Pickup assembly and head-mounted device

Abstract

The embodiment of the invention discloses a pickup assembly and head-mounted equipment, a bone conduction microphone and a nose pad are arranged on two sides of a first side wall of an equipment main body of the head-mounted equipment, and vibration conduction between the nose pad and the bone conduction microphone is realized through a connecting piece penetrating through the first side wall. The first buffer pad is arranged between the nose pad and the first side wall, and the second buffer pad is arranged between the bone conduction microphone and the first side wall, so that the vibration of the equipment main body is prevented from being transmitted to the bone conduction microphone, and the influence of audio playing of a loudspeaker of the head-mounted equipment on microphone pickup can be reduced; and the accuracy and sensitivity of user speech recognition in a noisy environment are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent wearable devices, and more particularly to a sound pickup component and a head-mounted device. Background Art

[0002] Smart wearable devices, such as smart glasses, head-mounted displays, and headphones, typically use multiple acoustic microphones to collect sound. For example, smart glasses can have one or more acoustic microphones placed on the frame or temples. However, this microphone configuration has limited noise suppression capabilities in environments with high ambient noise levels.

[0003] Bone conduction microphones detect the wearer's voice by converting the vibrations of the skin on the jawbone (caused by oral resonance) and the skin on the nasal bone (caused by nasal resonance) into electrical signals. This reduces interference from external noise, making voice recognition more convenient and accurate. However, current smart wearable devices using bone conduction microphones can vibrate during use, such as when the device is impacted or when its speakers emit sound. These vibrations can easily be transmitted to and picked up by the bone conduction microphone, affecting the accuracy of sound pickup. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a sound pickup assembly and a head-mounted device, which are conducive to improving or solving at least some of the above problems existing in the prior art.

[0005] In a first aspect, an embodiment of the present invention provides a sound pickup assembly for a head-mounted device, the head-mounted device comprising a device body, the device body having a first side wall, the first side wall having opposite first and second sides, the first side wall also having a first through-hole passing through the first side and the second side; the sound pickup assembly comprising a nose pad, a bone conduction microphone, a first cushion, a second cushion and a connector; the nose pad is arranged on the first side of the first side wall; the bone conduction microphone is arranged on the second side of the first side wall; the first cushion is arranged between the nose pad and the first side wall, the first cushion is made of a flexible material; the second cushion is arranged between the bone conduction microphone and the first side wall, the second cushion is made of a flexible material; the connector has opposite first and second ends, the first end is rigidly connected to the nose pad, and the second end passes through the first through-hole and is rigidly connected to the bone conduction microphone.

[0006] Furthermore, the nose pad includes a nose contact portion and a base; the nose contact portion is used to contact the user's nose; the base is rigidly connected to the nose contact portion, and the base has a mounting hole; wherein the connecting member passes through the mounting hole, and the first buffer pad is arranged between the base and the first side wall.

[0007] Furthermore, the mounting hole includes a through hole section and a countersunk hole, the countersunk hole is provided at one end of the through hole section away from the first side wall, the connecting member is a screw, and the head of the screw is at least partially provided in the countersunk hole.

[0008] Furthermore, the first buffer pad has a second through-hole, and the connecting member passes through the second through-hole; and / or the second buffer pad has a third through-hole, and the connecting member passes through the third through-hole.

[0009] Furthermore, the pickup assembly also includes a mounting bracket, the bone conduction microphone is rigidly connected to the mounting bracket, the second end is rigidly connected to the mounting bracket, and the second buffer pad is arranged between the mounting bracket and the first side wall.

[0010] Furthermore, the mounting bracket has a mounting groove on a side opposite to the first side wall, and the bone conduction microphone is fixed in the mounting groove.

[0011] Furthermore, the mounting bracket has a threaded hole, the second end has an external thread matching the threaded hole, and the external thread is connected to the threaded hole; and / or, the bone conduction microphone is fixedly connected to the mounting bracket by an adhesive.

[0012] In a second aspect, an embodiment of the present invention further provides a head-mounted device comprising at least one sound pickup assembly as described in the first aspect.

[0013] Furthermore, the device body has a cavity, the bone conduction microphone and the second buffer pad are arranged in the cavity, and the first side wall is a side wall of the cavity.

[0014] Furthermore, the head-mounted device is smart glasses, the device body includes a frame, and the frame has the first side wall.

