Display module, display device and display panel

Abstract

The invention discloses a display module, a display device and a display panel, the display module comprises the display panel and a circuit board, a plurality of bonding pads of a binding area of the display panel comprise a plurality of first bonding pads and a plurality of second bonding pads which are arranged along a first direction, a first area is arranged between the plurality of first bonding pads and the plurality of second bonding pads, and a second area is arranged between the plurality of second bonding pads and the plurality of first bonding pads. The first region has a first interval in the first direction, and the first interval is greater than the interval between the adjacent first bonding pads and the interval between the adjacent second bonding pads; a binding area of the circuit board is provided with a plurality of golden fingers, the plurality of golden fingers comprise a plurality of first golden fingers and a plurality of second golden fingers which are arranged along a first direction, a second area is arranged between the plurality of first golden fingers and the plurality of second golden fingers, the second area has a second interval in the first direction, and the second interval and the first interval meet the same condition; the probability of short circuit of partial bonding pads in the display panel is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a display device, and a display panel. Background Art

[0002] With the development of display technology, the application of display modules is becoming more and more extensive. Currently, display modules mainly include display panels and circuit boards. The circuit boards are used to provide control signals to the display panels to control the display of the display panels. Figure 1 As shown, the display panel has pads 01 and the circuit board has gold fingers 02. The pads 01 on the display panel and the gold fingers 02 on the circuit board are electrically connected to enable signal transmission between the display panel and the circuit board. However, in actual applications, short circuits easily occur between some of the pads on the display panel, affecting the display of the display module. Summary of the Invention

[0003] In view of the above problems, the present application provides a display module, a display device, and a display panel to reduce the probability of short circuits occurring in some pads of the display panel. The specific solution is as follows:

[0004] A display module, comprising:

[0005] a display panel, wherein the bonding area of ​​the display panel has a plurality of pads, the plurality of pads including a plurality of first pads and a plurality of second pads arranged along a first direction, a first area being defined between the plurality of first pads and the plurality of second pads, the first area having a first spacing in the first direction, the first spacing being greater than a spacing between adjacent first pads and a spacing between adjacent second pads;

[0006] A circuit board, wherein the binding area of ​​the circuit board has a plurality of gold fingers, the plurality of gold fingers including a plurality of first gold fingers and a plurality of second gold fingers arranged along the first direction, a second area is defined between the plurality of first gold fingers and the plurality of second gold fingers, the second area has a second spacing in the first direction, and the second spacing satisfies the same condition as the first spacing;

[0007] The voltage signals applied to the first pad and the second pad are different, the first gold finger is fixedly electrically connected to the first pad, and the second gold finger is fixedly electrically connected to the second pad.

[0008] A display device comprises the above-mentioned display module.

[0009] A display panel, wherein a bonding area of ​​the display panel has a plurality of pads, the plurality of pads including a plurality of first pads and a plurality of second pads arranged along a first direction, a first area being defined between the plurality of first pads and the plurality of second pads, the first area having a first spacing in the first direction, the first spacing being greater than a spacing between adjacent first pads and a spacing between adjacent second pads;

[0010] The voltage signals applied to the first pad and the second pad are different.

[0011] In the display module provided in the embodiment of the present application, the multiple pads in the binding area of ​​the display panel include multiple first pads and multiple second pads arranged along a first direction, and a first area is provided between the multiple first pads and the multiple second pads. The first area has a first spacing in the first direction, and the first spacing is greater than the spacing between adjacent first pads and the spacing between adjacent second pads. By increasing the distance between the first pads and the second pads, the probability of short circuit between the first pads and the second pads due to the entry of water vapor from the external environment is reduced, thereby reducing the probability of short circuit of the display module due to the entry of water vapor from the external environment.

[0012] Moreover, the multiple gold fingers in the binding area of ​​the circuit board include multiple first gold fingers and multiple second gold fingers arranged along the first direction, and there is a second area between the multiple first gold fingers and the multiple second gold fingers. The second area has a second spacing in the first direction, and the second spacing and the first spacing meet the same conditions, so that the positions of the multiple first gold fingers correspond to the positions of the multiple first pads, which is convenient for the first gold fingers and the first pads to be fixedly electrically connected, and the positions of the multiple second gold fingers correspond to the positions of the multiple second pads, which is convenient for the second gold fingers and the second pads to be fixedly electrically connected, thereby ensuring the transmission of signals between the display panel and the circuit board, and by increasing the distance between the first gold fingers and the second gold fingers, reducing the probability of short circuit between the first gold fingers and the second gold fingers due to the entry of water vapor in the external environment, thereby reducing the probability of short circuit in the binding area of ​​the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other features, advantages, and aspects of the various embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the originals and elements are not necessarily drawn to scale.

[0014] Figure 1 is a cross-sectional view of a conventional display module;

[0015] Figure 2 A cross-sectional view of a display module provided in this application;

[0016] Figure 3 for Figure 2 The corresponding top view;

[0017] Figure 4 for Figure 2 The schematic diagram of the display module being deformed is shown;

[0018] Figure 5 A cross-sectional view of another display module provided in this application;

[0019] Figure 6 for Figure 5 The corresponding top view;

[0020] Figure 7 A cross-sectional view of another display module provided by the present application;

[0021] Figure 8 for Figure 7 The corresponding top view;

[0022] Figure 9 A cross-sectional view of another display module provided by the present application;

[0023] Figure 10 for Figure 9 The corresponding top view;

[0024] Figure 11 A cross-sectional view of another display module provided by the present application;

[0025] Figure 12 for Figure 11 The corresponding top view;

[0026] Figure 13 A partial cross-sectional view of a display panel in a display module provided in one embodiment of the present application;

[0027] Figure 14 Another partial cross-sectional view of a display panel in a display module provided by one embodiment of the present application;

[0028] Figure 15 Another partial cross-sectional view of a display panel in a display module provided by one embodiment of the present application;

[0029] Figure 16 A partial cross-sectional view of a circuit board in a display module provided by one embodiment of the present application;

[0030] Figure 17 A cross-sectional view of another display module provided by the present application;

[0031] Figure 18 for Figure 17 The corresponding top view;

[0032] Figure 19 A cross-sectional view of another display module provided by the present application;

[0033] Figure 20 for Figure 19 The corresponding top view;

[0034] Figure 21 A cross-sectional view of another display module provided by the present application;

[0035] Figure 22 for Figure 21 The corresponding top view;

[0036] Figure 23 A cross-sectional view of another display module provided by the present application;

[0037] Figure 24 A top view of another display module provided in this application;

[0038] Figure 25 A top view of another display module provided in this application;

[0039] Figure 26 A schematic diagram of a display device provided in one embodiment of the present application;

[0040] Figure 27 A cross-sectional view of a display panel provided in this application;

[0041] Figure 28 for Figure 27 The corresponding top view;

[0042] Figure 29 A cross-sectional view of another display module provided in this application;

[0043] Figure 30 for Figure 29 The corresponding top view;

[0044] Figure 31 A cross-sectional view of another display module provided by the present application;

[0045] Figure 32 for Figure 31 The corresponding top view;

[0046] Figure 33 A cross-sectional view of another display module provided by the present application;

[0047] Figure 34 for Figure 33 The corresponding top view;

[0048] Figure 35 This is a top view of another display module provided by this application. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0051] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0052] As described in the background technology section, in actual applications, short circuits are likely to occur between some pads on a display panel, affecting the display of the display module.

[0053] This is because the signals transmitted by the pads on the display panel are not exactly the same. Some pads transmit signals with higher voltage values, while others transmit signals with lower voltage values. This results in a large voltage difference between some adjacent pads. At this time, if moisture from the external environment enters the electrical connection area between the display panel and the circuit board, the moisture will corrode the pads due to the high pressure difference, causing the pads to short circuit.

[0054] In view of this, the embodiment of the present application provides a display module, such as Figure 2 and Figure 3 As shown, the display module includes:

[0055] The display panel 10 includes a plurality of pads in a bonding area. The plurality of pads include a plurality of first pads 11 and a plurality of second pads 12 arranged along a first direction X. A first region is defined between the plurality of first pads 11 and the plurality of second pads 12. The first region has a first spacing D1 in the first direction X. The first spacing D1 is greater than a spacing D2 between adjacent first pads 11 and a spacing D3 between adjacent second pads 12. This increases the distance between the first pads 11 and the second pads 12, thereby reducing a probability of a short circuit between the first pads 11 and the second pads 12 due to entry of water vapor from the external environment, thereby reducing a probability of a short circuit in the display module due to entry of water vapor from the external environment.

