Multifunctional integrated composite busbar device

Abstract

The invention relates to a multifunctional integrated composite busbar device, and relates to the technical field of power electronics, the multifunctional integrated composite busbar device comprises a busbar main body, the busbar main body comprises a conductive layer, a heat dissipation layer and an insulating layer, the heat dissipation layer is combined below the conductive layer through a hot pressing process, and a current transmission interface is arranged on the outer wall of the conductive layer. The heat dissipation layer comprises a fin structure, the outer wall of the heat dissipation layer is coated with an insulating layer, one side of the current transmission interface is provided with a capacitor assembly, the conductive layer is internally provided with a coil winding, the coil winding is internally provided with an embedded inductor, four corners of the busbar main body are all provided with mounting positioning holes, and the mounting positioning holes are provided with mounting holes. According to the device, the heat dissipation efficiency, the electrical parameter adjusting capability and the current stability of a system are improved, the size and the weight of equipment are reduced, and the complexity and the cost of the system are reduced. Meanwhile, the device has wide applicability and flexibility, and can be customized and optimized according to actual requirements.

Description

Technical Field

[0001] The present application relates to the field of power electronics technology, and in particular to a multifunctional integrated composite busbar device. Background Art

[0002] In the field of power electronics, busbars are crucial components for current transmission, and their performance directly impacts the efficiency and stability of the entire system. Traditional busbars typically only perform the single function of current transmission, while components such as heat sinks, capacitors, and inductors are housed separately. This not only takes up a significant amount of space but also increases system complexity and cost.

[0003] At present, in order to solve this problem, some technologies try to integrate some components into the busbar, but the integration level is not high and the functions are relatively simple, which still cannot meet the requirements of modern power electronic equipment for high performance and miniaturization.

[0004] Existing integrated busbars have problems such as single function and low integration, which cannot fully utilize the advantages of composite busbars and limit the further improvement of the performance of power electronic equipment.

[0005] In view of the above-mentioned related technologies, a solution is now proposed. Summary of the Invention

[0006] The purpose of this application is to provide a multifunctional integrated composite busbar device to solve the technical problems of single function and low integration of traditional busbars in the prior art.

[0007] This application provides a multifunctional integrated composite busbar device, which adopts the following technical solutions: A multifunctional integrated composite busbar device includes a busbar body, which includes a conductive layer, a heat dissipation layer and an insulating layer. The heat dissipation layer is combined with a heat dissipation layer below the conductive layer through a hot pressing process. A current transmission interface is provided on the outer wall of the conductive layer. The current transmission interface is provided in several groups, and each group of the current transmission interfaces is evenly arranged along the horizontal direction of the conductive layer. The heat dissipation layer includes a fin structure, and the fin structure is provided in several groups, and each group of the fin structures is evenly arranged along the horizontal direction of the heat dissipation layer. The outer wall of the heat dissipation layer is covered with an insulating layer. A capacitor assembly is provided on one side of the current transmission interface. A coil winding is provided inside the conductive layer, and an embedded inductor is provided inside the coil winding. A conductive through-hole is provided on one side of the embedded inductor, and the embedded inductor is connected to the conductive layer through the conductive through-hole. Mounting positioning holes are provided at the four corners of the busbar body.

[0008] By adopting the above technical solutions, a comprehensive improvement in the integration, heat dissipation performance, electrical stability and structural reliability of power electronic equipment has been achieved. The core of this is to combine the multi-layer composite structure of the conductive layer, heat dissipation layer and insulation layer with the embedded integration of capacitors and inductors to form a highly compact busbar body. The conductive layer uses highly conductive materials such as oxygen-free copper as the current transmission core, and realizes multi-path low-loss current distribution through evenly arranged current transmission interfaces to ensure system efficiency; the heat dissipation layer uses the fin structure and the conductive layer through hot pressing and bonding design, and uses the wavy trapezoidal fins to increase the heat dissipation area, and cooperates with the thermal interface material layer to optimize the heat conduction path, so that heat can be quickly transferred from the conductive layer to the heat dissipation base, solving the problem of heat concentration in high power density scenarios; The capacitor components utilize KEMET T598 series surface-mount power capacitors soldered directly to the conductive layer. The comb-shaped conductive copper busbar layout reduces parasitic inductance and achieves high-frequency filtering. TDK SLF series embedded inductors are connected to the conductive layer via conductive vias, with the coil windings integrated within the busbar to reduce electromagnetic interference from external circuits. The symmetrical design of the mounting holes ensures precise mechanical fixation between the busbar and the equipment, preventing contact problems caused by vibration.

[0009] Preferably, a thermal interface material layer is arranged between the conductive layer and the heat dissipation layer, the thermal interface material layer is composed of thermal conductive silicone grease and graphene composite, and the thickness of the thermal interface material layer is 0.2 mm, a temperature compensation layer is arranged on one side of the thermal interface material layer, the temperature compensation layer includes a high conductive layer, a transition buffer layer and a combination layer, a molybdenum-copper alloy layer is arranged on one side of the high conductive layer, a combination layer is arranged on one side of the transition buffer layer, the high conductive layer is coated with oxygen-free copper by 50%, the transition buffer layer is coated with molybdenum-copper alloy by 40%, and the combination layer is coated with aluminum-silicon alloy by 10%.

