Key assembly and electronic equipment

Abstract

The embodiment of the invention provides a key assembly and electronic equipment, and relates to the technical field of keys. The key assembly comprises a key body, a circuit board and a sensor. The circuit board is located on one side of the key body and connected with the key body. The sensor is located on the side, away from the key body, of the circuit board and electrically connected with the circuit board. The sensors include at least two of a capacitive sensor, a gravity sensor and a pressure sensor. Wherein when the sensors comprise the capacitive sensors, the number of the capacitive sensors is multiple, and the multiple capacitive sensors are arranged at intervals. By means of the arrangement, the key assembly can be operated through at least two of the three modes of multi-direction sliding of fingers on the key body, knocking of the key body and pressing of the key body, and the flexibility and convenience of operation of the key assembly are improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application provide a key assembly and an electronic device, and relate to the technical field of keys. BACKGROUND

[0002] Electronic devices usually include keys, and a set function can be realized by pressing the keys, such as volume adjustment, turning on and off, and restarting, etc. In the related art, the keys cannot be operated in a manner other than pressing, which affects the operation flexibility of the keys. SUMMARY

[0003] Embodiments of the present application provide a key assembly and an electronic device, which can improve the operation flexibility of the key assembly.

[0004] In one aspect, embodiments of the present application provide a key assembly. The key assembly includes a key body, a circuit board, and a sensor. The circuit board is located on one side of the key body and connected to the key body. The sensor is located on the side of the circuit board away from the key body and electrically connected to the circuit board. The sensor includes at least two of a capacitive sensor, a gravity sensor, and a pressure sensor. When the sensor includes the capacitive sensor, the number of capacitive sensors is multiple, and the multiple capacitive sensors are arranged at intervals.

[0005] In embodiments of the present application, the circuit board is connected to the key body, for example, directly connected or indirectly connected, and the sensor is located on the side of the circuit board away from the key body and electrically connected to the circuit board, so that the user can be sensed by the sensor when operating the key body. The sensor converts the sensing signal (such as capacitance, gravity acceleration, and pressure, etc.) into an electrical signal (such as current or voltage, etc.), and sends the electrical signal to the mainboard of the electronic device through the circuit board. The processor (such as CPU) of the electronic device is electrically connected to the mainboard, so as to control other components of the electronic device according to the received electrical signal, so that the electronic device can realize a set function in response to the user's operation of the key body.

[0006] It can be understood that when the sensor includes multiple capacitive sensors arranged at intervals, the key assembly can be operated by using the multi-directional sliding of a finger on the key body. When the sensor includes a gravity sensor, the key assembly can be operated by tapping the key body. When the sensor includes a pressure sensor, the key assembly can be operated by pressing the key body.

[0007] In this way, the sensor includes at least two of a capacitive sensor, a gravity sensor and a pressure sensor, and multiple capacitive sensors are arranged at intervals when the sensor includes a capacitive sensor, so that the key assembly can be operated in at least two of the three ways of multidirectional sliding, tapping and pressing the key body by a finger, so that the electronic device can implement a set function, and the flexibility and convenience in operating the key assembly are improved.

[0008] In some possible implementation manners, the key body includes a main structure extending along a first direction and having a first surface and a second surface oppositely arranged along a second direction. The first direction intersects the second direction. The circuit board includes a first circuit board and a connecting plate, the first circuit board is arranged opposite to the second surface, and the connecting plate is electrically connected to the first circuit board. The sensor includes multiple capacitive sensors, at least two of which are arranged in an array. The capacitive sensors are arranged on a side of the first circuit board away from the second surface and electrically connected to the first circuit board. It can be understood that, the capacitive sensors are arranged on the side of the first circuit board away from the second surface and electrically connected to the first circuit board, so that the capacitive sensors can sense the capacitance formed between the finger and the first circuit board. The at least two capacitive sensors are arranged in an array, so that the at least two capacitive sensors can be located at different positions on the side of the first circuit board away from the second surface, thereby sensing the capacitance formed between the finger and the first circuit board at different positions. In this way, the key assembly can be operated by sliding the finger on the first surface along the first direction and a third direction (intersecting the plane in which the first direction and the second direction lie), and the flexibility and convenience in operating the key assembly are improved.

[0009] In some possible implementation manners, the main structure includes a protruding portion and an extending portion, and the protruding portion is connected to the extending portion. The width of the protruding portion along a third direction is greater than the width of the extending portion along the third direction. The third direction intersects the plane in which the first direction and the second direction lie. The at least two capacitive sensors of the multiple capacitive sensors are arranged at intervals along the extension direction of the edge of the protruding portion. In this way, the width of the main structure along the third direction can be increased, and the area of the first surface can be increased, so that the finger of the user can slide along a ring-shaped track on the first surface. The at least two capacitive sensors of the multiple capacitive sensors are arranged at intervals along the extension direction of the edge of the protruding portion, so that the capacitive sensors can sense the capacitance formed between the finger and the first circuit board at different positions when the finger slides along the ring-shaped path, thereby the key assembly can be operated by sliding the finger along the ring-shaped path on the first surface, and the flexibility and convenience in operating the key assembly are improved.

[0010] In some possible implementation manners, the protruding portion has a first side wall surface and a second side wall surface oppositely arranged along the third direction. At least one of the first side wall surface and the second side wall surface is curved away from the other. In this way, the width of the protruding portion along the third direction can be greater than the width of the extending portion along the third direction, so that the user's finger can slide along the annular track on the first surface, improving the flexibility and convenience in operating the key assembly.

[0011] In some possible implementation manners, the number of the extending portions is two, and the two extending portions are located on two sides of the protruding portion along the first direction and connected to the protruding portion respectively. In this way, the protruding portion can be located between the two extending portions, improving the structural regularity and aesthetic appearance of the main body structure.

[0012] In some possible implementation manners, the key assembly includes a first adhesive layer, and the first circuit board is adhered to the second surface through the first adhesive layer. In this way, the key body, the first circuit board and the capacitive sensor can be integrated as a whole, so that they can be assembled with the frame of the electronic device together without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0013] In some possible implementation manners, the key body further includes a bending structure located on the side of the second surface along the second direction and connected to the main body structure. The circuit board further includes a second circuit board oppositely arranged with the surface of the bending structure away from the main body structure. The connecting plate is electrically connected to the second circuit board. The sensor includes a gravity sensor located on the side of the second circuit board away from the bending structure and electrically connected to the second circuit board. In this way, the vibration caused by knocking the main body structure can be transmitted to the gravity sensor electrically connected to the second circuit board through the bending structure, shortening the transmission path of the vibration and improving the accuracy of the gravity acceleration sensed by the gravity sensor, thereby improving the reliability in operating the key assembly by using the knocking manner. Moreover, the mutual influence between the second circuit board and the first circuit board can be reduced.

[0014] In some possible implementation manners, the number of the bending structures is two, and the two bending structures are arranged at intervals along the first direction. The second circuit board includes two first sub-circuit boards electrically connected, and the two first sub-circuit boards are respectively arranged opposite to surfaces of the two bending structures away from the main body structure. The number of the gravity sensors is two, and the two gravity sensors are respectively located on sides of the two first sub-circuit boards away from the bending structures. In this way, the two gravity sensors can be arranged at intervals along the first direction. When the main body structure is tapped, the vibration can be transmitted to the two gravity sensors arranged at intervals through the two bending structures, the two gravity sensors arranged at intervals respectively sense the gravity acceleration caused by the tapping, and convert the gravity acceleration into an electrical signal and send the electrical signal to the main board, thereby improving the reliability when the key assembly is operated in the tapping manner.

[0015] In some possible implementation manners, the first circuit board is located between the two bending structures. In this way, the space occupied by the key assembly along the second direction can be reduced, thereby facilitating the miniaturization of the key assembly.

[0016] In some possible implementation manners, the bending structure includes a first sub-bending structure and a second sub-bending structure, and the first sub-bending structure is connected to the second sub-bending structure. An end of the first sub-bending structure away from the second sub-bending structure is connected to the main body structure. The first sub-bending structure extends along the second direction, and the second sub-bending structure extends away from the main body structure along the first direction. The second circuit board is arranged opposite to a surface of the second sub-bending structure away from the main body structure. In this way, the vibration caused by the tapping can be transmitted to the gravity sensor electrically connected to the second circuit board through the bending structure, so that the key assembly can be operated in the tapping manner. Moreover, the bending structure extends away from the main body structure along the first direction, so that the mutual influence between the second circuit board and the first circuit board can be reduced.

