Display device

Abstract

A display device is provided. The display device includes a display panel including pixels, a driving chip electrically connected to the display panel, a cover film covering the driving chip, and a heat dissipation member configured to dissipate heat generated by the driving chip, in which the heat dissipation member overlaps the cover film in a planar view, and includes a transition material having a glass transition temperature less than or equal to a heat generation temperature of the driver chip.

Description

Technical Field

[0001] The present invention relates to display devices, and in particular to display devices that provide visual information. Background Art

[0002] As information technology develops, the importance of display devices as a connecting medium between users and information has been emphasized.

[0003] The display device includes various components that are driven in response to electrical signals, wherein the components may generate heat during a driving process and the heat generated by the components may affect performance of the display device. Summary of the Invention

[0004] The embodiment provides a display device with improved heat dissipation.

[0005] Additional features of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

[0006] In an embodiment, a display device may include a display panel including pixels, a driver chip electrically connected to the display panel, a cover film covering the driver chip, and a heat dissipation member overlapping the cover film in a plan view, wherein the heat dissipation member is configured to dissipate heat generated by the driver chip and includes a transition material having a glass transition temperature (Tg) less than or equal to a heat generation temperature of the driver chip.

[0007] In an embodiment, the transition material can maintain a solid phase at the heating temperature of the driver chip.

[0008] In an embodiment, a ratio of the volume of the transition material to the total volume of the heat dissipation member may be about 100%.

[0009] In an embodiment, the glass transition temperature of the transition material may be in a range from about 25 degrees Celsius to about 80 degrees Celsius.

[0010] In an embodiment, the modulus of the heat dissipation member may be about 100 MPa or greater.

[0011] In an embodiment, the heat dissipation member may be directly disposed on one surface of the cover film.

[0012] In an embodiment, the heat dissipation member may be disposed adjacent to the driving chip.

[0013] In an embodiment, at least a portion of the cover film may be spaced apart from a side of the display panel to define an air gap between the cover film and the display panel, wherein a portion of the heat dissipation member may be positioned within the air gap.

[0014] In an embodiment, the display panel may include a first region in which pixels are disposed, a bending region bent relative to a bending axis, and a second region spaced apart from the first region with the bending region interposed therebetween. The cover film and the heat dissipation member may be disposed in the second region.

[0015] In an embodiment, the display device may further include a bending protection layer disposed in the bending area of ​​the display panel, and the heat dissipation member may completely cover the bending protection layer.

[0016] In an embodiment, the transition material may include at least one of an acrylic resin and an epoxy resin.

[0017] In embodiments, the acrylic resin may be a polymer derived from a resin composition including a (meth)acrylate monomer, a (meth)acrylate oligomer, and a photoinitiator.

[0018] In embodiments, a homopolymer formed from a (meth)acrylate monomer may have a glass transition temperature of about 100 degrees Celsius or greater.

[0019] In embodiments, the (meth)acrylate monomer may be included in an amount of about 20 parts by weight or more based on 100 parts by weight of the total resin composition.

[0020] In embodiments, the epoxy resin may be a polymer derived from a resin composition including an epoxy monomer and a photoinitiator.

[0021] In an embodiment, a display device may include a display panel including pixels, a metal plate disposed under the display panel, a heat source disposed under the metal plate, and a heat dissipation member disposed between the metal plate and the heat source, wherein the heat dissipation member is configured to dissipate heat generated by the heat source and includes a transition material having a glass transition temperature (Tg) less than or equal to a heat generation temperature of the heat source.

[0022] In an embodiment, the transition material can remain in a solid phase at the heat generation temperature of the heat source.

[0023] In an embodiment, a ratio of the volume of the transition material to the total volume of the heat dissipation member may be about 100%.

[0024] In an embodiment, the glass transition temperature of the transition material may be in a range from about 25 degrees Celsius to about 80 degrees Celsius.

[0025] In an embodiment, the modulus of the heat dissipation member may be about 100 MPa or greater.

[0026] In an embodiment, the heat dissipation member may overlap with the heat source in a plan view.

[0027] In an embodiment, the heat dissipation member may be directly provided on one surface of the metal plate.

[0028] In an embodiment, the heat dissipation member may include a transition material having a glass transition temperature less than or equal to the heat generation temperature of a heat source (e.g., a driver chip or an application processor) that is driven and generates heat. That is, the transition material may be a material that undergoes a transformation (such as a change in molecular arrangement or mobility) due to the heat generated when the heat source is driven. Therefore, the heat dissipation member can absorb the heat generated by the heat source. Therefore, the heat dissipation member can improve the heat dissipation of the display device.

[0029] In embodiments, the transition material may be a material that does not undergo a phase change (such as liquefaction (melting)) due to the heat generated when the heat source is driven. Therefore, the heat dissipation member may not include an additional component (e.g., a matrix resin in which the transition material is dispersed or a shell encapsulating the transition material) to prevent leakage due to liquefaction (melting) of the transition material. Depending on the embodiment, the ratio of the volume of the transition material to the total volume of the heat dissipation member may be increased. Consequently, the heat absorption efficiency of the heat dissipation member may be increased, and heat dissipation of the display device may be further improved.

[0030] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.

[0032] Figure 1 is a plan view showing a display device according to an embodiment.

[0033] Figure 2 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A plan view of an example of a display panel and circuit board.

[0034] Figure 3 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A cross-sectional view of an example of a display panel.

[0035] Figure 4 According to the embodiment Figure 1 1-1' is a cross-sectional view of the display device taken along line II'.

[0036] Figure 5 is a diagram showing a method according to an embodiment of the present invention Figure 1 A cross-sectional view of a display device in a bent state.

[0037] Figure 6 is a plan view showing a display device according to another embodiment.

[0038] Figure 7is a diagram showing a method according to an embodiment of the present invention Figure 6 A cross-sectional view of a display device in a bent state.

[0039] Figure 8 is a cross-sectional view illustrating a state in which a display device is bent according to still another embodiment.

[0040] Figure 9 is a cross-sectional view illustrating a state in which a display device is bent according to still another embodiment. DETAILED DESCRIPTION

[0041] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0042] It will be understood that when an element is referred to as being associated with another element, such as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being associated with another element, such as being “directly on” another element, there are no intervening elements present.

[0043] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, without departing from the teachings herein, the "first element," "first component," "first region," "first layer," or "first portion" discussed below can be referred to as a second element, second component, second region, second layer, or second portion.

[0044] The terms used herein are only for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, "a", "an", "the" and "at least one" do not represent a limit on quantity and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" will not be interpreted as limiting "a" or "an". "Or" means "and / or". As used herein, reference numerals may indicate singular or plural elements. For example, reference numerals marking an element in the singular form within a drawn figure may be used to reference the plural of a singular element within the text of the specification.

[0045] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will also be understood that the terms "include" and / or "comprising" or "include" and / or "comprising," when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or clusters thereof.