[0015] An embodiment of the present invention provides a sound pickup assembly and a head-mounted device. By arranging a bone conduction microphone and a nose pad on both sides of a first side wall of a device body of the head-mounted device, vibration conduction between the nose pad and the bone conduction microphone is achieved through a connector penetrating the first side wall. In addition, a first buffer pad is arranged between the nose pad and the first side wall, and a second buffer pad is arranged between the bone conduction microphone and the first side wall, so as to prevent the vibration of the device body itself from being transmitted to the bone conduction microphone. This can reduce the influence of audio played by the head-mounted device's own speaker on the microphone pickup, thereby improving the accuracy and sensitivity of user voice recognition in noisy environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of a sound pickup assembly according to an embodiment of the present invention from one perspective;

[0018] Figure 2 is a schematic diagram of the three-dimensional structure of a sound pickup assembly according to an embodiment of the present invention from another perspective;

[0019] Figure 3 is a schematic diagram of an exploded structure of a pickup assembly according to one embodiment of the present invention;

[0020] Figure 4 is a cross-sectional schematic diagram of the installation of a pickup assembly and a device body according to an embodiment of the present invention;

[0021] Figure 5 FIG. 1 is a schematic diagram of a head mounted device according to an embodiment of the present invention.

[0022] Description of reference numerals:

[0023] 1-pickup assembly; 10-device body; 11-first side wall; 111-first through-hole; 12-cavity; 13-frame; 20-nose pad; 21-nose contact portion; 22-base; 221-mounting hole; 2211-through-hole section; 2212-counterbore; 30-bone conduction microphone; 40-first cushion; 41-second through-hole; 50-second cushion; 51-third through-hole; 60-connector; 61-first end; 62-second end; 63-external thread; 64-screw head; 70-mounting bracket; 71-mounting slot; 72-threaded hole. DETAILED DESCRIPTION

[0024] The present application is described below based on the following embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. To avoid obscuring the essence of the present application, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0025] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0026] Unless the context clearly requires otherwise, words like “include”, “comprising” and the like throughout this application should be interpreted as including rather than exclusive or exhaustive; that is, as meaning “including but not limited to”.

[0027] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of this application, unless otherwise specified, "plurality" means two or more.

[0028] The embodiment of the present invention provides a head-mounted device and a sound pickup assembly 1 used in the head-mounted device. Figure 5 The head-mounted device includes a device body 10, which is worn on the user's head during use. The head-mounted device can be a virtual reality (VR) head-mounted display device, an augmented reality (AR) head-mounted display device, a mixed reality (MR) head-mounted display device, smart glasses, etc.

[0029] The head-mounted device includes a control circuit. The control circuit may include a processor for controlling the overall operation of the smart glasses and may include one or more processing units. For example, the processor may include at least one of a central processing unit (CPU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a video processing unit (VPU), a video codec, a digital signal processor (DSP), a baseband processor, and a neural-network processing unit (NPU). The different processing units may be independent devices or integrated into one or more processors. The controller may generate operation control signals based on instruction opcodes and timing signals to control the acquisition and execution of instructions. The processor may also be provided with a memory for storing instructions and data. The processor executes the instructions stored in the memory to execute various functional applications and data processing of the smart glasses. In some embodiments, the memory is a cache memory.

[0030] Reference Figure 1-Figure 5 The head-mounted device includes a sound pickup assembly 1 for picking up sound. In an embodiment of the present invention, the sound pickup assembly 1 includes a bone conduction microphone 30. The bone conduction microphone 30 can be electrically connected to a control circuit. The control circuit can perform necessary processing on the electrical signal converted from the vibration picked up by the bone conduction microphone 30 and can control the activation and deactivation of the bone conduction microphone 30.

[0031] In the embodiment of the present invention, referring to Figure 4The device body 10 has a first sidewall 11 having opposing first and second sides. The first sidewall 11 also has a first through-hole 111 extending through the first and second sides. The sound pickup assembly 1 also includes a nose pad 20 and a connector 60. The nose pad 20 is located on the first side of the first sidewall 11, and the bone conduction microphone 30 is located on the second side of the first sidewall 11. The connector 60 has opposing first and second ends 61 and 62. The connector 60 extends through the first through-hole 111. The first end 61 is located on the first side of the first sidewall 11 and rigidly connected to the nose pad 20, while the second end 62 is located on the second side of the first sidewall 11 and rigidly connected to the bone conduction microphone 30. When a user wears the head-mounted device, the nose pad 20 fits snugly against the user's nose. When the user speaks, the nasal bone vibrates. The vibration of the skin on the nasal bone is transmitted to the nose pad 20, and then transmitted to the bone conduction microphone 30 through the connector 60, enabling the bone conduction microphone 30 to convert the vibration into an electrical signal. Since the connection between the connector 60 and the nose pad 20 and the bone conduction microphone 30 is a rigid connection, the vibration of the user's nose can be transmitted to the bone conduction microphone 30 more completely and accurately, thereby improving the accuracy and detection sensitivity of the sound pickup by the bone conduction microphone 30.