[0017] In some possible implementation manners, the key assembly further includes a second adhesive layer, and the second circuit board is adhered to the surface of the second sub-bending structure away from the main body structure through the second adhesive layer. In this way, the key body, the second circuit board, and the gravity sensor can be integrated as a whole, so that the three components can be assembled together with the frame of the electronic device without being assembled separately, thereby improving the assembly efficiency and reducing the assembly cost.

[0018] In some possible implementation manners, the key assembly further includes a support structure located on a side of the first circuit board away from the main body structure along the second direction. The support structure is connected to the key body. In this way, the support structure can support the key body, the circuit board, the sensor, and the like. Moreover, the support structure is connected to the key body, the circuit board is bonded to the key body (the main body structure or the bent structure), and the sensor is electrically connected to the circuit board, so that the support structure, the circuit board, and the sensor can be integrated as a whole, which can be connected to the frame together without being connected to the frame separately, thereby improving the convenience of assembling the key assembly and the frame together, improving the assembly efficiency, and reducing the assembly cost.

[0019] In some possible implementation manners, the support structure includes a support plate and a support piece. The support plate extends along the first direction, and the support piece is located on a side of the support plate close to the first circuit board and connected to the support plate. The support piece and the support plate enclose the clamping groove. The second sub-bent structure, the second circuit board, and the gravity sensor are clamped in the clamping groove along at least part of the third direction. The third direction intersects the plane in which the first direction and the second direction lie. In this way, the clamping groove can limit the second sub-bent structure, the second circuit board (the first sub-circuit board), and the gravity sensor, reduce the risk of the second sub-bent structure, the second circuit board (the first sub-circuit board), and the gravity sensor deviating from the support structure when the main body structure is knocked or pressed, and improve the reliability of the key assembly.

[0020] In some possible implementation manners, the support piece includes a side wall and a bottom wall. The side wall is arranged opposite to the support plate. One end of the bottom wall is connected to the side wall, and the other end of the bottom wall is connected to the support plate. In this way, the support plate and the support piece can enclose the clamping groove.

[0021] In some possible implementation manners, the side wall comprises a first bending portion, the first bending portion is arranged opposite to the gravity sensor, and the first bending portion bends towards the support plate; or, the support plate comprises a second bending portion, the second bending portion is arranged opposite to the gravity sensor, and the second bending portion bends towards the side wall. It can be understood that, the first bending portion is arranged opposite to the gravity sensor and extends towards the support plate, so that the first bending portion can limit the gravity sensor, the second bending structure and the second circuit board (the first sub-circuit board), thereby reducing the risk that the gravity sensor, the second bending structure and the second circuit board (the first sub-circuit board) fall out of the clamping groove when the key body is knocked or pressed, and improving the reliability of the key assembly. The second bending portion is arranged opposite to the gravity sensor and extends towards the side wall, so that the second bending portion can limit the gravity sensor, the second bending structure and the second circuit board (the first sub-circuit board), thereby reducing the risk that the gravity sensor, the second bending structure and the second circuit board (the first sub-circuit board) fall out of the clamping groove when the key body is knocked or pressed, and improving the reliability of the key assembly.

[0022] In some possible implementation manners, the circuit board further comprises a third circuit board, the third circuit board is located on a side of the first circuit board away from the main body structure along the second direction. The third circuit board is electrically connected with the connecting plate. The sensor comprises a pressure sensor, the pressure sensor is located on a side of the third circuit board away from the first circuit board and is electrically connected with the third circuit board. In this way, when the key body and the main body structure are mechanically deformed by being pressed, the main body structure can apply pressure to the pressure sensor, so that the key assembly can be operated in the manner of being pressed.

[0023] In some possible implementation manners, the third circuit board is arranged opposite to a surface of the support plate away from the first circuit board. It can be understood that, when the main body structure of the key body is mechanically deformed by being pressed, the support plate can be squeezed to be mechanically deformed. The third circuit board is arranged opposite to the surface of the support plate away from the first circuit board, the pressure sensor is electrically connected with the third circuit board away from the support plate (the first circuit board), so that the pressure sensor can sense the pressure caused by the mechanical deformation of the support plate and convert the pressure into an electrical signal to be sent to the mainboard of the electronic device, thereby enabling the key assembly to be operated in the manner of being pressed.

[0024] In some possible implementation manners, the key assembly further comprises a third adhesive layer, the third circuit board is adhered to the surface of the support plate away from the first circuit board through the third adhesive layer. In this way, the key body, the support structure, the third circuit board and the pressure sensor can be integrated as a whole, so that the four components can be assembled together with the frame of the electronic device without being separately assembled, thereby improving the assembly efficiency and reducing the assembly cost.

[0025] In some possible implementations, the key assembly further includes a sealant surrounding the main structure. This arrangement allows the sealant to seal the through-holes in the frame, reducing the risk of water or impurities entering the receiving space through the through-holes, thereby improving the reliability of the electronic device.

[0026] In another aspect, an embodiment of the present application provides an electronic device. The electronic device includes a housing and a key assembly as described above. The housing includes a frame having a through hole formed therein. A key body of the key assembly is partially embedded in the through hole.

[0027] The electronic device provided by the embodiment of the present application includes the key assembly as described above, and thus has all the above-mentioned beneficial effects, which will not be repeated here. In addition, the key body is partially embedded in the through hole, so that the key body can be partially exposed, thereby improving the convenience when operating the key assembly.

[0028] In some possible implementations, the electronic device further includes a motherboard, the key assembly includes a circuit board, and the connecting plate of the circuit board is electrically connected to the motherboard. In this configuration, operating the key assembly can send an electrical signal to the motherboard. A processor (e.g., a CPU) of the electronic device is electrically connected to the motherboard, thereby controlling other components of the electronic device based on the received electrical signal, enabling the electronic device to implement a set function in response to the user's operation of the key assembly.

[0029] In some possible implementations, the key assembly further includes a support structure, including a support plate, which is connected to the frame of the electronic device. This arrangement enables the support plate to secure the key body, circuit board, sensor, etc. to the frame, reducing the risk of the key body, circuit board, sensor, etc., shaking relative to the frame and improving the reliability of the key assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0031] Figure 2 A schematic diagram of the positional relationship between the frame and the button assembly provided in some embodiments of the present application;

[0032] Figure 3 A schematic diagram of the structure of a frame provided in some embodiments of the present application;

[0033] Figure 4 A top view of a key assembly provided in some embodiments of the present application;

[0034] Figure 5 for Figure 4 A schematic cross-sectional view of the key assembly along the AA direction;

[0035] Figure 6 Structure diagram of the key assembly provided for some embodiments of the present application;

[0036] Figure 7 Explosion diagram of the key assembly provided for some embodiments of the present application;

[0037] Figure 8 Position relationship diagram of the capacitive sensor and the circuit board provided for some embodiments of the present application;

[0038] Figure 9 Position relationship diagram of the capacitive sensor, the circuit board and the key body provided for some embodiments of the present application;

[0039] Figure 10 Position relationship diagram of the pressure sensor, the circuit board and the key body provided for some embodiments of the present application;

[0040] Figure 11 Structure diagram of the main body structure provided for some embodiments of the present application;

[0041] Figure 12 Structure diagram of the main body structure provided for some embodiments of the present application;

[0042] Figure 13 Structure diagram of the main body structure provided for some embodiments of the present application; Figure 6 Sectional view along the direction of B-B;

[0043] Figure 14 Structure diagram of the circuit board provided for some embodiments of the present application;

[0044] Figure 15 Structure diagram of the circuit board provided for some embodiments of the present application; Figure 6 Sectional view along the direction of C-C;

[0045] Figure 16 Structure diagram of the support structure provided for some embodiments of the present application;

[0046] Figure 17 Structure diagram of the key assembly provided for some embodiments of the present application. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by those of ordinary skill in the art are within the scope of protection of the present application.

[0048] Unless otherwise required by context, as used herein the term "comprises" or "comprising" or the like is used on the basis and understood by those skilled in the art to present the inclusion of a stated step or element but not to the exclusion of any other steps or elements which can be insubstantially described. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic is included in at least one embodiment or example of the present disclosure. These terms do not necessarily indicate a reference to the same embodiment or example. In addition, the particular features, structures, materials, or characteristics can be included in any suitable embodiment or example in any appropriate manner.

[0049] Hereinafter, the terms "first", "second" are only used for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0050] In describing some embodiments, "electrically connected" and its derivatives can be used. The term "electrically connected" should be interpreted broadly, for example, "electrically connected" can be direct electrical connection or indirect electrical connection through other devices.

[0051] As used herein, "equal" includes the stated case and the approximately similar case to the stated case, the range of which is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled person in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may, for example, be that the difference between the two is less than or equal to 5% of either.