[0046] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as shown in the figures. It will be understood that relative terms are intended to cover different orientations of the device in addition to the orientations depicted in the figures. For example, if the device in one of the figures is turned over, the element described as being on the "lower" side of the other elements will subsequently be oriented on the "upper" side of the other elements. Thus, depending on the particular orientation of the figure, the term "lower" can cover both the "lower" and "upper" orientations. Similarly, if the device in one of the figures is turned over, the element described as being "below" or "beneath" the other elements will subsequently be oriented "above" the other elements. Thus, the term "lower" or "beneath" can cover both the above and below orientations.

[0047] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted in an ideal or overly formal sense unless expressly defined as such herein.

[0049] Embodiments are described herein with reference to schematic cross-sectional illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather should include deviations in shape due to, for example, manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the invention.

[0050] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0051] Figure 1 1 is a plan view showing a display device according to an embodiment. Specifically, Figure 1 The display device DD is in a state before the display panel DP is bent.

[0052] In the examples and with reference to Figure 1 The display device DD may display an image through a display surface oriented parallel to a plane defined by the first direction D1 and the second direction D2. The display device DD may display an image in a third direction D3 through the display surface, wherein the third direction D3 may be oriented substantially parallel to a normal direction of the display surface. The display surface on which the image is displayed may correspond to the front surface or top surface of the display device DD.

[0053] In an embodiment, the display device DD may include a display panel DP, a driving chip DIC, a circuit board FCB, a bending protection layer BPL, a cover film CIC, and a heat dissipation member HDM.

[0054] The display panel DP may be a light-emitting display panel and is not limited to any particular embodiment. For example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The emission layer of an organic light-emitting display panel may include an organic light-emitting material, and the emission layer of an inorganic light-emitting display panel may include an inorganic light-emitting material. The emission layer of a quantum dot light-emitting display panel may include quantum dots, quantum rods, or the like. Hereinafter, the display panel DP is described as an organic light-emitting display panel.

[0055] In an embodiment, the display panel DP may include a first area AA1, a bending area BA, and a second area AA2 arranged along the second direction D2. That is, the bending area BA may extend from the first area AA1 in the second direction D2, and the second area AA2 may extend from the bending area BA in the second direction D2.

[0056] The bending area BA may be a region that is curved with a predetermined curvature relative to a bending axis extending in the first direction D1. The first area AA1 and the second area AA2 may be uncurved, flat areas. When the bending area BA is curved, the first area AA1 and the second area AA2 may overlap each other in a plan view. That is, by curving the bending area BA, the second area AA2 of the display panel DP may be positioned on the lower surface of the display panel DP corresponding to the first area AA1.

[0057] Each of the bending area BA and the second area AA2 may have a width in the first direction D1 that is smaller than the width of the first area AA1 in the first direction D1. Since the width of the bending area BA is smaller in a direction parallel to the bending axis, the bending area BA can bend more easily. However, the present invention is not limited thereto, and in another embodiment, the width of the bending area BA in the first direction D1 may be substantially equal to the width of the first area AA1 in the first direction D1.

[0058] In an embodiment, the display panel DP may include a display area DA and a peripheral area PA, and may be defined within the first area AA1. The display area DA may be a region that displays an image by generating light or by controlling the transmission of light provided from an external light source.

[0059] The peripheral area PA may be positioned adjacent to the display area DA. For example, the peripheral area PA may surround the display area DA. However, the present invention is not limited thereto, and in other embodiments, the peripheral area PA may be defined in various shapes. The peripheral area PA may correspond to a region including the remaining area of ​​the first area AA1 excluding the display area DA, the bending area BA, and the second area AA2. The peripheral area PA may include a region where driver circuits or driver wiring for driving components disposed in the display area DA, as well as various signal lines and pads for supplying electrical signals to the components, are arranged.

[0060] In embodiments, a driver chip DIC may be disposed in the second area AA2 of the display panel DP, where the driver chip DIC may be electrically connected to the display panel DP. The driver chip DIC may include driver circuits, such as data driver circuits, for driving pixels of the display panel DP. The driver chip DIC may be manufactured in the form of an integrated circuit chip and may be mounted in the second area AA2 of the display panel DP. The driver chip DIC may be driven and may generate heat. For example, the driver chip DIC may be driven to control the driving of the display panel DP and may generate heat during the driving process.

[0061] In an embodiment, the circuit board FCB may be disposed adjacent to an end of the second area AA2 of the display panel DP, wherein the circuit board FCB may be spaced apart from the driving chip DIC in the second direction D2. By bending the bending area BA, the circuit board FCB may overlap with the first area AA1 of the display panel DP in a plan view.

[0062] In embodiments, the circuit board FCB may be bonded to the display panel DP through a bonding process. For example, the circuit board FCB may be electrically connected to the display panel DP and the driver chip DIC through an anisotropic conductive adhesive layer. The electrically connected circuit board FCB and driver chip DIC may control driving of the display panel DP.

[0063] In an embodiment, the circuit board FCB may include a base film FB and an electronic component DEL, wherein the base film FB may be a flexible circuit film, and the electronic component DEL may be mounted on the base film FB. The electronic component DEL may include an electronic element that converts a signal input from an external source into a signal required by the driving chip DIC or into a signal required for driving the display panel DP.

[0064] In embodiments, a bending protection layer BPL may be provided on the display panel DP, wherein the bending protection layer BPL may be provided in the bending area BA. The bending protection layer BPL may also be provided in portions of the first area AA1 and the second area AA2. The bending protection layer BPL may bend along with the bending area BA, wherein the bending protection layer BPL may protect the bending area BA from external impacts and may control the neutral plane of the bending area BA.

[0065] In an embodiment, a cover film CIC may be disposed in the second area AA2 of the display panel DP and may cover the driver chip DIC. Furthermore, the cover film CIC may cover one end portion of the circuit board FCB disposed in the second area AA2. In an embodiment, the cover film CIC may cover a portion of the bending protection layer BPL that overlaps with a portion of the second area AA2.

[0066] The cover film CIC may be a conductive film or include a conductive layer, wherein the cover film CIC can prevent or reduce damage to the driver chip DIC due to static electricity. In an embodiment, the cover film CIC may be provided in the form of a tape. That is, the cover film CIC may have an adhesive layer on one surface and may be attached to the second area AA2 of the display panel DP. However, embodiments of the cover film CIC are not limited thereto.

[0067] In embodiments, a heat dissipation member HDM may be disposed in the second area AA2 of the display panel DP, wherein the heat dissipation member HDM may overlap with the cover film CIC in plan view. For example, the heat dissipation member HDM may be disposed directly on one surface of the cover film CIC. The heat dissipation member HDM may be disposed adjacent to the driver chip DIC. In embodiments, the heat dissipation member HDM may be configured to dissipate heat generated by the driver chip DIC. For example, the heat dissipation member HDM may absorb heat generated when the driver chip DIC is driven. Thus, performance degradation of the display device DD due to heat generated by the driver chip DIC may be prevented or reduced. The heat dissipation member HDM will be described in more detail below.

[0068] Figure 2 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A plan view of an example of a display panel and circuit board. Figure 2 Schematically shows Figure 1 Some of the components of the display device DD.

