Light-emitting device manufacturing method, light-emitting device, and display panel

Abstract

This invention proposes a method for fabricating a light-emitting device, a light-emitting device, and a display panel. The method includes fabricating a dangling structure on a driving backplane, wherein the dangling structure is fabricated on the driving backplane via a weak connection structure, and the dangling structure is disposed between two adjacent pixel units. Any first plane projection of the dangling structure includes a second plane projection. A light-emitting layer is fabricated on the driving backplane. The dangling structure is then disconnected from the weak connection structure and removed. A remaining film layer is fabricated on the light-emitting layer. By setting the dangling structure, the connection between the light-emitting materials of two adjacent pixel units can be severed during the fabrication of the light-emitting layer, avoiding color shift. After the light-emitting layer is fabricated, the dangling structure is removed, thereby preventing the dangling structure from affecting subsequent encapsulation.

Description

Technical Field

[0001] This invention relates to the field of display panels, and more particularly to a method for preparing a light-emitting device, the light-emitting device, and a display panel. Background Technology

[0002] In the manufacturing process of OLEDs (Organic Light-Emitting Diodes), the light-emitting material is typically deposited using a fine metal mask (FMM) to form a pattern of the light-emitting material. However, due to the limited precision of the FMM, when the PPI of an OLED display is high, the distance between pixels is very close, which can easily cause the light-emitting material to deviate during deposition. This can lead to contact between different colors of light-emitting materials, resulting in color shift and other problems.

[0003] In existing technologies, a hanging structure is usually formed before vapor deposition to isolate adjacent pixels. Due to the presence of the hanging structure, the light-emitting material is completely separated from the opening area and the hanging structure, thereby avoiding color shift problems.

[0004] However, the presence of the overhang structure can affect the encapsulation effect, resulting in a shorter lifespan for the OLED display. Summary of the Invention

[0005] The main objective of this invention is to provide a method for fabricating a light-emitting device, the light-emitting device itself, and a display panel, aiming to solve the problem that the presence of a hanging structure in the prior art can affect the packaging effect.

[0006] To achieve the above objectives, the present invention provides a method for fabricating a light-emitting device, the method comprising:

[0007] A dangling structure is fabricated on a driving backplane, wherein the dangling structure is fabricated on the driving backplane through a weak connection structure, the dangling structure is disposed between two adjacent pixel units, and any first plane projection of the dangling structure includes a second plane projection, wherein the first plane projection is the projection of the dangling structure on the driving backplane corresponding to the cross section of the first plane, and the second plane projection is the projection of the dangling structure on the driving backplane corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane;

[0008] A light-emitting layer is prepared on the driving backplate;

[0009] Disconnect the overhang structure from the weak connection structure and remove the overhang structure;

[0010] The remaining film layer is prepared on the light-emitting layer.

[0011] Optionally, a pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes:

[0012] A photoresist layer is coated on the drive backplate;

[0013] A connecting hole is obtained by drilling a hole in the photoresist region on the pixel definition layer, and a hanging groove is prepared. The hanging groove is connected to the pixel definition layer through the connecting hole.

[0014] The drooping structure is obtained by fabricating a drooping structure film layer on the photoresist layer, wherein the drooping structure film layer at the drooping groove constitutes the drooping structure, and the drooping structure film layer at the connecting hole constitutes the weak connection structure, wherein the projection of the drooping structure on the pixel definition layer is included in the pixel definition layer.

[0015] Remove the photoresist layer.

[0016] Optionally, the method of creating a connection hole by drilling a hole in the photoresist region on the pixel definition layer includes:

[0017] A first hole is formed in the photoresist region on the pixel definition layer, wherein the first hole is connected to the pixel definition layer;

[0018] A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than that of the first hole, and the second hole is connected to the pixel definition layer through the first hole.

[0019] Optionally, the cross-section of the suspension structure is an inverted trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, and the upper bottom edge of the cross-section is disposed on the drive back plate through the weak connection structure.

[0020] Optionally, disconnecting the overhang structure from the weak connection structure and removing the overhang structure includes:

[0021] An auxiliary substrate is attached to the suspended structure, wherein a first adhesive layer is provided on the side of the auxiliary substrate facing the suspended structure;

[0022] Disconnect the weak connection structure;

[0023] Remove the auxiliary substrate to which the overhang structure is attached.

