Apparatus for manufacturing display device and method of manufacturing display device

Abstract

An apparatus for manufacturing a display device and a method of manufacturing a display device are provided. The apparatus comprises: a chamber; a stage that supports the target substrate; an electric field applying module disposed at one side of the stage; a heating element overlapping the table in a plan view; a heat source portion that moves in a direction parallel to a plane on which the target substrate is arranged; and a vacuum pump connected to the chamber.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0041261 filed on March 26, 2024, in the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to an apparatus for manufacturing a display device and a method of manufacturing a display device. Background Art

[0004] As information technology develops, the importance of display devices as a connection medium between users and information increases. Therefore, research and development of display devices have been continuously conducted.

[0005] A display device may include micron- or nanometer-sized inorganic light-emitting elements. The inorganic light-emitting elements may be arranged on a substrate and aligned when an electric field is formed on the substrate. If the inorganic light-emitting elements are not properly aligned, the display device may have difficulty achieving sufficient brightness, and the reliability of the display device may be degraded. Summary of the Invention

[0006] The embodiment provides an apparatus for manufacturing a display device and a method of manufacturing a display device capable of improving the degree of alignment of light emitting elements.

[0007] According to an embodiment of the present disclosure, an apparatus for manufacturing a display device may include: a chamber; a workbench supporting a target substrate; an electric field applying module arranged at one side of the workbench; a heating element overlapping the workbench in a plan view; a heat source portion moving in a direction parallel to a plane on which the target substrate is arranged; and a vacuum pump connected to the chamber.

[0008] The apparatus may further include a printing unit that ejects ink including at least one light emitting element onto the target substrate. The electric field applying module may form an electric field on the target substrate so that the at least one light emitting element can be aligned on the target substrate.

[0009] The workbench may include an interior space in which the heating element is disposed.

[0010] The heating element may comprise a hot plate.

[0011] The heating element may include a heat source having a temperature in the range of about 20°C to about 60°C.

[0012] The heat source part may include a rod-shaped heat source extending in the first direction. The heat source part may be movable in a direction other than the first direction.

[0013] The heat source portion may move on the workbench between a first moment and a second moment after the first moment. At the first moment, the heat source portion may overlap with a first side of the workbench in a plan view and may not overlap with a second side of the workbench in a plan view.

[0014] At the second moment, the heat source part may not overlap with the first side of the work table in a plan view, and may overlap with the second side of the work table in a plan view.

[0015] The heat source unit may include a first heat source unit and a second heat source unit. The first heat source unit and the second heat source unit may be movable on the workbench between a first moment and a second moment after the first moment. At the first moment, the first heat source unit may overlap with a first side of the workbench in a plan view. At the first moment, the second heat source unit may overlap with a second side of the workbench in a plan view.

[0016] The heat source unit may include a first heat source unit and a second heat source unit. The first heat source unit and the second heat source unit may move on the workbench between a first moment and a second moment after the first moment. At the first moment, the first heat source unit may overlap with an end portion of the workbench in a plan view. At the first moment, the second heat source unit may overlap with a central area of ​​the workbench in a plan view. Between the first moment and the second moment, the first heat source unit and the second heat source unit may move in the same direction.

[0017] The heat source portion may be disposed in the chamber.

[0018] The heat source part may include a heat source having a temperature in the range of about 60°C to about 200°C.

[0019] A vacuum pump may be connected to the chamber via an exhaust line. At least one of a pressure control valve and a flow control valve may be installed on the exhaust line. The vacuum pump may form a vacuum pressure atmosphere in the chamber.

[0020] The electric field application module may include a probe support and a probe unit arranged on a workbench. The probe unit may include a probe driver, a probe fixture, and a probe pad. The probe fixture is arranged on the probe driver so that an electrical signal is transmitted to the probe fixture, and the probe pad transmits the electrical signal to the target substrate. The probe driver can move the probe fixture in the horizontal and vertical directions.

[0021] The ink may also include a solvent.

[0022] According to an embodiment of the present disclosure, a method for manufacturing a display device may include: ejecting ink comprising at least one light-emitting element and a solvent onto a target substrate; aligning the at least one light-emitting element on the target substrate; and drying at least a portion of the solvent. Aligning the at least one light-emitting element may include forming an electric field on the target substrate; and controlling the temperature of the target substrate. Drying at least a portion of the solvent may include moving a heat source portion on the target substrate. Aligning the at least one light-emitting element and drying at least a portion of the solvent may be performed in a chamber.

[0023] Forming the electric field on the target substrate and controlling the temperature of the target substrate may be performed simultaneously.Controlling the temperature of the target substrate may include applying heat to the target substrate using a heating element.

[0024] Moving the heat source portion may include allowing the heat source portion to reciprocate in a direction parallel to a plane on which the target substrate is arranged. The heat source portion may include a rod-shaped heat source extending in the first direction.

[0025] Drying at least a portion of the solvent may include forming an inner space of the chamber to be in a vacuum state when a vacuum pump is connected to the chamber.

[0026] Forming the electric field on the target substrate may include forming the electric field using a probe unit, the probe unit may include a probe driver, a probe fixture, and a probe pad, the probe fixture being arranged on the probe driver so that an electrical signal is transmitted to the probe fixture, and the probe pad transmits the electrical signal to the target substrate. The probe driver may move the probe fixture in a horizontal direction and a vertical direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Example embodiments will now be described more fully hereinafter with reference to the accompanying drawings. However, example embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be more thorough and complete and will fully convey the scope of the example embodiments to those skilled in the art.

[0028] In the accompanying drawings, dimensions may be exaggerated for clarity of illustration. It will be understood that when an element is referred to as being "between" two elements, the element can be the only element between the two elements, or one or more intervening elements may also be present. Throughout the specification, like reference numerals refer to like elements.

[0029] Figure 1 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure.

[0030] Figure 2 is a schematic perspective view illustrating a light emitting element according to an embodiment of the present disclosure.

[0031] Figure 3 is a schematic block diagram illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0032] Figure 4 yes Figure 3 Schematic plan view of the device shown in .

[0033] Figure 5 is a schematic cross-sectional view illustrating the operation of the inkjet printing apparatus according to an embodiment of the present disclosure.

[0034] Figure 6 and Figure 7 is a schematic cross-sectional view illustrating the operation of the electric field applying module according to an embodiment of the present disclosure.

[0035] Figure 8 is a schematic cross-sectional view illustrating the operation of a heat source part according to an embodiment of the present disclosure.

[0036] Figure 9 is a schematic plan view of a heat source portion according to an embodiment of the present disclosure.

[0037] Figure 10 is a schematic cross-sectional view illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0038] Figure 11 is a schematic cross-sectional view illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0039] Figure 12 is a flowchart illustrating a method of manufacturing a display device.

[0040] Figures 13 to 15 is a schematic cross-sectional view illustrating a process of manufacturing a display device. DETAILED DESCRIPTION

[0041] The present disclosure can be applied to various variations and different shapes, so only specific examples are described in detail. However, these examples are not limited to certain shapes, but are applicable to all variations, equivalents and replacements. For better understanding, the included drawings are illustrated in a manner that the drawings are expanded.

