Automatic testing method and system, electronic equipment and storage medium

Abstract

The invention provides an automatic testing method and system, electronic equipment and a storage medium, and the method comprises the steps: an EAP system issues target parameters and verification levels of wafers of a batch needing to be tested to a testing machine, and the testing machine obtains formula parameters of a defined differentiated testing formula file and a common formula file; the test machine performs uniqueness matching detection on the target parameter and the formula parameter; if the uniqueness matching is passed, a test related file corresponding to the successfully matched formula parameter is obtained; if the uniqueness matching is not passed, performing verification judgment according to the verification level, determining a formula parameter corresponding to the target parameter, and obtaining a test related file; the test mode is determined according to the formula parameters and the test related file, the wafer to be tested is automatically tested according to the test mode and the corresponding test related file, and a differentiated automatic test process can be carried out in an online mode.

Description

Technical Field

[0001] The present invention relates to the field of wafer testing technology, and in particular to an automated testing method, system, electronic equipment and storage medium. Background Art

[0002] In the field of wafer electrical testing, wafer product development uses a test solution aggregation approach (which allows for differentiated testing of different wafers within a batch and different dies within each wafer) to perform differentiated testing on batches of wafers, testing the electrical parameters of specific structures on the wafers. Currently, existing electrical testing equipment can only perform differentiated testing using a test solution aggregation approach in offline mode, relying on manual real-time operation on the test machine, and cannot meet the requirements of fully automated testing. If a fab (wafer factory) wants to use a test solution aggregation approach to perform differentiated testing on wafers, existing automated testing solutions cannot meet their automated testing process requirements. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide an automated testing method, system, electronic device and storage medium to support testing in a test scheme set manner in an online mode to meet the needs of differentiated testing in the online mode.

[0004] In a first aspect, an embodiment of the present invention provides an automated testing method, comprising: an EAP system sends target parameters and verification levels of a batch of wafers to be tested to a test machine, and the test machine obtains the recipe parameters of a defined differentiated test recipe file and a common recipe file; the test machine performs a uniqueness matching test on the target parameters and the recipe parameters: if the uniqueness matching passes, the test-related files corresponding to the successfully matched recipe parameters are obtained; if the uniqueness matching fails, a verification judgment is performed based on the verification level to determine the recipe parameters corresponding to the target parameters, and obtain the test-related files corresponding to the recipe parameters; a test mode is determined based on the recipe parameters determined by the unique matching and the corresponding test-related files, and automated testing is performed on the wafers to be tested based on the test mode and the corresponding test-related files.

[0005] In an optional embodiment of the present application, the above method also includes: the test machine generates a differentiated test recipe file, the differentiated test recipe file includes at least one recipe parameter and its corresponding test-related file; wherein, the differentiated test recipe file is used to characterize the test content of each wafer in each batch.

[0006] In an optional embodiment of the present application, the above-mentioned test-related files include: a test plan file, a differentiated electrical test scheme, and a test algorithm file. The differentiated electrical test scheme is used to define the differentiated test content of each wafer.

[0007] In an optional embodiment of the present application, after the above-mentioned test machine uniquely matches the target parameters with the recipe parameters, it also includes: when the match passes or the verification judgment passes, the test machine sends a verification success flag to the EAP system; after the EAP system receives the verification success flag, it sends a test execution instruction to the test machine.

[0008] In an optional embodiment of the present application, the above-mentioned uniqueness matching detection also includes: the recipe parameters of the differential test recipe file and the ordinary recipe file are formed into multiple matching non-uniqueness situations according to the free combination of no parameters and repeated parameters; the multiple matching non-uniqueness situations are set to the verification level according to the earliest or latest creation time of the recipe file.

[0009] In an optional embodiment of the present application, the above-mentioned multiple matching non-uniqueness situations include: the first situation, the second situation, the third situation and the fourth situation; the first situation is used to characterize that there are no differentiated test formula parameters and no common formula parameters, the second situation is used to characterize that there are repeated differentiated test formula parameters and no common formula parameters, the third situation is used to characterize that there are no differentiated test formula parameters and repeated common formula parameters, and the fourth situation is used to characterize that there are repeated differentiated test formula parameters and repeated common formula parameters.

[0010] In an optional embodiment of the present application, the above-mentioned test machine performs a unique matching test on the target parameters and the recipe parameters, and also includes: determining the parameter category based on the recipe parameters determined by the unique matching, and determining the inspection rules based on the parameter category; the parameter category includes differentiated test recipe parameters and ordinary recipe parameters; according to the inspection rules, the test-related files corresponding to the recipe parameters determined by the unique matching are sequentially subjected to any existence check and test rule check.

