Full-color two-in-one SMD LED display device and preparation mold thereof

Abstract

The invention provides a full-color two-in-one SMD LED display device and a preparation mold thereof, the display device comprises display monomers which are symmetrically nested on the same support, only the bottom surfaces of pins of the display monomers are exposed on the bottom surface of the support, and grooves are formed in the joints of the bottom of the support and the pins; according to the invention, the thrust of the display screen device after board pasting is greatly improved, and the reliability is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display screens, in particular to a full-color two-in-one SMD LED display device and a manufacturing mold thereof. Background Art

[0002] The traditional two-in-one full-color display device is designed with eight pins, and the pins are bent and wrapped. However, this design is to bend and wrap the pins after PPA injection molding. The external force can easily cause gaps between the hardware and PPA, resulting in a decrease in the airtightness of the device. In order to solve this problem, the pins of the bracket are not wrapped and extend from the bottom of the bracket. However, this design will result in a small exposed area of ​​the pins, small tin absorption, small thrust on the device after the board is installed, and the device is easy to fall off. As in patent CN206301833U, a groove is set at the bottom of the bracket to increase the exposed ratio of the pin pad connection, while increasing the climbing height of the solder paste during patching, and enhancing the welding force between the lamp bead and the PCB board. However, the pins of this design are easily scratched and warped during the production process, resulting in uneven device pins. Summary of the Invention

[0003] The present invention solves the problem that the pins of the device are easily scratched and warped during the production process, resulting in uneven device pins. It proposes a full-color two-in-one SMD LED display device and its preparation mold, which greatly improves the thrust of the display device after board attachment and increases reliability.

[0004] In order to achieve the above objectives, the following technical solutions are proposed: A full-color two-in-one SMD LED display device includes display units symmetrically nested on the same bracket, wherein only the bottom surface of the pins of the display units are exposed on the bottom surface of the bracket, and a groove is provided at the connection between the bottom of the bracket and the pins.

[0005] In the present invention, only the bottom surface of the pin is exposed on the bottom surface of the bracket to prevent the pin from being bumped and deformed. The groove provided at the connection between the pin and the bottom of the bracket can increase the length of the pin. While increasing the tin-eating area, the anti-deformation ability of the pin is not reduced. At the same time, the tin climbing height of the solder paste during patching is increased, thereby enhancing the welding force between the lamp bead and the PCB board.

[0006] Preferably, the display monomer is provided with three display units, the display unit includes a display chip and pins, the pins include a first pin and a second pin symmetrically connected to the display chip, the bracket is provided with a bowl cup, the display chip is arranged in the bowl cup, and the bowl cup is filled with epoxy resin glue to wrap the display chip.

[0007] Preferably, the first pin includes a pad and a pin parallel to each other, and connecting bars are smoothly connected to the pad and the pin respectively. The first pin of the present invention includes a pad, a connecting bar, and a pin. The pad and the pin are arranged in parallel, and the connecting bar is used to connect the pad and the pin. The connection between the connecting bar and the pad and the connection between the connecting bar and the pin are both smoothed. The pad, the connecting bar, and the pin are integrally formed by stamping technology.

[0008] Preferably, the first included angle between the pad and the connecting bar is an acute angle, and the second included angle between the connecting bar and the pin is opposite to the direction of the first included angle and is an acute angle. The included angle formed by the pad and the connecting bar of the present invention is the first included angle, and the included angle formed by the connecting bar and the pin is the second included angle. Both the second included angle and the first included angle are acute angles and have opposite directions. This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure.

[0009] Preferably, both the width and the length of the groove are greater than the width and the length of the connection between the connecting bar and the pin. The length of the groove of the present invention is greater than the length of the connection between the connecting bar and the pin, and the width of the groove of the present invention is greater than the width of the connection between the connecting bar and the pin. The purpose of setting it like this in the present invention is to expose the connection between the connecting bar and the pin, increase the pin length, while not reducing the anti-deformation ability of the pin when increasing the tin-eating area. The tin liquid can wrap the left and right sides and the bottom surface of the connection between the connecting bar and the pin, increasing the tin-eating area.