[0010] By adopting the above solution, a thermal interface material layer and a layered temperature compensation layer composed of a thermal grease and graphene composite are introduced, significantly improving the heat dissipation efficiency, thermal stability, and mechanical reliability of the busbar device. The thermal interface material layer is located directly between the conductive layer and the heat dissipation layer. Its core function is to reduce the interfacial contact thermal resistance and utilize the high thermal conductivity of graphene to quickly transfer heat from the conductive layer to the heat dissipation layer. At the same time, the flexible filling properties of the thermal grease can compensate for the microscopic gaps caused by processing tolerances. The temperature compensation layer is further divided into a high-conductivity layer, a transition buffer layer, and a combination layer. A material gradient design achieves a step-by-step transition in the thermal expansion coefficient: the high conductivity of oxygen-free copper ensures low loss in the main current transmission path. Molybdenum-copper alloy acts as an intermediate layer to buffer the thermal stress between the conductive layer and the heat dissipation layer. Aluminum-silicon alloy enhances the interfacial bonding strength through silicon element diffusion strengthening, avoiding delamination failure under high-temperature cycling.

[0011] Preferably, the fin structure includes a wavy arrangement frame, fins, a heat dissipation base and root reinforcement ribs. Fins are arranged above the wavy arrangement frame, the cross-section of the fins is trapezoidal, and the fins are arranged in several groups. Each group of fins is evenly arranged along the horizontal direction of the wavy arrangement frame. A heat dissipation base is arranged below the wavy arrangement frame, and a root reinforcement rib is arranged on one side of the fin. Each group of fins is fixed to the wavy arrangement frame through the root reinforcement rib.

[0012] By adopting the above solution, the wavy arrangement frame serves as the fin support base, and its wavy layout extends in the horizontal direction, which increases the contact area between the heat dissipation layer and the air, and at the same time forms a tortuous airflow channel, which enhances convection heat dissipation through the turbulent effect. The trapezoidal cross-section fins are evenly arranged along the wavy arrangement frame. Its cross-sectional design reduces air flow resistance. The narrower trapezoidal structure at the top can reduce thermal stress concentration. The wide and thick area at the bottom improves thermal conductivity by increasing the contact surface. The heat dissipation base and the conductive layer are directly bonded through the thermal interface material layer, which quickly conducts the Joule heat generated by the conductive layer to the fin structure, forming an efficient heat conduction link. The root reinforcement ribs are located at the connection between the fin and the wavy arrangement frame. The local thickening design improves mechanical strength, prevents high-frequency vibration or thermal deformation from causing fin root fracture, and ensures long-term operational stability. The flexible structure of the wavy arrangement frame combined with the rigid support of the root reinforcement ribs can compensate for the expansion difference of the busbar caused by temperature changes and avoid thermal fatigue cracking. The trapezoidal fins are designed with a gradient cross-sectional area, which improves the heat dissipation efficiency compared to rectangular fins with the same material usage, while reducing the energy consumption of the air cooling system.

[0013] Preferably, an anti-creeping groove is provided on the outer wall of the insulating layer, an interface bonding layer is provided on one side of the anti-creeping groove, the interface bonding layer connects the insulating layer and the heat dissipation layer by vacuum diffusion welding, and the thickness of the interface bonding layer is 80 μm.

[0014] By adopting the above solution, anti-creeping grooves and interface bonding layers are designed on the outer wall of the insulation layer, and a vacuum diffusion welding process is used to achieve the connection between the heat dissipation layer and the insulation layer; Specifically, the anti-creep groove's geometric design extends the surface creepage distance, effectively suppressing the risk of arcing and leakage current. Together with the interface bonding layer, it forms a dual protection mechanism of "physical barrier + chemical bonding." The interface bonding layer is 80μm thick and utilizes a vacuum diffusion welding process with a temperature controlled at 800-850°C, a pressure of 5-8MPa, and a holding time of 30 minutes. This creates a metallurgical bond between the insulation layer and the heat dissipation layer, avoiding the high thermal resistance and aging issues of traditional adhesives. Furthermore, the intelligent monitoring module embedded in the groove integrates temperature, current, and vibration sensors via a flexible circuit. The temperature sensor uses the DS18B20, the current sensor uses the ACS712, and the vibration sensor uses the ADXL345. These three sensors achieve signal acquisition and anti-deformation protection through the serpentine-shaped flexible circuit.

[0015] Preferably, the capacitor assembly includes a surface-mount power capacitor, a capacitor connection loop, an electrode pad and a conductive copper busbar, a capacitor connection loop is provided on one side of the surface-mount power capacitor, an electrode pad is provided on one side of the surface-mount power capacitor, a conductive copper busbar is provided on one side of the capacitor connection loop, the conductive copper busbar is arranged in a comb-like shape along the horizontal direction of the capacitor connection loop, and the conductive copper busbar is connected to the electrode pad.

[0016] The above solution significantly improves the busbar's integration, current transmission efficiency, and heat dissipation performance. Surface-mount power capacitors are embedded directly near the busbar's conductive layer, electrically connected to the electrode pads via a capacitor connection loop. Comb-shaped conductive copper busbars are evenly arranged horizontally along the capacitor connection loop, forming a multi-path parallel power transmission network. This design reduces parasitic inductance by shortening the electrical path between the capacitor and the busbar. The comb-shaped distributed conductive copper busbar optimizes current density distribution and reduces the risk of localized heating. The electrode pads are connected to the conductive copper busbar using high-precision laser welding, ensuring contact resistance below 0.1mΩ. A mechanical stress distribution design improves vibration resistance.