[0052] Figure 1 A structural schematic diagram of an electronic device provided for some embodiments of the present application. Figure 2 A positional relationship schematic diagram of a frame and a key assembly provided for some embodiments of the present application. Figure 3 A structural schematic diagram of a frame provided for some embodiments of the present application.

[0053] As Figure 1 Embodiments of the present application provide an electronic device 200, as shown in the drawings. The electronic device 200 can be a mobile portable terminal device, such as a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, etc. Embodiments of the present application do not further limit the type of electronic device 200.

[0054] In some examples, as shown in FIG. 1, the electronic device 100 includes a housing 101 and a load (not shown in the figure), the housing 101 is capable of surrounding a containing space, and the load is located in the containing space surrounded by the housing 101. Figure 1

[0055] For example, the housing 201 includes a front frame, a middle frame, and a back shell, and the middle frame includes a side frame 2011 and a middle plate 2012. The middle plate 2012 is a flat plate structure, which is the skeleton of the electronic device 200 and plays a supporting role. It can be understood that, in order to simplify the structure of the drawing, Figure 2 Figure 3 Only a part of the middle plate 2012 is shown.

[0056] The side frame 2011 is a ring structure, which can surround the middle plate 2012 and be connected with the middle plate 2012. The front frame is connected with one side edge of the side frame 2011, and the back shell is connected with a side edge of the side frame 2011 away from the front frame. The front frame, the side frame 2011, and the back shell surround a containing space. It can be understood that the middle plate 2012 is located in the containing space surrounded by the front frame, the side frame 2011, and the back shell.

[0057] The load can be a central processing unit (CPU), a graphics processing unit (GPU), a microcontroller unit (MCU), or the like. Alternatively, the load can also be a display panel, a camera assembly, or the like. The load can be located in the containing space surrounded by the front frame and the middle plate 2012, or the load can also be located in the containing space surrounded by the back shell and the middle plate 2012. The electronic device 200 can include multiple loads, and the types and setting positions of the multiple loads can be the same or different.

[0058] In some examples, the electronic device 200 further includes a main board (not shown in the figure), which can be a printed circuit board (PCB). The multiple loads are electrically connected with the main board respectively, so that the electronic device 200 can work normally.

[0059] Figure 4 A top view of the key assembly provided by some embodiments of the present application. Figure 5 A cross-sectional view of the key assembly in FIG. 2 along the A-A direction. Figure 4

[0060] In some examples, as shown in FIG. 1, the electronic device 100 includes a housing 101 and a load (not shown in the figure), the housing 101 is capable of surrounding a containing space, and the load is located in the containing space surrounded by the housing 101. Figure 2 Figure 4 Figure 5 ​​​​​As shown, the electronic device 200 further comprises a key assembly 100, the key assembly 100 comprises a circuit board 120, and the circuit board 120 of the key assembly 100 is electrically connected with the main board.

[0061] It can be understood that the circuit board 120 of the key assembly 100 is electrically connected with the main board, and the electronic signal can be sent to the main board by operating the key assembly 100. The processor (for example, CPU) of the electronic device 200 is electrically connected with the main board, so that other components of the electronic device 200 can be controlled according to the received electronic signal, so that the electronic device 200 can realize the set function in response to the operation of the user on the key assembly 100.

[0062] For example, the circuit board 120 can comprise at least one of a flexible printed circuit (FPC) and a PCB.

[0063] In some possible cases, as shown in Figure 4 and Figure 5 As shown, the circuit board 120 comprises a first sub-portion 120a and a second sub-portion 120b which are arranged at intervals. The key assembly 100 can further comprise a switch device 160. The switch device 160 comprises a first spring 161, a second spring 162 and a spring 163.

[0064] The first spring 161 is electrically connected with the first sub-portion 120a, for example, the first spring 161 can be electrically connected with the first sub-portion 120a by welding. The second spring 162 is electrically connected with the second sub-portion 120b, for example, the second spring 162 can be electrically connected with the second sub-portion 120b by welding. The second spring 162 comprises a contact portion 162a, the contact portion 162a extends to a side of the first sub-portion 120a close to the first spring 161, and is arranged at intervals with the first sub-portion 120a.

[0065] The spring 163 is located at a side of the contact portion 162a away from the first sub-portion 120a, and is arranged at intervals with the contact portion 162a. It can be understood that when the spring 163 is pressed, the spring 163 can be elastically deformed, and the contact portion 162a can be extruded, so that the contact portion 162a can be in electrical contact with the first sub-portion 120a, that is, the second spring 162 can be electrically connected with the first spring 161, and the electronic signal can be transmitted between the second spring 162 and the first spring 161, so that the electronic device 200 can realize the set function (for example, volume adjustment or switching on and off, etc.).

[0066] When the pressing of the elastic sheet 163 is stopped, the elastic sheet 163 is restored under the action of the elasticity, and cannot continue to press the contact portion 162a, the contact portion 162a is separated from the first sub-portion 120a, that is, the second spring sheet 162 is disconnected from the first spring sheet 161, and the electrical signal cannot be transmitted between the first spring sheet 161 and the second spring sheet 162, and the electronic device 200 cannot realize the set function.

[0067] With the above arrangement, the key assembly 100 can only be operated by pressing, which affects the operation flexibility of the key assembly 100.

[0068] Figure 6 A structural schematic diagram of a key assembly provided for some embodiments of the application. Figure 7 An exploded schematic diagram of a key assembly provided for some embodiments of the application. Figure 8 A schematic diagram of the positional relationship between a capacitive sensor and a circuit board provided for some embodiments of the application. Figure 9 A schematic diagram of the positional relationship among a capacitive sensor, a circuit board and a key body provided for some embodiments of the application. Figure 10 A schematic diagram of the positional relationship among a pressure sensor, a circuit board and a key body provided for some embodiments of the application.

[0069] Based on this, the embodiments of the application provide a key assembly 100. In some examples, as shown in Figure 6 and Figure 7 , the key assembly 100 includes a key body 110, a circuit board 120 and a sensor 130.

[0070] For example, the key body 110 can extend along a first direction X. The key body 110 can be an appearance piece, and a user sends an electrical signal to a mainboard by operating the key body 110. The key body 110 can be a non-conductive material, such as glass, plastic, glass fiber, etc. It can be understood that the embodiments of the application do not further limit the material of the key body 110.

[0071] In some examples, as shown in Figure 6 and Figure 7 , the circuit board 120 is located on one side of the key body 110 and connected with the key body 110. For example, the circuit board 120 can be located on one side of the key body 110 along a second direction Y and connected with the key body 110. The circuit board 120 and the key body 110 can be directly connected or indirectly connected through other components. The second direction Y intersects the first direction X. For example, the second direction Y can be perpendicular to the first direction X.

[0072] In some examples, the sensor 130 is located on a side of the circuit board 120 away from the key body 110 and electrically connected with the circuit board 120.

[0073] In some examples, the circuit board 120 can be provided with a plurality of pads on the side away from the key body 110, and the sensor 130 can be welded to the pads, so that the sensor 130 can be located on the side of the circuit board 120 away from the key body 110 and electrically connected to the circuit board 120. In some examples, the number of the sensor 130 can be multiple, and the multiple sensors 130 can be arranged at intervals on the side of the circuit board 120 away from the key body 110 and electrically connected to the circuit board 120 respectively.

[0074] It can be understood that, by arranging the sensor 130 on the side of the circuit board 120 away from the key body 110, the sensor 130 can avoid affecting the connection between the key body 110 and the circuit board 120. By connecting the circuit board 120 to the key body 110 and arranging the sensor 130 on the side of the circuit board 120 away from the key body 110 and electrically connected to the circuit board 120, the user can be sensed by the sensor 130 when operating the key body 110.

[0075] The sensor 130 can convert the sensing signals (such as capacitance, gravity acceleration, and pressure, etc.) into electrical signals (such as current or voltage, etc.), and can send the electrical signals to the main board through the circuit board 120. The processor (such as CPU) can control other components of the electronic device 200 according to the received electrical signals, so that the electronic device 200 can realize the set functions in response to the user's operation of the key body 110.

[0076] In some examples, the sensor 130 includes at least two of a capacitance sensor (English: capacitor sensor) 131, a gravity sensor 132, and a pressure sensor 133. As shown in FIG. 1, when the sensor 130 includes the capacitance sensor 131, the number of the capacitance sensor 131 is multiple, and the multiple capacitance sensors 131 are arranged at intervals. Figure 8

[0077] It can be understood that, the sensor 130 can include the capacitance sensor 131 and the gravity sensor 132, or the sensor 130 can include the capacitance sensor 131 and the pressure sensor 133, or the sensor 130 can include the gravity sensor 132 and the pressure sensor 133, or the sensor 130 can include the capacitance sensor 131, the gravity sensor 132, and the pressure sensor 133.