[0010] Preferably, extension segments are provided on both sides of the pin, such that the shape of the pin exposed on the bottom surface of the bracket is a "T" shape. In the present invention, extension segments are provided on both sides of the pin. The extension segments and the pin body make the shape of the pin exposed on the bottom surface of the bracket a "T" shape. The pin is designed in a "T" shape, greatly increasing the tin-eating area and making the welding with the PCB board more reliable. All 12 pins are designed in a "T" shape, further increasing the tin-eating area. Refer to Figure 3 the shaded area in [reference] is the overall tin-eating area, far exceeding the tin-eating area of the prior art.

[0011] Preferably, the display chip is a full-color light-emitting lamp bead flip chip.

[0012] Preferably, the bracket is made of integrally formed PPA plastic material, and the length of the pin exposed on the bottom surface of the bracket does not exceed the PPA plastic material.

[0013] A mold for manufacturing a full-color two-in-one SMD LED display device, for manufacturing the groove of the above-mentioned full-color two-in-one SMD LED display device, including a bottom plate, and a plurality of pin fixers are provided on the bottom plate. The pin fixer includes a first clamping block and a second clamping block symmetrically arranged on both sides of an arc-shaped block, and the arc surface of the arc-shaped block fits with the smooth connection surface between the connecting bar and the pin.

[0014] Preferably, the heights of the first clamping block and the second clamping block are greater than the highest height of the arc-shaped block.

[0015] The beneficial effects of the present invention are as follows: the device is a Top-type bracket structure, the device size is not limited, and the hardware structure is a "J" symmetrical structure. The device is a 2-in-1 RGB pixel full-color light-emitting lamp bead, and the chip adopts a flip chip. The 2-in-1 device adopts a 12-pin design to increase the tinning area and make the welding more reliable. The 12 pins are all designed in a T shape, which further increases the tinning area. A small groove is opened where the pin extends out of the PPA to increase the pin length. While increasing the tinning area, the pin's anti-deformation ability is not reduced. The length of the pin on both sides does not exceed the PPA to prevent the pin from bumping and deforming. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a simplified structural diagram of the display device of the present invention.

[0017] Figure 2 It is a cross-sectional view of the display device structure of the present invention.

[0018] Figure 3 It is a front view of the bottom pins of the display device of the present invention.

[0019] Figure 4 It is a schematic diagram of the mold structure of the present invention.

[0020] Among them: 1. Display monomer; 2. Display unit; 3. First pin; 4. Second pin; 5. Display chip; 6. Bracket; 7. Bottom plate; 8. Pin holder; 31. Solder pad; 32. Connecting strip; 33. Solder foot; 61. Bowl; 62. Groove; 81. First clamping block; 82. Arc block; 83. Second clamping block. DETAILED DESCRIPTION

[0021] Example 1: This embodiment proposes a full-color two-in-one SMD LED display device, referring to Figure 1 Two display units 1 are symmetrically nested on the same bracket 6, and the pins of the display units 1 extend from the bottom surface of the bracket 6, and only the bottom surface of the pins is exposed on the bottom surface of the bracket 6, and a groove 62 is provided at the connection between the pins and the bottom of the bracket 6.

[0022] In the present invention, only the bottom surface of the pin is exposed on the bottom surface of the bracket 6 to prevent the pin from being bumped and deformed. The groove 62 provided at the connection between the pin and the bottom of the bracket 6 of the present invention can increase the length of the pin. While increasing the tin-eating area, the anti-deformation ability of the pin is not reduced. At the same time, the climbing height of the solder paste during patching is increased, thereby enhancing the welding force between the lamp bead and the PCB board.