[0069] In the examples and with reference to Figure 2 The display panel DP may include a first area AA1, a bending area BA, and a second area AA2 arranged along a second direction D2. The display area DA of the display panel DP may be defined within the first area AA1, and the remaining area of ​​the first area AA1 excluding the display area DA, the bending area BA, and the second area AA2 may be defined as a peripheral area PA. The above description may be substantially identically applied to each of the areas. Therefore, repeated descriptions may be omitted or simplified.

[0070] In an embodiment, the display panel DP may include pixels PX disposed in the display area DA and signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL electrically connected to the pixels PX. The display panel DP may include a pad PD disposed in the peripheral area PA, a scan driver SDV, and an emission driver EDV.

[0071] In an embodiment, each of the pixels PX may include a light emitting element and a pixel driving circuit including a transistor (eg, a switching transistor, a driving transistor, or the like) connected to the light emitting element and a capacitor. Each of the pixels PX may emit light in response to an electrical signal.

[0072] In an embodiment, the signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL may include scan lines SL1-SLm, data lines DL1-DLn, emission lines EL1-ELm, a first control line CSL1, a second control line CSL2, and a power line PL, where m and n represent natural numbers greater than 0. Each of the pixels PX may be connected to a corresponding one of the scan lines SL1-SLm and a corresponding one of the data lines DL1-DLn.

[0073] In an embodiment, each of the scan lines SL1-SLm may extend in a first direction D1 and may be connected to a scan driver SDV. Each of the data lines DL1-DLn may extend in a second direction D2 and may be connected to a driver chip DIC via a bending area BA. Each of the emission lines EL1-ELm may extend in the first direction D1 and may be connected to an emission driver EDV.

[0074] In an embodiment, the power line PL may extend in the second direction D2 and may be provided between the display area DA and the emission driver EDV. However, the present invention is not limited thereto, and the power line PL may be provided between the display area DA and the scan driver SDV. The power line PL may extend to the second area AA2 via the curved area BA and may be connected to a corresponding one of the pads PD provided at the end of the second area AA2 to receive a voltage. The power line PL may provide a reference voltage to the pixel PX via a connection line.

[0075] In an embodiment, the pads PD may be arranged along one direction in the second area AA2. The pads PD may be arranged adjacent to an end portion of the second area AA2 extending in the first direction D1 and may be arranged along the first direction D1. The pads PD may be a portion electrically connected to the circuit board FCB and may be connected to corresponding signal lines among the signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL.

[0076] In an embodiment, the first control line CSL1 may be connected to the scan driver SDV, and the second control line CSL2 may be connected to the emission driver EDV. The control lines CSL1 and CSL2 may each extend from the first area AA1 to the second area AA2 via the curved area BA and may be connected to corresponding ones of the pads PD. The data lines DL1-DLn may each extend from the first area AA1 to the second area AA2 via the curved area BA and may be connected to the driver chip DIC, where the driver chip DIC may be connected to the pads PD corresponding to the data lines DL1-DLn, respectively.

[0077] In an embodiment, the circuit board FCB may be connected to the pads PD to control the operation of the scan driver SDV, the emission driver EDV, and the driver chip DIC. For example, the circuit board FCB may include output pads corresponding to the pads PD, and the output pads may be electrically connected to the pads PD via an anisotropic conductive adhesive layer. However, the present invention is not limited thereto, and the bonding method between the pads PD and the circuit board FCB may include various bonding methods, such as soldering, ultrasonic bonding, or the like.

[0078] In an embodiment, a scan driver SDV may generate scan signals in response to scan control signals, wherein the scan signals may be applied to pixels PX via scan lines SL1-SLm. A data driver of a driver chip DIC may generate data voltages corresponding to image signals in response to data control signals, wherein the data voltages may be applied to pixels PX via data lines DL1-DLn. An emission driver EDV may generate emission signals in response to emission control signals, wherein the emission signals may be applied to pixels PX via emission lines EL1-ELm.

[0079] In an embodiment, the pixels PX may receive a data voltage in response to a scan signal and may display an image by emitting light having a brightness corresponding to the data voltage in response to an emission signal. The emission time of each of the pixels PX may be controlled by the emission signal. The display panel DP may display an image through the display area DA by the pixels PX.

[0080] In an embodiment, the signal line extending from the first area AA1 to the second area AA2 may be disposed on the bent area BA of the display panel DP. Figure 1 ) covers the bending area BA, so the bending protection layer BPL can prevent or reduce the signal lines disposed on the bending area BA from being damaged due to external impact.

[0081] Figure 3 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A cross-sectional view of an example of a display panel.

[0082] In the examples and with reference to Figure 3 The display panel DP may include a substrate SUB, a transistor TR, first, second, third, and fourth insulating layers ILD1, ILD2, ILD3, and ILD4, a pixel defining layer PDL, a light-emitting element LED, an encapsulation layer TFE, and an input sensing layer ISU. For example, the transistor TR may include an active pattern ACT, a gate electrode GE, a first connection electrode SE, and a second connection electrode DE. The light-emitting element LED may include a pixel electrode PE, an emission layer EML, and a common electrode CE.

[0083] The substrate SUB may include a transparent or opaque material. Examples of materials that can be used as the substrate SUB may include glass, quartz, plastic, or the like. These materials may be used alone or in combination with each other.

[0084] The first insulating layer ILD1 may be disposed on the substrate SUB and may prevent or reduce diffusion of metal atoms or impurities from the substrate SUB to the active pattern ACT. In embodiments, the first insulating layer ILD1 may include an insulating material.

[0085] In embodiments, the active pattern ACT may be disposed on the first insulating layer ILD1 and may include silicon semiconductor material, oxide semiconductor material, organic semiconductor material, or the like. The active pattern ACT may include a source region, a drain region, and a channel region positioned therebetween.

[0086] The second insulating layer ILD2 may be disposed on the active pattern ACT and may cover the active pattern ACT. In embodiments, the second insulating layer ILD2 may include an insulating material.

[0087] The gate electrode GE may be disposed on the second insulating layer ILD2 and may overlap the channel region of the active pattern ACT. In embodiments, the gate electrode GE may include metal, alloy, conductive metal oxide, transparent conductive material, or the like.

[0088] The third insulating layer ILD3 may be disposed on the gate electrode GE and may cover the gate electrode GE. In embodiments, the third insulating layer ILD3 may include an insulating material.

[0089] The first connection electrode SE and the second connection electrode DE may be disposed on the third insulating layer ILD3, wherein the first connection electrode SE and the second connection electrode DE may contact the source region and the drain region of the active pattern ACT through holes penetrating the second insulating layer ILD2 and the third insulating layer ILD3, respectively. In embodiments, the first connection electrode SE and the second connection electrode DE may include a metal, an alloy, a conductive metal oxide, a transparent conductive material, or the like.

[0090] The fourth insulating layer ILD4 may be disposed on the first and second connection electrodes SE and DE, and may cover the first and second connection electrodes SE and DE. In embodiments, the fourth insulating layer ILD4 may include an insulating material.

[0091] The pixel electrode PE may be disposed on the fourth insulating layer ILD4 and may include a conductive material such as a metal, an alloy, a conductive metal oxide, a transparent conductive material, or the like.

[0092] The pixel electrode PE may be electrically connected to the transistor TR, for example, the second connection electrode DE of the transistor TR, through a contact hole formed in the fourth insulating layer ILD4 .

