Testing and sorting all-in-one machine for digital-analog hybrid chip based on industrial vision

Abstract

The invention relates to the technical field of chip testing, and discloses an industrial vision-based digital-analog hybrid chip testing and sorting all-in-one machine which comprises a cabinet body, an opening and closing door is rotatably connected to the inner wall of the cabinet body, a supporting table is fixedly connected to the inner wall of the cabinet body, and an area-array camera is fixedly connected to the inner wall of the cabinet body; the hollow pressing plate can preliminarily fix the digital-analog hybrid chip, the testing stability and data accuracy of the digital-analog hybrid chip can be improved, meanwhile, the area-array camera can measure the surface of the chip, the consistency of imaging postures can be ensured, the deviation of a visual angle can be avoided, the measuring accuracy of the digital-analog hybrid chip can be improved, and the testing accuracy of the digital-analog hybrid chip can be improved. According to the digital-analog hybrid chip sorting device, the influence of chip position deviation is eliminated, measurement errors caused by position deviation can be avoided, the digital-analog hybrid chips can be preliminarily positioned, the measurement efficiency of the device on the digital-analog hybrid chips is improved, and the sorting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to an industrial vision-based all-in-one machine for testing and sorting digital-analog mixed chips. Background Art

[0002] Traditional testing and sorting methods for mixed-signal chips rely primarily on manual inspection and semi-automatic equipment. Manual inspection is not only inefficient and unable to meet the demands of large-scale production, but also results are significantly influenced by the operator's subjective factors, making it prone to missed and false detections. While semi-automatic equipment has improved inspection efficiency to a certain extent, it still suffers from deficiencies such as insufficient accuracy, poor flexibility, and an inability to adapt to diverse chip models. This makes it particularly difficult for traditional methods to achieve comprehensive, rapid, and accurate testing and sorting of mixed-signal chips, especially when faced with complex circuit structures and performance parameters.

[0003] The patent with announcement number CN212160007U discloses an automated chip testing device, which includes a testing body provided with a slide groove along the length direction and a chip mounting seat arranged on the slide groove and movably connected to the slide groove; wherein the testing body is provided with a loading port and a detection port connected to the slide groove in the vertical direction, and an upper chip testing seat is provided at the upper end of the detection port; wherein the chip mounting seat is connected to the push rod of the stroke cylinder, and a lower chip testing seat is provided at the upper end of the chip mounting seat, and the lower chip testing seat has a placement port for accommodating the chip to be tested and fixing the chip to be tested circumferentially, and when the upper chip testing seat and the lower chip testing seat are covered, the upper chip testing seat is used to test the chip to be tested. This patent proposes an automated chip testing device, which aims to achieve the purpose of high-efficiency testing of chips.

[0004] However, when the above device is in use, it is difficult to achieve preliminary positioning of the chip before the chip is clamped, which affects the efficiency of subsequent chip measurement and detection. Therefore, an industrial vision-based integrated testing and sorting machine for mixed digital and analog chips is proposed to solve the above problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to address the deficiencies in the above-mentioned prior art and provide an integrated machine for testing and sorting digital-analog mixed chips based on industrial vision.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: an integrated machine for testing and sorting digital-analog mixed chips based on industrial vision, comprising a cabinet, the inner wall of the cabinet is rotatably connected to an opening and closing door, the inner wall of the cabinet is fixedly connected to a support platform, the inner wall of the cabinet is fixedly connected to a planar array camera, the inner wall of the cabinet is fixedly connected to a cylinder, the inner wall of the support platform is fixedly connected to a placement plate, the top of the support platform is fixedly connected to a motor, the output end of the cylinder is fixedly connected to a horizontal plate, and the top of the horizontal plate is fixedly connected to a fixed block. The circumferential surface of the fixed block is rotatably connected to a pull rod, the inner wall of the support platform is slidably connected to a circular slider, the circumferential surface of the circular slider is fixedly connected to a connecting plate, the inner wall of the connecting plate is fixedly connected to an elastic telescopic rod 1, the telescopic end of the elastic telescopic rod 1 is fixedly connected to a hollow pressure plate, the inner wall of the connecting plate is fixedly connected to the connecting block 1, the inner wall of the connecting block 1 is slidably connected to the fixed plate, the circumferential surface of the fixed plate is fixedly connected to a vertical plate, the top of the support platform is provided with a sorting mechanism for chip sorting, the inner wall of the placement plate A protective mechanism for chip protection is provided, the placement plate is located directly below the area array camera, and the area array camera is used to perform appearance numerical measurement of the digital-analog hybrid chip, the pull rod is rotatably connected to the circumferential surface of the circular slider, the hollow pressure plate is in contact with the support platform, and the hollow pressure plate is used to fix the digital-analog hybrid chip, the vertical plate is in contact with the support platform, and the vertical plate is used to perform preliminary positioning of the digital-analog hybrid chip, so that the hollow pressure plate can perform preliminary fixing of the digital-analog hybrid chip, which can improve the testing stability and data accuracy of the digital-analog hybrid chip. At the same time, the area array camera can measure the chip surface, ensure the consistency of the imaging posture, avoid the deviation of the viewing angle, improve the measurement accuracy of the digital-analog hybrid chip, eliminate the influence of the chip position offset, and avoid the measurement error caused by position deviation. The vertical plate will adjust the angle of the digital-analog hybrid chip through thrust, and can perform preliminary positioning of the digital-analog hybrid chip, reducing the cost of manual placement and positioning, improving the measurement efficiency of the device, ensuring the uniformity of the measurement benchmark, eliminating position deviation, and improving the measurement efficiency of the device in digital-analog hybrid chips.

