Light-emitting device manufacturing method, light-emitting device, and display panel

Abstract

This invention proposes a method for fabricating a light-emitting device, a light-emitting device, and a display panel. The method for fabricating the light-emitting device includes: fabricating a suspended base on a driving backplane, wherein the suspended base is disposed between two adjacent pixel units, and any first plane projection of the suspended base includes a second plane projection; fabricating suspended arms on the two sides of the suspended base opposite to the pixel units; fabricating a light-emitting layer on the driving backplane; removing the suspended arms from the suspended base; and fabricating a remaining film layer on the light-emitting layer. By setting suspended arms on the suspended base, the connection between the light-emitting materials of two adjacent pixel units can be severed during the fabrication of the light-emitting layer, avoiding color shift. After the light-emitting layer is fabricated, the suspended arms are removed, thereby preventing the suspended arms from affecting subsequent encapsulation. Furthermore, due to the structural design of the suspended base, the suspended base does not affect subsequent encapsulation.

Description

Technical Field

[0001] This invention relates to the field of display panels, and more particularly to a method for preparing a light-emitting device, the light-emitting device, and a display panel. Background Technology

[0002] In the manufacturing process of OLEDs (Organic Light-Emitting Diodes), the light-emitting material is typically deposited using a fine metal mask (FMM) to form a pattern of the light-emitting material. However, due to the limited precision of the FMM, when the PPI of an OLED display is high, the distance between pixels is very close, which can easily cause the light-emitting material to deviate during deposition. This can lead to contact between different colors of light-emitting materials, resulting in color shift and other problems.

[0003] In existing technologies, a hanging structure is usually formed before vapor deposition to isolate adjacent pixels. Due to the presence of the hanging structure, the light-emitting material is completely separated from the opening area and the hanging structure, thereby avoiding color shift problems.

[0004] However, the presence of the overhang structure can affect the encapsulation effect, resulting in a shorter lifespan for the OLED display. Summary of the Invention

[0005] The main objective of this invention is to provide a method for fabricating a light-emitting device, the light-emitting device itself, and a display panel, aiming to solve the problem that the presence of a hanging structure in the prior art can affect the packaging effect.

[0006] To achieve the above objectives, the present invention provides a method for fabricating a light-emitting device, the method comprising:

[0007] A pendant base is fabricated on a driving backplate, wherein the pendant base is disposed between two adjacent pixel units, and any first plane projection of the pendant base includes a second plane projection, wherein the first plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the first plane, and the second plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplate, and the first plane is closer to the driving backplate than the second plane;

[0008] A cantilever arm is prepared on both sides of the cantilever base opposite to the pixel unit, wherein one side of the cantilever arm is connected to the cantilever base and the other side of the cantilever arm extends toward the pixel unit;

[0009] A light-emitting layer is prepared on the driving backplate;

[0010] Remove the cantilever arm from the cantilever base;

[0011] The remaining film layer is prepared on the light-emitting layer.

[0012] Optionally, a pixel definition layer is provided on the driving backplane; the fabrication of the suspension base on the driving backplane includes:

[0013] The suspension base is fabricated on the pixel definition layer, wherein the projection of the suspension base and the suspension arm onto the pixel definition layer is contained within the pixel definition layer.

[0014] Optionally, the cross-section of the suspension base is a regular trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, the lower base of the cross-section is disposed on the drive back plate, and the upper base of the cross-section is disposed on the suspension arm.

[0015] Optionally, fabricating the cantilever arms on the two sides of the cantilever base opposite to the pixel unit includes:

[0016] A support layer is applied to the drive back plate, wherein the top surface of the support layer is lower than the top surface of the suspension base;

[0017] The cantilever arm is fabricated on the support layer;

[0018] Remove the support layer.

[0019] Optionally, the process of fabricating the cantilever arm on the support layer includes:

[0020] A cut is made at the connection between the suspension arm and the suspension base.