[0078] ​When the sensor 130 includes the gravity sensor 132, the number of the gravity sensor 132 can be one or more. When the sensor 130 includes the pressure sensor 133, the number of the pressure sensor 133 can be one or more. When the sensor 130 includes the capacitance sensor 131, the gravity sensor 132 and the pressure sensor 133, the number of the capacitance sensor 131, the gravity sensor 132 and the pressure sensor 133 can be the same or different.

[0079] As shown in FIG. 1, when the user's finger touches the key body 110, a capacitance is formed between the finger and the circuit board 120. When the sensor 130 includes the capacitance sensor 131, the capacitance sensor 131 can sense the capacitance formed between the finger and the circuit board 120 and convert the capacitance into other electrical signals and send the electrical signals to the mainboard. Figure 9

[0080] As shown in FIG. 1, the number of the capacitance sensor 131 is multiple, and the multiple capacitance sensors 131 are arranged at intervals, so that the capacitance sensors 131 at different positions can sense the capacitance formed between the finger and the circuit board 120 at different positions. The processor (for example, CPU) can determine the sliding direction and the sliding path of the finger on the key body 110 according to the electrical signal changes of each capacitance sensor 131, so as to control other components of the electronic device 200 according to the sliding direction and the sliding path of the finger on the key body 110, so that the electronic device 200 can realize the set function in response to the sliding operation of the user's finger. Figure 8 That is, when the sensor 130 includes multiple capacitance sensors 131 arranged at intervals, the key assembly 100 can be operated by the multi-directional sliding of the finger on the key body 110, so that the electronic device 200 can realize the set function. It can be understood that the electronic device 200 realizes different set functions when the sliding direction and the sliding path of the finger on the key body 110 are different. For example, the sliding operation can realize page turning when browsing e-books and web pages, adjusting focal length when taking photos, adjusting ISO (International Standards Organization) and adjusting filters, etc. Alternatively, the sliding operation can also control AI (artificial intelligence) software. The embodiments of the present application do not make further limitation on the set function corresponding to the sliding operation.

[0081]

[0082] ​​When a user taps the key body 110, gravitational acceleration in different directions (a first direction X, a second direction Y, and a third direction Z intersecting the plane containing the first direction X and the second direction Y) can be applied to the circuit board 120 through the key body 110. If the sensor 130 includes a gravity sensor 132, the gravity sensor 132 can sense gravitational acceleration in different directions and convert the gravitational acceleration into an electrical signal that is transmitted to the mainboard. The magnitude of the gravitational acceleration varies with the force of the tap, and the gravity sensor 132 can transmit different electrical signals to the mainboard based on the magnitude of the gravitational acceleration.

[0083] The processor (such as a CPU) can determine the tapping force and the number of tapping times based on the electrical signal sent by the gravity sensor 132, and thus can control other components of the electronic device 200 based on the tapping force and the number of tapping times, so that the electronic device 200 can implement the set function in response to the tapping operation.

[0084] That is, when the sensor 130 includes a gravity sensor 132, the key assembly 100 can be operated by tapping the key body 110, so that the electronic device 200 can implement the set function. It is understandable that the set function implemented by the electronic device 200 is different when the tapping force and the number of taps are different. For example, tapping once can answer the call, and tapping twice can hang up the call. The embodiments of the present application do not further limit the set function corresponding to the tapping operation.

[0085] like Figure 10 As shown, when the user presses the button body 110, the button body 110 can undergo mechanical deformation, thereby squeezing the circuit board 120. When the sensor 130 includes a pressure sensor 133, the pressure sensor 133 can sense the pressure on the circuit board 120, that is, it can sense the mechanical deformation of the button body 110. The pressure sensor 133 converts the pressure into an electrical signal and sends it to the mainboard. When the pressing force is different, the degree of deformation of the button body 110 is different, and the pressure on the circuit board 120 is different, so the electrical signal sent by the pressure sensor 133 to the mainboard is different. For example, the pressure sensor 133 can be a resistive pressure sensor. When the pressure is different, the resistance value of the pressure sensor 133 is different, so that different electrical signals can be sent to the circuit board.

[0086] The processor (e.g., CPU) can determine the pressing force and number of presses based on the electrical signal sent by the pressure sensor 133, thereby controlling other components of the electronic device 200 based on the pressing force and number of presses, so that the electronic device 200 can implement the set function in response to the pressing operation.

[0087] That is, when the sensor 130 includes the pressure sensor 133, the key assembly 100 can be operated by pressing the key body 110, so that the electronic device 200 can implement the set function. It can be understood that when the pressing force and the pressing times are different, the set function implemented by the electronic device 200 is different. For example, when the pressing force is small, the focusing function during photographing can be implemented, and when the pressing force is large, the photographing function can be implemented. The embodiments of the present application do not make further limitation on the set function corresponding to the pressing operation.

[0088] In the embodiments of the present application, the circuit board 120 is connected with the key body 110, for example, directly connected or indirectly connected, and the sensor 130 is located on the side of the circuit board 120 away from the key body 110 and is electrically connected with the circuit board 120, so that the user can be sensed by the sensor 130 when operating the key body 110. The sensor 130 converts the sensing signal (such as capacitance, gravity acceleration and pressure, etc.) into an electrical signal (such as current or voltage, etc.), and sends the electrical signal to the mainboard of the electronic device 200 through the circuit board 120. The processor (such as CPU) of the electronic device 200 is electrically connected with the mainboard, so that the other components of the electronic device 200 can be controlled according to the received electrical signal, so that the electronic device 200 can implement the set function in response to the operation of the user on the key body 110.

[0089] It can be understood that when the sensor 130 includes a plurality of capacitive sensors 131 arranged at intervals, the key assembly 100 can be operated by sliding the finger in multiple directions on the key body 110. When the sensor 130 includes the gravity sensor 132, the key assembly 100 can be operated by tapping the key body 110. When the sensor 130 includes the pressure sensor 133, the key assembly 100 can be operated by pressing the key body 110.

[0090] In this way, the sensor 130 includes at least two of the capacitive sensor 131, the gravity sensor 132 and the pressure sensor 133, and when the sensor 130 includes the capacitive sensor 131, a plurality of capacitive sensors 131 are arranged at intervals, so that the key assembly 100 can be operated by at least two of the three ways of sliding the finger in multiple directions on the key body 110, tapping the key body 110 and pressing the key body 110, so that the electronic device 200 can implement the set function, and improve the flexibility and convenience when operating the key assembly 100.

[0091] In some examples, the frame 2011 is provided with a through hole G (see Figure 3 The key body 110 of the key assembly 100 is partially embedded in the through hole G. In this way, the key body 110 can be partially exposed, improving the convenience when operating the key assembly 100.

[0092] For example, the key assembly 100 in which the key body 110 is partially embedded in the through hole G can be called a side key. The electronic device 200 may include one side key or multiple side keys. The shapes and operation methods of the multiple side keys may be the same or different. When the electronic device 200 includes multiple side keys, a plurality of through holes G set at intervals may be provided on the frame 2011. The key body 110 of a side key is partially embedded in a through hole G, so that the key bodies 110 of the multiple side keys can be set at intervals.

[0093] Figure 11 A structural diagram of the main structure provided for some embodiments of the present application. Figure 12 A schematic structural diagram of the main structure provided for some other embodiments of the present application. Figure 13 for Figure 6 Schematic cross-section along the BB direction.

[0094] In some examples, such as Figure 11 and Figure 12 As shown, the key body 110 includes a main structure 111, which extends along a first direction X and has a first surface P1 and a second surface P2 arranged opposite to each other along a second direction Y. The first surface P1 and the second surface P2 can be smooth planes. The first surface P1 can be an ellipse, a rounded rectangle, or other asymmetric shape. The shape of the first surface P1 and the shape of the second surface P2 can be the same or different.

[0095] In some examples, the shape of the main structure 111 is the same as that of the through hole G, and the main structure 111 is embedded in the through hole G. It is understandable that when the main structure 111 is embedded in the through hole G, the first surface P1 can be exposed, and the user's fingers can slide, tap, or press in multiple directions on the first surface P1 to operate the key assembly 100, so that the electronic device 200 can perform the setting function.

[0096] In some examples, such as Figure 13 As shown, the circuit board 120 includes a first circuit board 121 and a connecting board 124 . The first circuit board 121 is disposed opposite to the second surface P2 , and the connecting board 124 is electrically connected to the first circuit board 121 .

[0097] The first circuit board 121 may be an FPC or a PCB. The shape of the first circuit board 121 may be the same as the shape of the second surface P2. The first surface P1 and the second surface P2 are arranged opposite each other, and the first circuit board 121 and the second surface P2 are arranged opposite each other. In this way, when a finger touches the first surface P1, a capacitance is formed between the finger and the first circuit board 121.