[0011] In the second aspect, an embodiment of the present invention also provides an automated testing method, including: the EAP system sends the target parameters of the batch of wafers to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file; the test machine performs a uniqueness matching test on the target parameters and the recipe parameters: if the uniqueness matching is passed, the test-related files corresponding to the successfully matched recipe parameters are obtained; if the uniqueness matching fails, the test machine sends a matching failure flag to the EAP system; the test mode is determined based on the recipe parameters determined by the unique matching and the corresponding test-related files, and the test machine performs differentiated testing on the wafers to be tested based on the test mode and the corresponding test-related files.

[0012] In an optional embodiment of the present application, after the above-mentioned test machine performs a unique matching test on the target parameters and the recipe parameters, it also includes: when the unique matching fails due to the existence of duplicate recipe parameters, the unique matching recipe parameters are determined based on the creation time of the differential test recipe file.

[0013] In the third aspect, an embodiment of the present invention also provides an automated testing system, which is applied to an EAP system and a test machine. The system includes: a communication module, which is used to establish two-way communication between the EAP system and the test machine, and send the target parameters and verification levels of the wafer batch to be tested of the EAP system to the test machine; a verification processing module, which is used to perform a unique matching test on the target parameters and the recipe parameters: if the unique matching is passed, the test-related files corresponding to the successfully matched recipe parameters are obtained; if the unique matching fails, a verification judgment is performed according to the verification level to determine the recipe parameters corresponding to the target parameters, and obtain the test-related files corresponding to the recipe parameters; a differentiated testing module, which is used to determine the test mode according to the recipe parameters determined by the unique matching and the corresponding test-related files, and the test machine performs automated testing on the wafers to be tested according to the test mode and the corresponding test-related files.

[0014] In an optional embodiment of the present application, the above-mentioned system also includes: a definition module for generating a differentiated test recipe file, the differentiated test recipe file including at least one recipe parameter and its corresponding test-related file; wherein, the differentiated test recipe file is used to characterize the test content of each wafer in each batch.

[0015] In a fourth aspect, an embodiment of the present invention further provides an electronic device, including a processor and a memory, wherein the memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the above-mentioned automated testing method.

[0016] In a fifth aspect, an embodiment of the present invention further provides a computer-readable storage medium, which stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions prompt the processor to implement the above-mentioned automated testing method.

[0017] The embodiments of the present invention bring the following beneficial effects: Embodiments of the present invention provide an automated testing method, system, electronic device, and storage medium. An EAP system sends target parameters and verification levels for a batch of wafers to be tested to a tester. The tester then obtains recipe parameters from a defined differentiated test recipe file and a common recipe file. The tester then performs a uniqueness match check between the target parameters and the recipe parameters. If the uniqueness match is successful, the test-related file corresponding to the successfully matched recipe parameters is obtained. If the uniqueness match fails, a verification judgment is performed based on the verification level to determine the recipe parameters corresponding to the target parameters and obtain the test-related file corresponding to the recipe parameters. A test mode is determined based on the recipe parameters determined by the uniqueness match and the corresponding test-related file. Automated testing verification levels are then performed on the wafers to be tested based on the test mode and the corresponding test-related file. In this method, a differentiated test recipe file can be defined during differentiated wafer testing. This file represents the differentiated test content for each wafer in each lot. This allows for a differentiated automated testing process to be performed online, meeting the automated testing requirements of fabs, reducing labor costs, and improving wafer testing efficiency in fabs through this automated testing process.

[0018] Other features and advantages of the present disclosure will be set forth in the following description, or some features and advantages may be inferred or unambiguously determined from the description, or may be learned by practicing the above-mentioned technology of the present disclosure.