[0021] Optionally, removing the cantilever arm from the cantilever base includes:

[0022] An auxiliary substrate is attached to the cantilever arm, wherein an adhesive structure is provided on the side of the auxiliary substrate facing the cantilever arm;

[0023] Remove the auxiliary substrate to which the cantilever arm is attached.

[0024] Optionally, the auxiliary substrate is further provided with a buffer structure on the side facing the cantilever arm. The buffer structure has the same height as the adhesive structure. When the auxiliary substrate is attached to the cantilever arm, the buffer structure contacts the cantilever base, and the adhesive structure contacts the cantilever arm.

[0025] Optionally, the step of preparing the remaining film layer on the light-emitting layer includes:

[0026] A cathode film layer is prepared on the light-emitting layer;

[0027] An encapsulation layer is prepared on the cathode film layer.

[0028] In addition, to achieve the above objectives, the present invention also provides a light-emitting device, which is prepared by the light-emitting device preparation method described above.

[0029] In addition, to achieve the above objectives, the present invention also provides a display panel including the light-emitting device as described above.

[0030] This invention proposes a method for fabricating a light-emitting device, a light-emitting device, and a display panel. The method for fabricating the light-emitting device includes: fabricating a suspended base on a driving backplate, wherein the suspended base is disposed between two adjacent pixel units, and any first plane projection of the suspended base includes a second plane projection, wherein the first plane projection is the projection of the suspended base's cross-section on the first plane corresponding to the driving backplate, and the second plane projection is the projection of the suspended base's cross-section on the second plane corresponding to the driving backplate, the first plane and the second plane are parallel to the driving backplate, and the first plane is closer to the driving backplate than the second plane; fabricating suspended arms on the two sides of the suspended base opposite to the pixel units, wherein one side of the suspended arm is connected to the suspended base, and the other side of the suspended arm extends toward the pixel unit; fabricating a light-emitting layer on the driving backplate; removing the suspended arms from the suspended base; and fabricating a remaining film layer on the light-emitting layer. By setting a cantilever arm on the cantilever base, the connection between the light-emitting materials of two adjacent pixel units can be cut off during the fabrication of the light-emitting layer to avoid color deviation. After the light-emitting layer is fabricated, the cantilever arm is removed, thereby avoiding the cantilever arm from affecting subsequent packaging. At the same time, due to the structural design of the cantilever base, the cantilever base will not affect subsequent packaging. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0034] Figure 1 This is a schematic diagram illustrating the fabrication method of the light-emitting device of the present invention;

[0035] Figure 2 This is a schematic diagram of the fabrication of the light-emitting layer in the prior art;

[0036] Figure 3 This is a schematic diagram of the fabrication of an encapsulation layer in the prior art;

[0037] Figure 4 This is a schematic diagram illustrating the fabrication of the suspended portion in the light-emitting device fabrication method of the present invention;

[0038] Figure 5 This is a schematic diagram of the preparation of the support layer in the method for preparing the light-emitting device of the present invention;

[0039] Figure 6 This is a schematic diagram illustrating the preparation of the notch in the light-emitting device fabrication method of the present invention;

[0040] Figure 7 This is a schematic diagram illustrating the preparation of the auxiliary substrate in the light-emitting device preparation method of the present invention;

[0041] Figure 8 This is a schematic diagram illustrating the removal of the cantilever arm in the method for fabricating the light-emitting device of the present invention.

