A naked eye 3D display device and a manufacturing method thereof

Abstract

The application relates to a naked-eye 3D display device and a preparation method thereof, and relates to the technical field of semiconductor display. In the preparation method of the naked-eye 3D display device, a first magnetic metal ion injection area is formed in a central region of the substrate of a first Micro LED unit, a second magnetic metal ion injection area is formed in an edge region, the magnetic metal ion concentration of the second magnetic metal ion injection area is greater than that of the first magnetic metal ion injection area, the injection depth of the second magnetic metal ion injection treatment is greater than that of the first magnetic metal ion injection area, and the shape of the magnetic structure of the Micro LED unit is effectively improved through the above process mode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor light emitting, in particular to a naked eye 3D display device and a preparation method thereof. BACKGROUND

[0002] The naked eye 3D display technology is a display technology that can obtain a realistic stereoscopic image with space and depth without wearing any auxiliary equipment. This technology uses the parallax characteristics of the two eyes of a person, and through specific optical technology and algorithms, different images are seen by the two eyes, thereby synthesizing a stereoscopic visual effect in the brain. Compared with the traditional 3D display technology, the naked eye 3D display technology has the technical advantages of not needing to wear auxiliary equipment, wide viewing angle range, high brightness, clear image quality, supporting multiple devices and scenes, etc. With the continuous breakthrough and development of semiconductor micro LED display technology, the super-high resolution display panel provides more possibilities for the naked eye 3D display technology. How to improve the preparation process of the naked eye 3D display device has attracted widespread attention. SUMMARY

[0003] The purpose of the present application is to overcome the shortcomings of the prior art, and to provide a naked eye 3D display device and a preparation method thereof.

[0004] To achieve the above purpose, the present application provides a preparation method of a naked eye 3D display device, which comprises the following steps:

[0005] A first light emitting wafer is provided, which comprises a substrate, an epitaxial functional layer, and a plurality of first metal electrodes on the epitaxial functional layer.

[0006] The first light emitting wafer is cut to form a plurality of first Micro LED units.

[0007] The plurality of first Micro LED units are arranged on a temporary carrier, so that the substrate faces away from the temporary carrier.

[0008] Then, a first magnetic metal ion implantation treatment is performed on the central region of the substrate of each first Micro LED unit to form a first magnetic metal ion implantation region, and then a second magnetic metal ion implantation treatment is performed on the edge region of the substrate of each first Micro LED unit to form a second magnetic metal ion implantation region, wherein the magnetic metal ion concentration of the second magnetic metal ion implantation region is greater than that of the first magnetic metal ion implantation region, and the implantation depth of the second magnetic metal ion implantation treatment is greater than that of the first magnetic metal ion implantation region.

[0009] A transfer substrate is provided, the transfer substrate comprising a plurality of recesses, and then a third magnetic metal ion implantation treatment is performed on the sidewall and bottom of each of the recesses to form a third magnetic metal ion implantation region on the sidewall and bottom of each of the recesses, the magnetic metal ion concentration of the third magnetic metal ion implantation region being greater than the magnetic metal ion concentration of the second magnetic metal ion implantation region.

[0010] Then, part of the first Micro LED units on the temporary carrier plate are transferred to the transfer substrate, so that one first Micro LED unit is arranged in one corresponding recess, and each of the first Micro LED units is fixedly adsorbed in the corresponding recess.

[0011] A driving substrate is provided, the driving substrate comprising a plurality of pixel electrodes, and the first Micro LED units on the transfer substrate are transferred to the driving substrate, so that the first metal electrode of each of the first Micro LED units is electrically connected with the corresponding pixel electrode.

[0012] As a preferred technical solution, after forming a plurality of the first Micro LED units, each of the first Micro LED units comprises one first metal electrode.

[0013] As a preferred technical solution, a temporary bonding layer is formed on the temporary carrier plate, and then the first metal electrode of each of the first Micro LED units is embedded into the temporary bonding layer.

[0014] As a preferred technical solution, the magnetic metal ions in the first magnetic metal ion implantation treatment, the second magnetic metal ion implantation treatment and the third magnetic metal ion implantation treatment are iron ions, cobalt ions or nickel ions.

[0015] As a preferred technical solution, the first Micro LED unit has a first lateral dimension, and the clear distance between adjacent recesses is greater than the sum of two first lateral dimensions.