[0019] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A flowchart of an automated testing method provided by an embodiment of the present invention; Figure 2 A schematic diagram of an automated testing method provided by an embodiment of the present invention; Figure 3 A flowchart of another automated testing method provided by an embodiment of the present invention; Figure 4 A schematic diagram of another automated testing method provided by an embodiment of the present invention; Figure 5A schematic diagram of performing a re-verification process when the verification level is a first value provided by an embodiment of the present invention; Figure 6 A schematic diagram of performing a re-verification process when the verification level is a second value provided by an embodiment of the present invention; Figure 7 A schematic diagram of performing a re-verification process when the verification level is the third value provided by an embodiment of the present invention; Figure 8 A schematic diagram of a re-verification process when the verification level is the fourth value provided by an embodiment of the present invention; Figure 9 A schematic diagram of a re-verification process when the verification level is the fifth value provided by an embodiment of the present invention; Figure 10 A schematic diagram of a re-verification process provided by an embodiment of the present invention; Figure 11 A schematic diagram of an automated test using a differentiated test module according to an embodiment of the present invention; Figure 12 A schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] Currently, in the field of wafer electrical testing, wafer product development uses a test solution aggregation approach (which allows for differentiated testing of different wafers within a batch and different dies within each wafer) to perform differentiated testing on batches of wafers, testing the electrical parameters of specific structures on the wafers. Existing electrical testing equipment can only perform differentiated testing using a test solution aggregation approach in offline mode during wafer testing, relying on manual real-time operation on the test machine, and cannot meet the requirements of fully automated testing. If a fab wants to use a test solution aggregation approach for differentiated wafer testing, existing automated testing solutions cannot meet the requirements of their automated testing process.

[0024] Based on this, an embodiment of the present invention provides an automated testing method, system, electronic device and storage medium, which specifically provides an automated testing method that supports both conventional testing and differentiated testing in online mode. During the differentiated testing of wafers, a differentiated test recipe file can be defined, which can define differentiated test content for each wafer in each lot (batch). A differentiated automatic testing process can be performed in online mode, thereby realizing the automated testing solution requirements of the FAB factory, reducing labor costs, and improving the wafer testing efficiency of the FAB factory through the automated testing process.

[0025] To facilitate understanding of this embodiment, an automated testing method disclosed in an embodiment of the present invention is first introduced in detail.

[0026] Example 1: The present invention provides an automated testing method. Figure 1 The flowchart of an automated testing method shown in FIG. 1 includes the following steps: In step S102 , the EAP system sends target parameters and calibration levels of the wafer batch to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file and the common recipe file.

[0027] See Figure 2 A schematic diagram of an automated testing method is shown. The test machine can establish two-way communication with a remote EAP (Equipment Automation Programming) system.

[0028] The above-mentioned target parameter is used to identify the recipe file and can be a recipe value, such as a recipe ID. The test machine can determine the corresponding recipe file to execute the corresponding test content through the recipe value issued by the EAP system. However, the regular recipe file may have the same recipe ID as the differentiated test recipe file, so uniqueness determination is required. In the process of determining the uniqueness of the recipe ID, the required recipe file can be determined based on the verification level set and selected by the user. The verification level can be set according to the test requirements. If differentiated testing is required, the differentiated test recipe file is given priority.

[0029] In step S104, the test machine performs a uniqueness match check on the target parameters and the recipe parameters. If the uniqueness match is successful, the test-related files corresponding to the successfully matched recipe parameters are obtained. If the uniqueness match is unsuccessful, a verification judgment is performed based on the verification level to determine the recipe parameters corresponding to the target parameters, and the test-related files corresponding to the recipe parameters are obtained.

[0030] Because both differentiated test recipe files and standard recipe files are manually defined, recipe values ​​may be identical or duplicated, whether due to duplicate definitions, incorrect definitions, or the same definition in different modes. Therefore, this embodiment determines the required recipe file through unique matching. This embodiment performs a unique matching test on the target parameters against the recipe parameters of the defined differentiated test recipe files and standard recipe files. If the unique matching test succeeds, the test-related file corresponding to the successfully matched recipe parameters is obtained. If the unique matching test fails, a further verification is performed based on the verification level.

[0031] In this embodiment, it is possible to determine whether a test-related file corresponding to a recipe value exists based on a unique matching test; if so, a recipe value and its corresponding test-related file are determined.

[0032] Step S106 , determining a test mode based on the recipe parameters determined by unique matching and the corresponding test-related files, and performing automated testing on the wafer to be tested based on the test mode and the corresponding test-related files.