[0042] Figure 9 This is a schematic diagram illustrating the fabrication of the light-emitting layer in the method for fabricating the light-emitting device of the present invention;

[0043] Figure 10 This is a schematic diagram illustrating the preparation of the remaining film layer in the method for fabricating the light-emitting device of the present invention;

[0044] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0045] Explanation of icon numbers:

[0046] Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0048] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0049] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0050] This invention provides a method for fabricating a light-emitting device, which is applied in light-emitting devices. Please refer to [link / reference]. Figure 1 , Figure 1 This is a functional block diagram of an embodiment of the light-emitting device fabrication method of the present invention. In this embodiment, the light-emitting device fabrication method includes:

[0051] A suspension base 200 is fabricated on a driving backplate 100, wherein the suspension base 200 is disposed between two adjacent pixel units, and any first plane projection of the suspension base 200 includes a second plane projection, wherein the first plane projection is the projection of the suspension base 200 on the driving backplate 100 corresponding to the cross section of the first plane, and the second plane projection is the projection of the suspension base 200 on the driving backplate 100 corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplate 100, and the first plane is closer to the driving backplate 100 than the second plane;

[0052] A suspension arm 300 is prepared on both sides of the suspension base 200 opposite to the pixel unit, wherein one side of the suspension arm 300 is connected to the suspension base 200, and the other side of the suspension arm 300 extends toward the pixel unit.

[0053] A light-emitting layer 400 is prepared on the driving backplate 100;

[0054] Remove the cantilever arm 300 from the cantilever base 200;

[0055] A residual film layer 600 is prepared on the light-emitting layer 400.

[0056] A pixel unit is an independent light-emitting unit, such as the pixel corresponding to a red, green, or blue OLED.

[0057] Understandably, in order to block the light-emitting material of adjacent pixel units, the overhanging structure 500 in the prior art is usually set in an inverted trapezoidal or inverted triangular shape. Taking the inverted trapezoid as an example, see... Figure 2 During the fabrication of the light-emitting layer 400, the light-emitting material falls from above and deposits onto the driving backplate 100 to form the light-emitting layer 400. Due to the inverted trapezoidal arrangement of the overhang structure 500, the light-emitting material cannot form a connection between two pixel units on the overhang structure 500, thus blocking the contact between the light-emitting materials of the two pixel units. Current cannot flow between the two pixel units through the light-emitting material, thereby avoiding color shift problems. However, during encapsulation, the inverted trapezoidal overhang structure 500 will affect the encapsulation process, see [link to encapsulation process]. Figure 3 After the suspension structure 500 is set, the remaining film layer 600 is also affected by the suspension structure 500 and cannot completely fill the bottom of the suspension structure 500. Therefore, encapsulation gaps will be generated near the suspension structure 500, which can easily lead to moisture intrusion and affect the life of the display panel.

[0058] In this embodiment, a suspension base 200 is first fabricated on the driving backplate 100. The suspension base 200 serves as a support for the suspension arm 300. The suspension base 200 is positioned between two adjacent pixel units to mark the separation between the two adjacent pixel units. The specific material and fabrication method of the suspension base 200 can be set according to actual needs. For example, the suspension base 200 can be made of materials such as silicon nitride (SiNx) or silicon oxide (SiOx). Specifically, it can be fabricated by CVD (Chemical Vapor Deposition) film formation and photolithography.

[0059] Hanging arms 300 are fabricated on both sides of the hanging base 200, extending towards the pixel unit, thereby forming an isolation space 700 between the hanging arms 300 and the hanging base 200. A light-emitting layer 400 is then fabricated on this basis. This isolation space 700 isolates the light-emitting materials of adjacent pixel units, preventing color shifts between adjacent pixel units. The specific fabrication method of the hanging arms 300 can be set according to actual needs. The specific material and fabrication method of the hanging arms 300 can also be set according to actual needs; for example, the hanging arms 300 can be made of brittle materials such as silicon nitride (SiNx) or silicon oxide (SiOx).

[0060] The remaining film layer 600 includes the other film layers above the light-emitting layer 400; the remaining film layer 600 includes, for example, the cathode film layer, the encapsulation film layer, etc.