[0056] The circuit board 20 has a plurality of gold fingers in its binding area, the plurality of gold fingers including a plurality of first gold fingers 21 and a plurality of second gold fingers 22 arranged along a first direction X, a second area being provided between the plurality of first gold fingers 21 and the plurality of second gold fingers 22, the second area having a second spacing D4 in the first direction X, the second spacing D4 and the first spacing D1 satisfying the same conditions, so that the positions of the plurality of first gold fingers 21 correspond to the positions of the plurality of first solder pads 11, facilitating a fixed electrical connection between the first gold fingers 21 and the first solder pads 11, and the positions of the plurality of second gold fingers 22 correspond to the positions of the plurality of second solder pads 12, facilitating a fixed electrical connection between the second gold fingers 22 and the second solder pads 12, thereby ensuring signal transmission between the display panel and the circuit board.

[0057] It should be noted that in this embodiment, the voltage signals applied to the first pad 11 and the second pad 12 are different, so as to increase the distance between the first pad 11 and the second pad 12, thereby reducing the probability of a short circuit between the first pad 11 and the second pad 12 due to the entry of external water vapor, thereby reducing the probability of a short circuit in the binding area of ​​the display module.

[0058] It should also be noted that the first gold finger 21 and the first pad 11 are fixedly electrically connected, and the second gold finger 22 and the second pad 12 are fixedly electrically connected. When the voltage signals applied to the first pad 11 and the second pad 12 are different, the voltage signals on the first gold finger 21 and the second gold finger 22 are also different. Therefore, in this embodiment, the distance between the first gold finger 21 and the second gold finger 22 is the second spacing D4, and the second spacing D4 and the first spacing D1 meet the same conditions. The distance between the first gold finger 21 and the second gold finger 22 can also be increased to reduce the probability of a short circuit between the first gold finger 21 and the second gold finger 22 due to the entry of water vapor in the external environment, thereby reducing the probability of a short circuit in the binding area of ​​the display module.

[0059] It should be further explained that, in this embodiment, the second spacing D4 and the first spacing D1 satisfy the same conditions, and the second spacing D4 and the first spacing D1 can be the same, or the second spacing D4 and the first spacing D1 can be basically the same, such as the second spacing D4 is slightly larger than the first spacing D1, or the second spacing D4 is slightly smaller than the first spacing D1. This application does not limit this. As long as it is ensured that in the direction perpendicular to the plane where the display module is located, the first pad 11 overlaps with its corresponding first gold finger 21, and the second pad 12 overlaps with its corresponding second gold finger 22, it is convenient to ensure that the first pad 11 is electrically connected to its corresponding first gold finger 21, and the second pad 12 is electrically connected to its corresponding second gold finger 22, which depends on the relative size of the width of the pad in the first direction and the width of the gold finger in the first direction.

[0060] Similarly, in this embodiment, the spacing D2 between adjacent first pads 11 and the spacing D5 between adjacent first gold fingers 21 also meet the same condition, and the spacing D3 between adjacent second pads 12 and the spacing D6 between adjacent second gold fingers 22 also meet the same condition.

[0061] Optionally, in one embodiment of the present application, Figure 4 As shown, the substrate 13 where the solder pads in the display panel are located is a flexible substrate. If the display panel is a flexible display panel, the substrate 23 where the gold fingers in the circuit board are located is a flexible substrate. If the circuit board is a flexible circuit board, the display panel and the circuit board are electrically connected through a conductive adhesive 30, wherein the conductive adhesive 30 contains a plurality of conductive particles 31, and the display panel and the circuit board are electrically connected through the conductive particles in the conductive adhesive 30.

[0062] It should be noted that, since the conductive adhesive has a certain flexibility, when the distance between the first solder pad 11 and the second solder pad 12 is large, and the distance between the first gold finger 21 and the second gold finger 22 is large, during the process of crimping the display panel 10 and the circuit board 20 to achieve electrical connection between the solder pads and the gold fingers, there may be a problem of uneven stress distribution in the first direction, resulting in the conductive adhesive 30 and the conductive particles being squeezed more into the area between the first solder pad 11 and the second solder pad 12, resulting in fewer conductive particles and stress concentration in the first area between the first solder pad 11 and the second solder pad 12, and increased binding resistance. Moreover, after the conductive adhesive is cured, the thickness between the first solder pad 11 and the second solder pad 12 increases, causing the morphology of the first area and / or the second area to deteriorate, affecting subsequent processes, and in severe cases even causing the display panel and the circuit board to peel off.

[0063] Therefore, in an optional embodiment of the present application, Figure 5 and Figure 6 As shown, the display module further includes: a plurality of dummy gold fingers 24 located in the second area and arranged along the first direction X. In the direction perpendicular to the plane of the display panel, the height of the dummy gold fingers 24 is not less than the height of the first gold finger 21 and the second gold finger 22. The dummy gold fingers 24 are insulating structures. By providing the insulating dummy gold fingers 24 between the first gold finger 21 and the second gold finger 22, when moisture in the environment enters the binding area of ​​the display module, the insulating dummy gold fingers 24 are used to ensure insulation between the first gold finger 21 and the second gold finger 22, thereby further reducing the probability of a short circuit between the first gold finger 21 and the second gold finger 22, thereby further reducing the probability of a short circuit between the display module.

[0064] It should be noted that in the embodiment, the height of the pseudo gold finger 24 is not lower than the height of the first gold finger 21 and the second gold finger 22, so in the embodiment, even if the water vapor in the external environment enters the binding area of the display module, corrodes the first gold finger 21 and the second gold finger 22, the corroded parts of the first gold finger 21 and the second gold finger 22 will not contact together through the insulating pseudo gold finger 24, causing the first gold finger 21 and the second gold finger 22 to short circuit.

[0065] Further, in the display module provided by the embodiment of the application, the pseudo gold finger 24 is arranged between the first gold finger 21 and the second gold finger 22, which can support the gap between the display panel and the circuit board when the display panel and the circuit board are pressed, reduce the probability that the conductive adhesive flows to the first gold finger 21 and the second gold finger 22, and causes the topography of the first area and / or the second area to be poor, thereby reducing the binding resistance of the pads and the gold fingers, and reducing the probability that the display panel and the circuit board are peeled off.

[0066] On the basis of any of the above embodiments, in an embodiment of the application, as shown in Figure 7 and Figure 8 The display module further includes: a plurality of pseudo pads 14 arranged in the first area and along the first direction X, the height of the pseudo pads 14 in the direction perpendicular to the plane where the display panel is located is not lower than the height of the first pad 11 and the second pad 12, wherein the surface of the pseudo pad is an insulating structure, so as to set the pseudo pad 14 with an insulating surface between the first pad 11 and the second pad 12, and use the pseudo pad 14 with an insulating surface to ensure the insulation between the first pad 11 and the second pad 12 after the water vapor in the environment enters the binding area of the display module, further reduce the probability of short circuit between the first pad 11 and the second pad 12, and further reduce the probability of short circuit of the display module.

[0067] It should be noted that in the embodiment, the height of the pseudo pad 14 is not lower than the height of the first pad 11 and the second pad 12, so in the embodiment, even if the water vapor in the external environment enters the binding area of the display module, corrodes the first pad 11 and the second pad 12, the corroded parts of the first pad 11 and the second pad 12 will not contact together through the pseudo pad 14 with an insulating surface, causing the first pad 11 and the second pad 12 to short circuit.

[0068] Moreover, in the display module provided in the embodiment of the present application, a dummy pad 14 is set between the first pad 11 and the second pad 12. When the display panel and the circuit board are crimped, the dummy pad 14 can be used to support the gap between the display panel and the circuit board, thereby reducing the probability of the conductive adhesive flowing between the first pad 11 and the second pad 12, causing the morphology of the first area and / or the second area to deteriorate, thereby reducing the binding resistance between the pad and the gold finger, and reducing the probability of peeling between the display panel and the circuit board.

[0069] Optionally, in one embodiment of the present application, in a direction perpendicular to the plane where the display module is located, the first solder pad and the second solder pad have the same height, and the first gold finger and the second gold finger have the same height, so that during the crimping process of the display panel and the circuit board, the stress at the first gold finger and the second gold finger is basically the same, thereby improving the stress balance during the crimping process of the display panel and the circuit board.

[0070] Optionally, in one embodiment of the present application, continue as Figure 7 As shown, the distance D8 between adjacent dummy pads 14 is the same as the distance D2 between adjacent first pads 11, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the first pads 11 are located and the area where the dummy pads 14 are located are the same; similarly, the distance D8 between adjacent dummy pads 14 is the same as the distance D3 between adjacent second pads 12, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the second pads 12 are located and the area where the dummy pads 14 are located are the same.