[0093] The pixel defining layer PDL may be disposed on the fourth insulating layer ILD4 and the pixel electrode PE and may include an insulating material. The pixel defining layer PDL may define an opening exposing at least a portion of the pixel electrode PE.

[0094] The emission layer EML may be disposed on the pixel electrode PE exposed by the opening of the pixel defining layer PDL. In an embodiment, the emission layer EML may have a multilayer structure including a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer, and an electron injection layer.

[0095] The common electrode CE may be disposed on the emission layer EML and may include a conductive material such as metal, alloy, conductive metal nitride, conductive metal oxide, transparent conductive material, or the like. In an embodiment, the common electrode CE may continuously extend across a plurality of pixels in the display area DA.

[0096] The encapsulation layer TFE may be disposed on the common electrode CE and may cover the light emitting element LED. The encapsulation layer TFE may prevent or reduce the penetration of impurities into the light emitting element LED. In an embodiment, the encapsulation layer TFE may include at least one organic layer and at least one inorganic layer.

[0097] The input sensing layer (ISU) may be disposed on the encapsulation layer (TFE) and may sense external input that may be provided in various forms. For example, in one embodiment, the external input may include a user's touch, a pen's touch, light, heat, pressure, or similar input. In another embodiment, the external input may include direct contact and may also include input applied to an adjacent area (e.g., hovering). The input sensing layer (ISU) may include at least one touch electrode and at least one insulating layer. In one embodiment, the input sensing layer (ISU) may be omitted.

[0098] Figure 4 According to the embodiment Figure 1 1-1' is a cross-sectional view of the display device taken along line II'. Figure 5 is a diagram showing a method according to an embodiment of the present invention Figure 1 A cross-sectional view of a display device in a bent state.

[0099] Figure 4 The display device DD is in a state before the display panel DP is bent, and Figure 5 The display device DD may be in a state in which the display panel DP is bent. The display device DD may be provided in a state in which the bending area BA of the display panel DP is bent.

[0100] In the examples and with reference to Figure 1 、 Figure 4 and Figure 5 , the display device DD may include a display panel DP, an anti-reflection layer ARL, an adhesive layer AL, a window WM, a first protective film PF1, a second protective film PF2, a buffer layer CU, a metal plate MP, a spacer SPC, a bending protection layer BPL, a driving chip DIC, a circuit board FCB, a cover film CIC, and a heat dissipation member HDM. The above description may be substantially equally applied to Figure 4 and Figure 5 The display panel DP, the bending protection layer BPL, the driving chip DIC, the circuit board FCB, the cover film CIC and the heat dissipation member HDM are shown in FIG. Therefore, repeated descriptions may be omitted or simplified.

[0101] In embodiments, the anti-reflection layer ARL and the window WM may be disposed on the display panel DP. For example, the anti-reflection layer ARL may be disposed on the display panel DP, and the window WM may be disposed on the anti-reflection layer ARL.

[0102] As such, the window WM may be disposed on the display panel DP and the anti-reflection layer ARL, and components of the display device DD may be prevented or reduced from being damaged by external impact or by scratches applied from an upper side of the window WM.

[0103] In embodiments, the window WM may comprise an optically transparent material. For example, the window WM may comprise glass, sapphire, plastic, or the like. The window WM may have a single-layer structure or a multi-layer structure. The window WM may further comprise a functional layer disposed on the optically transparent layer, such as an anti-fingerprint layer, a phase control layer, or a hard coating layer.

[0104] The anti-reflection layer ARL may reduce the reflectivity of external light incident from the upper side of the window WM. In an embodiment, the anti-reflection layer ARL may include a retarder and / or a polarizer. The anti-reflection layer ARL may further include a polymer film disposed on the retarder or the polarizer.

[0105] In embodiments, the window WM and the anti-reflection layer ARL may be bonded to each other by an adhesive layer AL, wherein the adhesive layer AL may be a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0106] In an embodiment, a first protective film PF1, a second protective film PF2, a buffer layer CU, a metal plate MP, and a spacer SPC may be disposed below the display panel DP. The first protective film PF1, the buffer layer CU, the metal plate MP, and the spacer SPC may be disposed in a first area AA1 and may be sequentially disposed on the lower surface of the display panel DP corresponding to the first area AA1. The second protective film PF2 may be disposed in the second area AA2.

[0107] The first and second protective films PF1 and PF2 may be disposed at substantially the same level on the lower surface of the display panel DP. That is, before the bending area BA is bent, the first and second protective films PF1 and PF2 may be disposed side by side in the second direction D2. The first and second protective films PF1 and PF2 may protect the lower surface of the display panel DP and enhance the impact resistance of the display panel DP. Furthermore, each of the first and second protective films PF1 and PF2 may include an insulating material.

[0108] In an embodiment, the first and second protective films PF1 and PF2 may include the same material. The first and second protective films PF1 and PF2 may be formed by removing a portion corresponding to the bending area BA from a monolithic film covering the entire lower surface of the display panel DP. However, the present invention is not limited thereto.

[0109] On the lower surface of the display panel DP, the first and second protection films PF1 and PF2 may be spaced apart from each other with the bending area BA disposed therebetween. Since the first and second protection films PF1 and PF2 are not disposed in the bending area BA, the bending area BA may be easily bent.

[0110] In an embodiment, a buffer layer CU may be disposed under the first protection film PF1 and may relieve pressure applied from the lower side. The buffer layer CU may include foam, sponge, urethane resin, or the like.

[0111] In embodiments, the metal plate MP may be disposed below the buffer layer CU and may comprise a metal material. For example, the metal plate MP may comprise copper, nickel, ferrite, silver, or the like, which has excellent thermal conductivity. These metal materials may be used alone or in combination. However, the present invention is not limited thereto. Furthermore, the metal plate MP may perform an electromagnetic shielding function.

[0112] In an embodiment, the spacer SPC may be disposed below the metal plate MP. Figure 5 As shown in , in a state in which the bending area BA is bent, the spacer SPC may compensate for the step difference. The spacer SPC may include an insulating material.

[0113] In an embodiment, in a state where the bending area BA is bent, the first protection film PF1, the buffer layer CU, the metal plate MP, the spacer SPC, and the second protection film PF2 may be sequentially disposed between the first area AA1 and the second area AA2 of the display panel DP. The first protection film PF1, the buffer layer CU, the metal plate MP, the spacer SPC, and the second protection film PF2 may be bonded to each other via an adhesive layer. However, the present invention is not limited thereto, and at least some of the first protection film PF1, the buffer layer CU, the metal plate MP, the spacer SPC, and the second protection film PF2 may be formed by a continuous process without requiring an adhesive layer.

[0114] In addition, in a state in which the bending area BA is bent, the circuit board FCB may be bonded to the metal plate MP by the conductive tape TP. That is, the conductive tape TP may compensate for the step difference and may include an anisotropic conductive film or the like.

[0115] As described above, the cover film CIC may be disposed in the second area AA2 of the display panel DP and may cover the driving chip DIC. The cover film CIC may prevent or reduce damage to the driving chip DIC due to static electricity.