[0061] After the light-emitting layer 400 is prepared, if the remaining film layer 600 is prepared directly, the presence of the hanging arm 300 will cause encapsulation gaps in the remaining film layer 600 during preparation. Therefore, in this embodiment, after the light-emitting layer 400 is prepared, the hanging arm 300 is removed first. After the hanging arm 300 is removed from the hanging base 200, the hanging structure 500 still retains the hanging base 200. Since any first plane projection of the hanging base 200 includes the second plane projection, and the first plane is parallel to the driving backplate 100 and relative to the second plane... The surface is closer to the driving backplate 100, making the portion of the droop base 200 closer to the driving backplate 100 larger and the portion farther away from the driving backplate 100 smaller. Simultaneously, the upper portion does not exceed the lower portion, thus preventing protrusions extending towards the pixel units from appearing on the droop base 200. This eliminates the isolation space 700 on the droop base 200 itself. Therefore, fabricating the remaining film layer 600 on the droop base 200 avoids encapsulation gaps in the remaining film layer 600, ensuring the integrity of the encapsulation structure and preventing moisture intrusion. The method of removing the droop structure 500 can be set based on actual needs.

[0062] In this embodiment, by setting a hanging arm 300 on the hanging base 200, the connection between the light-emitting materials of two adjacent pixel units can be cut off during the fabrication of the light-emitting layer 400 to avoid color deviation. After the light-emitting layer 400 is fabricated, the hanging arm 300 is removed, thereby avoiding the hanging arm 300 from affecting subsequent packaging. At the same time, due to the structural design of the hanging base 200, the hanging base will not affect subsequent packaging.

[0063] Further, see Figure 4 The driving backplate 100 is provided with a pixel definition layer; the fabrication of the suspension base 200 on the driving backplate 100 includes:

[0064] The suspension base 200 is fabricated on the pixel definition layer, wherein the projection of the suspension base 200 and the suspension arm 300 onto the pixel definition layer is contained within the pixel definition layer.

[0065] The PDL (Pixel Definition Layer) is used to define and separate each pixel unit in an OLED display; the suspension base 200 is also set up to isolate adjacent pixel units. Therefore, fabricating the suspension base 200 on the PDL can meet the requirements for pixel unit separation.

[0066] It is understandable that the pixel definition layer is set based on the actual pixel separation requirements. The pixel units constructed by the pixel definition layer all need to be prepared with the light-emitting layer 400. Therefore, in order to avoid the hanging base 200 and the hanging arm 300 affecting the preparation of the light-emitting layer 400 in the pixel unit, the projection of the hanging base 200 and the hanging arm 300 on the pixel definition layer is set to be included in the pixel definition layer, so that the light-emitting layer 400 can be completely prepared in the pixel unit.

[0067] The specific structure of the pixel definition layer can be set according to actual needs. For example, if the interface of the pixel definition layer is trapezoidal and the lower base of the trapezoidal cross section is set on the driving back plate 100, then in specific settings, the lower base of the cross section of the hanging base 200 can be set to be smaller than the upper base of the pixel definition layer. Since the plane projection corresponding to the plane further away from the driving back plate 100 is smaller, the entire hanging base 200 can be kept within the area of ​​the pixel definition layer. When setting the hanging arm 300, the outermost edge of the hanging arm 300 can be set to not exceed the edge of the pixel definition layer, so that the hanging arm 300 will not block the preparation of the light-emitting material of the pixel unit.

[0068] Furthermore, the cross-section of the suspension base 200 is a regular trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, the lower base of the cross-section is disposed on the drive back plate 100, and the upper base of the cross-section is disposed on the suspension arm 300.

[0069] It is understandable that the upper base of a trapezoid is smaller than the lower base. Therefore, by setting the cross-section of the suspension base 200 to be trapezoidal, the suspension base 200 itself does not have an isolation space 700, thereby avoiding the generation of encapsulation gaps.

[0070] In other embodiments, the cross-section of the suspended base 200 can be set to other shapes, such as setting the inclined surface of the trapezoid as an arc edge, based on the trapezoidal shape.