[0042] It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, the "first" element described below may also be referred to as the "second" element without departing from the teachings of the present disclosure. As used herein, the singular is intended to include the plural unless the context clearly indicates otherwise.

[0043] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, the terms "comprise," "include," "include," and / or "comprising," when used in this specification, specify the presence of the stated features, wholes, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0044] When an element or layer is referred to as being “on”, “connected to” or “coupled to” another element or layer, the element or layer may be directly on, directly connected to or directly coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being “directly on”, “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers. For this purpose, the term “connected” may refer to a physical connection, an electrical connection and / or a fluid connection with or without the use of intervening elements. Furthermore, when an element is referred to as being “in contact with” or “in contact with” another element, etc., the element may be “in electrical contact with” or “in physical contact with” the other element; or “indirectly in contact with” or “directly in contact with” the other element.

[0045] For descriptive purposes, spatially relative terms such as "below," "beneath," "under," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein and, thereby, are used to describe the spatial relationship of one element to another element(s) as illustrated in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device when in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings were turned over, elements described as being "below" or "beneath" other elements or features would be oriented as being "above" the other elements or features. Thus, the exemplary term "below" is capable of encompassing both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore the spatially relative descriptors used herein should be interpreted accordingly.

[0046] In the specification and claims, for the purposes of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of..." For example, "at least one of A and B" may be understood to mean "A, B, or A and B." In the specification and claims, for the purposes of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or." For example, "A and / or B" may be understood to mean "A, B, or A and B." The terms "and" and "or" may be used in the sense of conjunctions or disjunctions and may be understood to be equivalent to "and / or."

[0047] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the relevant measurements and errors associated with the measurement of a particular quantity (such as limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

[0048] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless explicitly defined in this specification.

[0049] The present disclosure generally relates to an apparatus for manufacturing a display device and a method for manufacturing a display device. Hereinafter, an apparatus for manufacturing a display device and a method for manufacturing a display device according to embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0050] Figure 1 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure. Figure 2 is a schematic perspective view illustrating a light emitting element according to an embodiment of the present disclosure.

[0051] refer to Figure 1 The display device DD may be configured to emit light. The display device DD may include a light emitting element LD (see Figure 2In an embodiment, the display device DD can display moving images or still images. The display device DD can be used not only as a display screen for portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notepads, electronic books, portable multimedia players (PMPs), navigation systems, and ultra-mobile PCs, but also as a display screen for various products such as televisions, notebook computers, monitors, billboards, and Internet of Things (IoT) devices. However, the application field of the display device DD is not limited to the specific examples.

[0052] The display device DD may be formed in a rectangular shape having, in a plan view, short sides in a first direction DR1 and long sides in a second direction DR2 intersecting the first direction DR1. The corners where the short sides in the first direction DR1 and the long sides in the second direction DR2 meet each other may be rounded to have a curvature or formed at right angles. The shape of the display device DD is not limited to a quadrilateral shape, and the display device DD may be formed in another polygonal shape or a rounded shape such as a circular shape or an elliptical shape. The display device DD may be formed flat, but the present disclosure is not limited thereto. For example, the display device DD may include a bent portion formed at the left / right end and having a constant curvature or a varying curvature. In an embodiment, the display device DD may be formed to be sufficiently flexible to be warpable, bendable, bendable, foldable, or rollable. For example, the display device DD may be a flexible display device.

[0053] In the present disclosure, the first direction DR1 may be a horizontal direction that is a row direction of the pixels PXL. The second direction DR2 may be a column (or vertical) direction of the pixels PXL. The third direction DR3 may be a display direction of the display device DD or a normal direction of a plane on which the base layer BSL is disposed.

[0054] The display device DD may include a display area DA and a non-display area NDA. The non-display area NDA may be an area other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA in a plan view.

[0055] The display area DA may be an area where pixels PXL are arranged. The non-display area NDA may be an area where pixels PXL are not arranged. Driving circuits, lines, and pads connected to the pixels PXL in the display area DA may be arranged in the non-display area NDA.

[0056] In an embodiment, the pixel PXL (or sub-pixel SPX) may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. At least one first sub-pixel SPX1, at least one second sub-pixel SPX2, and at least one third sub-pixel SPX3 may form a pixel unit capable of emitting light of various colors. Figure 1 , it is illustrated that each pixel PXL includes three sub-pixels, ie, a first sub-pixel SPX1 , a second sub-pixel SPX2 , and a third sub-pixel SPX3 . However, the present disclosure is not limited thereto.

[0057] In an embodiment, the stripe arrangement structure, The pixels PXL (or sub-pixels SPX) are arranged by arranging the structure, etc. However, the present disclosure is not necessarily limited thereto.

[0058] The first subpixel SPX1 may emit a first light, the second subpixel SPX2 may emit a second light, and the third subpixel SPX3 may emit a third light. The first light may be light in a red wavelength band, the second light may be light in a green wavelength band, and the third light may be light in a blue wavelength band. The red wavelength band may be a wavelength band within a range of approximately 600 nm to approximately 750 nm, the green wavelength band may be a wavelength band within a range of approximately 480 nm to approximately 560 nm, and the blue wavelength band may be a wavelength band within a range of approximately 370 nm to approximately 460 nm. However, the present disclosure is not limited thereto.

[0059] Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may include an inorganic light-emitting element including an inorganic semiconductor as a light-emitting element LD that emits light. Figure 2 An inorganic light emitting element included in each of the first subpixel SPX1 , the second subpixel SPX2 , and the third subpixel SPX3 is described.

[0060] exist Figure 2 , as an example of the light emitting element LD, a rod-type light emitting element having a cylindrical shape is illustrated. However, the type and shape of the light emitting element LD are not limited thereto.

[0061] The light emitting element LD may include a first conductive type semiconductor layer 11, a second conductive type semiconductor layer 13, and an active layer 12 interposed between the first conductive type semiconductor layer 11 and the second conductive type semiconductor layer 13. In an embodiment, the light emitting element LD may be configured as a stacked structure in which the first conductive type semiconductor layer 11, the active layer 12, and the second conductive type semiconductor layer 13 are stacked in sequence.

[0062] In the embodiment, the light emitting element LD may be provided in a rod shape extending in one direction. In the case where the extending direction of the light emitting element LD is the length direction, the light emitting element LD may have one end portion and the other end portion in the length direction.

[0063] In an embodiment, one of the first conductive type semiconductor layer 11 and the second conductive type semiconductor layer 13 may be arranged at one end portion of the light emitting element LD, and the other of the first conductive type semiconductor layer 11 and the second conductive type semiconductor layer 13 may be arranged at the other end portion of the light emitting element LD.

[0064] The light-emitting element LD according to an embodiment of the present disclosure may be an inorganic light-emitting element. In an embodiment, the light-emitting element LD may be manufactured into a rod shape. The "rod shape" may include a rod-like shape or a rod-like shape that is long in its length direction (for example, its aspect ratio is greater than 1), such as a circular column or a polygonal column, and the cross-sectional shape is not particularly limited. For example, the length of the light-emitting element LD may be greater than the diameter (or the width of the cross section) of the light-emitting element LD. However, the present disclosure is not limited thereto.