[0023] The display monomer 1 of the present invention includes 3 display units 2. Each display unit 2 is provided with a display chip 5 and pins. The pins include a first pin 3 and a second pin 4. The first pin 3 and the second pin 4 are symmetrically connected to the display chip 5 on the left and right. The 3 display chips 5 of the display monomer 1 respectively display blue, green and red. The bracket 6 is provided with a bowl 61 for placing the display chip 5. The display chip 5 is arranged at the center of the bottom of the bowl 61. The bowl 61 is filled with epoxy resin glue for wrapping the display chip 5. The present invention adopts a 12-pin design, increases the solder area, and the welding is more reliable. The bracket is designed with 12 pins, 6 pins on each side. One chip consists of two pins to control the positive and negative electrodes. The two-in-one pixel is two groups of RGB, a total of 12 chips. The pin pads are made of copper or iron.

[0024] Reference Figure 2 For the first pin 3 of the present invention, it includes a pad 31, a connecting strip 32 and a pin foot 33. The pad 31 and the pin foot 33 are arranged in parallel. The connecting strip 32 is used to connect the pad 31 and the pin foot 33. The connection part of the connecting strip 32 and the pad 31 and the connection part of the connecting strip 32 and the pin foot 33 are both smoothed. The pad 31, the connecting strip 32 and the pin foot 33 are integrally formed by stamping technology.

[0025] For the present invention, the included angle formed by the pad 31 and the connecting strip 32 is the first included angle, and the included angle formed by the connecting strip 32 and the pin foot 33 is the second included angle. Both the second included angle and the first included angle are acute angles and have opposite directions. This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure.

[0026] The device of the present invention is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip.

[0027] The bracket 6 of the present invention is made of PPA plastic material and is integrally formed. The length of the pins exposed on the bottom surface of the bracket 6 cannot exceed the PPA plastic material. The head of the pin is still wrapped with PPA, making the pin not easy to warp. The head of the pin does not protrude outside the PPA, which can further prevent the pin from being knocked and deformed.

[0028] This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure. The device is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip. The two-in-one device adopts a 12-pin design, increases the solder area, and the welding is more reliable. At the place where the pin extends out of the PPA, a small groove is opened to increase the length of the pin. While increasing the solder area, the anti-deformation ability of the pin is not reduced. The lengths of both sides of the pin do not exceed the PPA, preventing the pin from being knocked and deformed.

[0029] Example 2: This embodiment improves the groove on the basis of Embodiment 1, and proposes a full-color two-in-one SMD LED display device. Refer to Figure 1 , two display units 1 are symmetrically nested on the same bracket 6, and the pins of the display unit 1 extend from the bottom surface of the bracket 6, and only the bottom surfaces of the pins are exposed on the bottom surface of the bracket 6. A groove 62 is provided at the connection between the pins and the bottom of the bracket 6.

[0030] In this invention, only the bottom surfaces of the pins are exposed on the bottom surface of the bracket 6 to prevent the pins from being knocked and deformed. The groove 62 provided at the connection between the pins of this invention and the bottom of the bracket 6 can increase the pin length. While increasing the tin-eating area, the anti-deformation ability of the pins is not reduced. At the same time, the tin climbing height of the solder paste during patch is increased, and the welding force between the lamp bead and the PCB board is enhanced.

[0031] The display unit 1 of this invention includes three display cells 2. Each display cell 2 is provided with a display chip 5 and pins. The pins include a first pin 3 and a second pin 4. The first pin 3 and the second pin 4 are symmetrically connected to the display chip 5 on the left and right. The three display chips 5 of the display unit 1 respectively display blue, green and red; the bracket 6 is provided with a bowl cup 61 for placing the display chip 5. The display chip 5 is arranged at the center of the bottom of the bowl cup 61. The bowl cup 61 is filled with epoxy resin glue for wrapping the display chip 5. This invention adopts a 12-pin design to increase the tin-eating area and make the welding more reliable. The bracket is designed with 12 pins, 6 pins on each side. One chip is composed of two pins to control the positive and negative poles. The two-in-one pixel is two groups of RGB, a total of 12 chips, and the pin pads are made of copper or iron.