[0033] An embodiment of the present invention provides an automated testing method, in which an EAP system sends target parameters and verification levels of a batch of wafers to be tested to a test machine, and the test machine obtains the recipe parameters of a defined differentiated test recipe file and a common recipe file; the test machine performs a uniqueness matching test on the target parameters and the recipe parameters: if the uniqueness matching is successful, the test machine obtains the test-related files corresponding to the recipe parameters that are successfully matched; if the uniqueness matching fails, the test machine performs a verification judgment based on the verification level, determines the recipe parameters corresponding to the target parameters, and obtains the test-related files corresponding to the recipe parameters; the test machine determines a test mode based on the recipe parameters determined by the unique matching and the corresponding test-related files, and performs an automated test verification level on the wafers to be tested based on the test mode and the corresponding test-related files. In this method, a common recipe file for a batch of wafers and / or a differentiated test recipe file for each wafer in a batch of wafers can be defined in the test software of the test machine. When the user needs to perform differentiated testing, the recipe value and calibration level information of the differentiated test are sent through the EAP system to automatically determine whether there is a recipe value that meets the requirements on the test machine. After that, the test machine defines a test plan for each wafer according to the determined recipe value and performs automatic testing. It can perform differentiated automatic testing processes in online mode, realize the automated testing plan requirements of the FAB factory, reduce labor costs, and improve the wafer testing efficiency of the FAB factory through this automated testing process.

[0034] Example 2: This embodiment provides another automated testing method, which is implemented on the basis of the above embodiment. Figure 3 The flowchart of another automated testing method shown is as follows, the automated testing method includes the following steps: In step S302 , the test machine generates a differentiated test recipe file, where the differentiated test recipe file includes at least one recipe parameter and its corresponding test-related file; wherein the differentiated test recipe file is used to characterize the test content of each wafer in each batch.

[0035] The differentiated test recipe file is used to characterize the test content for each wafer in each batch and may include multiple recipe files. Each recipe file includes the test plan content for each wafer in each batch. The test plan content includes a test plan file, a differentiated electrical test plan, and a test algorithm file. The differentiated electrical test plan is used to define the differentiated test content for each wafer. In addition, the test plan content may also include the creation and update time of the recipe file.

[0036] In step S304 , the EAP system sends the target parameters and calibration levels of the wafer batch to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file and the common recipe file.

[0037] In step S306, the test machine performs a uniqueness match check on the target parameters and the recipe parameters. If the uniqueness match is successful, the test-related files corresponding to the successfully matched recipe parameters are obtained. If the uniqueness match is unsuccessful, a verification judgment is performed based on the verification level to determine the recipe parameters corresponding to the target parameters, and the test-related files corresponding to the recipe parameters are obtained.

[0038] In some embodiments, when the match is successful or the verification is successful, the test machine sends a verification success flag to the EAP system; after receiving the verification success flag, the EAP system sends a test execution instruction to the test machine.

[0039] See also Figure 2 A schematic diagram of an automated testing method is shown, and Figure 4 The diagram shows another automated testing method. Before testing, the remote EAP system establishes two-way communication with the tester. Once established, the remote EAP system sends the target parameters and verification levels for the wafer batch to the tester. After the tester successfully receives and interprets the information, it enters the verification processing module. After the software verification is successful, the tester sends a verification success flag to the remote EAP system. After receiving the verification success flag, the remote EAP sends a test execution command to the tester. After the tester successfully receives and interprets the verification success flag, it executes the differentiated test module. After the test is completed, the software sends the test result status to the remote EAP system.

[0040] After the tester successfully receives and parses the target parameters and verification level sent by the remote EAP, it reads the locally defined differentiated test recipe file and standard recipe file to obtain the local recipe parameter value list. It then performs a uniqueness check based on the target parameters and the local recipe parameter value list. If the recipe parameters are found to be unique, the tester proceeds to the next test flow. If the recipe parameters are not found to be unique, the tester performs a re-verification based on the verification level sent remotely to determine the required recipe parameters.

[0041] In some embodiments, the above-mentioned unique matching detection also includes: the recipe parameters of the differential test recipe file and the ordinary recipe file are formed into multiple matching non-uniqueness situations according to the free combination of no parameters and repeated parameters; the multiple matching non-uniqueness situations are set to the verification level according to the earliest or latest creation time of the recipe file.

[0042] Among them, the above-mentioned multiple matching non-uniqueness situations include: any one or more of the first situation, the second situation, the third situation and the fourth situation; the first situation is used to characterize the non-differentiated test formula parameters and the absence of common formula parameters, the second situation is used to characterize the repeated differentiated test formula parameters and the absence of common formula parameters, the third situation is used to characterize the non-differentiated test formula parameters and the repeated common formula parameters, and the fourth situation is used to characterize the repeated differentiated test formula parameters and the repeated common formula parameters.

