Display mother board, display panel and display device

Abstract

The invention discloses a display mother board, a display panel and a display device. The display mother board comprises a display area, a transition area and a hole digging area, the transition area surrounds the hole digging area, and the display area at least partially surrounds the transition area; the display mother board further comprises a substrate; the driving layer is arranged on the substrate; the light-emitting layer is arranged on one side, far away from the substrate, of the driving layer; the portion, located in the transition area, of the driving layer is provided with at least one conductive part, and the conductive part surrounds the hole digging area. The part, located in the display area, of the driving layer is provided with at least one signal line, and the conductive part is electrically connected with the signal line. The display panel can solve the problem that the vicinity of a hole digging area of the display panel is bright.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display motherboard, a display panel and a display device. Background Art

[0002] With the development of display technology, display panels, such as display panels with a hole area, are being used more and more widely, and correspondingly, the requirements for display panels are becoming higher and higher.

[0003] The display panel with the hole-punch area can be formed by cutting the portion of the display motherboard located in the hole-punch area. However, the display panel in the related art has the problem that the area near the hole-punch area is too bright. Summary of the Invention

[0004] The present invention provides a display motherboard, a display panel and a display device to improve the problem of excessive brightness near a hole-punch area of ​​the display panel.

[0005] According to one aspect of the present invention, a display motherboard is provided, comprising a display area, a transition area, and a punch hole area, wherein the transition area surrounds the punch hole area, and the display area at least partially surrounds the transition area; the display motherboard further comprises:

[0006] substrate;

[0007] a driving layer, disposed on the substrate;

[0008] a light-emitting layer, disposed on a side of the driving layer away from the substrate;

[0009] The portion of the driving layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the hole area; the portion of the driving layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line.

[0010] Optionally, the display motherboard further includes at least one connecting lead, the connecting lead being electrically connected to the conductive portion, the connecting lead extending from the transition area to the display area and being electrically connected to the signal line;

[0011] Preferably, the conductive portion is a conductive ring;

[0012] Preferably, the connecting lead and the conductive part are provided in the same layer;

[0013] Preferably, the material of the conductive part includes at least one of molybdenum, magnesium, silver, aluminum, copper and titanium;

[0014] Preferably, the display motherboard includes at least two connecting leads, and the at least two connecting leads are evenly distributed along the circumferential direction of the conductive portion;

[0015] Preferably, the conductive portion and the center of the hole area are the same.

[0016] Optionally, the driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the conductive portion is provided on the same layer as the light-shielding metal layer;

[0017] Preferably, the signal line is provided in the same layer as the light-shielding metal layer;

[0018] Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line;

[0019] Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

[0020] Optionally, the pixel driving circuit includes a driving transistor, a first light-emitting control transistor, and a second light-emitting control transistor; the power signal line includes a first power signal line and a second power signal line; a first end of the first light-emitting control transistor is electrically connected to the first power signal line, and a second end of the first light-emitting control transistor is electrically connected to a first end of the driving transistor; a second end of the driving transistor is electrically connected to a first end of the second light-emitting control transistor, a second end of the second light-emitting control transistor is electrically connected to a first electrode of a corresponding light-emitting element, and a second electrode of the light-emitting element is electrically connected to the second power signal line; and the signal line is the first power signal line;

[0021] Preferably, the pixel driving circuit further includes a data writing transistor, a threshold compensation transistor, a first initialization transistor, a second initialization transistor and a storage capacitor; the driving layer is provided with a first scanning signal line, a second scanning signal line, an initialization signal line, a light emitting control signal line and a data line; the first end of the data writing transistor is electrically connected to the data line, the second end of the data writing transistor is electrically connected to the first end of the driving transistor, and the control end of the data writing transistor is electrically connected to the second scanning signal line; the first end of the threshold compensation transistor is electrically connected to the second end of the driving transistor, the second end of the threshold compensation transistor is electrically connected to the control end of the driving transistor, and the control end of the threshold compensation transistor is electrically connected to the second scanning signal line; The first end of the first initialization transistor is electrically connected to the initialization signal line, the second end of the first initialization transistor is electrically connected to the control end of the driving transistor, and the control end of the first initialization transistor is electrically connected to the first scanning signal line; the first end of the second initialization transistor is electrically connected to the initialization signal line, the second end of the second initialization transistor is electrically connected to the first electrode of the light-emitting element, and the control end of the second initialization transistor is electrically connected to the first scanning signal line; the first end of the storage capacitor is electrically connected to the first power signal line, and the second end of the storage capacitor is electrically connected to the control end of the driving transistor; the control end of the first light-emitting control transistor and the control end of the second light-emitting control transistor are both electrically connected to the light-emitting control signal line.

[0022] Optionally, the portion of the driving layer located in the transition area includes at least one dam structure, and the dam structure is arranged around the excavated area;

[0023] The at least one conductive portion is disposed between the dam structure and the excavated area;

[0024] Preferably, the portion of the driving layer located in the transition region is provided with at least two conductive parts;

[0025] Preferably, the at least two conductive parts are evenly distributed between the digging area and the dam structure;

[0026] Optionally, the at least one dam structure comprises a first dam structure and a second dam structure located between the first dam structure and the excavated area;

[0027] Preferably, the driving layer includes a driving circuit layer, and the dam structure is located on a side of the driving circuit layer away from the substrate;

[0028] Preferably, the driving layer further comprises a planarization layer covering the driving circuit layer, a portion of the planarization layer located in the transition area constitutes the dam structure, and a groove is formed between a portion of the planarization layer located in the display area and the dam structure;

[0029] Preferably, the driving layer further comprises a pixel defining layer covering the planarization layer, wherein the pixel defining layer is formed with an opening, and the opening exposes a portion of the surface of the dam structure away from the substrate;

[0030] Preferably, a crack prevention dam is formed on a portion of the driving layer located in the transition zone, and the crack prevention dam at least partially penetrates the driving circuit layer; the crack prevention dam is located between the dam structure and the conductive portion.

[0031] Optionally, the display motherboard further includes a first isolation structure, the first isolation structure being located on a side of the driving layer away from the substrate; the first isolation structure encloses to form an isolation opening;

[0032] The light-emitting layer includes a plurality of light-emitting elements; the light-emitting elements correspond to the isolation openings one by one, and along the thickness direction of the display motherboard, the orthographic projections of the light-emitting elements on the substrate at least partially overlap with the orthographic projections of the isolation openings on the substrate;

[0033] Preferably, the first isolation structure includes a first supporting portion and a first crown portion, the first crown portion is located on a side of the first supporting portion away from the substrate, and the first supporting portion is a conductive structure;

[0034] Preferably, the light-emitting element includes a first electrode, a light-emitting functional layer and a second electrode sequentially stacked in the isolation opening; the second electrode is connected to the first supporting portion.

[0035] Optionally, the portion of the display motherboard located in the transition area includes a second isolation structure, the second isolation structure surrounding the digging area, penetrating the driving layer and electrically connected to the conductive portion, and the second isolation structure is insulated from the first isolation structure; the display motherboard further includes an electrode structure, the electrode structure covering the area between the second isolation structure and the digging area, and electrically connected to the second isolation structure;

[0036] Preferably, the second isolation structure is on the same layer as the first isolation structure;

[0037] Preferably, the electrode structure covers the area surrounded by the second isolation structure;

[0038] Preferably, the second isolation structure includes a second support portion and a second crown portion located on a side of the second support portion away from the substrate, the second support portion is a conductive structure, the second support portion passes through the driving layer and is electrically connected to the conductive portion; the electrode structure is connected to the second support portion;

[0039] Optionally, the display motherboard includes a dummy light-emitting element, the dummy light-emitting element covers the area surrounded by the second isolation structure, and the dummy light-emitting element includes a dummy light-emitting functional layer and the electrode structure on a side of the dummy light-emitting functional layer away from the substrate;

[0040] Preferably, the dummy light-emitting element is manufactured in the same layer as one of the light-emitting elements in the light-emitting layer;

[0041] Preferably, a first preset interval is formed between the second isolation structure and the edge of the hole-digging area.