[0065] In the embodiment, the light emitting element LD may have a diameter and a length as small as, for example, micrometer or nanometer. However, the size of the light emitting element LD is not limited thereto. For example, the size of the light emitting element LD may be variously changed according to the design conditions of the light emitting display device to which the light emitting element LD is applied.

[0066] The first conductive type semiconductor layer 11 may include, for example, at least one n-type semiconductor layer. For example, the first conductive type semiconductor layer 11 may include at least one of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may be doped with a first conductive dopant such as Si, Ge, or Sn. However, the material constituting the first conductive type semiconductor layer 11 is not limited thereto. For example, various materials may constitute the first conductive type semiconductor layer 11.

[0067] The active layer 12 may be arranged on the first conductive type semiconductor layer 11 and formed into a single quantum well structure or a multi-quantum well structure. In an embodiment, a cladding layer (not shown) doped with a conductive dopant may be formed in at least one of the upper and lower portions of the active layer 12. In an embodiment, the cladding layer may be formed of an AlGaN layer or an InAlGaN layer. In an embodiment, a material such as AlGaN or AlInGaN may be used to form the active layer 12. However, the present disclosure is not limited thereto, and various materials may constitute the active layer 12.

[0068] When power having a voltage or higher is applied to both end portions of the light emitting element LD, the light emitting element LD can emit light as electron-hole pairs are combined in the active layer 12. By using this principle, the light emission of the light emitting element LD can be controlled so that the light emitting element LD can be used as a light source for the pixel PXL.

[0069] The second conductive type semiconductor layer 13 may be arranged on the active layer 12 and include a semiconductor layer having a type different from that of the first conductive type semiconductor layer 11. In an embodiment, the second conductive type semiconductor layer 13 may include at least one p-type semiconductor layer. For example, the second conductive type semiconductor layer 13 may include at least one of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may be doped with a second conductive dopant such as Mg. However, the material constituting the second conductive type semiconductor layer 13 is not limited thereto. For example, various materials may constitute the second conductive type semiconductor layer 13.

[0070] In an embodiment, the light emitting element LD may further include additional components in addition to the first conductive type semiconductor layer 11, the active layer 12, and the second conductive type semiconductor layer 13 described above. In an embodiment, the light emitting element LD may further include at least one of one or more phosphor layers, one or more active layers, one or more semiconductor layers, and one or more electrode layers arranged at an upper portion or a lower portion of the first conductive type semiconductor layer 11, the active layer 12, and the second conductive type semiconductor layer 13.

[0071] In an embodiment, the light emitting element LD may further include an insulating film 14. In an embodiment, the insulating film 14 may be formed to surround at least a portion of the outer peripheral surface of the active layer 12. In an embodiment, the insulating film 14 may also surround at least a portion of the first conductive type semiconductor layer 11 and the second conductive type semiconductor layer 13.

[0072] In an embodiment, the insulating film 14 may include a transparent insulating material. For example, the insulating film 14 may include silicon oxide (SiO x ) (e.g., SiO2), silicon nitride (SiN x ) (e.g., Si3N4), aluminum oxide (Al x O y ) (e.g., Al2O3), titanium oxide (Ti x O y ) (e.g., TiO2) and hafnium oxide (HfO x ) or at least one other insulating material.

[0073] The insulating film 14 can prevent the active layer 12 of the light emitting element LD from being in contact with the first electrode 21 and the second electrode 22 (see FIG. Figure 13) etc. Therefore, the electrical stability of the light emitting element LD can be ensured.

[0074] The light-emitting element LD can be used as a light source in various types of display devices DD including light-emitting display panels. In an embodiment, at least one light-emitting element LD can be arranged in each pixel region of the light-emitting display panel, and thus, a light-emitting unit of each pixel PXL can be configured. However, the application field of the light-emitting element LD is not limited to the display device DD. For example, the light-emitting element LD can be used in other types of light-emitting devices that require a light source, such as a lighting device.

[0075] The light emitting elements LD may be aligned based on the electric field formed on the base layer BSL, and thus, the display device DD may be manufactured.

[0076] In the following, reference will be made to Figure 3 and Figure 4 An apparatus 1000 for manufacturing a display device DD, which is capable of aligning light emitting elements LD to manufacture the display device DD, will be described.

[0077] Figure 3 is a schematic block diagram illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figure 4 yes Figure 3 Schematic plan view of the device shown in . Figure 3 and Figure 4 The diagram shows a schematic block diagram and arrangement relationship of multiple components of the device 1000. Figure 3 and Figure 4 It may be a diagram schematically illustrating an arrangement relationship of a plurality of components of the device 1000. However, this is merely an embodiment, and the configuration and arrangement relationship of the device 1000 are not limited thereto.

[0078] In the apparatus 1000 according to an embodiment of the present disclosure, ink including a light-emitting element LD and a solvent in which the light-emitting element LD is dispersed can be ejected onto a target substrate, and the light-emitting element LD can be aligned by forming an electric field on the target substrate. In an embodiment, the light-emitting element LD can be mounted on the target substrate by removing at least a portion of the solvent ejected onto the target substrate.

[0079] According to the apparatus 1000 according to an embodiment of the present disclosure, the process of aligning the light emitting element LD and the process of removing at least a portion of the solvent sprayed onto the target substrate can be performed in the same chamber CB (see Figure 4 ) is performed, and the degree of alignment of the light emitting element LD can be improved.

[0080] refer to Figure 3 and Figure 4, the apparatus 1000 according to an embodiment of the present disclosure may include a printing part PA, an alignment part ALA, a transfer part TA, and a heat treatment part HA. However, the present disclosure is not limited thereto.

[0081] The printing section PA may include a printing unit capable of performing a process of converting a solvent SV including the light emitting element LD and the light emitting element LD dispersed therein (see Figure 14 ) of ink I (see Figure 14 ) is sprayed onto the target substrate SUB (see Figure 5 The printing part PA may include an area where a printing process of ejecting ink I onto a target substrate SUB is performed.

[0082] The target substrate SUB may be a member on which the light emitting element LD is arranged to form the display device DD, and may be a member including a pixel circuit, etc. The target substrate SUB may form a base to which the light emitting element LD is supplied. In an embodiment, the target substrate SUB may be a mother substrate, and Figure 1 The target substrate SUB may be a backplane layer.

[0083] The alignment unit ALA may include equipment and areas capable of performing processes for aligning the light-emitting elements LD contained in the solvent SV and removing (e.g., drying) at least a portion of the solvent SV. The alignment unit ALA may include equipment and areas capable of performing processes for simultaneously aligning the light-emitting elements LD ejected from the printing unit PA and removing at least a portion of the solvent SV. The alignment unit ALA may simultaneously perform an alignment operation for aligning the light-emitting elements LD and a drying operation for pre-drying at least a portion of the solvent SV.

[0084] The heat treatment unit HA may be spaced apart from the alignment unit ALA. The heat treatment unit HA may include equipment and an area capable of performing a process of irradiating heat onto the target substrate SUB onto which the ink I is ejected. The heat treatment unit HA may irradiate heat onto the target substrate SUB onto which the ink I is ejected. The heat provided by the heat treatment unit HA may remove another portion of the solvent SV that was not removed from the target substrate SUB.