[0071] Further, see Figure 5 The process of fabricating cantilever arms 300 on the two sides of the cantilever base 200 opposite to the pixel unit includes:

[0072] A support layer 310 is coated on the drive back plate 100, wherein the top surface height of the support layer 310 is lower than the top surface height of the suspension base 200;

[0073] The cantilever arm 300 is fabricated on the support layer 310;

[0074] Remove the support layer 310.

[0075] The support layer 310 is used to construct the manufacturing support for the cantilever arm 300. The specific material and preparation method of the support layer 310 can be set according to actual needs. It is understood that the support layer 310 needs to be removed later. Therefore, the preparation material of the support layer 310 can be set to an easily removable material, such as a photoresist material, which can be coated and photolithographically formed to obtain the photoresist support layer 310.

[0076] The top surface of the support layer 310 is lower than the top surface of the suspension base 200, so that the top surface of the suspension base 200 can protrude from the support layer 310. The suspension arm 300 is fabricated on the support layer 310 so that the fabricated suspension arm 300 can be connected with the suspension base 200, thereby forming an isolation space 700 through the suspension base 200 and the suspension arm 300.

[0077] The difference between the top surface height of the support layer 310 and the top surface height of the suspension base 200 can be set according to actual needs, such as the difference between the top surface height of the support layer 310 and the top surface height of the suspension base 200 being less than 1µm.

[0078] Further, see Figure 6 The process of fabricating the cantilever arm 300 on the support layer 310 includes:

[0079] A cut is made at the connection between the suspension arm 300 and the suspension base 200.

[0080] After the light-emitting layer 400 is prepared, the hanging arm 300 needs to be removed from the hanging base 200. Therefore, when preparing the hanging arm 300, the connection between the hanging arm 300 and the hanging base 200 can be made easier to separate, so as to facilitate the removal of the hanging arm 300. In this embodiment, a cut is prepared at the connection between the hanging arm 300 and the hanging base 200, so as to further weaken the connection between the hanging arm 300 and the hanging base 200, making it easier to remove the hanging arm 300.

[0081] To further facilitate the removal of the hanging arm 300, the contact area between the hanging arm 300 and the hanging base 200 can be minimized during the preparation of the hanging arm 300.

[0082] Further, removing the cantilever arm 300 from the cantilever base 200 includes:

[0083] The auxiliary substrate 900 is attached to the cantilever arm 300, wherein the auxiliary substrate 900 is provided with an adhesion structure 910 on the side facing the cantilever arm 300;

[0084] Remove the auxiliary substrate 900 to which the cantilever arm 300 is attached.

[0085] See Figure 7 An adhesive structure 910 is provided on the auxiliary substrate 900 to adhere the auxiliary substrate 900 to the cantilever arm 300, thereby allowing the adhesive structure 910 to adhere the cantilever arm 300. When the auxiliary substrate 900 is removed, because the cantilever arm 300 is adhered to the adhesive structure 910, the cantilever arm 300 is pulled away from the cantilever base 200 by the auxiliary substrate 900 and is removed along with the auxiliary substrate 900. To facilitate the removal of the cantilever arm 300, the cantilever arm 300 is made of brittle materials such as silicon nitride (SiNx) or silicon oxide (SiOx).

[0086] In order to ensure that the auxiliary substrate 900 can remove the cantilever arm 300 from the cantilever base 200, when setting the adhesion structure 910, a material with a stronger adhesion than the fixing force between the cantilever arm 300 and the cantilever base 200 can be used to manufacture the adhesion structure 910; the specific material can be set according to actual needs.

[0087] Furthermore, a buffer structure 920 is provided on the side of the auxiliary substrate 900 facing the hanging arm 300. The buffer structure 920 has the same height as the adhesive structure 910. When the auxiliary substrate 900 and the hanging arm 300 are attached to each other, the buffer structure 920 contacts the hanging base 200, and the adhesive structure 910 contacts the hanging arm 300.