[0042] Optionally, along the thickness direction of the display motherboard, a projection of the second isolation structure on the substrate overlaps with a projection of one of the conductive parts on the substrate;

[0043] Preferably, the display motherboard includes at least two conductive parts; along the thickness direction of the display motherboard, the projection of the second isolation structure on the substrate overlaps with the projection of the conductive part closest to the hole area on the substrate.

[0044] Optionally, the display motherboard further includes a third isolation structure, the third isolation structure being located in the hole-digging area and on a side of the driving layer away from the substrate; the electrode structure covers an area between the second isolation structure and the third isolation structure;

[0045] Preferably, the third isolation structure and the second isolation structure are on the same layer;

[0046] Preferably, the third isolation structure includes a third support portion and a third crown portion, the third support portion is located on a side of the driving layer away from the substrate, and the third crown portion is located on a side of the third support layer away from the substrate;

[0047] Preferably, the width of the third isolation structure is greater than the width of the second isolation structure;

[0048] Optionally, a second preset interval is formed between the third isolation structure and the edge of the hole-digging area;

[0049] Preferably, the display motherboard further includes a groove, and the edge of the hole area HO is located in the groove.

[0050] According to another aspect of the present invention, a display panel is provided, comprising a display area, a transition area, and a punch hole area, wherein the transition area surrounds the punch hole area, and the display area at least partially surrounds the transition area; the display panel further comprises:

[0051] substrate;

[0052] a driving layer, disposed on the substrate;

[0053] a light-emitting layer, disposed on a side of the driving layer away from the substrate;

[0054] The portion of the driving layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the hole area; the portion of the driving layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line.

[0055] Optionally, the display panel further includes at least one connecting lead, the connecting lead being electrically connected to the conductive portion, the connecting lead extending from the transition area to the display area and being electrically connected to the signal line;

[0056] Preferably, the conductive portion is a conductive ring;

[0057] Preferably, the connecting lead and the conductive part are provided in the same layer;

[0058] Preferably, the material of the conductive part includes at least one of molybdenum, magnesium, silver, aluminum, copper and titanium;

[0059] Preferably, the display panel comprises at least two connecting leads, and the at least two connecting leads are evenly distributed along the circumferential direction of the conductive portion;

[0060] Preferably, the conductive portion and the center of the hole area are the same.

[0061] Optionally, the driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the conductive portion is provided on the same layer as the light-shielding metal layer;

[0062] Preferably, the signal line is provided in the same layer as the light-shielding metal layer;

[0063] Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line;

[0064] Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

[0065] According to another aspect of the present invention, a display motherboard is provided, comprising a display area, a transition area, and a punch hole area, wherein the transition area surrounds the punch hole area, and the display area at least partially surrounds the transition area; the display motherboard further comprises:

[0066] substrate;

[0067] a driving layer, disposed on the substrate;

[0068] a light-emitting layer, disposed on a side of the driving layer away from the substrate;

[0069] Among them, the part of the driving layer located in the transition area is provided with at least one electrostatic adsorption structure, and the part of the driving layer located in the display area is provided with at least one signal line, and the signal line is used to provide an electrical signal to the electrostatic adsorption structure, and the electrostatic adsorption structure is used to adsorb static electricity in the hole area.

[0070] Optionally, the electrostatic adsorption structure surrounds the hole area.

[0071] Optionally, the driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the electrostatic adsorption structure is provided on the same layer as the light-shielding metal layer;

[0072] Preferably, the signal line is provided in the same layer as the light-shielding metal layer;

[0073] Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line;

[0074] Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

[0075] According to another aspect of the present invention, a display panel is provided. The display panel is formed by cutting the hole area from the display motherboard as described above.

[0076] According to another aspect of the present invention, a display device is provided, comprising the display panel as described above.

[0077] The technical solution of an embodiment of the present invention employs a display motherboard comprising a display area, a transition area, and a punched hole area, wherein the transition area surrounds the punched hole area, and the display area at least partially surrounds the transition area. The display motherboard also includes: a substrate; a drive layer disposed on the substrate; and a light-emitting layer disposed on a side of the drive layer away from the substrate. The portion of the drive layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the punched hole area; and the portion of the drive layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line. By providing the conductive portion near the punched hole area, static charge accumulation near the punched hole area can be prevented, thereby preventing transistor threshold voltage shift near the punched hole area, thereby improving the problem of luminescence near the punched hole area.

[0078] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0080] Figure 1 A schematic structural diagram of a display motherboard provided by an embodiment of the present invention;

[0081] Figure 2 A partially enlarged schematic diagram of a display motherboard provided by an embodiment of the present invention;

[0082] Figure 3 for Figure 1 A cross-section along the A1A2 direction;

[0083] Figure 4 A partial enlarged view of another display motherboard provided by an embodiment of the present invention;

[0084] Figure 5 A schematic diagram of the circuit structure of a pixel driving circuit provided by an embodiment of the present invention;

[0085] Figure 6 A partial enlarged view of another display motherboard provided by an embodiment of the present invention;

[0086] Figure 7 for Figure 1 Another cross-sectional view along the A1A2 direction;

[0087] Figure 8 for Figure 1Another cross-sectional view along the A1A2 direction;

[0088] Figure 9 A partial enlarged view of another display motherboard provided by an embodiment of the present invention;

[0089] Figure 10 A partial enlarged view of another display motherboard provided by an embodiment of the present invention;

[0090] Figure 11 for Figure 1 Another cross-sectional view along the A1A2 direction;

[0091] Figure 12 for Figure 1 Another cross-sectional view along the A1A2 direction;

[0092] Figure 13 for Figure 1 Another cross-sectional view along the A1A2 direction;

[0093] Figure 14 for Figure 1 Another cross-sectional view along direction A1A2. DETAILED DESCRIPTION

[0094] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0095] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0096] Figure 1 A schematic structural diagram of a display motherboard provided by an embodiment of the present invention is shown. Figure 2 A partially enlarged schematic diagram of a display motherboard provided by an embodiment of the present invention, with reference to Figure 1 and Figure 2 The display motherboard includes a display area AA, a transition area TA, and a hole-punch area HO. The transition area TA surrounds the hole-punch area HO, and the display area AA at least partially surrounds the transition area TA. The display motherboard also includes: a substrate; a drive layer disposed on the substrate; and a light-emitting layer disposed on a side of the drive layer away from the substrate. The portion of the drive layer located in the transition area is provided with at least one conductive portion DR, and the conductive portion DR surrounds the hole-punch area HO. The portion of the drive layer located in the display area AA is provided with at least one signal line SX, and the conductive portion DR is electrically connected to the signal line SX.

[0097] Specifically, the display motherboard is used to make a display panel, and the display panel can be prepared by cutting the portion located in the hole area HO. The cutting method is, for example, laser cutting. The hole area HO can be used to set devices such as a camera, an infrared sensor, a proximity light sensor or a 3D sensing module. By setting the hole area HO, the display panel can achieve a full-screen display effect. The shape of the hole area HO can be circular, square or other polygonal, etc., and this embodiment does not specifically limit this. A light-emitting layer is provided in the display area AA, and a pixel driving circuit is provided in the driving layer of the display area AA. The pixel driving circuit drives the corresponding light-emitting elements in the light-emitting layer to emit light, thereby realizing the display function. A transition area TA is provided between the display area AA and the hole area HO. No light-emitting layer is provided in the transition area TA. The transition area TA can also be understood as the border of the hole area HO.