[0024] Optionally, a pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes:

[0025] A second adhesion layer is prepared on the pixel definition layer;

[0026] An auxiliary substrate with the overhang structure is attached to the driving back plate, wherein the side with the overhang structure faces the driving back plate, and the overhang structure is attached to the second adhesive layer of the pixel definition layer.

[0027] The first adhesive layer on the auxiliary substrate is de-adheded;

[0028] Remove the auxiliary substrate.

[0029] Optionally, attaching the auxiliary substrate with the overhang structure to the drive backplate includes:

[0030] The weak connection structure on the overhang structure is etched to make the weak connection structure flush.

[0031] The auxiliary substrate with the overhang structure attached is attached to the drive backplate.

[0032] Optionally, the step of preparing the remaining film layer on the light-emitting layer includes:

[0033] A cathode film layer is prepared on the light-emitting layer;

[0034] An encapsulation layer is prepared on the cathode film layer.

[0035] In addition, to achieve the above objectives, the present invention also provides a light-emitting device, which is prepared by the light-emitting device preparation method described above.

[0036] In addition, to achieve the above objectives, the present invention also provides a display panel including the light-emitting device described above.

[0037] This invention proposes a method for fabricating a light-emitting device, a light-emitting device, and a display panel. A dangling structure is fabricated on a driving backplane, wherein the dangling structure is fabricated on the driving backplane via a weak connection structure. The dangling structure is disposed between two adjacent pixel units. Any first plane projection of the dangling structure includes a second plane projection. The first plane projection is the projection of the dangling structure's cross-section on the first plane onto the driving backplane, and the second plane projection is the projection of the dangling structure's cross-section on the second plane onto the driving backplane. The first and second planes are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane. A light-emitting layer is fabricated on the driving backplane. The dangling structure is then disconnected from the weak connection structure and removed. A remaining film layer is fabricated on the light-emitting layer. By setting the dangling structure, the connection between the light-emitting materials of two adjacent pixel units can be severed during the fabrication of the light-emitting layer, avoiding color shift. After the light-emitting layer is fabricated, the dangling structure is removed, thus preventing the dangling structure from affecting subsequent encapsulation. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0041] Figure 1 This is a schematic diagram illustrating the fabrication method of the light-emitting device of the present invention;

[0042] Figure 2 This is a schematic diagram of the fabrication of the light-emitting layer in the prior art;

[0043] Figure 3 This is a schematic diagram of the preparation of residual film layers in the prior art;

[0044] Figure 4 This is a schematic diagram of the pixel definition layer in the light-emitting device fabrication method of the present invention;

[0045] Figure 5 This is a schematic diagram of the photoresist layer in the method for fabricating the light-emitting device of the present invention;

[0046] Figure 6 This is a schematic diagram illustrating the fabrication of the pendant structure in the light-emitting device fabrication method of the present invention;

[0047] Figure 7 This is a schematic diagram of the photoresist layer in another embodiment of the method for fabricating a light-emitting device according to the present invention;

[0048] Figure 8 This is a schematic diagram of the auxiliary substrate in the method for fabricating the light-emitting device of the present invention;

[0049] Figure 9 This is a schematic diagram of the removal of the overhang structure in the method for fabricating the light-emitting device of the present invention;

[0050] Figure 10 This is a schematic diagram showing the alignment of the weak connection structure in the auxiliary substrate in the light-emitting device fabrication method of the present invention;

[0051] Figure 11This is a schematic diagram of the second adhesion layer in the method for fabricating the light-emitting device of the present invention;

[0052] Figure 12 This is a schematic diagram of the removal of the auxiliary substrate in the method for fabricating the light-emitting device of the present invention;

[0053] Figure 13 This is a schematic diagram of the light-emitting layer in the method for fabricating the light-emitting device of the present invention;

[0054] Figure 14 This is a schematic diagram of the remaining film layer in the method for fabricating the light-emitting device of the present invention.