[0017] Preferably, a groove is provided between the anti-creep groove and the interface bonding layer, an intelligent monitoring module is provided inside the groove, the intelligent monitoring module includes a temperature sensor, a current sensor and a vibration sensor, a current sensor is provided on one side of the temperature sensor, a vibration sensor is provided on one side of the current sensor, a flexible circuit is provided on one side of the temperature sensor, the current sensor and the vibration sensor, and the flexible circuit has a serpentine routing shape.

[0018] Using this solution, the module consists of a temperature sensor, a current sensor, and a vibration sensor. These sensors are connected via a serpentine flexible circuit and physically isolated from the busbar's conductive and heat dissipation layers. The DS18B20 temperature sensor is embedded in a groove near the conductive layer, directly monitoring the temperature rise caused by high current transmission. The ACS712 Hall-effect current sensor uses magnetic induction to contactlessly collect current fluctuations, preventing interference with the main circuit. The ADXL345 triaxial accelerometer-based vibration sensor detects abnormal busbar vibrations caused by mechanical stress or electromagnetic forces. The flexible circuit utilizes a polyimide-based serpentine routing design, which not only adapts to deformation caused by thermal expansion of the busbar but also reduces the impact of stress concentration on sensor signal transmission. This sensor data is transmitted to an external control system via the flexible circuit, enabling closed-loop management of overload warnings, optimized heat dissipation efficiency, and mechanical fault diagnosis. The innovation of this design lies in the deep integration of multimodal sensors with the busbar structure. Firstly, the customized spatial layout with a groove depth of 2mm provides physical protection for the sensors while ensuring the mechanical strength of the insulation layer. Secondly, the non-invasive coupling of the sensors with the conductive and heat dissipation layers avoids the negative impact of traditional external sensors on the busbar's electrical performance.

[0019] Preferably, a current transmission channel is provided above the current transmission interface, a conductive coating is provided on the inner wall of the current transmission channel, and the flexible circuit maintains a minimum safety distance of 3 mm from the current transmission channel.

[0020] By adopting the above solution, multiple components work together to achieve the compatibility of high-reliability current transmission and intelligent monitoring. The conductive coating uses a silver-graphene composite material such as Electrolube AG-901, which covers the inner wall of the current transmission channel, which can reduce contact resistance and improve arc resistance. At the same time, it forms a low-impedance path with the conductive layer to ensure the stability of large current transmission. The flexible circuit adopts serpentine routing and maintains a safety distance of 3mm to avoid electromagnetic interference of high current magnetic fields on temperature sensors, current sensors and vibration sensors. At the same time, it meets insulation spacing standards and prevents creepage risks. The flexible circuit is embedded in the groove through a hot pressing process. Its serpentine structure can compensate for the thermal expansion and deformation of the busbar during operation. The sensor is directly welded to the copper foil of the flexible circuit to achieve simultaneous optimization of signal acquisition and physical protection.

[0021] Preferably, the fins include main heat dissipation fins and auxiliary heat dissipation fins, the main heat dissipation fins and the auxiliary heat dissipation fins are arranged at a 35° staggered angle along the horizontal direction of the wavy arrangement frame, and the height of the main heat dissipation fins is 10 mm, and the height of the auxiliary heat dissipation fins is 5 mm.

[0022] The 35° staggered angle design, verified by aerodynamic simulations, breaks the laminar boundary layer accumulation caused by traditional parallel fins, forcing the airflow to form turbulent effects between the fins, thereby increasing the heat exchange area contact ratio. The main heat dissipation fins bear the main heat dissipation load, and their height matches the heat flux density distribution in the core heating area of ​​the busbar. The auxiliary heat dissipation fins fill the gaps between the main fins, providing auxiliary heat dissipation in low heat flux areas while reducing wind resistance. The two are spatially coupled through a wavy arrangement frame to ensure uniform heat diffusion along the base. Under alternating thermal stress, the root of the fin is fixed to the arrangement frame through reinforcing ribs using a brazing + riveting composite process, which increases the shear strength of the fin to more than 180MPa.

[0023] Preferably, a modular connection interface is provided at the top of the busbar body, and the modular connection interface includes a power connection terminal, a signal connection terminal and a mechanical fixing hole. A signal connection terminal is provided on one side of the power connection terminal, and a mechanical fixing hole is provided on one side of the signal connection terminal. There are two groups of mechanical fixing holes, and the two groups of mechanical fixing holes are symmetrically arranged along the horizontal direction of the modular connection interface. Anti-loosening threads are provided inside the mechanical fixing holes.