[0016] As a preferred technical solution, after transferring the first Micro LED units, a plurality of second Micro LED units are provided, the color of the second Micro LED units being different from the color of the first Micro LED units, the same magnetic metal ion implantation region as the first Micro LED units is arranged on each of the second Micro LED units, and the transfer substrate is used to transfer a plurality of the second Micro LED units to the driving substrate, so that the electrode of each of the second Micro LED units is electrically connected with the corresponding pixel electrode.

[0017] As a preferred technical solution, after transferring the second Micro LED unit, a plurality of third Micro LED units are provided, the color of the third Micro LED unit is different from the color of the first Micro LED unit and the color of the first Micro LED unit, the same magnetic metal ion injection area as the first Micro LED unit is arranged on each third Micro LED unit, and the plurality of third Micro LED units are transferred to the driving substrate by using the transfer substrate, so that the electrode of each third Micro LED unit is electrically connected with the corresponding pixel electrode.

[0018] As a preferred technical solution, the driving substrate has one second Micro LED unit and one third Micro LED unit between adjacent first Micro LED units.

[0019] The application also provides a naked eye 3D display device manufactured by the preparation method.

[0020] The application has the following beneficial effects:

[0021] In the preparation method of the naked eye 3D display device, the first magnetic metal ion injection area is formed in the central region of the substrate of the first Micro LED unit, the second magnetic metal ion injection area is formed in the edge region, the magnetic metal ion concentration of the second magnetic metal ion injection area is greater than that of the first magnetic metal ion injection area, the injection depth of the second magnetic metal ion injection processing is greater than that of the first magnetic metal ion injection area, and the shape of the magnetic structure of the Micro LED unit is effectively improved by the above process. Further, the third magnetic metal ion injection area is formed on the side wall and the bottom of the groove of the transfer substrate, the magnetic adsorption force between the Micro LED unit and the transfer substrate can be greatly increased when the Micro LED unit is arranged in a corresponding groove, and the first Micro LED unit has a first lateral size, the net distance between adjacent grooves is greater than the sum of two first lateral sizes, which can effectively avoid the magnetic interference between adjacent third magnetic metal ion injection areas, thereby greatly improving the transfer accuracy and transfer yield. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The structure schematic diagram of cutting the first light emitting wafer to form a plurality of first Micro LED units in the embodiment of the application is shown.

[0023] Figure 2A structure diagram showing the formation of a first magnetic metal ion implantation region and a second magnetic metal ion implantation region in an embodiment of the present application.

[0024] Figure 3 A structure diagram showing the transfer of a substrate in an embodiment of the present application.

[0025] Figure 4 A structure diagram showing the transfer of part of the first Micro LED units on the temporary carrier substrate to the transfer substrate in an embodiment of the present application.

[0026] Figure 5 A structure diagram showing the transfer of the first Micro LED units on the transfer substrate to the driving substrate in an embodiment of the present application.

[0027] Figure 6 A structure diagram showing the transfer of the second Micro LED units and the third Micro LED units to the driving substrate in an embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] As shown in Figures 1-6 , the present embodiment provides a preparation method of a naked-eye 3D display device, which comprises the following steps:

[0030] As shown in Figure 1 , a first light-emitting wafer is provided, which comprises a substrate 101, an epitaxial functional layer 102, and a plurality of first metal electrodes 103 on the epitaxial functional layer.

[0031] In a specific embodiment, the substrate 101 can be a sapphire substrate or a gallium nitride substrate, the epitaxial functional layer 102 comprises an N-type semiconductor layer, a quantum well layer, and a P-type semiconductor layer which are stacked in sequence, more specifically, the epitaxial functional layer 102 can be a gallium nitride-based semiconductor layer, the material of the first metal electrode 103 is one or more of copper, silver, gold, titanium, aluminum, and palladium, and the first metal electrode 103 is formed by electroplating, chemical plating, or PVD process.

[0032] As shown in Figure 1 , the first light-emitting wafer is cut to form a plurality of first Micro LED units 100.

[0033] In a specific embodiment, after forming a plurality of first Micro LED units 100, each first Micro LED unit 100 includes a first metal electrode 103.

[0034] In a specific embodiment, multiple first Micro LED units 100 are formed by laser cutting.

[0035] like Figure 2 As shown, a plurality of the first Micro LED units 100 are disposed on a temporary carrier plate 200, such that the substrate 101 is away from the temporary carrier plate 200.