[0088] In practical applications, when attaching the auxiliary substrate 900 to the cantilever arm 300, there may be cases where the force is too weak and not all cantilever arms 300 are successfully adhered, or cases where the force is too strong and damages the internal structure of the panel. Therefore, in order to successfully remove all cantilever arms 300 while avoiding affecting other structures of the substrate, in this embodiment, a buffer structure 920 is also provided on the auxiliary substrate 900. The auxiliary substrate 900 provides a buffer structure 920 and an adhesion structure 910 for each cantilever base 200. When the auxiliary substrate 900 is attached to the cantilever arm 300, the buffer structure 920 contacts the cantilever base 200, thereby buffering the attachment force of the auxiliary substrate 900 and avoiding damage to other devices due to excessive force. At the same time, the adhesion structure 910 and the buffer structure 920 have the same height, so that when the buffer structure 920 contacts the cantilever base 200, the adhesion structure 910 can also adhere to the cantilever arm 300.

[0089] See Figure 8When the auxiliary substrate 900 is attached to the cantilever arm 300, due to the action of the buffer structure 920, the buffer structure 920 cannot continue downward after contacting the top surface of the cantilever base 200, thereby controlling the distance between the auxiliary substrate 900 and the drive back plate 100, while ensuring that the adhesion structure 910 adheres to the cantilever arm 300. After the auxiliary substrate 900 is removed, the cantilever arm 300, which is adhered by the adhesion structure 910, is pulled apart from the cantilever base 200 by the auxiliary substrate 900, and the removal of the cantilever arm 300 is completed.

[0090] The specific materials and structure of the buffer structure 920 can be set according to actual needs, such as using organic materials such as PI (Polyimide) and PMMA (Polymethyl Methacrylate).

[0091] Further, the preparation of the remaining film layer 600 on the light-emitting layer 400 includes:

[0092] A cathode film layer is prepared on the light-emitting layer 400;

[0093] An encapsulation layer is prepared on the cathode film layer.

[0094] After the light-emitting layer 400 is prepared, the cathode film layer is prepared to realize the structure of the pixel unit. After the pixel unit structure is prepared, the encapsulation layer is prepared, thereby realizing the preparation of the light-emitting device.

[0095] The specific preparation methods for the cathode film layer and the encapsulation layer can be set according to actual needs; it is understood that, in addition to the cathode film layer and the encapsulation layer, other film layers can also be prepared on the light-emitting layer 400 according to actual needs.

[0096] The overall preparation process of this application is described below:

[0097] 1. Complete the fabrication of the driving backplane 100 and the pixel definition layer;

[0098] 2. See Figure 4 A pendant base 200 is fabricated on the pixel definition layer, and the cross section of the pendant base 200 is a regular trapezoid.

[0099] 3. See Figure 5 A support layer 310 is prepared, wherein the height of the top surface of the support layer 310 is less than the height of the top surface of the suspension base 200;

[0100] 4. A cantilever arm 300 is fabricated on the support layer 310. One side of the cantilever arm 300 is connected to the cantilever base 200, and the other side of the cantilever arm 300 extends toward the pixel unit. An isolation space 700 is formed between the cantilever arm 300 and the cantilever base 200. The extension length of the cantilever arm 300 toward the pixel unit is determined by the opening area of ​​the pixel unit and should not affect the film formation of the light-emitting material in the opening area. Specifically, the outermost edge of the cantilever arm 300 can be set to not exceed the edge of the pixel definition layer.

[0101] 5. See Figure 9 An emissive layer 400 is prepared. Due to the presence of the isolation space 700, the emissive material of the emissive layer 400 is discontinuous between adjacent pixel units.

[0102] 6. See also Figure 7 , 8 The auxiliary substrate 900 and the hanging arm 300 are attached together. After the buffer structure 920 contacts the top surface of the hanging base 200, it cannot continue to move downward, thereby controlling the distance between the auxiliary substrate 900 and the drive back plate 100. At the same time, it ensures that the adhesion structure 910 adheres to the hanging arm 300. Then the auxiliary substrate 900 is removed. The hanging arm 300 is attached by the adhesion structure 910 and is pulled away from the hanging base 200 by the auxiliary substrate 900, thus completing the removal of the hanging arm 300.