[0024] By adopting the above solution, the modular connection interface achieves efficient scalability, signal integrity, and mechanical stability of the busbar device through the coordinated design of power connection terminals, signal connection terminals, and mechanical fixing holes. The power connection terminals are directly connected to the conductive layer and are responsible for high current transmission. The signal connection terminals are connected to the flexible circuit of the intelligent monitoring module in claim 6 and are used to transmit monitoring signals from temperature, current, and vibration sensors. The physical isolation design of the two prevents electromagnetic interference between the power and signal lines. The mechanical fixing holes are symmetrically distributed on both sides of the interface. The internal anti-loosening thread adopts a 30° inclination angle design, combined with high-strength alloy material to ensure the tightness of the interface in a vibration environment, while providing a standardized installation reference for external modules. Through functional zoning, mechanical reinforcement and sensor fusion design, the busbar device achieves high compatibility, high reliability and intelligent monitoring capabilities under complex working conditions, significantly improving the modular integration level of the power system.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. The conductive layer adopts a composite design of oxygen-free copper and molybdenum-copper alloy to improve current transmission efficiency and reduce resistance loss. The coil winding and conductive vias directly embed the inductor into the conductive layer, reducing parasitic inductance and optimizing high-frequency current response. 2. The comb-shaped conductive copper busbar layout shortens the capacitor connection loop path, reduces parasitic parameters, and improves high-frequency filtering performance. Direct welding of electrode pads reduces intermediate connection links and enhances the electrical reliability of the capacitor and busbar. 3. Temperature, current, and vibration sensors monitor operating status in real time through flexible circuits, adapting to complex mechanical deformation environments. At the same time, a 3mm gap is maintained between the flexible circuit and the current transmission channel to avoid electromagnetic interference and breakdown risks. 4. The power connection terminals and signal terminals are arranged independently to reduce electromagnetic interference. The positioning holes on the four corners enable quick and accurate installation and adapt to different equipment frames. 5. Through the integration of the conductive layer, heat dissipation layer, capacitors, inductors and monitoring modules, the busbar's "transmission - heat dissipation - filtering - monitoring" multifunctional integration is achieved, reducing system complexity. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a multifunctional integrated composite busbar device of the present application; Figure 2 This is a schematic diagram of the partial three-dimensional structure of the heat dissipation layer and the insulation layer of a multifunctional integrated composite busbar device of the present application; Figure 3 This is a schematic diagram of the three-dimensional structure of a capacitor assembly of a multifunctional integrated composite busbar device of the present application; Figure 4 This is a schematic diagram of the partial side view of the conductive layer of a multifunctional integrated composite busbar device of the present application; Figure 5 This is a schematic diagram of the partial structure of the groove and intelligent monitoring module of a multifunctional integrated composite busbar device of the present application.

[0027] Explanation of the accompanying symbols: 1. Busbar body; 2. Conductive layer; 3. Heat dissipation layer; 4. Insulation layer; 5. Current transmission interface; 6. Fin structure; 601. Wave-shaped arrangement frame; 602. Fin; 6021. Main heat dissipation fin; 6022. Auxiliary heat dissipation fin; 603. Heat dissipation base; 604. Root reinforcement rib; 7. Capacitor assembly; 701. Surface-mount power capacitor; 702. Capacitor connection loop; 703. Electrode pad; 704. Conductive copper busbar; 8. Coil winding; 9. Embedded inductor; 10. Conductive through-hole; 11. Installation and positioning Hole; 12. Thermal interface material layer; 13. Temperature compensation layer; 1301. High conductive layer; 1302. Transition buffer layer; 1303. Combination layer; 14. Anti-creep groove; 15. Interface bonding layer; 16. Groove; 17. Intelligent monitoring module; 18. Temperature sensor; 19. Current sensor; 20. Vibration sensor; 21. Flexible circuit; 22. Current transmission channel; 23. Conductive coating; 24. Modular connection interface; 25. Power connection terminal; 26. Signal connection terminal; 27. Mechanical fixing hole; 28. Anti-loosening thread. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1 - Attachment Figure 5 , further details of this application are given.

[0029] The embodiments of the present application disclose a multifunctional integrated composite busbar device.

[0030] Reference Figure 1 A multifunctional integrated composite busbar device includes a busbar body 1, the busbar body 1 including a conductive layer 2, a heat dissipation layer 3 and an insulating layer 4, the heat dissipation layer 3 is combined with the heat dissipation layer 3 below the conductive layer 2 by a hot pressing process, a current transmission interface 5 is provided on the outer wall of the conductive layer 2, the current transmission interface 5 is provided in several groups, and each group of the current transmission interface 5 is evenly arranged along the horizontal direction of the conductive layer 2, the heat dissipation layer 3 includes a fin structure 6, the fin structure 6 is provided in several groups, and each group of the fin structure 6 is evenly arranged along the horizontal direction of the heat dissipation layer 3, the outer wall of the heat dissipation layer 3 is covered with an insulating layer 4, a capacitor assembly 7 is provided on one side of the current transmission interface 5, a coil winding 8 is provided inside the conductive layer 2, an embedded inductor 9 is provided inside the coil winding 8, a conductive through-hole 10 is provided on one side of the embedded inductor 9, the embedded inductor 9 is connected to the conductive layer 2 through the conductive through-hole 10, and mounting positioning holes 11 are provided at the four corners of the busbar body 1.

[0031] Specifically, the busbar body 1 adopts a layered integrated design. The conductive layer 2 is made of high-purity oxygen-free copper. The conductive layer 2 is tightly bonded to the heat dissipation layer 3 through a hot pressing process: the temperature is controlled at 180-220°C and the pressure is 15-20 MPa. A thermal interface material layer 12 composed of a thermal grease and graphene composite with a thickness of 0.2 mm is set between the two to ensure efficient heat transfer to the heat dissipation layer. The surface of the heat dissipation layer 3 is evenly distributed with wavy fin structures 6. The fins 602 are made of aluminum-silicon alloy with a trapezoidal cross-section. The main heat dissipation fins 6021 and the auxiliary heat dissipation fins 6022 are staggered at 35 degrees and fixed to the wavy arrangement frame 601 through root reinforcement ribs 604, forming a large surface area heat dissipation channel, effectively reducing the temperature rise of hot spots. Multiple groups of current transmission interfaces 5 are evenly arranged horizontally on the outer wall of the conductive layer 2 with precise spacing. TDK C series surface-mount power capacitor integrated capacitor components 7 are selected on the interface side and are welded to electrode pads 703 via comb-shaped conductive copper busbars 704 to shorten the loop inductance. Coil windings 8 are embedded inside the conductive layer 2, with a Murata LQH5BP series embedded inductor 9 at its core. Laser-drilled conductive through-holes 10 achieve a low-impedance connection to the conductive layer 2 to suppress high-frequency noise. Mounting positioning holes 11 are set at the four corners of the busbar to achieve modular mechanical fixation.