[0098] In the related art, there is no signal wiring in the hole-digging area HO. When performing laser cutting and the subsequent copper rod friction test, the static electricity generated will accumulate near the hole-digging area HO, causing the threshold voltage of the transistor near the hole-digging area HO to shift. In this embodiment, a conductive portion DR is provided in the transition area TA, and the conductive portion DR is electrically connected to the signal line SX. The static charge generated during the laser cutting process and the subsequent copper rod friction test is energized on the signal line SX, so that the conductive portion DR will be adsorbed on the conductive portion DR after being energized, and will not accumulate near the hole-digging area HO, thereby avoiding the shift of the transistor threshold voltage near the hole-digging area HO. From the above analysis, it can be seen that this embodiment can avoid the accumulation of static charge near the hole-digging area HO by providing the conductive portion DR near the hole-digging area HO, thereby avoiding the shift of the transistor threshold voltage near the hole-digging area HO, thereby improving the problem of brightness near the hole-digging area HO.

[0099] In addition, the conductive portion DR of the present embodiment is arranged in the transition area TA rather than in the display area AA. On the one hand, this does not affect the arrangement of the signal line SX in the display area AA, thereby reducing the design difficulty. On the other hand, it is equivalent to increasing the size of the signal line SX, which can reduce the impedance of the signal line SX, thereby reducing the power consumption of the display panel.

[0100] The technical solution of this embodiment adopts a display motherboard comprising a display area, a transition area, and a punched hole area, wherein the transition area surrounds the punched hole area, and the display area at least partially surrounds the transition area. The display motherboard also includes: a substrate; a drive layer disposed on the substrate; and a light-emitting layer disposed on a side of the drive layer away from the substrate. The portion of the drive layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the punched hole area; the portion of the drive layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line. By providing the conductive portion near the punched hole area, static charge accumulation near the punched hole area can be prevented, thereby preventing transistor threshold voltage shift near the punched hole area, thereby improving the problem of luminescence near the punched hole area.

[0101] In other embodiments, the conductive portion DR may be a conductive ring that surrounds the cutout area. The portion of the drive layer located in the display area is provided with at least one signal line, and the conductive ring is electrically connected to the signal line. The signal line provides an electrical signal to the conductive ring, enabling the conductive ring to absorb static charge near the cutout area, thereby preventing static charge accumulation near the cutout area HO and, in turn, preventing threshold voltage shift of transistors near the cutout area HO. This can alleviate the issue of luminescence near the cutout area HO.

[0102] In some other embodiments, the conductive portion DR can be replaced with an electrostatic adsorption structure; and the portion of the drive layer located in the display area is provided with at least one signal line, the signal line being used to provide an electrical signal to the electrostatic adsorption structure, and the electrostatic adsorption structure being used to adsorb static electricity in the hole-punch area. When the signal line is energized, the signal line provides a stable potential for the electrostatic adsorption structure, causing the electrostatic adsorption structure to be charged, thereby enabling the electrostatic adsorption structure to adsorb static charges near the hole-punch area. This also prevents the accumulation of static charges near the hole-punch area HO, thereby preventing the threshold voltage of transistors near the hole-punch area HO from shifting, thereby improving the problem of luminescence near the hole-punch area HO. Alternatively, the electrostatic adsorption structure can be arranged around the hole-punch area, thereby improving the ability to adsorb static charges near the hole-punch area and further reducing the static charges accumulated near the hole-punch area HO.

[0103] The present invention will be further described below with reference to the accompanying drawings.

[0104] Optionally, Figure 3 for Figure 1 A cross-sectional view along the A1A2 direction, refer to Figures 1 to 3 The display panel includes a substrate 11, a driving layer and a light-emitting layer stacked in sequence.

[0105] The substrate 11 is, for example, a rigid substrate or a flexible substrate. The rigid substrate is, for example, a silicon substrate or a glass substrate. The flexible substrate is made of, for example, a polymer resin, such as polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), cellulose triacetate (TAC), and cellulose acetate propionate (CAP).

[0106] The driving layer is provided with a plurality of array-arranged pixel driving circuits. In some embodiments, the transistors in the pixel driving circuit are all silicon transistors TFT1 (such as polysilicon transistors or amorphous silicon transistors, etc.). In other embodiments, the transistors in the pixel driving circuit also include oxide thin film transistors TFT2. Taking the pixel driving circuit including the oxide thin film transistor TFT2 as an example, the driving layer may include a first metal layer 12, an active layer 13, a gate insulating layer 14, a second metal layer 15, a third metal layer 16, an oxide semiconductor layer 17, a fourth metal layer 18, a fifth metal layer 19, a first planarization layer 20, a sixth metal layer 22 and a second planarization layer 21 stacked in sequence. Among them, the active layer 13 is used to set the active material of the silicon transistor TFT1, the second metal layer 15 is used to set the gate of the silicon transistor TFT1, the third metal layer 16 is used to set the plate of the capacitor in the pixel driving circuit, the oxide semiconductor layer 17 is used to set the oxide semiconductor material in the oxide thin film transistor TFT2, the fourth metal layer 18 is used to set the gate of the oxide thin film transistor TFT2, the fifth metal layer 19 is used to set the source and drain electrodes of the polysilicon transistor TFT1 and the oxide thin film transistor TFT2, the sixth metal layer 22 acts as a connecting layer, and the first planarization layer 20 and the second planarization layer 21 play a planarization role.

[0107] Optionally, continue to refer to Figures 1 to 3 The display motherboard further includes at least one connecting lead ZX, the connecting lead ZX being electrically connected to the conductive portion DR, the connecting lead ZX extending from the transition area TA to the display area AA and being electrically connected to the signal line SX.

[0108] Specifically, in this embodiment, the connecting lead ZX electrically connects the conductive portion DR to the signal line SX, thereby enabling charge transfer between the two. The conductive portion DR may be made of, for example, at least one of molybdenum (Mo), magnesium (Mg), silver (Ag), aluminum (Al), copper (Cu), and titanium (Ti). Alternatively, the conductive portion DR may comprise a single layer or multilayer structure containing these materials. The connecting lead ZX may be made of, for example, at least one of molybdenum (Mo), magnesium (Mg), silver (Ag), aluminum (Al), copper (Cu), and titanium (Ti). Alternatively, the conductive portion DR may comprise a single layer or multilayer structure containing these materials.

[0109] Optionally, the connecting lead ZX and the conductive portion DR are provided in the same layer.

[0110] Specifically, the connecting leads ZX need to connect the conductive portion DR and the signal lines SX, which are located within the display area. The transition area TA has fewer wiring (e.g., only the conductive portion DR), while the various wiring within the display area is more complex. Placing the connecting leads ZX on the same layer as the signal lines SX may present layout difficulties. However, by placing the connecting leads ZX on the same layer as the conductive portion DR, they can be subsequently connected to the film layer containing the signal lines SX through vias or other means, greatly improving the utilization of the display motherboard's internal space and reducing wiring difficulties.

[0111] Optionally, Figure 4 A partial enlarged view of another display motherboard provided by an embodiment of the present invention, referring to Figure 4 , the display motherboard includes at least two connecting leads ZX, and the at least two connecting leads ZX are evenly distributed along the surrounding direction of the conductive portion DR.