[0085] The transfer section TA may be disposed between the alignment section ALA and the heat treatment section HA. The transfer section TA may include equipment for transferring the target substrate SUB and an area in which the target substrate SUB is transferred. The transfer section TA may be an area in which the target substrate SUB is moved from the alignment section ALA to the heat treatment section HA after performing a printing process in which the ink I is ejected onto the target substrate SUB.

[0086] The light-emitting elements LD ejected onto the target substrate SUB can be aligned through an alignment process. For example, the alignment process of the light-emitting elements LD can be performed in the alignment section ALA, and the light-emitting elements LD can be aligned on the target substrate SUB. In the embodiment, the alignment process of the light-emitting elements LD is performed only in the alignment section ALA, but the present disclosure is not necessarily limited to this. For example, the alignment process of the light-emitting elements LD can also be performed in at least one of the printing section PA, the heat treatment section HA, and the transfer section TA.

[0087] The apparatus 1000 according to an embodiment of the present disclosure may include an inkjet printing apparatus 300, a heat source part 500, a vacuum pump 600, a stage 110, a heating element 190, and an electric field applying module 100. The apparatus 1000 may further include a transfer unit 700 and a heat treatment apparatus 900.

[0088] The inkjet printing apparatus 300 may be disposed in the printing portion PA. The inkjet printing apparatus 300 may be disposed in the printing portion PA to provide (eg, eject) ink I onto a target substrate SUB.

[0089] In embodiments, the inkjet printing apparatus 300 and the alignment unit ALA may be arranged in different areas. For example, the inkjet printing apparatus 300 may be arranged outside the chamber CB in which the alignment unit ALA is arranged. The chamber CB may be the area in which the alignment process of the light-emitting elements LD is performed, and may also be the area in which at least one component of the apparatus 1000 is arranged. The chamber CB may provide a space for aligning the light-emitting elements LD and a space for drying the solvent SV. The chamber CB may have a circular structure, a quadrilateral structure, or various other shapes.

[0090] When the inkjet printing apparatus 300 is disposed outside the chamber CB, the printing part PA may be disposed outside the chamber CB, and after the ink I is printed on the target substrate SUB outside the chamber CB, the target substrate SUB may be moved to the alignment part ALA. However, the present disclosure is not limited thereto.

[0091] In an embodiment, the inkjet printing apparatus 300 and the alignment unit ALA may be arranged in the same area. For example, the inkjet printing apparatus 300 may be arranged inside a chamber CB in which the alignment unit ALA is arranged. The printing unit PA may be arranged inside the chamber CB and may align the light emitting elements LD after the ink I is printed on the target substrate SUB inside the chamber CB.

[0092] The transfer unit 700 may be disposed in the transfer part TA and may move the target substrate SUB on which the printing process and the alignment process are completed from the alignment part ALA to the heat treatment part HA.

[0093] The heat treatment device 900 may be disposed in the heat treatment part HA. The heat treatment device 900 may generate heat on the target substrate SUB, thereby removing the solvent SV remaining on the target substrate SUB. The solvent SV sprayed onto the target substrate SUB may be removed by the heat energy generated by the heat treatment device 900.

[0094] The positions of the transfer part TA and the heat treatment part HA in the apparatus 1000 are not limited to a specific embodiment.

[0095] As described above, in the device 1000, after the ink I is ejected onto the target substrate SUB, the target substrate SUB can be moved to the alignment part ALA using the inkjet printing device 300 arranged in the printing part PA, and an alignment process of aligning the light emitting element LD contained in the ink I ejected onto the target substrate SUB can be performed in the alignment part ALA.

[0096] The alignment process of the light emitting element LD may be performed using the stage 110, the heating element 190, the electric field applying module 100, the heat source part 500, and the vacuum pump 600. The display device DD according to the present disclosure may be characterized in that the light emitting element LD may be aligned by drying at least a portion of the solvent SV while forming an electric field on the target substrate SUB in the same chamber CB.

[0097] The stage 110 may provide a space in which a target substrate SUB is disposed. For example, the target substrate SUB may be disposed on the stage 110. In an embodiment, the stage 110 may include an inner space in which a heating element 190 is disposed.

[0098] The heating element 190 may be arranged at least on one side of the workbench 110. For example, the heating element 190 may be arranged in the inner space of the workbench 110 so as to overlap with the workbench 110 in a plan view. However, the present disclosure is not limited thereto. In another embodiment, the heating element 190 may be arranged outside the workbench 110. For example, the heating element 190 may be arranged on the top of the workbench 110. In another embodiment, the heating element 190 may be arranged on the side surface of the workbench 110 or at the periphery of the workbench 110. The position of the heating element 190 may be changed in various ways. However, for convenience, an embodiment in which the heating element 190 is arranged inside the workbench 110 is illustrated in the accompanying drawings.

[0099] The heating element 190 may include a heating material (e.g., a heat source). For example, the heating element 190 may include a hot plate as a heat source. The heating element 190 may radiate heat toward the workbench 110. The heating element 190 may adjust (or control) the temperature of the workbench 110 when performing the alignment process. For example, the heating element 190 may include a heat source having a temperature in the range of approximately 20° C. to approximately 60° C., and the workbench 110 may receive the heat transferred from the heating element 190, so that the temperature of the workbench 110 may be adjusted in the range of approximately 20° C. to approximately 60° C.

[0100] In a plan view, the area of ​​the heating element 190 may correspond to the area of ​​the target substrate SUB. For example, the area of ​​the top surface of the heating element 190 and the area of ​​the bottom surface of the target substrate SUB may be equal to each other. However, the present disclosure is not limited thereto.

[0101] The heating element 190 can adjust the temperature of the target substrate SUB by adjusting the temperature of the workbench 110. The heating element 190 can adjust the temperature of the target substrate SUB, so that the temperature of the solvent SV sprayed onto the target substrate SUB can be indirectly adjusted. The viscosity of the solvent SV can change according to the temperature of the solvent SV. Therefore, the temperature of the solvent SV can be indirectly adjusted by adjusting the temperature of the target substrate SUB using the heating element 190, and the viscosity of the solvent SV can be controlled. The light-emitting element LD placed in the electric field can be rotated or moved more easily as the viscosity of the solvent SV decreases, so that the alignment and orientation of the light-emitting element LD can be improved.

[0102] The electric field applying module 100 can be arranged at one side of the workbench 110 (e.g., on top of an end portion of the workbench 110) to form an electric field on the target substrate SUB during the alignment process. The electric field formed by the electric field applying module 100 can be applied to the ink I ejected onto the target substrate SUB. When the light-emitting elements LD contained in the ink I placed in the electric field are applied with power, the orientation direction of the light-emitting elements LD can be controlled. Therefore, the light-emitting elements LD can be aligned in a single direction on the target substrate SUB.

[0103] The heat source part 500 may apply heat to the ink I ejected onto the target substrate SUB and dry at least a portion of the solvent SV, thereby improving fixation of the light emitting element LD on the target substrate SUB.

[0104] The vacuum pump 600 may control the pressure of the region where the alignment process is performed when the alignment process is performed. For example, the vacuum pump 600 may be connected to the chamber CB (see FIG. Figure 8). The vacuum pump 600 can control the internal pressure of the chamber CB. For example, the vacuum pump 600 can form a reduced pressure atmosphere in the chamber CB so that the internal space of the chamber CB has a vacuum state. The vacuum pump 600 can reduce the pressure in the chamber CB.