[0032] Reference Figure 1 and Figure 2 A thermal interface material layer 12 is provided between the conductive layer 2 and the heat dissipation layer 3. The thermal interface material layer 12 is composed of thermal grease and a graphene composite, and the thickness of the thermal interface material layer 12 is 0.2 mm. A temperature compensation layer 13 is provided on one side of the thermal interface material layer 12. The temperature compensation layer 13 includes a high conductive layer 1301, a transition buffer layer 1302 and a combination layer 1303. A molybdenum-copper alloy layer 1302 is provided on one side of the high conductive layer 1301, and a combination layer 1303 is provided on one side of the transition buffer layer 1302. The high conductive layer 1301 is coated with 50% oxygen-free copper, the transition buffer layer 1302 is coated with 40% molybdenum-copper alloy, and the combination layer 1303 is coated with 10% aluminum-silicon alloy.

[0033] Specifically, the thermal interface material layer 12 is made of a 0.2mm thick composite of thermally conductive silicone grease and graphene, in which graphene is evenly dispersed in the silicone grease matrix at a mass ratio of 5%. The thermal interface material layer 12 is filled with the microscopic gap between the conductive layer 2 and the heat dissipation layer 3 through a hot pressing process, reducing the interface contact thermal resistance to below 0.05°C·cm² / W. Above this layer, the temperature compensation layer 13 is designed with gradient materials: the high conductive layer 1301 is made of oxygen-free copper with a purity of ≥99.99% through a plasma spraying process to form a 50μm thick coating, which is directly attached to the conductive layer 2 to match its high conductivity properties; the transition buffer layer 1302 is formed by pre-cooling isostatic pressing of molybdenum-copper alloy, with a thickness of 40μm and a thermal expansion coefficient of 6.5×10⁻ 6 / ℃ between oxygen-free copper 17×10⁻ 6 / ℃ and aluminum silicon alloy 23×10⁻ 6 / ℃, which can relieve interlayer thermal stress; The combined layer 1303 is formed into a 10μm thin film using an aluminum-silicon alloy using a magnetron sputtering process, forming a metallurgical bond with the aluminum substrate of the heat dissipation layer 3. The three layers are bonded at the atomic level through vacuum diffusion welding at a temperature of 450°C, a pressure of 15MPa, and a heat preservation time of 30 minutes. The interlayer peel strength of the overall structure under the working conditions of -40°C to 150°C is ≥18MPa.

[0034] Reference Figure 1 and Figure 2The fin structure 6 includes a wavy arrangement frame 601, fins 602, a heat dissipation base 603 and a root reinforcement rib 604. The fins 602 are arranged above the wavy arrangement frame 601. The cross-section of the fins 602 is trapezoidal, and the fins 602 are arranged in several groups. Each group of fins 602 is evenly arranged along the horizontal direction of the wavy arrangement frame 601. A heat dissipation base 603 is arranged below the wavy arrangement frame 601. A root reinforcement rib 604 is provided on one side of the fins 602. Each group of fins 602 is fixed to the wavy arrangement frame 601 through the root reinforcement rib 604.

[0035] Specifically, the wave-shaped arrangement frame 601 serves as the supporting framework for the fins 602. Its wave-shaped design maximizes the heat dissipation surface area through a periodic undulating structure with a wavelength of 5-8 mm and an amplitude of 3-5 mm. It also guides the airflow along the wave direction to form turbulence, thereby improving heat dissipation efficiency. The fins 602 are designed with a trapezoidal cross-section and are evenly arranged horizontally along the wavy arrangement frame 601, with a spacing of 4-6 mm between each fin. Rapid heat diffusion is achieved by increasing the contact area and using a gradient heat dissipation path. The heat dissipation base 603 is made of a high-thermal-conductivity aluminum-based composite material and is seamlessly connected to the bottom of the wavy arrangement frame 601 through a vacuum brazing process, ensuring that heat is quickly transferred from the busbar conductive layer 2 to the fins 602. The root reinforcement ribs 604 are made of a nickel-based alloy and embedded in the connection between the fins 602 and the wavy arrangement frame 601. A triangular reinforcement area is formed through a laser cladding process to prevent the fins 602 from breaking due to high-frequency vibration or thermal stress.

[0036] Reference Figure 1 and Figure 2 An anti-creeping groove 14 is provided on the outer wall of the insulating layer 4, and an interface bonding layer 15 is provided on one side of the anti-creeping groove 14. The interface bonding layer 15 connects the insulating layer 4 and the heat dissipation layer 3 by vacuum diffusion welding, and the thickness of the interface bonding layer 15 is 80 μm.

[0037] Specifically, first, a V-shaped anti-creep groove 14 with a depth of 0.5 mm and a width of 1.2 mm is processed on the surface of the heat dissipation layer 3, and the groove is continuously distributed along the outer wall of the insulation layer 4 at an inclination angle of 45°, effectively increasing the surface creepage distance to 1.8 times the standard value; the interface bonding layer 15 uses a nickel-based alloy foil as an intermediate layer material, and through a vacuum diffusion welding process at a temperature of 850°C and a pressure of 15MPa for 30 minutes, the epoxy resin material of the insulation layer 4 and the aluminum alloy base of the heat dissipation layer 3 form a metallurgical bond, and the thickness of the bonding layer is accurately controlled within a tolerance range of 80μm±5μm, which not only ensures the thermal conductivity continuity but also avoids the interface stress caused by the difference in the thermal expansion coefficient of the materials, and the anti-creep groove 14 adopts a V-shaped asymmetric cross-section design, and its aspect ratio is optimized to 2:3, which is matched with the silicone sealant filling process to realize uniform distribution of the surface electric field.