[0007] Preferably, the sorting mechanism includes a reciprocating screw, a moving block, a limiting column, a fixed block two, an elastic telescopic rod two, a slot plate, a hinge plate, and a push plate. The reciprocating screw is fixedly connected to the output end of the motor, the moving block is movably connected to the circumferential surface of the reciprocating screw, the fixed block two is fixedly connected to the top of the support platform, the limiting column is fixedly connected to the inner wall of the fixed block two, the elastic telescopic rod two is fixedly connected to the inner wall of the moving block, the slot plate is fixedly connected to the telescopic end of the elastic telescopic rod two, the hinge plate is rotatably connected to the inner wall of the slot plate by a torsion spring, and the push plate is fixedly connected to the inner wall of the hinge plate. The sorting mechanism also includes a connecting column and a blocking plate, the connecting column is fixedly connected to the inner wall of the connecting plate, the blocking plate is fixedly connected to the circumferential surface of the connecting column, and the blocking plate is used to limit the digital-analog hybrid chip Protection, the reciprocating screw is rotatably connected to the inner wall of the fixed block 2, the moving block is slidably connected to the circumferential surface of the limit column, the slot plate is in contact with the support table, the push plate is in contact with the support table, and the push plate is used to push and sort unqualified digital-analog hybrid chips, so that the push plate will contact the unqualified digital-analog hybrid chips and push the digital-analog hybrid chips to move, which can automatically sort the measured digital-analog hybrid chips, improve the use efficiency of the device, increase the use effect of the device, reduce the manual sorting cost, and avoid the vibration generated by the movement of parts when the device is started, causing the digital-analog hybrid chip to move, resulting in the displacement of the digital-analog hybrid chip, and then away from the measurement area, which can relatively improve the stability of the digital-analog hybrid chip measurement, avoid damage to the digital-analog hybrid chip, and improve the safety of the device.

[0008] Preferably, the protective mechanism includes a guide plate, a hinged column, a buffer plate, a rotating column, and a roller. The guide plate is fixedly connected to the inner wall of the support platform, the hinged column is rotatably connected to the inner wall of the guide plate by a torsion spring, the buffer plate is fixedly connected to the circumferential surface of the hinged column, and the buffer plate is used to perform preliminary buffering on the digital-analog hybrid chip, the rotating column is rotatably connected to the inner wall of the placement plate, the roller is fixedly connected to the circumferential surface of the rotating column, and the roller is used to reduce the friction generated by the digital-analog hybrid chip when moving, the protective mechanism also includes a connecting block 2, a rotating column, a roller, an adhesion column, a cleaning brush plate, and a collection box, the connecting block 2 is fixedly connected to the rear part of the push plate, the rotating column is rotatably connected to the inner wall of the connecting block 2, the roller is fixedly connected to the circumferential surface of the rotating column, the adhesion column is fixedly connected to the circumferential surface of the rotating column, and The adhesion column is used to clean dust and debris on the surface of the placement plate, the cleaning brush plate is fixedly connected to the circumferential surface of the rotating column, the collection box is fixedly connected to the inner wall of the cabinet, the adhesion column is in contact with the support table, the roller is in contact with the support table, and the roller is used to drive the rotating column to rotate, which can make unqualified digital-analog hybrid chips slowly fall into the collection box, ensuring that unqualified digital-analog hybrid chips will not cause secondary damage when they are returned to the warehouse, improving the comprehensiveness of the sorting of the device, improving the overall sorting effect of the device, and improving the smoothness of the device. During the rotation process, the adhesion column and the cleaning brush plate can adhere and clean the dust and debris on the surface of the placement plate, which can prevent the digital-analog hybrid chips from being damaged due to the adverse effects caused by dust and debris when the test voltage is flowing, and can improve the measurement accuracy of the device.