[0043] The results of the uniqueness matching detection in this embodiment are not unique, mainly including: no differentiated test formula parameters and no common formula parameters (i.e., the first case), repeated differentiated test formula parameters and no common formula parameters (i.e., the second case), the third case is used to characterize no differentiated test formula parameters and repeated common formula parameters (i.e., the third case), and the fourth case is used to characterize repeated differentiated test formula parameters and repeated common formula parameters (i.e., the fourth case).

[0044] For the above four situations, the verification level can be set as follows: (1) When the verification level is the first value, a verification failure flag is sent to the remote test system.

[0045] See also Figure 5 The diagram shown is a schematic diagram of performing a re-verification process when the verification level is a first value. If the verification level is 0 (ie, the first value), an error is directly reported and all verification failure flags are sent.

[0046] (2) When the verification level is the second value, if it is the first case, a verification failure flag is sent to the remote test system; if it is the second case or the third case, the differentiated test recipe parameter or the common recipe parameter with the earliest creation time is determined from the repeated differentiated test recipe parameters or the repeated common recipe parameters as the recipe parameter for the final output; if it is the fourth case, the common recipe parameter with the earliest creation time is determined from the repeated common recipe parameters as the recipe parameter for the final output.

[0047] See also Figure 6 The diagram shows a re-verification process when the verification level is the second value. If the verification level is 1 (i.e., the second value), in the first case, an error is reported and a verification failure flag is sent. In the second and third cases, the differentiated test recipe parameters or the common recipe parameters with the earliest creation time are used as the final output recipe parameters. In the fourth case, the common recipe parameters with the earliest creation time are used as the final output recipe parameters. A secondary matching process is then performed to obtain a unique recipe parameter value and then perform an existence check.

[0048] (3) When the verification level is the third value, if it is the first case, a verification failure flag is sent to the remote test system; if it is the second or third case, the differentiated test formula parameter or common formula parameter with the earliest creation time is determined from the repeated differentiated test formula parameters or repeated common formula parameters as the final output formula parameter; if it is the fourth case, the differentiated test formula parameter with the earliest creation time is determined from the repeated differentiated test formula parameters as the final output formula parameter. After that, a secondary matching process is performed to obtain a unique formula parameter value and then perform an existence check.

[0049] See also Figure 7 The diagram shown is a schematic diagram of re-verification processing when the verification level is the third value. If the verification level is 2 (i.e., the third value), the first case directly reports an error and sends a verification failure flag. In the second and third cases, the differentiated test recipe parameters or common recipe parameters with the earliest creation time will be the final output recipe parameters. In the fourth case, the differentiated test recipe parameters with the earliest creation time will be determined as the final output recipe parameters.

[0050] (4) When the verification level is the fourth value, if it is the first case, a verification failure flag is sent to the remote test system; if it is the second case or the third case, the differentiated test recipe parameter or the common recipe parameter with the latest creation time is determined from the repeated differentiated test recipe parameters or the repeated common recipe parameters as the recipe parameter for the final output; if it is the fourth case, the common recipe parameter with the latest creation time is determined from the repeated common recipe parameters as the recipe parameter for the final output.

[0051] See also Figure 8The diagram shows a re-verification process when the verification level is the fourth value. If the verification level is 3 (i.e., the fourth value), in the first case, an error is reported and a verification failure flag is sent. In the second and third cases, the differentiated test recipe parameters or the common recipe parameters with the latest creation time are used as the final output recipe parameters. In the fourth case, the common recipe parameters with the latest creation time are used as the final output recipe parameters. A secondary matching process is then performed to obtain a unique recipe parameter value and then verify its existence.

[0052] (5) When the verification level is the fifth value, if it is the first case, a verification failure flag is sent to the remote test system; if it is the second case or the third case, the differentiated test recipe parameter or the common recipe parameter with the latest creation time is determined from the repeated differentiated test recipe parameters or the repeated common recipe parameters as the recipe parameter for the final output; if it is the fourth case, the differentiated test recipe parameter with the latest creation time is determined from the repeated differentiated test recipe parameters as the recipe parameter for the final output.

[0053] See also Figure 9 The diagram shown is a schematic diagram of re-verification processing when the verification level is the fifth value. If the verification level is 4 (i.e., the fifth value), the first case directly reports an error and sends a verification failure flag. In the second and third cases, the differentiated test recipe parameters or common recipe parameters with the latest creation time will be the final output recipe parameters. In the fourth case, the differentiated test recipe parameters with the latest creation time will be determined as the final output recipe parameters.