[0112] Specifically, the shape of the conductive portion DR can be the same as that of the hole area HO. For example, if the hole area HO is circular, the conductive portion DR is circular; if the hole area HO is rectangular, the conductive portion DR is also rectangular. Because the edge of the hole area HO is annular, static charge accumulates more evenly across its edge during laser cutting and copper rod friction testing. If only one connecting lead SX is provided, there may be less static charge near the connecting lead SX, while more static charge is accumulated in other parts of the conductive portion DR, resulting in uneven display near the hole area HO. Therefore, this embodiment provides at least two connecting leads ZX, and the connecting leads ZX are evenly distributed, that is, the angles between each connecting lead ZX are the same. This allows static charge to be more evenly distributed by the conductive portion and the connecting leads, avoiding uneven display near the hole area HO. Of course, it should be noted that each connecting lead ZX is connected to a signal line SX, and the signal lines SX connected to different connecting leads ZX transmit the same signal, thereby preventing short circuits between different signal lines.

[0113] Optionally, refer to Figure 4 In the above embodiment, the display motherboard includes at least two conductive parts DR. By providing more conductive parts DR, the static charge can be further evenly dispersed, thereby improving the uneven display near the hole area HO.

[0114] Furthermore, in the above embodiment, when there are multiple conductive portions DR, the intervals between two adjacent conductive portions DR may be equal. In addition, the line widths of different conductive portions DR may be equal.

[0115] Optionally, continue to refer to Figure 4The conductive portion DR and the hole area HO have the same center. The center described in this embodiment refers to the geometric center. For example, if the conductive portion DR is a ring and the hole area HO is a circle, the center is the corresponding center of the circle. The configuration of this embodiment allows the conductive portion DR to be evenly distributed within the transition area TA, thereby more evenly distributing static charge across the conductive portions DR, avoiding uneven display caused by uneven static charge distribution.

[0116] Optionally, continue to refer to Figure 3 The driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate 11; the conductive portion DR is provided on the same layer as the light-shielding metal layer.

[0117] Specifically, if Figure 3 As shown, in this embodiment, the light shielding metal layer is the first metal layer 12. The driving circuit layer may specifically include Figure 3 The film layers of the transistor shown in the figure, namely the active layer 13, the gate insulating layer 14, the second metal layer 15, the third metal layer 16, the oxide semiconductor layer 17, the fourth metal layer 18 and the fifth metal layer 19, of course also include the insulating layer or dielectric layer between each film layer. In addition, a buffer layer may be provided between the light-shielding metal layer and the substrate 11. The light-shielding metal layer includes a light-shielding metal, which corresponds to the pixel driving circuit setting. For example, it can be used to block the active layer of the driving transistor in the pixel driving circuit to prevent the active layer of the driving transistor from being affected and causing the threshold voltage to shift. In some embodiments, each light-shielding metal in the light-shielding metal layer can be independently provided; in other embodiments, each light-shielding metal can be connected into a mesh.

[0118] In this embodiment, the conductive portion DR is placed on the same layer as the light-shielding metal layer. This means that the light-shielding metal layer and the conductive portion DR are fabricated and formed simultaneously, and are made of the same material. The light-shielding metal layout is relatively simple within the light-shielding metal layer, and generally, no traces are placed on other layers within the same layer. Therefore, placing the conductive portion DR within the light-shielding metal layer significantly simplifies routing the conductive portion DR and the connecting lead ZX.

[0119] Optionally, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line.

[0120] Specifically, in this embodiment, the light-shielding metal not only has the function of light-shielding, but is also reused as the connecting lead ZX, thereby reducing the number of signal lines and further reducing the difficulty of wiring.

[0121] Optionally, the signal line SX is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving layer.

[0122] Specifically, the pixel driving circuit in this embodiment is, for example, a pixel driving circuit including seven transistors and one capacitor, which is also often referred to as a "7T1C" pixel driving circuit by those skilled in the art. Figure 5 As shown, Figure 5This is a schematic diagram of the circuit structure of a pixel driving circuit provided in an embodiment of the present invention. The pixel driving circuit may specifically include a driving transistor T1, a threshold compensation transistor T3, a data writing transistor T2, a first initialization transistor T4, a second initialization transistor T7, a first emission control transistor T5, a second emission control transistor T6, and a storage capacitor Cst. The data writing transistor T2 is used to write a data voltage into the driving transistor T1, and the driving transistor T1 is used to generate a driving current based on the data voltage. The threshold compensation transistor T3 is used to compensate for the threshold voltage of the driving transistor T1. The first initialization transistor T4 is used to initialize the gate of the driving transistor T1. The second initialization transistor T7 is used to initialize the first electrode of the light-emitting element 24 corresponding to the pixel driving circuit. The first emission control transistor T5 and the second emission control transistor T6 are used to provide a conduction path for the driving current. The threshold compensation transistor and the first initialization transistor may be oxide thin film transistors, and the other transistors may be silicon transistors. The first emission control transistor is connected between a first power signal line ELVDD and a second power signal line ELVSS, wherein the voltage signal provided by the first power signal line is greater than the voltage signal provided by the second power signal line.The power signal line includes a first power signal line ELVDD and a second power signal line ELVSS; a first end of the first light-emitting control transistor T5 is electrically connected to the first power signal line ELVDD, and a second end of the first light-emitting control transistor T5 is electrically connected to the first end of the driving transistor T1; a second end of the driving transistor T1 is electrically connected to the first end of the second light-emitting control transistor T6, a second end of the second light-emitting control transistor T6 is electrically connected to the first electrode of the corresponding light-emitting element, and the second electrode of the light-emitting element is electrically connected to the second power signal line ELVSS; the signal line is the first power signal line ELVDD; the driving layer is provided with a first scan signal line S1, a second scan signal line S2, an initialization signal line Vref1, a light-emitting control signal line EM and a data line Data; a first end of the data writing transistor T2 is electrically connected to the data line Data, a second end of the data writing transistor T2 is electrically connected to the first end of the driving transistor T1, and a control end of the data writing transistor T2 is electrically connected to the second scan signal line S2; a first end of the threshold compensation transistor T3 is electrically connected to the first end of the driving transistor T1, and a control end of the data writing transistor T2 is electrically connected to the second scan signal line S2; a first end of the threshold compensation transistor T3 is electrically connected to the first end of the driving transistor T1, and a control end of the data writing transistor T2 is electrically connected to the second scan signal line S2. One end is electrically connected to the second end of the driving transistor T1, the second end of the threshold compensation transistor T3 is electrically connected to the control end of the driving transistor T1, and the control end of the threshold compensation transistor T3 is electrically connected to the second scanning signal line S2; the first end of the first initialization transistor T4 is electrically connected to the initialization signal line Vref1, the second end of the first initialization transistor T4 is electrically connected to the control end of the driving transistor T1, and the control end of the first initialization transistor T4 is electrically connected to the first scanning signal line S1; the first end of the second initialization transistor T7 is electrically connected to the initialization signal line Vref1, the second end of the second initialization transistor T7 is electrically connected to the first electrode of the light-emitting element, and the control end of the second initialization transistor T7 is electrically connected to the first scanning signal line S1; the first end of the storage capacitor Cst is electrically connected to the first power signal line ELVDD, and the second end of the storage capacitor Cst is electrically connected to the control end of the driving transistor T1; the control end of the first light-emitting control transistor T5 and the control end of the second light-emitting control transistor T6 are both electrically connected to the light-emitting control signal line EM. The operation process of the pixel driving circuit includes an initialization phase, a compensation phase, and a light-emitting phase. During the initialization phase, the first scanning signal line S1 controls the conduction of the first initialization transistor T4 and the second initialization transistor T7. The initialization signal line Vref1 initializes the control terminal of the driving transistor T1 and the first electrode of the light-emitting element 24. During the compensation phase, the second scanning signal line S2 controls the conduction of the data writing transistor T2 and the threshold compensation transistor T3. The data voltage on the data line Data passes through the data writing transistor T2 and the threshold compensation transistor T3 and is then written to the control terminal of the driving transistor T1. This phase completes the threshold compensation of the driving transistor T1. During the emission phase, the emission control signal line EM controls the conduction of the first emission control transistor T5 and the second emission control transistor T6. The driving transistor T1 generates a drive current, and the light-emitting element 24 emits light in response to the drive current.