[0009] The present invention adopts the above technical solution, which can bring the following beneficial effects: 1. The industrial vision-based all-in-one machine for testing and sorting digital-analog hybrid chips, through the coordinated movement of the cabinet, opening and closing door, support platform, area array camera, cylinder, placement plate, motor, horizontal plate, fixed block 1, pull rod, circular slider, connecting plate, elastic telescopic rod 1, hollow pressure plate, connecting block 1, fixed plate, and vertical plate, enables the hollow pressure plate to preliminarily fix the digital-analog hybrid chip, thereby improving the stability and data accuracy of the digital-analog hybrid chip test. At the same time, the area array camera can measure the chip surface, ensure the consistency of the imaging posture, avoid the deviation of the viewing angle, improve the measurement accuracy of the digital-analog hybrid chip, eliminate the influence of the chip position offset, and avoid the measurement error caused by position deviation. The vertical plate will adjust the angle of the digital-analog hybrid chip through thrust, and can preliminarily position the digital-analog hybrid chip, reducing the cost of manual placement and positioning, improving the measurement efficiency of the device, ensuring the uniformity of the measurement benchmark, eliminating position deviation, and improving the measurement efficiency of the device in digital-analog hybrid chips.

[0010] 2. The industrial vision-based all-in-one machine for testing and sorting digital-analog hybrid chips, through the coordinated movement of the reciprocating screw, moving block, limiting column, fixed block 2, elastic telescopic rod 2, slot plate, hinged plate, push plate, connecting column, and blocking plate, makes the push plate contact unqualified digital-analog hybrid chips and push the digital-analog hybrid chips to move. It can automatically sort the measured digital-analog hybrid chips, improve the utilization efficiency of the device, increase the utilization effect of the device, reduce the manual sorting cost, and avoid the vibration generated by the movement of parts when the device is started, causing the digital-analog hybrid chips to move, resulting in displacement of the digital-analog hybrid chips and then away from the measurement area. It can relatively improve the stability of digital-analog hybrid chip measurement, avoid damage to the digital-analog hybrid chips, and improve the safety of the device.

[0011] 3. The industrial vision-based all-in-one machine for testing and sorting digital-analog hybrid chips can make unqualified digital-analog hybrid chips slowly fall into the collection box through the coordinated movement of the guide plate, hinged column, buffer plate, rotating column, roller, connecting block 2, rotating column, roller, adhesion column, cleaning brush plate and collection box, ensuring that unqualified digital-analog hybrid chips will not cause secondary damage when returning to the warehouse, thereby improving the comprehensiveness of the sorting of the device, improving the overall sorting effect of the device, and improving the smoothness of the device. During the rotation process, the adhesion column and the cleaning brush plate can adhere and clean the dust and debris on the surface of the placement plate, which can prevent the digital-analog hybrid chips from being damaged due to the adverse effects of dust and debris when the test voltage is flowing, and can improve the measurement accuracy of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a half-section diagram of the cabinet structure of the present invention; Figure 3 This is a schematic diagram of the support platform structure of the present invention; Figure 4 For the present invention Figure 3 A magnified view of the structure at center A; Figure 5 Schematic diagram of the sorting mechanism of the present invention; Figure 6 For the present invention Figure 5 A magnified view of the structure at point B in the middle; Figure 7 Schematic diagram of the protection mechanism of the present invention; Figure 8 For the present invention Figure 7 A magnified view of the structure at point C in the middle; Figure 9 For the present invention Figure 7 Enlarged view of the structure at point D in the middle.