[0071] On the basis of the above embodiments, in one embodiment of the present application, the distance D8 between adjacent dummy pads 14 is the same as the distance D2 between adjacent first pads 11, and the distance D8 between adjacent dummy pads 14 is the same as the distance D3 between adjacent second pads 12, so that during the crimping process of the display panel and the circuit board, the stress shared by the areas where the first pads 11 and the second pads 12 are located and the stress shared by the areas where the dummy pads 14 are located are the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0072] Optionally, in one embodiment of the present application, the distance between the dummy pad 14 adjacent to the first pad 11 and the first pad 11 is also the same as the distance D2 between adjacent first pads 11, and / or the distance between the dummy pad 14 adjacent to the second pad 11 and the second pad 12 is also the same as the distance D3 between adjacent second pads 12, so as to further improve the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0073] In another embodiment of the present application, Figure 9 and Figure 10As shown, the distance D8 between adjacent pseudo pads 14 can also be greater than the distance D2 between adjacent first pads 11; similarly, the distance D8 between adjacent pseudo pads 14 can also be greater than the distance D3 between adjacent second pads 12. The present application does not make a limitation in this regard, and the number of pseudo pads 14 can be adjusted according to specific circumstances on the basis of ensuring the uniformity of the binding of the display panel and the circuit board.

[0074] Optionally, in an embodiment of the present application, two pseudo pads 14 can be arranged between the first pad 11 and the second pad 12, as shown in Figure 9 and Figure 10 as shown, one pseudo pad 14 can also be arranged, as shown in Figure 11 and Figure 12 The present application does not make a limitation in this regard, and the specific circumstances are determined accordingly.

[0075] On the basis of any of the above embodiments, in an embodiment of the present application, as shown in Figure 7 the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D5 between adjacent first gold fingers 21, so that the stress borne by the region where the first gold fingers 21 are located and the region where the pseudo gold fingers 24 are located is the same during the pressing process of the display panel and the circuit board; similarly, the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D6 between adjacent second gold fingers 22, so that the stress borne by the region where the second gold fingers 22 are located and the region where the pseudo gold fingers 24 are located is the same during the pressing process of the display panel and the circuit board.

[0076] On the basis of the above embodiment, in an embodiment of the present application, the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D5 between adjacent first gold fingers 21, and the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D6 between adjacent second gold fingers 22, so that the stress borne by the region where the first gold fingers 21, the second gold fingers 22 are located and the region where the pseudo gold fingers 24 are located is the same during the pressing process of the display panel and the circuit board, improving the balance of stress distribution during the pressing process of the display panel and the circuit board.

[0077] Optionally, in an embodiment of the present application, the distance between the pseudo gold finger 24 adjacent to the first gold finger 21 and the first gold finger 21 is also the same as the distance D5 between adjacent first gold fingers 21, and / or the distance between the pseudo gold finger 24 adjacent to the second gold finger 21 and the second gold finger 22 is also the same as the distance D6 between adjacent second gold fingers 22, so as to further improve the balance of stress distribution during the pressing process of the display panel and the circuit board. However, the present application does not make a limitation in this regard, and the specific circumstances are determined accordingly.

[0078] In another embodiment of the present application, as shown in Figure 9 and Figure 10As shown, the distance D7 between adjacent pseudo golden fingers 24 can be greater than the distance D5 between adjacent first golden fingers 21; similarly, the distance D7 between adjacent pseudo golden fingers 24 can also be greater than the distance D6 between adjacent second golden fingers 22. The present application does not limit this, and the number of pseudo golden fingers 24 can be adjusted according to specific circumstances on the basis of ensuring the uniformity of the binding of the display panel and the circuit board.

[0079] Optionally, in an embodiment of the present application, two pseudo golden fingers 24 can be arranged between the first golden fingers 21 and the second golden fingers 22, as shown in Figure 9 and Figure 10 As shown, one pseudo golden finger 24 can also be arranged, as shown in Figure 11 and Figure 12 The present application does not limit this, and the specific circumstances are determined accordingly.

[0080] On the basis of any of the above embodiments, in an embodiment of the present application, the width of the pseudo pad can be the same as the width of the pad, or can be different from the width of the pad, and the present application does not limit this. The width of the pseudo pad can be adjusted according to specific circumstances on the basis of ensuring the uniformity of the binding of the display panel and the circuit board. Similarly, the width of the pseudo golden finger can be the same as the width of the golden finger, or can be different from the width of the golden finger, and the present application does not limit this. The width of the pseudo golden finger can be adjusted according to specific circumstances on the basis of ensuring the uniformity of the binding of the display panel and the circuit board.

[0081] In an embodiment of the present application, as shown in Figure 13-15 wherein, Figure 13 is a cross-sectional view of the region where the adjacent pads and the pseudo pads are located, Figure 14 is a cross-sectional view of the region where the pads not adjacent to the pseudo pads are located, Figure 15 is a cross-sectional view of the region where the pseudo pads not adjacent to the pads are located, and the display panel comprises:

[0082] a first substrate 101:

[0083] a first metal layer 102 located on the first side of the first substrate 101, the first metal layer 102 comprising a plurality of first metal regions;

[0084] a first insulating layer 103 located on the side of the first metal layer 102 away from the first substrate 101, the first insulating layer 103 at least exposing part of the surface of the first metal region in the region A where the pads are located, it should be noted that one A region corresponds to one region where the pads are located;

[0085] a second metal layer 104 located on the side of the first insulating layer 103 away from the first metal layer 102, the second metal layer 104 comprising a plurality of second metal regions;

[0086] a second insulating layer 105 located on the side of the second metal layer 104 away from the first insulating layer 103, the second insulating layer 105 at least exposing part of the surface of the second metal region of the area A where the plurality of pads are located;

[0087] a third metal layer 106 located on the side of the second insulating layer 105 away from the second metal layer 104, the third metal layer 106 comprising a plurality of third metal regions;

[0088] a third insulating layer 107 located on the side of the third metal layer 106 away from the second insulating layer 105, the third insulating layer 107 at least exposing part of the surface of the third metal region of the area A where the plurality of pads are located;

[0089] a fourth metal layer 108 located on the side of the third insulating layer 107 away from the third metal layer 106, the fourth metal layer 108 comprising a plurality of fourth metal regions;

[0090] a fourth insulating layer 109 located on the side of the third insulating layer 107 away from the third metal layer 106, the fourth insulating layer 109 at least covering the area B where the plurality of dummy pads are located. It should be noted that one B area corresponds to one dummy pad area.

[0091] It should be noted that in the embodiment, in the direction perpendicular to the plane of the display panel, the second metal region, the third metal region and the fourth metal region do not overlap with the plurality of dummy pad areas B, and in the plurality of pad areas A, the first metal region, the second metal region, the third metal region and the fourth metal region are stacked and electrically connected to form pads, and in the plurality of dummy pad areas B, the first metal region, the first insulating layer 103, the second insulating layer 105, the third insulating layer 107 and the fourth insulating layer 109 form the dummy pads 14, so as to form the dummy pads 14 by reusing the existing structure of the display panel, thereby increasing the number of dummy pads 14 in the display panel without increasing the process flow of the display panel.

[0092] Specifically, in an embodiment of the present application, the display panel comprises a plurality of display pixels, gate lines, data lines, power supply lines and touch electrode lines, wherein the gate lines are used to provide control signals to the display pixels to control their display or non-display, the data lines are used to provide data signals to the display pixels to control their brightness, the power supply lines are used to provide power supply signals to the components of the display panel, and the touch electrode lines are used for touch detection on the surface of the display panel. In the embodiment, the first metal layer is the metal layer where the gate lines are located, the second metal layer is the metal layer where the data lines are located, the third metal layer is the metal layer where the power supply lines are located, and the fourth metal layer is the metal layer where the touch electrode lines are located.

[0093] Optionally, in one embodiment of the present application, the first insulating layer, the second insulating layer, and the third insulating layer are inorganic insulating layers, and the fourth insulating layer is an organic insulating layer, but the present application does not limit this and it depends on the specific circumstances.

[0094] Specifically, in one embodiment of the present application, in a direction perpendicular to the plane of the display panel, the thickness of the metal layer where the data line and the power line are located ranges from 0.7 microns to 0.8 microns, the thickness of the metal layer where the touch electrode line is located is approximately 0.4 microns, the thickness of the metal layer where the gate line is located is approximately 0.3 microns, the total thickness of the first insulating layer, the second insulating layer, and the third insulating layer is approximately 1.06 microns, and the fourth insulating layer is approximately 2 microns.