[0032] Refer to Figure 2 , the first pin 3 of this invention includes a pad 31, a connecting strip 32 and a welding foot 33. The pad 31 and the welding foot 33 are arranged in parallel. The connecting strip 32 is used to connect the pad 31 and the welding foot 33. The connection between the connecting strip 32 and the pad 31 and the connection between the connecting strip 32 and the welding foot 33 are both smoothed. The pad 31, the connecting strip 32 and the welding foot 33 are integrally formed by stamping technology.

[0033] The included angle formed by the pad 31 and the connecting strip 32 of this invention is the first included angle, and the included angle formed by the connecting strip 32 and the welding foot 33 is the second included angle. Both the second included angle and the first included angle are acute angles and have opposite directions. This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure.

[0034] The device of this invention is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip.

[0035] The bracket 6 of the present invention is made of PPA plastic material, and the PPA plastic material is integrally formed. The length of the pin exposed on the bottom surface of the bracket 6 shall not exceed the PPA plastic material. The head of the pin is still wrapped with PPA, making it difficult for the pin to翘起 (I'm not sure what "翘起" exactly means here, maybe "翘曲"?). The head of the pin does not protrude outside the PPA, which can further prevent the pin from being knocked and deformed.

[0036] The length of the groove 62 of the present invention is greater than the length of the connection between the connecting bar 32 and the welding leg 33, and the width of the groove 62 of the present invention is greater than the width of the connection between the connecting bar 32 and the welding leg 33. The purpose of this setting of the present invention is to expose the connection between the connecting bar 32 and the welding leg 33, increase the pin length, and while increasing the tin - eating area, the anti - deformation ability of the pin is not reduced. The tin liquid can wrap the left and right sides and the bottom surface of the connection between the connecting bar 32 and the welding leg 33, increasing the tin - eating area.

[0037] This device is a Top - type bracket structure, the device size is not limited, and the hardware structure is a "ji" - shaped symmetric structure. The device is an RGB pixel two - in - one full - color light - emitting lamp bead, and the chip uses a flip - chip. The two - in - one device adopts a 12 - pin design, increasing the tin - eating area and making the welding more reliable. At the place where the pin extends out of the PPA, a small groove is opened to increase the pin length. While increasing the tin - eating area, the anti - deformation ability of the pin is not reduced. The lengths of both sides of the pin do not exceed the PPA, preventing the pin from being knocked and deformed.

[0038] Embodiment 3: Based on Embodiment 2, this embodiment also proposes a mold for manufacturing a full - color two - in - one SMD LED display device, which is used to make the groove 62 of a full - color two - in - one SMD LED display device. For the full - color two - in - one SMD LED display device, refer to Figure 1 , on the same bracket 6, two display monomers 1 are symmetrically nested and arranged. The pins of the display monomer 1 extend out from the bottom surface of the bracket 6, and only the bottom surface of the pin is exposed on the bottom surface of the bracket 6. A groove 62 is provided at the connection between the pin and the bottom of the bracket 6.

[0039] In the present invention, only the bottom surface of the pin is exposed on the bottom surface of the bracket 6 to prevent the pin from being knocked and deformed. The groove 62 provided at the connection between the pin and the bottom of the bracket 6 of the present invention can increase the pin length. While increasing the tin - eating area, the anti - deformation ability of the pin is not reduced, and at the same time, it can improve the tin - climbing height of the solder paste during chip - mounting, enhancing the welding force between the lamp bead and the PCB board.

[0040] The display monomer 1 of the present invention includes 3 display units 2, each of the display units 2 is provided with a display chip 5 and pins. The pins include a first pin 3 and a second pin 4. The first pin 3 and the second pin 4 are symmetrically connected to the display chip 5 on the left and right. The 3 display chips 5 of the display monomer 1 respectively display blue, green and red. The bracket 6 is provided with a bowl 61 for placing the display chip 5. The display chip 5 is arranged at the center of the bottom of the bowl 61. The bowl 61 is filled with epoxy resin glue for wrapping the display chip 5. The present invention adopts a 12-pin design, which increases the solderable area and makes the welding more reliable. The bracket is designed with 12 pins, 6 pins on each side. One chip is composed of two pins to control the positive and negative electrodes. The two-in-one pixel is two groups of RGB, a total of 12 chips. The pin pads are made of copper or iron.