[0013] In the figure: 1. Cabinet; 2. Opening and closing door; 3. Support platform; 4. Area array camera; 5. Cylinder; 6. Placement plate; 7. Sorting mechanism; 8. Protection mechanism; 9. Motor; 10. Horizontal plate; 11. Fixed block 1; 12. Pull rod; 13. Slider; 14. Connecting plate; 15. Elastic telescopic rod 1; 16. Hollow pressure plate; 17. Connecting block 1; 18. Fixed plate; 19. Vertical plate; 701. Reciprocating screw; 702. Moving block; 703 , limiting column; 704, fixed block two; 705, elastic telescopic rod two; 706, groove plate; 707, hinged plate; 708, push plate; 709, connecting column; 710, blocking plate; 801, guide plate; 802, hinged column; 803, buffer plate; 804, rotating column; 805, roller; 806, connecting block two; 807, rotating column; 808, roller; 809, adhesion column; 810, cleaning brush plate; 811, collection box. DETAILED DESCRIPTION

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0015] See also Figures 1-9 One embodiment of the present invention is: an integrated machine for testing and sorting digital-analog mixed chips based on industrial vision, comprising a cabinet 1, an opening and closing door 2 is rotatably connected to the inner wall of the cabinet 1, a support platform 3 is fixedly connected to the inner wall of the cabinet 1, an area array camera 4 is fixedly connected to the inner wall of the cabinet 1, a cylinder 5 is fixedly connected to the inner wall of the support platform 3, a placement plate 6 is fixedly connected to the inner wall of the support platform 3, a motor 9 is fixedly connected to the top of the support platform 3, an output end of the cylinder 5 is fixedly connected to a horizontal plate 10, and the top of the horizontal plate 10 is fixedly connected to a fixed A fixed block 11, the circumferential surface of the fixed block 11 is rotatably connected to a pull rod 12, the inner wall of the support platform 3 is slidably connected to a circular slider 13, the circumferential surface of the circular slider 13 is fixedly connected to a connecting plate 14, the inner wall of the connecting plate 14 is fixedly connected to an elastic telescopic rod 15, the telescopic end of the elastic telescopic rod 15 is fixedly connected to a hollow pressure plate 16, the inner wall of the connecting plate 14 is fixedly connected to a connecting block 17, the inner wall of the connecting block 17 is slidably connected to a fixed plate 18, and the circumferential surface of the fixed plate 18 is fixedly connected to a vertical plate 19; Before the device is started, the operator who is performing the measurement will first open the opening and closing door 2, and then place the digital-analog hybrid chip to be measured on the top of the placement plate 6. At this time, the cylinder 5 will be started, and the output end of the cylinder 5 will drive the horizontal plate 10 to move downward. In the process of the horizontal plate 10 moving downward, the horizontal plate 10 will drive the fixed block 11 to move downward, and the downward movement of the fixed block 11 will drive the pull rod 12 to move. At the same time, the pull rod 12 will adjust its own angle in the process of moving. In the process of moving the pull rod 12, the circular slider 13 will be driven to move laterally on the inner wall of the support platform 3. The movement of the circular slider 13 will drive the connecting plate 14 to move, and the connecting plate 14 will gradually approach the digital-analog hybrid chip. The movement of the connecting plate 14 will drive the elastic telescopic rod 15 to move. 5 will drive the hollow pressing plate 16 to move. After the hollow pressing plate 16 moves a certain distance, the hollow pressing plate 16 will move downward due to the inclined surface of the support platform 3 and the reset characteristics of the elastic telescopic rod 15. After the hollow pressing plate 16 moves downward for a certain distance through the inclined surface of the support platform 3, the hollow pressing plate 16 will contact the top of the digital-analog hybrid chip. At this time, the hollow pressing plate 16 can preliminarily fix the digital-analog hybrid chip, thereby improving the test stability and data accuracy of the digital-analog hybrid chip. At the same time, the area array camera 4 can measure the chip surface, ensure the consistency of the imaging posture, avoid the deviation of the viewing angle, improve the measurement accuracy of the digital-analog hybrid chip, eliminate the influence of the chip position offset, and avoid the measurement error caused by position deviation. A sorting mechanism 7 for chip sorting is provided on the top of the support platform 3, and a protective mechanism 8 for chip protection is provided on the inner wall of the placement plate 6. The placement plate 6 is located directly below the area array camera 4, and the area array camera 4 is used to perform appearance numerical measurement on the digital-analog hybrid chip. The pull rod 12 is rotatably connected to the circumferential surface of the circular slider 13. The hollow pressure plate 16 is in contact with the support platform 3 and is used to fix the digital-analog hybrid chip. The vertical plate 19 is in contact with the support platform 3 and is used to perform preliminary positioning of the digital-analog hybrid chip. When the device is started, the movement of the connecting plate 14 will drive the movement of the connecting block 17, the movement of the connecting block 17 will drive the movement of the fixed plate 18, and the movement of the fixed plate 18 will drive the vertical plate 19 to move. After moving a certain distance, the vertical plate 19 will contact the digital-analog hybrid chip. At this time, the vertical plate 19 will continue to move through the movement of the fixed plate 18. During the movement of the vertical plate 19, the vertical plate 19 will adjust the angle of the digital-analog hybrid chip through thrust, which can perform preliminary positioning of the digital-analog hybrid chip, reduce the cost of manual placement and positioning, improve the measurement efficiency of the device, ensure the uniformity of the measurement benchmark, eliminate position deviation, and improve the measurement efficiency of the device in the digital-analog hybrid chip.