[0105] In an embodiment, the vacuum pump 600 may be connected to the chamber CB via an exhaust line, and at least one of a pressure control valve and a flow control valve may be installed on the exhaust line. When the vacuum pump 600 exhausts gas, the interior space of the chamber CB may form a vacuum state.

[0106] The vacuum pump 600 can control the pressure (or form a vacuum) in the chamber CB, thereby controlling the fixation of the light-emitting element LD on the substrate SUB. For example, the vacuum pump 600 can form a vacuum in the chamber CB, thereby lowering the evaporation point of the solvent SV. As the evaporation point of the solvent SV is lowered, the solvent SV can evaporate more easily, and at least a portion of the solvent SV can be dried.

[0107] Figure 4 Illustrated is a schematic plan view in which the configuration of the device 1000 according to an embodiment of the present disclosure is viewed from the top. Figure 4 is a diagram for describing an arrangement relationship or operation of a plurality of components included in the device 1000 according to an embodiment, and the structure and arrangement of the device 1000 are not limited to Figure 4 In another embodiment, the device 1000 may include additional components and have Figure 4 In the following, reference will be made to other figures in conjunction with Figure 4 The configuration and operation of the device 1000 are described in detail.

[0108] Figure 5 is a schematic cross-sectional view illustrating the operation of the inkjet printing apparatus according to an embodiment of the present disclosure.

[0109] refer to Figure 5 , the inkjet printing apparatus 300 may eject the ink I onto the top of the target substrate SUB while moving in parallel with the plane on which the target substrate SUB is arranged. For example, the inkjet printing apparatus 300 may eject the ink I onto the top of the target substrate SUB while moving in one direction (e.g., the first direction DR1 or the second direction DR2), the plane on which the target substrate SUB is arranged extending in the one direction.

[0110] In one embodiment, as described above, the inkjet printing apparatus 300 may be disposed outside the chamber CB to which the vacuum pump 600 is connected, and the printing process may be performed outside the chamber CB. However, the present disclosure is not limited thereto. In another embodiment, the inkjet printing apparatus 300 may be disposed inside the chamber CB to which the vacuum pump 600 is connected, and the printing process may be performed inside the chamber CB.

[0111] Figure 6 and Figure 7 is a schematic cross-sectional view illustrating the operation of the electric field applying module according to an embodiment of the present disclosure. Figure 6 is a schematic cross-sectional view illustrating a first state in which an electric field is not formed on the target substrate SUB. Figure 7 is a schematic cross-sectional view illustrating a second state in which an electric field is formed on the target substrate SUB. Figure 6 and Figure 7 In the figure, the configuration of the heat source part 500 and the vacuum pump 600 is not shown to illustrate the operation of the electric field applying module 100. Figure 8 and Figure 9 The operations of the heat source part 500 and the vacuum pump 600 are described.

[0112] refer to Figure 6 and Figure 7 The work stage 110 may provide a space in which the target substrate SUB is arranged. The work stage 110 may support components included in the electric field applying module 100.

[0113] In a plan view, the overall shape of the workbench 110 may correspond to the shape of the target substrate SUB. For example, if the target substrate SUB has a rectangular shape in a plan view, the workbench 110 may have a rectangular shape. If the target substrate SUB has a circular shape in a plan view, the workbench 110 may have a circular shape. However, the present disclosure is not limited thereto.

[0114] The electric field applying module 100 may be arranged at one side of the workbench 110. For example, the electric field applying module 100 may be arranged on the workbench 110. The electric field applying module 100 may include a probe support 130 and a probe unit 150. The probe support 130 and the probe unit 150 may be arranged on the workbench 110.

[0115] The probe support 130 can provide a space in which the probe unit 150 is arranged on the workbench 110. For example, the probe support 130 can be arranged at least one side on the workbench 110 and extend in the direction in which the side portion extends. In an embodiment, the probe support 130 can be arranged on one side and the other side (for example, the upper side and the lower side in the plan view) on the second direction DR2 on the workbench 110, and extend in the first direction DR1. However, the present disclosure is not limited thereto, and the structure of the probe support 130 can be changed according to the number of probe units 150 included in the electric field application module 100, the arrangement or structure of the probe units 150, etc.

[0116] The probe unit 150 may be disposed on the probe support 130. The probe unit 150 may form an electric field on a target substrate SUB provided on the stage 110. Similar to the probe support 130, the probe unit 150 may extend in a direction, for example, a first direction DR1.

[0117] The probe unit 150 may include a probe driver 153 , a probe fixture 151 disposed on the probe driver 153 so that an electrical signal is transferred to the probe fixture 151 , and a probe pad 158 connected to the probe fixture 151 to transmit the electrical signal to the target substrate SUB.

[0118] The probe driver 153 may be disposed on the probe support 130 to move the probe fixture 151 and the probe pad 158. For example, the probe driver 153 may move the probe fixture 151 in a horizontal direction and a vertical direction (e.g., a horizontal direction (e.g., a second direction DR2 (or a first direction DR1)) which is a direction extending parallel to a plane on which the target substrate SUB is disposed, and a vertical direction (e.g., a third direction DR3) which is perpendicular to the plane on which the target substrate SUB is disposed). The probe pad 158 may be connected to or separated from the target substrate SUB by driving of the probe driver 153.

[0119] The probe pad 158 can form an electric field on the target substrate SUB by the electric signal transmitted from the probe fixture 151. The probe pad 158 can be connected to the target substrate SUB to transmit the electric signal to the target substrate SUB, thereby forming an electric field on the target substrate SUB. In an embodiment, the probe pad 158 can contact an electrode or a power pad of the target substrate SUB, and the electric signal of the probe fixture 151 can be transmitted to the electrode or the power pad. The electric signal transmitted to the target substrate SUB can form an electric field on the target substrate SUB. However, the present disclosure is not limited thereto, and the probe pad 158 can be a member that forms an electric field by the electric signal transmitted from the probe fixture 151 without contacting the target substrate SUB.

[0120] exist Figure 6 In the first state, the probe unit 150 may be arranged on the probe support 130 to be spaced apart from the target substrate SUB. The probe driver 153 of the probe unit 150 may be driven in the second direction DR2 (or the first direction DR1) as the horizontal direction and the third direction DR3 as the vertical direction, thereby allowing the probe pad 158 to be spaced apart from the target substrate SUB. The probe pad 158 may be spaced apart from the target substrate SUB so that no electric field is formed on the target substrate SUB.

[0121] exist Figure 7 In the second state, the probe driver 153 of the probe unit 150 can be driven to electrically connect the probe pad 158 to the target substrate SUB. The probe driver 153 of the probe unit 150 can be driven in the second direction DR2 (or the first direction DR1) as the horizontal direction and the third direction DR3 as the vertical direction, thereby allowing the probe pad 158 to contact the target substrate SUB. The probe fixture 151 of the probe unit 150 can transmit an electrical signal to the probe pad 158, and an electric field IEL can be formed on the target substrate SUB through the probe pad 158.