[0038] With reference to Figure 3 and Figure 4 , the capacitor assembly 7 comprises a surface-mounted power capacitor 701, a capacitor connection circuit 702, an electrode pad 703, and a conductive copper bar 704, one side of the surface-mounted power capacitor 701 is provided with the capacitor connection circuit 702, one side of the surface-mounted power capacitor 701 is provided with the electrode pad 703, one side of the capacitor connection circuit 702 is provided with the conductive copper bar 704, the conductive copper bar 704 is arranged in a comb-tooth shape along the horizontal direction of the capacitor connection circuit 702, and the conductive copper bar 704 is connected with the electrode pad 703.

[0039] Specifically, the surface-mounted power capacitor 701 is vertically installed on the electrode pad 703 through a reflow soldering process, the electrode pad 703 adopts a gold-plated copper substrate to reduce the contact resistance, and a pad array matched with the capacitor connection circuit 702 is formed through a laser etching process, the capacitor connection circuit 702 adopts a multi-layer copper-clad ceramic substrate design, a high-frequency low-loss dielectric layer is embedded inside, and the conductive copper bar 704 is physically connected with the conductive copper bar 704 through a silver paste sintering process, the conductive copper bar 704 innovatively adopts a comb-tooth arrangement structure, the single-tooth width is 2 mm, the pitch is 0.8 mm, and the conductive copper bar 704 is arranged along the horizontal direction of the capacitor connection circuit 702, and a wedge-shaped chamfer is arranged at the end of each copper tooth to optimize the current density distribution. In this design, the comb-tooth copper bar 704 and the electrode pad 703 form a three-dimensional connection architecture, so that the charge-discharge circuit of the surface-mounted power capacitor 701 is shortened to within 8 mm, the measured parasitic inductance is reduced, and when installed, the conductive copper bar 704 is mechanically fixed with the busbar body 1 through a 0.3 mm thick insulating adhesive layer, and a 0.5 mm thermal expansion gap is reserved to compensate for the thermal stress of copper-aluminum dissimilar materials.

[0040] With reference to Figure 1 , Figure 2 and Figure 5A groove 16 is provided between the anti-creep groove 14 and the interface bonding layer 15. An intelligent monitoring module 17 is provided inside the groove 16. The intelligent monitoring module 17 includes a temperature sensor 18, a current sensor 19 and a vibration sensor 20. A current sensor 19 is provided on one side of the temperature sensor 18, and a vibration sensor 20 is provided on one side of the current sensor 19. A flexible circuit 21 is provided on one side of each of the temperature sensor 18, the current sensor 19 and the vibration sensor 20. The flexible circuit 21 has a serpentine routing shape.

[0041] Specifically, an anti-creep groove 14 is first machined on the surface of the insulating layer 4, and then a precision stamping process is used to form a groove 16 with a depth of 1.2mm between the anti-creep groove 14 and the interface bonding layer 15. The intelligent monitoring module 17 is fixed to the bottom of the groove using surface mount technology (SMT). Its temperature sensor 18 uses a DS18B20 digital sensor mounted on the inner wall of the groove near the conductive layer 2, forming a heat conduction path with the conductive layer through thermal conductive silicone. The current sensor 19 uses an ACS712 Hall effect sensor embedded around the conductive through-hole 10, forming a current sensing loop with the conductive layer 2 through copper foil routing. The vibration sensor 20 uses an ADXL345 three-axis accelerometer and is fixed to the groove area corresponding to the heat dissipation substrate 603 through epoxy resin potting. Each sensor is interconnected through a flexible circuit 21 with a serpentine routing design. The flexible circuit 21 uses an FPC board with a polyimide substrate and extends to the signal connection terminal 26 of the modular connection interface 24 in a 35° staggered wiring manner. The peak-to-valley spacing of the serpentine routing is designed to be 0.5mm, which effectively improves the bending resistance of the line. The installation of the entire intelligent monitoring module 17 adopts a vacuum adsorption positioning process. After the sensor array is assembled, high-temperature resistant silicone rubber is used for overall potting to form an integrated monitoring unit with both protection and heat dissipation functions.

[0042] Reference Figure 1 A current transmission channel 22 is provided above the current transmission interface 5 , a conductive coating 23 is provided on the inner wall of the current transmission channel 22 , and the flexible circuit 21 maintains a minimum safety distance of 3 mm from the current transmission channel 22 .

[0043] Specifically, the current transmission channel 22 arranged above the current transmission interface 5 is realized by the process of silver-plated copper conductive coating 23 on the inner wall, and its surface roughness is controlled at Ra≤0.8μm to improve the current carrying capacity. The channel is integrated with the conductive layer 2 of the busbar body 1 through a precision stamping process. Its cross-section adopts a gradient trapezoidal design to effectively reduce the eddy current loss. The flexible circuit 21 is made of polyimide substrate and is bonded and fixed to the groove 16 in the anti-creep groove 14 through a vacuum hot pressing process. The serpentine flexible circuit 21 path maintains a parallel spacing of ≥3mm with the current transmission channel 22. This distance design is calculated based on the double insulation requirements, which can ensure the electromagnetic compatibility between the high current channel and the signal line. In specific implementation, the current transmission channel 22 is connected to the busbar body 1 by laser welding, and the welding penetration is controlled in the range of 30% to 40% of the busbar thickness, combined with the thermal expansion coefficient of the conductive coating 23 of 17×10⁻ 6 / ℃ and copper substrate 16.5×10⁻ 6 / ℃ to ensure structural reliability under high temperature conditions.