[0016] The overall working principle: After the hollow pressure plate 16 moves downward for a distance through the inclined surface of the support platform 3, the hollow pressure plate 16 will contact the top of the digital-analog hybrid chip. At this time, the hollow pressure plate 16 can preliminarily fix the digital-analog hybrid chip, which can improve the test stability and data accuracy of the digital-analog hybrid chip. At the same time, the array camera 4 can measure the chip surface, ensure the consistency of the imaging posture, avoid the deviation of the viewing angle, improve the measurement accuracy of the digital-analog hybrid chip, eliminate the influence of the chip position offset, and avoid the measurement error caused by position deviation. During the movement of the vertical plate 19, the vertical plate 19 will adjust the angle of the digital-analog hybrid chip through thrust, which can preliminarily position the digital-analog hybrid chip, reduce the cost of manual placement and positioning, improve the measurement efficiency of the device, ensure the uniformity of the measurement benchmark, eliminate position deviation, and improve the measurement efficiency of the device in digital-analog hybrid chips.

[0017] See also Figures 1-9 On the basis of the above embodiment, in another embodiment of the present invention, the sorting mechanism 7 includes a reciprocating screw 701, a moving block 702, a limiting column 703, a fixed block 704, an elastic telescopic rod 705, a slot plate 706, a hinged plate 707, and a push plate 708. The reciprocating screw 701 is fixedly connected to the output end of the motor 9, the moving block 702 is movably connected to the circumferential surface of the reciprocating screw 701, the fixed block 704 is fixedly connected to the top of the support platform 3, the limiting column 703 is fixedly connected to the inner wall of the fixed block 704, the elastic telescopic rod 705 is fixedly connected to the inner wall of the moving block 702, the slot plate 706 is fixedly connected to the telescopic end of the elastic telescopic rod 705, the hinged plate 707 is rotatably connected to the inner wall of the slot plate 706 by a torsion spring, and the push plate 708 is fixedly connected to the inner wall of the hinged plate 707; When the measurement of the digital-analog hybrid chip is completed, the measurement data is unqualified, and the hollow pressure plate 16 has released the fixation of the digital-analog hybrid chip. At this time, the motor 9 will start, and the output end of the motor 9 will drive the reciprocating screw rod 701 to rotate. The rotation of the reciprocating screw rod 701 will drive the moving block 702 to rotate, but at this time the moving block 702 is limited by the limiting column 703. The limiting column 703 will cause the moving block 702 to be in the process of the rotation of the reciprocating screw rod 701. The moving block 702 can only move laterally through the reciprocating groove on the surface of the reciprocating screw rod 701. During the movement of the moving block 702, the moving block 702 will drive the elastic telescopic rod 2 705 to move. The movement of the elastic telescopic rod 2 705 will drive the slot plate 706 to move. The movement of the slot plate 706 will drive the hinged plate 707 to move. During the movement of the hinged plate 707, the hinged plate 707 will When the chute 706 is in the process of moving horizontally, the chute 706 will move downward for a distance due to the reset characteristics of the inclined surface of the support platform 3 and the elastic telescopic rod 2 705. At this time, the chute 706 itself will come into contact with the placement plate 6. At this time, the movement of the chute 706 will drive the hinged plate 707 to move, and the movement of the hinged plate 707 will drive the push plate 708 to move. After moving a distance, the push plate 708 will also come into contact with the placement plate 6. At this time, the push plate 708 will continue to move. After moving a distance, the push plate 708 will come into contact with the unqualified digital-analog hybrid chip and push the digital-analog hybrid chip to move, so that the measured digital-analog hybrid chips can be automatically sorted, thereby improving the efficiency of the device, increasing the use effect of the device, and reducing the cost of manual sorting. The sorting mechanism 7 also includes a connecting column 709 and a blocking plate 710. The connecting column 709 is fixedly connected to the inner wall of the connecting plate 14, and the blocking plate 710 is fixedly connected to the circumferential surface of the connecting column 709. The blocking plate 710 is used to limit the protection of the digital-analog hybrid chip. The reciprocating screw 701 is rotatably connected to the inner wall of the fixed block 2 704, and the moving block 702 is slidably connected to the circumferential surface of the limiting column 703. The groove plate 706 is in contact with the support platform 3, and the push plate 708 is in contact with