[0116] In embodiments, the cover film CIC may be directly disposed on one surface of the display panel DP. For example, the cover film CIC may have an adhesive layer on one surface and may be attached to the upper surface of the display panel DP corresponding to the second area AA2. Furthermore, the cover film CIC may cover one end portion of the circuit board FCB disposed in the second area AA2 and may cover a portion of the bending protection layer BPL that overlaps with the portion of the second area AA2. Due to the step difference between the circuit board FCB, the driver chip DIC, and the bending protection layer BPL, a portion of the cover film CIC may be spaced apart from one surface (i.e., the upper surface) of the display panel DP, thereby defining an air gap between the display panel DP and the cover film.

[0117] As described above, the heat dissipation member HDM may be disposed in the second area AA2 of the display panel DP and may overlap the cover film CIC in plan view. For example, the heat dissipation member HDM may be disposed directly on one surface of the cover film CIC and may be disposed adjacent to the driver chip DIC. Thus, the heat dissipation member HDM may be configured to dissipate heat generated by the driver chip DIC. For example, the heat dissipation member HDM may absorb heat generated when the driver chip DIC is driven.

[0118] In some embodiments, the heat dissipation member HDM may include a transition material having a glass transition temperature (Tg) less than or equal to the heat generation temperature of the driver chip DIC. Therefore, the transition material may transition from a brittle glass state to a viscous or rubbery state due to the heat generated when the driver chip DIC is driven. In other words, the transition material may be a material that undergoes a transformation (such as a change in molecular alignment or mobility) due to the heat generated when the driver chip DIC is driven. In some embodiments, the heat generation temperature may be the maximum temperature of the heat generated when the heat source (e.g., the driver chip DIC) is driven.

[0119] Therefore, the transition material can absorb heat due to a transformation caused by a temperature increase (such as a change in molecular arrangement or mobility). In other words, the transition material can undergo a transformation due to heat generated when the driver chip DIC is driven, and at this time, the transition material can absorb surrounding heat. As a result, the heat dissipation member HDM can absorb the heat generated by the driver chip DIC, thereby improving heat dissipation in the display device DD.

[0120] In an embodiment, the heat generation temperature of the driver chip DIC may be in a range of about 40 degrees Celsius to about 80 degrees Celsius. That is, the glass transition temperature of the transition material may be about 80 degrees Celsius or less. In addition, the glass transition temperature of the transition material may be about 25 degrees Celsius or greater. If the glass transition temperature of the transition material is less than about 25 degrees Celsius, the transition may occur at room temperature, which may reduce the reliability of the display device DD.

[0121] In an embodiment, the glass transition temperature of the transition material may be lower than the heat generation temperature of the driver chip DIC by about 5 degrees Celsius to about 15 degrees Celsius. In this case, the transition material can more easily absorb the heat generated when the driver chip DIC is driven. For example, when the heat generation temperature of the driver chip DIC is about 50 degrees Celsius, the glass transition temperature of the transition material may be in the range of about 35 degrees Celsius to about 45 degrees Celsius. In an embodiment, the glass transition temperature of the transition material may be in the range of about 25 degrees Celsius to about 65 degrees Celsius, preferably, in the range of about 25 degrees Celsius to about 55 degrees Celsius, and more preferably, in the range of about 35 degrees Celsius to about 45 degrees Celsius.

[0122] Furthermore, the transition material may be a material that does not undergo a phase change (such as liquefaction (melting)) due to the heat generated when the driver chip DIC is driven. That is, the transition material included in the heat dissipation member HDM may be in a solid phase and may remain in the solid phase at the heat generation temperature of the driver chip DIC. In other words, the transition material may not liquefy (melt) due to the heat generated by the driver chip DIC.

[0123] As a result, the transition material can have a glass transition temperature less than or equal to the heat generation temperature of the driver chip DIC and can remain in a solid phase at the heat generation temperature of the driver chip DIC. Therefore, the heat dissipation member HDM can include no additional components (e.g., a matrix resin in which the transition material is dispersed or a shell encapsulating the transition material) to prevent leakage due to liquefaction (melting) of the transition material. Therefore, according to embodiments, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM can be increased. Consequently, the heat absorption efficiency of the heat dissipation member HDM can be increased, and heat dissipation of the display device DD can be further improved.

[0124] For example, in an embodiment, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM may be approximately 100%. That is, the heat dissipation member HDM may not include materials other than the transition material. For example, the heat dissipation member HDM including the transition material may be formed by a series of processes including applying a resin composition that is polymerized to form the transition material and then polymerizing the resin composition.

[0125] In embodiments, the heat dissipation member HDM may have a sufficient modulus. Specifically, the transition material of the heat dissipation member HDM may be a material that achieves a sufficient modulus for the heat dissipation member HDM. For example, the modulus of the heat dissipation member HDM at approximately 25 degrees Celsius (room temperature) may be approximately 100 MPa or greater. Consequently, deformation of the heat dissipation member HDM due to external forces may be reduced or prevented, without compromising the durability of the display device DD.

[0126] In an embodiment, the transition material included in the heat dissipation member HDM may include a polymer material. That is, the heat dissipation member HDM may be formed by curing the polymer material. For example, the heat dissipation member HDM may be formed by photocuring the polymer material using UV light. However, the present invention is not limited thereto.

[0127] Examples of the polymer material included in the transition material may include acrylic resin, epoxy resin, or the like. These polymer materials may be used alone or in combination with each other.

[0128] In an embodiment, the acrylic resin may be a polymer derived from a resin composition including a (meth)acrylate monomer, a (meth)acrylate oligomer, and a photoinitiator, wherein (meth)acrylate is a general term for acrylate and methacrylate.

[0129] In an embodiment, the (meth)acrylate monomer included in the acrylic resin may include a monofunctional (meth)acrylate, wherein the monofunctional (meth)acrylate may include a monofunctional (meth)acrylate containing a polar group and a monofunctional (meth)acrylate not containing a polar group.

[0130] For example, the monofunctional (meth)acrylate containing a polar group may include a hydroxyl group, an amino group, or a carboxyl group as a polar group. For example, the polar group may include a hydroxyl group, and the monofunctional (meth)acrylate including a hydroxyl group as a polar group may include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, or a combination thereof. However, the present invention is not limited thereto.