[0044] Reference Figure 2 The fins 602 include main heat dissipation fins 6021 and auxiliary heat dissipation fins 6022. The main heat dissipation fins 6021 and the auxiliary heat dissipation fins 6022 are arranged at a 35° staggered angle along the horizontal direction of the wavy arrangement frame 601, and the height of the main heat dissipation fins 6021 is 10 mm, and the height of the auxiliary heat dissipation fins 6022 is 5 mm.

[0045] Specifically, the main cooling fins 6021 and auxiliary cooling fins 6022 are vertically welded to the wave crests and troughs of the wave-shaped arrangement frame 601 via root reinforcement ribs 604, forming a 35° staggered angle. The main cooling fins 6021 are stamped from 1.5mm thick 6063 aluminum alloy, with trapezoidal cross-section grooves at a height of 10mm to increase the heat dissipation area. The auxiliary cooling fins 6022 are bent from 0.8mm thick copper sheets and are designed to be 5mm high to fit into the gaps between the main cooling fins 6021 to form an airflow channel. The two are interference-fitted with the arc-shaped groove of the wave-shaped arrangement frame 601 through the Y-shaped support structure of the root reinforcement rib 604, and are finally brazed as a whole to the dovetail groove positioning structure of the heat dissipation base 603.

[0046] Reference Figure 1A modular connection interface 24 is provided at the top of the busbar body 1. The modular connection interface 24 includes a power connection terminal 25, a signal connection terminal 26 and a mechanical fixing hole 27. A signal connection terminal 26 is provided on one side of the power connection terminal 25, and a mechanical fixing hole 27 is provided on one side of the signal connection terminal 26. There are two groups of mechanical fixing holes 27, and the two groups of mechanical fixing holes 27 are symmetrically arranged along the horizontal direction of the modular connection interface 24. The inside of the mechanical fixing hole 27 is provided with an anti-loosening thread 28.

[0047] Specifically, the power connection terminals 25, signal connection terminals 26 and mechanical fixing holes 27 are arranged symmetrically in the horizontal direction, wherein the power connection terminals 25 are directly welded to the surface of the conductive layer 2 using gold-plated copper alloy material, forming a vertical through-structure with the current transmission channel 22, ensuring that the contact resistance is less than 0.5 mΩ during large current transmission; the signal connection terminals 26 are connected to the intelligent monitoring module 17 through the flexible circuit 21, and a 0.5 mm pitch SMT mounting process is used to realize synchronous transmission of multi-parameter signals; two sets of mechanical fixing holes 27 are symmetrically distributed on both sides of the interface, and 60° V-shaped anti-loosening threads 28 are processed in the holes and pre-coated with Loctite 243 thread glue. They are rigidly connected to the equipment frame through M4 stainless steel screws and can withstand 20 N·m installation torque and 10G vibration shock.

[0048] The implementation principle of this embodiment is as follows: This composite busbar device uses a conductive layer 2 as its core carrier, with a heat dissipation layer 3 tightly laminated underneath via a hot pressing process, forming an integrated "conducting and dissipating" substrate. The outer wall of the conductive layer 2 is provided with evenly distributed current transmission interfaces 5, with power connection terminals 25 and signal connection terminals 26 installed horizontally at intervals. This interface forms a comb-like connection with the capacitor assembly 7 via a conductive copper busbar 704. The heat dissipation layer 3 utilizes a wavy arrangement frame 601 to support the main heat dissipation fins 6021 and auxiliary heat dissipation fins 6022. Root reinforcement ribs 604 ensure mechanical stability between the fins 602 and the base. Its outer surface is coated with a 0.08mm thick interface bonding layer 15 and an insulating layer 4 via a vacuum diffusion welding process. After current is input through modular interface 24, it is transmitted in two paths: the main path is conducted directly to transmission interface 5 through conductive layer 2, and the branch path enters embedded inductor 9 through conductive via 10 for filtering. The inductor coil winding 8 and capacitor assembly 7 form an LC filter circuit via electrode pad 703. The surface-mount power capacitor 701 achieves dynamic compensation through capacitor connection loop 702. Heat generated by conductive layer 2 is transferred to heat dissipation layer 3 through 0.2mm thermal interface material layer 12. Thermal grease fills microscopic gaps, and graphene composite improves lateral thermal conductivity. The temperature compensation layer 13 is a three-step gradient material combination of 50% oxygen-free copper, 40% molybdenum-copper alloy, and 10% aluminum-silicon alloy to achieve thermal expansion coefficient matching. The wavy fin structure 602 creates turbulent airflow, enhancing natural convection.

