodiment may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these sub-steps or stages is not necessarily performed in sequence, but can be performed in turn or alternately with at least a portion of other steps or sub-steps or stages of other steps.

[0057] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The program can be stored in a non-volatile computer-readable storage medium. When executed, the program can include the processes of the above-described method embodiments. Any reference to memory, storage, database, or other media used in the various embodiments provided herein may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM).

[0058] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for detecting the punching depth of a sewing machine plate based on image processing, characterized in that: The method comprises the following steps: Receive punching processing requirements of sewing machine plates, plan multiple punching processing positions, match corresponding punching processing parameters, and plan punching detection paths; According to the punching detection path, determine the current punching position, perform punching detection shooting, obtain the detection shooting image, and process the detection shooting image to generate an enhanced detection image; According to the current drilling position, matching the current drilling parameters, identifying the enhanced detection image, determining the drill bit depth on the board, and calculating the current drilling depth; Performing drilling process adjustment control according to the current drilling parameters and the current drilling depth; A three-dimensional model of a sewing machine plate is obtained, and based on the three-dimensional model of the plate, a processing visualization display of the current punching depth is performed.

2. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 1, characterized in that: The receiving of the punching processing requirements of the sewing machine plate, planning a plurality of punching processing positions, matching corresponding punching processing parameters, and planning the punching detection path specifically includes the following steps: Receive punching processing requirements for sewing machine plates; Identify the punching processing requirements and plan multiple punching processing positions; Extracting processing parameter data from the punching processing requirements; Matching punching processing parameters corresponding to a plurality of punching processing positions from the processing parameter data; Plan the punching detection path based on multiple punching processing positions and multiple punching processing parameters.

3. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 2, characterized in that: Planning a punching detection path based on multiple punching processing positions and multiple punching processing parameters includes the following steps: Calculating a detection priority coefficient for each drilling position based on a current required depth and a preset depth tolerance threshold in the plurality of drilling parameters to obtain a priority coefficient corresponding to the drilling position; Based on the drill bit type and hole diameter specifications in the plurality of drilling processing parameters, the drilling processing positions having the same drill bit type and hole diameter specifications are divided into processing parameter groups; Sorting the priority coefficients corresponding to the punching processing positions within the processing parameter group from high to low to obtain a sorting result; Plan the inspection path within the processing parameter group based on the spatial proximity principle and sorting results; Plan the inspection paths between processing parameter groups according to the principle of minimizing the number of switching between processing parameter groups; Based on the detection path within the planned processing parameter group and the detection path between the planned processing parameter groups, a punching detection path is finally generated.

4. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 3, characterized in that: The steps of determining the current punching position according to the punching detection path, performing punching detection shooting, acquiring a detection shooting image, and processing the detection shooting image to generate an enhanced detection image specifically include the following steps: Get the 3D model of the sewing machine plate and all currently processed holes; The unprocessed hole position is regarded as a growth point. The local stress value of each growth point is calculated under the preset load, and the highest stress value is taken as the stress concentration factor to obtain the target growth point. For the target hole position, the distance from the target hole position to the nearest unprocessed hole position and the distance from the target hole position to the next nearest unprocessed hole position are taken, and the two distances are multiplied and the inverse is taken to obtain the hole group density factor of the target growth point; Multiply the stress concentration factor by the hole group density factor of the target growth point to generate a dynamic priority value of the target growth point; Select the unprocessed hole position corresponding to the highest dynamic priority value of the target growth point as the current drilling position to obtain the priority processed hole position; Mark the priority processing holes at corresponding positions on the 3D model to obtain an updated 3D model; Determine the current punching position based on the updated three-dimensional model; For the current punching position, determining a punching detection direction; Perform punch detection shooting according to the punch detection direction to obtain the detection shooting image; The detection image is grayscaled, Gaussian filtering is used to filter image noise, and histogram equalization is used to enhance image contrast to generate an enhanced detection image.

5. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 4, characterized in that: The method of matching the current drilling parameters according to the current drilling position, identifying the enhanced detection image, determining the drill depth on the board, and calculating the current drilling depth specifically includes the following steps: Matching a current punching parameter corresponding to the current punching position from a plurality of punching processing parameters; Performing target recognition on the enhanced detection image to extract a target drill bit image; Performing size recognition on the target drill bit image to determine the drill bit depth on the board; Determining the current drill length according to the current drilling parameters; The current drilling depth is calculated according to the current drill length and the drill depth on the board.

6. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 5, characterized in that: Calculating the current drilling depth according to the current drill length and the drill depth on the board specifically includes the following steps: Performing a basic drilling depth calculation on the current drill bit length and the drill bit depth on the plate to obtain a calculated basic drilling depth; Performing drill bit posture analysis on the enhanced detection image, identifying the angle between the drill bit axis and the normal of a preset reference surface, and calculating a posture correction amount using a preset angle-depth correction model to obtain a calculated posture correction amount; Performing orifice state analysis on the enhanced detection image to identify the degree of obstruction of the orifice burr on the drill bit depth measurement on the plate, and calculating the orifice state correction amount using the angle-depth correction model to obtain the calculated orifice state correction amount; Obtain historical drilling depth data of completed holes within a preset range of the current drilling position, and calculate the spatial depth trend compensation amount using the angle-depth correction model to obtain the calculated spatial depth trend compensation amount; According to the drill type and the current drilling sequence in the current drilling parameters, combined with the wear compensation coefficient of similar drill bits in history, the drill wear dynamic compensation amount is calculated using the angle-depth correction model to obtain the calculated drill wear dynamic compensation amount; The basic drilling depth, the posture correction, the hole state correction, the spatial depth trend compensation and the drill wear dynamic compensation are comprehensively calculated, and the angle-depth correction model is used to finally calculate the current drilling depth.

7. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 6, characterized in that: The drilling process adjustment control according to the current drilling parameters and the current drilling depth specifically includes the following steps: Determining the current required depth according to the current drilling parameters; Compare the current required depth with the current drilling depth to calculate the machining adjustment depth; generating a machining adjustment instruction according to the machining adjustment depth; According to the processing adjustment instruction, the punching processing adjustment control is performed.

8. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 7, characterized in that: Comparing the current required depth with the current drilling depth to calculate the machining adjustment depth specifically includes the following steps: Calculating a basic depth deviation between the current required depth and the current drilling depth to obtain a calculated basic depth deviation; Determine and obtain a feature-error correlation model, perform feature analysis on the enhanced detection image, identify the hole burr feature and the drill side wear feature, and use the feature-error correlation model to calculate the feature compensation amount for the hole burr feature and the drill side wear feature to obtain the calculated feature compensation amount; Obtain the historical records of the machining adjustment depth of completed holes within the preset range of the current drilling position, and use the feature-error correlation model to calculate the spatial prediction compensation amount to obtain the calculated spatial prediction compensation amount; Calculating a drill bit characteristic compensation amount using a feature-error association model based on the drill bit type, current speed parameter, and feed rate parameter in the current drilling parameters and the drill bit type, historical speed parameter, and historical feed rate parameter in the historical drilling parameters to obtain a calculated drill bit characteristic compensation amount; The machining adjustment depth is calculated based on the calculated basic depth deviation, the calculated characteristic compensation amount, the calculated spatial prediction compensation amount and the calculated drill characteristic compensation amount.

9. The method for detecting the punching depth of a sewing machine plate based on image processing according to claim 8, characterized in that: The obtaining of the three-dimensional model of the sewing machine plate and the visual display of the current punching depth based on the three-dimensional model of the plate specifically include the following steps: Get the internal processing code of the sewing machine plate; According to the internal processing code, matching and exporting the three-dimensional model of the sewing machine plate from a preset model database; generating a punching display image according to the current punching position, the current punching depth, and the current punching parameters; Based on the three-dimensional model of the plate, the positioning of the punching process is visualized on the punching display image.

10. A sewing machine plate punching depth detection system based on image processing, characterized in that: The system applies the method for detecting the punching depth of a sewing machine plate based on image processing as described in any one of claims 1 to 9 above, and the system comprises: The detection path planning unit is used to receive the punching processing requirements of the sewing machine plate, plan multiple punching processing positions, match the corresponding punching processing parameters, and plan the punching detection path; a detection and shooting processing unit, configured to determine the current punching position according to the punching detection path, perform punching detection shooting, obtain a detection shooting image, and process the detection shooting image to generate an enhanced detection image; a drilling depth calculation unit, configured to match current drilling parameters according to the current drilling position, identify the enhanced detection image, determine the drill depth on the board, and calculate the current drilling depth; A processing adjustment control unit, configured to perform adjustment control of the drilling process according to the current drilling parameters and the current drilling depth; The processing visualization display unit is used to obtain a three-dimensional model of the plate of the sewing machine plate, and based on the three-dimensional model of the plate, perform processing visualization display of the current punching depth.

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