[0095] It can be seen that in this embodiment, in area A where multiple pads are located, the first metal area, the second metal area, the third metal area and the fourth metal area are stacked and electrically connected to each other to form a pad with a height of 2.3+1.06 microns. In order to ensure that the height of the dummy pad area and the pad area meets the same conditions, so that the area where the pad is located and the area where the dummy pad is located have the same stress sharing effect when the display panel and the circuit board are pressed together, the display module provided in the embodiment of the present application utilizes a fourth insulating layer with a larger thickness and a first metal layer with a smaller thickness to form a dummy pad, so that the height of the pad is the same as the height of the dummy pad, but the present application does not limit this. In other embodiments of the present application, other methods can also be used to make the height of the pad and the height of the dummy pad basically the same, depending on the specific circumstances.

[0096] It should be noted that in this embodiment, in area B where multiple dummy pads are located, the first metal layer is covered by the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer on the side away from the first substrate. Therefore, it will not be corroded by water vapor in the external environment.

[0097] Specifically, in one embodiment of the present application, the first metal layer 102 is a molybdenum layer, and since the second insulating layer 105 on the side of the second metal layer 104 away from the first substrate 101 and the third insulating layer 107 on the side of the third metal layer 106 away from the first substrate 101 are relatively thin, in order to reduce the probability of the second metal layer 104 and the third metal layer 106 being corroded by water vapor in the external environment, the second metal layer 104 and the third metal layer 106 adopt a stacked structure of titanium layer, aluminum layer and titanium layer, but the present application does not limit this, and it depends on the specific situation.

[0098] It should also be noted that since the height of the dummy pad 14 in the display panel (i.e., the thickness in the direction perpendicular to the plane of the display panel) cannot be the sum of the height of the pad and its corresponding gold finger, in order to further improve the stress balance during the pressing process of the display panel and the circuit board, as shown in FIG. Figure 7 、 Figure 9 and Figure 11 As shown, when a dummy pad 14 is provided in the display panel, a dummy gold finger 24 corresponding to the dummy pad 14 is also provided on the circuit board, so that the sum of the heights of the dummy pad 14 and the dummy gold finger 24 meets the same condition as the sum of the heights of the pad and the gold finger.

[0099] In one embodiment of the present application, Figure 16 As shown, the dummy gold finger 24 is located on the insulating protrusion on the second substrate of the circuit board. Optionally, the dummy gold finger 24 and the second substrate 25 of the circuit board 20 are an integrated structure, but the present application is not limited to this. In other embodiments of the present application, the dummy gold finger 24 can also be formed separately, depending on the specific situation.

[0100] Specifically, in one embodiment of the present application, the gold finger is a Cu metal structure or a metal structure composed of a stack of Cu metal and Sn metal. This application does not limit this, and the specific configuration depends on the specific situation.

[0101] Optionally, in one embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the heights of the dummy gold finger and the gold finger meet the same conditions. Specifically, the heights of the dummy gold finger and the gold finger may be the same or substantially the same. This application does not impose any limitation on this, and it depends on the specific circumstances.

[0102] On the basis of the above embodiments, in one embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the sum of the heights of the dummy pad and its corresponding dummy gold finger is the same as the sum of the heights of the first pad and its corresponding first gold finger, so that during the process of pressing the display panel and the circuit board, the stress shared by the area where the dummy pad and its corresponding dummy gold finger is located is basically the same as the stress shared by the area where the first pad and its corresponding first gold finger is located, thereby improving the balance of stress distribution during the pressing process of the display panel and the circuit board; similarly, the sum of the heights of the dummy pad and its corresponding dummy gold finger is the same as the sum of the heights of the second pad and its corresponding second gold finger, so that during the process of pressing the display panel and the circuit board, the stress shared by the area where the dummy pad and its corresponding dummy gold finger is located is basically the same as the stress shared by the area where the second pad and its corresponding second gold finger is located, thereby improving the balance of stress distribution during the pressing process of the display panel and the circuit board.

[0103] Optionally, in one embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the sum of the heights of the dummy pad and its corresponding dummy gold finger is the same as the sum of the heights of the first pad and its corresponding first gold finger, and the sum of the heights of the dummy pad and its corresponding dummy gold finger is the same as the sum of the heights of the second pad and its corresponding second gold finger, so as to further improve the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0104] It should be noted that if the forming material of at least one of the dummy pad and the dummy gold finger includes an organic material, since the organic material has a certain elasticity, it will be compressed a certain distance during the crimping process of the display panel and the circuit board. Therefore, in an optional embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the sum of the heights of the dummy pad and its corresponding dummy gold finger is greater than the sum of the heights of the first pad and its corresponding first gold finger, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy pad and its corresponding dummy gold finger is located is basically the same as the stress shared by the area where the first pad and its corresponding first gold finger is located, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board; similarly, the sum of the heights of the dummy pad and its corresponding dummy gold finger is greater than the sum of the heights of the second pad and its corresponding second gold finger, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy pad and its corresponding dummy gold finger is located is basically the same as the stress shared by the area where the second pad and its corresponding second gold finger is located, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0105] Optionally, in one embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the sum of the heights of the dummy pad and its corresponding dummy gold finger is greater than the sum of the heights of the first pad and its corresponding first gold finger, and the sum of the heights of the dummy pad and its corresponding dummy gold finger is greater than the sum of the heights of the second pad and its corresponding second gold finger, so as to further improve the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0106] It should be noted that the above embodiments describe the display module provided in the embodiments of the present application by taking the display module including both pseudo pads and pseudo gold fingers as an example, but the present application does not limit this. In other embodiments of the present application, the display module may also only include pseudo gold fingers but not pseudo pads, depending on the specific circumstances.

[0107] The following describes the situation where the display module only includes dummy gold fingers.

[0108] Optionally, in one embodiment of the present application, Figure 17As shown, the display and module also include: a plurality of dummy gold fingers 24 located in the second area and arranged along the first direction X. In the direction perpendicular to the plane where the display panel is located, the height of the dummy gold fingers 24 is not less than the sum of the heights of the first gold fingers 21 and the first pads 11 corresponding thereto, so that during the process of pressing the display panel and the circuit board, the stress shared by the area where the dummy gold fingers 24 are located and the first pads and the area where the first gold fingers are located corresponding thereto are substantially the same, thereby improving the balance of stress distribution during the pressing process of the display panel and the circuit board; similarly, the height of the dummy gold fingers 24 is not less than the sum of the heights of the second gold fingers 22 and the second pads 12 corresponding thereto, so that during the process of pressing the display panel and the circuit board, the stress shared by the area where the dummy gold fingers 24 are located and the second pads and the area where the second gold fingers are located corresponding thereto are substantially the same, thereby improving the balance of stress distribution during the pressing process of the display panel and the circuit board.

[0109] On the basis of the above embodiments, in one embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the height of the dummy gold finger 24 is not less than the sum of the heights of the first gold finger 21 and its corresponding first solder pad 11, and the height of the dummy gold finger 24 is not less than the sum of the heights of the second gold finger 22 and its corresponding second solder pad 12, so as to further improve the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0110] Optionally, in one embodiment of the present application, when the material forming the dummy gold finger includes an organic material, since the organic material has a certain elasticity, it will be compressed a certain distance during the crimping process of the display panel and the circuit board. Therefore, in an optional embodiment of the present application, in a direction perpendicular to the plane where the display panel is located, the height of the dummy gold finger 24 is greater than the sum of the heights of the first gold finger 21 and its corresponding first solder pad 11, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy gold finger 24 is located and the area where the first solder pad 11 and its corresponding first gold finger 21 are located is basically the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board; similarly, the height of the dummy gold finger 24 is greater than the sum of the heights of the second solder pad 12 and its corresponding second gold finger 22, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy gold finger 24 is located and the area where the second solder pad 12 and its corresponding second gold finger 22 are located is basically the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0111] On the basis of the above-mentioned embodiments, in one embodiment of the present application, in the direction perpendicular to the plane where the display panel is located, the height of the pseudo gold finger 24 is greater than the sum of the height of the first gold finger 21 and the height of the first pad 11 corresponding to the first gold finger 21, and the height of the pseudo gold finger 24 is greater than the sum of the height of the second pad 12 and the height of the second gold finger 22 corresponding to the second pad 12, so as to further improve the balance of stress distribution in the process of pressing the display panel and the circuit board.