[0103] 7. See also Figure 10 Prepare the remaining film layer 600.

[0104] Another overall preparation process:

[0105] 1. Complete the fabrication of the driving backplane 100 and the pixel definition layer;

[0106] 2. Prepare a pendant base 200 on the pixel definition layer. The cross-section of the pendant base 200 is a regular trapezoid.

[0107] 3. Prepare a support layer 310, wherein the height of the top surface of the support layer 310 is less than the height of the top surface of the suspension base 200;

[0108] 4. A cantilever arm 300 is fabricated on the support layer 310. One side of the cantilever arm 300 is connected to the cantilever base 200, and the other side of the cantilever arm 300 extends toward the pixel unit. An isolation space 700 is formed between the cantilever arm 300 and the cantilever base 200. The extension length of the cantilever arm 300 toward the pixel unit is determined by the opening area of ​​the pixel unit and should not affect the film formation of the light-emitting material in the opening area. Specifically, the outermost edge of the cantilever arm 300 can be set to not exceed the edge of the pixel definition layer.

[0109] 5. See Figure 6 A cut is made at the connection between the suspension arm 300 and the suspension base 200;

[0110] 6. Prepare the light-emitting layer 400. Due to the presence of the isolation space 700, the light-emitting material of the light-emitting layer 400 is discontinuous between adjacent pixel units.

[0111] 7. The auxiliary substrate 900 and the hanging arm 300 are attached together. After the buffer structure 920 contacts the top surface of the hanging base 200, it cannot continue to move downward, thereby controlling the distance between the auxiliary substrate 900 and the drive back plate 100. At the same time, it ensures that the adhesion structure 910 adheres to the hanging arm 300. Then the auxiliary substrate 900 is removed. The hanging arm 300 is attached by the adhesion structure 910 and is pulled away from the hanging base 200 by the auxiliary substrate 900, thus completing the removal of the hanging arm 300.

[0112] 8. Prepare the remaining film layer 600.

[0113] This invention also protects a light-emitting device, which includes a method for preparing the light-emitting device, and is prepared by the method described above; the method for preparing the light-emitting device includes:

[0114] A pendant base is fabricated on a driving backplate, wherein the pendant base is disposed between two adjacent pixel units, and any first plane projection of the pendant base includes a second plane projection, wherein the first plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the first plane, and the second plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplate, and the first plane is closer to the driving backplate than the second plane;

[0115] A cantilever arm is prepared on both sides of the cantilever base opposite to the pixel unit, wherein one side of the cantilever arm is connected to the cantilever base and the other side of the cantilever arm extends toward the pixel unit;

[0116] A light-emitting layer is prepared on the driving backplate;

[0117] Remove the cantilever arm from the cantilever base;

[0118] The remaining film layer is prepared on the light-emitting layer.

[0119] Furthermore, a pixel definition layer is provided on the driving backplane; the fabrication of the suspension base on the driving backplane includes:

[0120] The suspension base is fabricated on the pixel definition layer, wherein the projection of the suspension base and the suspension arm onto the pixel definition layer is contained within the pixel definition layer.

[0121] Furthermore, the cross-section of the suspension base is a regular trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, the lower base of the cross-section is disposed on the drive back plate, and the upper base of the cross-section is disposed on the suspension arm.

[0122] Further, the process of fabricating cantilever arms on the two sides of the cantilever base opposite to the pixel unit includes:

[0123] A support layer is applied to the drive back plate, wherein the top surface of the support layer is lower than the top surface of the suspension base;

[0124] The cantilever arm is fabricated on the support layer;

[0125] Remove the support layer.

[0126] Further, the process of fabricating the cantilever arm on the support layer includes:

[0127] A cut is made at the connection between the suspension arm and the suspension base.