[0055] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0056] Explanation of icon numbers:

[0057] Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0059] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0060] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0061] This invention provides a method for fabricating a light-emitting device; please refer to [link / reference]. Figure 1 , Figure 1This is a functional block diagram of an embodiment of the light-emitting device fabrication method of the present invention. In this embodiment, the light-emitting device fabrication method includes:

[0062] A dangling structure 200 is fabricated on a driving backplate 100, wherein the dangling structure 200 is fabricated on the driving backplate 100 through a weak connection structure 300, the dangling structure 200 is disposed between two adjacent pixel units, and any first plane projection of the dangling structure 200 includes a second plane projection, wherein the first plane projection is the projection of the dangling structure 200 on the driving backplate 100 corresponding to the cross section of the first plane, and the second plane projection is the projection of the dangling structure 200 on the driving backplate 100 corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplate 100, and the second plane is closer to the driving backplate 100 than the first plane;

[0063] A light-emitting layer 400 is prepared on the driving backplate 100;

[0064] The overhang structure 200 is disconnected from the weak connection structure 300, and the overhang structure 200 is removed.

[0065] A residual film layer 500 is prepared on the light-emitting layer 400.

[0066] A pixel unit is an independent light-emitting unit, such as the pixel corresponding to a red, green, or blue OLED.

[0067] Understandably, in order to block the light-emitting material of adjacent pixel units, the overhanging structure 200 in the prior art is usually set in an inverted trapezoidal or inverted triangular shape. Taking the inverted trapezoid as an example, see... Figure 2 During the fabrication of the light-emitting layer 400, the light-emitting material falls from above and deposits onto the driving backplate 100 to form the light-emitting layer 400. Due to the inverted trapezoidal arrangement of the overhang structure 200, the light-emitting material cannot form a connection between two pixel units on the overhang structure 200, thus blocking the contact between the light-emitting materials of the two pixel units. Current cannot flow between the two pixel units through the light-emitting material, thereby avoiding color shift problems. However, during encapsulation, the inverted trapezoidal overhang structure 200 will affect the encapsulation process, see [link to encapsulation process]. Figure 3 After the suspension structure 200 is set, the encapsulation layer is also affected by the suspension structure 200 and cannot completely fill the bottom of the suspension structure 200. Therefore, encapsulation gaps will be generated near the suspension structure 200, which can easily lead to moisture intrusion and affect the life of the display panel.

[0068] In this embodiment, a dangling structure 200 is first provided on the driving backplate 100. Simultaneously, any first plane projection of the dangling structure 200 includes a second plane projection. The first plane is parallel to the driving backplate 100 and further away from the driving backplate 100 than the second plane. This results in the portion of the dangling structure 200 closer to the driving backplate 100 being smaller, and the portion further away from the driving backplate 100 being larger. Furthermore, the lower portion does not exceed the upper portion, allowing for an extension towards the pixel unit on the dangling structure 200. This allows the side of the dangling structure 200 to form an isolation space 600 for the light-emitting material. The specific material of the dangling structure 200 can be set according to actual needs. Since the dangling structure 200 needs to be removed later, brittle materials such as silicon nitride (SiNx) can be used. The specific size of the dangling structure 200 can be set according to actual needs, such as 3µm.

[0069] Based on the suspended structure 200, the light-emitting layer 400 is prepared so that the suspended structure 200 can cut off the connection between the light-emitting materials of two adjacent pixel units and avoid color deviation.

[0070] The weak connection structure 300 is a structure with relatively weak connection strength.

[0071] After the light-emitting layer 400 is prepared, if the remaining film layer 500 is prepared directly, the overhang structure 200 will affect the encapsulation and create encapsulation gaps during preparation. Therefore, in order to avoid the influence of the overhang structure 200 on the encapsulation, a weak connection structure 300 is provided in this embodiment to connect the driving backplate 100 and the overhang structure 200. After the light-emitting layer 400 is prepared, the weak connection structure 300 of the overhang structure 200 is disconnected, so that the overhang structure 200 can be removed. After the overhang structure 200 is removed, the encapsulation will not be affected by the overhang structure 200, thereby achieving complete encapsulation preparation.

[0072] The remaining film layer 500 includes the other film layers above the light-emitting layer 400; the remaining film layer 500 may include a cathode film layer, an encapsulation film layer, etc.