[0131] For example, examples of monofunctional (meth)acrylates containing no polar group may include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, 1-ethylpropyl (meth)acrylate, 2-ethylpropyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 1-ethylbutyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, 3-ethylbutyl (meth)acrylate, n-pentyl (meth)acrylate, tert-pentyl (meth)acrylate, neopentyl (meth)acrylate, isopentyl (meth)acrylate, sec-pentyl (meth)acrylate, 3-pentyl (meth)acrylate, Secondary isoamyl (meth)acrylate, 1-ethylpentyl (meth)acrylate, 2-ethylpentyl (meth)acrylate, 3-ethylpentyl (meth)acrylate, 4-ethylpentyl (meth)acrylate, n-hexyl (meth)acrylate, isohexyl (meth)acrylate, secondary hexyl (meth)acrylate, tert-hexyl (meth)acrylate, 1-ethylhexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 3-ethylhexyl (meth)acrylate, 4-ethylhexyl (meth)acrylate, 5-ethylhexyl (meth)acrylate, n-heptyl (meth)acrylate, isoheptyl (meth)acrylate, secondary heptyl (meth)acrylate, tert-heptyl (meth)acrylate, 1-ethylheptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate ethylheptyl (meth)acrylate, 3-ethylheptyl (meth)acrylate, 4-ethylheptyl (meth)acrylate, 5-ethylheptyl (meth)acrylate, 6-ethylheptyl (meth)acrylate, 7-ethylheptyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, sec-octyl (meth)acrylate, tert-octyl (meth)acrylate, 1-ethyloctyl (meth)acrylate, 2-ethyloctyl (meth)acrylate, 3-ethyloctyl (meth)acrylate, 4-ethyloctyl (meth)acrylate, 5-ethyloctyl (meth)acrylate, 6-ethyloctyl (meth)acrylate, 7-ethyloctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, sec-nonyl (meth)acrylate, ( tert-nonyl (meth)acrylate, 1-ethylnonyl (meth)acrylate, 2-ethylnonyl (meth)acrylate, 3-ethylnonyl (meth)acrylate, 4-ethylnonyl (meth)acrylate, 5-ethylnonyl (meth)acrylate, 6-ethylnonyl (meth)acrylate, 7-ethylnonyl (meth)acrylate, 8-ethylnonyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, secondary decyl (meth)acrylate, tert-decyl (meth)acrylate, 1-ethyldecyl (meth)acrylate, 2-ethyldecyl (meth)acrylate, 3-ethyldecyl (meth)acrylate, 4-ethyldecyl (meth)acrylate, 5-ethyldecyl (meth)acrylate, 6-ethyldecyl (meth)acrylate,7-ethyldecyl (meth)acrylate, or 8-ethyldecyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, or the like. These may be used alone or in combination. Preferably, the monofunctional (meth)acrylate containing no polar group may be adamantyl (meth)acrylate. However, the present invention is not limited thereto.

[0132] In an embodiment, the glass transition temperature of the homopolymer formed from the (meth)acrylate monomer may be in the range of about 100 degrees Celsius to about 250 degrees Celsius. In this embodiment, the content of the (meth)acrylate monomer may be in the range of about 20 parts by weight to about 95 parts by weight based on a total of about 100 parts by weight of the resin composition. Since the resin composition includes the (meth)acrylate monomer that satisfies the above-mentioned glass transition temperature within the above-mentioned content range, the fluidity of the resin composition can be further reduced. Therefore, the durability of the heat dissipation member HDM formed by curing the resin composition can be further improved.

[0133] In an embodiment, the (meth)acrylate monomer included in the acrylic resin may further include a multifunctional (meth)acrylate.

[0134] Examples of the (meth)acrylate oligomer included in the acrylic resin may include urethane (meth)acrylate oligomer, polyisoprene (meth)acrylate oligomer, polybutadiene (meth)acrylate oligomer, or the like, which may be used alone or in combination with each other.

[0135] Examples of the photoinitiator included in the acrylic resin may include benzophenone compounds, anthraquinone compounds, benzoin compounds, acetophenone compounds, α-aminoalkylphenone compounds, acylphosphine oxide compounds, or the like, which may be used alone or in combination.

[0136] In embodiments, the epoxy resin may be a polymer derived from a resin composition including an epoxy monomer and a photoinitiator.

[0137] Examples of epoxy monomers included in the epoxy resin may include commonly used aromatic epoxy resins, alicyclic epoxy resins, or the like. These may be used alone or in combination. Examples of aromatic epoxy resins may include biphenyl epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolac epoxy resins, dicyclopentadiene epoxy resins, or the like. These may be used alone or in combination.

[0138] Examples of the photoinitiator included in the epoxy resin may include aromatic diazonium salts, aromatic sulfonium salts, aromatic iodonium aluminum salts, aromatic sulfonium aluminum salts, metallocene compounds, iron complex salts, or the like, which may be used alone or in combination with each other.

[0139] Examples of the transition material included in the heat dissipation member HDM are not limited thereto, and may include various materials having a glass transition temperature less than or equal to a heat generation temperature of the driving chip DIC.

[0140] In an embodiment, Figure 4 and Figure 5 As shown in , the heat dissipation member HDM may include a first heat dissipation member HDM1 and a second heat dissipation member HDM2. Figure 4 , the first heat dissipating member HDM1 and the second heat dissipating member HDM2 are shown by dividing the heat dissipating member HDM into a portion disposed above the cover film CIC and a portion disposed below the cover film CIC. That is, the above description of the heat dissipating member HDM can be substantially equally applied to each of the first heat dissipating member HDM1 and the second heat dissipating member HDM2.

[0141] In an embodiment, the first heat dissipation member HDM1 may be positioned within the air gap defined by the cover film CIC and the display panel DP. That is, the first heat dissipation member HDM1 may be positioned in the space between the cover film CIC and the display panel DP. Therefore, the first heat dissipation member HDM1 may be covered by the cover film CIC and may be directly disposed on the lower surface of the cover film CIC.

[0142] In an embodiment, the first heat dissipation member HDM1 may directly contact the driving chip DIC. Therefore, it is easier to absorb heat generated by the driving chip DIC. However, the present invention is not limited thereto, and the first heat dissipation member HDM1 may be spaced apart from the driving chip DIC by a predetermined distance.

[0143] The second heat dissipation member HDM2 may be disposed directly on the upper surface of the cover film CIC. In one embodiment, the cover film CIC may have a recess due to the step difference caused by the circuit board FCB, the driver chip DIC, and the bending protection layer BPL, and the second heat dissipation member HDM2 may be disposed to fill the recess. For example, the second heat dissipation member HDM2 may fill the recess and may overlap the driver chip DIC in plan view. However, the present invention is not limited to this, and the second heat dissipation member HDM2 may be spaced apart from the driver chip DIC in plan view and may be disposed to correspond to the recess. Furthermore, in one embodiment, the second heat dissipation member HDM2 may be disposed entirely on the upper surface of the cover film CIC. Meanwhile, in another embodiment, the second heat dissipation member HDM2 may be omitted.

[0144] In an embodiment, the display device DD may include a heat dissipation member HDM that overlaps with the cover film CIC in a plan view. The heat dissipation member HDM may include a transition material having a glass transition temperature less than or equal to the heat generation temperature of the driver chip DIC. In other words, the transition material may be a material that undergoes a transformation (such as a change in molecular alignment or mobility) due to heat generated when the driver chip DIC is driven. Therefore, the heat dissipation member HDM may absorb heat generated by the driver chip DIC. Consequently, the heat dissipation member HDM may improve heat dissipation of the display device DD.

[0145] Furthermore, the transition material may be a material that does not undergo a phase change (such as liquefaction (melting)) due to the heat generated when the driver chip DIC is driven. Therefore, the heat dissipation member HDM may not include an additional component (e.g., a matrix resin in which the transition material is dispersed or a shell encapsulating the transition material) to prevent leakage due to liquefaction (melting) of the transition material. Therefore, according to embodiments, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM may be increased. Consequently, the heat absorption efficiency of the heat dissipation member HDM may be increased, and heat dissipation of the display device DD may be further improved.