[0032] In this embodiment, the pickup assembly 1 further includes a first buffer pad 40 and a second buffer pad 50. The first buffer pad 40 is provided between the base 22 and the first side wall 11 as a buffer component, and the second buffer pad 50 is provided between the bone conduction microphone 30 and the first side wall 11 as a buffer component. The first buffer pad 40 and the second buffer pad 50 are both made of a flexible material, which can absorb and buffer the vibration of the first side wall 11, and prevent the vibration of the device body 10 from being transmitted to the bone conduction microphone 30 through the first side wall 11, thereby improving the detection accuracy of the bone conduction microphone 30 in picking up the user's voice. The first buffer pad 40 and the second buffer pad 50 can be made of the same material or different materials. For example, the first buffer pad 40 and the second buffer pad 50 can include one or more of ethylene-vinyl acetate copolymer (EVA) foam, polyurethane (PU) foam, rubber, silicone, flexible composite materials, or other materials with vibration isolation and buffering properties.

[0033] The first cushioning pad 40 may include one or more first cushioning pads to achieve good vibration isolation between the nose pad 20 and the first side wall 11. For example, in one embodiment, there may be multiple first cushioning pads 40, with the multiple first cushioning pads 40 being interposed between the nose pad 20 and the first side wall 11 and surrounding the outer periphery of the connector 60. In another embodiment, the first cushioning pad 40 has a second through-hole 41 through which the connector 60 passes.

[0034] Similar to the arrangement of the first cushion 40, one or more second cushions 50 may be included to achieve effective vibration isolation between the bone conduction microphone 30 and the first sidewall 11. For example, in one embodiment, multiple second cushions 50 may be provided, with the plurality of second cushions 50 positioned between the bone conduction microphone 30 and the first sidewall 11 and surrounding the outer periphery of the connector 60. In another embodiment, the second cushion 50 has a third through-hole 51, through which the connector 60 passes.

[0035] The specific shape and structure of the nose pad 20 can be designed according to the specific application scenario requirements of the head-mounted device, and the embodiments of the present invention are not limited to this. In some embodiments, the nose pad 20 includes a nose contact portion 21 and a base 22, wherein the nose contact portion 21 is used to contact the user's nose, and can be made of, for example, silicone, rubber, plastic, titanium alloy, or other materials that are less irritating to the skin. The base 22 is rigidly connected to the nose contact portion 21, and the nose contact portion 21 transmits the vibration of the nose to the base 22. The base 22 has a mounting hole 221, and the connector 60 passes through the mounting hole 221 to achieve connection with the base 22.

[0036] In one embodiment, the connector 60 is a screw, and the first end 61 of the connector 60 is the screw head 64. The mounting hole 221 includes a through-hole section 2211 and a countersunk hole 2212. The countersunk hole 2212 is located at the end of the through-hole section 2211 away from the first side wall 11. The screw head 64 is at least partially hidden in the countersunk hole 2212, which improves the appearance of the head-mounted device.

[0037] In some embodiments, the pickup assembly 1 further includes a mounting bracket 70, the bone conduction microphone 30 is rigidly connected to the mounting bracket 70, and the second end 62 is rigidly connected to the mounting bracket 70. The second buffer pad 50 is provided between the mounting bracket 70 and the first side wall 11, and its size can match the size of the mounting bracket 70 to achieve a good vibration filtering effect. Optionally, the mounting bracket 70 has a threaded hole 72, and the second end 62 of the connector 60 has an external thread 63 that matches the threaded hole 72. The external thread 63 is screwed and connected to the threaded hole 72 to achieve fixation. The provision of the mounting bracket is conducive to improving the convenience of assembling the pickup assembly 1 and the device body 10. The bone conduction microphone 30 can be fixedly connected to the mounting bracket 70 by fasteners or by adhesives.

[0038] In one embodiment, the mounting bracket 70 has a mounting slot 71 on a side opposite the first sidewall 11. The bone conduction microphone 30 is secured in the mounting slot 71. The mounting slot 71 can position and protect the bone conduction microphone 30. Optionally, the bone conduction microphone 30 can be secured in the mounting slot 71 by adhesive.

[0039] In some embodiments, as Figure 4 As shown, the head-mounted device body 10 has a cavity 12, a bone conduction microphone 30 is disposed within the cavity 12, and the first sidewall 11 serves as a sidewall of the cavity 12. That is, the bone conduction microphone 30 is disposed within the cavity 12, while the nose pad 20 is disposed outside the cavity 12. Placing the bone conduction microphone 30 within the cavity 12 and then transmitting vibrations from the nose pad 20 outside the cavity 12 to the bone conduction microphone 30 via the connector 60 that passes through the first sidewall 11 can protect the bone conduction microphone 30.