[0073] In this embodiment, by setting the overhang structure 200, the connection between the light-emitting materials of two adjacent pixel units can be cut off during the fabrication of the light-emitting layer 400 to avoid color deviation. After the light-emitting layer 400 is fabricated, the overhang structure 200 is removed, thereby avoiding the impact of the overhang structure 200 on subsequent encapsulation.

[0074] Further, see Figure 4 The driving backplate 100 is provided with a pixel definition layer 700; the fabrication of the overhang structure 200 on the driving backplate 100 includes:

[0075] A photoresist layer 800 is coated on the drive backplate 100;

[0076] A connecting hole 810 is obtained by drilling a hole in the photoresist region on the pixel definition layer 700, and a hanging groove 820 is prepared. The hanging groove 820 is connected to the pixel definition layer 700 through the connecting hole 810.

[0077] A hanging structure 200 film layer is prepared on the photoresist layer 800 to obtain the hanging structure 200. The hanging structure 200 film layer at the hanging groove 820 constitutes the hanging structure 200, and the hanging structure 200 film layer at the connecting hole 810 constitutes the weak connection structure 300. The projection of the hanging structure 200 on the pixel definition layer 700 is included in the pixel definition layer 700.

[0078] Remove the photoresist layer 800.

[0079] The PDL (Pixel Definition Layer) 700 is used to define and separate each pixel unit in an OLED display; the dangling structure 200 is also set up to isolate adjacent pixel units. Therefore, fabricating the dangling structure 200 on the PDL can meet the requirements for pixel unit separation.

[0080] It is understandable that the pixel definition layer 700 is set based on the actual pixel separation needs. The pixel units constructed by the pixel definition layer 700 all need to have the light-emitting layer 400 prepared. Therefore, in order to avoid the dangling structure 200 affecting the preparation of the light-emitting layer 400 in the pixel unit, the projection of the dangling structure 200 on the pixel definition layer 700 is set to be included in the pixel definition layer 700, so that the light-emitting layer 400 can be completely prepared in the pixel unit.

[0081] The specific structure of the pixel definition layer 700 can be set according to actual needs. For example, if the interface of the pixel definition layer 700 is trapezoidal and the lower base of the trapezoidal cross section is set on the driving back plate 100, then in specific settings, the upper base of the cross section of the hanging structure 200 can be set to be smaller than the upper base of the pixel definition layer 700. Since the plane projection corresponding to the plane further away from the driving back plate 100 in the hanging structure 200 is larger, the entire hanging structure 200 can not exceed the area of ​​the pixel definition layer 700.

[0082] See Figure 5The photoresist layer 800 is used to construct the support for the construction of the overhang structure 200 and the weak connection structure 300. The specific material and preparation method of the photoresist layer 800 can be set according to actual needs. It is understood that the photoresist layer 800 needs to be removed later. Therefore, the preparation material of the photoresist layer 800 can be set to an easily removable material, such as photoresist material, which can be coated and photolithographically formed to obtain the photoresist layer 800.

[0083] Understandably, the dangling structure 200 needs to be connected to the pixel definition layer 700 via the weak connection structure 300. However, if it is fabricated directly on the photoresist layer 800, it will be blocked by the photoresist layer 800 and unable to contact the pixel definition layer 700. Therefore, it is necessary to create fabrication positions for the weak connection structure 300 and the dangling structure 200 on the photoresist layer 800. Specifically, for the weak connection structure 300, a hole is made in the photoresist layer 800 to obtain the connection hole 810. Since the weak connection structure 300 needs to directly contact the pixel definition layer 700, when making the hole, a hollow area is made in the photoresist region of the pixel definition layer 700, so that the resulting connection hole 810 can contact the pixel definition layer 700. The photoresist region is the area in the photoresist layer 800 located on the pixel definition layer 700. The specific type of the connection hole 810 can be set according to actual needs, such as a cylindrical hole or a prism hole. The specific size and number of the connecting holes 810 can be set according to actual needs, such as setting two symmetrical connecting holes 810 based on the pixel definition layer 700. The specific method of drilling the holes can be set according to actual needs, such as etching.