the support platform 3. The push plate 708 is used to push and sort unqualified digital-analog hybrid chips. When the device is started, the movement of the circular slider 13 will drive the connecting plate 14 to move, and the connecting plate 14 will drive the connecting column 709 to move during the movement. During the movement of the connecting column 709, the connecting column 709 will drive the blocking plate 710 to move. At this time, the blocking plate 710 will move synchronously with the connecting plate 14. After the blocking plate 710 is at a certain distance, the blocking plate 710 will isolate the opening in the front of the support table 3 from the digital-analog hybrid chip placed on the top of the placement plate 6, so as to avoid the vibration generated by the movement of parts when the device is started, causing the digital-analog hybrid chip to move, resulting in displacement of the digital-analog hybrid chip and then away from the measurement area, which can relatively improve the stability of the digital-analog hybrid chip measurement, avoid damage to the digital-analog hybrid chip, and improve the safety of the device. The protection mechanism 8 includes a guide plate 801, a hinged column 802, a buffer plate 803, a rotating column 804, and a roller 805. The guide plate 801 is fixedly connected to the inner wall of the support platform 3. The hinged column 802 is rotatably connected to the inner wall of the guide plate 801 via a torsion spring. The buffer plate 803 is fixedly connected to the circumferential surface of the hinged column 802 and is used to provide preliminary buffering for the digital-analog hybrid chip. The rotating column 804 is rotatably connected to the inner wall of the placement plate 6. The roller 805 is fixedly connected to the circumferential surface of the rotating column 804 and is used to reduce the friction generated by the digital-analog hybrid chip when it moves. When the push plate 708 pushes the unqualified digital-analog hybrid chip to move a certain distance, the digital-analog hybrid chip will contact the roller 805. At the same time, after the digital-analog hybrid chip passes through multiple rollers 805, the digital-analog hybrid chip can initially slide down through the inclined surface of the guide plate 801. During the sliding process of the digital-analog hybrid chip, the digital-analog hybrid chip will contact the buffer plate 803. At this time, the buffer plate 803 can buffer and guide the digital-analog hybrid chip, so that the unqualified digital-analog hybrid chip can slowly fall into the collection box 811, ensuring that the unqualified digital-analog hybrid chip will not cause secondary damage when returning to the warehouse, thereby improving the comprehensiveness of the sorting of the device, improving the overall sorting effect of the device, and improving the smoothness of the device. The protection mechanism 8 also includes a second connecting block 806, a rotating column 807, a roller 808, an adhesion column 809, a cleaning brush plate 810, and a collection box 811. The second connecting block 806 is fixedly connected to the rear part of the push plate 708, the rotating column 807 is rotatably connected to the inner wall of the second connecting block 806, the roller 808 is fixedly connected to the circumferential surface of the rotating column 807, the adhesion column 809 is fixedly connected to the circumferential surface of the rotating column 807, and the adhesion column 809 is used to clean dust and debris on the surface of the placement plate 6, the cleaning brush plate 810 is fixedly connected to the circumferential surface of the rotating column 807, the collection box 811 is fixedly connected to the inner wall of the cabinet 1, the adhesion column 809 is in contact with the support platform 3, the roller 808 is in contact with the support platform 3, and the roller 808 is used to drive the rotating column 807 to rotate; At the same time, when the push plate 708 moves, the movement of the push plate 708 will drive the connecting block 2 806 to move, and the movement of the connecting block 2 806 will drive the rotating column 807 to move. The rotating column 807 will drive the roller 808 to move during the movement. At this time, the roller 808 will generate friction due to contact with the support platform 3 during the movement, causing the roller 808 to rotate first during the movement, and the rotation of the roller 808 will drive the rotating column 807 to rotate. The rotation of the rotating column 807 will drive the adhesion column 809 to rotate. At the same time, the rotation of the rotating column 807 will also drive the cleaning brush plate 810 to rotate. During the rotation process, the adhesion column 809 and the cleaning brush plate 810 can adhere and clean the dust and debris on the surface of the placement plate 6, which can prevent the digital-analog hybrid chip from being damaged due to the adverse effects caused by dust and debris when the test voltage is flowing, and can improve the measurement accuracy of the device.