[0123] The signal line described in this embodiment can be the first power signal line ELVDD or the second power signal line ELVSS. Since the second power signal line ELVSS is arranged on the side of the driving layer away from the substrate, when the signal line is set as the second power signal line ELVSS, the connecting lead needs to be connected to the second power signal line through more vias in the display area, which makes the layout difficult. The first power signal line ELVDD can be set in the light-shielding metal layer, so setting the signal line as the first power signal line ELVDD can further reduce the wiring difficulty. It can be understood that in the above embodiment, the conductive part DR, the light-shielding metal, the first power signal line and the connecting lead are an integrated structure. Of course, in some other embodiments, the signal line can also be other types of signal lines, such as an initialization signal line that provides an initialization signal for the pixel driving circuit.

[0124] Optionally, Figure 6 A partial enlarged view of another display motherboard provided by an embodiment of the present invention, referring to Figures 1 to 6 The portion of the driving layer located in the transition area TA includes at least one dam structure 30, which is arranged around the hole area HO; the at least one conductive portion DR is located between the dam structure 30 and the hole area HO.

[0125] Specifically, the dam structure 30 is used to prevent the organic layer (such as the IJP ink layer) in the encapsulation layer (not shown) of the display motherboard from overflowing. Of course, it is understandable that the encapsulation layer of the display motherboard can be a TFE encapsulation, that is, a laminated structure of an inorganic layer, an organic layer, and an inorganic layer. The shape of the dam structure 30 can be the same as the shape of the hole-digging area HO, that is, when the hole-digging area HO is circular, the dam structure 30 is also circular; when the hole-digging area HO is rectangular, the dam structure 30 is also rectangular. In this embodiment, the conductive part DR is arranged between the dam structure 30 and the hole-digging area HO. On the one hand, the conductive part DR is closer to the hole-digging area HO, which is convenient for absorbing static charges near the hole-digging area HO; on the other hand, there is no dam structure above the conductive part DR, that is, there are fewer film layers above, which is convenient for subsequently drawing out the potential on the conductive part DR from the film layer above it (to be explained later).

[0126] Optionally, in the above embodiment, the transition area may be provided with at least two conductive portions; and the at least two conductive portions are evenly distributed between the excavated area and the dam structure.

[0127] Optionally, Figure 7 for Figure 1 Another cross-sectional view along the A1A2 direction, combined with Figure 1 and Figure 7 , the at least one dam structure includes a first dam structure 301 and a second dam structure 302 located between the first dam structure 301 and the hole-digging area HO.

[0128] Specifically, the shape of the second dam structure 302 may be the same as that of the first dam structure 301. By providing two dam structures, the overflow of the IJP ink layer can be further improved.

[0129] Optionally, in the above embodiment, the dam structure 30 is located on the side of the drive circuit layer away from the substrate 11. The dam structure can be formed by etching the planarization layer (the first planarization layer 20 and the second planarization layer 21 in this embodiment). In this case, a groove exists between the dam structure 30 and the planarization layer located in the display area AA. The height and size of the dam structure 30, as well as the size of the groove between the dam structures, can be set according to the specific parameters of the display motherboard and are not specifically limited in this embodiment.

[0130] Optionally, continue to refer to Figure 7 The driving layer further includes a pixel defining layer 23 covering the planarization layer. The pixel defining layer 23 is formed with an opening 231. The opening 231 exposes a portion of the surface of the dam structure 30 away from the substrate.

[0131] Specifically, the pixel defining layer is arranged on the side of the planarization layer away from the substrate. It is known to those skilled in the art that, in the display area, the opening of the pixel defining layer is used to define the position of the light-emitting element. In this embodiment, the opening 231 refers to an opening located in the transition area TA and used to expose a portion of the surface of the dam structure 30. The dam structure 30 generally includes an inorganic layer, such as silicon oxide or silicon nitride. The water vapor in the inorganic layer is not easy to dissipate. If it remains in the inorganic layer, it may cause damage to the inorganic layer film. In this embodiment, by providing the opening 231, it is convenient to dissipate the water vapor in the dam structure, thereby ensuring that the dam structure has good performance in blocking the IJP ink layer.

[0132] Optionally, Figure 8 for Figure 1 Another cross-sectional view along the A1A2 direction, refer to Figure 1 and Figure 8 The portion of the driving layer located in the transition area TA is provided with an anti-crack dam 40 , which at least partially penetrates the driving circuit layer; the anti-crack dam 40 is located between the dam structure 30 and the conductive portion DR.

[0133] Specifically, the anti-crack dam 40 can be formed by etching a through hole on the driving circuit layer and filling the through hole with other film materials. By providing the anti-crack dam 40, cracks generated near the hole-digging area HO can be prevented from spreading to the display area AA. Of course, it should be noted that the anti-crack dam 40 can be a partial film layer or the entire film layer that passes through the driving circuit layer. In addition, the conductive portion DR is provided between the anti-crack dam 40 and the hole-digging area HO, so that the conductive portion DR is closer to the hole-digging area HO, which is more conducive to absorbing the static charge generated near the hole-digging area HO.

[0134] Optionally, continue to refer to Figure 8 The display motherboard also includes a first isolation structure 26, which is located on the side of the drive layer away from the substrate. The first isolation structure 26 encloses an isolation opening. The light-emitting layer includes a plurality of light-emitting elements 24, each corresponding to the isolation opening. Along the thickness direction of the display motherboard, the orthographic projections of the light-emitting elements 24 on the substrate at least partially overlap with the orthographic projections of the isolation opening on the substrate. The composition and preparation of the first isolation structure 26 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310692671.8 for reference.

[0135] Specifically, in this embodiment, the first isolation structure 26 includes a first support portion 261 and a first crown portion 262. The first crown portion 262 is located on the side of the first support portion 261 away from the substrate 11. The first support portion 261 is a conductive structure. The light-emitting element 24 includes a first electrode 241, a light-emitting functional layer 242, and a second electrode 243, which are sequentially stacked within the isolation opening. The second electrode 243 is connected to the first support portion 261. The light-emitting functional layer 242 can be disposed within the isolation opening. For example, the first electrode serves as an anode, and the second electrode serves as a cathode. In this embodiment, the different light-emitting elements are individually packaged. That is, when manufacturing the light-emitting elements, light-emitting elements of different colors are manufactured separately. For example, a red light-emitting element is first manufactured, and then the red light-emitting element within the isolation opening corresponding to the other color light-emitting element is removed. Then, light-emitting elements of the other color are manufactured, and so on, until all the light-emitting elements are manufactured. Of course, each light-emitting element also includes an encapsulation layer 25. This embodiment adopts an isolation structure and a structure in which the light-emitting elements are individually packaged. There is no undesirable problem such as color mixing or color spots between different light-emitting elements. There is no lateral leakage between the light-emitting elements, and the second pole of each light-emitting element can be individually controlled. Moreover, since the light-emitting elements are independent of each other, the optical performance can also be optimized. The light-emitting elements are individually packaged, which can improve the packaging reliability. In addition, since there is no need to use a precision mask, the preparation cost can be reduced and special-shaped pixel arrangements can be achieved.