[0041] Reference Figure 2 For the first pin 3 of the present invention, it includes a pad 31, a connecting strip 32 and a pin foot 33. The pad 31 and the pin foot 33 are arranged in parallel. The connecting strip 32 is used to connect the pad 31 and the pin foot 33. The connection between the connecting strip 32 and the pad 31 and the connection between the connecting strip 32 and the pin foot 33 are both smoothed. The pad 31, the connecting strip 32 and the pin foot 33 are integrally formed by stamping technology.

[0042] The included angle formed by the pad 31 and the connecting strip 32 of the present invention is the first included angle, and the included angle formed by the connecting strip 32 and the pin foot 33 is the second included angle. Both the second included angle and the first included angle are acute angles and have opposite directions. This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure.

[0043] The device of the present invention is a RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip.

[0044] The bracket 6 of the present invention is made of PPA plastic material and is integrally formed. The length of the pins exposed on the bottom surface of the bracket 6 cannot exceed the PPA plastic material. The pin head is still wrapped with PPA, which makes the pins not easy to warp. The pin head does not protrude outside the PPA, which can better prevent the pins from being knocked and deformed.

[0045] The length of the groove 62 of the present invention is greater than the length of the connection between the connecting strip 32 and the pin foot 33, and the width of the groove 62 of the present invention is greater than the width of the connection between the connecting strip 32 and the pin foot 33. The purpose of such a setting in the present invention is to expose the connection between the connecting strip 32 and the pin foot 33, increase the pin length, and while increasing the solderable area, the pin anti-deformation ability is not reduced. The solder can wrap the left and right sides and the bottom surface of the connection between the connecting strip 32 and the pin foot 33, increasing the solderable area. [[ID= nineteen]]

[0046] The mold for preparing a full-color two-in-one SMD LED display device, reference Figure 4 , including a bottom plate 7, on which a number of pin fixers 8 for fixing device pins are provided. The pin fixer 8 includes a first clamping block 81, an arc-shaped block 82 and a second clamping block 83. The first clamping block 81 and the second clamping block 83 are symmetrically arranged on both sides of the arc-shaped block 82. The upper part of the arc-shaped block 82 has an arc surface, which fits with the smooth connection surface of the welding foot 33 and the connecting bar 32. After the whole of the first clamping block 81, the arc-shaped block 82 and the second clamping block 83 are injection-molded with PPA plastic material, a groove 62 is formed. The groove 62 enables the tin liquid to wrap the left and right sides and the bottom surface of the connection part of the connecting bar 32 and the welding foot 33, increasing the tin-holding area.

[0047] In the present invention, the first clamping block 81 and the second clamping block 83 have the same height and are higher than the highest height of the arc-shaped block 82, so that the formed groove 62 can expose more parts of the connection part of the connecting bar 32 and the welding foot 33, increasing the tin-holding area.

[0048] This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure. The device is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip uses a flip chip. The two-in-one device adopts a 12-pin design, increasing the tin-holding area and making the welding more reliable. Where the pins extend out of the PPA, a small groove is opened to increase the pin length. While increasing the tin-holding area, the anti-deformation ability of the pins is not reduced. The lengths of both sides of the pins do not exceed the PPA to prevent the pins from being knocked and deformed.

[0049] Embodiment 4: In this embodiment, the pins are improved on the basis of Embodiment 3, and a full-color two-in-one SMD LED display device is proposed. Refer to Figure 1 , on the same bracket 6, 2 display monomers 1 are symmetrically nested. The pins of the display monomer 1 extend out from the bottom surface of the bracket 6, and only the bottom surface of the pins is exposed on the bottom surface of the bracket 6. A groove 62 is provided at the connection part of the pins and the bottom of the bracket 6. <COUNTER>In the present invention, only the bottom surface of the pins is exposed on the bottom surface of the bracket 6 to prevent the pins from being knocked and deformed. The groove 62 provided at the connection part of the pins and the bottom of the bracket 6 can increase the pin length. While increasing the tin-holding area, the anti-deformation ability of the pins is not reduced. At the same time, it improves the tin climbing height of the solder paste during chip mounting and enhances the welding force between the lamp bead and the PCB board.