[0018] The overall working principle: the movement of the hinged plate 707 will drive the push plate 708 to move, and the push plate 708 will also contact the placement plate 6 after moving a certain distance. At this time, the push plate 708 will continue to move. After moving a certain distance, the push plate 708 will contact the unqualified digital-analog hybrid chip and push the digital-analog hybrid chip to move, which can automatically sort the measured digital-analog hybrid chips, improve the utilization efficiency of the device, increase the utilization effect of the device, and reduce the manual sorting cost. The blocking plate 710 will isolate the opening in the front of the support table 3 from the digital-analog hybrid chip placed on the top of the placement plate 6 to avoid the vibration generated by the movement of parts when the device is started, causing the digital-analog hybrid chip to move, resulting in the displacement of the digital-analog hybrid chip, and then away from the measurement area, which can relatively improve the stability of the digital-analog hybrid chip measurement and avoid the occurrence of digital-analog hybrid chips. The damage of the chip is improved, and the safety of the use of the device is improved. The buffer plate 803 can buffer and guide the digital-analog hybrid chip, and can make the unqualified digital-analog hybrid chip slowly fall into the collection box 811, ensuring that the unqualified digital-analog hybrid chip will not cause secondary damage when returning to the warehouse, thereby improving the comprehensiveness of the sorting of the device, improving the overall sorting effect of the device, and improving the fluency of the device. The rotation of the rotating column 807 will drive the adhesion column 809 to rotate, and the rotation of the rotating column 807 will also drive the cleaning brush plate 810 to rotate. During the rotation process, the adhesion column 809 and the cleaning brush plate 810 can adhere and clean the dust and debris on the surface of the placement plate 6, which can prevent the digital-analog hybrid chip from being damaged due to the adverse effects caused by dust and debris when the test voltage is flowing, and can improve the measurement accuracy of the device.

[0019] The present invention provides an integrated testing and sorting machine for mixed-analog and digital chips based on industrial vision. There are numerous methods and approaches for implementing this technical solution. The above is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art may make improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also within the scope of protection of the present invention. Any components not specified in this embodiment may be implemented using existing technologies.

Claims

1. An integrated machine for testing and sorting digital-analog hybrid chips based on industrial vision, comprising a cabinet (1), characterized in that: The inner wall of the cabinet (1) is rotatably connected to an opening and closing door (2), the inner wall of the cabinet (1) is fixedly connected to a support platform (3), the inner wall of the cabinet (1) is fixedly connected to a planar array camera (4), the inner wall of the cabinet (1) is fixedly connected to a cylinder (5), the inner wall of the support platform (3) is fixedly connected to a placement plate (6), the top of the support platform (3) is fixedly connected to a motor (9), the output end of the cylinder (5) is fixedly connected to a transverse plate (10), the top of the transverse plate (10) is fixedly connected to a fixed block (11), and the circumferential surface of the fixed block (11) is rotatably connected to the inner wall of the cabinet (1). The supporting platform (3) is movably connected with a pull rod (12), the inner wall of the supporting platform (3) is slidably connected with a circular slider (13), the circumferential surface of the circular slider (13) is fixedly connected with a connecting plate (14), the inner wall of the connecting plate (14) is fixedly connected with an elastic telescopic rod (15), the telescopic end of the elastic telescopic rod (15) is fixedly connected with a hollow pressure plate (16), the inner wall of the connecting plate (14) is fixedly connected with a rear connecting block (17), the inner wall of the connecting block (17) is slidably connected with a fixed plate (18), and the circumferential surface of the fixed plate (18) is fixedly connected with a vertical plate (19).

2. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 1, characterized in that: A sorting mechanism (7) for chip sorting is provided on the top of the support platform (3), a protective mechanism (8) for chip protection is provided on the inner wall of the placement plate (6), the placement plate (6) is located directly below the area array camera (4), and the area array camera (4) is used to perform appearance numerical measurement on the digital-analog hybrid chip.

3. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 2, characterized in that: The pull rod (12) is rotatably connected to the circumferential surface of the circular slider (13), the hollow pressure plate (16) is in contact with the support platform (3), and the hollow pressure plate (16) is used to fix the digital-analog hybrid chip, the vertical plate (19) is in contact with the support platform (3), and the vertical plate (19) is used to perform preliminary positioning of the digital-analog hybrid chip.

4. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 3, characterized in that: The sorting mechanism (7) includes a reciprocating screw (701), a moving block (702), a limiting column (703), a second fixed block (704), a second elastic telescopic rod (705), a slot plate (706), a hinge plate (707), and a push plate (708). The reciprocating screw (701) is fixedly connected to the output end of the motor (9), the moving block (702) is movably connected to the circumferential surface of the reciprocating screw (701), and the second fixed block (704) is fixedly connected to the output end of the motor (9). Connected to the top of the support platform (3), the limiting column (703) is fixedly connected to the inner wall of the second fixed block (704), the second elastic telescopic rod (705) is fixedly connected to the inner wall of the moving block (702), the slot plate (706) is fixedly connected to the telescopic end of the second elastic telescopic rod (705), the hinge plate (707) is rotatably connected to the inner wall of the slot plate (706) through a torsion spring, and the push plate (708) is fixedly connected to the inner wall of the hinge plate (707).

5. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 4, characterized in that: The sorting mechanism (7) further comprises a connecting column (709) and a blocking plate (710), wherein the connecting column (709) is fixedly connected to the inner wall of the connecting plate (14), and the blocking plate (710) is fixedly connected to the circumferential surface of the connecting column (709), and the blocking plate (710) is used to limit and protect the digital-analog hybrid chip.

6. The industrial vision-based integrated testing and sorting machine for mixed-analog and digital chips according to claim 5, characterized in that: The reciprocating screw (701) is rotatably connected to the inner wall of the second fixed block (704), the movable block (702) is slidably connected to the circumferential surface of the limiting column (703), the slot plate (706) is in contact with the support table (3), the push plate (708) is in contact with the support table (3), and the push plate (708) is used to push and sort unqualified digital-analog hybrid chips.

7. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 6, characterized in that: The protective mechanism (8) includes a guide plate (801), a hinged column (802), a buffer plate (803), a rotating column (804), and a roller (805). The guide plate (801) is fixedly connected to the inner wall of the support platform (3). The hinged column (802) is rotationally connected to the inner wall of the guide plate (801) via a torsion spring. The buffer plate (803) is fixedly connected to the circumferential surface of the hinged column (802), and the buffer plate (803) is used to perform preliminary buffering on the digital-analog hybrid chip. The rotating column (804) is rotationally connected to the inner wall of the placement plate (6). The roller (805) is fixedly connected to the circumferential surface of the rotating column (804), and the roller (805) is used to reduce the friction generated by the digital-analog hybrid chip when it moves.

8. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 7, characterized in that: The protective mechanism (8) further comprises a second connecting block (806), a rotating column (807), a roller (808), an adhesion column (809), a cleaning brush plate (810), and a collection box (811), wherein the second connecting block (806) is fixedly connected to the rear of the push plate (708), the rotating column (807) is rotatably connected to the inner wall of the second connecting block (806), the roller (808) is fixedly connected to the circumferential surface of the rotating column (807), the adhesion column (809) is fixedly connected to the circumferential surface of the rotating column (807), and the adhesion column (809) is used to clean dust and debris from the surface of the placement plate (6), the cleaning brush plate (810) is fixedly connected to the circumferential surface of the rotating column (807), and the collection box (811) is fixedly connected to the inner wall of the cabinet (1).

9. The industrial vision-based integrated testing and sorting machine for mixed-analog chips according to claim 8, characterized in that: The adhesion column (809) is in contact with the support platform (3), the roller (808) is in contact with the support platform (3), and the roller (808) is used to drive the rotating column (807) to rotate.

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