[0122] In the accompanying drawings, two probe units 150 are illustrated as being arranged on the side of the workbench 110 and connected to the target substrate SUB at the same time. However, the present disclosure is not limited thereto. In another embodiment, a plurality of probe units 150 may be driven individually. For example, a plurality of probe units 150 may be driven simultaneously to form an electric field IEL on the target substrate SUB, or may be driven in sequence to form an electric field IEL on the target substrate SUB.

[0123] The electric field applying module 100 of the device 1000 can perform an operation of forming an electric field IEL on the target substrate SUB by driving the probe driver 153 when performing an alignment process of the light-emitting element LD after the ink I is ejected onto the target substrate SUB, and separate the probe pad 158 from the target substrate SUB by re-driving the probe driver 153 in a process after the alignment process.

[0124] Figure 8 is a schematic cross-sectional view illustrating the operation of a heat source part according to an embodiment of the present disclosure. Figure 9 is a schematic plan view of a heat source portion according to an embodiment of the present disclosure. Figure 9 1 is a plan view illustrating a schematic arrangement of the heat source part 500 , the stage 110 , and the target substrate SUB.

[0125] refer to Figure 8 and Figure 9The heat source unit 500 may be disposed in the chamber CB. The heat source unit 500 may be disposed on the workbench 110 and the target substrate SUB. The heat source unit 500 may be disposed on the target substrate SUB on which the electric field is formed and apply heat to the target substrate SUB. The heat source unit 500 may include a heat source and apply thermal energy to the target substrate SUB.

[0126] In an embodiment, the heat source part 500 may include a hot plate, an oven, a high voltage direct current (HVDC) irradiation device, an infrared radiation (IR) irradiation device, etc. However, the present disclosure is not limited thereto.

[0127] The heat source portion 500 may include a rod-shaped heat source. For example, the heat source portion 500 may have a rod shape extending in the first direction DR1. For example, in a plan view, the heat source portion 500 may have a rectangular shape having short sides in the second direction DR2 and long sides in the first direction DR1. However, the present disclosure is not limited thereto, and in a plan view, the heat source portion 500 may have a quadrilateral shape other than a rectangular shape.

[0128] In an embodiment, the heat source part 500 may include a rod-shaped heating lamp. For example, the heat source part 500 may include a lamp having a filament inside a rod-shaped tube having a vacuum state or having gas injected therein.

[0129] The heat source of the heat source part 500 may have a temperature in the range of about 60° C. to about 200° C. Since the heat source of the heat source part 500 has a temperature in the range of about 60° C. to about 200° C., the solvent SV may be effectively evaporated or dried.

[0130] The heat source portion 500 can move on the target substrate SUB. The heat source portion 500 can move parallel to the plane on which the target substrate SUB is arranged. The heat source portion 500 can move in a direction (e.g., a second direction DR2), and the plane on which the target substrate SUB is arranged extends in this direction. For example, the heat source portion 500 can move in a direction other than the direction on which the heat source portion 500 extends (e.g., a first direction DR1). For example, the heat source portion 500 can move in a direction (e.g., a second direction DR2) perpendicular to the direction (e.g., the first direction DR1) on which the heat source portion 500 extends. However, the present disclosure is not limited thereto. The heat source portion 500 can move in the first direction DR1 and in a direction (e.g., a third direction DR3) perpendicular to the plane on which the target substrate SUB is arranged. Hereinafter, for convenience, an embodiment in which the heat source portion 500 moves in the second direction DR2 among multiple directions will be described, and the plane on which the target substrate SUB is arranged extends in these multiple directions.

[0131] The heat source part 500 may reciprocate parallel to a plane on which the target substrate SUB is disposed. For example, the heat source part 500 may reciprocate in a direction (eg, a second direction DR2) parallel to a plane on which the target substrate SUB is disposed.

[0132] At a first time T1, the heat source part 500 may be aligned with the stage 110 or a first side (eg, Figure 8 and may not overlap with the stage 110 or the second side of the target substrate SUB (eg, Figure 8 The right end part of the ) overlaps.

[0133] During a period between the first time T1 and a second time T2 after the first time T1, the heat source portion 500 may move on the work stage 110 (or the target substrate SUB). After the first time T1, the heat source portion 500 may move in a direction (e.g., a second direction DR2) parallel to the plane on which the target substrate SUB is arranged. At the second time T2, the heat source portion 500 may not overlap with a first side (e.g., a left end portion) of the work stage 110 or the target substrate SUB in a plan view, and may overlap with a second side (e.g., a right end portion) of the work stage 110 or the target substrate SUB in a plan view.

[0134] Since the heat source part 500 includes a rod-shaped heat source and moves on the target substrate SUB, the solvent SV disposed on the target substrate SUB can be locally heated. Therefore, the heat source part 500 can effectively remove the solvent SV and minimize temperature changes of the stage 100 and the target substrate SUB.

[0135] If the temperature of the work stage 110 increases excessively (for example, exceeding 60° C.), the solvent SV may be dried before the light emitting element LD is properly aligned, and therefore, the light emitting element LD may not rotate in the solvent SV, and the light emitting element LD may not be properly aligned. In the apparatus 1000 according to the present disclosure, the heat source part 500 can locally heat the target substrate SUB, thereby drying the solvent SV at an appropriate time without affecting the temperature of the work stage 110 and the target substrate SUB.

[0136] Figure 10 and Figure 11 is a schematic cross-sectional view illustrating an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figure 10 and Figure 11 The devices 1000 and 1000 shown in FIG. Figure 8 The apparatus 1000 shown in FIG. 1 may be different at least in that the heat source part 500 is formed in plural.

[0137] refer to Figure 10 , the heat source part 500 may include a first heat source part 510 and a second heat source part 520 .

[0138] The first heat source portion 510 and the second heat source portion 520 may not overlap each other in a plan view. The first heat source portion 510 and the second heat source portion 520 may be arranged on the work table 110. For example, the first heat source portion 510 may be arranged to overlap with a first side (e.g., a left end portion) of the work table 110 or the target substrate SUB in a plan view, and the second heat source portion 520 may be arranged to overlap with a second side (e.g., a right end portion) of the work table 110 or the target substrate SUB in a plan view.

[0139] The first heat source part 510 and the second heat source part 520 may move on the target substrate SUB. The first heat source part 510 and the second heat source part 520 may move on the plane on which the target substrate SUB is arranged. The first heat source part 510 and the second heat source part 520 may move in a direction parallel to the plane on which the target substrate SUB is arranged (e.g., a second direction DR2).

[0140] The first heat source part 510 and the second heat source part 520 may reciprocate on the plane on which the target substrate SUB is disposed. For example, the first heat source part 510 and the second heat source part 520 may reciprocate in a direction parallel to the plane on which the target substrate SUB is disposed (eg, the second direction DR2).

[0141] The first heat source part 510 and the second heat source part 520 may move in different directions on a line during the same period. For example, when the first heat source part 510 moves in the second direction DR2, the second heat source part 520 may move in a direction opposite to the second direction DR2.

[0142] At the first moment T1, the first heat source part 510 may overlap with a first side (e.g., a left end portion) of the work table 110 in a plan view, and the second heat source part 520 may overlap with a second side (e.g., a right end portion) of the work table 110 in a plan view. At the first moment T1, the first heat source part 510 and the second heat source part 520 may not overlap with a third side (e.g., a central area) of the work table 110 in a plan view. In a plan view, when the work table 110 is divided into three parts along the second direction DR2, the central area of ​​the work table 110 may be an area corresponding to the central part.