[0036] In a specific embodiment, a temporary adhesive layer 201 is formed on the temporary carrier plate 200, and then the first metal electrode 103 of each first Micro LED unit 100 is embedded into the temporary adhesive layer 201.

[0037] like Figure 2 As shown, a first magnetic metal ion implantation process is then performed on the central region of the substrate 101 of each first Micro LED unit 100 to form a first magnetic metal ion implantation region 1011. Then, a second magnetic metal ion implantation process is performed on the edge region of the substrate of each first Micro LED unit 100 to form a second magnetic metal ion implantation region 1012. The magnetic metal ion concentration of the second magnetic metal ion implantation region 1012 is greater than that of the first magnetic metal ion implantation region 1011, and the implantation depth of the second magnetic metal ion implantation process is greater than that of the first magnetic metal ion implantation region, so that the depth of the second magnetic metal ion implantation region 1012 is greater than that of the first magnetic metal ion implantation region 1011.

[0038] In a specific embodiment, the magnetic metal ions in the first magnetic metal ion implantation treatment and the second magnetic metal ion implantation treatment are iron ions, cobalt ions, or nickel ions.

[0039] In a specific embodiment, the specific process of the first magnetic metal ion implantation treatment is as follows: the implantation energy is 800 eV-2000 eV, and the implantation dose of the magnetic metal ions is 2 × 10⁻⁶. 16 cm -2 -3×10 17 cm -2The magnetic metal ions are iron ions, cobalt ions, or nickel ions. After the first magnetic metal ion implantation treatment, a low-temperature heat treatment is performed at 150-250°C for 50-100 seconds. In a more specific embodiment, the implanted ions are nickel ions, the implantation energy is 1500 eV, and the implantation dose of the magnetic metal ions is 8 × 10⁻⁶. 16 cm -2 Furthermore, after nickel ion implantation, a low-temperature heat treatment is performed at 200°C for 80 seconds to form the first magnetic metal ion implantation region 1011.

[0040] In a specific embodiment, the second magnetic metal ion implantation process is as follows: the implantation energy is 2500 eV-4000 eV, and the implantation dose of the magnetic metal ions is 8 × 10⁻⁶. 17 cm -2 -5×10 18 cm -2 The magnetic metal ions are iron ions, cobalt ions, or nickel ions. After the second magnetic metal ion implantation treatment, a low-temperature heat treatment is performed at 200-300°C for 50-150 seconds. In a more specific embodiment, the implanted ions are nickel ions, the implantation energy is 3000 eV, and the implantation dose of the magnetic metal ions is 2 × 10⁻⁶. 18 cm -2 After nickel ion implantation, a low-temperature heat treatment is performed at 250°C for 100 seconds to form the second magnetic metal ion implantation region 1012, thereby making the depth of the second magnetic metal ion implantation region 1012 greater than the depth of the first magnetic metal ion implantation region 1011.

[0041] In a specific embodiment, by adjusting the specific process parameters of the first magnetic metal ion implantation treatment and the specific process of the second magnetic metal ion implantation treatment, the depth of the second magnetic metal ion implantation region 1012 is 1-5 micrometers greater than the depth of the first magnetic metal ion implantation region 1011. By setting the above process parameters, on the one hand, the first magnetic metal ion implantation treatment can be avoided from affecting the light-emitting performance of the first Micro LED unit 100, and on the other hand, since the second magnetic metal ion implantation treatment is performed in the edge region of the substrate, the magnetic attraction of the first Micro LED unit 100 can be ensured.

[0042] like Figure 3As shown, a transfer substrate 300 is provided, which includes a plurality of recesses 301, and then a third magnetic metal ion implantation treatment is performed on the sidewall and bottom of each of the recesses 301 to form a third magnetic metal ion implantation region 302 on the sidewall and bottom of each of the recesses, the magnetic metal ion concentration of the third magnetic metal ion implantation region 302 being greater than the magnetic metal ion concentration of the second magnetic metal ion implantation region 1012.

[0043] In specific embodiments, the magnetic metal ions in the third magnetic metal ion implantation treatment are iron ions, cobalt ions or nickel ions.