[0054] It is worth noting that, under the setting of the above-mentioned verification level, the verification level can also include information on the test type or test mode. If the user selects the test mode of differentiated test, the above-mentioned first and third situations will not pass the verification, and the fourth situation will only pass the verification if the differentiated test formula parameters are taken; if the user selects the test mode of normal test, the above-mentioned first and second situations will not pass the verification, and the fourth situation will only pass the verification if the normal test formula parameters are taken.

[0055] In some embodiments, the test machine determines the parameter category based on the recipe parameters determined by the unique match, and determines the inspection rules based on the parameter category; the parameter category includes differentiated test recipe parameters and ordinary recipe parameters; the test machine performs any existence check and test rule check on the test-related files corresponding to the recipe parameters determined by the unique match in turn according to the inspection rules.

[0056] See also Figure 10The following diagram illustrates a re-verification process. If differentiated test recipe parameters are obtained, the corresponding test-related files are retrieved: the test plan file and the test algorithm file. The existence of the differentiated electrical test solution is checked. If any of them do not exist, the verification fails and a verification failure flag is sent. If any of them do exist, the next process is carried out. The defined test-related file contents must comply with the test rules of the differentiated electrical test solution. If not, the verification fails and a verification failure flag is sent. If all of them do, the verification succeeds and a verification success flag is sent.

[0057] like Figure 10 As shown, if the obtained parameters are common recipe parameters, the corresponding test-related files are obtained: the test plan file and the test algorithm file are checked for existence. The existence of the common electrical test solution is checked. If any of them do not exist, the verification fails and a verification failure flag is sent. If any of them exist, the next process is carried out. The defined test-related file contents must comply with the test rules of the common electrical test solution. If not, the verification fails and a verification failure flag is sent. If all of them comply, the verification succeeds and a verification success flag is sent.

[0058] Step S308 , determining a test mode based on the recipe parameters determined by unique matching and the corresponding test-related files, and performing automated testing on the wafer to be tested based on the test mode and the corresponding test-related files.

[0059] See also Figure 11 The schematic diagram of a differentiated test module for automated testing is shown. When the test machine receives the execution test flag of the remote EAP system, the test process is executed. The number of the wafer to be tested in the current card slot is remotely obtained. According to the obtained final output recipe parameters and the corresponding test content, it is determined whether it is a differentiated test recipe ID or a common recipe ID, and the corresponding test plan is executed; if it is a differentiated test recipe ID, a test plan for differentiated testing is defined for each wafer. The test machine is remotely turned on to execute the test plan for differentiated testing. If it is a common recipe ID, a test plan for common testing is defined for each wafer. The test machine is remotely turned on to execute the test plan for common testing. In particular, the key node status information is uploaded to the remote EAP system in real time during the test. After the test is completed, the test result flag is uploaded to the remote EAP system in real time.

[0060] To meet internal and customer requirements for supporting tester software and an EAP system, and to enable remote differential testing of wafers in different lots using the EAP system, it is necessary to define remote differential test solution sets for each lot. This embodiment of the present invention provides an automated testing method for differential testing in online mode. Different differential test recipe files can be configured to select different test solution sets for different wafers in each lot, enabling automated testing in online mode.

[0061] In summary, refer to Figure 2 As shown, a two-way communication is established between the remote EAP system and the test machine. The electrical test plan of the remote test can be added or redefined according to the user's test requirements. The user generates a differentiated test recipe file by executing the definition module. Specifically, it can include setting the recipe ID, recipe file, and the creation and update time of the recipe file. The recipe file includes a test plan file, a differentiated electrical test plan, and a test algorithm file. The remote EAP system sends the target parameters (recipe ID) and verification level to the test machine, which executes the verification processing module to complete the unique matching detection / verification processing. Regardless of the verification result, the verification flag is fed back to the remote EAP system. If the verification is successful, the test execution instruction is sent to the test machine. The test machine accepts the test instruction and parses the relevant information. Finally, the differentiated test information is obtained and automatically tested through the differentiated test module.

[0062] Example 3: Corresponding to the above-mentioned method embodiment, an embodiment of the present invention provides another automated testing method, which includes: the EAP system sends the target parameters of the batch of wafers to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file; the test machine performs a uniqueness matching test on the target parameters and the recipe parameters: if the uniqueness matching is passed, the test-related files corresponding to the successfully matched recipe parameters are obtained; if the uniqueness matching fails, the test machine sends a matching failure flag to the EAP system; the test mode is determined based on the recipe parameters determined by the unique matching and the corresponding test-related files, and the test machine performs differentiated testing on the wafers to be tested based on the test mode and the corresponding test-related files.