[0112] Optionally, in one embodiment of the present application, as shown in Figure 17 and Figure 18 , the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D5 between adjacent first gold fingers 21, so that the stress borne by the area where the first gold finger 21 is located and the area where the pseudo gold finger 24 is located is the same in the process of pressing the display panel and the circuit board; similarly, the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D6 between adjacent second gold fingers 22, so that the stress borne by the area where the second gold finger 22 is located and the area where the pseudo gold finger 24 is located is the same in the process of pressing the display panel and the circuit board.

[0113] On the basis of the above-mentioned embodiments, in one embodiment of the present application, the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D5 between adjacent first gold fingers 21, and the distance D7 between adjacent pseudo gold fingers 24 is the same as the distance D6 between adjacent second gold fingers 22, so that the stress borne by the area where the first gold finger 21 and the second gold finger 22 are located and the area where the pseudo gold finger 24 is located is the same in the process of pressing the display panel and the circuit board, thereby improving the balance of stress distribution in the process of pressing the display panel and the circuit board.

[0114] Optionally, in one embodiment of the present application, the distance between the pseudo gold finger 24 adjacent to the first gold finger 21 and the first gold finger 21 is also the same as the distance D5 between adjacent first gold fingers 21, and / or the distance between the pseudo gold finger 24 adjacent to the second gold finger 21 and the second gold finger 22 is also the same as the distance D6 between adjacent second gold fingers 22, so as to further improve the balance of stress distribution in the process of pressing the display panel and the circuit board. However, the present application does not make any limitation in this regard, and the specific conditions are determined accordingly.

[0115] In another embodiment of the present application, as shown in Figure 19 and Figure 20 , the distance D7 between adjacent pseudo gold fingers 24 can be greater than the distance D5 between adjacent first gold fingers 21; similarly, the distance D7 between adjacent pseudo gold fingers 24 can also be greater than the distance D6 between adjacent second gold fingers 22. The present application does not make any limitation in this regard, and the number of pseudo gold fingers 24 can be adjusted according to specific conditions on the basis of ensuring the uniformity of the binding of the display panel and the circuit board.

[0116] Optionally, in one embodiment of the present application, two dummy gold fingers 24 may be provided between the first gold finger 21 and the second gold finger 22, such as Figure 19 and Figure 20 As shown, a golden finger 24 can also be set, such as Figure 21 and Figure 22 As shown, this application does not limit this and the specific circumstances will depend on the specific situation.

[0117] Based on any of the above embodiments, in one embodiment of the present application, the width of the dummy gold finger may be the same as or different from the width of the gold finger. The present application does not impose any limitation on this. On the basis of ensuring the binding uniformity of the display panel and the circuit board, the width of the dummy gold finger may be adjusted according to the specific situation.

[0118] Optionally, in one embodiment of the present application, Figure 23 As shown, the circuit board includes: a second substrate 25 and a plurality of gold fingers located on the surface of the second substrate; in the area where the plurality of dummy gold fingers 24 are located, the surface of the second substrate 25 has a plurality of protrusions, which form the dummy gold fingers 24. Optionally, in one embodiment of the present application, the protrusions are integrally formed with the second substrate 25, that is, the dummy gold fingers are integrally formed with the second substrate, but this application is not limited to this. In other embodiments of the present application, the dummy gold fingers 24 can also be formed separately, depending on the specific situation.

[0119] Based on any of the above embodiments, in one embodiment of the present application, Figure 12 and Figure 22 As shown, the pad is a strip structure extending along the second direction Y to ensure electrical connection of the pad at each position along the second direction, and the gold finger is a strip structure extending along the second direction Y to ensure electrical connection of the gold finger at each position along the second direction.

[0120] Based on the above embodiment, in one embodiment of the present application, Figure 12 As shown, the dummy pad 14 is a strip structure extending along the second direction Y to simplify the process flow when making the dummy pad 14; however, this application is not limited to this. In other embodiments of this application, such as Figure 24 As shown, the dummy pad 14 includes a plurality of sub-dummy pads 141 arranged along the second direction Y, depending on the specific situation.

[0121] Similarly, continue as Figure 12 and Figure 22 As shown, the dummy gold finger 24 is a strip structure extending along the second direction Y, so as to simplify the process flow when making the dummy gold finger 24. However, this application is not limited to this. In other embodiments of this application, such as Figure 24 and Figure 25As shown, the pseudo gold finger 24 includes a plurality of sub-pseudo gold fingers 241 arranged along the second direction Y, as the case may be.

[0122] It should be noted that when the pseudo pad 14 includes a plurality of sub-pseudo pads 141 arranged along the second direction Y, since the different sub-pseudo pads 141 are electrically insulated, in the embodiment, the pseudo pad can be a structure with an insulating surface, or can be a conductive structure; similarly, the pseudo gold finger 24 includes a plurality of sub-pseudo gold fingers 241 arranged along the second direction Y, since the different pseudo gold fingers 241 are electrically insulated, in the embodiment, the pseudo gold finger can also be an insulating structure, or can be a conductive structure, which is not limited by the present application, and is as the case may be.

[0123] Specifically, in one embodiment of the present application, as shown in Figure 9 and Figure 24 , the display module includes:

[0124] a plurality of pseudo pads 14 located in the first area and arranged along the first direction X, in the direction perpendicular to the plane where the display panel is located, the height of the pseudo pad 14 is not less than the height of the first pad 11 and the second pad 12;

[0125] a plurality of pseudo gold fingers 24 located in the second area and arranged along the first direction X, in the direction perpendicular to the plane where the display panel is located, the height of the pseudo gold finger 24 is not less than the height of the first gold finger 21 and the second gold finger 22;

[0126] wherein the pseudo pad 14 and the pseudo gold finger 24 are conductive structures, wherein the pseudo pad 14 includes a plurality of sub-pseudo pads 141 arranged along the second direction Y, and the pseudo gold finger 24 includes a plurality of sub-pseudo gold fingers 241 arranged along the second direction Y.

[0127] Optionally, in one embodiment of the present application, as shown in Figure 9 and Figure 24 , the pseudo gold finger 24 and the first gold finger 21 and the second gold finger 22 are formed at the same time, so as to increase the pseudo gold finger 24 on the circuit board 20 without increasing the process flow of the circuit board 20; similarly, the pseudo pad 14 and the first pad 11 and the second pad 12 are formed at the same time, but the present application does not limit this, and is as the case may be.

[0128] In another embodiment of the present application, when the display module does not include a pseudo pad, but only includes a pseudo gold finger, as shown in Figure 19 and Figure 25 , the display module includes:

[0129] The plurality of dummy gold fingers 24 located in the second area and arranged along the first direction X have a height, in a direction perpendicular to the plane of the display panel, of no less than the sum of the heights of the first gold finger 21 and its corresponding first pad 11, and / or a height of no less than the sum of the heights of the second gold finger 22 and its corresponding second pad 12;

[0130] The dummy gold finger 24 is a conductive structure, and includes a plurality of sub-dummy gold fingers 241 arranged along the second direction Y.

[0131] Correspondingly, such as Figure 26 As shown, an embodiment of the present application further provides a display device, which includes the display module provided by any of the above embodiments. Since the relevant content of the display module has been described in the above embodiments, this application will not repeat it again.

[0132] Optionally, in one embodiment of the present application, the display device can be a mobile phone, a tablet computer, a wearable device, an in-vehicle device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc., and the embodiment of the present application does not impose any restrictions on this.

[0133] In summary, in the display module and display device provided in the embodiments of the present application, the multiple pads in the binding area of ​​the display panel include multiple first pads 11 and multiple second pads 12 arranged along the first direction X, and there is a first area between the multiple first pads 11 and the multiple second pads 12. The first area has a first spacing D1 in the first direction X, and the first spacing D1 is greater than the spacing D2 between adjacent first pads 11 and the spacing D3 between adjacent second pads 12. By increasing the distance between the first pads 11 and the second pads 12, the probability of short circuit between the first pads 11 and the second pads 12 due to the entry of water vapor from the external environment is reduced, thereby reducing the probability of short circuit of the display module due to the entry of water vapor from the external environment.