[0051] The display monomer 1 of the present invention includes 3 display units 2. Each display unit 2 is provided with a display chip 5 and pins. The pins include a first pin 3 and a second pin 4. The first pin 3 and the second pin 4 are symmetrically connected to the display chip 5 on the left and right. The 3 display chips 5 of the display monomer 1 respectively display blue, green, and red. The bracket 6 is provided with a bowl 61 for placing the display chip 5. The display chip 5 is arranged at the center of the bottom of the bowl 61. The bowl 61 is filled with epoxy resin glue for wrapping the display chip 5. The present invention adopts a 12-pin design, increases the solder area, and makes the welding more reliable. The bracket is designed with 12 pins, 6 pins on each side. One chip consists of two pins to control the positive and negative electrodes. The two-in-one pixel is two groups of RGB, with a total of 12 chips. The pin pads are made of copper or iron.

[0052] Reference Figure 2 , the first pin 3 of the present invention includes a pad 31, a connecting strip 32, and a pin foot 33. The pad 31 and the pin foot 33 are arranged in parallel. The connecting strip 32 is used to connect the pad 31 and the pin foot 33. The connection between the connecting strip 32 and the pad 31 and the connection between the connecting strip 32 and the pin foot 33 are both smoothed. The pad 31, the connecting strip 32, and the pin foot 33 are integrally formed by stamping technology.

[0053] The included angle formed by the pad 31 and the connecting strip 32 of the present invention is the first included angle, and the included angle formed by the connecting strip 32 and the pin foot 33 is the second included angle. Both the second included angle and the first included angle are acute angles and have opposite directions. This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure.

[0054] The present invention is provided with extension segments on both sides of the pin foot 33 of the pin. The extension segments and the main body of the pin foot 33 make the shape of the pin exposed on the bottom surface of the bracket 6 be a "T" shape. The pin shape is designed as a "T" shape, which greatly increases the solder area and makes the welding with the PCB board more reliable. All 12 pins adopt the "T" shape design, which further increases the solder area. Reference Figure 3 The shaded area in is the overall solder area, which far exceeds the solder area of the prior art.

[0055] The device of the present invention is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip.

[0056] The bracket 6 of the present invention adopts PPA plastic material and is integrally formed. The length of the pin exposed on the bottom surface of the bracket 6 cannot exceed the PPA plastic material. The pin head is still wrapped with PPA, which makes the pin not easy to warp. The pin head does not protrude outside the PPA, which can better prevent the pin from being knocked and deformed.

[0057] The length of the groove 62 of the present invention is greater than the length of the joint between the connecting bar 32 and the welding leg 33, and the width of the groove 62 of the present invention is greater than the width of the joint between the connecting bar 32 and the welding leg 33. The purpose of such a setting in the present invention is to expose the joint between the connecting bar 32 and the welding leg 33, increase the pin length, and while increasing the tin eating area, the anti-deformation ability of the pins is not reduced. The tin liquid can wrap the left and right sides and the bottom surface of the joint between the connecting bar 32 and the welding leg 33, increasing the tin eating area.

[0058] The mold for preparing a full-color two-in-one SMD LED display device, referring to Figure 4 , includes a bottom plate 7. A plurality of pin fixers 8 for fixing the device pins are provided on the bottom plate 7. The pin fixer 8 includes a first clamping block 81, an arc-shaped block 82 and a second clamping block 83. The first clamping block 81 and the second clamping block 83 are symmetrically arranged on both sides of the arc-shaped block 82. An arc surface is provided on the upper part of the arc-shaped block 82, and the arc surface fits with the smooth connection surface of the welding leg 33 and the connecting bar 32. The whole of the first clamping block 81, the arc-shaped block 82 and the second clamping block 83 forms a groove 62 after being injection molded into PPA plastic material. The groove 62 enables the tin liquid to wrap the left and right sides and the bottom surface of the joint between the connecting bar 32 and the welding leg 33, increasing the tin eating area.