[0084] See Figure 6 After completing the drilling of the connection hole 810, the location of the overhang structure 200 is then constructed. Specifically, an overhang groove 820 is fabricated on the connection hole 810. The overhang groove 820 does not directly contact the pixel definition layer 700, but is connected to the pixel definition layer 700 through the connection hole 810. Therefore, based on this, the film layer of the overhang structure 200 is fabricated, so that after the overhang material fills the connection hole 810 and the overhang groove 820, the overhang structure 200 and the weak connection structure 300 are formed. The distance between the overhang structure 200 and the pixel definition layer 700, i.e., the length of the weak connection structure 300, can be set according to actual needs, such as less than 500nm.

[0085] Further, see Figure 7 The method of drilling a hole in the photoresist region on the pixel definition layer 700 to obtain the connection hole 810 includes:

[0086] A first hole is formed in the photoresist region on the pixel definition layer 700, wherein the first hole is conductive to the pixel definition layer 700;

[0087] A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than that of the first hole, and the second hole is connected to the pixel definition layer 700 through the first hole.

[0088] In this embodiment, during the fabrication of the weak connection structure 300, the connection hole 810 includes multiple holes, with the smaller diameter holes being closer to the pixel definition layer 700. As a result, the fabricated weak connection structure 300 is composed of multiple support steps, and the diameter of the steps closer to the pixel definition layer 700 is smaller, which makes the weak connection structure 300 more prone to breakage.

[0089] The specific number of holes that can be excavated can be set based on the actual application requirements.

[0090] Furthermore, the cross-section of the suspension structure 200 is an inverted trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, and the upper bottom edge of the cross-section is disposed on the drive back plate 100 through the weak connection structure 300.

[0091] It is understandable that the upper base of a trapezoid is smaller than the lower base. Therefore, by setting the cross-section of the suspension base to an inverted trapezoid, the suspension base itself can have an isolation space of 600, thereby creating a sealing gap.

[0092] In other embodiments, the cross-section of the suspended base can be set to other shapes, such as setting the inclined surface of the trapezoid as an arc edge, based on the trapezoidal shape.

[0093] Further, see Figure 8 The step of disconnecting the overhang structure 200 from the weak connection structure 300 and removing the overhang structure 200 includes:

[0094] The auxiliary substrate 900 is attached to the suspension structure 200, wherein a first adhesive layer 910 is provided on the side of the auxiliary substrate 900 facing the suspension structure 200.

[0095] Disconnect the weak connection structure 300;

[0096] Remove the auxiliary substrate 900 to which the overhang structure 200 is attached.

[0097] See Figure 9An auxiliary substrate 900 has a first adhesive layer 910. The auxiliary substrate 900 and the hanging structure 200 are then bonded together, allowing the first adhesive layer 910 to adhere to the hanging structure 200. When the auxiliary substrate 900 is removed, because the hanging structure 200 is adhered to the first adhesive layer 910, the hanging structure 200 is pulled apart from the weak connection structure 300 by the auxiliary substrate 900 and is removed along with the auxiliary substrate 900. To facilitate the removal of the hanging structure 200, the weak connection structure 300 is made of brittle materials such as silicon nitride (SiNx) or silicon oxide (SiOx).

[0098] In order to ensure that the auxiliary substrate 900 can remove the cantilever arm from the cantilever base, when setting the first adhesive layer 910, a material with a stickiness greater than the fixing force of the weak connection structure 300 can be used to manufacture the first adhesive layer 910; the specific material can be set according to actual needs.

[0099] Further, see Figure 11 The driving backplate 100 is provided with a pixel definition layer 700; the fabrication of the overhang structure 200 on the driving backplate 100 includes:

[0100] A second adhesion layer 710 is prepared on the pixel definition layer 700;

[0101] An auxiliary substrate 900 to which the droop structure 200 is attached is attached to the driving back plate 100, wherein the side to which the droop structure 200 is attached faces the driving back plate 100, and the droop structure 200 is attached to the second adhesive layer of the pixel definition layer 700.

[0102] The first adhesive layer 910 on the auxiliary substrate 900 is de-adheded;

[0103] Remove the auxiliary substrate 900.

[0104] It is understandable that after the droop structure 200 is removed, the removed droop structure 200 is still a complete droop structure 200. In order to reduce material consumption and save costs, the removed droop structure 200 can be reused, and the droop structure 200 removed by the auxiliary substrate 900 in the previous preparation can be used as the droop structure 200 of the newly prepared light-emitting device.