[0143] During a period between the first moment T1 and a second moment T2 after the first moment T1, the first heat source portion 510 and the second heat source portion 520 may move on the workbench 110 (or the target substrate SUB). After the first moment T1, each of the first heat source portion 510 and the second heat source portion 520 may move toward an area that overlaps with a third side (e.g., a center area) of the workbench 110 in a plan view. For example, after the first moment T1, the first heat source portion 510 may move in the second direction DR2, and the second heat source portion 520 may move in a direction opposite to the second direction DR2.

[0144] At the second moment T2, the first heat source portion 510 may not overlap with the first side (e.g., the left end portion) of the workbench 110 in a plan view, and the second heat source portion 520 may not overlap with the second side (e.g., the right end portion) of the workbench 110 in a plan view.

[0145] refer to Figure 11 In an embodiment, the first heat source part 510' and the second heat source part 520' may move in the same direction on a line within the same period of time. For example, the first heat source part 510' and the second heat source part 520' may move in the second direction DR2.

[0146] The first heat source portion 510' can be arranged to overlap with a first side (e.g., a left end portion) of the workbench 110 or the target substrate SUB in a plan view, and the second heat source portion 520' can be arranged to overlap with a third side (e.g., a center area) of the workbench 110 or the target substrate SUB in a plan view.

[0147] At the first time T1, the first heat source part 510' may overlap with a first side (e.g., a left end portion) of the work table 110 in a plan view, and the second heat source part 520' may overlap with a third side (e.g., a center area) of the work table 110 in a plan view. However, the present disclosure is not limited thereto.

[0148] During a period between the first moment T1 and a second moment T2 after the first moment T1, the first heat source portion 510' and the second heat source portion 520' may move on the workbench 110 (or the target substrate SUB). The first heat source portion 510 may move along the second direction DR2 toward an area overlapping with a third side (e.g., a central area) of the workbench 110 in a plan view. At the second moment T2, the first heat source portion 510' may not overlap with the first side (e.g., a left end portion) of the workbench 110 in a plan view, and may overlap with the third side (e.g., the central area) of the workbench 110 in a plan view.

[0149] At the second moment T2, the second heat source part 520' may move along the second direction DR2 toward an area that overlaps with the second side (e.g., the right end portion) of the work table 110 in a plan view. At the second moment T2, the second heat source part 520' may not overlap with the third side (e.g., the center region) of the work table 110 in a plan view, and may overlap with the second side (e.g., the right end portion) of the work table 110 in a plan view.

[0150] In the following, reference will be made to Figures 12 to 15 A method of manufacturing the display device DD is described. Figure 12 is a flowchart illustrating a method of manufacturing a display device. Figures 13 to 15 is a schematic cross-sectional view illustrating a process of manufacturing a display device.

[0151] refer to Figure 12 The method of manufacturing a display device DD may include ejecting ink including a light emitting element and a solvent onto a target substrate ( S100 ), aligning the light emitting element on the target substrate ( S200 ), and drying at least a portion of the solvent ( S300 ).

[0152] refer to Figure 13 Before step S100 of ejecting the ink including the light emitting element and the solvent onto the target substrate, the target substrate SUB may be prepared. In an embodiment, a pixel circuit layer including a pixel circuit for driving the light emitting element LD may be formed on the target substrate SUB. The pixel circuit layer may include a plurality of conductive layers and an insulating layer arranged between the plurality of conductive layers. For example, Figure 13 As shown in FIG, a first electrode 21 and a second electrode 22 for driving the light emitting element LD may be formed on a target substrate SUB.

[0153] In an embodiment, the first electrode 21 may be an anode electrode, and the second electrode 22 may be a cathode electrode. However, the present disclosure is not limited thereto. In another embodiment, the first electrode 21 may be a cathode electrode, and the second electrode 22 may be an anode electrode.

[0154] refer to Figure 14 The step S100 of ejecting ink including the light emitting element and the solvent onto the target substrate may include the step of ejecting the ink I through the inkjet printing device 300 .

[0155] The ink I may include light emitting elements LD and a solvent SV. The light emitting elements LD may be dispersed in the solvent SV.

[0156] The ink I may be discharged through the nozzles NZ of the inkjet printing apparatus 300 and sprayed onto the first and second electrodes 21 and 22 disposed on the target substrate SUB.

[0157] In an embodiment, step S100 of ejecting ink including light emitting elements and solvent onto a target substrate may be performed together with step S200 of aligning the light emitting elements on the target substrate and step S300 of drying at least a portion of the solvent in the same chamber CB or in a different space.

[0158] refer to Figure 15 , after step S100 of ejecting ink including the light emitting element and the solvent onto the target substrate, step S200 of aligning the light emitting element on the target substrate and step S300 of drying at least a portion of the solvent may be performed.

[0159] The step S200 of aligning the light emitting element on the target substrate and the step S300 of drying at least a portion of the solvent may be performed in the same chamber CB.

[0160] The step S200 of aligning the light emitting elements on the target substrate may include forming an electric field IEL on the target substrate SUB. The light emitting elements LD may be aligned by the electric field IEL. For example, the light emitting elements LD may be arranged between the first electrode 21 and the second electrode 22 by dielectrophoretic force.

[0161] As described above, the electric field IEL can be formed on the target substrate SUB using the probe unit 150. The probe unit 150 can apply an electric signal to the first electrode 21 and the second electrode 22. The probe unit 150 can be connected to a pad (not shown) provided on the target substrate SUB and apply an electric signal to the first electrode 21 and the second electrode 22 connected to the pad. When the probe unit 150 applies an electric signal to the first electrode 21 and the second electrode 22, the electric field IEL can be formed between the first electrode 21 and the second electrode 22. The dielectrophoretic force caused by the electric field IEL can act on the light-emitting element LD. By the dielectrophoretic force, when the orientation direction and position of the light-emitting element LD change, the light-emitting element LD can be arranged between the first electrode 21 and the second electrode 22.

[0162] The step S200 of aligning the light emitting element on the target substrate may include a step of controlling the temperature of the target substrate SUB. The step of controlling the temperature of the target substrate SUB may be performed simultaneously with the step of forming the electric field IEL on the target substrate SUB.

[0163] The step of controlling the temperature of the target substrate SUB may include applying heat to the target substrate SUB using a heating element 190. The heating element 190 can control the temperature of the target substrate SUB by applying heat to the target substrate SUB when aligning the light-emitting element LD. The heating element 190 can also control the temperature of the solvent SV. When the temperature of the solvent SV is controlled, the heating element 190 can facilitate movement or rotation of the light-emitting element LD, thereby improving the alignment of the light-emitting element LD.

[0164] The heating element 190 can increase the temperature of the solvent SV so that the light emitting element LD can be easily moved or rotated, and prevent the temperature of the solvent SV from increasing to a specific temperature range or higher. For example, the heating element 190 can control the workbench 110 to have a temperature within a range of approximately 20°C to approximately 60°C. Therefore, the heating element 190 can prevent the solvent SV from being completely dried before the light emitting element LD is aligned.