[0146] Figure 6 is a plan view showing a display device according to another embodiment. Figure 7 is a diagram showing a method according to an embodiment of the present invention Figure 6 A cross-sectional view of a display device in a bent state.

[0147] Specifically, Figure 6 The display device DD1 is shown in a state before the display panel DP is bent, and Figure 7 The display device DD1 is shown in a state in which the display panel DP is bent. The display device DD1 may be provided in a state in which the bending area BA of the display panel DP is bent.

[0148] In the examples and with reference to Figure 6 and Figure 7 , the display device DD1 may include a display panel DP, an anti-reflection layer ARL, an adhesive layer AL, a window WM, a first protective film PF1, a second protective film PF2, a buffer layer CU, a metal plate MP, a spacer SPC, a bending protection layer BPL, a driving chip DIC, a conductive tape TP, a circuit board FCB, a cover film CIC, a heat dissipation member HDM' and a heat source HS. The above description may be substantially equally applied to Figure 6 and Figure 7The display panel DP, the anti-reflection layer ARL, the adhesive layer AL, the window WM, the first protective film PF1, the second protective film PF2, the buffer layer CU, the metal plate MP, the spacer SPC, the bending protection layer BPL, the driving chip DIC, the conductive tape TP, the circuit board FCB, and the cover film CIC are shown. Therefore, repeated descriptions may be omitted or simplified.

[0149] In an embodiment, a heat source HS may be disposed on the lower surface of the display panel DP corresponding to the first area AA1. Specifically, the heat source HS may be disposed below the metal plate MP and may be driven to generate heat. For example, the heat source HS may be an application processor (AP), a direct current-to-direct current converter (DC-DC converter), a built-in battery, or the like. However, the present invention is not limited thereto, and the heat source HS is not limited to a specific type, as long as it is disposed below the metal plate MP, driven, and generates heat.

[0150] The heat dissipation member HDM' may be disposed on the lower surface of the display panel DP corresponding to the first area AA1. Specifically, the heat dissipation member HDM' may be disposed directly on the lower surface of the metal plate MP. For example, the heat dissipation member HDM' may be disposed between the metal plate MP and the heat source HS. In other words, the heat dissipation member HDM' may be disposed on the lower surface of the metal plate MP corresponding to the area where the heat source HS is disposed. In other words, the heat dissipation member HDM' may overlap with the heat source HS in a plan view.

[0151] Therefore, in embodiments, a heat dissipation member HDM' may be disposed adjacent to a heat source HS, wherein the heat dissipation member HDM' may be configured to dissipate heat generated by the heat source HS. For example, the heat dissipation member HDM' may absorb heat generated when the heat source HS is driven. Thus, performance degradation of the display device DD1 due to heat generated by the heat source HS may be prevented or reduced.

[0152] In embodiments, the heat dissipation member HDM' may include a transition material having a glass transition temperature (Tg) less than or equal to the heat generation temperature of the heat source HS. Therefore, due to the heat generated when the heat source HS is driven, the transition material may transition from a brittle glass state to a viscous state or a rubbery state. In other words, the transition material may be a material that undergoes a transition (such as a change in molecular arrangement or mobility) due to the heat generated when the heat source HS is driven.

[0153] As a result, the transition material included in the heat dissipation member HDM' can absorb heat due to a transformation caused by a temperature increase (such as a change in molecular arrangement or mobility). In other words, the transition material can undergo a transformation due to the heat generated when the heat source HS is driven, and at this time, the transition material can absorb surrounding heat. Therefore, the heat dissipation member HDM' can absorb the heat generated by the heat source HS. Therefore, the heat dissipation member HDM' can improve heat dissipation from the display device DD1.

[0154] In an embodiment, the heat source HS may generate heat at a temperature in the range of about 40 degrees Celsius to about 80 degrees Celsius. That is, the glass transition temperature of the transition material may be about 80 degrees Celsius or less. In addition, the glass transition temperature of the transition material may be about 25 degrees Celsius or greater. If the glass transition temperature of the transition material is less than about 25 degrees Celsius, the transition may occur at room temperature, which may reduce the reliability of the display device DD1.

[0155] Preferably, the glass transition temperature of the transition material may be lower than the heat generation temperature of the heat source HS by about 5 degrees Celsius to about 15 degrees Celsius. In this case, the transition material can more easily absorb the heat generated when the heat source HS is driven. For example, when the heat generation temperature of the heat source HS is about 50 degrees Celsius, the glass transition temperature of the transition material may be in the range of about 35 degrees Celsius to about 45 degrees Celsius. In embodiments, the glass transition temperature of the transition material may be in the range of about 25 degrees Celsius to about 65 degrees Celsius, preferably in the range of about 25 degrees Celsius to about 55 degrees Celsius, and more preferably in the range of about 35 degrees Celsius to about 45 degrees Celsius.

[0156] Furthermore, the transition material may be a material that does not undergo a phase change (such as liquefaction (melting)) due to the heat generated when the heat source HS is driven. That is, the transition material included in the heat dissipation member HDM' may be in a solid phase and may remain in the solid phase at the heat generation temperature of the heat source HS. In other words, the transition material may not liquefy (melt) due to the heat generated by the heat source HS.

[0157] As a result, the transition material can have a glass transition temperature less than or equal to the heat generation temperature of the heat source HS and can remain in a solid phase at the heat generation temperature of the heat source HS. Therefore, the heat dissipation member HDM' can include no additional components (e.g., a matrix resin in which the transition material is dispersed or a shell encapsulating the transition material) to prevent leakage due to liquefaction (melting) of the transition material. According to embodiments, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM' can be increased. Consequently, the heat absorption efficiency of the heat dissipation member HDM' can be increased, and heat dissipation of the display device DD1 can be further improved.

[0158] For example, in an embodiment, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM' may be approximately 100%. That is, the heat dissipation member HDM' may not include any material other than the transition material. For example, the heat dissipation member HDM' including the transition material may be formed by a series of processes including applying a resin composition that is polymerized to form the transition material and polymerizing the resin composition.

[0159] In embodiments, the heat dissipation member HDM' may have a sufficient modulus. Specifically, the transition material of the heat dissipation member HDM' may be a material that achieves a sufficient modulus for the heat dissipation member HDM'. For example, the modulus of the heat dissipation member HDM' at approximately 25 degrees Celsius (room temperature) may be approximately 100 MPa or greater. Consequently, deformation of the heat dissipation member HDM' due to external forces may be reduced or prevented, without compromising the durability of the display device DD1.

[0160] The transition material included in the heat dissipation member HDM' may include a polymer material. Figure 1 、 Figure 4 and Figure 5 The description of the polymer material included in the transition material included in the heat dissipation member HDM may be substantially equally applied to the polymer material included in the transition material included in the heat dissipation member HDM′. Therefore, repeated description may be omitted.