[0134] Moreover, the multiple gold fingers in the binding area of ​​the circuit board 20 include multiple first gold fingers 21 and multiple second gold fingers 22 arranged along the first direction X. There is a second area between the multiple first gold fingers 21 and the multiple second gold fingers 22. The second area has a second spacing D4 in the first direction X. The second spacing D4 and the first spacing D1 meet the same conditions, so that the positions of the multiple first gold fingers 21 correspond to the positions of the multiple first solder pads 11, which facilitates the fixed electrical connection between the first gold fingers 21 and the first solder pads 11, and the positions of the multiple second gold fingers 22 correspond to the positions of the multiple second solder pads 12, which facilitates the fixed electrical connection between the second gold fingers 22 and the second solder pads 12, thereby ensuring the transmission of signals between the display panel and the circuit board, and by increasing the distance between the first gold fingers 21 and the second gold fingers 22, the probability of short circuit between the first gold fingers 21 and the second gold fingers 22 due to the entry of water vapor in the external environment is reduced, thereby reducing the probability of short circuit in the binding area of ​​the display module.

[0135] In addition, an embodiment of the present application further provides a display panel, which can be a display panel in a display module provided in any of the above embodiments, such as Figure 27 and Figure 28 As shown, in this embodiment, the binding area of ​​the display panel 10 has a plurality of pads, and the plurality of pads include a plurality of first pads 11 and a plurality of second pads 12 arranged along a first direction X. A first area is defined between the plurality of first pads 11 and the plurality of second pads 12. The first area has a first spacing D1 in the first direction X. The first spacing D1 is greater than the spacing D2 between adjacent first pads 11 and the spacing D3 between adjacent second pads 12. By increasing the distance between the first pads 11 and the second pads 12, the probability of a short circuit between the first pads 11 and the second pads 12 due to the entry of water vapor from the external environment is reduced, thereby reducing the probability of a short circuit in the display module due to the entry of water vapor from the external environment.

[0136] It should be noted that in this embodiment, the voltage signals applied to the first pad 11 and the second pad 12 are different, so as to increase the distance between the first pad 11 and the second pad 12, thereby reducing the probability of a short circuit between the first pad 11 and the second pad 12 due to the entry of external water vapor, thereby reducing the probability of a short circuit in the binding area of ​​the display module.

[0137] Optionally, in one embodiment of the present application, Figure 29 and Figure 30As shown, the display module also includes: a plurality of dummy pads 14 located in the first area and arranged along the first direction X, wherein the height of the dummy pads 14 is not lower than the height of the first pad 11 and the second pad 12 in the direction perpendicular to the plane where the display panel is located, wherein the surface of the dummy pad is an insulating structure, so that by arranging the dummy pad 14 with an insulating surface between the first pad 11 and the second pad 12, after the water vapor in the environment enters the binding area of ​​the display module, the dummy pad 14 with an insulating surface is utilized to ensure the insulation between the first pad 11 and the second pad 12, thereby further reducing the probability of a short circuit between the first pad 11 and the second pad 12, thereby further reducing the probability of a short circuit in the display module.

[0138] It should be noted that, in this embodiment, the height of the dummy pad 14 is not lower than the height of the first pad 11 and the second pad 12. Therefore, in this embodiment, even if water vapor in the external environment enters the binding area of ​​the display module and causes corrosion to the first pad 11 and the second pad 12, the corroded portions of the first pad 11 and the second pad 12 will not cross the dummy pad 14 with an insulating surface and come into contact with each other, causing a short circuit between the first pad 11 and the second pad 12.

[0139] Moreover, in the display module provided in the embodiment of the present application, a dummy pad 14 is set between the first pad 11 and the second pad 12. When the display panel and the circuit board in the display module to which it is applied are crimped, the dummy pad 14 can be used to support the gap between the display panel and the circuit board, thereby reducing the probability of the conductive adhesive flowing between the first pad 11 and the second pad 12, causing the morphology of the first area to deteriorate, thereby reducing the binding resistance between the pad and its corresponding gold finger, and reducing the probability of peeling between the display panel and the circuit board.

[0140] Optionally, in one embodiment of the present application, in a direction perpendicular to the plane where the display module is located, the first solder pad and the second solder pad have the same height, so that during the crimping process of the display panel and the circuit board, the stress at the first solder pad and the second solder pad is basically the same, thereby improving the stress balance during the crimping process of the display panel and the circuit board.

[0141] Optionally, in one embodiment of the present application, continue as Figure 29 As shown, the distance D8 between adjacent dummy pads 14 is the same as the distance D2 between adjacent first pads 11, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the first pads 11 are located and the area where the dummy pads 14 are located are the same; similarly, the distance D8 between adjacent dummy pads 14 is the same as the distance D3 between adjacent second pads 12, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the second pads 12 are located and the area where the dummy pads 14 are located are the same.

[0142] On the basis of the above embodiments, in one embodiment of the present application, the distance D8 between adjacent dummy pads 14 is the same as the distance D2 between adjacent first pads 11, and the distance D8 between adjacent dummy pads 14 is the same as the distance D3 between adjacent second pads 12, so that during the crimping process of the display panel and the circuit board, the stress shared by the areas where the first pads 11 and the second pads 12 are located and the stress shared by the areas where the dummy pads 14 are located are the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0143] Optionally, in one embodiment of the present application, the distance between the dummy pad 14 adjacent to the first pad 11 and the first pad 11 is also the same as the distance D2 between adjacent first pads 11, and / or the distance between the dummy pad 14 adjacent to the second pad 11 and the second pad 12 is also the same as the distance D3 between adjacent second pads 12, so as to further improve the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0144] In another embodiment of the present application, Figure 31 and Figure 32 As shown, the distance D8 between adjacent dummy pads 14 may also be greater than the distance D2 between adjacent first pads 11; similarly, the distance D8 between adjacent dummy pads 14 may also be greater than the distance D3 between adjacent second pads 12. This application does not impose any limitation on this. On the basis of ensuring the uniformity of the binding between the display panel and the circuit board, the number of dummy pads 14 can be adjusted according to specific circumstances.

[0145] Optionally, in one embodiment of the present application, two dummy pads 14 may be provided between the first pad 11 and the second pad 12, such as Figure 31 and Figure 32 As shown, a dummy pad 14 may also be provided, such as Figure 33 and Figure 34 As shown, this application does not limit this and the specific circumstances will depend on the specific situation.

[0146] In one embodiment of the present application, Figure 13-15 As shown, Figure 13 It is a cross-sectional view of the area where the adjacent pads and dummy pads are located. Figure 14 is a cross-sectional view of the area where the pad is located that is not adjacent to the dummy pad. Figure 15 is a cross-sectional view of a region where a dummy pad is located and is not adjacent to a pad, wherein the display panel includes:

[0147] First substrate 101:

[0148] a first metal layer 102 located on a first side of the first substrate 101, the first metal layer 102 including a plurality of first metal regions;

[0149] a first insulating layer 103 located on a side of the first metal layer 102 away from the first substrate 101, wherein the first insulating layer 103 exposes at least a portion of the surface of the first metal region located in an area A where the plurality of solder pads are located. It should be noted that one area A corresponds to one solder pad region;

[0150] a second metal layer 104 located on a side of the first insulating layer 103 away from the first metal layer 102, the second metal layer 104 including a plurality of second metal regions;

[0151] a second insulating layer 105 located on a side of the second metal layer 104 away from the first insulating layer 103 , wherein the second insulating layer 105 exposes at least a portion of the surface of the second metal region in area A where the plurality of pads are located;

[0152] a third metal layer 106 located on a side of the second insulating layer 105 away from the second metal layer 104 , the third metal layer 106 including a plurality of third metal regions;

[0153] a third insulating layer 107 located on a side of the third metal layer 106 away from the second insulating layer 105 , wherein the third insulating layer 107 exposes at least a portion of the surface of the third metal region in area A where the plurality of pads are located;

[0154] a fourth metal layer 108 located on a side of the third insulating layer 107 away from the third metal layer 106 , wherein the fourth metal layer 108 includes a plurality of fourth metal regions;

[0155] The fourth insulating layer 109 is located on a side of the third insulating layer 107 away from the third metal layer 106 . The fourth insulating layer 109 at least covers the areas where the multiple dummy pads B are located. It should be noted that one B area corresponds to one dummy pad area.

[0156] It should be noted that, in this embodiment, in the direction perpendicular to the plane where the display panel is located, the second metal region, the third metal region and the fourth metal region do not overlap with the region B where the multiple dummy pads are located, and in the region A where the multiple pads are located, the first metal region, the second metal region, the third metal region and the fourth metal region are stacked and electrically connected to each other to form pads, and in the region B where the multiple dummy pads are located, the first metal region, the first insulating layer 103, the second insulating layer 105, the third insulating layer 107 and the fourth insulating layer 109 form a dummy pad 14, so as to form the dummy pad 14 by reusing the existing structure in the display panel, thereby adding the dummy pad 14 to the display panel without increasing the process flow of the display panel.