[0098] For example, the first circuit board 121 and the connecting plate 124 may be an integrally formed structure, or the first circuit board 121 and the connecting plate 124 may be electrically connected via a cable, etc. In some examples, the connecting plate 124 of the circuit board 120 is electrically connected to the mainboard.

[0099] It is understood that the connecting plate 124 is electrically connected to the first circuit board 121 and the main board, so that the first circuit board 121 can be electrically connected to the main board via the connecting plate 124. For example, the connecting plate 124 can be an FPC, so that the connecting plate 124 can be bent to reduce the mutual positional restrictions between the first circuit board 121 and the main board, thereby improving the convenience of the electrical connection between the first circuit board 121 and the main board.

[0100] In some examples, such as Figure 8 As shown, the sensor 130 includes a plurality of capacitive sensors 131, which are located on a side of the first circuit board 121 away from the second surface P2 and are electrically connected to the first circuit board 121. At least two of the plurality of capacitive sensors 131 are arranged in an array.

[0101] It can be understood that at least two of the plurality of capacitance sensors 131 are arranged in an array, that is, the plurality of capacitance sensors 131 can be arranged in an array, or, as shown in FIG. Figure 8 As shown, a portion (two, three or more) of the plurality of capacitive sensors 131 are arranged in an array. For example, at least two of the plurality of capacitive sensors 131 can be arranged in an array along the first direction X and the third direction Z.

[0102] In some examples, a first pad arranged in an array is provided on a side of the first circuit board 121 away from the second surface P2, and at least two of the multiple capacitive sensors 131 are soldered to the first pad, so that at least two of the multiple capacitive sensors 131 can be arranged in an array.

[0103] It can be understood that the capacitive sensor 131 is disposed on a side of the first circuit board 121 away from the second surface P2 and is electrically connected to the first circuit board 121, so that the capacitive sensor 131 can sense the capacitance formed between the finger and the first circuit board 121. In addition, at least two of the multiple capacitive sensors 131 are arranged in an array, so that the at least two capacitive sensors 131 can be located at different positions on the side of the first circuit board 121 away from the second surface P2, thereby sensing the capacitance formed between the finger and the first circuit board 121 at different positions. In this way, sliding a finger on the first surface P1 along the first direction X and the third direction Z can operate the key assembly 100, improving the flexibility and convenience of operating the key assembly 100.

[0104] In some examples, as shown in Figure 13 The key assembly 100 includes a first adhesive layer 101, and the first circuit board 121 is adhered to the second surface P2 through the first adhesive layer 101.

[0105] In examples, after the capacitive sensor 131 is electrically connected to the first circuit board 121, the first circuit board 121 can be adhered to the second surface P2 through the first adhesive layer 101 from the side of the capacitive sensor 131, so that the key body 110, the first circuit board 121 and the capacitive sensor 131 can be integrated as a whole, thereby the three can be assembled together with the frame 2011 of the electronic device 200 without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0106] In some examples, as shown in Figure 11 and Figure 12 The main body structure 111 includes a protruding portion 111a and an extending portion 111b, and the protruding portion 111a is connected to the extending portion 111b. It can be understood that the extending portion 111b is located on one side of the protruding portion 111a along the first direction X and is connected to the protruding portion 111a. In examples, the protruding portion 111a and the extending portion 111b can be an integrated structure to improve the connection reliability therebetween.

[0107] The width of the protruding portion 111a along the third direction Z is greater than the width of the extending portion 111b along the third direction Z. The third direction Z intersects the plane in which the first direction X and the second direction Y lie. In examples, the third direction Z is perpendicular to the plane in which the first direction X and the second direction Y lie.

[0108] It can be understood that the width of the protruding portion 111a along the third direction Z at different positions along the first direction X can be the same or different. The width of the extending portion 111b along the third direction Z at different positions along the first direction X can be the same or different. The width of the protruding portion 111a along the third direction Z at any position along the first direction X is greater than the width of the extending portion 111b along the third direction Z at any position along the first direction X.

[0109] In some examples, as shown in Figure 8 At least two capacitive sensors 131 of the plurality of capacitive sensors 131 are spaced apart along the extension direction of the edge of the protruding portion 111a.

[0110] At least two capacitive sensors 131 of the plurality of capacitive sensors 131 are spaced apart along the extension direction of the edge of the protruding portion 111a, that is, the plurality of capacitive sensors 131 can be spaced apart along the extension direction of the edge of the protruding portion 111a, or, as Figure 8As shown, a part (two, three or more) of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a.

[0111] It can be understood that the main body structure 111 includes the protrusion 111a, which can increase the width of the main body structure 111 along the third direction Z, increase the area of the first surface P1, so that the user's finger can slide along the annular track on the first surface P1. At least two capacitive sensors 131 of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a, so that the capacitive sensor 131 can sense the capacitance formed between the first circuit board 121 at different positions when the finger slides along the annular path, so that the key assembly 100 can be operated by sliding the finger along the annular path on the first surface P1, improving the flexibility and convenience when operating the key assembly 100. For example, sliding the finger along the annular path on the first surface P1 can adjust the focal length, ISO, and filter when taking pictures.

[0112] For example, as shown in Figure 8 A part (two, three or more) of the plurality of capacitive sensors 131 are arranged in an array, and another part (two, three or more) of the plurality of capacitive sensors 131 are arranged along the extension direction of the edge of the protrusion 111a, so that the finger can operate the key assembly 100 by sliding along the first direction X, along the third direction Z, or along the annular track on the first surface P1, improving the operation flexibility and convenience of the key assembly 100.

[0113] In some examples, as shown in Figure 11 and Figure 12 The protrusion 111a has a first side wall surface M1 and a second side wall surface M2 arranged opposite along the third direction Z. At least one of the first side wall surface M1 and the second side wall surface M2 is curved away from the other.

[0114] For example, as shown in Figure 11 and Figure 12 The first side wall surface M1 is curved away from the second side wall surface M2, and the second side wall surface M2 is curved away from the first side wall surface M1. Alternatively, the first side wall surface M1 is curved away from the second side wall surface M2, and the second side wall surface M2 is not curved away from the first side wall surface M1. Alternatively, the first side wall surface M1 is not curved away from the second side wall surface M2, and the second side wall surface M2 is curved away from the first side wall surface M1.

[0115] It can be understood that at least one of the first side wall surface M1 and the second side wall surface M2 is curved away from the other, so that the width of the protruding portion 111a along the third direction Z can be greater than the width of the extending portion 1111b along the third direction Z, so that the user's finger can slide along the annular track on the first surface P1, improving the flexibility and convenience when operating the key assembly 100.

[0116] In some examples, the first side wall surface M1 is curved away from the second side wall surface M2. The second side wall surface M2 is curved away from the first side wall surface M1. In this way, the structural regularity of the protruding portion 111a can be improved.

[0117] In some examples, as shown in Figure 11 and Figure 12 , the number of extending portions 111b is two, and the two extending portions 111b are located on both sides of the protruding portion 111a along the first direction X and are connected to the protruding portion 111a respectively.

[0118] In this way, the protruding portion 111a can be located between the two extending portions 111b, improving the structural regularity and aesthetics of the main body structure 111.

[0119] In some examples, as shown in Figure 11 and Figure 12 , the key body 110 further comprises a bending structure 112. The bending structure 112 is located on the side where the second surface P2 is located along the second direction Y and is connected to the main body structure 111. For example, the bending structure 112 and the main body structure 111 can be an integral molding structure to improve the connection reliability between them. The bending structure 112 can be bent and extended away from the main body structure 111 along the first direction X.

[0120] Figure 14 The structural schematic diagram of the circuit board provided by some embodiments of the present application is shown. Figure 15 For Figure 6 The cross-sectional view along the C-C direction is shown.

[0121] In some examples, as shown in Figure 14 and Figure 15 , the circuit board 120 further comprises a second circuit board 122, and the second circuit board 122 is arranged opposite to the surface of the bending structure 112 away from the main body structure 111. The connecting plate 124 is electrically connected to the second circuit board 122. It can be understood that the connecting plate 124 is electrically connected to the main board, so that the second circuit board 122 can be electrically connected to the main board circuit through the connecting plate 124.

[0122] The second circuit board 122 and the connecting plate 124 can be an integrally formed structure, or the second circuit board 122 and the connecting plate 124 can be electrically connected by a cable or the like. For example, the connecting plate 124 can be a FPC, so that the connecting plate 124 can be bent to reduce the mutual restriction in position between the second circuit board 122 and the main board, and improve the convenience of electrical connection between the second circuit board 122 and the main board. The second circuit board 122 can be a FPC or a PCB.