[0044] In specific embodiments, the specific process of the third magnetic metal ion implantation treatment is that the implantation energy is 4000 ev-6000 ev, the implantation dose of the magnetic metal ions is 2x10 19 cm -2 -4x10 20 cm -2 , the magnetic metal ions are iron ions, cobalt ions or nickel ions, and after the third magnetic metal ion implantation treatment, a low-temperature heat treatment is performed at 200-300°C for 50-150 seconds, in more specific embodiments, the implantation ions are nickel ions, the implantation energy is 5000 ev, the implantation dose of the magnetic metal ions is 6x10 19 cm -2 , and after the implantation of the metal nickel ions, a low-temperature heat treatment is performed at 250°C for 100 seconds to form the third magnetic metal ion implantation region 302.

[0045] In specific embodiments, the first Micro LED unit 100 has a first lateral dimension, and the clear distance between adjacent recesses 301 is greater than the sum of two first lateral dimensions, thereby facilitating subsequent transfer processes.

[0046] As Figure 4 shown, then part of the first Micro LED units 100 on the temporary carrier 200 are transferred to the transfer substrate 300, so that one first Micro LED unit 100 is arranged in one corresponding recess 301, and each of the first Micro LED units 100 is fixedly adsorbed in the corresponding recess 301.

[0047] In specific embodiments, due to the magnetic adsorption between the third magnetic metal ion implantation region 302 and the first magnetic metal ion implantation region 1011 and the second magnetic metal ion implantation region 1012, the stability of the first Micro LED unit 100 in the recess is greatly improved.

[0048] As Figure 5As shown in FIG. 1, a driving substrate 400 is provided, which includes a plurality of pixel electrodes 401. The first Micro LED units 100 on the transfer substrate 300 are transferred to the driving substrate 400, so that the first metal electrode 103 of each first Micro LED unit 100 is electrically connected to the corresponding pixel electrode 401.

[0049] As shown in FIG. 2, after the first Micro LED units 100 are transferred, a plurality of second Micro LED units 500 are provided, which are different in color from the first Micro LED units 100. The same magnetic metal ion injection region as the first Micro LED units 100 is provided on each second Micro LED unit 500. The second Micro LED units 500 are transferred to the driving substrate 400 by using the transfer substrate 300, so that the electrode 501 of each second Micro LED unit 500 is electrically connected to the corresponding pixel electrode 401. Figure 6 As shown in FIG. 3, after the second Micro LED units 500 are transferred, a plurality of third Micro LED units 600 are provided, which are different in color from the first Micro LED units 100 and the second Micro LED units 500. The same magnetic metal ion injection region as the first Micro LED units 100 is provided on each third Micro LED unit 600. The third Micro LED units 600 are transferred to the driving substrate 400 by using the transfer substrate 300, so that the electrode 601 of each third Micro LED unit 600 is electrically connected to the corresponding pixel electrode 401.

[0050] Figure 6

[0051] In specific embodiments, there is one second Micro LED unit 500 and one third Micro LED unit 600 between adjacent first Micro LED units 100 on the driving substrate 400.

[0052] ​​In specific embodiments, one first Micro LED unit 100, one second Micro LED unit 500 and one third Micro LED unit 600 form one pixel, more specifically, the first Micro LED unit 100 is a red Micro LED unit, the second Micro LED unit 500 is a green Micro LED unit, and the third Micro LED unit 600 is a blue Micro LED unit.

[0053] In specific embodiments, after the transferring is completed, the driving substrate 400 is encapsulated to form an encapsulation layer 700, and then the substrate of each of the first Micro LED unit 100, the second Micro LED unit 500 and the third Micro LED unit 600 is removed, and then a common conductive layer 800 is formed.

[0054] As shown in Figure 6 The present application also provides a naked-eye 3D display device manufactured by the above preparation method.

[0055] In other preferred technical solutions, the present application provides a preparation method of a naked-eye 3D display device, which comprises the following steps:

[0056] A first light-emitting wafer is provided, which comprises a substrate, an epitaxial functional layer and a plurality of first metal electrodes on the epitaxial functional layer.

[0057] The first light-emitting wafer is cut to form a plurality of first Micro LED units.

[0058] The plurality of first Micro LED units are arranged on a temporary carrier, so that the substrate faces away from the temporary carrier.