[0105] Specifically, since the dangling structure 200 on the auxiliary substrate 900 is adhered to the actual fabricated light-emitting device, the dangling structure 200 corresponds to the pixel definition layer 700 on the driving substrate of the same type. Since the dangling structure 200 needs to be disposed on the pixel definition layer 700, a second adhesion layer 710 is fabricated on the pixel definition layer 700, and the auxiliary substrate 900 is then attached to the driving backplate 100, thereby making the dangling structure 200 on the auxiliary substrate 900 contact the second adhesion layer 710. Because the auxiliary substrate 900 has a first adhesion layer 910, in order for the dangling structure 200 to detach from the first adhesion layer 910, the first adhesion layer 910 needs to be de-adheded. The specific de-adhesion method can be set according to actual needs, such as laser de-adhesion, thermal de-adhesion, etc.

[0106] See Figure 12 After the first adhesive layer 910 is debonded, the pendant structure 200 detaches from the first adhesive layer 910. At this time, the auxiliary substrate 900 is removed, and the pendant structure 200 will adhere to the second adhesive layer 710, thus completing the preparation of the pendant structure 200.

[0107] Further, attaching the auxiliary substrate 900 to which the overhang structure 200 is attached to the drive backplate 100 includes:

[0108] The weak connection structure 300 on the overhang structure 200 is etched to make the weak connection structure 300 flush.

[0109] The auxiliary substrate 900 to which the suspension structure 200 is attached is attached to the drive back plate 100.

[0110] See Figure 10 It is understood that the overhang structure 200 is removed by the auxiliary substrate 900 from the weak connection structure 300. Therefore, the removed overhang structure 200 will include a part of the weak connection structure 300, and the weak connection structure 300 is characterized by being broken and uneven. Therefore, in order to enable the overhang structure 200 to adhere smoothly to the second adhesion layer 710, in this embodiment, the weak connection structure 300 on the overhang structure 200 is first etched so that the weak connection structure 300 is flush, thereby enabling the overhang structure 200 to adhere stably to the second adhesion layer 710 through the flush weak connection structure 300.

[0111] It should be noted that since the overhang structure 200 needs to be etched each time it is reused, the length of the weak connection structure 300 on the overhang structure 200 will gradually shorten. When the weak connection structure 300 is too short, it is difficult to break. Therefore, the length of the weak connection structure 300 on the overhang structure 200 can be detected. When the length of the weak connection structure 300 on the overhang structure 200 is detected to be less than a preset length threshold, the overhang structure 200 will no longer be reused.

[0112] In other embodiments, when the overhang structure 200 is connected to the pixel definition layer 700 via the second adhesion layer 710, when removing the overhang structure 200, after the overhang structure 200 is adhered to the first adhesion layer 910, the overhang structure 200 can be removed by unadhesing the second adhesion layer 710. Thus, in subsequent reuse of the overhang structure 200, there is no need to etch the overhang structure 200, and the length of the weak connection structure 300 is not shortened. Therefore, it can be reused more times.

[0113] Further, the preparation of the remaining film layer 500 on the light-emitting layer 400 includes:

[0114] A cathode film layer is prepared on the light-emitting layer 400;

[0115] An encapsulation layer is prepared on the cathode film layer.

[0116] After the light-emitting layer 400 is prepared, the cathode film layer is prepared to realize the structure of the pixel unit. After the pixel unit structure is prepared, the encapsulation layer is prepared, thereby realizing the preparation of the light-emitting device.

[0117] The specific preparation methods for the cathode film layer and the encapsulation layer can be set according to actual needs; it is understood that, in addition to the cathode film layer and the encapsulation layer, other film layers can also be prepared on the light-emitting layer 400 according to actual needs.

[0118] The overall preparation process of this application is described below:

[0119] 1. Complete the fabrication of the driving backplane 100 and the pixel definition layer 700;

[0120] 2. See Figure 5 A photoresist layer 800 is coated on the pixel definition layer 700, a hole is drilled in the photoresist region on the pixel definition layer 700 to obtain a connection hole 810, and a hanging groove 820 is prepared.