[0157] Specifically, in one embodiment of the present application, a display panel includes: a plurality of display pixels, gate lines, data lines, power lines, and touch electrode lines. The gate lines are used to provide control signals to the display pixels to control whether they display or not display; the data lines are used to provide data signals to the display pixels to control their display brightness; the power lines are used to provide power signals to various components in the display panel; and the touch electrode lines are used to detect touches on the surface of the display panel. In this embodiment, the first metal layer is the metal layer where the gate lines are located, the second metal layer is the metal layer where the data lines are located, the third metal layer is the metal layer where the power lines are located, and the fourth metal layer is the metal layer where the touch electrode lines are located.

[0158] Optionally, in one embodiment of the present application, the first insulating layer, the second insulating layer, and the third insulating layer are inorganic insulating layers, and the fourth insulating layer is an organic insulating layer, but the present application does not limit this and it depends on the specific circumstances.

[0159] Specifically, in one embodiment of the present application, in a direction perpendicular to the plane of the display panel, the thickness of the metal layer where the data line and the power line are located ranges from 0.7 microns to 0.8 microns, the thickness of the metal layer where the touch electrode line is located is approximately 0.4 microns, the thickness of the metal layer where the gate line is located is approximately 0.3 microns, the total thickness of the first insulating layer, the second insulating layer, and the third insulating layer is approximately 1.06 microns, and the fourth insulating layer is approximately 2 microns.

[0160] It can be seen that in this embodiment, in area A where multiple pads are located, the first metal area, the second metal area, the third metal area and the fourth metal area are stacked and electrically connected to each other to form a pad with a height of 2.3+1.06 microns. In order to ensure that the height of the dummy pad area and the pad area meets the same conditions, so that the area where the pad is located and the area where the dummy pad is located have the same stress sharing effect when the display panel and the circuit board are pressed together, the display module provided in the embodiment of the present application utilizes a fourth insulating layer with a larger thickness and a first metal layer with a smaller thickness to form a dummy pad, so that the height of the pad is the same as the height of the dummy pad, but the present application does not limit this. In other embodiments of the present application, other methods can also be used to make the height of the pad and the height of the dummy pad basically the same, depending on the specific circumstances.

[0161] It should be noted that in this embodiment, in area B where multiple dummy pads are located, the first metal layer is covered by the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer on the side away from the first substrate. Therefore, it will not be corroded by water vapor in the external environment.

[0162] Specifically, in one embodiment of the present application, the first metal layer 102 is a molybdenum layer, and since the second insulating layer 105 on the side of the second metal layer 104 away from the first substrate 101 and the third insulating layer 107 on the side of the third metal layer 106 away from the first substrate 101 are relatively thin, in order to reduce the probability of the second metal layer 104 and the third metal layer 106 being corroded by water vapor in the external environment, the second metal layer 104 and the third metal layer 106 adopt a stacked structure of titanium layer, aluminum layer and titanium layer, but the present application does not limit this, and it depends on the specific situation.

[0163] It should be noted that if the material forming the dummy pad includes an organic material, since the organic material has a certain elasticity, it will be compressed a certain distance during the crimping process of the display panel and the circuit board. Therefore, in an optional embodiment of the present application, in the direction perpendicular to the plane where the display panel is located, the height of the dummy pad is greater than the height of the first pad, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy pad is located and the area where the first pad is located are basically the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board; similarly, the height of the dummy pad is greater than the height of the second pad, so that during the crimping process of the display panel and the circuit board, the stress shared by the area where the dummy pad is located and the area where the second pad is located are basically the same, thereby improving the balance of stress distribution during the crimping process of the display panel and the circuit board.

[0164] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 28 、 Figure 30 、 Figure 32 and Figure 34 As shown, the pad is a strip structure extending along the second direction Y to ensure electrical connection of each position of the pad along the second direction.

[0165] Based on the above embodiment, in one embodiment of the present application, Figure 30 、 Figure 32 and Figure 34 As shown, the dummy pad 14 is a strip structure extending along the second direction Y to simplify the process flow when making the dummy pad 14; however, this application is not limited to this. In other embodiments of this application, such as Figure 35 As shown, the dummy pad 14 includes a plurality of sub-dummy pads 141 arranged along the second direction Y, depending on the specific situation.

[0166] It should be noted that when the dummy pad 14 includes multiple sub-dummy pads 141 arranged along the second direction Y, since different sub-dummy pads 141 are electrically insulated, in this embodiment, the dummy pad can be a structure with an insulating surface or a conductive structure. This application does not limit this, and it depends on the specific situation.

[0167] Specifically, in one embodiment of the present application, Figure 31 and Figure 35 As shown, the display module includes:

[0168] A plurality of dummy pads 14 located in the first region and arranged along the first direction X, wherein the height of the dummy pads 14 in a direction perpendicular to the plane of the display panel is not less than the height of the first pads 11 and the second pads 12;

[0169] The dummy pad 14 is a conductive structure, and includes a plurality of sub-dummy pads 141 arranged along the second direction Y.

[0170] Optionally, in one embodiment of the present application, the dummy pad 14 and the first pad 11 and the second pad 12 are formed simultaneously, so as to add the dummy pad 14 to the display panel without increasing the process flow of the display panel, but the present application does not limit this, and it depends on the specific situation.

[0171] In summary, in the display panel provided in the embodiment of the present application, the multiple pads in the binding area of ​​the display panel include multiple first pads 11 and multiple second pads 12 arranged along the first direction X, and there is a first area between the multiple first pads 11 and the multiple second pads 12. The first area has a first spacing D1 in the first direction X, and the first spacing D1 is greater than the spacing D2 between adjacent first pads 11 and the spacing D3 between adjacent second pads 12, so as to reduce the probability of short circuit between the first pad 11 and the second pad 12 due to the entry of water vapor from the external environment by increasing the distance between the first pad 11 and the second pad 12, thereby reducing the probability of short circuit between the first pad 11 and the second pad 12 due to the entry of water vapor from the external environment, thereby reducing the probability of short circuit of the display module due to the entry of water vapor from the external environment.

[0172] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on the differences from other embodiments, and reference can be made to the common and similar parts between the various embodiments. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple. For relevant parts, refer to the description of the methods.

[0173] It should be noted that, in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. It should also be noted that, in this article, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the article or equipment comprising a series of elements includes not only those elements, but also includes other elements that are not clearly listed, or also includes elements that are inherent to such article or equipment. In the absence of more restrictions, the elements limited by the statement "comprising a ..." do not exclude the presence of other identical elements in the article or equipment comprising the above elements.

[0174] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that: include: a display panel, wherein the bonding area of ​​the display panel has a plurality of pads, the plurality of pads including a plurality of first pads and a plurality of second pads arranged along a first direction, a first area being defined between the plurality of first pads and the plurality of second pads, the first area having a first spacing in the first direction, the first spacing being greater than a spacing between adjacent first pads and a spacing between adjacent second pads; A circuit board, wherein the binding area of ​​the circuit board has a plurality of gold fingers, the plurality of gold fingers including a plurality of first gold fingers and a plurality of second gold fingers arranged along the first direction, a second area is defined between the plurality of first gold fingers and the plurality of second gold fingers, the second area has a second spacing in the first direction, and the second spacing satisfies the same condition as the first spacing; The voltage signals applied to the first pad and the second pad are different, the first gold finger is fixedly electrically connected to the first pad, and the second gold finger is fixedly electrically connected to the second pad.

2. The display module according to claim 1, wherein: Also includes: A plurality of dummy gold fingers are located in the second area and arranged along the first direction. In a direction perpendicular to the plane of the display panel, the height of the dummy gold fingers is not less than the height of the first gold fingers and the second gold fingers. The dummy gold fingers are insulating structures.

3. The display module according to claim 2, wherein: Also includes: A plurality of dummy pads located in the first area and arranged along the first direction, wherein the height of the dummy pads is not less than the height of the first pad and the second pad in a direction perpendicular to the plane of the display panel; Wherein, the surface of the dummy pad is an insulating structure.