[0049] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are marked with the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A multifunctional integrated composite busbar device, comprising a busbar body (1), characterized in that: The busbar body (1) comprises a conductive layer (2), a heat dissipation layer (3) and an insulating layer (4); a heat dissipation layer (3) is combined below the conductive layer (2) by a hot pressing process; a current transmission interface (5) is provided on the outer wall of the conductive layer (2); the current transmission interface (5) is provided in a plurality of groups, and each group of the current transmission interface (5) is evenly arranged along the horizontal direction of the conductive layer (2); the heat dissipation layer (3) comprises a fin structure (6); the fin structure (6) is provided in a plurality of groups, and each group of the fin structure (6) is evenly arranged along the horizontal direction of the heat dissipation layer (3); The heat dissipation layer (3) is evenly arranged in the direction, an insulating layer (4) is provided on the outer wall of the heat dissipation layer (3), a capacitor assembly (7) is provided on one side of the current transmission interface (5), a coil winding (8) is provided inside the conductive layer (2), an embedded inductor (9) is provided inside the coil winding (8), a conductive through hole (10) is provided on one side of the embedded inductor (9), the embedded inductor (9) is connected to the conductive layer (2) through the conductive through hole (10), and mounting positioning holes (11) are provided at the four corners of the busbar body (1).

2. A multifunctional integrated composite busbar device according to claim 1, characterized in that: A thermal interface material layer (12) is provided between the conductive layer (2) and the heat dissipation layer (3), the thermal interface material layer (12) being composed of thermal conductive silicone grease and a graphene composite, and having a thickness of 0.2 mm; a temperature compensation layer (13) is provided on one side of the thermal interface material layer (12), the temperature compensation layer (13) comprising a high conductive layer (1301), a transition buffer layer (1302) and a combination layer (1303); a molybdenum-copper alloy layer (1302) is provided on one side of the high conductive layer (1301), a combination layer (1303) is provided on one side of the transition buffer layer (1302), the high conductive layer (1301) is coated with 50% oxygen-free copper, the transition buffer layer (1302) is coated with 40% molybdenum-copper alloy, and the combination layer (1303) is coated with 10% aluminum-silicon alloy.

3. The multifunctional integrated composite busbar device according to claim 1, characterized in that: The fin structure (6) comprises a wavy arrangement frame (601), fins (602), a heat dissipation base (603) and root reinforcement ribs (604); the fins (602) are arranged above the wavy arrangement frame (601); the cross section of the fins (602) is trapezoidal, and the fins (602) are arranged in a plurality of groups; each group of the fins (602) is evenly arranged along the horizontal direction of the wavy arrangement frame (601); the heat dissipation base (603) is arranged below the wavy arrangement frame (601); a root reinforcement rib (604) is arranged on one side of the fins (602); and each group of the fins (602) is fixed to the wavy arrangement frame (601) via the root reinforcement rib (604).

4. The multifunctional integrated composite busbar device according to claim 1, characterized in that: An anti-creeping groove (14) is provided on the outer wall of the insulating layer (4), and an interface bonding layer (15) is provided on one side of the anti-creeping groove (14). The interface bonding layer (15) connects the insulating layer (4) and the heat dissipation layer (3) by vacuum diffusion welding, and the thickness of the interface bonding layer (15) is 80 μm.

5. The multifunctional integrated composite busbar device according to claim 1, characterized in that: The capacitor assembly (7) comprises a surface-mount power capacitor (701), a capacitor connection loop (702), an electrode pad (703) and a conductive copper busbar (704); the capacitor connection loop (702) is provided on one side of the surface-mount power capacitor (701); the electrode pad (703) is provided on one side of the surface-mount power capacitor (701); a conductive copper busbar (704) is provided on one side of the capacitor connection loop (702); the conductive copper busbar (704) is arranged in a comb-tooth shape along the horizontal direction of the capacitor connection loop (702), and the conductive copper busbar (704) is connected to the electrode pad (703).

6. The multifunctional integrated composite busbar device according to claim 4, characterized in that: A groove (16) is provided between the anti-creep groove (14) and the interface bonding layer (15), an intelligent monitoring module (17) is provided inside the groove (16), and the intelligent monitoring module (17) includes a temperature sensor (18), a current sensor (19) and a vibration sensor (20), a current sensor (19) is provided on one side of the temperature sensor (18), a vibration sensor (20) is provided on one side of the current sensor (19), and a flexible circuit (21) is provided on one side of the temperature sensor (18), the current sensor (19) and the vibration sensor (20), and the flexible circuit (21) is in a serpentine routing shape.

7. The multifunctional integrated composite busbar device according to claim 6, characterized in that: A current transmission channel (22) is provided above the current transmission interface (5), a conductive coating (23) is provided on the inner wall of the current transmission channel (22), and the flexible circuit (21) maintains a minimum safety distance of 3 mm from the current transmission channel (22).

8. The multifunctional integrated composite busbar device according to claim 3, characterized in that: The fins (602) include main heat dissipation fins (6021) and auxiliary heat dissipation fins (6022), the main heat dissipation fins (6021) and the auxiliary heat dissipation fins (6022) being arranged in a 35° staggered arrangement along the horizontal direction of the wavy arrangement frame (601), the main heat dissipation fins (6021) having a height of 10 mm, and the auxiliary heat dissipation fins (6022) having a height of 5 mm.

9. The multifunctional integrated composite busbar device according to claim 1, characterized in that: A modular connection interface (24) is provided at the top of the busbar body (1), and the modular connection interface (24) includes a power connection terminal (25), a signal connection terminal (26) and a mechanical fixing hole (27). A signal connection terminal (26) is provided on one side of the power connection terminal (25), and a mechanical fixing hole (27) is provided on one side of the signal connection terminal (26). There are two groups of mechanical fixing holes (27), and the two groups of mechanical fixing holes (27) are symmetrically arranged along the horizontal direction of the modular connection interface (24). Anti-loosening threads (28) are provided inside the mechanical fixing holes (27).

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