[0123] In some examples, as shown in FIG. 1, the second circuit board 122 and the first circuit board 121 can be electrically connected to the same connecting plate 124, and electrically connected to the main board through the same connecting plate 124. In other examples, the second circuit board 122 and the first circuit board 121 can be electrically connected to different connecting plates 124 respectively, and electrically connected to the main board through the different connecting plates 124. Figure 14

[0124] In some examples, the sensor 130 includes a gravity sensor 132, which is located on the side of the second circuit board 122 away from the bent structure 112, and is electrically connected to the second circuit board 122.

[0125] The side of the second circuit board 122 away from the bent structure 112 can be provided with a second pad, and the gravity sensor 132 is welded to the second pad, so that the gravity sensor 132 can be located on the side of the second circuit board 122 away from the bent structure 112 and electrically connected to the second circuit board 122.

[0126] It can be understood that when the user taps the main body structure 111, the main body structure 111 will vibrate, thereby driving the bent structure 112 to vibrate. The vibration can be transmitted to the gravity sensor 132 electrically connected to the second circuit board 122. The gravity sensor 132 senses the gravitational acceleration caused by the vibration and converts the gravitational acceleration into an electrical signal and sends it to the main board, so that the electronic device 200 can realize the set function.

[0127] That is, the second circuit board 122 is arranged opposite to the surface of the bent structure 112 away from the main body structure 111, so that the vibration caused by tapping the main body structure 111 can be transmitted to the gravity sensor 132 electrically connected to the second circuit board 122 through the bent structure 112, shortening the transmission path of the vibration, improving the accuracy of the gravitational acceleration sensed by the gravity sensor 132, thereby improving the reliability of operating the key assembly 100 in the manner of tapping. And it can also reduce the mutual influence between the second circuit board 122 and the first circuit board 121.

[0128] In some examples, as shown in FIG. 1, the second circuit board 122 and the first circuit board 121 can be electrically connected to the same connecting plate 124, and electrically connected to the main board through the same connecting plate 124. In other examples, the second circuit board 122 and the first circuit board 121 can be electrically connected to different connecting plates 124 respectively, and electrically connected to the main board through the different connecting plates 124. Figure 11 Figure 12 ​​As shown, the number of the bending structures 112 is two, and the two bending structures 112 are arranged at intervals along the first direction X. For example, the two bending structures 112 can be located at two ends of the main body structure 111 along the first direction X, and are connected to the ends of the main body structure 111 respectively.

[0129] As shown, the second circuit board 122 includes two first sub-circuit boards 1221 electrically connected, and the two first sub-circuit boards 1221 are arranged opposite to the surfaces of the two bending structures 112 away from the main body structure 111 respectively. For example, the second circuit board 122 further includes a second sub-circuit board 1222, and the two first sub-circuit boards 1221 are electrically connected through the second sub-circuit board 1222. The second sub-circuit board 1222 and the two first sub-circuit boards 1221 can be an integral structure. The number of the gravity sensors 132 is two, and the two gravity sensors 132 are located on the sides of the two first sub-circuit boards 1221 away from the bending structures 112 respectively. Figure 14 In this way, the two gravity sensors 132 can be arranged at intervals along the first direction X. When the main body structure 111 is struck, the vibration can be transmitted to the two gravity sensors 132 arranged at intervals through the two bending structures 112, and the two gravity sensors 132 arranged at intervals can respectively sense the gravity acceleration caused by the strike and convert the gravity acceleration into an electrical signal and send it to the main board, thereby improving the reliability when the key assembly 100 is operated in the manner of strike.

[0130] In some examples, the first circuit board 121 is located between the two bending structures 112.

[0131] In this way, the occupation space of the key assembly 100 along the second direction Y can be reduced, which is beneficial to the miniaturization of the key assembly 100.

[0132] In some examples, as shown in

[0133] and Figure 11 As shown, the bending structure 112 includes a first sub-bending structure 1121 and a second sub-bending structure 1122, and the first sub-bending structure 1121 is connected to the second sub-bending structure 1122. The end of the first sub-bending structure 1121 away from the second sub-bending structure 1122 is connected to the main body structure 111. The first sub-bending structure 1121 extends along the second direction Y, and the second sub-bending structure 1122 extends away from the main body structure 111 along the first direction X. The second circuit board 122 (the first sub-circuit board 1221) is arranged opposite to the surface of the second sub-bending structure 1122 away from the main body structure 111. Figure 12

[0134] ​The bending structure 112 can be a one-piece structure to improve the connection reliability between the first sub-bending structure 1121 and the second sub-bending structure 1122. The first sub-bending structure 1121 extends along the second direction Y, and the second sub-bending structure 1122 extends away from the main body structure 111 along the first direction X, so that the bending structure 112 can be bent and extended away from the main body structure 111 along the first direction X.

[0135] The second circuit board 122 (the first sub-circuit board 1221) is arranged opposite to the surface of the second sub-bending structure 1122 away from the main body structure 111, so that the vibration caused by the knocking can be transmitted to the gravity sensor 132 electrically connected to the second circuit board 122 through the bending structure 112, thereby enabling the knocking to operate the key assembly 100. Moreover, the bending structure 112 is bent and extended away from the main body structure 111 along the first direction X, which can reduce the mutual influence between the second circuit board 122 and the first circuit board 121.

[0136] In some examples, the key assembly 100 further includes a second adhesive layer 102 (see Figure 7 The second circuit board 122 (the first sub-circuit board 1221) is adhered to the surface of the second sub-bending structure 1122 away from the main body structure 111 through the second adhesive layer 102.

[0137] In examples, after the gravity sensor 132 is electrically connected to the second circuit board 122 (the first sub-circuit board 1221), the second circuit board 122 (the first sub-circuit board 1221) is adhered to the surface of the second sub-bending structure 1122 away from the main body structure 111 through the second adhesive layer 102, so that the key body 110, the second circuit board 122, and the gravity sensor 132 can be integrated as a whole, thereby enabling them to be assembled together with the frame 2011 of the electronic device 200 without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0138] Figure 16 A structural diagram of a support structure provided for some embodiments of the present application.

[0139] In some examples, as shown in Figure 6 and Figure 7 The key assembly 100 further includes a support structure 140, which is located on the side of the first circuit board 121 away from the main body structure 111 along the second direction Y. The support structure 140 is connected to the key body 110. In examples, the support structure 140 can be connected to the bending structure 112 of the key body 110. For example, the support structure 140 can be connected to the bending structure 112 in a clamping manner.

[0140] It can be understood that the support structure 140 can support the key body 110, the circuit board 120 and the sensor 130. For example, the support structure 140 can be made of stainless steel, or the support structure 140 can be made of other metal or non-metal materials. The embodiments of the present application do not make further limitation on the material of the support structure 140.

[0141] In addition, the support structure 140 is connected with the key body 110, the circuit board 120 is bonded with the key body 110 (the main body structure 111 or the bent structure 112), and the sensor 130 is electrically connected with the circuit board 120, so that the support structure 140, the circuit board 120 and the sensor 130 can be an integral whole, which can be connected with the frame 2011 together, without being connected with the frame 2011 respectively, thereby improving the convenience of assembling the key assembly 100 and the frame 2011 together, improving the assembly efficiency and reducing the assembly cost.

[0142] In some examples, as shown in Figure 15 and Figure 16 , the support structure 140 includes a support plate 141 and a support piece 142. The support plate 141 extends along the first direction X.

[0143] For example, as shown in Figure 16 , the support plate 141 includes a support body 1411 and a connecting portion 1412. The number of the connecting portion 1412 is two, and the two connecting portions 1412 are located on both sides of the support body 1411 along the first direction X and are connected with the support body 1411 respectively. For example, the support plate 141 can be an integral structure, so as to improve the connection reliability between the connecting portion 1412 and the support body 1411.

[0144] As shown in Figure 16 , both ends of the support body 1411 are bent and extended along the second direction Y. The connecting portion 1412 includes a first sub-structure 1412a and a second sub-structure 1412b, and the first sub-structure 1412a is connected with the second sub-structure 1412b. The end of the first sub-structure 1412a away from the second sub-structure 1412b is connected with the end of the support body 1411. Among them, the second sub-structure 1412b is close to the first circuit board 121 relative to the first sub-structure 1412a.

[0145] In some examples, the support plate 141 is connected with the frame 2011 of the electronic device 200.

[0146] For example, a screw hole D is formed on the second sub-structure 1412b, as shown in Figure 13 and Figure 15As shown, the key assembly 100 includes connecting bolts 105, which are capable of being connected with the frame 2011 through connecting screw holes D, so that the support plate 141 is capable of being connected with the frame 2011 of the electronic device 200. It can be understood that the support structure 140 (including the support plate 141 and the support piece 142) is located in the accommodating space surrounded by the shell 201.