[0121] 3. See Figure 6 A hanging structure 200 film layer is prepared on the photoresist layer 800 to obtain the hanging structure 200 and the weak connection structure 300.

[0122] 4. See Figure 13 An emissive layer 400 is prepared. Due to the presence of the overhang structure 200, the emissive material of the emissive layer 400 is discontinuous between adjacent pixel units.

[0123] 5. See Figure 8 The auxiliary substrate 900 is attached to the hanging structure 200, and the first adhesive layer 910 is attached to the hanging structure 200.

[0124] 6. See also Figure 9 The auxiliary substrate 900 is removed. Since the hanging structure 200 is adhered to the first adhesive layer 910, the hanging structure 200 is pulled by the auxiliary substrate 900 and separates from the weak connection structure 300, and is removed along with the auxiliary substrate 900.

[0125] 7. See also Figure 14 Prepare the remaining film layer 500.

[0126] This invention also protects a light-emitting device, which is prepared by the light-emitting device preparation method described above, the light-emitting device preparation method comprising:

[0127] A dangling structure is fabricated on a driving backplane, wherein the dangling structure is fabricated on the driving backplane through a weak connection structure, the dangling structure is disposed between two adjacent pixel units, and any first plane projection of the dangling structure includes a second plane projection, wherein the first plane projection is the projection of the dangling structure on the driving backplane corresponding to the cross section of the first plane, and the second plane projection is the projection of the dangling structure on the driving backplane corresponding to the cross section of the second plane, the first plane and the second plane are parallel to the driving backplane, and the second plane is closer to the driving backplane than the first plane;

[0128] A light-emitting layer is prepared on the driving backplate;

[0129] Disconnect the overhang structure from the weak connection structure and remove the overhang structure;

[0130] The remaining film layer is prepared on the light-emitting layer.

[0131] Furthermore, a pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes:

[0132] A photoresist layer is coated on the drive backplate;

[0133] A connecting hole is obtained by drilling a hole in the photoresist region on the pixel definition layer, and a hanging groove is prepared. The hanging groove is connected to the pixel definition layer through the connecting hole.

[0134] The drooping structure is obtained by fabricating a drooping structure film layer on the photoresist layer, wherein the drooping structure film layer at the drooping groove constitutes the drooping structure, and the drooping structure film layer at the connecting hole constitutes the weak connection structure, wherein the projection of the drooping structure on the pixel definition layer is included in the pixel definition layer.

[0135] Remove the photoresist layer.

[0136] Furthermore, the method of creating a connection hole by drilling a hole in the photoresist region on the pixel definition layer includes:

[0137] A first hole is formed in the photoresist region on the pixel definition layer, wherein the first hole is connected to the pixel definition layer;

[0138] A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than that of the first hole, and the second hole is connected to the pixel definition layer through the first hole.

[0139] Furthermore, the cross-section of the suspension structure is an inverted trapezoid, wherein the hypotenuse of the cross-section is disposed opposite to the pixel unit, and the upper bottom edge of the cross-section is disposed on the drive back plate through the weak connection structure.

[0140] Further, disconnecting the overhanging structure from the weak connection structure and removing the overhanging structure includes:

[0141] An auxiliary substrate is attached to the suspended structure, wherein a first adhesive layer is provided on the side of the auxiliary substrate facing the suspended structure;

[0142] Disconnect the weak connection structure;

[0143] Remove the auxiliary substrate to which the overhang structure is attached.

[0144] Furthermore, a pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes:

[0145] A second adhesion layer is prepared on the pixel definition layer;

[0146] An auxiliary substrate with the overhang structure is attached to the driving back plate, wherein the side with the overhang structure faces the driving back plate, and the overhang structure is attached to the second adhesive layer of the pixel definition layer.

[0147] The first adhesive layer on the auxiliary substrate is de-adheded;

[0148] Remove the auxiliary substrate.

[0149] Further, attaching the auxiliary substrate with the overhang structure to the drive backplate includes:

[0150] The weak connection structure on the overhang structure is etched to make the weak connection structure flush.

[0151] The auxiliary substrate with the overhang structure attached is attached to the drive backplate.

[0152] Further, the preparation of the remaining film layer on the light-emitting layer includes:

[0153] A cathode film layer is prepared on the light-emitting layer;

[0154] An encapsulation layer is prepared on the cathode film layer.