[0059] Then, a first magnetic metal ion implantation treatment is performed on the central region of the substrate of each first Micro LED unit to form a first magnetic metal ion implantation region, and a second magnetic metal ion implantation treatment is performed on the edge region of the substrate of each first Micro LED unit to form a second magnetic metal ion implantation region, wherein the magnetic metal ion concentration of the second magnetic metal ion implantation region is greater than that of the first magnetic metal ion implantation region, and the implantation depth of the second magnetic metal ion implantation treatment is greater than that of the first magnetic metal ion implantation region.

[0060] A transfer substrate is provided, the transfer substrate comprising a plurality of recesses, and then a third magnetic metal ion implantation treatment is performed on the sidewall and bottom of each of the recesses to form a third magnetic metal ion implantation region on the sidewall and bottom of each of the recesses, the magnetic metal ion concentration of the third magnetic metal ion implantation region being greater than the magnetic metal ion concentration of the second magnetic metal ion implantation region.

[0061] Then, part of the first Micro LED units on the temporary carrier plate are transferred to the transfer substrate, so that one first Micro LED unit is arranged in one corresponding recess, and each of the first Micro LED units is fixedly adsorbed in the corresponding recess.

[0062] A driving substrate is provided, the driving substrate comprising a plurality of pixel electrodes, and the first Micro LED units on the transfer substrate are transferred to the driving substrate, so that the first metal electrode of each of the first Micro LED units is electrically connected with the corresponding pixel electrode.

[0063] In other preferred technical solutions, after forming a plurality of the first Micro LED units, each of the first Micro LED units comprises one first metal electrode.

[0064] In other preferred technical solutions, a temporary bonding layer is formed on the temporary carrier plate, and then the first metal electrode of each of the first Micro LED units is embedded into the temporary bonding layer.

[0065] In other preferred technical solutions, the magnetic metal ions in the first magnetic metal ion implantation treatment, the second magnetic metal ion implantation treatment and the third magnetic metal ion implantation treatment are iron ions, cobalt ions or nickel ions.

[0066] In other preferred technical solutions, the first Micro LED units have a first lateral dimension, and the clear distance between adjacent recesses is greater than the sum of two first lateral dimensions.

[0067] In other preferred technical solutions, after transferring the first Micro LED units, a plurality of second Micro LED units are provided, the color of the second Micro LED units being different from the color of the first Micro LED units, the same magnetic metal ion implantation region as the first Micro LED units is arranged on each of the second Micro LED units, and the transfer substrate is used to transfer a plurality of the second Micro LED units to the driving substrate, so that the electrode of each of the second Micro LED units is electrically connected with the corresponding pixel electrode.

[0068] In other preferred technical solutions, after transferring the second Micro LED unit, a plurality of third Micro LED units are provided, the color of the third Micro LED unit is different from the color of the first Micro LED unit and the color of the second Micro LED unit, the same magnetic metal ion injection area as the first Micro LED unit is arranged on each third Micro LED unit, and the plurality of third Micro LED units are transferred to the driving substrate by using the transfer substrate, so that the electrode of each third Micro LED unit is electrically connected with the corresponding pixel electrode.

[0069] In other preferred technical solutions, there is one second Micro LED unit and one third Micro LED unit between adjacent first Micro LED units on the driving substrate.

[0070] In other preferred technical solutions, the naked eye 3D display device is also provided, which is manufactured by the above preparation method.

[0071] In the preparation method of the naked eye 3D display device, the first magnetic metal ion injection area is formed in the central region of the substrate of the first Micro LED unit, the second magnetic metal ion injection area is formed in the edge region, the magnetic metal ion concentration of the second magnetic metal ion injection area is greater than that of the first magnetic metal ion injection area, the injection depth of the second magnetic metal ion injection processing is greater than that of the first magnetic metal ion injection area, and the shape of the magnetic structure of the Micro LED unit is effectively improved by the above process. Further, the third magnetic metal ion injection area is formed on the side wall and the bottom of the groove of the transfer substrate, the magnetic adsorption force between the Micro LED unit and the transfer substrate can be greatly increased when the Micro LED unit is arranged in a corresponding groove, and the first Micro LED unit has a first lateral size, the net distance between adjacent grooves is greater than the sum of two first lateral sizes, which can effectively avoid the magnetic interference between adjacent third magnetic metal ion injection areas, thereby greatly improving the transfer accuracy and transfer yield.