[0147] For example, the number of the connecting screw holes D can be two, and the two connecting screw holes D are located on both sides of the key body 110 along the first direction X, so as to avoid affecting the key body 110 by the connecting bolts 105.

[0148] The support plate 141 is connected with the frame 2011, so that the 1141 can fix the key body 110, the circuit board 120 and the sensor 130 and the like on the frame 2011, reduce the risk of shaking of the key body 110, the circuit board 120 and the sensor 130 and the like relative to the frame 2011, and improve the reliability of the key assembly 100.

[0149] It can be understood that during the processing process, there can be an error between the size of the through hole G of the frame 2011, the key body 110 and the support structure 140 and the set size, which can be referred to as a tolerance. If the tolerance is within the set tolerance range, the product size is qualified. For example, the frame 2011, the key body 110 and the support structure 140 with the tolerance at the upper limit of the tolerance range are assembled, and the frame 2011, the key body 110 and the support structure 140 with the tolerance at the lower limit of the tolerance range are assembled, so as to improve the yield after assembly.

[0150] In some examples, as shown in Figure 15 and Figure 16 The support piece 142 is located on the side of the support plate 141 close to the first circuit board 121 and is connected with the support plate 141. The support piece 142 and the support plate 141 surround a clamping groove Q. The second sub-bending structure 1122, at least a part of the second circuit board 122 (the first sub-circuit board 1221) along the third direction Z and the gravity sensor 132 are clamped in the clamping groove Q.

[0151] In this way, the clamping groove Q can limit the second sub-bending structure 1122, the second circuit board 122 (the first sub-circuit board 1221) and the gravity sensor 132, reduce the risk of deviation of the second sub-bending structure 1122, the second circuit board 122 (the first sub-circuit board 1221) and the gravity sensor 132 relative to the support structure 140 when the main body structure 111 is knocked or pressed, and improve the reliability of the key assembly 100.

[0152] In some examples, as shown in Figure 16As shown, the number of the support members 142 is two, and the two support members 142 are spaced apart along the first direction X. The two support members 142 can respectively surround the support plate 141 to form a clamping groove Q, and one second sub-bending structure 1122, one second circuit board 122 and one gravity sensor 133 are located in one clamping groove Q.

[0153] For example, the key assembly 100 includes a fourth adhesive layer 104 (see Figure 7 ), and the first circuit board 121 is located between the two support members 142, and the side of the first circuit board 121 close to the capacitive sensor 131 is adhered to the surface of the side of the support plate 141 close to the first circuit board 121 through the fourth adhesive layer 104, so as to improve the convenience of assembly between the first circuit board 121 and the support plate 141. In addition, the key body 110, the circuit board 120, the sensor 130 and the support structure 140 can be integrated as a whole, so as to improve the convenience of assembly of the key assembly 100 and the frame 2011.

[0154] In some examples, as shown in Figure 15 The support member 142 includes a side wall 1421 and a bottom wall 1422, the side wall 1421 is opposite to the support plate 141, and one end of the bottom wall 1422 is connected to the side wall 1421 and the other end is connected to the support plate 141. In this way, the support member 142 can surround the support plate 141 to form a clamping groove Q.

[0155] In some examples, as shown in Figure 15 The side wall 1421 includes a first bending part 1423, the first bending part 1423 is opposite to the gravity sensor 133, and the first bending part 1423 is bent towards the support plate 141.

[0156] It can be understood that the first bending part 1423 is opposite to the gravity sensor 133 and is bent and extends towards the support plate 141, so that the first bending part 1423 can limit the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122, reduce the risk of the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122 falling out of the clamping groove Q when the key body 110 is tapped or pressed, and improve the reliability of the key assembly 100.

[0157] For example, the side wall 1421 can be S-shaped or approximately S-shaped. Alternatively, the side wall 1421 can also be other shapes. The embodiments of the present application do not further limit the shape of the side wall 1421.

[0158] In some examples, the support plate 141 includes a second bending part (not shown in the figure), the second bending part is opposite to the gravity sensor 133, and the second bending part is bent towards the side wall 1421.

[0159] It can be understood that the second bending part is arranged opposite to the gravity sensor 133 and extends in a direction close to the side wall 1421, so that the second bending part can limit the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122, reduce the risk of the gravity sensor 133, the second sub-bending structure 1122 and the second circuit board 122 falling out of the clamping groove Q when the key body 110 is knocked or pressed, and improve the reliability of the key assembly 100.

[0160] In some examples, the side wall 1421 includes the first bending part 1423, and the support plate 141 does not include the second bending part. In other examples, the side wall 1421 does not include the first bending part 1423, and the support plate 141 includes the second bending part. In yet other examples, the side wall 1421 includes the first bending part 1423, and the support plate 141 includes the second bending part.

[0161] Figure 17 A structural schematic diagram of a key assembly provided for another embodiment of the present application.

[0162] In some examples, as shown in Figure 14 and Figure 17 The circuit board 120 further includes a third circuit board 123, which is located on a side of the first circuit board 121 away from the main body structure 111 along the second direction Y. The connecting plate 124 is electrically connected with the third circuit board 123.

[0163] The third circuit board 123 can be an FPC or a PCB. In examples, the third circuit board 123 can be located between the first circuit board 121 and the support structure 140, or the third circuit board 123 can also be located on a side of the support structure 140 away from the first circuit board 121. In some examples, the number of the connecting plates 124 is one, and the first circuit board 121, the second circuit board 122 and the third circuit board 123 are electrically connected with the main plate through one connecting plate 124. In other examples, the number of the connecting plates 124 is multiple, and the first circuit board 121, the second circuit board 122 and the third circuit board 124 are electrically connected with the main plate through at least two connecting plates 124.

[0164] In some examples, as shown in Figure 17 The sensor 130 includes a pressure sensor 133, which is located on a side of the third circuit board 123 away from the first circuit board 121 and is electrically connected with the third circuit board 123.

[0165] The number of pressure sensors 133 can be one or more. When the number of pressure sensors 133 is more than one, the plurality of pressure sensors 133 are arranged at intervals on the side of the third circuit board 123 away from the first circuit board 121. For example, the side of the third circuit board 123 away from the first circuit board 121 is provided with a third pad, and the pressure sensor 133 is welded to the third pad, so that the pressure sensor 133 can be located on the side of the third circuit board 123 away from the first circuit board 121 and electrically connected to the third circuit board 123.

[0166] The third circuit board 123 is arranged on the side of the first circuit board 121 away from the main body structure 111 along the second direction Y, and the pressure sensor 133 is arranged on the side of the third circuit board 123 away from the first circuit board 121 and electrically connected to the third circuit board 123, so that when the main body structure 111 is mechanically deformed by pressing the key body 110, the main body structure 111 can apply pressure to the pressure sensor 133, thereby enabling the key assembly 100 to be operated by the manner of pressing the key body 110.

[0167] In some examples, the third circuit board 123 is arranged opposite to the surface of the support plate 141 on the side away from the first circuit board 121.

[0168] It can be understood that when the main body structure 111 is pressed, the main body structure 111 is mechanically deformed, which can press the support plate 141, so that the support plate 141 is mechanically deformed. The third circuit board 123 is arranged opposite to the surface of the support plate 141 on the side away from the first circuit board 121, and the pressure sensor 133 is electrically connected to the third circuit board 123 on the side away from the support plate 141 (the first circuit board 121), so that the pressure sensor 133 can sense the pressure caused by the mechanical deformation of the support plate 141 and convert the pressure into an electrical signal and send it to the mainboard, thereby enabling the key assembly 100 to be operated by the manner of pressing the key body 110.

[0169] In some examples, the key assembly 100 further comprises a third adhesive layer 103 (see Figure 7 ). The third circuit board 123 is adhered to the surface of the support plate 141 on the side away from the first circuit board 121 by the third adhesive layer 103.

[0170] For example, after the pressure sensor 133 is electrically connected to the third circuit board 123, the surface of the third circuit board 123 on the side away from the pressure sensor 133 is adhered to the surface of the support plate 141 on the side away from the first circuit board 121 by the third adhesive layer 103, so that the key body 110, the support structure 140, the third circuit board 123 and the pressure sensor 133 can be integrated as a whole, thereby the four can be assembled together with the frame 2011 of the electronic device 200 without separate assembly, improving the assembly efficiency and reducing the assembly cost.

[0171] In some examples, as shown in FIG. 1A, the key assembly 100 further comprises a sealing member 150 surrounding the main body structure 111. Figure 6 Figure 7 As shown in FIG. 1A, the sealing member 150 can be an O ring. In some examples, an injection molding liquid silicone rubber (LIM) can be formed around the main body structure 111 as the sealing member 150. In other examples, an O ring can be sleeved on the main body structure 111 as the sealing member 150.