[0161] In an embodiment, the display device DD1 may include a heat dissipation member HDM' disposed between the metal plate MP and the heat source HS. The heat dissipation member HDM' may include a transition material having a glass transition temperature less than or equal to the heat generation temperature of the heat source HS. In other words, the transition material may be a material that undergoes a transformation (such as a change in molecular alignment or mobility) due to heat generated when the heat source HS is driven. Therefore, the heat dissipation member HDM' can absorb the heat generated by the heat source HS. Consequently, the heat dissipation member HDM' can improve heat dissipation of the display device DD1.

[0162] Furthermore, the transition material may be a material that does not undergo a phase change (such as liquefaction (melting)) due to the heat generated when the heat source HS is driven. Therefore, the heat dissipation member HDM' may not include an additional component (e.g., a matrix resin in which the transition material is dispersed or a shell encapsulating the transition material) for preventing leakage due to liquefaction (melting) of the transition material. Therefore, according to embodiments, the ratio of the volume of the transition material to the total volume of the heat dissipation member HDM' may be increased. Consequently, the heat absorption efficiency of the heat dissipation member HDM' may be increased, and heat dissipation of the display device DD1 may be further improved.

[0163] Figure 8 is a cross-sectional view illustrating a state in which a display device is bent according to still another embodiment.

[0164] In the examples and with reference to Figure 8 In addition to the display device DD2 including a heat dissipation member HDM, the display device DD2 can be used with reference to Figure 6 and Figure 7 The display devices DD1 described are substantially the same, and therefore, repeated descriptions may be omitted.

[0165] That is, the display device DD2 may include both the heat dissipation member HDM for absorbing heat generated when the driving chip DIC is driven and the heat dissipation member HDM′ for absorbing heat generated when the heat source HS is driven.

[0166] Figure 9 is a cross-sectional view illustrating a state in which a display device is bent according to still another embodiment.

[0167] In the examples and with reference to Figure 9 The display device DD3 uses a heat dissipation member HDM instead of a heat dissipation member HDM (see Figure 4 and Figure 5 ) can be used in conjunction with Figure 1 、 Figure 4 and Figure 5 The display device DD described is substantially the same, wherein the heat dissipation member HDM″ may be substantially the same as the heat dissipation member HDM except for the arrangement form. Therefore, repeated description may be omitted.

[0168] In an embodiment, the display device DD3 may include a heat dissipation member HDM" that can completely cover the curved protective layer BPL and can overlap with the cover film CIC in a plan view. That is, the heat dissipation member HDM" can completely cover the curved protective layer BPL bent with a predetermined curvature. For example, the heat dissipation member HDM" can be arranged along the outer edge of the display device DD3 provided in a curved state, and can be provided as a whole to completely cover the curved protective layer BPL and overlap with the cover film CIC in a plan view.

[0169] That is, in the display device DD3, according to an embodiment, the heat dissipation member HDM" may be used as a molding part that determines the frame shape of the display device DD3. The molding part may be an outer frame of the display device DD3 and may be in contact with a fixed bracket surrounding the display device DD3. That is, the display device DD3 may have a structure in which the heat dissipation member HDM" for dissipating heat generated by the driving chip DIC is used as a molding part. Therefore, the display device DD3 may have a simpler structure.

[0170] The foregoing is an explanation of the present invention and will not be construed as limiting it. Although some embodiments of the present invention have been described, it will be readily appreciated by those skilled in the art that many modifications of the present invention are possible without departing substantially from the scope of the present invention and novel teachings and advantages. Therefore, all such modifications are intended to be included within the scope of the present invention. Therefore, it is to be understood that the foregoing is an explanation of the present invention and will not be construed as being limited to the specific embodiments disclosed herein that are intended to be included within the scope of the present invention. In addition, the present invention or parts of the present invention may be combined in whole or in part without departing from the scope of the present invention.

Claims

1. A display device, comprising: A display panel, the display panel comprising pixels; a driving chip, the driving chip being electrically connected to the display panel; a covering film, wherein the covering film covers the driving chip; as well as a heat dissipation member configured to dissipate heat generated by the driver chip, wherein the heat dissipation member overlaps with the cover film in a plan view and includes a transition material having a glass transition temperature less than or equal to a heat generation temperature of the driver chip.

2. The display device according to claim 1, wherein The transition material remains in a solid phase at the heating temperature of the driving chip.

3. The display device according to claim 1, wherein A ratio of the volume of the transition material to the total volume of the heat dissipation member is 100%.

4. The display device according to claim 1, wherein The glass transition temperature of the transition material is in the range of 25 degrees Celsius to 80 degrees Celsius.

5. The display device according to claim 1, wherein The modulus of the heat dissipation member is 100 MPa or greater. The display device according to claim 1 , wherein: The heat dissipation member is directly provided on one surface of the cover film.

7. The display device according to claim 1, wherein The heat dissipation member is disposed adjacent to the driving chip.

8. The display device according to claim 1, wherein At least a portion of the cover film is spaced apart from one side of the display panel to define an air gap between the cover film and the display panel, and Part of the heat dissipation member is positioned within the air gap.

9. The display device according to claim 1, wherein The display panel includes: a first region, wherein the pixels are arranged in the first region; a bending region that is curved relative to a bending axis; and a second region, the second region being spaced apart from the first region and the curved region being interposed between the first region and the second region; Wherein, the cover film and the heat dissipation member are provided in the second region.

10. The display device according to claim 9, further comprising: a bending protection layer disposed in the bending region, and Wherein, the heat dissipation member completely covers the curved protection layer.

11. The display device according to claim 1, wherein The transition material includes at least one of an acrylic resin and an epoxy resin.

12. The display device according to claim 11, wherein The acrylic resin is a polymer derived from a resin composition including a (meth)acrylate monomer, a (meth)acrylate oligomer, and a photoinitiator.

13. The display device according to claim 12, wherein: A homopolymer formed from the (meth)acrylate monomer has a glass transition temperature of 100 degrees Celsius or greater.

14. The display device according to claim 13, wherein: The (meth)acrylate monomer may be present in an amount of 20 parts by weight or more based on 100 parts by weight of the resin composition.

15. The display device according to claim 11, wherein The epoxy resin is a polymer derived from a resin composition including an epoxy monomer and a photoinitiator.

16. A display device comprising: A display panel, the display panel comprising pixels; a metal plate, the metal plate being arranged below the display panel; a heat source, the heat source being disposed below the metal plate; as well as A heat dissipation member is provided between the metal plate and the heat source and configured to dissipate heat generated by the heat source, wherein the heat dissipation member includes a transition material having a glass transition temperature less than or equal to a heat generation temperature of the heat source.

17. The display device according to claim 16, wherein: The transition material remains in a solid phase at the heat generation temperature of the heat source.

18. The display device according to claim 16, wherein: A ratio of the volume of the transition material to the total volume of the heat dissipation member is 100%.

19. The display device according to claim 16, wherein: The glass transition temperature of the transition material is in the range of 25 degrees Celsius to 80 degrees Celsius.

20. The display device according to claim 16, wherein The modulus of the heat dissipation member is 100 MPa or greater.

21. The display device according to claim 16, wherein The heat dissipation member overlaps the heat source in a plan view.

22. The display device according to claim 16, wherein The heat dissipation member is directly provided on one surface of the metal plate.

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