[0063] In some embodiments, after the above-mentioned test machine performs a unique matching test on the target parameters and the recipe parameters, it also includes: when the unique matching fails due to the existence of duplicate recipe parameters, the test machine determines the unique matching recipe parameters based on the creation time of the differential test recipe file.

[0064] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working process of the automated testing method described above can refer to the corresponding process in the aforementioned embodiment of the automated testing method, and will not be repeated here.

[0065] Example 4: An embodiment of the present invention also provides an automated testing system, which is applied to an EAP system and a test machine. The system includes: a communication module, which is used to establish two-way communication between the EAP system and the test machine, and send the target parameters and verification levels of the wafer batch to be tested of the EAP system to the test machine; a verification processing module, which is used to perform a unique matching test on the target parameters and the recipe parameters: if the unique matching is successful, the test-related files corresponding to the successfully matched recipe parameters are obtained; if the unique matching fails, a verification judgment is performed based on the verification level to determine the recipe parameters corresponding to the target parameters, and the test-related files corresponding to the recipe parameters are obtained; a differential testing module, which is used to determine a test mode based on the recipe parameters determined by the unique matching and the corresponding test-related files, and the test machine performs automated testing on the wafers to be tested based on the test mode and the corresponding test-related files.

[0066] In some embodiments, the above system also includes: a differentiated test recipe generation module, used to generate a differentiated test recipe file, the differentiated test recipe file includes at least one recipe parameter and its corresponding test-related file; wherein the differentiated test recipe file is used to characterize the test content of each wafer in each batch.

[0067] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working process of the automated testing system described above can refer to the corresponding process in the aforementioned embodiment of the automated testing method, and will not be repeated here.

[0068] Embodiment 5: The embodiment of the present invention also provides an electronic device for running the above-mentioned automated testing method; see Figure 12 The structure diagram of an electronic device shown in the figure includes a memory 100 and a processor 101, wherein the memory 100 is used to store one or more computer instructions, and the one or more computer instructions are executed by the processor 101 to implement the above-mentioned automated testing method.

[0069] Furthermore, Figure 12 The electronic device shown further includes a bus 102 and a communication interface 103 , and the processor 101 , the communication interface 103 and the memory 100 are connected via the bus 102 .

[0070] The memory 100 may include high-speed random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage. The communication connection between the system network element and at least one other network element is achieved through at least one communication interface 103 (which may be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. may be used. The bus 102 may be an ISA bus, a PCI bus, or an EISA bus. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 12 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0071] The processor 101 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in the processor 101 or software instructions. The above processor 101 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in conjunction with the embodiments of the present invention can be directly embodied as being executed by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium well-known in the art, such as a random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or register. The storage medium is located in the memory 100, and the processor 101 reads the information in the memory 100 and, in conjunction with its hardware, completes the steps of the method of the aforementioned embodiment.

[0072] An embodiment of the present invention also provides a computer-readable storage medium, which stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions prompt the processor to implement the above-mentioned automated testing method. The specific implementation can be found in the method embodiment and will not be repeated here.

[0073] The computer program products of the automated testing methods, devices, electronic devices, and storage media provided in the embodiments of the present invention include computer-readable storage media storing program codes. The instructions included in the program codes can be used to execute the methods in the previous method embodiments. For specific implementations, please refer to the method embodiments and will not be repeated here.

[0074] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working process of the system and / or device described above can refer to the corresponding process in the aforementioned method embodiment and will not be repeated here.

[0075] In addition, in the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0076] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the method of the present invention. The aforementioned storage medium includes various media that can store program code, such as USB flash drives, mobile hard drives, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical disks.

[0077] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0078] Finally, it should be noted that the above embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above embodiments within the technical scope disclosed by the present invention, or replace some of the technical features therein with equivalents. Such modifications, changes or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An automated testing method, characterized in that: The method comprises: The EAP system sends the target parameters and calibration levels of the wafer batch to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file and the common recipe file; The test machine performs a unique matching test on the target parameter and the recipe parameter. If the unique matching is successful, the test-related file corresponding to the successfully matched recipe parameter is obtained. If the unique matching is unsuccessful, a verification judgment is performed according to the verification level to determine the recipe parameter corresponding to the target parameter, and the test-related file corresponding to the recipe parameter is obtained. A test mode is determined based on the recipe parameters determined by unique matching and the corresponding test-related files, and an automated test is performed on the wafer to be tested based on the test mode and the corresponding test-related files.