[0172] As can be understood, when the main body structure 111 is embedded in the through hole G of the frame 2011, the sealing member 150 is located in the space surrounded by the shell 201 and in contact with the inner wall surface of the frame 2011, so that the sealing member 150 can seal the through hole G, reduce the risk of water or impurities entering the accommodation space through the through hole G, and improve the reliability of the electronic device 200.

[0173] As can be understood, when the main body structure 111 is embedded in the through hole G of the frame 2011, the sealing member 150 is located in the space surrounded by the shell 201 and in contact with the inner wall surface of the frame 2011, so that the sealing member 150 can seal the through hole G, reduce the risk of water or impurities entering the accommodation space through the through hole G, and improve the reliability of the electronic device 200.

[0174] In summary, the embodiments of the present application have at least the following beneficial effects:

[0175] In the embodiments of the present application, the circuit board 120 is connected to the key body 110, for example, directly connected or indirectly connected, and the sensor 130 is located on the side of the circuit board 120 away from the key body 110 and is electrically connected to the circuit board 120, so that the user can be sensed by the sensor 130 when operating the key body 110. The sensor 130 converts the sensing signal (such as capacitance, gravity acceleration, and pressure, etc.) into an electrical signal (such as current or voltage, etc.), and sends the electrical signal to the mainboard of the electronic device 200 through the circuit board 120. The processor (such as CPU) of the electronic device 200 is electrically connected to the mainboard, so as to control other components of the electronic device 200 according to the received electrical signal, so that the electronic device 200 can respond to the operation of the key body 110 by the user to realize the set function.

[0176] As can be understood, when the sensor 130 comprises a plurality of capacitance sensors 131 arranged at intervals, the key assembly 100 can be operated by using the multi-directional sliding of the finger on the key body 110. When the sensor 130 comprises a gravity sensor 132, the key assembly 100 can be operated by tapping the key body 110. When the sensor 130 comprises a pressure sensor 133, the key assembly 100 can be operated by pressing the key body 110.

[0177] ​In this way, the sensor 130 is provided with at least two of the capacitive sensor 131, the gravity sensor 132 and the pressure sensor 133, and when the sensor 130 includes the capacitive sensor 131, the plurality of capacitive sensors 131 are arranged at intervals, so that the key assembly 100 can be operated in at least two of the three ways of multidirectional sliding, tapping and pressing the key body 110 by a finger, so that the electronic device 200 can implement a set function, and the flexibility and convenience in operating the key assembly 100 are improved.

[0178] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art who thinks of changes or replacements within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A key assembly, characterized in that: include: Button body; a circuit board, located on one side of the key body and connected to the key body; and A sensor is located on a side of the circuit board away from the button body and is electrically connected to the circuit board; the sensor includes at least two of a capacitive sensor, a gravity sensor, and a pressure sensor; wherein, when the sensor includes the capacitive sensor, the number of the capacitive sensors is multiple, and the multiple capacitive sensors are arranged at intervals.

2. The key assembly according to claim 1, wherein: The button body includes a main structure, the main structure extends along a first direction and has a first surface and a second surface arranged opposite to each other along a second direction; the first direction intersects the second direction; The circuit board includes a first circuit board and a connecting board, the first circuit board is arranged opposite to the second surface, and the connecting board is electrically connected to the first circuit board; The sensor includes a plurality of capacitive sensors, which are located on a side of the first circuit board away from the second surface and electrically connected to the first circuit board; at least two of the plurality of capacitive sensors are arranged in an array.

3. The key assembly according to claim 2, characterized in that: The main structure includes a protruding portion and an extending portion, wherein the protruding portion is connected to the extending portion; the width of the protruding portion along the third direction is greater than the width of the extending portion along the third direction; the third direction intersects with the plane where the first direction and the second direction are located; At least two of the plurality of capacitance sensors are spaced apart from each other along an extending direction of the edge of the protruding portion.

4. The key assembly according to claim 3, characterized in that: The protrusion has a first side wall surface and a second side wall surface that are opposite to each other along a third direction; at least one of the first side wall surface and the second side wall surface is bent in a direction away from the other.

5. The key assembly according to claim 3 or 4, characterized in that: There are two extending portions, and the two extending portions are located on both sides of the protruding portion along the first direction and are respectively connected to the protruding portion.

6. The key assembly according to any one of claims 2 to 5, characterized in that: It also includes a first adhesive layer, and the first circuit board is bonded to the second surface through the first adhesive layer.

7. The key assembly according to any one of claims 2 to 6, characterized in that: The button body further includes a bending structure, which is located on the side where the second surface is located along the second direction and is connected to the main structure; The circuit board further includes a second circuit board, which is arranged opposite to a surface of the bending structure away from the main structure; the connecting plate is electrically connected to the second circuit board; The sensor includes a gravity sensor, which is located on a side of the second circuit board away from the bending structure and is electrically connected to the second circuit board.

8. The key assembly according to claim 7, characterized in that: There are two bending structures, and the two bending structures are arranged at intervals along the first direction; the second circuit board includes two electrically connected first sub-circuit boards, and the two first sub-circuit boards are respectively arranged opposite to the surfaces of the two bending structures on the side away from the main structure; there are two gravity sensors, and the two gravity sensors are respectively located on the side of the two first sub-circuit boards away from the bending structures.

9. The key assembly according to claim 8, characterized in that: The first circuit board is located between the two bending structures.

10. The key assembly according to any one of claims 7 to 9, characterized in that: The bending structure includes a first sub-bending structure and a second sub-bending structure, wherein the first sub-bending structure is connected to the second sub-bending structure; an end of the first sub-bending structure away from the second sub-bending structure is connected to the main structure; the first sub-bending structure extends along the second direction, and the second sub-bending structure extends along the first direction away from the main structure; The second circuit board is disposed opposite to a surface of the second sub-bending structure away from the main structure.

11. The key assembly according to claim 10, characterized in that: It also includes a second adhesive layer, and the second circuit board is bonded to the surface of the second sub-bending structure away from the main structure through the second adhesive layer.

12. The key assembly according to claim 10 or 11, characterized in that: Also includes: a supporting structure, the supporting structure being located along the second direction on a side of the first circuit board away from the main structure; The supporting structure is connected to the button body.

13. The key assembly according to claim 12, wherein: The support structure includes a support plate and a support member; the support plate extends along the first direction, the support member is located on a side of the support plate close to the first circuit board and is connected to the support plate; the support member and the support plate are surrounded by a clamping groove; At least a portion of the second sub-bending structure along the third direction, at least a portion of the second circuit board along the third direction, and the gravity sensor are clamped in the clamping groove; The third direction intersects a plane where the first direction and the second direction lie.

14. The key assembly according to claim 13, wherein: The support member includes a side wall and a bottom wall, wherein the side wall is arranged opposite to the support plate; one end of the bottom wall is connected to the side wall, and the other end is connected to the support plate.

15. The key assembly according to claim 14, characterized in that: The side wall includes a first bending portion, the first bending portion is arranged opposite to the gravity sensor, and the first bending portion is bent in a direction close to the support plate; or, The support plate includes a second bending portion, the second bending portion is arranged opposite to the gravity sensor, and the second bending portion is bent in a direction close to the side wall.

16. The key assembly according to any one of claims 13 to 15, characterized in that: The circuit board further includes a third circuit board, the third circuit board being located on a side of the first circuit board away from the main structure along the second direction; the connecting plate is electrically connected to the third circuit board; The sensor includes a pressure sensor, which is located on a side of the third circuit board away from the first circuit board and is electrically connected to the third circuit board.

17. The key assembly according to claim 16, wherein: The third circuit board is arranged opposite to a surface of the support plate away from the first circuit board.

18. The key assembly according to claim 17, wherein: It also includes a third adhesive layer; the third circuit board is bonded to the surface of the support plate away from the first circuit board through the third adhesive layer.

19. The key assembly according to any one of claims 2 to 18, characterized in that: Also included is a sealing member, which surrounds the main structure.

20. An electronic device, characterized in that: include: A housing, the housing comprising a frame, the frame being provided with a through hole; The key assembly according to any one of claims 1 to 18, wherein the key body of the key assembly is partially embedded in the through hole.

21. The electronic device according to claim 20, characterized in that It also includes a main board, the key assembly includes a circuit board, and the connecting plate of the circuit board is electrically connected to the main board.

22. The electronic device according to claim 20 or 21, characterized in that: The button assembly further includes a supporting structure, which includes a supporting plate, and the supporting plate is connected to the frame of the electronic device.

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