[0136] Optionally, Figure 9 A partial enlarged view of another display motherboard provided by an embodiment of the present invention, referring to Figure 1 、 Figure 8 and Figure 9The portion of the display motherboard located in the transition area TA includes a second isolation structure 27, which surrounds the hole area HO, penetrates the drive layer, and is electrically connected to the conductive portion DR. The second isolation structure 27 is insulated from the first isolation structure 26. The display motherboard also includes an electrode structure 282, which covers the area between the second isolation structure 27 and the hole area HO and is electrically connected to the second isolation structure 27.

[0137] Specifically, the electrode structure in this embodiment covers the edge of the hole area HO. When the hole area HO is cut or a copper rod friction test is performed, the static charge generated near the hole area HO will be absorbed by the electrode structure. In this embodiment, the electrode structure is electrically connected to the signal line through the second isolation structure 27, so that the electrode structure is charged, ensuring that the static charge near the hole area HO can be absorbed. The position of the second isolation structure 27 and the conductive part DR is not specifically limited, as long as electrical connection can be achieved. The second isolation structure and the electrode structure can both be made of metal or other conductive materials. For example, the second isolation structure 27 is made of opaque metal. Since the second isolation structure 27 surrounds the hole area HO, it can also prevent light in the display area AA from entering the hole area HO and interfering with the optical device provided in the hole area HO.

[0138] Optionally, continue to refer to Figure 8 The second isolation structure 27 and the first isolation structure 26 are on the same layer.

[0139] Specifically, the second isolation structure 27 and the first isolation structure 26 are on the same layer, which means that the two are made at the same time. The second isolation structure 27 includes a second support portion 271 and a second crown portion 272 located on the side of the second support portion 271 away from the substrate 11. The second support portion 271 and the first support portion 261 are on the same layer, and the second crown portion 272 and the second crown portion 262 are on the same layer. The second support portion 271 is a conductive structure, and the second support portion 271 passes through the drive layer and is electrically connected to the conductive portion DR; the electrode structure is connected to the second support portion 271. Before making the isolation structure (including the first isolation structure and the second isolation structure), a through hole exposing the conductive portion DR is first etched by etching, and then the first isolation structure 26 and the second isolation structure 27 are made, so that the second isolation structure is electrically connected to the conductive portion DR. After the isolation structure is made, the electrode structure located in the isolation structure is made.

[0140] Optionally, continue to refer to Figure 8 , the electrode structure 282 covers the area surrounded by the second isolation structure 27 .

[0141] Specifically, in this embodiment, when manufacturing the electrode structure, the entire area surrounded by the second isolation structure 27 is manufactured, thereby ensuring that the edges of the hole area HO can be covered by the electrode structure and ensuring that the electrode structure can effectively absorb static charges.

[0142] Alternatively, as Figure 8 As shown, the display motherboard includes a dummy light emitting element 28, which covers the area surrounded by the second isolation structure 27. The dummy light emitting element 28 includes a dummy light emitting functional layer 281 and an electrode structure 282 on the side of the dummy light emitting functional layer 281 away from the substrate 11.

[0143] Specifically, the dummy light-emitting element 28 is manufactured on the same layer as one of the light-emitting elements in the light-emitting layer, for example, it can be manufactured on the same layer as the red light-emitting element, the green light-emitting element, or the blue light-emitting element. The dummy light-emitting element 28 does not have a first pole, nor does it have a pixel driving circuit electrically connected to it, and therefore does not emit light. In this embodiment, the dummy light-emitting element 28 is provided, and the corresponding electrode structure can be manufactured by utilizing the steps of manufacturing the light-emitting element in the current process steps of the display motherboard without having to add new process steps to prepare the electrode structure, thereby improving production efficiency. It can be understood that the dummy light-emitting element 28 is manufactured on the same layer as one of the light-emitting elements, and the corresponding dummy light-emitting element 28 also includes an encapsulation layer 25. The dummy light-emitting element 28 is not used for emitting light, but is used to prepare the electrode structure 282 without adding additional process steps.

[0144] Optionally, refer to Figure 9 , a first preset interval is formed between the second isolation structure 27 and the edge of the hole region HO.

[0145] Specifically, the edge of the hole-punch area HO can be understood as the cutting line of the display motherboard, and subsequent laser cutting will be carried out along the cutting line. If the second isolation structure 27 is close to the cutting line, the second isolation structure 27 may be cut during cutting, thereby affecting the electrical performance of the second isolation structure 27. In this embodiment, a first preset interval is set between the second isolation structure 27 and the edge of the hole-punch area HO to ensure that the second isolation structure will not be cut during subsequent cutting. The specific value of the first preset interval can be determined according to the cutting process, as long as it can ensure that the second isolation structure will not be cut during cutting.

[0146] Optionally, refer to Figure 8 In this embodiment, along the thickness direction of the display motherboard, the projection of the second isolation structure 27 on the substrate 11 overlaps with the projection of one of the conductive portions DR on the substrate 11 .

[0147] Specifically, the second isolation structure 27 needs to be electrically connected to the conductive portion DR. In this embodiment, the projections of the two overlap, and only one via needs to be etched to achieve electrical connection between the two. In some embodiments, the line width of the second isolation structure 27 can be set to be the same as the line width of the conductive portion DR that overlaps with its projection; the projection of the second isolation structure 27 on the substrate 11 can also be set to be located within the projection of the corresponding conductive portion DR.

[0148] Optionally, the display motherboard includes at least two conductive portions DR; along the thickness direction of the display motherboard, the projection of the second isolation structure 27 on the substrate 11 overlaps with the projection of the conductive portion DR closest to the hole area HO on the substrate 11.

[0149] Specifically, the arrangement of this embodiment makes the second isolation structure 27 closest to the hole area HO, and the corresponding ability to absorb static charges is also stronger. In addition, the equivalent ring area of ​​the second isolation structure 27 is smaller, which is also conducive to reducing material usage and thus saving costs.

[0150] Optionally, Figure 10 A partial enlarged view of another display motherboard provided in an embodiment of the present invention, Figure 11 for Figure 1 Another cross-sectional view along the A1A2 direction, Figure 12 for Figure 1 Another cross-sectional view along the A1A2 direction, Figure 13 for Figure 1 Another cross-sectional view along the A1A2 direction, refer to Figure 1 、 Figures 11 to 13 The display motherboard further includes a third isolation structure 31 , which is located in the hole area HO and on the side of the driving layer away from the substrate 11 ; the electrode structure covers the area between the second isolation structure 27 and the third isolation structure 31 .

[0151] Specifically, in the above-described embodiment, the electrode structure covers the entire excavated area HO. However, the excavated area HO has a relatively large area, making it difficult to fabricate a dummy light-emitting element that covers the entire excavated area HO, resulting in a low yield, which affects the electrode structure's ability to absorb static charge. In this embodiment, by adding a third isolation structure 31 to the excavated area HO and positioning the dummy light-emitting element 28 between the third isolation structure 31 and the second isolation structure 27, the size of the dummy light-emitting element 28 can be reduced, thereby improving the yield of the dummy light-emitting element 28. This is equivalent to improving the yield of the electrode structure, ensuring that the electrode structure has good charge absorption capabilities.

[0152] Optionally, in the above embodiment, the third isolation structure 31 and the second isolation structure 27 are in the same layer.

[0153] Specifically, the third isolation structure 31, the second isolation structure 27, and the first isolation structure 26 are all fabricated on the same layer and are formed simultaneously. The third isolation structure 31 may include a third support portion 311 and a third crown portion 312 located on the side of the third support portion 311 facing away from the substrate 11. Placing the three isolation structures on the same layer allows the isolation structure to be fabricated without adding additional process steps, thereby reducing fabrication costs.