[0128] Further, removing the cantilever arm from the cantilever base includes:

[0129] An auxiliary substrate is attached to the cantilever arm, wherein an adhesive structure is provided on the side of the auxiliary substrate facing the cantilever arm;

[0130] Remove the auxiliary substrate to which the cantilever arm is attached.

[0131] Furthermore, a buffer structure is provided on the side of the auxiliary substrate facing the cantilever arm. The buffer structure has the same height as the adhesive structure. When the auxiliary substrate and the cantilever arm are attached together, the buffer structure contacts the cantilever base, and the adhesive structure contacts the cantilever arm.

[0132] Further, the preparation of the remaining film layer on the light-emitting layer includes:

[0133] A cathode film layer is prepared on the light-emitting layer;

[0134] An encapsulation layer is prepared on the cathode film layer.

[0135] The present invention also protects a display panel including the light-emitting device described above.

[0136] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element. The sequence numbers of the above-described embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0137] In this invention, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0138] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0139] Although embodiments of the present invention have been shown and described above, the scope of protection of the present invention is not limited thereto. It is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, and substitutions to the above embodiments within the scope of the present invention, and such changes, modifications, and substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for fabricating a light-emitting device, characterized in that, The method for fabricating the light-emitting device includes: A pendant base is fabricated on a driving backplate, wherein the pendant base is disposed between two adjacent pixel units, and any first plane projection of the pendant base includes a second plane projection, wherein the first plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the first plane, and the second plane projection is the projection of the pendant base on the driving backplate corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplate, and the first plane is closer to the driving backplate than the second plane; A cantilever arm is prepared on both sides of the cantilever base opposite to the pixel unit, wherein one side of the cantilever arm is connected to the cantilever base and the other side of the cantilever arm extends toward the pixel unit. When preparing the cantilever arm, the contact area between the cantilever arm and the cantilever base is reduced. A light-emitting layer is prepared on the driving backplate; A cut is made at the connection between the suspension arm and the suspension base; Remove the cantilever arm from the cantilever base; The remaining film layer is prepared on the light-emitting layer; The driving backplate is provided with a pixel definition layer; the fabrication of the suspension base on the driving backplate includes: The suspension base is fabricated on the pixel definition layer, wherein the projections of the suspension base and the suspension arm onto the pixel definition layer are contained within the pixel definition layer; The step of removing the cantilever arm from the cantilever base includes: An auxiliary substrate is attached to the cantilever arm, wherein an adhesive structure is provided on the side of the auxiliary substrate facing the cantilever arm; Remove the auxiliary substrate to which the cantilever arm is attached; The auxiliary substrate is further provided with a buffer structure on the side facing the cantilever arm. The buffer structure has the same height as the adhesive structure. When the auxiliary substrate and the cantilever arm are attached together, the buffer structure contacts the cantilever base, and the adhesive structure contacts the cantilever arm. The material of the buffer structure is an organic material. The process of fabricating cantilever arms on the two sides of the cantilever base opposite to the pixel unit includes: A support layer is applied to the drive back plate, wherein the top surface of the support layer is lower than the top surface of the suspension base; The cantilever arm is fabricated on the support layer; Remove the support layer.

2. The method for fabricating a light-emitting device as described in claim 1, characterized in that, The cross-section of the suspension base is a regular trapezoid, wherein the hypotenuse of the cross-section is opposite to the pixel unit, the lower base of the cross-section is disposed on the drive back plate, and the upper base of the cross-section is disposed on the suspension arm.

3. The method for fabricating a light-emitting device as described in claim 1, characterized in that, The step of preparing the residual film layer on the light-emitting layer includes: A cathode film layer is prepared on the light-emitting layer; An encapsulation layer is prepared on the cathode film layer.

4. A light-emitting device, characterized in that, The light-emitting device is prepared by the light-emitting device preparation method as described in any one of claims 1 to 3.

5. A display panel, characterized in that, Includes the light-emitting device as described in claim 4.

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