[0040] In one application scenario, refer to Figure 5 If the head-mounted device is a pair of smart glasses, the device body 10 may include a frame 13 having the first side wall 11. That is, the bone conduction microphone 30 may be disposed inside the cavity 12 of the frame 13 near the nose pad 20.

[0041] The technical solution of the embodiment of the present invention is to arrange the bone conduction microphone 30 and the nose pad 20 on both sides of the first side wall 11 of the device body 10 of the head-mounted device, realize vibration conduction between the nose pad 20 and the bone conduction microphone 30 through the connecting piece 60 that passes through the first side wall 11, and arrange a first buffer pad 40 between the nose pad 20 and the first side wall 11, and arrange a second buffer pad 50 between the bone conduction microphone 30 and the first side wall 11, so as to prevent the vibration of the device body 10 itself from being transmitted to the bone conduction microphone 30, thereby reducing the influence of the audio played by the speaker of the head-mounted device itself on the microphone pickup, thereby improving the accuracy and sensitivity of user voice recognition in noisy environments.

[0042] The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application are intended to be within the scope of protection of the present application.

Claims

1. A sound pickup assembly for a head-mounted device, characterized in that: The head-mounted device comprises a device body (10), wherein the device body (10) has a first side wall (11), wherein the first side wall (11) has a first side and a second side opposite to each other, and the first side wall (11) further has a first through hole (111) passing through the first side and the second side; the sound pickup assembly (1) comprises: a nose pad (20) provided on the first side of the first side wall (11); a bone conduction microphone (30), disposed on the second side of the first side wall (11); a first buffer pad (40), disposed between the nose pad (20) and the first side wall (11), wherein the first buffer pad (40) is made of a flexible material; a second buffer pad (50), provided between the bone conduction microphone (30) and the first side wall (11), the second buffer pad (50) being made of a flexible material; and A connecting member (60) has a first end (61) and a second end (62) opposite to each other, wherein the first end (61) is rigidly connected to the nose pad (20), and the second end (62) passes through the first through-hole (111) and is rigidly connected to the bone conduction microphone (30).

2. The pickup assembly according to claim 1, wherein: The nose pad (20) comprises: a nose contact portion (21) for contacting the nose of a user; and a base (22) rigidly connected to the nose contact portion (21), the base (22) having a mounting hole (221); The connecting member (60) passes through the mounting hole (221), and the first buffer pad (40) is arranged between the base (22) and the first side wall (11).

3. The pickup assembly according to claim 2, wherein: The mounting hole (221) comprises a through-hole section (2211) and a countersunk hole (2212), wherein the countersunk hole (2212) is provided at one end of the through-hole section (2211) away from the first side wall (11), and the connecting member (60) is a screw, wherein the head (64) of the screw is at least partially provided in the countersunk hole (2212).

4. The pickup assembly according to claim 1, wherein: The first buffer pad (40) has a second through-hole (41), and the connecting member (60) passes through the second through-hole (41); and / or The second buffer pad (50) has a third through-hole (51), and the connecting member (60) passes through the third through-hole (51).

5. The pickup assembly according to claim 1, wherein: The pickup assembly (1) further includes a mounting bracket (70), the bone conduction microphone (30) is rigidly connected to the mounting bracket (70), the second end (62) is rigidly connected to the mounting bracket (70), and the second buffer pad (50) is arranged between the mounting bracket (70) and the first side wall (11).

6. The pickup assembly according to claim 5, characterized in that The mounting bracket (70) has a mounting groove (71) on a side opposite to the first side wall (11), and the bone conduction microphone (30) is fixed in the mounting groove (71).

7. The pickup assembly according to claim 5, wherein: The mounting bracket (70) has a threaded hole (72), the second end (62) has an external thread (63) matching the threaded hole (72), and the external thread (63) is connected to the threaded hole (72); and / or The bone conduction microphone (30) is fixedly connected to the mounting bracket (70) via an adhesive.

8. A head-mounted device, characterized in that: The invention comprises at least one pickup assembly (1) according to any one of claims 1 to 7.

9. The head-mounted device according to claim 8, wherein: The device body (10) has a cavity (12), the bone conduction microphone (30) and the second buffer pad (50) are arranged in the cavity (12), and the first side wall (11) is a side wall of the cavity (12).

10. The head mounted device according to claim 8, wherein: The head-mounted device is a pair of smart glasses, the device body (10) comprises a frame (13), and the frame (13) has the first side wall (11).

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