[0154] It is understandable that in Figure 12 In the structure shown, the display motherboard includes a dam structure 30; Figure 13 In the structure shown, the display motherboard includes two dam structures 30; Figure 13 In the structure shown, the display motherboard further includes a crack prevention dam 40 .

[0155] Optionally, the width of the third isolation structure 31 is greater than the width of the second isolation structure 27 .

[0156] Specifically, the third isolation structure 31 can be configured to be relatively small, as it needs to take into account the small size of the transition area TA. Since the third isolation structure 31 will subsequently need to be cut away, its size has no effect on the size of the transition area TA. However, its larger size is more conducive to evaporating the dummy light-emitting element, which in turn is more conducive to producing a high-performance electrode structure. Therefore, in this embodiment, by making the width of the third isolation structure 31 greater than that of the second isolation structure 27, this not only reduces the size of the transition area TA but also facilitates the production of a high-performance electrode structure.

[0157] Optionally, a second preset interval is formed between the third isolation structure 31 and the edge of the hole region HO.

[0158] Specifically, the principle of the first preset interval is similar to that of the first preset interval. By setting the second preset interval, the third isolation structure is prevented from being cut during cutting, thereby affecting the cutting effect, such as unsatisfactory cutting results. The specific value of the second preset interval can be set according to the specific cutting process, as long as it can ensure that the third isolation structure is not cut during cutting. This embodiment does not specifically limit this.

[0159] Optionally, Figure 14 for Figure 1 Another cross-sectional view along the A1A2 direction, refer to Figure 1 and Figure 14 The display motherboard further includes a groove Gap, and the edge of the hole area HO is located in the groove Gap.

[0160] Specifically, the groove Gap can penetrate part or all of the film layers of the driving layer. The edge of the hole area HO is also the cutting line position. When there are more film layers at the cutting line position, the difficulty of subsequent laser cutting is also higher. Therefore, this embodiment can reduce the film layers that need to be cut later by setting the groove Gap, thereby reducing the cutting difficulty. It is understandable that the groove Gap can be formed by etching. In addition, the dummy light-emitting element 28 can be set in the groove Gap.

[0161] An embodiment of the present invention further provides a display panel comprising a display area, a transition area, and a punched hole area, wherein the transition area surrounds the punched hole area, and the display area at least partially surrounds the transition area. The display panel further comprises: a substrate; a drive layer disposed on the substrate; and a light-emitting layer disposed on a side of the drive layer away from the substrate. The portion of the drive layer located in the transition area is provided with at least one conductive portion, which surrounds the punched hole area; and the portion of the drive layer located in the display area is provided with at least one signal line, which is electrically connected to the signal line. The display panel of this embodiment differs from the above-described embodiment in that the display panel does not include the punched hole area of ​​the display motherboard; the remaining structures are identical. The conductive portion provided in the display panel can prevent static charge accumulation near the punched hole area, thereby preventing transistor threshold voltage shift near the punched hole area, thereby improving the problem of luminescence near the punched hole area. The specific principles behind this can be found in the description of the display motherboard in the embodiment of the present invention and will not be elaborated here.

[0162] The features and beneficial effects of the portion outside the hole area of ​​the display panel can be referred to the description of the display motherboard portion of the present invention, and will not be repeated here.

[0163] The present invention also provides a display panel, which is formed by cutting the hole area of ​​any display motherboard according to the present invention. The display panel can be an OLED (Organic Light-Emitting Diode) display panel, a micro organic light-emitting diode (Micro Organic Light-Emitting Diode, Micro OLED) display panel, a quantum dot organic light-emitting diode (Quantum Dot Light Emitting Diodes, QLED) display panel, a mini light-emitting diode (Mini Light-Emitting Diode, Mini LED) display panel, or a micro light-emitting diode (Micro Light-Emitting Diode, Micro LED) display panel. Because it is formed by cutting the display motherboard provided by the embodiment of the present invention, it also has the same beneficial effect, that is, it can improve the problem of luminescence in the hole area.

[0164] The present invention further provides a display device comprising the display panel provided by any embodiment of the present invention. The display device can be a mobile phone, tablet computer, MP3 player, MP4 player, smartwatch, videophone, personal digital assistant, smart helmet, or other wearable device. Because it includes the display panel provided by any embodiment of the present invention, it also has the same beneficial effects and will not be further described here.

[0165] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0166] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A display motherboard, characterized in that: The display motherboard includes a display area, a transition area, and a hole-punch area, wherein the transition area surrounds the hole-punch area, and the display area at least partially surrounds the transition area; the display motherboard further includes: substrate; a driving layer, disposed on the substrate; a light-emitting layer, disposed on a side of the driving layer away from the substrate; The portion of the driving layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the hole area; the portion of the driving layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line.

2. The display motherboard according to claim 1, wherein: The display motherboard further includes at least one connecting lead, the connecting lead being electrically connected to the conductive portion, the connecting lead extending from the transition area to the display area and being electrically connected to the signal line; Preferably, the conductive portion is a conductive ring; Preferably, the connecting lead and the conductive part are provided in the same layer; Preferably, the material of the conductive part includes at least one of molybdenum, magnesium, silver, aluminum, copper and titanium; Preferably, the display motherboard includes at least two connecting leads, and the at least two connecting leads are evenly distributed along the circumferential direction of the conductive portion; Preferably, the conductive portion and the center of the hole area are the same.

3. The display motherboard according to claim 1, wherein: The driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the conductive portion is provided on the same layer as the light-shielding metal layer; Preferably, the signal line is provided in the same layer as the light-shielding metal layer; Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line; Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

4. The display motherboard according to claim 3, wherein: The pixel driving circuit includes a driving transistor, a first light-emitting control transistor, and a second light-emitting control transistor; the power signal line includes a first power signal line and a second power signal line; a first end of the first light-emitting control transistor is electrically connected to the first power signal line, and a second end of the first light-emitting control transistor is electrically connected to the first end of the driving transistor; a second end of the driving transistor is electrically connected to the first end of the second light-emitting control transistor, a second end of the second light-emitting control transistor is electrically connected to the first electrode of the corresponding light-emitting element, and a second electrode of the light-emitting element is electrically connected to the second power signal line; the signal line is the first power signal line; Preferably, the pixel driving circuit further includes a data writing transistor, a threshold compensation transistor, a first initialization transistor, a second initialization transistor and a storage capacitor; the driving layer is provided with a first scanning signal line, a second scanning signal line, an initialization signal line, a light emitting control signal line and a data line; the first end of the data writing transistor is electrically connected to the data line, the second end of the data writing transistor is electrically connected to the first end of the driving transistor, and the control end of the data writing transistor is electrically connected to the second scanning signal line; the first end of the threshold compensation transistor is electrically connected to the second end of the driving transistor, the second end of the threshold compensation transistor is electrically connected to the control end of the driving transistor, and the control end of the threshold compensation transistor is electrically connected to the second scanning signal line; The first end of the first initialization transistor is electrically connected to the initialization signal line, the second end of the first initialization transistor is electrically connected to the control end of the driving transistor, and the control end of the first initialization transistor is electrically connected to the first scanning signal line; the first end of the second initialization transistor is electrically connected to the initialization signal line, the second end of the second initialization transistor is electrically connected to the first electrode of the light-emitting element, and the control end of the second initialization transistor is electrically connected to the first scanning signal line; the first end of the storage capacitor is electrically connected to the first power signal line, and the second end of the storage capacitor is electrically connected to the control end of the driving transistor; the control end of the first light-emitting control transistor and the control end of the second light-emitting control transistor are both electrically connected to the light-emitting control signal line.