[0165] After aligning the light emitting element LD by forming the electric field IEL using the probe unit 150 , step S300 of drying at least a portion of the solvent may be performed.

[0166] The step S300 of drying at least a portion of the solvent may include moving the heat source part 500 on the target substrate SUB. In the step of moving the heat source part 500 on the target substrate SUB, the heat source part 500 may move in a direction parallel to the plane on which the target substrate SUB is arranged (e.g., the second direction DR2). Hereinafter, the operation of the heat source part 500 has been described above, and therefore the description of the overlapping part will be omitted.

[0167] The apparatus 1000 can locally heat the solvent SV. Therefore, the heat source part 500 can minimize temperature changes of the stage 110 and the target substrate SUB and effectively dry the solvent SV at an appropriate time.

[0168] When performing step S300 of drying at least a portion of the solvent, the vacuum of the chamber CB may be maintained by the vacuum pump 600. Step S300 of drying at least a portion of the solvent may include a step of forming the internal space of the chamber CB into a vacuum state when the vacuum pump 600 is connected to the chamber CB. When performing step S300 of drying at least a portion of the solvent, the vacuum pump 600 may reduce the pressure in the chamber CB, thereby forming the internal space of the chamber CB into a vacuum state.

[0169] The evaporation point of the solvent SV may be lowered by the vacuum pump 600 , and since the solvent SV is more easily evaporated, at least a portion of the solvent SV may be dried.

[0170] In an embodiment, after performing step S300 of drying at least a portion of the solvent, the target substrate SUB may be further moved to the heat treatment part HA through the transfer part TA, and additional components such as an insulating layer may be further manufactured after the solvent SV is dried.

[0171] According to the present disclosure, an apparatus for manufacturing a display device and a method for manufacturing a display device can improve the degree of alignment of light emitting elements.

[0172] The above description is an example of the technical features of the present disclosure, and those skilled in the art will be able to make various modifications and changes. Therefore, the multiple embodiments of the present disclosure described above can be implemented individually or in combination with each other.

[0173] Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical spirit of this disclosure, but are intended to describe the technical spirit of this disclosure, and the scope of the technical spirit of this disclosure is not limited by these embodiments. The scope of protection of this disclosure should be interpreted by the accompanying claims, and should be interpreted as all technical spirits within the scope of equivalents are included in the scope of this disclosure.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: chamber; a workbench supporting a target substrate; an electric field applying module, the electric field applying module being arranged at one side of the workbench; a heating element, said heating element overlapping said work table in plan view; a heat source portion that moves in a direction parallel to a plane on which the target substrate is arranged; as well as A vacuum pump is connected to the chamber.

2. The apparatus for manufacturing a display device according to claim 1, further comprising: a printing unit that ejects ink including at least one light-emitting element onto the target substrate, The electric field applying module forms an electric field on the target substrate so that the at least one light emitting element is aligned on the target substrate.

3. The apparatus for manufacturing a display device according to claim 1, wherein The workbench includes an interior space, and the heating element is arranged in the interior space.

4. The apparatus for manufacturing a display device according to claim 3, wherein: The heating element comprises a hot plate.

5. The apparatus for manufacturing a display device according to claim 3, wherein: The heating element comprises a heat source having a temperature in the range of 20°C to 60°C.

6. The apparatus for manufacturing a display device according to claim 1, wherein The heat source portion includes a rod-shaped heat source extending in a first direction, and The heat source portion moves in a direction other than the first direction.

7. The apparatus for manufacturing a display device according to claim 1, wherein The heat source moves on the workbench between a first moment and a second moment after the first moment, and At the first moment, the heat source portion overlaps with a first side of the work table in the plan view, and the heat source portion does not overlap with a second side of the work table in the plan view.

8. The apparatus for manufacturing a display device according to claim 7, wherein: At the second moment, the heat source portion does not overlap with the first side of the work table in the plan view, and the heat source portion overlaps with the second side of the work table in the plan view.

9. The apparatus for manufacturing a display device according to claim 1, wherein: The heat source portion includes a first heat source portion and a second heat source portion, The first heat source and the second heat source move on the workbench between a first moment and a second moment after the first moment. At the first moment, the first heat source portion overlaps with the first side of the workbench in the plan view, and At the first moment, the second heat source portion overlaps with the second side of the workbench in the plan view.

10. The apparatus for manufacturing a display device according to claim 1, wherein The heat source portion includes a first heat source portion and a second heat source portion, The first heat source and the second heat source move on the workbench between a first moment and a second moment after the first moment. At the first moment, the first heat source portion overlaps with the end portion of the workbench in the plan view, At the first moment, the second heat source portion overlaps with the center area of ​​the workbench in the plan view, and Between the first time and the second time, the first heat source portion and the second heat source portion move in the same direction.

11. The apparatus for manufacturing a display device according to claim 1, wherein The heat source portion is disposed in the chamber.

12. The apparatus for manufacturing a display device according to claim 1, wherein The heat source part includes a heat source having a temperature in a range of 60°C to 200°C.

13. The apparatus for manufacturing a display device according to claim 1, wherein The vacuum pump is connected to the chamber via an exhaust line, At least one of a pressure control valve and a flow control valve is installed on the exhaust line, and The vacuum pump forms a vacuum pressure atmosphere in the chamber.

14. The apparatus for manufacturing a display device according to claim 1, wherein The electric field applying module includes a probe support and a probe unit arranged on the workbench, The probe unit comprises: Probe driver; a probe fixture disposed on the probe driver such that an electrical signal is transferred to the probe fixture; and a probe pad that transmits the electrical signal to the target substrate, and The probe driver moves the probe fixture in horizontal and vertical directions.

15. The apparatus for manufacturing a display device according to claim 2, wherein: The ink also includes a solvent.

16. A method for manufacturing a display device, the method comprising: ejecting an ink comprising at least one light emitting element and a solvent onto a target substrate; aligning the at least one light-emitting element on the target substrate; as well as drying at least a portion of the solvent, Wherein, aligning the at least one light emitting element comprises: forming an electric field on the target substrate; and controlling the temperature of the target substrate, Drying the at least a portion of the solvent includes: moving a heat source portion over the target substrate, and Aligning the at least one light emitting element and drying the at least a portion of the solvent are performed in a chamber.

17. The method for manufacturing a display device according to claim 16, wherein: forming the electric field on the target substrate and controlling the temperature of the target substrate are performed simultaneously, and Controlling the temperature of the target substrate includes applying heat to the target substrate using a heating element.

18. The method for manufacturing a display device according to claim 16, wherein: Moving the heat source portion includes: allowing the heat source portion to reciprocate in a direction parallel to a plane on which the target substrate is arranged, and The heat source portion includes a rod-shaped heat source extending in a first direction.

19. The method for manufacturing a display device according to claim 16, wherein: Drying the at least a portion of the solvent includes forming an inner space of the chamber into a vacuum state when a vacuum pump is connected to the chamber.

20. The method for manufacturing a display device according to claim 16, wherein: Forming the electric field on the target substrate includes: forming the electric field using a probe unit, The probe unit comprises: Probe driver; a probe fixture disposed on the probe driver such that an electrical signal is transferred to the probe fixture; and a probe pad that transmits the electrical signal to the target substrate, and The probe driver moves the probe fixture in horizontal and vertical directions.

Images