[0072] The above embodiments are only illustrative of the principles of the present application and its efficacy, and are not intended to limit the present application. Any modification or change made by any person skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. A method of manufacturing a naked-eye 3D display device, characterized by: The preparation method of the naked-eye 3D display device comprises the following steps: A first light-emitting wafer is provided, which comprises a substrate, an epitaxial functional layer, and a plurality of first metal electrodes on the epitaxial functional layer; The first light-emitting wafer is cut to form a plurality of first Micro LED units; The plurality of first Micro LED units are arranged on a temporary carrier, so that the substrate faces away from the temporary carrier; Then, a first magnetic metal ion implantation treatment is performed on the central region of the substrate of each first Micro LED unit to form a first magnetic metal ion implantation region, and then a second magnetic metal ion implantation treatment is performed on the edge region of the substrate of each first Micro LED unit to form a second magnetic metal ion implantation region, wherein the magnetic metal ion concentration of the second magnetic metal ion implantation region is greater than that of the first magnetic metal ion implantation region, and the implantation depth of the second magnetic metal ion implantation treatment is greater than that of the first magnetic metal ion implantation region; A transfer substrate is provided, which comprises a plurality of grooves, and then a third magnetic metal ion implantation treatment is performed on the sidewall and bottom of each groove to form a third magnetic metal ion implantation region on the sidewall and bottom of each groove, and the magnetic metal ion concentration of the third magnetic metal ion implantation region is greater than that of the second magnetic metal ion implantation region; Then, part of the first Micro LED units on the temporary carrier are transferred to the transfer substrate, so that one first Micro LED unit is arranged in one corresponding groove, and each first Micro LED unit is fixedly adsorbed in the corresponding groove; A driving substrate is provided, which comprises a plurality of pixel electrodes, and the first Micro LED units on the transfer substrate are transferred to the driving substrate, so that the first metal electrode of each first Micro LED unit is electrically connected to the corresponding pixel electrode.

2. The method of claim 1, wherein the method further comprises: applying a first polarizer to the first substrate; and applying a second polarizer to the second substrate. After forming a plurality of first Micro LED units, each first Micro LED unit comprises one first metal electrode.

3. The method of claim 2, wherein the method further comprises: applying a first polarizer to the first substrate; and applying a second polarizer to the second substrate. A temporary bonding layer is formed on the temporary carrier, and then the first metal electrode of each first Micro LED unit is embedded in the temporary bonding layer.

4. The method of claim 1, wherein the method further comprises: applying a first polarizer to the first substrate; and applying a second polarizer to the second substrate. The magnetic metal ions in the first magnetic metal ion implantation treatment, the second magnetic metal ion implantation treatment, and the third magnetic metal ion implantation treatment are iron ions, cobalt ions, or nickel ions.

5. The method of claim 1, wherein the method further comprises: applying a protective layer on the patterned surface of the first substrate. The first Micro LED unit has a first lateral dimension, and the clear distance between adjacent grooves is greater than the sum of two first lateral dimensions.

6. The method of claim 1, wherein the method further comprises: applying a protective layer on the patterned surface of the first substrate. After transferring the first Micro LED units, a plurality of second Micro LED units are provided, the colors of the second Micro LED units being different from the color of the first Micro LED units, the same magnetic metal ion injection region as that of the first Micro LED units is arranged on each of the second Micro LED units, and the plurality of second Micro LED units are transferred to the driving substrate by using the transfer substrate, so that the electrode of each of the second Micro LED units is electrically connected with the corresponding pixel electrode.

7. The method of claim 6, wherein the method further comprises: applying a protective layer on the patterned surface of the first substrate. After transferring the second Micro LED units, a plurality of third Micro LED units are provided, the colors of the third Micro LED units being different from the color of the first Micro LED units and the color of the second Micro LED units, the same magnetic metal ion injection region as that of the first Micro LED units is arranged on each of the third Micro LED units, and the plurality of third Micro LED units are transferred to the driving substrate by using the transfer substrate, so that the electrode of each of the third Micro LED units is electrically connected with the corresponding pixel electrode.

8. The method of claim 6, wherein the method further comprises: applying a protective layer on the patterned surface of the first substrate. There is one second Micro LED unit and one third Micro LED unit between adjacent first Micro LED units on the driving substrate.

9. A naked-eye 3D display device, characterized by comprising: The naked-eye 3D display device is manufactured by using the manufacturing method of the naked-eye 3D display device according to any one of claims 1-8.

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