2. The method according to claim 1, characterized in that The method further comprises: The test machine generates a differential test recipe file, which includes at least one recipe parameter and its corresponding test-related file; wherein the differential test recipe file is used to characterize the test content of each wafer in each batch.

3. The method according to claim 2, characterized in that The test-related files include: a test plan file, a differentiated electrical test scheme, and a test algorithm file. The differentiated electrical test scheme is used to define the differentiated test content of each wafer.

4. The method according to claim 1, wherein After the test machine uniquely matches the target parameter with the recipe parameter, the method further includes: When the match is successful or the verification is successful, the test machine sends a verification success flag to the EAP system; After receiving the verification success flag, the EAP system sends a test execution instruction to the test machine.

5. The method according to claim 1, wherein The unique matching detection further includes: The recipe parameters of the differentiated test recipe file and the common recipe file form a variety of matching non-unique situations according to the free combination of no parameters and repeated parameters; The multiple matching non-uniqueness situations are configured with verification levels according to whether the recipe file creation time is earliest or latest.

6. The method according to claim 5, characterized in that The multiple matching non-uniqueness situations include: a first situation, a second situation, a third situation, and a fourth situation; The first case is used to characterize that there are no differentiated test recipe parameters and no common recipe parameters, the second case is used to characterize that there are repeated differentiated test recipe parameters and no common recipe parameters, the third case is used to characterize that there are no differentiated test recipe parameters and repeated common recipe parameters, and the fourth case is used to characterize that there are repeated differentiated test recipe parameters and repeated common recipe parameters.

7. The method according to claim 5, characterized in that After the test machine performs unique matching detection on the target parameter and the recipe parameter, the method further includes: Determining parameter categories based on the recipe parameters determined by unique matching, and determining inspection rules based on the parameter categories; the parameter categories include differentiated test recipe parameters and common recipe parameters; According to the check rules, any existence check and test rule check are performed on the test-related files corresponding to the recipe parameters determined by unique matching in sequence.

8. An automated testing method, characterized in that: The method comprises: The EAP system sends the target parameters of the wafer batch to be tested to the test machine, and the test machine obtains the recipe parameters of the defined differentiated test recipe file; The test machine performs a unique matching test on the target parameter and the recipe parameter. If the unique matching is successful, the test-related file corresponding to the successfully matched recipe parameter is obtained. If the unique matching is unsuccessful, the test machine sends a match failure flag to the EAP system. A test mode is determined according to the recipe parameters determined by unique matching and the corresponding test-related files, and the test machine performs differentiated testing on the wafer to be tested according to the test mode and the corresponding test-related files.

9. The method according to claim 8, characterized in that After the test machine performs unique matching detection on the target parameter and the recipe parameter, the method further includes: When the unique matching fails due to duplicate recipe parameters, the unique matching recipe parameters are determined based on the creation time of the differential test recipe file.

10. An automated testing system, characterized in that: Applicable to EAP system and test machine, the system includes: The communication module is used to establish two-way communication between the EAP system and the test machine, and send the target parameters and calibration levels of the wafer batch to be tested by the EAP system to the test machine; a verification processing module, configured to perform a uniqueness matching test between the target parameter and the recipe parameter; if the uniqueness matching is successful, obtaining the test-related files corresponding to the successfully matched recipe parameter; if the uniqueness matching is unsuccessful, performing a verification judgment based on the verification level, determining the recipe parameter corresponding to the target parameter, and obtaining the test-related files corresponding to the recipe parameter; The differential test module is used to determine the test mode according to the recipe parameters determined by unique matching and the corresponding test-related files, and the test machine performs automated testing on the wafer to be tested according to the test mode and the corresponding test-related files.

11. The automated testing system according to claim 10, wherein: The system further comprises: A definition module is used to generate a differentiated test recipe file, wherein the differentiated test recipe file includes at least one recipe parameter and its corresponding test-related file; wherein the differentiated test recipe file is used to characterize the test content of each wafer in each batch.

12. An electronic device, characterized in that: The system comprises a processor and a memory, wherein the memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the automated testing method according to any one of claims 1 to 7.

13. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions prompt the processor to implement the automated testing method according to any one of claims 1 to 7.

Images