4. The display module according to claim 3, wherein: The display panel includes: a first substrate; a first metal layer located on the first side of the first substrate, the first metal layer comprising a plurality of first metal regions; a first insulating layer located on a side of the first metal layer away from the first substrate, the first insulating layer exposing at least a portion of a surface of the first metal region located in an area where the plurality of pads are located; a second metal layer located on a side of the first insulating layer away from the first metal layer, the second metal layer comprising a plurality of second metal regions; a second insulating layer located on a side of the second metal layer away from the first insulating layer, the second insulating layer exposing at least a portion of a surface of the second metal region located in an area where the plurality of pads are located; a third metal layer located on a side of the second insulating layer away from the second metal layer, the third metal layer comprising a plurality of third metal regions; a third insulating layer located on a side of the third metal layer away from the second insulating layer, the third insulating layer exposing at least a portion of a surface of the third metal region located in the region where the plurality of pads are located; a fourth metal layer located on a side of the third insulating layer away from the third metal layer, the fourth metal layer comprising a plurality of fourth metal regions; a fourth insulating layer located on a side of the third insulating layer away from the third metal layer, the fourth insulating layer at least covering an area where the plurality of dummy pads are located; In which, in the direction perpendicular to the plane where the display panel is located, the second metal area, the third metal area and the fourth metal area do not overlap with the area where the multiple dummy pads are located, and in the area where the multiple pads are located, the first metal area, the second metal area, the third metal area and the fourth metal area are stacked and electrically connected to each other to form the pads, and in the area of ​​the multiple dummy pads, the first metal area, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer are stacked to form the dummy pads.

5. The display module according to claim 3, wherein: The distance between adjacent dummy pads is the same as the distance between adjacent first pads, and / or the distance between adjacent dummy pads is the same as the distance between adjacent second pads; The distance between adjacent dummy golden fingers is the same as the distance between adjacent first golden fingers, and / or the distance between adjacent dummy golden fingers is the same as the distance between adjacent second golden fingers.

6. The display module according to claim 3, wherein: The distance between adjacent dummy pads is greater than the distance between adjacent first pads, and / or the distance between adjacent dummy pads is greater than the distance between adjacent second pads; The distance between adjacent dummy golden fingers is greater than the distance between adjacent first golden fingers, and / or the distance between adjacent dummy golden fingers is greater than the distance between adjacent second golden fingers.

7. The display module according to claim 3, wherein: In a direction perpendicular to the plane of the display panel, the sum of the heights of the dummy pad and the corresponding dummy gold finger is the same as the sum of the heights of the first pad and the corresponding first gold finger, and / or the sum of the heights of the dummy pad and the corresponding dummy gold finger is the same as the sum of the heights of the second pad and the corresponding second gold finger.

8. The display module according to claim 3, wherein: In a direction perpendicular to the plane of the display panel, the sum of the heights of the dummy pad and the corresponding dummy gold finger is greater than the sum of the heights of the first pad and the corresponding first gold finger, and / or the sum of the heights of the dummy pad and the corresponding dummy gold finger is greater than the sum of the heights of the second pad and the corresponding second gold finger.

9. The display module according to claim 1, wherein: Also includes: A plurality of dummy gold fingers located in the second area and arranged along the first direction, in a direction perpendicular to the plane of the display panel, the height of the dummy gold fingers is not less than the sum of the heights of the first gold fingers and their corresponding first pads, and / or the height of the dummy gold fingers is not less than the sum of the heights of the second gold fingers and their corresponding second pads.

10. The display module according to claim 9, wherein: In a direction perpendicular to the plane of the display panel, the height of the dummy gold finger is greater than the sum of the heights of the first gold finger and its corresponding first pad, and / or the height of the dummy gold finger is greater than the sum of the heights of the second gold finger and its corresponding second pad.

11. The display module according to claim 9, wherein: The distance between adjacent dummy golden fingers is the same as the distance between adjacent first golden fingers, and / or the distance between adjacent dummy golden fingers is the same as the distance between adjacent second golden fingers.

12. The display module according to claim 9, wherein: The distance between adjacent dummy golden fingers is greater than the distance between adjacent first golden fingers, and / or the distance between adjacent dummy golden fingers is greater than the distance between adjacent second golden fingers.

13. The display module according to claim 2 or 9, characterized in that: The circuit board comprises: A second substrate and a plurality of gold fingers are located on the surface of the second substrate; in the area where the plurality of dummy gold fingers are located, the surface of the second substrate has a plurality of protrusions, and the protrusions form the dummy gold fingers.

14. The display module according to claim 13, wherein: The protrusion and the second substrate are an integral structure.

15. The display module according to claim 3, wherein: The pad is a strip-shaped structure extending along the second direction, and the gold finger is a strip-shaped structure extending along the second direction; The dummy pad is a strip structure extending along the second direction, or includes a plurality of sub-dummy pads arranged along the second direction; The dummy gold finger is a strip structure extending along the second direction, or includes a plurality of sub-dummy gold fingers arranged along the second direction.

16. The display module according to claim 1, wherein: Also includes: A plurality of dummy pads located in the first area and arranged along the first direction, wherein the height of the dummy pads is not less than the height of the first pad and the second pad in a direction perpendicular to the plane of the display panel; A plurality of dummy gold fingers located in the second area and arranged along the first direction, wherein the height of the dummy gold fingers is not less than the height of the first gold fingers and the second gold fingers in a direction perpendicular to the plane of the display panel; The dummy pad and the dummy gold finger are conductive structures, wherein the dummy pad includes a plurality of sub-dummy pads arranged along the second direction, and the dummy gold finger includes a plurality of sub-dummy gold fingers arranged along the second direction.

17. The display module according to claim 16, wherein: The dummy pad and the pad are formed simultaneously, and the dummy gold finger and the gold finger are formed simultaneously.

18. A display device, characterized in that: A display module comprising any one of claims 1-17.

19. A display panel, characterized in that: The bonding area of ​​the display panel has a plurality of pads, the plurality of pads including a plurality of first pads and a plurality of second pads arranged along a first direction, a first area being defined between the plurality of first pads and the plurality of second pads, the first area having a first spacing in the first direction, the first spacing being greater than a spacing between adjacent first pads and a spacing between adjacent second pads; The voltage signals applied to the first pad and the second pad are different.

20. The display panel according to claim 19, wherein Also includes: A plurality of dummy pads located in the first area and arranged along the first direction, wherein the height of the dummy pads is not less than the height of the first pad and the second pad in a direction perpendicular to the plane of the display panel; Wherein, the surface of the dummy pad is an insulating structure.

21. The display panel according to claim 20, wherein: The display panel includes: a first substrate; a first metal layer located on the first side of the first substrate, the first metal layer comprising a plurality of first metal regions; a first insulating layer located on a side of the first metal layer away from the first substrate, the first insulating layer exposing at least a portion of a surface of the first metal region located in an area where the plurality of pads are located; a second metal layer located on a side of the first insulating layer away from the first metal layer, the second metal layer comprising a plurality of second metal regions; a second insulating layer located on a side of the second metal layer away from the first insulating layer, the second insulating layer exposing at least a portion of a surface of the second metal region located in an area where the plurality of pads are located; a third metal layer located on a side of the second insulating layer away from the second metal layer, the third metal layer comprising a plurality of third metal regions; a third insulating layer located on a side of the third metal layer away from the second insulating layer, the third insulating layer exposing at least a portion of a surface of the third metal region located in the region where the plurality of pads are located; a fourth metal layer located on a side of the third insulating layer away from the third metal layer, the fourth metal layer comprising a plurality of fourth metal regions; a fourth insulating layer located on a side of the third insulating layer away from the third metal layer, the fourth insulating layer at least covering an area where the plurality of dummy pads are located; In which, in the direction perpendicular to the plane where the display panel is located, the second metal area, the third metal area and the fourth metal area do not overlap with the area where the multiple dummy pads are located, and in the area where the multiple pads are located, the first metal area, the second metal area, the third metal area and the fourth metal area are stacked and electrically connected to each other to form the pads, and in the area of ​​the multiple dummy pads, the first metal area, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer are stacked to form the dummy pads.

22. The display panel according to claim 20, wherein: The distance between adjacent dummy pads is the same as the distance between adjacent first pads, and / or the distance between adjacent dummy pads is the same as the distance between adjacent second pads; or, The distance between adjacent dummy pads is greater than the distance between adjacent first pads, and / or the distance between adjacent dummy pads is greater than the distance between adjacent second pads.

23. The display panel according to claim 20, wherein: The pad is a strip-shaped structure extending along the second direction; the dummy pad is a strip-shaped structure extending along the second direction, or includes a plurality of sub-dummy pads arranged along the second direction.

24. The display panel according to claim 19, wherein: Also includes: A plurality of dummy pads located in the first area and arranged along the first direction, wherein the height of the dummy pads is not less than the height of the first pad and the second pad in a direction perpendicular to the plane of the display panel; The dummy pad is a conductive structure, wherein the dummy pad includes a plurality of sub-dummy pads arranged along the second direction.

25. The display panel according to claim 24, wherein: The dummy pad and the pad are formed simultaneously.

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