[0155] The present invention also protects a display panel including the light-emitting device described above.

[0156] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element. The sequence numbers of the above-described embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0157] In this invention, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0158] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

Claims

1. A method for fabricating a light-emitting device, characterized in that, The method for fabricating the light-emitting device includes: A drooping structure is fabricated on a driving backplate. The drooping structure is made of a brittle material. The drooping structure is fabricated on the driving backplate through a weak connection structure. The drooping structure is disposed between two adjacent pixel units. Any first plane projection of the drooping structure includes a second plane projection. The first plane projection is the projection of the drooping structure on the driving backplate corresponding to the cross section of the first plane. The second plane projection is the projection of the drooping structure on the driving backplate corresponding to the cross section of the second plane. The first plane and the second plane are parallel to the driving backplate, and the second plane is closer to the driving backplate than the first plane. A light-emitting layer is prepared on the driving backplate; Disconnect the overhang structure from the weak connection structure and remove the overhang structure; The remaining film layer is prepared on the light-emitting layer; A pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes: A photoresist layer is coated on the drive backplate; A connecting hole is obtained by drilling a hole in the photoresist region on the pixel definition layer, and a hanging groove is prepared. The hanging groove is connected to the pixel definition layer through the connecting hole. The droop structure film layer is prepared on the photoresist layer to obtain the droop structure, wherein the droop structure film layer at the droop groove constitutes the droop structure, and the droop structure film layer at the connection hole constitutes the weak connection structure, wherein the projection of the droop structure on the pixel definition layer is included in the pixel definition layer. Remove the photoresist layer; The method of drilling a hole in the photoresist region on the pixel definition layer to obtain a connection hole includes: A first hole is formed in the photoresist region on the pixel definition layer, wherein the first hole is connected to the pixel definition layer; A second hole is prepared on the first hole, wherein the second hole is coaxially arranged with the first hole, the diameter of the second hole is larger than that of the first hole, and the second hole is connected to the pixel definition layer through the first hole; The fabricated weak connection structure consists of multiple support steps, and the diameter of the steps closer to the pixel definition layer is smaller, making the weak connection structure more prone to breakage.

2. The method for fabricating a light-emitting device as described in claim 1, characterized in that, The cross-section of the suspension structure is an inverted trapezoid, wherein the hypotenuse of the cross-section is positioned opposite to the pixel unit, and the upper base of the cross-section is positioned on the drive back plate through the weak connection structure.

3. The method for fabricating a light-emitting device as described in claim 1, characterized in that, The step of disconnecting the overhang structure from the weak connection structure and removing the overhang structure includes: An auxiliary substrate is attached to the suspended structure, wherein a first adhesive layer is provided on the side of the auxiliary substrate facing the suspended structure; Disconnect the weak connection structure; Remove the auxiliary substrate to which the overhang structure is attached.

4. The method for fabricating a light-emitting device as described in claim 1, characterized in that, A pixel definition layer is provided on the driving backplane; the fabrication of the overhang structure on the driving backplane includes: A second adhesion layer is prepared on the pixel definition layer; An auxiliary substrate with the overhang structure is attached to the driving back plate, wherein the side with the overhang structure faces the driving back plate, and the overhang structure is attached to the second adhesive layer of the pixel definition layer. The first adhesive layer on the auxiliary substrate is de-adheded; Remove the auxiliary substrate.

5. The method for fabricating a light-emitting device as described in claim 4, characterized in that, The step of attaching the auxiliary substrate with the overhang structure to the drive back plate includes: The weak connection structure on the overhang structure is etched to make the weak connection structure flush. The auxiliary substrate with the overhang structure attached is attached to the drive backplate.

6. The method for fabricating a light-emitting device as described in claim 1, characterized in that, The step of preparing the residual film layer on the light-emitting layer includes: A cathode film layer is prepared on the light-emitting layer; An encapsulation layer is prepared on the cathode film layer.

7. A light-emitting device, characterized in that, The light-emitting device is prepared by the light-emitting device preparation method as described in any one of claims 1 to 6.

8. A display panel, characterized in that, Includes the light-emitting device as described in claim 7.

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