5. The display motherboard according to claim 1, wherein: The portion of the driving layer located in the transition area includes at least one dam structure, and the dam structure is arranged around the excavated area; The at least one conductive portion is disposed between the dam structure and the excavated area; Preferably, the portion of the driving layer located in the transition region is provided with at least two conductive parts; Preferably, the at least two conductive parts are evenly distributed between the digging area and the dam structure.

6. The display motherboard according to claim 5, characterized in that: The at least one dam structure includes a first dam structure and a second dam structure located between the first dam structure and the excavated area; Preferably, the driving layer includes a driving circuit layer, and the dam structure is located on a side of the driving circuit layer away from the substrate; Preferably, the driving layer further comprises a planarization layer covering the driving circuit layer, a portion of the planarization layer located in the transition area constitutes the dam structure, and a groove is formed between a portion of the planarization layer located in the display area and the dam structure; Preferably, the driving layer further comprises a pixel defining layer covering the planarization layer, wherein the pixel defining layer is formed with an opening, and the opening exposes a portion of the surface of the dam structure away from the substrate; Preferably, a crack prevention dam is formed on the portion of the driving layer located in the transition zone, and the crack prevention dam at least partially penetrates the driving circuit layer; The crack prevention dam is located between the dam structure and the conductive part.

7. The display motherboard according to claim 1, wherein: The display motherboard further includes a first isolation structure, the first isolation structure being located on a side of the driving layer away from the substrate; the first isolation structure encloses an isolation opening; The light-emitting layer includes a plurality of light-emitting elements; the light-emitting elements correspond to the isolation openings one by one, and along the thickness direction of the display motherboard, the orthographic projections of the light-emitting elements on the substrate at least partially overlap with the orthographic projections of the isolation openings on the substrate; Preferably, the first isolation structure includes a first supporting portion and a first crown portion, the first crown portion is located on a side of the first supporting portion away from the substrate, and the first supporting portion is a conductive structure; Preferably, the light-emitting element includes a first electrode, a light-emitting functional layer and a second electrode sequentially stacked in the isolation opening; the second electrode is connected to the first supporting portion.

8. The display motherboard according to claim 7, wherein: The portion of the display motherboard located in the transition region includes a second isolation structure, the second isolation structure surrounding the excavated region, penetrating the drive layer and electrically connected to the conductive portion, and insulated from the first isolation structure; the display motherboard further includes an electrode structure, the electrode structure covering the region between the second isolation structure and the excavated region, and electrically connected to the second isolation structure; Preferably, the second isolation structure is on the same layer as the first isolation structure; Preferably, the electrode structure covers the area surrounded by the second isolation structure; Preferably, the second isolation structure includes a second supporting portion and a second crown portion located on the side of the second supporting portion away from the substrate, the second supporting portion is a conductive structure, the second supporting portion passes through the driving layer and is electrically connected to the conductive portion; the electrode structure is connected to the second supporting portion.

9. The display motherboard according to claim 8, characterized in that: The display motherboard includes a dummy light-emitting element, the dummy light-emitting element covers the area surrounded by the second isolation structure, and the dummy light-emitting element includes a dummy light-emitting functional layer and the electrode structure on a side of the dummy light-emitting functional layer away from the substrate; Preferably, the dummy light-emitting element is manufactured in the same layer as one of the light-emitting elements in the light-emitting layer; Preferably, a first preset interval is formed between the second isolation structure and the edge of the hole-digging area.

10. The display motherboard according to claim 8, wherein: Along the thickness direction of the display motherboard, a projection of the second isolation structure on the substrate overlaps with a projection of one of the conductive parts on the substrate; Preferably, the display motherboard includes at least two conductive parts; Along the thickness direction of the display motherboard, a projection of the second isolation structure on the substrate overlaps with a projection of the conductive portion closest to the hole area on the substrate.

11. The display motherboard according to claim 8, wherein: The display motherboard further includes a third isolation structure, the third isolation structure being located in the hole-digging area and on a side of the driving layer away from the substrate; the electrode structure covers an area between the second isolation structure and the third isolation structure; Preferably, the third isolation structure and the second isolation structure are on the same layer; Preferably, the third isolation structure includes a third support portion and a third crown portion, the third support portion is located on a side of the driving layer away from the substrate, and the third crown portion is located on a side of the third support layer away from the substrate; Preferably, the width of the third isolation structure is greater than the width of the second isolation structure.

12. The display motherboard according to claim 11, wherein: A second preset interval is formed between the third isolation structure and the edge of the hole-digging area; Preferably, the display motherboard further includes a groove, and the edge of the hole-digging area is located in the groove.

13. A display panel, characterized in that: The display panel includes a display area, a transition area, and a punch hole area, wherein the transition area surrounds the punch hole area, and the display area at least partially surrounds the transition area; the display panel further includes: substrate; a driving layer, disposed on the substrate; a light-emitting layer, disposed on a side of the driving layer away from the substrate; The portion of the driving layer located in the transition area is provided with at least one conductive portion, and the conductive portion surrounds the hole area; the portion of the driving layer located in the display area is provided with at least one signal line, and the conductive portion is electrically connected to the signal line.

14. The display panel according to claim 13, wherein: The display panel further includes at least one connecting lead, the connecting lead being electrically connected to the conductive portion, the connecting lead extending from the transition area to the display area and being electrically connected to the signal line; Preferably, the conductive portion is a conductive ring; Preferably, the connecting lead and the conductive part are provided in the same layer; Preferably, the material of the conductive part includes at least one of molybdenum, magnesium, silver, aluminum, copper and titanium; Preferably, the display panel comprises at least two connecting leads, and the at least two connecting leads are evenly distributed along the circumferential direction of the conductive portion; Preferably, the conductive portion and the center of the hole area are the same.

15. The display panel according to claim 13, wherein: The driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the conductive portion is provided on the same layer as the light-shielding metal layer; Preferably, the signal line is provided in the same layer as the light-shielding metal layer; Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line; Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

16. A display motherboard, characterized in that: The display motherboard includes a display area, a transition area, and a hole-punch area, wherein the transition area surrounds the hole-punch area, and the display area at least partially surrounds the transition area; the display motherboard further includes: substrate; a driving layer, disposed on the substrate; a light-emitting layer, disposed on a side of the driving layer away from the substrate; Among them, the part of the driving layer located in the transition area is provided with at least one electrostatic adsorption structure, and the part of the driving layer located in the display area is provided with at least one signal line, and the signal line is used to provide an electrical signal to the electrostatic adsorption structure, and the electrostatic adsorption structure is used to adsorb static electricity in the hole area.

17. The display motherboard according to claim 16, wherein: The electrostatic adsorption structure surrounds the hole area.

18. The display motherboard according to claim 16, wherein: The driving layer includes a light-shielding metal layer and a driving circuit layer located on a side of the light-shielding metal layer away from the substrate; the electrostatic adsorption structure is provided on the same layer as the light-shielding metal layer; Preferably, the signal line is provided in the same layer as the light-shielding metal layer; Preferably, the light-shielding metal layer includes a light-shielding metal, and the light-shielding metal is electrically connected to the signal line; Preferably, the signal line is a power signal line, and the power signal line is used to provide a power signal to the pixel driving circuit in the driving circuit layer.

19. A display panel, characterized in that: The display panel is formed by cutting the hole area from the display motherboard according to any one of claims 1 to 12; Alternatively, the display panel is formed by cutting the hole area from the display motherboard according to any one of claims 16 to 18.

20. A display device, characterized in that: The display device includes the display panel according to claim 19.

Images