[0059] The heights of the first clamping block 81 and the second clamping block 83 of the present invention are the same and greater than the highest height of the arc-shaped block 82, so that the formed groove 62 can expose more parts of the joint between the connecting bar 32 and the welding leg 33, increasing the tin eating area.

[0060] This device is a Top-type bracket structure, and the device size is not limited. The hardware structure is a "ji" character symmetric structure. The device is an RGB pixel two-in-one full-color light-emitting lamp bead, and the chip adopts a flip chip. The two-in-one device adopts a 12-pin design, increasing the tin eating area and making the welding more reliable. All 12 pins adopt a T-shaped design, further increasing the tin eating area. A small groove is opened at the place where the pins extend out of the PPA, increasing the pin length, and while increasing the tin eating area, the anti-deformation ability of the pins is not reduced. The lengths of both sides of the pins do not exceed the PPA, preventing the pins from being knocked and deformed.

Claims

1. A full-color two-in-one SMD LED display device, characterized in that: It comprises a display unit (1) symmetrically nested on a same bracket (6), wherein only the bottom surface of the pin of the display unit (1) is exposed on the bottom surface of the bracket (6), and a groove (62) is provided at the connection between the bottom of the bracket (6) and the pin.

2. A full-color two-in-one SMD LED display device according to claim 1, characterized in that: The display unit (1) is provided with three display units (2), the display unit (2) includes a display chip (5) and pins, the pins include a first pin (3) and a second pin (4) symmetrically connected to the display chip (5), the bracket (6) is provided with a bowl (61), the display chip (5) is arranged in the bowl (61), and the bowl (61) is filled with epoxy resin glue that wraps the display chip (5).

3. A full-color two-in-one SMD LED display device according to claim 2, characterized in that: The first pin (3) comprises a solder pad (31) and a solder foot (33) arranged in parallel, and the solder pad (31) and the solder foot (33) are respectively smoothly connected to a connecting bar (32).

4. A full-color two-in-one SMD LED display device according to claim 3, characterized in that: A first angle between the soldering pad (31) and the connecting strip (32) forms an acute angle, and a second angle between the connecting strip (32) and the soldering foot (33) forms an acute angle in a direction opposite to the first angle.

5. A full-color two-in-one SMD LED display device according to claim 3, characterized in that: The width and length of the groove (62) are both greater than the width and length of the connection point between the connecting strip (32) and the welding foot (33).

6. A full-color two-in-one SMD LED display device according to claim 1, characterized in that: Extension sections are provided on both sides of the pin, so that the pin exposed on the bottom surface of the bracket (6) is in a "T" shape.

7. A full-color two-in-one SMD LED display device according to claim 2, characterized in that: The display chip (5) is a full-color luminous lamp bead flip chip.

8. A full-color two-in-one SMD LED display device according to claim 1, characterized in that: The bracket (6) is made of an integrally formed PPA plastic material, and the length of the pin exposed on the bottom surface of the bracket (6) does not exceed the PPA plastic material.

9. A mold for preparing a full-color two-in-one SMD LED display device, for preparing a groove (62) of a full-color two-in-one SMD LED display device according to any one of claims 3 to 8, characterized in that: The invention comprises a bottom plate (7), wherein a plurality of pin holders (8) are provided on the bottom plate (7), wherein the pin holders (8) comprise a first clamping block (81) and a second clamping block (83) symmetrically arranged on both sides of an arc block (82), and the arc surface of the arc block (82) is in contact with the smooth connection surface of the connecting strip (32) and the welding foot (33).

10. A mold for preparing a full-color two-in-one SMD LED display device according to claim 9, characterized in that: The heights of the first clamping block (81) and the second clamping block (83) are greater than the highest height of the arc-shaped block (82).

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